Small Form Factor MT-RJ Fiber Optic Transceivers for Gigabit Ethernet Technical Data

Small Form Factor MT-RJ
Fiber Optic Transceivers
for Gigabit Ethernet
Technical Data
Features
• Compliant with
Specifications for
IEEE 802.3z/ Gigabit
Ethernet
• Multisourced 2 x 5 Package
Style with Integral MT-RJ
Connector
• Performance
HFBR-5912E (1000 Base-SX)
– 220 m Links in 62.5/125
µm MMF 160 MHz*km
Cables
– 275 m Links in 62.5/125
µm MMF 200 MHz*km
Cables
– 500 m Links in 50/125 µm
MMF 400 MHz*km Cables
– 550 m Links in 50/125 µm
MMF 500 MHz*km Cables
HFCT-5912E (1000 Base-LX)
– 550 m Links in 62.5/125
µm MMF Cables
– 10 km Links in 8/125 µm
SMF Cables
• IEC 60825-1 Class 1/CDRH
Class 1 Laser Eye Safe
• Single +3.3 V Power Supply
Operation with PECL Logic
I/O Interfaces, TTL Signal
Detect and Transmit Disable
• Wave Solder and Aqueous
Wash Process Compatible
Applications
• Switch to Switch Interface
• Switched Backbone
Applications
HFBR-5912E,
850 nm VCSEL
HFCT-5912E,
1300 nm FP Laser
• High Speed Interface for
File Servers
• High Performance Desktops
Related Products
• Physical Layer ICs Available
for Optical or Copper
Interface (HDMP-1636A/
1646A)
• Quad SERDES IC Available
for High Density Interfaces
(HDMP-1680)
• 1x9 Fiber Optic Transceivers
for Gigabit Ethernet
(HFBR/HFCT-53D5)
• Gigabit Interface Converters
(GBIC) for Gigabit Ethernet
SX – HFBR-5601
LX – HFCT-5611
Description
The HFBR/HFCT-5912E
transceiver from Agilent allows
the system designer to implement
a range of solutions for multimode
and single mode Gigabit Ethernet
applications.
The transceivers are configured
in the new multisourced industry
standard 2 x 5 dual-in-line package
with an integral MT-RJ fiber
connector.
Transmitter Section
The transmitter section of the
HFBR-5912E consists of an
850 nm Vertical Cavity Surface
Emitting Laser (VCSEL) in an
optical subassembly (OSA),
which mates to the fiber cable.
The HFCT-5912E incorporates a
1300 nm Fabry-Perot (FP) Laser
designed to meet the Gigabit
Ethernet LX specification. The
OSA is driven by a custom silicon
bipolar IC which accepts
differential PECL logic signals
(ECL referenced to a +3.3 V
supply) and provides bias and
modulation control for the laser.
Receiver Section
The receiver of the HFBR-5912E
includes a GaAs PIN photodiode
mounted together with a custom,
silicon bipolar transimpedance
preamplifier IC in an OSA. This
OSA is mated to a custom silicon
bipolar circuit that provides postamplification and quantization.
The HFCT-5912E utilizes an InP
PIN photodiode in a similar
configuration.
The post-amplifier also includes
a Signal Detect circuit which
provides a TTL logic-high output
upon detection of an optical signal.
2
APPLICATION SUPPORT
Package and Handling
Instructions
Flammability
The HFBR/HFCT-5912E
transceiver housing consists of
high strength, heat resistant,
chemically resistant, and UL 94 V-0
flame retardant plastic and metal
packaging.
Recommended Solder and
Wash Process
The HFBR/HFCT-5912E is
compatible with industrystandard wave or hand solder
processes.
Process plug
This transceiver is supplied with
a process plug for protection of
the optical port within the MT-RJ
connector receptacle. This
process plug prevents
contamination during wave
solder and aqueous rinse as well
as during handling, shipping and
storage. It is made of a hightemperature, molded sealing
material that can withstand
+80°C and a rinse pressure of
110 lbs per square inch. Due to
the differences in the multimode
and single mode connector
construction, the HFBR-5912E
and HFCT-5912E process plugs
are different and not
interchangeable. The multimode
port plug is black and the single
mode variant is a blue color.
Recommended Solder fluxes
Solder fluxes used with the
HFBR/HFCT-5912E should be
water-soluble, organic fluxes.
Recommended solder fluxes
include Lonco 3355-11 from
London Chemical West, Inc. of
Burbank, CA, and 100 Flux from
Alpha-Metals of Jersey City, NJ.
Recommended Cleaning/
Degreasing Chemicals
Alcohols: methyl, isopropyl,
isobutyl.
Aliphatics: hexane, heptane
Other: naphtha.
Do not use partially halogenated
hydrocarbons such as 1,1.1
trichloroethane, ketones such as
MEK, acetone, chloroform, ethyl
acetate, methylene dichloride,
phenol, methylene chloride, or
N-methylpyrolldone. Also,
Agilent does not recommend the
use of cleaners that use
halogenated hydrocarbons
because of their potential
environmental harm.
Regulatory Compliance
(See the Regulatory Compliance
Table for transceiver performance)
The overall equipment design will
determine the certification level.
The transceiver performance is
offered as a figure of merit to
assist the designer in considering
their use in equipment designs.
