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HP Moonshot System
Site Planning Guide
Abstract
This guide is for an experienced service technician. HP assumes you are qualified in the servicing of computer equipment and trained in recognizing hazards in products with hazardous energy levels and are familiar with weight and stability precautions for rack installations.
Part Number: 711769-004
December 2014
Edition: 4
© Copyright 2013, 2014 Hewlett-Packard Development Company, L.P.
The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein.
Contents
Contents 3
Contents 4
Introduction
About this guide
This document helps facilities and IT staff plan for the receipt and installation of HP Moonshot System products in a dedicated computer facility.
The document is structured as follows:
•
Environmental requirements (on page 6 )
This section provides information on the environmental site requirements, including temperature, airflow, and space requirements.
•
Power requirements and considerations (on page 23 )
This section details the power requirements and electrical factors that must be considered before installation. This section also discusses PDU installation.
•
Hardware specifications and requirements (on page 34 )
This section provides system specifications for the HP Moonshot 1500 Chassis, HP Intelligent Rack
Family series racks, and single-phase and three-phase power sources.
•
Configuration scenarios (on page 36 )
This section provides examples of maximum and typical rack configurations using HP Moonshot System products, and worksheets to help determine power usage and total weight.
•
Preparing for installation (on page 38 )
This section includes tools and information to help prepare for HP Moonshot System product delivery and installation.
Related documentation
The HP Moonshot Information Library ( http://www.hp.com/go/moonshot/docs ) is a task-based repository that includes installation instructions, user guides, maintenance and service guides, best practices, useful links, and videos. Use this website to obtain the latest documentation and look up information about the following:
•
Learning about the HP Moonshot System technology
•
Setting up and configuring the HP Moonshot System
•
Updating the components of the HP Moonshot System
•
Integrating the HP Moonshot System and understanding how it connects to the outside world
•
Using and managing the HP Moonshot System
Introduction 5
Environmental requirements
Environmental elements
The following environmental elements can affect HP Moonshot System product installation.
Humidity level
Maintaining proper humidity levels in the computer room is essential for reliable equipment performance.
Humidity levels outside the recommended range of 25% to 45%, especially if these levels are sustained, lead to equipment damage and result in equipment malfunction through several mechanisms.
High humidity levels enable galvanic activity to occur between dissimilar metals. Galvanic activity can cause high resistance to develop between connections and lead to equipment malfunctions and failures. Extended periods of humidity levels greater than 60% have also been shown to adversely affect modern printed circuit board reliability. High humidity can also adversely affect some magnetic tapes and paper media.
High humidity levels are often the result of malfunctioning facility air conditioning systems. High humidity can also be the result of facility expansion in excess of air conditioning system capacity.
Humidity levels below the minimum recommended value can also have undesirable effects. Low humidity contributes to high ESD voltage potentials. ESD events can cause component damage during service operations and equipment malfunction or damage during normal operation. Low humidity levels can reduce the effectiveness of static dissipating materials and have also been shown to cause high speed printer paper feed problems.
Low humidity levels are often the result of the facility heating system and occur during the cold season. Most heating systems cause air to have a low humidity level, unless the system has a built-in humidifier.
ASHRAE and representatives of IT equipment manufacturers recommend a range of 18°C dry bulb with a
5.5°C dew point temperature to 27°C dry bulb with a 5.5°C dew point temperature. Over this range of dry bulb temperature with a 5.5°C dew point, the relative humidity varies from approximately 25% to 45%.
For more information on humidity levels, see the ASHRAE website ( http://www.ashrae.org
).
Dust and pollution
Dust and microscopic particles in the site environment adversely affect computer equipment. Airborne abrasive particles can cause bearing failures in disk drives, tape drives, and other mechanical devices. Dust may also blanket electronic components and printed circuit boards, causing premature failure because of excess heat, humidity buildup, or both.
Conductive metallic particles can cause power supply and other electronic component failures. A build-up of these metallic particles over time can cause short circuits on the densely packed circuit boards common in modern electronics. Use every effort to ensure that the environment is as dust- and particulate-free as possible.
See "Metallic particulate contamination (on page 7 )."
Environmental requirements 6
Smaller particles can pass through some filters, and over time, cause problems in mechanical parts. Selection of the appropriate filter media and maintaining the air conditioning system at a high static air pressure level can prevent small dust particles from entering the computer room.
Other dust, metallic, conductive, abrasive, or microscopic particles can result from the following sources:
•
Subfloor shedding
•
Raised floor shedding
•
Ceiling tile shedding
These particulates are not always visible to the naked eye. A good method to determine their possible presence is to check the underside of the tiles. The tile should be shiny, galvanized, and free from rust.
To minimize dust and pollution in the computer room, observe the following guidelines:
•
Smoking—Establish a no-smoking policy. Cigarette smoke particles are eight times larger than the clearance between disk drive read/write heads and the disk surface.
•
Printer location—Locate printers and paper products in a separate room to eliminate paper particulate problems.
•
Eating or drinking—Establish a no-eating or drinking policy. Spilled liquids can cause short circuits in equipment such as keyboards.
•
Floor cleaning—Use a dust-absorbent cloth mop rather than a dry mop to clean tile floors.
Special precautions are necessary if the computer room is near a source of air pollution. Some air pollutants, especially hydrogen sulfide (H
2
S), are not only highly toxic and unpleasant but corrosive as well. Hydrogen sulfide damages wiring and electronic equipment. The use of activated charcoal filters reduces this form of air pollution.
Metallic particulate contamination
Metallic particulates can be especially harmful around electronic equipment. This type of contamination can enter the data center environment from a variety of sources, including but not limited to raised floor tiles, worn air conditioning parts, heating ducts, rotor brushes in vacuum cleaners, or printer component wear. Because metallic particulates conduct electricity, they have an increased potential for creating short circuits in electronic equipment. This problem is exaggerated by the increasingly dense circuitry of electronic equipment.
Over time, very fine whiskers of pure metal can form on electroplated zinc, cadmium, or tin surfaces. If these whiskers are disturbed, they may break off and become airborne, possibly causing failures or operational interruptions. For more than 50 years, the electronics industry has been aware of the relatively rare but possible threat posed by metallic particulate contamination. During recent years, a growing concern has developed in computer rooms where these conductive contaminants are formed on the bottom of some raised floor tiles.
Although this problem is relatively rare, it may be an issue within your computer room. Because metallic contamination can cause permanent or intermittent failures on your electronic equipment, HP strongly recommends that your site be evaluated for metallic particulate contamination before installation of electronic equipment.
Environmental requirements 7
Electrostatic discharge prevention
Static charges (voltage levels) occur when objects are separated or rubbed together. The voltage level of a static charge is determined by the following factors:
•
Types of materials
•
Relative humidity
•
Rate of change or separation
Follow these precautions to minimize possible ESD-induced failures in the computer room:
•
Maintain recommended humidity level and airflow rates in the computer room.
•
Install conductive flooring (conductive adhesive must be used when laying tiles).
•
Use conductive wax if waxed floors are necessary.
•
Ensure that all equipment and flooring are properly grounded and are at the same ground potential.
•
Use conductive tables and chairs.
•
Use a grounded wrist strap (or other grounding method) when handling circuit boards.
•
Store spare electronic modules in antistatic containers.
Acoustic noise specification
The declared noise emission values for the HP Moonshot 1500 Chassis in accordance with ISO 9296 are listed in the following table.
Specification Value
Declared sound power level, LWAd Bels
Idle
Operating
—
7.27
7.27
Declared sound pressure level, LpAm dBA
Idle
Operating
—
58.93
59.00
For detailed information on conformance to country Technical Regulations and certificates of conformance, see the HP website ( http://www.hp.eu/certificates ).
The levels specified in the previous table are appropriate for dedicated computer room environments, not office environments.
You must consider the acoustic noise specifications relative to operator positions within the computer room when adding additional systems to computer rooms with existing noise sources.
You can reduce ambient noise level in a computer room using the following methods:
•
Dropped ceiling—Cover with a commercial grade of fire-resistant, acoustic rated, fiberglass ceiling tile.
•
Sound deadening—Cover the walls with curtains or other sound deadening material.
