SIM5215&SIM5216_Hardware_Design_V2.02

SIM5215&SIM5216_Hardware_Design
_V2.02
Smart Machine Smart Decision
Document Title
SIM5215&SIM5216 Hardware Design
Version
2.02
Date
2012-08-31
Status
Release
Document Control ID
SIM5215&SIM5216_Hardware Design_V2.02
General Notes
SIMCom offers this information as a service to its customers, to support application and engineering
efforts that use the products designed by SIMCom. The information provided is based upon requirements
specifically provided to SIMCom by the customers. SIMCom has not undertaken any independent search
for additional relevant information, including any information that may be in the customer’s possession.
Furthermore, system validation of this product designed by SIMCom within a larger electronic system
remains the responsibility of the customer or the customer’s system integrator. All specifications supplied
herein are subject to change.
Copyright
This document contains proprietary technical information which is the property of SIMCom Limited,
copying of this document and giving it to others and the using or communication of the contents thereof,
are forbidden without express authority. Offenders are liable to the payment of damages. All rights
reserved in the event of grant of a patent or the registration of a utility model or design. All specification
supplied herein are subject to change without notice at any time.
Copyright © Shanghai SIMCom Wireless Solutions Ltd. 2012
Smart Machine Smart Decision
Contents
Revision History .......................................................................................................................................... 9
1
Introduction ........................................................................................................................................ 10
1.1 Product Outline.............................................................................................................................. 10
1.2 Hardware Interface Overview.........................................................................................................11
1.3 Hardware Diagram..........................................................................................................................11
1.4 Functional Overview...................................................................................................................... 12
2
Package Information .......................................................................................................................... 13
2.1 Pin Configuration........................................................................................................................... 13
2.2 Pin description ............................................................................................................................... 16
2.3 Package Dimensions ...................................................................................................................... 19
3
Application Interface Specification................................................................................................... 20
3.1 Power Supply................................................................................................................................. 20
3.1.1 Power Supply Pin.................................................................................................................... 21
3.1.2 Design Guide .......................................................................................................................... 21
3.1.3 RTC Backup............................................................................................................................ 23
3.2 Power on/off Time Sequence ......................................................................................................... 25
3.2.1 Power on Sequence ................................................................................................................. 25
3.2.2 Power off Sequence ................................................................................................................ 27
3.3 UART Interface.............................................................................................................................. 28
3.3.1 Pin Description........................................................................................................................ 29
3.3.2 Application Guide................................................................................................................... 29
3.4 Audio Interfaces............................................................................................................................. 30
3.4.1 Pin Description........................................................................................................................ 31
3.4.2 Design Guide .......................................................................................................................... 32
3.4.3 Audio Parameter Characteristic .............................................................................................. 33
3.5 USIM Interface .............................................................................................................................. 34
3.5.1 Pin description ........................................................................................................................ 35
3.5.2 Application Guide................................................................................................................... 35
3.5.3 Recommend Components ....................................................................................................... 36
3.6 I2C Interface .................................................................................................................................. 37
3.6.1 Pin Description........................................................................................................................ 38
3.6.2 Signal Description................................................................................................................... 38
3.6.3 Design Guide .......................................................................................................................... 38
3.7 Camera Interface............................................................................................................................ 38
3.7.1 Pin Description........................................................................................................................ 38
3.7.2 Application Guide................................................................................................................... 39
3.8 USB Interface ................................................................................................................................ 41
3.8.1 Application Guide................................................................................................................... 42
3.9 SDIO Interface............................................................................................................................... 42
3.9.1 Pin Description........................................................................................................................ 43
3.9.2 Design guide ........................................................................................................................... 43
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3.10
GPIO Interface ........................................................................................................................... 44
3.10.1
Pin Description .................................................................................................................... 44
3.10.2
Application Guide ............................................................................................................... 45
3.11
PCM Interface ............................................................................................................................ 46
3.11.1
Pin Description .................................................................................................................... 47
3.11.2
Signal Description ............................................................................................................... 47
3.12
Multi-functional interface........................................................................................................... 50
3.12.1
Reset Function ..................................................................................................................... 50
3.12.2
ADC..................................................................................................................................... 51
3.12.3
LDO..................................................................................................................................... 52
4
RF Specification .................................................................................................................................. 52
4.1 RF Specification ............................................................................................................................ 52
4.2 Operating Specification ................................................................................................................. 53
4.3 Antenna Design Guide................................................................................................................... 54
4.3.1 Antenna connector .................................................................................................................. 55
4.3.2 Antenna pad ............................................................................................................................ 56
5
Reliability and Operating Characteristics........................................................................................ 57
5.1 Electronic Characteristics .............................................................................................................. 57
5.2 Operating Mode ............................................................................................................................. 57
5.2.1 Operating Modes Overview .................................................................................................... 58
5.2.2 Minimize Power Consumption ............................................................................................... 59
5.3 Current Consumption..................................................................................................................... 59
5.4 EMC and ESD Notes ..................................................................................................................... 61
6
Guide for Production.......................................................................................................................... 62
6.1 Top and Bottom View of SIM5215&SIM5216 ............................................................................. 62
6.2 Moisture Sensitivity Level (MSL) ................................................................................................. 63
6.3 Firmware Update ........................................................................................................................... 63
6.3.1 SD Card Update ...................................................................................................................... 63
6.3.2 USB Update ............................................................................................................................ 64
Appendix .................................................................................................................................................... 66
A. SIM5215&SIM5216 GPIOs List ........................................................................................................ 66
B. Digital I/O Characteristics................................................................................................................... 66
C. Related Documents.............................................................................................................................. 67
D. Terms and Abbreviations .................................................................................................................... 68
E. Safety Caution ..................................................................................................................................... 70
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Table Index
Table 1: SIM5215&SIM5216 series frequency bands..................................................................................................... 10
Table 2: General Feature ................................................................................................................................................. 12
Table 3: Pin definition..................................................................................................................................................... 15
Table 4: Pin description................................................................................................................................................... 16
Table 5: Pin description................................................................................................................................................... 21
Table 6: Power on timing ................................................................................................................................................ 26
Table 7: Power off timing ............................................................................................................................................... 27
Table 8: Pin description................................................................................................................................................... 29
Table 9: Logic level ........................................................................................................................................................ 29
Table 10: Pin description................................................................................................................................................. 31
Table 11: MIC input characteristics ................................................................................................................................ 31
Table 12: Audio output characteristics ............................................................................................................................ 31
Table 13: Speaker output characteristics ......................................................................................................................... 31
Table 14: Audio parameter .............................................................................................................................................. 34
Table 15: Electronic characteristic .................................................................................................................................. 35
Table 16: Pin description................................................................................................................................................. 35
Table 18: Pin description................................................................................................................................................. 38
Table 19: Electronic characteristic .................................................................................................................................. 38
Table 20: Pin description................................................................................................................................................. 39
Table 21: GPIO configuration......................................................................................................................................... 41
Table 22: Electronic characteristic .................................................................................................................................. 41
Table 23: Electronic characteristic .................................................................................................................................. 43
Table 24: Pin description................................................................................................................................................. 43
Table 25: Electronic characteristic .................................................................................................................................. 44
Table 26: Pin description................................................................................................................................................. 44
Table 27: LED status....................................................................................................................................................... 45
Table 28: Control status .................................................................................................................................................. 46
Table 29: Electronic characteristic .................................................................................................................................. 47
Table 30: Pin description................................................................................................................................................. 47
Table 31: Timing parameters........................................................................................................................................... 48
Table 32: Timing parameters........................................................................................................................................... 50
Table 33: Electronic Characteristics................................................................................................................................ 51
Table 34: Electronic characteristic .................................................................................................................................. 52
Table 35: Conducted transmission power ....................................................................................................................... 52
Table 36: Operating frequencies ..................................................................................................................................... 52
Table 37: Conducted receive sensitivity.......................................................................................................................... 53
Table 38: GPRS/EDGE data throughout ......................................................................................................................... 53
Table 39: HSDPA throughout.......................................................................................................................................... 54
Table 40: Absolute maximum ratings.............................................................................................................................. 57
Table 41: Recommended operating ratings ..................................................................................................................... 57
Table 42: Operating temperature..................................................................................................................................... 57
Table 43: Operating Modes Overview ............................................................................................................................ 58
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Table 44: Current consumption....................................................................................................................................... 60
Table 45: The ESD performance measurement table (Temperature: 25℃, Humidity: 45%) .......................................... 62
Table 46: SIM5215&SIM5216 GPIOs list ...................................................................................................................... 66
Table 47: Digital I/O characteristics................................................................................................................................ 66
Table 48: Related documents .......................................................................................................................................... 67
Table 49: Terms and Abbreviations................................................................................................................................. 68
Table 50: Safety caution.................................................................................................................................................. 70
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Figure Index
Figure 1: SIM5215&SIM5216 functional architecture ................................................................................................... 11
Figure 2: Pin view........................................................................................................................................................... 13
Figure 3: Board to Board connector jack(NAIS AXK770247G) ............................................................................... 14
Figure 4:
Board to Board connector pin(NAIS AXK870145W)............................................................................. 14
Figure 5: Top dimensions (Unit: mm) ............................................................................................................................. 19
Figure 6: Side dimensions (Unit: mm)............................................................................................................................ 19
Figure 7: Bottom dimensions (Unit: mm) ....................................................................................................................... 20
Figure 8: VBAT voltage drop during burst emission (GSM/GPRS) ............................................................................... 21
Figure 9: VBAT input application circuit........................................................................................................................ 22
Figure 10: Reference circuit of the LDO power supply .................................................................................................. 22
Figure 11: Reference circuit of the DCDC power supply ............................................................................................... 23
Figure 12: RTC supply from capacitor............................................................................................................................ 23
Figure 13: RTC supply from non-chargeable battery ...................................................................................................... 24
Figure 14: RTC supply from rechargeable battery .......................................................................................................... 24
Figure 15: Seiko XH414H-IV01E Charge-Discharge characteristic............................................................................... 25
Figure 16: Power on Timing Sequence ........................................................................................................................... 26
Figure 18: Power off timing sequence ............................................................................................................................ 27
Figure 19: Full modem.................................................................................................................................................... 28
Figure 20: Null modem ................................................................................................................................................... 28
Figure 21: RI behaviour in NULL Modem ..................................................................................................................... 30
Figure 22: RI behaviour in FULL Modem ...................................................................................................................... 30
Figure 23: Speaker interface configuration ..................................................................................................................... 32
Figure 24: Receiver interface configuration.................................................................................................................... 32
Figure 25: Microphone interface configuration .............................................................................................................. 33
Figure 26:: Headphone Microphone interface configuration .......................................................................................... 33
Figure 27: USIM interface reference circuit ................................................................................................................... 36
Figure 28: Amphenol SIM card socket ........................................................................................................................... 37
Figure 29: Reference circuit............................................................................................................................................ 40
Figure 30: Analog sensor circuit reference...................................................................................................................... 40
Figure 31: USB interface ................................................................................................................................................ 42
Figure 32: SDIO interface circuit.................................................................................................................................... 44
Figure 33: Application circuit ......................................................................................................................................... 45
Figure 34: Flight mode switch ........................................................................................................................................ 46
Figure 35: Synchrony timing .......................................................................................................................................... 47
Figure 36: EXT CODEC to MODULE timing................................................................................................................ 48
Figure 37: MODULE to EXT CODEC timing................................................................................................................ 48
Figure 38: Synchrony timing .......................................................................................................................................... 49
Figure 39: EXT CODEC to MODULE timing................................................................................................................ 49
Figure 40: MODULE to EXT CODEC timing................................................................................................................ 49
Figure 41: Reset circuit................................................................................................................................................... 51
Figure 42: Reference circuit............................................................................................................................................ 51
Figure 43: RF adapter cable MXTK88TK2000 .............................................................................................................. 55
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Figure 44: Module antenna connector............................................................................................................................. 55
Figure 45: RF connector MM9329-2700 ........................................................................................................................ 56
Figure 46: Module antenna pad....................................................................................................................................... 56
Figure 47: Top and bottom view of SIM5215&SIM5216 ............................................................................................... 62
Figure 48: Reference circuit for SD card update............................................................................................................. 63
Figure 49: SD card update procedure.............................................................................................................................. 64
Figure 50: Reference circuit for USB update (UART communication) .......................................................................... 64
Figure 51: Reference circuit for USB update (USB communication) ............................................................................. 65
Figure 52: SD card update procedure.............................................................................................................................. 65
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Revision History
Data
Version
Description of change
2010-4-26
01.00
Origin
Author
2010-07-19
01.01
2010-08-26
01.02
Add RESET timing and module is
waked up by DTR signal description,
modify the description of PCM
interface
Add firmware update description
2011-3-17
2.00
Arrange new structure
Xiaoyangyang
2012-07-12
2.01
Modify the Hardware Diagram
libing
2.02
Delete the chapter of Automatic
power on.