Electrostatic Discharge (ESD)
There are two design cases in
which immunity to ESD damage
is important.
The first case is during handling
of the transceiver prior to
mounting it on the circuit board.
It is important to use normal ESD
handling precautions for ESD
sensitive devices. These precautions include using grounded
wrist straps, work benches, and
floor mats in ESD controlled
areas. The transceiver performance has been shown to provide
adequate performance in typical
industry production environments.
The second case to consider is
static discharges to the exterior of
the equipment chassis containing
the transceiver parts. To the
extent that the MT-RJ connector
receptacle is exposed to the
outside of the equipment chassis
it may be subject to whatever
system-level ESD test criteria that
the equipment is intended to meet.
The transceiver performance is
more robust than typical industry
equipment requirements of today.
Electromagnetic Interference
(EMI)
Most equipment designs utilizing
these high-speed transceivers
from Agilent will be required to
meet the requirements of FCC in
the United States, CENELEC
EN55022 (CISPR 22) in Europe
and VCCI in Japan. Refer to EMI
section (page 5) for more details.
Immunity
Equipment utilizing these
transceivers will be subject to
radio-frequency electromagnetic
fields in some environments.
These transceivers have good
immunity to such fields due to
their shielded design.
Eye Safety
These laser-based transceivers
are classified as AEL Class I
(U.S. 21 CFR(J) and AEL Class 1
per EN 60825-1 (+A11). They are
eye safe when used within the
data sheet limits per CDRH. They
are also eye safe under normal
operating conditions and under
all reasonably foreseeable single
fault conditions per EN60825-1.
Agilent has tested the transceiver
design for compliance with the
requirements listed below under
normal operating conditions and
under single fault conditions
where applicable. TUV Rheinland
has granted certification to these
transceivers for laser eye safety
and use in EN 60950 and
EN 60825-2 applications. Their
performance enables the
transceivers to be used without
concern for eye safety up to 5.0 V
transmitter VCC.
3
CAUTION:
There are no user serviceable parts
nor any maintenance required for
the HFBR/HFCT-5912E. All
adjustments are made at the
factory before shipment to our
customers. Tampering with or
modifying the performance of the
HFBR/HFCT-5912E will result in
voided product warranty. It may
also result in improper operation
of the HFBR/HFCT-5912E
circuitry, and possible overstress
of the laser source. Device
degradation or product failure
may result.
Connection of the HFBR/HFCT5912E to a non-approved optical
source, operating above the
recommended absolute maximum
conditions or operating the
HFBR/HFCT-5912E in a manner
inconsistent with its design and
function may result in hazardous
radiation exposure and may be
considered an act of modifying or
manufacturing a laser product.
The person(s) performing such
an act is required by law to
recertify and reidentify the laser
product under the provisions of
U.S. 21 CFR (Subchapter J).
Optical Power Budget
and Link Penalties
The worst-case Optical Power
Budget (OPB) in dB for a fiberoptic link is determined by the
difference between the minimum
transmitter output optical power
(dBm avg) and the minimum
receiver sensitivity (dBm avg).
This OPB provides the necessary
optical signal range to establish a
working fiber-optic link. The
OPB is allocated for the fiberoptic cable length and the corresponding link penalties. For
proper link performance, all
penalties that affect the link
performance must be accounted
for within the link optical power
budget. The Gigabit Ethernet
IEEE 802.3z standard identifies,
and has modeled, the
contributions of these OPB
penalties to establish the link
length requirements for 9/125 µm
single mode and 50/125 µm and
62.5/125 µm multimode fiber
usage. Refer to the IEEE 802.3z
standard and its supplemental
documents that develop the
model, empirical results and final
specifications.
Regulatory Compliance
Feature
Electrostatic Discharge
(ESD) to the
Electrical Pins
Electrostatic Discharge
(ESD) to the MT-RJ
Receptacle
Electromagnetic
Interference (EMI)
Test Method
MIL-STD-883C
Method 3015.4
Variation of IEC 801-2
Immunity
FCC Class B
CENELEC EN55022 Class B
(CISPR 22A)
VCCI Class I
Variation of IEC 801-3
Laser Eye Safety
and Equipment Type
Testing
US 21 CFR, Subchapter J
per Paragraphs 1002.10
and 1002.12
EN 60825-1: 1994 +A11
EN 60825-2: 1994
EN 60950: 1992+A1+A2+A3
Component
Recognition
Underwriters Laboratories and
Canadian Standards Association
Joint Component Recognition
for Information Technology
Equipment Including Electrical
Business Equipment.
Performance
Class 1 (>1500 V).
Typically withstand at least 15 kV without damage
when the MT-RJ connector receptacle is contacted
by a Human Body Model probe.
Margins are dependent on customer board and
chassis designs.
Typically show no measurable effect from a
10 V/m field swept from 27 to 1000 MHz applied to
the transceiver without a chassis enclosure.
AEL Class I, FDA/CDRH
HFBR-5912E Accession # 9720151-09
HFCT-5912E Accession # 9521220-20
AEL Class 1, TUV Rheinland of North America
HFBR-5912E: Certificate # E9971083.01
HFCT-5912E: Certificate # 933/510817/05
Protection Class III
UL File # E173874
4
10 km Link Support
As well as complying with the LX
5 km standard, the HFCT-5912E
specification provides additional
margin allowing for a 10 km
Gigabit Ethernet link on single
mode fiber. This is accomplished
by limiting the spectral width and
center wavelength range of the
transmitter while increasing the
output optical power and
improving sensitivity. All other
LX cable plant recommendations
should be followed.
