IX2600_SR2600UR_System_Guide_R1.5

Intel® Server System SR2600UR
Technical Product Specification
Intel order number E45274-008
Revision 1.5
July 2010
Enterprise Platforms and Services Division
Revision History
Intel® Server System SR2600UR TPS
Revision History
Date
March 2009
Revision
Number
1.0
Modifications
Initial release.
October 2009
1.1
Updated section 7.3 - Control Panel Connectors
January 2010
1.2
Updated Section 2.6 NIC Connectors
®
Updated Section 6.4.2 Intel IT/IR RAID
March 2010
1.3
Updated Section 2.1.1 Processor Support
April 2010
1.4
Updated Section 2.6 System board overview
Removed CCC certification
July 2010
1.5
Updated Section 2 Product overview
Disclaimers
®
Information in this document is provided in connection with Intel products. No license, express or implied, by
estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's
Terms and Conditions of Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any
express or implied warranty, relating to sale and/or use of Intel products including liability or warranties relating to
fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property
right. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make
changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or
"undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or
incompatibilities arising from future changes to them.
®
The Intel Server System SR2600UR may contain design defects or errors known as errata which may cause the
product to deviate from published specifications. Current characterized errata are available on request.
This document and the software described in it are furnished under license and may only be used or copied in
accordance with the terms of the license. The information in this manual is furnished for informational use only, is
subject to change without notice, and should not be construed as a commitment by Intel Corporation. Intel
Corporation assumes no responsibility or liability for any errors or inaccuracies that may appear in this document or
any software that may be provided in association with this document.
Except as permitted by such license, no part of this document may be reproduced, stored in a retrieval system, or
transmitted in any form or by any means without the express written consent of Intel Corporation.
Intel, Pentium, Itanium, and Xeon are trademarks or registered trademarks of Intel Corporation.
*Other brands and names may be claimed as the property of others.
Copyright © Intel Corporation 2008-2010.
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Table of Contents
Table of Contents
1. Introduction ........................................................................................................................1
1.1
Chapter Outline ......................................................................................................1
1.2
Server Board Use Disclaimer .................................................................................2
2. Product Overview ...............................................................................................................3
2.1.1
Processor Support .................................................................................................5
2.2
System Overview ...................................................................................................7
2.3
System Dimensions ...............................................................................................7
2.4
System Components ..............................................................................................8
2.5
Hard Drive and Peripheral Bays .............................................................................9
2.6
System Board Overview .......................................................................................10
2.7
Front Bezel Features ............................................................................................14
2.8
Rack and Cabinet Mounting Options ....................................................................15
3. Power Subsystem.............................................................................................................16
3.1
Mechanical Overview ...........................................................................................16
3.2
Single Power Supply Module Population ..............................................................17
3.3
Handle and Retention Mechanism........................................................................18
3.4
Hot-swap Support ................................................................................................18
3.5
Airflow ..................................................................................................................18
3.6
AC Power Cord Specification Requirements ........................................................19
3.7
Output Cable Harness ..........................................................................................19
3.7.1
P1 – Server Board Power Connector ...................................................................20
3.7.2
P2 – Processor Power Connector ........................................................................20
3.7.3
P3 – Power Signal Connector ..............................................................................21
3.7.4
P4 – Backplane Power Connector ........................................................................21
3.7.5
P5 – Midplane Power Connector ..........................................................................21
3.8
AC Input Requirements ........................................................................................22
3.8.1
Efficiency..............................................................................................................22
3.8.2
AC Input Voltage Specification .............................................................................22
3.8.3
AC Line Dropout/Holdup ......................................................................................23
3.8.4
AC Line 5 VSB Holdup .........................................................................................23
3.8.5
AC Inrush .............................................................................................................23
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Intel® Server System SR2600UR TPS
Protection Circuits ................................................................................................23
3.9.1
Over-current Protection (OCP) .............................................................................23
3.9.2
Over-voltage Protection (OVP) .............................................................................24
3.9.3
Over-temperature Protection (OTP) .....................................................................24
3.10
DC Output Specification .......................................................................................25
3.10.1
Output Power/Currents ........................................................................................25
3.10.2
Standby Output/Standby Mode ............................................................................25
3.11
Power Supply Status LED ....................................................................................25
4. Cooling Subsystem ..........................................................................................................26
4.1
Non-redundant Fan Module..................................................................................27
4.2
Redundant Fan Module ........................................................................................30
4.3
Airflow Support .....................................................................................................32
4.3.1
Power Supply Zone ..............................................................................................32
4.3.2
Full-height Riser Zone ..........................................................................................33
4.3.3
CPU/Memory/Low-profile PCI Zone .....................................................................33
4.4
Drive Bay Population ............................................................................................33
4.5
Memory Slot Population .......................................................................................34
5. System Board Interconnects ...........................................................................................35
5.1
Midplane ..............................................................................................................35
5.2
Bridge Board ........................................................................................................42
5.3
Hot-swap SAS/SATA Backplane ..........................................................................43
6. Peripheral and Hard Drive Subsystem ............................................................................50
6.1
Slimline Drive Bay ................................................................................................50
6.2
Hard Drive Bays ...................................................................................................52
6.2.1
Hot-swap Drive Carriers .......................................................................................52
6.3
Optional Tape Drive or Additional Hard Drive Flex Bay ........................................ 53
6.4
Midplane Options .................................................................................................54
6.4.1
Passive Midplane .................................................................................................55
6.4.2
Active Midplane with SAS/SATA RAID Support....................................................55
6.5
Hot-swap SAS/SATA Backplane ..........................................................................58
6.5.1
SAS/SATA Backplane Layout ..............................................................................59
6.5.2
SAS/SATA Backplane Functional Architecture .....................................................61
6.6
Enclosure Management Cabling for Passive Midplane ......................................... 62
7. Standard Control Panel ....................................................................................................64
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7.1
Control Panel Buttons ..........................................................................................64
7.2
Control Panel LED Indicators ...............................................................................65
7.2.1
Power/Sleep LED .................................................................................................66
7.2.2
System Status LED ..............................................................................................67
7.2.3
Drive Activity LED.................................................................................................68
7.2.4
System Identification LED ....................................................................................68
7.3
Control Panel Connectors ....................................................................................68
7.4
Internal Control Panel Interconnect ......................................................................69
®
8. Intel Local Control Panel ................................................................................................71
8.1
LED Functionality .................................................................................................72
8.1.1
Power/Sleep LED .................................................................................................73
8.1.2
System Status LED ..............................................................................................73
8.1.3
Drive Activity LED.................................................................................................74
8.1.4
System Identification LED ....................................................................................74
8.2
®
Intel Local Control Panel Interconnects ..............................................................75
9. PCI Riser Cards and Assembly .......................................................................................77
9.1
Riser Card Options...............................................................................................78
9.2
PCI Riser Card Mechanical Drawings ..................................................................79
10. Environmental Specifications .........................................................................................83
10.1
System Level Environmental Limits ......................................................................83
10.2
Serviceability and Availability................................................................................83
10.3
Replacing the Backup Battery ..............................................................................84
11. Regulatory and Certification Information .......................................................................85
11.1
Product Regulatory Compliance ...........................................................................85
11.1.1
Product Safety Compliance ..................................................................................85
11.1.2
Product EMC Compliance – Class A Compliance ................................................ 86
11.1.3
Product Ecology Compliance ...............................................................................86
11.1.4
Certifications/Registrations/Declarations ..............................................................86
11.2
Product Regulatory Compliance Markings ...........................................................87
11.3
Rack Mount Installation Guidelines ......................................................................89
11.4
Power Cord Usage Guidelines .............................................................................91
11.5
Electromagnetic Compatibility Notices .................................................................91
11.5.1
FCC Verification Statement (USA) .......................................................................91
11.5.2
ICES-003 (Canada) ..............................................................................................92
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11.5.3
Europe (CE Declaration of Conformity) ................................................................92
11.5.4
VCCI (Japan) .......................................................................................................92
11.5.5
BSMI (Taiwan) .....................................................................................................93
11.5.6
KCC (Korea) ........................................................................................................93
11.6
Regulated Specified Components ........................................................................94
Appendix A: Integration and Usage Tips .................................................................................95
Appendix B: POST Code Diagnostic LED Decoder ....................................................................96
Appendix C: POST Code Errors ...............................................................................................101
Glossary..................................................................................................................................106
Reference Documents ...........................................................................................................108
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List of Figures
List of Figures
Figure 1. Top Down View – Passive System SKU Shown ...........................................................7
Figure 2. Major System Components ..........................................................................................8
Figure 3. Drive Bay Overview......................................................................................................9
®
Figure 4. Intel Server Board S5520UR ....................................................................................10
®
Figure 5 Intel Server Board S5520UR Components ...............................................................11
Figure 6. Back Panel Feature Overview ....................................................................................12
Figure 7. Intel® Light-Guided Diagnostic LEDs - Server Board ..................................................13
Figure 8. Optional Front Bezel ..................................................................................................14
Figure 9. Front Bezel Supporting Standard Control Panel.........................................................14
®
Figure 10. Front Bezel Supporting Intel Local Control Panel ...................................................15
Figure 11. Mechanical Drawing for Power Supply Module ........................................................16
Figure 12. Mechanical Drawing for Power Distribution Module .................................................17
Figure 13. Power Supply Blank .................................................................................................17
Figure 14. Non-redundant Fan Module .....................................................................................27
Figure 15. Non-redundant Fan Header Assignments on Midplane ............................................ 29
Figure 16. Fan Module Assembly..............................................................................................30
Figure 17. Redundant Fan Header Assignments on Midplane ..................................................31
Figure 18. CPU Air Duct with Air Baffle .....................................................................................33
Figure 19. 3.5-inch Drive Blank .................................................................................................34
Figure 20. DIMM Blank .............................................................................................................34
Figure 21. Passive Midplane Board...........................................................................................35
Figure 22. Active SAS/SATA RAID Midplane Board..................................................................36
Figure 23. Bridge Board ............................................................................................................42
Figure 24. 3.5-inch Hot-swap SAS/SATA Backplane (Front Side View) .................................... 43
Figure 25. 3.5-inch Hot-swap SAS/SATA Backplane (Back Side View) .................................... 44
Figure 26. Optional Sixth Hard Drive (Front View) ....................................................................50
Figure 27. Slimline Optical Drive Assembly for 3.5-inch drive System....................................... 51
Figure 28 Connector to Slimline Optical Device ........................................................................51
Figure 29. 3.5-inch Hard Drive Tray Assembly ..........................................................................52
Figure 30. Flex Bay ...................................................................................................................53
Figure 31. Optional Sixth Hard Drive (Front View) ....................................................................53
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Figure 32. Optional Tape Drive (Front View) .............................................................................54
Figure 33. Passive Midplane Board...........................................................................................55
Figure 34. Active Midplane with SAS/SATA RAID Support .......................................................56
Figure 35. Architecture Overview ..............................................................................................57
Figure 36. Hot-swap SAS/SATA Backplane (Front Side View)..................................................59
Figure 37. Hot-swap SAS/SATA Backplane (Back Side View) ..................................................60
Figure 38. SAS/SATA Backplane Functional Block Diagram ....................................................61
Figure 39. Standard Control Panel Assembly Module ...............................................................64
Figure 40. Control Panel Buttons ..............................................................................................64
Figure 41. Control Panel LEDs .................................................................................................65
Figure 42. Standard Control Panel PCB....................................................................................69
®
Figure 43. Intel Local Control Panel Assembly Module............................................................71
®
Figure 44. Intel Local Control Panel Overview .........................................................................71
Figure 45. 2U Riser Assembly ..................................................................................................77
Figure 46. 2U PCI Express* Passive Riser ...............................................................................78
Figure 47. 2U PCI Express* Passive Riser – Primary Side .......................................................79
Figure 48. 2U PCI Express* Passive Riser – Secondary Side................................................... 80
Figure 49. 2U Butterfly PCI-X/PCI Express* Active Riser – Primary Side.................................. 80
Figure 50. 2U Butterfly PCI-X/PCI Express* Active Riser – Secondary Side ............................. 81
Figure 51. 2U Butterfly PCI Express* Active Riser – Primary Side ............................................ 81
Figure 52. 2U Butterfly PCI Express* Active Riser – Secondary Side ....................................... 82
Figure 53. Diagnostic LED Placement Diagram ........................................................................96
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List of Tables
List of Tables
Table 1. System Feature Set ......................................................................................................3
Table 2. Mixed Processor Configurations....................................................................................6
Table 3. System Dimensions ......................................................................................................7
Table 4. Drive Overview ..............................................................................................................9
Table 5. Major Board Components ...........................................................................................12
Table 6. AC Power Cord Specifications ....................................................................................19
Table 7. Power Harness Cable Definitions ................................................................................19
Table 8. P1 Main Power Connector ..........................................................................................20
Table 9. P2 Processor Power Connector ..................................................................................20
Table 10. P3 Power Signal Connector ......................................................................................21
Table 11. P4 Backplane Power Connector ................................................................................21
Table 12. P5 Midplane Power Connector ..................................................................................21
Table 13. Efficiency...................................................................................................................22
Table 14. AC Input Rating .........................................................................................................22
Table 15. Over-current Protection Limits/240 VA Protection .....................................................24
Table 16. Over-voltage Protection (OVP) Limits .......................................................................24
Table 17. Output Power and Current Ratings ...........................................................................25
Table 18. LED Indicators ..........................................................................................................25
Table 19. Non-redundant Cooling Zones ..................................................................................27
Table 20. Non-redundant Fan Connector Pin Assingment ........................................................28
Table 21. Non-redundant Fan Header Assignment ...................................................................29
Table 22. Redundant Cooling Zones .........................................................................................30
Table 23. Redundant Fan Connector Pin Assingment ..............................................................31
Table 24. Redundant Fan Header Assignment .........................................................................32
Table 25. 120-pin Server Board-to-Midplane Bridge Board Connector Pin-out ......................... 36
Table 26. Midplane Fan Header Pin-outs ..................................................................................38
Table 27. Midplane Power Connector Pin-out ...........................................................................38
Table 28. Midplane-to-Backplane Card Edge Connector #1 Pin-out ......................................... 39
Table 29. Midplane-to-Backplane Card Edge Connector #2 Pin-out ......................................... 40
Table 30. Active Midplane SAS RAID Battery Backup Connector Pin-out ................................. 40
Table 31. Passive Midplane SATA/SAS Connector Pin-outs.....................................................41
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Table 32. 2x4 SAS/SATA Backplane Power Connector Pin-out (J7L2) ..................................... 44
Table 33. 1x7 Sixth HDD/Tape Drive Option Power Connector Pin-out (J2M1) ........................ 44
Table 34. Sixth HDD Option SATA/SAS I/O Connector Pin-out (J4L1) ..................................... 45
Table 35. Slimline Optical Drive Slot Connector (J1A1) ............................................................45
2
Table 36. I C Connector (J6L3).................................................................................................45
Table 37. PCI Express* X4 Slot Connector from Midplane (J4N1) ............................................ 46
Table 38. PCI Express* X4 Slot Connector from Midplane (J6N1) ............................................ 47
Table 39. USB Floppy Drive Connector (J2A1) .........................................................................47
®
Table 40. Intel Local Control Panel (LCP) Connector (J9A1) ...................................................48
Table 41. Control Panel Slot Connector (J9B1) ........................................................................48
Table 42. SAS/SATA Hard Drive Connector Pin-outs (J2C3, J2B1, J4C1, J4B1, J7C1) ........... 49
Table 43. J1L1 Connector to Slimline Optical Device ................................................................51
Table 44. Hard Drive LED Function Definitions .........................................................................62
Table 45. Hard Drive Activity LED Functionality ........................................................................62
Table 46. Control Button and Intrusion Switch Functions ..........................................................65
Table 47. Control Panel LED Functions ....................................................................................66
Table 48. SSI Power LED Operation .........................................................................................66
Table 49. Control Panel LED Operation ....................................................................................67
Table 50. External USB Connectors (J1B1) ..............................................................................68
Table 51. Video Connector (J1A1) ............................................................................................68
Table 52. 64-pin Control Panel Connector (J6B1) .....................................................................70
Table 53. Control Panel LED Functions ....................................................................................72
Table 54. SSI Power LED Operation .........................................................................................73
Table 55. Control Panel LED Operation ....................................................................................73
Table 56. 50-pin Control Panel Connector ................................................................................75
Table 57. Internal USB Header .................................................................................................76
Table 58. Riser Card Options....................................................................................................78
Table 59. System Environmental Limits Summary ....................................................................83
Table 60. Time Estimate for System Maintenance Procedures .................................................83
Table 61. POST Progress Code LED Example .........................................................................96
Table 62. Diagnostic LED POST Code Decoder .......................................................................97
Table 63. POST Error Messages and Handling ...................................................................... 101
Table 64. POST Error Beep Codes .........................................................................................104
Table 65. Integrated BMC Beep Codes ..................................................................................105
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1.
Introduction
Introduction
This Technical Product Specification (TPS) provides system-specific information detailing the
features, functionality, and high-level architecture of the Intel® Server System SR2600UR. The
Intel® Server Board S5520UR Technical Product Specification should also be referenced to
obtain greater detail of functionality and architecture specific to the integrated server board, but
which are also supported on this server system.
In addition, design-level information for specific subsystems can be obtained by ordering the
External Product Specifications (EPS) or External Design Specifications (EDS) for a given
subsystem. EPS and EDS documents are not publicly available. They are only made available
under NDA with Intel and must be ordered through your local Intel representative. See the
Reference Documents section at the end of this document for a complete list of available
documents.
The Intel® Server System SR2600UR may contain design defects or errors known as errata,
which may cause the product to deviate from published specifications. Refer to the Intel Server
Board S5520UR/Intel Server System SR2600UR Specification Update for published errata.
1.1
Chapter Outline
This document is divided into the following chapters:
















Chapter 1 – Introduction
Chapter 2 – Product Overview
Chapter 3 – Power Subsystem
Chapter 4 – Cooling Subsystem
Chapter 5 – System Board Interconnects
Chapter 6 – Peripheral and Hard Drive Subsystem
Chapter 7 – Standard Control Panel
Chapter 8 – Intel Local Control Panel
Chapter 9 – PCI Riser Cards and Assembly
Chapter 10 – Environmental Specifications
Chapter 11 – Regulatory and Certification Information
Appendix A – Integration and Usage Tips
Appendix B – POST Code Diagnostic LED Decoder
Appendix C – Post Code Errors
Glossary
Reference Documents
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Introduction
1.2
Intel® Server System SR2600UR TPS
Server Board Use Disclaimer
Intel Corporation server boards support add-in peripherals and contain a number of highdensity VLSI and power delivery components that need adequate airflow to cool. Intel ensures
through its own system development and testing that when Intel server building blocks are used
together, the fully integrated system will meet the intended thermal requirements of these
components. It is the responsibility of the system integrator who chooses not to use Inteldeveloped server building blocks to consult vendor datasheets and operating parameters to
determine the amount of air flow required for their specific application and environmental
conditions. Intel Corporation cannot be held responsible if components fail or the server board
does not operate correctly when used outside any of their published operating or non-operating
limits.
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2.
Product Overview
Product Overview
The Intel Server System SR2600UR is a rack mount 2U server system with features that are
designed to support the high-density high performance computing server market. The system is
integrated with an Intel Server Board S5520UR and is offered in two different system
configurations:

Configuration 1: System integrated with an active SAS/SATA midplane, a redundant fan
module, and a 5 slot PCI-E Riser (SR2600URLX)
 Configuration 2: System integrated with a passive midplane, a non-redundant fan
module, and a 3 slot PCI-E Riser (SR2600URBRP)
This chapter provides a high-level overview of the system features. Greater detail for each
major system component or feature is provided in the following chapters.
Table 1. System Feature Set
Feature
Peripheral Interfaces
Description
External connections:
 DB-15 video connector (back)
 RJ-45 serial Port A connector
 Two RJ-45 10/100/1000 Mb network connections
 Four USB 2.0 connectors (back)
 One USB 2.0 connector (front)
Internal connections:
 One USB 2x5 pin header, which supports two USB 2.0 ports
 One low-profile USB 2x5 pin header to support low-profile USB Solid State
drives
 One DH-10 Serial Port B header
 Six Serial ATA (SATA) II connectors
 Two I/O module connectors






®
One RMM3/GCM4 connector to support optional Intel Remote Management
Module 3
SATA Software 5 Activation Key connector
One SSI-EEB compliant front panel header
One SSI-EEB compliant 24-pin main power connector
One SSI-compliant 8-pin CPU power connector
One SSI-compliant auxiliary power connector
Video
On-board ServerEngines* LLC Pilot II Controller
 Integrated 2D Video Controller
 8 MB DDR2 Memory
LAN
Two 10/100/1000 Intel 82575 PHYs
®
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Feature
Description
Expansion Capabilities
The following riser card options are available:
 Three full-height PCI Express* slots (passive)
 Two full-height PCI-X slots with an on-board PXH bridge chip and one fullheight and two low-profile PCI Express* slots
 Five full-height PCI Express* slots
Hard Drive Options


Five 3.5-inch hot-swap SATA/SAS hard drives
Flex bay for sixth 3.5-inch hot-swap SATA/SAS hard drive or a 3.5-inch tape
drive or two fixed 2.5-inch hard drives
Peripherals


Slimline bay for slimline SATA optical drive
PCI riser card bracket
Control Panel

Standard control panel

Intel Local Control Panel
LEDs and displays
®
With standard control panel:
 NIC1 Activity
 NIC2 Activity
 Power/Sleep
 System Status
 System Identification
 Hard Drive Activity
®
Intel Light-Guided diagnostics:
 Fan Fault
 DIMM Fault
 CPU Fault
 5V-STBY
 System Status
 System Identification
 POST Code Diagnostics
Power Supply
Up to two 750-W power supply modules
Fans
Intel Server System SR2600URBRP:
 Non-redundant fan option containing three system fans
 Two non-redundant fans in power supply
®
Intel Server System SR2600URLX:
 Redundant fan option containing six system fans
 Two non-redundant fans in power supply
System Management
On-board ServerEngines* LLC Pilot II Controller
 Integrated Baseboard Management Controller (Integrated BMC), IPMI 2.0
compliant
 Integrated Super I/O on LPC interface
®
Support for Intel System Management Software 3.1
®
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2.1.1
Product Overview
Processor Support
®
The Intel Server Boards S5520UR supports the following processors:
•
One or two Intel® Xeon® Processor 5500 Series with a 4.8 GT/s, 5.86 GT/s, or 6.4 GT/s
Intel® QPI link interface and Thermal Design Power (TDP) up to 95 W.
•
One or two Intel® Xeon® Processor 5600 Series with a 6.4 GT/s Intel® QPI link interface
and Thermal Design Power (TDP) up to 130 W.
The server boards do not support previous generations of the Intel® Xeon® Processors.
For a complete updated list of supported processors,
see: http://support.intel.com/support/motherboards/server/S5520UR/. On the Support tab, look
for “Compatibility” and then “Supported Processor List”.
2.1.1.1
Processor Population Rules
Note: Although the server board does support dual-processor configurations consisting of
different processors that meet the defined criteria below, Intel does not perform validation
testing of this configuation. For optimal system performance in dual-processor configurations,
Intel recommends that identical processors be installed.
When using a single processor configuration, the processor must be installed into the
processor socket labeled CPU1. A terminator is not required in the second processor socket
when using a single processor configuration.
When two processors are installed, the following population rules apply:

Both processors must be of the same processor family.
 Both processors must have the same front-side bus speed.
 Both processors must have the same cache size.
 Processors with different speeds can be mixed in a system, given the prior rules are met.
If this condition is detected, all processor speeds are set to the lowest common
denominator (highest common speed) and an error is reported.
 Processor stepping within a common processor family can be mixed as long as it is
listed in the processor specification updates published by Intel Corporation.
The following table describes mixed processor conditions and recommended actions for all
Intel® server boards and systems that use the Intel® 5520 Chipset. The errors fall into one of the
following two categories:

Fatal: If the system can boot, it goes directly to the error manager, regardless of
whether the “Post Error Pause” setup option is enabled or disabled.

