Website:http://biz.LGservice.com

E-mail:http://www.LGEservice.com/techsup.html

COLOR MONITOR

SERVICE MANUAL

CHASSIS NO. : CL-82

MODEL: L1750SQ-SN (L1750SQ-SNN.AN**QP)

L1750SQ-BN (L1750SQ-BNN.AN**QP)

L1750SQ-WN (L1750SQ-WNN.AN**QP)

( ) **Same model for Service

CAUTION

BEFORE SERVICING THE UNIT,

READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

*To apply the MSTAR Chip.

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CONTENTS

SPECIFICATIONS ................................................... 2

PRECAUTIONS ....................................................... 3

TIMING CHART ....................................................... 7

DISASSEMBLY ....................................................... 8

BLOCK DIAGRAM ................................................... 9

DESCRIPTION OF BLOCK DIAGRAM....................10

ADJUSTMENT ...................................................... 12

SERVICE OSD ...................................................... 13

TROUBLESHOOTING GUIDE .............................. 14

WIRING DIAGRAM ............................................... 18

EXPLODED VIEW...................................................19

REPLACEMENT PARTS LIST ...............................21

SCHEMATIC DIAGRAM ......................................... 23

2. OPTICAL CHARACTERISTICS

2-1. Viewing Angle by Contrast Ratio

≥

10

SPECIFICATIONS

1. LCD CHARACTERISTICS

Type : TFT Color LCD Module

Active Display Area : 17 inch

Size

Pixel Pitch

: 358.5(W) x 296.5(H) x 17.0(D)

: 0.264 (H) x 0.264 (V)

Color Depth : 16.2M colors

Electrical Interface : LVDS

Surface Treatment : Hard-coating(3H), Anti-Glare

Operating Mode

Backlight Unit

: Normally White, Transmissive mode

: 4-CCFL

4. Max. Resolution

D-sub Analog : 1280 x 1024@75Hz

5. POWER SUPPLY

5-1. Power : AC 100~240V, 50/60Hz , 1.0A

5-2. Power Consumption

MODE

POWER ON (NORMAL)

STAND-BY

SUSPEND

DPMS OFF

H/V SYNC VIDEO POWER CONSUMPTION LED COLOR

ON/ON

OFF/ON

ON/OFF

OFF/OFF

ACTIVE

OFF

OFF

OFF less than 35 W less than 1 W less than 1 W less than 1 W

GREEN

AMBER

AMBER

AMBER

Left : -60°min., -70°(Typ) Right : +60°min., +70°(Typ)

Top :+45°min., +60°(Typ) Bottom : -50°min., -60°(Typ)

6. ENVIRONMENT

2-2. Luminance : 185(min), 250(Typ)

2-3. Contrast Ratio : 300(min), 450(Typ)

3. SIGNAL (Refer to the Timing Chart)

3-1. Sync Signal

• Type : Separate Sync, SOG, composite.

6-1. Operating Temperature : 10°C~35°C

6-2. Relative Humidity : 10%~80%

6-3. MTBF : 50,000 HRS with 90%

Confidence level

Lamp Life : 50,000 Hours(Min)

7. DIMENSIONS (with TILT/SWIVEL)

3-2. Video Input Signal

1) Type

2) Voltage Level

: R, G, B Analog

: 0~0.71 V a) Color 0, 0 b) Color 7, 0

: 0 Vp-p

: 0.467 Vp-p c) Color 15, 0 : 0.714 Vp-p

3) Input Impedance : 75

Ω

Width

Depth

Height

: 368 mm (14.49'')

: 230.5 mm (9.07'')

: 389.2 mm (15.32'')

8. WEIGHT (with TILT/SWIVEL)

Net. Weight

Gross Weight

: 4.9 kg (10.80 lbs)

: 6.5 kg (14.33 lbs) 3-3. Operating Frequency

Horizontal : 30 ~ 83kHz

Vertical : 56 ~ 75Hz

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PRECAUTION

WARNING FOR THE SAFETY-RELATED COMPONENT.

• There are some special components used in LCD monitor that are important for safety. These parts are

marked on the schematic diagram and the

replacement parts list. It is essential that these critical parts should be replaced with the manufacturer’s specified parts to prevent electric shock, fire or other hazard.

• Do not modify original design without obtaining written permission from manufacturer or you will void the original parts and labor guarantee.

WARNING

BE CAREFUL ELECTRIC SHOCK !

• If you want to replace with the new backlight (CCFL) or inverter circuit, must disconnect the AC adapter because high voltage appears at inverter circuit about

650Vrms.

• Handle with care wires or connectors of the inverter circuit. If the wires are pressed cause short and may burn or take fire.

Leakage Current Hot Check Circuit

AC Volt-meter

TAKE CARE DURING HANDLING THE LCD MODULE

WITH BACKLIGHT UNIT.

• Must mount the module using mounting holes arranged in four corners.

• Do not press on the panel, edge of the frame strongly or electric shock as this will result in damage to the screen.

