Adlink XMC-G745 XMC Module Owner's Manual

XMC-G745

Rugged Graphics XMC Module with

GeForce GT 745M GPU

User’s Manual

Manual Rev.: 0.10

Revision Date: September 30, 2015

Part No: 50-1Z195-1000

Advance Technologies; Automate the World.

Revision History

Revision Release Date

0.10

2015/09/30

Description of Change(s)

Preliminary release ii Revision History

XMC-G460

Preface

Copyright 2015 ADLINK Technology Inc.

This document contains proprietary information protected by copyright. All rights are reserved. No part of this manual may be reproduced by any mechanical, electronic, or other means in any form without prior written permission of the manufacturer.

Disclaimer

The information in this document is subject to change without prior notice in order to improve reliability, design, and function and does not represent a commitment on the part of the manufacturer.

In no event will the manufacturer be liable for direct, indirect, special, incidental, or consequential damages arising out of the use or inability to use the product or documentation, even if advised of the possibility of such damages.

Environmental Responsibility

ADLINK is committed to fulfill its social responsibility to global environmental preservation through compliance with the European Union's Restriction of Hazardous Substances (RoHS) directive and Waste Electrical and Electronic Equipment (WEEE) directive. Environmental protection is a top priority for ADLINK.

We have enforced measures to ensure that our products, manufacturing processes, components, and raw materials have as little impact on the environment as possible. When products are at their end of life, our customers are encouraged to dispose of them in accordance with the product disposal and/or recovery programs prescribed by their nation or company.

Trademarks

Product names mentioned herein are used for identification purposes only and may be trademarks and/or registered trademarks of their respective companies.

Preface iii

iv

Conventions

Take note of the following conventions used throughout this manual to make sure that users perform certain tasks and instructions properly.

Additional information, aids, and tips that help users perform tasks.

CAUTION:

Information to prevent minor physical injury, component damage, data loss, and/or program corruption when trying to complete a task.

WARNING:

Information to prevent serious physical injury, component damage, data loss, and/or program corruption when trying to complete a specific task.

Preface

XMC-G745

Table of Contents

Revision History...................................................................... ii

Preface .................................................................................... iii

List of Figures ....................................................................... vii

List of Tables.......................................................................... ix

1 Introduction ........................................................................ 1

1.1

Overview.............................................................................. 1

1.2

Features............................................................................... 1

1.2.1 Graphics .......................................................................... 2

1.2.2 Display Support ............................................................... 2

1.2.3 Cooling ............................................................................ 2

1.2.4 Supported OS .................................................................. 2

1.3

Functional Block Diagram .................................................... 3

1.4

Ruggedness......................................................................... 4

1.5

Package Contents ............................................................... 4

2 Specifications ..................................................................... 5

2.1

XMC-G745........................................................................... 5

2.2

Power Consumption ............................................................ 7

2.3

Performance ........................................................................ 8

3 Functional Description .................................................... 11

3.1

GPGPU Features............................................................... 11

3.2

GDDR5 Memory ................................................................ 12

3.3

Display Interfaces .............................................................. 13

4 Board Interfaces ............................................................... 15

4.1

XMC-G745 Board Layout (conduction cooled) .................. 15

Table of Contents v

4.2

XMC-G745 Board Layout (air cooled)................................ 16

4.3

Connector Pin Assignments............................................... 17

5 Getting Started .................................................................. 21

5.1

Installing the Module .......................................................... 21

5.2

Driver Installation ............................................................... 22

Important Safety Instructions............................................... 23

Getting Service ...................................................................... 25

vi Table of Contents

XMC-G745

List of Figures

Figure 1-1: XMC-G745 Functional Block Diagram............................. 3

Figure 4-1: XMC-G745 Board Layout (conduction cooled) .............. 15

Figure 4-2: XMC-G745 Board Layout (air cooled) ........................... 16

List of Figures vii

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viii List of Figures

XMC-G745

List of Tables

Table 2-1: XMC-G745 Power Consumption ..................................... 7

Table 4-1: DVI-I Connector Pin Definition....................................... 18

Table 4-2: XMC Site Connector Pin Definition................................ 19

Table 4-3: XMC I/O Connector Pin Definition ................................. 20

List of Tables ix

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x List of Tables

XMC-G745

1 Introduction

1.1

Overview

The ADLINK XMC-G745M is a rugged XMC module equipped with the CUDA-enabled 384-core NVIDIA GeForce GT 745M GPU, utilizing the NVIDIA "Kepler" architecture and yielding the unprecedented levels of graphics processing performance for defense and aerospace applications. The GeForce GT 745M features 2048MB of GDDR5 memory, ensuring high-capacity and high-bandwidth access to data during "massively parallel" GPGPU algorithm processing. ADLINK recognizes the trend towards implementing General Purpose computing on Graphics Processing Units (GPGPU) for parallel computing for increased processing performance and the XMC-G745M is targeted at a variety of high-performance computing application that can take advantage of this technology.

