AN 71: Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless Devices

2015.06.12
AN-071
Guidelines for Handling J-Lead, QFP, BGA, FBGA, and
Lidless FBGA Devices
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This application note provides guidelines for handling J-Lead, Quad Flat Pack (QFP), and Ball-Grid Array
(BGA, including FineLine BGA [FBGA] and lidless FBGA packaging) devices to preserve the quality of
these devices during storage, shipment, and transfer and to ensure easier soldering.
Devices that use surface-mount J-Lead, QFP, BGA, FBGA, and lidless BGA are now common on boards
because they provide density, size, and cost benefits. However, a few precautions are necessary to protect
these devices from mechanical damage during transportation and storage.
Handling J-Lead and QFP Devices
To protect device leads and ensure proper operation, you must handle J-Lead and QFP devices carefully
when they are stored, shipped, and transferred. You must store and ship J-Lead devices in tubes sealed
with stoppers. Add foam inside the tubes for cushioning if necessary.
You must ship QFP devices in carriers only inside tubes sealed with stoppers and with foam (if necessary).
Carriers are static-dissipative, molded plastic shells that hold QFP devices in a secure frame to prevent
mechanical damage to device leads. You can program and erase these QFP devices inside carriers and they
can tolerate the 125°C baking required for dry packing. When handling QFP devices in carriers, do not
touch the QFP device; only use fingers cots to touch the carrier.
If you are required to insert a QFP device into a carrier, contact Altera® Customer Marketing. For more
information, refer to the QFP Carrier and Development Socket Datasheet as listed in the Related Informa‐
tion section.
You must store and ship QFP devices without carriers, QFP devices that have been extracted from
carriers, and BGA devices only in trays sealed with straps. When extracting QFP devices from a carrier,
use only Altera QFP extraction tools and inspect the orientation and lead integrity of the devices. You
must extract the device and place them directly into trays.
Related Information
• QFP Carrier and Development Socket Datasheet
Provides more details on QFP carriers.
• Trays for QFP, BGA, FBGA, and Lidless FBGA Devices without Carriers on page 6
Provides more details about handling QFP or BGA devices without carriers.
• Straps for QFP, BGA, FBGA, and Lidless FBGA Devices without Carriers on page 14
Provides more details about handling QFP or BGA devices without carriers.
© 2015 Altera Corporation. All rights reserved. ALTERA, ARRIA, CYCLONE, ENPIRION, MAX, MEGACORE, NIOS, QUARTUS and STRATIX words and logos are
trademarks of Altera Corporation and registered in the U.S. Patent and Trademark Office and in other countries. All other words and logos identified as
trademarks or service marks are the property of their respective holders as described at www.altera.com/common/legal.html. Altera warrants performance
of its semiconductor products to current specifications in accordance with Altera's standard warranty, but reserves the right to make changes to any
products and services at any time without notice. Altera assumes no responsibility or liability arising out of the application or use of any information,
product, or service described herein except as expressly agreed to in writing by Altera. Altera customers are advised to obtain the latest version of device
specifications before relying on any published information and before placing orders for products or services.
www.altera.com
101 Innovation Drive, San Jose, CA 95134
ISO
9001:2008
Registered
2
AN-071
2015.06.12
Tubes for J-Lead Devices and QFP Devices in Carriers
Tubes for J-Lead Devices and QFP Devices in Carriers
Altera-approved tubes protect J-Lead and QFP devices in carriers from electrostatic discharge (ESD) and
during transportation and storage. Use clear tubes to inspect the top-side marking of the contents easily.
The tube material must be antistatic (with “antistatic” printed on the tube), and stiff enough to prevent
the tubes from warping, cracking, or developing burrs during normal handling.
When transporting or storing devices in tubes, follow these guidelines:
• Keep tubes horizontal
• Keep devices in “dead bug” orientation (refer to the Dead Bug Versus Live Bug Orientation figure)
• Ensure that the devices do not overlap inside the tube
The following figure shows the difference between a "dead bug" and "live bug" orientation.
The following figure shows the tube dimensions required for each J-Lead device. The tubes must match
the dimensions of the device. For the tube dimension, refer to the Tube Dimension for J-Lead Device
Antistatic Shipping Tube table.
Figure 1: Dead Bug Versus Live Bug Orientation
Dead bug orientation
Live bug orientation
The following table lists the tube dimension as shown in the Tube Dimensions for J-Lead Device
Antistatic Shipping Tube figure.
Figure 2: Tube Dimensions for J-Lead Device Antistatic Shipping Tube
C
B
A
Table 1: Tube Dimension for J-Lead Device Antistatic Shipping Tube
Pin Count
A
B
C
Shipping Length
20
0.480
0.260
0.025
20.00
28
0.580
0.260
0.025
20.00
44
0.780
0.260
0.025
20.25
68
1.100
0.280
0.035
20.00
84
1.300
0.280
0.035
20.25
The following table lists the part numbers for Altera-approved tubes for J-Lead devices.
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Stoppers for J-Lead and QFP Devices in Carriers
3
Table 2: Antistatic Tube Part Numbers for J-Lead Devices
For more information about how to order tubes, refer to the Altera-Approved Packing Media and Suppliers table
as listed in the Related Information section.