•
Removable partitions—Use foam rubber models for the most effectiveness.
Environmental requirements 8
Recommended operating environment
To help ensure continued safe and reliable equipment operation, install or position the rack in a well ventilated, climate-controlled environment.
Air inlet temperature to the rack should be between 20ºC to 25ºC (68°F to 77°F) under normal operating conditions in the data center, per ASHRAE standard TG9 HDEC.
The following table shows product technical requirements based on customer environments.
Operating Environment (ambient)
1
Environment Industry equivalent
ASHRAE
3
Dry bulb temperature 2
Recommended
(Allowable 4,5 )
6
Relative humidity, noncondensing
Recommended
(Allowable
5
)
6
Dew point
(max) 7
Rate of change
(max)
Controlled computer room
1 20°C to 25°C (15°C to 32°C)
68°F to 77°F (59°F to 90°F)
40% to 55% (20% to 80%) 17.0°C
62.6°F
5°C/hr
41°F/hr
Controlled office
2 20°C to 25°C (10°C to 35°C)
68°F to 77°F (50°F to 95°F)
40% to 55% (20% to 80%) 21.0°C
69.8°F
5°C/hr
41°F/hr
Uncontrolled office
Home
3
3
Light industrial 4
Portable/mobi le
4
NA
NA
8
8
(5°C to 35°C)
NA
8
(41°F to 95°F)
NA
8
(5°C to 35°C)
NA 8 (41°F to 95°F)
NA 8
NA 8
(5°C to 40°C)
(41°F to 104°F)
(5°C to 40°C)
NA
8
(41°F to 104°F)
NA
NA
NA
NA
8
8
8
8
(8% to 85%)
(8% to 85%)
(8% to 90%)
(8% to 90%)
28.0°C
82.4°F
28.0°C
82.4°F
28.0°C
82.4°F
28.0°C
82.4°F
NA
NA
NA
NA
8
8
8
8
1
Special 9
— — — — —
2
The maximum elevation for all operating environmental classes is 3050 m (10,007 ft).
Dry bulb temperature is the regular ambient temperature. Derate maximum dry bulb temperature 1ºC/300 m above
900 m (34°F/984 ft above 2,953 ft).
3
The values in each row meet or exceed the stated industry equivalent class specifications.
4 With installed media, the minimum temperature is 10ºC (50°F) and maximum relative humidity is limited to 80%.
Specific media requirements may vary.
5
6
Allowable: equipment design extremes as measured at the equipment inlet.
7
Recommended: target facility design and operational range.
Must be noncondensing environment.
8 Local product groups must make business decisions for the appropriate values.
9 Product specifications are controlled by contract or other requirements.
The operating temperature inside the rack is always higher than the room temperature and is dependent on the configuration of equipment in the rack. Check the TMRA for each piece of equipment before installation.
CAUTION: To reduce the risk of damage to the equipment when installing third-party options:
•
Do not permit optional equipment to impede airflow around the chassis or to increase the internal rack temperature beyond the maximum allowable limits.
• Do not exceed the manufacturer’s TMRA.
Environmental requirements 9
Airflow requirements
HP rack-mountable products typically draw in cool air through the front and exhaust warm air out through the rear of the rack. The front door of the rack must be ventilated adequately to enable ambient room air to enter the rack with as little restriction as possible. Likewise, the rear door must offer as little restriction as possible to the warm air escaping from the rack.
The free area of a door determines the amount of airflow that can pass through the doors. Rack doors must have a minimum of 63% free area compared to the total area of the door. Some doors appear to have sufficient free area but do not.
To prevent air recirculation from the rear of the rack, the computer room air conditioning system must deliver sufficient airflow to the front of the rack to meet the airflow requirements of the installed equipment in the rack.
Idle, normally operating, and maximum airflow requirements for cartridge configurations can be obtained from the HP website ( http://h18004.www1.hp.com/products/solutions/power ).
Route cables away from fans and air inlets and outlets to ensure proper airflow. Improperly routed cables can impede airflow, cause the cooling fans to work harder, consume more power, and reduce cooling system efficiency.
Blanking panels
If the front of the rack is not filled completely with components, unused equipment mounting space between the components can adversely affect cooling within the rack. Cover unused equipment mounting space with blanking panels.
Seal air gaps in the rack and between adjacent racks to prevent recirculation of hot-air from the rear of the rack to the front of the rack. Use cable brushes to seal cable entry and exit cutouts and cabinet fillers to seal the space between the cabinets to provide improved cooling efficiency.
G3 Optimization Kit
The G3 Optimization Kit enables you to install foam rail gaskets in your HP Intelligent Series 36U, 42U, and
47U 600-mm (24-in) wide racks and in 42U 800-mm (31-in) wide racks to improve separation between hot and cold aisles in the data center.
The G3 Optimization Kit supports all HP Intelligent Series Rack rack heights including 42U and 47U. It also supports 800-mm wide HP racks.
Space requirements
When deciding where to place your rack:
•
At least 1219 mm (48 in) of clearance is needed all the way around the pallet and above the rack to enable the removal of the packing material.
•
At least 1219 mm (48 in) of clearance is needed in front of the rack to enable the door to open completely.
•
At least 762 mm (30 in) of clearance is needed in the rear of the rack to provide access to components.
•
At least 380 mm (15 in) of clearance is needed around a power supply to facilitate servicing.
Environmental requirements 10
Delivery space requirements
There should be enough clearance to move equipment safely from the receiving area to the computer room.
Permanent obstructions, such as pillars or narrow doorways, can cause equipment damage.
Delivery plans should include the possible removal of walls or doors.
Operational space requirements
Other factors must be considered along with the basic equipment dimensions. Reduced airflow around equipment causes overheating, which can lead to equipment failure. Therefore, the location and orientation of air conditioning ducts, as well as airflow direction, are important. Obstructions to equipment intake or exhaust airflow must be eliminated.
CAUTION: Do not block venting holes in the covers or side panels. Proper airflow is required to prevent overheating of the unit.
The locations of lighting fixtures and utility outlets affect servicing operations. Plan equipment layout to take advantage of lighting and utility outlets. Do not forget to include clearance for opening and closing equipment doors.
Clearance at the front and rear of the racks must also be provided for proper cooling airflow through the equipment.
If other equipment is located so that it exhausts heated air near the cooling air intakes of the racks, larger space requirements are needed to keep ambient air intake to the racks and equipment within the specified temperature and humidity ranges.
Space planning should also include the possible addition of equipment or other changes in space requirements. Equipment layout plans should also include provisions for the following:
•
Channels or fixtures used for routing data cables and power cables
•
Access to air conditioning ducts, filters, lighting, and electrical power hardware
•
Power conditioning equipment
•
Cabinets for cleaning materials
•
Maintenance area and spare parts
Environmental requirements 11
Rack or cabinet space required for HP Moonshot 1500 Chassis
The HP Moonshot 1500 Chassis installation requires a total of 990 mm (39 in) of rack space.
1
2
3
Item Description
Rack column
HP Moonshot 1500 Chassis
Cable management tray
CAUTION: Special precautions must be taken when installing the HP Moonshot 1500 Chassis in a 1075mm HP Intelligent Series Rack. The cable management arm or rear-mounted PDU prohibits the rear rack door from closing.
The HP Moonshot 1500 Chassis can be installed in any of the 1075mm HP Intelligent Series Racks; however, the following exceptions must be accounted for:
•
The rack rear doors must stay open or be completely removed from the rack.
•
The PDU must use the horizontal mount, either above or below the chassis.
Environmental requirements 12
PDU location options for the HP Moonshot 1500 Chassis
The PDU can be installed in one of the following configurations:
•
Side mount (0U)
Environmental requirements 13
•
Horizontal mount (1U)
Environmental requirements 14
•
Vertical mount (rear)
Equipment clearance and floor loading
HP recommends a clearance of 1219 mm (48 in) in front of a configured rack and 762 mm (30 in) to the rear of a configured rack. All buildings and raised computer room floors are engineered to provide a specific floor loading.
WARNING: When configuring a solution, make sure that the floor loading specifications are followed. Failure to do so can result in physical injury or damage to the equipment and the facility.