1.2

Features

X

X

X

X

X

NVIDIA GeForce GT 745M GPU with "Kepler" architecture

CUDA Compute Capability 3.0 for parallel computation and graphics processing

High-resolution, high-performance platform for rugged video

I/O and GPGPU applications

Ideal for defense, radar, sonar, UAV and ground vehicles

Introduction 1

2

1.2.1

Graphics

X

X

X

X

X

X

X

X

X

X

X

NVIDIA GeForce GT 745M GPU

384 CUDA cores

548 MHz base clock

High-Bandwith Digital Content Protection (HDCP) support

OpenCL 1.2

OpenGL 4.4

GPU Boost 2.0

DirectX 11.1

Hardware H.264 video encoding

NVIDIA PureVideo Technology hardware decoding

NVIDIA PhysX realtime physics engine

1.2.2

Display Support

X

X

1x analog output (Cconduction cooled version only)

Z

Z

400 MHz integrated RAMDAC

Up to 2048x1536 30 bpp at 75 Hz

4x DVI-D outputs.

Z Internal single-link TMDS

Z Up to 1920x1200 32 bpp at 60 Hz

1.2.3

Cooling

X

X

Air-cooled

Conduction-cooled

1.2.4

Supported OS

X

X

X

X

Windows 8.1

Windows 8

Windows 7

Linux

Introduction

XMC-G745

1.3

Functional Block Diagram

Front Panel

VHDCI

Connector

(air cooled version)

SL-DVI

SL-DVI

SL-DVI

SL-DVI

NVIDIA

GeForce GT 745M

GDDR5

GDDR5

GDDR5

GDDR5

GPU

PWM

VGA

PCIe x8 Gen3

Power

Input

5V

Power

Input

3.3V

XMC (P16)

(conduction cooled version)

XMC (P15)

Figure 1-1: XMC-G745 Functional Block Diagram

Introduction 3

4

1.4

Ruggedness

X R2: Conduction cooled version supporting -40°C to +85°C at card edge

X A1: Air cooled version supporting 0°C to +55°C ambient temperature

1.5

Package Contents

The XMC-G745 is packaged with the following components. If any of the items on the contents list are missing or damaged, retain the shipping carton and packing material and contact the dealer for inspection. Please obtain authorization before returning any product to ADLINK.

X

X

XMC-G745 module

VHDCI to DVI adapter connector (air cooled version only)

CAUTION:

This product must be protected from static discharge and physical shock. Never remove any of the components except at a static-free workstation. Use the anti-static bag shipped with the product when putting the board on a surface. Wear an anti-static wrist strap properly grounded on one of the system's ESD ground jacks when installing or servicing system components.

Introduction

2 Specifications

2.1

XMC-G745

Graphics

GPU

CUDA Cores

NVIDIA GeForce GT 745M

384

Graphics Clock 680 MHz

Floating Point Performance 522.2 GFLOPS

Memory

Memory Size

Memory Clock

Memory Interface Width

Memory Bandwidth

2GB GDDR5

2000 MHz (4 Gbps)

128-bit

64 GB/sec

Feature Support

Bus Type

OpenGL

OpenCL

DirectX

NVIDIA CUDA

NVIDIA PhysX

NVIDIA PureVideo

HW Decode

PCI x16 Gen3 (x16/x8/x4/x1)

4.4

1.2

11.1

CUDA Compute Capability 3.0

Realtime physics engine

MPEG-2

MPEG-4 Part 2 Advanced Simple profile

H.264 SVC codec support

Support for 3D Blu-ray

VC1

DivX version 3.11 and later

MVC

Hardware H.264 encoding supported

DirectCompute API supported

Operating System Windows 8.1

Windows 8

Windows 7

Linux

XMC-G745

Specifications 5

DVI-D

VGA

Independent Displays

Display Outputs

4x DVI-D outputs

Internal single-link TMDS

Up to 1920x1200 32 bpp at 60 Hz

1x analog VGA output (conduction cooled version only)

400 MHz integrated RAMDAC

Up to 2048x1536 30 bpp at 75 Hz

3

Mechanical and Power

Form Factor

Air cooled version

XMC module

149 mm x 74mm

Conduction cooled version 143.75mm x 74 mm (with conformal coating)

Power Consumption 40 W (max.)

