TQ STK-MBa35 User`s Manual

STK-MBa35

User's Manual

STK-MBa35 UM 103

28.03.2013

User's Manual l STK-MBa35 UM 103 l © 2013 by TQ-Group Page i

Table of contents

1.8

1.9

1.10

2.

3.

3.1

3.1.1

3.1.2

1.

1.1

1.2

1.3

1.4

1.5

1.6

1.7

ABOUT THIS MANUAL ...................................................................................................................... 1

Copyright ............................................................................................................................................. 1

Tips on safety ...................................................................................................................................... 1

Symbols and Typographic Conventions .................................................................................... 1

Handling and ESD tips ..................................................................................................................... 2

Registered trademarks ..................................................................................................................... 2

Imprint .................................................................................................................................................. 3

Disclaimer ............................................................................................................................................ 3

Copyright and licence expenses ................................................................................................... 3

Further applicable documents / presumed knowledge ....................................................... 4

Acronyms and definitions ............................................................................................................... 5

BRIEF DESCRIPTION .......................................................................................................................... 7

TECHNICAL DATA .............................................................................................................................. 7

System architecture and system functionality ......................................................................... 7

Block diagram ..................................................................................................................................... 7

System functionality ......................................................................................................................... 7

3.1.2.1

External interfaces ............................................................................................................................. 8

3.1.2.2

Internal interfaces ............................................................................................................................. 8

3.1.2.3

User's interfaces ................................................................................................................................. 8

3.1.2.4

System components ......................................................................................................................... 8

Technical data mechanics, design ............................................................................................... 8 3.1.3

4.

4.1

4.1.1

ELECTRONICS SPECIFICATION ....................................................................................................... 9

External interfaces ............................................................................................................................. 9

Function specification ..................................................................................................................... 9

4.1.1.1

Ethernet 1 (X26B) ............................................................................................................................... 9

4.1.1.2

Ethernet 2 (X26A) ............................................................................................................................ 10

4.1.1.3

RS485 (X32A) .................................................................................................................................... 10

4.1.1.4

RS232 (X32B) ..................................................................................................................................... 11

4.1.1.5

CAN 1 / CAN 2 (X1A) ....................................................................................................................... 12

4.1.1.6

GPIO (X1B) ......................................................................................................................................... 13

4.1.1.7

USB 2.0 Hi-Speed Host (X12-A) ................................................................................................... 14

4.1.1.8

USB 2.0 Hi-Speed OTG (X12-B) .................................................................................................... 15

4.1.1.9

Audio-output right (X27) and left (X28), microphone input (X13) ................................... 15

4.1.1.10

Buzzer (N10) ...................................................................................................................................... 16

4.1.1.11

SD card (X4) ....................................................................................................................................... 16

4.1.1.12

Power-IN (X6) .................................................................................................................................... 16

Page

ii User's Manual l STK-MBa35 UM 103 l © 2013 by TQ-Group

Table of contents (continued)

4.1.2

Electrical characteristics ................................................................................................................ 17

4.1.2.1

Ethernet 1 (X26B) ............................................................................................................................. 17

4.1.2.2

Ethernet 2 (X26A) ............................................................................................................................ 17

4.1.2.3


4.1.2.4


4.1.2.5

RS485 (X32A) .................................................................................................................................... 17

4.1.2.6

RS232 (X32B) ..................................................................................................................................... 17

4.1.2.7

CAN 1/ CAN 2 (X1A) ........................................................................................................................ 18

4.1.2.8

GPIO (X1B) ......................................................................................................................................... 18

4.1.2.9

SD card (X4) ....................................................................................................................................... 18

4.1.2.10

Audio-output right (X27) and left (X28) ................................................................................... 19

4.1.2.11

Microphone input (X13) ................................................................................................................ 19

4.1.2.12

Power-IN (X6) .................................................................................................................................... 19

4.1.3

Connectors and pin assignments ............................................................................................... 20

4.1.3.1

Ethernet 1 (X26B) ............................................................................................................................. 20

4.1.3.2

Ethernet 2 (X26A) ............................................................................................................................ 22

4.1.3.3

RS485 (X32A) .................................................................................................................................... 23

4.1.3.4

RS232 (X32B) ..................................................................................................................................... 24

4.1.3.5

CAN 1/ CAN 2 (X1A) ........................................................................................................................ 25

4.1.3.6

GPIO (X1B) ......................................................................................................................................... 26

4.1.3.7


4.1.3.8


4.1.3.9

Audio-output right (X27) and left (X28) ................................................................................... 29

4.1.3.10

Microphone input (X13) ................................................................................................................ 30

4.1.3.11

SD card (X4) ....................................................................................................................................... 31

4.1.3.12

Power-IN (X6) .................................................................................................................................... 32

Internal interfaces ........................................................................................................................... 33 4.2

4.2.1

Function specification ................................................................................................................... 35

4.2.1.1

Module interface (D10) .................................................................................................................. 35

4.2.1.2

JTAG (X16) ......................................................................................................................................... 35

4.2.1.3

LCD (X22, X23) .................................................................................................................................. 35

4.2.1.4

LCD backlight (X21, X24, X5) ........................................................................................................ 36

4.2.1.5

Touchscreen (X2, X8) ...................................................................................................................... 36

4.2.1.6

LVDS Display (X9) ............................................................................................................................ 37

4.2.1.7

SD card (X25) .................................................................................................................................... 38

4.2.1.8

Power-On (X19) ................................................................................................................................ 38

4.2.1.9

Starterkit interfaces (X7, X10, X14, X15, X18, X31) ................................................................. 39

User's Manual l STK-MBa35 UM 103 l © 2013 by TQ-Group Page iii


4.3.1

4.3.2

4.3.3

4.3.4

4.4

4.4.1

4.4.2

4.4.3

4.2.2

Electrical characteristics ................................................................................................................ 39

4.2.2.1

LCD (X22, X23) .................................................................................................................................. 39

4.2.2.2


4.2.2.2.1

LED driver (X21, X24) ...................................................................................................................... 39

4.2.2.2.2

Backlight power supply (X5) ........................................................................................................ 39

4.2.2.3

Touchscreen (X2, X8) ...................................................................................................................... 40

4.2.2.4

LVDS Display (X9) ............................................................................................................................ 40

4.2.2.5

SD card (X25) .................................................................................................................................... 40

4.2.2.6


4.2.3

Connectors and pin assignment ................................................................................................. 41

4.2.3.1

Module interface (D10) .................................................................................................................. 41

4.2.3.2

JTAG (X16) ......................................................................................................................................... 45

4.2.3.3

LCD (X22, X23) .................................................................................................................................. 46

4.2.3.4


4.2.3.5

Touchscreen (X2, X8) ...................................................................................................................... 49

4.2.3.6

LVDS Display (X9) ............................................................................................................................ 50

4.2.3.7

SD card (X25) .................................................................................................................................... 51

4.2.3.8

Power-On (X19) ................................................................................................................................ 52

4.2.3.9


4.2.3.9.1

Starterkit interface (X7) .................................................................................................................. 53

4.2.3.9.2

Starterkit interface (X10) ............................................................................................................... 54

4.2.3.9.3


4.2.3.9.4


4.2.3.9.5


4.2.3.9.6


4.3

User's interfaces ............................................................................................................................... 59

Reset button (S2) ............................................................................................................................. 59

Status-LEDs external (V77)............................................................................................................ 59

Status-LEDs internal (V22, V24, V25, V46, V78) ....................................................................... 60

DIP switch (S1, S3) ........................................................................................................................... 60

System components ....................................................................................................................... 61

Temperature sensor (D22) ............................................................................................................ 61

I2C address allocation ..................................................................................................................... 61

Battery ................................................................................................................................................. 61

Page

iv User's Manual l STK-MBa35 UM 103 l © 2013 by TQ-Group

7.2

8.

8.1

8.2

9.

9.1

9.2

9.3

5.

6.

6.1

6.1.1

6.1.2

6.1.3

7.

7.1

9.4

9.4.1

9.4.2

9.5

9.6

9.7


SOFTWARE SPECIFICATION .......................................................................................................... 61

MECHANICS SPECIFICATION ........................................................................................................ 62

Construction ..................................................................................................................................... 62

PCB outlines STK-MBa35 ............................................................................................................... 62

STK-MBa35 top view ....................................................................................................................... 63

STK-MBa35 bottom view ............................................................................................................... 64

REQUIREMENTS FOR THE SUPERIOR SYSTEM ......................................................................... 65

Protection against external effects ............................................................................................ 65

Thermal management ................................................................................................................... 65

SAFETY REQUIREMENTS AND PROTECTIVE REGULATIONS ................................................ 66

EMC characteristics ......................................................................................................................... 66

Operational safety and personal security ................................................................................ 66

CLIMATIC AND OPERATIONAL CONDITIONS .......................................................................... 67

Protection against external effects ............................................................................................ 67

Reliability and product life ........................................................................................................... 67

Displays used .................................................................................................................................... 67

Batteries.............................................................................................................................................. 67

General notes ................................................................................................................................... 67

Lithium battery ................................................................................................................................ 67

Environment protection ................................................................................................................ 68

RoHS compliance ............................................................................................................................ 68

WEEE regulation .............................................................................................................................. 68

User's Manual l STK-MBa35 UM 103 l © 2013 by TQ-Group Page v

Table directory

Table 1:

Table 2:

Table 3:

Table 4:

Table 5:

Table 6:

Table 7:

Table 8:

Terms and conventions ............................................................................................................. 1

Acronyms ....................................................................................................................................... 5

Allocation of the GPIOs............................................................................................................ 14

Electrical characteristics of the GPIs .................................................................................... 18

Electrical characteristics of the GPOs .................................................................................. 18

Electrical characteristics of the power supply .................................................................. 19

Overview of the function groups of the power supply ................................................. 19

Ethernet 1 connector (X26B) .................................................................................................. 20

Table 9: Pin assignment Ethernet 1 connector (X26B) ................................................................... 20

Table 10: Status LEDs Ethernet 1 ............................................................................................................. 21

Table 11: Ethernet 2 connector (X26A) ................................................................................................. 22

Table 12: Pin assignment Ethernet 2 connector (X26A) .................................................................. 22

Table 13: RS485 connector (X32A) ......................................................................................................... 23

Table 14: Pin assignment RS485 connector (X32A) ........................................................................... 23

Table 15: RS232 connector (X32B) .......................................................................................................... 24

Table 16: Pin assignment RS232 connector (X32B) ........................................................................... 24

Table 17: CAN 1 and CAN 2 connector (X1A) ...................................................................................... 25

Table 18: Pin assignment CAN 1 and CAN 2 connector (X1A) ....................................................... 25

Table 19: GPIO connector (X1B) .............................................................................................................. 26

Table 20: Pin assignment GPIO connector (X1B) ............................................................................... 26

Table 21: USB Host connector (X12-A) .................................................................................................. 27

Table 22: Pin assignment USB Host connector (X12-A) ................................................................... 27

Table 23: USB OTG connector (X12-B) ................................................................................................... 28

Table 24: Pin assignment USB OTG connector (X12-B) .................................................................... 28

Table 25: Audio output right (X27) and left (X28) .............................................................................. 29

Table 26: Pin assignment audio output right (X27) and left (X28) ............................................... 29

Table 27: Microphone connector (X13)................................................................................................. 30

Table 28: Pin assignment microphone connector (X13) ................................................................. 30

Table 29: External SD card connector (X4) ........................................................................................... 31

Table 30: Pin assignment external SD card connector (X4) ............................................................ 31

Table 31: Power-IN connector (X6) ......................................................................................................... 32