Environmental requirements 15
HP Intelligent Series Rack footprint (600 mm [24 in] wide)
HP Intelligent Series Rack footprint (800 mm [31.5 in] wide)
Floor plan grid
A floor plan grid is used to plan the location of equipment in the computer room. In addition to its use for planning, the floor plan grid should also be used when planning the locations of the following items:
•
Air conditioning vents
•
Lighting fixtures
•
Utility outlets
•
Doors
•
Access areas for power wiring and air conditioning filters
•
Equipment cable routing
Chassis environmental specifications
Specification
Temperature range*
Value
—
Environmental requirements 16
Specification
Operating
Non-operating
Maximum Wet bulb temperature
Operating
Value
10°C to 35°C (50°F to 95°F)
-30°C to 60°C (-22°F to
140°F)
—
28ºC (82.4ºF)
Non-operating
38.7ºC (101.7ºF)
Relative humidity (non-condensing)** —
Operating
10% to 90%
Non-operating
5% to 95%
* All temperature ratings shown are for sea level. An altitude derating of 1°C per 304.8 m (1.8°F per 1000 ft) to 3048 m (10,000 ft) is applicable. No direct sunlight allowed. Upper operating limit is 3,048 m (10,000 ft) or 70 kPa/10.1 psia. Upper non-operating limit is 9,144 m (30,000 ft).
** Storage maximum humidity of 95% is based on a maximum temperature of 45°C (113°F). Altitude maximum for storage corresponds to a pressure minimum of 70 kPa (10.1 psia).
Rack and accessory footprints
When accessories such as extensions and stabilizing kits are added to a particular rack, the footprint of the rack extends into the rack rear row and infringes upon necessary clearances.
Footprint for a 600-mm rack configuration (597.8 mm [23.54 in] wide x 1300.2 mm [51.19 in] deep):
Front door clearance
When racks are bayed together, the design of the front door limits the extent to which the rack door on the right can open. If there is not sufficient work space, open the door on the left side or remove the door from the rack being serviced. Slight differences exist between the opening allowances of the HP Intelligent Series
Racks because of the different geometries and construction of the doors.
HP Intelligent Series Racks configured with 600-mm (23.62-in) baying brackets have the following front door clearances:
Environmental requirements 17
•
90º access with one door closed
•
120º access with both doors open
HP Intelligent Series Racks configured with 609.60-mm (24.00-in) baying brackets have the following front door clearances:
Environmental requirements 18
•
102º access with one door closed
•
120º access with both doors open
Best practices for deployment in rows
Baying kits are used to physically connect adjacent racks to create a row of two or more units. Racks that are bayed together with a baying kit are more stable and reduce the potential tipping of the rack. If racks are secured together with baying kits, the side feet installed on each end of the row of racks are considered optional.
If gaps are created between racks that could allow airflow from the rear of the rack, these gaps should be sealed with an appropriate material that will not cause particulate or electro-static discharge issues.
Fixed stabilizers are anti-tip side feet (front and side) that provide stability and support when equipment is installed, removed, or accessed within the rack. Rack rows with four or more bayed racks do not need a stabilizer kit installed. For single racks or bays of three racks, with no component exceeding 100 kg (220 lb), a standard 600 mm stabilizer is required.
Environmental requirements 19
If a standard 600 mm (23.62 in) or 800 mm (31.50 in) front stabilizing foot is installed on a stand-alone rack, the side feet, provided with the fixed stabilizer kit, should also be installed.
A heavy duty 600 mm (23.62 in) front stabilizer foot is required in any of the following situations:
•
A single rack-mountable component weighing 100 kg (220 lb) or greater is installed in a stand-alone rack.
•
A row of three or fewer racks are bayed together.
•
Side feet, which are included in the stabilizer kits, should also be installed to stabilize the rack.
For more information about supported rack option kits, see the HP Intelligent Rack Family Options Installation
Guide on the HP website ( http://www.hp.com/go/rackandpower ).
Rack placement and arrangement for proper airflow
CAUTION: Always use blanking panels to fill empty vertical spaces in the rack. This arrangement ensures proper airflow. Using a rack without blanking panels results in improper cooling that can lead to thermal damage.
Racks must be placed and arranged properly in the data center to provide sufficient airflow and clearance for access to the rack.
In the front of the rack, a clearance of 1219 mm (48 in) is required. This requirement applies when installing individual racks as well as when aligning rack rows so that the front doors are facing each other.
In the rear of the rack, a clearance of 762 mm (30 in) is required to provide space for servicing the rack.
If a data center has multiple rows of racks, the rows of racks can be arranged to take advantage of the front-to-back airflow by arranging racks front-to-front and back-to-back. Additionally, conditioned air registers can be oriented along the front aisles and the return air registers in the back aisles. This arrangement utilizes the aisle space as air plenums and increases the efficiency of the air conditioning.
Environmental requirements 20
Item Description
3
4
1
2
Building ceiling or roof
Return air plenum
Suspended ceiling
Down flow air conditioner located perpendicular to equipment rows
5
Airflow grille
6
Building floor*
7
Raised floor
8
Front of rack
9
Rear of rack
10
Return air grille
*Elevation: Raised floor - under flow plenum distribution system with ceiling return
Third-party racks
If a third-party rack is used, observe the following additional requirements to ensure adequate airflow and to prevent damage to the equipment:
•
Front and rear doors: If the rack includes closing front and rear doors, a minimum of 65 percent open area must be provided to ensure adequate airflow.
•
Front door: The clearance from face of rack to inside of the front door must be a minimum of 77 mm (3 in).
•
Rear door: The clearance between the rear of the enclosure and the rear rack door must be a minimum of 177.80 mm (7.00 in) to accommodate system cabling.
•
Side: The clearance between the installed rack component and the side panels of the rack must be a minimum of 70 mm (2.75 in).
•
Width: 483 mm (19 in)
•
Depth: Maximum clearance between front and rear RETMA rails is 876.00 mm (34.5 in). Minimum clearance for square-hole and round-hole racks is 654.00 mm (25.75 in).
•
The rack must be able to accept the adjustable rack rails that are shipped with each chassis: o
Minimum rail length: 654.00 mm (25.75 in) o
Maximum rail length: 876.00 mm (34.50 in)
Rack tie-down option kit
The HP Intelligent Rack Family Rack Tie-Down Option Kit enables you to secure HP Intelligent Rack Family racks to the floor.
Environmental requirements 21
The following figure indicates where to drill the holes to secure the rack to the floor. The distances are measured from the holes on the tie-downs. HP recommends having the building structural engineer drill the holes. Secure the rack to the floor by inserting a bolt with a washer into each hole.
For more information, see the HP Intelligent Rack Family Options Installation Guide.
Environmental requirements 22
Power requirements and considerations
Power requirements
When planning power distribution requirements, observe the following:
•
The power load must be balanced between available AC supply branch circuits.
•
The AC current load attached to a branch circuit must not exceed 80 percent of that branch circuit current rating.
•
If a UPS system is used, when the peak load reaches 90 percent of the non-redundant UPS system capacity, no new loads can be installed until the UPS system capacity is increased.
Installation of this equipment must be performed by licensed electricians and must comply with local and regional electrical regulations governing the installation of IT equipment. This equipment is designed to operate in installations covered by NFPA-70 (National Electric Code) and NFPA-75 (code for Protection of
Electronic Computer/Data Processing Equipment). For electrical power ratings on options, refer to the product rating label or the user documentation supplied with that option
WARNING: To reduce the risk of personal injury, fire, or damage to the equipment, do not overload the AC supply branch circuit that provides power to the rack. Consult the electrical authority having jurisdiction over wiring and installation requirements of your facility.
CAUTION: Protect the chassis from power fluctuations and temporary interruptions with a regulating UPS. This device protects the hardware from damage caused by power surges and voltage spikes and keeps the chassis in operation during a power failure.
Electrical factors
Proper design and installation of a power distribution system requires specialized skills. The person responsible for this task must have a thorough knowledge of appropriate electrical codes and the limitations of the power systems for computer and data processing equipment.
A well designed power distribution system exceeds the requirements of most electrical codes. A good design, when coupled with proper installation practices, produces the most trouble-free operation.
A detailed discussion of power distribution system design and installation is beyond the scope of this document. However, electrical factors relating to power distribution system design and installation must be considered during the site preparation process.