Environmental

Operating Temperature

Storage Temperature

Rel. Humidity

Shock

Vibration

Air Cooled: A1

• 0 °C to +55°C ambient

Conduction Cooled: R2

• -40°C to +85°C (mounted on VPX3000/3001 blade)

-50°C to +100°C

95%

Air Cooled: A1

• 20g peak, 11ms (air cooled: A1)

Conduction Cooled: R2

• 40g peak, 11ms (conduction cooled: R2)

Air Cooled: A1

• Random: 0.002g

2

/Hz from 10 to 2000Hz;

Sine: 2G, 5 to 500Hz

Conduction Cooled: R2

• 15Hz-2KHz, 12Grms, random, each axis, operating

(MIL-STD-810F Fig 514.4-8 for aircraft)

Note: Specifications are subject to change without notice.

6 Specifications

XMC-G745

2.2

Power Consumption

The power consumption data of the XMC-G745 was measured using 3D Mark06 at different engine clock frequencies (memory clock fixed at 2000 MHz).

Configuration

Futuremark 3DMark06 Professional Edition 1.1.0

Engine

Clock

Voltage (V)

Current (A)

Max

(1)

Mean

(2)

Power (W)

Max Mean

679MHz

600MHz

550MHz

510MHz

496MHz

Table 2-1: XMC-G745 Power Consumption

Notes: Maximum and mean current measured using Unigine

Heaven Benchmark 4.0.

Specifications 7

8

2.3

Performance

Futuremark 3DMarkX Professional was used to measure the graphics performance of the XMC-G745 while mated to an

ADLINK VPX3000 3U VPX Processor Blade. The table below shows the test results under different configurations.

Processor Blade

XMC Card

Processor

Memory

Graphics

HDD

OS

DirectX

BIOS

Futuremark 3DMark 05

3DMark Score

Futuremark 3DMark 06

3DMark Score

SM2.0 Score

HDR/SM3.0 Score

CPU Score

Futuremark 3DMark 11

Advanced Edition (Build

1.0.3.0)

VPX3000

XMC-G745 conduction cooled version

Intel® Core™ i7-3612QE Processor

(6M Cache, up to 3.10 GHz)

8GB

Intel® HD Graphics 4000

NVIDIA GeForce GT745M

ASD26-HA2032 32GB

Win 7 SP1 x64

11

0.01(VPX3001)

Wedge Lock 85°C

3795

Wedge Lock 85°C

1913

860

880

455

Wedge Lock 85°C

Performance (P)

3DMark 11 Score

Graphics Score

Physics Score

Combined Score

P363

342

682

299

Specifications

3DMark 11 Score

Graphics Score

Physics Score

Combined Score

Extreme (X) [Wedge Lock 80°C]

X308

275

3566

326

Futuremark 3DMark Vantage

(Build 1.0.1.0)

Wedge Lock 85°C

Performance (P)

3DMark Score

GPU Score

CPU Score

P1313

1044

5737

High (H)

3DMark Score

GPU Score

CPU Score

H754

694

1487

XMC-G745

Specifications 9

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10 Specifications

VPX3G10

3 Functional Description

The following sections describe the VPX3G10 features and functions.

3.1

GPGPU Features

X Kepler GPU Architecture: NVIDIA's Kepler GPU architecture has been designed from the ground up for maximum performance with DirectX 11 and optimal performance per watt. The new SMS streaming multiprocessor is twice as efficient as the prior generation and the new geometry engine draws triangles twice as fast. The result is world class performance and the highest image quality.

X

X

X

X

X

X

X

NVIDIA CUDA Technology: Compute Unified Device

Architecture, is a parallel computing platform and programming model that unlocks the power of the GPU's processor cores to accelerate the most demanding system tasks.