Table 32: Pin assignment Power-IN connector (X6) .......................................................................... 32

Table 33: Allocation of RGB signals on LVDS lines ............................................................................. 37

Table 34: Module interface connector (D10) ....................................................................................... 41

Table 35: Pin assignment module connector (D10-X1) ................................................................... 42



Page

vi User's Manual l STK-MBa35 UM 103 l © 2013 by TQ-Group

Table directory (continued)

Table 38: JTAG connector (X16) .............................................................................................................. 45

Table 39: Pin assignment JTAG connector (X16) ................................................................................ 45

Table 40: LCD connectors (X22, X23) ..................................................................................................... 46

Table 41: Pin assignment LCD connectors (X22, X23) ...................................................................... 46

Table 42: LCD backlight connectors (X21, X24) .................................................................................. 48

Table 43: Pin assignment LCD backlight connectors (X21, X24) ................................................... 48

Table 44: LCD backlight connector (X5) ................................................................................................ 48

Table 45: Pin assignment LCD backlight connector (X5) ................................................................. 48

Table 46: Touchscreen connector (X2) .................................................................................................. 49

Table 47: Touchscreen connector (X8) .................................................................................................. 49

Table 48: Pin assignment touchscreen connector (X2, X8) ............................................................. 49

Table 49: LVDS Display connector (X9) ................................................................................................. 50

Table 50: Pin assignment LVDS Display connector (X9) .................................................................. 50

Table 51: Internal SD card connector (X25) ......................................................................................... 51

Table 52: Pin assignment internal SD card connector (X25) .......................................................... 51

Table 53: Power-On connector (X19) ..................................................................................................... 52

Table 54: Pin assignment touchscreen connectors (X2, X8) ........................................................... 52

Table 55: Starterkit interface connector (X7) ....................................................................................... 53

Table 56: Pin assignment Starterkit interface connector (X7) ........................................................ 53

Table 57: Starterkit interface connector (X10) .................................................................................... 54

Table 58: Pin assignment Starterkit interface connector (X10) ..................................................... 54









Table 67: Reset button (S2) ....................................................................................................................... 59

Table 68: External Status-LEDs (V77)...................................................................................................... 59

Table 69: Overview external LEDs ........................................................................................................... 59

Table 70: Overview internal LEDs ........................................................................................................... 60

Table 71: DIP switch S1 .............................................................................................................................. 60

Table 72: DIP switch S3 .............................................................................................................................. 60

Table 73: I2C address allocation ............................................................................................................... 61

Table 74: RTC battery .................................................................................................................................. 61

User's Manual l STK-MBa35 UM 103 l © 2013 by TQ-Group Page vii

Illustration directory

Illustration 1:

Illustration 2:

Illustration 3:

Illustration 4:

Illustration 5:

Illustration 6:

Illustration 7:

Illustration 8:

Illustration 9:

Illustration 10:

Illustration 11:

Illustration 12:

Illustration 13:

Illustration 14:

Illustration 15:

Illustration 16:

Illustration 17:

Illustration 18:

Illustration 19:

Illustration 20:

Illustration 21:

Illustration 22:

Illustration 23:

Illustration 24:

Illustration 25:

Illustration 26:

Illustration 27:

Illustration 28:

Illustration 29:

Illustration 30:

Illustration 31:

Illustration 32:

Illustration 33:

Illustration 34:

Illustration 35:

Illustration 36:

Illustration 37:

Illustration 38:

Illustration 39:

Illustration 40:

Block diagram STK-MBa35 ............................................................................................. 7

External interfaces of the STK-MBa35 ........................................................................ 9

Block diagram Ethernet 1 .............................................................................................. 9

Block diagram Ethernet 2 ............................................................................................ 10

Block diagram RS485..................................................................................................... 10

Block diagram RS232..................................................................................................... 11

Block diagram CAN ........................................................................................................ 12

Block diagram GPIO ....................................................................................................... 13

Block diagram USB Host ............................................................................................... 14

Block diagram USB OTG ............................................................................................... 15

Block diagram audio ..................................................................................................... 15

Block diagram buzzer ................................................................................................... 16

Block diagram external SD card ................................................................................. 16

Block diagram Power-IN............................................................................................... 16

Wiring of connector X26B............................................................................................ 21

Wiring of connector X32A ........................................................................................... 23

Wiring of connector X32B............................................................................................ 24

Wiring of connector X1A .............................................................................................. 25

Wiring of connector X1B .............................................................................................. 26

Wiring of connector X12-A .......................................................................................... 27

Wiring of connector X12-B .......................................................................................... 28

Wiring of connector X27 / X28 ................................................................................... 29

Wiring of connector X13 .............................................................................................. 30

Wiring of connector X4................................................................................................. 31

Wiring of connector X6................................................................................................. 32

Component placement top ........................................................................................ 33

Component placement bottom ................................................................................ 34

Block diagram LCD......................................................................................................... 35

Block diagram LCD backlight ..................................................................................... 36

Block diagram touchscreen ........................................................................................ 36

Block diagram LVDS Display ....................................................................................... 37

Block diagram internal SD card.................................................................................. 38

Block diagram Power-On ............................................................................................. 38

Wiring of connector D10 .............................................................................................. 41

Wiring of connector connectors X21, X24 .............................................................. 48

Wiring of connector X25 .............................................................................................. 51

Block diagram LED ......................................................................................................... 59

PCB outlines STK-MBa35 .............................................................................................. 62

Top view ............................................................................................................................ 63

Bottom view..................................................................................................................... 64

Page

viii User's Manual l STK-MBa35 UM 103 l © 2013 by TQ-Group

Revision history

Rev. Date Name

100 14.04.2011 Petz

101 01.08.2011 Petz

102

103

24.05.2012

28.03.2013

Petz

Petz

Pos.

Illustration 2

Table 39

7.1.1

7.1.2

8.1.1

8.1.2

Section 5

All

9.4.2

Modification

Document created

Replaced

Remarks corrected

7.1

7.2

8.1

8.2

Typo

Link to Wiki added

Signal description of WP and CD# corrected

Updated

User's Manual l STK-MBa35 UM 103 l © 2013 by TQ-Group Page 1

Copyright protected © 2013 by TQ-Systems GmbH.

This User’s Manual may not be copied, reproduced, translated, changed or distributed, completely or partially in electronic, machine readable, or in any other form without the written consent of TQ-Systems GmbH.

Improper or incorrect handling of the product can substantially reduce its life span.

Table 1: Terms and conventions

Symbol /

Visual Cue

Meaning

This symbol represents the handling of electrostatic-sensitive modules and / or components. These components are often damaged / destroyed by the transmission of a voltage higher than about 50 V. A human body usually only experiences electrostatic discharges above approximately 3,000 V.

This symbol indicates the possible use of voltages higher than 24 V. Please note the relevant statutory regulations in this regard. Non-compliance with these regulations can lead to serious damage to your health and also cause damage / destruction of the component.

This symbol indicates a possible source of danger. Acting against the procedure described can lead to possible damage to your health and / or cause damage / destruction of the material used.

This symbol represents important details or aspects for working with TQproducts.

Command

A font with fixed-width is used to denote commands, file names, or menu items.

Page

2 User's Manual l STK-MBa35 UM 103 l © 2013 by TQ-Group

General handling of your TQ-products

The TQ-product may only be used and serviced by certified personnel who have taken note of the information, the safety regulations in this document and all related rules and regulations.

A general rule is: do not touch the TQ-product during operation. This is especially important when switching on, changing jumper settings or connecting other devices without ensuring beforehand that the power supply of the system has been switched off.

Violation of this guideline may result in damage / destruction of the module and be dangerous to your health.

Improper handling of your TQ-product would render the guarantee invalid.

Proper ESD handling

The electronic components of your TQ-product are sensitive to electrostatic discharge (ESD).

Always wear antistatic clothing, use ESD-safe tools, packing materials etc., and operate your TQ-product in an ESD-safe environment. Especially when you switch modules on, change jumper settings, or connect other devices.

TQ-Systems GmbH aims to adhere to the copyrights of all the graphics used and texts in all publications and strives to use original or license-free graphics and texts.

All the brand names and trademarks mentioned in the publication, including those protected by a third party, unless specified otherwise in writing, are subjected to the specifications of the current copyright laws and the proprietary laws of the present registered proprietor without any limitation. One should conclude that brands and trademarks are protected through the rights of a third party.


TQ-Systems GmbH

Gut Delling, Mühlstraße 2

82229 Seefeld

Tel: +49 (0)8153 9308–0

Fax: +49 (0)8153 9308–134

Email:

[email protected]

Web:

http://www.tq-group.com/

TQ-Systems GmbH does not guarantee that the information in this manual is up-to-date, correct, complete or of good quality. Nor does TQ-Systems assume guarantee for further usage of the information. Liability claims against TQ-Systems GmbH, referring to material or non-material related damages, caused due to usage or non-usage of the information given in the manual, or caused due to usage of erroneous or incomplete information, are exempted, as long as there is no proven, intentional or negligent fault of TQ-Systems GmbH.

TQ-Systems GmbH explicitly reserves the rights to change or add to the contents of this manual or parts of it without special notification.

The drivers and utilities for the components used as well as the BIOS are subject to the copyrights of the respective manufacturers. The licence conditions of the respective manufacturer are to be adhered to.

Bootloader-licence expenses are paid by TQ and are included in the price.

Licence expenses for the operating system and applications are not taken into consideration and must be separately calculated / declared.

Page


Specifications and manual of the modules

These documents describe the service, functionality and special characteristics of the module used (incl. BIOS).

Specifications of the components

The manufacturer's specifications of the components used, for example Compact-Flash cards, are to be taken note of. They contain, if applicable, additional information that must be taken note of for safe and reliable operation. These documents are stored at TQ.

Chip errata:

It is the user's responsibility to make sure all errata published by the manufacturer of each component are taken note of. The manufacturer’s advice should be followed.

Software behaviour:

No warranty can be given, nor responsibility taken for any unexpected software behaviour due to deficient components.

General expertise:

Expertise in electrical engineering / computer engineering is required for the installation and the use of the device.


Acronym

EN

FET

FFC

FPC

FR-4

GND

GPI

GPIO

GPO

HD-D-sub

I/O

I/P

IEEE

IP00

I2C

JTAG

LCD

AC

AGND

ARM®

CAN

CPU

DC

DCE

DGND

DIN

DIP

DTE

EEPROM

EMC

EMMC

The following acronyms and abbreviations are used in this document:

Table 2: Acronyms

Meaning

Alternating Current

Analog Ground

Advanced RISC Machine

Controller Area Network

Central Processing Unit

Direct Current

Data Communication Equipment (e.g. modem)

Digital Ground

Deutsche Industrie Norm

Dual In-line Package

Data Terminal Equipment (e.g. PC)

Electrically Erasable Programmable Read-only Memory

Electromagnetic Compatibility embedded MultiMediaCard (Flash)

Europäische Norm (European Standards)

Field Effect Transistor

Flat Flex Cable

Flexible Printed Circuit

Flame Retardant-4

Ground

General Purpose Input

General Purpose Input/Output

General Purpose Output

High Density D-sub

Input/Output

Input/Power

Institute of Electrical and Electronics Engineers

Ingress Protection 00

Inter-Integrated Circuit

Joint Test Action Group

Liquid Crystal Display

Page


Table 2: Acronyms (continued)

Acronym

PCB

PHY

PMIC

PWM

RAM

RCA

RFU

RGB

RJ

RoHS

RS232

RTC

SD

SDHC

SPI

LED

LVDS

MIC

MII

MMC

MOZI

NC

OTG

SPS

THD+N

UART

UN

USB

VGA

WEEE

WEIM

WP

Meaning

Light Emitting Diode

Low Voltage Differential Signal

Microphone

Media-Independent Interface

Multimedia Card

Module extractor (Modulzieher)

Not Connected

On-The-Go

Printed Circuit Board

Physical (Interface)

Power Management IC

Pulse Width Modulation

Random Access Memory

Radio Corporation of America

Reserved for Future Use

Red Green Blue

Registered Jack

Restriction of (the use of certain) Hazardous Substances

Recommended Standard (serial interface)

Real-Time Clock

Secure Digital

Secure Digital High Capacity

Serial Peripheral Interface

Speicherprogrammierbare Steuerung Programmable Logic Controller (PLC)

Total Harmonic Distortion + Noise

Universal Asynchronous Receiver/Transmitter

United Nations

Universal Serial Bus

Video Graphics Array (640 × 480)

Waste Electrical and Electronic Equipment

Wireless External Interface Module

Write-Protect


The STK-MBa35 is designed to be driven by TQ modules based on the Freescale ARM CPU

MCIMX35 (i.MX35). In combination with a module and a display with touchscreen it offers PC core functionalities and standard interfaces.

