WAFER-LX User Manual MODEL: 3.5" Low Power AMD Geode-LX 800 Motherboard

WAFER-LX Motherboard
MODEL:
WAFER-LX
3.5" Low Power AMD Geode-LX 800 Motherboard
CRT, LCD/LVDS, Dual LAN and SATA
User Manual
Page i
Rev. 1.22 – 24 February, 2009
WAFER-LX Motherboard
Revision
Date
Version
Changes
24 February, 2009
1.22
Corrected fan voltage label
16 December, 2008
1.21
Corrected pin labels for ATX power
31 July, 2008
1.20
IDE master/slave jumper information added
Updated manual template
31 December, 2006
1.10
Sec. 2.4 modified
30 September, 2006
1.00
Initial release
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Copyright
COPYRIGHT NOTICE
The information in this document is subject to change without prior notice in order to
improve reliability, design and function and does not represent a commitment on the part
of the manufacturer.
In no event will the manufacturer be liable for direct, indirect, special, incidental, or
consequential damages arising out of the use or inability to use the product or
documentation, even if advised of the possibility of such damages.
This document contains proprietary information protected by copyright. All rights are
reserved. No part of this manual may be reproduced by any mechanical, electronic, or
other means in any form without prior written permission of the manufacturer.
TRADEMARKS
All registered trademarks and product names mentioned herein are used for identification
purposes only and may be trademarks and/or registered trademarks of their respective
owners.
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WAFER-LX Motherboard
Packing List
NOTE:
If any of the components listed in the checklist below are missing,
please do not proceed with the installation. Contact the IEI reseller or
vendor you purchased the WAFER-LX from or contact an IEI sales
representative directly. To contact an IEI sales representative, please
send an email to sales@iei.com.tw .
The items listed below should all be included in the WAFER-LX package.
ƒ
1x WAFER-LX800 single board computer
ƒ
1 x Mini jumper pack
ƒ
1 x IDE flat cable 44P/44P
ƒ
2 x SATA cables
ƒ
1 x SATA power cable
ƒ
1 x Audio cable
ƒ
1 x KB/MS cable
ƒ
1 x USB cable
ƒ
1 x RS-232 cable
ƒ
1x Utility CD
ƒ
1x Quick Installation Guide
Images of the above items are shown in Chapter 3.
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Table of Contents
1 INTRODUCTION.......................................................................................................... 1
1.1 OVERVIEW.................................................................................................................. 2
1.1.1 Models................................................................................................................ 2
1.1.2 Applications ....................................................................................................... 3
1.1.3 Benefits............................................................................................................... 3
1.1.4 Features ............................................................................................................. 3
1.1.5 Connectors ......................................................................................................... 4
1.1.6 Technical Specifications..................................................................................... 6
1.2 OPERATING SYSTEM PACKAGES ................................................................................. 8
1.2.1 Windows XPE SP2 (350 MB image size stored in a 512 MB CF card) ............. 8
1.2.2 Windows CE 5.0 (around 22 MB, CF must > 32 MB) ....................................... 8
2 DETAILED SPECIFICATIONS .................................................................................. 9
2.1 OVERVIEW................................................................................................................ 10
2.2 DIMENSIONS ............................................................................................................. 10
2.2.1 Board Dimensions............................................................................................ 10
2.2.2 External Interface Panel Dimensions ...............................................................11
2.3 DATA FLOW .............................................................................................................. 12
2.4 AMD GEODE™ LX 800 CPU .................................................................................. 13
2.4.1 Specifications ................................................................................................... 13
2.4.2 Power Management ......................................................................................... 13
2.5 SYSTEM CHIPSET...................................................................................................... 14
2.6 GRAPHICS SUPPORT.................................................................................................. 15
2.7 MEMORY SUPPORT ................................................................................................... 16
2.8 PCI BUS INTERFACE SUPPORT .................................................................................. 16
2.9 ETHERNET CONTROLLER SPECIFICATIONS................................................................ 17
2.9.1 Overview .......................................................................................................... 17
2.9.2 Features ........................................................................................................... 17
2.10 DRIVE INTERFACES ................................................................................................ 18
2.10.1 SATA Drives ................................................................................................... 18
2.10.2 IDE HDD Interfaces ...................................................................................... 18
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2.10.3 Floppy Disk Drive (FDD).............................................................................. 18
2.10.4 Compact Flash Support ................................................................................. 18
2.11 SERIAL PORTS......................................................................................................... 19
2.12 REAL TIME CLOCK ................................................................................................. 19
2.13 SYSTEM MONITORING ............................................................................................ 19
2.14 USB INTERFACES ................................................................................................... 19
2.15 BIOS...................................................................................................................... 19
2.16 OPERATING TEMPERATURE AND TEMPERATURE CONTROL ..................................... 20
2.17 AUDIO CODEC ........................................................................................................ 20
2.18 POWER CONSUMPTION ........................................................................................... 21
2.19 PACKAGED CONTENTS AND OPTIONAL ACCESSORY ITEMS ..................................... 22
2.19.1 Package Contents........................................................................................... 22
2.19.2 Optional Accessory Items............................................................................... 22
3 UNPACKING ............................................................................................................... 23
3.1 ANTI-STATIC PRECAUTIONS ...................................................................................... 24
3.2 UNPACKING .............................................................................................................. 24
3.2.1 Unpacking Precautions.................................................................................... 24
3.3 UNPACKING CHECKLIST ........................................................................................... 25
3.3.1 Package Contents............................................................................................. 25
4 CONNECTORS AND JUMPERS .............................................................................. 27
4.1 PERIPHERAL INTERFACE CONNECTORS..................................................................... 28
4.1.1 WAFER-LX Layout........................................................................................... 28
4.1.2 Peripheral Interface Connectors ..................................................................... 29
4.1.3 External Interface Panel Connectors............................................................... 30
4.1.4 On-board Jumpers ........................................................................................... 31
4.2 INTERNAL PERIPHERAL CONNECTORS ...................................................................... 32
4.2.1 AT Power Connector........................................................................................ 32
4.2.2 ATX Power Connector ..................................................................................... 33
4.2.3 ATX Power Button Connector.......................................................................... 34
4.2.4 Audio Connector .............................................................................................. 34
4.2.5 Battery Connector............................................................................................ 36
4.2.6 Compact Flash Connector ............................................................................... 37
4.2.7 Fan Connector ................................................................................................. 38
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4.2.8 Floppy Disk Connector (Slim Type, Optional)................................................. 39
4.2.9 GPIO Connector .............................................................................................. 41
4.2.10 IDE Connector ............................................................................................... 42
4.2.11 Inverter Power Connector.............................................................................. 43
4.2.12 Keyboard/Mouse Connector .......................................................................... 44
4.2.13 LED Connector .............................................................................................. 45
4.2.14 Print Port Connector ..................................................................................... 46
4.2.15 PC/104 Power Input Connector..................................................................... 47
4.2.16 PC/104 Slot .................................................................................................... 48
4.2.17 Reset Button Connector ................................................................................. 50
4.2.18 RS-232/422/485 Cable Connectors................................................................ 51
4.2.19 SATA Drive Connectors ................................................................................. 52
4.2.20 TFT LCD LVDS Connector............................................................................ 53
4.2.21 TFT LCD TTL Connector............................................................................... 55
4.2.22 Internal USB Connectors............................................................................... 56
4.3 EXTERNAL INTERFACE CONNECTORS ....................................................................... 57
4.3.1 External Interface Connector Overview .......................................................... 57
4.3.2 USB Combo Port.............................................................................................. 58
4.3.3 Ethernet Connector.......................................................................................... 58
4.3.4 Serial Communications COM 1 and COM2 Connector .................................. 59
4.3.5 VGA Connector ................................................................................................ 60
5 INSTALLATION AND CONFIGURATION ............................................................ 62
5.1 ANTI-STATIC PRECAUTIONS ...................................................................................... 63
5.2 INSTALLATION CONSIDERATIONS .............................................................................. 63
5.2.1 Installation Notices .......................................................................................... 63
5.3 UNPACKING .............................................................................................................. 64
5.3.1 Unpacking Precautions.................................................................................... 64
5.3.2 Checklist........................................................................................................... 65
5.4 INSTALLATION PROCEDURE ...................................................................................... 65
5.4.1 DIMM Module Installation .............................................................................. 66
5.4.1.1 Purchasing the Memory Module............................................................... 66
5.4.1.2 DIMM Module Installation....................................................................... 67
5.4.2 Peripheral Device Connection......................................................................... 67
5.4.2.1 IDE Disk Drive Connector (IDE1) ........................................................... 68
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5.5 JUMPER SETTINGS .................................................................................................... 69
5.5.1 AT Power Select Jumper Settings..................................................................... 70
5.5.2 COM3 Setup Jumper Settings .......................................................................... 71
5.5.3 COM1 and COM2 Pin 9 Setup (Optional Jumper) ......................................... 71
5.5.4 LCD Voltage..................................................................................................... 72
5.5.5 CompactFlash® Master/Slave Setup ............................................................... 72
5.5.6 TFT LCD Type.................................................................................................. 73
5.5.7 Clear CMOS Jumper........................................................................................ 73
5.6 CHASSIS INSTALLATION ............................................................................................ 74
5.7 REAR PANEL CONNECTORS ...................................................................................... 74
5.7.1 LCD Panel Connection .................................................................................... 74
5.7.2 Ethernet Connection ........................................................................................ 74
5.7.3 USB Connection............................................................................................... 75
5.7.4 Keyboard and Mouse Connection.................................................................... 75
6 BIOS SETUP ................................................................................................................ 76
6.1 INTRODUCTION......................................................................................................... 77
6.1.1 Starting Setup................................................................................................... 77
6.1.2 Using Setup ...................................................................................................... 77
6.1.3 Getting Help..................................................................................................... 78
6.1.4 Unable to Reboot After Configuration Changes.............................................. 78
6.1.5 Main BIOS Menu ............................................................................................. 79
6.2 STANDARD CMOS FEATURES .................................................................................. 81
6.2.1 IDE Primary Master/Slave .............................................................................. 83
6.3 ADVANCED BIOS FEATURES .................................................................................... 85
6.4 ADVANCED CHIPSET FEATURES ................................................................................ 93
6.4.1 Flat Panel Configuration................................................................................. 96
6.5 INTEGRATED PERIPHERALS....................................................................................... 99
6.5.1 IT8888 ISA Decode IO................................................................................... 104
6.5.2 IT8888 ISA Decode Memory.......................................................................... 106
6.6 POWER MANAGEMENT SETUP ................................................................................ 109
6.7 PNP/PCI CONFIGURATIONS .....................................................................................111
6.8 PC HEALTH STATUS ................................................................................................117
7 RAID SETUP ..............................................................................................................119
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7.1 VIA® RAID UTILITY ............................................................................................ 120
7.2 ACCESSING THE RAID UTILITY ............................................................................. 120
7.3 CREATING A RAID ARRAY ..................................................................................... 121
7.3.1 Automatic Setup ............................................................................................. 122
7.3.2 Manual Setup ................................................................................................. 124
7.4 DELETE A RAID ARRAY ......................................................................................... 128
7.5 SELECTING A BOOT ARRAY .................................................................................... 130
7.6 VIEWING DISK DRIVE SERIAL NUMBERS................................................................ 131
7.7 EXITING THE RAID UTILITY.................................................................................. 133
8 SOFTWARE DRIVERS ............................................................................................ 134
8.1 AVAILABLE SOFTWARE DRIVERS ............................................................................ 135
8.2 DEVICE DRIVER MENU .......................................................................................... 137
8.3 VGA DRIVER ......................................................................................................... 140
8.4 AUDIO DRIVER ....................................................................................................... 148
8.5 LAN DRIVER ......................................................................................................... 157
8.6 SATA/RAID DRIVER ............................................................................................. 163
8.7 ISA DRIVER ........................................................................................................... 168
A BIOS OPTIONS ........................................................................................................ 176
B TERMINOLOGY...................................................................................................... 180
C DIGITAL I/O INTERFACE..................................................................................... 184
C.1 INTRODUCTION ...................................................................................................... 185
C.2 DIO CONNECTOR PINOUTS .................................................................................... 185
C.3 ASSEMBLY LANGUAGE SAMPLES ........................................................................... 186
C.3.1 Enable the DIO Input Function..................................................................... 186
C.3.2 Enable the DIO Output Function .................................................................. 186
D WATCHDOG TIMER .............................................................................................. 187
E ADDRESS MAPPING .............................................................................................. 190
E.1 IO ADDRESS MAP .................................................................................................. 191
E.2 1ST MB MEMORY ADDRESS MAP ........................................................................... 192
E.3 IRQ MAPPING TABLE............................................................................................. 192
E.4 DMA CHANNEL ASSIGNMENTS ............................................................................. 193
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WAFER-LX Motherboard
F COMPATIBILITY..................................................................................................... 194
F.1 COMPATIBLE OPERATING SYSTEMS ........................................................................ 195
F.2 COMPATIBLE PROCESSORS...................................................................................... 195
F.3 COMPATIBLE MEMORY MODULES .......................................................................... 196
G HAZARDOUS MATERIALS DISCLOSURE ....................................................... 197
G.1 HAZARDOUS MATERIALS DISCLOSURE TABLE FOR IPB PRODUCTS CERTIFIED AS
ROHS COMPLIANT UNDER 2002/95/EC WITHOUT MERCURY ..................................... 198
H RAID LEVELS ......................................................................................................... 201
H.1 RAID 0 ................................................................................................................. 203
H.2 RAID 1 ................................................................................................................. 204
H.3 JBOD.................................................................................................................... 205
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WAFER-LX Motherboard
List of Figures
Figure 1-1: WAFER-LX Overview ..................................................................................................4
Figure 1-2: WAFER-LX Solder Side Overview .............................................................................5
Figure 2-1: WAFER-LX Dimensions (mm) ..................................................................................10
Figure 2-2: External Interface Panel Dimensions (mm) ............................................................11
Figure 2-3: Data Flow Block Diagram .........................................................................................12
Figure 4-1: Connector and Jumper Locations...........................................................................28
Figure 4-2: Connector and Jumper Locations (Solder Side) ...................................................29
Figure 4-3: AT Power Connector Location ................................................................................32
Figure 4-4: ATX Power Connector Location ..............................................................................33
Figure 4-5: ATX Power Button Connector .................................................................................34
Figure 4-6: Audio Connector Location .......................................................................................35
Figure 4-7: Battery Connector Location.....................................................................................36
Figure 4-8: Compact Flash Connector Location (Solder Side)................................................37
Figure 4-9: Fan Connector Location...........................................................................................39
Figure 4-10: FDD Connector Location........................................................................................40
Figure 4-11: GPIO Connector Location ......................................................................................41
Figure 4-12: IDE Device Connector Locations ..........................................................................42
Figure 4-13: Inverter Connector Locations................................................................................44
Figure 4-14: Keyboard/Mouse Connector Location ..................................................................45
Figure 4-15: LED Connector Locations ......................................................................................46
Figure 4-16:Print Port Connector Location................................................................................47
Figure 4-17: PC/104 Power Input Connector Pinouts ...............................................................48
Figure 4-18: PC/104 Slot Location ..............................................................................................49
Figure 4-19: Reset Button Connector Locations.......................................................................51
Figure 4-20: RS-232 Serial Port Connector Locations..............................................................52
Figure 4-21: SATA Drive Connector Locations .........................................................................53
Figure 4-22: TFT LCD LVDS Connector Pinout Locations .......................................................54
Figure 4-23: TFT LCD TTL Connector Pinout Locations ..........................................................55
Figure 4-24: USB Connector Pinout Locations .........................................................................57
Figure 4-25: WAFER-LX On-board External Interface Connectors .........................................58
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Figure 4-26: J7 Connector ...........................................................................................................59
Figure 4-27: COM1 Pinout Locations..........................................................................................60
Figure 4-28: VGA1 Connector .....................................................................................................61
Figure 5-1: SO-DIMM Module Installation...................................................................................67
Figure 5-2: Jumper Locations .....................................................................................................70
Figure 7-1: RAID Utility ............................................................................................................. 120
Figure 7-2: RAID Setup Main Screen ....................................................................................... 121
Figure 7-3: Create Array............................................................................................................ 121
Figure 7-4: RAID Type ............................................................................................................... 122
Figure 7-5: Automatic Setup..................................................................................................... 122
Figure 7-6: Confirm Data Deletion ........................................................................................... 123
Figure 7-7: RAID Array Setup Complete ................................................................................. 123
Figure 7-8: Select Drives........................................................................................................... 124
Figure 7-9: Select First Drive.................................................................................................... 124
Figure 7-10: Select Second Drive............................................................................................. 125
Figure 7-11: Disk Drives Selected............................................................................................ 125
Figure 7-12: Stripe Size............................................................................................................. 126
Figure 7-13: Select Stripe Size ................................................................................................. 126
Figure 7-14: Start RAID Creation.............................................................................................. 127
Figure 7-15: Confirm RAID Creation ........................................................................................ 127
Figure 7-16: RAID Array Created.............................................................................................. 128
Figure 7-17: Delete RAID Array ................................................................................................ 128
Figure 7-18: Select Array to Delete .......................................................................................... 129
Figure 7-19: Confirm Array Deletion........................................................................................ 129
Figure 7-20: Array Deleted........................................................................................................ 130
Figure 7-21: Select Boot Array ................................................................................................. 130
Figure 7-22: Select Boot Array ................................................................................................. 131
Figure 7-23: Set Array as Boot Array....................................................................................... 131
Figure 7-24: Serial Number View.............................................................................................. 132
Figure 7-25: Serial Number....................................................................................................... 132
Figure 7-26: Exit RAID Utility.................................................................................................... 133
Figure 8-1: AMD LX/GX CD Main Menu ................................................................................... 136
Figure 8-2: AMD LX/GX CD Driver Menu ................................................................................. 136
Figure 8-3: Start Menu............................................................................................................... 137
Figure 8-4: Control Panel.......................................................................................................... 138
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Figure 8-5: System..................................................................................................................... 139
Figure 8-6: Device Manager...................................................................................................... 140
Figure 8-7: Hardware Update Wizard....................................................................................... 141
Figure 8-8: Installation Location .............................................................................................. 142
Figure 8-9: Driver Location....................................................................................................... 143
Figure 8-10: Have Disk .............................................................................................................. 144
Figure 8-11: Browse For Driver Location ................................................................................ 144
Figure 8-12: Graphics Driver Directory ................................................................................... 145
Figure 8-13: Select Driver File .................................................................................................. 145
Figure 8-14: Install From Disk .................................................................................................. 146
Figure 8-15: Select The Driver.................................................................................................. 146
Figure 8-16: Windows Logo Testing........................................................................................ 147
Figure 8-17: Installation Complete........................................................................................... 147
Figure 8-18: Device Manager.................................................................................................... 148
Figure 8-19: Hardware Update Wizard..................................................................................... 149
Figure 8-20: Installation Location ............................................................................................ 150
Figure 8-21: Driver Location..................................................................................................... 151
Figure 8-22: Have Disk .............................................................................................................. 152
Figure 8-23: Have Disk .............................................................................................................. 152
Figure 8-24: Browse For Driver Location ................................................................................ 153
Figure 8-25: Graphics Driver Directory ................................................................................... 153
Figure 8-26: Select Driver File .................................................................................................. 154
Figure 8-27: Install From Disk .................................................................................................. 154
Figure 8-28: Select The Driver.................................................................................................. 155
Figure 8-29: Windows Logo Testing........................................................................................ 155
Figure 8-30: Installation Complete........................................................................................... 156
Figure 8-31: Device Manager.................................................................................................... 157
Figure 8-32: Hardware Update Wizard..................................................................................... 158
Figure 8-33: Installation Location ............................................................................................ 159
Figure 8-34: Have Disk .............................................................................................................. 159
Figure 8-35: Browse For Driver Location ................................................................................ 160
Figure 8-36: Graphics Driver Directory ................................................................................... 160
Figure 8-37: Select Driver File .................................................................................................. 161
Figure 8-38: Install From Disk .................................................................................................. 161
Figure 8-39: Select The Driver.................................................................................................. 162
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Figure 8-40: Installation Complete........................................................................................... 162
Figure 8-41: Locate the Setup Program Icon.......................................................................... 163
Figure 8-42: Preparing Setup Screen ...................................................................................... 164
Figure 8-43: Install Wizard Welcome Screen .......................................................................... 164
Figure 8-44: Software License Agreement.............................................................................. 165
Figure 8-45: Select Driver Packages........................................................................................ 165
Figure 8-46: Review Installation Items .................................................................................... 166
Figure 8-47: Installation Status ................................................................................................ 166
Figure 8-48: InstallShield Wizard Complete Screen............................................................... 167
Figure 8-49: Device Manager.................................................................................................... 168
Figure 8-50: Hardware Update Wizard..................................................................................... 169
Figure 8-51: Installation Location ............................................................................................ 170
Figure 8-52: Driver Location..................................................................................................... 171
Figure 8-53: Have Disk .............................................................................................................. 172
Figure 8-54: Browse For Driver Location ................................................................................ 172
Figure 8-55: Graphics Driver Directory ................................................................................... 173
Figure 8-56: Select Driver File .................................................................................................. 173
Figure 8-57: Install From Disk .................................................................................................. 174
Figure 8-58: Select The Driver.................................................................................................. 174
Figure 8-59: Installation Complete........................................................................................... 175
Figure H-1: RAID 0 ..................................................................................................................... 203
Figure H-2: RAID 1 ..................................................................................................................... 204
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List of Tables
Table 1-1: WAFER-LX Model Specifications................................................................................2
Table 1-2: Technical Specifications..............................................................................................7
Table 2-1: Geode LX Graphics Features ....................................................................................16
Table 2-2: Power Consumption...................................................................................................22
Table 3-1: Package List Contents ...............................................................................................26
Table 4-1: Peripheral Interface Connectors ...............................................................................30
Table 4-2: Rear Panel Connectors ..............................................................................................30
Table 4-3: On-board Jumpers......................................................................................................31
Table 4-4: AT Power Connector Pinouts....................................................................................33
Table 4-5: ATX Power Connector Pinouts .................................................................................34
Table 4-6: ATX Power Button Connector Pinouts.....................................................................34
Table 4-7: Audio Connector Pinouts ..........................................................................................35
Table 4-8: Battery Connector Pinouts ........................................................................................36
Table 4-9: Compact Flash Connector Pinouts...........................................................................38
Table 4-10: Fan Connector Pinouts ............................................................................................39
Table 4-11: FDD Connector Pinouts ...........................................................................................40
Table 4-12: GPIO Connector Pinouts..........................................................................................41
Table 4-13: Secondary IDE Connector Pinouts .........................................................................43
Table 4-14: Inverter Power Connector Pinouts .........................................................................44
Table 4-15: Keyboard/Mouse Connector Pinouts .....................................................................45
Table 4-16: LED Connector Pinouts ...........................................................................................46
Table 4-17: Parallel Port Connector Pinouts .............................................................................47
Table 4-18: PC/104 Power Input Connector Pinouts.................................................................48
Table 4-19: PC/104 Slot Connector Pinouts...............................................................................50
Table 4-20: Reset Button Connector Pinouts ............................................................................51
Table 4-21: RS-232/422/485 Serial Port Connector Pinouts .....................................................52
Table 4-22: SATA Drive Connector Pinouts...............................................................................53
Table 4-23: TFT LCD LVDS Port Connector Pinouts.................................................................54
Table 4-24: TFT LCD TTL Port Connector Pinouts....................................................................56
Table 4-25: USB Port Connector Pinouts...................................................................................57
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Table 4-26: CN19 Connector Pinouts .........................................................................................58
Table 4-27: J7 Connector Pinouts...............................................................................................59
Table 4-28: J7 Connector LEDs...................................................................................................59
Table 4-29: COM1 Pinouts ...........................................................................................................60
Table 4-30: VGA1 Connector Pinouts.........................................................................................61
Table 5-1: IEI Provided Cables ....................................................................................................68
Table 5-2: Jumpers .......................................................................................................................69
Table 5-3: AT Power Select Jumper Settings ............................................................................70
Table 5-4: COM3 Setup Jumper Settings ...................................................................................71
Table 5-5: COM1 Pin 9 Setup.......................................................................................................71
Table 5-6: COM2 Pin 9 Setup.......................................................................................................72
Table 5-7: COM3 Setup Jumper Settings ...................................................................................72
Table 5-8: CompactFlash® Master/Slave Setup ........................................................................73
Table 5-9: TFT LCD Type .............................................................................................................73
Table 5-10: Clear CMOS Jumper Settings..................................................................................74
Table 6-1: BIOS Navigation Keys ................................................................................................78
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BIOS Menus
BIOS Menu 1: Award BIOS CMOS Setup Utility ........................................................................79
BIOS Menu 2: Standard CMOS Features....................................................................................81
BIOS Menu 3: Advanced BIOS Features ....................................................................................85
BIOS Menu 4: Advanced Chipset Features................................................................................93
BIOS Menu 5: Flat Panel Configuration......................................................................................96
BIOS Menu 6: Integrated Peripherals .........................................................................................99
BIOS Menu 7: IT8888 ISA Decode IO ....................................................................................... 104
BIOS Menu 8: IT8888 ISA Decode Memory ............................................................................. 107
BIOS Menu 9: Power Management Setup ............................................................................... 109
BIOS Menu 10: PnP/PCI Configurations.................................................................................. 111
BIOS Menu 11: IRQ Resources ................................................................................................ 113
BIOS Menu 12: DMA Resources............................................................................................... 114
BIOS Menu 13: Memory Resources ......................................................................................... 115
BIOS Menu 14: PC Health Status ............................................................................................. 117
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WAFER-LX Motherboard
Chapter
1
1 Introduction
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WAFER-LX Motherboard
1.1 Overview
The 3.5” WAFER-LX AMD LX-800 low power single board computer (SBC) is fully
equipped with advanced multi-mode I/Os. The WAFER-LX is designed for system
manufacturers, integrators, and VARs that want performance, reliability, and quality at a
reasonable price.