Microsoft DirectX 11 Support: DirectX 11 GPU with

Shader Model 5.0 support designed for ultra high performance with GPU-accelerated tessellation.

NVIDIA PhysX Technology: A powerful physics engine enabling real-time physics that is is optimized for hardware acceleration by massively parallel processors. GeForce

GPUs with PhysX provide an exponential increase in physics processing power.

NVIDIA FXAA Technology: Shader-based antialiasing technology available from the NVIDIA Control Panel that enables ultra-fast antialiasing.

NVIDIA Adaptive Vertical Sync: Adaptive V-Sync is a smarter way to render frames. At high frame rates, V-sync is enabled to eliminate tearing. At low frame rates, it is disabled to minimize stuttering.

High-Definition Audio Bitstreaming: Full-support for high-definition audio bitstreaming, including Dolby TrueHD and DTS-HD formats.

Hardware Video Decode Acceleration: The combination of high-definition video decode acceleration and post-processing that delivers stutter-free video, stunning picture

Functional Description 11

X clarity, accurate color, and precise image scaling with incredible energy efficiency.

PCI Express 3.0 & 2.0 Support: Designed for the PCI

Express 3.0 bus architecture offering the highest data transfer speeds while maintaining backwards compatibility with earlier PCI Express revisions.

3.2

GDDR5 Memory

GDDR5 double data rate type five synchronous graphics random access memory (SGRAM) conforms to the standards which were set out in the GDDR5 specification by JEDEC and it is specifically designed for use in graphics devices for the most demanding and memory-intensive graphics applications, such as 3D gaming and

HD video editing. It is a dedicated memory for the Graphic Processing Unit (GPU). Such memory not only reduces the display and graphics related load on the computer's main memory, but also serves to improve the performance of the GPU and the system's display, providing much better visual experiences than would be possible with just the computer's integrated graphics.

12 Functional Description

VPX3G10

3.3

Display Interfaces

Digital Output

The XMC-G745 has 4x single-link DVI-D to the P16 connector

(conduction cooled version) or to a VHDCI connector (air cooled version). The maximum supported resolution is 1920 x

1200 x 32 bpp at 60 Hz.

Analog Output

The analog VGA output port is routed to the P16 connector

(conduction cooled version only). The maximum supported resolutions is 2048 x 1536 x 30 bpp at 75 Hz.

Functional Description 13

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14 Functional Description

XMC-G745

4 Board Interfaces

This chapter illustrates the board layout and connector pin assignments.

4.1

XMC-G745 Board Layout (conduction cooled)

P16

Thermal Module

P15

P15 XMC Connector:

PCIe x16 Gen3

P16 XMC I/O:

4x single-link DVI and

1x VGA

Thermal

Module

XMC conduction cooling thermal module

Figure 4-1: XMC-G745 Board Layout (conduction cooled)

Board Interfaces 15

4.2

XMC-G745 Board Layout (air cooled)

J14

G1

P15

P15

G1

XMC Connector:

PCIe x16 Gen3

Nvidia GT 745M

J14 VHDCI Connector:

4x single-link DVI

Figure 4-2: XMC-G745 Board Layout (air cooled)

16 Board Interfaces

XMC-G745

4.3

Connector Pin Assignments

VHDCI Connector (J14, air cooled only)

