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GSM TELEPHONE
SGH-D807
GSM TELEPHONE CONTENTS
1. Safety Precautions
2. General Introduction
3. Specification
4. Product Function
5. Circuit Description
6. Test Command & Test Procedure
7. Array course control
8. Exploded View and Parts List
9. Disassembly and Assembly instructions
10. MAIN Electrical Parts List
11. Flow Chart of Troubleshooting
12. PCB Diagrams
13. Block Diagrams
14. Reference data
This Service Manual is a property of Samsung Electronics Co.,Ltd.
Any unauthorized use of Manual can be punished under applicable
International and/or domestic law.
ⓒ
Samsung Electronics Co.,Ltd.
Code No.: GH68-10831A
2006. 05. Rev.1.0
Contents
1. Safety Precautions
1-1. Repair Precaution ...........................................................................1-1
1-2. ESD(Electrostatically Sensitive Devices) Precaution ...........................1-2
2. General Introduction
3. Specification
3-1. GSM General Specification ..............................................................3-1
3-2. GSM TX power class ......................................................................3-2
3-3. EDGE TX Power Level ....................................................................3-3
4. Product Function
5. Circuit Description
6. Test Command & Test Procedure
6-1. Calibration Equipment ....................................................................6-1
6-2. Calibration Program .......................................................................6-1
6-3. Tx Power Tune up Procedure ..........................................................6-2
7. Array course control
7-1. Downloading Binary Files ................................................................7-1
7-2. Pre-requisition for Downloading .......................................................7-1
7-3. S/W Downloader Program ...............................................................7-2
7-4. How to Download ..........................................................................7-2
8. Exploded View and Parts List
8-1. Cellular phone Exploded View .........................................................8-1
8-2. Cellular phone Parts list .................................................................8-2
9. Disassembly and Assembly instructions
9-1. Disassembly ..................................................................................9-1
9-2. Assembly ......................................................................................9-7
9-3. KIT Assembly ..............................................................................9-10
9-4. Window Disassembly ....................................................................9-13
Contents
10. MAIN Electrical Parts List
11. Flow Chart of Troubleshooting
11-1. Baseband
11-1-1. Power ON ..............................................................................11-1
11-1-2. Initial ....................................................................................11-6
11-1-3. Sim Part ...............................................................................11-9
11-1-4. Microphone Part ...................................................................11-10
11-1-5. Speaker Part_1(MP3, SPEAKER PHONE) .................................11-12
11-1-6. Speaker Part_2(RECEIVER) ...................................................11-16
11-1-7. Charging Part ......................................................................11-18
11-2. RF
11-2-1. GSM850/EGSM RX ................................................................11-21
11-2-2. DCS RX ...............................................................................11-23
11-2-3. PCS RX ...............................................................................11-25
11-2-4. GSM850/EGSM TX ................................................................11-26
11-2-5. DCS/PCS TX ........................................................................11-28
12. PCB Diagrams
13. Block Diagrams
14. Reference data
1. Safety Precautions
1-1. Repair Precaution
● Repair in Shield Box, during detailed tuning.
Take specially care of tuning or test, because specipicty of cellular phone is sensitive for surrounding interference(RF noise).
● Be careful to use a kind of magnetic object or tool, because performance of parts is damaged by the influence of manetic force.
● Surely use a standard screwdriver when you disassemble this product, otherwise screw will be worn away.
● Use a thicken twisted wire when you measure level.
A thicken twisted wire has low resistance, therefore error of measurement is few.
● Repair after separate Test Pack and Set because for short danger (for example an overcurrent and furious flames of parts etc) when you repair board in condition of connecting Test Pack and tuning on.
● Take specially care of soldering, because Land of PCB is small and weak in heat.
● Surely tune on/off while using AC power plug, because a repair of battery charger is dangerous when tuning ON/OFF PBA and Connector after disassembing charger.
● Don't use as you pleases after change other material than replacement registered on SEC
System. Otherwise engineer in charge isn't charged with problem that you don't keep this rules.
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Safety Precautions
1-2. ESD(Electrostatically Sensitive Devices) Precaution
Several semiconductor may be damaged easilly by static electricity. Such parts are called by
ESD(Electrostatically Sensitive Devices), for example IC,BGA chip etc. Read Precaution below.
You can prevent from ESD damage by static electricity.
● Remove static electricity remained your body before you touch semiconductor or parts with semiconductor. There are ways that you touch an earthed place or wear static electricity prevention string on wrist.
● Use earthed soldering steel when you connect or disconnect ESD.
● Use soldering removing tool to break static electricity. , otherwise ESD will be damaged by static electricity.
● Don't unpack until you set up ESD on product. Because most of ESD are packed by box and aluminum plate to have conductive power,they are prevented from static electricity.
● You must maintain electric contact between ESD and place due to be set up until ESD is connected completely to the proper place or a circuit board.
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2. General Introduction
The SGH-D807 Quad Band phone functions as digital phone working in GSM
(Global System for Mobile communications)850,EGSM900, DCS1800 and
PCS(PersonalCommunication System)1900 modes.
<Specification>
● Dimension : 99.9x52.0x15.4 mm (with Standard Battery)
● LCD : QCIF(176×220) TFT, 2.12"
● R/F band
● Vocoder
● Antenna
● SIM
: GSM850 / EGSM 900 / DCS1800 / PCS1900
: EFR + FR + HR + AMR
: Intenna type
: 3 Voltage operation
● BLUETOOTH : VER 1.2
<GPRS/EGPRS Factor>
● MS Class : Class B
● GPRS Phase : GSM Phase II+
● Multi-slot
● SMG
: GPRS/EGPRS Class 10 (2 Up-link, 4 Down-link, 5 Sum)
: SMG #31
● Coding scheme : CS1 - CS4(GPRS), MCS5 - MCS9(EGPRS) support
● Power class : GSM850 - Class 4 (2W)
EGSM900 - Class 4 (2W)
DCS1800 - Class 1 (1W)
PCS1900 - Class 1 (1W)
● WAP 2.0 Browser
● SIM AT(Application Toolkit)
● 40 Polyphonic Ringtone
< Basic Package >
● Handset + Standard Battery + TA
+ User Guide
< Option Item >
● Battery : Li-Ion, 880mA
● Travel Adapter
● Ear Microphone
● Bluetooth Headset
● Bluetooth Hands Free Kit
● Car Charger/Adapter
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3. Specification
3-1. GSM General Specification
Freq. Band[MHz]
Uplink/Downlink
ARFCN range
GSM850
824~849
869~894
128~251
Tx/Rx spacing 45 MHz
Mod. Bit rate/
Bit Period
GPRS
EDGE
Time Slot
Period/Frame Period
270.833 Kbps
3.692 us
812.5 Kbps
3.692 us
576.9 us
4.615 ms
GPRS 0.3 GMSK
Modulation
EDGE 8 PSK
EGSM900
880~915
925~960
0~124&
975~1023
45 MHz
270.833 Kbps
3.692 us
812.5 Kbps
3.692 us
576.9 us
4.615 ms
0.3 GMSK
DCS1800
1710~1785
1805~1880
512~885
95 MHz
270.833 Kbps
3.692 us
812.5 Kbps
3.692 us
576.9 us
4.615 ms
0.3 GMSK
PCS1900
1850~1910
1930~1990
512~810
80 MHz
270.833 Kbps
3.692 us
812.5 Kbps
3.692 us
576.9 us
4.615 ms
0.3 GMSK
8 PSK 8 PSK 8 PSK
MS Power
GPRS 33 dBm~5 dBm 33 dBm~5 dBm 30 dBm~0 dBm 30 dBm~0 dBm
EDGE 27~5 dBm 27~5 dBm 26~0 dBm 26~0 dBm
0~15(class1)
Power Level
GPRS 5~19(class4) 5~19(class4)
EDGE 8~19(class E2) 8~19(class E2)
Sensitivity -102 dBm -102 dBm
0~15(class1)
2~15(class E2)
-100 dBm
2~15(class E2)
-102 dBm
TDMA Mux
Cell Radius
8
35 Km
8
35 Km
8
2 Km
8
2 Km
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Specification
3-2. GSM TX power class
8
9
10
11
12
TX
Power control level
5
6
7
16
17
18
13
14
15
19
GSM850
33±2 dBm
31±2 dBm
29±2 dBm
27±2 dBm
25±2 dBm
23±2 dBm
21±2 dBm
19±2 dBm
17±2 dBm
15±2 dBm
13±2 dBm
11±2 dBm
9±2 dBm
7±2 dBm
5±2 dBm
8
9
10
11
12
TX
Power control level
5
6
7
16
17
18
13
14
15
19
EGSM900
33±2 dBm
31±2 dBm
29±2 dBm
27±2 dBm
25±2 dBm
23±2 dBm
21±2 dBm
19±2 dBm
17±2 dBm
15±2 dBm
13±2 dBm
11±2 dBm
9±2 dBm
7±2 dBm
5±2 dBm
DCS1800
30±3 dBm
28±3 dBm
26±3 dBm
24±3 dBm
22±3 dBm
20±3 dBm
18±3 dBm
16±3 dBm
14±3 dBm
12±4 dBm
10±4 dBm
8±4 dBm
6±4 dBm
4±4 dBm
2±5 dBm
0±5 dBm
3
4
5
6
7
TX
Power control level
0
1
2
11
12
13
8
9
10
14
15
PCS1900
30±3 dBm
28±3 dBm
26±3 dBm
24±3 dBm
22±3 dBm
20±3 dBm
18±3 dBm
16±3 dBm
14±3 dBm
12±4 dBm
10±4 dBm
8±4 dBm
6±4 dBm
4±4 dBm
2±5 dBm
0±5 dBm
4
5
6
7
8
TX
Power control level
0
1
2
3
12
13
14
15
9
10
11
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Specification
3-3. EDGE TX Power Level
14
15
16
17
18
19
TX
Power control level
8
9
10
11
12
13
GSM850
27±3 dBm
25±3 dBm
23±3 dBm
21±3 dBm
19±3 dBm
17±3 dBm
15±3 dBm
13±3 dBm
11±5 dBm
9±5 dBm
7±5 dBm
5±5 dBm
14
15
16
17
18
19
10
11
12
13
TX
Power contro l level
8
9
EGSM900
27±3 dBm
25±3 dBm
23±3 dBm
21±3 dBm
19±3 dBm
17±3 dBm
15±3 dBm
13±3 dBm
11±5 dBm
9±5 dBm
7±5 dBm
5±5 dBm
2
9
10
7
8
5
6
3
4
11
12
13
14
15
TX
Power control level
26±3 dBm
24±3dBm
22±3dBm
20±3dBm
18±3dBm
16±3dBm
14±3dBm
12±4dBm
10±4dBm
8±4dBm
6±4dBm
4±4dBm
2±5dBm
0±5dBm
DCS1800
12
13
14
15
10
11
8
9
6
7
4
5
TX
Power control level
2
3
PCS1900
26±3 dBm
24±3 dBm
22±3 dBm
20±3 dBm
18±3 dBm
16±3 dBm
14±3 dBm
12±4 dBm
10±4 dBm
8±4 dBm
6±4 dBm
4±4 dBm
2±5 dBm
0±5 dBm
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4. Product Function
Main Function
- 1.3 Mega Pixel Camera
- Instant Messaging Capability
- Multimedia Capability
- Bluetooth Wireless Technology
- Voice Command Feature
- Speakerphone Capability
- Personal Assistant feature provides alarms, calendar, calculator, timer, stopwatch, record audio, world time, and converter.