Pin Count
Altera Reference Part
Number
Tube Capacity (Devices)
20
E20-03708-00
49
28
E20-02078-00
39
44
E20-05952-00
26
68
E20-04431-00
18
84
E20-04740-00
15
The following table lists the part numbers for Altera-approved tubes for QFP devices in carriers.
Table 3: Altera-Approved Tubes for QFP Devices in Carriers
For more information about how to order tubes, refer to the Altera-Approved Packing Media and Suppliers table
as listed in the Related Information section.
Pin Count
Package Dimensions
(mm)
Tube Capacity (QFP
Devices in Carriers)
Altera Reference Part Number
100
14 x 20
23
E20-02080-00
160
28 x 28
14
E20-04743-00
208
28 x 28
14
E20-04743-00
240
32 x 32
12
E20-04800-00
304
40 x 40
10
E20-04783-00
Related Information
• Ordering Information on page 24
• Transferring Devices Between Tubes on page 15
Stoppers for J-Lead and QFP Devices in Carriers
Stoppers seal tubes and protect J-Lead and QFP devices in carriers against mechanical damage and ESD.
Altera uses black stoppers that match the tube dimensions. When inserting stoppers, follow these
guidelines:
• Before transporting or storing devices, seat stoppers firmly into both ends of the tube.
• For easy removal, push stopper teeth fully inside the tube, with the grip extending outside. Do not
insert the stopper completely inside the tube (refer to the Stopper Properly Inserted into a Tube
figure).
• To prevent devices from moving inside an incompletely filled tube, insert foam between the parts and
stopper.
The following figure shows how you can properly insert a stopper in a tube.
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Stoppers for J-Lead and QFP Devices in Carriers
Figure 3: Stopper Properly Inserted into a Tube
Grip
Teeth
Tube
Device
To reduce the risk of damaging leads, some special stoppers are designed to fit into a tube in only one
way. It is important to insert these special stoppers correctly with the grip in the same direction as the
leads, as shown in the following figure.
Figure 4: Proper Orientation of Special Stoppers
Grip
Teeth
Tube
Device
The following table lists the part numbers for Altera-approved black stoppers for J-Lead devices.
Table 4: Black Stopper Part Numbers for J-Lead Devices
For more information about how to order stoppers, refer to the Altera-Approved Packing Media and Suppliers
table as listed in the Related Information section.
Pin Count
Manufacturer Part Number
20
K-VT0236-25
28
K-VT0236-12
44
KBR-044
68
KBR-068
84
KBR-084
To prevent damage to leads during shipping, tubes containing 208-, 240-, and 304-lead Power Quad Flat
Pack (RQFP) packages in carriers must have modified stoppers. These modified stoppers are used just like
other stopper although they have a notch cut out of them, refer to the following figure.
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Foam for J-Lead Devices and QFP Devices in Carriers
5
Figure 5: Notched Stoppers for Tubes of RQFPs in Carriers
Altera
208
Stopper
Hole in
stopper
Pin-One indicator
on carrier
Pin-One indicator
on QFP package
Tube
208-Lead
Altera
240
240- and 304-Leads
The following table lists the part numbers for Altera-approved black stoppers for QFP devices in carriers.
Table 5: Black Stopper Part Numbers for QFP Devices in Carriers
For more information about how to order stoppers, refer to the Altera-Approved Packing Media and Suppliers
table as listed in the Related Information section.
Pin Count
Altera Part Number
100
E20-04739-00
160
E20-04764-00
208
E20-04764-00
240
E20-04765-00
304
E20-04766-00
Related Information
Ordering Information on page 24
Foam for J-Lead Devices and QFP Devices in Carriers
Foam provides extra cushioning and restricts movement inside the tube to prevent device pins from
bending. To support the devices evenly, the foam must be nearly as wide as the tubes. You must not use
foam in any full tube containing special stoppers, as shown in the Proper Orientation of Special Stoppers
figure. When you use the foam, place the foam at each end of the tube between the stoppers and devices,
as shown in the following figure.
Foam must be antistatic, non-corrosive, and free of contaminants. Place foam in tubes containing the
following:
• A gap inside the tube measuring 1/4 inch or greater (for both J-Lead and QFP devices in carriers)
• Plastic J-Lead Chip Carrier (PLCC) devices with 44 or more pins (full tubes containing PLCC devices
with 28 or fewer pins generally do not require foam)
• Ceramic J-Lead Chip Carrier (JLCC) devices
The following figure shows the position of the stopper, foam, and devices in a tube.
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Trays for QFP, BGA, FBGA, and Lidless FBGA Devices without Carriers
AN-071
2015.06.12
Figure 6: Stoppers, Foam, and Devices in a Tube
Stopper
Stopper
Black Foam
Related Information
Stoppers for J-Lead and QFP Devices in Carriers on page 3
Trays for QFP, BGA, FBGA, and Lidless FBGA Devices without Carriers
To hold QFP devices without carriers or BGA devices, use only altera-approved trays as listed in the
Altera-Approved Low-Profile Trays Part Number table.
When stacking trays for transportation or storage, follow these guidelines:
•
•
•
•
•
Seal stacks of trays with straps.
Ensure that all trays are of the same revision. The revision is indicated by the letter following “Rev”.
Align all pin-one chamfers on the trays together, as shown in the Properly-Aligned Peak Trays figure.
Align trays and ensure that they are seated properly before strapping them together.
Stack RQFP trays no higher than five trays (for example, four trays containing devices and one cover
tray).