34 1

68 35

15

16

17

18

11

12

13

14

51

52

8

9

10

6

7

4

5

Pin#

1

2

3

DVI4

DDC4_SCL

DDC4_SDA

DGND

DVI4_TX2+

DVI4_TX2-

DGND

DVI4_TX1+

DVI4_TX1-

DGND

DVI4_TX0+

DVI4_TX0-

DGND

DVI4_TXC+

DVI4_TXC-

DGND

DVI4_HPD

29

30

31

32

33

34

26

27

28

22

23

24

25

Pin#

19

20

21

DVI3

DDC3_SDA

DDC3_SCL

DGND

Pin#

35

36

37

DVI2

DDC2_SCL

DDC2_SDA

DGND

DVI3_TX2-

DVI3_TX2+

DGND

DVI3_TX1-

DVI3_TX1+

DGND

DVI3_TX0+

42

43

44

38

39

40

41

DVI2_TX2+

DVI2_TX2-

DGND

DVI2_TX1+

DVI2_TX1-

DGND

DVI2_TX0+

DVI3_TX0-

DGND

DVI3_TXC+

DVI3_TXC-

45

46

47

48

DGND

DVI3_HPD

49

50

DDC_5V

DDC_5V

DGND

DVI2_HPD

DGND

DGND

DVI2_TX0-

DGND

DVI2_TXC+

DVI2_TXC-

63

64

65

66

67

68

60

61

62

56

57

58

59

Pin#

53

54

55

DVI1

DDC1_SDA

DDC1_SCL

DGND

DVI1_TX2-

DVI1_TX2+

DGND

DVI1_TX1-

DVI1_TX1+

DGND

DVI1_TX0-

DVI1_TX0+

DGND

DVI1_TXC+

DVI1_TXC-

DGND

DVI1_HPD

Board Interfaces 17

18

DVI-D Connectors on VHDCI Cable

Pin #

13

14

15

9

10

11

12

7

8

5

6

3

4

1

2

Signal

DVI_TDC2-N

DVI_TDC2-P

GND

NC

NC

DDCCLK_5V

DDCDAT_5V

NC

DVI_TDC1-N

DVI_TDC1-P

GND

NC

NC

P5V

GND

Pin #

24

C1

C2

C3

C4

C5

20

21

22

23

16

17

18

19

Table 4-1: DVI-I Connector Pin Definition

Signal

DVI_HTPLG

DVI_TDC0-N

DVI_TDC0-P

GND

NC

NC

GND

DVI_TLC-P

DVI_TLC-N

NA

NA

NA

NA

GND

Board Interfaces

XMC-G745

XMC Site Connector (P15)

A1 A19

F1 F19

Pin# A B C D E F

6

7

4

5

1

2

3

PCIe_TX0+ PCIe_TX0-

GND GND

PCIe_TX2+ PCIe_TX2-

GND GND

PCIe_TX4+ PCIe_TX4-

GND GND

PCIe_TX6+ PCIe_TX6-

8

9

GND

NC

GND

NC

JTAG_TDI

NC

GND

NC

GND

NC

10 GND GND JTAG_TDO GND GND

11 PCIe_RX0+ PCIe_RX0NC (MBIST#) PCIe_RX1+ PCIe_RX1-

12 GND GND

13 PCIe_RX2+ PCIe_RX2-

14 GND GND

15 PCIe_RX4+ PCIe_RX4-

XMC_GA1

NC

XMC_GA2

NC

GND

PCIe_RX3+

GND

PCIe_RX5+

GND

PCIe_RX3-

GND

PCIe_RX5-

16 GND GND

17 PCIe_RX6+ PCIe_RX6-

18 GND GND

19 PCIe_CLK+ PCIe_CLK-

+3D3V

JTAG_TRST#

+3D3V

JTAG_TCLK

+3D3V

JTAG_TMS

+3D3V

NVMRO

NC

NC (FPGAIO1)

NC

PCIe_TX1+ PCIe_TX1-

GND GND

PCIe_TX3+ PCIe_TX3-

GND GND

PCIe_TX5+ PCIe_TX5-

GND GND

PCIe_TX7+ PCIe_TX7-

GND

PCIe_RX7+

GND

PCIe_RX7-

VPWR (5V)

MRSTI#

VPWR (5V)

MRSTO#

VPWR (5V)

+12V

VPWR (5V)

NC

VPWR (5V)

XMC_GA0

VPWR (5V)

MPRESENT#

VPWR (5V)

NC (MSDA)

VPWR (5V)

NC (MSCL)

NC

GND GND NC

NC (WAKE#) NC (ROOT#) NC (FPGAIO2)

Table 4-2: XMC Site Connector Pin Definition

PCIe_TX

PCIe_RX

PCIe_CLK

Power

JTAG

Board Interfaces 19

XMC I/O Connector (P16, conduction cooled only)