IMPORTANT: Electrical practices and suggestions in this guide are based on North America practices. For regions and areas outside North America, local electrical codes take precedence over North American electrical codes.
Local authority has jurisdiction (LAHJ) and should make the final decision regarding adherence to region-specific or area-specific electrical codes and guidelines.
Power requirements and considerations 23
Power consumption
Power consumption can be divided into two broad categories:
•
Marked electrical amperage, which is listed on the required safety and regulatory labels, generally represents the maximum current draw that the marked device could achieve. Safety and regulatory labels on computer equipment list the ratings for maximum power consumption conditions.
•
Typical consumption, which is measured under normal circumstances, should be used only in customer calculations with UPS and air conditioning sizing where remaining capacities are needed.
When determining the necessary electrical infrastructure required, consider several factors. The first and most important factor is the local electrical and regulatory codes. The installation must meet or exceed these codes. The local authority has jurisdiction and makes the final decision as to whether an installation conforms to the relevant codes.
In North America, the relevant code is National Electrical Code 2005 Article 210 and Article 645, which states the continuous measured load must not exceed 80 percent of the rated circuit maximum, where continuous load is defined as three hours or longer.
This method leaves some flexibility to the infrastructure designer and includes the following options for determining power requirements:
NOTE: The following scenarios use North America circuit sizes and voltages.
•
Use the HP Power Advisor to calculate the infrastructure required as configured and allow some flexibility for growth. HP provides power sizing tools for all its current industry standard servers at the HP website ( http://www.hp.com/go/hppoweradvisor ).
This tool provides a conservative estimate of power loading values at a given system utilization as well as a theoretical maximum load that the system could achieve as configured. These tools enable the infrastructure designer to use realistic maximum values to estimate power loading and circuit requirements. In this scenario, however, monitoring tools such as Insight Power Manager or HP
Monitored PDUs must be used to ensure that the continuous loads do not exceed 80 percent of the rated circuit load.
•
Install devices in a test environment and measure the actual worst case loads running the applications and loading that is specific to your environment, and then size the electrical infrastructure accordingly.
This method is the most accurate, but it might not be practical for many customers. This method also requires ongoing monitoring of the installation to ensure that infrastructure is not overloaded as applications and loads change.
•
Manage the electrical load using the HP APM. For information about HP APM, see the HP ProLiant SL
Advanced Power Manager User Guide on the HP Moonshot Information Library
(
http://www.hp.com/go/moonshot/docs ).
•
Size air conditioning and UPS devices with typical ratings, but account for overloading that might take place with additional infrastructure growth.
HP recommends a cooling plan for the maximum rated power output of the room and a growth plan for cooling the infrastructure.
When determining power requirements, always consider any peripheral equipment that will be installed during initial installation or as a future upgrade. To determine the power required to support these devices, see the applicable documentation for such devices. HP recommends using dedicated breakers for peripheral equipment.
Power requirements and considerations 24
Electrical load requirements (circuit breaker sizing)
IMPORTANT: LAHJ is the final authority regarding adherence to country-specific electrical codes and guidelines.
HP recommends derating the power distribution systems for one or both of the following reasons:
•
To avoid nuisance tripping from load shifts or power transients, do not run circuit protection devices continuously above 80 percent of their RMS current ratings.
•
Safety agencies derate most power connectors to 80 percent of their RMS current ratings.
Power quality
Most HP products are designed to operate over a wide range of voltages and frequencies. The products are tested and shown to comply with certain EMC Specifications. However, damage can occur if these ranges are exceeded. Severe electrical disturbances can exceed the design specifications of the equipment.
Factors affecting power quality
Common factors that affect power quality include the following:
•
Electrical storms
•
Utility service brownouts or sags
•
Faults in the power generation equipment
•
Large inductive loads, such as motors and welders
•
Load fluctuations occurring within the facility distribution system
•
Loose connections or other faults in the distribution system wiring
Power system protection
HP products can be protected from the sources of many of these electrical disturbances by using the following:
•
A dedicated power distribution system
•
Power conditioning equipment
•
Over- and under-voltage protection and detection circuits
•
Lightning arresters on power cables to protect equipment against electrical storms
The power distribution system is designed to provide immunity to power interruptions. However, testing cannot conclusively rule out loss of service. Use the following guidelines to provide the best possible performance of power distribution systems for HP computer equipment:
•
Dedicated power source—Isolates the power distribution system from other circuits in the facility.
•
Online uninterruptible power supply (UPS)—Keeps input voltage to devices constant and should be considered if outages of one-half cycle or more are common.
•
Auto-start generators–provide backup power to the UPS.
Power requirements and considerations 25
•
Missing-phase and low-voltage detectors—initiate a transfer of the UPS to generator power when a severe power interruption occurs. For peripheral equipment, these devices are recommended but optional.
For each situation, refer to qualified contractors or consultants.
Power considerations
Power is best managed within the rack by the use of one or more rack-mounted PDUs. Depending on the configuration, you might have to use multiple PDUs to connect all devices inside the rack.
The total power load for a PDU must not exceed 80% of the branch circuit rating. If you do not use a PDU, connect each piece of equipment within the rack to a dedicated branch circuit.
For additional information, see the HP website ( http://www.hp.com/go/hppoweradvisor ).
Power redundancy
High-availability information technology equipment such as the HP Moonshot System can be configured with backup or redundant power sources and power supplies in either of the following configurations:
•
N+N design: N power supplies can be provided where N/2 power supplies are capable of sustaining the associated equipment's power demand. For the HP Moonshot 1500 Chassis this quantity is typically a 2+2 power supply configuration.
•
N+1 design: For the HP Moonshot System, the typical N+1 configuration can result in either 3 power supplies or 4 power supplies, depending on the power draw of the system. When the N+1 design requires four power supplies, three of the power supplies are required to handle the equipment's power demand. If one fails, the other three remain online with enough capacity to meet the power demand.
Be sure that the wiring and branch circuitry to each installation is suitably rated for the power demand of the connected equipment. To provide additional redundancy, HP recommends routing the power through separate branch circuits, breaker panels, and PDUs.
Non-redundant power
For equipment supplied by a single source of power, connect all components to the same power distribution device (PDU or UPS). The power distribution device should be suitably rated for the connected load. If the total load exceeds the rating of the power distribution device, obtain a suitable rated device or add a second power distribution device and divide the load equally between the devices.
Line voltage selection
All HP products that are optimized for rack mounting have wide-range power supply inputs designed to operate at a voltage range of 100-240V. HP recommends operating rack-optimized equipment with high line voltage (200 V AC to 240V AC).
Benefits of high line voltage operation include the following:
•
Power supplies run more efficiently and waste less power when operating at 200V to 240 V, thus saving electrical power.
•
Greater capacity is available in a single rack. For the same size circuit, almost twice the power can be delivered to a rack at high line versus low line. For example, a branch circuit that is 115 V 30A can deliver 2760 VA (derated) to a rack, while a branch circuit that is 208 V 30A can deliver 4992VA
(de-rated) to a rack.
Power requirements and considerations 26
•
Some products require 200 V to 240 V input power to operate at their full-rated capacity.
•
The HP 1200W High Efficiency Power Supply operates only at 200 V AC to 240V AC and provides significantly higher efficiency than the 750 W power supply.
•
Power supplies run cooler at higher input voltages, last longer, and improve overall availability. Also, because they run cooler, they produce less heat which helps to lower cooling costs.
•
Keeping input currents lower allows the use of smaller, more standardized power connections.
Distribution hardware
This section describes wire selection and the types of raceways (electrical conduits) used in the distribution system.
Wire selection
Use copper conductors instead of aluminum, because aluminum’s coefficient of expansion differs significantly from that of other metals used in power hardware. Because of this difference, aluminum conductors can cause connector hardware to work loose, overheat, and fail.
Raceway systems (electrical conduits) (LAHJ)
Raceways (electrical conduits) form part of the protective ground path for personnel and equipment.
Raceways protect the wiring from accidental damage and also provide a heatsink for the wires.