• Do not scratch or press on the panel with any sharp objects, such as pencil or pen as this may result in damage to the panel.

• Protect the module from the ESD as it may damage the electronic circuit (C-MOS).

• Make certain that treatment person’s body are grounded through wrist band.

• Do not leave the module in high temperature and in areas of high humidity for a long time.

• The module not be exposed to the direct sunlight.

• Avoid contact with water as it may a short circuit within the module.

• If the surface of panel become dirty, please wipe it off with a softmaterial. (Cleaning with a dirty or rough cloth may damage the panel.)

CAUTION

Please use only a plastic screwdriver to protect yourself from shock hazard during service operation.

To Instrument's exposed

METALLIC PARTS

1.5 Kohm/10W

Good Earth Ground such as WATER PIPE,

CONDUIT etc.

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SERVICING PRECAUTIONS

CAUTION: Before servicing receivers covered by this

service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication.

NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First.

9. Use with this receiver only the test fixtures specified in

this service manual.

CAUTION: Do not connect the test fixture ground strap

to any heat sink in this receiver.

General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board module or any other receiver assembly.

b. Disconnecting or reconnecting any receiver electrical plug or other electrical connection.

c. Connecting a test substitute in parallel with an electrolytic capacitor in the receiver.

CAUTION: A wrong part substitution or incorrect

polarity installation of electrolytic capacitors may result in an explosion hazard.

d. Discharging the picture tube anode.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe.

Do not test high voltage by "drawing an arc".

3. Discharge the picture tube anode only by (a) first connecting one end of an insulated clip lead to the degaussing or kine aquadag grounding system shield at the point where the picture tube socket ground lead is connected, and then (b) touch the other end of the insulated clip lead to the picture tube anode button, using an insulating handle to avoid personal contact with high voltage.

4. Do not spray chemicals on or near this receiver or any of its assemblies.

5. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cottontipped stick or comparable non-abrasive applicator;

10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength)

CAUTION: This is a flammable mixture.

Unless specified otherwise in this service manual, lubrication of contacts in not required.

6. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

7. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed.

8. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead.

Always remove the test receiver ground lead last.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES)

Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with

ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type solder removal device.

Some solder removal devices not classified as "antistatic" can generate electrical charges sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.

CAUTION: Be sure no power is applied to the chassis

or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.)

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General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 。 F.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wire-bristle (0.5 inch, or 1.25cm) brush with a metal handle.

Do not use freon-propelled spray-on cleaners.

5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature.

(500 。 F) b. Heat the component lead until the solder melts.

c. Quickly draw the melted solder with an anti-static, suction-type solder removal device or with solder braid.

CAUTION: Work quickly to avoid overheating the

circuitboard printed foil.

6. Use the following soldering technique.

a. Allow the soldering iron tip to reach a normal temperature (500 。 F) b. First, hold the soldering iron tip and solder the strand against the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil.

CAUTION: Work quickly to avoid overheating the

circuit board printed foil.

d. Closely inspect the solder area and remove any excess or splashed solder with a small wire-bristle brush.

IC Remove/Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above.

Removal

1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

1. Carefully insert the replacement IC in the circuit board.

2. Carefully bend each IC lead against the circuit foil pad and solder it.

3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor

Removal/Replacement

1. Remove the defective transistor by clipping its leads as close as possible to the component body.

2. Bend into a "U" shape the end of each of three leads remaining on the circuit board.

3. Bend into a "U" shape the replacement transistor leads.

4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device

Removal/Replacement

1. Heat and remove all solder from around the transistor leads.

2. Remove the heat sink mounting screw (if so equipped).

3. Carefully remove the transistor from the heat sink of the circuit board.

4. Insert new transistor in the circuit board.

5. Solder each transistor lead, and clip off excess lead.

6. Replace heat sink.

Diode Removal/Replacement

1. Remove defective diode by clipping its leads as close as possible to diode body.

2. Bend the two remaining leads perpendicular y to the circuit board.

3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.

5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder.

Fuse and Conventional Resistor

Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

2. Securely crimp the leads of replacement component around notch at stake top.

3. Solder the connections.

CAUTION: Maintain original spacing between the

replaced component and adjacent components and the circuit board to prevent excessive component temperatures.

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Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or

"lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the

IC connection.

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At Other Connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife.

Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side.

Carefully crimp and solder the connections.

CAUTION: Be sure the insulated jumper wire is

dressed so the it does not touch components or sharp edges.