A1 A19

F1 F19

Pin#

12

13

14

15

8

9

10

11

16

17

18

19

6

7

4

5

1

2

3

A B C D E

DVI0_TX0+ DVI0_TX0-

DGND DGND

DVI0_TX2+ DVI0_TX2-

DGND DGND

DVI2_TX0+ DVI2_TX0-

DGND DGND

DVI2_TX2+ DVI2_TX2-

NC

NC

NC

NC

NC

NC

NC

DVI0_TX1+ DVI0_TX1-

DGND DGND

DVI0_TXC+ DVI0_TXC-

DGND DGND

DVI2_TX1+ DVI2_TX1-

DGND DGND

DVI2_TXC+ DVI2_TXC-

DGND DGND NC DGND DGND

DVI3_TX0+ DVI3_TX0DDC3_SCL DVI3_TX1+ DVI3_TX1-

DGND DGND DDC1_SCL DGND DGND

DVI1_TX0+ DVI1_TX0DDC1_SDA DVI1_TX1+ DVI1_TX1-

DGND DGND DDC0_SCL DGND DGND

DVI1_TX2+ DVI1_TX2DDC0_SDA DVI1_TXC+ DVI1_TXC-

DGND DGND DVI0_HPD DGND DGND

DVI3_TX2+ DVI3_TX2DVI3_HPD DVI3_TXC+ DVI3_TXC-

DGND

NC

DGND

NC

DGND

NC

DGND

NC

RGB0_SDA

RGB0_H

RGB0_SCL

RGB0_V

DGND

NC

DGND

NC

DGND

NC

DGND

NC

Table 4-3: XMC I/O Connector Pin Definition

DVI0

DVI1

DVI2

DVI3

RGB0

Power

F

NC

NC

NC

NC

NC

NC

NC

NC

DDC3_SDA

NC

DVI1_HPD

DDC2_SDA

DDC2_SCL

DVI2_HPD

DDC_5V

DDC_5V

RGB0_B

RGB0_G

RBG0_R

20 Board Interfaces

XMC-G745

5 Getting Started

5.1

Installing the Module

1. Remove the XMC slot filler faceplate from the front panel of the host board (air cooled version only).

2. Insert the faceplate of the XMC module into the XMC slot in the front panel of the host board (air cooled version only).

3. Carefully align the male connectors of the XMC module

(component-side down) to the female connectors of the host board and firmly press down.

4. Secure the XMC module with the four screws provided from the bottom side of the host board.

Getting Started 21

22

5.2

Driver Installation

Validated Windows 7 drivers for the XMC-G745 can be downloaded from the ADLINK website: http://www.adlinktech.com/

PD/web/PD_detail.php?cKind=&pid=1419 . Driver installation procedures are described below.

1. Install the Windows operating system before installing any driver. Most standard I/O device drivers are installed during Windows installation.

2. Install the chipset driver by extracting the contents of

NVIDIA_Graphic_WIN7_64_V_R340.52.zip

and running the program setup.exe

.

3. The driver package will auto-extract to the default location. Change the path if desired.

Getting Started

Important Safety Instructions

XMC-G745

For user safety, please read and follow all instructions ,

WARNINGS , CAUTIONS, and NOTES marked in this manual and on the associated equipment before handling/operating the equipment.

X

X

X

X

X

Read these safety instructions carefully.

Keep this user’s manual for future reference.

Read the specifications section of this manual for detailed information on the operating environment of this equipment.

When installing/mounting or uninstalling/removing equipment:

Z

Z

Z

Z Turn off power and unplug any power cords/cables.

To avoid electrical shock and/or damage to equipment:

Keep equipment away from water or liquid sources;

Keep equipment away from high heat or high humidity;

Z

Keep equipment properly ventilated (do not block or cover ventilation openings);

Make sure to use recommended voltage and power source settings;

Z

Z

Z

Z

Always install and operate equipment near an easily accessible electrical socket-outlet;

Secure the power cord (do not place any object on/over the power cord);

Only install/attach and operate equipment on stable surfaces and/or recommended mountings; and,

If the equipment will not be used for long periods of time, turn off and unplug the equipment from its power source.

Important Safety Instructions 23

X Never attempt to fix the equipment. Equipment should only be serviced by qualified personnel.

A Lithium-type battery may be provided for uninterrupted, backup or emergency power.

WARNING:

Risk of explosion if battery is replaced with one of an incorrect type. Dispose of used batteries appropriately.

X

Z

Z

Z

Z

Equipment must be serviced by authorized technicians when:

The power cord or plug is damaged;

Liquid has penetrated the equipment;

It has been exposed to high humidity/moisture;

It is not functioning or does not function according to the user’s manual;

Z

Z

It has been dropped and/or damaged; and/or,

It has an obvious sign of breakage.

24 Important Safety Instructions

Getting Service

Contact us should you require any service or assistance.

ADLINK Technology, Inc.