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5. Circuit Description
< RF Circuit Description of SGH-D807 >
1. FEM (DUF400)
==> Switching Tx, Rx path for GSM850, EGSM900, DCS1800 and PCS1900 controlled by logic.
Integration of GSM850, EGSM900, DCS1800 and PCS1900 RX SAW Filters.
To convert Electromagnetic Field Wave to Acoustic Wave and the pass the specific frequency band.
- for filtering the frequency band 824 ~ 849 / 869 ~ 894 MHz
- for filtering the frequency band 880 ~ 915 / 925 ~ 960 MHz
- for filtering the frequency band 1710 ~ 1785 / 1805 ~ 1880 MHz
- for filtering the frequency band 1850 ~ 1910 / 1930 ~ 1990 MHz
2. FEM Control Logic
==> Truth Table
GSM850 Rx Mode
EGSM900 Rx Mode
GSM850/EGSM900 Tx Mode
DCS/PCS Rx Mode
DCS/PCS Tx Mode
VC1
L
L
L
L
H
VC2
L
L
H
L
L
VC3
H
L
L
L
L
3. VC-TCXO(TCX400)
==> To generate the 26 MHz reference clock to drive the logic and RF.
After additional process, the reference clock applies to the U401 VCXOB pin to modulate TXIQ and demodulate RXIQ.
4. HD155154NP (U405)
==> The HD155154NP is a RF tranceiver IC for GS850, EGSM900 DCS1800 and PCS1900 QUAD band cellular systems, and incorporates EDGE tranceiver capabillity, and integrates most of the low power silicon functions of a tranceiver.
The HD155154NP incorporates triple RF LNAs, direct conversion mixers which are IQ demodulator, an auto offset calibrated programmable gain amplifier with baseband filter for both IQ chains, RF architecture for the transmitter.
Moreover the HD155154NP includes power mode controller to optimize the power consumption. These functions can operate down to 2.7V and are housed in a
48-pin DPE QFN SMD package.
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Circuit Description
- RX Function
●
Differential Low Noise Amplifiers
● Direct Conversion mixer and IQ demodulator with 90 degree phase splitter.
●
Auto offset calibrated programmable gain amplifier with baseband filter(PGA)
- TX Function
●
I/Q modulator with 90 degree phase splitter
●
Offset PLL
- Phase comparator included fast lock system (Digital phase detector)
● Polar loop
- Lineariser
- Voltage gain amplifier
- Inverse voltage gain amplifier
- Down converter
- AM detector
● PLL Synthesiser
- RF Synthesiser for RX/TX RF local included fast lock system
- 400kHz comparison frequency to achieve faster lock-up time
5. POWER AMP (PAM406)
==> The PF09025B is a high-power, high-efficiency power amplifier module with integrated power control
●
Quad band Polar Loop Amplifier for GSM850 (824 to 849 MHz),
GSM900(880 to 915 MHz), DCS1800(1710 to 1785 MHz) and PCS1900
(1850 to 1910 MHz).
●
For 3.5 V normal operation
●
Built in LDO
● Superb output linearity
●
High gain 3-stage amplifier : +5dBm input typical
●
GPRS / EGPRS Operation Compatible
● Small package : 8.0 X 8.0 mm
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Circuit Description
< Baseband Circuit description of SGH-D807 >
1. CSP2750 (UCD101)
==> The CSP2750 has two major logical components power management and conversion signal processing.
The PSC component is responsible for all power-related functionality, including the following;
●
Power management for RF, BB and ancillary devices within the GSM/GPRS
● Battery-charge management
●
Reset control
●
SIM card voltage-level shifting
The CSP component is responsible for the following ;
●
Intraframe event scheduling
●
Voice band processing, including voice band ADC and DAC
● Analog baseband processing, including baseband ADC and DAC
●
Providing RF interface for Trident digital baseband device
●
Transmitter Power control
● Automatic frequency control
●
A5 ciphering
●
Low-power sleep mode and wake-up control
The CSP2750 has the following major physical components;
●
Timing and control unit
●
RF serial interface
● Low-power sleep mode controller
●
Baseband Transmitter / Receiver
●
Voice input and output
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Circuit Description
2. WM8955L(UCD503)
==> The WM8955L is a low power, high quality stereo DAC with intergrated headphone and loudspwaker amplifiers, designed to reduce external component requirements in portable digital audio application.
The on-chip headsphone amplifiers can deliver 40mW into a 16Ω load. Advanced on-chip digital signal processing performs bass and treble tone comtrol.
The WM8955L can operate as a master or a slave, and include an on-chip PLL. It can use most master clock frequencies commonly found in portable systems, including USB,GSM, CDMA or PDC clocks, or standard 256f s
, clock rates.
Different audio sample rates such as 48khz, 44.1khz, 8khz and many other are supported.
The WM8955L operates on supply voltages from 1.8V up to 3.6V, although the digital core can operates on a separate supply down to 1.42V, saving power.
Different section of the chip can also be powered down under software control.
3. HPE(UCP201)
==> The Trident-HPE digital baseband processor is a complete system IC designed for wireless terminals that includes two digital signal processor(DSP) cores optimized for low-power communications applications and a powerful, highperformance, industry-standard microcontroller core along with a rich set of peripherals.
The Trident-HPE digital baseband processor achieves best-in-class signal processing performance while maintaining the efficient software code density, low power consumption, and small physical size required for GSM/GPRS terminals
ARM946E-S microcontroller core;
●
101 MHz system bus, 16 kbyte instruction and 16kbyte data caches.
● 8 kbyte tightly coupled zero wait-state instruction and 4kbyte tightly coupled zero waitstate data memory
● direct memory access controller for transparent transfer between memory and peripherals.
●
External Memory interface with asynchronous burst mode support
● Synchronous serial port supporting
● Programmable 48-bit general-purpose IO unit, keyboard interface, programmable interval timer and real-time clock.
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Circuit Description
●
SD/MMC controller that supports interfacing to secure digital/multimedia memory card.
Two DSP16000 dual-MAC DSP cores;
● Up to 404 million MACs per second at 101 MHz.
● Memory complement;
- DSP0 : 144K X 16-bit ROM, 40k X 16-bit RAM.
- DSP1 : 96K X 16-bit ROM, 16k X 16-bit RAM.
JTAG boundary scan and integrated H/W developement system Low power;
● Ultralow leakage process technology for best-in-class standby power
● Flexible power management modes to allow for maximum active power management
Interprocessor communication hardware support between ARM, DSP0 and DSP1.
Supported by Trident-HPE digital baseband processor software and hardware developement tools as well as industry standard ARM software and hardware developement tools Two on-chip, programmable, PLL clock synthesizers;
- one for ARM and DSP, the other one for USB.