As for the receiver section, it is
internally ac-coupled between
the preamplifier and the postamplifier stages. The actual Data
and Data-bar outputs of the postamplifier are dc-coupled to their
respective output pins (pins 4, 5).
Signal Detect is a single-ended,
+3.3 V TTL output signal that is
dc-coupled to pin 3 of the
module. Signal Detect should not
be ac-coupled externally to the
follow-on circuits because of its
infrequent state changes.
Data Line
Interconnections
Caution should be taken to
account for the proper interconnection between the supporting
Physical Layer integrated circuits
and this HFBR/HFCT-5912E
transceiver. Figure 3 illustrates a
recommended interface circuit
for interconnecting to a +3.3 V dc
PECL fiber-optic transceiver.
Agilent’s HFBR/HFCT-5912E
fiber-optic transceiver is designed
to couple to +3.3 V PECL signals.
In order to reduce the number of
passive components required on
the customer’s board, Agilent has
included the functionality of the
external transmitter bias resistors
and coupling capacitors within
the fiber optic module. The
transceiver is compatible with a
“dc-coupled” configuration and
Figure 3 depicts the circuit
options. Additionally, there is an
internal, 50 Ohm termination
resistance within the transmitter
input section. The transmitter
driver circuit regulates the output
optical power. The regulated light
output will maintain a constant
output optical power provided
the data pattern is reasonably
balanced in duty factor. If the
data duty factor has long,
continuous state times (low or
high data duty factor), then the
output optical power will
gradually change its average
output optical power level to its
preset value.
Per the multisource agreement,
the HFBR/HFCT-5912E feature a
transmit disable function which is
a single-ended +3.3 V TTL input
signal dc-coupled to pin 8.
Electrical and
Mechanical Interface
Recommended Circuit
Figure 3 shows the recommended
interface for deploying the Agilent
transceiver in a +3.3 V system.
Also present are power supply
filtering arrangements which
comply with the recommendations
of the small form factor
multisource agreement. This
configuration ensures noise
rejection compatibility between
transceivers from various vendors.
Power Supply Filtering and
Ground Planes
It is important to exercise care in
circuit board layout to achieve
optimum performance from these
transceivers. Figure 3 shows the
recommended power supply filter
circuit for the SFF transceiver. It
is further recommended that a
contiguous ground plane be
provided in the circuit board
directly under the transceiver to
provide a low inductance ground
for signal return current. This
recommendation is in keeping
with good high frequency board
layout practices.
The HFBR/HFCT-5912E is
designed to cope with the
electrically noisy environment
inside the chassis box of Gigabit
data communication systems. To
minimize the impact of
conducted and radiated noise
upon receiver performance the
metal cover at the rear of the
HFBR/HFCT-5912E should be
connected to the host system’s
circuit common ground plane.
To maximize the shielding
effectiveness and minimize the
radiated emissions that escape
from the host system’s chassis
box the metal shield that covers
the MT-RJ receptacle should
make electrical contact with the
aperture required for the optical
connector. The metal cover at
the rear of the fiber-optic module
is dielectrically isolated from the
metal shield that covers the
MT-RJ receptacle to avoid
conflicts between circuit and
chassis common.
Package footprint and front
panel considerations
The Agilent transceiver complies
with the circuit board “Common
Transceiver Footprint” hole
pattern defined in the original
multisource announcement
which defined the 2 x 5 package
style. This drawing is reproduced
in Figure 5 with the addition of
ANSI Y14.5M compliant
dimensioning to be used as a
guide in the mechanical layout of
your circuit board. Figure 6
shows the front panel dimensions
associated with such a layout.
5
Eye Safety Circuit
For an optical transmitter device
to be eye-safe in the event of a
single fault failure, the transmitter must either maintain eye-safe
operation or be disabled.
In the HFBR-5912E there are
three key elements to the laser
driver safety circuitry: a monitor
diode, a window detector circuit,
and direct control of the laser
bias. The window detection
circuit monitors the average
optical power using the monitor
diode. If a fault occurs such that
the transmitter dc regulation
circuit cannot maintain the
preset bias conditions for the
laser emitter within ± 20%, the
transmitter will automatically be
disabled. Once this has occurred,
an electrical power reset or
toggling the transmit disable will
allow an attempted turn-on of the
transmitter. If fault remains the
transmitter will stay disabled.
The HFCT-5912E utilizes an
optical subassembly consisting of
a short piece of single mode fiber
along with a current limiting
circuit to guarantee eye-safety. It
is intrinsically eye safe and does
not require shut down circuitry.
Signal Detect
The Signal Detect circuit provides
a TTL low output signal when the
optical link is broken or when the
transmitter is OFF as defined by
the Gigabit Ethernet specification
IEEE 802.3z, Table 38.1. The
Signal Detect threshold is set to
transition from a high to low
state between the minimum
receiver input optional power and
-30 dBm avg. input optical power
indicating a definite optical fault
(e.g. unplugged connector for the
receiver or transmitter, broken
fiber, or failed far-end transmitter
or data source). A Signal Detect
indicating a working link is
functional when receiving
encoded 8B/10B characters. The
Signal Detect does not detect
receiver data error or error-rate.