By using the functionalities of the Starterkit STK-MBa35 this carrier board forms together with the

TQMa35 a modular system to develop own product ideas.

3.1.1 Block diagram

USB Host type A

USB OTG type A external

SD card

Microphone

3.5 mm phone jack

HP / Line out

2 x Cinch (stereo)

Buzzer

Audio codec

SGTL5000

LCD

LVDS connector

LED backlight

LVDS transmitter

SN75LVDS83B

Backlight driver

LT3518

120-pin plug connector

Tyco 5177986-5

TQMa35


Tyco 5177986-5

Ethernet 2

RJ45

Ethernet controller

LAN9115


Tyco 5177986-3

Opto coupler

Opto coupler

Opto coupler

I

2

C expander

PCA9554

I 2 C expander

PCA9554

CAN transceiver

MCP2551

CAN transceiver

MCP2551

Ethernet transceiver

78Q2133

RS232 transceiver

SP3222E

RS485 transceiver

SP491E

High-Side driver

VN808CM-E

Touch controller

ADS7846

Temperature sensor

LM75CIMM-3

2 x CAN

D-Sub 9-pin

Ethernet 1

RJ45

RS232

D-Sub 9-pin

RS485

D-Sub 9-pin

24 V GPIO

D-Sub 15-pin

Touch

RTC backup battery

Internal

SD card

Illustration 1: Block diagram STK-MBa35

3.1.2 System functionality

The interfaces and system components listed in the following are implemented on the STK-

MBa35. Due to the fact that the STK-MBa35 can be installed in a casing the interfaces are divided into external and internal interfaces.

Page


3.1.2.1 External interfaces

2 × Ethernet 10/100 Mbit

1 × RS485

1 × RS232

2 × CAN

1 × USB 2.0 Hi Speed Host interface

1 × USB 2.0 Hi Speed On-The-Go device interface

1 × GPIO (8 × OUT / 4 × IN)

1 × SD card

2 × Audio output

1 × Microphone input

1 × Power supply

3.1.2.2 Internal interfaces

1 × TQMa35

1 × JTAG

2 × LCD (model dependent)

2 × LCD backlight (model dependent)

2 × Touchscreen (model dependent)

1 × LCD via LVDS (optional)

1 × SD card (optional)

1 × Power-On button

5 × Pin headers and 1 × power supply (Starterkit function / optional)

3.1.2.3 User's interfaces

1 × Reset button

3 × Status LEDs (external)

5 × Status LEDs (internal)

2 × DIP switch

3.1.2.4 System components

Backup battery

Buzzer

Temperature sensor

Power supply

Voltage supervision and reset concept

3.1.3 Technical data mechanics, design

Dimensions PCB (W × D × H):

Overall dimensions (W × D × H):

Weight:

175 × 120 × 2 mm3

175 × 130 × 32 mm3 (app.)

261 g


ELECTRONICS SPECIFIC ATION

Illustration 2: External interfaces of the STK-MBa35

4.1.1 Function specification

4.1.1.1 Ethernet 1 (X26B)

The MII interface of the TQMa35 drives the Ethernet 1 interface.

The Teridian78Q2133 is used as PHY.

TQMa35 - X1

FEC_TXDN

FEC_RXDN

MII

GPIO2_25

TQM_RESET_OUT#

INTR

RSTN#

78Q2133

TPO

TPI

LED0

LED1

Illustration 3: Block diagram Ethernet 1

LED configuration see Table 9 on page 20.

Further LED configurations are programmable.

RJ45

LED

LED

Page


4.1.1.2 Ethernet 2 (X26A)

The Ethernet 2 interface is implemented by using the SMSC WEIM-PHY LAN9115.

This interface is only available if the TQMa35 is equipped with connector X3.

TQMa35 - X3 LAN9115 RJ45

D[15:0]

ADDR[7:1]

OE#_3V3

RW#_3V3

CS#1_3V3

GPIO3_3

GPIO3_4

TQM_RESET_OUT#

D[15:0]

A[7:1]

RD#

WR#

CS#

IRQ

PME

RESET#

TPO

TPI

LED1#

LED2#

LED3#

LED

LED

LED

Illustration 4: Block diagram Ethernet 2

LED configuration see Table 12 on page 22.

4.1.1.3 RS485 (X32A)

The UART2 of the TQMa35 drives the RS485 interface of the STK-MBa35. The optocouplers Avago

HCPL0631 and HCPL0601 are used for galvanic separation. The Recom RSS-0505/HP serves as the power supply for the galvanically separated part of the RS485 interface.

The Exar SP491EEN-L is used as RS485 transceiver.

TQMa35 - X1 galvanic separation

SP491E

S3-4

D-Sub 9

UART2_CTS#

UART2_TxD

HCPL0631

DE

DI

Y/Z

UART2_RxD HCPL0601 RO

A/B n.a.

RE#

RSS-0505/HP

S3-3

Illustration 5: Block diagram RS485

The RS485 signals can be terminated with 120 Ω with either DIP switch S3 or cable-sided by

bridging pins 8 / 9 (RxD) and 1 / 7 (TxD). Details can be found in Table 72 on page 60.


4.1.1.4 RS232 (X32B)

The UART3 interface of the TQMa35 drives the RS232 interface of the STK-MBa35 by default.

The Exar SP3222EEA-L is used as a driver. The RS232 interface driver on the TQMa35 can be used as an alternative. This uses UART1 of the TQMa35. It is however not recommended due to EMC reasons.

TQMa35 - X1

RS232_TX

RS232_RX n.a.

n.a.

UART3_TxD

UART3_CTS

SP3222E

T1IN T1OUT

T2IN T2OUT

D-Sub 9

TxD

RTS

UART3_RxD

UART3_RTS

R1OUT

R2OUT

R1IN

R2IN

RxD

CTS

Illustration 6: Block diagram RS232

The CPU i.MX35 on the TQMa35 is designed as data communication equipment (DCE).

The signals RTS and CTS do therefore not behave as in data terminal equipment (DTE, e.g., PC).

The signal UART3_RTS of the TQMa35 is an input, the signal UART3_CTS of the TQMa35 is an output.

To compensate for this behaviour of the i.MX35, the signals RTS and CTS are crossed on the STK-

MBa35: the CTS signal coming from an external source via (X32_8B) is routed as signal

UART3_RTS on the STK-MBa35 to pin X1_108 of the TQMa35 the RTS signal going to an external receiver via (X32_7B) comes as signal UART3_CTS on the STK-MBa35 from pin X1_109 of the TQMa35

Page


4.1.1.5 CAN 1 / CAN 2 (X1A)

The two CAN ports of the TQMa35 directly drive both CAN interfaces on the STK-MBa35.

Optocouplers of type Avago HCPL0601 are used for galvanic separation. The Recom RTS-0505/P serves as the power supply for the galvanically separated part of the CAN interface.

Microchip MCP2551T-I/SN are used as CAN transceivers.

TQMa35 - X1 galvanic separation

MCP2551

S1 - 1/2

D-Sub 9

CAN[1,2]TxD HCPL0601 TxD

CANH

CAN[1,2]RxD HCPL0601 RxD

CANL

RTS-0505/P

Illustration 7: Block diagram CAN

The CAN signals can be terminated with 120 Ω by using DIP switch S1 (see Table 71 on page 60).


4.1.1.6 GPIO (X1B)

Eight GPIO outputs and four GPIO inputs are made available at an external connector.

A voltage of 24 V ±20 % at the GPIO connector serves as the power supply. Due to the placement option the supply voltage of the STK-MBa35 can alternatively be used as the power supply. In this case the user has to ensure the correct level of the input voltage.

Two NXP (PCA9554D) 8 bit I2C bus I/O port circuits generate the GPIOs. This circuit offers eight bidirectional GPIO ports, which can drive and sink 10 mA.

The I2C addresses of both I2C I/O ports are listed in section 4.4.1 on page 61.

The basic circuit of the GPIO connection on the STK-MBa35 is shown in Illustration 8. The

remaining four I/O ports are used for two user-LEDs (yellow and red) at V77, to switch on the backlight via connector X5 and to switch on the LVDS transmitter (LVDS Display).

TQMa35 - X1

PCA9554 VN808CM-E D-Sub 15

I2C 1

STATUS

GPIO1_12

PCA9554

10 nF

USER_LED1

USER_LED2

LD_BKL_ON

LCD_LVDS_ENA

10 k

100 pF

Illustration 8: Block diagram GPIO

Page


Table 3: Allocation of the GPIOs

Signal I2C base address I/O port Direction

GPO1

GPO2

GPO3

GPO4

GPO5

GPO6

GPO7

GPO8

GPI1

GPI2

GPI3

GPI4

USER_LED1

USER_LED2

LD_BKL_ON

LCD_LVDS-ENA

0x20

0x21

IO0

IO1

IO2

IO3

IO4

IO5

IO6

IO7

IO0

IO1

IO2

IO3

IO4

IO5

IO6

IO7

4.1.1.7 USB 2.0 Hi-Speed Host (X12-A)

The USB host interface of the TQMa35 is routed directly to the USB-A jack X12-A, including the protection circuit. The over-current protection is implemented with a Texas Instruments

TPS2042B.

O

O

O

O

I

I

I

I

O

O

O

O

O

O

O

O

Illustration 9: Block diagram USB Host


4.1.1.8 USB 2.0 Hi-Speed OTG (X12-B)

The USB OTG interface is configured as the host by default and cannot be connected to a PC as device.

To offer OTG functionality it is possible to provide a USB-Mini-AB jack or Mini-B by a placement option.

However, as a result the USB 2.0 Hi Speed interface falls away.

TQMa35 - X2

USBOTG_UDM/UDP

USBOTG_VBUS

D+ / D-

TPS2042B

USB

A-Type

USBOTG_PSW# EN2#

OUT2 VBUS

USBOTG_OC OC2#

LED

USBOTG_UID

USB Mini-AB

D+ / D-

VBUS

ID

Illustration 10: Block diagram USB OTG

4.1.1.9 Audio-output right (X27) and left (X28), microphone input (X13)

The audio-functionality is implemented with a Freescale SGTL5000 on the STK-MBa35.

TQMa35 - X1/X2

I2S

I2C1

SGTL5000

HP_L

I2S

CTRL

HP_VGND

HP_R

Cinch

Cinch

CLKO SYS_MCLK

MIC

100 nF Phone jack

Illustration 11: Block diagram audio

The SGTL5000 can be accessed via I2C base address 0x0A.