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TIMING CHART

VIDEO

D B

E

A

SYNC

C

<< Dot Clock (MHz), Horizontal Frequency (kHz), Vertical Frequency (Hz), Horizontal etc... (µs), Vertical etc... (ms) >>

MODE

1

2

3

4

5

6

7

8

9

10

11

12

13

Section

V(Lines)

H(Pixels)

V(Lines)

H(Pixels)

V(Lines)

H(Pixels)

V(Lines)

H(Pixels)

V(Lines)

H(Pixels)

V(Lines)

H(Pixels)

V(Lines)

H(Pixels)

V(Lines)

H(Pixels)

V(Lines)

H(Pixels)

V(Lines)

H(Pixels)

V(Lines)

H(Pixels)

V(Lines)

H(Pixels)

V(Lines)

H(Pixels)

Polarity

+/-

+/-

+/-

-

+/-

-

-

+

+

+

+

+

+/-

+/-

-

+

+

-

+

-

-

+

-

+

-

-

Dot

Clock

25.175

28.321

25.175

31.5

40.0

49.5

57.283

65.0

78.75

100.0

92.978

108.0

135.0

Frequency

31.469

Total

Period

( E )

800

70.09 449

31.468

900

75.0

49.725

74.55

48.363

60.0

60.123

75.029

68.681

70.08

31.469

59.94

37.5

75

37.879

60.317

46.875

75.062

61.805

65.96

63.981

60.02

79.976

75.035

625

1152

667

1344

806

1312

800

1456

449

800

525

840

500

1056

628

1056

915

1504

937

1688

1066

1688

1066

Display

( A )

Sync.

( C )

6

96

3

128

3

134

4

112

3

144

3

3

64

3

136

3

128

4

80

96

2

108

2

96

2

64

768

1024

768

1152

870

1152

900

1280

1024

1280

1024

480

800

600

800

600

832

624

1024

640

350

720

400

640

480

640

Front

Porch

( D )

16

37

18

3

16

1

32

1

32

1

24

1

40

1

16

12

16

10

16

48

1

16

1

3

18

2

29

176

28

144

21

224

39

160

16

88

23

160

35

48

33

120

39

200

31

248

38

248

38

Back

Porch

( B )

48

60

54

Resolution

640 x 350

720 X 400

640 x 480

640 x 480

800 x 600

800 x 600

832 x 624

1024 x 768

1024 x 768

1152 x 870

1152 x 900

1280 x 1024

1280 x 1024

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# 1

DISASSEMBLY

# 2

# 3

Disassembly Hinge Cover.

# 4

Remove the screws.

# 5

1. Pull the front cover upward.

2. Then, let the all latches are separated.

3. Put the front face down.

# 6

Disassemble back cover.

# 7

Remove the 6 screws from each up of metal frame.

# 8

Pell off Al-tape from panel.

Remove Al-tape from control pcb fix.

Remove the 4 screws from each side of metal frame.

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BLOCK DIAGRAM

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DESCRIPTION OF BLOCK DIAGRAM

1. Video Controller Part.

This part amplifies the level of video signal for the digital conversion and converts from the analog video signal to the digital video signal using a pixel clock.

The pixel clock for each mode is generated by the PLL.

The range of the pixel clock is from 25MHz to 135MHz.

This part consists of the Scaler, ADC convertor and LVDS transmitter.

The Scaler gets the video signal converted analog to digital, interpolates input to 1280 X 1024 resolution signal and outputs 8-bit R, G, B signal to transmitter.

2. Power Part.

This part consists of the one 3.3V, and one 1.8V regulators to convert power which is provided 5V in Power board.

12V is provided for inverter, 12V is provided for LCD panel and 5V for micom.

Also, 5V is converted 3.3V and 1.8V by regulator. Converted power is provided for IC in the main board.

The inverter converts from DC12V to AC 700Vrms and operates back-light lamps of module.

3. MICOM Part.

This part is include video controller part. And this part consists of EEPROM IC which stores control data, Reset IC and the Micom.

The Micom distinguishes polarity and frequency of the H/V sync are supplied from signal cable.

The controlled data of each modes is stored in EEPROM.

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LIPS Board Block Diagram

50 ~ 60Hz

LINE

100 ~ 240V

EMI

COMPONENTS

INPUT RECTIFIER

AND FILTER

HVDC

ENERGY

TRANSFER

100KHz

12V

OUTPUT RECTIFIER

AND FILTER

5V

GND

PRIMARY

PWM

COMTROL

CIRCUIT

PHOTO-

COUPLER

ISOLATI ON

SIGNAL

COLLENT-

ION

SECONDARY

Operation description_LIPS

1. EMI components.

This part contains of EMI components to comply with global marketing EMI standards like FCC, VCCI CISPR, the circuit included a line-filter, across line capacitor and of course the primary protection fuse.

2. Input rectifier and filter.

This part function is for transfer the input AC voltage to a DC voltage through a bridge rectifier and a bulk capacitor.

3. Energy Transfer.

This part function is transfer the primary energy to secondary through a power transformer.

4. Output rectifier and filter.

This part function is to make a pulse width modulation control and to provide the driver signal to power switch, to adjust the duty cycle during different AC input and output loading condition to achive the dc output stablize, and also the over power protection is also monitor by this part.

5. Photo-Coupler isolation.

This part function is to feed back the dc output changing status through a photo transistor to primary controller to achieve the stabilized dc output voltage.

6. Signal collection.

This part function is to collect the any change from the dc output and feed back to the primary through photo transistor.