Major: If the “Post Error Pause” setup option is enabled, system goes directly to the
error manager. Otherwise, the system continues to boot and no prompt is given for the
error. The error is logged to the error manager.
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Table 2. Mixed Processor Configurations
Error
Processor family not
identical
Severity
Fatal
System Action
The BIOS detects the error condition and responds as follows:
 Logs the error into the system event log (SEL).
 Alerts the Integrated BMC of the configuration error with an IPMI
command.
 Does not disable the processor.
 Displays “0194: Processor family mismatch detected” message
in the error manager.
 Halts the system.
Processor cache not
identical
Fatal
The BIOS detects the error condition and responds as follows:
 Logs the error into the SEL.
 Alerts the Integrated BMC of the configuration error with an IPMI
command.
 Does not disable the processor.
 Displays “0192: Cache size mismatch detected” message in the
error manager.
 Halts the system.
Processor frequency (speed)
not identical
Major
The BIOS detects the error condition and responds as follows:
 Adjusts all processor frequencies to lowest common
denominator.
 Continues to boot the system successfully.
If the frequencies for all processors cannot be adjusted to be the
same, then the BIOS:
 Logs the error into the SEL.
 Displays “0197: Processor speeds mismatched” message in the
error manager.
 Halts the system.
Processor microcode
missing
Fatal
The BIOS detects the error condition and responds as follows:
 Logs the error into the SEL.
 Alerts the Integrated BMC of the configuration error with an IPMI
command.
 Does not disable processor.
 Displays “816x: Processor 0x unable to apply microcode update”
message in the error manager.
 Pauses the system for user intervention.
Halt
The BIOS detects the error condition and responds as follows:
 Logs the error into the system event log (SEL).
 Alerts the Integrated BMC of the configuration error with an IPMI
command.
 Does not disable the processor.
 Displays “0195: Processor Front Side Bus speed mismatch
detected” message in the error manager.
 Halts the system.
®
Processor Intel QuickPath
Interconnect speeds not
identical
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Intel order number E45274-008
Intel® Server System SR2600UR TPS
2.2
Product Overview
System Overview
Figure 1. Top Down View – Passive System SKU Shown
2.3
System Dimensions
Table 3. System Dimensions
Height
87.30 mm
3.44 in
Width without rails
430 mm
16.93 in
Width with rails
451.3 mm
17.77 in
Depth without CMA
704.8 mm
27.75 in
Depth with CMA
838.2 mm
33.0 in
Maximum Weight
29.5 kg
65 lbs
Revision 1.5
7
Intel order number E45274-008
Product Overview
2.4
Intel® Server System SR2600UR TPS
System Components
A.
Rack Handles
H.
CPU Air Duct
B.
SAS/SATA Backplane
I.
System Fan Assembly
C.
Air Baffles
J.
D.
Power Distribution Module
K.
E.
Power Supply Modules
L.
Standard Control Panel
Flex Bay – Sixth HDD or Tape or two 2.5-inch
HDDs (Optional)
Hard Drive Bays
F.
Riser Card Assembly
M.
Slimline Optical Drive Bay
G.
System Memory
N.
Front Bezel (Optional)
Figure 2. Major System Components
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Intel® Server System SR2600UR TPS
2.5
Product Overview
Hard Drive and Peripheral Bays
The system is designed to support several different hard drive and peripheral configurations.
The system includes a hot-swap backplane capable of supporting either SAS or SATA drives.
The sixth bay (see letter “B” in the following figure) can optionally be configured to support a
sixth 3.5-inch hard drive, a 3.5-inch tape drive, or two additional fixed 2.5-inch hard drives.
A.
C.
Slimline Optical Drive Bay
Flex Bay - Sixth Hard Drive, Tape Drive, or two fixed 2.5inch Hard Drives (Optional)
System Control Panel
D.
3.5-inch Hard Drive Bays (5)
B.
Figure 3. Drive Bay Overview
Table 4. Drive Overview
Active System
Product Code – SR2600URLX
Passive System
Product Code – SR2600URBRP
Supported
Supported
Not Supported
Not Supported
SATA Drives
Up to six 3.5-inch drives
Up to six 3.5-inch drives
SAS Drives
Up to six 3.5-inch drives
Up to six 3.5-inch drives
Slimline SATA Optical Drive
Slimline USB Floppy Drive
Revision 1.5
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Product Overview
2.6
Intel® Server System SR2600UR TPS
System Board Overview
®
Figure 4. Intel Server Board S5520UR
The following figure shows the board layout of the server board. Each connector and major
component is identified by a number or letter, and a description is given below the figure.
10
Revision 1.5
Intel order number E45274-008
Intel® Server System SR2600UR TPS
Product Overview
®
Figure 5 Intel Server Board S5520UR Components
Revision 1.5
11
Intel order number E45274-008
Product Overview
Intel® Server System SR2600UR TPS
Table 5. Major Board Components
A
Description
®
280-pin Intel Adaptive Riser Card Slot
Q
Description
®
Fan Board Connector (Intel Server Chassis)
B
POST Code LEDs
R
2x4 Power Connector
C
Intel RMM3 Header
S
Main Power Connector
D
Processor 1
T
Power Supply SMBus Connector
E
Back Panel I/O
U
Fan Header
F
ID LED
V
USB Header
G
System Status LED
W
Low-profile USB Solid State Driver Header
H
Fan Header
X
Fan Header
I
Fan Header
Y
LCP IPMB Header
J
Processor 1 DIMM Slots
Z
SATA RAID 5 Key Header
K
Processor 2 DIMM Slots
AA
SGPIO Header
L
Processor 2
BB
SATA Connectors
M
Fan Header
CC
I/O Module Mezzanine Connector 2
N
Fan Header
DD
I/O Module Mezzanine Connector 1
®
®
O
Bridge Board Connector (Intel Server Chassis)
P
Front Panel Connector
A.
Low-profile PCIe* Add-in Card Slots
I.
NIC 2
B.
Full-height PCI Add-in Card Slots
J.
NIC 1
C.
Upper Power Supply Module Fans
K.
USB
D.
Upper Power Receptacle
L.
USB
E.
Lower Power Receptacle
M.
DB-9 Serial B Connector
F.
Lower Power Supply Module Fans
N.
Video
O.
RJ-45 Serial A Connector
G.
H.
®
Intel I/O Expansion Module (Optional)
®
Intel Remote Management Module 3 NIC
(Optional)
Figure 6. Back Panel Feature Overview
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Intel® Server System SR2600UR TPS
Product Overview
A
POST Code Diagnostic LEDs
F
CPU 1 DIMM Fault LEDs
B
System Identification LED
G
CPU 2 Fan Fault LED
C
Status LED
H
Memory 2 Fan Fault LED
D
Memory 1 Fan Fault LED
I
CPU 2 DIMM Fault LEDs
E
CPU 1 Fan Fault LED
J
5V Standby LED
®
Figure 7. Intel Light-Guided Diagnostic LEDs - Server Board
Revision 1.5
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Product Overview
2.7
Intel® Server System SR2600UR TPS
Front Bezel Features
The optional front bezel is made of molded plastic and uses a snap-on design. When installed,
its design allows for maximum airflow to maintain system cooling requirements.
Figure 8. Optional Front Bezel
Separate front bezels are available to support systems that use either a standard control panel
or the Intel® Local Control Panel with LCD support.
When the standard control panel is used, light pipes on the backside of the front bezel allow the
system status LEDs to be monitored with the front bezel in the closed position. The front bezel
lock is provided to prevent unauthorized access to hard drives, peripheral devices and the
control panel.
Figure 9. Front Bezel Supporting Standard Control Panel
When the local control panel is used, the control panel module can be adjusted to extend
further out from the chassis face to allow the LCD panel to protrude from the front bezel.
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Intel® Server System SR2600UR TPS
Product Overview
®
Figure 10. Front Bezel Supporting Intel Local Control Panel
2.8
Rack and Cabinet Mounting Options
The system is designed to support 19 inches wide by up to 30 inches deep server cabinets. The
system supports three rack mount options:



A fixed mount relay rack/cabinet mount kit (Product Order Code - AXXBRACKETS)
which can be configured to mount the system into either a 2-post rack or 4-post cabinet.
A tool-less full extracting slide rail kit (Product Order Code – AXXHERAIL2) designed to
support an optional cable management arm (Product Order Code – AXXRACKCARM2).
A basic slide rail kit (Product Order Code – AXXBASRAIL13) designed to mount the
system into a standard (19 inches by up to 30 inches deep) EIA-310D compatible server
cabinet.
Revision 1.5
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Intel order number E45274-008
Power Subsystem
3.
Intel® Server System SR2600UR TPS
Power Subsystem
The power subsystem of the system consists of an integrated Power Distribution Module (PDM),
a power module enclosure, and support for up to two 750-Watt power supply modules. The
power subsystem can be configured to support a single module in a 1+0 non-redundant
configuration, or dual modules in a 1+1 redundant power configuration. In a 1+1 configuration,
a single failed power module can be hot-swapped with the system running. Either configuration
supports up to a maximum of 750 Watts of power.
This chapter provides technical details on the operation of the power supply module and power
subsystem. For additional information, refer to the Intel® Server System SR2600 AC Power
Supply Specification and the Intel® Server System SR2600 Power Distribution Module
Specification.
3.1
Mechanical Overview
The following figures display the Power Distribution Module and the Power Supply Module
dimensions.
Figure 11. Mechanical Drawing for Power Supply Module
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Intel® Server System SR2600UR TPS
Power Subsystem
Figure 12. Mechanical Drawing for Power Distribution Module
3.2
Single Power Supply Module Population
In single power module configurations, server management firmware requires that the power
supply module be populated in the top power module slot. The non-operating slot must have
the power supply blank installed.
Figure 13. Power Supply Blank
Revision 1.5
17
Intel order number E45274-008
Power Subsystem
Intel® Server System SR2600UR TPS
Configuring a single power supply module in the bottom location causes the server
management firmware and BIOS to generate a system error during POST and the error is
reported to the System Event Log (SEL).
3.3
Handle and Retention Mechanism
Each power supply module includes a handle for module insertion to or removal from the
module enclosure. Each module has a simple retention mechanism to hold the power module in
place once it is inserted. This mechanism withstands the specified platform mechanical shock
and vibration requirements. The tab on the retention mechanism is colored green to indicate it
is a hot-swap touch point. The latch mechanism is designed to prevent insertion or removal of
the module when the power cord is plugged in. This aids the hot-swapping procedure.
3.4
Hot-swap Support
Hot-swapping a power supply module is the process of extracting and re-inserting a power
supply module from an operating power system. During this process, the output voltages
remain within specified limits. Up to two power supply modules may be on a single AC line. The
power supply module can be hot-swapped using the following procedure:


3.5
Extraction: To remove the power supply, unplug the power cord first, and then remove
the power module. This can be done in standby mode or power-on mode.
Insertion: Insert the module first, and then plug in the power cord. If the system is
powered off, the system and the power supply will power on into standby mode or
power-on mode.
Airflow
Each power supply module incorporates two non-redundant 40-mm fans for self cooling and
partial system cooling. The fans provide at least 10 CFM airflow through the power supply when
installed in the system and operating at maximum fan speed. The cooling air enters the power
module from the PDB side (pre-heated air from the system).
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Intel® Server System SR2600UR TPS
3.6
Power Subsystem
AC Power Cord Specification Requirements
The AC power cord used must meet the specification requirements listed in the following table:
Table 6. AC Power Cord Specifications
Cable Type
3.7
SJT
Wire Size
16 AWG
Temperature Rating
105°C
Amperage Rating
13 A
Voltage Rating
125 V
Output Cable Harness
The power distribution board provides a cable harness providing connectors to the various
system boards. The harness size, connectors, and pin outs are shown below. Listed or
recognized component appliance wiring material (AVLV2), CN, rated 105°C minimum, 300 VDC
minimum is used for all output wiring.
Table 7. Power Harness Cable Definitions
Length
mm
95
110
100
150
220
To
Connector #
P1
P2
P3
P4
P5
No of
Pins
2x12
2x4
1x5
2x4
2x5
Description
Main Power Connector, 90° angle
Processor Power Connector, 90° angle
Server Board Signal Connector
Backplane Power Connector
Midplane Power Connector
Revision 1.5
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Power Subsystem
3.7.1
Intel® Server System SR2600UR TPS
P1 – Server Board Power Connector
Connector housing: 24-pin Molex* Mini-Fit Jr. 39-01-2245 or equivalent
Contact: Molex Mini-Fit, HCS, Female, Crimp 44476 or equivalent
Table 8. P1 Main Power Connector
Pin
1
2
3
4
Signals
+3.3 VDC
+3.3 VDC
COM (GND)
5 VDC
5 V RS
COM
+5 VDC
COM
PWR OK
5 VSB
+12 V3
+12 V3
+3.3 VDC
5
6
7
8
9
10
11
12
3.7.2
18 AWG Color
Orange
Orange
Black
Red
Red (24 AWG)
Black
Red
Black
Gray
Purple
Yellow/Blue
Yellow/Blue
Orange
Pin
13
14
15
16
17
18
19
20
21
22
23
24
Signal
+3.3 VDC
-12 VDC
COM
PS_ON#
COM
COM
COM
Reserved (-5 V in ATX)
+5 VDC
+5 VDC
+5 VDC
COM
18 AWG Colors
Orange
Blue
Black
Green
Black
Black
Black
N.C.
Red
Red
Red
Black
P2 – Processor Power Connector
Connector housing: 8-pin Molex* 39-01-2085 or equivalent
Contact: Molex 45750-1112 or equivalent
Table 9. P2 Processor Power Connector
Pin
1
2
3
4
Signal
COM
COM
COM
COM
16 AWG Colors
Black
Black
Black
Black
Pin
5
6
7
8
Signal
+12 V1
+12 V1
+12 V2
+12 V2
20
16 AWG Colors
Yellow
Yellow
Yellow/Black
Yellow/Black
Revision 1.5
Intel order number E45274-008
Intel® Server System SR2600UR TPS
3.7.3
Power Subsystem
P3 – Power Signal Connector
Connector housing: 5-pin Molex* 50-57-9705 or equivalent
Contact: Molex 16-02-0087 or equivalent
Table 10. P3 Power Signal Connector
PIN
1
2
3
4
5
3.7.4
Signal
2
I C Clock (SCL)
2
I C Data (SDL)
SMBAlert#
ReturnS
3.3RS
24 AWG Colors
White/Green
White/Yellow
White
White/Black
White/Orange
P4 – Backplane Power Connector
Connector housing: 8-pin Molex* Mini-Fit Jr. PN# 39-01-2285 or equivalent
Contact: Molex Mini-Fit, HCS, Female, Crimp 44476 or equivalent
Table 11. P4 Backplane Power Connector
Pin
1
2
3
4
3.7.5
Signal
COM
COM
+5 V
+5 V
18 AWG Colors
Black
Black
Red
Red
Pin
5
6
7
8
Signal
+12 V4
+12 V4
+5 VSB
+3.3 V
18 AWG Colors
Yellow/Green
Yellow/Green
Purple
Orange
P5 – Midplane Power Connector
Connector housing: 10-pin Molex* Mini-Fit Jr. 43025-1000 or equivalent
Contact: Molex Mini-Fit, HCS, Female, Crimp 43030-0007 or equivalent
Table 12. P5 Midplane Power Connector
Pin
1
2
3
4
5
Signal
COM
COM
+5 V
+3.3 V
COM
20 AWG Colors
Black
Black
Red
Orange
Black
Pin
6
7
8
9
10
Signal
+12 V3
+12 V3
+12 V3
+12 V3
+5 VSB
Revision 1.5
20 AWG Colors
Yellow/Blue
Yellow/Blue
Yellow/Blue
Yellow/Blue
Purple
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Power Subsystem
3.8
Intel® Server System SR2600UR TPS
AC Input Requirements
The power supply module incorporates universal power input with active power factor correction,
which reduces line harmonics in accordance with the EN61000-3-2 and JEIDA MITI standards.
3.8.1
Efficiency
The following table provides the required minimum efficiency level at various loading conditions.
These are provided at three different load levels: 100%, 50% and 20%. Efficiency is tested only
at 230 VAC.
Table 13. Efficiency
Loading
Recommended Efficiency
3.8.2
100% of Maximum
85%
50% of Maximum
89%
20% of Maximum
85%
AC Input Voltage Specification
The power supply must operate within all specified limits over the input voltage range shown in
the following table.
Table 14. AC Input Rating
Parameter
Line Voltage
(110)
Line Voltage
(220)
Frequency
Minimum
Startup
VAC
Power-off
VAC
140 Vrms
85 VAC ± 4
VAC
75 VAC ±
5 VAC
12 Arms
200 - 240 Vrms
264 Vrms
-
-
6.0 Arms
50/60 Hz
63 Hz
Rated
Maximum
90 Vrms
100 - 127 Vrms
180 Vrms
47 Hz
Maximum
Input AC
Current
1,3
2,3
Maximum Rated
Input AC Current
11.0 Arms
5.5 Arms
Notes:
1.
2.
3.
4.
Maximum input current at low input voltage range is measured at 90 VAC, at maximum load.
Maximum input current at high input voltage range is measured at 180 VAC, at maximum load.
This is not to be used for determining agency input current markings.
Maximum rated input current is measured at 100 VAC and 200 VAC.
Harmonic distortion of up to 10% of the rated AC input voltage must not cause the power
supply to go out of specified limits. The power supply powers off at or below 75 VAC ± 5 VAC.
The power supply starts up at or above 85 VAC ± 4 VAC. Application of an input voltage below
85 VAC does not cause damage to the power supply or blow a fuse.
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4
4
Intel® Server System SR2600UR TPS
3.8.3
Power Subsystem
AC Line Dropout/Holdup
An AC line dropout is defined to be when the AC input drops to 0 VAC at any phase of the AC
line for any length of time. During an AC dropout of one cycle or less, the power supply must
meet dynamic voltage regulation requirements over the rated load. If the AC dropout lasts
longer than one cycle, the power supply should recover and meet all turn-on requirements. The
power supply must meet the AC dropout requirement over rated AC voltages, frequencies, and
output loading conditions. Any dropout of the AC line does not cause damage to the power
supply.