Modify time value in table 6 and
table 7.
Figure 19, Figure 20 and Figure 27
are modified.
Libing
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1 Introduction
This document describes electronic specifications, RF specifications, function interface, mechanical
characteristic and testing conclusions of the SIMCom SIM5215&SIM5216 module. With the help of this
document and other SIM5215&SIM5216 software application notes, user guides, users can quickly
understand and use SIM5215&SIM5216 module to design and develop applications quickly.
1.1
Product Outline
Designed for global market, SIM5215&SIM5216 is a quad-band GSM/GPRS/EDGE and dual-band
UMTS /HSDPA that works on frequencies of GSM 850MHz, EGSM 900 MHz, DCS 1800 MHz, PCS
1900MHz and WCDMA 2100/900MHz, 2100/850 MHz or 1900/850MHz. User can choose the module
based on the wireless network configuration. In this document, the entire radio band configuration of
SIM5215&SIM5216 series is described in the following table.
Table 1: SIM5215&SIM5216 series frequency bands
Standard
GSM
Frequency
SIM5215E
SIM5216E
SIM5215J
SIM5216J
SIM5215 A
SIM5216 A
GSM
850MHz
3
3
3
3
3
3
EGSM
900MHz
3
3
3
3
3
3
DCS1800M
Hz
3
3
3
3
3
3
PCS1900M
Hz
3
3
3
3
3
3
3
3
3
3
3
3
850MHz
WCDMA
900MHz
3
1900MHz
2100MHz
HSPA
3
3
HSDPA
3
3
3
3
3
3
HSUPA
With a tiny configuration of 36*26*4.5 mm and integrated functions, SIM5215&SIM5216 can meet
almost any space requirement in users’ application, such as Smart phone, PDA phone, industrial handhelds,
machine-to-machine, vehicle applications, etc..
There are 70 pins on SIM5215&SIM5216, which provide most application interfaces for customers’ board.
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1.2
Hardware Interface Overview
Sub-interfaces are described in detail in the next chapter, which includes:
● Power Supply
● USB Interface
● Serial Interface
● Analog Audio Interfaces
● SIM Interface
● GPIO
● ADC
● LDO Power Output
● Camera Interface
● PCM Interface
● SDIO Interface
● RTC
● I2C Interface
1.3
Hardware Diagram
The global architecture of the SIM5215&SIM5216 Embedded module is described in the figure below.
Figure 1: SIM5215&SIM5216 functional architecture
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1.4
Functional Overview
Table 2: General Feature
Feature
Implementation
Power supply
Single supply voltage 3.3~4.2V
●
●
Transmission data
●
●
●
●
Dual-mode UMTS/HSDPA/EDGE/GPRS operation
GPRS Class B, multislot class 12 operation, Supports coding scheme:
CS1-4
EDGE multislot class 12 operation, Supports coding schemes
MSC1-9
UMTS R99 data rates-384 kbps DL/UL
HSDPA Category 5/6 -3.6 Mbps Category12-1.8 Mbps
CSD feature: 9.6, 14.4, 64 kbps UL/DL
MT, MO, CB, Text and PDU mode
● SMS storage: SIM card
● Support transmission of SMS alternatively over CSD or GPRS.
User can choose preferred mode.
●
SMS
SIM interface
Audio features(optional)
Serial interface
Support identity card: 1.8V, 3V.
Speech codec modes:
● Half Rate (ETS 06.20)
● Full Rate (ETS 06.10)
● Enhanced Full Rate (ETS 06.50 / 06.60 / 06.80)
● AMR (WCDMA)
● AMR+QCP (GSM)
● A5/1, A5/2, and A5/3 ciphering
Serial Port standard or null modem mode on Serial Port Interface
● Serial Port can be used to control module by sending AT command
●
USB
Support USB2.0 Slave mode
Phonebook management
Support phonebook types: SM, FD, LD, RC, ON, MC.
Support SAT class 3, GSM 11.14 Release 98
Support USAT
SIM application toolkit
Real Time Clock
Timer function
Physical characteristics
Firmware upgrade
PCM
Temperature range
Support RTC
Programmable by AT command
Size:36*26*4.5mm
Weight:7g
Firmware upgrade over USB interface
Multiplex on GPIOs. 3 kinds of coding formats: 8 bit (υ-law or A-law)
and 16 bit (linear).
Operation temperature: -30°C to +80°C
● Storage temperature -40°C to +85°C
●
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2 Package Information
2.1
Pin Configuration
All hardware interfaces which connect SIM5215&SIM5216 to customers’ application platform are through
70 pins B2B connector. Figure 2 is SIM5215&SIM5216 outline diagram.
Figure 2: Pin view
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Figure 3: Board to Board connector jack(NAIS AXK770247G)
Figure 4:
Board to Board connector pin(NAIS AXK870145W)
Note: We recommend users to adopt the board to board connector jack ( NAIS AXK770247G ) to connect with
SIM5215A&SIM5216A(NAIS AXK870145W).
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Table 3: Pin definition
Pin No.
Define
Pin No.
Define
1
VBAT
70
VBAT
2
VBAT
69
VBAT
3
VBAT
68
VBAT
4
GND
67
GND
5
GND
66
GND
6
UART_TXD
65
GPIO0
7
UART_CTS
64
UART_RXD
8
UART_DCD
63
UART_RTS
9
USB_VBUS
62
UART_DTR
10
GPIO1
61
UART_RI
11
VRTC
60
USB_D_P
12
USIM_CLK
59
USB_D_M
13
USIM_RESET
58
GND
14
Reserved
57
V_USIM
15
CAM_D2
56
USIM_DATA
16
CAM_D4
55
Reserved
17
CAM_D6
54
CAM_D3
18
CAM_D8
53
CAM_D5
19
CAM_HSYNC
52
CAM_D7
20
GND
51
CAM_D9
21
CAM_CLK
50
CAM_VSYNC
22
CAM_STANDBY
49
CAM_PCLK
23
SPK_P
48
CAM_RESET
24
SPK_N
47
IIC_SDA
25
EAR_P
46
IIC_SCL
26
EAR_N
45
POWER_ON
27
HPR
44
MIC_N
28
HPL
43
MIC_P
29
RESET
42
HP_MICP
30
GPIO2
41
HKADC
31
GPIO3
40
VREG_AUX
32
GPIO4
39
SD_DATA3
33
GPIO5
38
SD_DATA2
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34
SD_CLK
37
SD_DATA1
35
SD_CMD
36
SD_DATA0
2.2
Pin description
Table 4: Pin description
Pin name
I/O
Description
Comment
Power Supply
VBAT
Power supply voltage
VRTC
I/O
Power supply for RTC
VREG_AUX
O
LDO power output
GND
If it is unused, keep open.
Ground
Power on/off
I
POWER_ON should be pulled low at
least 64ms to power on or 500ms to
power off the module.
I
Differential audio input
I
Single audio input
O
Positive and negative voice-band
Differential output
O
Auxiliary right channel and left
channel voice-band output
O
Loud Speaker Differential Output
V_USIM
O
Voltage Supply for SIM card
Support 1.8V or 3V SIM card
USIM_DATA
I/O
SIM Data Output/Input
USIM_CLK
USIM_RESET
O
O
SIM Clock
SIM Reset
SD_CLK
O
SDIO clock
SD_CMD
I/O
SDIO command
SD_DATA0
I/O
SDIO data
SD_DATA1
I/O
SDIO data
SD_DATA2
I/O
SDIO data
POWER_ON
Audio interface
MIC_P
MIC_N
HP_MICP
EAR_P
EAR_N
HPR
HPL
SPK_P
SPK_N
If it is unused, connect to
ground through a 100N
capacitor.
If these pins are unused,
keep open.
USIM interface
All signals of SIM
interface
should
be
protected
against
ESD/EMC.
SDIO interface
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If it is unused, keep open.
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SD_DATA3
I/O
SDIO data
USB_VBUS
I
USB power supply input
USB_DP
I/O
USB_DM
I/O
USB
Plus (+) line of the differential,
bi-directional USB signal to/from the
peripheral device.
Minus (-) line of the differential,
bi-directional USB signal to/from the
peripheral device.
They are compliant with
the USB 2.0 specification.
If it is unused, keep open.
Serial interface
UART_RXD
I
Receive Data
UART_TXD
O
Transmit Data
UART_RTS
O
Request to send
UART_CTS
I
Clear to Send
UART_RI
UART_DTR
UART_DCD
O
I/O
O
Ring Indicator
DTE get ready
Carrier detects
I2C_SDA
I/O
I2C data
I2C_SCL
O
I2C clock output
CAM_CLK
O
Camera clock
CAM_PCLK
I
Camera pixel clock
CAM_VSYNC
I
Horizontal synchronization
CAM_HSYNC
I
Vertical synchronization
CAM_STANDBY
O
Power down control
CAM_RESET
O
Reset control
CAM_D2
I
Data bit 0 (YUV or RGB)
CAM_D3
I
Data bit 1 (YUV or RGB)
CAM_D4
I
Data bit 2 (YUV or RGB)
CAM_D5
I
Data bit 3 (YUV or RGB)
CAM_D6
I
Data bit 4 (YUV or RGB)
CAM_D7
I
Data bit 5 (YUV or RGB)
CAM_D8
I
Data bit 6 (YUV or RGB)
CAM_D9
I
Data bit 7 (YUV or RGB)
UART_RXD has been
pulled down with a 12kR
resistor to ground in the
module.