1.1.1 Models
The WAFER-LX series has five models:
ƒ
WAFER-LX-800-R12
ƒ
WAFER-LX-WINXPE
ƒ
WAFER-LX-CENET050
ƒ
WAFER-LX-CLIENT-XPE
ƒ
WAFER-LX-CLIENT-CENET050
The specifications for the four models are show in Table 1-1.
WAFER-LX-
800-R12
WINXPE
CENET050
CLIENT-XPE
CLIENT-CENET050
AMD LX-800 CPU
Yes
Yes
Yes
Yes
Yes
SO-DIMM Memory*
No
Yes
Yes
Yes
Yes
CRT
Yes
Yes
Yes
Yes
Yes
LCD/LVDS
Yes
Yes
Yes
Yes
Yes
Dual LAN
Yes
Yes
Yes
Yes
Yes
SATA
Yes
Yes
No driver
Yes
No driver
Audio
Yes
Yes
Yes
Yes
Yes
IFM
No
512 MB
32 MB
512 MB
64 MB
WinXPE Image
No
Yes
No
Yes
No
WinCE Image
No
No
Yes
No
Yes
Thin Client Package
No
No
No
Yes
Yes
Table 1-1: WAFER-LX Model Specifications
*
The preinstalled memory is a 256 MB DDR SO-DIMM memory module.
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WAFER-LX Motherboard
1.1.2 Applications
The WAFER-LX is designed for applications in the following areas:
ƒ
Kiosks and Point of Sales
ƒ
Restaurants
ƒ
Human Machine Interface (HMI) applications
ƒ
Marine, GPS and transportation applications
ƒ
Financial, retail and kiosk applications
1.1.3 Benefits
Some of the WAFER-LX benefits include:
ƒ
Reduced hardware costs
ƒ
Reduced software costs
ƒ
Reduced maintenance costs
ƒ
Client crash prevention
ƒ
Central resource control
ƒ
Security protection
1.1.4 Features
Some of the WAFER-LX features are listed below:
ƒ
3.5” form factor
ƒ
RoHS compliant
ƒ
AMD LX-800 processor installed
ƒ
Dual-independent display functionality
ƒ
Low power consumption (6 Watts)
ƒ
Two high performance 10/100 megabit Ethernet controllers on-board
ƒ
Two SATA channels with transfer rates up to 150 MB/s on-board
ƒ
Four USB 2.0 devices on-board
ƒ
Integrated audio
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WAFER-LX Motherboard
1.1.5 Connectors
Figure 1-1: WAFER-LX Overview
Page 4
WAFER-LX Motherboard
Figure 1-2: WAFER-LX Solder Side Overview
The WAFER-LX has the following connectors on-board:
ƒ
1 x AT power connector
ƒ
1 x ATX power function connector
ƒ
1 x Audio connector
ƒ
1 x Battery connector
ƒ
1 x Compact Flash (CF) connector (solder side)
ƒ
1 x External LED connector
ƒ
1 x Fan connector
ƒ
1 x Floppy disk drive connector (slim type, optional)
ƒ
1 x General purpose input/output (GPIO) connector
ƒ
1 x IDE Interface connectors (44-pin)
ƒ
1 x Inverter power connector
ƒ
1 x Keyboard/mouse connector
ƒ
1 x Parallel port connector
ƒ
1 x PC/104 slot
ƒ
1 x PC/104 power connector
Page 5
WAFER-LX Motherboard
ƒ
1 x Reset button connector
ƒ
1 x RS-232/422/485 serial port connector
ƒ
2 x SATA connectors
ƒ
1 x Suspend power input connector
ƒ
1 x TFT LCD LVDS interface connector
ƒ
1 x TFT LCD TFT interface connector
ƒ
1 x USB connector
ƒ
1 x SO-DIMM socket
The WAFER-LX has the following connectors on the board rear panel:
ƒ
2 x Ethernet connectors
ƒ
1 x Dual USB connector
ƒ
1 x Serial port connector
ƒ
1 x VGA connector
The WAFER-LX has the following on-board jumpers:
ƒ
AT power select jumper
ƒ
COM3 function select jumper
1.1.6 Technical Specifications
WAFER-LX technical specifications are listed in Table 1-2.
Specification
WAFER-LX
Form Factor
3.5” form factor
CPU
AMD Geode™ LX 800 500 MHz
Southbridge Chipset
AMD Geode™ CS5536
Display
CRT integrated in AMD Geode™ LX800
TTL/LVDS
18-bit single channel TFT LCD
Memory
BIOS
Page 6
Supports one 1 GB DDR 333/400 200-pin SO-DIMM SDRAM
module
Award BIOS
WAFER-LX Motherboard
Specification
WAFER-LX
SSD
CompactFlash®
Super I/O
W83627EHG
Audio
AC'97 Codec Realtek ALC203
LAN
10/100 Base-T dual RTL8100C
COM
Two RS-232
One RS-422/485
USB2.0
Four USB 1.1 or USB 2.0 devices supported
IDE
One 44-pin IDE connects to two Ultra ATA33/66/100 devices
Floppy
One floppy disk drive connector
Parallel Port
One LPT port connector
SATA
Two SATA connectors with transfer rates up to 150 Mb/sec
KB/MS
One on-board keyboard/mouse connector
Watchdog Timer
Software programmable 1-255 sec. by supper I/O
Digital I/O
One GPIO connector
Fan connector
One CPU fan connector
Expansion
One PC/104 slot
Power Supply
+5 V ± 5% AT/ATX power support
(12 V only necessary for LCD power)
Temperature
0ºC - 60ºC
Humidity (operating)
5%~95% non-condensing
Dimensions
145 mm x 102 mm
Weight (GW/NW)
670g/230g
Table 1-2: Technical Specifications
Page 7
WAFER-LX Motherboard
1.2 Operating System Packages
1.2.1 Windows XPE SP2 (350 MB image size stored in a 512 MB CF card)
1. Advance Set Top Box: The package includes the components required to
create the advanced Set-Top Box (ASTB). The package provides the
functionality of the basic set-top box and also supports DVD playback, DVR,
Web browsing, networking, universal serial bus (USB), terminal services, and
Windows Media Player.
2. Internet Explorer.
3. Net Framework 1.1.
4. EWF (Enhanced Write Filter).
5. CMD - Windows Command Processor.
6. Device Manager and Task Manager.
7. Video / audio and other board chipset drivers.
8. PS/2 keyboard / mouse drivers.
9. IDE Compact Flash/HDD/Flash Disk/CD-ROM support0.
1.2.2 Windows CE 5.0 (around 22 MB, CF must > 32 MB)
1. Enterprise Web Pad (provides the starting point for a range of Web
Pad-based devices.)
2. IE 6.0, Media Player, Excel Viewer, Image Viewer, PDF viewer, PowerPoint
viewer, Word viewer, and WordPad.
3. Support hive-based registry.
4. SIP (Software-based Input Panel): SIP for Large Screens.
5. Microsoft Foundation Classes (MFC).
6. NET Compact Framework 2.0.
7. Standard SDK for Windows CE.
8. Transaction-Safe FAT File System (TFAT).
9. PCL Printer Driver.
10. Devices drivers: IDE, CF card, CD-ROM, USB host, USB
keyboard/mouse/storage, Ethernet, and serial ports. 0.
Page 8
WAFER-LX Motherboard
Chapter
2
2 Detailed Specifications
Page 9
WAFER-LX Motherboard
2.1 Overview
This chapter describes the specifications and on-board features of the WAFER-LX in
detail.
2.2 Dimensions
2.2.1 Board Dimensions
The dimensions of the board are listed below:
ƒ
Length:
146.06 mm
ƒ
Width:
102 mm
Figure 2-1: WAFER-LX Dimensions (mm)
Page 10
WAFER-LX Motherboard
2.2.2 External Interface Panel Dimensions
External interface panel dimensions are shown in Figure 2-2.
Figure 2-2: External Interface Panel Dimensions (mm)
Page 11
WAFER-LX Motherboard
2.3 Data Flow
Figure 2-3 shows the data flow between the two on-board chipsets and other components
installed on the motherboard and described in the following sections of this chapter.
Figure 2-3: Data Flow Block Diagram
Page 12
WAFER-LX Motherboard
2.4 AMD Geode™ LX 800 CPU
The WAFER-LX series motherboards all come with a preinstalled AMD Geode™ LX 800
500 MHz CPU.
2.4.1 Specifications
The specifications for the 500 MHz AMD Geode™ LX 800 are listed below
ƒ
x86/x87-compatible core
ƒ
Processor frequency up to 500 MHz
ƒ
64K I/64K D L1 cache and 128K L2 cache
ƒ
Split I/D cache/TLB (Translation Look-Aside Buffer)
ƒ
64-bit DDR Memory interface up to 400 MHz (LX 800), up to 333 MHz (LX
700)
ƒ
Integrated FPU that supports the Intel MMX® and AMD 3DNow!™
Technology instruction sets
ƒ
9 GB/s internal GeodeLink™ Interface Unit (GLIU)
ƒ
Security Block
o
o
ƒ
128-bit AES (CBC/ECB)
True Random Number Generator
High-resolution CRT and TFT outputs (simultaneous operation)
o
o
Support for High Definition (HD) and Standard Definition (SD) standards
Support 1920x1440 in CRT mode and 1600x1200 in TFT mode
ƒ
VESA 1.1 and 2.0 VIP/VDA support
ƒ
0.13 micron process
ƒ
481-terminal PBGA (Plastic Ball Grid Array) with internal heatspreader
2.4.2 Power Management
The power management for the 500 MHz AMD Geode™ LX 800 is listed below:
ƒ
1.8 W Typical (3.9 W TDP) @ 500 MHz
ƒ
GeodeLink active hardware power management
ƒ
Hardware support for standard ACPI software power management
ƒ
I/O companion SUSP#/SUSPA# power controls
ƒ
Lower power I/O
Page 13
WAFER-LX Motherboard
ƒ
Wakeup on SMI/INTR
2.5 System Chipset
The WAFER-LX series motherboards all have a preinstalled AMD Geode™ CS5536
system chipset. The system chipset features are listed below.
ƒ
GeodeLink™ Interface Unit
o
o
64-bit, 66 MHz operation
PCI VSM (Virtual System Module) that makes the interface transparent to
applications software and BIOS
o
Programmable routing descriptors, use and activity monitors, and SSMI
(Synchronous System Management Interrupt)
ƒ
ATA-6 Controller
o
o
ƒ
100 MB/s IDE Controller in UDMA mode per the ATA-6 specification
5 V interface
Flash Interface
o
Multiplexed with IDE interface Connects to an array of industry standard
NAND Flash and/or NOR Flash
ƒ
USB Controller
o
o
ƒ
4 USB ports
Supports both USB 1.1 and USB 2.0
Audio Codec 97 (AC97) Controller
o
AC97 specification v2.3 compliant interface to multiple audio codecs:
Serial In, Serial Out, Sync Out, Bit Clock In
o
ƒ
Diverse Device
o
o
o
o
o
o
o
o
o
Page 14
Legacy “PC Beep” support
82xx Legacy Devices
IR Communication Port
System Management Bus (SMB) Controller
LPC (Low Pin Count) Port
General Purpose I/Os (GPIOs)
8 Multi-Function General Purpose Timers (MFGPTs)
Real-Time Clock (RTC) with CMOS RAM
Power Management Controller
ACPI v2.0 compliant
WAFER-LX Motherboard
2.6 Graphics Support
The Geode LX processor’s Graphics Processor is a BitBLT/vector engine that supports
pattern generation, source expansion, pattern/source transparency, 256 ternary raster
operations, alpha blenders to support alpha- BLTs, incorporated BLT FIFOs, a GeodeLink
interface and the ability to throttle BLTs according to video timing. New features added to
the Graphics Processor include:
ƒ
Command buffer interface
ƒ
Hardware accelerated rotation BLTs
ƒ
Color depth conversion
ƒ
Paletized color
ƒ
Full 8x8 color pattern buffer
ƒ
Separate base addresses for all channels
ƒ
Monochrome inversion
Table 2-1 lists a complete list of Geode LX graphics features. For more details, please
refer to the AMD website or the Geode LX series data book available from AMD.
Feature
AMD Geode™ LX Processor
Color Depth
8, 16, 32 bpp (A) RGB 4 and 8-bit indexed
ROPs
256 (2-src, dest and pattern)
BLT Buffers
FIFOs in Graphics Processor
BLT Splitting
Managed by hardware
Video Synchronized BLT/Vector
Throttle by VBLANK
Bresenham Lines
Yes
Patterned (stippled) Lines
Yes
Screen to Screen BLT
Yes
Screen to Screen BLT with mono expansion
Yes
Memory to Screen BLT
Yes (throttled rep movs writes)
Accelerated Text
No
Pattern Size (Mono)
8x8 pixels
Pattern Size (Color)
8x8 pixels
Monochrome Pattern
Yes (with inversion)
Dithered Pattern (4 color)
No
Page 15
WAFER-LX Motherboard
Feature
AMD Geode™ LX Processor
Color Pattern
8, 16, 32 bpp
Transparent Pattern
Monochrome
Solid Fill
Yes
Pattern Fill
Yes
Transparent Source
Monochrome
Color Key Source Transparency
Y with mask
Variable Source Stride
Yes
Variable Destination Stride
Yes
Destination Write Bursting
Yes
Selectable BLT Direction
Vertical and Horizontal
Alpha BLT
Yes (constant α, α/pix, or sep. α channel)
VGA Support
Decodes VGA Register
Pipeline Depth
Unlimited
Accelerated Rotation BLT
8, 16, 32 bpp
Color Depth Conversion
5:6:5, 1:5:5:5, 4:4:4:4, 8:8:8:8
Table 2-1: Geode LX Graphics Features
2.7 Memory Support
The WAFER-LX has one 200-pin DDR SO-DIMM SDRAM socket that supports one
333 MHz or 400 MHz DDR SO-DIMM memory module with a maximum capacity of
1.0 GB.
2.8 PCI Bus Interface Support
The PCI bridge on the WAFER-LX has the following features:
Page 16
ƒ
33 MHz Revision 2.2 is implemented
ƒ
Maximum throughput: 133 MB/s
ƒ
PCI and GLIU interface control
ƒ
Read and write FIFOs
ƒ
PCI
WAFER-LX Motherboard
2.9 Ethernet Controller Specifications
2.9.1 Overview
The Realtek RTL8100C(L) is a highly integrated and cost-effective single-chip Fast
Ethernet controller. It is enhanced with an ACPI (Advanced Configuration Power Interface)
management function for PCI in order to provide efficient power management for
advanced
operating
systems
with
OSPM
(Operating
System
Directed
Power
Management).
The RTL8100C(L) also supports remote wake-up (including AMD Magic Packet™ and
Microsoft® Wake-up frame) to increase cost-efficiency in network maintenance and
management. It is an ideal solution for notebook/motherboard-embedded network
designs.
2.9.2 Features
ƒ
Integrates Fast Ethernet MAC, physical chip, and transceiver onto a single
chip
ƒ
10 Mb/s and 100 Mb/s operation
ƒ
Supports 10 Mb/s and 100 Mb/s N-way auto-negotiation
ƒ
Supports 25 MHz Crystal or 25 MHz OSC as the internal clock source
ƒ
Complies with PC99/PC2001 standards
ƒ
Supports ACPI power management
ƒ
Provides PCI bus master data transfer
ƒ
Provides PCI memory space or I/O space mapped data transfer
ƒ
Supports PCI clock speed of 16.75 MHz-40 MHz
ƒ
Advanced power saving mode
ƒ
Supports Wake-on-LAN and remote wake-up (AMD Magic Packet™, Link
Change, and Microsoft® Wake-up frame)
ƒ
Half/Full duplex capability
ƒ
Supports Full Duplex Flow Control (IEEE 802.3x)
ƒ
Provides interface to 93C46 EEPROM to store resource configuration and ID
parameters
ƒ
Provides PCI clock run pin
ƒ
Provides LED pins for network operation status indication
Page 17
WAFER-LX Motherboard
ƒ
2.5/3.3 V power supply with 5 V tolerant I/Os
2.10 Drive Interfaces
The WAFER-LX can support the following drive interfaces.