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6. Test Command & Test Procedure
6-1. Calibration Equipment
- HP 8960
- DC Power Supply
- Test Jig
- Configuration
HP8960
RF
DC POWER SUPPLY
GPIB
+
+ --
TEST JIG
Serial
6-2. Calibration Program
- Samsung internal software
GPIB
Serial
P C
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Test Command & Test Procedure
6-3. Tx Power Tune up Procedure
- GMSK
1) Procedure: a. Calibraion equipment HP8960 and the cell phone are connected through RF cable.
b. Target power ( required power level according to the specification which should be set by calibration program) is set to equipment as power level (ex: GSM 5 level is 32.5 dBm).
c. Activate phone in Tx_Mode_Only.
d. HP8960 equipment measures transmitted power through rf test cable from the phone and reports measured level to calibration program.
e. The program compares measured power with the target power.
f. The calibration program decides power code which is defined in advance in the program and writes the codes to the flash memory in the phone.
2) Target value is defined according to the value of GSM specification.
See the TX power level definition table below.
3) Target values of the peak level of the phone are set normally in conducted mode
- GSM850 5 level : 32.5 dBm
- EGSM900 5 level : 32.5 dBm
- DCS 0 level : 29.5 dBm
- PCS 0 level : 30.2 dBm (Tolerance : -2 dB ~ +1 dB )
4) Accuracy
All the TX level from the phone after tuned-up satisfy the GSM specification
5) TX ramp mask specification applied to the calibration program :
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Test Command & Test Procedure
- 8PSK
1) Procedure: a. Calibraion equipment HP8960 and the cell phone are connected through RF cable.
b. Target power ( required power level according to the specification which should be set by calibration program) is set to equipment as power level (ex: GSM 8 level is 27 dBm).
c. Activate phone in Cont_8psk_Tx_Mode_Only.
d. HP8960 equipment measures transmitted power through rf test cable from the phone and reports measured level to calibration program.
e. The program compares measured power with the target power.
f. The calibration program decides power code which is defined in advance in the program and writes the codes to the flash memory in the phone.
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Test Command & Test Procedure
2) Target value is defined according to the value of EGPRS specification.
See the TX power level definition table below.
3) Target values of the peak level of the phone are set normally in conducted mode
- GSM850 8 level : 27 dBm
- EGSM900 8 level : 27 dBm
- DCS 2 level : 26 dBm
- PCS 2 level : 26 dBm (Tolerance : -2 dB ~ +1 dB )
4) Accuracy
All the TX level from the phone after tuned-up satisfy the EGPRS specification
5) TX ramp mask specification applied to the calibration program :
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7. Array course control
• D807 DATA Cable and JTAG
Software Downloading
7-1. Downloading Binary Files
• A binary file for downloading D807.
- gsmstack.s3
7-2. Pre-requisition for Downloading
• Downloader Program(Optiflash.exe) - Optiflash version 4.16 T1 S01
• D807 Mobile Phone
• Data Cable
• Binary file
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Array course control
7-3. S/W Downloader Program
• Optiflash application
• Path: version(D807ucfb6)\utils\SIBLEY_OPTIFLASH\optiflash.exe
7-4. How to Download
①
Connect the data cable and press '*(star)' key on the keypad simultaneously.
② Run Optiflash application (Optiflash.exe)
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③ File open
• Select an existing load file ( usually, gsmstack.s3 )
Array course control
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Array course control
③ Option
• Click 'Settings' , Display as below.
* Generic
• Specify Hardware Platform: Select a model and platform (USB)
• Misc.Settings : Check the 'Debug Mode' and 'Erase All Unused Regions'
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Array course control
* COM Port
• Select com port
- if you don't know the usb port, please see the control pannel.
(Device Manager – Hardware – Port)
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Array course control
* Flash and Verify
• Click 'Browse' button - file to load and verify
• Check the reserved memory regions
④ All procedures are done, Click 'Flash' Button.
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⑤ Pop up the window as below. Type the "yes" and Click 'OK'
Array course control
⑥ Start Download.
• Display status of downloading progress.
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Array course control
⑦ Display "All is well" and the D807 will reboot automatically.
⑧ After download..
• You do "Full service reset" by pressing key button "*2767*3855#".
•
You can see S/W version by pressing key button "*#9998*1234#".
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8. Exploded View and Parts List
8-1. Cellular phone Exploded View
QMP01
QCR17
QAN02
QRE01
QRF03
QVO01
QBA01
QRF01
QCR06
QFR06
QKP01
QME01
QFR01
QCR32
QAN05
QME06
QMI03
QLC01
QPC01
QCA01
QCA05
QCH05
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QBA00
QFU01
QFL01
QCR05
QSC01
QKP02
QME02
QCR32
Exploded View and Parts List
8-2. Cellular phone Parts list
QCR32
QFL01
QFR01
QFR06
QFU01
QKP01
QKP02
QLC01
QME01
QME02
QME06
QMI03
QMP01
QPC01
QRE01
QRF01
QRF03
QSC01
QVO01
QAN02
QAN05
QBA00
QBA01
QCA01
QCA05
QCH05
QCR04
QCR05
QCR17
QCR32
INTENNA-SGHD807
ASSY MEC-RUBBER INTENNA CONTAC
PMO-BATT COVER V1
INNER BATTERY PACK-800MAH,BLK,
UNIT-CAMERA
ASSY MEC-CAMERA DECO
PMO-MICRO SD COVER
SCREW-MACHINE
SCREW-MACHINE
SCREW-MACHINE
SCREW-MACHINE
SCREW-MACHINE
ASSY MEC-SLIDE LOWER HINGE
ASSY MEC-CASE FRONT
PMO-CASE FRONT U BUSH
ASSY CASE-SLIDE UPPER
ASSY MEC-KEYPAD(CIN/ZK)
ASSY MEC-KEYPAD SUB
MEA-LCD MODULE KIT
UNIT-3X4 KEY FPCB ASSY
UNIT-NAVY KEY FPCB
UNIT-MODULE SPEAKER
ASSY MEC-MIC HOLDER
PBA MAIN-SGHD807
MEA-SLIDE FPCB KIT
ASSY MEC-CASE REAR
PMO-RF COVER 2
PMO-EARJACK COVER
RMO-LOWER SCREW CAP
PMO-VOLUM KEY
GH42-00749A
GH75-09496A
GH72-28679A
GH43-02389A
GH59-02729A
GH75-07777A
GH72-27731A
6001-001479
6001-001478
6001-001460
6001-001700
6001-001700
GH75-08808A
GH75-08730A
GH72-27384A
GH98-01668A
GH75-08727A
GH75-07758A
GH97-05871A
GH59-02878A
GH59-02866A
GH59-03051A
GH75-09497A
GH92-02519A
GH97-05904A
GH75-08731A
GH72-25716A
GH72-24043A
GH73-05237A
GH72-24041A
8-2
SAMSUNG Proprietary-Contents may change without notice
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CBF INTERFACE-SGHE900,DLC,B_TY
ADAPTOR-SGHE900,BLK,PHIL,B_TYP
S/W CD-SGH-D807 PC STUDIO 3.0
UNIT-EARPHONE,SGHE900,BLK,D-TY
LABEL(P)-INTENNA WARNING LABEL
MPR-BOHO VINYL MAIN WIN
MPR-TAPE MAIN CONN COVER
MPR-TAPE MAIN FPCB SHIELD
MPR-TAPE LCD CONN BASE
MPR-TAPE INS COVER MAIN
MPR-TAPE TEST POINT
LABEL(R)-WATER SOAK
AS-WINDOWS SVC
AS-SPK GASKET(T.0.5)
LABEL(R)-WATER SOAK T_MOBILE
MPR-BOHO VINYL FUNCTION
MPR-TAPE LCD CONN COVER
MPR-TAPE KEY FPCB CONN
MPR-TAPE FRONT SCREW
MPR-VINYL BOHO UPPER B
MPR-VINYL BOHO FRONT BUS
MPR-TAPE CONN COVER
MPR-TAPE SPRING ANCHOR
MPR-TAPE MAIN FPCB SHIELD
MPR-GASK TAPE
ASSY MEC-RUBBER KEY FPCB
MPR-TAPE UPPER LCD
MANUAL USERS-ROGERS ENGLISH
MANUAL USERS-ROGERS FRENCH
MANUAL USERS-ROGERS QRC
BAG PE
LABEL(R)-MAIN(RWC)
CUSHION-CASE(CIN)
BOX(P)-UNIT MAIN(CKD-CHINA)
Exploded View and Parts List
GH74-19561A
GH74-19564A
GH74-20758A
GH74-20768A
GH74-21091A
GH74-21709A
GH74-21711A
GH74-22333A
GH74-22658A
GH75-09498A
GH74-27527A
GH68-11340A
GH68-11341A
GH68-11342A
6902-000634
GH68-09538B
GH69-03758A
GH69-03760A
GH39-00654A
GH44-01343A
GH46-00274A
GH59-03537A
GH68-09868A
GH74-15426A
GH74-19552A
GH74-22333A
GH74-19553A
GH74-20753A
GH74-20754A
GH68-09361A
GH81-03625A
GH81-03355A
GH68-05914A
GH74-18027A
8-3
SAMSUNG Proprietary-Contents may change without notice
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9. Disassembly and Assembly instructions
9-1. Disassembly
1 2
Unscrew 4 places of the Rear
3
Open the Ear Cover.