Data errors can be determined by
signal processing offered by
upstream PHY ICs.
Electromagnetic
Interference (EMI)
One of a circuit board designer’s
foremost concerns is the control
of electromagnetic emissions
from electronic equipment.
Success in controlling generated
Electromagnetic Interference
(EMI) enables the designer to
pass a governmental agency’s
EMI regulatory standard and
more importantly, it reduces the
possibility of interference to
neighboring equipment. Agilent
has designed the HFBR/HFCT5912E to provide excellent EMI
performance. The EMI
performance of a chassis is
dependent on physical design and
features which help improve EMI
suppression. Agilent encourages
using standard RF suppression
practices and avoiding poorly
EMI-sealed enclosures.
Radiated Emissions for the
HFBR-5912E and HFCT-5912E
have been tested successfully in
several environments. While this
number is important for system
designers in terms of emissions
levels inside a system, Agilent
recognizes that the performance
of most interest to our customers
is the emissions levels, which
could be expected to radiate to
the outside world from inside a
typical system. In their
application, SFF transceivers are
intended for use inside an
enclosed system, protruding
through the specified panel
opening at the specified
protrusion depth.
Along with the system advantage
of high port density comes the
increase in the number of
apertures. Careful attention must
be paid to the locations of highspeed clocks or gigabit circuitry
with respect to these apertures.
While experimental measurements
and experiences do not indicate
any specific transceiver emissions
issues, Agilent recognizes that
the transceiver aperture is often a
weak link in system enclosure
integrity and has designed the
modules to minimize emissions
and if necessary, contain the
internal system emissions by
shielding the aperture.
To that end, Agilent’s gigabit
MT-RJ transceivers (HFCT-5912E
and HFBR-5912E) have nose
shields which provide a
convenient chassis connection to
the nose of the transceiver. This
nose shield improves system EMI
performance by closing off the
MT-RJ aperture. Localized
shielding is also improved by
tying the four metal housing
package grounding tabs to signal
ground on the PCB. Though not
obvious by inspection, the nose
shield and metal housing are
electrically separated for
customers who do not wish to
directly tie chassis and signal
grounds together. The
recommended transceiver
position, PCB layout and panel
opening for both HFBR-5912E
and HFCT-5912E are the same,
making them mechanically dropin compatible. Figure 6 shows
the recommended positioning of
the transceivers with respect to
the PCB and faceplate.
6
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause catastrophic damage to the device. Limits apply to each parameter in isolation, all
other parameters having values within the recommended operating conditions. It should not be assumed that limiting values of more than one
parameter can be applied to the product at the same time. Exposure to the absolute maximum ratings for extended periods can adversely affect
device reliability.
Parameter
Storage Temperature
Supply Voltage
Received Data Output Current
Relative Humidity
TTL Transmit Disable Input Current - Low
TTL Transmit Disable Input Current - High
TTL Signal Detect Output Current - Low
TTL Signal Detect Output Current - High
Symbol
TS
VCC
ID
RH
IILMAX
IIHMAX
IOLMAX
IOHMAX
Min.
-40
-0.5
Typ.
5
-3.0
Max.
+85
5.0
30
95
3.0
-5.0
4.0
Unit
°C
V
mA
%
mA
mA
mA
mA
Reference
Unit
°C
°C
V
mVP-P
V
Reference
1
Recommended Operating Conditions
Parameter
Ambient Operating Temperature
Case Temperature
Supply Voltage
Power Supply Rejection
Transmitter Differential Input Voltage
Received Data Output Load
TTL Signal Detect Output Current
TTL Signal Detect Output Current
Transmit Disable Input Voltage - Low
Transmit Disable Input Voltage - High
Transmit Disable Assert Time
Transmit Disable Deassert Time
TTL Transmit Disable Input Current - Low
TTL Transmit Disable Input Current - High
Symbol
TA
TC
VCC
PSR
VD
RDL
IOL
IOH
VIL
VIH
TASSERT
TDEASSERT
IIL
IIH
Min.
0
0
3.14
Typ.
Max.
+70
+80
3.47
100
0.4
1.6
50
1.0
400
Max.
+260/10
+260/10
Unit
°C/sec.
°C/sec.
-400
0.8
VCC
10
1.0
VCC -1.3
W
mA
µA
V
V
µs
ms
mA
µA
-1.0
2
3
4
5
6
Process Compatibility
Parameter
Hand Lead Soldering Temperature/Time
Wave Soldering and Aqueous Wash
Symbol
TSOLD/tSOLD
TSOLD/tSOLD
Min.
Typ.
Reference
7
Notes:
1. The transceiver is Class 1 eye safe up to VCC = 5.0 V.
2. Case temperature measurement referenced to the metal housing.
3. Tested with a 100 mVP-P sinusoidal signal in the frequency range from 10 Hz to 2 MHz on the VCC supply with the recommended
power supply filter (with C8) in place. Typically less than a 1 dB change in sensitivity is experienced.