ƒ
2 x SATA drives
ƒ
2 x IDE devices
ƒ
1 x FDD (slim type, optional)
ƒ
1 x CF I or CF II card
2.10.1 SATA Drives
The WAFER-LX supports two, first generation SATA drives with transfer rates of up to
150 Mb/s
2.10.2 IDE HDD Interfaces
The WAFER-LX system chipset IDE controller supports up to two HDDs with the following
specifications:
ƒ
Supports PIO IDE transfers up to 16 MB/s
ƒ
Supports the following Ultra ATA devices:
o
o
o
Ultra ATA/100, with data transfer rates up to 100 MB/s
Ultra ATA/66, with data transfer rates up to 66 MB/s
Ultra ATA/33, with data transfer rates up to 33 MB/s
2.10.3 Floppy Disk Drive (FDD)
The WAFER-LX supports a single FDD. The following FDD formats are compatible with
the board.
ƒ
5.25”: 360 KB and 1.2 MB
ƒ
3.5”: 720 KB, 1.44 MB and 2.88 MB
2.10.4 Compact Flash Support
A standard CF I or CF II card can be inserted into the compact flash slot on the solder side
of the WAFER-LX PCB.
Page 18
WAFER-LX Motherboard
2.11 Serial Ports
The WAFER-LX has two high-speed UART serial ports, configured as COM1 and COM2.
The serial ports have the following specifications.
ƒ
16C550 UART with 16-byte FIFO buffer
ƒ
115.2 Kb/s transmission rate
COM2 can be configured as RS-232, RS-422 or RS-485.
2.12 Real Time Clock
256-byte battery backed CMOS RAM
2.13 System Monitoring
The WAFER-LX is capable of self-monitoring various aspects of its operating status
including:
ƒ
CPU, chipset, and battery voltage, +3.3 V, +5 V, and +12 V
ƒ
RPM of cooling fans
ƒ
CPU and board temperatures (by the corresponding embedded sensors)
2.14 USB Interfaces
The WAFER-LX has four USB interfaces, two internal (on one pin header connector) and
two external. The USB interfaces support USB 2.0.
2.15 BIOS
The WAFER-LX uses a licensed copy of AWARD BIOS. The features of the flash BIOS
used are listed below:
ƒ
SMIBIOS (DMI) compliant
ƒ
Console redirection function support
ƒ
PXE (Pre-Boot Execution Environment) support
ƒ
USB booting support
Page 19
WAFER-LX Motherboard
2.16 Operating Temperature and Temperature Control
The maximum and minimum operating temperatures for the WAFER-LX are listed below.
ƒ
Minimum Operating Temperature: 0ºC (32°F)
ƒ
Maximum Operating Temperature: 60°C (140°F)
A cooling fan and heat sink must be installed on the CPU. Thermal paste must be
smeared on the lower side of the heat sink before it is mounted on the CPU. Heat sinks
are also mounted on the Northbridge and Southbridge chipsets to ensure the operating
temperature of these chips remain low.
2.17 Audio Codec
The WAFER-LX has an integrated RealTek ALC203 codec. The RealTek ALC203 is a
20-bit DAC and 18-bit ADC full-duplex AC'97 2.3 compatible stereo audio CODEC
designed for PC multimedia systems, including host/soft audio, and AMR/CNR based
designs. The codec meets performance requirements for audio on PC99/2001 systems
ƒ
Single chip with high S/N ratio (>100 dB)
ƒ
Meets performance requirements for audio on PC2001 systems
ƒ
Meets Microsoft WHQL/WLP 2.0 audio requirements
ƒ
20-bit DAC and 18-bit ADC resolution
ƒ
18-bit Stereo full-duplex CODEC with independent and variable sampling rate
ƒ
Complies with AC'97 2.3 specifications
o
o
o
o
o
o
LINE/HP-OUT, MIC-IN and LINE-IN sensing
14.318 MHz -> 24.576 MHz PLL saves crystal
12.288 MHz BITCLK input can be consumed
Integrated PCBEEP generator to save buzzer
Interrupt capability
Page registers and Analog Plug & Play
ƒ
Support of S/PDIF out is fully compliant with AC'97 rev2.3 specifications
ƒ
Three analog line-level stereo inputs with 5-bit volume control: LINE_IN, CD,
AUX
Page 20
ƒ
High quality differential CD input
ƒ
Two analog line-level mono input: PCBEEP, PHONE-IN
ƒ
Supports double sampling rate (96 KHz) of DVD audio playback
WAFER-LX Motherboard
ƒ
Two software selectable MIC inputs
ƒ
+6/12/20/30dB boost preamplifier for MIC input
ƒ
Stereo output with 6-bit volume control
ƒ
Mono output with 5-bit volume control
ƒ
Headphone output with 50mW/20Ohm amplifier
ƒ
3D Stereo Enhancement
ƒ
Multiple CODEC extension capability
ƒ
External Amplifier Power Down (EAPD) capability
ƒ
Power management and enhanced power saving features
ƒ
Stereo MIC record for AEC/BF application
ƒ
DC Voltage volume control
ƒ
Auxiliary power to support Power Off CD
ƒ
Adjustable VREFOUT control
ƒ
2 GPIO pins with smart GPIO volume control
ƒ
2 Universal Audio Jacks (UAJ)® for front panel
ƒ
Supports 32K/44.1K/48K/96 KHz S/PDIF output
ƒ
Supports 32K/44.1K/48 KHz S/PDIF input
ƒ
Power support: Digital: 3.3 V; Analog: 3.3 V/5 V
ƒ
Standard 48-Pin LQFP Package
ƒ
EAX™ 1.0 & 2.0 compatible
ƒ
Direct Sound 3D™ compatible
ƒ
A3D™ compatible
ƒ
I3DL2 compatible
ƒ
HRTF 3D Positional Audio
ƒ
Sensaura™ 3D Enhancement (optional)
ƒ
10 Bands of Software Equalizer
ƒ
Voice Cancellation and Key Shifting in Karaoke mode
ƒ
AVRack® Media Player
2.18 Power Consumption
Table 2-2 shows the power consumption parameters for the WAFER-LX when an AMD
Geode LX 800 processor is running with one 1 GB DDR400 memory module and running
3D Mark.
Page 21
WAFER-LX Motherboard
Voltage
Current
+5 V
1.53 A
Table 2-2: Power Consumption
2.19 Packaged Contents and Optional Accessory Items
2.19.1 Package Contents
The WAFER-LX is shipped with the following components.
ƒ
1x WAFER-LX800 single board computer
ƒ
1 x Mini jumper pack
ƒ
1 x IDE flat cable 44P/44P
ƒ
2 x SATA cables
ƒ
1 x SATA power cable
ƒ
1 x Audio cable
ƒ
1 x KB/MS cable
ƒ
1 x USB cable
ƒ
1 x RS-232 cable
ƒ
1 x Utility CD
ƒ
1 x Quick Installation Guide
2.19.2 Optional Accessory Items
The items shown in the list below are optional accessory items are purchased separately.
ƒ
Page 22
LPT cable
WAFER-LX Motherboard
Chapter
3
3 Unpacking
Page 23
WAFER-LX Motherboard
3.1 Anti-static Precautions
WARNING:
Failure to take ESD precautions during the installation of the
WAFER-LX may result in permanent damage to the WAFER-LX and
severe injury to the user.
Electrostatic discharge (ESD) can cause serious damage to electronic components,
including the WAFER-LX. Dry climates are especially susceptible to ESD. It is therefore
critical that whenever the WAFER-LX, or any other electrical component is handled, the
following anti-static precautions are strictly adhered to.
ƒ
Wear an anti-static wristband: - Wearing a simple anti-static wristband can
help to prevent ESD from damaging the board.
ƒ
Self-grounding:- Before handling the board touch any grounded conducting
material. During the time the board is handled, frequently touch any
conducting materials that are connected to the ground.
ƒ
Use an anti-static pad: When configuring the WAFER-LX, place it on an
antic-static pad. This reduces the possibility of ESD damaging the
WAFER-LX.
ƒ
Only handle the edges of the PCB:-: When handling the PCB, hold the PCB
by the edges.
3.2 Unpacking
3.2.1 Unpacking Precautions
When the WAFER-LX is unpacked, please do the following:
ƒ
Follow the anti-static precautions outlined in Section 3.1.
ƒ
Make sure the packing box is facing upwards so the WAFER-LX does not fall
out of the box.
ƒ
Page 24
Make sure all the components shown in Section 3.3 are present.
WAFER-LX Motherboard
3.3 Unpacking Checklist
NOTE:
If some of the components listed in the checklist below are missing,
please do not proceed with the installation. Contact the IEI reseller or
vendor you purchased the WAFER-LX from or contact an IEI sales
representative directly. To contact an IEI sales representative, please
send an email to sales@iei.com.tw.
3.3.1 Package Contents
The WAFER-LX is shipped with the following components:
Quantity
Item and Part Number
1
WAFER-LX
1
HDD cable
Image
(P/N: 32200-000009-RS)
1
KB/MS PS/2 Y-cable
(P/N: 32000-023800-RS)
1
Audio cable
(P/N: 32000-072100-RS)
2
SATA cables
(P/N: 32000-062800-RS)
Page 25
WAFER-LX Motherboard
Quantity
Item and Part Number
1
SATA power cable
(P/N: 32100-088600-RS)
1
RS-232/422/485 cable
(P/N: 32200-026500-RS)
1
USB Cable
(P/N: 32000-070300-RS)
1
Mini jumper Pack
(P/N: 33100-000033-RS)
1
Quick Installation Guide
(P/N: 51000-022027-RS)
1
Utility CD
(P/N: IEI-7B000-000098-RS)
Table 3-1: Package List Contents
Page 26
Image
WAFER-LX Motherboard
Chapter
4
4 Connectors and Jumpers
Page 27
WAFER-LX Motherboard
4.1 Peripheral Interface Connectors
Section 4.1.2 shows peripheral interface connector locations. Section 4.1.2 lists all the
peripheral interface connectors seen in Section 4.1.2.
4.1.1 WAFER-LX Layout
Figure 4-1 shows the on-board peripheral connectors, rear panel peripheral connectors
and on-board jumpers.
Figure 4-1: Connector and Jumper Locations
Page 28
WAFER-LX Motherboard
Figure 4-2: Connector and Jumper Locations (Solder Side)
4.1.2 Peripheral Interface Connectors
Table 4-1 shows a list of the peripheral interface connectors on the WAFER-LX. Detailed
descriptions of these connectors can be found in Section 4.2 on page 31.
Connector
Type
Label
AT power connector
4-pin header
CN1
ATX power function connector
3-pin header
CN2
ATX power button connector
2-pin header
CN13
Audio connector
10-pin header
CN8
Battery connector
2-pin header
CN7
Compact Flash (CF) connector
50-pin header
CN32
Fan connector
3-pin header
CN4
Floppy Disk connector
26-pin header
CN31
GPIO connector
10-pin header
CN14
Page 29
WAFER-LX Motherboard
Connector
Type
Label
IDE Interface connector
44-pin header
CN30
Inverter power connector
5-pin header
CN3
Keyboard/Mouse connector
6-pin header
CN17
LED connector
6-pin header
CN5
Parallel port connector
26-pin header
CN15
PC/104 power input connector
3-pin header
CN11
PC/104 slot
104-pin slot
CN10
Reset button connector
2-pin header
CN12
RS-232/422/485 serial port connector
14-pin header
CN16
SATA drive connector (150 MB/s)
7-pin SATA connector
CN23
SATA drive connector (150 MB/s)
7-pin SATA connector
CN25
TFTLCD LVDS connector
20-pin header
CN29
TFT LCD TTL connector
40-pin header
CN28
USB connector (USB 1.1 and USB 2.0)
8-pin header
CN24
Table 4-1: Peripheral Interface Connectors
4.1.3 External Interface Panel Connectors
Table 4-2 lists the rear panel connectors on the WAFER-LX. Detailed descriptions of
these connectors can be found in Section 4.3 on page 57.
Connector
Type
Label
Ethernet connector
RJ-45
CN20
Ethernet connector
RJ-45
CN21
RS-232 serial port connector
9-pin male
CN22
USB port
USB port
CN19
VGA port connector
15-pin female
CN26
Table 4-2: Rear Panel Connectors
Page 30
WAFER-LX Motherboard
4.1.4 On-board Jumpers
NOTE:
A jumper is a metal bridge that is
used to close an electrical circuit. It
consists of two metal pins and a small
metal clip (often protected by a plastic
cover) that slides over the pins to
connect them. To CLOSE/SHORT a
jumper means connecting the pins of
Jumper
the jumper with the plastic clip and to
OPEN a jumper means removing the plastic clip from a jumper.
Table 4-3 lists the on-board jumpers. Detailed descriptions of these jumpers can be found
in Section 5.5 on page 69.
Description
Label
Type
AT power select
JP1
2-pin header
COM3 mode setup
JP2
3-pin header
COM1 and COM2 pin 9 setup
JP3
10-pin header
LCD voltage selection
JP4
3-pin header
CompactFlash® master/slave setup
JP5
3-pin header
LCD type selection
JP6
3-pin header
Clear CMOS
CN7
2-pin header
(Optional jumper)
Table 4-3: On-board Jumpers
Page 31
WAFER-LX Motherboard
4.2 Internal Peripheral Connectors
Internal peripheral connectors are found on the motherboard and are only accessible
when the motherboard is outside of the chassis. This section has complete descriptions of
all the internal, peripheral connectors on the WAFER-LX.
4.2.1 AT Power Connector
CN Label:
CN1
CN Type:
4-pin AT power connector (1x4)
CN Location:
See Figure 4-3
CN Pinouts:
See Table 4-4
The AT power connector is connected to an AT power source that powers the system.
Figure 4-3: AT Power Connector Location
PIN NO.
DESCRIPTION
1
+12 V
2
GND
Page 32
WAFER-LX Motherboard
PIN NO.
DESCRIPTION
3
GND
4
+5 V
Table 4-4: AT Power Connector Pinouts
4.2.2 ATX Power Connector
CN Label:
CN2
CN Type:
3-pin header (1x3)
CN Location:
See Figure 4-4
CN Pinouts:
See Table 4-5
The ATX Power connector (CN2) connects an ATX or AT power supply connector.
Figure 4-4: ATX Power Connector Location
PIN NO.
DESCRIPTION
1
+5 V_SB
2
NC (v1.10)
Page 33
WAFER-LX Motherboard
PIN NO.
DESCRIPTION
3
PS_ON
Table 4-5: ATX Power Connector Pinouts
4.2.3 ATX Power Button Connector
CN Label:
CN13
CN Type:
1-pin header (1x2)
CN Location:
See Figure 4-5
CN Pinouts:
See Table 4-6
The ATX power button connector to a power switch installed on the system chassis.
Figure 4-5: ATX Power Button Connector
PIN NO.
DESCRIPTION
1
PWRBTN#
2
GND
Table 4-6: ATX Power Button Connector Pinouts
4.2.4 Audio Connector
CN Label:
Page 34
CN8
WAFER-LX Motherboard
CN Type:
10-pin header (2x5)
CN Location:
See Figure 4-6
CN Pinouts:
See Table 4-7
The audio connector is connected to an on-board codec. An external audio connector kit
can be connected to the connector to provide sound input and output.
Figure 4-6: Audio Connector Location
PIN NO.
DESCRIPTION
PIN NO.
DESCRIPTION
1
Line Out Right
2
Line In Right
3
GND
4
GND
5
Line Out Left
6
Line In Left
7
GND
8
GND
9
MIC In
10
N/C
Table 4-7: Audio Connector Pinouts
Page 35
WAFER-LX Motherboard
4.2.5 Battery Connector
CN Label:
CN7
CN Type:
2-pin header (1x2)
CN Location:
See Figure 4-7
CN Pinouts:
See Table 4-8
The battery connector is connected to a backup battery. The battery connector is also
used to reset the CMOS memory if the incorrect BIOS settings have been made and the
system cannot boot up.
Figure 4-7: Battery Connector Location
PIN NO.
DESCRIPTION
1
Battery+
2
Ground
Table 4-8: Battery Connector Pinouts
Page 36
WAFER-LX Motherboard
4.2.6 Compact Flash Connector
CN Label:
CN32 (solder side)
CN Type:
50-pin header (2x25)
CN Location:
See Figure 4-8
CN Pinouts:
See Table 4-9
A compact flash memory module is inserted to the Compact Flash 2 connector (J2).
Jumper 2 (JP2) configures the compact flash drive as either a slave or master device.
Figure 4-8: Compact Flash Connector Location (Solder Side)
PIN NO.
DESCRIPTION
PIN NO.
DESCRIPTION
1
GROUND
26
VCC-IN CHECK1
2
DATA 3
27
DATA 11
3
DATA 4
28
DATA 12
4
DATA 5
29
DATA 13
5
DATA 6
30
DATA 14
6
DATA 7
31
DATA 15
7
HDC_CS0#
32
HDC_CS1
8
N/C
33
N/C
9
GROUND
34
IOR#
10
N/C
35
IOW#
Page 37
WAFER-LX Motherboard
PIN NO.
DESCRIPTION
PIN NO.
DESCRIPTION
11
N/C
36
VCC_COM
12
N/C
37
IRQ15
13
VCC_COM
38
VCC_COM
14
N/C
39
CSEL
15
N/C
40
N/C
16
N/C
41
HDD_RESET
17
N/C
42
IORDY
18
SA2
43
SDREQ
19
SA1
44
SDACK#
20
SA0
45
HDD_ACTIVE#
21
DATA 0
46
66DET
22
DATA 1
47
DATA 8
23
DATA 2
48
DATA 9
24
N/C
49
DATA 10
25
VCC-IN CHECK2
50
GROUND
Table 4-9: Compact Flash Connector Pinouts
4.2.7 Fan Connector
CN Label:
CN4
CN Type:
3-pin header
CN Location:
See Figure 4-9
CN Pinouts:
See Table 4-10
The cooling fan connector provides a 12 V, 500mA current to a system cooling fan. The
connector has a "rotation" pin to get rotation signals from fans and notify the system so the
system BIOS can recognize the fan speed. Please note that only specified fans can issue
the rotation signals.
Page 38
WAFER-LX Motherboard
Figure 4-9: Fan Connector Location
PIN NO.
DESCRIPTION
1
CPUFAN_OUT
2
+12 V
3
GND
Table 4-10: Fan Connector Pinouts
4.2.8 Floppy Disk Connector (Slim Type, Optional)
CN Label:
CN31 (solder side)
CN Type:
26-pin header (1 x 26)
CN Location:
See Figure 4-10
CN Pinouts:
See Table 4-11
The floppy disk connector (FDD1) is connected to a floppy disk drive.
Page 39
WAFER-LX Motherboard
Figure 4-10: FDD Connector Location
PIN NO.
DESCRIPTION
PIN NO.
DESCRIPTION
1
+5 V
14
STEP#
2
INDEX#
15
GND
3
+5 V
16
WDATA#
4
DSA#
17
GND
5
+5 V
18
WGATE#
6
DSKCHG#
19
GND
7
NC
20
TRACK0#
8
NC
21
GND
9
NC
22
WP#
10
MOTO0#
23
GND
11
NC
24
RDATA#
12
DIR#
25
GND
13
NC
26
HEAD#
Table 4-11: FDD Connector Pinouts
Page 40
WAFER-LX Motherboard
4.2.9 GPIO Connector
CN Label:
CN14
CN Type:
10-pin header (2x5)
CN Location:
See Figure 4-11
CN Pinouts:
See Table 4-12
The General Purpose Input Output (GPIO) connector can be connected to external I/O
control devices including sensors, lights, alarms and switches.
Figure 4-11: GPIO Connector Location
PIN NO.
DESCRIPTION
PIN NO.
DESCRIPTION
1
GND
2
5V
3
GPO0
4
GPO1
5
GPO2
6
GPO3
7
GPI0
8
GPI1
9
GPI2
10
GPI3
Table 4-12: GPIO Connector Pinouts
Page 41
WAFER-LX Motherboard
4.2.10 IDE Connector
CN Label:
CN30
CN Type:
44pin header (2x22)
CN Location:
See Figure 4-12
CN Pinouts:
See Table 4-13
One 44-pin IDE device connector on the WAFER-LX motherboard supports connectivity to
Ultra ATA/33/66/100 IDE devices with data transfer rates up to 100 MB/s.
Figure 4-12: IDE Device Connector Locations
PIN NO.
DESCRIPTION
1
RESET#
2
GROUND
3
DATA 7
4
DATA 8
5
DATA 6
6
DATA 9
7
DATA 5
8
DATA 10
9
DATA 4
10
DATA 11
11
DATA 3
12
DATA 12
13
DATA 2
14
DATA 13
15
DATA 1
16
DATA 14
17
DATA 0
18
DATA 15
19
GROUND
20
N/C
Page 42
PIN NO.
DESCRIPTION
WAFER-LX Motherboard
PIN NO.
DESCRIPTION
PIN NO.
DESCRIPTION
21
IDE DRQ
22
GROUND
23
IOW#
24
GROUND
25
IOR#
26
GROUND
27
IDE CHRDY
28
GROUND
29
IDE DACK
30
GROUND–DEFAULT
31
INTERRUPT
32
N/C
33
SA1
34
N/C
35
SA0
36
SA2
37
HDC CS0#
38
HDC CS1#
39
HDD ACTIVE#
40
GROUND
41
VCC
42
VCC
43
GROUND
44
N/C
Table 4-13: Secondary IDE Connector Pinouts
4.2.11 Inverter Power Connector
CN Label:
CN3
CN Type:
5-pin header (1x5)
CN Location:
See Figure 4-13
CN Pinouts:
See Table 4-14
The inverter connector is connected to the LCD backlight.