If it is unused, keep open.
I2C interface
Pulled up with a 2.2kR
resistor to 2.6V internally.
If it is unused, keep open.
Camera interface
All camera pins can be
configured as GPIOs.
If it is unused, keep open.
PCM interface
PCM_DIN/GPIO0
I
PCM_SYNC/GPIO2
I
PCM_CLK/GPIO3
O
General Input PIN with module
wake/interrupt. It also can be
multiplexed as the PCM_DIN pin.
General Input PIN. It also can be
multiplexed as the PCM_SYNC pin.
General Output PIN. It also can be
multiplexed as the PCM_CLK pin.
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If it is unused, keep open.
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PCM_DOUT/GPIO5
O
General Output PIN. It also can be
multiplexed as the PCM_DOUT pin.
GPIO
GPIO1
O
GPIO4
I
Output PIN as LED control for
network status.
RF Control: Flight Modem switch
RESET
I
System reset in, active low.
HKADC
I
Analog Digital Converter Input
VREG_AUX
O
LDO output
If it is unused, keep open.
Other interface
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Refer to 3.12
Refer to 3.12
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2.3
Package Dimensions
The following figure shows mechanical dimensions of SIM5215&SIM5216.
Figure 5: Top dimensions (Unit: mm)
Figure 6: Side dimensions (Unit: mm)
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Figure 7: Bottom dimensions (Unit: mm)
3 Application Interface Specification
3.1
Power Supply
The power supply pins of SIM5215&SIM5216 include six VBAT pins. VBAT directly supplies the power
to RF PA and baseband system. For the VBAT, the ripple due to GSM/GPRS emission burst (every
4.615ms)may cause voltage drop, and the current consumption rises typically to peak of 2A. So the power
supply must be able to provide sufficient current up to more than 2A. The following figure is the VBAT
voltage ripple wave at the maximum power transmit phase.
The test condition: VBAT =4.0V, VBAT maximum output current =2A, CA=100 µF tantalum capacitor
(ESR=0.7Ω) and CB=1µF(Please refer to Figure 9—Application circuit).
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Figure 8: VBAT voltage drop during burst emission (GSM/GPRS)
3.1.1
Power Supply Pin
Six VBAT pins are dedicated to connect the supply voltage.
Table 5: Pin description
Pin type
Pin name
Min
Typ
Max
Unit
POWER
VBAT
3.3
3.8
4.2
V
Note: 1. When the module is power off, users must pay attention to the issue about current leakage. Refer to Chapter
3.10.2 Note2.
3.1.2
Design Guide
Make sure that the input voltage at the VBAT pin will never drop below 3.3V even during a transmit burst
when the current consumption rises up to more than 2A. If the power voltage drops below 3.3V, the
module may be shut down automatically. Using large tantalum capacitors (above 100uF) will be the best
way to reduce the voltage drops. If the power current cannot support up to 2A, users must introduce larger
capacitor (typical 1000uF) to storage electric power, especially GPRS multiple time slots emission.
For the consideration of RF performance and system stability, some multi-layer ceramic chip (MLCC)
capacitors (0.1/1uF) need to be used for EMC because of their low ESR in high frequencies. Note that
capacitors should be put beside VBAT pins as close as possible. Also User should minimize the PCB trace
impedance from the power supply to the VBAT pins through widening the trace to 80 mil or more on the
board. The following figure is the recommended circuit.
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VBAT
1
VBAT
2
3
VBAT
GND
CB
CA
CA
CB
4/5
VBAT
68
VBAT
VBAT
69
70
GND
VBAT
66/67
Figure 9: VBAT input application circuit
There are three sections about how to design and optimize users’ power systems.
Power supply circuit
We recommend DCDC or LDO is used for the power supply of the module, make sure that the peak
current of power components can rise up to more than 2A. The following figure is the reference design of
+5V input power supply. The designed output for the power supply is 4.1V; here a linear regulator can be
used.
Figure 10: Reference circuit of the LDO power supply
If there is a big difference between the input voltage and the desired output (VBAT), a switching converter
power will be preferable because of its better efficiency, especially at the high current situation. The
following figure is the reference circuit. Note that DCDC may deprave RF performance because of ripple
current intrinsically.
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Figure 11: Reference circuit of the DCDC power supply
Voltage monitor
To monitor the power supply voltage, user can use the AT command “AT+CBC”, this command has two
parameters: the battery status and the voltage value (mV). It will return the capacity percentage and actual
value of battery (at the VBAT pin). The voltage is continuously measured at intervals, whenever the
measured battery voltage is lower than a specific value set by the AT command “AT+CVALARM”. For
example, if the voltage value is set to be 3.4V, the following URC will be presented: “warning! voltage is
low: 3.3v”. If the voltage is lower than a specific value which is set by the AT command “AT+CPMVT”,
the module will be powered off automatically and AT commands cannot be executed any more.
Note: Under-voltage warning function is disabled by default, user can enable it by the AT command “AT+CVALARM”.
Auto power off feature is disabled by default, user should set it by the AT command “AT+CPMVT” to an appropriate
value. Please refer to Document [1].
3.1.3
RTC Backup
The module uses RTC (Real Time Clock) to update and maintain inherent time and keeps system alive at
no power supply status. The RTC power supply of module can be provided by an external capacitor or a
battery (non-chargeable or rechargeable) through the VRTC. The following figures show various reference
circuits for RTC back up. The discharge current is less than 10uA. If this feature is used, please refer to the
AT commands “AT+CTZU” and “AT +CTZR”.
z
External capacitor backup
MODULE
VRTC
RTC
Core
Non-chargeable
Backup Battery
Figure 12: RTC supply from capacitor
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z
Non-chargeable battery backup
Figure 13: RTC supply from non-chargeable battery
z
Rechargeable battery backup
Figure 14: RTC supply from rechargeable battery
Note: The VRTC can be disabled, jus disconnect it in application circuit.
Coin-type rechargeable battery is recommended, such as XH414H-IV01E form Seiko can be used.
Typical charge-discharge curves for this battery are shown in the following figure.
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Figure 15: Seiko XH414H-IV01E Charge-Discharge characteristic
3.2
3.2.1
Power on/off Time Sequence
Power on Sequence
SIM5215&SIM5216 can be powered on by POWER_ON pin, which starts normal operating mode.
POWER_ON pin is pulled up with a 200kR resistor to 1.8V in module. User can power on the
SIM5215&SIM5216 by pulling the POWER_ON pin down for a short time. The power-on scenarios are
illustrated in the following figures.
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1.8V
200K
Power
on / off logic
POWER_ON
4.7K
Turn on/ off impulse
MODULE
47K
Figure 16: Power on Timing Sequence
Table 6: Power on timing
Parameter
Time value
Description
Typ.
Max.
180
-
Ton
The time to pull POWER_ON down to power on
64
TpD+
The time to indicate connecting with the network
-
Tpw+
The time to indicate the module is powered on
completely
-
Tuart
The time to enable UART
-
Tusb
The time to enable USB
-
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Unit
Min.
-
ms
5.5
s
9
s
-
5
s
-
9
s
-
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3.2.2
Power off Sequence
The following methods can be used to power down SIM5215&SIM5216. These procedures will make
module disconnect from the network and allow the software to enter a safe state, and then save data before
completely powering the module off.
Method 1: Power off SIM5215&SIM5216 by pulling the POWER_ON pin down
● Method 2: Power off SIM5215&SIM5216 by AT command
●
User can power off the SIM5215&SIM5216 by pulling POWER_ON down for a specific time. The power
off scenario is illustrated in the following figure.
Figure 17: Power off timing sequence
Table 7: Power off timing
Parameter
Time value
Description
Min.
Typ.
Max.
Unit
0.5
-
5
s
Toff
The time pulling POWER_ON down to power off
TpD-
The time to indicate disconnecting from the network
-
-
7
s
Tpw-
The time to indicate the module power off completely
-
-
7.5
s
Tuart_off
The time to disable UART
-
-
6
s
Tusb_off
The time to disable USB
-
-
7.5
s
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Tona
The time to power on again after Tpw-
0
-
-
s
User can also use the AT command “AT+CPOF” to power down the module. After that, the AT commands
cannot be executed any longer. The module enters the POWER DOWN mode, only the RTC is still active.
For details, refer to Document [1].
3.3
UART Interface
SIM5215&SIM5216 provides a UART (universal asynchronous serial transmission) port. It consists of a
flexible 7-wire serial interface. The module is as the DCE (Data Communication Equipment) and the client
PC is as the DTE (Data Terminal Equipment). AT commands are entered and serial communication is
performed through UART interface.
In order to prevent the UART signals of the module damaged due to voltage spikes or ESD, some resistors
can be added on UART signals. The values of resistors are adjusted according to the actual circuit.
The application circuit is in the following figures.
Figure 18: Full modem
Figure 19: Null modem
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3.3.1
Pin Description
Table 8: Pin description
Pin type
UART
Pin name
Pin No.
I/O
Active voltage
Default Status
UART_RXD
64
I
H
Pull-Down
UART_TXD
6
O
H
Pull-Up
UART_RTS
63
O
H
UART_CTS
7
I
H
Pull-Up
UART_DTR
62
I
H
Pull-Up
UART_DCD
8
O
H
UART_RI
61
O
H
More pin information refers to chapter 2.2.
Table 9: Logic level
Parameter
Min
Max
Unit
Logic low input
0
0.3*VDD_EXT
V
Logic high input
0.7 *VDD_EXT
VDD_EXT +0.3
V
Logic low output
GND
0.2
V
Logic high output
VDD_EXT -0.2
VDD_EXT
V
Note: VDD_EXT (=2.6V) is e reference voltage in module internal interface.
All pins of all serial ports have 8mA driver capacity.
3.3.2
Application Guide
If UART port is used in Null Modem, the pin “RI” can be used as an interrupt signal to HOST. Normally it
will keep high logic level until certain condition such as receiving SMS, voice call (CSD, video) or URC
reporting, then “RI” will change to low logic level to inform the master (client PC). It will stay low until
the master clears the interrupt event with AT command.
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Figure 20: RI behaviour in NULL Modem
If Full Modem is used to establish communication between devices, the pin “RI” is another operation
status. Initially it keeps high, when a voice call or CSD call comes, the pin “RI” will change to low for
about 5900ms, then it will return to high level for 100ms. It will repeat this procedure until this call is
answered or hung up.
