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COMEX-IE38 reference guide | Manualzz

COMEX-IE38

Reference Guide

Revised September 2015

Introduction

© 2015 CompuLab Ltd.

All Rights Reserved. No part of this document may be photocopied, reproduced, stored in a retrieval system, or transmitted, in any form or by any means whether, electronic, mechanical, or otherwise without the prior written permission of CompuLab Ltd..

No warranty of accuracy is given concerning the contents of the information contained in this publication. To the extent permitted by law no liability (including liability to any person by reason of negligence) will be accepted by CompuLab Ltd., its subsidiaries or employees for any direct or indirect loss or damage caused by omissions from or inaccuracies in this document.

CompuLab Ltd. reserves the right to change details in this publication without notice.

Product and company names herein may be the trademarks of their respective owners.

CompuLab

Ha-Yetzira 17, Yoqneam Illit

26290, Israel

Tel: +972 (4) 8290100 http://www.compulab.co.il

Fax: +972 (4) 8325251

COMEX-IE38 Reference Guide 2

Introduction

Table of Contents

1 INTRODUCTION .............................................................................................................. 6

1.1

About This Document ...................................................................................................... 6

1.2

COMEX-IE38 Part Number Legend ................................................................................ 6

1.3

Related Documents .......................................................................................................... 6

2 OVERVIEW ........................................................................................................................ 7

2.1

COMEX-IE38 Highlights ................................................................................................ 7

2.2

COMEX-IE38 Block Diagram ......................................................................................... 8

2.3

COMEX-IE38 Features .................................................................................................... 9

3 SYSTEM CORE ............................................................................................................... 11

3.1

CPU ................................................................................................................................ 11

3.2

System Memory ............................................................................................................. 11

3.3

On-board Storage ........................................................................................................... 11

3.4

Graphics Core................................................................................................................. 12

3.5

Display Interfaces........................................................................................................... 12

3.5.1

eDP ........................................................................................................................ 12

3.5.2

LVDS .................................................................................................................... 12

4 PERIPHERAL INTERFACES ....................................................................................... 13

4.1

PCI Express .................................................................................................................... 13

4.1.1

Additional PCIe clocks ......................................................................................... 13

4.2

USB3.0 ........................................................................................................................... 13

4.3

USB 2.0 .......................................................................................................................... 13

4.4

SATA ............................................................................................................................. 14

4.5

Gigabit Ethernet ............................................................................................................. 14

4.6

High Definition Audio (HDA) Interface ........................................................................ 14

4.7

UART ............................................................................................................................. 14

4.8

SD ................................................................................................................................... 15

4.9

SPI .................................................................................................................................. 15

4.10

LPC ............................................................................................................................ 15

4.11

GPIO .......................................................................................................................... 15

5 SYSTEM LOGIC .............................................................................................................. 16

5.1

Power Subsystem ........................................................................................................... 16

5.1.1

Power Rails ........................................................................................................... 16

5.1.2

Power-on Logic ..................................................................................................... 16

5.1.3

Power Control ....................................................................................................... 17

5.2

SPI Boot ......................................................................................................................... 17

5.3

RTC ................................................................................................................................ 17

5.4

System LEDs .................................................................................................................. 17

Revised September 2015 COMEX-IE38 Reference Guide 3

Introduction

6 CARRIER BOARD INTERFACE .................................................................................. 18

6.1

Carrier Board Connectors Pin-out .................................................................................. 18

6.2

Mating Connectors ......................................................................................................... 22

7 MECHANICAL SPECIFICATIONS ............................................................................. 23

7.1

Mechanical Drawings..................................................................................................... 23

7.2

Heat Spreader and Cooling Solutions ............................................................................ 24

8 OPERATIONAL CHARACTERISTICS ....................................................................... 25

8.1

Recommended Operating Conditions ............................................................................ 25

8.2

Operating Temperature Ranges...................................................................................... 25

Revised September 2015 COMEX-IE38 Reference Guide 4

Table 1 Document Revision Notes

Description Date

Sep 2015 First release

Please check for a newer revision of this document at the CompuLab web site http://www.compulab.co.il/ .