Page 43
WAFER-LX Motherboard
Figure 4-13: Inverter Connector Locations
PIN NO.
DESCRIPTION
1
ADJ (Def: GND)
2
GND
3
12 V
4
GND
5
BL_EN
Table 4-14: Inverter Power Connector Pinouts
4.2.12 Keyboard/Mouse Connector
CN Label:
CN17
CN Type:
6-pin header (1x6)
CN Location:
See Figure 4-14
CN Pinouts:
See Table 4-15
The keyboard and mouse connector can be connected to a standard PS/2 cable or PS/2
Y-cable to add keyboard and mouse functionality to the system.
Page 44
WAFER-LX Motherboard
Figure 4-14: Keyboard/Mouse Connector Location
PIN NO.
DESCRIPTION
1
+5 V
2
MS DATA
3
MS CLK
4
KB DATA
5
KB CLK
6
GND
Table 4-15: Keyboard/Mouse Connector Pinouts
4.2.13 LED Connector
CN Label:
CN5
CN Type:
6-pin header (1x6)
CN Location:
See Figure 4-15
CN Pinouts:
See Table 4-16
The LED connector (CN5) connects to an HDD indicator LED and a power LED on the
system chassis to inform the user about HDD activity and the power on/off status of the
system.
Page 45
WAFER-LX Motherboard
Figure 4-15: LED Connector Locations
PIN NO.
DESCRIPTION
1
+5 V
2
GND
3
Power LED+
4
Power LED-
5
HDD LED+
6
HDD LED-
Table 4-16: LED Connector Pinouts
4.2.14 Print Port Connector
CN Label:
CN15
CN Type:
26-pin header (2 x 13)
CN Location:
See Figure 4-16
CN Pinouts:
See Table 4-17
The WAFER-LX has one print port connector that can be connected directly to a printer.
Page 46
WAFER-LX Motherboard
Figure 4-16:Print Port Connector Location
PIN NO.
DESCRIPTION
PIN NO.
DESCRIPTION
1
STB#
2
AFD#
3
PD0
4
ERR#
5
PD1
6
INIT#
7
PD2
8
SLIN#
9
PD3
10
GND
11
PD4
12
GND
13
PD5
14
GND
15
PD6
16
GND
17
PD7
18
GND
19
ACK#
20
GND
21
BUSY
22
GND
23
PE
24
GND
25
SLCT
26
N/C
Table 4-17: Parallel Port Connector Pinouts
4.2.15 PC/104 Power Input Connector
CN Label:
CN11
CN Type:
3-pin header (1x3)
Page 47
WAFER-LX Motherboard
CN Location:
See Figure 4-17
CN Pinouts:
See Table 4-18
The PC/104 power input connector provides power to the PC/104 expansion module
installed on the PC/104 slot.
Figure 4-17: PC/104 Power Input Connector Pinouts
PIN NO. DESCRIPTION
1
-5 V
2
GND
3
-12 V
Table 4-18: PC/104 Power Input Connector Pinouts
4.2.16 PC/104 Slot
CN Label:
CN10
CN Type:
104-pin PC/104 slot
CN Location:
See Figure 4-18
Page 48
WAFER-LX Motherboard
CN Pinouts:
See Table 4-19
The PC/104 slot enables a PC/104 compatible expansion module to be connected to the
board.
Figure 4-18: PC/104 Slot Location
Pin No.
Column A
Column B
Column C
Column D
1
IOCHK-
GROUND
GROUND
GROUND
2
SD7
RSTDRV
SBHE-
MCS16-
3
SD6
+5 V
SA23
IOCS16-
4
SD5
IRQ9
SA22
IRQ10
5
SD4
-5 V
SA21
IRQ11
6
SD3
DREQ2
SA20
IRQ12
7
SD2
-12 V
SA19
IRQ15
8
SD1
ZWS-
SA18
IRQ14
9
SD0
+12 V
SA17
DACK0-
10
IOCHRDY
GROUND
MEMR-
DREQ0
11
AEN
SMEMW-
MEMW-
DACK5-
12
SA19
SMEMR-
SD8
DRREQ5
13
SA18
IOW-
SD9
DACK6-
Page 49
WAFER-LX Motherboard
Pin No.
14
Column A
SA17
Column B
Column C
Column D
IOR-
SD10
DREQ6
15
SA16
DACK3-
SD11
DACK7-
16
SA15
DREQ3
SD12
DREQ7
17
SA14
DACK1-
SD13
+5 V
18
SA13
DREQ1
SD14
MASTER-
19
SA12
REFRESH-
SD15
GROUND
20
SA11
ISACLK
NC
GROUND
21
SA10
IRQ7
22
SA9
IRQ6
23
SA8
IRQ5
24
SA7
IRQ4
25
SA6
IRQ3
26
SA5
DACK2-
27
SA4
TC
28
SA3
BALE
29
SA2
+5 V
30
SA1
ISA_OSC
31
SA0
GROUND
32
GROUND
GROUND
Table 4-19: PC/104 Slot Connector Pinouts
4.2.17 Reset Button Connector
CN Label:
CN12
CN Type:
2-pin header (1x2)
CN Location:
See Figure 4-19
CN Pinouts:
See Table 4-20
The reset button connector is connected to the reset button on the external chassis.
Page 50
WAFER-LX Motherboard
Figure 4-19: Reset Button Connector Locations
PIN NO.
DESCRIPTION
1
Reset+
2
Ground
Table 4-20: Reset Button Connector Pinouts
4.2.18 RS-232/422/485 Cable Connectors
CN Label:
CN16
CN Type:
14-pin header (2x7)
CN Location:
See Figure 4-20
CN Pinouts:
See Table 4-21
The COM2/COM3 serial port combination connectors connect to RS-232 serial port
devices. The COM2 port is located on pin 1 to pin 10 and the COM3 is located on pin 11 to
pin 14 of CN16.
Page 51
WAFER-LX Motherboard
Figure 4-20: RS-232 Serial Port Connector Locations
PIN NO. DESCRIPTION
PIN NO. DESCRIPTION
1
DCD#
2
DSR#
3
RXD
4
RTS#
5
TXD
6
CTS#
7
DTR#
8
RI#/Vout
9
GND
10
GND
11
TxD485+
12
TxD485-
13
RxD485+
14
RxD485-
Table 4-21: RS-232/422/485 Serial Port Connector Pinouts
4.2.19 SATA Drive Connectors
CN Label:
CN23 and CN25
CN Type:
7-pin SATA drive connectors
CN Location:
See Figure 4-24
CN Pinouts:
See Table 4-25
The two SATA drive connectors are connected to two first generation SATA drives. First
generation SATA drives transfer data at speeds as high as 150 MB/s.
Page 52
WAFER-LX Motherboard
Figure 4-21: SATA Drive Connector Locations
PIN NO. DESCRIPTION
1
GND
2
TX+
3
TX-
4
GND
5
RX-
6
RX+
7
GND
Table 4-22: SATA Drive Connector Pinouts
4.2.20 TFT LCD LVDS Connector
CN Label:
CN29
CN Type:
20-pin header (2x10)
CN Location:
See Figure 4-22
CN Pinouts:
See Table 4-23
Page 53
WAFER-LX Motherboard
The TFT LCD LVDS can be connected to a TFT LCD screen directly.
Figure 4-22: TFT LCD LVDS Connector Pinout Locations
PIN NO. DESCRIPTION
PIN NO.
DESCRIPTION
1
GND
2
GND
3
D0+
4
D0-
5
D1+
6
D1-
7
D2+
8
D2-
9
CLK+
10
CLK-
11
NC
12
NC
13
GND
14
GND
15
NC
16
NC
17
LCD_Vcc
18
LCD_Vcc
19
LCD_Vcc
20
LCD_Vcc
Table 4-23: TFT LCD LVDS Port Connector Pinouts
Page 54
WAFER-LX Motherboard
4.2.21 TFT LCD TTL Connector
CN Label:
CN28
CN Type:
40-pin header (2x20)
CN Location:
See Figure 4-23
CN Pinouts:
See Table 4-24
The TFT LCD LVDS can be connected to a TFT LCD screen directly.
Figure 4-23: TFT LCD TTL Connector Pinout Locations
PIN NO. DESCRIPTION
PIN NO.
DESCRIPTION
1
LCD_Vcc
2
LCD_Vcc
3
GND
4
GND
5
LCD_Vcc
6
LCD_Vcc
7
NC
8
GND
9
B0
10
B1
11
B2
12
B3
13
B4
14
B5
15
B6
16
B7
17
G0
18
G1
19
G2
20
G3
21
G4
22
G5
23
G6
24
G7
Page 55
WAFER-LX Motherboard
PIN NO. DESCRIPTION
PIN NO.
DESCRIPTION
25
R0
26
R1
26
R2
28
R3
29
R4
30
R5
31
R6
32
R7
33
GND
34
GND
35
CLK
36
VSYNC
37
LCD_EN
38
HSYNC
39
NC
40
DISP_EN
Table 4-24: TFT LCD TTL Port Connector Pinouts
4.2.22 Internal USB Connectors
CN Label:
CN24
CN Type:
8-pin header (2x4)
CN Location:
See Figure 4-24
CN Pinouts:
See Table 4-25
The 2x4 USB pin connector provides connectivity to two USB 2.0 devices. The USB ports
are used for I/O bus expansion.
Page 56
WAFER-LX Motherboard
Figure 4-24: USB Connector Pinout Locations
PIN NO. DESCRIPTION
PIN NO.
DESCRIPTION
1
VCC_USB
2
GND
3
DATA3-
4
DATA4+
5
DATA3+
6
DATA4-
7
GND
8
VCC_USB
Table 4-25: USB Port Connector Pinouts
4.3 External Interface Connectors
4.3.1 External Interface Connector Overview
Figure 4-25 shows the WAFER-LX motherboard external interface connectors. The
WAFER-LX on-board external interface connectors are listed below and shown in
Figure 4-25:
ƒ
1 x USB combo port
ƒ
2 x Ethernet connector
ƒ
1 x Serial communications port
ƒ
1 x VGA port
Page 57
WAFER-LX Motherboard
Figure 4-25: WAFER-LX On-board External Interface Connectors
4.3.2 USB Combo Port
CN Label:
CN19
CN Type:
USB Combo port
CN Location:
See Figure 4-25
CN Pinouts:
See Table 4-26
The USB combo port provides connectivity to additional USB devices through an adapter
cable. Various adapters may come with USB ports on a slot bracket or ports that can be
attached to D-SUB openings on a chassis. USB devices connect directly to the USB
connectors on the rear panel.
PIN
DESCRIPTION
PIN
DESCRIPTION
1
VCC_USB
5
VCC_USB
2
DATA1-
6
DATA2-
3
DATA1+
7
DATA2+
4
GND
8
GND
Table 4-26: CN19 Connector Pinouts
4.3.3 Ethernet Connector
CN Label:
CN20 and CN 21
CN Type:
RJ-45
CN Location:
See Figure 4-25
CN Pinouts:
See Table 4-27
A 10/100 Megabit connection can be made between the Ethernet connector and a Local
Area Network (LAN) through a network hub.
Page 58
WAFER-LX Motherboard
PIN
DESCRIPTION
PIN
DESCRIPTION
1
TX+
2
TX-
3
RX+
4
NC
5
NC
6
RX-
7
NC
8
NC
Table 4-27: J7 Connector Pinouts
Figure 4-26: J7 Connector
The RJ-45 Ethernet connector has two status LEDs, one green and one yellow. The green
LED indicates activity on the port and the yellow LED indicates the port is linked.
SPEED LED
LINK LED
Status
Description
Status
GREEN
ON: 100 MB
YELLOW
Description
ON: Linked
OFF: 10 MB
Flashing: Activity
Table 4-28: J7 Connector LEDs
4.3.4 Serial Communications COM 1 and COM2 Connector
CN Label:
CN22
CN Type:
RS-232 serial connector
CN Location:
See Figure 4-25
CN Pinouts:
See Table 4-29 and Figure 4-27
The RS-232 serial connector provides serial connection in the RS-232 mode.
PIN
DESCRIPTION
PIN
DESCRIPTION
1
DCD1
2
RXD1
Page 59
WAFER-LX Motherboard
PIN
DESCRIPTION
PIN
DESCRIPTION
3
TXD1
4
DTR1
5
GND
6
DSR1
7
RTS1
8
CTS1
9
COM_RI1
Table 4-29: COM1 Pinouts
Figure 4-27: COM1 Pinout Locations
4.3.5 VGA Connector
CN Label:
CN26
CN Type:
See VGA Connector
CN Location:
See Figure 4-25
CN Pinouts:
See Figure 4-28 and Table 4-30
The standard 15-pin female VGA connector connects to a CRT or LCD monitor.
PIN
DESCRIPTION
PIN
DESCRIPTION
PIN
DESCRIPTION
1
RED
6
GROUND
11
NC
2
GREEN
7
GROUND
12
DDCDAT
3
BLUE
8
GROUND
13
HSYNC
4
NC
9
NC
14
VSYNC
Page 60
WAFER-LX Motherboard
PIN
DESCRIPTION
PIN
DESCRIPTION
PIN
DESCRIPTION
5
GROUND
10
GROUND
15
DDCCLK
Table 4-30: VGA1 Connector Pinouts
Figure 4-28: VGA1 Connector
Page 61
WAFER-LX Motherboard
Chapter
5
5 Installation and
Configuration
Page 62
WAFER-LX Motherboard
5.1 Anti-static Precautions
Electrostatic discharge (ESD) can cause serious damage to electronic components,
including the WAFER-LX. (Dry climates are especially susceptible to ESD.) It is therefore
critical that whenever the WAFER-LX (or any other electrical component) is handled, the
following anti-static precautions are strictly adhered to.
ƒ
Wear an anti-static wrist band: - Wearing a simple anti-static wrist band can
help to prevent ESD from damaging the board.
ƒ
Self-grounding:- Before handling the board touch any grounded conducting
material. During the time the board is handled, frequently touch any
conducting materials that are connected to the ground.
5.2 Installation Considerations
NOTE:
The following installation notices and installation considerations should
be read and understood before the motherboard is installed. All
installation notices pertaining to the installation of the motherboard
should be strictly adhered to. Failing to adhere to these precautions
may lead to severe damage of the motherboard and injury to the
person installing the motherboard.
5.2.1 Installation Notices
Before and during the installation of the WAFER-LX, please do the following:
ƒ
Read the user manual:
o
The user manual provides a complete description of the WAFER-LX,
installation instructions and configuration options.
ƒ
Wear an electrostatic discharge cuff (ESD):
o
Electronic components are easily damaged by ESD. Wearing an ESD cuff
removes ESD from the body and helps prevent ESD damage.
ƒ
Place the motherboard on an antistatic pad:
Page 63
WAFER-LX Motherboard
o
When installing or configuring the motherboard, place it on an antistatic
pad. This helps to prevent potential ESD damage.
ƒ
Turn off all power to the WAFER-LX:
o
When working with the motherboard, make sure that it is disconnected
from all power supplies and that no electricity is being fed into the system.
Before and during the installation of the WAFER-LX DO NOT do the following:
ƒ
DO NOT remove any of the stickers on the PCB board. These stickers are
required for warranty validation.
ƒ
DO NOT use the product before verifying all the cables and power connectors
are properly connected.
ƒ
DO NOT allow screws to come in contact with the PCB circuit, connector pins,
or its components.
5.3 Unpacking
NOTE:
If any of the items listed below are missing when the WAFER-LX is
unpacked, do not proceed with the installation and contact the
WAFER-LX reseller or vendor.
5.3.1 Unpacking Precautions
Before installing the WAFER-LX, unpack the motherboard. Some components on
WAFER-LX are very sensitive to static electricity and can be damaged by a sudden rush
of power. To protect it from being damaged, follow these precautions:
ƒ
The user should ground them self to remove any static charge before
touching the WAFER-LX. To do so wear a grounded wrist strap at all times or
frequently touch any conducting materials that is connected to the ground.
ƒ
Handle the WAFER-LX by its edges. Do not touch the IC chips, leads or
circuitry if not necessary.
Page 64
WAFER-LX Motherboard
Do not place a PCB on top of an anti-static bag. Only the inside of the bag is safe from
static discharge.
5.3.2 Checklist
When unpacking the WAFER-LX, please make sure that the package contains the
following items.
ƒ
1x WAFER-LX800 single board computer
ƒ
1 x Mini jumper pack
ƒ
1 x IDE flat cable 44P/44P
ƒ
2 x SATA cables
ƒ
1 x SATA power cable
ƒ
1 x Audio cable
ƒ
1 x KB/MS cable
ƒ
1 x USB cable
ƒ
1 x RS-232 cable
ƒ
1 x Utility CD
ƒ
1 x Quick Installation Guide
If one or more of these items are missing, please contact the reseller or vendor the
WAFER-LX was purchased from and do not proceed any further with the installation.
5.4 Installation Procedure
WARNING!
Never run the motherboard without an appropriate heatsink and cooler
that can be ordered from IEI Technology or purchased separately.
Be sure to use the CPU 12 V power connector (CN10007) for the CPU
power.
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WAFER-LX Motherboard
WARNING!
Please note that the installation instructions described in this manual
should be carefully followed in order to avoid damage to the
motherboard components and injury to the user.
WARNING!
When installing electronic components onto the motherboard always
take the anti-static precautions listed above in order to prevent ESD
damage to the motherboard and other electronic components like the
CPU and DIMM modules
The following components must be installed onto the motherboard or connected to the
motherboard during the installation process.
NOTE:
Some WAFER-LX models already have preinstalled CPUs. If the
motherboard has a preinstalled CPU then the following section on CPU
installation can be skipped.
ƒ
DIMM modules
ƒ
Peripheral device connection
5.4.1 DIMM Module Installation
5.4.1.1 Purchasing the Memory Module
When purchasing SO-DIMM modules, the following considerations should be taken into
account:
ƒ
The SO-DIMM socket can support a memory chip with a maximum size of
1 GB
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WAFER-LX Motherboard
ƒ
The SO-DIMM socket supports SDRAM DIMM speeds of 333 MHz and
400 MHz
5.4.1.2 DIMM Module Installation
The WAFER-LX motherboard has two DDR SDRAM DIMM sockets. To install the DIMM
modules, follow the instructions below.
Step 1: Locate the SO-DIMM module connector.
Step 2: Push the SO-DIMM chip into the socket at an angle. (See Figure 5-1)
Step 3: Gently pull the arms of the SO-DIMM socket out and push the rear of the
SO-DIMM module down. (See Figure 5-1)
Step 4: Release the arms on the SO-DIMM socket. They clip into place and secure the
SO-DIMM module in the socket. Step 0:
Figure 5-1: SO-DIMM Module Installation
5.4.2 Peripheral Device Connection
Cables provided by IEI that connect peripheral devices to the motherboard are listed in
Table 5-1. Cables not included in the kit must be separately purchased.
Quantity
Type
1
Audio cable
1
IDE flat cable 44P/44P
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WAFER-LX Motherboard
Quantity
Type
2
SATA cables
1
SATA power cable
1
RS-232 cable
1
USB cable
Table 5-1: IEI Provided Cables
5.4.2.1 IDE Disk Drive Connector (IDE1)
The cable used to connect the motherboard to the IDE HDD is a standard 44-pin ATA
66/100 flat cable. To connect an IDE HDD to the motherboard, follow the instructions
below.
Step 1: Find the ATA 66/100 flat cable in the kit that came with the motherboard.
Step 2: Connect one end of the cable to the PIDE1 connector on the motherboard. A
keyed pin on the IDE connectors prevents it from being connected incorrectly.
Step 3: Locate the red wire on the other side of the cable that corresponds to the pin 1
connector.
Step 4: Connect the other side of the cable to the HDD making sure that the pin 1 cable
corresponds to pin 1 on the connector.Step 0:
NOTE:
When two EIDE disk drives are connected together, back-end jumpers
on the drives must be used to configure one drive as a master and the
other as a slave.
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WAFER-LX Motherboard
5.5 Jumper Settings
NOTE:
A jumper is a metal bridge that is
used to close an electrical circuit. It
consists of two metal pins and a small
metal clip (often protected by a plastic
cover) that slides over the pins to
connect them. To CLOSE/SHORT a
jumper means connecting the pins of
Jumper
the jumper with the plastic clip and to
OPEN a jumper means removing the plastic clip from a jumper.
Before the WAFER-LX is installed in the system, the jumpers must be set in accordance
with the desired configuration. The WAFER-LX motherboard has six on-board jumpers.
The jumpers are described in Table 5-2 and shown in Figure 5-2.
Description
Label
Type
AT power select
JP1
2-pin header
COM3 mode setup
JP2
3-pin header
COM1 and COM2 pin 9 setup
JP3
10-pin header
LCD voltage selection
JP4
3-pin header
CompactFlash® master/slave setup
JP5
3-pin header
LCD type selection
JP6
3-pin header
Clear CMOS
CN7
2-pin header
(Optional jumper)
Table 5-2: Jumpers
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WAFER-LX Motherboard
Figure 5-2: Jumper Locations
5.5.1 AT Power Select Jumper Settings
Jumper Label:
JP1
Jumper Type:
2-pin header
Jumper Settings:
See Table 5-3
Jumper Location:
See Figure 5-2
The AT/ATX Power Mode Select jumper specifies the systems power mode. Jumper
settings are shown in Table 5-3.