4
Open the lower part of Rear's right side using stick for disassembly.
5
Pull stick for disassembly and opens
Rear's right side Hook
6
Open the Rear's left side Hook.
Push the Rear and unlock top portion
Hook 2 places, disassemble the Rear.
9-1
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Disassembly and Assembly instructions
7 8
Unscrew 2 places of PBA.
9
Down Slide.
10
Remove the PBA carafully.
11
Remove the Key Connector.
12
Control the Slide and makes the FPCB longest.
9-2
Remove a electric conduction Tape and a insulation Tape on the FPCB
Connector using tweezers.
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
13 14
Disassembly and Assembly instructions
Open the cover of the Connector using wide surface of a tweezers.
15
Pull out the Slide FPCB carefully in the Connector.
16
Remove a insulation Tape and a electric conduction Tape that is covering Screw.
17
Unscrew 6 places of Front.
18 disassemble the Front.
9-3
Remove the Screw Cap that is covering the Slide Lower.
SAMSUNG Proprietary-Contents may change without notice
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Disassembly and Assembly instructions
19 20
Unscrew on the Slide Lower
21
Push stick for disassembly with the picture in the Slide's corner.
22
Pull out the Hook of the Lower's top portion and disassemble Slide Lower.
23
Remove the FPCB's fixing Tape.
24
Remove the Connector's fixing Tape.
Open the Connector cover.
9-4
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
25 26
Disassembly and Assembly instructions
Pull out the Slide FPCB.
27
Remove the Connector insulation
Tape.
28
Remove the ESD electric conduction
Tape.
29 disassemble the SPK Module.
30 disassemble the Camera Module.
disassemble the Sub Key PBA.
9-5
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Disassembly and Assembly instructions
31 disassemble the LCD Module.
9-6
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
9-2. Assembly
1 2
Disassembly and Assembly instructions
3
Assemble the LCD and Sub
Keypad to Front.
4
Assemble the Sub Key PBA,
Camera, SPK gradually.
5
After the ESD electric conduction Tape sticking, attach a insulation tape on
Connector.
6
Assemble the LCD's FPCB.
Attach a insulation Tape according to Main FPCB's white surface. Attach a electric conduction Tape according to gilding end line.
Attach as do not pass over the FPCB's gilding part.
9-7
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Disassembly and Assembly instructions
7 8 9
Inserts two places of
Hook's lower part and assembles Slide Lower.
10
Attach Screw Cap in 2 places of the top portion after screw on the Slide
Lower's 6 places.
11 screw on the Front's 6 places .
12
Attach a insulation Tape and a electric conduction
Tape on a screw.
Combine the FPCB with the
PBA.
Sets in white surface of
FPCB on Connector, and set a insulation Tape in gilding surface. Then, a insulation Tape attaches electric conduction Tape .
9-8
SAMSUNG Proprietary-Contents may change without notice
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13 14
Disassembly and Assembly instructions
Connect the 3*4 Key Connector.
15
Combine fix Screw 2 places of the PBA.
16
Assemble the Rear Hook's top portion.
17
Assemble the Set's right side Hook.
18
Assemble the Set's left side Hook.
9-9
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Disassembly and Assembly instructions
9-3. KIT Assembly
Attach LCD on Upper's inside.
State that LCD sticks on inside
Connect Sub Key PBA, Camera, Spk to sequential connector.
Take care so that ESD electric conduction Tape may not reach with surrounding Chip.
After attach ESD electric conduction
Tapes, attach insulation tapes according to base line that is written to LCD.
(All connectors should be covered.)
9-10
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This Document can not be used without Samsung's authorization
14
Disassembly and Assembly instructions
13
Assemble the SLIDE FPCB with the
Connector.
15
Attach a insulation Tape according to the
Main FPCB's white surface.Then, attach a electric conduction Tape depending on end line which do gilding.
16
Must not pass over the FPCB's gilding part.
17
The Lower assembly and the Screw combine. Combine a Screw after assemble the Front.
18
Attach a insulation Tape and a electric conduction Tape on the base line .
Combine the FPCB with the PBA.
9-11
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Disassembly and Assembly instructions
19
Place a insulation Tape according to the
FPCB's white surface on the Connector correctly.
Attach electric conduction Tape on gilding surface.
9-12
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9-4. Window Disassembly
1 2
Disassembly and Assembly instructions
Infix tweezers in middle groove of the
LCD top portion.
3
Put end of tweezers at groove until the
WINDOW goes up little bit.
4
Lift the window, at the same time put tweezers into the window's right side
5
Lift the window, at the same time puts tweezers into the window's left side.
6
Lift the WINDOW between the gab using a finger.
Lift WINDOW with two hands slightly.
9-13
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Disassembly and Assembly instructions
7
Check that the WINDOW's end segment has the step.
There is no step at the opposite, and assembles the Window with the step locating in the LCD top portion.
8
The Wide surface among steps sticks directly with the LCD, and assembles the
WINDOW to under portion direction after set end of the LCD top portion with the
WINDOW.
9
After assemble finally the LCD's under portion, confirm whether the GAB does not happen between the WINDOW and the LCD
9-14
SAMSUNG Proprietary-Contents may change without notice
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10. MAIN Electrical Parts List
SEC CODE
0403-001411
0403-001427
0403-001511
0403-001547
0406-001150
0406-001150
0406-001150
0406-001150
0406-001190
0406-001190
0406-001190
0406-001210
0406-001210
0406-001210
0406-001210
0504-000168
0801-002958
0801-002975
0801-002993
0801-002995
0801-003022
1001-001306
1001-001400
1002-001441
1003-001716
1009-001018
1108-000046
1201-002240
1201-002267
1203-003340
1203-003432
1203-003432
1203-003523
1203-003523
1203-003754
1203-003789
1203-004119
1203-004151
1203-004253
1205-002272
1205-002568
1205-002652
Design LOC
AN400
ANT401
ANT402
BAT100
BTC502
C100
C101
C102
C103
C112
C113
C114
C115
C116
C117
C118
C119
C104
C105
C106
C107
C108
C109
C110
C111
C120
C121
C122
C123
C124
C125
C126
C127
C128
C129
C130
C133
C135
C136
C137
C138
C139
Discription
DIODE-ZENER
DIODE-ZENER
DIODE-ZENER
DIODE-ZENER
DIODE-TVS
DIODE-TVS
DIODE-TVS
DIODE-TVS
DIODE-TVS
DIODE-TVS
DIODE-TVS
DIODE-TVS
DIODE-TVS
DIODE-TVS
DIODE-TVS
TR-DIGITAL
IC-CMOS LOGIC
IC-CMOS LOGIC
IC-CMOS LOGIC
IC-CMOS LOGIC
IC-CMOS LOGIC
IC-ANALOG MULTIPLEX
IC-ANALOG SWITCH
IC-D/A CONVERTER
IC-EL DRIVER
IC-HALL EFFECT S/W
IC-MCP
IC-AUDIO AMP
IC-POWER AMP
IC-POSI.FIXED REG.
IC-POSI.FIXED REG.
IC-POSI.FIXED REG.
IC-POSI.FIXED REG.
IC-POSI.FIXED REG.
IC-POSI.FIXED REG.