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Windows EDID V1.0 User Manual

ADJUSTMENT

2. EDID Read & Write

1) Run WinEDID.exe

Operating System: MS Windows 98, 2000, XP

Port Setup: Windows 98 => Don’t need setup

Windows 2000, XP => Need to Port Setup.

This program is available to LCD Monitor only.

1. Port Setup a) Copy “UserPort.sys” file to

“c:\WINNT\system32\drivers” folder b) Run Userport.exe

2) Edit Week of Manufacture, Year of Manufacture,

Serial Number a) Input User Info Data b) Click “Update” button c) Click “ Write” button c) Remove all default number d) Add 300-3FF e) Click Start button.

f) Click Exit button.

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SERVICE OSD

1) Turn off the power switch at the front side of the display.

2) Wait for about 5 seconds and press MENU, POWER switch with 1 second interval.

3) The SVC OSD menu contains additional menus that the User OSD menu as described below.

a) Auto Color : W/B balance and Automatically sets the gain and offset value.

b) NVRAM INIT : EEPROM initialize.(24C08) c) CLEAR ETI : To initialize using time.

d) AGING : Select Aging mode(on/off).

e) R/G/B-9300K : Allows you to set the R/G/B-9300K value manually.

f) R/G/B-6500K : Allows you to set the R/G/B-6500K value manually.

g) R/G/B-Offset : Allows you to set the R/G/B-Offset value manually.(Analog Only) h) R/G/B-Gain : Allows you to set the R/G/B-Gain value manually.(Analog Only) i) MODULE : To select applied module.

Video Signal

Generator

IBM

Compatible PC

15

10

5

PARALLEL PORT

Not used

RS232C

C

PARALLEL

A

VGS

MONITOR

V-SYNC

ST

POWER

B

220

Power inlet (required)

Power Select Switch

(110V/220V)

Power LED

E ST Switch

5V

OFF

F

ON

F V-Sync On/Off Switch

(Switch must be ON.)

B

A

11

6

1

5

9

ON

OFF

E

6

1

13

25

C

5V

74LS06

4.7K

5V

4.7K

4.7K

74LS06

14

1

Figure 1. Cable Connection

- 13 -

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TROUBLESHOOTING GUIDE

1. NO POWER

NO POWER

(POWER INDICATOR OFF)

CHECK J705

VOLTAGE

PIN5, PIN6 (5V)?

YES

CHECK

U501 PIN 8 Voltage

(5V) ?

YES

CHECK KEY CONTROL

CONNECTOR ROUTINE

NO

NO

CHECK POWER BOARD,

AND FIND OUT A SHORT

POINT AS OPENING

EACH POWER LINE

CHECK 5VS LINE

(OPEN CHECK)

NO PROBLEM

1

IS U201

PIN90 (3.3V)

VOLTAGE ?

YES

CHECK U201 PIN 96

PULSE

YES

CHECK U201

Waveforms

1

U201-#96

NO

NO

CHECK 3.3V LINE

CHECK X-TAL

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2. NO RASTER (OSD IS NOT DISPLAYED) – LIPS

NO RASTER

(OSD IS NOT DISPLAYED)

J705

PIN5, PIN6

5V?

YES

J705 PIN9

2.5V?

YES

J705 PIN10

5V?

YES

CHECK

PULSE AS

CONTACTING SCOPE

PROBE TO CAUTION LABEL.

(CONTACT PROBE TO

CAUTION LABEL.

CAN YOU SEE PULSE

AT YOUR

SCOPE?

YES

REPLACE CCFL LAMP

IN THE LCD MODULE

NO

NO

NO

NO

LIPS

CHECK POWER BOARD,

AND FIND OUT A SHORT

POINT AS OPENING

EACH POWER LINE

CHECK MICOM INV

ON/OFF PORT.

1. CONFIRM BRIGHTNESS

OSD CONTRL STATE.

2. CHECK MICOM DIM-ADJ

PORT

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3. NO RASTER (OSD IS NOT DISPLAYED) – MSTAR

1

NO RASTER

(OSD IS NOT DISPLAYED)

U201

PIN 18, 90

3.3V?

YES

U201

PIN96, 97

OSCILLATE AS

12MHZ?

YES

NO

NO

CHECK U801 (17", 19")

CHECK U803 (15")

1. CHECK PIN122, 123

SOLDERING CONDITION

2. CHECK X501

3. TROUBLE IN U201

2

U501

PIN43 IS 48KHz H-SYNC?

PIN44 IS 60Hz V-SYNC?

IS PULSE APPEARED

AT SIGNAL PINS?

AT MODE 12?

YES

TROUBLE IN CABLE

OR LCD MODULE

NO

CHECK CONNECTION LINE

FROM D-SUB TO U501

Waveforms

1

U201-#96, 97

2

U501-#43 H-SYNC

2

U501-#44 V-SYNC

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TROUBLE IN DPM

3

CHECK

R216, R217

R778, R781

YES

CHECK

U501 PIN 43.44

SYNC PULSE ?