AT Power Select
Description
Short
Use AT power
Open
Use ATX power
Default
Table 5-3: AT Power Select Jumper Settings
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WAFER-LX Motherboard
5.5.2 COM3 Setup Jumper Settings
Jumper Label:
JP2
Jumper Type:
3-pin header
Jumper Settings:
See Table 5-4
Jumper Location:
See Figure 5-2
This jumper settings sets the COM3 serial port as RS-422 or RS-485.
COM3 Setup
Description
1-2
RS-422
2-3
RS-485
Default
Table 5-4: COM3 Setup Jumper Settings
5.5.3 COM1 and COM2 Pin 9 Setup (Optional Jumper)
Jumper Label:
JP3
Jumper Type:
10-pin header
Jumper Settings:
See Table 5-5 and Table 5-6
Jumper Location:
See Figure 5-2
Pin 9 on COM1 and COM2 can be configured as RI or to supply 5 V or 12 V of power.
COM1 Setup
Description
1-3
12 V
3-5 or 5-7
5V
7-9
RI
Default
Table 5-5: COM1 Pin 9 Setup
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WAFER-LX Motherboard
COM2 Setup
Description
2-4
12 V
4-6 or 6-8
5V
8-10
RI
Default
Table 5-6: COM2 Pin 9 Setup
5.5.4 LCD Voltage
Jumper Label:
JP4
Jumper Type:
3-pin header
Jumper Settings:
See Table 5-7
Jumper Location:
See Figure 5-2
This jumper settings sets the voltage of the power supplied to the LCD panel.
LCD Voltage Setup
Description
1-2
3.3 V
2-3
5V
Default
Table 5-7: COM3 Setup Jumper Settings
5.5.5 CompactFlash® Master/Slave Setup
Jumper Label:
JP5
Jumper Type:
3-pin header
Jumper Settings:
See Table 5-8
Jumper Location:
See Figure 5-2
This jumper sets the CompactFlash® as either the IDE master or slave.
CompactFlash® Setup
Description
1-2
IDE Slave
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Default
WAFER-LX Motherboard
CompactFlash® Setup
Description
2-3
IDE Master
Table 5-8: CompactFlash® Master/Slave Setup
5.5.6 TFT LCD Type
Jumper Label:
JP6
Jumper Type:
3-pin header
Jumper Settings:
See Table 5-9
Jumper Location:
See Figure 5-2
This jumper setting specifies the type of TFT LCD panel installed on the system.
TFT LCD Type
Description
1-2
FPCLK
2-3
#FPCLK
Default
Table 5-9: TFT LCD Type
5.5.7 Clear CMOS Jumper
NOTE:
The battery connector (CN7) is used as the clear CMOS jumper on the
WAFER-LX.
Jumper Label:
CN7
Jumper Type:
2-pin header
Jumper Settings:
See Table 5-10
Jumper Location:
See Figure 5-2
If the WAFER-LX fails to boot due to improper BIOS settings, use this connector to clear
the CMOS data and reset the system BIOS information. To do this, disconnect CN7 and
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WAFER-LX Motherboard
keep it disconnected for at least five seconds. After five seconds has elapsed, reinsert the
connector.
If the “CMOS Settings Wrong” message is displayed during the boot up process, the fault
may be corrected by pressing the F1 to enter the CMOS Setup menu. Do one of the
following:
ƒ
Enter the correct CMOS setting
ƒ
Load Optimal Defaults
ƒ
Load Failsafe Defaults.
After having done one of the above, save the changes and exit the CMOS Setup menu.
Clear CMOS
DESCRIPTION
Closed
Keep CMOS Setup
Open
Clear CMOS Setup
Table 5-10: Clear CMOS Jumper Settings
5.6 Chassis Installation
After the CPU, the cooling kit, and the DIMM modules have been installed and after the
internal peripheral connectors have been connected to the peripheral devices and the
jumpers have been configure, the motherboard can be mounted into chassis.
To mount the motherboard into a chassis please refer to the chassis user guide that came
with the product.
5.7 Rear Panel Connectors
5.7.1 LCD Panel Connection
The conventional CRT monitor connector, VGA1, is a 15-pin, female D-SUB connector.
Pin assignments can be seen in that can be connected to external monitors.
5.7.2 Ethernet Connection
The rear panel RJ-45 connectors can be connected to an external LAN and communicate
with data transfer rates up to 1 Gb/s.
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WAFER-LX Motherboard
5.7.3 USB Connection
The rear panel USB connectors provide easier and quicker access to external USB
devices. The rear panel USB connector is a standard connector and can easily be
connected to other USB devices.
5.7.4 Keyboard and Mouse Connection
A PS/2 keyboard and a PS/2 mouse can be connected to the appropriate PS/2 connector
on the rear panel.
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WAFER-LX Motherboard
Chapter
6
6 BIOS Setup
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WAFER-LX Motherboard
6.1 Introduction
A licensed copy of Phoenix Award BIOS is preprogrammed into the ROM BIOS. The BIOS
setup program allows users to modify the basic system configuration.
This chapter
describes how to access the BIOS setup program and the configuration options that may
be changed.
6.1.1 Starting Setup
The Phoenix Award BIOS is activated when the computer is turned on. The setup program
can be activated in one of two ways.
1. Press the DELETE key as soon as the system is turned on or
2. Press the DELETE key when the “Press Del to enter SETUP” message
appears on the screen.
If the message disappears, restart the computer and try again.
6.1.2 Using Setup
Use the arrow keys to highlight items, press ENTER to select, use the PAGEUP and
PAGEDOWN keys to change entries, press F1 for help and press ESC to quit. Navigation
keys are shown below.
Key
Function
Up arrow
Move to the item above
Down arrow
Move to the item below
Left arrow
Move to the item on the left hand side
Right arrow
Move to the item on the right hand side
+/Page up
Increase the numeric value or make changes
-/Page down
Decrease the numeric value or make changes
Esc
Main Menu – Quit and do not save changes into CMOS
Status Page Setup Menu and Option Page Setup Menu -Exit current page and return to Main Menu
F1
General help, only for Status Page Setup Menu and Option
Page Setup Menu
F2
Item help
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WAFER-LX Motherboard
Key
Function
F5
Previous values for the page menu items
F6
Fail-safe defaults for the current page menu items
F7
Optimized defaults for the current page menu items
F9
Menu in BIOS
F10
Save changes and Exit BIOS
Table 6-1: BIOS Navigation Keys
6.1.3 Getting Help
When F1 is pressed a small help window describing the appropriate keys to use and the
possible selections for the highlighted item appears. To exit the Help Window press ESC or
the F1 key again.
6.1.4 Unable to Reboot After Configuration Changes
If the system cannot be booted after changes are made, restore the CMOS defaults. The
CPU card should come with a restore CMOS settings jumper.
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WAFER-LX Motherboard
6.1.5 Main BIOS Menu
Once the BIOS opens, the main menu (BIOS Menu 1) appears.
BIOS Menu 1: Award BIOS CMOS Setup Utility
NOTE:
The following sections will completely describe the menus listed below
and the configuration options available to users.
The following menu options are seen in BIOS Menu 1.
ƒ
Standard CMOS Features: Changes the basic system configuration.
ƒ
Advanced BIOS Features: Changes the advanced system settings.
ƒ
Advanced Chipset Features: Changes the chipset configuration features.
ƒ
Integrated Peripherals: Changes the settings for integrated peripherals.
ƒ
Power Management Setup: Configures power saving options.
ƒ
PnP/PCI Configurations: Changes the advanced PCI/PnP settings.
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WAFER-LX Motherboard
ƒ
PC Health Status: Monitors essential system parameters.
The following user configurable options are also available in BIOS Menu 1:
Î
Load Fail-Safe Defaults
Use the Load Fail-Safe Defaults option to load failsafe default values for each BIOS
parameter in the setup menus. Press F6 for this operation on any page.
Î
Load Optimized Defaults
Use the Load Optimized Defaults option to load optimal default values for each BIOS
parameter in the setup menus. Press F7 for this operation on any page.
Î
Set Supervisor Password
Use the Set Supervisor Password option to set the supervisor password. By default, no
supervisor password is set. To install a supervisor password, select this field and enter the
password. After this option is selected, a red dialogue box appears with “Enter
Password: ”. Type the password and press ENTER. Retype the original password into the
“Confirm Password: ” dialogue box and press ENTER. To disable the password, simply
press ENTER in the “Enter Password: ” dialogue box, then press any key in the
“Password Disabled !!!” dialogue box.
Î
Set User Password
Use the Set User Password option to set the user password. By default no user
password is set. To install a user password, select this field and enter the password. After
this option is selected, a red dialogue box appears with “Enter Password: ”. Type the
password and press ENTER. Retype the original password into the “Confirm Password: ”
dialogue box and press ENTER. To disable the password, simply press ENTER in the “Enter
Password: ” dialogue box, then press any key in the “Password Disabled !!!” dialogue
box.
Î
Save & Exit Setup
Use the Save & Exit Setup option to save any configuration changes made and exit the
BIOS menus.
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WAFER-LX Motherboard
Î
Exit Without Saving
Use the Exit Without Saving
option to exit the BIOS menus without saving any
configuration changes.
6.2 Standard CMOS Features
Use the Standard CMOS Features BIOS menu (BIOS Menu 2) to set basic BIOS
configuration options.
BIOS Menu 2: Standard CMOS Features
Î
Date [Day mm:dd:yyyy]
Use the Date option to set the system date.
Î
Time [hh/mm/ss]
Use the Time option to set the system time.
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WAFER-LX Motherboard
Î
IDE Master and IDE Slave
When entering setup, BIOS auto detects the presence of IDE devices. The Standard
CMOS Features menu shows the status of the auto detected IDE devices. The following
IDE devices are detected and shown in the Standard CMOS Features menu:
ƒ
IDE Primary Master
ƒ
IDE Primary Slave
IDE device configurations are changed or set in the IDE Configuration menu. If an IDE
device is detected, and one of the above listed two BIOS configuration options is selected,
the IDE configuration options shown in Section 6.2.1 appear.
Î
Drive A [None]
Use the Drive A/B configuration to specify the floppy drive type installed in the system.
The floppy drive configuration options are:
Î
ƒ
None
ƒ
360K, 5.25 in.
ƒ
1.2M, 5.25 in.
ƒ
720K, 3.5 in.
ƒ
1.44M, 3.5in (Default)
ƒ
2.88M, 3.5 in.
Base Memory:
The Base Memory is NOT user configurable. The POST determines the amount of base
(or conventional) memory installed in the system. The value of the base memory is
typically 512K for systems with 512K memory installed, or 640K for systems with 640K or
more memory installed.
Î
Extended Memory
The Extended Memory is NOT user configurable. The BIOS determines how much
extended memory is present during the POST. This is the amount of memory above 1 MB
located in the memory address map of the CPU.
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WAFER-LX Motherboard
Î
Total Memory
The Total Memory is NOT user configurable.
6.2.1 IDE Primary Master/Slave
Use the IDE Primary Master/Slave menu to set or change the master/slave IDE
configurations.
Î
IDE HDD Auto-Detection [Press Enter]
Use the IDE HDD Auto-Detection option to enable BIOS to automatically detect the IDE
settings. Select IDE HDD Auto-Detection and press ENTER. BIOS automatically detects
the HDD type. Do not set this option manually.
Î
IDE Primary Master [Auto]
Use the IDE Primary Master option to activate or deactivate the following drive channels:
Î
ƒ
Channel 0 Master
ƒ
Channel 0 Slave
ƒ
Channel 1 Master
ƒ
Channel 0 Slave
If no drives are connected to the IDE channel select this
None
option.
Once
set,
this
IDE
channel
becomes
inaccessible and any drives attached to it are
undetected.
Î
Auto
DEFAULT
Setting this option allows the device to be automatically
detected by the BIOS.
Î
Manual
Selecting this option allows manual configuration of the
device on the IDE channel in BIOS.
Î
Access Mode [Auto]
The Access Mode option can only be configured if the BIOS configuration option is set to
either Manual or Auto.. Use the Access Mode option to determine the hard disk BIOS
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WAFER-LX Motherboard
translation modes. Most systems now use hard drives with large capacities and therefore
either the LBA translation mode or auto mode should be selected.
Î
Select this mode if the HDD capacity is less than
CHS
504 MB.
Î
Select this mode if the HDD capacity is more than
LBA
8.4 GB.
Î
This mode is an extended ECHS mode and while it
Large
supports
HDDs
larger
than
504 MB,
it
is
not
recommended.
Î
Auto
DEFAULT
If you are unsure of what access mode to set, select this
option.
Î
Capacity
The Capacity specification indicates the storage capacity of the HDD installed in the
system.
Î
Cylinder
The Cylinder specification indicates how many cylinders (tracks) are on the HDD installed
in the system.
Î
Head
The Head specification indicates how many logical heads are on the HDD installed in the
system.
Î
Precomp
The Precomp specification indicates on what track the write precompensation begins.
Î
Landing Zone
The Landing Zone specification indicates where the disk head will park itself after the
system powers off.
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WAFER-LX Motherboard
Î
Sector
The Sector specification indicates how many logical sectors the HDD has been divided
into.
6.3 Advanced BIOS Features
Use the Advanced BIOS Features menu (BIOS Menu 3) to configure the CPU and
peripheral device configuration options.
BIOS Menu 3: Advanced BIOS Features
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WAFER-LX Motherboard
Î
Virus Warning [Disabled]
NOTE:
Many disk diagnostic programs can cause the above warning message
to appear when the program attempts to access the boot sector table. If
you are running such a program, it is recommended that the virus
protection function be disabled beforehand.
Use the Virus Warning option to enable BIOS to monitor the boot sector and partition
table of the HDD for any attempted modification. If a modification attempt is made, the
BIOS halts the system and an error message appears. If necessary, an anti-virus program
can then be run to locate and remove the virus before any damage is done.
Î Enabled
Activates automatically when the system boots up
causing a warning message to appear when anything
attempts to access the boot sector or HDD partition table.
Î Disabled DEFAULT
No warning message appears when there is an attempt
to access the boot sector or HDD partition table.
Î
CPU Internal Cache [Enabled]
Use the CPU Internal Cache option to enable or disable the internal CPU cache.
Î Disabled
Î Enabled
Î
The internal CPU cache is disabled.
DEFAULT
The internal CPU cache is enabled.
Boot From LAN Control [Disabled]
Use the BOOT From LAN Control option to enable the system to be booted from a
remote system.
Î
Disabled
DEFAULT
The system cannot be booted from a remote system
through the LAN.
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WAFER-LX Motherboard
Î
The system can be booted from a remote system
Enabled
through the LAN.
Î
SATA Boot ROM Control [Disabled]
Use the SATA Boot ROM Control option to configure SATA IDE use in DOS mode.
Î
Î Disabled DEFAULT
Disables SATA IDE use in DOS mode.
Î Enabled
Enables SATA IDE use in DOS mode.
Boot Device
Use the Boot Device options to select the order of the devices the system boots from.
There are three boot device configuration options:
ƒ
First Boot Device [Default: HDD-0]
ƒ
Second Boot Device [Default: CDROM]
ƒ
Third Boot Device [Default: SCSI]
Using the default values, the system first looks for a HDD to boot from. If it cannot find an
HDD, it boots from a CD-ROM. If both The HDD and the CD-ROM are unavailable, the
system boots from a SCSI drive.
Boot Device configuration options are:
ƒ
Floppy
ƒ
LS120
ƒ
HDD-0
ƒ
SCSI
ƒ
CDROM
ƒ
HDD-1
ƒ
HDD-2
ƒ
HDD-3
ƒ
ZIP100
ƒ
USB-FDD
ƒ
USB-ZIP
ƒ
USB-CDROM
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WAFER-LX Motherboard
Î
ƒ
USB-HDD
ƒ
LAN
ƒ
Disabled
Boot Other Device [Enabled]
Use the Boot Other Device option to determine whether the system uses a second or
third boot device if the first boot device is not found.
Î Disabled
The system does not look for second and third boot
devices if the first one is not found.
Î Enabled
DEFAULT
The system looks for second and third boot devices if the
first one is not found.
Î
Boot Up Floppy Seek [Disabled]
Use the Boot Up Floppy Seek option to enable the BIOS to determine if the floppy disk
drive installed has 40 or 80 tracks during the POST. 360K FDDs have 40 tracks while
760K, 1.2M and 1.44M FDDs all have 80 tracks.
Î Disabled DEFAULT
BIOS does not search for the type of FDD drive by track
number. Note that there is no warning message if the
drive installed is 360K.
Î Enabled
BIOS searches for a FDD to determine if it has 40 or 80
tracks. Note that BIOS cannot tell the difference between
720K, 1.2M or 1.44M drives as they all have 80 tracks.
Î
Boot Up Numlock Status [On]
Use the Boot Up Numlock Status option to specify the default state of the numeric
keypad.
Î Off
Î On
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The keys on the keypad are not activated.
DEFAULT
Activates the keys on the keypad.
WAFER-LX Motherboard
Î
Gate A20 Option [Fast]
Use the Gate A20 Option option to set if the keyboard controller or the chipset controls
the Gate A20 switching.
Î Normal
Î Fast
Î
The keyboard controller does the switching.
DEFAULT
The chipset does the switching.
Typematic Rate Setting [Disabled]
Use the Typematic Rate Setting configuration option to specify if only one character is
allowed to appear on the screen if a key is continuously held down. When this option is
enabled, the BIOS reports as before, but it then waits a moment, and, if the key is still held
down, it begins to report that the key has been pressed repeatedly. This feature
accelerates cursor movement with the arrow keys.
Î
Î Disabled DEFAULT
Disables the typematic rate.
Î Enabled
Enables the typematic rate.
Typematic Rate (Chars/sec) [6]
The Typematic Rate option can only be configured if the Typematic Rate Setting is
enabled. Use the Typematic Rate option to specify the rate keys are accelerated.
Î 6
DEFAULT
6 characters per second
Î 8
8 characters per second
Î 10
10 characters per second
Î 12
12 characters per second
Î 15
15 characters per second
Î 20
20 characters per second
Î 24
24 characters per second
Î 30
30 characters per second
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WAFER-LX Motherboard
Î
Typematic Delay (Msec) [250]
The Typematic Rate option can only be configured if the Typematic Rate Setting is
enabled. Use the Typematic Delay option to specify the delay time between when a key
is first pressed and when the acceleration begins.
Î 250
Î
DEFAULT
250 milliseconds
Î 500
500 milliseconds
Î 750
750 milliseconds
Î 1000
1000 milliseconds
Security Option [Setup]
Use the Security Option to limit access to both the system and Setup, or just Setup.
Î Setup
DEFAULT
The system does not boot and access to Setup is denied
if the correct password is not entered at the prompt.
Î System
The system boots, but access to Setup is denied if the
correct password is not entered at the prompt.
NOTE:
To disable security, select the password setting in the Main Menu.
When asked to enter a password, don’t type anything, press ENTER and
the security is disabled. Once the security is disabled, the system boots
and Setup can be accessed.
Î
OS Select For DRAM > 64 MB [Non-OS2]
Use the OS Select For DRAM > 64 MB option to specify the operating system.
Î Enabled
Specifies the operating system used as OS/2.
Î Disabled DEFAULT
Select this option when not using the OS/2 operating
system.
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WAFER-LX Motherboard
Î
HDD S.M.A.R.T [Disabled]
Use the S.M.A.R.T option to enable S.M.A.R.T (Self-Monitoring, Analysis, and Reporting
Technology) on the drive connected to SATA drive connector n.
Î Enabled
DEFAULT
S.M.A.R.T is enabled on the drive connected to SATA
drive connector n on the system
Î Disabled
S.M.A.R.T is disabled on the drive connected to SATA
drive connector n on the system
Î
Console Redirection [Disabled]
The Console Redirection BIOS option set the options for allowing the computer to be
controlled over the COM port instead of through the keyboard.
Î
Enabled
Î
Disabled
Attempt to redirect the console via the COM port
DEFAULT
Only attempt to redirect the console when there is no
keyboard installed
Î
Baud Rate [19200]
The Serial Port Mode designates baud rate through which the console redirection is
made. The following configuration options are available
ƒ
9600
ƒ
19200 DEFAULT
ƒ
38400
ƒ
57600
ƒ
115200
NOTE:
Identical baud settings at the host and slave are required
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WAFER-LX Motherboard
Î
Agent after boot [Disabled]
Use the Agent after boot option to keep the console redirection agent active after the
computer has booted up.
Î Disabled DEFAULT
The agent is disabled after the operating system has
booted up
Î Enabled
The agent remains active after the operating system has
loaded
Î
Small Logo (EPA) Show [Disabled]
Use the Small Logo (EPA) Show option to specify if the Environmental Protection
Agency (EPA) logo appears during the system boot-up process. If enabled, the boot up
process may be delayed.
Î Disabled DEFAULT
EPA logo does not appear during boot up.
Î Enabled
EPA logo appears during boot up.
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WAFER-LX Motherboard
6.4 Advanced Chipset Features
Use the Advanced Chipset Features menu (BIOS Menu 4) to change chipset configuration
options.