4. To VCC -2 V.
5. Time delay from Transmit Disable Assertion to laser shutdown.
6. Time delay from Transmit Disable Deassertion to laser startup.
7. Aqueous wash pressure <110 psi.
7
HFBR-5912E, 850 nm VCSEL
Transmitter Electrical Characteristics
(TA = 0°C to +70°C, VCC = 3.14 V to 3.47 V)
Parameter
Supply Current
Power Dissipation
Symbol
ICCT
PDIST
Min.
Typ.
55
0.18
Max.
75
0.26
Unit
mA
W
Reference
Min.
Typ.
80
0.23
Max.
135
0.36
-1.620
-0.740
0.40
0.40
0.6
Unit
mA
W
V
V
ns
ns
V
V
µs
µs
Reference
1
2
3
3
4
4
5
5
Receiver Electrical Characteristics
(TA = 0°C to +70°C, VCC = 3.14 V to 3.47 V)
Parameter
Supply Current
Power Dissipation
Data Output Voltage - Low
Data Output Voltage - High
Data Output Rise Time
Data Output Fall Time
Signal Detect Output Voltage - Low
Signal Detect Output Voltage - High
Signal Detect Assert Time
Signal Detect Deassert Time
Symbol
ICCR
PDISR
VOL - VCC
VOH - VCC
tr
tf
VOL
VOH
TASSERT
TDEASSERT
-1.950
-1.045
2.2
100
350
Notes:
1. With recommended 130 W receiver data output load.
2. Power dissipation value is the power dissipated in the receiver itself. It is calculated as the sum of the products of VCC and ICC
minus the sum of the products of the output voltages and currents.
3. These outputs are compatible with 10 k, 10 kH, and 100 k ECL and PECL inputs.
4. These are 20-80% values.
5. Under recommended operating conditions.
NORMALIZED AMPLITUDE
1.3
1.0
0.8
0.5
0.2
0
-0.2
0
0.22
0.375
0.625
NORMALIZED TIME
Figure 1. Transmitter Optical Eye Diagram Mask
0.78
1.0
8
HFBR-5912E Family, 850 nm VCSEL
Transmitter Optical Characteristics
(TA = 0°C to +70°C, VCC = 3.14 V to 3.47 V)
Parameter
Symbol
Output Optical Power
POUT
50/125 µm, NA = 0.20 Fiber
Output Optical Power
POUT
62.5/125 µm, NA = 0.275 Fiber
Disabled Transmit Output Power
POUT DISABLED
Optical Extinction Ratio
Center Wavelength
lC
Spectral Width - rms
s
Optical Rise/Fall Time
tr/tf
RIN12
Coupled Power Ratio
CPR
Total Transmitter Jitter
Added at TP2
Min.
-9.5
Typ.
-9.5
Max.
-4
-4
-30.0
9
830
850
860
0.85
0.26
-117
9
227
Unit
Reference
dBm avg.
1
dBm avg.
1
dBm avg.
dB
2
nm
nm rms
ns
3,4, Figure 1
dB/Hz
dB
5
ps
6
Receiver Optical Characteristics
(TA = 0°C to +70°C, VCC = 3.14 V to 3.47 V)
Parameter
Symbol
Input Optical Power
PIN
Stressed Receiver Sensitivity
62.5 µm
50 µm
Stressed Receiver Eye Opening at TP4
Receive Electrical 3 dB
Upper Cutoff Frequency
Operating Center Wavelength
lC
Return Loss
Signal Detect – Asserted
PA
Signal Detect – Deasserted
PD
Signal Detect – Hysteresis
PA - PD
Min.
-17
Typ.
Max.
0
-12.5
-13.5
201
1500
770
12
860
-17
-30
1.5
Unit
Reference
dBm avg.
7
dBm avg.
8
dBm avg.
8
ps
6,9
MHz
10
nm
dB
dBm avg.
dBm avg.
dB
11
12
12
12
Notes:
1. The maximum Optical Output Power complies with the IEEE 802.3z specification, and is Class 1 laser eye safe.
2. Optical Extinction Ratio is defined as the ratio of the average output optical power of the transmitter in the high (“1”) state to the
low (“0”) state. The transmitter is driven with a Gigabit Ethernet 1250 MBd 8B/10B encoded serial data pattern. This Optical
Extinction Ratio is expressed in decibels (dB) by the relationship 10log(Phigh avg/Plow avg).
3. These are unfiltered 20-80% values.
4. Laser transmitter pulse response characteristics are specified by an eye diagram (Figure 1). The characteristics include rise time,
fall time, pulse overshoot, pulse undershoot, and ringing, all of which are controlled to prevent excessive degradation of the
receiver sensitivity. These parameters are specified by the referenced Gigabit Ethernet eye diagram using the required filter. The
output optical waveform complies with the requirements of the eye mask discussed in section 38.6.5 and Fig. 38-2 of IEEE 802.3z.
5. CPR is measured in accordance with EIA/TIA-526-14A as referenced in 802.3z, section 38.6.10.
6. TP refers to the compliance point specified in 802.3z, section 38.2.1.
7. The receive sensitivity is measured using a worst case extinction ratio penalty while sampling at the center of the eye.
8. The stressed receiver sensitivity is measured using the conformance test signal defined in 802.3z, section 38.6.11. The
conformance test signal is conditioned by applying deterministic jitter and intersymbol interference.