Any of the following types may be used:
•
EMT thin-wall tubing
•
Rigid (metal) conduit
•
Liquidtight with RFI shield grounded (most commonly used under raised floors)
•
Armored cable
Building distribution
All building feeders and branch circuitry should be in rigid metallic conduit with proper connectors (to provide ground continuity). Conduit that is exposed and subject to damage should be constructed of rigid galvanized steel.
Grounding requirements
This equipment must be grounded properly for proper operation and safety. In the United States, you must install the equipment in accordance with NFPA 70 (National Electric Code), Article 250, as well as any local and regional building codes.
In Canada, you must install the equipment in accordance with Canadian Standards Association, CSA
C22.1, Canadian Electrical Code.
In all other countries, you must install the equipment in accordance with any regional or national electrical wiring codes, such as the International Electrotechnical Commission (IEC) Code 364, parts 1 through 7.
Furthermore, you must be sure that all power distribution devices used in the installation, such as branch wiring and receptacles, are listed or certified grounding-type devices.
Power requirements and considerations 27
Because of the high ground-leakage currents associated with this equipment, HP recommends the use of a
PDU that is either permanently wired to the building’s branch circuit or includes a nondetachable cord that is wired to an industrial-style plug. NEMA locking-style plugs or those complying with IEC 60309 are considered suitable for this purpose. Using common power outlet strips to supply power to this equipment is not recommended.
Grounding systems
HP systems are tested and certified only with grounding systems in which a neutral return path and a protective earth are separate conductors without any inserted impedances. Additionally, the protective earth and return neutral wires are shorted together at the XO bonding junction on the secondary side of the newly derived power source.
Grounding and earth leakage current
For proper operation and safety, rack components must be properly grounded in accordance with any local and regional building codes. Furthermore, be sure that all power distribution devices used in the installation, such as branch wiring and receptacles, are Listed or Certified grounding-type devices.
Observe the following limits when connecting products to AC power distribution devices:
•
For UPS products and PDUs that have permanently attached AC power cords or are directly wired to the building power, the total combined leakage current should not exceed 5 percent of the total input current required for the connected products.
•
For UPS products and PDUs that have detachable AC power cords, the total combined leakage current should not exceed 3.5 mA per PDU or UPS.
Power distribution safety grounding (LAHJ)
The power distribution safety grounding system consists of connecting various points in the power distribution system to earth ground using green (green/yellow) wire ground conductors. When tied to metal chassis parts that might be touched, these ground connections protect computer room personnel against shock hazard from current leakage and fault conditions.
Power distribution systems consist of several parts. HP recommends that these parts be solidly interconnected to provide an equipotential ground to all points.
Main building electrical ground
The main electrical service entrance equipment should have an earth ground connection, as required by applicable codes. Connections such as a grounding rod, building steel, or a conductive type cold water service pipe provide an earth ground.
Conduit bonding
Construct all electrical distribution systems of metallic conduit that is connected together securely or bonded to panels and electrical boxes to provide a continuous grounding system.
Power requirements and considerations 28
Power panel ground
Each power panel should be grounded to the electrical service entrance with green (green/yellow) wire ground conductors. The green (green/yellow) wire ground conductors should be sized per applicable codes
(based on circuit overcurrent device ratings).
NOTE: The green wire ground conductor can be a black wire with green tape (LAHJ).
Computer safety ground
Ground all computer equipment with the green (green/yellow) wire included in the branch circuitry. The green (green/yellow) wire ground conductors should be connected to the appropriate power panel and should be sized per applicable codes (based on circuit overcurrent device ratings).
Dual power source grounding
With dual power sources, both sources must have the same ground reference. Otherwise, an electrical potential could exist that could be hazardous to personnel and might cause performance issues for the equipment.
Because the dual power sources often originate from two different transformers or two different UPS devices, use the same ground reference point to ground the secondary of each transformer or UPS device. Measure the voltage potentials from ground pin to ground pin of these sources. Voltage levels that are measured above 3.0 V might be hazardous to personnel or cause equipment performance issues and must be corrected before placing the equipment in service.
Cabinet performance grounding (high frequency ground)
Some safety power distribution wires are too long and too inductive to provide adequate high-frequency return paths. Signal interconnects between system cabinets might need high-frequency ground return paths in
addition to the safety or power distribution system 50-60Hz grounding system. HP recommends the use of a properly installed SRG, also bonded to the 50-60Hz grounding system.
WARNING: Do not use a cabinet-to-floor ground strap in place of a properly installed safety
(50-60Hz) grounding system, nor in place of a properly installed SRG. An improperly installed grounding system can present a shock hazard to personnel.
Power panels located in close proximity to the computer equipment should also be connected to the site grounding grid.
Raised floor high-frequency noise grounding
IMPORTANT: Regardless of the grounding connection method used, the raised floor should be grounded as an absolute safety minimum.
If a raised floor system is used, the floor must be designed as a signal ground grid that maintains an equal potential over a broad band of frequencies. To accomplish this, observe the following guidelines:
•
Use a raised floor system where the stringers are bolted to the pedestals.
•
Select floor components that have a corrosion-resistant plating to provide low resistance connection points to other components and to computer cabinets.
Power requirements and considerations 29
•
Connect a 2/0 copper conductor to every other pedestal around the perimeter and to the equipment grounding system of the building.
•
Bond all metal pipes that enter or leave the raised floor area to the 2/0 perimeter ground.
•
Bond each row and column of the floor grid to the 2/0 perimeter ground.
•
Bond any I-beams that penetrate the raised floor to the pedestals.
•
Connect the opposite corners of equipment cabinets to the pedestals with #12 stranded wire.
•
Where the cabinets are bolted together in rows, bonding two corners at opposite ends of the row is sufficient.
•
Use bonding straps that are 70 cm (24 in) or less in length.
If a bolted-stringer raised floor system is not used, the following alternate methods can provide acceptable results:
•
Use a grounded #6 AWG minimum copper wire grid that is clamped mechanically to floor pedestals and bonded properly to the building or site ground.
•
Add a grounding grid made of copper strips mounted to the subfloor. The strips should be 0.8 mm
(0.032 in) thick and a minimum of 76 mm (3.0 in) wide. Connect each pedestal to four strips using
6-mm (0.25-in) bolts tightened to the manufacturer’s torque recommendation.
Raised floor SRG bonding detail
3
4
Item
1
2
Description
#2/0 CU bond to nearest building steel or ground connection
Bond the computer equipment rack to SRG with #4 CU AWG, maximum length 70 cm (24 in)
Computer equipment racks
All metallic conduits, pipes (water, fire suppression, steam, air, drain, refrigerant, and so on) and those that penetrate vertically or horizontally into the raised floor must be bonded to the SRG with a
#4 CU AWG, maximum length 70 cm (24 in).
Power requirements and considerations 30
8
9
6
7
Item
5
10
11
12
Description
All power panels, control and alarm panels must be bonded to the
SRG with a #4 CU AWC.
HVAC equipment
HVAC equipment must be bonded to the SRG with #4 CU AVG, maximum length 70 cm (24 in).
#2/0 CU bond to nearest building ground connection
Bond every 1.22 m (4.00 ft) along the perimeter with a #2/0 bare
CU conductor.
Perimeter bonding point
Access floor pedestal (typical)
Power distribution units or power panels must be bonded to the SRG with a #4 CU AWG maximum length 70 cm (24 in).
SRG (metal stringers of raised floor system)
13
Equipment grounding implementation details
Connect all HP equipment cabinets to the site ground grid as follows:
1.
2.
Attach one end of each ground strap to the applicable cabinet ground lug.
Attach the other end to the nearest pedestal base (raised floor) or cable trough ground point (nonraised floor).
3.
4.
Check that the braid contact on each end of the ground strap consists of a terminal and connection hardware (a 6-mm [0.25-in] bolt, nuts, and washers).
Check that the braid contact connection points are free of paint or other insulating material and treated with a contact enhancement compound (similar to Burndy Penetrox).
System installation guidelines
In domestic installations, install the proper receptacles before the HP equipment arrives. For installation procedures, see the appropriate installation guide.
Wiring connections
Expansion and contraction rates vary among different metals. Therefore, the integrity of an electrical connection depends on the restraining force applied. Connections that are too tight can compress or deform the hardware and cause it to weaken. This deformation usually leads to high impedance, preventing circuit breakers from tripping when needed or contributing to a buildup of high frequency noise.