Page


4.1.1.10 Buzzer (N10)

The PWM output of the TQMa35 controls the buzzer.

TQMa35 - X2

PWM

Buzzer

Illustration 12: Block diagram buzzer

4.1.1.11 SD card (X4)

The external SD card is connected to the SD1 bus of the TQMa35. Card-Detect and Write-Protect of the card are connected to GPIOs of the TQMa35.

Illustration 13: Block diagram external SD card

4.1.1.12 Power-IN (X6)

For protective and EMC reasons the supply input of the STK-MBa35 is designed very robustly.

Plug connector

24 V

Fuse

3.5 A, F

Overvoltage protection

30 V

Filter

Reverse polarity protection

Overvoltage protection

30 V

Filter

Switching regulator

Illustration 14: Block diagram Power-IN


4.1.2 Electrical characteristics


Type of media:

Interface on module:

Status LEDs:

Signal characteristic:


Type of media:


Status LEDs:


10/100 Mbit

MII interface (controller on the module TQMa35)

See Table 9 on page 20

Compatible with the IEEE-802.3 standard

10/100 Mbit

External memory bus (WEIM) / controller on the STK-MBa35


Compatible with the IEEE-802.3 standard


Type of media:



ESD protection:

USB 2.0 Hi-Speed, 5 V bus voltage (limited to 500 mA)

USB Host physical

Compatible with the Universal Serial Bus Specification Rev. 2.0

±15 kV human body model


Type of media:



ESD protection:

USB 2.0 OTG Hi-Speed, 5 V bus voltage (limited to 500 mA)

USB OTG physical (only OTG / cannot be used as device)

Compatible with the Universal Serial Bus Specification Rev. 2.0


4.1.2.5 RS485 (X32A)

Transfer rate:


Handshake:


ESD protection:

Up to 4 Mbit/s (full-duplex)

UART2

Used for clearing the transmission direction

Compatible with the EIA/TIA-485 standard / galvanically separated


4.1.2.6 RS232 (X32B)

Transfer rate:


Handshake:


ESD protection:

Up to 120 Kbit/s

UART3 resp. RS232 (optional)

RTS/CTS (via UART3) resp. none (via RS232 from module / optional)

Compatible with the EIA/TIA-232 standard


Page


4.1.2.7 CAN 1/ CAN 2 (X1A)

Transfer rate:



ESD protection:

Up to 1 Mbit/s

CAN1 resp. CAN2

Compatible with the ISO-11898 standard (CAN 2.0B) / galvanically separated

6 kV human body model

4.1.2.8 GPIO (X1B)

Type of media:



ESD protection:

24 V GPIOs (according to the SPS standard)

I2C1

See Table 4 / not galvanically separated

600 W pulse power (10 / 1 ms, 0.01 % duty cycle)

Table 4: Electrical characteristics of the GPIs

Parameter Min. Typ. Max. Unit

Input frequency (hardware limitation)

Input voltage V

IN

Input current (V

IN

= 28 V)

Positive trigger level (LOW-to-HIGH)

0

4.4 5.3

15

28

2.5

7.5 kHz

V mA

V

Negative trigger level (HIGH-to-LOW) 2.2 3.1 5.3 V

Depending on the operating system and its workload the maximum input frequency can be significantly lower than the value specified by the hardware.

Table 5: Electrical characteristics of the GPOs

Parameter

Output frequency

Supply voltage (V

CC24V_EX

)

Output voltage (depending on R

Load

)

Load resistance R

Load

Load inductance (V

CC24V_EX

= 24 V, R

Load

= 48 Ω)

Output current of a single output

Output current of all outputs together

Short circuit current (V

CC24V_EX

= 24 V, R

Load

= 10 mΩ)

4.1.2.9 SD card (X4)

Type of media:



Min.

12

48

0.7

Typ.

24

<V

CC24V_EX

Max.

3

30

2

700

5

1.7

Unit kHz

V

V

Ω

H mA

A

A

SD / SDHC card

SD 4-bit

Compatible with the SD Host Controller Standard Specification version 2.0

Support for high capacity SD memory cards


4.1.2.10 Audio-output right (X27) and left (X28)

SNR (–60 dB Input):

THD+N:

Load:

Power output:

98 dB

–86 dB

16 Ω

58 mW

4.1.2.11 Microphone input (X13)

Input:

Gain:

Mono

Programmable (0, +20, +30, +40 dB)

4.1.2.12 Power-IN (X6)

Table 6: Electrical characteristics of the power supply

Parameter Min. Typ. Max. Unit

Input voltage

Input current

Power consumption

15 24

190

4.56

30

Rated current of the fuse 3.5

Voltage drop in the fuse

Melting time of the fuse (t < 10 ms) 3.9

Melting time of the fuse (I = 10

∗

I

N

) 3.3

The specified standard power supply for the STK-MBa35 is the following:

0.13

V mA

W

A

V

A2s

A2s

IPCX86MM NT REV. 100 18 V (max. 3.9 A)

With the abovementioned power supply the low voltage directives according to EN 60950 are met. In the case where another power supply is used or if the device is supplied from a 24 V power grid, it is the customer’s responsibility to make sure the specified maximum ratings and standards are met.

Table 7: Overview of the function groups of the power supply

Parameter Min.

Reverse voltage protection Yes, actively via serial FET (max. 30 V for both polarities allowed)

Excess voltage protection

Yes, voltage limitation to 30 V.

With lasting excess voltage the assembly can be damaged!

Short circuit protection

Filter

Yes. Passive over current protection by soldered ceramic fuse.

Integrated filters for the power supply input.

Page


4.1.3 Connectors and pin assignments


Table 8: Ethernet 1 connector (X26B)

Manufacturer / number Description

Tyco / 6368011-3

Type: 2 × RJ45 jack

Eight contacts each

LEDs: green and yellow

–40 °C to +80 °C

The following table shows the configuration of the Ethernet 1 connector.

Table 9: Pin assignment Ethernet 1 connector (X26B)

Pin Signal

7

8

5

6

3

4

1

2

TX+

TX–

RX+

Termplane

Termplane

RX–

Termplane

Termplane

M DGND

LED1 Link_Activity

LED2 Speed_Indicator

Type

–

–

–

I

O

O

I

–

P

–

–

Remark

Galvanically separated



75 Ω, AC coupled to DGND

Connected to pin 4



Connected to pin 7

Ground housing




Two LEDs are used for diagnosis of the interface. The LEDs are visible from the outside and can be configured via the register MR23 of the Ethernet transceiver.

Table 10: Status LEDs Ethernet 1

Register MR23

0000

0001

0010

0011

0100

0101

0110

0111

1000

Status display

Link OK

RX/TX activity

TX activity

RX activity

Collision

100 BASE-TX mode

10 BASE-T mode

Full-duplex

LED on: Link OK

Blinking: RX/TX activity

Remark

Standard for yellow LED

Standard for green LED

Illustration 15: Wiring of connector X26B

Page



Table 11: Ethernet 2 connector (X26A)


Tyco / 6368011-3

Type: 2 × RJ45 jack

Eight contacts each

LEDs: green and yellow

–40 °C to +80 °C

Two LEDs are used for diagnosis of the interface. The LEDs are visible from the outside and have predefined functions.

The following table shows the configuration of the Ethernet 2 connector.

Table 12: Pin assignment Ethernet 2 connector (X26A)

Pin Signal Type Remark

6

7

8

M

1

2

3

4

5

TX+

TX–

RX+

Termination

Termination

RX–

Termination

Termination

DGND

LED1 Link_Activity

LED2 Speed_Indicator

I

–

–

P

O

O

I

–

–

–

–






Ethernet 1; galvanically separated



Ground housing

Link activity (green LED)

LED on:

LED off:

Valid link and network cable plugged in

No valid link, network cable not plugged in

Blinking: Packet transmission (transmission or reception)

Speed indicator (yellow LED)

LED on: 100 Mbit/s, disconnected resp. autonegotiation

LED off: 10 Mbit/s

Duplex indicator (green LED)

LED on: Full-duplex

LED off: Half-duplex

LED3

V78

Duplex_Indicator –

LED V78 is visible from outside

(positioned on the right hand side of the RJ45 jack)

Wiring of X26A see Illustration 15 on page 21.


Pin

5

6

7

8

1

2

3

4

9

M

4.1.3.3 RS485 (X32A)

Table 13: RS485 connector (X32A)


Yamaichi / DDP-011S1

Dual standard D-sub connector

9-pin each

–55 °C to +105 °C

The following table shows the configuration of the RS485 connector.

Table 14: Pin assignment RS485 connector (X32A)

Signal

RS485_Y

NC

NC

RS485_A

GND_S2

RS485_Z

120R_TX

120R_RX

RS485_B

DGND

Type Remark

P

O

–

–

O

–

–

I

I

P

Non inverted output / galvanically separated

Not connected

Not connected

Non inverted input / galvanically separated

Ground / galvanically separated

Inverted output / galvanically separated

Bridge to pin 1 for 120 Ω termination

Bridge to pin 9 for 120 Ω termination

Inverted input / galvanically separated

Ground housing

Illustration 16: Wiring of connector X32A

Attention: Destruction or malfunction!

Due to three physically identical 9-pin D-sub connectors there is the danger of confusion between RS232, RS485 and CAN.

The exact arrangement of the interfaces is shown in Illustration 2 on page 9.

Page


Pin

5

6

7

8

1

2

3

4

9

M

4.1.3.4 RS232 (X32B)

Table 15: RS232 connector (X32B)


Yamaichi / DDP-011S1

Dual Standard D-sub connector

9-pin each

–55 °C to +105 °C

The following table shows the configuration of the RS232 connector.

Table 16: Pin assignment RS232 connector (X32B)

Signal

NC

RS232_RxD

RS232_TxD

NC

DGND

NC

RS232_RTS

RS232_CTS

NC

DGND

Type

P

–

O

I

–

I

O

–

–

P

Remark

Not connected

Received Data

Transmitted Data

Not connected

Ground

Not connected

Request To Send

Clear To Send

Not connected

Ground






4.1.3.5 CAN 1/ CAN 2 (X1A)

Table 17: CAN 1 and CAN 2 connector (X1A)

Pin

1

2

3

4

5

6

7

8

9

M


Yamaichi / DDPXR-E9P/E15S-C4N-CT

Dual Standard D-sub connector / jack

Top: 9-pin jack

Bottom: 15-pin jack

–55 °C to +105 °C

The following table shows the configuration of the connector for both CAN interfaces.

Table 18: Pin assignment CAN 1 and CAN 2 connector (X1A)

Signal

CANL_2

CANL_1

GND_CAN

CANH_2

NC

NC

CANH_1

NC

NC

DGND

Type

I/O

I/O

P

I/O

–

–

I/O

–

–

P

Remark

CAN Low-Level I/O of CAN 2 / galvanically separated

CAN Low-Level I/O of CAN 1 / galvanically separated

Ground / galvanically separated

CAN High-Level I/O of CAN 2 / galvanically separated

Not connected

Not connected

CAN High-Level I/O of CAN 1 / galvanically separated

Not connected

Not connected

Ground housing

Illustration 18: Wiring of connector X1A




Page


4.1.3.6 GPIO (X1B)

Table 19: GPIO connector (X1B)

Pin

9

10

11

12

13

14

15

M

1

2

3

4

5

6

7

8


Yamaichi / DDPXR-E9P/E15S-C4N-CT

Dual Standard D-sub connector / jack

Top: connector 9-pin

Bottom: jack 15-pin

–55 °C to +105 °C

The following table shows the configuration of the GPIO connector.