Introduction

Revised September 2015 COMEX-IE38 Reference Guide 5

Introduction

1

1.1

1.2

1.3

INTRODUCTION

About This Document

This document is part of a set of reference documents providing information necessary to operate and program the CompuLab COMEX-IE38 Computer-on-Module.

COMEX-IE38 Part Number Legend

Please refer to the CompuLab website ‘Ordering information’ section to decode the COMEX-IE38 part number: http://www.compulab.co.il/products/com-express/comex-ie38/#ordering .

Related Documents

For additional information, refer to the documents listed in Table 2.

Table 2 Related Documents

Document

COMEX-IE38 Developer Resources

Location http://www.compulab.com/

Revised September 2015 COMEX-IE38 Reference Guide 6

Overview

2

2.1

OVERVIEW

COMEX-IE38 Highlights

COM Express Mini Type-10

Intel BayTrail Atom E3800 and Celeron

Up to 8GB DDR3L soldered on-board

Up to 64GB on-board SSD

4x PCIe, USB3, 6x USB2, 2x SATA

Dual mode display: LVDS, eDP, DVI, HDMI, DisplayPort

Linux and MS Windows

COMEX-IE38 is a credit-card sized Computer-on-Module packed in industry-standard COM

Express Mini form factor. COMEX-IE38 is fully compliant with the COM Express standard and has been designed for seamless integration into COM Express system designs.

COMEX-IE38 is built around the Intel Atom E3800 and Celeron (Bay Trail) processor family featuring a highly scalable single/dual/quad CPU core coupled with the powerful Intel Gen 7 graphics engine. The SoC is supplemented with up-to 8GB DDR3 and 64GB of high-speed onboard SSD storage. In addition, COMEX-IE38 features a wide range of industry standard interfaces – Gigabit Ethernet, PCIe, SATA, USB3 and UARTs.

Small size and low power consumption of the COMEX-IE38 allow integration into portable and space-constrained designs, while its low price makes it an ideal selection for cost-sensitive systems.

Revised September 2015 COMEX-IE38 Reference Guide 7

2.2 COMEX-IE38 Block Diagram

Figure 1 COMEX-IE38 Block Diagram

Overview

Revised September 2015 COMEX-IE38 Reference Guide 8

Overview

2.3 COMEX-IE38 Features

The "Option" column specifies the COMEX-IE38 configuration option required for a particular feature to be populated. When a configuration option is prefixed by “not”, the particular feature is only available when the option is not populated.

"+" means that the feature is always available.

Table 3 Features and Configuration options

Feature Description

CPU

Chipset

RAM

Storage

Graphics Controller

DDI eDP

LVDS

Ethernet

Digital Audio

PCI Express

USB

Serial

General

Interfaces

GPIO

RTC

Power Management

CPU Core

Intel Atom Bay Trail E3815 64-bit single-core 1.46GHz, 5W TDP

Intel Celeron Bay Trail N2807 64-bit dual-core 1.58GHz, 4.3W TDP

Intel Celeron Bay Trail J1900 64-bit quad-core 2GHz, 10W TDP

Intel Atom Bay Trail E3845 64-bit quad-core 1.91GHz, 10W TDP

Integrated in SoC

Memory and Storage

Up to 8GB DDR3L-1333 (soldered onboard)

Up-to 2x SATA 3Gb/s

On-board SSD, 8GB - 64GB, MLC, via SATA interface

* precludes one of the SATA ports

Display

Intel® HD Graphics Gen 7

Dual display mode supported

DDI0: HDMI / DVI / DP / DP++, up-to 2560 x 1600 eDP v1.3 up to 2560 x 1600

Single-channel LVDS

* precludes eDP port

Network

1000Base-T Ethernet port implemented with Intel I211 GbE controller

* precludes one PCIe port

Audio

HD Audio Interface

Dual HDMI audio output

I/O

Up-to 4 x PCI Express x1 ports

1x USB3.0 (incl. USB2.0)

6x USB2.0

1x UART

LPC Bus

SMBus

Watch Dog Timer

FAN control

8 GPIO signals

System Logic

Real time clock, powered from the carrier board

ACPI 5 .0 compliant, Smart Battery Management

Option

CE3815

CN2807

CJ1900

CE3845

+

D

+

NS

+

+ not L

L

E

+

+

+

+

+

+

+

+

+

+

Revised September 2015 COMEX-IE38 Reference Guide 9

Table 4 Electrical, Mechanical and Environmental Specifications

Supply Voltage

Digital I/O voltage

Form-factor

Dimensions

Weight

MTTF

Operation temperature (case)