CAUTION: Connections that are too loose or too tight can have a high impedance that causes serious problems, such as erratic equipment operation. A high impedance connection overheats and sometimes causes fire or high temperatures that can destroy hard-to-replace components such as distribution panels or system bus bars.
Wiring connections must be properly torqued. Many equipment manufacturers specify the proper connection torque values for their hardware.
Ground connections must only be made on a conductive, nonpainted surface. When equipment vibration is present, lock washers must be used on all connections to prevent connection hardware from working loose.
Power requirements and considerations 31
Data communications cables
Power transformers create high-energy fields in the form of EMI. Heavy foot traffic can create ESD that can damage electronic components. Route data communications cables away from these areas. To reduce the effects of external fields, use shielded data communications cables that meet approved industry standards.
Power configuration
The HP Moonshot 1500 Chassis can be powered from single-phase AC power sources. Power supply options are available at the time of purchase through either the Build-to-Order or Configure-to-Order processes.
Existing units can be converted from one power source to another when necessary. For more information on converting an enclosure power source, see the HP website
( http://h18004.www1.hp.com/products/solutions/power ).
Single-phase AC configuration
The HP Moonshot 1500 Chassis has four power supplies, five fans, and a single HP APM interface located on the Moonshot 1500 CM module.
7
8
5
6
1
2
3
4
9
10
11
Item Description
Fan bay 1
Fan bay 2
Fan bay 3
Fan bay 4
Fan bay 5
HP APM port
Moonshot 1500 CM module
Power supply bay 4
Power supply bay 3
Power supply bay 2
Power supply bay 1
Power requirements and considerations 32
To cable the chassis using a single-phase AC configuration:
1.
Connect the AC power cables to the power supply connections on the rear of the chassis.
2.
Connect the AC power cables to the AC power source or to an installed PDU.
Power supply specifications
For the latest power supply specifications, see the HP Moonshot 1500 Chassis QuickSpecs in the HP website
( http://h18004.www1.hp.com/products/quickspecs/14757_na/14757_na.html
).
Power requirements and considerations 33
Hardware specifications and requirements
Chassis specifications
Specification Value
Height
Depth
Width
Weight, fully loaded
18.96 cm (7.46 in)
84.91 cm (33.43 in)
44.33 cm (17.45 in)
81.65 kg (180.00 lb)
Weight, empty
43.09 kg (95.00 lb)
HP Intelligent Rack Series rack specifications
For more information about product features, specifications, options, configurations, and compatibility, see the product QuickSpecs on the HP website ( http://www.hp.com/go/qs ).
Rack Height Width Depth Dynamic load
(gross)
—
Static load
HP 642 1200mm Pallet Intelligent
Rack
HP 642 1200mm Shock Intelligent
Rack
HP 647 1200mm Pallet Intelligent
Rack
42U 597.80 mm
(23.54 in)
42U 597.80 mm
(23.54 in)
47U 597.80 mm
(23.54 in)
1300.20 mm
(51.19 in)
1300.20 mm
(51.19 in)
1300.20 mm
(51.19 in)
1,360.78 kg
(3,000.00 lb)
—
1,360.78 kg
(3,000.00 lb)
1,360.78 kg
(3,000.00 lb)
1,360.78 kg
(3,000.00 lb)
HP 647 1200mm Shock Intelligent
Rack
HP 842 1200mm Pallet Intelligent
Rack
HP 842 1200mm Shock Intelligent
Rack
47U 597.80 mm
(23.54 in)
42U 797.80 mm
(31.40 in)
42U 797.80 mm
(31.40 in)
1300.20 mm
(51.19 in)
1300.10 mm
(51.19 in)
1300.10 mm
(51.19 in)
1,360.78 kg
(3,000.00 lb)
—
1,360.78 kg
(3,000.00 lb)
1,360.78 kg
(3,000.00 lb)
1,360.78 kg
(3,000.00 lb)
1,360.78 kg
(3,000.00 lb)
Rack requirements
The chassis is compatible with the following HP Intelligent Series Racks:
•
HP 642 1200mm Pallet Intelligent Rack
•
HP 642 1200mm Shock Intelligent Rack
•
HP 647 1200mm Pallet Intelligent Rack
•
HP 647 1200mm Shock Intelligent Rack
•
HP 842 1200mm Pallet Intelligent Rack
Hardware specifications and requirements 34
•
HP 842 1200mm Shock Intelligent Rack
•
Telco racks
If a third-party rack is used, observe the following additional requirements to ensure adequate airflow and to prevent damage to the equipment:
•
Front and rear doors: If the rack includes closing front and rear doors, a minimum of 65 percent open area must be provided to ensure adequate airflow.
•
Front door: The clearance from face of rack to inside of the front door must be a minimum of 77 mm (3 in).
•
Rear door: The clearance between the rear of the enclosure and the rear rack door must be a minimum of 177.80 mm (7.00 in) to accommodate system cabling.
•
Side: The clearance between the installed rack component and the side panels of the rack must be a minimum of 70 mm (2.75 in).
•
Width: 483 mm (19 in)
•
Depth: Maximum clearance between front and rear RETMA rails is 876.00 mm (34.5 in). Minimum clearance for square-hole and round-hole racks is 654.00 mm (25.75 in).
•
The rack must be able to accept the adjustable rack rails that are shipped with each chassis: o
Minimum rail length: 654.00 mm (25.75 in) o
Maximum rail length: 876.00 mm (34.50 in)
Rack-free environment requirements
The HP Moonshot 1500 Chassis (referred to as the chassis) can be used in a rack-free environment. The following conditions must be met when performing a rack-free installation:
•
A fully-populated chassis can weigh up to 81.65 kg (180.00 lb). The object supporting the chassis must be able to withstand this weight.
•
The chassis should be supported by a sturdy, flat surface.
WARNING: To reduce the risk of personal injury or damage to the equipment in a rack-free environment:
•
Never stack the chassis on top of another chassis.
•
Never place equipment on top of the chassis.
• Never place the chassis on a surface that cannot support up to 81.65 kg (180.00 lb).
Hardware specifications and requirements 35
Configuration scenarios
Example configurations
Configuration examples can be calculated using the HP Power Advisor Tool
( http://www.hp.com/go/hppoweradvisor ). This tool is designed for facilities planning purposes only.
Values obtained from the tool are based on worst case loads. Whenever possible, HP recommends using actual measurements in configuration planning. Measurements must be made with the intended configuration, application loading, and ambient environment.
Actual power usage will vary, depending on application loading, ambient temperature, and other factors.
Estimating power and cooling
Power consumed by the HP Moonshot System is converted to heat, which is expressed in Btu/h. You can calculate the heat load for a system by using the following equation: Heat Load = Power (W) x 3.413 BTU/h.
In the preceding equation, 1 W equals 3.413 BTU/h. The installation of an HP Moonshot System into a computer room containing existing systems might have a significant impact on cooling requirements. HP
Data Center Services provides consultation to assist you in developing an efficient high-density cooling strategy by using dynamic modeling.
For more information, contact your HP sales representative.
A complete discussion of cooling requirements is beyond the scope of this guide. For more information, see the Technology Brief TC050901TB, Optimizing facility operation in high density data center environments,
2nd edition, available on the HP website
( http://h20564.www2.hp.com/portal/site/hpsc/public/kb/docDisplay/?docId=c00064724 ).
The budget allowed for cartridges should include at least 1.8kW of actual power usage per chassis at maximum configuration. When planning upgrades to older data centers to add an HP Moonshot System, plan to upgrade the electrical and mechanical infrastructure to properly support the added electrical and cooling requirements. New data center planning for the HP Moonshot 1500 Chassis must specify a minimum of 355 W/sf or 17 kW/cabinet power densities.
To estimate computer room cooling requirements, first calculate the amount of energy used by the solution.
HP provides online power-consumption calculators that enable you to configure a virtual rack and determine its power consumption. For more information, see the HP website
( http://www.hp.com/go/hppoweradvisor ).
For other models, obtain the power consumption data from the component specifications.
The QuickSpecs contain the specifications for all HP products. For more information, see the HP website
( http://www.hp.com/go/qs ).