• Stack Plastic Quad Flat Pack (PQFP) and BGA trays no higher than seven trays  (for example, six trays
containing devices and one cover tray).
• Shipping trays used for shipment of QFP and BGA (including FBGA, and lidless FBGA) packages
must be low profile.
• Shipping trays used for shipment of Pin-Grid Array (PGA) packages must be high profile.
The following figure shows an example of a properly-aligned peak trays.
Figure 7: Properly-Aligned Peak Trays
All the full-size JEDEC trays used by Altera can withstand temperatures of at least 150°C, or you can also
refer to the maximum rated temperature marked on each tray. These heat-resistant trays are not only
more rigid, but they endure baking at 125°C, which is the recommended temperature for dehydrating
moisture-sensitive devices.
The following table lists the part number for Altera-approved, low-profile trays.
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Trays for QFP, BGA, FBGA, and Lidless FBGA Devices without Carriers
Table 6: Altera-Approved Low-Profile Trays Part Number
This can either be an eight for 180ºC bakeable trays, six for 150ºC bakeable trays, or 13 for 140ºC bakeable trays.
Package
Type
Package
Code
Lead
Count
Body
Size
(mm)
Primary Supplier
Remark
Vendor and
Vendor Part
Number
Tray
Revision
Altera Part
Number
Parts or Tray
225
27 x 27 Plastic BGA
Daewon 1252727-9XX (1)
A
E20-1221100
40
225
27 x 27 Ceramic
BGA
R.H. Murphy
# RHM-672
—
E20-0355403
40
256
27 x 27
Daewon 1252727-9XX (1)
A
E20-1221100
40
356
35 x 35 FineLine
BGA
Daewon 1253535-9XX (1)
E
E20-1221400
24
Daewon
12Y-45454XX (1)
A
E20-1221600
12
—
Package
thickness of
~2.2mm
BGA
B
600
45 x 45
—
652
45 x 45 Wire Bond
Daewon
12Y-45454XX (1)
A
E20-1221600
12
652
45 x 45 Flip Chip
KOSTAT
KS-880351
ORIG
E20-3317000
12
672
35 x 35 FineLine
BGA
Daewon 1253535-9XX (1)
E
E20-1221400
24
Daewon
T0809050
A
E20-3314900
24
Package
thickness of
~2.2mm
672
35 x 35 Flip Chip
BGA
Package
thickness >
2.2mm
(1)
"XX represents Daewon temperature category. Must be 19 for 150ºC bakeable trays.
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Trays for QFP, BGA, FBGA, and Lidless FBGA Devices without Carriers
Package
Type
Package
Code
Lead
Count
724
Body
Size
(mm)
Primary Supplier
Remark
35 x 35 Flip Chip
BGA
Vendor and
Vendor Part
Number
Tray
Revision
Altera Part
Number
Parts or Tray
Daewon
T0809050
A
E20-3314900
24
Package
thickness >
2.2mm
FineLine
BGA
956
40 x 40
—
KOSTAT
KS-886H
02
E20-3312900
21
100
11 x 11
—
Daewon
12F-11111XX (1)
A
E20-1220500
176
144
13 x 13
—
Daewon
1F3-1313DXX (1)
A
E20-1220600
160
169
14 x 14
—
KOSTAT
KS-88088
00
E20-15430
119
256
17 x 17
—
Daewon
1F1-1717AXX (1)
A
E20-1220700
90
324
19 x 19
—
Daewon
12U-1919GXX (1)
A
E20-1220800
84
400
21 x 21
—
KOSTAT
KS-880104
ORIG
E20-0884303
60
484
23 x 23 FineLine
BGA
Daewon
12Y-23239XX (1)
A
E20-1220900
60
Daewon
12V-2323419
A
E20-1221000
60
F
Package
thickness of
~2.5mm
484
23 x 23 Flip Chip
BGA
Package
thickness of
~3.5mm
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Trays for QFP, BGA, FBGA, and Lidless FBGA Devices without Carriers
Package
Type
Package
Code
Lead
Count
Body
Size
(mm)
Primary Supplier
Vendor and
Vendor Part
Number
Remark
Tray
Revision
Altera Part
Number
Parts or Tray
484
23 x 23 OMPAC
Daewon
PFBGA
T0812012
(Convention
al and Pin
Gate)
B
E20-3326900
60
572
25 x 25
Daewon
14Y-2525119
A
E20-3319000
44
672
27 x 27 Flip Chip
BGA
Daewon
12V-2727319
B
E20-1221200
40
Daewon 1252727-9XX (1)
A
E20-1221100
40
—
Package
thickness >
2.2mm
672
27 x 27 FineLine
BGA
Package
thickness </
=2.2mm and
OMPAC
PFBGA
(Convention
al and Pin
Gate)
(2)
780
29 x 29 Flip Chip
KOSTAT
KS-88085
ORIG
E20-0737303
36
780
29 x 29 OMPAC
(Wirebond
PBGA) and
Lidless Flip
Chip (2)
KOSTAT
KS-880466
A
E20-3332900
36
780
29 x 29 FCmBGA
Flip Chip
Daewon
1F1-2929C19
B
E-20-3334900
36
These packages have lidless package tray offering.