Figure 21: RI behaviour in FULL Modem
To comply with RS-232 protocol, the RS-232 level shifter chip should be used to connect
SIM5215&SIM5216 to the RS-232-C interface. In this connection, the TTL level and RS-232 level are
converted mutually. SIMCom recommends that user uses the SP3238ECA chip with a full modem. For
more information please refers to the RS-232 chip datasheet.
Note: SIM5215&SIM5216 supports the communication rate: 300, 600, 1200, 2400, 4800, 9600, 19200, 38400, 57600,
115200, 230400, 460800, 921600, 3200000, 3686400, 4000000bps. Default rate is 115200bps.
3.4
Audio Interfaces
SIM5215&SIM5216 provides three analog signal outputs and two analog input. MIC1P/N and HP_MICP
is used as microphone, HPL/R, EAR1P/N and SPK_P/N are used as audio output. Regarding audio
parameters configuration, please refer to the ATC manual.
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3.4.1
Pin Description
Table 10: Pin description
Audio channel
Normal
Hand-free
Headset
Pin name
MIC_P
MIC_N
EAR_P
EAR_N
MIC_P
MIC_N
SPK_P
SPK_N
HP_MICP
Pin No.
43
44
25
26
43
44
23
24
42
Function
MIC positive input
MIC negative input
Receiver positive output
Receiver negative output
MIC positive input
MIC negative input
Loudspeaker positive output
Loudspeaker negative output
Headset MIC positive input
HPR
27
Headset right channel
HPL
28
Headset left channel
Table 11: MIC input characteristics
Parameter
Working Voltage
Min
-
Typ
1.8
Max
-
Unit
V
Working Current
External Microphone Load Resistance
0.07
1.2
0.4
2.2
1
mA
k Ohms
Table 12: Audio output characteristics
Parameter
Normal
(EAR_P,EAR_N)
Headset
(HPR,HPL)
Differential
Load resistance
Output power
Min
27
-
Typ
32
50
Max
-
Unit
Ohm
mW
Single nded
load Resistance
12
16
-
Ohm
Differential
load Resistance
27
32
-
Ohm
Single Ended
Output power
-
21.6
-
mW
Table 13: Speaker output characteristics
Parameter
Quiescent Current
Load resistance
Output power(1KHz)
Min
-
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Typ
2.5
8
500
31
Max
4
-
Unit
mA
Ohm
mW
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3.4.2
Design Guide
There are three audio channels in SIM5215&SIM5216,including speaker output , receiver output and
microphone input.
SPEAKER circuit in SIM5215&SIM5216 is a Class-D amplifier, optional EMI filter is shown in the
following figure; these components (two ferrite beads and two capacitors) can reduce electromagnetic
interference. If used, they should be located beside SPK_P and SPK_N pins. Considerable current flows in
the channels, so wider PCB traces are recommended (~ 20 mils).
Figure 22: Speaker interface configuration
These components should
be placed to speaker as
close as possible
The lines in bold type should
be accorded to differential
signal layout rules
10pF
33pF
10pF
33pF
10pF
33pF
ESD
ANTI
EAR_P
MODULE
EAR_N
ESD
ANTI
Figure 23: Receiver interface configuration
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Figure 24: Microphone interface configuration
Figure 25:: Headphone Microphone interface configuration
Note: SIM5215&SIM5216 has integrated MIC bias circuit. There is no need to pull the MIC_P and MIC_N up to the
external power, just connect it to microphone. MIC_P and MIC_N must be differential lines.
3.4.3
Audio Parameter Characteristic
Main audio parameters can be changed to satisfy users’ requirement. Here primary register parameters and
related description are listed. User can adjust them through AT command. For more detail please refers to
Audio Application Document.
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Table 14: Audio parameter
Parameter
Influence to
Range
Gain range
Calculation
AT command
micAmp1
MICP/MICN
analogue amplifier
gain before ADC
0…1
0…24dB
2 steps
AT+CMICAMP1
txVol
Digital gain of input
signal after ADC
0,
1...65535
Mute,
-84...+12dB
20 * log
(txVol/
16384)
AT+CTXVOL
txGain
Digital gain of input
signal
after
summation
of
sidetone
0,
1...65535
Mute,
-84...+12dB
20 * log
(txGain/
16384)
AT+CTXGAIN
txFilter
Input PCM 13-tap
filter parameters, 7
values
0...65535
---
MATLAB
calculate
AT+CTXFTR
rxGain
Digital
gain
of
output signal after
summation
of
sidetone
0,
1...65535
Mute,
-84...+12dB
20 * log
(rxGain/
16384)
AT+CRXGAIN
rxVol
Digital Volume of
output signal after
speech
decoder,
before summation of
sidetone and DAC
-300…300
dbm
-300…300d
bm
AT+CLVL
AT+CVLVL
AT+CRXVOL
stGain
Digital attenuation
of sidetone
0, 1...65535
Mute,
-96...0dB
20 * log
(stGain/
16384) -12
AT+SIDET
rxFilter
Output PCM 13-tap
filter parameters, 7
values
0...65535
---
MATLAB
calculate
AT+CRXFTR
Note: If users require better experience on audio, users should modify these parameters according to their own electronic
and mechanical design.
3.5
USIM Interface
The USIM provides the required subscription verification information to allow the mobile equipment to
attach to a GSM or UMTS network. Both 1.8V and 3.0V SIM Cards are supported.
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3.5.1
Pin description
Table 15: Electronic characteristic
Pin name
3.0V mode
1.8V mode
Min
Typ
Max
Min
Typ
Max
V_USIM
2.7
3.00
3.3
1.65
1.8
2.0
USIM_RESET
0.8* V_USIM
3.00
V_USIM
0.8* V_USIM
1.8
V_USIM
USIM_CLK
0.7* V_USIM
3.00
V_USIM
0.8* V_USIM
1.8
V_USIM
USIM_DATA
0.7* V_USIM
3.00
V_USIM
0.8* V_USIM
1.8
V_USIM
Table 16: Pin description
Pin name
Pin
Description
USIM_CLK
12
USIM Card Clock
USIM_RESET
13
USIM_DATA
56
V_USIM
57
USIM Card Reset
USIM Card data I/O, which has been pulled up with a 22kR resistor to
V_USIM in module. Do not pull up or pull down in users’ application
circuit.
USIM Card Power output depends automatically on USIM mode,one
is 3.0V±10%, another is 1.8V±10%. Current is less than 50mA.
3.5.2
Application Guide
It is recommended to use an ESD protection component such as ST (www.st.com ) ESDA6V1W5 or ON
SEMI (www.onsemi.com ) SMF05C. Note that the SIM peripheral circuit should be close to the SIM card
socket. The reference circuit of the 8-pin SIM card holder is illustrated in the following figure.
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Figure 26: USIM interface reference circuit
Note: USIM_DATA has been pulled up with a 22kR resistor to V_USIM in module. A 220nF shut capacitor on V_USIM
is used to reduce interference. Use AT Commands to get information in USIM card. For more detail, please refer to
document [1].
3.5.3
Recommend Components
For 6 pins USIM socket, SIMCom recommend to use Amphenol C707 10M006 512 2. User can visit
http://www.amphenol.com for more information about the holder.
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Figure 27: Amphenol SIM card socket
Table 17: Amphenol USIM socket pin description
3.6
Pin
Signal
C1
USIM_VDD
C2
USIM_RST
Description
SIM Card Power supply, it can identify automatically the
SIM Card power mode,one is 3.0V±10%, another is
1.8V±10%.
SIM Card Reset.
C3
C5
C6
C7
USIM_CLK
GND
VPP
USIM_DATA
SIM Card Clock.
Connect to GND.
Connect to USIM_VDD
SIM Card data I/O.
I2C Interface
I2C is used to communicate with peripheral equipments and can be operated as either a transmitter or
receiver, depending on the device function. Use AT Commands “AT+CRIIC and AT+CWIIC” to read/write
register values of related peripheral equipments connected with I2C interface.
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3.6.1
Pin Description
Table 17: Pin description
Pin name
I2C_SDA
Pin No.
47
Function
Serial interface data input and output
I2C_SCL
46
Serial interface clock input
3.6.2
Signal Description
Both SDA and SCL are bidirectional lines, connected to a positive supply via a pull-up resistor
respectively. When the bus is free, both lines are high.
3.6.3
Design Guide
For SIM5215&SIM5216, the data on the I2C bus can be transferred at rates up to 400kbps. The number of
peripheral devices connected to the bus is solely dependent on the bus capacitance limit of 400pF. Note
that PCB traces length and bending are in users’ control to minimize load capacitance.
Note:I2C_SDA and I2C _SCL have been pulled up with two 2.2kR resistors to 2.6V level in module. So there is no need
to pull them up in users’ application circuit.
3.7
Camera Interface
SIM5215&SIM5216 module provides a Camera interface that supports camera and video phone functions.
SIM5215A&SIM5216A support both digital and analog (NTSC or PAL signal) sensor.
3.7.1
Pin Description
Table 18: Electronic characteristic
Pin name
Min
Typ
Max
CAM_D2
2.5
2.6
2.7
CAM_D3
2.5
2.6
2.7
CAM_D4
2.5
2.6
2.7
CAM_D5
2.5
2.6
2.7
CAM_D6
2.5
2.6
2.7
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CAM_D7
2.5
2.6
2.7
CAM_D8
2.5
2.6
2.7
CAM_D9
2.5
2.6
2.7
CAM_HSYNC
2.5
2.6
2.7
CAM_VSYNC
2.5
2.6
2.7
CAM_CLK
2.5
2.6
2.7
CAM_PCLK
2.5
2.6
2.7
CAM_RESET
2.5
2.6
2.7
CAM_STANDBY
2.5
2.6
2.7
Table 19: Pin description
Pin name
Pin No.
Function
CAM_D2
15
Data bit 0 (YUV or RGB)
CAM_D3
54
Data bit 1 (YUV or RGB)
CAM_D4
16
Data bit 2 (YUV or RGB)
CAM_D5
53
Data bit 3 (YUV or RGB)
CAM_D6
17
Data bit 4 (YUV or RGB)
CAM_D7
52
Data bit 5 (YUV or RGB)
CAM_D8
18
Data bit 6 (YUV or RGB)
CAM_D9
51
Data bit 7 (YUV or RGB)
CAM_HSYNC
19
Horizontal synchronization
CAM_VSYNC
50
Vertical synchronization
CAM_CLK
21
Camera clock
CAM_PCLK
49
Camera pixel clock
CAM_RESET
48
Reset control
CAM_STANDBY
22
Power down control
3.7.2
Application Guide
When using a YUV sensor, users must connect the sensor data pin (OV7670: data0~data7; OV2640 and
OV7725: data2~data9) to the module CAM_D2~CAM_D9 orderly. A typical circuit about the camera is
shown in the following figure.