Storage temperature

Relative humidity

Shock

Vibration

Electrical Specifications

4.7V – 20V

3.3V

Mechanical Specifications

COM Express Mini, pin-out Type 10

84 x 55 mm

35 gram

Environmental and Reliability

> 100,000 hours

Commercial: 0° to 70° C

Extended: -20° to 70° C

Industrial: -40° to 85° C

-40° to 85° C

10% to 90% (operation)

05% to 95% (storage)

50G / 20 ms

20G / 0 - 600 Hz

Overview

Revised September 2015 COMEX-IE38 Reference Guide 10

System Core

3 SYSTEM CORE

3.1 CPU

COMEX-IE38 supports Intel Atom and Celeron Bay Trail CPUs.

Intel Bay Trail SoC supports the following key features:

Advanced 22-nm process technology

Up to four IA-compatible low power Intel x86 processor cores

One thread per core

Up to 2MB L2 cache

INTEL 64 architecture

Advanced Branch Prediction

Out-of-Order Instruction Execution

64-bit floating-point unit

SSE4.1,SSE4.2, AES,AES-NI,AVX

Intel Carry-Less Multiplication Instruction (PCLMULQDQ)

Digital Random Number Generator (DRNG)

Intel Virtualization technology (Intel VT-x)

3.2

3.3

System Memory

COMEX-IE38 features up to 8GB of dual-channel non-ECC DDR3L-1333 soldered on-board memory. The table below summarizes supported CPU and DDR combination:

Table 5 Supported Memory Configurations

CPU configuration

CE3815

CN2807

CE3845

CJ1900

Channels Supported

1

2

2

2

Max. Speed

DDR3L-1067

DDR3L-1333

DDR3L-1333

DDR3L-1333

Max. Memory Size

2GB

4GB

8GB

8GB

On-board Storage

COMEX-IE38 features up to 64GB of on-board MLC SSD storage with build-in hardware ECC achieving up to 300MB/s sequential read and 160MB/s sequential write. The on-board SSD resides on the SATA0 interface.

NOTE: When on-board SSD is populated, SATA0 interface is not available on the COM

Express connector.

Revised September 2015 COMEX-IE38 Reference Guide 11

3.4

3.5

3.5.1

3.5.2

System Core

Graphics Core

Intel Bay Trail SoC integrated GPU supports the following key features:

Intel’s 7 th

generation (Gen7) graphics and media encode/decode engine

VED video decoder in addition to Gen 7 Media decoder

DirectX 11

OpenCL 1.2

OpenGL 3.0

OpenGLES 2.0

GPU shader up to 8 gigaflops

4x anti-aliasing

Full HW acceleration for decode H.264,JPEG,MJPEG,MPEG2,VC-1,WMV9

Full HW acceleration for encode H.264

Polyphase 8 tap scaling

HD HQV

Display Interfaces

COMEX-IE38 supports two simultaneous display interfaces – one as DDI port and second available in 2 configurations: eDP or LVDS (option “L”).

Table 6 Display Interfaces Maximum Resolution

Interface

HDMI / DVI eDP

LVDS

Max. Resolution

1920x1200@60Hz

2560x1600@60Hz

1400x1050@60Hz

eDP

COMEX-IE38 supports eDP1.3 with resolutions of up to 3840x2160 @ 60Hz.

NOTE: eDP is only available without the ‘L’ configuration option.

LVDS

The optional LVDS interface is implemented with an eDP to LVDS bridge. COMEX-IE38 supports single channel LVDS which can be configured for 18 or 24 bpp operation.

NOTE: LVDS is only available with the ‘L’ configuration option.

Revised September 2015 COMEX-IE38 Reference Guide 12

Peripheral Interfaces

4 PERIPHERAL INTERFACES

4.1

4.1.1

4.2

4.3

PCI Express

COMEX-IE38 incorporates up to 4 PCIe x1 Gen2 ports [0..3].

NOTE: PCIe port #3 is available only without the ‘E’ configuration option.