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Trays for QFP, BGA, FBGA, and Lidless FBGA Devices without Carriers
Package
Type
Package
Code
Lead
Count
Body
Size
(mm)
Primary Supplier
Remark
Vendor and
Vendor Part
Number
Tray
Revision
Altera Part
Number
Parts or Tray
896
31 x 31 OMPAC
KOSTAT
PFBGA
KS-880120
(Convention
al and Pin
Gate)
01
E20-1129000
27
1020
33 x 33
Daewon
12Y-33334XX (1)
A
E20-1221300
24
1152
35 x 35 Flip Chip
BGA
Daewon
T0809050
A
E20-3314900
24
—
Package
thickness >
2.2mm
Hybrid BGA
(HBGA)
Altera Corporation
H
1152
35 x 35 Lidless Flip
Chip (2)
Daewon 1253535-9XX (1)
E
E20-1221400
24
1508
40 x 40
KOSTAT
KS-886H
02
E20-3312900
21
1510
40 x 40
Lidded Flip KOSTAT
Chip
KS-886H
02
E20-3312900
21
1517
40 x 40
—
KOSTAT
KS-886H
02
E20-3312900
21
1760
42.5 x
42.5
—
KOSTAT
KS-880350
ORIG
E20-3316900
12
1932
45 x 45
—
KOSTAT
KS-880351
ORIG
E20-3317000
12
484
27 x 27 Flip Chip
BGA
Daewon
12V-2727319
B
E20-1221200
40
—
Package
thickness >
2.2mm
780
33 x 33
—
Daewon
12Y-33334XX (1)
A
E20-1221300
24
1152
40 x 40
—
KOSTAT
KS-886H
02
E20-3312900
21
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Trays for QFP, BGA, FBGA, and Lidless FBGA Devices without Carriers
Package
Type
Package
Code
Micro BGA
(MBGA)
M
Lead
Count
Body
Size
(mm)
Primary Supplier
Vendor and
Vendor Part
Number
Remark
Altera Part
Number
Parts or Tray
1152
42.5 x
42.5
—
KOSTAT
KS-880350
ORIG
E20-3316900
12
1517
42.5 x
42.5
—
KOSTAT
KS-880350
ORIG
E20-3316900
12
1517
45 x 45
—
KOSTAT
KS-880351
ORIG
E20-3317000
12
1760
45 x 45
—
KOSTAT
KS-880351
ORIG
E20-3317000
12
64
4.5 x 4.5
—
Daewon
14C-4545D19
A
E20-3328900
490
68
5x5
—
KOSTAT
KS-880203
00
E20-3323000
640
100
6x6
—
KOSTAT
KS-88090
00
E20-3300700
429
144
7x7
—
Daewon
12U-07079XX (1)
A
E20-1220401
416
153
8x8
—
Daewon
1F3-0808119
A
E20-3322900
348
164
8x8
Daewon
1F3-0808119
A
E20-3322900
348
256
9x9
—
ePAK
eTR0121-54
(eN BG0909
1.5 1026 54)
0
E20-3335300
260
256
11 x 11
—
Daewon
12F-11111XX (1)
A
E20-1220500
176
301
11 x 11
—
Daewon
12F-11111XX (1)
A
E20-1220500
176
383
13 x 13
—
KOSTAT
KS-880432
00
E20-3335500
119
Lidless Flip
Chip (2)
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Tray
Revision
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AN-071
2015.06.12
Trays for QFP, BGA, FBGA, and Lidless FBGA Devices without Carriers
Package
Type
Quad Flat
No-Lead
(QFN)
Ultra
FineLine
BGA (UBGA)
Thin Quad
Flat Pack
(TQFP)/
Plastic
Enhanced
Altera Corporation
Package
Code
N
U
T/E
Primary Supplier
Lead
Count
Body
Size
(mm)
Remark
484
15 x 15
—
1019
17 x 17
148
Tray
Revision
Altera Part
Number
Parts or Tray
KOSTAT
KS-870369
00
E20-3335000
119
—
Daewon
1F1-1717AXX (1)
A
E20-1220700
90
11 x 11
—
Kostat KS870324
A
E20-3324900
176
49
7x7
—
Daewon
12U-07079XX (1)
A
E20-1220401
416
88
8 x 11
—
Shinon SLBG081115TJ
-1
ORIG
E20-0974303
210
169
11 x 11
—
Daewon
12F-11111XX (1)
A
E20-1220500
176
256
14 x 14
—
Kostat KS88088
00
E20-15430
119
324
15 x 15
—
KOSTAT
KS-870369
00
E20-3335000
119
358
17 x 17 Lidless Flip
Chip (2)
Daewon
1F1-1717AXX (1)
A
E20-1220700
90
484
19 x 19
Daewon
12U-1919GXX (1)
A
E20-1220800
84
672
23 x 23
B
E20-3326900
60
32
(TQFP
only)
7x7
—
KS-86015
00
E20-0717903
250
44
10 x 10
—
KS-8607
02
E20-0719303
160
—
Vendor and
Vendor Part
Number
OMPAC
Daewon
PFBGA
T0812012
(Convention
al & Pin
Gate)
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Trays for QFP, BGA, FBGA, and Lidless FBGA Devices without Carriers
Package
Type
Package
Code
Quad Flat
Pack (EQFP)
PQFP
RQFP
PGA
(3)
Remark
64
(EQFP
only)
7x7
—
100
14 x 14
144
Lead
Count
Tray
Revision
Altera Part
Number
Parts or Tray
KS-86015
00
E20-0717903
250
—
KS-8605
00
E20-0719403
90
20 x 20
—
KS-8303
03
E20-0719503
60
44
10 x 10
—
Daewon 1211010-3XX (1)
A
AE20-1222700
96
100
14 x 20
—
Kostat KS8212
03
E20-0523903
66
100
14 x 20 PQFP parts Peak NDassembled by 1420-2.7Sharp0611- 6P
JAPAN must
use Rev.6P
6P
E20-0990700
66
160
28 x 28
—
Kostat KS8201
10
E20-0524003
24
208
28 x 28
—
Kostat KS8201
10
E20-0524003
24
240
32 x 32
—
Kostat KS8205
06
E20-0524103
24
208
28 x28
—
Kostat KS8201
10
E20-0524003
24
240
32 x 32
—
Kostat KS8205
06
E20-0524103
24
304
40 x 40
—
Peak ND4040-3.80206 (3)
ORIG
E20-0355203
12
68
11 x 11
—
R.H. Murphy
# RHM-605
—
E20-0426603
21
84
11 x 11
—
R.H. Murphy
# RHM-605
—
E20-0426603
21
Q
R
G
Primary Supplier
Body
Size
(mm)
Vendor and
Vendor Part
Number
This can either be an eight for 180ºC bakeable trays, six for 150ºC bakeable trays, or 13 for 140ºC bakeable
trays.