BIOS Menu 4: Advanced Chipset Features
Î
CPU Frequency [500 MHz]
Use the CPU Frequency option to set the CPU frequency. The CPU Frequency options
are:
ƒ
Auto
ƒ
200 MHz
ƒ
333 MHz
ƒ
400 MHz
ƒ
433 MHz
ƒ
500 MHz (Default)
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WAFER-LX Motherboard
Î
Memory Frequency [333 MHz]
Use the Memory Frequency option to set the frequency of the installed DRAM modules.
The Memory Frequency options are:
Î
ƒ
200 MHz
ƒ
266 MHz
ƒ
333 MHz (Default)
ƒ
400 MHz
Video Memory Size [8M]
Use the Video Memory Size option to determine how much memory is allocated to the
video graphics device. The Video Memory Size options are:
Î
ƒ
None
ƒ
8M (Default)
ƒ
16M
ƒ
32M
ƒ
64M
ƒ
128M
ƒ
254M
Output Display [Panel & CRT]
Use the Output Display configuration to specify the display devices the system is
connected to. The Output Display options are:
Î
ƒ
Flat Panel
ƒ
CRT
ƒ
Panel & CRT (Default)
Flat Panel Configuration [Press Enter]
Use the Flat Panel Configuration option to open the Flat Panel Configuration menu. The
Flat Panel Configuration options are shown in Section .
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WAFER-LX Motherboard
Î
OnBoard Audio [Enabled]
Use the OnBoard Audio option to enable or disable the onboard codec.
Î
Î
Disabled
Î
Enabled
The onboard codec is disabled.
DEFAULT
The onboard codec is detected and enabled.
Onboard USB1.1 [Enabled]
The Onboard USB1.1 BIOS option enables or disables the onboard USB1.1 controller. If
disabled, USB1.1 devices cannot be used on the system.
Î
Î
Disabled
Î
Enabled
USB 1.1 interface is disabled and cannot be used.
DEFAULT
USB 1.1 interface is enabled and can be used.
Onboard USB2.0 [Enabled]
The Onboard USB2.0 BIOS option enables or disables the onboard USB2.0 controller. If
disabled, USB2.0 devices cannot be used on the system.
Î
Î
Disabled
Î
Enabled
USB 2.0 interface is disabled and cannot be used.
DEFAULT
USB 2.0 interface is enabled and can be used.
Onboard IDE [Enabled]
Use the Onboard IDE option to specify if the system uses the integrated primary IDE
channel or not.
Î Disabled
Î Enabled
Î
The primary IDE channel is not used.
DEFAULT
The primary IDE channel is used.
Memory Hole At 15M – 16M [Disabled]
The Memory Hole At 15M – 16M reserves the memory space between 15 MB and 16 MB
for ISA expansion cards that require a specified area of memory to work properly. If an
older ISA expansion card is used, please refer to the documentation that came with the
card to see if it is necessary to reserve the space.
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Î Disabled
DEFAULT
Î Enabled
Memory is not reserved for ISA expansion cards
Memory is reserved for ISA expansion cards
6.4.1 Flat Panel Configuration
Use the Flat Panel Configuration menu (BIOS Menu 5) to set the configuration settings
for the flat panel screen connected to the system.
BIOS Menu 5: Flat Panel Configuration
Î
Resolution [800 x 600]
The Resolution option can only be configured if the Flat Panel Type option is not set to
Auto. Use the Resolution option to set the resolution of the flat panel screen connected
to the system. The Resolution options are:
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ƒ
320 x 240
ƒ
640 x 480
ƒ
800 x 600 (Default)
WAFER-LX Motherboard
Î
ƒ
1024 x 768
ƒ
1152 x 864
ƒ
1280 x 1024
ƒ
1600 x 1200
Data Bus Type [9 – 24 bits, 1 ppc]
The Data Bus Type option can only be configured if the Flat Panel Type option is not set
to Auto. Use the Data Bus Type option to set the bus type and the data bus width used to
transfer data between the system and the flat panel screen connected to the system. The
Data Bus Type options are:
Î
ƒ
9-24 bits, 1 ppc (Default)
ƒ
18, 24 bits, 2 ppc
Refresh Rate [60Hz]
The Refresh Rate option can only be configured if the Flat Panel Type option is not set to
Auto. Use the Refresh Rate option to set the screen refresh rate required by the panel
connected to the system. Check the documentation that came with the panel before
setting this option. The Refresh Rate options are:
Î
ƒ
60Hz (Default)
ƒ
70Hz
ƒ
72Hz
ƒ
75Hz
ƒ
85Hz
ƒ
90Hz
ƒ
100Hz
HSYNC Polarity [High]
The HSYNC Polarity option can only be configured if the Flat Panel Type option is not
set to Auto. Use the HSYNC Polarity option to set the polarity of the HSYNC signal to the
panel. The HSYNC Polarity options are:
ƒ
High
ƒ
Low (Default)
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Î
VSYNC Polarity Active [Low]
The VGSYNC Polarity Active option can only be configured if the Flat Panel Type option
is not set to Auto. Use the VGSYNC Polarity Active option to set the polarity of the
VSYNC signal to the panel. The VGSYNC Polarity Active options are:
Î
ƒ
High
ƒ
Low (Default)
SHFCLK Active Period [Free Running]
Use the SHFCLK Active Period option to set the SHFCLK. The SHFCLK Active Period
options are:
Î
ƒ
Active Only
ƒ
Free running (Default)
LP Active Period [Free Running]
Use the LP Active Period option to set the LDE/MOD signal to the panel. The LP Active
Period options are:
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ƒ
Active Only
ƒ
Free running (Default)
WAFER-LX Motherboard
6.5 Integrated Peripherals
Use the Integrated Peripherals menu (BIOS Menu 6) to change the configuration options
for the attached peripheral devices.
BIOS Menu 6: Integrated Peripherals
Î
On-Chip IDE Channel 1 [Enabled]
Use the On-Chip IDE Channel 1 option to specify if the system uses the integrated
primary IDE channel or not.
Î Disabled
Î Enabled
Î
The primary IDE channel is not used.
DEFAULT
The primary IDE channel is used.
Drive PIO Mode [Auto]
Use the Drive PIO Mode options below to select the Programmed Input/Output (PIO)
mode for the following HDDs:
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ƒ
Master Drive PIO Mode
ƒ
Slave Drive PIO Mode
Î Auto
DEFAULT
The computer selects the correct mode.
Î Mode 0
PIO mode 0 selected with a maximum transfer rate of 3.3 MB/s.
Î Mode 1
PIO mode 1 selected with a maximum transfer rate of 5.2 MB/s.
Î Mode 2
PIO mode 2 selected with a maximum transfer rate of 8.3 MB/s.
Î Mode 3
PIO mode 3 selected with a maximum transfer rate of 11.1 MB/s.
Î Mode 4
PIO mode 4 selected with a maximum transfer rate of
16.6 MB/s.
Î Mode 5
PIO mode 5 selected with a maximum transfer rate of
22.2 MB/s.
Î
IDE UDMA [Auto]
Use the IDE UDMA option below to select the Ultra DMA (UDMA) mode for the following
HDDs:
ƒ
IDE Primary Master UDMA
ƒ
IDE Primary Slave UDMA
Î Auto
DEFAULT
Î Disabled
Î
The computer selects the correct UDMA.
The UDMA for the HDD device is disabled.
IT8888 ISA Decode IO
Use the IT8888 ISA Decode IO menu (BIOS Menu 7) to set the IO memory range for the
onboard ISA. See Section 0.
Î
IT8888 ISA Decode Memory
Use the IT8888 ISA Decode Memory (BIOS Menu 8) to set the resources for the
onboard ISA bus. See Section 6.5.2.
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Î
IDE HDD Block Mode [Enabled]
If the drive connected to the system supports block mode, use the IDE HDD Block Mode
option to enable the system to detect the optimal number of block read/writes per sector
the system IDE drive can support. Block mode is also called block transfer, multiple
commands, or multiple sector read/write.
Î Disabled
Î Enabled
Î
Block mode is not supported.
DEFAULT
Block mode is supported.
Onboard FDC Controller [Disabled]
Use the Onboard FDC Controller option to enable or disable the onboard floppy
controller. If the system is not connected to a floppy disk or uses an adapter for the FDD,
this option can be disabled.
Î Disabled
DEFAULT
Î Enabled
Î
The FDD controller is disabled.
The FDD controller is enabled.
Onboard Serial Port 1 [3F8/IRQ4]
Use the Onboard Serial Port 1 option to select the I/O address and IRQ for the onboard
serial port 1. The serial port can be disabled or the I/O address and the IRQ can be
automatically selected by the BIOS. The Onboard Serial Port 1 options are:
Î
ƒ
Disabled
ƒ
3F8/IRQ4 (Default)
ƒ
2F8/IRQ3
ƒ
3E8/IRQ4
ƒ
2E8/IRQ3
ƒ
Auto
Onboard Serial Port 2 [2F8/IRQ3]
Use the Onboard Serial Port 2 option to select the I/O address and IRQ for the onboard
serial port 2. The serial port can be disabled or the I/O address and the IRQ can be
automatically selected by the BIOS. The Onboard Serial Port 2 options are:
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Î
ƒ
Disabled
ƒ
3F8/IRQ4
ƒ
2F8/IRQ3 (Default)
ƒ
3E8/IRQ4
ƒ
2E8/IRQ3
ƒ
Auto
Onboard Serial Port 3 [Disabled]
Use the Onboard Serial Port 3 option to select the I/O address and IRQ for the onboard
serial port 2. The serial port can be disabled or the I/O address and the IRQ can be
automatically selected by the BIOS. The Onboard Serial Port 3 options are:
Î
ƒ
Disabled (Default)
ƒ
3F8/IRQ4
ƒ
2F8/IRQ3
ƒ
3E8/IRQ4
ƒ
2E8/IRQ3
ƒ
Auto
Onboard Parallel Port [378/IRQ7]
Use the Onboard Parallel Port option to specify a logical LPT port address and
corresponding interrupt for the physical parallel port. The Onboard Parallel Port options
are:
Î
ƒ
Disabled
ƒ
378/IRQ7 (Default)
ƒ
278/IRQ5
ƒ
3BC/IRQ7
Parallel Port Mode [SPP]
Use the Parallel Port Mode option to select parallel port operation mode.
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Î SPP
DEFAULT
The parallel port operates in the standard parallel port
(SPP) mode. This parallel port mode works with most
parallel port devices but is slow.
Î EPP
The parallel port operates in the enhanced parallel port
mode (EPP). The EPP mode supports bi-directional
communication between the system and the parallel
port device and the transmission rates between the two
are much faster than the SPP mode.
Î ECP
The parallel port operates in the extended capabilities
port
(ECP)
mode.
The
ECP
mode
supports
bi-directional communication between the system and
the parallel port device and the transmission rates
between the two are much faster than the SPP mode.
Î ECP+EPP
The parallel port is compatible with both ECP and EPP
devices.
Î Normal
Î
EPP Mode Select [EPP1.7]
The EPP Mode Select option is only available if the Parallel Port Mode option is set to
EPP mode. Use the EPP Mode Select option to select the parallel port mode standard for
the parallel port.
Î EPP1.9
Î EPP1.7
Î
EPP 1.9 is selected as the EPP standard.
DEFAULT
EPP 1.7 is selected as the EPP standard.
ECP Mode Use DMA [1]
The ECP Mode Use DMA option is only available if the Parallel Port Mode option is set
to ECP mode. Use the ECP Mode Use DMA option to specify the DMA channel the
parallel port must use in the ECP mode.
Î 1
Î 3
The parallel port uses DMA Channel 1 in ECP mode.
DEFAULT
The parallel port uses DMA Channel 3 in ECP mode.
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6.5.1 IT8888 ISA Decode IO
NOTE:
Five PCI-104 devices can be stacked onto the WAFER-LX
motherboard. If these devices are stacked onto the board, the ISA bus
space should be enabled. If no PCI-104 devices are being used,
disable all the buses. Disabling these buses frees up system resources
that can be allocated to other system applications.
Use the IT8888 ISA Decode IO menu (BIOS Menu 7 to set the IO memory range for the
onboard ISA.
BIOS Menu 7: IT8888 ISA Decode IO
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The IT8888 ISA Decode IO menu has the following common options:
ƒ
Decode I/O Space N
ƒ
Decode I/O Speed N
ƒ
Decode I/O Addr. N [15:0]
ƒ
Decode I/O Size N
Where N is an integer in the set [1, 2, 3, 4, 5] and represents a set for the PCI-104 devices
that are attached to the system.
Î
Decode IO Space N [Enabled]
Use the Decode IO Space N option to allocate system resources to the ISA bridge and to
enable the Nth PCI-104 to function correctly.
Î Disabled
The Nth IO set is disabled and the system resources
are reallocated to other applications.
Î Enabled
DEFAULT
The Nth IO set is enabled and dedicated system
resources are allocated to the Nth ISA bus.
Î
Decode IO Speed N [Fast Speed]
Use the Decode IO Speed N option to specify the speed of the Nth ISA bus. The following
options are available:
Î
ƒ
Fast Speed
ƒ
Middle Speed
ƒ
Slow Speed
ƒ
Subtractive Speed
Decode IO Address N 0:15 [xx]
Use the Decode IO Address N 0:15 option to allocate an address to the ISA bus. The
address may range from 0001 to FFFF.
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WAFER-LX Motherboard
Î
Decode IO Size N [Fast Speed]
Use the Decode IO Size N option to specify the size of the ISA bus. The following options
are available:
ƒ
1 Byte
ƒ
2 Bytes
ƒ
4 Bytes
ƒ
8 Bytes
ƒ
16 Bytes
ƒ
32 Bytes
ƒ
64 Bytes
ƒ
128 Bytes
6.5.2 IT8888 ISA Decode Memory
NOTE:
Five PCI-104 devices can be stacked onto the WAFER-LX
motherboard. If these devices are stacked onto the board, the ISA
memory should be enabled. If no PCI-104 devices are being used,
disable all the memory allocations for these buses. Disabling the
memory allocations frees up system resources that can be allocated to
other system applications.
Use the IT8888 ISA Decode Memory (BIOS Menu 8) to set the resources for the onboard
ISA bus.
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WAFER-LX Motherboard
BIOS Menu 8: IT8888 ISA Decode Memory
The IT8888 ISA Decode IO menu has the following common options:
ƒ
Decode Memory Space N
ƒ
Decode Memory Speed N
ƒ
Decode Memory Addr. N [15:0]
ƒ
Decode Memory Size N
Where N is an integer in the set [1, 2, 3, 4, 5] and represents a memory set for the PCI-104
devices that are attached to the system.
Î
Decode Memory Space N [Enabled]
Use the Decode IO Memory N option to allocate memory resources to the ISA bridge and
to enable the PCI-104 to function correctly.
Î Disabled
The Nth memory set is disabled and the system
memory resources are reallocated to other applications.
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WAFER-LX Motherboard
Î Enabled
DEFAULT
The Nth memory set is enabled and dedicated system
memory resources are allocated to the ISA bus.
Î
Decode Memory Speed N [Fast Speed]
Use the Decode Memory Speed N option to specify the memory speed of the ISA bus.
The following options are available:
Î
ƒ
Fast Speed
ƒ
Middle Speed
ƒ
Slow Speed
ƒ
Subtractive Speed
Decode Memory Address N [xx]
Use the Decode Memory Address N option to allocate an address to the memory of the
ISA bus. The address may range from 0001 to FFFF.
Î
Decode Memory Size N [xx]
Use the Decode Memory Size N option to specify the memory size of the ISA bus. The
following options are available:
Page 108
ƒ
16 KB
ƒ
32 KB
ƒ
64 KB
ƒ
128 KB
ƒ
256 KB
ƒ
512 KB
ƒ
1 MB
ƒ
2 MB
WAFER-LX Motherboard
6.6 Power Management Setup
Use the Power Management Setup menu (BIOS Menu 1) to set the BIOS power
management and saving features.
BIOS Menu 9: Power Management Setup
Î
AC Power Mode [ATX]
Use the AC Power Mode BIOS option to to select the power supply that is connected to
the system.
Î
Î
AT
Î
ATX
An AT power supply is connected to the system
DEFAULT
An ATX power supply is connected to the system
HDD Power Down [Disabled]
The HDD Power Down option specifies the period of hard drive inactivity before entering a
power saving state.
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Î
ƒ
Disabled
ƒ
1 Min
ƒ
2 Min
ƒ
3 Min
ƒ
4 Min
ƒ
5 Min
ƒ
6 Min
ƒ
7 Min
ƒ
8 Min
ƒ
9 Min
ƒ
10 Min
ƒ
11 Min
ƒ
12 Min
ƒ
13 Min
ƒ
14 Min
ƒ
15 Min
Default
Soft-Off by PWR-BTTN [Instant-Off]
Use the Soft-Off by PWR-BTTN option to enabled the system to enter a very
low-power-usage state when the power button is pressed.
Î Instant-Off
DEFAULT
When the power button is pressed, the system is
immediately shutdown.
Î Delay 4-sec
To shutdown the system the power button must be held
down longer than four seconds otherwise the system
enters a low power usage state.
Î
Power-On by Alarm [Disabled]
Use the Power-On by Alarm option to specify when the computer is roused from a
suspended state by the system alarm.
Î
Disabled
DEFAULT
The real time clock (RTC) cannot generate a wake
event
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WAFER-LX Motherboard
Î
Enabled
The system alarm will turn the system on when the
alarm goes off. If this option is enabled the following
values can be selected:
hours
minutes
seconds
6.7 PnP/PCI Configurations
Use the PnP/PCI Configurations menu (BIOS Menu 10) to set the plug and play, and PCI
options.
BIOS Menu 10: PnP/PCI Configurations
Î
PNP OS Installed [No]
The PNP OS Installed option determines whether the Plug and Play devices connected to
the system are configured by the operating system or the BIOS.
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WAFER-LX Motherboard
Î
No
DEFAULT
If the operating system does not meet the Plug and Play
specifications, BIOS configures all the devices in the system.
Î
Yes
Set this option if the system is running Plug and Play aware
operating systems. The operating system changes the
interrupt, I/O, and DMA settings.
Î
Reset Configuration Data [Disabled]
Use the Reset Configuration Data option to reset the Extended System Configuration
Data (ESCD) when exiting setup if booting problems occur after a new add-on is installed.
Î Disabled
DEFAULT
Î Enabled
Î
ESCD will not be reconfigured
ESCD will be reconfigured after you exit setup
Resources Controlled By [Auto (ESCD)]
Use the Resources Controlled By option to either manually configure all the boot and
plug and play devices, or allow BIOS to configure these devices automatically. If BIOS is
allowed to configure the devices automatically IRQs, DMA and memory base address
fields cannot be set manually.
Î Auto(ESCD)
DEFAULT
BIOS automatically configures plug and play devices as
well as boot devices.
Î Manual
Manually configure the plug and play devices and any
other boot devices.
Î
x IRQ Resources [Press Enter]
The IRQ Resources option (BIOS Menu 11) can only be selected if the Resources
Controlled By option is set to Manual.
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BIOS Menu 11: IRQ Resources
The IRQ Resources menu has the following options:
ƒ
IRQ-3 assigned to
ƒ
IRQ-4 assigned to
ƒ
IRQ-5 assigned to
ƒ
IRQ-7 assigned to
ƒ
IRQ-10 assigned to
ƒ
IRQ-11 assigned to
The above options all have the following default options.
Î PCI/ISA
PnP
Î Legacy ISA
DEFAULT
PCI or ISA cards designed according to the Plug and
Play standard can be used
Only an ISA card compliant with the original AT bus
specification can be installed
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WAFER-LX Motherboard
Î
x DMA Resources [Press Enter]
The DMA Resources option (BIOS Menu 12) can only be selected if the Resources
Controlled By option is set to Manual.
BIOS Menu 12: DMA Resources
The DMA Resources menu has the following options:
ƒ
DMA-0 assigned to
ƒ
DMA-1 assigned to
ƒ
DMA-3 assigned to
ƒ
DMA-5 assigned to
ƒ
DMA-6 assigned to
ƒ
DMA-7 assigned to
The above options all have the following default options.
Î PCI/ISA
PnP
Page 114
DEFAULT
PCI or ISA cards designed according to the Plug and Play
standard can be used
WAFER-LX Motherboard
Î Legacy ISA
Only an ISA card compliant with the original AT bus
specification can be installed
Î
x Memory Resources [Press Enter]
The Memory Resources menu (BIOS Menu 13) can only be accessed if the Resources
Controlled By option is set to Manual. Use Memory Resources to select a base address
and the length for the memory area used by a peripheral that requires high memory.
BIOS Menu 13: Memory Resources
The menu has two configurable options:
Î
ƒ
Reserved Memory Base
ƒ
Reserved Memory Length
Reserved Memory Base [N/A]
The Reserved Memory Base option specifies the base address for the peripheral device.
The Reserved Memory Base options are:
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WAFER-LX Motherboard
Î
ƒ
N/A (Default)
ƒ
C800
ƒ
CC00
ƒ
D000
ƒ
D400
ƒ
D800
ƒ
DC00
x Reserved Memory Length [8K]
The Reserved Memory Length option can only be accessed if the Reserved Memory
Base option is not set to N/A. The Reserved Memory Length specifies the amount of
memory reserved for the peripheral device. The Reserved Memory Length options:
Î
ƒ
8K (Default)
ƒ
16K
ƒ
32K
ƒ
64K
PCI/VGA Palette Snoop [Disabled]
Use the PCI/VGA Palette Snoop option to enable the system to determine whether or not
some special VGA cards, high-end hardware MPEG decoders and other similar devices
are allowed to look at the VGA palette on the video card so these devices can determine
what colors are in use. This option is needed very rarely and should be left "Disabled"
unless a video device specifically requires the setting to be enabled upon installation.