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Figure 28: Reference circuit
When using analog sensor, you need to use AK8856 to decode NTSC or PAL signal to digital signal
firstly,and then AK8856 transmits the digital data into the camera interface. Refer to the following figure.
Figure 29: Analog sensor circuit reference
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All camera pins can be configured for GPIOs by the AT command “AT+CCGSWT”. These GPIOs also
support interruption operation if used as input pins. If these pins are configured for GPIOs, the sequence is
listed in the following table.
Table 20: GPIO configuration
Pin name
GPIO No.
CAM_D2
GPIO6
CAM_D3
GPIO7
CAM_D4
GPIO8
CAM_D5
GPIO9
CAM_D6
GPIO10
CAM_D7
GPIO11
CAM_D8
GPIO12
CAM_D9
GPIO13
CAM_HSYNC
GPIO14
CAM_VSYNC
GPIO15
CAM_CLK
GPIO16
CAM_PCLK
GPIO17
CAM_RESET
GPIO18
CAM_STANDBY
GPIO19
Note: 1.We have tested several kinds of digital sensors, such as OV2640, OV7670,OV7725 and a NTSC/PAL digital video
decoder named AK8856. Software must be adjusted before users adopt other kinds of sensors.
2. Because of high bit rate on camera bus, pay attention to influence of junction capacitance of ESD component on clock
and data lines. Typically, the capacitance should be less than 10pF.
3. Pay attention to the polarity of power down pin in users’ sensor before designing. Default polarity of
SIM5215A&SIM5216A is shown:
3.8
LOW: normal operation
HIGH: power-down.
USB Interface
SIM5215&SIM5216 module contains a USB interface. This interface is compliant with the USB2.0
specification. The USB2.0 specification requires hosts such as the computer to support all three USB
speeds, namely low-speed (1.5Mbps), full-speed (12Mbps) and high-speed (480Mbps). USB charging and
USB-OTG is not supported.
Table 21: Electronic characteristic
Pin name
Pin No.
Input voltage scope( V )
Min
SIM5215&SIM5216_Hardware Design_V2.02
Typ
41
Max
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USB_VBUS
9
USB_DP
60
USB_DM
59
3.8.1
4.4
5.0
5.25
They are compliant with the USB 2.0 specification.
Application Guide
Currently SIM5215&SIM5216 supports the USB suspend and resume mechanism which can help to save
power. If no transaction is on USB bus, SIM5215&SIM5216 will enter suspend mode. When some
events such as voice call or receiving SMS happen, SIM5215&SIM5216 will resume normal mode
automatically.
Figure 30: USB interface
Because of high bit rate on USB bus, pay attention to influence of junction capacitance of ESD component
on USB data lines. Typically, the capacitance should be less than 4pF @1MHz.
Note:The SIM5215&SIM5216 has two kinds of interface (UART and USB) to connect to host CPU.
USB interface is
mapped to five virtual ports: “SIMTECH USB Modem”, “SIMTECH NMEA Device”, “SIMTECH ATCOM Device”,
“SIMTECH Diagnostics interface” and “SIMTECH Wireless Ethernet Adapter”.
3.9 SDIO Interface
SIM5215A&SIM5216A provides one 4-bit SDIO interface. Its operation voltage is 2.85V, with clock rates
up to 52 MHz.It supports 1-bit SD/MMC or 4-bit SD data transmission mode. Though the same hardware
controller is used, the initialization procession for SD or MMC cards is different. SIM5215A&SIM5216A
will detect which card is inserted automatically.
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3.9.1
Pin Description
Table 22: Electronic characteristic
2.85V mode
Pin name
Min
Typ
Max
SD_DATA0
2.7
2.85
3.0
SD_DATA1
2.7
2.85
3.0
SD_DATA2
2.7
2.85
3.0
SD_DATA3
2.7
2.85
3.0
SD_CLK
2.7
2.85
3.0
SD_CMD
2.7
2.85
3.0
VREG_AUX
2.7
2.85
3.0
Table 23: Pin description
Pin name
Pin No.
Function
SD_DATA0
36
SD/MMC card data0
SD_DATA1
37
SD card data1
SD_DATA2
38
SD card data2
SD_DATA3
39
SD card data3
SD_CLK
34
SD card clock
SD_CMD
35
SD card command
VREG_AUX
40
SD card power
3.9.2
Design guide
The module provides a LDO named VREG_AUX for SD card power supply. The LDO is 2.85V by default,
capable of 250mA. Data lines should be pulled up to VREG_AUX by 10K resistors. ESD/EMI
components should be arranged beside SD card socket. Refer to the following application circuit.
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Figure 31: SDIO interface circuit
3.10 GPIO Interface
SIM5215&SIM5216 provides a limited number of GPIO pins. All GPIOs can be configured as inputs or
outputs. User can use AT Commands to read or write GPIOs status. Refer to ATC document for details.
3.10.1 Pin Description
Table 24: Electronic characteristic
2.6V mode
Pin name
Min
Typ
Max
GPIO1
2.5
2.6
2.7
GPIO4
2.5
2.6
2.7
Note: If more GPIOs need to be used, users can configure GPIO on other multiple function interfaces, such as PCM.
Please refer to GPIO list.
Table 25: Pin description
Pin name
Pin No.
I/O
Function
GPIO1
65
O
Output PIN as LED control for network status. If it is
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unused, left open.
GPIO4
32
Input PIN as RF operating control.
H: Normal Mode L:Flight Mode
If it is unused, left open.
I
Note: The output driver current of GPIOs is 1mA at the lower supply voltage and 2mA at the higher supply voltage.
3.10.2 Application Guide
Network status
GPIO1 is used to control Network Status LED; application circuit is shown below.
Figure 32: Application circuit
Note: The value of resistor Rx depends on LED characteristic.
Table 26: LED status
LED Status
Always On
200ms ON, 200ms OFF
800ms ON, 800ms OFF
Module Status
Searching Network/Call Connect
Data Transmit
Registered network
Off
Power off / Sleep
Flight mode control
GPIO4 controls SIM5215&SIM5216 module to enter or exit the Flight mode. In Flight mode,
SIM5215&SIM5216 closes RF function to prevent interference with other equipments or minimize current
consumption. Bidirectional ESD protection component is suggested to add on GPIO4.
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Figure 33: Flight mode switch
Table 27: Control status
GPIO4 Status
Low Level
High Level
Module operation
Flight Mode: RF is closed.
Normal Mode: RF is working.
Note:1. For SIM5215&SIM5216, GPIO0, GPIO2, GPIO3 and GPIO5 have multiplex function, user can use them as
PCM interface to connect extend codec. Refer to section 3.10 and document [1] for details.
2. When the module is powered off, make sure all digital interfaces (PCM UART, etc) connected with peripheral devices
have no voltage higher than 0.3V. If users’ design cannot meet above conditions, high level voltages maybe occur in
GPIO pins because current leakage from above digital interfaces may occur.
3.11 PCM Interface
SIM5215&SIM5216 provides hardware PCM interface for external codec. The PCM interface enables
communication with an external codec to support hands-free applications. SIM5215&SIM5216 PCM
interface can be used in two modes: the default mode is auxiliary PCM (8 KHz long sync mode at 128
KHz PCM CLK); the other mode is primary PCM (8 KHz short sync mode at 2048 KHz PCM CLK). In
short-sync (primary PCM) mode, SIM5215&SIM5216 can be a master or a slave. In long-sync (auxiliary
PCM) mode, SIM5215&SIM5216 is always a master. SIM5215&SIM5216 also supports 3 kinds of
coding formats: 8 bits (υ-law or A-law) and 16 bits (linear).
Note: PCM interface is multiplexed from GPIO (default setting). The AT command “AT+CPCM” is used to switch
between PCM and GPIO functions. Please refer to document [22] and document [1] for details.
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3.11.1 Pin Description
Table 28: Electronic characteristic
2.6V mode
Pin name
Min
Typ
Max
PCM_CLK
2.5
2.6
2.7
PCM_SYNC
2.5
2.6
2.7
PCM_DOUT
2.5
2.6
2.7
PCM_DIN
2.5
2.6
2.7
Table 29: Pin description
Pins
Pin No.
AUX_PCM
functionality
Primary PCM
functionality
Description
PCM_DIN/GPIO0
74
AUX_PCM_DIN
PCM_DIN
PCM data input
PCM_SYNC/GPIO2
75
AUX_PCM_SYNC
PCM_SYNC
PCM data synchrony
PCM_DOUT/GPIO5
73
AUX_PCM_DOUT
PCM_DOUT
PCM data output
PCM_CLK/GPIO3
76
AUX_PCM_CLK
PCM_CLK
PCM data clock
3.11.2 Signal Description
The default PCM interface in SIM5215&SIM5216 is the auxiliary PCM interface. The data changes on the
high level of PCM_CLK and is sampled at the falling edge of PCM_CLK in one period. Primary PCM is
disabled after every power-on or every reset event. So user must use AT command to enable the primary
PCM mode after powering on or resetting the module every time if user wants to use Primary
PCM.SIM5215&SIM5216 PCM Interface can be operated in Master or Slave mode if it is configured to
primary PCM. In Master Mode, the Module drives the clock and sync signals that are sent to the external
codec. When it is in Slave Mode, the external codec drives the clock and sync signals which are sent to the
module. Both PCM modes are discussed in this section followed by additional PCM topics.
Auxiliary PCM (128 KHz PCM clock)
υ-law coding is supported by the auxiliary PCM. The auxiliary codec port operates with standard
long-sync timing and a 128 KHz clock. The AUX_PCM_SYNC runs at 8 KHz with 50% duty cycle.
Most υ-law codec support the 128 KHz clock.
Figure 34: Synchrony timing
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Figure 35: EXT CODEC to MODULE timing
Figure 36: MODULE to EXT CODEC timing
Table 30: Timing parameters
Parameter
Description
Min
Typ
Max
Unit
T(auxsync)
AUX_PCM_SYNC cycle time
–
125
-
μs
T(auxsynch)
AUX_PCM_SYNC high time
62.4
62.5
-
μs
T(auxsyncl)
AUX_PCM_SYNC low time
62.4
62.5
-
μs
T(auxclk)*
AUX_PCM_CLK cycle time
-
7.8
–
μs
T(auxclkh)
AUX_PCM_CLK high time
3.8
3.9
–
μs
T(auxclkl)
AUX_PCM_CLK low time
3.8
3.9
–
μs
T(suauxsync)
AUX_PCM_SYNC setup time high before
falling edge of PCM_CLK
1.95
–
–
μs
T(hauxsync)
AUX_PCM SYNC hold time after falling edge
of PCM_CLK
1.95
–
–
μs
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T(suauxdin)
AUX_PCM_DIN setup time before falling
edge of AUX_PCM_CLK
70
–
–
ns
T(hauxdin)
AUX_PCM_DIN hold time after falling edge
of AUX_PCM_CLK
20
–
–
ns
T(pauxdout)
Delay from AUX_PCM_CLK
AUX_PCM_DOUT valid
–
–
50
ns
rising
to
*Note: T(auxclk) = 1/(128 KHz).