Table 20: Pin assignment GPIO connector (X1B)

Signal

OUT6

OUT5

OUT4

OUT3

OUT2

OUT1

OUT0

DGND

IN0

IN1

IN2

IN3

GND_EX

VCC24V_EX

GND_EX

OUT7

Type

O

O

O

O

O

O

O

P

I

I

P

P

I

I

P

O

Remark

Input 0

Input 1

Input 2

Input 3

Ground

Supply input for the outputs

Ground

Output 7

Output 6

Output 5

Output 4

Output 3

Output 2

Output 1

Output 0

Ground housing



The 15-pin HD-D-sub connector for GPIO (X1B) looks like a VGA-monitor output.

No monitor may be connected there!



Table 21: USB Host connector (X12-A)


Yamaichi / USB-A-002A

Dual USB jack, type A

U

N

= 30 V AC (rms) / I

N

= 1 A

U max

= 500 V AC for 1 minute

–55 °C to +85 °C

The following table shows the configuration of the USB Host interface connector.

Table 22: Pin assignment USB Host connector (X12-A)

Pin

1

2

3

4

M

Signal

VBUS

DM

DP

DGND

DGND

Type

P

I/O

I/O

P

P

Remark

5 V supply (current limitation to 0.5 A) / 100 µF

Negative differential data line

Positive differential data line

Ground

Ground housing

Illustration 20: Wiring of connector X12-A

Page



Table 23: USB OTG connector (X12-B)

Pin

1

2

3

4

M


Yamaichi / USB-A-002A

Dual USB jack, type A

U

N

= 30 V AC (rms) / I

N

= 1 A

U max


–55 °C to +85 °C

The following table shows the configuration of the USB OTG interface connector.

Table 24: Pin assignment USB OTG connector (X12-B)

Signal

VBUS

DM

DP

DGND

DGND

Type

P

I/O

I/O

P

P

Remark

5 V supply (current limitation to 0.5 A) / 100 µF

Negative differential data line

Positive differential data line

Ground

Ground housing

Illustration 21: Wiring of connector X12-B


4.1.3.9 Audio-output right (X27) and left (X28)

Table 25: Audio output right (X27) and left (X28)


Kycon / KLPX-0848A-2-B

RCA phono jack

U max


–25 °C to +85 °C

The following table shows the configuration of the right audio-output connector.

Table 26: Pin assignment audio output right (X27) and left (X28)

Pin

1

2

Signal

GND

OUTR

Type

P

AO

Remark

Ground

Analog audio output right

Illustration 22: Wiring of connector X27 / X28

Page


Pin

1

2

3

4

4.1.3.10 Microphone input (X13)

Table 27: Microphone connector (X13)


Yamaichi / AJ330-4T-SMT

3.5 mm stereo jack

5,000 mating cycles

U max


The following table shows the configuration of the microphone input connector.

Table 28: Pin assignment microphone connector (X13)

Signal

AGND

AGND

MIC_IN

NC

Type

P

P

AI

–

Remark

Ground

22 kΩ to ground

Analog microphone input

Not connected

Illustration 23: Wiring of connector X13


4.1.3.11 SD card (X4)

Table 29: External SD card connector (X4)


Yamaichi / FPS009-2405-0

SD card and MMC reader

10,000 mating cycles

U max


The following table shows the configuration of the external SD card connector.

Table 30: Pin assignment external SD card connector (X4)


1

2

3

4

DAT3

CMD

DGND

VCC3V3

I/O

I/O

P

P

Data line 3, 100 kΩ

↑

Command / response Signal

Ground

3.3 V supply

5 CLK I Clock input 50 MHz

6

7

8

9

CD

WP

DGND

DAT0

DAT1

DAT2

CD#

WP

P

I/O

I/O

I/O

I

I

Ground


↑


↑


↑

Card Detect

Write Protect, 10 kΩ

↑

COM DGND P Ground

# - low active signal,

↑

- element to VCC5V (pull up),

↓

- element to ground (pull down),

→

- element in series


Page


4.1.3.12 Power-IN (X6)

Table 31: Power-IN connector (X6)


Phoenix Contact / MSTBA 2.5/ 2-G-5.08

Basic package

5.08 mm pitch

2-pin

U

N

= 250 V / I

N

= 12 A

The following table shows the configuration of the 15–30 V power supply connector.

Table 32: Pin assignment Power-IN connector (X6)

Pin

1

2

Signal

VCC24V

GND

Type

P

P

Remark

Input supply voltage

Ground

1 2


(View on contacts from outside)


Illustration 26: Component placement top

Page


Illustration 27: Component placement bottom


4.2.1 Function specification

4.2.1.1 Module interface (D10)

The module interface of the TQMa35 module on which the module is plugged consists of two or three connectors.


To avoid damages caused by mechanical stress, the TQMa35 may only be extracted from the carrier board by using the extraction tool MOZI8XXL. 2.5 mm should be kept free on the carrier board, along the longitudinal edges on both sides of the module for the extraction tool MOZI8XXL.

4.2.1.2 JTAG (X16)

On the TQMa35 the CPUs’ JTAG interface is routed directly to a 2.54 mm pitch pin header.


The JTAG signals at the connector are directly routed to the CPU.

No ESD measures are taken, as it is an internal interface.

4.2.1.3 LCD (X22, X23)

On the STK-MBa35 the LCD bus of the TQMa35 is conditioned by a Texas Instruments driver

74LVC541 and routed to two FFC connectors (placement option). For EMC reasons every signal of the LCD bus is terminated with 22 Ω.

Illustration 28: Block diagram LCD

Page


4.2.1.4 LCD backlight (X21, X24, X5)

As a placement option the STK-MBa35 offers a driver for displays with LED backlight. A Linear

Technology LT3518 is used for this purpose. A 12 V supply of up to 2 A, as well as the signals

LD_BKL_ON and LD_CONTRAST are available at another connector.

Illustration 29: Block diagram LCD backlight

In Table 3 on page 14 the mapping of the signal LD_BKL_ON is described.

4.2.1.5 Touchscreen (X2, X8)

A Texas Instruments ADS7846N touch controller is integrated on the STK-MBa35, which is routed to the SPI2 interface of the TQMa35. In this way a 4-wire touchscreen can be connected to the

STK-MBa35. The lines of the touchscreen are equipped with protective ESD diodes, as well as a

CLC filter.

Two connectors are available as placement option: an FFC connector with 1.25 mm pitch, or a pin header with 2.54 mm pitch.

Illustration 30: Block diagram touchscreen

In Table 3 on page 14 the mapping of the signal LCL_LVDS-ENA is described.


4.2.1.6 LVDS Display (X9)

An LVDS transmitter, which transforms the data signals of the LCD bus to LVDS level, is implemented on the

STK-MBa35 as a placement option. A Texas Instruments SN75LVDS83B is used for this.

Illustration 31: Block diagram LVDS Display

Table 33: Allocation of RGB signals on LVDS lines

Input SN75LVDS83B

D11

D12

D13

D14

D15

D16

D17

D18

D19

D20

D21

D22

D23

D24

D25

D26

D27

CLKIN

CLKSEL

D5

D6

D7

D8

D9

D10

D0

D1

D2

D3

D4

TQMa35 signal

LD16

LD17

LD18

LD19

LD20

LD23

LD21

LD8

LD9

LD10

LD14

LD15

LD11

LD12

LD13

LD0

LD6

LD7

LD1

LD2

LD3

LD4

LD5

–

LD_HSYNC

LD_VSYNC

LD_DRDY

LD22

LD_CLK

Remark

In the i.MX35 Reference Manual the assignment of the RGB signals on the LCD bus of the i.MX35 can be looked up.

Pull-down

Pull-down

Page


4.2.1.7 SD card (X25)

The internal SD card is connected to the SD3 bus of the TQMa35. Card-Detect and Write-Protect of the card are routed to GPIOs of the TQMa35.

Illustration 32: Block diagram internal SD card

Attention: Usage of SD interface

The internal SD card may only be used if a TQMa35 module without eMMC flash is used.

4.2.1.8 Power-On (X19)

The power-on interface can be used to wake up the TQMa35 from standby and sleep state by a keystroke. The input at the TQMa35 must be configured accordingly.

Illustration 33: Block diagram Power-On


4.2.1.9 Starterkit interfaces (X7, X10, X14, X15, X18, X31)

In order to be able to use all applicable processor signals several pin headers are assembled on the STK-MBa35 when it is used as a Starterkit.


The signals on the Starterkit interfaces are directly routed to the CPU.

No ESD measures are taken as these are internal interfaces.

4.2.2 Electrical characteristics

4.2.2.1 LCD (X22, X23)

Type of interface:

Control signals:

Configuration:

RGB, 18 bit

Clock, Data enable

The configuration of the LCD interface can be looked up in the i.MX35 Reference Manual

The following displays are supported by the STK-MBa35:

PowerView

Data Image

Admatec

T070W2D2

FG0700K5DSSWBG01

NLC800T70D480CTMK


4.2.2.2.1 LED driver (X21, X24)

Output current: 200 mA (app. 10 V)

The LED driver is designed for the supported displays (Admatec, PowerView).

4.2.2.2.2 Backlight power supply (X5)

Type:

Voltage:

Current max

:

Buck regulator

12 V

2 A

Page



Interface on module: SPI2

Interface touchscreen: 4-wire

ESD protection: ±15 kV AD, ±8 kV CD


Type of interface:

Differential pairs:

Control signals:

Configuration:

ESD protection:

LVDS 18 bit / 24 bit

3 × data, 1 × clock

Clock, HSYNC, VSYNC, and DRDY

The configuration of the LCD interface can be looked up in the i.MX35

Reference Manual


4.2.2.5 SD card (X25)

Type of media:



SD / SDHC card

SD 4-bit

Compatible with the SD Host Controller Standard Specification version 2.0

Support for High Capacity SD memory cards


All signals are 3.3 V compatible (except for the RS232 signals) at the Starterkit interfaces.


4.2.3 Connectors and pin assignment

4.2.3.1 Module interface (D10)

Table 34: Module interface connector (D10)


Tyco:

X1, X2: 5177986-5

X3: 5177986-3

Pin header 120-pin, resp. 80-pin

Stack height 5 mm

U max

= 100 V / I max

= 0.5 A

100 mating cycles

The arrangement of the module connectors is shown in the following illustration.

Illustration 34: Wiring of connector D10

The configuration of the module connectors is shown in the following three tables.