Î Disabled
DEFAULT
Does not allow the graphics devices to examine the
VGA palette on the graphics card.
Î Enabled
Allows the graphics devices to examine the VGA
palette on the graphics card.
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6.8 PC Health Status
The PC Health Status menu (BIOS Menu 14) has no user configurable options, but
shows system operating parameters that are essential to the stable operation of the
system.
BIOS Menu 14: PC Health Status
The following system parameters are monitored by the PC Health Status menu.
Î
System Temperature
The following temperatures are monitored:
ƒ
Î
Current CPU Temperature
System Fan
The following system fans are monitored:
ƒ
Current CPU Fan Speed
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WAFER-LX Motherboard
Î
Voltages
The following voltages are monitored:
Page 118
ƒ
Vcore
ƒ
+3.3 V
ƒ
VccMem
ƒ
+5 V
ƒ
+12 V
ƒ
VBAT(V)
WAFER-LX Motherboard
Chapter
7
7 RAID Setup
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WAFER-LX Motherboard
7.1 VIA® RAID Utility
The WAFER-LX has a VIA® VT6421 SATA controller chip onboard. The SATA RAID
controller allows the two SATA ports to be setup as
ƒ
Two individual drives
ƒ
A RAID 0 striped array for performance
ƒ
A RAID 1 mirrored array for data security
ƒ
A JBOD array to allow both disks to be accessed as a single large disk
For maintenance after the initial setup, please use the operating system software RAID
software utility.
7.2 Accessing The RAID Utility
During the boot process, the message below shows. Press the TAB key to enter the RAID
utility.
Figure 7-1: RAID Utility
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WAFER-LX Motherboard
7.3 Creating a RAID Array
The steps for creating a RAID 0, RAID 1 and JBOD array are similar. To create a RAID
array, follow the steps below.
Step 1: The RAID setup utility main screen appears. Select the “Create Array” option
from the list and press Enter.
Figure 7-2: RAID Setup Main Screen
Step 2: Select the second option “Array Mode…” and press Enter to select the type of
RAID array to setup.
Figure 7-3: Create Array
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WAFER-LX Motherboard
Step 3: Select the RAID type from the list that appears. Press Enter to select.
Figure 7-4: RAID Type
Step 4: Proceed with either the “Automatic Setup” or “Manual Setup”.Step0:
7.3.1 Automatic Setup
Step 1: The automatic setup uses default settings to setup the RAID array. This is the
recommended method. Select “Auto Setup For…” and press Enter.
Figure 7-5: Automatic Setup
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WAFER-LX Motherboard
Step 2: All data on the hard disks is destroyed when the RAID array is setup. Press Y to
setup the array, or N to go back.
Figure 7-6: Confirm Data Deletion
Step 3: The RAID array is created. The details of the new array are shown in the bottom
half of the screen. Step0:
Figure 7-7: RAID Array Setup Complete
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7.3.2 Manual Setup
Step 1: Select “Select Disk Drives” and press Enter
Figure 7-8: Select Drives
Step 2: Select the drive to be the “Source” or “Stripe0” and press Enter.
Figure 7-9: Select First Drive
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WAFER-LX Motherboard
Step 3: The “Source” or “Stripe0” drive is shown in green text with a [*] at the beginning.
Step 4: Select the drive to be the “Mirror” or “Stripe1” and press Enter.
Figure 7-10: Select Second Drive
Step 5: The “Mirror” or “Stripe1” drive is now also shown in green text with a [*] at the
beginning.
Figure 7-11: Disk Drives Selected
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WAFER-LX Motherboard
Step 6: Select the “Stripe Size” option and press Enter.
Figure 7-12: Stripe Size
Step 7: Select the stripe size from the popup list and press Enter.
Figure 7-13: Select Stripe Size
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Step 8: Select “Start Create Process” and press Enter to create the RAID array.
Figure 7-14: Start RAID Creation
Step 9: Press Y create the RAID array, or N to go back.
Figure 7-15: Confirm RAID Creation
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WAFER-LX Motherboard
Step 10: The display message confirms that the array has been created. Details of the
newly created array are shown in the bottom half of the screen. Step0:
Figure 7-16: RAID Array Created
7.4 Delete a RAID Array
Deleting a RAID array deletes all the data on the hard disks in the array. Save and backup
all information from the RAID array before deleting the array. To delete a RAID array,
follow the steps below.
Step 1: Select “Delete Array” and press Enter.
Figure 7-17: Delete RAID Array
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Step 2: Select the array to delete.
Figure 7-18: Select Array to Delete
Step 3: Press Y to delete the array, or N to go back.
Figure 7-19: Confirm Array Deletion
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Step 4: The display message confirms that the array has been deleted. Step0:
Figure 7-20: Array Deleted
7.5 Selecting a Boot Array
To allow an operating system to be installed on the RAID array so that the system can
boot from the array, the array must be set as a “Boot Array”.
Step 1: Select the “Select Boot Array” option and press Enter.
Figure 7-21: Select Boot Array
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Step 2: Select the array to set as a boot array.
Figure 7-22: Select Boot Array
Step 3: Press Enter to set the array as a boot array. A (b) appears before the array name
to indicate that the array is now a bootable array. Step0:
Figure 7-23: Set Array as Boot Array
7.6 Viewing Disk Drive Serial Numbers
Viewing the disk drive serial numbers helps to determine which disk is being selected
when the array consists of two disks of the same type.
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Step 1: Select the “Serial Number View” option and press Enter.
Figure 7-24: Serial Number View
Step 2: Select the drive to view it’s serial number at the bottom of the screen. Step0:
Figure 7-25: Serial Number
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7.7 Exiting The RAID Utility
To exit the RAID utility, press ESC. Press Y to exit or N to go back.
Figure 7-26: Exit RAID Utility
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Chapter
8
8 Software Drivers
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8.1 Available Software Drivers
NOTE:
The content of the CD may vary throughout the life cycle of the product
and is subject to change without prior notice. You may visit the IEI
website or contact technical support for the latest updates.
There are five software drivers for the WAFER-LX motherboard installed in the
subsystem:
ƒ
ƒ
ƒ
ƒ
ƒ
8.3 VGA Driver ....................................................................................... 140
8.4 Audio Driver...................................................................................... 148
8.5 LAN Driver........................................................................................ 157
8.6 SATA/RAID Driver ............................................................................ 163
8.7 ISA Driver ......................................................................................... 168
All five drivers can be found on the CD that came with the CPU card. To install the drivers
please follow the instructions in the sections below.
Insert the CD into the system that contains the WAFER-LX CPU card.
NOTE:
If your system does not run the "autorun" program when the CD is
inserted, click the Start button, select Run, then type X:\autorun.exe
(replace X with the actual drive letter for your CD-ROM) to access the
IEI Driver CD main menu.
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Step 1: From the AMD LX/GX Driver CD main menu (Figure 8-1), click WAFER-LX.
Figure 8-1: AMD LX/GX CD Main Menu
Step 2: A window appears listing the drivers available for installation (Figure 8-2).
Figure 8-2: AMD LX/GX CD Driver Menu
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Step 3: Select any item from the list to view more information on the driver installation,
or select Manual to navigate to the WAFER-LX user manual. Step 0:
The following sections fully describe the driver installation procedures for the WAFER-LX
CPU card.
8.2 Device Driver Menu
Most of the drivers need to installed through the “Device Driver” window. Follow the steps
below to open the “Device Driver” window.
Step 1: Click the “Start” button. Click “Control Panel”.
Figure 8-3: Start Menu
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Step 2: Double-click the “System” icon.
Figure 8-4: Control Panel
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Step 3: Click the “Hardware” tab. Click DEVICE MANAGER .
Figure 8-5: System
Step 4: The “Device Manager” window opens. Step0:
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8.3 VGA Driver
To install the VGA driver please follow the steps below.
Step 1: Open the “Device Manager” (Section 8.2 on page 137)
Step 2: Right-click on the “Video Controller (VGA Compatible)” item and click “Update
Driver…” (this driver option might be located under “Other Devices”).
Figure 8-6: Device Manager
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Step 3: The Hardware Update Wizard appears. Click the “No, not this time” option.
Click NEXT to continue.
Figure 8-7: Hardware Update Wizard
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Step 4: Click the “Install from a list or specific location”. Click NEXT to continue.
Figure 8-8: Installation Location
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Step 5: Click “Don’t search. I will choose the driver to install”. Click NEXT to
continue.
Figure 8-9: Driver Location
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Step 6: Click HAVE DISK to choose the driver from a specific location.
Figure 8-10: Have Disk
Step 7: Click BROWSE to choose the driver location.
Figure 8-11: Browse For Driver Location
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Step 8: Browse to the directory with the graphics driver.
Figure 8-12: Graphics Driver Directory
Step 9: Click on the driver file. Click OPEN to use this file and continue.
Figure 8-13: Select Driver File
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Step 10: Click OK to continue.
Figure 8-14: Install From Disk
Step 11: Click on the driver that appears. Click NEXT to continue.
Figure 8-15: Select The Driver
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Step 12: The Windows logo testing warning window appears. Click CONTINUE ANYWAY to
continue.
Figure 8-16: Windows Logo Testing
Step 13: Click FINISH to exit the hardware installation wizard. Step 0:
Figure 8-17: Installation Complete
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8.4 Audio Driver
To install the audio driver please follow the steps below.
Step 1: Open the “Device Manager” (Section 8.2 on page 137)
Step 2: Right-click on the “Multimedia Audio Controller” item and click “Update
Driver…”
Figure 8-18: Device Manager
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Step 3: The Hardware Update Wizard appears. Click the “No, not this time” option.
Click NEXT to continue.
Figure 8-19: Hardware Update Wizard
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Step 4: Click the “Install from a list or specific location”. Click NEXT to continue.
Figure 8-20: Installation Location
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Step 5: Click “Don’t search. I will choose the driver to install”. Click NEXT to
continue.
Figure 8-21: Driver Location
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Step 6: Click the “Sound, video and gamer controllers” option. Click NEXT to continue
Figure 8-22: Have Disk
Step 7: Click HAVE DISK to choose the driver from a specific location.
Figure 8-23: Have Disk
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Step 8: Click BROWSE to choose the driver location.
Figure 8-24: Browse For Driver Location
Step 9: Browse to the directory with the graphics driver.
Figure 8-25: Graphics Driver Directory
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Step 10: Click on the driver file. Click OPEN to use this file and continue.
Figure 8-26: Select Driver File
Step 11: Click OK to continue.
Figure 8-27: Install From Disk
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Step 12: Click on the driver that appears. Click NEXT to continue.
Figure 8-28: Select The Driver
Step 13: The Windows logo testing warning window appears. Click CONTINUE ANYWAY to
continue.
Figure 8-29: Windows Logo Testing
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Step 14: Click FINISH to exit the hardware installation wizard. Step 0:
Figure 8-30: Installation Complete
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8.5 LAN Driver
To install the LAN driver, please follow the steps below.
Step 1: Open the “Device Manager” (Section 8.2 on page 137)
Step 2: Right-click on the “Realtek RTL8139 Family PCI Fast Ethernet NIC” item and
click “Update Driver…”
Figure 8-31: Device Manager
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Step 3: The Hardware Update Wizard appears. Click the “No, not this time” option.
Click NEXT to continue.
Figure 8-32: Hardware Update Wizard
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Step 4: Click the “Install from a list or specific location”. Click NEXT to continue.
Figure 8-33: Installation Location
Step 5: Click HAVE DISK to choose the driver from a specific location.
Figure 8-34: Have Disk
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Step 6: Click BROWSE to choose the driver location.
Figure 8-35: Browse For Driver Location
Step 7: Browse to the directory with the graphics driver.
Figure 8-36: Graphics Driver Directory
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Step 8: Click on the driver file. Click OPEN to use this file and continue.
Figure 8-37: Select Driver File
Step 9: Click OK to continue.
Figure 8-38: Install From Disk
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Step 10: Click on the driver that appears. Click NEXT to continue.
Figure 8-39: Select The Driver
Step 11: Click FINISH to exit the hardware installation wizard. Step 0:
Figure 8-40: Installation Complete
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8.6 SATA/RAID Driver
To install the VIA® SATA/RAID driver, please follow the steps below.
Step 1: Click SATA from the WAFER-LX menu (Figure 8-1) to open a window to the
X:\4-SATA folder (where X:\ is the system CD drive) folder on the driver CD.
Step 2: Browse to X:\4-SATA\VIA VT6421\V-RAID and double-click the Setup program
icon (Figure 8-41).
Figure 8-41: Locate the Setup Program Icon
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Step 3: The Install Shield Wizard (Figure 8-42) is prepared to guide the user through
the rest of the process.
Figure 8-42: Preparing Setup Screen
Step 4: Once initialized, the Install Wizard welcome screen appears (Figure 8-43).
Click NEXT to continue the installation or CANCEL to stop the installation.
Figure 8-43: Install Wizard Welcome Screen
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Step 5: The VIA® Software License Agreement appears. Choose “I Agree” and click
NEXT to continue.
Figure 8-44: Software License Agreement
Step 6: Choose both the “VIA® V-RAID Driver Package” and “VIA® V-RAID Config
Utility” for installation. Click NEXT to continue (Figure 8-45)
Figure 8-45: Select Driver Packages
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Step 7: Review the items to be installed and click NEXT to begin the installation process
(Figure 8-46).
Figure 8-46: Review Installation Items
Step 8: Once the installation is complete the status of the install is shown on the screen
in Figure 8-47. Click NEXT to continue.
Figure 8-47: Installation Status
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Step 9: Once the installation is complete, the Install Wizard Complete screen appears
(Figure 8-48). Save any work or documents, and close any programs being
used. Click FINISH to complete the installation and restart the computer. Step 9:
Figure 8-48: InstallShield Wizard Complete Screen
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8.7 ISA Driver
To install the IT8888 ISA Bridge driver please follow the steps below:
Step 10: Open the “Device Manager” (Section 8.2 on page 137)
Step 11: Right-click on the “Other PCI Bridge Device” item and click “Update Driver…”
(this driver option might be located under “Other Devices”).
Figure 8-49: Device Manager
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Step 12: The Hardware Update Wizard appears. Click the “No, not this time” option.
Click NEXT to continue.
Figure 8-50: Hardware Update Wizard
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Step 13: Click the “Install from a list or specific location”. Click NEXT to continue.
Figure 8-51: Installation Location
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Step 14: Click “Don’t search. I will choose the driver to install”. Click NEXT to
continue.
Figure 8-52: Driver Location
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Step 15: Click HAVE DISK to choose the driver from a specific location.
Figure 8-53: Have Disk
Step 16: Click BROWSE to choose the driver location.
Figure 8-54: Browse For Driver Location
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Step 17: Browse to the directory with the graphics driver.
Figure 8-55: Graphics Driver Directory
Step 18: Click on the driver file. Click OPEN to use this file and continue.
Figure 8-56: Select Driver File
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Step 19: Click OK to continue.
Figure 8-57: Install From Disk
Step 20: Click on the driver that appears. Click NEXT to continue.
Figure 8-58: Select The Driver
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Step 21: Click FINISH to exit the hardware installation wizard. Step 0:
Figure 8-59: Installation Complete
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Appendix
A
A BIOS Options
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Below is a list of BIOS configuration options in the BIOS chapter.
Î
Load Fail-Safe Defaults .......................................................................................................80
Î
Load Optimized Defaults.....................................................................................................80
Î
Set Supervisor Password....................................................................................................80
Î
Set User Password ..............................................................................................................80
Î
Save & Exit Setup ................................................................................................................80
Î
Exit Without Saving .............................................................................................................81
Î
Date [Day mm:dd:yyyy] .......................................................................................................81
Î
Time [hh/mm/ss] ..................................................................................................................81
Î
IDE Master and IDE Slave....................................................................................................82
Î
Drive A [None] ......................................................................................................................82
Î
Base Memory: ......................................................................................................................82
Î
Extended Memory ................................................................................................................82
Î
Total Memory........................................................................................................................83
Î
IDE HDD Auto-Detection [Press Enter]..............................................................................83
Î
IDE Primary Master [Auto] ..................................................................................................83
Î
Access Mode [Auto] ............................................................................................................83
Î
Capacity ................................................................................................................................84
Î
Cylinder.................................................................................................................................84
Î
Head ......................................................................................................................................84
Î
Precomp................................................................................................................................84
Î
Landing Zone .......................................................................................................................84
Î
Sector ....................................................................................................................................85
Î
Virus Warning [Disabled] ....................................................................................................86
Î
CPU Internal Cache [Enabled] ............................................................................................86
Î
Boot From LAN Control [Disabled] ....................................................................................86
Î
SATA Boot ROM Control [Disabled] ..................................................................................87
Î
Boot Device ..........................................................................................................................87
Î
Boot Other Device [Enabled] ..............................................................................................88
Î
Boot Up Floppy Seek [Disabled] ........................................................................................88
Î
Boot Up Numlock Status [On] ............................................................................................88
Î
Gate A20 Option [Fast] ........................................................................................................89
Î
Typematic Rate Setting [Disabled].....................................................................................89
Î
Typematic Rate (Chars/sec) [6] ..........................................................................................89
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Î
Typematic Delay (Msec) [250].............................................................................................90
Î
Security Option [Setup].......................................................................................................90
Î
OS Select For DRAM > 64 MB [Non-OS2] ..........................................................................90
Î
HDD S.M.A.R.T [Disabled] ...................................................................................................91
Î
Console Redirection [Disabled] .........................................................................................91
Î
Baud Rate [19200]................................................................................................................91
Î
Agent after boot [Disabled].................................................................................................92
Î
Small Logo (EPA) Show [Disabled]....................................................................................92
Î
CPU Frequency [500 MHz] ..................................................................................................93
Î
Memory Frequency [333 MHz] ............................................................................................94
Î
Video Memory Size [8M]......................................................................................................94
Î
Output Display [Panel & CRT] ............................................................................................94
Î
Flat Panel Configuration [Press Enter]..............................................................................94
Î
OnBoard Audio [Enabled] ...................................................................................................95
Î
Onboard USB1.1 [Enabled] .................................................................................................95
Î
Onboard USB2.0 [Enabled] .................................................................................................95
Î
Onboard IDE [Enabled]........................................................................................................95
Î
Memory Hole At 15M – 16M [Disabled] ..............................................................................95
Î
Resolution [800 x 600] .........................................................................................................96
Î
Data Bus Type [9 – 24 bits, 1 ppc]......................................................................................97
Î
Refresh Rate [60Hz] .............................................................................................................97
Î
HSYNC Polarity [High].........................................................................................................97
Î
VSYNC Polarity Active [Low] ..............................................................................................98
Î
SHFCLK Active Period [Free Running]..............................................................................98
Î
LP Active Period [Free Running]........................................................................................98
Î
On-Chip IDE Channel 1 [Enabled] ......................................................................................99
Î
Drive PIO Mode [Auto].........................................................................................................99
Î
IDE UDMA [Auto]............................................................................................................... 100
Î
IT8888 ISA Decode IO ....................................................................................................... 100
Î
IT8888 ISA Decode Memory ............................................................................................. 100
Î
IDE HDD Block Mode [Enabled] ...................................................................................... 101
Î
Onboard FDC Controller [Disabled]................................................................................ 101
Î
Onboard Serial Port 1 [3F8/IRQ4] .................................................................................... 101
Î
Onboard Serial Port 2 [2F8/IRQ3] .................................................................................... 101
Î
Onboard Serial Port 3 [Disabled]..................................................................................... 102
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Î
Onboard Parallel Port [378/IRQ7] .................................................................................... 102
Î
Parallel Port Mode [SPP] .................................................................................................. 102
Î
EPP Mode Select [EPP1.7] ............................................................................................... 103
Î
ECP Mode Use DMA [1] .................................................................................................... 103
Î
Decode IO Space N [Enabled].......................................................................................... 105
Î
Decode IO Speed N [Fast Speed] .................................................................................... 105
Î
Decode IO Address N 0:15 [xx]........................................................................................ 105
Î
Decode IO Size N [Fast Speed]........................................................................................ 106
Î
Decode Memory Space N [Enabled] ............................................................................... 107
Î
Decode Memory Speed N [Fast Speed] .......................................................................... 108
Î
Decode Memory Address N [xx]...................................................................................... 108
Î
Decode Memory Size N [xx] ............................................................................................. 108
Î
AC Power Mode [ATX] ...................................................................................................... 109
Î
HDD Power Down [Disabled] ........................................................................................... 109
Î
Soft-Off by PWR-BTTN [Instant-Off] ............................................................................... 110
Î
Power-On by Alarm [Disabled] ........................................................................................ 110
Î
PNP OS Installed [No]....................................................................................................... 111
Î
Reset Configuration Data [Disabled] .............................................................................. 112
Î
Resources Controlled By [Auto (ESCD)]........................................................................ 112
Î
x IRQ Resources [Press Enter]........................................................................................ 112
Î
x DMA Resources [Press Enter]...................................................................................... 114
Î
x Memory Resources [Press Enter] ................................................................................ 115
Î
Reserved Memory Base [N/A].......................................................................................... 115
Î
x Reserved Memory Length [8K]..................................................................................... 116
Î
PCI/VGA Palette Snoop [Disabled].................................................................................. 116
Î
System Temperature ........................................................................................................ 117
Î
System Fan ........................................................................................................................ 117
Î
Voltages ............................................................................................................................. 118
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Appendix
B
B Terminology
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AC ’97
Audio Codec 97 (AC’97) refers to a codec standard developed by Intel®
in 1997.