Primary PCM (2048 KHz PCM clock)
SIM5215&SIM5216 also supports 2.048 MHz PCM data and sync timing for υ-law codec. This is called
the primary PCM interface. User can use AT command to take the mode you want as discussed above.
Figure 37: Synchrony timing
Figure 38: EXT CODEC to MODULE timing
Figure 39: MODULE to EXT CODEC timing
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Table 31: Timing parameters
Parameter
Description
Min
Typ
Max
Unit
T(sync)
PCM_SYNC cycle time
–
125
–
μs
T(synch)
PCM_SYNC high time
400
500
–
ns
T(syncl)
PCM_SYNC low time
–
124.5
–
μs
T(clk)
PCM_CLK cycle time
–
488
–
ns
T(clkh)
PCM_CLK high time
–
244
–
ns
T(clkl)
PCM_CLK low time
–
244
–
ns
T(susync)
PCM_SYNC setup time high before falling edge of
PCM_CLK
60
–
–
ns
T(hsync)
PCM_SYNC hold time after falling edge of
PCM_CLK
60
–
–
ns
T(sudin)
PCM_DIN setup time before falling edge of
PCM_CLK
50
–
–
ns
T(hdin)
PCM_DIN hold
PCM_CLK
10
–
–
ns
T(pdout)
Delay from PCM_CLK rising to PCM_DOUT valid
–
–
350
ns
T(zdout)
Delay from PCM_CLK falling to PCM_DOUT
HIGH-Z
–
160
–
ns
time
after
falling
edge
of
Note: SIM5215&SIM5216 can transmit PCM data by USB except for PCM interface. Please refer to document [22] for
more information of PCM Application Note.
3.12 Multi-functional interface
SIM5215&SIM5216 merges functions for various applications. It can enrich users’ design and lower the
cost of users’ hardware.
3.12.1 Reset Function
SIM5215&SIM5216 also have a RESET pin (PIN29) to reset the module. This function is used as an
emergency reset only when AT command “AT+CPOF” and the POWER_ON pin has no effect. User can
pull the RESET pin to ground, then the module will reset.
This pin is already pulled up in module, so the external pull-up resistor is not necessary. A 100nF capacitor
close to the RESET pin is strongly recommended. A reference circuit is recommended in the following
figure.
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Figure 40: Reset circuit
Note:50ms<t<200ms. ESD components are suggested to be used on Reset pin.
3.12.2 ADC
SIM5215&SIM5216 has a dedicated ADC that is available for digitizing analog signals such as battery
voltage and so on; it is on PIN 41, namely HKADC. This HKADC is 8 bit successive-approximation
circuit, and electronic specification is shown in the following table.
Table 32: Electronic Characteristics
Specification
Resolution
Differential nonlinearity
Integral nonlinearity
Gain Error
Offset Error
Input Range
Input serial resistance
Input capacitance
Power-down to wakeup
Min
Typ
Max
Unit
+4
+8
+2.5
+40
2.2V
Bits
LSB
LSB
%
LSB
V
kΩ
12
-4
-8
-2.5
-4
GND
2
53
9.6
Comments/Conditions
Analog Vdd = ADC reference
2.4MHz sample rate
Sample and hold switch resistance
pF
μs
19.2
User can introduce a signal in the ADC pin directly and use the AT command “AT+CADC” to get the raw
data which is between 0 and 4095. The data can be transformed to any type such as voltage, temperature
etc. Please refer to document [1].
Figure 41: Reference circuit
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Note: The input signal voltage value in ADC must not be higher than 2.2V.
3.12.3 LDO
SIM5215&SIM5216 has a LDO power output, namely VREG_AUX. The LDO is available and output
voltage is 2.85v by default, rated for 250mA. User can switch the LDO on or off by the AT command
“AT+CVAUXS” and configure its output voltage by the AT command “AT+CVAUXV”.
Table 33: Electronic characteristic
Symbol
Description
Min
Typ
Max
Unit
VREG_AUX
Output voltage
1.5
2.85
3.05
V
IO
Output current
-
-
250
mA
4 RF Specification
4.1 RF Specification
Table 34: Conducted transmission power
Frequency
GSM850
E-GSM900
DCS1800
PCS1900
GSM850 (8-PSK)
E-GSM900 (8-PSK)
DCS1800 (8-PSK)
PCS1900(8-PSK)
WCDMA 2100
WCDMA 1900
WCDMA 850
WCDMA 900
Max
33dBm ±2dB
33dBm ±2dB
30dBm ±2dB
30dBm ±2dB
27dBm ±3dB
27dBm ±3dB
26dBm +3/-4dB
26dBm +3/-4dB
24dBm +1/-3dB
24dBm +1/-3dB
24dBm +1/-3dB
24dBm + 1/-3dB
Min
5dBm ± 5dB
5dBm ± 5dB
0dBm ± 5dB
0dBm ± 5dB
5dBm ± 5dB
5dBm ± 5dB
0dBm ±5dB
0dBm ±5dB
-56dBm ±5dB
-56dBm ±5dB
-56dBm ±5dB
-56dBm ±5dB
Table 35: Operating frequencies
Frequency
GSM850
Receiving
869 ~894
MHz
Transmission
824 ~849 MHz
E-GSM900
925 ~960
MHz
880 ~915
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DCS1800
1805~1880 MHz
1710~1785 MHz
PCS1900
1930~1990 MHz
1850~1910 MHz
WCDMA 2100
2110~2170
MHz
1920~1980 MHz
WCDMA1900
1930~1990 MHz
1850~1910 MHz
WCDMA 850
869 ~894
MHz
824 ~849
MHz
WCDMA 900
925 ~960
MHz
880 ~915
MHz
Table 36: Conducted receive sensitivity
Frequency
GSM850
E-GSM900
DCS1800
DCS1800
WCDMA 2100
WCDMA 1900
WCDMA 850
WCDMA 900
4.2
Receive sensitivity
< -106dBm
< -106dBm
< -106dBm
< -106dBm
< -108dBm
< -108dBm
< -106dBm
< -106dBm
Operating Specification
SIM5215&SIM5216 can support high rate data by GSM/WCDMA wireless network. In the different
network environment, data transmission rate shifts depending on modulation and encoding.
Table 37: GPRS/EDGE data throughout
Function
GPRS
EDGE
Coding schemes
CS-1
CS-2
CS-3
CS-4
MCS-1
MCS-2
MCS-3
MCS-4
MCS-5
MCS-6
MCS-7
MCS-8
MCS-9
1 Timeslot
9.05kbps
13.4kbps
15.6kbps
21.4kbps
8.80kbps
11.2kbps
14.8kbps
17.6kbps
22.4kbps
29.6kbps
44.8kbps
54.4kbps
59.2kbps
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18.1kbps
26.8kbps
31.2kbps
42.8kbps
17.6kbps
22.4kbps
29.6kbps
35.2kbps
44.8kbps
59.2kbps
89.6kbps
108.8kbps
118.4kbps
53
4 Timeslot
36.2kbps
53.6kbps
62.4kbps
85.6kbps
35.20kbps
44.8kbps
59.2kbps
70.4kbps
89.6kbps
118.4kbps
179.2kbps
217.6kbps
236.8kbps
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Table 38: HSDPA throughout
Max supported
HS-DSCH codes
Theoretical max
peak rate(Mbps)
Modulation
Category1
5
1.2
16QAM,QPSK
Category2
5
1.2
16QAM,QPSK
Category3
5
1.8
16QAM,QPSK
Category4
5
1.8
16QAM,QPSK
Category
Supported
Category5
3
5
3.6
16QAM,QPSK
Category6
3
5
3.6
16QAM,QPSK
Category7
10
7.2
16QAM,QPSK
Category8
10
7.2
16QAM,QPSK
Category9
15
10.0
16QAM,QPSK
Category10
15
14.0
16QAM,QPSK
Category11
5
0.9
QPSK
5
1.8
QPSK
Category12
3
Note: Actual throughout rates depend on network configuration, network loading, signal condition and so on.
4.3
Antenna Design Guide
SIM5215&SIM5216 provides a RF antenna connector and a antenna pad. Customer’s antenna can be
soldered to the module antenna pad or connected to module’s antenna connector through a 50Ω RF cable.
SIMCom recommends that the total insertion loss of RF cable should meet the following requirements:
GSM900/GSM850 <1dB
● DCS1800/PCS1900 <1.5dB
● WCDMA 2100/1900 <1.5dB
● WCDMA 900/850 <1dB
●
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Figure 42: RF adapter cable MXTK88TK2000
4.3.1
Antenna connector
SIM5215A&SIM5216A use MURATA MM9329-2700 RF connector. MURATA MXTK88XXXXX as
matching connector is recommended to use in the host board. Refer to the following figure for details.
Figure 43: Module antenna connector
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Figure 44: RF connector MM9329-2700
Note: For more information about the connector, visit http://www.murata.com/
4.3.2
Antenna pad
The antenna can be soldered to RF pad or attached through contacting springs. The reference ground pad is located nearby.
Figure 45: Module antenna pad
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5 Reliability and Operating Characteristics
5.1
Electronic Characteristics
Absolute maximum rating for digital and analog pins of SIM5215&SIM5216 are listed in the following
table:
Table 39: Absolute maximum ratings
Parameter
Voltage at digital pins (1.8v mode)
Voltage at digital pins (2.6v mode)
Voltage at VBAT
Voltage at VRTC
Voltage at USB_VBUS
Min
-0.3
-0.3
-0.5
1.5
-0.5
Max
1.8+0.3
2.6+0.3
6.0
3.2
6.0
Unit
V
V
V
V
V
Table 40: Recommended operating ratings
Parameter
Voltage at digital pins (1.8v mode)
Voltage at digital pins (2.6v mode)
Voltage at VBAT
Voltage at VRTC
Voltage at USB_VBUS
Min
1.65
2.5
3.3
1.5
4.75
Typ
1.8
2.6
3.8
5
Max
1.95
2.7
4.2
3.0
5.25
Unit
V
V
V
V
V
The operating temperature and power specification is listed in the following table.
Table 41: Operating temperature
Parameter
Ambient temperature
Storage temperature
Min
-30
-40
Typ
25
25
Max
80
+85
Unit
℃
℃
Note: SIMCom recommends user to install a heat sink on the module shielding case if SIM5215&SIM5216 operates in
WCDMA band.
5.2
Operating Mode
The following table summarizes the various operating modes, each operating modes will be referred to in
the following chapters.
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5.2.1
Operating Modes Overview
Table 42: Operating Modes Overview
Mode
Sleep mode
Function
GSM/WCDM
A SLEEP
Module will automatically enter SLEEP mode if DTR is set to high
level and there is no on air or hardware interrupt (such as GPIO
interrupt or data on serial port).
