RClamp3374N

Low Capacitance RailClamp®

4-Line Surge and ESD Protection for Ethernet Interfaces

PROTECTION PRODUCTS

Description

RailClamp® TVS diodes are specifically designed to protect sensitive components which are connected to high-speed data and transmission lines from over voltage caused by ESD (electrostatic discharge),

CDE (cable discharge events), and EFT (electrical fast transients).

The unique design incorporates surge rated, low capacitance steering diodes and a TVS diode in a single package. The RClamp®3374N is designed to replace up to two components for board level GbE protection.

Each device is designed to protect two line pairs.

This is accomplished by routing traces through the device. When connected in this fashion, the device can withstand a high level of surge current (40A, tp =8/20us) while maintaining a low loading capacitance of less than

5pF. The high surge capability means it can be used in high threat environments in applications such as Gigabit

Ethernet, telecommunication lines, and LVDS interfaces.

The RClamp3374N is constructed using Semtech’s proprietary EPD process technology. The EPD process provides low stand-off voltages with significant reductions in leakage current and capacitance over silicon avalanche diode processes. It features a true operating voltage of 3.3 volts for superior protection.

RClamp3374N is in a DFN 3.0 x 2.0 x 0.6mm 10 Lead package. The leads are finished with lead-free NiPdAu.

Functional Schematic

Features

• Transient protection for high-speed data lines to

IEC 61000-4-2 (ESD) ±30kV (air), ±30kV (contact)

IEC 61000-4-4 (EFT) 40A (5/50ns)

IEC 61000-4-5 (Lightning) 40A (8/20μs)

• Array of surge rated diodes with internal TVS Diode

• Protects up to eight lines

• Low capacitance for high-speed interfaces

• Low variation in capacitance vs. bias voltage

• Low clamping voltage

• Low operating voltage: 3.3V

• Solid-state silicon-avalanche technology

Mechanical Characteristics

• Package: DFN 3.0 x 2.0 x 0.6mm 10 Lead

• Pb-Free, Halogen Free, RoHS/WEEE Compliant

• Lead Finish: NiPdAu

• Molding Compound Flammability Rating: UL 94V-0

• Marking : Marking Code + Date Code

• Packaging : Tape and Reel

Applications

• 10/100/1000 Ethernet

• Central Office Equipment

• LVDS Interfaces

• MagJacks / Integrated Magnetics

• Notebooks / Desktops / Servers

Pin Configuration

Pin 1

Line 1 In

Pin 4

Line 3 In

Pin 10

Line 1 Out

Pin 2

Line 2 In

Pin 9

Line 2 Out

Pin 7

Line 3 Out

Pin 5

Line 4 In

Pin 6

Line 4 Out

Line 1 In

Line 2 In

GND

Line 3 In

Line 4 In

5

1

GND

GND

GND

10

Line 1 Out

Line 2 Out

GND

6

Line 3 Out

Line 4 Out

Pin 3, 8

Center tab

RClamp3374N

Final Datasheet

1/15/2020

Rev 4.0

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Absolute Maximum Ratings

Rating

Peak Pulse Power (tp = 8/20µs)

Peak Pulse Current (tp = 8/20µs)

ESD per IEC 61000-4-2 (Contact)

(1)

ESD per IEC 61000-4-2 (Air)

(1)

Operating Temperature

Storage Temperature

Symbol

P

PK

I

PP

V

ESD

T

OP

T

STG

Value

1000

40

±30

±30

-40 to +125

-55 to +150

Electrical Characteristics (T=25

O

C unless otherwise specified)

°C

°C

Units

W

A kV

Parameter

Reverse Stand-Off Voltage

Reverse Breakdown Voltage

Snapback Voltage

Reverse Leakage Current

Clamping Voltage

(2)

Clamping Voltage (2) (3)

Junction Capacitance

(2)

Symbol Conditions

V

RWM

V

PT

V

SB

I

PT

= 2µA

I

SB

= 50mA

I

R

V

C

V

C

C

J

V

RWM

= 5V

T = 25

O

C

T = 125

O

C tp = 8/20µs

Any I/O to GND

I

I

PP

= 1A

PP

=10A

I

PP

= 25A tp = 8/20µs , Line to Line I

PP

= 40A

V

R

= 0V, f = 1MHz, any I/O Pin to GND

V

R

= 0V, f = 1MHz, between I/O pins

Min.