IC-POWER SUPERVISOR
IC-POWER SUPERVISOR
IC-BATTERY
IC-DC/DC CONVERTER
IC-TRANSCEIVER
IC-SWITCH
IC-TRANSCEIVER
10-1
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
STATUS
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
Main Electrical Parts List
SEC CODE
1404-001165
1405-001082
1405-001082
1405-001082
1405-001082
1405-001082
1405-001082
2007-000137
2007-000138
2007-000138
2007-000138
2007-000138
2007-000139
2007-000139
2007-000143
2007-000148
2007-000148
2007-000161
2007-000170
2007-000170
2007-000170
2007-000171
2007-000171
2007-000171
2007-000171
2007-000171
2007-000171
2007-000171
2007-000173
2007-000173
2007-000242
2007-000690
2007-000775
2007-000982
2007-001217
2007-001292
2007-001292
2007-002797
2007-002965
2007-002965
2007-007107
2007-007107
Design LOC
C200
C201
C202
C203
C204
C205
C206
C207
C208
C217
C218
C219
C220
C221
C222
C223
C224
C209
C210
C211
C212
C213
C214
C215
C216
C225
C226
C227
C228
C229
C230
C300
C301
C302
C303
C304
C305
C306
C307
C308
C309
C310
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
Discription
THERMISTOR-NTC
VARISTOR
VARISTOR
VARISTOR
VARISTOR
VARISTOR
VARISTOR
R-CHIP
R-CHIP
10-2
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
STATUS
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
Main Electrical Parts List
SEC CODE
2007-007107
2007-007107
2007-007134
2007-007134
2007-007142
2007-007142
2007-007142
2007-007142
2007-007316
2007-007318
2007-007528
2007-007528
2007-007528
2007-007528
2007-007586
2007-007588
2007-008051
2007-008055
2007-008055
2007-008055
2007-008055
2007-008055
2007-008055
2007-008055
2007-008055
2007-008055
2007-008055
2007-008057
2007-008117
2007-008210
2007-008210
2007-008419
2007-008419
2007-008419
2007-008419
2007-008419
2007-008420
2007-008478
2007-008478
2007-008483
2007-008483
2007-008483
Design LOC
C311
C312
C313
C315
C318
C319
C320
C321
C322
C335
C336
C337
C338
C339
C340
C341
C342
C323
C324
C325
C329
C330
C331
C333
C334
C344
C345
C346
C347
C348
C400
C401
C404
C405
C406
C407
C408
C409
C410
C411
C412
C414
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
Discription
10-3
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
STATUS
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
Main Electrical Parts List
SEC CODE
2007-008483
2007-008483
2007-008483
2007-008483
2007-008483
2007-008483
2007-008483
2007-008483
2007-008483
2007-008486
2007-008516
2007-008516
2007-008516
2007-008516
2007-008516
2007-008516
2007-008516
2007-008531
2007-008531
2007-008531
2007-008531
2007-008531
2007-008531
2007-008542
2007-008542
2007-008542
2007-008542
2007-008542
2007-008582
2007-008582
2007-008582
2007-008582
2007-008587
2007-008587
2007-008588
2007-008806
2007-008806
2007-008816
2007-008816
2007-009158
2007-009208
2007-009208
Design LOC
C415
C416
C417
C418
C419
C420
C421
C422
C423
C432
C433
C434
C435
C436
C438
C439
C440
C424
C425
C426
C427
C428
C429
C430
C431
C441
C442
C443
C444
C445
C446
C447
C448
C449
C450
C451
C452
C453
C454
C455
C456
C457
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
R-CHIP
Discription
10-4
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
STATUS
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
Main Electrical Parts List
SEC CODE
2007-009208
2007-009223
2203-000233
2203-000254
2203-000254
2203-000254
2203-000254
2203-000254
2203-000254
2203-000254
2203-000254
2203-000254
2203-000278
2203-000359
2203-000438
2203-000438
2203-000438
2203-000438
2203-000489
2203-000550
2203-000550
2203-000627
2203-000627
2203-000627
2203-000654
2203-000654
2203-000812
2203-000812
2203-000812
2203-000812
2203-000812
2203-000836
2203-000995
2203-000995
2203-001153
2203-001412
2203-001412
2203-001412
2203-002982
2203-005056
2203-005056
2203-005138
Design LOC
C458
C459
C500
C501
C502
C504
C505
C506
C508
C519
C520
C522
C523
C524
C525
C527
C529
C509
C510
C512
C513
C514
C515
C517
C518
C530
C531
C532
C533
C534
C535
C536
C537
C538
C539
C540
C541
C542
C545
C547
C548
C549
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
Discription
R-CHIP
R-CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
10-5
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
SA
SA
SA
SA
SNA
SNA
SNA
SA
SA
SA
SA
SA
SA
SA
SA
SA
STATUS
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SNA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
Main Electrical Parts List
SEC CODE
2203-005138
2203-005344
2203-005344
2203-005344
2203-005395
2203-005395
2203-005446
2203-005446
2203-005514
2203-005514
2203-005514
2203-005514
2203-005682
2203-005682
2203-005682
2203-005682
2203-005682
2203-005682
2203-005682
2203-005682
2203-005682
2203-005682
2203-005682
2203-005682
2203-005682
2203-005682
2203-005682
2203-005682
2203-005682
2203-005682
2203-005682
2203-005682
2203-005682
2203-005682
2203-005682
2203-005682
2203-005682
2203-005682
2203-005682
2203-005682
2203-005682
2203-005682
Design LOC
C550
C551
CD200
CN300
D504
DUF400
F301
F302
F303
F304
HDC301
IFC501
L100
L101
L102
L200
L401
L403
L404
L405
L406
L407
L408
L409
L410
L412
L500
L501
L502
L503
L504
OSC200
OSC301
PAM406
Q100
Q101
R100
R101
R102
R103
R104
R105
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
Discription
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
10-6
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
STATUS
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
Main Electrical Parts List
SEC CODE
2203-005682
2203-005683
2203-005725
2203-005725
2203-005736
2203-006048
2203-006048
2203-006048
2203-006048
2203-006048
2203-006048
2203-006048
2203-006048
2203-006048
2203-006048
2203-006048
2203-006048
2203-006048
2203-006048
2203-006121
2203-006194
2203-006194
2203-006194
2203-006194
2203-006194
2203-006194
2203-006194
2203-006194
2203-006194
2203-006194
2203-006194
2203-006194
2203-006194
2203-006194
2203-006194
2203-006194
2203-006257
2203-006257
2203-006257
2203-006257
2203-006260
2203-006260
Design LOC
R106
R107
R108
R109
R110
R111
R112
R113
R116
R203
R204
R205
R206
R207
R209
R210
R211
R117
R118
R120
R122
R123
R200
R201
R202
R212
R213
R214
R215
R216
R218
R219
R220
R301
R302
R303
R304
R305
R306
R307
R308
R309
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
Discription
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
10-7
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
STATUS
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
Main Electrical Parts List
SEC CODE
2203-006324
2203-006348
2203-006348
2203-006423
2203-006423
2203-006423
2203-006423
2203-006423
2203-006423
2203-006423
2203-006423
2203-006423
2203-006423
2203-006423
2203-006423
2203-006423
2203-006423
2203-006423
2203-006423
2203-006423
2203-006556
2203-006556
2203-006556
2203-006562
2203-006562
2203-006562
2203-006562
2203-006562
2203-006562
2203-006562
2203-006562
2203-006562
2203-006562
2203-006562
2203-006562
2203-006562
2203-006562
2203-006562
2203-006562
2203-006562
2203-006562
2203-006562