Use a worksheet similar to the following to calculate power consumption and heat load.
Component Quantity Watts BTUs
HP Moonshot 1500 Chassis
(configured)
Total
Configuration scenarios 36
Component
Other rack options
Option A
Option B
Total power
Quantity Watts BTUs Total
Estimating total weight
You might need to determine the total weight of custom configurations if any of the following considerations apply:
•
Variations in flooring support when moving the solution during installation
•
Trucking equipment limits
•
Raised floor installation (calculating load limits and reinforcement)
•
Secondary or tertiary floor installation
Determine the weight and floor load requirements for the purpose of site planning:
•
Capacity planning: Assume that the rack will eventually be laden to its 907.18 kg (2,000 lb) capacity.
•
To obtain an approximation for planning, you can use the worksheet supplied in the following table for each rack in the configuration.
You must add the weight of any components that are not included in the list of rack options, for example, additional drives in the cartridge. To obtain the weight of any individual component, see the product
QuickSpecs on the HP website ( http://www.hp.com/go/productbulletin ).
Component Quantity Weight (kg) Weight (lb) Total
Rack
HP Moonshot 1500 Chassis weight including all components
Other rack options and requirements
Option A
Option B
Option C
Total weight
Configuration scenarios 37
Preparing for installation
Warnings and cautions
WARNING: To reduce the risk of personal injury or damage to equipment, heed all warnings and cautions throughout the installation instructions.
WARNING: To reduce the risk of personal injury or damage to the equipment, be sure that:
• The rack is bolted to the floor using the concrete anchor kit.
•
The leveling feet extend to the floor.
•
The full weight of the rack rests on the leveling feet.
• The racks are coupled together in multiple rack installations.
•
Only one component is extended at a time. If more than one component is extended, a rack might become unstable.
WARNING: The chassis is very heavy. To reduce the risk of personal injury or damage to the equipment:
•
Observe local occupational health and safety requirements and guidelines for manual material handling.
• Remove all installed components from the chassis before installing or moving the chassis.
•
Use caution and get help to lift and stabilize the chassis during installation or removal, especially when the chassis is not fastened to the rack.
WARNING: To reduce the risk of personal injury or damage to the equipment, you must adequately support the chassis during installation and removal.
WARNING: Always use at least two people to lift the chassis into the rack. If the chassis is being loaded into the rack above chest level, a third person must assist with aligning the chassis with the rails while the other two people support the weight of the chassis.
WARNING: Be sure to install chassis starting from the bottom of the rack and work your way up the rack.
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.
WARNING: To reduce the risk of electric shock or damage to the equipment:
• Never reach inside the chassis while the system is powered up.
•
Perform service on system components only as instructed in the user documentation.
CAUTION: Always be sure that equipment is properly grounded and that you follow proper grounding procedures before beginning any installation procedure. Improper grounding can result in ESD damage to electronic components. For more information, refer to "Electrostatic
discharge (" Electrostatic discharge prevention " on page 8 )."
Preparing for installation 38
CAUTION: When performing non-hot-plug operations, you must power down the chassis and/or the system. However, it may be necessary to leave the chassis powered up when performing other operations, such as hot-plug installations or troubleshooting.
Additional rack considerations
Consider the following additional specifications and components with regard to your specific rack configuration:
•
Power—If a UPS is installed, do not exceed its output rating. Be sure to review the installation instructions provided with each component for important cautions and warnings.
•
PDUs—Install PDUs before installing other components.
•
Height—The height of the rack and of rack-mountable components is measured in U increments, where
U = 4.5 cm (1.75 in). When you are configuring your rack installation, remember that the total U measurement of the components you want to install cannot exceed the stated U height of the rack.
•
Keyboard—The rack keyboard requires installation of a 1U keyboard drawer rack option kit.
•
Monitor—The monitor requires installation of a monitor/utility shelf rack option kit unless you are using a rack-mountable flat-panel monitor.
•
Console switch—If a console switch is configured, use the CPU-to-console switch cable included with the product. The standard distance between the console switch and the keyboard, monitor, and mouse can vary by the following lengths: o
0.91 m (3.00 ft) o o o o
2.13 m (7.00 ft)
3.65 m (12.00 ft)
6.09 m (20.00 ft)
12.19 m (40.00 ft)
NOTE: National electrical regulations governing the installation of building wiring require that an appropriate cable, meeting fire-safety standards, must be used any time cabling is routed:
•
Through an overhead drop-ceiling
• Under raised flooring
• From room to room
•
From floor to floor
Be sure that the cable jacket or sleeving is made of material that does not burn easily and does not exude toxic fumes when exposed to heat. Be sure that the cable you have selected is appropriate for your installation site. If you require a U.S. plenum-rated (CL2P) cable, contact your local HP authorized reseller to obtain any of the following options:
•
149363-B21-20-foot plenum cable
• 149364-B21-40-foot plenum cable
•
Rack baying option kits—The number of baying kits needed to join a series of racks is one less than the number of racks in the suite. Each baying kit supplies parts to bay two cabinets on 600 mm (24 in) center line spacing.
•
Side panels—Only one set of side panels is required for each row of bayed racks.
Preparing for installation 39
•
Stabilizer kit—A stabilizer kit is either required or recommended, depending on your rack configuration.
For more information about supported rack option kits, see the HP Intelligent Rack Family Options Installation
Guide on the HP website ( http://www.hp.com/go/rackandpower ).
General component placement guidelines
WARNING: To reduce the risk of personal injury or damage to the equipment, adequately stabilize the rack before extending a component outside the rack. Extend only one component at a time. A rack may become unstable if more than one component is extended.
WARNING: To reduce the risk of personal injury or damage to the equipment, always load the heaviest item first from the bottom of the rack up. This makes the rack bottom-heavy and helps prevent the rack from becoming unstable.
WARNING: To reduce the risk of personal injury or damage to the equipment, be sure that:
•
The leveling feet are extended to the floor.
• The full weight of the rack rests on the leveling feet.
• The stabilizing feet are attached to the rack if it is a single-rack installation.
•
The racks are coupled together in multiple-rack installations.
•
Only one component is extended at a time. A rack may become unstable if more than one component is extended for any reason.
CAUTION: To reduce the risk of damage to the equipment when installing third-party options:
•
Do not permit optional equipment to impede airflow around the chassis or to increase the internal rack temperature beyond the maximum allowable limits.
•
Do not exceed the manufacturer’s TMRA.
IMPORTANT: HP strongly recommends that you configure the rack using the HP eCo-Enterprise
Configurator, which provides factory default racking. The latest version of this software is available on the HP website ( http://h30099.www3.hp.com/eGlue/eco/begin.do
).
When loading your components, observe the general guidelines:
•
For detailed instructions on installing specific component or third-party hardware, see the user documentation that shipped with that component.
•
Before installing components into the rack, see "Electrostatic discharge prevention (on page 8 )."
•
Use the configuration prepared by the eCo Enterprise Configurator as a guideline for installation components.
•
Load the heavier components first from the bottom of the rack.
•
Be sure to balance the weight load among bayed racks. For example, if you have several UPS units and several chassis, do not load all of the UPS units into one rack. Instead, distribute them evenly in the bottom positions of each rack.
•
Allow a minimum clearance of 76 cm (30 in) between the wall and the rear of the rack to provide adequate access for installation and service.
Preparing for installation 40
Rack configuration software
To help you plan your rack configuration more efficiently, HP provides eCo-Enterprise Configurator, a powerful web-based service that enables you to build, store, and export end-to-end rack configurations. HP strongly recommends that you configure the rack using the eCo-Enterprise Configurator, which provides factory default racking. The latest version of the software is available on the HP website
( http://h30099.www3.hp.com/eGlue/eco/begin.do
).
Sample installation schedule
The following schedule lists the sequence of events for a typical system installation. For situations that prevent following this type of schedule, consider using a milestone schedule.