Additional PCIe clocks

COMEX-IE38 provides two additional PCIe clocks for external PCIe devices saving additional clock buffers on the customer’s carrier-board:

Table 7 Additional PCIe Clock Signals

PU/PD/Plane Pin Name

CLK_PCIE_P1

CLK_PCIE_N1

CLK_PCIE_P2

CLK_PCIE_N2

Pin #

B55

B56

B52

B53

PCIE CLOCK 2

PCIE CLOCK 3

USB3.0

COMEX-IE38 features one USB3.0 interface which supports SuperSpeed, High-speed and Fullspeed/Low-speed connections. USB3.0 port should be paired with the USB2.0 SoC port#0.

USB 2.0

The COMEX-IE38 features seven USB2.0 interfaces on the COM Express connectors:

Three interfaces are routed directly from the SoC to the COM Express connector

Four USB2.0 interfaces are implemented with a USB hub

The table below summarizes USB2.0 mappings:

Table 8 USB2.0 Port Mappings

COMEX-IE38 port number port #0 port #1 port #2 port #3 port #4 port #5 port #6

USB port source

SoC port0

SoC port1

USB hub port1

USB hub port2

USB hub port3

USB hub port4

SoC port2

Revised September 2015 COMEX-IE38 Reference Guide 13

4.4

4.5

4.6

4.7

Peripheral Interfaces

SATA

COMEX-IE38 supports up to two SATA interfaces via the SATA host controller integrated in the Intel Bay Trail SoC. The controller supports independent DMA operation and data transfer rates of 1.5 Gb/s and 3.0 Gb/s. It also supports two modes of operation - a legacy mode and

AHCI mode. Software that uses legacy mode will not have AHCI capabilities.

NOTE: When on-board SSD is populated, SATA0 interface is not available on the COM

Express connector.

Gigabit Ethernet

COMEX-IE38 Gigabit Ethernet interface is implemented with the I211 Intel Gigabit Ethernet controller. The controller is connected to the PCIe port #3.

The COMEX-IE38 Gigabit Ethernet port support the following key features:

PCIe v2.1 (2.5GT/s) x1

Jumbo frames

802.1q Double VLAN support

IEEE 1588

Crossover Detection and Auto-Correction

Wake-on-LAN and remote wake-up support

Auto-negotiation

Activity and speed indicator LED controls

NOTE: PCIe port #3 is available only without the ‘E’ configuration option.

High Definition Audio (HDA) Interface

COMEX-IE38 features Intel HD Audio signals with support up to two CODECs.

UART

COMEX-IE38 supports one UART interface implemented with the internal Bay Trail SoC

UART controller.

Revised September 2015 COMEX-IE38 Reference Guide 14

4.8

Peripheral Interfaces

SD

COMEX-IE38 supports one SD card interface implemented with the internal Bay Trail SoC SD controller. The SD interface support the following key features:

SD card 3.0 Bus interface

Up to 400 Mbits per second

Support for UHS-I modes: HS, DDR50 and SD12/25

Support for CRC7 for command and CRC16 for data integrity

IEEE 1588

COMEX-IE38 supports boot from SD card in DOS, Linux and MS Windows 8.x.

4.9 SPI

COMEX-IE38 SPI interface can used for booting from external SPI flash. For additional details

please refer to section 5.2.

4.10 LPC

COMEX-IE38 supports LPC (Low Pin Count) bus. The LPC bus can be used for implementing

I/O extensions such as additional Super I/O or TPM devices on an application specific carrier board. LPC bus operates at 33MHz with Atom SoCs and at 25MHz with Celeron SoCs.

4.11 GPIO

COMEX-IE38 provides eight GPIO signals multiplexed with the SD interface.

GPIO signals can be configured as input or output (GPI or GPO). All of the GPIO signals are

SoC GPIO pins.

Table 9 GPIO Signals Details

Pin Name

GPI0

GPI1

GPI2

GPI3

GPO0

GPO1

GPO2

GPO3

Pin #

A54

A63

A67

A85

A93

B54

B57

B63

Default Function

SD_DATA0

SD_DATA1

SD_DATA2

SD_DATA3

SD_CLK

SD_CMD

SD_WP

SD_CD#

PU/PD/Plane

PU 20k (S0)

PU 20k (S0)

PU 20k (S0)

PU 20k (S0)

20k PD

PU 20k (S0)

PU 10k (S5)

PU 10k (S5)

Revised September 2015 COMEX-IE38 Reference Guide 15

System Logic

5 SYSTEM LOGIC

5.1

5.1.1

5.1.2

Power Subsystem

Power Rails

COMEX-IE38 has multiple power supply options:

+5VSBY is always available and +VCC is supplied through S3. All working states provided by COMEX-IE38 are supported with this configuration (S0/S3/S5).