Design LOC
R310
R400
R401
R402
R403
R404
R405
R406
R407
R419
R420
R421
R422
R423
R424
R425
R426
R408
R409
R410
R411
R412
R413
R417
R418
R427
R428
R429
R430
R431
R432
R433
R434
R437
R500
R501
R502
R503
R504
R505
R508
R511
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
Discription
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
10-8
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
STATUS
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
Main Electrical Parts List
SEC CODE
2203-006562
2203-006562
2203-006562
2203-006562
2203-006562
2203-006562
2203-006562
2203-006562
2203-006562
2203-006562
2203-006562
2203-006585
2203-006638
2203-006648
2203-006712
2203-006824
2203-006824
2203-006824
2203-006824
2203-006824
2203-006824
2203-006824
2203-006824
2203-006825
2203-006825
2404-001225
2404-001225
2404-001336
2404-001336
2404-001339
2404-001352
2404-001352
2404-001381
2404-001381
2404-001381
2404-001381
2404-001381
2404-001381
2404-001396
2404-001406
2404-001406
2703-001178
Design LOC
R512
R513
R514
R515
R516
R517
R518
R519
R520
R531
R532
R533
R536
R537
R538
R539
R540
R521
R522
R523
R524
R525
R527
R529
R530
R541
R542
R543
R544
R546
R547
RFS400
SIM100
SW301
SW302
TCX400
U100
U102
U103
U107
U108
U202
Discription
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-CER,CHIP
C-TA,CHIP
C-TA,CHIP
C-TA,CHIP
C-TA,CHIP
C-TA,CHIP
C-TA,CHIP
C-TA,CHIP
C-TA,CHIP
C-TA,CHIP
C-TA,CHIP
C-TA,CHIP
C-TA,CHIP
C-TA,CHIP
C-TA,CHIP
C-TA,CHIP
C-TA,CHIP
INDUCTOR-SMD
10-9
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
STATUS
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
Main Electrical Parts List
SEC CODE
2703-001178
2703-001180
2703-001737
2703-002203
2703-002205
2703-002206
2703-002268
2703-002368
2703-002734
2703-002734
2703-002966
2801-004285
2801-004373
2809-001293
2901-001389
2901-001389
2901-001389
2901-001389
2911-000017
3301-001158
3301-001158
3301-001729
3301-001729
3301-001729
3301-001729
3301-001729
3404-001152
3404-001152
3705-001358
3708-002194
3709-001344
3709-001421
3710-002306
3711-005976
3711-006220
4202-001116
4302-001158
4709-001372
GH09-00044A
GH13-00032A
GH71-05646A
GH71-05646A
Design LOC
U203
U204
U205
U206
U300
U301
U303
U304
U400
U401
U402
U403
U404
U405
U500
U501
U502
U504
UCD101
UCD503
UCP201
UME200
V500
V501
V502
V503
V504
V505
ZD101
ZD201
ZD202
ZD203
ZD204
ZD301
ZD302
ZD303
ZD304
ZD305
ZD500
ZD501
ZD502
ZD504
Discription
INDUCTOR-SMD
INDUCTOR-SMD
INDUCTOR-SMD
INDUCTOR-SMD
INDUCTOR-SMD
INDUCTOR-SMD
INDUCTOR-SMD
INDUCTOR-SMD
INDUCTOR-SMD
INDUCTOR-SMD
INDUCTOR-SMD
CRYSTAL-SMD
CRYSTAL-SMD
OSCILLATOR-VCTCXO
FILTER-EMI/ESD
FILTER-EMI/ESD
FILTER-EMI/ESD
FILTER-EMI/ESD
DUPLEXER-FEM
BEAD-SMD
BEAD-SMD
BEAD-SMD
BEAD-SMD
BEAD-SMD
BEAD-SMD
BEAD-SMD
SWITCH-TACT
SWITCH-TACT
CONNECTOR-COAXIAL
CONNECTOR-FPC/FFC/PIC
CONNECTOR-CARD EDGE
CONNECTOR-CARD EDGE
SOCKET-INTERFACE
HEADER-BOARD TO BOARD
HEADER-BATTERY
ANTENNA-CHIP
BATTERY-LI(2ND)
BLUETOOTH MODULE
IC MICOM
IC ASIC
NPR-ANTENNA CONTACT
NPR-ANTENNA CONTACT
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
STATUS
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
SA
10-10
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
11. Flow Chart of Troubleshooting
11-1.Baseband
11-1-1. Power ON
'Power On' does not work
Check the current consumption
Yes
Current consumption
>= 100mA
Yes
Check the Vbat Voltage
No
Download again
No
Voltage >=3.3V
Yes
Check the pin of U101
Charge the Battery
No
①
Check U101 and C115
Pin#J12 >= 2.8V
Yes
Pin#A13 and pin#A14>=2.8V
Yes
③
Check the clock signal at C414
No pin#C12 =
1.8V
Yes
No
②
Check U101, U103
No
④
Check the clock generation circuit
(related to 3pin of TCX400, C407, R404)
Freq = 26MHz
Vrms >=300mV
Vpp≒ 900mV
Yes
Check the initial operation
END
11-1
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting
8
F
A
M
P
R
N
B
C
P
L
N
J
N
M
G
K
F
J
K
B
C
E
B
6
6
6
2
5
4
6
3
5
4
3
4
4
5 D
S
S
C
N
D
D
D
D
D
C
C
U
D
O I _
O I _
D
D
D
S
S
S
S
D
D
S
S
S
S
N
D
D
D
N
D
N
D
C
C
D
T
D
T
D
V
V
V
V
O
O
P
P
H
G
V
V
V
V
V
G
V
G
V
D
D
G
V
_
_
D
D
D
_
_
_
D
D
D
D
V
V
N
N
N
N
D
G
V
1
2
3
2
1
2
R
1
Q
V
L
V
L
B
B
D
4
D
3
2
1
G
G
G
6
5
S
S
S
S
S
S
S
S
N
N
C
C
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
S
S
S
S
S
S
C
S
S
S
N
N
N
N
N
N
A
N
N
N
7
6
5
4
9
8
3
1
3
2
N
N
N
N
N
N
N
N
G
G
G
G
G
G
G
G
G
G
G
G
G
G
_
G
G
G
U X
H
H
H
G
J
J
J
K
J
H
1
2
G
G
F
F
F
D
G
F
8
7
9
9
8
7
9
7
6
8
9
8
7
A
11-2
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
P
N
P
N
T
T
P
N
P
N
T
T
P
N
M
P
N
U
U
A
A
B
B
P
N
U
U
O
N
O
O
K
G
G
C
D I A
I D I A
C I A
E
R I A
E
V
X
X
T
T
N I X
N I X
U
T
T
O
O
U
N I C I M
N I C I M
O
U
C I M
C I M
O
O
U
U
U
O
X
R
R
U
U
A
A
A
A
D
D
D
D
A
A
V
V
V
A
A
P
N
2
1
T
T
T
T
R
R
P I X
N I X
Q
Q
X
X
F
F
E
E
R
R
R
R
R
R
X
X
X
X
A
A
F
X
C
P
A
T
N E
P
_
E
1 N
F
2
U
O
G
W
E
B
W
_
N
K
T
Q
E
_
_ S
_ S
E
_ R
T
B I V
W
O
P
S
E
W
M
P
P
R
W
W
S
P
R
R
D
R
R
4 X
K
Q
U
L
A
C
A
R
N
_
_
T
E
C
C
D
N I D
C
O
T
A
M
R
X
P
R
P
N
D
5
6
3
4
1
9
7
9
L 9
L
M
N
L
K
C
C
6
4
6
4
L
P
R
M
K
L
M
R
R
M
L
R
N
P
N
M
N
P
P
D
E
9
7
C
C
D
D
B
B
7
6
7
6
5
6
1 C
N T U O X U A
P T U O X U A
N N I X U A
P N I X U A
N T U O C I M
P T U O C I M
N N I C I M
P N I C I M
N B T U O A
P B T U O A
N A T U O A
P A T U O A
C P A V
C F A
F U B _ 1 W
N O _ R
N O _ G I J
W
T N I _ P S D
P
S P
K
C M _ M 3 1 K L C
Q A N E O X
K L C
Flow Chart of Troubleshooting
AFC
C408
TCX400
VRF_2_9
R401 13MHZ_BB
C407
R404
R400
R402
R434
C400
C401
C409
CLK13M_TR
CLK13M_MC
CLK13M_WM
CLK26M_RF
VCCD_1_6 VCCD_1_8
VBAT
C136 C138
L101
L100
C133 C139
C135
1
VIN2
2
SW2
3
PGND2
4
VDD
5
SGND
6
PGND1
7
SW1
8
VIN1
U103
FB2
16
EN2
15
EN1
14
NPOR2 13
NPOR1
12
SCL
11
SDA
10
FB1
9
R120
R122
R123
V1_8_EN
11-3
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting
VCLOCK
26M_REF_CLK
C415
C414
L401
C412
1 NC
2
A
3 GND
U403
VCC
6
NC 5
Y
4
R407
1
2
3
8
VCC
U404
_PR CK
7
6
_CLR D
5
Q
GND
_Q
4
C416
13MHZ_BB
11-4
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting
①
②
①
③
④
④
②
11-5
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting
11-1-2. Initial
Initial Failure
Yes
The pin #C12 of U101 =
1.8V and the pin #J12 of U101 =
2.8V ?
Yes
No
①
Check the
U101
(if it has some problem, it is to be replaced.)
Is the pin #K9 of U101
"Low → High" ?
Yes
No
①
Check the
U101
(if it has some problem, it is to be replaced.)
There is 32.768kHz wave forms at the C216 and
C217
No
②
Check the
UCP201
Yes
③
Is the pin #14 & #15 of
U103 "High"?
Yes
No
Check the
U103, R120
No
④
The voltage is "High" at the C110,C115,C116
Yes
LCD display is O.K?
No
Check the
U101
Check the LCD part
Yes
Sound is O.K?
No
Check the Audio part
END
Yes
11-6
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
A(0:25)
CP_WEN
CP_OEN
CHG_DET
FLASH_RESET
ROM1_CS
ROM2_CS
RAM1_CS
RAM2_CS
MV_CS
D(0:15)
D(0)
D(1)
D(2)
D(3)
D(4)
D(5)
D(6)
D(7)
D(8)
D(9)
D(10)
D(11)
D(12)
D(13)
D(14)
D(15)
A(10)
A(11)
A(12)
A(13)
A(14)
A(15)
A(16)
A(17)