20 ms minimum when tested under the following conditions: Maximum combined load =
562.5 W
12 ms minimum when tested under the following conditions: Maximum combined load =
750 W
3.8.4
AC Line 5 VSB Holdup
The 5 VSB output voltage should stay in regulation under its full load (static or dynamic) during
an AC dropout of 70 ms minimum (= 5 VSB holdup time) whether the power supply is in ON or
OFF state (PSON asserted or de-asserted).
3.8.5
AC Inrush
AC line inrush current should not exceed 40 A peak for up to one-quarter of the AC cycle, after
which the input current should be no more than the specified maximum input current. The peak
inrush current should be less than the ratings of its critical components (including input fuse,
bulk rectifiers, and surge limiting device).
The power supply must meet the inrush requirements for any rated AC voltage, during turn on
at any phase of AC voltage, during a single cycle AC dropout condition as well as upon
recovery after AC dropout of any duration, and over the specified temperature range (Top). It is
acceptable that AC line inrush current may reach up to 60 A peak for up to 1 millisecond.
3.9
Protection Circuits
Protection circuits inside the PDB and the power supply cause the power supply’s main +12 V
output to shut down, or cause a shutdown of any of the three outputs on the PDB. Any one of
these shutdowns results in shutting down the entire power supply/PDB combination. If the
power supply latches off due to a protection circuit tripping, an AC cycle OFF for 15 seconds
resets the power supply and the PDB.
3.9.1
Over-current Protection (OCP)
Each DC/DC converter output on the PDB has individual OCP protection circuits. The power
supply and power distribution board (PS and PDB) shut down and latch off after an over-current
condition occurs. This latch is cleared by toggling the PSON# signal or by an AC power
interruption. The over-current limits are measured at the PDB harness connectors.
Revision 1.5
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Power Subsystem
Intel® Server System SR2600UR TPS
The DC/DC converters are not damaged from repeated power cycling in this condition. The +12
V output from the power supply is divided on the PDB into four channels and each is limited to
240 VA of power. Current sensors and limit circuits shut down the entire PS and PDB if the limit
is exceeded. The limits are listed in the following table.
Table 15. Over-current Protection Limits/240 VA Protection
Output Voltage
+3.3 V
+5 V
-12 V
+12 V1
+12 V2
+12 V3
+12 V4
3.9.2
Minimum OCP Trip Limits
110% min (= 26.4 A min)
110% min (= 33 A min)
125% min (= 0.625 A min)
26.0 A min
26.0 A min
112.5% min (= 18.0 A min)
112.5% min (= 18.0 A min)
Maximum OCP Trip Limits
150% max (= 36 A max)
150% max (= 45 A max)
400% max (= 2.0 A max)
32 A max
32 A max
20 A max
20 A max
Over-voltage Protection (OVP)
Each DC/DC converter output on the PDB has individual OVP circuits built in and they are
locally sensed. The PS and PDB shut down and latch off after an over-voltage condition occurs.
This latch is cleared by toggling the PSON# signal or by an AC power interruption. The overvoltage limits are measured at the PDB harness connectors. The voltage never exceeds the
maximum levels when measured at the power pins of the output harness connector during any
single point of fail. The voltage never trips any lower than the minimum levels when measured
at the power pins of the PDB connector.
Table 16. Over-voltage Protection (OVP) Limits
Output Voltage
+3.3 V
+5 V
+5 VSB
-12 V
+12 V1/2/3/4
3.9.3
OVP Minimum (V)
3.9
5.7
5.7
-13.3
13.0
OVP Maximum (V)
4.5
6.5
6.5
-14.5
14.5
Over-temperature Protection (OTP)
The power supply is protected against over-temperature conditions caused by loss of fan
cooling or excessive ambient temperature. In an OTP condition, the power supply shuts down.
When the power supply temperature drops to within specified limits, the power supply restores
power automatically, while the 5 VSB remains constantly on. The OTP trip level has a minimum
of 4°C of ambient temperature hysteresis, so that the power supply does not oscillate on and off
due to a temperature recovery condition. The power supply alerts the system of the OTP
condition via the power supply FAIL signal and the PWR LED.
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Power Subsystem
3.10 DC Output Specification
3.10.1
Output Power/Currents
The following table defines power and current ratings for this 750 W continuous (860 W pk)
power supply in 1+0 or 1+1 redundant configuration. The combined output power of both
outputs does not exceed the rated output power. The power supply must meet both static and
dynamic voltage regulation requirements for the minimum loading conditions. Also, the power
supply is able to supply the listed peak currents and power for a minimum of 10 seconds.
Outputs are not required to be peak loaded simultaneously.
Table 17. Output Power and Current Ratings
+12 V
62.0 A
3.0 A
0.0 A
70.0 A (12 seconds
minimum)
12 V x 62 A = 744 W
maximum
12 V x 70 A = 840 W pk
Maximum Load
Minimum Dynamic Load
Minimum Static Load
Peak Load
Maximum Output Power (continuous)
Peak Output Power
3.10.2
+5 VSB
3.0 A
0.1 A
0.1 A
5.0A (0.5 seconds minimum @
turn-on)
5 V x 3 A = 15 W maximum
5 V x 5 A = 25 W pk
Standby Output/Standby Mode
The 5 VSB output is present when an AC input greater than the power supply turn-on AC
voltage is applied. Applying an external 5.25 V to 5 VSB does not cause the power supply to
shut down or exceed operating limits. When the external voltage is removed, the voltage
returns to the power supplies’ operating voltage without exceeding the dynamic voltage limits.
3.11 Power Supply Status LED
Each power supply module has a single bi-color LED to indicate power supply status. The LED
operation is defined in the following table.
Table 18. LED Indicators
Power Supply Condition
No AC power to all power supplies
No AC power to this PSU only (for 1+1 configuration)
or
Power supply critical event causing a shutdown:
failure, fuse blown (1+1 only), OCP, OVP, fan failed
Power supply warning events where the power supply continues to
operate: high temp, high power, high current, slow fan.
AC present/Only 5 VSB on (PS Off)
Output ON and OK
Bi-Color LED
Off
Amber
1 Hz Blink Amber
1 Hz Blink Green
Green
The LED is visible on the rear panel of each installed power supply module.
Revision 1.5
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Intel order number E45274-008
Cooling Subsystem
4.
Intel® Server System SR2600UR TPS
Cooling Subsystem
Several components and configuration requirements make up the cooling subsystem of the
system. These include the system fan module, the power supply fans, air baffles, CPU air duct,
and drive bay population. All are necessary to provide and regulate the airflow and air pressure
needed to maintain the system’s thermals when operating at or below maximum specified
thermal limits.
Two system fan assembly options are available for this system:

The first option is a non-redundant three fan solution providing sufficient airflow to
maintain internal system thermal requirements when the external ambient temperature
remains within specified limits.
 The second option is a redundant fan solution. Three parallel sets of fans are arranged
in series to provide redundant cooling in the event of a single fan failure. Each cooling
option utilizes two fan types: a 60-mm variable-speed fan and an 80-mm variable-speed
fan.
The system uses a variable fan speed control engine to provide adequate cooling for the
system at various ambient temperature conditions, under various server workloads, and with
the least amount of acoustic noise possible. To minimize acoustics, the fans operate at the
lowest speed for any given condition.
The Integrated Baseboard Management Controller (Integrated BMC) on the Intel® Server Board
S5520UR is used for the variable fan speed control function. The Integrated BMC monitors
selective component temperatures, the ambient temperature, and each fan’s RPM to determine
the necessary airflow. The Integrated BMC sets the fan speeds to the appropriate RPM to
maintain proper cooling. The Integrated BMC also logs errors into the System Event Log (SEL)
when temperature sensors exceed their safe operating ranges, or if any of the fans fail to
operate at safe airflow speeds.
If a fan fails, the Integrated BMC boosts the remaining fans to compensate for the lost airflow. A
system with redundant fans can continue to operate in this degraded condition while the nonredundant system may not. If the cooling is not sufficient under a failed fan condition, the
system eventually shuts down to protect its primary components from thermal damage.
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4.1
Cooling Subsystem
Non-redundant Fan Module
Figure 14. Non-redundant Fan Module
This option provides the primary airflow for system configurations that do not require redundant
cooling.
Table 19. Non-redundant Cooling Zones
Fan
System Fan #1
System Fan #2
Cooling Zone
CPU2
CPU1
System Fan #3
PCI
Power Supply
Fans - 2 fans per
module
Power
Supply
Description of greatest cooling influence
Primary cooling for CPU 2 and Memory 1
Primary cooling for hard drives 4 and 5, CPU 1,
and Memory 2
Primary cooling for hard drives 2 and 3, full®
height PCI cards, and the Intel 5520 Chipset
IOH
Primary cooling for hard drives 0 and 1, and the
power supply module(s)
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The system fan module is designed for ease of use and supports several management features
that can be utilized by the Integrated Baseboard Management Controller.


The fan module houses two different fan sizes: System fans 1 and 2 use an 80-mm fan;
System fan 3 uses a 60-mm fan.
Each fan is designed for tool-less insertion to or removal from the fan module housing.
For instructions on installing or removing a fan module, see the Intel® Server System
SR2600UR/SR2625UR Service Guide.
Note: The fans are NOT hot-swappable. The system must be turned off in order to replace a
failed fan.




Each fan within the module is capable of supporting multiple speeds. If the external
ambient temperature of the system exceeds the value programmed into the thermal
sensor data record (SDR), the Integrated BMC firmware increases the speed for all the
fans within the fan module.
Each fan is responsible for cooling a specific zone of the system. If the components in
the zone begin to exceed a safe operating temperature as programmed by the SDR, the
Integrated BMC firmware increases the speed for the fans tied to that zone.
Each fan connector within the module supplies a tachometer signal that allows the
Integrated BMC to monitor the status of each fan. If one of the fans fails, the remaining
fans increase their rotation and attempt to maintain the thermal requirements of the
system.
Each fan has an associated fault LED on the midplane located next to the fan header. If
a fan fails, system management illuminates the fault LED for the failing fan.
Table 20. Non-redundant Fan Connector Pin Assingment
Pin
1
2
3
4
5
Signal Name
Tachometer B
PWM
12 V
12 V
Tachometer A
6
7
8
9
10
Return
Return
Fan Presence
LED Cathode
LED Anode
Description
Reserved, unused by the non-redundant fan
Fan speed control signal
Power for fan
Power for fan
Fan RPM sensor output
Two pulse per revolution for the 80-mm fan
Four pulses per revolution for the 60-mm fan
Return path to ground
Return path to ground
Reserved, unused by the non-redundant fan
Loopback signal to pin 10
Loopback signal to pin 9
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Cooling Subsystem
The system fans plug into headers on the midplane board as shown in the following figure.
Figure 15. Non-redundant Fan Header Assignments on Midplane
Table 21. Non-redundant Fan Header Assignment
Fan ID
Fan #1 - CPU1 cooling
Fan #2 - CPU2 cooling
Fan #3 - PCI cooling
Midplane Fan Header Name
FAN_2
FAN_4
FAN_5
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4.2
Intel® Server System SR2600UR TPS
Redundant Fan Module
Figure 16. Fan Module Assembly
Table 22. Redundant Cooling Zones
Fan
System Fan #1 & #2
System Fan #2 & #3
Cooling
Zone
CPU2
CPU1
System Fan #5 & #6
PCI
Power Supply Fans
2 fans per module
Power
Supply
Description of Greatest Cooling Influence
Primary cooling for CPU 2 and Memory 1
Primary cooling for hard drives 4 and 5, CPU 1,
memory 2, and the low-profile PCI cards
Primary cooling for hard drives 2 and 3, Full®
height PCI cards, Intel 5520 Chipset IOH
Primary cooling for hard drives 0 and 1, and the
power supply module(s)
Each 10-pin fan connector provides power and ground, PWM control, tachometer output, a fan
present detection signal, and a fault LED signal allowing it to be monitored independently by
server management software. The following table provides the pin-out and description for the
connectors on each fan.
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Cooling Subsystem
Table 23. Redundant Fan Connector Pin Assingment
Pin
1
2
3
4
5
Signal Name
Tachometer B
PWM
12 V
12 V
Tachometer A
6
7
8
9
10
Return
Return
Fan Presence
LED Cathode
LED Anode
Description
Reserved, unused by redundant fan
Fan speed control signal
Power for fan
Power for fan
Fan RPM sensor output
Two pulses per revolution for the 80-mm fan
Four pulses per revolution for the 60-mm fan
Return path to ground
Return path to ground
Detection if fan is installed in system
LED in fan
Reserved, unused by the redundant fan
The system fans are hot-pluggable and do not have any cable connections. They mate directly
to the fan module. The system fan module plugs into headers on the midplane board as shown
in the following figure.
Figure 17. Redundant Fan Header Assignments on Midplane
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Table 24. Redundant Fan Header Assignment
Fan #1
Fan #2
Fan #3
Fan #4
Fan #5
Fan #6
-
Fan ID
CPU1 Cooling
CPU1 Cooling
CPU2 Cooling
CPU2 Cooling
PCI Cooling
PCI Cooling
Midplane Fan Header Name
FAN_1
FAN_2
FAN_3
FAN_4
FAN_5
FAN_6
The system fan module is designed for ease of use and supports several management features
that can be utilized by the Integrated Baseboard Management Controller.