9. The stressed receiver jitter is measured using the conformance test signal defined in 802.3z, section 38.6.11 and set to an average
optical power 0.5 dB greater than the specified stressed receiver sensitivity.
10. The 3 dB electrical bandwidth of the receiver is measured using the technique outlined in 802.3z, section 38.6.12.
11. Return loss is defined as the minimum attenuation (dB) of received optical power for energy reflected back into the optical fiber.
12. With valid 8B/10B encoded data.
9
HFCT-5912E, 1300 nm FP Laser
Transmitter Electrical Characteristics
(TA = 0°C to +70°C, VCC = 3.14 V to 3.47 V)
Parameter
Supply Current
Power Dissipation
Symbol
ICCT
PDIST
Min.
Typ.
70
0.23
Max.
120
0.42
Unit
mA
W
Reference
Min.
Typ.
85
0.28
Max.
100
0.33
-1.620
-0.880
0.40
0.40
0.6
Unit
mA
W
V
V
ns
ns
V
V
µs
µs
Reference
Receiver Electrical Characteristics
(TA = 0°C to +70°C, VCC = 3.14 V to 3.47 V)
Parameter
Supply Current
Power Dissipation
Data Output Voltage - Low
Data Output Voltage - High
Data Output Rise Time
Data Output Fall Time
Signal Detect Output Voltage - Low
Signal Detect Output Voltage - High
Signal Detect Assert Time
Signal Detect Deassert Time
Symbol
ICCR
PDISR
VOL - VCC
VOH - VCC
tr
tf
VOL
VOH
TASSERT
TDEASSERT
-1.810
-1.045
2.2
100
100
1
2
2
3
3
Notes:
1. Power dissipation value is the power dissipated in the receiver itself. It is calculated as the sum of the products of VCC and ICC
minus the sum of the products of the output voltages and currents.
2. These outputs are compatible with 10 k, 10 kH, and 100 k ECL and PECL inputs.
3. These are 20-80% values.
10
HFCT-5912E, 1300 nm FP Laser
Transmitter Optical Characteristics
(TA = 0°C to +70°C, VCC = 3.14 V to 3.47 V)
Parameter
Output Optical Power
9 µm SMF
Output Optical Power
62.5 µm MMF
Output Optical Power
50 µm MMF
Disabled Transmit Output Power
Optical Extinction Ratio
Center Wavelength
Spectral Width - rms
Optical Rise/Fall Time
RIN12
Total Transmitter Jitter
Added at TP2
Symbol
POUT
Min.
-9.5
-11.5
-11.5
Typ.
POUT DISABLED
lC
s
9
1285
Max.
-3
-3
-3
-30.0
1343
2.8
0.26
-120
227
tr/tf
Unit
Reference
dBm
1
dBm
1
dBm
1
dBm avg.
dB
2
nm
nm rms
ns
3,4, Figure 1
dB/Hz
ps
5
Receiver Optical Characteristics
(TA = 0°C to +70°C, VCC = 3.14 V to 3.47 V)
Parameter
Input Optical Power
Stressed Receiver Sensitivity
Stressed Receiver Eye Opening at TP4
Receive Electrical 3 dB
Upper Cutoff Frequency
Operating Center Wavelength
Return Loss
Signal Detect – Asserted
Signal Detect – Deasserted
Signal Detect – Hysteresis
Symbol
PIN
Min.
-20
Typ.
Max.
-3
-14.4
201
1500
lC
PA
PD
PA - PD
1270
12
1355
-20
-30
0.5
Unit
Reference
dBm avg.
6
dBm avg.
7
ps
5, 8
MHz
9
nm
dB
dBm avg.
dBm avg.
dB
10
11
11
11
Notes:
1. The maximum Optical Output Power complies with the IEEE 802.3z specification, and is class 1 laser eye safe.
2. Optical Extinction Ratio is defined as the ratio of the average output optical power of the transmitter in the high (“1”) state to the
low (“0”) state. The transmitter is driven with a Gigabit Ethernet 1250 MBd 8B/10B encoded serial data pattern. This Optical
Extinction Ratio is expressed in decibels (dB) by the relationship 10log(Phigh avg /Plow avg ).
3. These are unfiltered 20-80% values.
4. Laser transmitter pulse response characteristics are specified by an eye diagram (Figure 1). The characteristics include rise time,
fall time, pulse overshoot, pulse undershoot, and ringing, all of which are controlled to prevent excessive degradation of the
receiver sensitivity. These parameters are specified by the referenced Gigabit Ethernet eye diagram using the required filter. The
output optical waveform complies with the requirements of the eye mask discussed in section 38.6.5 and Fig. 38-2 of IEEE 802.3z.
5. TP refers to the compliance point specified in 802.3z, section 38.2.1.
6. The receive sensitivity is measured using a worst case extinction ratio penalty while sampling at the center of the eye.
7. The stressed receiver sensitivity is measured using the conformance test signal defined in 802.3z, section 38.6.11. The
conformance test signal is conditioned by applying deterministic jitter and intersymbol interference.
8. The stressed receiver jitter is measured using the conformance test signal defined in 802.3z, section 38.6.11 and set to an average
optical power 0.5 dB greater than the specified stressed receive sensitivity.