A(18)
A(0)
A(1)
A(2)
A(3)
A(4)
A(5)
A(6)
A(7)
A(8)
A(9)
A(20)
A(21)
A(22)
A(23)
A(24)
A(25)
SIMCLK
USB_SUSP
CAM_IC_RESET
USB_OEN
USB_DATA
UP_SCLK
UP_SDI
UP_CS
CHG_EN
BT_EN
T_FLASH_ON
DEBUG_RTS
DEBUG_TXD
DEBUG_RXD
DEBUG_CTS
MAIN_EL_EN
EL_IC_EN
SDS_TXD
SDS_RXD
KEY_COL(0:4)
PSW1_BUF
KEY_ROW(0:5)
E11 A_D6
G12
A_D7
D11 A_D8
E12
A_D9
C12 A_D10
A12
A_D11
F12 A_D12
D12
A_D13
E13 A_D14
D13
A_D15
D14 A_WEN
B14
H14
A_OEN
E14 PIO30_WAITN
FLASHRSTN
A14 A_CS0N
C15
G14
A_CS1N
A_CS2N
J14
A_CS3N
D15 A_CS4N
C16
A_CS5N
F15 A_CS6N
B17
A_CS7N
H16 A_BE0N
A17
A_BE1N
B7 A_A0
C8
D8
A_A1
A_A2
A6 A_A3
C6 A_A4
C5 A_A5
D7 A_A6
E7 A_A7
C4 A_A8
C2 A_A9
A3 A_A10
B3 A_A11
B1 A_A12
D6 A_A13
D5 A_A14
D3 A_A15
E8 A_A16
F8 A_A17
E6
D2
A_A18
A_A19
E4 A_A20
E3 A_A21
F5 A_A22
F4 A_A23
F3 A_A24
F2
PIO35_A_A25_BOOTSEL
A8
E9
A_D0
A_D1
F9 A_D2
G10
A_D3
G11 A_D4
F11 A_D5
KEY_COL(0)
KEY_COL(1)
KEY_COL(2)
KEY_COL(3)
KEY_COL(4)
KEY_ROW(0)
KEY_ROW(1)
KEY_ROW(2)
KEY_ROW(3)
KEY_ROW(4)
KEY_ROW(5)
Flow Chart of Troubleshooting
VCCD_1_6 VCCD_1_8 VRTC_1_5
C200
UCP201
R203
TDO
TDI
TCK
CKO_IACK
IOBIT1_PIO06
IOBIT0_PIO05
SPFS1_PIO15
SPTXD1_I2SD_PIO16
SPRXD1_PIO17
SPCLK1_PIO18
INT0
IO
RWN
D_D15
D_D14
D_D13
D_D12
D_D11
D_D10
D_D9
D_D8
D_D7
D_D6
D_D5
D_D4
D_D3
D_D2
T7
R7
D_D1
D_D0
D_A8
D_A7
D_A6
D_A5
D_A4
D_A3
D_A2
D_A1
D_A0
T6
U6
R6
N6
V4
T5
U4
V3
W3
W2
V1
TEST3 V16
TEST2 T14
TEST1 U15
CPTSTSTOP_CKO
T17
ATDO_PWM2
T13
ATDI_RTS1
L5
ATCK_CTS1
M4
ATMS_PIO45 K12
PIO31_IRQ6
P12
PIO00_IRQ5 P16
P8
R9
T9
T8
N10
N9
N8
P9
U8
V8
R8
T12
V14
U14
N12
N11
V12
N15
N16
M17
M18
T15
W6
V6
P11
IRQ4
IRQ3
IRQ2
IRQ1
PIO47
PIO34
PIO33
P18
P17
M19
M16
J16
R14
U18
R220
CLK13M_TR
TR_RST
DSP_TMS
DSP_TDO
DSP_TDI
DSP_TCK
PCM_SYNC
PCM_CLK
DSP_IO
DSP_RWN
DSP_DB(14)
DSP_DB(13)
DSP_DB(12)
DSP_DB(11)
DSP_DB(10)
DSP_DB(9)
DSP_DB(8)
DSP_DB(7)
DSP_DB(6)
DSP_DB(5)
DSP_DB(4)
DSP_DB(3)
DSP_DB(2)
DSP_DB(1)
DSP_DB(0)
DSP_AB(8)
DSP_AB(7)
DSP_AB(6)
DSP_AB(5)
DSP_AB(4)
DSP_AB(3)
DSP_AB(2)
DSP_AB(1)
DSP_AB(0)
CP_TDO
CP_TDI
CP_TCK
CP_TMS
WM_SDIN
WM_CS
MV_INT
FLIP_SNS
JACK_INT
INTRQ
WM_SCLK
4J 8J
DSP_DB(0:15)
DSP_AB(0:8)
AS4
EAR_SWITCH
AS2
CODEC_PDN
BL_CONT
PWR_KEEP
CLK32K
RTCALARM
C219
OSC200
1 2
C220
MCI_DAT0_EN
MCI_DAT_EN
MCI_CMD_EN
MCI_DAT0
MCI_CMD
MCI_CLK
11-7
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Flow Chart of Troubleshooting
①
④
②
③
11-8
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Flow Chart of Troubleshooting
11-1-3. Sim Part
"Insert SIM is displayed on the LCD
Yes
Check the SIM connector's (SIM100) connection to SIM card
Yes
Check the voltage at pin#1 of SIM100 >=
2.8V ?
Yes
Is there any signals pin#2,#3,#4 of ?
Yes
Check the SIM Card
No
①
Resolder or change
SIM100
No
②
Check the
U101
No
③
Check the
UCP201
END
①
11-9
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Flow Chart of Troubleshooting
11-1-4. Microphone Part
Microphone does not work
Yes
Is the assembled status of microphone O.K?
Yes
Check the reference voltage on mic path
Yes
C111 ≒ 2.8V ?
Yes
Is microphone ok?
END
Yes
No
Reassembled the microphone
No
No
①
Resolder or change
R500,R501,R502,R505,R514,R517,
C502,C505
②
Check
U101
11-10
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Flow Chart of Troubleshooting
AUXOUTP
AUXINP
AUXINN
AUXOUTN
R516
R518
C514
R524
R523
C519
MICOUTP
MICINP
MICINN
MICOUTN
C516
R500
R501
C502
R505
R502
C505
C503
R504
C508 C509
VCCA_2_8
EAR_MIC_P
EAR_MIC_N
R514
R519
R521
C515
R517
R520
C518
MAIN_MIC_P
MAIN_MIC_N
①
11-11
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Flow Chart of Troubleshooting
11-1-5. Speaker Part_1(MP3, SPEAKER PHONE)
There is no sound from the Speaker
No
②
Check
UCD503
Is the terminal of Speaker
O.K ?
Yes
Are there any signals at the L500, L501
No
No
①
Yes
MP3
Is there any signals at the pin#12 and pin#13 of UCD503 ?
Yes
The pin #5, #7 of U500 is
"High"
Yes
No
What is the type of sound from the
Speaker
No
Replace the Speaker
Check
U501
SPEAKER PHONE
Is there any signals at C506, C512 ?
Yes
The pin #5,
#7 of U500 is
"High"
Yes
④
Check
UCP201
No
③
Check
U101
END
11-12
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Flow Chart of Troubleshooting
VBAT
C500
AMP_IN_P
AMP_IN_N
C506
C512
R503
R512
AMP_EN
R546 R547
R513
18 NC
19 NC
1
VREF
2
VIM
3
VIP
4
EN
17 16 15 14
U501
13
VOM
12
VSS 11
VSS 10
VOP
9
5 6 7 8
C513
VBAT
C517
VBAT
R515
L500
L501
C504
C510
AMP_OUT_N
AMP_OUT_P
L504
AOUTAP
SPK_P
AMP_OUT_N
R511
C551
C501
1
VCC
2 NO1
3
COM1
U500
NO2
10
COM2 9
NC2
8
IN2
7 4 NC1
5 IN1
GND
11
GND 6
C550
AS2
R508
R522
AOUTAN
SPK_N
AMP_OUT_P
11-13
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Flow Chart of Troubleshooting
VCCD_1_8
R525
R527
C520
C522
AOUTAN
AOUTAP
WM_CS
WM_SDIN
WM_SCLK
CLK13M_WM
R543
R544
C533 C534
PCM_CLK
PCM_TXD
PCM_SYNC
R532
C537
R531
R533
35 34 33
32 31
36
37
38
GND
NC5
NC4
1 MCLK
2
DCVDD
3
DBVDD
4
DGND
5
BCLK
6 DACDAT
7
DACLRC
8 CLKOUT
9 10
30 29
11 12
28 27 26 25
UCD503
24
NC3
23
HPDETECT
22
NC2
21
VMID
VREF
20
19
AGND
18
AVDD
HPVDD
17
13 14 15 16
C529
C532
C530
C531
C536
VDAC_3_1
AMP_IN_N
AMP_IN_P
MP3_L
MP3_R
11-14
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Flow Chart of Troubleshooting
①
②
③
④
11-15
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Flow Chart of Troubleshooting
11-1-6. Speaker Part_2(RECEIVER)
There is no sound from the Speaker
No
Is the terminal of Speaker
O.K ?
Yes
Are there any signals at the PIN#3, #9 of U500
Yes
The pin #5, #7 of U500 is "Low"
Yes
④
Are there any signals at the PIN#2, #10 of U500
Yes
Check
UCP201
END
No
①
No
②
No
③
Replace the Speaker
Check
U500
Check
UCP201
Check
U101
11-16
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①
Flow Chart of Troubleshooting
11-17
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Flow Chart of Troubleshooting
11-1-7. Charging Part
Abnormal charging part
The pin #1 of
U108 is
VEXT 뵃 5V?
Yes
The pin #6 of
U108 is
"LOW"?
Yes
Charging Current is 350mA~650mA?
Yes
Check The Battery
END
No
Check
IF501
①
No
Check
UCP201
②
No
Check
U108
③
11-18
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Flow Chart of Troubleshooting
③
①
11-19
SAMSUNG Proprietary-Contents may change without notice
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Flow Chart of Troubleshooting
EAR_MIC_P
EAR_MIC_N
EAR_R
EAR_GND
EAR_L
EAR_SWITCH
JACK_INT
TTY_DETECT
SDS_TXD
SDS_RXD
JIG_ON_IF
USB_DPLS
USB_DMNS
V501 V502 V503 V504
R538
R539
R541
VCCD_1_8
R536 R537
V500
C541
V505
VBAT USB_5V VEXT_5V
C547
C542
C540
1
2
3
4
1
2
3
IFC501
8
6
8
9
9
10
10
11
11
12
12
13
13
14
14
15 15
16
16
17 17
18
18
19 19
20
20
21 NC
22
NC
23 NC
24 NC
NC 25
NC
26
NC
27
NC 28
VEXT_5V
VBAT
C137
ICHRG
C124
C123
R110
1 IN
2
VL
3 GND
4
ISET
U108
BATT
8
ACOK 7
EN 6
CHG
5
9
C122
R109
CHG_EN
11-20
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Flow Chart of Troubleshooting
11-2. RF
11-2-1. GSM850/EGSM RX
⑧
NORMAL CONDITION catch the channel?
Yes
DUF400 Check
Pin1 ≥ -65dBm ?
Yes
DUF400 Check
Pin10, 11 ≥ -65dBm ?