YES

TROUBLE IN U501

4. TROUBLE IN DPM

NO

NO

CHECK PC

PC IS NOT GOING

INTO DPM OFF MODE

CHECK H/V SYNC LINE

Waveforms

3

R216, R778 H-Sync

3

R217, R781 V-Sync

- 17 -

龙泉现代YDW资料收藏

WIRING DIAGRAM

Connector Ass’y P/N:

6631T11012W or 6631T11020W

Connector Ass’y P/N:

6631T20034M or 6631T20023A

Connector Ass’y P/N:

6631T11017X

- 18 -

龙泉现代YDW资料收藏

EXPLODED VIEW

- 19 -

龙泉现代YDW资料收藏

EXPLODED VIEW PARTS LIST

Ref. No.

010

020

030

040

050

060

070

080

090

100

110

Part No.

3091TKL168C

Description

CABINET ASSEMBLY, L1750SQ BRAND L122 SILVER ABS350 89483 TCO03 8MS

3091TKL168T

3091TKL181A

3091TKL168E

3091TKL168X

CABINET ASSEMBLY, L1750SQ BRAND L122 SILVER ABS TCO03 8MS LIFE GOOD AU-Austrailia

CABINET ASSEMBLY, L1750SQ BRAND L122 SILVER ABS TCO03+8MS CHINA VER-C/SKD

CABINET ASSEMBLY, L1750SQ BRAND L122 BLACK ABS350 9930 TCO99 8MS

CABINET ASSEMBLY, L1750SQ BRAND L122 WHITE ABS TCO03 8MS JP-VER

6304FLP200A LCD(LIQUID CRYSTAL DISPLAY), LM170E01-A6K4 LG PHILPS TFT COLOR 8MS,LPL NJ/KUMI,PB FREE,EGI,TI S D-IC,SXGA,LVDS or 6304FLP199A LCD(LIQUID CRYSTAL DISPLAY), LM170E01-A6K3 LG PHILPS TFT COLOR 8MS,LPL NJ/KUMI,PB FREE,EGI,SS S D-IC,EGI,250NITS,SXGA,LVDS

3809TKL100A

3809TKL100J

BACK COVER ASSEMBLY, L1750S L100 ABS350 9930(BK)-SILVER,BLACK

BACK COVER ASSEMBLY, L1750S L100 ABS 8B656(WHITE) ANALOGUE JP-VER

3043TKK227A

3043TKK227E

3043TKK227L

3043TKK228A

3043TKK228C

3043TKK228F

6871TST798A

6871TST798B

TILT SWIVEL ASSEMBLY, L1750S - TILT STAND BODY-SILVER,BLACK

TILT SWIVEL ASSEMBLY, L1750S - TILT STAND BODY NT-LOCAL-SILVER

TILT SWIVEL ASSEMBLY, L1750S - TILT STAND BODY JP-VER-WHITE

TILT SWIVEL ASSEMBLY, L1750S - TILT STAND BASE-SILVER,BLACK

TILT SWIVEL ASSEMBLY, LX 50S - TILT STAND BASE NT LOCAL-SILVER

TILT SWIVEL ASSEMBLY, LX 50S - TILT STAND BASE WHITE COLOR-JP-VER

PWB(PCB) ASSEMBLY,SUB, L1750 CONTROL TOTAL BRAND KEY

PWB(PCB) ASSEMBLY,SUB, L1750 CONTROL TOTAL BRAND NT C/SKD

4951TKS199A

6871TPT282C

3313TL7100A

3313TL7100D

3313TL7100B

4951TKS203A

3550TKK740A

3550TKK740C

METAL ASSEMBLY, FRAME MAIN L1750 LPL-A5 KUMI

PWB(PCB) ASSEMBLY,POWER, M-CHASSIS 1720 DOCKING,2PIN,450V POWER TOTAL LIEN CHANG PB FREE

MAIN TOTAL ASSEMBLY, L1750SN TSU16AL - LPL BRAND CL-82-SILVER

MAIN TOTAL ASSEMBLY, L1750SN.KNCNEPT BRAND CL-82 LF-C/SKD

MAIN TOTAL ASSEMBLY, L1750SN TSU16AL LPL BRAND 4-LANGUAGE CL-82-BLACK,WHITE

METAL ASSEMBLY, REAR SHIELD LX50 KUMI

COVER, L1750 BACK DOOR BRAND-SILVER,BLACK

COVER, L1750 BACK DOOR BRAND WHITE JP-VER

- 20 -

龙泉现代YDW资料收藏

REPLACEMENT PARTS LIST

CAUTION: BEFORE REPLACING ANY OF THESE COMPONENTS,

READ CAREFULLY THE SAFETY PRECAUTIONS IN THIS MANUAL.

* NOTE : S SAFETY Mark

AL ALTERNATIVE PARTS

*S *AL LOC. NO.

MAIN BOARD

PART NO.