In this case, the current consumption of module will be reduced to the
minimal level.
In SLEEP mode, the module can still receive paging message,voice
call and SMS.
Software is active. Module has registered to the GSM network, and
the module is ready to communicate.
Connection between two subscribers is in progress. In this case, the
GSM TALK
power consumption depends on network settings (DTX off/on,
FR/EFR/HR, hopping sequences, etc.) and antenna.
Module is ready for GPRS data transfer, but no data is currently sent
GPRS
or received. In this case, power consumption depends on network
STANDBY
settings and GPRS configuration.
There is GPRS data transfer (PPP or TCP or UDP) in progress. In this
case, power consumption is related with network settings (e.g. power
GPRS DATA
control level), uplink/downlink data rates and GPRS configuration
(e.g. used multi-slot settings).
Module is ready for data transfer in EDGE mode, but no data is
EDGE
currently sent or received. In this case, power consumption depends
STANDBY
on network settings and EDGE configuration
There is EDGE data transfer (PPP or TCP or UDP) in progress. In this
EDGE DATA case, power consumption is related with network settings (e.g. power
control level), uplink/downlink data rates and EDGE configuration.
WCDMA
Module has registered to the WCDMA network, and the module is
IDLE
ready to communicate.
WCDMA
Module is active in WCDMA mode. The power consumption depends
TALK
on network settings.
Module is ready for data transmission, but no data is currently sent or
HSDPA IDLE received. Power consumption depends on network settings and
HSDPA configuration
There is HSDPA data transfer (PPP or TCP or UDP) in progress. In
HSDPA
this case, power consumption is related with network settings (e.g.
DATA
power control level), uplink/downlink data rates and HSDPA
configuration
Module can be powered down by the AT command “AT+CPOF” or the POWER_ON
pin. The power management unit shuts down the power supply of the module, only the
power supply of RTC is remained. The serial interface is not accessible. Operating
voltage (connected to VBAT) remains applied.
The AT command “AT+CFUN” can be used to set the module to a minimum
functionality mode without removing the power supply. In this mode, the RF part of
the module will not work or the SIM card will not be accessible, or both will be closed,
and the serial port is still accessible. The power consumption in this mode is very low.
GSM IDLE
GSM
GPRS
EDGE
WCDMA
HSDPA
Power down
Minimum
functionality
mode
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5.2.2
Minimize Power Consumption
There are two modes that SIM5215&SIM5216 achieves low power consumption.
Sleep mode
If peripheral equipments stops working, and there is no on air or hardware interrupts (such as GPIO
interrupts or data on UART), SIM5215&SIM5216 will enter sleep mode automatically. In this mode,
SIM5215&SIM5216 can still receive paging,voice call or SMS from network. If USB interface of
SIM5215&SIM5216 is connected to host CPU, but host CPU does not support USB suspending, then
SIM5215&SIM5216 will not enter sleep mode. After USB is disconnected, SIM5215&SIM5216 will enter
sleep mode.
Note: When UART interface is connected with host CPU, SIM5215&SIM5216 can not enter sleep mode until RXD is
pulled down by the host CPU. If the module is in the idle mode, make sure to pull the RXD to low level by host CPU.
SIMCom recommends using UART_DTR to wake up the module from host CPU and to use UART_RI to wake up the
host CPU. Before designing, pay attention to how to realize waking function and refer to Document [24] and Document
[25] for more detail.
Minimum functionality mode
Minimum functionality mode ceases a majority function of module, thus minimizing the power
consumption. This mode is set by the AT command which provides a choice of the functionality levels.
AT+CFUN=0: Minimum functionality
● AT+CFUN=1: Full functionality (Default)
● AT+CFUN=4: Disable RF function of the module (Flight mode)
●
If SIM5215&SIM5216 has been set to minimum functionality mode, the module will firstly enter sleep
mode, then the RF function and SIM card function will be closed. In this case, the serial port is still
accessible, but RF function or SIM card will be unavailable. When SIM5215&SIM5216 is in minimum
functionality or flight mode, it can return to full functionality by the AT command “AT+CFUN=1”.
Note: For flight mode, please refer to Chapter 3.10.2.
5.3
Current Consumption
The current consumption in suspended mode and without USB connection is listed in the table below.
Here, “suspended mode” means that SIM5215&SIM5216 is connected to USB bus, but it does not transfer
data.
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Table 43: Current consumption
GSM Sleep mode (without USB connection)
GSM850
Sleep @DRX=2
Sleep @DRX=5
Sleep @DRX=9
3.0mA
1.8mA
1.4mA
GSM900
Sleep @DRX=2 3.0mA
Sleep @DRX=5 1.86mA
Sleep @DRX=9 1.4mA
DCS1800
Sleep @DRX=2
Sleep @DRX=5
Sleep @DRX=9
3.1mA
1.7mA
1.4mA
PCS1900
Sleep @DRX=2
Sleep @DRX=5
Sleep @DRX=9
3.1mA
1.6mA
1.5mA
GSM850
Sleep @DRX=2
Sleep @DRX=5
Sleep @DRX=9
4.3mA
2.8mA
2.2mA
GSM900
Sleep @DRX=2
Sleep @DRX=5
Sleep @DRX=9
4.3mA
2.7mA
2.1mA
DCS1800
Sleep @DRX=2
Sleep @DRX=5
Sleep @DRX=9
4.4mA
2.8mA
2.3mA
PCS1900
Sleep @DRX=2
Sleep @DRX=5
Sleep @DRX=9
4.4mA
2.7mA
2.2mA
GSM Sleep Mode (with USB suspended)
Voice Call
GSM850
@power level #5 <300mA,Typical 305mA
GSM 900
@power level #5 <300mA,Typical 305mA
DCS1800
@power level #0 <250mA,Typical 237mA
PCS1900
@power level #0 <250mA,Typical 237mA
GPRS Data
DATA mode, GPRS ( 1 Rx,4 Tx ) CLASS 12
GSM 850
@power level #5 <540mA
GSM 900
@power level #5 <500mA
DCS1800
@power level #0 <380mA
PCS1900
@power level #0 <380mA
DATA mode, GPRS ( 3Rx, 2 Tx ) CLASS 12
GSM 850
@power level #5 <390mA
GSM 900
@power level #5 <380mA
DCS1800
@power level #0 <300mA
PCS1900
@power level #0 <250mA
EDGE Data
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DATA mode, EDGE( 1 Rx,4 Tx ) CLASS 12
GSM 850
@power level #8 <350mA
GSM 900
@power level #8 <340mA
DCS1800
@power level #2 <325mA
PCS1900
@power level #2 <290mA
DATA mode, EDGE( 3Rx, 2 Tx ) CLASS 12
GSM 850
@power level #8 <250mA
GSM 900
@power level #8 <240mA
DCS1800
@power level #2 <230mA
PCS1900
@power level #2 <210mA
UMTS Sleep Mode (without USB connection)
Sleep @DRX=9 1.2mA
Sleep @DRX=8 2.1mA
WCDMA 1900
Sleep @DRX=6 4.2mA
WCDMA 850
Sleep @DRX=9 1.2mA
Sleep @DRX=8 2.0mA
Sleep @DRX=6 4.4mA
UMTS Sleep Mode (with USB suspended)
Sleep @DRX=9 1.9mA
Sleep @DRX=8 2.6mA
WCDMA 1900
Sleep @DRX=6 4.6mA
WCDMA 850
Sleep @DRX=9 1.9mA
Sleep @DRX=8 2.7mA
Sleep @DRX=6 4.8mA
UMTS Talk
WCDMA 1900
@Power 23dBm Typical 580mA
@Power 10dBm Typical 205mA
@Power-55dBm Typical 174mA
WCDMA 850
@Power 23dBm Typical 510mA
@Power 10dBm Typical 195mA
@Power-55dBm Typical 131mA
HSDPA Data(Only 5216A)
WCDMA 1900
@Power 23dBm Typical 584mA
@Power 10dBm Typical 331mA
@Power-55dBm Typical 179mA
WCDMA 850
@Power 23dBm Typical 536mA
@Power 10dBm Typical 231mA
@Power-55dBm Typical 165mA
5.4
EMC and ESD Notes
EMC tests should be performed to detect any potential problems. Possible harmful emissions radiate by
the application to the RF receiver in the receiver band. RF emissions interfere with audio input/output. It is
recommended to shield the sensitive components and trace with common ground and user can add beads
where necessary.
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Normally SIM5215&SIM5216 is mounted on customer host board. Although some ESD components have
been added in SIM5215&SIM5216, to prevent ESD, user should put some ESD components on customers’
board. The ESD components should be placed beside the connectors which human body might touch, such
as SIM card holder, audio jacks, switches, keys, etc. The following table is the SIM5215&SIM5216 ESD
measurement performance; the results are from SIMCom EVB test.
Table 44: The ESD performance measurement table (Temperature: 25℃, Humidity: 45%)
Part
VBAT,GND
UART,USB
Antenna port
Other ports
Contact discharge
±4KV
±2KV
±4KV
±2KV
Air discharge
±6KV
±6KV
±6KV
±2KV
6 Guide for Production
6.1
Top and Bottom View of SIM5215&SIM5216
Figure 46: Top and bottom view of SIM5215&SIM5216
These test points are only used for module manufacturing and testing. They are not for customer’s
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application.
6.2
Moisture Sensitivity Level (MSL)
SIM5215&SIM5216 is qualified to Moisture Sensitivity Level (MSL) 3 in accordance with JEDEC
J-STD-020. After the prescribed time limit exceeded, users should bake modules for 192 hours in drying
equipment (<5% RH) at 40° C +5° C/-0° C, or 72 hours at 85° C +5° C/-5° C. Note that plastic tray is not
heat-resistant, users must not use the tray to bake at 85° C or the tray may be damaged.
6.3
Firmware Update
When SIM5215A&SIM5216A modules are embed into users’ equipment, there are two methods to update
firmware easily, which are called SD card and USB update.
6.3.1
SD Card Update
SD card update means that user can use SD card to update the firmware into the module. The realization
process is described in following figures.
Figure 47: Reference circuit for SD card update
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Figure 48: SD card update procedure
Note: QCN will be erased after SD card update, so users must backup QCN files before downloading the new firmware.
6.3.2
USB Update
Users can use USB interface to download the new firmware. The realization process is described in
following figures.
Figure 49: Reference circuit for USB update (UART communication)
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Figure 50: Reference circuit for USB update (USB communication)
Figure 51: SD card update procedure
Note: We recommend using SD card update when users adopt USB to communicate with the module.