Yes
U405 Check
Pin6, 7 ≥ -65dBm ?
Yes
U405 Check
Pin1, 31, 48 : 2.9V ?
Yes
U405 Check
Pin35 : 26Mhz?
Vp-p : 950mV?
Yes
U405 Check
Pin25, 26, 27, 28
Vp-p : 120mV?
Yes
U101
CHECK!!
No
①
CHECK
ANT401
,
R405
contact?
No
②
C421
,
RFS400
resolder or change
No
③
DUF400
resolder or change
No
④
C431
,
C436
,
L406
resolder or change
No
⑤
U101
pin
A13
,
B10
,
C112
,
C114
resolder or change
No
⑥
TCX400
resolder or change
No
⑦
U405
resolder or change
11-21
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This Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting
①
②
①
③
②
⑤ ⑧
⑦
⑥
11-22
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This Document can not be used without Samsung's authorization
④
Flow Chart of Troubleshooting
11-2-2. DCS RX
⑧
NORMAL CONDITION catch the channel?
Yes
DUF400 Check
Pin1 ≥ -65dBm ?
Yes
DUF400 Check
Pin12, 13 ≥ -65dBm ?
Yes
U405 Check
Pin4, 5 ≥ -65dBm ?
Yes
U405
Pin1, 31, 48 : 2.9V ?
Yes
U405 Check
Pin35 : 26Mhz?
Vp-p : 950mV?
Yes
U405 Check
Pin25, 26, 27, 28
Vp-p : 120mV?
Yes
U101
CHECK!!
No
①
CHECK
ANT401
,
R405
contact?
No
②
C421
,
RFS400
resolder or change
No
③
DUF400
resolder or change
No
④
C429
,
C430
,
L405
resolder or change
No
⑤
U101
pin
A13
,
B10
,
C113
,
C115
resolder or change
No
⑥
TCX400
resolder or change
No
⑦
U405
resolder or change
11-23
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This Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting
⑧ ⑤
⑥
⑦
④
11-24
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This Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting
11-2-3. PCS RX
⑧
NORMAL CONDITION catch the channel?
Yes
DUF400 Check
Pin1 ≥ -65dBm ?
Yes
DUF400 Check
Pin14, 15 ≥ -65dBm ?
Yes
U405 Check
Pin2, 3 ≥ -65dBm ?
Yes
U405
Pin1, 31, 48 : 2.9V ?
Yes
U405 Check
Pin35 : 26Mhz?
Vp-p : 950mV?
Yes
U405 Check
Pin25, 26, 27, 28
Vp-p : 120mV?
Yes
U101
CHECK!!
No
①
CHECK
ANT401
,
R405
contact?
No
②
C421
,
RFS400
resolder or change
No
③
DUF400
resolder or change
No
④
C427
,
C428
,
L404
resolder or change
No
⑤
U101
pin
A13
,
B10
,
C113
,
C115
resolder or change
No
⑥
TCX400
resolder or change
No
⑦
U405
resolder or change
11-25
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Flow Chart of Troubleshooting
11-2-4. GSM850/EGSM TX
PAM406 pin 13 : about 32dBm?
②
Yes
C421
,
RFS400
R405
,
ANT401
check & change
No
No
No
PAM406 pin16, 17: 3.7V?
Yes
PAM406 pin 6 : 2.9V ?
Yes
PAM406 pin7 about 5dBm ?
Yes
PAM406 pin 2,3 : 3V ?
⑤
Yes
PAM406
check & change
DUF400 pin 8 : 2.6V ?
Yes
PAM406 pin13: about 32dBm?
③
Yes
DUF400
check & change
No
BATTERY check & change
No
①
U101
check & change
No
④
U405 pin21
check
①
No
U101
check
①
U101
check or resolder
No
⑦
U101
pin
A13
,
B10
,
C112
,
C114
check or resolder
No
U405 pin16,41,31,29
: 2.9V ?
Yes
U405 pin35 : 26MHz ?
Vp-p : 950mV ?
Yes
No
⑥
TCX400
check or resolder
U405 pin25,26,27,28
Vp-p=1V ?
⑧
Yes
U405
check or resolder
11-26
SAMSUNG Proprietary-Contents may change without notice
This Document can not be used without Samsung's authorization
⑥
④
⑧
⑤
Flow Chart of Troubleshooting
11-27
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This Document can not be used without Samsung's authorization
Flow Chart of Troubleshooting
11-2-5. DCS/PCS TX
U404 pin 13 : about 30dBm?
②
Yes
C421
,
RFS400
R405
,
ANT401
check & change
No
No
No
PAM406 pin16, 17: 3.7V?
Yes
PAM406 pin 6 : 2.9V ?
Yes
PAM406 pin1 about 5dBm ?
Yes
DUF400 pin 3 : 2.6V ?
Yes
PAM406 pin19: about 30dBm?
③
Yes
DUF400
check & change
No
BATTERY check & change
No
①
U101
check & change
No
④
U405 pin21
check
No
⑤
Yes
PAM406
check & change
①
U101
check
①
U101
check or resolder
No
⑦
U101
pin
A13
,
B10
,
C112
,
C114
check or resolder
No
U405 pin16,41,31,29
: 2.9V ?
Yes
U405 pin35 : 26MHz ?
Vp-p : 950mV ?
Yes
No
⑥
TCX400
check or resolder
U405 pin25,26,27,28
Vp-p=1V ?
Yes
⑧
U405
check or resolder
11-28
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Flow Chart of Troubleshooting
C V
4
C
N
1
O C V
T
D
2
N G
3
O U
N D G
G49
G50
M C C V
A C
B I P A C
Q P A C
4 B
Q P A C
O L F R C C V
O C V F R C C V
N Y S F R C C V
N Y S F R P C
K C O L F
38 E
L
2 T U O O X C V
C 4
P F
C
4
4
B G O C V X T
G O C V X T
N O X T
2 X T C C V
W M B P
T O E D M P
T N O C M _ A
O T E M D A
C A D P M A R
O C V X T C C V
G T U O X T
D T U O X T
9 0 4 L
8 0 4 L
C N
C
C
C
N
G
G
G
N
N
G
G
G
G
G
5
4
4
3
2
1
2
2
2
2
2
8 1
1 4
9
1
0
8
1
1
5 C
11-29
SAMSUNG Proprietary-Contents may change without notice
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12. PCB Diagrams
ANT_J
G1
ZD502
ANT401
ANT402
DUF400
U102
V502
V501
U502
TP201
TP301
TP302
TP303
U501
UCD503
U401
ZD302
G3
BTC502
D504
U107
12-1
SIM100
TP_GND
WEN
RST
TDI
TCK
TDOTMS
G2
PCB Diagrams
SOC302
U108
V500
ZD500
U404
PAM406
U101
TCX400
ZD203
ZD202
ZD204
U204
U206
UME200
CN300
OSC200
F302 F303 F301 F304
OSC301
HDC301
U103
U303
12-2
13. Block Diagrams
13
-1. RF Solution Block Diagram
13-1
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Block Diagrams
13-2. Base Band Solution Block Diagram
13-2
SAMSUNG Proprietary-Contents may change without notice
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14. Reference data
14-1. Reference Abbreviate
AAC: Advanced Audio Coding.
AVC : Advanced Video Coding.
BER : Bit Error Rate
BPSK: Binary Phase Shift Keying
CA : Conditional Access
CDM : Code Division Multiplexing
C/I : Carrier to Interference
DMB : Digital Multimedia Broadcasting
EN : European Standard
ES : Elementary Stream
ETSI: European Telecommunications Standards Institute
MPEG: Moving Picture Experts Group
PN : Pseudo-random Noise
PS : Pilot Symbol
QPSK: Quadrature Phase Shift Keying
RS : Reed-Solomon
SI : Service Information
TDM : Time Division Multiplexing
TS : Transport Stream
14-1
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Table of contents
- 16 1-1. Repair Precaution
- 16 1-2. ESD(Electrostatically Sensitive Devices) Precaution
- 18 3-1. GSM General Specification
- 18 3-2. GSM TX power class
- 18 3-3. EDGE TX Power Level
- 21 6-1. Calibration Equipment
- 21 6-2. Calibration Program
- 21 6-3. Tx Power Tune up Procedure
- 22 7-1. Downloading Binary Files
- 22 7-2. Pre-requisition for Downloading
- 22 7-3. S/W Downloader Program
- 22 7-4. How to Download
- 23 8-1. Cellular phone Exploded View
- 23 8-2. Cellular phone Parts list
- 24 9-1. Disassembly
- 24 9-2. Assembly
- 24 9-3. KIT Assembly
- 24 9-4. Window Disassembly
- 83 11-1-1. Power ON
- 83 11-1-2. Initial
- 83 11-1-3. Sim Part
- 83 11-1-4. Microphone Part
- 83 11-1-5. Speaker Part_1(MP3, SPEAKER PHONE)
- 83 11-1-6. Speaker Part_2(RECEIVER)
- 83 11-1-7. Charging Part
- 83 11-2-1. GSM850/EGSM RX
- 83 11-2-2. DCS RX
- 83 11-2-3. PCS RX
- 83 11-2-4. GSM850/EGSM TX
- 83 11-2-5. DCS/PCS TX