•
60 days before installation o
Floor plan design completed and sent to Hewlett-Packard (if required to be an HP task)
•
30 days before installation o
Primary power and air conditioning installation completed o o o o o o o o
Telephone and data cables installed
Fire protection equipment installed
Major facility changes completed
Special delivery requirements defined
Site inspection survey completed
Delivery survey completed
A signed copy of the site inspection and delivery survey sent to HP
Site inspection and predelivery coordination meeting arranged with an HP representative to review the inspection checklist and arrange an installation schedule
•
7 days before installation o
Final check made with an HP site preparation specialist to resolve any last minute problems
Sample checklists
Customer and Hewlett-Packard information checklist:
Customer information
Name:
Phone:
Street address:
City or town:
State or province:
Zip or postal code:
Primary customer contact:
Secondary customer contact:
Traffic coordinator:
Hewlett-Packard information
Sales representative:
Country:
Phone:
Phone:
Phone:
Phone:
Preparing for installation 41
Survey representative:
Order number:
Sample site inspection checklist:
No.
Computer room
Date:
Scheduled delivery date:
1. Is there a completed floor plan?
2. Is there adequate space for maintenance needs? Minimum recommended clearances, front and rear: 914 mm (36 in).
3. Is access to the site or computer room restricted?
4. Is the computer room structurally complete?
5. Is a raised floor installed and in good condition?
6. Is the raised floor adequate for equipment loading?
7. Are there channels or cutouts for cable routing?
8. Is there a remote console telephone line available with an
RJ-11 jack?
9. Is a telephone line available?
10. Are customer supplied peripheral cables and LAN cables available and of the proper type?
11. Are floor tiles in good condition and properly braced?
12. Is the floor tile underside shiny or painted? If painted, determine the need for particulate test.
Power and lighting
13. Are lighting levels adequate for maintenance?
14. Are AC outlets available for servicing needs? (for example, vacuuming)
15. Does the input voltage correspond to equipment specifications?
16. Is a dual power source used? If so, identify type and evaluate grounding.
17. Does the input frequency correspond to equipment specifications?
18. Are lighting arrestors installed inside the building?
19. Is power conditioning equipment installed?
20. Is there a dedicated branch circuit for equipment?
Yes
21. Is the dedicated branch circuit less than 72 m (250 ft)?
22. Are the input circuit breakers adequate for equipment loads?
Safety
23. Is there an emergency power shut-off switch?
24. Is a telephone available for emergency purposes?
25. Is a fire protection system installed in the computer room?
26. Is antistatic flooring installed?
No Comment or date
Preparing for installation 42
27. Do any equipment servicing hazards exist (loose ground wires, poor lighting, or others)?
Cooling
28. Can cooling be maintained between 20ºC and 55ºC (up to
5000 ft)? Derate 1º C/1000 ft above 5000 ft and up to
10,000 ft.
29. Can temperature changes be held to 10ºC/h with tape media? Can temperature changes be held to 20ºC/h without tape media?
30. Can humidity levels be maintained at 40% to 60% at 35ºC noncondensing?
31. Are air conditioning filters installed and clean?
Storage
32. Are cabinets available for tape and disc media?
33. Is shelving available for documentation?
Training
34. Are personnel enrolled in the System Administrator's Course?
35. Is on-site training required?
Delivery survey
Special instructions or recommendations should be entered on the special instructions or recommendations form. The following list gives examples of special instructions or issues:
•
Packaging restrictions at the facility, such as size and weight limitations
•
Special delivery procedures
•
Special equipment required for installation, such as tracking or hoists
•
What time the facility is available for installation (after the equipment is unloaded)
•
Special security requirements applicable to the facility, such as security clearance
Dock delivery
Is the dock large enough for a semitrailer?
Yes or No
Location of the dock:
North, south, east, or west
Street name if different than company address:
Street delivery
Location of the access door:
North, south, east, or west
Street name if different than company address:
Height of access door:
Width of access door:
Special permits (list type and agency obtained from):
Preparing for installation 43
Elevator
Capacity (kg or lb):
Depth:
Height:
Width:
Stairs
Number of flights:
Width:
Preparing for installation 44
Conversion factors and formulas
Conversion factors
The conversion factors provided here are intended to help in data calculation for systems that do not conform to the specific configurations listed in this guide. Listed below are the conversion factors used in this document, as well as additional conversion factors that can be helpful in determining those factors required for site planning.
•
Refrigeration o
1 watt = 0.86 kcal/h o o o
1 watt = 3.412 BTU/h
1 watt = 2.843 x 10 -4 tons
1 ton = 200 BTU/min
1 ton = 12,000 BTU/h o o
1 ton = 3517.2 W
•
Equivalents o o
1 centimeter = 0.3937 in
1 meter = 3.28 ft o o o o
1 meter = 1.09 yards
1 inch = 2.54 cm
1 foot = 0.305 m
1 CFM = 1.7 m
3
/h
Formulas
The following formulas can be helpful in determining conversion factors required for site planning:
• kVA = voltage x Current (amps)
•
Watts = VA x PF
•
BTU = Watts x 3.41
Conversion factors and formulas 45
Support and other resources
Before you contact HP
Be sure to have the following information available before you call HP:
•
Technical support registration number (if applicable)
•
Product name
•
Chassis serial number
•
Product identification number
•
Applicable error messages
•
Operating system type and revision level
To obtain product information, log in to iLO CM firmware and use the Show Chassis Info command. For more information, see the HP Moonshot iLO Chassis Management CLI User Guide in the HP Moonshot
Information Library ( http://www.hp.com/go/moonshot/docs ).
HP contact information
For United States and worldwide contact information, see the Contact HP website
( http://www.hp.com/go/assistance ).
In the United States:
•
To contact HP by phone, call 1-800-334-5144. For continuous quality improvement, calls may be recorded or monitored.
•
If you have purchased a Care Pack (service upgrade), see the Support & Drivers website
( http://www8.hp.com/us/en/support-drivers.html
). If the problem cannot be resolved at the website, call 1-800-633-3600. For more information about Care Packs, see the HP website
( http://pro-aq-sama.houston.hp.com/services/cache/10950-0-0-225-121.html
).
Support and other resources 46
Acronyms and abbreviations
ASHRAE
American Society of Heating, Refrigerating and Air-Conditioning Engineers
AWG
American wire gauge
BTU
British Thermal Units
CM chassis manager
EMI electromagnetic interference
EMT electrical metallic tubing
ESD electrostatic discharge
HP APM
HP Advanced Power Manager
ISO
International Organization for Standardization kVA kilovolt-ampere
LAHJ local authority has jurisdiction
PDU power distribution unit
Acronyms and abbreviations 47
PF power factor
RETMA
Radio Electronics Television Manufacturers Association (rack spacing)
RMS root-mean-square
SRG signal reference grid
TMRA recommended ambient operating temperature
UPS uninterruptible power system
Acronyms and abbreviations 48
Documentation feedback
HP is committed to providing documentation that meets your needs. To help us improve the documentation, send any errors, suggestions, or comments to Documentation Feedback ( mailto:[email protected]
).
Include the document title and part number, version number, or the URL when submitting your feedback.
Index 49
Index
A
acoustic noise specification 8
additional rack considerations 39
B
C
cabinet performance grounding 29
chassis environmental specifications 16
contact information 46 contacting HP 46
D
delivery considerations 11, 43 delivery survey 43
documentation 5, 49 documentation feedback 49
dual power source grounding 29
E
electrical load requirements 25 electrical requirements 23, 25
environmental requirements 6, 16
equipment grounding details 31
estimating power and cooling 36
F
factors affecting power quality 25
G
grounding requirements 27, 28 grounding systems 28
H
hardware specifications and requirements 34
HP Rack Tie-Down Option Kit 21
I
installation guidelines 31, 40
Index 50
L
M
main building electrcial ground 28
metallic particular contamination 7
N
O
operating environment, recommended 9
operational space requirements 11, 12
P
PDU (power distribution unit) 13
power considerations 26 power consumption 24, 26
power distribution safety grounding 28
power supply specifications 33
R
rack configuration software 41
rack placement, additional considerations 20, 21
rack-free environment requirements 35 rack-free installation 35
recommneded operating environment 9
requirements, rack-free environment 35
S
single-phase AC configuration 32
site planning considerations 41
space requirements, delivery 11
space requirements, operational 11, 12
support 46 support and other resources 46
T
technical support 46 telephone numbers 46
W
Index 51
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