CAPACITORS

C251

C503

C504

C506

C507

C508

C701

C707

C224

C225

C226

C230

C231

C232

C233

C240

C216

C217

C218

C219

C220

C221

C222

C223

C204

C205

C206

C207

C211

C213

C214

C215

C735

C744

C803

C805

C809

C812

C814

C819

C708

C709

C717

C718

C727

C732

C733

C734

0CK103CK51A

0CK103CK51A

0CK103CK51A

0CK104CK56A

0CK104CK56A

0CK104CK56A

0CK104CK56A

0CK104CK56A

0CK103CK51A

0CK103CK51A

0CH8106F611

0CC030CK01A

0CC180CK41A

0CK103CK51A

0CK105CD56A

0CC680CK41A

0CK104CK56A

0CK104CK56A

0CK104CK56A

0CK104CK56A

0CK103CK51A

0CK103CK51A

0CK103CK51A

0CK103CK51A

0CK103CK51A

0CK103CK51A

0CK103CK51A

0CK103CK51A

0CK103CK51A

0CK103CK51A

0CK103CK51A

0CK103CK51A

0CK103CK51A

0CK103CK51A

0CC101CK41A

0CC101CK41A

0CK105CD56A

0CK103CK51A

0CK104CK56A

0CK104CK56A

0CK104CK56A

0CC680CK41A

0CE107EF610

0CK104CK56A

0CK103CK51A

0CE107EF610

0CE107EF610

0CK105CD56A

DATE: 2005. 03. 15.

DESCRIPTION / SPECIFICATION

0.1UF 1608 50V 10% R/TP X7R

0.1UF 1608 50V 10% R/TP X7R

0.1UF 1608 50V 10% R/TP X7R

0.1UF 1608 50V 10% R/TP X7R

0.01UF 1608 50V 10% R/TP B(Y

0.01UF 1608 50V 10% R/TP B(Y

0.01UF 1608 50V 10% R/TP B(Y

0.01UF 1608 50V 10% R/TP B(Y

0.01UF 1608 50V 10% R/TP B(Y

0.01UF 1608 50V 10% R/TP B(Y

0.01UF 1608 50V 10% R/TP B(Y

0.01UF 1608 50V 10% R/TP B(Y

0.01UF 1608 50V 10% R/TP B(Y

0.01UF 1608 50V 10% R/TP B(Y

0.01UF 1608 50V 10% R/TP B(Y

0.01UF 1608 50V 10% R/TP B(Y

0.01UF 1608 50V 10% R/TP B(Y

0.01UF 1608 50V 10% R/TP B(Y

0.01UF 1608 50V 10% R/TP B(Y

0.1UF 1608 50V 10% R/TP X7R

0.1UF 1608 50V 10% R/TP X7R

0.1UF 1608 50V 10% R/TP X7R

0.1UF 1608 50V 10% R/TP X7R

0.1UF 1608 50V 10% R/TP X7R

0.01UF 1608 50V 10% R/TP B(Y

0.01UF 1608 50V 10% R/TP B(Y

10UF 16V M 85STD(CYL) R/TP

3PF 1608 50V 0.25 PF R/TP NP

18PF 1608 50V 5% R/TP NP0

0.01UF 1608 50V 10% R/TP B(Y

1UF 1608 10V 10% R/TP X7R

68PF 1608 50V 5% R/TP NP0

0.01UF 1608 50V 10% R/TP B(Y

0.01UF 1608 50V 10% R/TP B(Y

100PF 1608 50V 5% R/TP NP0

100PF 1608 50V 5% R/TP NP0

1UF 1608 10V 10% R/TP X7R

0.01UF 1608 50V 10% R/TP B(Y

0.1UF 1608 50V 10% R/TP X7R

0.1UF 1608 50V 10% R/TP X7R

0.1UF 1608 50V 10% R/TP X7R

68PF 1608 50V 5% R/TP NP0

"100UF KMG,RD 16V 20% FL BULK"

0.1UF 1608 50V 10% R/TP X7R

0.01UF 1608 50V 10% R/TP B(Y

"100UF KMG,RD 16V 20% FL BULK"

"100UF KMG,RD 16V 20% FL BULK"

1UF 1608 10V 10% R/TP X7R

DIODEs

D701 0DS226009AA KDS226 TP KEC - 80V - - 4NSE

*S *AL LOC. NO.

PART NO.

ICs

D702

D706

ZD701

ZD702

ZD703

ZD704

ZD711

ZD712

0DS226009AA

0DS226009AA

0DZ560009GB

0DZ560009GB

0DZ560009GB

0DZ560009GB

0DZ560009GB

0DZ560009GB

DATE: 2005. 03. 15.