Page


Group

Power

Power

Power

Power

Power

Power

General clock

Power

GPIO

Power

GPIO

Power

4x4 keypad

Power

1-Wire

SPI 1

Power

SPI 1

Power

Timer

SD card 3

Power

SD card 3

Power

Ethernet MII

Power

Ethernet MII

Power

CAN 2

CAN 1

UART 3

Power

UART 2

Power

Table 35: Pin assignment module connector (D10-X1)

I/O

I/O

I/O

I/O

P

I/O

O

P

I/O

I

P

I

O

P

I/O

I/O

I/O

P

I

I

O

O

O

I

O

I

O

P

I

O

P

O

I

P

I

O

P

I/O

I/O

P

I/O

I/O

P

I/O

I/O

P

O

P

I/O

P

P

P

P

I/O

I/O

I/O

I/O

I/O

I/O

I/O

P

I/O

P

O

O

O

I/O

I/O

I/O

I/O

I/O

I/O

I/O

P

I/O

I

P

I/O

P

I

P

I

I

I

P

P

I

O

I

I

I

I/O

I

O

P

O

I

P

I/O

I/O

I/O

I/O

I/O

I/O

I/O

P

P

P

P

P

P

P

P

P

I/O

P

I/O

I/O

P

I/O

I/O

I/O

75

77

79

81

67

69

71

73

59

61

63

65

51

53

55

57

83

85

87

89

91

93

95

97

99

101

103

105

107

109

111

113

115

117

119

1

27

29

31

33

19

21

23

25

11

13

15

17

7

9

3

5

43

45

47

49

35

37

39

41

Signal

DGND

SPI1_CLK

SPI1_MISO

SPI1_MOSI

SPI1_RDY

DGND

TIM_CAPIN1

TIM_CMPOUT1

SD3_CMD

SD3_CLK

DGND

SD3_DAT4

SD3_DAT5

SD3_DAT6

SD3_DAT7

DGND

FEC_TXD3

FEC_TX_ER

FEC_TX_EN

FEC_RXD1

DGND

FEC_RXD3

FEC_RX_ER

FEC_RX_DV

FEC_MDC

DGND

CAN2_TX

CAN1_TX

CAN1_RX

UART3_CTS#

DGND

UART2_RTS#

UART2_TXD

UART2_RXD

DGND

VCC3V3

VCC3V3

VCC3V3

VCC3V3

VBAT

DGND

CLKO

DGND

GPIO1_4

GPIO1_5

DGND

GPIO2_7

GPIO2_18

GPIO2_23

GPIO2_25

DGND

ROW0

ROW1

ROW2

ROW3

DGND

OWDAT

SPI1_SS0

SPI1_SS1

SPI1_SS3

76

78

80

82

68

70

72

74

60

62

64

66

52

54

56

58

84

86

88

90

92

94

96

98

100

102

104

106

108

110

112

114

116

118

120

2

28

30

32

34

20

22

24

26

12

14

16

18

8

10

4

6

44

46

48

50

36

38

40

42

Signal

SPI2_MOSI

SPI2_RDY

DGND

I2C1_SCL

I2C1_SDA

I2C2_SCL

I2C2_SDA

DGND

SD3_DAT0

SD3_DAT1

SD3_DAT2

SD3_DAT3

DGND

FEC_TXD0

FEC_TXD1

FEC_TXD2

FEC_TX_CLK

DGND

FEC_RXD0

FEC_RXD2

DGND

FEC_RX_CLK

DGND

FEC_MDIO

FEC_CRS

FEC_COL

CAN2_RX

DGND

UART3_RTS#

UART3_TXD

UART3_RXD

UART2_CTS#

DGND

RS232_TXD

RS232_RXD

VCC3V3

VCC3V3

VCC3V3

VCC3V3

DGND

DGND

DGND

DGND

DGND

GPIO1_12

GPIO1_22

GPIO2_0

DGND

COL0

COL1

COL2

COL3

DGND

GPIO3_3

GPIO3_4

GPIO3_5

SPI2_SS0

DGND

SPI2_CLK

SPI2_MISO

4x4 keypad

Power

GPIO

SPI 2

Power

SPI 2

Power

I2C 1

I2C 2

Power

SD card 3

Power

Ethernet MII

Power

Ethernet MII

Power

Ethernet MII

Power

Ethernet MII

CAN 2

Power

UART 3

UART 2

Power

RS232

Group

Power

Power

Power

Power

Power

Power

Power

Power

Power

GPIO

Power


Power

Group

Reserve

Power Management

Timer

Power

SSI 4

Power

IPU-LCD

Power

IPU-LCD

Power

IPU-LCD

Power

IPU-LCD

Power

IPU-LCD

Power

USB Host Hi-Speed

Power

USB Host Hi-Speed

Power

USB OTG Hi-Speed

Power

SD card 1

Power

SD card 1

IPU-CSI

Power

IPU-CSI

Power

IPU-CSI

Power


CPU-JTAG

94

96

98

100

86

88

90

92

78

80

82

84

70

72

74

76

102

104

106

108

110

112

114

116

118

120

62

64

66

68

54

56

58

60

42

44

46

48

50

52

34

36

38

40

26

28

30

32

18

20

22

24

10

12

14

16

6

8

2

4

Signal

USBHS_UDM

DGND

USB_OTG_DM

USB_OTG_DP

DGND

SD1_CLK

DGND

SD1_CMD

CSI_D1

CSI_D3

CSI_D5

DGND

CSI_D7

CSI_D9

CSI_D11

CSI_D13

DGND

CSI_D15

CSI_VSYNC

CSI_HSYNC

CSI_PIXCLK

DGND

TCK

TMS

TDI

DGND

LD11

LD13

LD15

LD17

DGND

LD19

LD21

LD23

LD_DRDY

DGND

LD_HSYNC

LD_VSYNC

DGND

LD_CLK

DGND

USBHS_UID

DGND

USBHS_UDP

DGND

NC

NC

VSTBY

PWM

DGND

SSI_TXD

SSI_RXD

SSI_TXC

SSI_TXFS

DGND

LD3

LD5

LD7

LD9

DGND

I/O

I

I

I

I

I

P

I

I

I/O 69

P 71

I/O 73

I/O 75

P

O

77

79

P 81

I/O 83

93

95

97

99

85

87

89

91

I

I

P 101

I 103

105

107

I

I

I 109

P 111

113

115

I 117

P 119

P

O

O

O

O

P

O

O

O

O

O

O

P

O

P

I

61

63

P 65

I/O 67

53

55

57

59

41

43

45

47

49

51

33

35

37

39

-

I

P

-

O

P

9

11

I/O 13

I/O 15

5

7

1

3

O

O

O

P

I/O 17

I/O 19

P

O

21

23

25

27

29

31

I/O

I

I

I

P

I

I

P

I

I/O

I/O

I/O

I/O

O

I

I/O

P

I

P

I/O

O

I

I

P

O

O

I

P

I

O

I/O

O

P

O

I

O

O

P

O

O

O

O

P

O

O

P

O

O

O

O

O

O

O

I

I

O

P

P

I

I

I

Power

Signal

USB_OTG_PWR

USB_OTG_UID

USB_OTG_VBUS

DGND

SD1_DAT0

SD1_DAT1

SD1_DAT2

SD1_DAT3

DGND

CSI_D0

CSI_D2

CSI_D4

CSI_D6

DGND

CSI_D8

CSI_D10

CSI_D12

CSI_D14

DGND

CSI_MCLK

DE#

RTCK

JTAG_MOD

DGND

TDO

TRST#

LD0

LD1

LD2

LD4

DGND

LD6

LD8

LD10

FLASH_RESET#

WP#_ACC

DGND

WDOG_RST#

JTAG_RESET#

RESET_IN#

POR#

DGND

LD12

DGND

LD14

LD16

LD18

LD20

DGND

LD22

LD_SPL

LD_REV

LD_CLS

DGND

LD_CONTRAST

USBHS_OC

USBHS_PSW#

USBHS_VBUS

DGND

USB_OTG_OC

Group

NOR-Flash-CTRL

Power

SD card 1

Power

IPU-CSI

Power

IPU-CSI

Power

IPU-CSI

CPU-JTAG

Power

CPU-JTAG

Reset

Power

IPU-LCD

Power

IPU-LCD

Power

IPU-LCD

Power

IPU-LCD

Power

IPU-LCD

USB Host Hi-Speed

Power

USB OTG Hi-Speed

Power

Page



26 Bit address bus

Power

26 Bit address bus

Bus-CTRL

Power

Bus-CTRL

Power

Bus-CTRL

Factory test only

Power

Factory test only

Power

Power

Group

16 Bit data bus

Power

16 Bit data bus

Power

26 Bit address bus

Power

26 Bit address bus

Power

I/O

-

-

P

-

P

-

P 57

O 59

P 61

O 63

O 65

O 67

69

71

73

75

77

79

O 37

O 39

P 41

O 43

O 45

O 47

O 49

P 51

O 53

I 55

P 1

I/O 3

I/O 5

I/O 7

I/O 9

P 11

I/O 13

I/O 15

I/O 17

I/O 19

P 21

O 23

O 25

O 27

O 29

P 31

O 33

O 35

Signal

DGND

BUS_CLK

DGND

EB1#

CS1#

CS5#

DNC

DGND

DNC

DNC

DNC

DGND

A13

A15

DGND

A17

A19

A21

A23

DGND

A25

DTACK#

DGND

D1

D3

D5

D7

DGND

D9

D11

D13

D15

DGND

A1

A3

A5

A7

DGND

A9

A11

I/O

P

-

-

-

-

-

O

P

-

O

O

I

O

P

O

O

O

O

O

O

O

P

I/O

I/O

P

I/O

I/O

O

I/O

I/O

P

I/O

I/O

O

O

O

P

O

P

O

70

72

74

76

78

80

58

60

62

64

66

68

38

40

42

44

46

48

50

52

54

56

12

14

16

18

20

22

2

4

6

8

10

24

26

28

30

32

34

36

Signal

RW#

OE#

ECB#

EB0#

DGND

DNC

DNC

DNC

DNC

DGND

NC

NC

A12

A14

A16

A18

DGND

A20

A22

A24

LBA#

DGND

D0

D2

DGND

D4

D6

D8

D10

DGND

D12

D14

A0

A2

DGND

A4

A6

A8

A10

DGND

Group

16 Bit data bus

Power

16 Bit data bus

Power

16 Bit data bus

26 Bit address bus

Power

26 Bit address bus

Power

26 Bit address bus

Power

26 Bit address bus

Bus-CTRL

Power

Bus-CTRL

Power

Factory test only

Power

Reserve


4.2.3.2 JTAG (X16)

Table 38: JTAG connector (X16)


Samtec / TSM-107-01-L-DV Pin header 2.54 mm, 7 × 2-pin

The following table shows the configuration of the JTAG connector.

Table 39: Pin assignment JTAG connector (X16)


5

6

7

8

1

2

3

4

VCC3V3

DGND

JTAG_TRST#

DGND

JTAG_TDI

NC

JTAG_TMS

MR_RESET#

9 JTAG_TCK

10 JTAG_MOD

11 JTAG_TDO

P

P

I

P

I

–

I

I

I

I

O

Supply voltage 3.3 V

Ground

Test Reset

Ground

Test Data In

(Not connected)

Test Mode Select

0 Ω, not assembled

Test Clock

0 Ω, not assembled

Test Data Out

12 JTAG_RST# I Global module reset

13 JTAG_DE#

14 JTAG_RTCK

I/O

O

Debug Request, 0 Ω, not assembled

Return Clock, 0 Ω, not assembled


↑


↓


→

- element in series

Polarity see Illustration 26 on page 33.