Typ.

Max. Units

3.5

2.8

3.3

0.5

1

V

μA

V

V

μA

5.5

V

10.5

V

3.6

1.7

18

25

5

V

V pF pF

Notes:

(1): ESD Gun return path to Ground Reference Plane (GRP)

(2): Guaranteed by design (not production tested)

(3): Ratings with 2 pins connected together per the recommended configuration (i.e. pin 1 connected to pin 10, pin 2 connected to pin 9, pin 4 connected to pin 7, and pin 5 connected to pin 6).

RClamp3374N

Final Datasheet

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Rev 4.0

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Typical Characteristics

Non-Repetitive Peak Pulse Power vs. Pulse Time

100

T

A

= 25

O

C

10

1

3.0

2.0

1.0

0.0

0

15

10

5

0

0

0.1

0.1

1 10

Pulse Duration - tp (µs)

100

Clamping Voltage vs. Peak Pulse Current

25

20

I/O to GND

I/O to I/O

2 I/O to GND

2 I/O to 2 I/O

10 20 30

Peak Pulse Current - Ipp (A)

Capacitance vs. Reverse Voltage

40

1000

Waveform

Parameters: tr = 8µs td = 20µs

50

5.0

4.0

I/O to GND

I/O to I/O

1 2

Reverse Voltage - V

R

(V)

3 f = 1 MHz

4

RClamp3374N

Final Datasheet

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5 www.semtech.com

Power Derating Curve

120

100

80

60

40

20

0

0 25 50 75

Ambient Temperature - T

A

100

(

O

C)

125

DR040514-25-125-150

150

Forward Clamping Voltage vs. Peak Pulse Current

15

GND to 1 I/O

GND to 2 I/O

0

0

30

25

20

15

10

5

0

-5

0

TLP

Parameters: tp = 100ns tr = 200ps

2

10 20 30

Peak Pulse Current - Ipp (A)

Typical TLP Characerisitic

4 6

Voltage (V)

8

40

R dyn

=0.23 Ohms

10 12

50

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Typical Characteristics (Continued)

Insertion Loss (I/O to GND)

CH1 S21 LOG 6 dB / REF 0 dB

0 dB

-6 dB

-12 dB

-18 dB

-24 dB

-30 dB

-36 dB

-42 dB

-48 dB

1

MHz

START

.

030 MHz

10

MHz

1 2

3

4

5

1: - 0.5954 dB

800 MHz

2: - 0.6386 dB

900 MHz

3: - 1.9606 dB

1.8 GHz

4: - 4.3959 dB

2.5 GHz

5: - 5.2975 dB

2.7 GHz

100

MHz

STOP

1

GHz

3 000 .

3

GHz

000 000 MHz

Insertion Loss (2 I/O to GND)

CH1 S21 LOG 6 dB / REF 0 dB

0 dB

-6 dB

-12 dB

-18 dB

-24 dB

-30 dB

-36 dB

-42 dB

-48 dB

1

MHz

START .

030 MHz

10

MHz

1

2

3

4

5

1: - 2.3263 dB

800 MHz

2: - 2.5056 dB

900 MHz

3: - 5.7891 dB

1.8 GHz

4: - 9.2386 dB

2.5 GHz

5: - 10.111 dB

2.7 GHz

100

MHz

STOP

1

GHz

3 000 .

3

GHz

000 000 MHz

Insertion Loss (I/O to I/O)

CH1 S21 LOG 6 dB / REF 0 dB

0 dB

-6 dB

-12 dB

-18 dB

-24 dB

-30 dB

-36 dB

-42 dB

-48 dB

START

.