9. The 3 dB electrical bandwidth of the receiver is measured using the technique outlined in 802.3z, section 38.6.12.
10. Return loss is defined as the minimum attenuation (dB) of received optical power for energy reflected back into the optical fiber.
11. With valid 8B/10B encoded data.
11
RX
TX
Mounting Studs/
Solder Posts
Package
Grounding Tabs
Top
View
RECEIVER SIGNAL GROUND
RECEIVER POWER SUPPLY
SIGNAL DETECT
RECEIVER DATA OUT BAR
RECEIVER DATA OUT
f
f
f
f
f
1
2
3
4
5
10
9
8
7
6
f
f
f
f
f
TRANSMITTER DATA IN BAR
TRANSMITTER DATA IN
TRANSMITTER DISABLE
TRANSMITTER SIGNAL GROUND
TRANSMITTER POWER SUPPLY
Figure 2. Pin Out
Table 1. Pin Out Table
Pin
Symbol
Two Mounting
Studs
Four Package
Grounding Tabs
1
VEER 1
2
3
VCCR
SD
4
RD-
5
RD+
6
7
8
VCCT
VEET 1
TDis
9
TD+
10
TD-
Functional Description
The mounting studs are provided for transceiver mechanical attachment to the circuit
board, they may also provide an optional connection of the transceiver to the
equipment chassis ground.
Note :- The holes in the circuit board must be tied to chassis ground.
Connect to signal ground.
Receiver Signal Ground
Directly connect this pin to receiver signal ground plane.
Receiver Power Supply
Signal Detect
Normal operation: Logic “1” Output
Fault Condition: Logic “0” Output
Received Data Out Bar
No internal terminations provided.
Received Data Out
No internal terminations provided.
Transmitter Power Supply
Transmitter Signal Ground
Transmitter Disable:
Normal Operation: Logic "0" - Laser On or Open Circuit
Transmit Disabled: Logic "1" - Laser Off
Transmitter Data In
An internal 50R termination consisting of 100R across TD+ and TD- will be provided
Transmitter Data In Bar
(See TD+ pin for terminaton details)
Note:
1. The Transmitter and Receiver VEE connections are commoned within the module.
12
3.3 V dc
+
C11
0.1 µF
VEET
7
9
3.3 V dc
R7*
3.3 k
PECL
INPUT
100 W
TD-
HFBR/HFCT-5912E
FIBER-OPTIC
TRANSCEIVER
10
8
TRANSMIT
DISABLE
VCCT
R5*
5.1 k
R6*
5.1 k
50 W
C6*
0.01 µF
0.1 µF
L2
C2
C8**
0.1 µF
10 µF
3
RD- 4
EER
TDR10
150
VEE2
OUTPUT
DRIVER
R9
150
CLOCK
SYNTHESIS
CIRCUIT
PARALLEL
TO SERIAL
CIRCUIT
1 µH
HDMP-1636A/-1646A
SERIAL/DE-SERIALIZER
(SERDES - 10 BIT
TRANSCEIVER)
3.3 V dc
+ C10
10 µF
C9
0.1 µF
TO LVTTL STAGE
C3
0.01 µF
POSTAMPLIFIER
RD+ 5
1
V
TD+
C7
1 µH
0.1 µF
1.8
kW
SD
VCC2
50 W
C5*
0.01 µF
L1
C1
VCC
SIGNAL
DETECT
CIRCUIT
TO
LVTTL
STAGE
6
VCCR 2
PREAMPLIFIER
R8*
3.3 k
TD+
LASER
DRIVER
CIRCUIT
GND
R3
130
R4
130
C4
0.01 µF
50 W
RD-
R14
100
50 W
INPUT
BUFFER
RD+
CLOCK
RECOVERY
CIRCUIT
SERIAL TO
PARALLEL
CIRCUIT
SEE HDMP-1636A/-1646A DATA SHEET FOR
DETAILS ABOUT THIS TRANSCEIVER IC.
NOTES:
USE SURFACE-MOUNT COMPONENTS FOR OPTIMUM HIGH-FREQUENCY PERFORMANCE.
USE 50 W MICROSTRIP OR STRIPLINE FOR SIGNAL PATHS.
LOCATE 50 W TERMINATIONS AT THE INPUTS OF RECEIVING UNITS.
* IN ORDER TO ELIMINATE REQUIRED EXTERNAL PASSIVE COMPONENTS, AGILENT HAS INCLUDED THE EQUIVALENT OF RESISTORS R5 - R8 AND CAPACITORS
C5 AND C6 WITHIN THE MODULE. R5 - R8, C5 AND C6 ARE INCLUDED AS PART OF THE APPLICATION CIRCUIT TO ACCOMMODATE OTHER TRANSCEIVER
VENDORS' MODULES. THE HFBR/HFCT-5912E WILL OPERATE IN BOTH CONFIGURATIONS.
**C8 IS A RECOMMENDED BYPASS CAPACITOR FOR ADDITIONAL LOW FREQUENCY NOISE FILTERING.
THE SIGNAL DETECT OUTPUT ON THE HFBR-5912E CONTAINS AN INTERNAL 1.8 kW PULL UP RESISTOR. THE OUTPUT STAGE ON THE HFCT-5912E IS A PUSH
PULL CONFIGURATION AND THEREFORE DOES NOT REQUIRE AN EXTERNAL PULL UP RESISTOR.