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Straps for QFP, BGA, FBGA, and Lidless FBGA Devices without Carriers
Package
Type
Package
Code
Primary Supplier
Lead
Count
Body
Size
(mm)
Remark
Vendor and
Vendor Part
Number
Tray
Revision
Altera Part
Number
Parts or Tray
100
13 x 13
—
R.H. Murphy
# RHM-605
—
E20-0426603
21
160
15 x 15
—
R.H. Murphy
# RHM-605
—
E20-0426603
21
192
17 x 17
—
R.H. Murphy
# RHM-601
—
E20-0421703
10
232
17 x 17
—
R.H. Murphy
# RHM-601
—
E20-0421703
10
280
19 x 19
—
R.H. Murphy
# RHM-601
—
E20-0421703
10
403
19 x 19 Ceramic lid
R.H. Murphy
# RHM-620
—
E20-0355603
10
403
19 x 19 Gold lid
R.H. Murphy
# RHM-750
—
E20-0356303
8
503
22 x 22
—
R.H. Murphy
# RHM-750
—
E20-0356303
8
599
24 x 24
—
R.H. Murphy
# RHM-750
—
E20-0356303
8
Straps for QFP, BGA, FBGA, and Lidless FBGA Devices without Carriers
Straps secure trays and prevent devices from jostling during transportation and storage. To hold trays
together during transportation, Altera recommends using at least 1/2-inch wide polypropylene straps that
can withstand temperatures up to 130°C in case you are required to bake the devices before mounting.
When storing devices, Altera recommends using either velcro or polypropylene straps.
Velcro straps that are 20 inches in length are sufficiently long to bind stacks of two to seven trays for
storage. When you strap trays together for shipping, follow these guidelines:
• Use only heat-sealed polypropylene straps. Although velcro straps can hold trays together during
storage, they lack the strength required to hold trays during transportation.
• Set the tension on the strapping machine high enough to prevent straps from sliding off a stack of
trays.
• Secure one polypropylene strap across the length of the tray.
• Remove straps with a knife to prevent jostling devices in the trays.
Note: Do not use rubber bands, masking tape, string, or other similar material in place of velcro or
polypropylene straps.
The following figure shows the proper way to secure polypropylene straps on a stack of trays.
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Transferring Devices Between Tubes
15
Figure 8: Properly Secured Polypropylene Straps on a Stack of Trays
Transferring Devices Between Tubes
To prevent leads from bending on tube edges, follow these steps when transferring J-Lead devices and
QFP devices in carriers from one tube to another:
1. Use a metal or plastic sleeve to line up tube ends. If you do not have a sleeve, carefully line up the tube
ends.
2. Tilt the tubes so that the devices slide from one tube to the other. Do not shake or vibrate the tubes.
The following figure shows the sleeve for tube-to-tube transfer.
Figure 9: Sleeve for Tube-to-Tube Transfer
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Transferring QFP, BGA, FBGA, and Lidless FBGA Devices Without Carriers...
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Transferring QFP, BGA, FBGA, and Lidless FBGA Devices Without Carriers
Between Trays
Altera recommends using automated pick-and-place machines in an ESD-protected environment to
transfer QFP or BGA devices between trays. If you are required to transfer these devices manually, follow
these guidelines:
• Work in an ESD-protected environment.
• Use ground straps and finger cots.
• Use only vacuum pens to transfer QFP or BGA devices manually. Vacuum pens must be able to
maintain their vacuum for at least four seconds.
• Transfer devices right-side-up over a table, then release the vacuum only after the device is oriented
and seated in the tray properly.
• Do not allow QFP device leads to contact the tray.
For transferring lidless FBGA devices, follow these guidelines:
•
•
•
•
Ensure that you use vacuum pens with soft rubber tips.
Ensure that the vacuum pen does not touch the edge of the exposed die.
Ensure that the vacuum tip covers the die area without losing any suction.
