HLMP-LM65, HLMP-LB65

Precision Optical Performance Green and Blue

New 4mm Standard Oval LEDs

Data Sheet

Description

This Precision Optical Performance Oval LEDs are specifically designed for full color/video and passenger information signs. The oval shaped radiation pattern and high luminous intensity ensure that these devices are excellent for wide field of view outdoor applications where a wide viewing angle and readability in sunlight are essential.

The package epoxy contains both UV-A and UV-B inhibitors to reduce the effects of long term exposure to direct sunlight.

Applications

x Full color signs

Features

x

Well defined spatial radiation pattern x

High brightness material x

Available in green and blue color

Green InGaN 525nm

Blue InGaN 470nm x

Superior resistance to moisture x

Standoff x

Tinted and diffused x

Typical viewing angle 50° x100°

Package Dimensions

7.26 ± 0.20

0.286 ± 0.008

21.0

0.827

MIN.

1.25 ± 0.20

0.049 ± 0.008

CATHODE LEAD

3.80 ± 0.20

0.1496 ± 0.008

10.00 ± 0.50

0.394 ± 0.020

0.80

0.031

MAX. EPOXY MENISCUS

Notes:

All dimensions in millimeters (inches).

Tolerance is ± 0.20mm unless other specified

Sq Typ.

0.50 ± 0.10

0.020 ± 0.004

1.0

0.039

MIN.

NOTE:

1. MEASURED AT BASE OF LENS.

3.00 ± 0.20

0.118 ± 0.008

2.54 ± 0.30

0.100 ± 0.012

Caution: InGaN devices are Class 1C HBM ESD sensitive per JEDEC Standard. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details.

2

Device Selection Guide

Part Number

HLMP-LM65-Z30xx

HLMP-LB65-RU0xx

Color and Dominant

Wavelength O d (nm) Typ

Green 525

Blue 470

Luminous Intensity

Iv (mcd) at 20 mA-Min [1]

2400

550

Luminous Intensity

Iv (mcd) at 20 mA-Max [1]

5040

1150

Notes:

1. The luminous intensity is measured on the mechanical axis of the lamp package and it is tested with pulsing condition.

Part Numbering System

H LMP - L x 65 - x x x xx

Pac k aging Op t ion

DD: Ammo packs

ZZ : F l exi Ammopacks

Co l or Bin Se l ec t ion

0: Fu ll Distribution

Maximum I n t ensi t y Bin

Refer to se l ection guide

Minimum I n t ensi t y Bin

Refer to Device Se l ection Guide.

Co l or

M: Green 525

B: B l ue 470

Pac k age

L: 4mm Standard Ova l 50°x 1 00°

Note: Please refer to AB 5337 for complete information about part numbering system

Absolute Maximum Ratings

T

J

= 25°C

Parameter

DC Forward Current [1]

Peak Forward Current

Power Dissipation

Reverse Voltage

LED Junction Temperature

Operating Temperature Range

Storage Temperature Range

Notes:

1. Derate linearly as shown in Figure 2.

2. Duty Factor 10%, frequency 1KHz.

Green/ Blue

30

100 [2]

114

5 (I

R

=10μA)

110

-40 to +85

-40 to +100

°C

°C

°C

Unit mA mA mW

V

Electrical / Optical Characteristics

T

J

= 25°C

Parameter

Forward Voltage

Green

Blue

Symbol Min.

V

F

2.8

2.8

Typ.

3.2

3.2

Max.

3.8

3.8

Units

V

Test Conditions

I

F

= 20 mA

Reverse Voltage

Green

Blue

Dominant Wavelength [1]

Green

Blue

V

R

O d

5

5

520

460

525

470

540

480

V nm

I

R

= 10 μA

I

F

= 20 mA

Peak Wavelength

Green

Blue

O

PEAK

516

464 nm Peak of Wavelength of Spectral

Distribution at I

F

= 20 mA

Thermal Resistance

Luminous Efficacy [2]

Green

Blue

Luminous Efficiency [3]

Green

Blue

R

K

T

V

K e

J-PIN

240

530

65

60

13

°C/W lm/W

LED Junction-to-Cathode lead

Emitted Luminous Power/Emitted

Radiant Power

Luminous Flux/ Electrical Power

I

F

= 20 mA

Notes:

1. The dominant wavelength is derived from the chromaticity Diagram and represents the color of the lamp

2. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = I

V

/

K is the luminous efficacy in lumens/watt.