4.3
The fan module houses two different fan sizes: System fans 1, 2, 3 and 4 use an 80-mm
fan; System fans 5 and 6 use a 60-mm fan.
Each fan is designed for tool-less insertion to or removal from the fan module and can
be hot-swapped in the event of failure.
Each fan within the module is equipped with a failure LED. In a fan fails, server
management illuminates the fault LED on the failing fan.
Each fan within the module is capable of supporting multiple speeds. If the external
ambient temperature of the system exceeds the value programmed into the thermal
sensor data record (SDR), the Integrated BMC firmware increases the speed for all the
fans within the fan module.
Each fan is responsible for cooling a specific zone of the system. If the components in
the zone begin to exceed a safe operating temperature as programmed by the SDR, the
Integrated BMC firmware increases the speed for the fans tied to that zone.
Each fan connector within the module supplies a tachometer signal that allows the
Integrated BMC to monitor the status of each fan. If one of the fans fails, the remaining
fans increase their rotation and attempt to maintain the thermal requirements of the
system.
Airflow Support
To control airflow within the system, the system uses an air baffle and a CPU air duct to isolate
and direct airflow to three critical zones: the power supply zone, the full-height PCI riser zone,
and the CPU/memory/low-profile PCI riser zone.
4.3.1
Power Supply Zone
An air baffle is used to isolate the airflow of the main system board zones from the zone directly
in front of the power supply. As the power supply fans pull pre-heated air through the power
supply from inside the system, the zone in front of it must remain as cool as possible by
drawing air from the leftmost drive bays only.
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4.3.2
Cooling Subsystem
Full-height Riser Zone
The full-height riser zone is the area between the power supply assembly and the full-height
riser card of the riser assembly. The airflow through this area is generated by system fan 3 of
the fan module in a non-redundant fan configuration. In a redundant fan configuration, the
airflow for this zone is provided by system fans 5 and 6. Air is drawn from the drive bay area
through the fan and pushed out of the system through ventilation holes at the back of the
system.
4.3.3
CPU/Memory/Low-profile PCI Zone
The CPU/memory/low-profile PCI zone is the area between the low-profile riser card of the riser
assembly and the right chassis wall. In a non-redundant fan configuration, the airflow for this
zone is generated by system fans 1 and 2 of the fan module. In a redundant fan configuration,
the airflow for this zone is provided by system fans 1, 2, 3 and 4. Air is drawn from the drive bay
area, through the fans, directed through the CPU air duct, and out through ventilation holes on
both the back wall and rear side wall of the system.
The CPU air duct combined with the DIMM blanks is used to direct airflow through the
processor heat sinks and memory areas for both single and dual processor configurations.
Figure 18. CPU Air Duct with Air Baffle
4.4
Drive Bay Population
To maintain proper air pressure within the system, all hard drive bays must be populated with
either a hard drive or drive blank.
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Intel® Server System SR2600UR TPS
Figure 19. 3.5-inch Drive Blank
4.5
Memory Slot Population
To maintain proper airflow over the DIMMs and CPUs, DIMMs or DIMM blanks must be
populated. The requirements are as follows:
 One CPU installed – All CPU 1 DIMM slots must either have a DIMM or DIMM blank
installed. You may leave the CPU 2 DIMM slots empty or store extra DIMM blanks in the
blue DIMM slots.
 Two CPUs installed – All blue DIMM slots in CPU 1 and CPU 2 must either have a
DIMM or DIMM blank installed. You may store extra DIMM blanks in any unused CPU1
DIMM slots.
Figure 20. DIMM Blank
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5.
System Board Interconnects
System Board Interconnects
System boards within the system include the midplane, bridge board, hot-swap backplane, and
control panel. This chapter describes the interconnect features of each, and defines the pinouts for each connector. Functional details of each system board are described in later
chapters.
5.1
Midplane
The midplane is designed and used, along with that of the bridge board and hot-swap
backplane, to improve cable routing within the system. The midplane is the key system board of
the system. It serves as the primary interface between the server board, hot-swap backplane,
and control panel. Two midplanes are offered for this system: a passive SATA/SAS, and an
active SAS/SATA RAID.
The passive midplane is a simple pass-through from the backplane to the SATA connectors on
the server board or SAS/SATA connectors on an add-in card.
The following figure shows the location for each connector found on the passive midplane
board.
A.
Power Connector
F.
Fan 4 Connector
B.
Fan 6 Connector
G.
Fan 3 Connector
C.
Fan 5 Connector
H.
Fan 1 Connector
D.
SAS/SATA Connectors
I.
Fan 2 Connector
E.
Bridge Board Connector
J.
Backplane Connector
Figure 21. Passive Midplane Board
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Intel® Server System SR2600UR TPS
The system also supports an active SAS/SATA RAID midplane. This system board incorporates
an LSI LSISAS1078 SAS controller onto the board. For information about SAS/SATA RAID
support, see Chapter 6. The following figure shows the location for each connector found on
this board.
B.
C.
D.
Optional RAID Cache Battery
Backup Connection
Power Connector
Mini-DIMM Connector
Fan 6 Connector
E.
Fan 5 Connector
K.
F.
Bridge Board Connector
L.
A.
G.
Fan 4 Connector
H.
I.
J.
Fan 3 Connector
Fan 1 Connector
Fan 2 Connector
RAID Activation Key
Connector
Backplane Connectors
Figure 22. Active SAS/SATA RAID Midplane Board
The following tables define the connector pin-outs for both midplane boards.
Table 25. 120-pin Server Board-to-Midplane Bridge Board Connector Pin-out
Pin
1
2
3
4
5
6
7
8
9
Signal Name
GND
PE1_ESB_TX_DN3
PE1_ESB_TX_DP3
GND
PE_WAKE_N
GND
PE1_ESB_TX_DN2
PE1_ESB_TX_DP2
GND
Pin
61
62
63
64
65
66
67
68
69
Signal Name
SMB_SENSOR_3V3SB_CLK_BUF
SMB_SENSOR_3V3SB_DAT_BUF
FM_BRIDGE_PRSNT_N
GND
PE1_ESB_RX_DN_C3
PE1_ESB_RX_DP_C3
GND
FAN_PRSNT6_N
GND
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Pin
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
System Board Interconnects
Signal Name
FAN_PRSNT5_N
GND
PE1_ESB_TX_DN1
PE1_ESB_TX_DP1
GND
RST_PS_PWRGD
GND
PE1_ESB_TX_DN0
PE1_ESB_TX_DP0
GND
FM_RAID_MODE
GND
CLK_IOP_DN
CLK_IOP_DP
GND
SGPIO_DATAOUT1
SGPIO_DATAOUT0
SGPIO_LOAD
SGPIO_CLOCK
GND
USB2_ESB_DP
USB2_ESB_DN
GND
USB2_ESB_OC_N
NIC1_LINK_LED_N
NIC1_ACT_LED_N
LED_STATUS_AMBER_R1
NIC2_LINK_LED_N
NIC2_ACT_LED_N
LED_STATUS_GREEN_BUF_R1
GND
SMB_PBI_5VSB_DAT
SMB_PBI_5VSB_CLK
GND
V_IO_HSYNC2_BUF_FP
V_IO_VSYNC2_BUF_FP
GND
V_IO_BLUE_CONN_FP
V_IO_GREEN_CONN_FP
V_IO_RED_CONN_FP
GND
LED_FAN6_FAULT
LED_FAN5_FAULT
LED_FAN4_FAULT
FAN_PWM3
GND
PCI_FAN_TACH10
FAN_TACH8
Pin Signal Name
70
PE1_ESB_RX_DN_C2
71
PE1_ESB_RX_DP_C2
72
GND
73
FAN_PRSNT4_N
74
GND
75
PE1_ESB_RX_DN_C1
76
PE1_ESB_RX_DP_C1
77
GND
78
RAID_KEY_PRES
79
GND
80
PE1_ESB_RX_DN_C0
81
PE1_ESB_RX_DP_C0
82
GND
83
FAN_PRSNT1_N
84
FAN_PRSNT3_N
85
FAN_PRSNT2_N
86
GND
87
USB1_ESB_DP
88
USB1_ESB_DN
89
GND
90
USB1_ESB_OC_N
91
USB0_ESB_OC_N
92
GND
93
USB0_ESB_DP
94
USB0_ESB_DN
95
GND
96
FP_NMI_BTN_N
97
BMC_RST_BTN_N
98
FP_PWR_BTN_N
99
FP_ID_SW_L
100 GND
101 SMB_IPMB_5VSB_DAT
102 SMB_IPMB_5VSB_CLK
103 GND
104 LED_HDD_ACTIVITY_N
105 LED_HDD_5V_A
106 FP_PWR_LED_R_N
107 FP_PWR_LED_3VSB
108 FP_ID_LED_R1_N
109 FM_SIO_TEMP_SENSOR
110 LED_FAN3_FAULT
111 LED_FAN2_FAULT
112 LED_FAN1_FAULT
113 FAN_PWM_CPU1
114 GND
115 FAN_PWM_CPU2
116 PCI_FAN_TACH9
117 FAN_TACH7
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Pin
58
59
60
Intel® Server System SR2600UR TPS
Signal Name
FAN_TACH6
FAN_TACH4_H7
FAN_TACH2_H7
Pin Signal Name
118 FAN_TACH5
119 FAN_TACH3_H7
120 FAN_TACH1_H7
Table 26. Midplane Fan Header Pin-outs
Pin
1
2
3
4
5
6
7
8
9
10
J2B1 - FAN_1
Signal Name
FAN_TACH5
FAN_PWM_CPU1
P12V
P12V
FAN_TACH1_H7
GND
GND
FAN_PRSNT1_N
LED_FAN1_FAULT
LED_FAN1
Pin
1
2
3
4
5
6
7
8
9
10
J2B2 - FAN_2
Signal Name
FAN_TACH6
FAN_PWM_CPU1
P12V
P12V
FAN_TACH2_H7
GND
GND
FAN_PRSNT2_N
LED_FAN2_FAULT
LED_FAN2
Pin
1
2
3
4
5
6
7
8
9
10
J2B3 - FAN_3
Signal Name
FAN_TACH7
FAN_PWM_CPU2
P12V
P12V
FAN_TACH3_H7
GND
GND
FAN_PRSNT3_N
LED_FAN3_FAULT
LED_FAN3
Pin
1
2
3
4
5
6
7
8
9
10
J3B1 - FAN_4
Signal Name
FAN_TACH8
FAN_PWM_CPU2
P12V
P12V
FAN_TACH4_H7
GND
GND
FAN_PRSNT4_N
LED_FAN4_FAULT
LED_FAN4
Pin
1
2
3
4
5
6
7
8
9
10
J7B1 - FAN_5
Signal Name
FAN_TACH10
FAN_PWM3
P12V
P12V
FAN_TACH9
GND
GND
FAN_PRSNT5_N
LED_FAN5_FAULT
LED_FAN5
Pin
1
2
3
4
5
6
7
8
9
10
J7B2 - FAN_6
Signal Name
UNUSED
FAN_PWM3
P12V
P12V
FAN_TACH10
GND
GND
FAN_PRSNT6_N
LED_FAN6_FAULT
LED_FAN6
Table 27. Midplane Power Connector Pin-out
Pin
1
2
3
4
5
6
7
8
9
10
Signal Description
GND
GND
P5V
P3V3
GND
P12V
P12V
P12V
P12V
P5V_STBY
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System Board Interconnects
Table 28. Midplane-to-Backplane Card Edge Connector #1 Pin-out
Pin Signal Name
A1
RST_PS_PWRGD
A2
GND
A3
GND
A4
SATA1_RX_N
A5
SATA1_RX_P
A6
GND
A7
GND
A8
SATA1_TX_P
A9
SATA1_TX_N
A10 GND
A11 GND
A12 USB2_ESB_OC_N
A13 GND
A14 GND
A15 SATA3_RX_N
A16 SATA3_RX_P
A17 GND
A18 GND
A19 GND
A20 SATA3_TX_P
A21 SATA3_TX_N
A22 GND
A23 GND
A24 SATA5_RX_N
A25 SATA5_RX_P
A26 GND
A27 GND
A28 SATA5_TX_P
A29 SATA5_TX_N
A30 GND
A31 GND
A32 P5V_STBY
J7A1 - HSBP#1 I/F
Pin Signal Name
B1
GND
B2
SATA0_RX_N
B3
SATA0_RX_P
B4
GND
B5
GND
B6
SATA0_TX_N
B7
SATA0_TX_P
B8
GND
B9
GND
B10 USB2_ESB_DN
B11 USB2_ESB_DP
B12 GND
B13 SATA2_RX_N
B14 SATA2_RX_P
B15 GND
B16 NC_RESERVEDB16
B17 SMB_SAS_EDGE_DAT
B18 NC_RESERVEDB18
B19 SMB_SAS_EDGE_CLK
B20 NC_RESERVEDB20
B21 GND
B22 SATA2_TX_P
B23 SATA2_TX_N
B24 GND
B25 GND
B26 SATA4_RX_N
B27 SATA4_RX_P
B28 GND
B29 GND
B30 SATA4_TX_P
B31 SATA4_TX_N
B32 GND
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Table 29. Midplane-to-Backplane Card Edge Connector #2 Pin-out
Pin Signal Name
A1
SGPIO_DATAOUT0
A2
SGPIO_DATAOUT1
A3
GND
A4
GND
A5
SATA_ADDIN2_RX_N
A6
SATA_ADDIN2_RX_P
A7
GND
A8
GND
A9
SATA_ADDIN2_TX_P
A10 SATA_ADDIN2_TX_N
A11 GND
A12 SMB_PBI_3VSB_DAT
A13 SMB_PBI_3VSB_CLK
A14 USB0_ESB_OC_N
A15 GND
A16 GND
A17 USB0_ESB_DP
A18 USB0_ESB_DN
A19 GND
A20 LED_NIC1_ACT_N
A21 LED_NIC1_LINK_N
A22 FM_SIO_TEMP_SENSOR
A23 LED_NIC2_LINK_N
A24 LED_NIC2_ACT_N
A25 GND
A26 V_BLUE_CONN_FP
A27 V_GREEN_CONN_FP
A28 V_RED_CONN_FP
A29 GND
A30 V_HSYNC2_BUF_FP
A31 V_VSYNC2_BUF_FP
A32 GND
J4A1 - HSBP#2 I/F
Pin Signal Name
B1
SGPIO_CLOCK
B2
GND
B3
SATA_ADDIN1_RX_N
B4
SATA_ADDIN1_RX_P
B5
GND
B6
GND
B7
SATA_ADDIN1_TX_N
B8
SATA_ADDIN1_TX_P
B9
GND
B10 GND
B11 SGPIO_LOAD
B12 SMB_IPMB_5VSB_DAT
B13 SMB_IPMB_5VSB_CLK
B14 GND
B15 USB1_ESB_DP
B16 USB1_ESB_DN
B17 GND
B18 GND
B19 USB1_ESB_OC_N
B20 LED_HDD_ACTIVITY_N
B21 LED_HDD_5V_A
B22 FP_ID_SW_L
B23 BMC_RST_BTN_N
B24 FP_PWR_BTN_N
B25 FP_NMI_BTN_N
B26 FP_PWR_LED_3VSB
B27 FP_PWR_LED_R_N
B28 FP_ID_LED_R1_N
B29 GND
B30 LED_STATUS_AMBER_R1
B31 LED_STATUS_GREEN_BUF_R1
B32 FP_LED
Table 30. Active Midplane SAS RAID Battery Backup Connector Pin-out
Pin
1
2
3
4
5
6
7
8
9
Signal Description
P12V
GND
NC_P5V_MONITOR
GND
P1V8_VBAT_RAID
GND
PWRGD_P3V3_STBY
GND
P1V8_VBAT_RAID
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System Board Interconnects
Pin
10
11
12
13
14
15
16
17
18
19
20
Signal Description
GND
PX_RESET_N
GND
SMB_CLK_P3V3
GND
SMB_DAT_P3V3
BBU_PFAIL_N
BBU_DDR_SEL
BBU_BBE
BBU_BBSTROBE
BBU_BBSTATUS
Table 31. Passive Midplane SATA/SAS Connector Pin-outs
Pin
1
2
3
4
5
6
7
J5A2 - SAS_7
Signal Name
GND
SATA_ADDIN1_TX_P
SATA_ADDIN1_TX_N
GND
SATA_ADDIN1_RX_N
SATA_ADDIN1_RX_P
GND
J6A1 - SAS_6
Pin Signal Name
1
GND
2
SATA5_TX_P
3
SATA5_TX_N
4
GND
5
SATA5_RX_N
6
SATA5_RX_P
7
GND
Pin
1
2
3
4
5
6
7
J5A1- SAS_8
Signal Name
GND
SATA_ADDIN2_TX_P
SATA_ADDIN2_TX_N
GND
SATA_ADDIN2_RX_N
SATA_ADDIN2_RX_P
GND
J6A2 - SAS_5
Signal Name
GND
SATA4_TX_P
SATA4_TX_N
GND
SATA4_RX_N
SATA4_RX_P
GND
Pin
1
2
3
4
5
6
7
Pin
1
2
3
4
5
6
7
J5B1 - SAS_4
Signal Name
GND
SATA3_TX_P
SATA3_TX_N
GND
SATA3_RX_N
SATA3_RX_P
GND
Pin
1
2
3
4
5
6
7
J5B2 - SAS_3
Signal Name
GND
SATA2_TX_P
SATA2_TX_N
GND
SATA2_RX_N
SATA2_RX_P
GND
Revision 1.5
Pin
1
2
3
4
5
6
7
J6B1 - SAS_2
Signal Name
GND
SATA1_TX_P
SATA1_TX_N
GND
SATA1_RX_N
SATA1_RX_P
GND
Pin
1
2
3
4
5
6
7
J6B2 - SAS_1
Signal Name
GND
SATA0_TX_P
SATA0_TX_N
GND
SATA0_RX_N
SATA0_RX_P
GND
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5.2
Intel® Server System SR2600UR TPS
Bridge Board
The system utilizes a bridge board to route signals from the server board to the midplane board.
The bridge board carries signals for three USB ports, SSI front panel control signals, video,
various I2C buses, fan control signals, and a PCI Express* x4 bus for SAS controller function.
For details, see Table 25.
Figure 23. Bridge Board
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5.3
System Board Interconnects
Hot-swap SAS/SATA Backplane
The hot-swap backplane provides support for both SAS and SATA hard drives. There are no
hard drive cables that connect to the backplane. All hard drive control signals are routed from
the midplane board, which plugs directly into the backplane.
A.
Slimline Interposer Card Connector
C.
Control Panel Connector
B.
USB Floppy Connector
D.
SAS/SATA hot-swap Connectors
Figure 24. 3.5-inch Hot-swap SAS/SATA Backplane (Front Side View)
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A.
Power Connector (for Sixth Hard Drive
or SATA Tape Drive)
C.
Power Connector
B.
SAS/SATA Connector (for Sixth Hard
Drive or SATA Tape Drive)
D.
Midplane Connector
Figure 25. 3.5-inch Hot-swap SAS/SATA Backplane (Back Side View)
Table 32. 2x4 SAS/SATA Backplane Power Connector Pin-out (J7L2)
Pin #
1
2
3
4
5
6
7
8
Signal Name
Ground
Ground
P5V
P5V
P12V
P12V
P5V_STBY
P3V3
Table 33. 1x7 Sixth HDD/Tape Drive Option Power Connector Pin-out (J2M1)
Pin #
1
2
3
4
5
6
7
Signal Name
P12V
Ground
Ground
P5V
SASS_PRSTNT_L
LED_SASS_ACT_L
P3V3
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Table 34. Sixth HDD Option SATA/SAS I/O Connector Pin-out (J4L1)
Pin #
1
2
3
4
5
6
7
Signal Name
Ground
SASS_TX_DP
SASS_TX_DN
Ground
SASS_RX_DN
SASS_RX_DP
Ground
Table 35. Slimline Optical Drive Slot Connector (J1A1)
A1
Pin #
Signal Name
P5V
Pin #
B1
Signal Name
GND
A2
P5V
B2
SATA_TXP
A3
P5V
B3
SATA_TXN
A4
P5V
B4
GND
A5
P5V
B5
GND
A6
P5V
B6
SATA_RXN
A7
P5V
B7
SATA_RXP
A8
P5V
B8
GND
A9
P5V
B9
GND
A10
P5V
B10
GND
P5V
B11
A11
KEY
GND
KEY
A12
P5V
B12
GND
A13
P5V
B13
GND
A14
P5V
B14
GND
A15
P5V
B15
GND
A16
P5V
B16
GND
A17
P5V
B17
GND
A18
P5V
B18
GND
2
Table 36. I C Connector (J6L3)
Pin #
1
2
3
4
Signal Description
SMB_VSC_12C_DAT0
GROUND
SMB_VSC_12C_CLK0
Not Used
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Table 37. PCI Express* X4 Slot Connector from Midplane (J4N1)
Pin #
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19
A20
A21
A22
A23
A24
A25
A26
A27
A28
A29
A30
A31
A32
Signal Name
SGPIO_DATA0
SGPIO_DATA1
Ground
Ground
SAS7_RX_DN
SAS7_RX_DP
Ground
Ground
SAS7_TX_DP
SAS7_TX_DN
Ground
SMB_PB1_5VSB_DAT
SMB_PB1_5VSB_CLK
USB_OC1_N
Ground
Ground
USB_P1P
USB_P1N
Ground
LED_NIC1_ACT_L
LED_NIC1_LINK_R_L
FP_THERM_SENSOR
LED_NIC2_LINK_R_L
LED_NIC2_ACT_L
Ground
V_IO_BLUE_CONN_FP
V_IO_GREEN_CONN_FP
V_IO_RED_CONN_FP
Ground
V_IO_HSYNC_BUFF_FP_L
V_IO_VSYNC_BUFF_FP_L
Ground
Pin #
B1
B2
B3
B4
B5
B6
B7
B8
B9
B10
B11
B12
B13
B14
B15
B16
B17
B18
B19
B20
B21
B22
B23
B24
B25
B26
B27
B28
B29
B30
B31
B32
Signal Name
SGPIO_CLOCK
Ground
SAS6_RX_DN
SAS6_RX_DP
Ground
Ground
SAS6_TX_DN
SAS6_TX_DP
Ground
Ground
SGPIO_LOAD
SMB_IPMB_5VSB_DAT
SMB_IPMB_5VSB_CLK
Ground
USB_P2P
USB_P2N
Ground
Ground
USB_OC2_N
LED_HDD_ACT_R_L
PV_HDD_LED_3V_A
FP_ID_SW_L
RST_FP_BTN_L
FP_PWR_BTN_L
FP_NMI_BTN_L
FP_PWR_LED_5VSB
LED_FP_PWR_R_L
LED_FP_ID_R_L
Ground
LED_FP_SYS_FLT1_R_L
LED_FP_SYS_FLT2_R_L
FP_FLT_LED_5VSB
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Table 38. PCI Express* X4 Slot Connector from Midplane (J6N1)
Pin #
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19
A20
A21
A22
A23
A24
A25
A26
A27
A28
A29
A30
A31
A32
Signal Name
RST_PWRGD_PS
Ground
Ground
SAS1_RX_DN
SAS1_RX_DP
Ground
Ground
SAS1_TX_DP
SAS1_TX_DN
Ground
Ground
USB_OC3_N
Ground
Ground
SAS3_RX_DN
SAS3_RX_DP
Ground
Ground
Ground
SAS3_TX_DP
SAS3_RT_DN
Ground
Ground
SAS5_RX_DN
SAS5_RX_DP
Ground
Ground
SAS5_TX_DP
SAS5_TX_DN
Ground
Ground
P5V_STBY
Pin #
B1
B2
B3
B4
B5
B6
B7
B8
B9
B10
B11
B12
B13
B14
B15
B16
B17
B18
B19
B20
B21
B22
B23
B24
B25
B26
B27
B28
B29
B30
B31
B32
Signal Name
Ground
SAS0_RX_DN
SAS0_RX_DP
Ground
Ground
SAS0_TX_DN
SAS0_TX_DP
Ground
Ground
USB_P3N
USB_P3P
Ground
SAS2_RX_DN
SAS2_RX_DP
Ground
Not Used
SMB_SAS_3V3_SDA
Not Used
SMB_SAS_3V3_SCL
Not Used
Ground
SAS2_TX_DP
SAS2_TX_DN
Ground
Ground
SAS4_RX_DN
SAS4_RX_DP
Ground
Ground
SAS4_TX_DP
SAS4_TX_DN
Ground
Table 39. USB Floppy Drive Connector (J2A1)
Pin #
1
2
3
4
Signal Description
P5V_USB_PWR
USB_ICH_P7N
USB_ICH_P7P
Ground
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®
Table 40. Intel Local Control Panel (LCP) Connector (J9A1)
Pin #
1
2
3
4
Signal Description
SMB_IPMB_5VSB_DAT
Ground
SMB_IPMB_5VSB_CLK
P5V_STBY_R
Table 41. Control Panel Slot Connector (J9B1)
B1
Pin #
Signal Name
FP_THERM_SENSOR
Pin #
B2
P5V
A2
V_IO_VSYNCH_BUF_FP
B3
P5V
A3
GND
B4
P5V
A4
V_IO_HSYNCH_BUF_FP
B5
N/C
A5
GND
B6
GND
A6
V_IO_BLUE_CONN_FP
B7
P5V_STBY
A7
GND
B8
GND
A8
V_IO_GREEN_CONN_FP
B9
FP_SLT)LED_3VSB
A9
GND
B10
GND
A10
V_IO_RED_CONN_FP
B11
LED_FP_SYS_FLT1_N
A11
GND
B12
FP_ID_BTN_N
A12
GND
B13
LED_FP_ID_N
A13
FP_RST_BTN_N
B14
SMB_IPMB_5VSB_DAT
A14
GND
B15
SMB_IPMB_5VSB_CLK
A15
N/C
A1
Signal Name
GND
KEY
KEY
B16
GND
A16
GND
B17
LED_NIC1_ACT_N
A17
SMB_SEN_3VSB_DAT
B18
LED_NIC1_LINK_N
A18
SMB_SEN_3VSB_CLK
B19
FP_PWR_BTN_N
A19
GND
B20
FP_PWR_LED_3VSB
A20
FP_NMI_BTN_N
B21
PV_LED_HDD_3V3_A
A21
GND
B22
GND
A22
USB_HUB_DOWN_P2P
B23
GND
A23
USB_HUB_DOWN_P2N
B24
LED_NIC2_ACT_N
A24
GND
B25
LED_NIC2_LINK_N
A25
GND
B26
N/C
A26
P5V_USB_HUB_P2
B27
LED_HDD_ACT_N
A27
P5V_USB_HUB_P1
B28
LED_FP_PWR_N
A28
GND
B29
LED_FP_SYS_FLT2_N
A29
GNd
B30
GND
A30
USB_HUB_DOWN_P1P
B31
GND
A31
USB_HUB_DOWN_P1N
B32
RST_PWRGD_PS
A32
GND
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System Board Interconnects
Table 42. SAS/SATA Hard Drive Connector Pin-outs (J2C3, J2B1, J4C1, J4B1, J7C1)
Pin #
SI
S2
S3
S4
S5
S6
S7
S8
S9
S10
S11
S12
S13
S14
P1
P2
P3
P4
P5
P6
P7
P8
P9
P10
P11
P12
P13
P14
P15
PTH0
PTY1
Signal Description
Ground
SAS#_TX_DP (# = 0…4)
SAS#_TX_DN (# = 0…4)
Ground
SAS#_RX_DN (# = 0…4)
SAS#_RX_DP (# = 0…4)
Ground
Not Used
Not Used
Not Used
Not Used
Not Used
Not Used
Not Used
Not Used
Not Used
Not Used
Ground
Ground
P3V3
P5V
P5V
P5V
Ground
LED_SAS#_ACT_L (# = 0…4)
Ground
P12V
P12V
P12V
Ground
Ground
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Peripheral and Hard Drive Subsystem
6.
Intel® Server System SR2600UR TPS
Peripheral and Hard Drive Subsystem
The system can be configured to support several different hard drive and peripheral
configurations. The peripheral/hard drive subsystem consists of a drive bay supporting a
slimline optical drive, hard drives, and a flex bay; a midplane; and a hot-swap backplane. This
chapter describes the details for each subsystem component.
A.
B.
C.
D.
Slimline SATA Optical Drive Bay
Flex Bay - Sixth Hard Drive (shown), Tape Drive, or two
fixed 2.5-inch Hard Drives (Optional)
System Control Panel
3.5-inch Hard Drive Bays (5)
Figure 26. Optional Sixth Hard Drive (Front View)
6.1
Slimline Drive Bay
The system provides a slimline drive bay that is designed to support a single slimline SATA
optical drive or USB Floppy Drive. For a list of supported drives, use the Server Configurator
Tool available at
http://serverconfigurator.intel.com/default.aspx.
Either drive type is mounted to a tool-less tray that allows for easy installation into and removal
from the system. Once inserted into the system, the assembly locks into place. It is not hotswappable. For removal, the system must be powered down, the system top cover removed
and the locking latch disengaged. For additional details, see the Intel® Server System
SR2600UR/SR2625UR Service Guide.
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Peripheral and Hard Drive Subsystem
Figure 27. Slimline Optical Drive Assembly for 3.5-inch drive System
The SATA Optical drive assembly includes an interposer board which plugs into the back of the
optical drive. The interposer board is a card-edge type card that eliminates the need for cable
connections. As the drive assembly is inserted into the drive bay, the edge connector is blind
mated to a slot connector on the backplane.
The interposer board has two connectors. The first connector is the industry standard 13-pin
SATA interface used by all slimline optical devices. The second connector is the card edge
used to connect directly to the hot-swap backplane board.
Figure 28 Connector to Slimline Optical Device
Table 43. J1L1 Connector to Slimline Optical Device
A1
Pin #
Signal Name
P5V
Pin #
B1
Signal Name
GND
A2
P5V
B2
SATA_TXP
A3
P5V
B3
SATA_TXN
A4
P5V
B4
GND
A5
P5V
B5
GND
A6
P5V
B6
SATA_RXN
A7
P5V
B7
SATA_RXP
A8
P5V
B8
GND
A9
P5V
B9
GND
A10
P5V
B10
GND
A11
P5V
B11
GND
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Intel® Server System SR2600UR TPS
Pin #
6.2
Signal Name
KEY
Pin #
Signal Name
KEY
A12
P5V
B12
GND
A13
P5V
B13
GND
A14
P5V
B14
GND
A15
P5V
B15
GND
A16
P5V
B16
GND
A17
P5V
B17
GND
A18
P5V
B18
GND
Hard Drive Bays
1
The system can be configured to support up to six hot-swap 3.5-inch SAS or SATA hard disk
drives. Hard drives are mounted to hot-swap drive trays for easy insertion to or extraction from
the drive bay.
6.2.1
Hot-swap Drive Carriers
Each hard drive must be mounted to a hot-swap drive carrier, making insertion and extraction of
the drive from the system very simple. Each drive carrier has its own dual-purpose latching
mechanism, which is used to both insert/extract drives from the system and lock the carrier in
place. Each drive tray supports a light pipe that provides a drive status indicator. The light pipe
is located on the backplane and can be viewed from the front of the system.
A.
Hard Drive
B.
Drive Carrier
C.
Side Rail
D.
Mounting Screw
E.
Hard Drive Connector
Figure 29. 3.5-inch Hard Drive Tray Assembly
1 Default Five Hard Drives + one optional Sixth Hard Drive using Flex Bay
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6.3
Peripheral and Hard Drive Subsystem
Optional Tape Drive or Additional Hard Drive Flex Bay
For system configurations that require either a Tape Drive, a sixth 3.5-inch hard disk drive, or
two additional fixed 2.5-inch drives, a multi-purpose drive bay is provided. By default, this drive
bay is covered by one face plate. The bay is located next to the control panel.
Figure 30. Flex Bay
To configure two additional fixed 2.5-inch hard drives, a drive cage is installed in the default
filler panel (Product Order Code – ASR2600FIXDRV). The kit includes one cage supporting two
fixed 2.5-inch drives, four vibration isolators, power and SATA cables, and all required hardware.
Note: The 2.5-inch drives are not hot-swappable and must be cabled to either the server board
or an add-in controller card.
To configure a sixth hard drive, the filler panel is removed and the sixth hard drive accessory kit
is installed (Product Order Code – ASR2500SIXDRV). This kit includes a backplane board
insert, power cable, drive carrier, and upper filler panel.
Figure 31. Optional Sixth Hard Drive (Front View)
To install a 3.5-inch tape drive, the filler panel is removed and the optional tape drive kit is
installed (Product Order Codes – ASR2500SATAPE or ADRTAPEKIT). Both tape drive kits
include tape drive mounting tray and necessary cables.
Note: To remove the tape drive tray from the system, a spring latch located inside the system
on the back right side of the carrier must be released to allow the drive tray to slide free. Do not
attempt to pull out the drive tray without first releasing the spring latch. Doing so may damage
the plastic faceplate.
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Intel® Server System SR2600UR TPS
Figure 32. Optional Tape Drive (Front View)
6.4
Midplane Options
The midplane is the interconnection between the server board and both the hot-swap
backplane and control panel. It is also used to determine which hard drive technology is to be
supported. Two different midplane options are available for this platform: 1) a passive midplane
capable of supporting SATA ports from the server board or SAS using ports from an add-in
card; 2) an active SAS/SATA RAID midplane.
This section describes the hard drive interface support of each of the midplane boards.
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6.4.1
Peripheral and Hard Drive Subsystem
Passive Midplane
The passive midplane is used as an interconnect, routing drive control signals from either the
on-board SATA ports of the server board or SAS/SATA ports from an add-in card to the hotswap backplane. The hard drive controller signals are cabled to the midplane, which then
routes the signals to the hot-swap backplane through two edge connectors that plug directly
into it. For details, see Table 28 and Table 29.
A.
Power Connector
F.
Fan 4 Connector
B.
Fan 6 Connector
G.
Fan 3 Connector
C.
Fan 5 Connector
H.
Fan 1 Connector
D.
SAS/SATA Connectors
I.
Fan 2 Connector
E.
Bridge Board Connector
J.
Backplane Connector
Figure 33. Passive Midplane Board
6.4.2
Active Midplane with SAS/SATA RAID Support
The active midplane is used to provide SAS/SATA RAID support. It has an integrated LSI
LSISAS1078 3 Gb/s RAID On-a-Chip (ROC) device. It provides support for up to six SAS drives
in this system. By default, this midplane option provides software RAID levels 0, 1, and 10 and
utilizes Intel® IT/IR RAID . With the installation of optional RAID enablement devices, the
midplane can support hardware RAID levels 0, 1, 5, 6, 10, 50 and 60. The midplane attaches to
the hot-swap backplane by two card edge connectors, which eliminates the need for any hard
drive cables. The following sub-sections describe the board-level SAS/SATA RAID functionality.
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Intel® Server System SR2600UR TPS
B.
C.
D.
RAID Battery Backup Unit
Connector
Power Connector
Mini-DIMM Connector
Fan 6 Connector
E.
Fan 5 Connector
K.
F.
Bridge Board Connector
L.
A.
G.
Fan 4 Connector
H.
I.
J.
Fan 3 Connector
Fan 1 Connector
Fan 2 Connector
RAID Activation Key
Connector
Backplane Connector
Figure 34. Active Midplane with SAS/SATA RAID Support
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6.4.2.1
Peripheral and Hard Drive Subsystem
Architectural Overview
Figure 35. Architecture Overview
6.4.2.2
x4 PCI Express* Card Edge Interfaces
Two x4 PCI Express* card edges are used to connect the active midplane to the hot-swap
backplane. For details, see Table 28 and Table 29. The use of card edge connectors to the
backplane eliminates all hard drive cabling.
6.4.2.3
LSI LSISAS1078 ROC
The LSI LSISAS1078 ROC supports transfer rates of up to 3 GB/s on each SAS port. It
integrates a high-speed DDR/DDR2 SDRAM interface for Hardware RAID cache. It utilizes a
PCI Express* interface to provide transmission and reception rates of up to 10 GB/s over a x4
link.
6.4.2.4
Optional Hardware RAID Support
The active midplane supports options to provide full hardware RAID support. Options required
to enable hardware RAID support include an Intel® RAID Activation Key (Product Order Code –
AXXRAKSAS2) and installation of a Mini-DIMM for Intel® RAID Cache support. To protect from
data loss during an unexpected power loss event, an Intel® RAID Smart Battery Backup module
(AXXRSBBU3) is also supported. Hardware RAID levels supported include 0, 1, 5, 10, and 50.
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6.4.2.4.1
Intel® Server System SR2600UR TPS
Intel® RAID Activation Key
®
The Intel RAID Activation Key enables the full intelligent SAS Hardware RAID solution. The
activation key plugs directly into a connector (J1A10) on the midplane board. With no RAID
activation key installed, only SAS Software RAID levels 0, 1, and 10 are supported.
6.4.2.4.2
Intel® RAID Cache support
To further enable support for hardware RAID, the active midplane provides a 244-pin miniDIMM connector (J8C1), supporting a single registered ECC non-parity DDR2-400 MHz Mini®
DIMM to provide Intel RAID cache. Supported mini-DIMM capacities range from 128 MB to 1
GB.
Note: For a list of Intel validated mini-DIMMs, use the Server Configurator Tool available at
http://serverconfigurator.intel.com/default.aspx.
6.4.2.4.3
Intel® RAID Smart Battery Backup Module
®
With an Intel RAID Smart Battery Backup module installed, data loss is prevented when data
is still present in the RAID Cache Module and power is unexpectedly lost. Depending on the
cache module capacity used, the battery backup unit can provide 48 to 72 hours of battery
backup power to allow data stored in the RAID cache to be processed. A 2x10 connector (J9A2)
is used to attach the battery backup unit to the midplane. For details, see Table 30.
6.5
Hot-swap SAS/SATA Backplane
The SR2600 system supports its own multifunctional SAS/SATA backplane with the following
features:









Vitesse VSC410 enclosure management controller
o External non-volatile Flash ROM
2
o Four I C interfaces
o Compliance with SCSI Accessed Fault Tolerant Enclosures (SAF-TE)
specification
o Compliance with Intelligent Platform Management Interface (IPMI)
Five 3.5-inch compatible hot-swap hard drive connectors
Designed to support an optional sixth hard drive
Power for an optional tape drive or two additional 2.5-inch SAS/SATA hard drives
Hard Drive Status and Fault LEDs for each hard drive connector
Card edge connectors for most interconnects, including:
o Midplane
o Control Panel
o Slimline SATA Optical Drive
Temperature Sensor
FRU EEPROM
One 2x4-pin Power Connector
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6.5.1
Peripheral and Hard Drive Subsystem
SAS/SATA Backplane Layout
The hot-swap backplane installs on the back side of the hot-swap drive bay inside the system.
Alignment features on the system and backplane assembly make for easy tool-less installation.
For instructions on installing and removing the backplane, see the Intel® Server System
SR2600UR/SR2625UR Service Guide. The following diagram shows the layout of components
and connectors found on the board.
A.
Slimline interposer Card Connector
C.
Control Panel Connector
B.
Slimline USB Floppy Connector
D.
SAS/SATA Hot-swap Connectors
Figure 36. Hot-swap SAS/SATA Backplane (Front Side View)
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Intel® Server System SR2600UR TPS
A.
Power Connector (for sixth Hard Drive
or Tape Drive or 2.5-inch fixed drives)
C.
Power Connector
B.
SAS/SATA Connector (for sixth Hard
Drive or SATA Tape Drive)
D.
Midplane Connectors
Figure 37. Hot-swap SAS/SATA Backplane (Back Side View)
Note: To prevent the backplane from flexing when installing or removing hard drives from the
drive bay, make sure the midplane is securely fastened and the system top cover is in place.
Make sure all system boards, peripherals, and cables are detached from the backplane before
removing the backplane from the system. Failure to detach components from the backplane
before removal may result in component damage.
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6.5.2
Peripheral and Hard Drive Subsystem
SAS/SATA Backplane Functional Architecture
The following figure shows the functional blocks of the SAS/SATA backplane.
Figure 38. SAS/SATA Backplane Functional Block Diagram
6.5.2.1
Enclosure Management Controller
The backplane utilizes the features of the Vitesse VSC410 to implement several enclosure
management functions. The chip provides in-band SAF-TE and SES management, and utilizes
the following four I2C interfaces:
1.
2.
3.
4.
I2C bus 0 is connected to an EEPROM, which stores configuration and FRU data.
2
I C bus 1 is connected to an LM75 temperature sensor.
2
I C bus 2 is connected to an IPMB bus from the server board.
2
I C bus 3 is connected to an active midplane SAS controller.
6.5.2.2
Hard Drive Activity and Fault LEDs
The backplanes support an activity/fault LED for each of the hard drive connectors. The LED
illuminates green for activity or amber for a drive fault. The green activity LED is driven by the
SAS/SATA hard disk drive directly. The amber fault LED is driven by the VSC410 management
controller whenever a fault condition is detected. When the drive is used in a RAID
configuration, the RAID controller has control over the fault LED and it may exhibit different
behavior.
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Table 44. Hard Drive LED Function Definitions
Status LED
Green
Definition
HDD Activity
Amber
HDD Fail
The activity LED functionality is controlled directly by the hard drives. This causes the LED to
function differently between SAS and SATA drives. The expected operation is outlined in the
following table.
Table 45. Hard Drive Activity LED Functionality
Condition
Power on with no drive activity
Power on with drive activity
Power on and drive spun down
Power on and drive spinning up
6.5.2.3
Drive Type
SAS
Behavior
Ready LED stays on
SATA
Ready LED stays off
SAS
Ready LED blinks off when processing a command
SATA
Ready LED blinks on when processing a command
SAS
Ready LED stays off
SATA
Ready LED stays off
SAS
Ready LED blinks
SATA
Ready LED stays off
Optional Sixth Hard Drive
The SR2600 is capable of supporting a sixth hot-swap SAS/SATA hard drive with the addition
of an optionally installed backplane add-in board. The sixth drive add-in board assembly
consists of a PCB with power and interface connectors, and a mounting bracket. This allows the
add-in card to slide into a fitted cutout on the existing backplane.
6.5.2.4
Optional Two 2.5-inch Hard Drives
The SR2600 is capable of supporting two additional 2.5-inch non-hot-swap SAS/SATA hard
drives with the addition of an optionally installed drive cage and cables. The 2.5-inch fixed drive
assembly is installed in the default filler panel and consists of a hard drive cage, all required
mounting hardware, and all required cabling.
6.6
Enclosure Management Cabling for Passive Midplane
When using a rack-optimized system with a passive backplane or midplane and an add-in RAID
card, you must install an additional 3-pin cable between the RAID card and the backplane or
midplane to enable fault LED control. The cable is included with your integrated system or the
backplane or midplane kit.
In Intel Server System SR2600URBRP, the 3-pin white HBA CONN connector on the passive
midplane should be used.
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Peripheral and Hard Drive Subsystem
IMPORTANT: No cable is required for fault LED control when using the on-board SAS or SATA
RAID controller. No cable is required for fault LED control when using an active backplane or
midplane. In these configurations, connecting a 3-pin I2C cable to the backplane or midplane
may cause unexpected system behavior.
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7.
Intel® Server System SR2600UR TPS
Standard Control Panel
The standard control panel supports several push buttons, status LEDs, USB and video ports to
centralize system control, monitoring, and accessibility within a common compact design.
The control panel assembly comes pre-assembled and is modular in design. The control panel
assembly module slides into a slot on the front of the system and is blind mated with a slot
connector on the backplane. It is not hot-swappable.
Control panels from previous server generations are not compatible with the SR2600 system.
Figure 39. Standard Control Panel Assembly Module
7.1
Control Panel Buttons
The standard control panel assembly houses several system control buttons. The function of
each control button is listed in the following table.
Figure 40. Control Panel Buttons
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Table 46. Control Button and Intrusion Switch Functions
Reference
A
B
C
Reset
Button
NMI Button
D
7.2
Feature
Power/Sleep
Button
ID Button
Function
Toggles the system power on/off. This button also functions as a Sleep
Button if enabled by an ACPI-compliant operating system.
Toggles the front panel ID LED and the server board ID LED on/off. The
server board ID LED is visible through the rear of the system and allows for
server identification and location when working behind a rack of servers.
Reboots and initializes the system.
When the NMI button is pressed with a paper clip or pin, it puts the server
in a halt state for diagnostic purposes and allows the issuance of a
non-maskable interrupt. After issuing the interrupt, a memory download can
be performed to determine the cause of the problem.
Control Panel LED Indicators
The control panel houses six LEDs to display the system’s operating state. The LEDs are
visible with or without the front bezel.
Figure 41. Control Panel LEDs
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The following table identifies each LED and describes its functionality.
Table 47. Control Panel LED Functions
LED
NIC1/NIC2
Activity
Power/Sleep
(on standby power)
Color
Green
Disk Activity
System
Identification
Blink
NIC Activity
Legacy power-on/ACPI S0 state
Blink
1,4
Off
Running/normal operation
Blink
1,2
On
Amber
Sleep/ACPI S1 state
Power-off/ACPI S4 or S5 state
On
Green
Description
NIC Link
On
Green
Off
System Status
(on standby power)
State
On
Degraded
Critical or non-recoverable condition.
Blink
1,2
Off
Off
Green
Random blink
Non-critical condition.
POST/system stop.
3
Provides an indicator for disk activity.
Off
Off
Blue
On
Identify active via command or button.
No hard disk activity
Off
Off
No Identification.
Notes:
1.
Blink rate is ~1 Hz at 50% duty cycle.
2.
The amber status takes precedence over the green status. When the amber LED is on or blinking,
the green LED is off.
3.
Off when the system is powered off (S4/S5) or in a sleep state (S1).
4.
The power LED sleep indication is maintained on standby by the chipset. If the system is powered
down without going through the BIOS, the LED state that is in effect at the time of power-off is restored
when the system is powered on until the BIOS clears it. If the system is not powered down normally, it is
possible that the Power LED is blinking while the system status LED is off. This is due to a failure or
configuration change that prevents the BIOS from running.
The current limiting resistors for the power LED, the system fault LED, and the NIC LEDs are
located on the server board.
7.2.1
Power/Sleep LED
Table 48. SSI Power LED Operation
State
Power-off
Power-on
S5
Power Mode
Non-ACPI
Non-ACPI
ACPI
Off
On
Off
LED
S4
ACPI
Off
S3-S1
ACPI
Slow blink
S0
ACPI
Steady on
1
Description
System power is off, and the BIOS has not initialized the chipset.
System power is on, but the BIOS has not yet initialized the chipset.
Mechanical is off, and the operating system has not saved any
context to the hard disk.
Mechanical is off. The operating system has saved context to the
hard disk.
DC power is still on. The operating system has saved context and
gone into a level of low-power state.
System and the operating system are up and running.
Note:
1.
Blink rate is ~ 1Hz at 50% duty cycle.
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7.2.2
Standard Control Panel
System Status LED
Table 49. Control Panel LED Operation
Color
Off
State
N/A
Criticality
Not ready
AC power off
Description
Green
Solid on
Ok
System booted and ready
Green
Blink
Degraded
System degraded
Including, but not limited to:
 Unable to use all of the installed memory (more than one
DIMM installed).
 Correctable errors over a threshold of 10 and migrating to a
spare DIMM (memory sparing). This indicates that the user no
longer has spare DIMMs specifying a redundancy lost
condition. The corresponding DIMM LED should light up.
 In a mirrored configuration, when memory mirroring takes
place and system loses memory redundancy. This is not
covered by the second bullet above.
 Redundancy loss such as power supply or fan. This does not
apply to non-redundant subsystems.
 PCI Express* link errors
 CPU failure/disabled – if there are two processors and one of
them fails
 Fan alarm – Fan failure. Number of operational fans should be
more than the minimum number needed to cool the system
 Non-critical threshold crossed – temperature and voltage
Amber
Blink
Non-critical
Non-fatal alarm – system is likely to fail
Including, but not limited to:
 Critical voltage threshold crossed
 VRD hot asserted
 Minimum number of fans to cool the system are not present or
have failed
 In non-sparing and non-mirroring mode if the threshold of ten
correctable errors is crossed within the window
Amber
Solid on
Critical, nonrecoverable
Fatal alarm – system has failed or shut down
Including, but not limited to:
 DIMM failure when there is one DIMM present and no good
memory is present
 Run-time memory uncorrectable error in non-redundant mode
 IERR signal asserted
 Processor 1 missing
 Temperature (e.g., CPU ThermTrip, memory TempHi, critical
threshold crossed)
 No power good – power fault
 Processor configuration error (e.g., processor stepping
mismatch)
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7.2.3
Intel® Server System SR2600UR TPS
Drive Activity LED
The drive activity LED on the front panel indicates drive activity from the on-board hard disk
controllers. The Intel® Server Board S5520UR also provides a header giving access to this LED
for add-in controllers.
7.2.4
System Identification LED
The blue system identification LED is used to help identify a system for servicing. This is
especially useful when the system is installed in a high-density rack or cabinet that is populated
with several similar systems.
The blue system ID LED can be illuminated using one of the following mechanisms:


7.3
By pressing the system ID button on the system control panel, the ID LED displays a
solid blue color until the button is pressed again.
By issuing the appropriate hex IPMI system identify value, the ID LED either blinks blue
for 15 seconds and turns off or blinks indefinitely until the appropriate hex IPMI system
identify value is issued to turn it off.
Control Panel Connectors
The control panel has two external I/O connectors:

One USB port
 One VGA video port
The following tables provide the pin-outs for each connector.
Table 50. External USB Connectors (J1B1)
Pin #
1
2
3
4
5
6
7
Description
PWR_FP_USB2
USB_DN2_FP_R
USB_DP2_FP_R
GND
GND
GND
GND
Table 51. Video Connector (J1A1)
Description
VGA_RED
VGA_GREEN
VGA_BLUE
Unused
GND
GND
VGA_INUSE_L
GND
Pin #
1
2
3
4
5
6
7
8
Pin #
9
10
11
12
13
14
15
16
17
Description
GND
GND
Unused
VGA_DDCDAT
VGA_HSYNC_L
VGA_VSYNC_L
VGA_DDCCLK
GND
GND
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Standard Control Panel
If a monitor is connected to the control panel video connector, the rear video port on the server
board is disabled and the control panel video is enabled. The video source is the same for both
connectors and is switched between the two, with the rear video having priority over the control
panel. This provides easy front access to the server.
7.4
Internal Control Panel Interconnect
All control panel signals are directed through a single 64-pin card edge connector eliminating
the need for any cables. When installed into the system control panel bay, the control panel
card edge connector is blind mated with a slot connector on the backplane.
Figure 42. Standard Control Panel PCB
Revision 1.5
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The following table defines the pin-out for the 64-pin edge connector.
Table 52. 64-pin Control Panel Connector (J6B1)
Pin Signal Name
A1
GND
A2
VGA_VSYNC_FP_L
A3
GND
A4
VGA_HSYNC_FP_L
A5
GND
A6
VGA_BLUE_FP
A7
GND
A8
VGA_GREEN_FP
A9
GND
A10 VGA_RED_FP
A11 GND
A12 GND
A13 FP_RST_BTN_L
A14 GND
A15 NC_FP_CHASSIS_L
A16 GND
A17 BP_I2C_5V_SDA
A18 BP_I2C_5V_SCL
A19 GND
A20 FP_NMI_BTN_L
A21 GND
A22 USB_DP2_FP
A23 USB_DN2_FP
A24 GND
A25 GND
A26 PWR_FP_USB2
A27 PWR_FP_USB3
A28 GND
A29 GND
A30 USB_DP3_FP
A31 USB_DN3_FP
A32 GND
Pin Signal Name
B1
1_WIRE_BUS
B2
P5V
B3
P5V
B4
P5V
B5
VGA_INUSE_L
B6
GND
B7
P5V_STBY
B8
GND
B9
FAULT_LED_5VSB
B10 GND
B11 FP_SYS_FLT_LED1_R_L
B12 FP_ID_SW_L
B13 FP_ID_LED_R_L
B14 NC_IPMB_5VSB_SDA
B15 NC_IPMB_5VSB_SCL
B16 GND
B17 NIC1_ACT_LED_L
B18 NIC1_LINK_LED_R_L
B19 FP_PWR_BTN_L
B20 PWR_LED_5VSB
B21 HDD_LED_P3V3_A
B22 GND
B23 GND
B24 NIC2_ACT_LED_L
B25 NIC2_LINK_LED_R_L
B26 HDD_FAULT_LED_R_L
B27 HDD_LED_ACT_R_L
B28 FP_PWR_LED_R_L
B29 FP_SYS_FLT_LED2_R_L
B30 GND
B31 GND
B32 NC_RST_P6_PWRGOOD
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8.
Intel® Local Control Panel
Intel® Local Control Panel
The Intel® Local Control Panel utilizes a combination of control buttons, LEDs, and LCD display
to provide system accessibility, monitoring, and control functions. The pre-assembled module
slides into a slot on the front of the system where a card edge connector is blind mated to a
matching slot edge connector on the backplane eliminating any cable attachments. The Intel®
Local Control Panel module is designed so that it can be adjusted for use with or without an
outer front bezel.
®
Figure 43. Intel Local Control Panel Assembly Module
The following diagram provides an overview of the control panel features.
A.
B.
C.
D.
E.
F.
G.
H.
USB 1.1 Port
LCD Display
LCD Menu Control Button – Up
LCD Menu Control Button – Down
LCD Menu Control Button – Previous Option
LCD Menu Control Button – Enter
ID LED
Power LED
I.
J.
K.
L.
M.
N.
O.
System Power Button
System Status LED
NIC 2 Activity LED
NIC 1 Activity LED
Hard Drive Activity LED
System Reset Button
USB 1.1 Port
®
Figure 44. Intel Local Control Panel Overview
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8.1
Intel® Server System SR2600UR TPS
LED Functionality
The following table identifies each LED and describes its functionality.
Table 53. Control Panel LED Functions
LED
NIC1/NIC2
Activity
Color
Green
On
NIC Link
Green
Blink
NIC Activity
Green
On
Power/Sleep
(on standby power)
System Status
(on standby power)
State
Legacy power-on/ACPI S0 state
Blink
Off
Off
Green
On
System
Identification
Sleep/ACPI S1 state
Running/normal operation
1,2
On
Degraded
Critical or non-recoverable condition.
Blink
Disk Activity
1,4
Power-off/ACPI S4 or S5 state
Blink
Amber
Description
1,2
Off
Off
Green
Random blink
Non-critical condition.
POST/system stop.
3
Provides an indicator for disk activity.
Off
Off
Blue
On
No hard disk activity
Identify active via command or button.
Off
Off
No Identification.
Notes:
1.
Blink rate is ~1 Hz at 50% duty cycle.
2.
The amber status takes precedence over the green status. When the amber LED is on or blinking,
the green LED is off.
3.
Off when the system is powered off (S4/S5) or in a sleep state (S1).
4.
The power LED sleep indication is maintained on standby by the chipset. If the system is powered
down without going through the BIOS, the LED state that is in effect at the time of power-off is restored
when the system is powered on until the BIOS clears it. If the system is not powered down normally, it is
possible that the Power LED is blinking while the system status LED is off. This is due to a failure or
configuration change that prevents the BIOS from running.
The current limiting resistors for the power LED, the system fault LED, and the NIC LEDs are
located on the Intel® Server Board S5520UR.
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8.1.1
Intel® Local Control Panel
Power/Sleep LED
Table 54. SSI Power LED Operation
State
Power-off
Power-on
S5
Power Mode
Non-ACPI
Non-ACPI
ACPI
Off
On
Off
LED
S4
ACPI
Off
S3-S1
ACPI
Slow blink
S0
ACPI
Steady on
1
Description
System power is off, and the BIOS has not initialized the chipset.
System power is on, but the BIOS has not yet initialized the chipset.
Mechanical is off, and the operating system has not saved any
context to the hard disk.
Mechanical is off, and the operating system has saved context to the
hard disk.
DC power is still on, and the operating system has saved context and
gone into a level of low-power state.
System and the operating system are up and running.
Note: Blink rate is ~ 1Hz at 50% duty cycle.
8.1.2
System Status LED
Table 55. Control Panel LED Operation
Color
Off
State
Not
applicable
Criticality
Not ready
AC power off
Description
Green
Solid on
Ok
System booted and ready
Green
Blink
Degraded
System degraded
Including, but not limited to:
 Unable to use all of the installed memory (more than one
DIMM installed).
 Correctable errors over a threshold of 10 and migrating to a
spare DIMM (memory sparing). This indicates that the user no
longer has spare DIMMs indicating a redundancy lost
condition. Corresponding DIMM LED should light up.
 In a mirrored configuration, when memory mirroring takes
place and system loses memory redundancy. This is not
covered by the second bullet above.
 Redundancy loss such as power supply or fan. This does not
apply to non-redundant subsystems.
 PCI Express* link errors
 CPU failure/disabled – if there are two processors and one of
them fails
 Fan alarm – Fan failure. Number of operational fans should be
more than the minimum number needed to cool the system
 Non-critical threshold crossed – temperature and voltage
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Color
Amber
State
Blink
Criticality
Non-critical
Description
Non-fatal alarm – system is likely to fail
Including, but not limited to:
 Critical voltage threshold crossed
 VRD hot asserted
 Minimum number of fans necessary to cool the system are not
present or have failed
 In non-sparing and non-mirroring mode if the threshold of ten
correctable errors is crossed within the window
Amber
Solid on
Critical, nonrecoverable
Fatal alarm – system has failed or shut down
Including, but not limited to:
 DIMM failure when there is one DIMM present, no good
memory present
 Run-time memory uncorrectable error in non-redundant mode
 IERR signal asserted
 Processor 1 missing
 Temperature (e.g., CPU ThermTrip, memory TempHi, critical
threshold crossed)
 No power good – power fault
 Processor configuration error (e.g., processor stepping
mismatch)
8.1.3
Drive Activity LED
The drive activity LED on the front panel indicates drive activity from the on-board hard disk
controllers. The Intel® Server Board S5520UR also provides a header giving access to this LED
for add-in controllers.
8.1.4
System Identification LED
The blue system identification LED is used to help identify a system for servicing. This is
especially useful when the system is installed in a high-density rack or cabinet that is populated
with several similar systems.
The blue system ID LED can be illuminated using one of the following mechanisms:
-
By pressing the system ID button on the system control panel, the ID LED displays a
solid blue color until the button is pressed again.
-
By issuing the appropriate hex IPMI system identify value, the ID LED either blinks blue
for 15 seconds and turns off or blinks indefinitely until the appropriate hex IPMI system
identify value is issued to turn it off.
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8.2
Intel® Local Control Panel
Intel® Local Control Panel Interconnects
®
The Intel Local Control Panel module includes the control panel interface board and an
interposer board. Connectors on the control panel interface board are cabled to matching
connectors on the interposer board. When the pre-assembled control panel module is installed
into the system, a card edge connector on the interposer card is blind mated with a slot edge
connector on the backplane. This section defines the pin-out for each connector and header
found on both the control panel interface board and interposer board.

A 64-pin card edge connector on the interposer board is used to route signals to/from
the backplane to the control panel interface board. The backplane is used as a conduit
for communication to the server board.
 Signals from the card edge connector are routed to the control panel interface board
through matching 50-pin connectors on the interposer board and control panel interface
board. The 50-pin connectors are attached using a small 50-pin flat cable.
 USB signals from the card edge connector are routed to the control panel interface
board through matching 10-pin connectors on the interposer board and control panel
interface board. The 10-pin connectors are attached using a small 10-pin round cable.
 A 4-pin IPMI header (not used).
 A 4-pin NMI/Temp Sensor header.
The following tables provide the pin-outs for each connector.
Table 56. 50-pin Control Panel Connector
Pin Signal Name
A1
GND
A2
VGA_VSYNC_FP_L
A3
GND
A4
VGA_HSYNC_FP_L
A5
GND
A6
VGA_BLUE_FP
A7
GND
A8
VGA_GREEN_FP
A9
GND
A10 VGA_RED_FP
A11 GND
A12 GND
A13 FP_RST_BTN_L
A14 GND
A15 NC_FP_CHASSIS_L
A16 GND
A17 BP_I2C_5V_SDA
A18 BP_I2C_5V_SCL
A19 GND
A20 FP_NMI_BTN_L
A21 GND
A22 USB_DP2_FP
A23 USB_DN2_FP
Pin Signal Name
B1
1_WIRE_BUS
B2
P5V
B3
P5V
B4
P5V
B5
VGA_INUSE_L
B6
GND
B7
P5V_STBY
B8
GND
B9
FAULT_LED_5VSB
B10 GND
B11 FP_SYS_FLT_LED1_R_L
B12 FP_ID_SW_L
B13 FP_ID_LED_R_L
B14 NC_IPMB_5VSB_SDA
B15 NC_IPMB_5VSB_SCL
B16 GND
B17 NIC1_ACT_LED_L
B18 NIC1_LINK_LED_R_L
B19 FP_PWR_BTN_L
B20 PWR_LED_5VSB
B21 HDD_LED_P3V3_A
B22 GND
B23 GND
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Pin Signal Name
A24 GND
A25 GND
A26 PWR_FP_USB2
A27 PWR_FP_USB3
A28 GND
A29 GND
A30 USB_DP3_FP
A31 USB_DN3_FP
A32 GND
Pin Signal Name
B24 NIC2_ACT_LED_L
B25 NIC2_LINK_LED_R_L
B26 HDD_FAULT_LED_R_L
B27 HDD_LED_ACT_R_L
B28 FP_PWR_LED_R_L
B29 FP_SYS_FLT_LED2_R_L
B30 GND
B31 GND
B32 NC_RST_P6_PWRGOOD
Table 57. Internal USB Header
Pin #
1
2
3
4
5
6
7
8
9
10
Description
PWR_FP_USB2
PWR_FP_USB3
USB_DP2_FP
USB_DN2_FP
USB_DP3_FP
USB_DN3_FP
GND
GND
TP_USB0_P9
TP_USB0_P10
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9.
PCI Riser Cards and Assembly
PCI Riser Cards and Assembly
The system supports different riser card options depending on the add-in card configuration
desired. The riser assembly for the system is tool-less. Standoffs on the bracket allow the riser
cards to slide onto the assembly where a latching mechanism secures each riser in place.
Holding down the latch releases the risers for easy removal.
Figure 45. 2U Riser Assembly
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When re-inserting the riser assembly into the system, tabs on the back of the assembly should
be aligned with slots on the back edge of the system. The tabs fit into the slots securing the
riser assembly to the system when the top cover is in place. For additional information, see the
Intel® Server System SR2600UR/SR2625UR Service Guide.
Figure 46. 2U PCI Express* Passive Riser
9.1
Riser Card Options
The Intel® Server Board S5520UR has one riser slot capable of supporting riser cards for both
1U and 2U system configurations. The riser slot (J4E1) implements Intel® Adaptive Slot
Technology. This 280-pin connector is capable of supporting riser cards that meet either the
PCI-X or PCI Express* technology specifications. Some risers can support both full-height and
low-profile add-in cards by using a ‘butterfly’ configuration.
The following table identifies the card configurations and the connector types used.
Table 58. Riser Card Options
Riser Card Option
2U PCI Express* Passive Riser
(Product Order Code – ASR26XXFHR)
2U Butterfly PCI Express*/PCI-X Active Riser
(Product Order Code – ASR26XXFHXR)
2U Butterfly PCI Express* Active Riser
(Product Order Code – ASR26XXFHLPR)
2U PCI-X Active Riser
(Product Order Code – ASR26XX____)
Slot Configuration
Three full-height PCI Express* connectors
Two full-height PCI-X 133 connectors
One full-height PCI Express* connector
Two low-profile PCI Express* connectors
Three full-height PCI Express* connectors
Two low-profile PCI Express* connectors
One Full Height PCI-X 133Mhz connector
Two Full Height PCI-X 100Mhz connectors
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PCI Riser Cards and Assembly
Note: All PCI Express* add-in cards run at x8 speeds independent of population. The PCI
Express* x16 connectors utilize a x8 electrical connection.
9.2
PCI Riser Card Mechanical Drawings
Figure 47. 2U PCI Express* Passive Riser – Primary Side
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Figure 48. 2U PCI Express* Passive Riser – Secondary Side
Figure 49. 2U Butterfly PCI-X/PCI Express* Active Riser – Primary Side
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PCI Riser Cards and Assembly
Figure 50. 2U Butterfly PCI-X/PCI Express* Active Riser – Secondary Side
Figure 51. 2U Butterfly PCI Express* Active Riser – Primary Side
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Figure 52. 2U Butterfly PCI Express* Active Riser – Secondary Side
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Environmental Specifications
10. Environmental Specifications
10.1 System Level Environmental Limits
The following table defines the system level operating and non-operating environmental limits.
Table 59. System Environmental Limits Summary
Parameter
Operating Temperature
Non-Operating
Temperature
Non-Operating Humidity
Acoustic noise
Shock, operating
Shock, unpackaged
Shock, packaged
Vibration, unpackaged
Shock, operating
ESD
System Cooling
Requirement in BTU/Hr
Limits
+10°C to +35°C with the maximum rate of change not to exceed 10°C per hour
-40°C to +70°C
90%, non-condensing at 35°C
Sound power: 7.0 BA in an idle state at typical office ambient temperature. (23
+/- 2 degrees C)
Half sine, 2 g peak, 11 milliseconds
Trapezoidal, 25 g, velocity change 136 inches/second (≧40 lbs to < 80 lbs)
Non-palletized free fall in height 24 inches (≧40 lbs to < 80 lbs)
5 Hz to 500 Hz, 2.20 g RMS random
Half sine, 2 g peak, 11 milliseconds
+/-15 KV except I/O port +/- 8 KV per Intel® Environmental test specification
2550 BTU/hour
10.2 Serviceability and Availability
The system is designed to be serviced by qualified technical personnel only.
The desired Mean Time To Repair (MTTR) of the system is 30 minutes, including diagnosis of
the system problem. To meet this goal, the system enclosure and hardware have been
designed to minimize the MTTR.
The following table defines the maximum time needed by a trained field service technician to
perform the listed system maintenance procedures, after diagnosing the system and identifying
the failed component.
Table 60. Time Estimate for System Maintenance Procedures
Activity
Remove cover
Remove and replace hard disk drive
Remove and replace power supply module
Remove and replace system fan
Remove and replace backplane board
Remove and replace control panel module
Remove and replace server board
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Time Estimate
1 min
2 min
1 min
2 min
6 min
1 min
8 min
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10.3 Replacing the Backup Battery
The lithium battery on the server board powers the real time clock (RTC) for up to 10 years in
the absence of power. When the battery starts to weaken, it loses voltage, and the server
settings stored in CMOS RAM in the RTC (e.g., the date and time) may be wrong. Contact your
customer service representative or dealer for a list of approved devices.
WARNING
Danger of explosion if batter y is incor r ectly r eplaced. Replace only with
the same or equivalent type r ecommended by the equipment
manufactur er . Discar d used batter ies accor ding to manufactur er ’s
instr uctions.
ADVARSEL!
Lithiumbatter i - Eksplosionsfar e ved fejlagtig håndter ing. Udskiftning
må kun ske med batter i af samme fabr ikat og type. Levér det br ugte
batter i tilbage til lever andør en.
ADVARSEL
Lithiumbatter i - Eksplosjonsfar e. Ved utskifting benyttes kun batter i
som anbefalt av appar atfabr ikanten. Br ukt batter i r etur ner es
appar atlever andør en.
VARNING
Explosionsfar a vid felaktigt batter ibyte. Använd samma batter ityp eller
en ekvivalent typ som r ekommender as av appar attillver kar en. Kasser a
använt batter i enligt fabr ikantens instr uktion.
VAROITUS
Par isto voi r äjähtää, jos se on vir heellisesti asennettu. Vaihda par isto
ainoastaan laitevalmistajan suosittelemaan tyyppiin. Hävitä käytetty
par isto valmistajan ohjeiden mukaisesti.
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Regulatory and Certification Information
11. Regulatory and Certification Information
WARNING
To ensure regulatory compliance, you must adhere to the assembly instructions in this
document to ensure and maintain compliance with existing product certifications and approvals.
Use only the described, regulated components specified in this document. Use of other
products/components will void the UL listing and other regulatory approvals of the product and
will most likely result in noncompliance with product regulations in the region(s) in which the
product is sold.
To help ensure EMC compliance with your local regional rules and regulations, before computer
integration, make sure that the chassis, power supply, and other modules have passed EMC
testing using a server board with a microprocessor from the same family (or higher) and
operating at the same (or higher) speed as the microprocessor used on this server board. The
final configuration of your end system product may require additional EMC compliance testing.
For more information please contact your local Intel Representative.
This is an FCC Class A device. Integration of it into a Class B chassis does not result in a Class
B device.
11.1 Product Regulatory Compliance
The server chassis product, when correctly integrated per this document, complies with the
following safety and electromagnetic compatibility (EMC) regulations.
Intended Application – This product was evaluated as Information Technology Equipment
(ITE), which may be installed in offices, schools, computer rooms, and similar commercial type
locations. The suitability of this product for other product categories and environments (such as
medical, industrial, telecommunications, NEBS, residential, alarm systems, test equipment,
etc.), other than an ITE application, may require further evaluation.
11.1.1










Product Safety Compliance
UL60950 – CSA 60950(USA/Canada)
EN60950 (Europe)
IEC60950 (International)
CB Certificate & Report, IEC60950 (report to include all country national deviations)
GS Certification (Germany)
GOST R 50377-92 - Certification (Russia)
Belarus Certification (Belarus)
Ukraine Certification (Ukraine)
CE - Low Voltage Directive 73/23/EEE (Europe)
IRAM Certification (Argentina)
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11.1.2














11.1.3
Intel® Server System SR2600UR TPS
Product EMC Compliance – Class A Compliance
FCC /ICES-003 - Emissions (USA/Canada) Verification
CISPR 22 – Emissions (International)
EN55022 - Emissions (Europe)
EN55024 - Immunity (Europe)
EN61000-3-2 - Harmonics (Europe)
EN61000-3-3 - Voltage Flicker (Europe)
CE – EMC Directive 89/336/EEC (Europe)
VCCI Emissions (Japan)
AS/NZS 3548 Emissions (Australia/New Zealand)
BSMI CNS13438 Emissions (Taiwan)
GOST R 29216-91 Emissions (Russia)
GOST R 50628-95 Immunity (Russia)
Belarus Certification (Belarus)
Ukraine Certification (Ukraine)
KCC Certification (EMI) (Korea)
Product Ecology Compliance
Intel has a system in place to restrict the use of banned substances in accordance with world
wide regulatory requirements. A Material Declaration Data Sheet is available for Intel products.
For more reference on material restrictions and compliance you can view Intel’s Environmental
Product Content Specification at http://supplier.intel.com/ehs/environmental.htm.