ACPI
Advanced Configuration and Power Interface (ACPI) is an OS-directed
configuration, power management, and thermal management interface.
AHCI
Advanced Host Controller Interface (AHCI) is a SATA Host controller
register-level interface.
ATA
The Advanced Technology Attachment (ATA) interface connects storage
devices including hard disks and CD-ROM drives to a computer.
ARMD
An ATAPI Removable Media Device (ARMD) is any ATAPI device that
supports removable media, besides CD and DVD drives.
ASKIR
Amplitude Shift Keyed Infrared (ASKIR) is a form of modulation that
represents a digital signal by varying the amplitude (“volume”) of the
signal. A low amplitude signal represents a binary 0, while a high
amplitude signal represents a binary 1.
BIOS
The Basic Input/Output System (BIOS) is firmware that is first run when
the computer is turned on and can be configured by the end user
CODEC
The Compressor-Decompressor (CODEC) encodes and decodes digital
audio data on the system.
CompactFlash®
CompactFlash® is a solid-state storage device. CompactFlash® devices
use flash memory in a standard size enclosure. Type II is thicker than
Type I, but a Type II slot can support both types.
CMOS
Complimentary metal-oxide-conductor is an integrated circuit used in
chips like static RAM and microprocessors.
COM
COM refers to serial ports. Serial ports offer serial communication to
expansion devices. The serial port on a personal computer is usually a
male DB-9 connector.
DAC
The Digital-to-Analog Converter (DAC) converts digital signals to analog
signals.
DDR
Double Data Rate refers to a data bus transferring data on both the rising
and falling edges of the clock signal.
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DMA
Direct Memory Access (DMA) enables some peripheral devices to
bypass the system processor and communicate directly with the system
memory.
DIMM
Dual Inline Memory Modules are a type of RAM that offer a 64-bit data
bus and have separate electrical contacts on each side of the module.
DIO
The digital inputs and digital outputs are general control signals that
control the on/off circuit of external devices or TTL devices. Data can be
read or written to the selected address to enable the DIO functions.
EHCI
The Enhanced Host Controller Interface (EHCI) specification is a
register-level interface description for USB 2.0 Host Controllers.
EIDE
Enhanced IDE (EIDE) is a newer IDE interface standard that has data
transfer rates between 4.0 MB/s and 16.6 MB/s.
EIST
Enhanced Intel® SpeedStep Technology (EIST) allows users to modify
the power consumption levels and processor performance through
application software. The application software changes the bus-to-core
frequency ratio and the processor core voltage.
FSB
The Front Side Bus (FSB) is the bi-directional communication channel
between the processor and the Northbridge chipset.
GbE
Gigabit Ethernet (GbE) is an Ethernet version that transfers data at
1.0 Gb/s and complies with the IEEE 802.3-2005 standard.
GPIO
General purpose input
HDD
Hard disk drive (HDD) is a type of magnetic, non-volatile computer
storage device that stores digitally encoded data.
ICH
The Input/Ouput Controll Hub (ICH) is an Intel® Southbridge chipset.
IrDA
Infrared Data Association (IrDA) specify infrared data transmission
protocols used to enable electronic devices to wirelessly communicate
with each other.
L1 Cache
The Level 1 Cache (L1 Cache) is a small memory cache built into the
system processor.
L2 Cache
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The Level 2 Cache (L2 Cache) is an external processor memory cache.
WAFER-LX Motherboard
LCD
Liquid crystal display (LCD) is a flat, low-power display device that
consists of two polarizing plates with a liquid crystal panel in between.
LVDS
Low-voltage differential signaling (LVDS) is a dual-wire, high-speed
differential electrical signaling system commonly used to connect LCD
displays to a computer.
POST
The Power-on Self Test (POST) is the pre-boot actions the system
performs when the system is turned-on.
RAM
Random Access Memory (RAM) is volatile memory that loses data when
power is lost. RAM has very fast data transfer rates compared to other
storage like hard drives.
SATA
Serial ATA (SATA) is a serial communications bus designed for data
transfers between storage devices and the computer chipsets. The SATA
bus has transfer speeds up to 1.5 Gb/s and the SATA II bus has data
transfer speeds of up to 3.0 Gb/s.
S.M.A.R.T
Self Monitoring Analysis and Reporting Technology (S.M.A.R.T) refers to
automatic status checking technology implemented on hard disk drives.
UART
Universal Asynchronous Receiver-transmitter (UART) is responsible for
asynchronous communications on the system and manages the system’s
serial communication (COM) ports.
UHCI
The Universal Host Controller Interface (UHCI) specification is a
register-level interface description for USB 1.1 Host Controllers.
USB
The Universal Serial Bus (USB) is an external bus standard for
interfacing devices. USB 1.1 supports 12 Mb/s data transfer rates and
USB 2.0 supports 480 Mb/s data transfer rates.
VGA
The Video Graphics Array (VGA) is a graphics display system developed
by IBM.
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Appendix
C
C Digital I/O Interface
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C.1 Introduction
The DIO connector on the WAFER-LX is interfaced to GPIO ports on the Super I/O
chipset. The DIO has both 4-bit digital inputs and 4-bit digital outputs. The digital inputs
and digital outputs are generally control signals that control the on/off circuit of external
devices or TTL devices. Data can be read or written to the selected address to enable the
DIO functions.
NOTE:
For further information, please refer to the datasheet for the Super I/O
chipset.
C.2 DIO Connector Pinouts
The following table describes how the DIO connector pins are connected to the Super I/O
GPIO port 1.
Pin
Description
Super I/O Pin
Super I/O Pin Description
1
Ground
N/A
N/A
2
VCC
N/A
N/A
3
Output 3
GP27
General purpose I/O port 2 bit 7.
4
Output 2
GP26
General purpose I/O port 2 bit 6.
5
Output 1
GP25
General purpose I/O port 2 bit 5.
6
Output 0
GP24
General purpose I/O port 2 bit 4.
7
Input 3
GP23
General purpose I/O port 2 bit 3.
8
Input 2
GP22
General purpose I/O port 2 bit 2
9
Input 1
GP21
General purpose I/O port 2 bit 1
10
Input 0
GP20
General purpose I/O port 2 bit 0
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C.3 Assembly Language Samples
C.3.1 Enable the DIO Input Function
The BIOS interrupt call INT 15H controls the digital I/O. An assembly program to enable
digital I/O input functions is listed below.
MOV
AX, 6F08H
Sets the digital port as input
INT
15H
Initiates the INT 15H BIOS call
C.3.2 Enable the DIO Output Function
The BIOS interrupt call INT 15H controls the digital I/O. An assembly program to enable
digital I/O output functions is listed below.
MOV
AX, 6F09H
MOV
BL, 09H
INT
15H
Page 186
Sets the digital port as output
Initiates the INT 15H BIOS call
WAFER-LX Motherboard
Appendix
D
D Watchdog Timer
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NOTE:
The following discussion applies to DOS environment. IEI support is
contacted or the IEI website visited for specific drivers for more
sophisticated operating systems, e.g., Windows and Linux.
The Watchdog Timer is provided to ensure that standalone systems can always recover
from catastrophic conditions that cause the CPU to crash. This condition may have
occurred by external EMIs or a software bug. When the CPU stops working correctly,
Watchdog Timer either performs a hardware reset (cold boot) or a Non-Maskable Interrupt
(NMI) to bring the system back to a known state.
A BIOS function call (INT 15H) is used to control the Watchdog Timer.
INT 15H:
AH – 6FH Sub-function:
AL – 2:
Sets the Watchdog Timer’s period.
BL:
Time-out value (Its unit-second is dependent on the item “Watchdog
Timer unit select” in CMOS setup).
Table D-1: AH-6FH Sub-function
Call sub-function 2 to set the time-out period of Watchdog Timer first. If the time-out value
is not zero, the Watchdog Timer starts counting down. When the timer value reaches zero,
the system resets. To ensure that this reset condition does not occur, calling sub-function
2 must periodically refresh the Watchdog Timer. However, the watchdog timer is disabled
if the time-out value is set to zero.
A tolerance of at least 10% must be maintained to avoid unknown routines within the
operating system (DOS), such as disk I/O that can be very time-consuming.
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NOTE:
When exiting a program it is necessary to disable the Watchdog Timer,
otherwise the system resets.
EXAMPLE PROGRAM:
; INITIAL TIMER PERIOD COUNTER
;
W_LOOP:
;
MOV
AX, 6F02H
;setting the time-out value
MOV
BL, 30
;time-out value is 48 seconds
INT
15H
;
; ADD THE APPLICATION PROGRAM HERE
;
CMP
JNE
EXIT_AP, 1
W_LOOP
MOV
AX, 6F02H
MOV
BL, 0
INT
;is the application over?
;No, restart the application
;disable Watchdog Timer
;
15H
;
; EXIT ;
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Appendix
E
E Address Mapping
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E.1 IO Address Map
I/O address Range
Description
000-01F
DMA Controller
020-021
Interrupt Controller
040-043
System time
060-06F
Keyboard Controller
070-07F
System CMOS/Real time Clock
080-09F
DMA Controller
0 A0-0 A1
Interrupt Controller
0C0-0DF
DMA Controller
0F0-0FF
Numeric data processor
1F0-1F7
Primary IDE Channel
2F8-2FF
Serial Port 2 (COM2)
378-37F
Parallel Printer Port 1 (LPT1)
3B0-3BB
SiS661CX Graphics Controller
3C0-3DF
SiS661CX Graphics Controller
3F6-3F6
Primary IDE Channel
3F7-3F7
Standard floppy disk controller
3F8-3FF
Serial Port 1 (COM1)
Table E-1: IO Address Map
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E.2 1st MB Memory Address Map
Memory address
Description
00000-9FFFF
System memory
A0000-BFFFF
VGA buffer
F0000-FFFFF
System BIOS
1000000-
Extend BIOS
Table E-2: 1st MB Memory Address Map
E.3 IRQ Mapping Table
IRQ0
System Timer
IRQ8
RTC clock
IRQ1
Keyboard
IRQ9
ACPI
IRQ2
Available
IRQ10
LAN
IRQ3
COM2
IRQ11
LAN/USB2.0/SATA
IRQ4
COM1
IRQ12
PS/2 mouse
IRQ5
SMBus Controller
IRQ13
FPU
IRQ6
FDC
IRQ14
Primary IDE
IRQ7
Available
IRQ15
Secondary IDE
Table E-3: IRQ Mapping Table
Page 192
WAFER-LX Motherboard
E.4 DMA Channel Assignments
Channel
Function
0
Available
1
Available
2
Floppy disk (8-bit transfer)
3
Available
4
Cascade for DMA controller 1
5
Available
6
Available
7
Available
Table E-4: IRQ Mapping Table
Page 193
WAFER-LX Motherboard
Appendix
F
F Compatibility
Page 194
WAFER-LX Motherboard
NOTE:
The compatible items described here have been tested by the IEI R&D
team and found to be compatible with the WAFER-LX
F.1 Compatible Operating Systems
The following operating systems have been successfully run on the WAFER-LX.
ƒ
MS-DOS 6.22
ƒ
Microsoft Windows XP (32-bit)
ƒ
Microsoft Windows 2000
ƒ
Red Hat 9.0
F.2 Compatible Processors
The following Intel® Socket 478 processors have been successfully tested on the
WAFER-LX
CPU
Intel® Pentium 4
FSB
800 MHz
Frequency
3.2GHz
L2 Cache
1 MB
Page 195
WAFER-LX Motherboard
F.3 Compatible Memory Modules
NOTE:
The memory modules listed below have been tested on the
WAFER-LX other memory modules that comply with the specifications
may also work on the WAFER-LX but have not been tested.
The following memory modules have been successfully tested on the WAFER-LX.
Manufacturer
Kingston
Page 196
Model No.
KVR400X64C3 A
Capacity
512 MB
Speed
400 MHz
Type
DDR
WAFER-LX Motherboard
Appendix
G
G Hazardous Materials
Disclosure
Page 197
WAFER-LX Motherboard
G.1 Hazardous Materials Disclosure Table for IPB Products
Certified as RoHS Compliant Under 2002/95/EC Without
Mercury
The details provided in this appendix are to ensure that the product is compliant with the
Peoples Republic of China (China) RoHS standards. The table below acknowledges the
presences of small quantities of certain materials in the product, and is applicable to China
RoHS only.
A label will be placed on each product to indicate the estimated “Environmentally Friendly
Use Period” (EFUP). This is an estimate of the number of years that these substances
would “not leak out or undergo abrupt change.” This product may contain replaceable
sub-assemblies/components which have a shorter EFUP such as batteries and lamps.
These components will be separately marked.
Please refer to the table on the next page.
Page 198
WAFER-LX Motherboard
Part Name
Toxic or Hazardous Substances and Elements
Lead
Mercury
Cadmium
Hexavalent
Polybrominated
Polybrominated
(Pb)
(Hg)
(Cd)
Chromium
Biphenyls
Diphenyl
(CR(VI))
(PBB)
Ethers
(PBDE)
Housing
X
O
O
O
O
X
Display
X
O
O
O
O
X
Printed Circuit
X
O
O
O
O
X
X
O
O
O
O
O
X
O
O
O
O
X
Fan Assembly
X
O
O
O
O
X
Power Supply
X
O
O
O
O
X
O
O
O
O
O
O
Board
Metal
Fasteners
Cable
Assembly
Assemblies
Battery
O:
This toxic or hazardous substance is contained in all of the homogeneous materials for the part is
below the limit requirement in SJ/T11363-2006
X:
This toxic or hazardous substance is contained in at least one of the homogeneous materials for
this part is above the limit requirement in SJ/T11363-2006
Page 199
WAFER-LX Motherboard
此附件旨在确保本产品符合中国 RoHS 标准。以下表格标示此产品中某有毒物质的含量符
合中国 RoHS 标准规定的限量要求。
本产品上会附有”环境友好使用期限”的标签,此期限是估算这些物质”不会有泄漏或突变”的
年限。本产品可能包含有较短的环境友好使用期限的可替换元件,像是电池或灯管,这些元
件将会单独标示出来。
部件名称
有毒有害物质或元素
铅
汞
镉
六价铬
多溴联苯
多溴二苯
(Pb)
(Hg)
(Cd)
(CR(VI))
(PBB)
醚
(PBDE)
壳体
X
O
O
O
O
X
显示
X
O
O
O
O
X
印刷电路板
X
O
O
O
O
X
金属螺帽
X
O
O
O
O
O
电缆组装
X
O
O
O
O
X
风扇组装
X
O
O
O
O
X
电力供应组装
X
O
O
O
O
X
电池
O
O
O
O
O
O
O: 表示该有毒有害物质在该部件所有物质材料中的含量均在 SJ/T11363-2006 标准规定的限量要求以下。
X: 表示该有毒有害物质至少在该部件的某一均质材料中的含量超出 SJ/T11363-2006 标准规定的限量要求。
Page 200
WAFER-LX Motherboard
Appendix
H
H RAID Levels
Page 201
WAFER-LX Motherboard
RAID allows multiple disks to be connected in an array. A RAID array allows extra
capabilities like increased speed and performance, or increased data protection and
security. A RAID array is viewed as a single disk by the computer and the operating
system. Details of the different RAID levels are outlined in the sections below.
WARNING!
Irrecoverable data loss occurs if a working drive is removed when
trying to remove a failed drive. It is strongly recommended to mark the
physical connections of all SATA disk drives. Drive locations can be
identified by attaching stickers to the drive bays. If a drive member of a
RAID array should fail, the failed drive can then be correctly identified.
NOTE:
A configured RAID volume (which may consist of multiple hard drives)
appears to an operating system as a contingent storage space. The
operating system will not be able to distinguish the physical disk drives
contained in a RAID configuration.
Page 202
WAFER-LX Motherboard
H.1 RAID 0
RAID 0, or striping, spreads data evenly over the disks in the RAID array. One block of
data is written to the first disk, then one block of data is written to the second disk, and so
on. The same applies for data reads.
RAID 0 offers faster performance than a single disk setup. Read and write performance is
increased. RAID 0 is not as secure as a single disk, and the failure of just one disk in the
array results in failure of the whole array.
The logical RAID volume below shows the disk drive that the operating system would see.
The physical disks show the disks that are contained in the RAID volume.
Figure H-1: RAID 0
Page 203
WAFER-LX Motherboard
H.2 RAID 1
RAID 1, or mirroring, places the exact same data on all disks in the RAID array. One block
of data is written to the first disk, the same block of data is written to the second disk, and
so on. When data is read, it can be read from either disk in the array.
RAID 1 offers more data security than a single disk setup. Read and write performance is
the same as a single disk. RAID 1 is more secure than a single disk as a failed disk can be
removed from the array, and the information restored from the remaining working drives.
The logical RAID volume below shows the disk drive that the operating system would see.
The physical disks show the disks that are contained in the RAID volume.
Figure H-2: RAID 1
Page 204
WAFER-LX Motherboard
H.3 JBOD
JBOD, sometimes called concatenation, strings physical hard disks together to create one
larger logical disk. Blocks of data are written to the first disk until it is finished and then the
blocks are written to the second drive, and so on.
JBOD offers no extra security and no extra performance. It is useful for combining smaller
disks into a single large logical disk. There is no redundancy, but the failure of one disk
usually only results in the failure of the data on that disk.
The logical RAID volume below shows the disk drive that the operating system would see.
The physical disks show the disks that are contained in the RAID volume.
Page 205
WAFER-LX Motherboard
Index
Page 206
WAFER-LX Motherboard
5
D
5.25” form factor ..........................................3
dimensions.................................................10
Dual USB connector ....................................6
A
anti-static precautions..........................24, 63
anti-static pad ........................................24
Dual-independent display ............................3
E
anti-static wristband...............................24
electrostatic discharge ........................ 24, 63
handling .................................................24
Ethernet connector ............................. 57, 58
self-grounding........................................24
Ethernet connectors.....................................6
AT power connector...............................5, 32
AT Power Select ........................................70
AT/ATX Power Mode Select jumper ..........70
ATX power button connector .....................34
ATX power connector ..................................5
ATX Power connector ................................33
Audio cable ........................................... iv, 65
audio connector .........................................35
Audio connector...........................................5
B
battery connector ...................................5, 36
C
CF II ...........................................................18
Clear CMOS ..............................................73
Clear CMOS Jumper .................................73
COM2 Setup ..............................................71
Compact Flash connector............................5
F
fan connector ........................................ 5, 38
FDD............................................................18
floppy disk connector .................................39
Floppy disk drive ..........................................5
form factor, 5.25"..........................................3
G
Geode™ LX 800 ........................................13
gigabit Ethernet............................................3
GPIO connector .................................... 5, 41
Graphics Processor ...................................15
H
HDD .................................................... 84, 85
I
compact flash memory module..................37
IDE device connector.................................42
CS5536......................................................14
IDE devices................................................18
Page 207
WAFER-LX Motherboard
IDE flat cable ........................................ iv, 65
RJ-45 connectors.......................................74
IDE Interface connectors .............................5
RoHS compliant ...........................................3
inverter connector ......................................43
RS-232 cable ........................................ iv, 65
Inverter power connector.............................5
RS-232 serial connector ............................59
IrDA............................................................91
RS-232/422/485 serial port connector.........6
K
S
KB/MS cable ......................................... iv, 65
Safety Precautions.................................. 195
keyboard and mouse connector ................44
SATA ....................................................... 163
Keyboard/mouse connector.........................5
SATA cables .......................................... iv, 65
SATA channels.............................................3
L
LED connector .............................................5
low power.....................................................2
LX-800 .........................................................3
M
SATA connector ...........................................6
SATA drive connectors...............................52
SATA drives................................................18
Serial communications port .......................57
Serial port connector....................................6
SO-DIMM module ......................................67
static precautions .......................................63
memory module .........................................16
Mini jumper pack................................... iv, 65
P
T
technical specifications ................................6
TFT LCD LVDS ................................... 54, 55
Parallel port connector.................................5
TFT LCD LVDS interface connector ............6
PC/104 power connector .............................5
TFT LCD TFT interface connector ...............6
PC/104 power input connector ..................48
PC/104 slot ............................................5, 49
PCI bridge..................................................16
power consumption....................................21
print port connector....................................46
R
U
unpacking...................................................24
unpacking checklist ...............................25
unpacking precautions...........................24
USB 2.0........................................................3
USB cable ............................................. iv, 65
reset button connector...............................50
USB combo port.................................. 57, 58
Reset button connector ...............................6
USB connector.............................................6
Page 208
WAFER-LX Motherboard
USB connectors.........................................75
VGA port ....................................................57
Utility CD............................................... iv, 65
X
V
x SO-DIMM socket.......................................6
VGA connector.......................................6, 60
Page 209
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