V

where I

V

is the luminous intensity in candelas and

K

V

3. ηe = φ

V

/ I

F

x V

F

, where φ

V

is the emitted luminous flux, I

F

is electrical forward current and V

F

is the forward voltage.

3

4

InGaN Green

1.0

0.9

0.8

0.7

BLUE

GREEN

0.6

0.5

0.4

0.3

0.2

0.1

0.0

380 430 480 530 580 630

WAVELENGTH - nm

Figure 1. Relative Intensity vs Wavelength

100

80

60

40

20

0

0 1 2 3

FORWARD VOLTAGE - V

Figure 2. Forward Current vs Forward Voltage

4 5

2.0

1.5

1.0

0.5

3.5

3.0

2.5

0.0

0 20 40 60 80

DC FORWARD CURRENT - mA

Figure 3. Relative Intensity vs Forward Current

BLUE

GREEN

100 120

35

30

25

20

15

10

5

0

0 20 40 60 80 100

T

A

- AMBIENTTEMPERATURE - °C

Figure 4. Maximum Forward Current vs Ambient Temperature

10

8

6

4

2

-2

0

-4

-6

-8

-10

0

BLUE

20 40 60

FORWARD CURRENT - mA

Figure 5. Relative dominant wavelength vs Forward Current

80

GREEN

100

1.0

0.8

0.6

0.4

0.2

0.0

-90 -60 -30 0 30

ANGULAR DISPLACEMENT - DEGREE

60

Figure 6. Radiation Pattern – Major Axis

BLUE

GREEN

90

1.0

0.8

0.6

0.4

0.2

0.0

-90 -60 -30 0 30

ANGULAR DISPLACEMENT - DEGREE

60

Figure 7. Radiation Pattern – Minor Axis

BLUE

GREE

90

10

1

BLUE

GREEN

0.1

-40 -20 0 20 40 60 80 100 120

T

J

- JUNCTION TEMPERATURE - °C

Figure 8. Relative Light Output vs Junction Temperature

0.3

0.2

0.1

0

BLUE

GREEN

-0.1

-0.2

-0.3

-40 -20 0 20 40 60 80 100 120

T

J

- JUNCTION TEMPERATURE - °C

Figure 9. Relative Forward Voltage vs Junction Temperature

Intensity Bin Limit Table (1.2: 1 Iv Bin Ratio)

Bin

R

S

T

U

X

Y

V

W

1150

1380

1660

1990

Z

1

2400

2900

2 3500

3 4200

Tolerance for each bin limit is r

15%

Intensity (mcd) at 20 mA

Min Max

550 660

660

800

960

800

960

1150

1380

1660

1990

2400

2900

3500

4200

5040

5

Green Color Bin Table

Bin

1

Min

Dom

Max

Dom Xmin Ymin Xmax Ymax

520.0

524.0

0.0743

0.8338

0.1856

0.6556

0.1650

0.6586

0.1060

0.8292

2

3

524.0

528.0

0.1060

0.8292

0.2068

0.6463

0.1856

0.6556

0.1387

0.8148

528.0

532.0

0.1387

0.8148

0.2273

0.6344

0.2068

0.6463

0.1702

0.7965

4

5

532.0

536.0

0.1702

0.7965

0.2469

0.6213

0.2273

0.6344

0.2003

0.7764

536.0

540.0

0.2003

0.7764

0.2659

0.6070

0.2469

0.6213

0.2296

0.7543

Tolerance for each bin limit is r

0.5nm

Bin

1

Min

Dom

Max

Dom Xmin Ymin Xmax Ymax

460.0

464.0

0.1440

0.0297

0.1766

0.0966

0.1818

0.0904

0.1374

0.0374

2

3

464.0

468.0

0.1374

0.0374

0.1699

0.1062

0.1766

0.0966

0.1291

0.0495

468.0

472.0

0.1291

0.0495

0.1616

0.1209

0.1699

0.1062

0.1187

0.0671

4

5

472.0

476.0

0.1187

0.0671

0.1517

0.1423

0.1616

0.1209

0.1063

0.0945

476.0

480.0

0.1063

0.0945

0.1397

0.1728

0.1517

0.1423

0.0913

0.1327

Tolerance for each bin limit is r

0.5nm

Note:

1. All bin categories are established for classification of products. Products may not be available in all bin categories. Please contact your Avago representative for further information.