DESCRIPTION / SPECIFICATION

KDS226 TP KEC - 80V - - 4NSE

KDS226 TP KEC - 80V - - 4NSE

"BZT52C5V6S-(F),LF DIODES R/T"

"BZT52C5V6S-(F),LF DIODES R/T"

"BZT52C5V6S-(F),LF DIODES R/T"

"BZT52C5V6S-(F),LF DIODES R/T"

"BZT52C5V6S-(F),LF DIODES R/T"

"BZT52C5V6S-(F),LF DIODES R/T"

U201

U501

U501

U502

U801

Q502

TRANSISTOR

0IPRPM3017A

0IZZTSZ595A

0IZZTSZ595B

0ICS240813B

0IPMGKE011A

0IKE704200H

"TSU16AL-LF MSTAR 100P,QFP TR"

L1750SN MSTAR MICOM ASSY - 1

L1750SN MSTAR MICOM ASSY-C/SKD

"CAT24WC08J-TE13 8P,SOIC R/TP"

KIA78D33F KEC DPAK R/TP 3.3V

KIA7042AP TO-92 TP 4.2 VOLT

FAIRCHILD KST3904(LGEMTF) TP

FAIRCHILD KST3904(LGEMTF) TP

FAIRCHILD KST3904(LGEMTF) TP

KST3906-MTF TP SAMSUNG SOT2

KST3906-MTF TP SAMSUNG SOT2

KTA1273-Y(KTA966A) TP KEC TO

FAIRCHILD KST3904(LGEMTF) TP

KTA1273-Y(KTA966A) TP KEC TO

R217

R220

R240

R501

R503

R506

R508

R520

R201

R202

R203

R207

R208

R209

R210

R216

R521

R522

R523

R530

R534

R535

R537

Q503

Q504

Q505

Q703

Q704

Q801

Q802

Q803

RESISTORs

0TR390409AE

0TR390409AE

0TR390409AE

0TR390609FA

0TR390609FA

0TR127309AA

0TR390409AE

0TR127309AA

0RJ0682D677

0RJ0682D677

0RJ0682D677

0RJ3900D677

0RJ0682D677

0RJ0682D677

0RJ0682D677

0RJ0000D677

0RJ0000D677

0RJ4701D677

0RJ1001D677

0RJ4701D677

0RJ4701D677

0RJ4701D677

0RJ4701D677

0RJ4701D677

0RJ4701D677

0RJ4701D677

0RJ4701D677

0RJ1002D677

0RJ0000D677

0RJ3301D677

0RJ3301D677

68 OHM 1/10 W 5% 1608 R/TP

68 OHM 1/10 W 5% 1608 R/TP

68 OHM 1/10 W 5% 1608 R/TP

390 OHM 1/10 W 5% 1608 R/TP

68 OHM 1/10 W 5% 1608 R/TP

68 OHM 1/10 W 5% 1608 R/TP

68 OHM 1/10 W 5% 1608 R/TP

0 OHM 1/10 W 5% 1608 R/TP

0 OHM 1/10 W 5% 1608 R/TP

4.7K OHM 1/10 W 5% 1608 R/TP

1K OHM 1/10 W 5% 1608 R/TP

4.7K OHM 1/10 W 5% 1608 R/TP

4.7K OHM 1/10 W 5% 1608 R/TP

4.7K OHM 1/10 W 5% 1608 R/TP

4.7K OHM 1/10 W 5% 1608 R/TP

4.7K OHM 1/10 W 5% 1608 R/TP

4.7K OHM 1/10 W 5% 1608 R/TP

4.7K OHM 1/10 W 5% 1608 R/TP

4.7K OHM 1/10 W 5% 1608 R/TP

10K OHM 1/10 W 5% 1608 R/TP

0 OHM 1/10 W 5% 1608 R/TP

3.3K OHM 1/10 W 5% 1608 R/TP

3.3K OHM 1/10 W 5% 1608 R/TP

- 21 -

龙泉现代YDW资料收藏

*S *AL LOC. NO.

PART NO.

R727

R737

R744

R747

R751

R752

R753

R754

R712

R716

R717

R720

R722

R723

R724

R726

R560

R701

R702

R703

R704

R706

R708

R709

R543

R544

R545

R547

R548

R549

R555

R557

R808

R816

R820

R821

R824

R825

R755

R769

R778

R781

R803

R804

R805

R806

CONTROL BOARD

0RJ0102D677

0RJ4701D677

0RJ4701D677

0RJ0000D677

0RJ1000D677

0RJ0332D677

0RJ0332D677

0RJ1002D677

0RJ1002D677

0RJ0000D677

0RJ4701D677

0RJ4701D677

0RJ4700D677

0RJ1000D677

0RJ1000D677

0RJ1000D677

0RJ4701D677

0RJ4701D677

0RJ4700D677

0RJ4700D677

0RJ0332D677

0RJ0332D677

0RJ1000D677

0RJ1000D677

0RJ1501D677

0RJ0752D677

0RJ2001D677

0RJ0752D677

0RJ2001D677

0RJ0752D677

0RJ4700D677

0RJ4700D677

0RJ1000D677

0RJ0000D677

0RJ0682D677

0RJ0682D677

0RH0000D622

0RJ1002D677

0RH2000D622

0RH2000D622

0RJ0000D677

0RJ1002D677

0RJ0000D677

0RH0000D622

0RJ0272D677

0RJ2000D677

DATE: 2005. 03. 15.