1

MHz

030 MHz

10

MHz

1 2

3

4

5

1: - 0.3708 dB

800 MHz

2: - 0.3976 dB

900 MHz

3: - 1.3979 dB

1.8 GHz

4: - 3.4436 dB

2.5 GHz

5: - 4.3385 dB

2.7 GHz

100

MHz

STOP

1

GHz

3 000 .

3

GHz

000 000 MHz

Insertion Loss (2 I/O to 2 I/O)

CH1 S21 LOG 6 dB / REF 0 dB

0 dB

-6 dB

-12 dB

-18 dB

-24 dB

-30 dB

-36 dB

-42 dB

-48 dB

START

1

MHz

.

030 MHz

10

MHz

1 2

3

4

5

1: - 1.1102 dB

800 MHz

2: - 1.1958 dB

900 MHz

3: - 3.4256 dB

1.8 GHz

4: - 6.8820 dB

2.5 GHz

5: - 7.9734 dB

2.7 GHz

100

MHz

STOP

1

GHz

3 000 .

3

GHz

000 000 MHz

RClamp3374N

Final Datasheet

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Rev 4.0

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Typical Characteristics (Continued)

Analog Crosstalk (I/O to GND)

CH1 S21 LOG 20dB / REF 0 dB

40

30

60

50

20

10

0

-10

0 dB

-20 dB

-40 dB

-60 dB

-80 dB

-100 dB

-120 dB

-140 dB

-160 dB

START .

030 MHz STOP

3

000

.

000 000 MHz

8kV ESD Clamping (I/O to GND per IEC 61000-4-2)

10 30

Time (ns)

50 70

Analog Crosstalk (I/O to I/O)

CH1 S21 LOG 20dB / REF 0 dB

0 dB

-20 dB

-40 dB

-60 dB

-80 dB

-100 dB

-120 dB

-140 dB

-160 dB

START .

030 MHz STOP

3

000

.

000 000 MHz

RClamp3374N

Final Datasheet

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Rev 4.0

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Application Information

Ethernet Protection

Ethernet ports are exposed to external transient events in the form of ESD, EFT, lightning, and cable discharge events (CDE). Test standards that model these events include IEC 61000-4-2 for ESD, IEC 61000-4-4 for EFT, and

IEC 61000-4-5 and GR-1089 for lightning. Any of these events can cause catastrophic damage to the PHY IC.

When designing Ethernet protection, the entire system must be considered. Over-voltage events can be common mode (with respect to ground) or differential

(line-to-line). An Ethernet port includes interface magnetics consisting of transformers integrated with common mode chokes. The transformer center taps are connected to ground via an RC network or “Bob

Smith” termination. The purpose of this termination is to reduce common mode emissions. The transformer provides common mode isolation to transient events, but no protection for differential surges. During a differential transient event, current will flow through the transformer, charging the windings on the line side.

Energy is transferred to the secondary until the surge subsides or the transformer saturates.

A typical protection scheme which utilizes RClamp3374N is shown in Figure 1. The devices are located on the PHY side of the transformer with one device placed across two line pairs. Parasitic inductance in the protection path should be minimized by locating RClamp3374N as physically close to the magnetics as possible, and preferably on the same side of the PCB. Reducing parasitic inductance is especially important for suppressing fast rise time transients such as ESD and EFT. Inductance in the path of the protection device increases the peak clamping voltage seen by the protected device (V =

L di/dt). Differential pairs are routed through each

RClamp3374N. Traces are routed unbroken to connect pins 1 and 10 (Line 1), 2 and 9 (Line 2), 4 and 7 (Line 3) and 5 and 6 (Line 4). Pins 3 and 8 as well as the tabs are not connected.

Placing the protection on the PHY side of the magnetics is advantageous in that the magnitude and duration of the surge is attenuated by the transformer windings. The amount of attenuation will vary by vendor and configuration of the magnetics. The Ethernet transformer has to be able to support the impulse tests without failure.

A typical Ethernet transformer can withstand a few hundred amperes (tp=8/20µs) before failure occurs, but this needs to be verified by testing. Alternatively, the protection can be placed on the line side of the transformer. However, the additional protection afforded by the transformer is lost, and the ability of the system to withstand high energy surges is limited to the capability of the protection device.