Altera recommends that you use Altera-specified trays for lidless flip chip. For more information, refer
to the Altera-Approved Low-Profile Trays Part Number table as listed in the Related Information
section.
The following figure shows how you can transfer a QFP device with a vacuum pen.
Figure 10: Transferring a QFP Device with a Vacuum Pen
Related Information
Trays for QFP, BGA, FBGA, and Lidless FBGA Devices without Carriers on page 6
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Dry Packing J-Lead, QFP, BGA, FBGA, and Lidless BGA Devices
17
Dry Packing J-Lead, QFP, BGA, FBGA, and Lidless BGA Devices
Dry packing is a method of packing moisture-sensitive devices for shipment. Risk to moisture-sensitive
devices can occur when the high-soldering temperatures of the reflow process suddenly heat any moisture
absorbed by a plastic package. Although many of Altera devices are not sensitive to moisture, Altera
adopted dry packing as a standard practice for moisture-sensitive devices to eliminate all risk of moisture.
Additionally, Altera can dry-pack other devices upon request. During dry packing, devices are first baked
to remove any existing moisture and then packed and vacuum-sealed in moisture-barrier bags.
The following table lists the contents of a typical package.
Table 7: Dry Pack Contents
Item
Specification
Moisture-barrier bag
MIL-B-81705C, Type I or equivalent
Desiccant
MIL-D-3464, Type II or equivalent
Humidity-indicator card
Compliant with MIL-I-8835A
Labels
ID label and caution label
To maintain a moisture-free environment, follow these guidelines after receiving dry-packed devices from
Altera:
• Open bags as close to the seal as possible to leave enough of the bag for resealing.
• Reseal bags after opening to minimize exposure to moisture.
• Inspect all dry packs for potential leaks in the seals or bags. If a leak exists and the humidity-indicator
card shows an unacceptable humidity level (for example, the 20% dot has started to turn pink), rebake
the devices. If a leak exists but the humidity-indicator shows an acceptable humidity level (for
example, the 20% dot is blue with no pink), reseal the devices in an undamaged bag.
• Check that the humidity-indicator card shows acceptable humidity after opening dry packs. If the card
shows an unacceptable humidity level, rebake the devices.
• Store dry packs in condition less than 40°C and less than 90% relative humidity.
In addition, Altera lists the floor life on every dry-pack label. The floor life is the length of time you can
expose a device to a factory environment (less than 30°C and less than 60% relative humidity) after you
removed the device from the bag and before it is mounted. Parts that are not dry packed have an
unlimited floor life but you must store at a proper environment (less than 30°C and less than 85% relative
humidity). If the interval between opening a dry pack and mounting the devices onto a board exceeds the
floor life of the device, rebake devices prior to mounting.
Distributors have an additional allotment of time beyond the labelled floor life. Six hours are available for
products with a 24-hour floor life, and 24 hours are available for products with a 168-hour or one-year
floor life. These time allotments allow for programming and repacking as required.
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Dry Pack Sizes
When dry-packing devices, follow these guidelines:
• When transferring parts to new dry pack bags, operators must remember to copy the floor life and
expiration date accurately to the new dry-pack labels.
• Bake QFP or BGA devices in strapped heat-resistant trays at 125°C for at least 12 hours.
• Bake J-Lead devices in heat-resistant tubes at 125°C for at least 12 hours. If you lack heat-resistant
tubes, bake J-Lead devices on a cookie sheet in a dead-bug orientation.
• Use heat-sealed bags that are resistant to punctures and abrasion.
• Use foam covers or bubble wrap around a stack of trays inside the moisture-barrier bag to avoid
punctures.
• Seal bags with a vacuum-operated bag-sealing machine. Relax the vacuum enough to prevent the tube
or tray from puncturing the bag.
• If the dry pack is open for longer than one hour, replace the desiccant and humidity indicator card.
• Use at least one unit of desiccant per dry pack.
• You must not use zip-lock and dry-pack bags for longer than one week.
Dry Pack Sizes
The following table lists the available dry pack sizes. Altera uses heavy-duty, 6" x 24", 6" x 30", and 10" x
30" bags for dry-packing tubes. Bags for trays by Altera are 10" x 20".
Table 8: Dry Pack Sizes
•
•
•
•
•
•
•
•
The tray quantities do not include one cover tray.
For the dry-packed devices in Tube 2, foam sheets are used at the bottom of the tube box.
To optimize the material and space usage, the box and foam sizes are "recommended only".
If bubble wrap is used inside the moisture bag, follow the "2-feet bubble" recommendation. This is applicable
only for all dry-packed devices.
J44 = 100% Pack 2.
L20DP, L28DP, S08/16, TR = 100% Pack 3.
No Pack 3 for all PGAs.
Pack 1 and Pack 2 are in jewellery boxes.