Single + VCC is always available. All working states provided by COMEX-IE38 are supported with this configuration (S0/S3/S5).

Single + VCC is supplied through S0. In this case only S0 state is supported.

Table 10 Power Rails Requirements

Power Rail

+VCC

+5VSBY

Voltage Range

(Volt)

4.75-20

4.75 – 5.25

Nominal Voltage

(Volt)

12

5

Max Input Ripple

(mV)

100

50

Power-on Logic

COMEX-IE38 is designed to support standard PC power-on logic. The COMEX-IE83 BIOS can be configured (using the “State after G3” menu) for the following power-on behavior:

S5 - Stay off

S3 - Turn on automatically

Revised September 2015 COMEX-IE38 Reference Guide 16

5.1.3

5.2

5.3

5.4

System Logic

Power Control

The power control signals of the COMEX-IE38, available for the carrier board, include:

PWRBTN# / SLEEP# (Module Input): The power button signal is an ACPI standard. It has a 16 milliseconds de-bounce circuit at the PCH, and may initiate a power event, depending on the software. At any power state, if PWRBTN# is held low for at least four seconds, the system should be immediately powered off (G2/S5 state).

SYS_RESET# (Module Input): The system reset signal has a 16 milliseconds de-bounce circuit at the PCH. At falling edge of SYS_RESET#, after de-bouncing, the system should wait up to 25 milliseconds for the SMBus to go idle, and then initiate a system reset.

CB_RESET# (Module Output): The Carrier Board reset signal originates from the

PCH, and generates a reset for all the subsystems on the module. It is asserted at

PWR_OK low input, at a watchdog timeout, after a SYS_RESET# event, or by the software.

PWR_OK (Module Input): The power OK signal indicates to the module that the main power supply is within specification. It can be held low by the carrier board in order to delay the startup of the module. After pulled up by the carrier, PWR_OK must be left up as long as the main power supply is within specification.

SUS_STAT# (Module Output): The suspend status signals indicates peripheral devices that the system should switch into a sleep mode, at least 210 microseconds later.

WAKE0# (Module Input): The wake signals are indicates the PCH that a PCIe Device generated a wake event. Upon a falling edge, the system should wake up to S0 operation mode.

SPI Boot

The COMEX-IE38 SPI bus can used in order to boot from an external SPI flash device.

When BIOS_DIS1# pin is pulled to GND, external SPI Flash device is selected as boot source.

When BIOS_DIS1# is pulled-up or left unconnected, COMEX-IE38 will boot from the onboard

SPI flash.

RTC

COMEX-IE38 features an RTC with internal CMOS memory backed up by an external battery via the +VRTC pin on the COM Express connector:

Table 11 RTC Power Rail

Power Rail

+VRTC

Voltage Range

(Volt)

2.0-3.2

Nominal Voltage

(Volt)

3.0

COMEX-IE38 may operate in RTC-less mode (without battery back-up), saving all main parameters in the BIOS SPI flash. Date and time information is not saved in this mode.

System LEDs

COMEX-IE38 features two on-board LED indicators with the following behavior:

Green- The system is in the ON state

Red - SATA activity LED

Revised September 2015 COMEX-IE38 Reference Guide 17

Carrier Board Interface

6 CARRIER BOARD INTERFACE

6.1 Carrier Board Connectors Pin-out

The COMEX-IE38 connects to a carrier board with 2x110 pin connector. The pin numbering is divided to two groups: A, B, where each pin number starts with the letter of the row it's in.

The pin-out of the connectors is compatible to type 10 COM Express specifications.

Each described signal can be one of the following types. Signal type is noted in the “Signal description” tables. Multifunctional pin direction, pull resistor and open drain functionality

may be software controlled. The “Type” column header for multifunctional pins refers to

the recommended pin configuration with regards to the discussed signal.

