DDC-SE-01


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DDC-SE-01 | Manualzz

DDC-SE-01

IQRF Development Daisy Chain

Sensor kit

User's Guide

© 2011 MICRORISC s.r.o.

www.iqrf.org

MNDDCSE01_110415 Page 1

DDC-SE-01

Description

A sensor development kit for IQRF wireless applications with transceiver modules (TR) plugged in DK-EVAL-04 kit. Compatible with other DDC (Development Daisy

Chain) kits.

Ready-to-use examples are available demonstrating how to use I 2 C and Dallas 1-wire buses and A/D converter inside TR to measure temperature, voltage etc.

Applications

• Development of IQRF applications

• I 2 C and Dallas 1-wire bus demonstration

• A/D measurement demonstration

Key features

• Compatible with other IQRF DDC kits

• Supplied from DK-EVAL-04

• I 2 C temperature sensor

• I 2 C bus connector to access external peripherals

• Dallas 1-wire temperature sensor

• Light intensity measurement using a photoresistor

• Voltage measurement using a potentiometer

• Internal voltage LDO regulator

Simplified schematics

© 2011 MICRORISC s.r.o.

www.iqrf.org

MNDDCSE01_110215 Page 2

DDC-SE-01

Electrical specifications

Power supply (VDD)

Internal supply voltage (VCC)

(typical values unless otherwise stated)

3.2 V to 5.5 V DC

3 V

Supply current (when peripherals inactive)

Temperature range

650 µA

0 °C to +70 °C

Dimensions

Weight

48 mm x 27 mm x 11 mm

10 g

Absolute maximum ratings

Stresses above those values may cause permanent damage to the device. Exposure to maximum rating conditions for extended periods may affect device reliability.

Supply voltage:

Storage temperature:

6.0 V

-40 °C to +85 °C

Hardware

Power supply

DDC-SE-01 should be supplied from DK-EVAL-04 via connector XC2.

Interface connectors

The XC2 male connector with square 0.635 mm, 2.54 mm pitch pins is intended for I/Os and power supply.

Corresponding XC1 female connector serves for interconnection with other DDC kits.

XC3 is a 1.25 mm pitch miniature connector DF13C-5P (Hirose).

Mating Hirose cable connector: DF13-5S (plastic shell), DF13 crimp contacts.

Jumper JP1

In position 1 – 2 enables 1-wire sensor.

In position 2 – 3 enables I external bus.

2 C temperature sensor and I 2 C

Sensors

I 2 C temperature sensor: MCP9802A3 (Microchip) with fixed I slave address 10010110 (in binary).

External I 2 C device must have I 2

2 C

C slave address different from

10010110 (in binary).

1-wire temperature sensor: DS1820B20 (Dallas).

Photoresistor: A906013 by Perkin Elmer. Resistance 8 kΩ at 100 lux, dark resistance ~1.5 MΩ.

Refer to datasheets of used devices.

Software

Ready-to-use examples are available in the Startup package at www.iqrf.org.

© 2011 MICRORISC s.r.o.

www.iqrf.org

MNDDCSE01_110215 Page 3

Product information

Pack list

DDC-SE-01

Recommended options

DK-EVAL-04

DDC-IO-01

DDC-RE-01

DF13-5S

DF13

Ordering code

DDC-SE-01

Document history

110415

DDC sensor kit

IQRF development kit for TR modules

DDC input/output kit

DDC relay kit

Cable connector fitting to XC3

Crimp contacts for cable connector fitting to XC3

IQRF sensor DDC kit

First release

DDC-SE-01

© 2011 MICRORISC s.r.o.

www.iqrf.org

MNDDCSE01_110215 Page 4

Sales and Service

Corporate office

MICRORISC s.r.o., Delnicka 222, 506 01 Jicin, Czech Republic, EU

Tel: +420 493 538 125, Fax: +420 493 538 126, www.microrisc.com

Partners and distribution

Please visit www.iqrf.org/partners

DDC-SE-01

Quality management

ISO 9001 : 2000 certified

Complies with ETSI directives EN 30279 V.1.2.1:99, ETS 30683:97, ETSI EN 301489-1:00,

ETSI EN 300220-1:00, ETSI EN 300390-2V.1.1.1:00

Complies with FCC directives FCC CFR, Title 47, Part 15, Section 15.209, FCC CFR, Title 47, Part 15, Section 15.249

Complies with Directive 2002/95/EC (RoHS)

Trademarks

The IQRF name and logo are registered trademarks of MICRORISC s.r.o.

PIC, SPI, Microchip, RFM and all other trademarks mentioned herein are property of their respective owners.

Legal

All information contained in this publication is intended through suggestion only and may be superseded by updates without prior notice. No representation or warranty is given and no liability is assumed by MICRORISC s.r.o. with respect to the accuracy or use of such information.

Without written permission it is not allowed to copy or reproduce this information, even partially.

No licenses are conveyed, implicitly or otherwise, under any intellectual property rights.

The IQRF products utilize several patents (CZ, EU, US)

On-line support: http://iq-esupport.com

© 2011 MICRORISC s.r.o.

www.iqrf.org

MNDDCSE01_110215 Page 5

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