Package and Lead
"Quantity/
Primary
Container"
Type of
Container
Minimum
Container
Quantity
Maximum
Container
Quantity
B225
40
TRAY
1
40
6
240
B256
40
TRAY
1
40
6
240
B356
24
TRAY
1
24
4
96
B600
12
TRAY
1
12
6
72
B652
12
TRAY
1
12
4
48
B672
24
TRAY
1
24
3
72
B724
24
TRAY
1
24
3
72
B956
21
TRAY
1
21
3
63
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Dry Pack Sizes
Package and Lead
"Quantity/
Primary
Container"
Type of
Container
Minimum
Container
Quantity
Maximum
Container
Quantity
D08
50
TUBE
1
50
N/A
N/A
D10
1000
REEL
N/A
N/A
1
1000
D12
1000
REEL
N/A
N/A
1
1000
D20
20
TUBE
10
200
N/A
N/A
D24
15
TUBE
8
120
48
720
D28
13
TUBE
5
65
45
585
D36
500
REEL
1
500
2
1000
D36TR
500
REEL
1
500
2
1000
D40
10
TUBE
5
50
40
400
E144
60
TRAY
1
60
6
360
E64
250
TRAY
1
250
6
1500
F100
176
TRAY
1
176
6
1056
F1020
24
TRAY
1
24
3
72
F1152
24
TRAY
1
24
3
72
F144
160
TRAY
1
160
6
960
F1508
21
TRAY
1
21
3
63
F1510
21
TRAY
1
21
3
63
F1517
21
TRAY
1
21
3
63
F169
119
TRAY
1
119
6
714
F1760
12
TRAY
1
12
4
48
F1932
12
TRAY
1
12
4
48
F1933
12
TRAY
1
12
4
48
F24
187
TRAY
1
187
5
935
F256
90
TRAY
1
90
6
540
F324
84
TRAY
1
84
3
252
F33
24
TRAY
1
24
3
72
F400
60
TRAY
1
60
4
240
F484
60
TRAY
1
60
4
240
F484FC
60
TRAY
1
60
4
240
F572
44
TRAY
1
44
4
176
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Dry Pack Sizes
Package and Lead
"Quantity/
Primary
Container"
Type of
Container
Minimum
Container
Quantity
Maximum
Container
Quantity
F672
40
TRAY
1
40
4
160
F672F35
24
TRAY
1
24
3
72
F672FC
40
TRAY
1
40
4
160
F780
36
TRAY
1
36
4
144
F780FC
36
TRAY
1
36
4
144
F896
27
TRAY
1
27
3
81
G100
21
TRAY
1
21
N/A
N/A
G160
21
TRAY
1
21
N/A
N/A
G192
10
TRAY
1
10
N/A
N/A
G232
10
TRAY
1
10
N/A
N/A
G280
10
TRAY
1
10
N/A
N/A
G403
10
TRAY
1
10
N/A
N/A
G503
10
JEWEL
1
10
N/A
N/A
G599
8
JEWEL
1
8
N/A
N/A
G655
8
JEWEL
1
8
N/A
N/A
G68
21
TRAY
1
21
N/A
N/A
G84
21
TRAY
1
21
N/A
N/A
H1152
21
TRAY
1
21
3
63
H1152H425
12
TRAY
1
12
4
48
H1517
12
TRAY
1
12
4
48
H1760
12
TRAY
1
12
4
48
H484
40
TRAY
1
40
4
160
H780
24
TRAY
1
24
3
72
J28
36
TUBE
1
36
9
324
J44
26
TUBE
N/A
N/A
N/A
N/A
J68
18
TUBE
1
18
10
180
J84
15
TUBE
1
15
10
150
L20
49
TUBE
4
196
24
1176
L20DP
49
TUBE
N/A
N/A
24
1176
L28
39
TUBE
4
156
24
936
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Dry Pack Sizes
Package and Lead
"Quantity/
Primary
Container"
Type of
Container
Minimum
Container
Quantity
Maximum
Container
Quantity
L28DP
39
TUBE
N/A
N/A
24
936
L44
26
TUBE
5
130
30
780
L44DP
26
TUBE
5
130
30
780
L44TR
500
REEL
N/A
N/A
1
500
L68
18
TUBE
3
54
24
432
L84
15
TUBE
1
15
15
225
L84TR
200
REEL
N/A
N/A
1
200
M100
429
TRAY
1
429
3
1287
M100TR
3000
REEL
N/A
N/A
1
3000
M1019TR
875
REEL
N/A
N/A
1
875
M144
416
TRAY
1
416
3
1248
M153
348
TRAY
1
348
3
1044
M164
348
TRAY
1
348
3
1044
M256
176
TRAY
1
176
6
1056
M256M99
260
TRAY
1
260
3
780
M301
176
TRAY
1
176
6
1056
M383
119
TRAY
1
119
6
714
M484
119
TRAY
1
119
6
714
M64
490
TRAY
1
490
3
1470
M68
640
TRAY
1
640
3
1920
N148
176
TRAY
1
176
6
1056
P08
50
TUBE
2
100
12
600
P20
18
TUBE
10
180
60
1080
P24
15
TUBE
8
120
48
720
P28
14
TUBE
8
112
48
672
P40
10
TUBE
5
50
40
400
Q100
66
TRAY
1
66
10
660
Q100SH
50
TRAY
1
50
10
500
Q100TR
1
REEL
N/A
N/A
1
1
Q132
36
TRAY
1
36
6
216
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Dry Pack Sizes
Package and Lead
"Quantity/
Primary
Container"
Type of
Container
Minimum
Container
Quantity
Maximum
Container
Quantity
Q16
1000
REEL
N/A
N/A
1
1000
Q160
24
TRAY
1
24
6
144
Q20
1000
REEL
N/A
N/A
1
1000
Q208
24
TRAY
1
24
6
144
Q24
500
REEL
1
500
2
1000
Q240
24
TRAY
1
24
4
96
Q28
500
REEL
N/A
N/A
1
500
Q30
500
REEL
N/A
N/A
1
500
Q36
1000
REEL
N/A
N/A
1
1000
Q38
500
REEL
N/A
N/A
1
500
Q40
1000
REEL
N/A
N/A
1
1000
Q44
96
TRAY
1
96
6
576
Q44TR
500
REEL
N/A
N/A
1
500
Q46
1000
REEL
N/A
N/A
1
1000