“I” – Digital Input

"O" – Digital Output

“IO” – Digital Input/Output

"PU33SPI" – Always pulled up to 3.3V SPI power rail.

"PU33" – Always pulled up to 3.3V on-board COMEX-IE38

"PD" - Always pulled down on-board COMEX-IE38

"NC" – Connector Pin is Not Connected

"PI" – Power input pin ( to COMEX-IE38)

"PO" – Power output pin ( from COMEX-IE38)

“G” – Ground pint

Table 12 COMEX-IE38 Carrier Board Connectors Signals

Pin

A22

A23

A24

A25

A26

A27

A14

A15

A16

A17

A18

A19

A20

A21

A7

A8

A9

A10

A11

A12

A13

A1

A2

A3

A4

A5

A6

Signal Name

GND

LAN_MDIN3

LAN_MDIP3

LINK_100_LAN

LINK_1000_LAN

LAN_MDIN2

LAN_MDIP2

LINK_ACT_LAN

LAN_MDIN1

LAN_MDIP1

GND

LAN_MDIN0

LAN_MDIP0

NC

SLP_S3#

SATA_TXP0

SATA_TXN0

SLP_S4#

SATA_RXP0

SATA_RXN0

GND

USB3_RXN0

USB3_RXP0

SLP_S5#

NC

NC

NC

Type

O

O

O

O

I

I

G

O

O

O

IO

O

IO

IO

G

IO

IO

G

IO

IO

O

O

IO

Description / Standard

GND (FIXED)

GBE0_MDI3-

GBE0_MDI3+

GBE0_LINK100#

GBE0_LINK1000#

GBE0_MDI2-

GBE0_MDI2+

GBE0_LINK#

GBE0_MDI1-

GBE0_MDI1+

GND (FIXED)

GBE0_MDI0-

GBE0_MDI0+

GBE0_CTREF

SUS_S3#

SATA0_TX+

SATA0_TX-

SUS_S4#

SATA0_RX+

SATA0_RX-

GND (FIXED)

USB_SSRX0-

USB_SSRX0+

SUS_S5#

USB_SSRX1-

USB_SSRX1+

BATLOW#

Comments / Availability

10k PU (S5) PU33

AC coupled on module

AC coupled on module

Suspend to disk, 10k PU (S5) PU33

AC coupled on module

AC coupled on module

AC coupled off module

AC coupled off module

Tied together with SLP_S4# (A18)

Revised September 2015 COMEX-IE38 Reference Guide 18

Signal Name

SATA_LED#

HDA_SYNC

HDA_RST#

GND

HDA_BITCLK

HDA_SDO

BIOS_DIS0#

NC

USB_PN2

USB_PP2

USB1_OC#

SDIO_D2

PCIE_TXP0

PCIE_TXN0

GND

EDP_P2_A0+

EDP_N2_A0-

EDP_P1_A1+

EDP_N1_A1-

EDP_P0_A2+

EDP_N0_A2-

EDP_LVDS_VDDEN

LVDS_A3+

LVDS_A3-

GND

EDP_P3_CK+

EDP_N3_CK-

EDP_AUXP_I2C_CK

EDP_AUXN_I2C_DAT

SDIO_D3

DEBUG#

EDP_HPD

CLK_PCIE_P0

CLK_PCIE_N0

GND

+V3.3A_SPI

SPI_MISO

SDIO_CLK

USBH_PN3

USBH_PP3

GND

USBH_PN1

USBH_PP1

OC#1_2_HB

USB_PN0

USB_PP0

+VRTC

NC

NC

LPC_SERIRQ#

GND

NC

NC

SDIO_D0/GPIO

NC

NC

GND

PCIE_TXP3

PCIE_TXN3

GND

PCIE_TXP2

PCIE_TXN2

SDIO_D1

PCIE_TXP1

PCIE_TXN1

GND

Pin

A28

A29

A30

A31

A32

A33

A34

A35

A36

A37

A38

A81

A82

A83

A84

A85

A86

A87

A88

A89

A90

A91

A92

A93

A74

A75

A76

A77

A78

A79

A80

A67

A68

A69

A70

A71

A72

A73

A60

A61

A62

A63

A64

A65

A66

A52

A53

A54

A55

A56

A57

A58

A59

A45

A46

A47

A48

A49

A50

A51

A39

A40

A41

A42

A43

A44

Revised September 2015

Carrier Board Interface

Type

O

O

O

G

O

O

I

IO

IO

I

O

G

PO

I

IO

IO

I

I

O

O

O

O

IO

O

O

G

O

O

O

O

IO

O

O

G

O

O

O

G

O

O

IO

O

O

G

G

O

O

IO

IO

IO

PI

I

G

IO

IO

G

IO

IO

I

Description / Standard

ATA_ACT#

AC_SYNC

AC_RST#

GND (FIXED)