Avago Color Bin on CIE 1931 Chromaticity Diagram

1 .000

6

0.800

Green

1

2 3

4

5

0.600

0.400

0.200

0.000

0.000

5

4

3

2

1

B l ue

0.200

0.400

X

0.600

0.800

7

Precautions:

Lead Forming:

x

The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board.

x For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually.

x

If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into LED package.

This is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink.

Note:

1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to re-calibrate the soldering profile again before loading a new type of PCB.

Avago Technologies LED Configuration

Soldering and Handling:

x

Care must be taken during PCB assembly and soldering process to prevent damage to the LED component. x

LED component may be effectively hand soldered to PCB. However, it is only recommended under unavoidable circumstances such as rework. The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59mm.

Soldering the LED using soldering iron tip closer than

1.59mm might damage the LED.

1 .59mm

x ESD precaution must be properly applied on the soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive.

Do refer to Avago application note AN 1142 for details.

The soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded.

x

Recommended soldering condition:

CA TH ODE

I nGaN Device x Any alignment fixture that is being applied during wave soldering should be loosely fitted and should not apply weight or force on LED. Non metal material is recommended as it will absorb less heat during wave soldering process.

x At elevated temperature, LED is more susceptible to mechanical stress. Therefore, PCB must allowed to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet.

x If PCB board contains both through hole (TH) LED and x other surface mount components, it is recommended that surface mount components be soldered on the top side of the PCB. If surface mount need to be on the bottom side, these components should be soldered using reflow soldering prior to insertion the TH LED.

Recommended PC board plated through holes (PTH) size for LED component leads.

Wave

Soldering [1, 2]

Manual Solder

Dipping

LED component lead size Diagonal

Plated through hole diameter

Pre-heat temperature 105°C Max.

0.45 x 0.45 mm 0.636 mm 0.98 to 1.08 mm

(0.018x 0.018 inch) (0.025 inch) (0.039 to 0.043 inch)

Preheat time 60 sec Max -

0.50 x 0.50 mm 0.707 mm 1.05 to 1.15 mm

Peak temperature 260°C Max.

260°C Max.

(0.020x 0.020 inch) (0.028 inch) (0.041 to 0.045 inch)

Dwell time 5 sec Max.

5 sec Max x

Over-sizing the PTH can lead to twisted LED after clinching. On the other hand under sizing the PTH can

Note:

1. Above conditions refers to measurement with thermocouple cause difficulty inserting the TH LED.

mounted at the bottom of PCB.

2. It is recommended to use only bottom preheaters in order to reduce thermal stress experienced by LED.

x

Wave soldering parameters must be set and maintained according to the recommended

Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps.

temperature and dwell time. Customer is advised to perform daily check on the soldering profile to ensure that it is always conforming to recommended soldering conditions.

8

Example of Wave Soldering Temperature Profile for TH LED

260°C Max

105°C Max

60 sec Max

TIME (sec)

Ammo Packs Drawing

6.35± 1 .30

0.25±0.05

1 2

1 2.70± 1 .00

0.50±0.0394

CA TH ODE

1 8.00±0.50

0.7087±0.0

1 97

9.

1 25±0.625

0.3593±0.025

Recommended solder:

Sn63 (Leaded solder alloy)

SAC305 (Lead free solder alloy)

Flux: Rosin flux

Solder bath temperature: 255°C ± 5°C

(maximum peak temperature = 260°C)

Dwell time: 3.0 sec - 5.0 sec

(maximum = 5sec)

Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force.

20.5± 1 .00

0.807

1 ±0.0394

1 2.70±0.30

0.50±0.0

11 8

0.70±0.20

0.276±0.0079

V I EW A - A

Ø

4.00±0.20

0.

1 575±0.0079

T YP.

Packaging Box for Ammo Packs

F ROM LE FT S I DE O F BOX

AD H ES I VE T APE MUS T BE

F AC I NG UPWARDS.

LABEL ON THI S

S I DE O F BOX

ANODE LEAD LEAVES

TH E BOX FI RS T .

9

Note: For InGaN device, the ammo pack packaging box contain ESD logo

Packaging Label

(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)

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(ii) Avago Baby Label (Only available on bulk packaging)

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DISCLAIMER:

AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR

AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAIN-

TENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS.

CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUP-

PLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE.

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Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved.

AV02-1148EN - February 10, 2010