Q54
250
REEL
N/A
N/A
1
250
Q58
250
REEL
N/A
N/A
1
250
Q68
250
REEL
1
250
2
500
Q76
250
REEL
N/A
N/A
1
250
Q92
250
REEL
N/A
N/A
1
250
R144
60
TRAY
1
60
4
240
R208
24
TRAY
1
24
4
96
R240
24
TRAY
1
24
4
96
R304
12
TRAY
1
12
4
48
S08
100
TUBE
N/A
N/A
20
2000
S14
1000
REEL
N/A
N/A
1
1000
S16
49
TUBE
N/A
N/A
25
1225
S20
38
TUBE
1
38
9
342
S24
31
TUBE
1
31
9
279
S28
27
TUBE
1
27
9
243
S8
1000
REEL
N/A
N/A
1
1000
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Shipping J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices in Boxes
Package and Lead
"Quantity/
Primary
Container"
Type of
Container
Minimum
Container
Quantity
Maximum
Container
23
Quantity
T100
90
TRAY
1
90
6
540
T100TR
1000
REEL
N/A
N/A
1
1000
T14
1000
REEL
N/A
N/A
1
1000
T144
60
TRAY
1
60
6
360
T32
250
TRAY
1
250
6
1500
T44
160
TRAY
1
160
6
960
U14
1000
REEL
N/A
N/A
1
1000
U16
1000
REEL
N/A
N/A
1
1000
U169
176
TRAY
1
176
6
1056
U16TR
1000
REEL
N/A
N/A
1
1000
U256
119
TRAY
1
119
6
714
U324
119
TRAY
1
119
6
714
U358
90
TRAY
1
90
6
540
U484
84
TRAY
1
84
3
252
U49
416
TRAY
1
416
3
1248
U672
60
TRAY
1
60
4
240
U88PK
210
TRAY
1
210
3
630
U88SH
80
TRAY
1
80
6
480
V81
1000
REEL
N/A
N/A
1
1000
W100
66
TRAY
1
66
6
396
W208
24
TRAY
1
24
4
96
Shipping J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices in Boxes
When shipping trays or tubes of devices, only use boxes that have passed the ASTM D776 test for
shipping containers. To protect against ESD, Altera recommends using boxes with an internal, conductive
finish. You must add filler material to boxes to cushion the contents and prevent trays or tubes from
shifting position during shipping. Boxes must contain enough filler material to prevent stoppers from
falling out of tubes when jostled. Filler material must meet the following standards:
• Must be antistatic and non-corrosive
• Must not crumble, flake, powder, outgas, or shed
• Must not scratch or puncture the trays, tubes, or dry-pack bags
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Ordering Information
Ordering Information
The following table lists Altera-approved packing media and suppliers.
Material
Tubes and stoppers
Trays (QFPs and BGAs)
Suppliers
Altera
Kostat
Daewon
Trays (PGAs)
R.H Murphy
ESD velcro straps
Com-Kyl
0.5”-wide, polypropylene, heat-sealed straps South Bay Packaging
(E30-04766)
Tray-strapping machines (using polypropy‐ Kent Lansdberg
lene, heat-sealed straps) or other dryStraPack (Sivaron Model S-699, D-52, and AQ-7)
packing equipment
Foam packaging (foam filler)
Pacific Southwest Container
Bubble wraps, trays, or dry-packing
supplies
Ecotech
Vacuum pens
Virtual Industries
Related Information
•
•
•
•
•
•
•
•
•
•
Altera
Kostat
Daewon
R. H. Murphy
Com-Kyl
South Bay Packaging
Kent Landsberg
Pacific Southwest Container
Ecotech
Virtual Industries
Document Revision History
The following table lists the revision history for this document.
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Document Revision History
25
Table 9: Document Revision History
Date
Version
June 2015
2015.06.12
Changes
• Updated the Altera-Approved Low-Profile
Trays Part Number table to include the
following packages:
• FBGA 780 FCmBGA Flip Chip (29 mm
x 29 mm)
• FBGA 1510 Lidded Flip Chip (40 mm x
40 mm)
• HBGA 1517 (45 mm x 45 mm)
• HBGA 1760 (45 mm x 45 mm)
• MBGA 153 (8 mm x 8 mm)
• MBGA 256 (9 mm x 9 mm)
• MBGA 301 (11 mm x 11 mm)
• MBGA 383 (13 mm x 13 mm)
• MBGA 484 (15 mm x 15 mm)
• UBGA 324 (15 mm x 15 mm)
• UBGA 672 (23 mm x 23 mm)
• Updated the Dry Pack Sizes table.
January 2011
5.0
Guidelines for Handling J-Lead, QFP, BGA, FBGA, and Lidless FBGA Devices
Send Feedback
• Updated to include lidless FBGA in this
document.
• Updated Table 6, Table 8, and Table 9.
• Minor text edits.
Altera Corporation