AC_BITCLK

AC_SDOUT

BIOS_DIS0#

THRMTRIP#

USB6-

USB6+

USB_6_7_OC#

GPI2/SD_D2

PCIE_TX0+

PCIE_TX0-

GND (FIXED)

LVDS_A0+

LVDS_A0-

LVDS_A1+

LVDS_A1-

LVDS_A2+

LVDS_A2-

LVDS_VDD_EN

LVDS_A3+

LVDS_A3-

GND (FIXED)

LVDS_A_CK+

LVDS_A_CK-

LVDS_I2C_CK

LVDS_I2C_DAT

GPI3/SD_D3

RSRVD eDP_HPD

PCIE0_CK_REF+

PCIE0_CK_REF-

GND (FIXED)

SPI_POWER

SPI_MISO

GPO0/SD_CLK

USB4-

USB4+

GND (FIXED)

USB2-

USB2+

USB_2_3_OC#

USB0-

USB0+

VCC_RTC

EXCD0_PERST#

EXCD0_CPPE#

LPC_SERIRQ

GND (FIXED)

RSRVD

RSRVD

GPI0/SD_D0

RSRVD

RSRVD

GND

PCIE_TX3+

PCIE_TX3-

GND (FIXED)

PCIE_TX2+

PCIE_TX2-

GPI1/SD_D1

PCIE_TX1+

PCIE_TX1-

GND

Comments / Availability

10k PU (S0) PU33

20k PD (SOC)

20k PD (SOC)

20k PD (SOC)

20k PD (SOC)

10k PU (S5) PU33SPI

SOC USB port #2

OC for USB port #2 and #3, 10K PU

(S5) PU33

SOC USB2 port #3

USB hub port #1

OC for USB hub port #1 and #2

SOC USB port 0

External RTC power rail

10k PU (S5)

20k PU (S0)

AC coupled on module

AC coupled on module

AC coupled on module

AC coupled on module

20k PU (S0)

AC coupled on module

AC coupled on module

20k PU (S0)

AC coupled on module

AC coupled on module eDP_P2/LVDS_A0+ eDP_N2/LVDS_A0- eDP_P1/LVDS_A1+ eDP_N1/LVDS_A1- eDP_P0/LVDS_A2+ eDP_N0/LVDS_A2- eDP_P3/LVDS_CK+ eDP_N3/LVDS_CK-

2.2k PU (S0) (LVDS)

2.2k PU (S0) (LVDS)

20k PU (S0)

Do not connect

100k PD

20k PD(S0)