11.1.4






Europe - European Directive 2002/95/EC Restriction of Hazardous Substances (RoHS) Threshold limits and banned substances
are noted below.
Quantity limit of 0.1% by mass (1000 PPM) for:
Lead, Mercury, Hexavalent Chromium, Polybrominated Biphenyls Diphenyl Ethers
(PBB/PBDE)
Quantity limit of 0.01% by mass (100 PPM) for:
Cadmium
California Code of Regulations, Title 22, Division 4.5, Chapter 33:
Best Management Practices for Perchlorate Materials
China – Restriction of Hazardous Substances (China RoHS)
WEEE Directive (Europe)
Packaging Directive (Europe)
Certifications/Registrations/Declarations
NRTL Certification (US/Canada)
CE Declaration of Conformity (CENELEC Europe)
FCC/ICES-003 Class A Attestation (USA/Canada)
VCCI Certification (Japan)
C-Tick Declaration of Conformity (Australia)
MED Declaration of Conformity (New Zealand)
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







Regulatory and Certification Information
BSMI Certification (Taiwan)
GOST R Certification/Certification (Russia)
Belarus Certification/Certification (Belarus)
KCC Certification (Korea)
IRAM Certification (Argentina)
Ecology Declaration (International)
China RoHS Environmental Friendly Use Period
Packaging & Product Recycling Marks
11.2 Product Regulatory Compliance Markings
This Intel Server Chassis product if provided with the following regulatory and safety markings.
In the event there is no room for a marking(s) on the chassis, the information is provided here in
this document.
Regulatory Compliance
cULus Listing Marks
Country
USA/Canada
GS Mark
Germany
CE Mark
Europe
FCC Marking (Class A)
USA
EMC Marking (Class A)
Canada
VCCI Marking (Class A)
Japan
BSMI Certification
Number & Class A
Warning
Taiwan
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Marking
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Regulatory Compliance
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Country
GOST R Marking
Russia
KCC Mark (Korean
Communications
Comission)
Korea
Belarus Safety
Compliance Mark
Belarus
Waste of Electronic and
Electrical Equipment
Recycling Mark
Europe
China Restriction of
Hazardous Substance
Environmental Friendly
Use Period Mark
China
China Recycling Mark
China
Recycling Marks
International
Battery Perchlorate
Warning Information
California
Safety
Multiple Power
Cord Marking
Marking
Perchlorate Material – Special handling may apply.
See www.dtsc.ca.gov/hazardouswaste/perchlorate
This notice is required by California Code of Regulations, Title 22,
Division 4.5, and Chapter 33: Best Management Practices for
Perchlorate Materials. This product may include a battery which
contains Perchlorate material.
This unit has more than one power supply cord. To reduce the risk
of electrical shock, disconnect (2) two power supply cords before
servicing.
Simplified Chinese:
注意:
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Regulatory and Certification Information
Country
Marking
本设备包括多条电源系统电缆。为避免遭受电击,在进行维修之前
应断开两(2)条电源系统电缆。
Traditional Chinese:
注意:
本設備包括多條電源系統電纜。為避免遭受電擊,在進行維修之前應
斷開兩(2)條電源系統電纜。
German:
Dieses Geräte hat mehr als ein Stromkabel. Um eine Gefahr des
elektrischen Schlages zu verringern trennen sie beide (2)
Stromkabeln bevor Instandhaltung.
Nordic Countries
Connection to
Proper Ground
Outlet
Safety
Stand-by power
“WARNING:”
“Apparaten skall anslutas till jordat uttag, när den ansluts till ett
nätverk.”
“Laite on liitettävä suojamaadoituskoskettimilla varustettuun
pistorasiaan.”
“Connect only to a properly earth grounded outlet.”
11.3 Rack Mount Installation Guidelines
Anchor the equipment rack: The equipment rack must be anchored to an unmovable support to
prevent it from falling over when one or more servers are extended in front of the rack on slides.
You must also consider the weight of any other device installed in the rack. A crush hazard
exists should the rack tilt forward which could cause serious injury.
Temperature: The temperature, in which the server operates when installed in an equipment
rack, must not go below 5 °C (41 °F) or rise above 40 °C (104 °F). Extreme fluctuations in
temperature can cause a variety of problems in your server.
Ventilation: The equipment rack must provide sufficient airflow to the front of the server to
maintain proper cooling. The rack must also include ventilation sufficient to exhaust a maximum
of 1023 BTU's (British Thermal Units) per hour for the server. The rack selected and the
ventilation provided must be suitable to the environment in which the server will be used.
If AC power supplies are installed:
Mains AC power disconnection: The AC power cord(s) is considered the mains disconnect for
the server and must be readily accessible when installed. If the individual server power cord(s)
will not be readily accessible for disconnection then you are responsible for installing an AC
power disconnect for the entire rack unit. This main disconnect must be readily accessible, and
it must be labeled as controlling power to the entire rack, not just to the server(s).
Grounding the rack installation: To avoid the potential for an electrical shock hazard, you must
include a third wire safety ground conductor with the rack installation. If the server power cord is
plugged into an AC outlet that is part of the rack, then you must provide proper grounding for
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the rack itself. If the server power cord is plugged into a wall AC outlet, the safety ground
conductor in the power cord provides proper grounding only for the server. You must provide
additional, proper grounding for the rack and other devices installed in it.
Overcurrent protection: The server is designed for an AC line voltage source with up to 20
amperes of overcurrent protection per cord feed. If the power system for the equipment rack is
installed on a branch circuit with more than 20 amperes of protection, you must provide
supplemental protection for the server.
If DC power supplies are installed:
Connection with a DC (Direct Current) source should only be performed by trained service
personnel. The server with DC input is to be installed in a Restricted Access Location in
accordance with articles 110-16, 110-17, and 110-18 of the National Electric Code, ANSI/NFPA
70. The DC source must be electrically isolated by double or reinforced insulation from any
hazardous AC source.
Main DC power disconnect: You are responsible for installing a properly rated DC power
disconnect for the server system. This mains disconnect must be readily accessible, and it must
be labeled as controlling power to the server. The circuit breaker of a centralized DC power
system may be used as a disconnect device when easily accessible and should be rated no
more than 10 amps.
Grounding the server: To avoid the potential for an electrical shock hazard, you must reliably
connect an earth grounding conductor to the server. The earth grounding conductor must be a
minimum 18AWG connected to the earth ground stud(s) on the rear of the server. The safety
ground conductor should be connected to the chassis stud with a Listed closed two-hole crimp
terminal having 5/8 inch pitch. The nuts on the chassis earth ground studs should be installed
with a 10 in/lbs torque. The safety ground conductor provides proper grounding only for the
server. You must provide additional, proper grounding for the rack and other devices installed in
it.
Over current protection: Over current protection circuit breakers must be provided as part of
each host equipment rack and must be incorporated in the field wiring between the DC source
and the server. The branch circuit protection shall be rated minimum 75Vdc, 10 A maximum per
feed pair. If the DC power system for the equipment rack is installed with more than 10
amperes of protection, you must provide supplemental protection for the server.
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11.4 Power Cord Usage Guidelines
WARNING
Do not attempt to modify or use an AC power cord set that is not the exact type required. You
must use a power cord set that meets the following criteria:




Rating: In the U.S. and Canada, cords must be UL (Underwriters Laboratories, Inc.)
Listed/CSA (Canadian Standards Organization) Certified type SJT, 18-3 AWG
(American Wire Gauge). Outside of the U.S. and Canada, cords must be flexible
harmonized (<HAR>) or VDE (Verband Deutscher Electrotechniker, German Institute of
Electrical Engineers) certified cord with 3 x 0.75 mm conductors rated 250 VAC (Volts
Alternating Current).
Connector, wall outlet end: Cords must be terminated in grounding-type male plug
designed for use in your region. The connector must have certification marks showing
certification by an agency acceptable in your region and for U.S. must be Listed and
rated 125% of overall current rating of the server.
Connector, server end: The connectors that plug into the AC receptacle on the server
must be an approved IEC (International Electrotechnical Commission) 320, sheet C13,
type female connector.
Cord length and flexibility: Cords must be less than 4.5 meters (14.76 feet) long.
11.5 Electromagnetic Compatibility Notices
11.5.1
FCC Verification Statement (USA)
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) This device may not cause harmful interference, and (2) this device must accept
any interference received, including interference that may cause undesired operation.
Intel Corporation
5200 N.E. Elam Young Parkway
Hillsboro, OR 97124-6497
1-800-628-8686
This equipment has been tested and found to comply with the limits for a Class A digital device,
pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable
protection against harmful interference in a residential installation. This equipment generates,
uses, and can radiate radio frequency energy and, if not installed and used in accordance with
the instructions, may cause harmful interference to radio communications. However, there is no
guarantee that interference will not occur in a particular installation. If this equipment does
cause harmful interference to radio or television reception, which can be determined by turning
the equipment off and on, the user is encouraged to try to correct the interference by one or
more of the following measures:
 Reorient or relocate the receiving antenna.
 Increase the separation between the equipment and the receiver.
 Connect the equipment into an outlet on a circuit different from that to which the receiver
is connected.
 Consult the dealer or an experienced radio/TV technician for help.
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Any changes or modifications not expressly approved by the grantee of this device could void
the user’s authority to operate the equipment. The customer is responsible for ensuring
compliance of the modified product.
Only peripherals (computer input/output devices, terminals, printers, etc.) that comply with FCC
Class A or B limits may be attached to this computer product. Operation with noncompliant
peripherals is likely to result in interference to radio and TV reception.
All cables used to connect to peripherals must be shielded and grounded. Operation with cables,
connected to peripherals that are not shielded and grounded may result in interference to radio
and TV reception.
11.5.2
ICES-003 (Canada)
Cet appareil numérique respecte les limites bruits radioélectriques applicables aux
appareils numériques de Classe Aprescrites dans la norme sur le matériel brouilleur:
“Appareils Numériques”, NMB-003 édictée par le Ministre Canadian des
Communications.
English translation of the notice above:
This digital apparatus does not exceed the Class A limits for radio noise emissions from digital
apparatus set out in the interference-causing equipment standard entitled “Digital Apparatus,”
ICES-003 of the Canadian Department of Communications.
11.5.3
Europe (CE Declaration of Conformity)
This product has been tested in accordance too, and complies with the Low Voltage Directive
(73/23/EEC) and EMC Directive (89/336/EEC). The product has been marked with the CE Mark
to illustrate its compliance.
11.5.4
VCCI (Japan)
English translation of the notice above:
This is a Class A product based on the standard of the Voluntary Control Council for
Interference (VCCI) from Information Technology Equipment. If this is used near a radio or
television receiver in a domestic environment, it may cause radio interference. Install and use
the equipment according to the instruction manual.
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11.5.5
Regulatory and Certification Information
BSMI (Taiwan)
The BSMI Certification Marking and EMC warning is located on the outside rear area of
the product.
11.5.6
KCC (Korea)
Following is the KCC certification information for Korea.
English translation of the notice above:
1.
2.
3.
4.
5.
Type of Equipment (Model Name): On Certification and Product
Certification No.: On KCC certificate. Obtain certificate from local Intel representative
Name of Certification Recipient: Intel Corporation
Date of Manufacturer: Refer to date code on product
Manufacturer/Nation: Intel Corporation/Refer to country of origin marked on product
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11.6 Regulated Specified Components
To maintain the UL listing and compliance to other regulatory certifications and/or declarations,
the following regulated components must be used and conditions adhered to. Interchanging or
use of other component will void the UL listing and other product certifications and approvals.
Updated product information for configurations can be found on the Intel Server Builder Web
site at the following URL:
http://channel.intel.com/go/serverbuilder
If you do not have access to Intel’s Web address, please contact your local Intel representative.
 Server chassis (base chassis is provided with power supply and fans) — UL listed.
 Server board — you must use an Intel server board — UL recognized.
 Add-in boards — must have a printed wiring board flammability rating of minimum
UL94V-1. Add-in boards containing external power connectors and/or lithium batteries
must be UL recognized or UL listed. Any add-in board containing modem
telecommunication circuitry must be UL listed. In addition, the modem must have the
appropriate telecommunications, safety, and EMC approvals for the region in which it is
sold.
 Peripheral Storage Devices — must be UL recognized or UL listed accessory and TUV
or VDE licensed. Maximum power rating of any one device or combination of devices
cannot exceed manufacturer’s specifications. Total server configuration is not to exceed
the maximum loading conditions of the power supply.
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Appendix A: Integration and Usage Tips
Appendix A: Integration and Usage Tips
This section provides a list of useful information that is unique to the Intel® Server System
SR2600UR and should be kept in mind while integrating and configuring your Intel® Server
Board S5520UR.









Only low-profile (1.2 in or 30.48 mm) DIMMs can be used in the server system.
Processor fans are not supported and are not needed in the server system. The system
fan module and power supply fans provide the necessary cooling needed for the system.
Using a processor fan in this system may cause Intel® System Management Software to
incorrectly monitor the system fans.
The CPU air duct and air baffle must be used to maintain system thermals.
To maintain system thermals, all hard drive bays must be populated with either a hard
drive or drive blank.
System fans are not hot-swappable
Use of the screw found on the front edge of the top cover is required when the unit is
installed in a user accessible environment.
A USB Floppy support kit (Product Order Code – AXXUSBFLOPPY) is available for
installing a slimline USB floppy drive in either the slimline bay or in the first 3.5-inch hard
drive bay.
The FRUSDR utility must be run to load the proper Sensor Data Records for the server
chassis onto the server board.
Make sure the latest system software is loaded on the server. This includes system
BIOS, FRUSDR, Integrated BMC firmware, and hot-swap controller firmware. The latest
system software can be downloaded
from http://support.intel.com/support/motherboards/server/s5520ur/
Revision 1.5
95
Intel order number E45274-008
Appendix B: POST Code Diagnostic LED Decoder
Intel® Server System SR2600UR TPS
Appendix B: POST Code Diagnostic LED Decoder
During the system boot process, the BIOS executes a number of platform configuration
processes, each of which is assigned a specific hex POST code number. As each configuration
routine is started, the BIOS displays the POST code to the POST Code Diagnostic LEDs on the
back edge of the server board. To assist in troubleshooting a system hang during the POST
process, the Diagnostic LEDs can be used to identify the last POST process that was executed.
Each POST code is represented by eight amber Diagnostic LEDs. The POST codes are divided
into two nibbles, an upper nibble and a lower nibble. The upper nibble bits are represented by
Diagnostic LEDs #4, #5, #6, #7. The lower nibble bits are represented by Diagnostics LEDs #0,
#1, #2 and #3. If the bit is set in the upper and lower nibbles, the corresponding LED is lit. If the
bit is clear, the corresponding LED is off.
The Diagnostic LED #7 is labeled as “MSB”, and the Diagnostic LED #0 is labeled as “LSB”.
A. Status LED
B. ID LED
C. Diagnostic LEDs
Figure 53. Diagnostic LED Placement Diagram
In the following example, the BIOS sends a value of ACh to the diagnostic LED decoder. The
LEDs are decoded as follows:
Table 61. POST Progress Code LED Example
Upper Nibble LEDs
LEDs
Status
Results

MSB
LED #7
8h
ON
LED #6
4h
OFF
1
0
Lower Nibble LEDs
LED #5
2h
ON
LED #4
1h
OFF
LED #3
8h
ON
LED #2
4h
OFF
1
0
1
1
Ah
LED #1
2h
ON
LSB
LED #0
1h
OFF
0
0
Ch
Upper nibble bits = 1010b = Ah; Lower nibble bits = 1100b = Ch; the two are
concatenated as ACh.
96
Revision 1.5
Intel order number E45274-008
Intel® Server System SR2600UR TPS
Appendix B: POST Code Diagnostic LED Decoder
Table 62. Diagnostic LED POST Code Decoder
Diagnostic LED Decoder
O = On, X=Off
Upper Nibble
Lower Nibble
Checkpoint
LED
MSB
8h
#7
4h
#6
2h
#5
Description
LSB
1h 8h 4h 2h 1h
#4 #3 #2 #1 #0
Multi-use code (This POST Code is used in different contexts)
Seen at the start of Memory Reference Code (MRC)
0xF2h
O
O
O
O
X
X
O
X
Start of the very early platform initialization code
Very late in POST, it is the signal that the OS has switched to virtual
memory mode
0xE8h
Memory Error Codes (Accompanied by a beep code)
No Usable Memory Error: No memory in the system, or SPD bad so
X
X
X
no memory could be detected
O
O
O
X
O
O
O
O
X
O
X
O
X
Channel Training Error: DQ/DQS training failed on a channel during
memory channel initialization.
O
O
O
X
O
X
O
O
Memory Test Error: memory failed Hardware BIST.
O
O
O
X
O
O
X
O
Population Error: RDIMMs and UDIMMs cannot be mixed in the
system
0xEEh
O
O
O
X
O
O
O
X
Mismatch Error: more than 2 Quad Ranked DIMMS in a channel.
0xB0h
O
X
O
Memory Reference Code Progress Codes (Not accompanied by a beep code)
O
X
X
X
X
Chipset Initialization Phase
0xB1h
O
X
O
O
X
X
X
O
Reset Phase
0xB2h
O
X
O
O
X
X
O
X
DIMM Detection Phase
0xB3h
O
X
O
O
X
X
O
O
Clock Initialization Phase
0xB4h
O
X
O
O
X
O
X
X
SPD Data Collection Phase
0xB6h
O
X
O
O
X
O
O
X
Rank Formation Phase
0xB8h
O
X
O
O
O
X
X
X
Channel Training Phase
0xB9h
O
X
O
O
O
X
X
O
Memory Test Phase
0xBAh
O
X
O
O
O
X
O
X
Memory Map Creation Phase
0xBBh
O
X
O
O
O
X
O
O
RAS Initialization Phase
0xBFh
O
X
O
O
O
O
O
O
MRC Complete
0x04h
X
X
X
X
X
O
X
X
0x10h
X
X
X
O
X
X
X
X
Power-on initialization of the host processor (bootstrap processor)
0x11h
X
X
X
O
X
X
X
O
Host processor cache initialization (including AP)
0x12h
X
X
X
O
X
X
O
X
Starting application processor initialization
0x13h
X
X
X
O
X
X
O
O
SMM initialization
0x21h
X
X
O
X
X
X
X
O
Chipset
Initializing a chipset component
0x22h
X
X
O
X
X
X
O
X
Memory
Reading configuration data from memory (SPD on DIMM)
0x23h
X
X
O
X
X
X
O
O
Detecting presence of memory
0x24h
X
X
O
X
X
O
X
X
Programming timing parameters in the memory controller
0x25h
X
X
O
X
X
O
X
O
Configuring memory parameters in the memory controller
0x26h
X
X
O
X
X
O
O
X
Optimizing memory controller settings
0x27h
X
X
O
X
X
O
O
O
Initializing memory, such as ECC init
0xEAh
0xEBh
0xEDh
Host Processor
Early processor initialization where system BSP is selected
Revision 1.5
97
Intel order number E45274-008
Appendix B: POST Code Diagnostic LED Decoder
Intel® Server System SR2600UR TPS
Diagnostic LED Decoder
O = On, X=Off
Upper Nibble
Lower Nibble
Checkpoint
Description
LED
0x28h
MSB
LSB
8h 4h 2h 1h 8h 4h 2h 1h
#7 #6 #5 #4 #3 #2 #1 #0
X
X
O
X
O
X
X
X
Testing memory
0x50h
X
O
X
O
X
X
X
X
PCI Bus
Enumerating PCI busses
0x51h
X
O
X
O
X
X
X
O
Allocating resources to PCI busses
0x52h
X
O
X
O
X
X
O
X
Hot Plug PCI controller initialization
0x53h
X
O
X
O
X
X
O
O
Reserved for PCI bus
0x54h
X
O
X
O
X
O
X
X
Reserved for PCI bus
0x55h
X
O
X
O
X
O
X
O
0x56h
0x57h
X
X
O
O
X
X
O
O
X
X
O
O
O
O
0x58h
0x59h
X
X
O
O
X
X
O
O
O
O
X
X
X
X
0x5Ah
0x5Bh
X
X
O
O
X
X
O
O
O
O
X
X
O
O
0x5Ch
0x5Dh
X
X
O
O
X
X
O
O
O
O
O
O
X
X
0x70h
0x71h
0x72h
X
X
X
O
O
O
O
O
O
O
O
O
X
X
X
X
X
X
X
X
O
0x78h
0x79h
0x7Ah
X
X
X
O
O
O
O
O
O
O
O
O
O
O
O
X
X
X
X
X
O
0x90h
0x91h
0x92h
0x93h
0x94h
0x95h
O
O
O
O
O
O
X
X
X
X
X
X
X
X
X
X
X
X
O
O
O
O
O
O
X
X
X
X
X
X
X
X
X
X
O
O
X
X
O
O
X
X
0x98h
0x99h
0x9Ah
0x9Bh
O
O
O
O
X
X
X
X
X
X
X
X
O
O
O
O
O
O
O
O
X
X
X
X
X
X
O
O
0xB0h
0xB1h
O
O
X
X
O
O
O
O
X
X
X
X
X
X
0xB2h
O
X
O
O
X
X
O
0xB3h
O
X
O
O
X
X
O
0xB8h
0xB9h
O
O
X
X
O
O
O
O
O
O
X
X
X
X
0xBAh
O
X
O
O
O
X
O
Reserved for PCI bus
X
O
Reserved for PCI bus
Reserved for PCI bus
USB
X
Resetting USB bus
O
Reserved for USB devices
ATA/ATAPI/SATA
X
Resetting SATA bus and all devices
O
Reserved for ATA
SMBUS
X
Resetting SMBUS
O
Reserved for SMBUS
Local Console
X
Resetting the video controller (VGA)
O
Disabling the video controller (VGA)
X
Enabling the video controller (VGA)
Remote Console
X
Resetting the console controller
O
Disabling the console controller
X
Enabling the console controller
Keyboard (only USB)
X
Resetting the keyboard
O
Disabling the keyboard
X
Detecting the presence of the keyboard
O
Enabling the keyboard
X
Clearing keyboard input buffer
O
Instructing keyboard controller to run Self Test (PS2 only)
Mouse (only USB)
X
Resetting the mouse
O
Detecting the mouse
X
Detecting the presence of mouse
O
Enabling the mouse
Fixed Media
X
Resetting fixed media device
O
Disabling fixed media device
Detecting presence of a fixed media device (hard drive detection,
X
etc.)
O
Enabling/configuring a fixed media device
Removable Media
X
Resetting removable media device
O
Disabling removable media device
Detecting presence of a removable media device (CDROM detection,
X
etc.)
98
Revision 1.5
Intel order number E45274-008
Intel® Server System SR2600UR TPS
Checkpoint
LED
0xBCh
Appendix B: POST Code Diagnostic LED Decoder
Diagnostic LED Decoder
O = On, X=Off
Upper Nibble
Lower Nibble
Description
MSB
LSB
8h 4h 2h 1h 8h 4h 2h 1h
#7 #6 #5 #4 #3 #2 #1 #0
O
X
O
O
O
O
X
X
Enabling/configuring a removable media device
Boot Device Selection (BDS)
0xD0
O
O
X
O
X
X
X
X
Trying to boot device selection 0
0xD1
O
O
X
O
X
X
X
O
Trying to boot device selection 1
0xD2
O
O
X
O
X
X
O
X
Trying to boot device selection 2
0xD3
O
O
X
O
X
X
O
O
Trying to boot device selection 3
0xD4
O
O
X
O
X
O
X
X
Trying to boot device selection 4
0xD5
O
O
X
O
X
O
X
O
Trying to boot device selection 5
0xD6
O
O
X
O
X
O
O
X
Trying to boot device selection 6
0xD7
O
O
X
O
X
O
O
O
Trying to boot device selection 7
0xD8
O
O
X
O
O
X
X
X
Trying to boot device selection 8
0xD9
O
O
X
O
O
X
X
O
Trying to boot device selection 9
0xDA
O
O
X
O
O
X
O
X
Trying to boot device selection A
0xDB
O
O
X
O
O
X
O
O
Trying to boot device selection B
0xDC
O
O
X
O
O
O
X
X
Trying to boot device selection C
0xDD
O
O
X
O
O
O
X
O
Trying to boot device selection D
0xDE
O
O
X
O
O
O
O
X
Trying to boot device selection E
0xDF
O
O
X
O
O
O
O
O
Trying to boot device selection F
0xE0h
O
O
O
X
X
X
X
0xE1h
O
O
O
X
X
X
X
O
Reserved for initialization module use (PEIM)
0xE2h
O
O
O
X
X
X
O
X
Initial memory found, configured, and installed correctly
0xE3h
O
O
O
X
X
X
O
O
Reserved for initialization module use (PEIM)
0xE4h
O
O
O
Driver eXecution Environment (DXE) Core (not accompanied by a beep code)
X
X
O
X
X
Entered EFI driver execution phase (DXE)
0xE5h
O
O
O
X
X
O
X
O
Started dispatching drivers
0xE6h
O
O
O
X
X
O
O
X
Started connecting drivers
0xE7h
O
O
O
X
O
O
X
O
DXE Drivers
Waiting for user input
0xE8h
O
O
O
X
O
X
X
X
Checking password
0xE9h
O
O
O
X
O
X
X
O
Entering BIOS setup
0xEAh
O
O
O
X
O
X
O
X
Flash Update
0xEEh
O
O
O
X
O
O
O
X
Calling Int 19. One beep unless silent boot is enabled.
0xEFh
O
O
O
X
O
O
O
O
Unrecoverable boot failure
Pre-EFI Initialization (PEI) Core
X
Started dispatching early initialization modules (PEIM)
0xF2h
O
O
O
O
X
Runtime Phase/EFI Operating System Boot
X
O
X
Signal that the OS has switched to virtual memory mode
0xF4h
O
O
O
O
X
O
X
X
Entering Sleep state
0xF5h
O
O
O
O
X
O
X
O
Exiting Sleep state
0xF8h
O
O
O
O
O
X
X
X
OS has requested EFI to close boot services (ExitBootServices ( )
Has been called)
0xF9h
O
O
O
O
O
X
X
O
OS has switched to virtual address mode (SetVirtualAddressMap ( )
Has been called)
0xFAh
O
O
O
O
O
X
O
X
OS has requested the system to reset (ResetSystem ( ) has been
Revision 1.5
99
Intel order number E45274-008
Appendix B: POST Code Diagnostic LED Decoder
Diagnostic LED Decoder
O = On, X=Off
Upper Nibble
Lower Nibble
Checkpoint
LED
Intel® Server System SR2600UR TPS
MSB
8h
#7
4h
#6
2h
#5
1h
#4
8h
#3
4h
#2
2h
#1
Description
LSB
1h
#0
called)
0x30h
X
X
O
O
X
Pre-EFI Initialization Module (PEIM)/Recovery
X
X
X
Crisis recovery has been initiated because of a user request
0x31h
X
X
O
O
X
X
X
O
Crisis recovery has been initiated by software (corrupt flash)
0x34h
X
X
O
O
X
O
X
X
Loading crisis recovery capsule
0x35h
X
X
O
O
X
O
X
O
Handing off control to the crisis recovery capsule
0x3Fh
X
X
O
O
O
O
O
O
Unable to complete crisis recovery capsule
100
Revision 1.5
Intel order number E45274-008
Intel® Server System SR2600UR TPS
Appendix C: POST Code Errors
Appendix C: POST Code Errors
Whenever possible, the BIOS outputs the current boot progress codes on the video screen.
Progress codes are 32-bit quantities plus optional data. The 32-bit numbers include class,
subclass, and operation information. The class and subclass fields point to the type of hardware
that is being initialized. The operation field represents the specific initialization activity. Based
on the data bit availability to display progress codes, a progress code can be customized to fit
the data width. The higher the data bit, the higher the granularity of information that can be sent
on the progress port. The progress codes may be reported by the system BIOS or option ROMs.
The Response section in the following table is divided into three types:



No Pause: The message is displayed on the screen during POST or in the Error
Manager. The system continues booting with a degraded state. The user may want to
replace the erroneous unit. The setup POST error Pause setting does not have any
effect with this error.
Pause: The message is displayed on the Error Manager screen, and an error is logged
to the SEL. The setup POST error Pause setting determines whether the system pauses
to the Error Manager for this type of error, where the user can take immediate corrective
action or choose to continue booting.
Halt: The message is displayed on the Error Manager screen, an error is logged to the
SEL, and the system cannot boot unless the error is resolved. The user needs to
replace the faulty part and restart the system. The setup POST error Pause setting does
not have any effect with this error.
Table 63. POST Error Messages and Handling
Error Code
0012
0048
0108
0109
0113
0140
0141
0146
0192
0194
0195
0196
0197
0198
019F
5220
5221
5224
8110
8111
8120
8121
8130
8131
Error Message
CMOS date/time not set
Password check failed
Keyboard component encountered a locked error.
Keyboard component encountered a stuck key error.
Fixed Media The SAS RAID firmware cannot run properly. The user should attempt to
reflash the firmware.
PCI component encountered a PERR error.
PCI resource conflict
PCI out of resources error
L3 cache size mismatch
CPUID, processor family are different
Front side bus mismatch
Processor Model mismatch
Processor speeds mismatched
Processor family is unsupported.
Processor and chipset stepping configuration is unsupported.
CMOS/NVRAM Configuration Cleared
Passwords cleared by jumper
Password clear Jumper is Set.
Processor 01 internal error (IERR) on last boot
Processor 02 internal error (IERR) on last boot
Processor 01 thermal trip error on last boot
Processor 02 thermal trip error on last boot
Processor 01 disabled
Processor 02 disabled
Revision 1.5
Response
Pause
Halt
No Pause
No Pause
Pause
Pause
Pause
Pause
Halt
Halt
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
101
Intel order number E45274-008
Appendix C: POST Code Errors
Error Code
8140
8141
8160
8161
8170
8171
8180
8181
8190
8198
8300
84F2
84F3
84F4
84FF
8500
8520
8521
8522
8523
8524
8525
8526
8527
8528
8529
852A
852B
852C
852D
852E
852F
8540
8541
8542
8543
8544
8545
8546
8547
8548
8549
854A
854B
854C
854D
854E
854F
8560
8561
8562
8563
8564
8565
8566
8567
8568
8569
Intel® Server System SR2600UR TPS
Error Message
Processor 01 Failed FRB-3 Timer.
Processor 02 Failed FRB-3 Timer.
Processor 01 unable to apply BIOS update
Processor 02 unable to apply BIOS update
Processor 01 failed Self Test (BIST).
Processor 02 failed Self Test (BIST).
Processor 01 BIOS does not support the current stepping for processor
Processor 02 BIOS does not support the current stepping for processor
Watchdog timer failed on last boot
Operating system boot watchdog timer expired on last boot
Integrated Baseboard Management Controller failed self-test
Integrated Baseboard Management Controller failed to respond
Integrated Baseboard Management Controller in update mode
Sensor data record empty
System event log full
Memory component could not be configured in the selected RAS mode.
DIMM_A1 failed Self Test (BIST).
DIMM_A2 failed Self Test (BIST).
DIMM_A3 failed Self Test (BIST).
DIMM_A4 failed Self Test (BIST).
DIMM_B1 failed Self Test (BIST).
DIMM_B2 failed Self Test (BIST).
DIMM_B3 failed Self Test (BIST).
DIMM_B4 failed Self Test (BIST).
DIMM_C1 failed Self Test (BIST).
DIMM_C2 failed Self Test (BIST).
DIMM_C3 failed Self Test (BIST).
DIMM_C4 failed Self Test (BIST).
DIMM_D1 failed Self Test (BIST).
DIMM_D2 failed Self Test (BIST).
DIMM_D3 failed Self Test (BIST).
DIMM_D4 failed Self Test (BIST).
DIMM_A1 Disabled.
DIMM_A2 Disabled.
DIMM_A3 Disabled.
DIMM_A4 Disabled.
DIMM_B1 Disabled.
DIMM_B2 Disabled.
DIMM_B3 Disabled.
DIMM_B4 Disabled.
DIMM_C1 Disabled.
DIMM_C2 Disabled.
DIMM_C3 Disabled.
DIMM_C4 Disabled.
DIMM_D1 Disabled.
DIMM_D2 Disabled.
DIMM_D3 Disabled.
DIMM_D4 Disabled.
DIMM_A1 Component encountered a Serial Presence Detection (SPD) fail error.
DIMM_A2 Component encountered a Serial Presence Detection (SPD) fail error.
DIMM_A3 Component encountered a Serial Presence Detection (SPD) fail error.
DIMM_A4 Component encountered a Serial Presence Detection (SPD) fail error.
DIMM_B1 Component encountered a Serial Presence Detection (SPD) fail error.
DIMM_B2 Component encountered a Serial Presence Detection (SPD) fail error.
DIMM_B3 Component encountered a Serial Presence Detection (SPD) fail error.
DIMM_B4 Component encountered a Serial Presence Detection (SPD) fail error.
DIMM_C1 Component encountered a Serial Presence Detection (SPD) fail error.
DIMM_C2 Component encountered a Serial Presence Detection (SPD) fail error.
102
Response
No Pause
No Pause
Pause
Pause
Pause
Pause
No Pause
No Pause
Pause
Pause
Pause
Pause
Pause
Pause
No Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Revision 1.5
Intel order number E45274-008
Intel® Server System SR2600UR TPS
Error Code
856A
856B
856C
856D
856E
856F
8580
8581
8582
8583
8584
8585
8586
8587
8588
8589
858A
858B
858C
858D
858E
858F
85A0
85A1
85A2
85A3
85A4
85A5
85A6
85A7
85A8
85A9
85AA
85AB
85AC
85AD
85AE
85AF
8601
8602
8603
8604
9000
9223
9226
9243
9246
9266
9268
9269
9286
9287
9288
92A3
92A9
92C6
92C7
92C8
Appendix C: POST Code Errors
Error Message
DIMM_C3 Component encountered a Serial Presence Detection (SPD) fail error.
DIMM_C4 Component encountered a Serial Presence Detection (SPD) fail error.
DIMM_D1 Component encountered a Serial Presence Detection (SPD) fail error.
DIMM_D2 Component encountered a Serial Presence Detection (SPD) fail error.
DIMM_D3 Component encountered a Serial Presence Detection (SPD) fail error.
DIMM_D4 Component encountered a Serial Presence Detection (SPD) fail error.
DIMM_A1 Correctable ECC error encountered.
DIMM_A2 Correctable ECC error encountered.
DIMM_A3 Correctable ECC error encountered.
DIMM_A4 Correctable ECC error encountered.
DIMM_B1 Correctable ECC error encountered.
DIMM_B2 Correctable ECC error encountered.
DIMM_B3 Correctable ECC error encountered.
DIMM_B4 Correctable ECC error encountered.
DIMM_C1 Correctable ECC error encountered.
DIMM_C2 Correctable ECC error encountered.
DIMM_C3 Correctable ECC error encountered.
DIMM_C4 Correctable ECC error encountered.
DIMM_D1 Correctable ECC error encountered.
DIMM_D2 Correctable ECC error encountered.
DIMM_D3 Correctable ECC error encountered.
DIMM_D4 Correctable ECC error encountered.
DIMM_A1 Uncorrectable ECC error encountered.
DIMM_A2 Uncorrectable ECC error encountered.
DIMM_A3 Uncorrectable ECC error encountered.
DIMM_A4 Uncorrectable ECC error encountered.
DIMM_B1 Uncorrectable ECC error encountered.
DIMM_B2 Uncorrectable ECC error encountered.
DIMM_B3 Uncorrectable ECC error encountered.
DIMM_B4 Uncorrectable ECC error encountered.
DIMM_C1 Uncorrectable ECC error encountered.
DIMM_C2 Uncorrectable ECC error encountered.
DIMM_C3 Uncorrectable ECC error encountered.
DIMM_C4 Uncorrectable ECC error encountered.
DIMM_D1 Uncorrectable ECC error encountered.
DIMM_D2 Uncorrectable ECC error encountered.
DIMM_D3 Uncorrectable ECC error encountered.
DIMM_D4 Uncorrectable ECC error encountered.
Override jumper is set to force boot from lower alternate BIOS bank of flash ROM
WatchDog timer expired (secondary BIOS may be bad!)
Secondary BIOS checksum fail
Chipset Reclaim of non critical variables complete.
Unspecified processor component has encountered a non specific error.
Keyboard component was not detected.
Keyboard component encountered a controller error.
Mouse component was not detected.
Mouse component encountered a controller error.
Local Console component encountered a controller error.
Local Console component encountered an output error.
Local Console component encountered a resource conflict error.
Remote Console component encountered a controller error.
Remote Console component encountered an input error.
Remote Console component encountered an output error.
Serial port component was not detected
Serial port component encountered a resource conflict error
Serial Port controller error
Serial Port component encountered an input error.
Serial Port component encountered an output error.
Revision 1.5
Response
Pause
Pause
Pause
Pause
Pause
Pause
Pause after 10 Occurrence
Pause after 10 Occurrence
Pause after 10 Occurrence
Pause after 10 Occurrence
Pause after 10 Occurrence
Pause after 10 Occurrence
Pause after 10 Occurrence
Pause after 10 Occurrence
Pause after 10 Occurrence
Pause after 10 Occurrence
Pause after 10 Occurrence
Pause after 10 Occurrence
Pause after 10 Occurrence
Pause after 10 Occurrence
Pause after 10 Occurrence
Pause after 10 Occurrence
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
Pause
No Pause
No Pause
No Pause
No Pause
Pause
No Pause
No Pause
No Pause
No Pause
No Pause
No Pause
No Pause
No Pause
No Pause
No Pause
Pause
Pause
No Pause
No Pause
No Pause
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Appendix C: POST Code Errors
Error Code
94C6
94C9
9506
95A6
95A7
95A8
9609
9641
9667
9687
96A7
96AB
96E7
0xA022
0xA027
0xA028
0xA421
0xA500
0xA501
0xA5A0
0xA5A1
0xA5A4
0xA6A0
Intel® Server System SR2600UR TPS
Error Message
LPC component encountered a controller error.
LPC component encountered a resource conflict error.
ATA/ATPI component encountered a controller error.
PCI component encountered a controller error.
PCI component encountered a read error.
PCI component encountered a write error.
Unspecified software component encountered a start error.
PEI Core component encountered a load error.
PEI module component encountered an illegal software state error.
DXE core component encountered an illegal software state error.
DXE boot services driver component encountered an illegal software state error.
DXE boot services driver component encountered invalid configuration.
SMM driver component encountered an illegal software state error.
Processor component encountered a mismatch error.
Processor component encountered a low voltage error.
Processor component encountered a high voltage error.
PCI component encountered a SERR error.
ATA/ATPI ATA bus SMART not supported.
ATA/ATPI ATA SMART is disabled.
PCI Express* component encountered a PERR error.
PCI Express* component encountered a SERR error.
PCI Express* IBIST error.
DXE boot services driver Not enough memory available to shadow a legacy option ROM.
Response
No Pause
Pause
No Pause
No Pause
No Pause
No Pause
No Pause
No Pause
Halt
Halt
Halt
No Pause
Halt
Pause
No Pause
No Pause
Halt
No Pause
No Pause
No Pause
Halt
Pause
No Pause
POST Error Beep Codes
The following table lists the POST error beep codes. Prior to system video initialization, the
BIOS uses these beep codes to inform users on error conditions. The beep code is followed by
a user-visible code on the POST Progress LEDs. For complete details, refer to the Intel®
S5500/S5520 Server Board Family BIOS External Product Specification.
Table 64. POST Error Beep Codes
Beeps
3
Error Message
Memory error
POST Progress Code
0xE8, 0xEB, 0xED,
0xEE
Description
System halted because a fatal error related to the memory
was detected.
The Integrated BMC may generate beep codes upon detection of failure conditions. Beep
codes are sounded each time the problem is discovered, such as on each power-up attempt,
but are not sounded continuously. Codes that are common across all Intel server boards and
systems that use same generation chipset are listed in the following table. Each digit in the
code is represented by a sequence of beeps whose count is equal to the digit. For complete
details, refer to the Intel® Server System Integrated Baseboard Management Controller Core
External Product Specification.
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Appendix C: POST Code Errors
Table 65. Integrated BMC Beep Codes
Code
1-5-2-1
Reason for Beep
No CPUs installed or first CPU socket is
empty.
Associated Sensors
CPU Missing Sensor
Supported
Yes
1-5-4-2
Power fault: DC power unexpectedly lost
(power good dropout).
Power unit – power unit failure
offset.
Yes
1-5-4-4
Power control fault (power good assertion
timeout).
Power unit – soft power control
failure offset.
Yes
Revision 1.5
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Glossary
Intel® Server System SR2600UR TPS
Glossary
Word/Acronym
ACA
Australian Communication Authority
Definition
ACPI
Advanced Configuration and Power Interface
ANSI
American National Standards Institute
ATA
Advanced Technology Attachment
BMC
Baseboard Management Controller
BIOS
Basic Input/Output System
CMOS
Complementary Metal-oxide-semiconductor
D2D
DC-to-DC
EMC
Electromagnetic Compatibility
EMP
Emergency Management Port
ESD
Electrostatic Discharge
FP
Front Panel
FRB
Fault Resilient Boot
FRU
Field Replaceable Unit
2
IC
Inter-integrated Circuit bus
IPMI
Intelligent Platform Management Interface
LCD
Liquid Crystal Display
LPC
Low-pin Count
LSB
Least Significant Bit
MSB
Most Significant Bit
MTBF
Mean Time Between Failure
MTTR
Mean Time to Repair
NIC
Network Interface Card
NMI
Non-maskable Interrupt
OTP
Over-temperature Protection
OVP
Over-voltage Protection
PCI
Peripheral Component Interconnect
PCB
Printed Circuit Board
PCIe*
Peripheral Component Interconnect Express*
PCI-X
Peripheral Component Interconnect Extended
PFC
Power Factor Correction
POST
Power-on Self Test
PSU
Power Supply Unit
RAID
Redundant Array of Independent (or Inexpensive) Disks
RAM
Random Access Memory
RI
Ring Indicate
SATA
Serial Advanced Technology Attachment
SCA
Single Connector Attachment
SDR
Sensor Data Record
SE
Single-Ended
SMBus
System Management Bus
THD
Total Harmonic Distortion
UART
Universal Asynchronous Receiver Transmitter
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Glossary
Word/Acronym
USB
Universal Serial Bus
Definition
VCCI
Voluntary Control Council for Interference
VRD
Voltage Regulator Down
VSB
Voltage Standby
Revision 1.5
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Intel order number E45274-008
Reference Documents
Intel® Server System SR2600UR TPS
Reference Documents
See the following documents for additional information:






Intel® Server Board S5520UR Technical Product Specification
®
Intel Server System SR2600UR AC Power Supply Module Specification
Intel® Server Board S5520UR/Intel® Server System SR2600UR Spares/Parts List and
Configuration Guide
Intel® Server System SR2600UR/SR2625UR Service Guide
Intel® S5500/S5520 Server Board Family BIOS External Product Specification
®
Intel Server System Integrated Baseboard Management Controller Core External
Product Specification
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