Address: 9F, No.166 Jian Yi Road, Zhonghe District

Tel:

Fax:

New Taipei City 235, Taiwan

ᄅקؑխࡉ೴৬ԫሁ 166 ᇆ 9 ᑔ

+886-2-8226-5877

+886-2-8226-5717

Email: [email protected]

Ampro ADLINK Technology, Inc.

Address: 5215 Hellyer Avenue, #110

Tel:

San Jose, CA 95138, USA

+1-408-360-0200

Toll Free: +1-800-966-5200 (USA only)

Fax: +1-408-360-0222

Email: [email protected]

ADLINK Technology (China) Co., Ltd.

Address: Ϟ⍋Ꮦ⌺ϰᮄऎᓴ∳催⾥ᡔುऎ㢇᯹䏃 300 ো (201203)

300 Fang Chun Rd., Zhangjiang Hi-Tech Park

Pudong New Area, Shanghai, 201203 China

Tel:

Fax:

Email:

+86-21-5132-8988

+86-21-5132-3588 [email protected]

ADLINK Technology Beijing

Address: ࣫ҀᏖ⍋⎔ऎϞഄϰ䏃 1 োⲜ߯ࡼ࡯໻ॺ E ᑻ 801 ᅸ (100085)

Rm. 801, Power Creative E, No. 1 Shang Di East Rd.

Beijing, 100085 China

Tel:

Fax:

Email:

+86-10-5885-8666

+86-10-5885-8626 [email protected]

ADLINK Technology Shenzhen

Address: ⏅ഇᏖफቅऎ⾥ᡔುफऎ催ᮄफϗ䘧᭄ᄫᡔᴃು

A1 ᷟ 2 ὐ C ऎ (518057)

2F, C Block, Bldg. A1, Cyber-Tech Zone, Gao Xin Ave. Sec. 7

Tel:

Fax:

Email:

High-Tech Industrial Park S., Shenzhen, 518054 China

+86-755-2643-4858

+86-755-2664-6353 [email protected]

LiPPERT ADLINK Technology GmbH

Address: Hans-Thoma-Strasse 11, D-68163

Tel:

Fax:

Email:

+49-621-43214-0

+49-621 43214-30 [email protected]

XMC-G745

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ADLINK Technology, Inc. (French Liaison Office)

Address: 6 allée de Londres, Immeuble Ceylan

Tel:

91940 Les Ulis, France

+33 (0) 1 60 12 35 66

Fax:

Email:

+33 (0) 1 60 12 35 66 [email protected]

ADLINK Technology Japan Corporation

Address: ͱ 101-0045 ᵅҀ䛑गҷ⬄ऎ⼲⬄䤯ފ⬎

⼲⬄ 374 ɛɳ 4F

3-7-4

KANDA374 Bldg. 4F, 3-7-4 Kanda Kajicho,

Tel:

Fax:

Email:

Chiyoda-ku, Tokyo 101-0045, Japan

+81-3-4455-3722

+81-3-5209-6013 [email protected]

ADLINK Technology, Inc. (Korean Liaison Office)

Address: 137-881 326, 802 ( 昢爎壟 , 微汾瘶捒娯 )

802, Mointer B/D, 326 Seocho-daero, Seocho-Gu,

Tel:

Fax:

Email:

Seoul 137-881, Korea

+82-2-2057-0565

+82-2-2057-0563 [email protected]

ADLINK Technology Singapore Pte. Ltd.

Address: 84 Genting Lane #07-02A, Cityneon Design Centre

Singapore 349584

Tel: +65-6844-2261

Fax:

Email:

+65-6844-2263 [email protected]

ADLINK Technology Singapore Pte. Ltd. (Indian Liaison Office)

Address: #50-56, First Floor, Spearhead Towers

Margosa Main Road (between 16th/17th Cross)

Tel:

Fax:

Email:

Malleswaram, Bangalore - 560 055, India

+91-80-65605817, +91-80-42246107

+91-80-23464606 [email protected]

ADLINK Technology, Inc. (Israeli Liaison Office)

Address: 27 Maskit St., Corex Building

Tel:

Fax:

Email:

Herzliya 4673300, Israel

+972-54-632-5251

+972-77-208-0230 [email protected]

ADLINK Technology, Inc. (UK Liaison Office)

Tel: +44 774 010 59 65

Email: [email protected]

Getting Service