Page


4.2.3.3 LCD (X22, X23)

Table 40: LCD connectors (X22, X23)

Manufacturer / number

Yamaichi / FPC-98210-4021

Description

FPC connector

0.5 mm pitch

U

N

= 50 V / I

N

= 0.5 A

Minimum 30 mating cycles

–20 °C to +85 °C

Table 41: Pin assignment LCD connectors (X22, X23)

14

15

16

17

18

9

10

11

12

13

PowerView

Data Image

(X22)

1

2

3

4

5

6

7

8

Admatec

(X23)

Signal

–

–

–

40

39

38

37

–

28

27

26

25

24

35

34

32

30

29

GND

GND

PowerView: NC

Data Image: ADJ

PowerView/Admatec: VCC3V3

Data Image: VCC5V


Data Image: VCC5V


Data Image: VCC5V

VCC3V3

PowerView: NC

Data Image: VCC3V3

DATA Enable

GND

GND

GND

Blue 5

Blue 4

Blue 3

GND

Blue 2

Blue 1

Type Remark

Supply voltage

P

P

P

O

P

–

P

O

P

P

–

O

P

P

P

P

P

P

O

O

P

O

O

Ground

Ground

PowerView: 100 kΩ

Data Image: LCD_CONTRAST (PWM)

Supply voltage

Supply voltage

Supply voltage

PowerView: not connected

Data Image: Supply voltage

LCD_OE, 22 Ω

→

Ground

Ground

Ground

LCD_D5, 22 Ω

→

LCD_D4, 22 Ω

→

LCD_D3, 22 Ω

→

Ground

LCD_D2, 22 Ω

→

LCD_D1, 22 Ω

→


PowerView

Data Image

(X22)

Admatec

(X23)

Signal Type Remark

31

32

33

34

35

28

29

30

36

37

38

39

40

–

–

22

23

24

25

19

20

21

26

27

11

10

9

8

7

14

13

12

2

1

6

31

5

4

3

20

19

18

17

23

22

21

16

15

GND

Red 5

Red 4

Red 3

GND

Red 2

Red 1

Red 0

GND

GND

DCLK

GND

GND

NC

NC

Blue 0

GND

Green 5

Green 4

Green 3

GND

Green 2

Green 1

Green 0

O

P

O

O

O

P

O

O

–

–

P

P

P

P

O

O

O

P

O

O

P

O

O

O

LCD_D0, 22 Ω

→

Ground

LCD_D11, 22 Ω

→

LCD_D10, 22 Ω

→

LCD_D9, 22 Ω

→

Ground

LCD_D8, 22 Ω

→

LCD_D7, 22 Ω

→

LCD_D6, 22 Ω

→

Ground

LCD_D17, 22 Ω

→

LCD_D16, 22 Ω

→

LCD_D15, 22 Ω

→

Ground

LCD_D14, 22 Ω

→

LCD_D13, 22 Ω

→

LCD_D12, 22 Ω

→

Ground

Ground

LCD_SCLK, 22 Ω

→

/ 10 pF

↓

Ground

Ground not connected not connected

– 33 NC – not connected

– 36 NC – not connected


↑


↓


→

- element in series

Page



Table 42: LCD backlight connectors (X21, X24)


JST / SM02B-BHSS-1-TB

Description

Crimp connector

U

N

= 1,400 V / I

N

= 1 A

–25 °C to +85 °C

Table 43: Pin assignment LCD backlight connectors (X21, X24)

Pin

1

2

Signal

VLEDA

VLEDC

Type

P

P

Remark

Anode of LED backlight

Cathode of LED backlight

Illustration 35: Wiring of connector connectors X21, X24

Table 44: LCD backlight connector (X5)


Harwin / M20-8900405

Description

Pin header 2.54 mm, 1 × 4-pin

I

N

= 3 A

–40 °C to +105 °C

Table 45: Pin assignment LCD backlight connector (X5)

Pin Signal Type

1

2

3

4

VCC12V

LD_BKL_ON

LD_CONTRAST

DGND

P

O

O

P

Wiring see Illustration 27 on page 34.

Remark

Supply voltage 12 V, alternative 5 V

GPIO from PCA9554D to switch the backlight

PWM contrast

Ground



Table 46: Touchscreen connector (X2)


JST / 04FFS-SP-TF

Description

FFC connector

Pitch 1.25 mm

U

N

= 50 V, I

N

= 0.5 A

–25 °C to +85 °C

Table 47: Touchscreen connector (X8)


Harwin / M20-8900405

Description

Pin header 2.54 mm

4 × 1-pin

I

N

= 3 A

–40 °C to +105 °C

Table 48: Pin assignment touchscreen connector (X2, X8)

Pin Signal Type

1

2

3

4

Y–

X+

Y+

X–

I/P

I/P

I/P

I/P


Remark

Touchscreen Bottom

Touchscreen Right

Touchscreen Top

Touchscreen Left

Page



Table 49: LVDS Display connector (X9)


Hirose / DF14-20P-1.25H(25)

Description

Crimp connector

U

N

= 150 V, I

N

= 1 A

–35 °C to +85 °C

Table 50: Pin assignment LVDS Display connector (X9)


5

6

7

8

1

2

3

4

DGND

DGND

LVDS3+

LVDS3–

DGND

LVDSCLK+

LVDSCLK–

DGND

9 LVDS2+

10 LVDS2–

11 DGND

12 LVDS1+

13 LVDS1–

14 DGND

15 LVDS0+

16 LVDS0–

17 DGND

18 DGND

19 VCC3V3

20 VCC3V3

P

O

O

P

P

P

P


P

O

O

P

P

P

O

O

O

O

P

O

O

Ground

Ground

Data pair 3 positive

Data pair 3 negative

Ground

Clock pair positive

Clock pair negative

Ground



Ground



Ground



Ground

Ground

Supply voltage 3.3 V, alternatively 5 V

Supply voltage 3.3 V, alternatively 5 V


4.2.3.7 SD card (X25)

Table 51: Internal SD card connector (X25)


Yamaichi / FPS009-2405-0

SD card and MMC reader

10,000 mating cycles

U max


The following table shows the configuration of the internal SD card connector.

Table 52: Pin assignment internal SD card connector (X25)


1

2

3

4

DAT3

CMD

DGND

VCC3V3

I/O Data line 3, 100 kΩ

↑

I/O Command/Response signal

P

P

Ground

3.3 V supply

5 CLK I Clock input 50 MHz

6

7

8

9

CD

WP

DGND

DAT0

DAT1

DAT2

CD#

WP

P

I

I

Ground

I/O


↑


↑


↑

Card Detect

Write Protect, 10 kΩ

↑

COM DGND P Ground


↑


↓


→

- element in series


Page


4.2.3.8 Power-On (X19)

Table 53: Power-On connector (X19)


Samtec / TSM-104-01-LM-SV-P-TR

Description

Pin header 2.54 mm

4 × 1-pin

I

N

= 3 A

–55 °C to +125 °C

Table 54: Pin assignment touchscreen connectors (X2, X8)


1

2

WAKEUP#

NC

I

–

TQMa35 GPIO1_4

RFU

3 NC – RFU

4 RFU P Ground


↑


↓


→

- element in series



Almost every signal of the i.MX35 has two or more functions at the Starterkit interfaces.

These can be taken from the i.MX35 Reference Manual.


4.2.3.9.1 Starterkit interface (X7)

Table 55: Starterkit interface connector (X7)


Fischer Elektronik / SL11-SMD-052-10-S

Description

Pin header 2.54 mm

5 × 2-pin

–40 °C to +105 °C

Pin

Table 56: Pin assignment Starterkit interface connector (X7)

Signal Type

5

6

7

8

1

2

3

4

VCC3V3

VCC5V

VCC3V3

VCC5V

VCC12V

VCC12V

DGND

DGND

9 DGND

10 DGND

P

P


P

P

P

P

P

P

P

P

Remark


Supply voltage 5 V


Supply voltage 5 V

Supply voltage 12 V

Supply voltage 12 V

Ground

Ground

Ground

Ground

Page





Molex / 87759-3075

Description


–55 °C to +105 °C


Pin Signal

DGND

DGND

WEIM_A0

WEIM_A1

WEIM_A2

WEIM_A3

WEIM_A4

WEIM_A5

WEIM_A6

WEIM_A7

WEIM_A8

WEIM_A9

WEIM_A10

WEIM_A11

WEIM_A12

WEIM_A13

WEIM_A14

WEIM_A15

WEIM_A16

WEIM_A17

WEIM_A18

WEIM_A19

WEIM_A20

WEIM_A21

WEIM_A22

WEIM_A23

WEIM_A24

WEIM_A25

DGND

DGND

9

10

11

12

13

14

15

16

17

18

19

1

2

3

4

5

6

7

8

20

21

22

23

24

25

26

27

28

29

30


O

O

O

O

O

O

O

O

O

O

O

P

P

O

O

O

O

O

O

O

O

O

O

O

O

O

O

O

P

P

Type Remark

Ground

Ground

External memory bus (WEIM bus) address line 0


























Ground

Ground





Molex / 87759-3075

Description


–55 °C to +105 °C



17

18

19

20

21

22

11

12

13

14

15

16

23

24

25

26

27

28

6

7

8

9

10

1

2

3

4

5

DGND

DGND

WEIM_D0

WEIM_D1

WEIM_D2

WEIM_D3

WEIM_D4

WEIM_D5

WEIM_D6

WEIM_D7

WEIM_D8

WEIM_D9

WEIM_D10

WEIM_D11

WEIM_D12

WEIM_D13

WEIM_D14

WEIM_D15

WEIM_DTACK#

WEIM_LBA#

WEIM_BUSCLK

WEIM_RW#

WEIM_ECB#

WEIM_OE#

WEIM_EB0#

WEIM_CS1#

WEIM_EB1#

WEIM_CS5#

I

O

O

O

O

O

P

P

Ground

Ground

I/O External memory bus (WEIM bus) data line 0
















I

O

External memory bus (WEIM bus) Data transfer acknowledge / wait

External memory bus (WEIM bus) Load burst address

O

O

External memory bus (WEIM bus) Burst Clock

External memory bus (WEIM bus) Read / Write

External memory bus (WEIM bus) End current burst / wait

External memory bus (WEIM bus) Out Enable

External memory bus (WEIM bus) Byte Enable 0

External memory bus (WEIM bus) Chip Select 1

External memory bus (WEIM bus) Byte Enable 1

External memory bus (WEIM bus) Chip Select 5

29 DGND P Ground

30 DGND P Ground


↑


↓


→

- element in series


Page





Molex / 87759-3075

Description


–55 °C to +105 °C


Pin Signal Type

DGND

DGND

CSI_D0

CSI_D1

CSI_D2

CSI_D3

CSI_D4

CSI_D5

CSI_D6

CSI_D7

CSI_D8

CSI_D9

CSI_D10

CSI_D11

CSI_D12

CSI_D13

CSI_D14

CSI_D15

CSI_HSYNC

CSI_VSYNC

DGND

DGND

CSI_MCLK

CSI_PIXCLK

DGND

DGND

RS232_TX

RS232_RX

DGND

DGND

9

10

11

12

13

14

15

16

17

18

19

1

2

3

4

5

6

7

8

20

21

22

23

24

25

26

27

28

29

30


I

I

I

I

I

I

I

I

I

I

I

I

I

I

I

I

I

P

P

I

P

P

O

I

P

P

O

I

P

P

Remark

Ground

Ground

Camera Sensor Interface data line 0
















Camera Sensor Interface HSYNC

Camera Sensor Interface VSYNC

Ground

Ground

Camera Sensor Interface Master Clock

Camera Sensor Interface Pixel Clock

Ground

Ground

RS232 Transmit (UART1)

RS232 Receive (UART1)