1

2

3

4

RClamp3374N

RClamp3374N

Final Datasheet

1/15/2020

Rev 4.0

RClamp3374N

0.01uF

Figure 1 - Typical Ethernet Protection Circuit

75 Ohms

0.001uF

2kV www.semtech.com

8

5

6

7

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Outline Drawing - DFN 3.0 x 2.0 x 0.6mm 10 Lead

A D

B

PIN 1

INDICATOR

(LASER MARK)

E aaa C

A2 A1

A

C

SEATING

PLANE

A

A1

A2 b b1

D e1 e2

L

L1

N aaa bbb

DIM

DIMENSIONS

MILLIMETERS

MIN

0.50

0.00

2.90

1.90

NOM

0.60

0.03

(0.15)

0.15 0.20

0.25 0.35

3.00

MAX

0.65

0.05

0.25

0.45

3.10

2.00

2.10

0.60 BSC

0.65 BSC

0.95 BSC

0.25 0.30

0.35

1.05

0.08

0.10

D/2

3X b1

1 2

LxN

E/2

3X L1

L1 /2 e e1

N bxN bbb C A B e2

NOTES:

1.

CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).

Land Pattern - DFN 3.0 x 2.0 x 0.6mm 10 Lead

P1

P X1

(C)

0.50

Y1

G

Y

Z

DIM

C

G

P

P1

P2

X

X1

Y

Y1

Z

DIMENSIONS

MILLIMETERS

(1.98)

1.40

0.60

0.65

0.95

0.25

0.40

0.58

1.00

2.56

P2

X

NOTES:

1.

2.

CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).

THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.

CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR

COMPANY'S MANUFACTURING GUIDELINES ARE MET.

RClamp3374N

Final Datasheet

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Tape and Reel Specification

4mm Pitch, 8mm wide plastic tape

4mm Pitch, 12mm wide plastic tape

Pin 1 Location

(Towards Sprocket Holes)

RClamp3374N

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Marking Code

3374N

YYWW

Notes: Dot indicates Pin 1 Location

Ordering Information

Part Number Qty per Reel Reel Size

RClamp3374N.TCT

3000 7 Inch

RClamp3374N.TRT

3000 7 Inch

RailClamp and RClamp are registered trademarks of Semtech Corporation.

Carrier Tape Tape Width Pitch

Plastic 8mm 4mm

Plastic 12mm 4mm

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Final Datasheet

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Rev 4.0

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Important Notice

Information relating to this product and the application or design described herein is believed to be reliable, however such information is provided as a guide only and Semtech assumes no liability for any errors in this document, or for the application or design described herein. Semtech reserves the right to make changes to the product or this document at any time without notice. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. Semtech warrants performance of its products to the specifications applicable at the time of sale, and all sales are made in accordance with Semtech’s standard terms and conditions of sale.

SEMTECH PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS,

DEVICES OR SYSTEMS, OR IN NUCLEAR APPLICATIONS IN WHICH THE FAILURE COULD BE REASONABLY EXPECTED TO RESULT IN PERSONAL INJURY,

LOSS OF LIFE OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. INCLUSION OF SEMTECH PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD

TO BE UNDERTAKEN SOLELY AT THE CUSTOMER’S OWN RISK. Should a customer purchase or use Semtech products for any such unauthorized application, the customer shall indemnify and hold Semtech and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs damages and attorney fees which could arise.

The Semtech name and logo are registered trademarks of the Semtech Corporation. All other trademarks and trade names mentioned may be marks and names of Semtech or their respective companies. Semtech reserves the right to make changes to, or discontinue any products described in this document without further notice. Semtech makes no warranty, representation or guarantee, express or implied, regarding the suitability of its products for any particular purpose. All rights reserved.

© Semtech 2020

Contact Information

RClamp3374N

Final Datasheet

1/15/2020

Rev 4.0

Semtech Corporation

200 Flynn Road, Camarillo, CA 93012

Phone: (805) 498-2111, Fax: (805) 498-3804 www.semtech.com

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