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Appendix
A. SIM5215&SIM5216 GPIOs List
Table 45: SIM5215&SIM5216 GPIOs list
Name
PCM_DIN
GPIO1
PCM_SYNC
PCM_CLK
GPIO4
PCM_DOUT
CAM_D2
CAM_D3
CAM_D4
CAM_D5
CAM_D6
CAM_D7
CAM_D8
CAM_D9
CAM_HSYNC
CAM_VSYNC
CAM_CLK
CAM_PCLK
CAM_RESET
CAM_STANDBY
UART1_CTS
UART1_RFR
UART1_DTR
UART_DCD
UART_RI
GPIO Index
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
Default Function
GPIO Interrupt [LEVEL/LOW]
Status led
GPIO [IN]
GPIO [OUT/LOW]
RF Switch
GPIO [OUT/LOW]
Data bit 0 (YUV or RGB)
Data bit 1 (YUV or RGB)
Data bit 2 (YUV or RGB)
Data bit 3 (YUV or RGB)
Data bit 4 (YUV or RGB)
Data bit 5 (YUV or RGB)
Data bit 6 (YUV or RGB)
Data bit 7 (YUV or RGB)
Horizontal synchronization
Vertical synchronization
Camera clock
Camera pixel clock
Reset control
Power down control
CTS
RTS
DTR wake up module
DCD
RI wake up host
Alternate Function
PCM_DIN
GPIO
PCM_SYNC
PCM_CLK
Enable/Disable RF subsystem
PCM_OUT
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
B. Digital I/O Characteristics
Table 46: Digital I/O characteristics
Parameter
Description
2.6V Mode
Unit
Min
Typ
Max
VREG_AUX
LDO output
0
2.6
2.9
V
VIH
High-level
input voltage
1.69
2.6
2.9
V
VIL
Low-level
-0.3
0
0.91
V
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input voltage
VOH
High-level
output voltage
1.17
2.6
2.6
V
VOL
Low-level
output voltage
0
0
0.45
V
IIH
Input
high
leakage
current
-
-
1
uA
IIL
Input
leakage
current
-1
-
-
uA
CIN
Input
capacitance
-
-
7
pF
low
Note: These parameters are for digital interface pins, such as keypad, GPIO, I2C, UART, and DEBUG. The Digital I/O
specifications under both conditions are presented in the above tables.
C. Related Documents
Table 47: Related documents
SN
[1]
[2]
Document name
SIM5215&SIM5216_AT
C_V1.00
ITU-T
Draft
new
recommendationV.25ter
[3]
GSM 07.07
[4]
GSM 07.10
[5]
GSM 07.05
[6]
GSM 11.14
[7]
GSM 11.11
[8]
GSM 03.38
[9]
GSM 11.10
[10]
3GPP TS 51.010-1
Remark
SIM5215&SIM5216_ATC_V1.00
Serial asynchronous automatic dialing and control
Digital cellular telecommunications (Phase 2+); AT command set
for GSM Mobile Equipment (ME)
Support GSM 07.10 multiplexing protocol
Digital cellular telecommunications (Phase 2+); Use of Data
Terminal Equipment – Data Circuit terminating Equipment (DTE –
DCE) interface for Short Message Service (SMS) and Cell
Broadcast Service (CBS)
Digital cellular telecommunications system (Phase 2+);
Specification of the SIM Application Toolkit for the Subscriber
Identity Module – Mobile Equipment (SIM – ME) interface
Digital cellular telecommunications system (Phase 2+);
Specification of the Subscriber Identity Module – Mobile
Equipment (SIM – ME) interface
Digital cellular telecommunications system (Phase 2+); Alphabets
and language-specific information
Digital cellular telecommunications system (Phase 2); Mobile
Station (MS) conformance specification; Part 1: Conformance
specification
Digital cellular telecommunications system (Release 5); Mobile
Station (MS) conformance specification
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Electromagnetic Compatibility (EMC) for mobile terminals and
ancillary equipment.
[11]
3GPP TS 34.124
[12]
3GPP TS 34.121
[13]
3GPP TS 34.123-1
[14]
3GPP TS 34.123-3
[15]
EN 301 908-02 V2.2.1
[16]
EN 301 489-24 V1.2.1
[17]
IEC/EN60950-1(2001)
Safety of information technology equipment (2000)
[18]
3GPP TS 51.010-1
Digital cellular telecommunications system (Release 5); Mobile
Station (MS) conformance specification
[19]
GCF-CC V3.23.1
Global Certification Forum - Certification Criteria
[20]
2002/95/EC
Directive of the European Parliament and of the Council of 27
January 2003 on the restriction of the use of certain hazardous
substances in electrical and electronic equipment (RoHS)
[21]
[22]
[23]
Audio Application Note
V1.01
PCM Application Note
V1.02
Keypad
Application
Note V1.01
Electromagnetic Compatibility (EMC) for mobile terminals and
ancillary equipment.
Technical Specification Group Radio Access Network; Terminal
conformance specification; Radio transmission and reception
(FDD)
User Equipment (UE) conformance specification; Part 3: Abstract
Test Suites.
Electromagnetic compatibility and Radio spectrum Matters
(ERM); Base Stations (BS) and User Equipment (UE) for
IMT-2000. Third Generation cellular networks; Part 2:
Harmonized EN for IMT-2000, CDMA Direct Spread
(UTRA FDD) (UE) covering essential requirements of article
3.2 of the R&TTE Directive
Electromagnetic compatibility and Radio Spectrum Matters (ERM);
Electromagnetic Compatibility (EMC) standard for radio
equipment and services; Part 24: Specific conditions for IMT-2000
CDMA Direct Spread (UTRA) for Mobile and portable (UE) radio
and ancillary equipment
Audio Application Note V1.01
PCM Application Note V1.02
Keypad Application Note V1.01
[24]
Sleep_Application_Note
[25]
Waking_up_Applicatio
n_Note
Waking_up_Application_Note
[26]
Module
SMT Note
Sleep_Application_Note
secondary-SMT-UGD
[27]
SIM5xxx_Automatic_powe
SIM5xxx_Automatic_power_on_Application_Note
r_on_Application_Note
D. Terms and Abbreviations
Table 48: Terms and Abbreviations
Abbreviation
ADC
Description
Analog-to-Digital Converter
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ARP
BER
BTS
CS
CSD
CTS
DAC
DRX
DSP
DTE
DTR
DTX
EFR
EGSM
EMC
ESD
ETS
FCC
FD
FDMA
FR
GMSK
GPRS
GSM
HR
I2C
IMEI
Inorm
Imax
kbps
Li-Ion
MO
MS
MT
PAP
PBCCH
PCB
PCS
RF
RMS
RTC
Rx
SIM
SMS
SPI
TDMA
TE
TX
Antenna Reference Point
Bit Error Rate
Base Transceiver Station
Coding Scheme
Circuit Switched Data
Clear to Send
Digital-to-Analog Converter
Discontinuous Reception
Digital Signal Processor
Data Terminal Equipment (typically computer, terminal, printer)
Data Terminal Ready
Discontinuous Transmission
Enhanced Full Rate
Enhanced GSM
Electromagnetic Compatibility
Electrostatic Discharge
European Telecommunication Standard
Federal Communications Commission (U.S.)
SIM fix dialing phonebook
Frequency Division Multiple Access
Full Rate
Gaussian Minimum Shift Keying
General Packet Radio Service
Global Standard for Mobile Communications
Half Rate
Inter-Integrated Circuit
International Mobile Equipment Identity
Normal Current
Maximum Load Current
Kilo bits per second
Lithium-Ion
Mobile Originated
Mobile Station (GSM engine), also referred to as TE
Mobile Terminated
Password Authentication Protocol
Packet Switched Broadcast Control Channel
Printed Circuit Board
Personal Communication System, also referred to as GSM 1900
Radio Frequency
Root Mean Square (value)
Real Time Clock
Receive Direction
Subscriber Identification Module
Short Message Service
serial peripheral interface
Time Division Multiple Access
Terminal Equipment, also referred to as DTE
Transmit Direction
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UART
VSWR
Vmax
Vnorm
Vmin
VIHmax
VIHmin
VILmax
VILmin
VImax
VImin
VOHmax
VOHmin
VOLmax
VOLmin
SM
NC
EDGE
HSDPA
HSUPA
ZIF
WCDMA
VCTCXO
USIM
UMTS
UART
Universal Asynchronous Receiver & Transmitter
Voltage Standing Wave Ratio
Maximum Voltage Value
Normal Voltage Value
Minimum Voltage Value
Maximum Input High Level Voltage Value
Minimum Input High Level Voltage Value
Maximum Input Low Level Voltage Value
Minimum Input Low Level Voltage Value
Absolute Maximum Input Voltage Value
Absolute Minimum Input Voltage Value
Maximum Output High Level Voltage Value
Minimum Output High Level Voltage Value
Maximum Output Low Level Voltage Value
Minimum Output Low Level Voltage Value
SIM phonebook
Not connect
Enhanced data rates for GSM evolution
High Speed Downlink Packet Access
High Speed Uplink Packet Access
Zero intermediate frequency
Wideband Code Division Multiple Access
Voltage control temperature-compensated crystal oscillator
Universal subscriber identity module
Universal mobile telecommunications system
Universal asynchronous receiver transmitter
E. Safety Caution
Table 49: Safety caution
Marks
Requirements
When in a hospital or other health care facility, observe the restrictions about the use of
mobiles. Switch the cellular terminal or mobile off, medical equipment may be sensitive
to not operate normally for RF energy interference.
Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it is
switched off. The operation of wireless appliances in an aircraft is forbidden to prevent
interference with communication systems. Forget to think much of these instructions
may lead to the flight safety or offend against local legal action, or both.
Do not operate the cellular terminal or mobile in the presence of flammable gases or
fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots,
chemical plants or where blasting operations are in progress. Operation of any electrical
equipment in potentially explosive atmospheres can constitute a safety hazard.
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Your cellular terminal or mobile receives and transmits radio frequency energy while
switched on. RF interference can occur if it is used close to TV sets, radios, computers
or other electric equipment.
Road safety comes first! Do not use a hand-held cellular terminal or mobile when
driving a vehicle, unless it is securely mounted in a holder for hands free operation.
Before making a call with a hand-held terminal or mobile, park the vehicle.
GSM cellular terminals or mobiles operate over radio frequency signals and cellular
networks and cannot be guaranteed to connect in all conditions, for example no mobile
fee or a invalid SIM card. While you are in this condition and need emergent help,
please remember using emergency calls. In order to make or receive calls, the cellular
terminal or mobile must be switched on and in a service area with adequate cellular
signal strength.
Some networks do not allow for emergency call if certain network services or phone
features are in use (e.g. lock functions, fixed dialing etc.). You may have to deactivate
those features before you can make an emergency call.
Also, some networks require that a valid SIM card be properly inserted in the cellular
terminal or mobile.
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Contact us:
Shanghai SIMCom Wireless Solutions Ltd.
Add: SIM Technology Building, No.633, Jinzhong Road, Changning District, Shanghai P.R.
China 200335
Tel: +86 21 3235 3300
Fax: +86 21 3235 3301
URL: www.sim.com/wm
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