Ground

Ground





Molex / 87759-3075

Description


–55 °C to +105 °C



DGND

DGND

LD_BKL_ON

LCD_LVDS-ENA

LD_CONTRAST

LD_REV

LD_SPL

LD_CLS

DGND

DGND

USER_LED1

DGND

USER_LED2

I2C2_SCL

DGND

I2C2_SDA

TIMER_CAPIN1

DGND

DGND

I2C1_SCL

TIMER_CMPOUT1

I2C1_SDA

DGND

DGND

CAN1_RxD

CAN2_RxD

CAN1_TxD

CAN2_TxD

DGND

DGND

9

10

11

12

13

14

15

16

17

18

19

1

2

3

4

5

6

7

8

20

21

22

23

24

25

26

27

28

29

30


P

P

Ground

Ground

O

O

GPIO from PCA9554D to switch the backlight

GPIO from PCA9554D to switch on the LVDS transmitter

O PWM contrast

I/O REV Signal for Sharp displays / GPIO1_3

I/O SPL Signal for Sharp displays / GPIO1_5

I/O CLS Signal for Sharp displays / GPIO1_4

P

P

O

P

O

O

Ground

Ground

LED V77 red

Ground

LED V77 yellow

I2C bus 2 clock

P Ground

I/O I2C bus 2 data

I

P

P

Timer Capture

Ground

Ground

I

O

O

P

P

O

O

I2C bus 1 clock

Timer Compare

I/O I2C bus 1 data

P Ground

P

I

Ground

CAN bus 1 receive

CAN bus 2 receive

CAN bus 1 transmit

CAN bus 2 transmit

Ground

Ground

Page





Molex / 87759-3075

Description

Pin header 2 00 mm, 15 × 2-pin

–55 °C to +105 °C



11

12

13

14

15

16

17

6

7

8

9

10

1

2

3

4

5

18

19

20

21

22

23

24

25

26

DGND

DGND

COL0

ROW0

COL1

ROW1

COL2

ROW2

COL3

ROW3

DGND

DGND

DGND

OWDAT

SPI1_CLK

DGND

SPI1_MISO

VSTBY

SPI1_MOSI

DGND

SPI1_RDY

GPIO3_5

SPI1_SS0

WDOG_RST#

SPI1_SS1

FLASH_RST#

P

P

P

I/O

O

P

I

I/O

I/O

I/O

I/O

I/O

P

P

I/O

I/O

I/O

O

O

P

O

I/O

O

I

O

O

Ground

Ground

4 × 4 KEYPAD

Ground

Ground

Ground

Requires external pull-up resistor

SPI1 clock

Ground

SPI1 Master In Slave Out

Standby request to an external PMIC, switches after getting into a standby / low-power mode

SPI1 Master Out Slave In

Ground

SPI1 Ready

GPIO

SPI1 Slave Select 0

Watchdog Reset

SPI1 Slave Select 1

Reset signal of the flash memory on the TQMa35

27

28

29

SPI1_SS3

WP_ACC

DGND

O

O

P

SPI1 Slave Select 3

WP/ACC signal of the flash memory on the TQMa35

Ground

30 DGND P Ground


↑


↓


→

- element in series



4.3.1 Reset button (S2)

The reset button resets the CPU, the flash and the USB Host controller on the TQMa35.

As a result the CPU generates a reset signal, which resets all other devices (RAM, Ethernet, etc.).

Table 67: Reset button (S2)


Knitter switch / TMSE 10 J-RA

Description

Miniature pushbutton

Minimum 100,000 operations

Operating force 3 N ±1 N

Max. 1.27 mm path

–55 °C to +125 °C

4.3.2 Status-LEDs external (V77)

Table 68: External Status-LEDs (V77)


VS Optoelectronic / WU-2301

3-fold LED

Red / green / yellow

0 °C to +80 °C

Three LEDs are implemented in addition to the status LEDs of both Ethernet jacks.

Their function can be taken from the following table.

Table 69: Overview external LEDs

LED

V77A

V77B

V77C

Colour

Green

Yellow

Red

Function / display

User can define function

User can define function

Power-On (Voltage regulator indicates power-good)

TQMa35 - X1

I2C 1

PCA9554

USER_LED1

USER_LED2

POWER

LED

LED

LED

Illustration 37: Block diagram LED

For the control of the LEDs see Table 3 on page 14.

Page


4.3.3 Status-LEDs internal (V22, V24, V25, V46, V78)

Internal LEDs are available to display other functions or status messages.

The functions of the LED displays are listed in the following table.

Table 70: Overview internal LEDs

LED

V22

V24

V25

V46

V78

Colour

Blue

Red

Red

Green

Green

Function / display

Power-On (Voltage VCC5V is OK)

Over-current at the USB Host interface

Over-current at the USB OTG interface

Reset to module is active

Ethernet 1 works in full-duplex mode

4.3.4 DIP switch (S1, S3)

The STK-MBa35 possesses two DIP switches whose functions are listed in the following tables.

Table 71: DIP switch S1

Switch ON OFF (default)

S3-1 Termination CAN1 (120 Ω)

S3-2 Termination CAN2 (120 Ω)

CAN1 not terminated

CAN2 not terminated

S3-3

(1)

Slew rate configuration for CAN1 disabled Slew rate configuration for CAN1 enabled

S3-4

(1) Slew rate configuration for CAN2 disabled Slew rate configuration for CAN2 enabled

Table 72: DIP switch S3

Switch

S3-1

S3-2

S3-3

S3-4

ON

No function

No function

RS485 RxD terminated (120 Ω)

RS485 TxD terminated (120 Ω)

OFF (default)

No function

No function

RS485 RxD not terminated

RS485 TxD not terminated

1 To be able to use the switch functions, resistors ≥10 kΩ must be equipped for R45 or R50.


4.4.1 Temperature sensor (D22)

Near the LCD connectors on the bottom side of the STK-MBa35 is a National Semiconductor

LM75 temperature sensor. It can be read out via I2C1. The base address can be taken from the following table.

4.4.2 I2C address allocation

Table 73: I2C address allocation

I2C bus Position

1

1

1

1

2

2

STK-MBa35

STK-MBa35

STK-MBa35

STK-MBa35

TQMa35

TQMa35

2 TQMa35

*) TQMa35 model dependent

Device

Audio codec – SGTL5000

GPO – PCA9554D

GPI, USERLED – PCA9554D

Temperature sensor – LM75

Temperature sensor – LM75

EEPROM – M24C46*

RTC– DS1339U-33

4.4.3 Battery

To supply the RTC of the TQMa35, a lithium battery with very low self-discharge is used.

The battery is socketed and, therefore, can be exchanged easily.

Table 74: RTC battery

Address

0x0A

0x20

0x21

0x49

0x48

0x50

0x68

Manufacturer / number e.g. Sony / CR2032

Description

Lithium battery, typical capacity approx. 200 mAh / 3 V


Reverse polarity of the battery can damage or destroy the device.

Attention must be paid to the correct polarity of the battery.

No software is required for the STK-MBa35.

Suitable software is only required on the module TQMa35. It is not a part of this specification.

More information can be found in the

Support Wiki for the TQMa35

.

Page


MECHANICS SPECIFICAT ION

6.1.1 PCB outlines STK-MBa35

Illustration 38: PCB outlines STK-MBa35

6.1.2 STK-MBa35 top view


Illustration 39: Top view

Page


6.1.3 STK-MBa35 bottom view

Illustration 40: Bottom view


The STK-MBa35 is not protected against dust, external impact and contact (IP00). An adequate protection has to be guaranteed by the surrounding system.

The main heat source is the TQMa35. Information to the cooling of the TQMa35 is to be taken from his specification.

Page


SAFETY REQUIREMENTS

AND PROTECTIVE REGULATIONS

The assembly TQMa35/STK-MBa35 is EMC tested in a TQ Blue-IPC. Current technical concepts were taken into consideration during the development to avoid or reduce EMC interference.

The STK-MBa35 meets the following EMC rules and EMC standards:

EMC-Interference radiation:

Measurement of the electrically radiated emission for standard, residential, commercial and light industrial environments in the range of 30 MHz to 1 GHz according to

DIN EN 61000-6-3 respective DIN EN 55022.

EMC-Interference radiation:

Measurement of the electrically radiated emission for industrial environments in the range of 30 MHz to 1 GHz according to DIN EN 61000-6-4 respective DIN EN 55011.

EMC-Immunity according to EN 61000-4-2

2

):

Electrostatic discharge immunity (ESD).


2

):

Radiated radio frequency, electromagnetic field immunity.

EMC-Immunity to fast transients according to EN 61000-4-4

2

):

Electrical fast transient (BURST).

EMC-Immunity to surge according to EN 61000-4-5

2

):

Surge immunity test (SURGE).

In DC networks an inlet length of less than 10 m is assumed.

For the audit a reference power supply has to be defined / supplied.

Signal and I/O lines > 30 m must be checked for SURGE.


2

):

Immunity to conducted disturbances, induced by radio-frequency fields.


2

):

Immunity to voltage dips, voltage variation and short interruptions in the mains supply

(VOLTAGE DIPS).


3

):

Immunity to voltage dips and short interruptions on the DC input power supply.

Due to the occurring voltages (

≤

36 V DC), tests with respect to the operational and personal safety have not been carried out.

2 The test level and test criteria are taken from the generic standards EN 61000-6-1 and EN 61000-6-2.

3 The test criteria are not fixed here yet, because there are still no generic standards or product standards on which to base

this standard. When required the test criteria have to be defined with the customer.


Permitted component temperature:

Permitted storage temperature:

Relative air humidity (operation / storing):

Protection class:

0 °C to +70 °C

–40 °C to +100 °C

10 % to 90 % (not condensing)

IP00

See section 7.1 Protection against external effects on page 65.

Reliability and product life

The device is designed for a typical product life of five years.

Connectors of middle grade, which guarantee at least 100 mating cycles, are used for all external accessible interfaces.

D isplays

The display manufacturers permit a number of pixel defects. These vary depending on the manufacturer and type of display. The permissible error of the pixel display manufacturers (warranty claims) is usually set very high. TQ-Systems GmbH allows pixel errors in the display.

9.4.1 General notes

Due to technical reasons a battery is necessary for this product. Batteries containing mercury (Hg), cadmium

(Cd) or lead (Pb) are not used. To allow a separate disposal, batteries are generally only mounted in sockets.

9.4.2 Lithium battery

The requirements concerning special provision 188 of the ADR (section 3.3) are complied with for Lithium batteries. There is therefore no classification as dangerous goods:

Basic lithium content per cell not more than 1 g

(except for lithium ion and lithium polymer cells for which a lithium content of not more than 1.5 g per cell applies (equals 5 Ah)).

Basic lithium content per battery not more than 2 g

(except for lithium ion batteries for which a lithium content of not more than 8 g per cell applies

(equals 26 Ah)).

Lithium cells and batteries are examined according to UN document ST/SG/AC.10-1.

During transport a short circuit or discharging of the socketed lithium battery is prevented by extricable insulating foils or by other suitable insulating measures.

Page


By environmentally friendly processes, production equipment and products, we contribute to the protection of our environment.

To be able to reuse the product, it is produced in such a way (a modular construction) that it can be easily repaired and disassembled.

The energy consumption of this subassembly is minimised by suitable measures.

Printed pc-boards are delivered in reusable packaging. Modules and devices are delivered in an outer packaging of paper, cardboard or other recyclable material.

Because now there is still no technical equivalent alternative for printed circuit boards with bromine-containing flame protection (FR-4 material), such printed circuit boards are still used.

These points are an essential part of the following laws:

The law to encourage the circular flow economy and assurance of the environmentally acceptable removal of waste as at 27.9.94

(source of information: BGBl I 1994, 2705)

Regulation with respect to the utilization and proof of removal as at 1.9.96

(source of information: BGBl I 1996, 1382, (1997, 2860)

Regulation with respect to the avoidance and utilization of packaging waste as at

21.8.98


Regulation with respect to the European Waste Directory as at 1.12.01


This information is to be seen as notes.

Tests or certifications were not carried out with respect to that.

The STK-MBa35 is manufactured RoHS compliant. TQ-Systems GmbH issues the RoHS conformity declaration.

TQ-Systems GmbH, which markets the product, is responsible for the observance of the WEEE regulation.

Mühlstraße 2 l Gut Delling l 82229 Seefeld [email protected]

l www.tq-group.com

TQ STK-MBa35 User`s Manual

Command

[email protected]

http://www.tq-group.com/

Support Wiki for the TQMa35

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