DESCRIPTION / SPECIFICATION

4.7K OHM 1/10 W 5% 1608 R/TP

4.7K OHM 1/10 W 5% 1608 R/TP

470 OHM 1/10 W 5% 1608 R/TP

470 OHM 1/10 W 5% 1608 R/TP

33 OHM 1/10 W 5% 1608 R/TP

33 OHM 1/10 W 5% 1608 R/TP

100 OHM 1/10 W 5% 1608 R/TP

100 OHM 1/10 W 5% 1608 R/TP

1.5K OHM 1/10 W 5% 1608 R/TP

75 OHM 1/10 W 5% 1608 R/TP

2K OHM 1/10 W 5% 1608 R/TP

75 OHM 1/10 W 5% 1608 R/TP

2K OHM 1/10 W 5% 1608 R/TP

75 OHM 1/10 W 5% 1608 R/TP

470 OHM 1/10 W 5% 1608 R/TP

470 OHM 1/10 W 5% 1608 R/TP

10 OHM 1/10 W 5% 1608 R/TP

4.7K OHM 1/10 W 5% 1608 R/TP

4.7K OHM 1/10 W 5% 1608 R/TP

0 OHM 1/10 W 5% 1608 R/TP

100 OHM 1/10 W 5% 1608 R/TP

33 OHM 1/10 W 5% 1608 R/TP

33 OHM 1/10 W 5% 1608 R/TP

10K OHM 1/10 W 5% 1608 R/TP

10K OHM 1/10 W 5% 1608 R/TP

0 OHM 1/10 W 5% 1608 R/TP

4.7K OHM 1/10 W 5% 1608 R/TP

4.7K OHM 1/10 W 5% 1608 R/TP

470 OHM 1/10 W 5% 1608 R/TP

100 OHM 1/10 W 5% 1608 R/TP

100 OHM 1/10 W 5% 1608 R/TP

100 OHM 1/10 W 5% 1608 R/TP

100 OHM 1/10 W 5% 1608 R/TP

0 OHM 1/10 W 5% 1608 R/TP

68 OHM 1/10 W 5% 1608 R/TP

68 OHM 1/10 W 5% 1608 R/TP

0 OHM 1 / 10 W 2012 5.00% D

10K OHM 1/10 W 5% 1608 R/TP

200 OHM 1 / 10 W 5% D R/TP

200 OHM 1 / 10 W 5% D R/TP

0 OHM 1/10 W 5% 1608 R/TP

10K OHM 1/10 W 5% 1608 R/TP

0 OHM 1/10 W 5% 1608 R/TP

0 OHM 1 / 10 W 2012 5.00% D

27 OHM 1/10 W 5% 1608 R/TP

200 OHM 1/10 W 5% 1608 R/TP

X501

OTHERs

6212AA2004A

C1

C2

LED1

R1

R2

R3

R4

R5

SW1

HC-49U TXC 12.0MHZ +/- 30 PP

0CK104CK56A

0CK104CK56A

0DLLT0208AA

0RJ4701D677

0RJ4701D677

0RJ2001D677

0RJ2001D677

0RJ4701D677

6600TR1002A

0.1UF 1608 50V 10% R/TP X7R

0.1UF 1608 50V 10% R/TP X7R

LITEON LTST-C155KGJSKT R/TP

4.7K OHM 1/10 W 5% 1608 R/TP

4.7K OHM 1/10 W 5% 1608 R/TP

2K OHM 1/10 W 5% 1608 R/TP

2K OHM 1/10 W 5% 1608 R/TP

4.7K OHM 1/10 W 5% 1608 R/TP

SKQGACE010 J-ALPS NON 12V 50

*S *AL LOC. NO.

PART NO.

SW2

SW3

SW4

SW5

ZD1

ZD2

6600TR1002A

6600TR1002A

6600TR1002A

6600TR1002A

0DZ560009GB

0DZ560009GB

DATE: 2005. 03. 15.

DESCRIPTION / SPECIFICATION

SKQGACE010 J-ALPS NON 12V 50

SKQGACE010 J-ALPS NON 12V 50

SKQGACE010 J-ALPS NON 12V 50

SKQGACE010 J-ALPS NON 12V 50

"BZT52C5V6S-(F),LF DIODES R/T"

"BZT52C5V6S-(F),LF DIODES R/T"

- 22 -

龙泉现代YDW资料收藏

SCHEMATIC DIAGRAM

1. TSU56AL / TSU16AL

- 23 -

龙泉现代YDW资料收藏

2. MICOM

- 24 -

龙泉现代YDW资料收藏

3.POWER

- 25 -

龙泉现代YDW资料收藏

4. CONNECTOR & JACKS

- 26 -

龙泉现代YDW资料收藏

P/NO : 3828TSL094K

Mar. 2005

Printed in Korea

龙泉现代YDW资料收藏