Figure 3. Recommended Gigabit/sec Ethernet HFBR/HFCT-5912E Fiber-Optic Transceiver and HDMP-1636A/1646A
SERDES Integrated Circuit Transceiver Interface and Power Supply Filter Circuits.
13
13.97
(0.55)
MIN.
5.15
(0.20)
(PCB to OVERALL
RECEPTACLE
CENTER LINE)
4.5 ±0.2
(0.177 ±0.008)
(PCB to OPTICS
CENTER LINE)
FRONT VIEW
7.11
(0.28)
13.59 10.0
(0.535) (0.394)
MAX. MAX.
10.16
(0.4)
TOP VIEW
4.57
(0.18)
Pin 1
1.778
(0.07)
7.59
(0.299)
17.778
(0.7)
12.4
(0.488)
+0
–0.2
(+000)
(0.24)
(–008)
Ø 0.61
7.112
(0.28)
HFCT = 49.56 (1.951)
HFBR = 48.57 (1.912) MAX.
HFCT = 37.56 (1.479) MAX.
HFBR = 36.04 (1.419) MAX.
9.3
9.8
(0.386) (0.366)
MAX. MAX.
SIDE VIEW
0.25
(0.01)
Ø 1.07
(0.042)
Full Radius
1
(0.039)
3.3
(0.13)
HFBR = 0
HFCT = 0.99 (0.04)
DIMENSIONS IN MILLIMETERS (INCHES)
NOTES:
1. THIS PAGE DESCRIBES THE MAXIMUM PACKAGE OUTLINE, MOUNTING STUDS, PINS AND THEIR RELATIONSHIPS TO EACH OTHER.
2. TOLERANCED TO ACCOMMODATE ROUND OR RECTANGULAR LEADS.
3. THE 10 I/O PINS, 2 SOLDER POSTS AND 4 PACKAGE GROUNDING TABS ARE TO BE TREATED AS A SINGLE PATTERN.
(SEE FIGURE 5 PCB LAYOUT).
4. THE MT-RJ HAS A 750 µm FIBER SPACING.
5. THE MT-RJ ALIGNMENT PINS ARE IN THE MODULE.
6. SEE MT-RJ TRANSCEIVER PIN OUT DIAGRAM FOR DETAILS.
Figure 4. Package Outline Drawing of HFBR/HFCT-5912E
14
Ø 1.4 ±0.1
(0.55 ±0.004)
7.11
(0.28)
3.56
(0.14)
Ø 1.4 ±0.1
(0.55 ±0.004)
Holes For
Housing
Leads
7
(0.276)
Ø 1.4 ±0.1
(0.55 ±0.004)
10.16
(0.4)
10.8
(0.425)
13.34
(0.525)
3.08
(0.121)
7.59
(0.299)
3
(0.118)
3
(0.118)
27
(1.063)
6
(0.236)
4.57
(0.18)
9.59
(0.378)
1.778
(0.07)
17.78
(0.7)
13.97
(0.55)
MIN.
2
(0.079)
Ø 2.29
(0.09)
7.112
(0.28)
3.08
(0.121)
Ø 0.81 ±0.1
(0.032 ±0.004)
DIMENSIONS IN MILLIMETERS (INCHES)
NOTES:
1. THIS FIGURE DESCRIBES THE RECOMMENDED CIRCUIT BOARD LAYOUT FOR THE MT-RJ TRANSCEIVER PLACED AT
.550 SPACING.
2. THE HATCHED AREAS ARE KEEP-OUT AREAS RESERVED FOR HOUSING STANDOFFS. NO METAL TRACES OR GROUND
CONNECTION IN KEEP-OUT AREAS.
3. 2 x 5 TRANSCEIVER MODULE REQUIRES 16 PCB HOLES (10 I/O PINS, 2 SOLDER POSTS AND 4 PACKAGE GROUNDING
TABS).
PACKAGE GROUNDING TABS SHOULD BE CONNECTED TO SIGNAL GROUND.
4. SOLDER POSTS SHOULD BE SOLDERED TO PCB FOR MECHANICAL INTEGRITY AND THE HOLES IN THE CIRCUIT BOARD
CONNECTED TO CHASSIS GROUND.
Figure 5. Recommended Board Layout Hole Pattern
15
10.8 ±0.1
(0.425 ±0.004)
3.8
(0.15)
1
(0.039)
9.8 ±0.1
(0.386 ±0.004)
13.97
(0.55)
MIN.
0.25 ±0.1
(0.01 ±0.004)
(TOP OF PCB TO
BOTTOM OF
OPENING)
14.79
(0.589)
DIMENSIONS IN MILLIMETERS (INCHES)
NOTE: NOSE SHIELD SHOULD BE CONNECTED TO CHASSIS GROUND.
Figure 6. Recommended Panel Mounting
Ordering Information
HFBR-5912E - 850 nm VCSEL (Short Wavelength Laser) 1000 Base SX Application
HFCT-5912E - 1300 nm FP Laser (Long Wavelength Laser) 1000 Base LX Application
www.semiconductor.agilent.com
Data subject to change.
Copyright © 2000 Agilent Technologies Inc.
5968-9719E (02/00)