COMEX-IE38 Reference Guide 19

Pin

B34

B35

B36

B37

B38

B39

B40

B26

B27

B28

B29

B30

B31

B32

B33

B41

B42

B43

B44

B19

B20

B21

B22

B23

B24

B25

B12

B13

B14

B15

B16

B17

B18

B4

B5

B6

B7

B8

B9

B10

B11

A107

A108

A109

A110

B1

B2

B3

A94

A95

A96

A97

A98

A99

A100

A101

A102

A103

A104

A105

A106

B45

B46

B47

B48

B49

Revised September 2015

Signal Name

PWRBTN#

SMB_CLK

SMB_DATA

SMB_ALRT#

SATA_TXP1

SATA_TXN1

LPCPD#

SATA_RXP1

SATA_RXN1

GND

USB3_TXN0

USB3_TXP0

PWR_OK_IN

NC

NC

WDO

NC

HDA_SDIN1

HDA_SDIN0

GND

HDA_SPKR

I2C0_SCL_3.3V

I2C0_SDA_3.3V

NC

NC

NC

OC#3_4_HB

USBH_PN4

USBH_PP4

GND

USBH_PN2

USBH_PP2

USB0_OC#

SPI_CLK

SPI_MOSI

NC

TYPE10

COM0_TX

COM0_RX

GND

NC

NC

NC

+VCC

+VCC

+VCC

+VCC

+VCC

+VCC

GND

GND

LINK_ACT#

LPC_FRAME#

LPC_AD0

LPC_AD1

LPC_AD2

LPC_AD3

NC

NC

LPC_CLK

GND

USB_PN1

USB_PP1

NC

NC

SYS_RESET#

COMEX-IE38 Reference Guide

Carrier Board Interface

Type

IO

I

IO

IO

G

IO

IO

I

I

G

O

IO

O

I

O

I

I

I

G

O

I

O

IO

I

O

O

O

O

G

IO

IO

IO

IO

PI

PI

PI

G

G

O

IO

G

PI

PI

PI

O

O

IO

O

I

IO

IO

I

Description / Standard

PWRBTN#

SMB_CK

SMB_DAT

SMB_ALERT#

SATA1_TX+

SATA1_TX-

SUS_STAT#

SATA1_RX+

SATA1_RX-

GND (FIXED)

USB_SSTX0-

USB_SSTX0+

PWR_OK

USB_SSTX1-

USB_SSTX1+

WDT

AC_SDIN2

AC_SDIN1

AC_SDIN0

GND (FIXED)

SPKR

I2C_CK

I2C_DAT

THRM#

USB7-

USB7+

USB_4_5_OC#

USB5-

USB5+

GND (FIXED)

USB3-

USB3+

USB_0_1_OC#

SPI_CLK

SPI_MOSI

TPM_PP

TYPE10#

SER0_TX

SER0_RX

GND (FIXED)

SER1_TX

SER1_RX

LID#

VCC_12V

VCC_12V

VCC_12V

VCC_12V

VCC_12V

VCC_12V

GND (FIXED)

GND (FIXED)

GBE0_ACT#

LPC_FRAME#

LPC_AD0

LPC_AD1

LPC_AD2

LPC_AD3

LPC_DRQ0#

LPC_DRQ1#

LPC_CLK

GND (FIXED)

USB1-

USB1+

EXCD1_PERST#

EXCD1_CPPE#

SYS_RESET#

Comments / Availability

49.9k PD

12V tolerant, 10k PD

12V tolerant

4.75-20V Typical

4.75-20V Typical

4.75-20V Typical

4.75-20V Typical

4.75-20V Typical

4.75-20V Typical

Connected to GBE0_LINK#

20k PU (S0)

20k PU (S0)

20k PU (S0)

20k PU (S0)

20k PU (S0)

33MHz clock, 20k PD (S0)

10k PU (S5)

10k PU (S5)

10k PU (S5)

10k PU (S5)

AC coupled on module

AC coupled on module

10k PU (S5)

AC coupled on module

AC coupled on module

AC coupled on module

AC coupled on module

10-30k PU (S5)

TBD

20k PD (SOC)

20k PD (SOC)

10k PU (S0)

2.2k PU (S5)

2.2k PU (S5)

OC for USB hub port #3 and #4

USB hub port #4

USB hub port #2

OC for USB ports #0 and #1, 10k PU

(S5)

SOC USB2 port #1

10k PU (S5)

20

Signal Name

NC

EDP_LVDS_BKEN

GND

DDI0_LANE3_P

DDI0_LANE3_N

EDP_LVDS_BKCTL

+V5SBY

+V5SBY

+V5SBY

+V5SBY

BIOS_DIS1#

DDIO_HPDET

GND

NC

NC

NC

NC

DDI0_DDC_AUX_SEL

NC

SPI_CS0#

DDI0_CLK_AUXP

DDI0_DAT_AUXM

GND

FAN_PWM_CONN

FAN_TACH_IN

NC

+VCC

+VCC

+VCC

+VCC

+VCC

+VCC

GND

PLT_RST#

GND

CLK_PCIE_P2

CLK_PCIE_N2

SDIO_CMD

CLK_PCIE_P1

CLK_PCIE_N1

SDIO_WP

PCIE_RXP3_OUT

PCIE_RXN3_OUT

GND

PCIE_RXP2

PCIE_RXN2

SDIO_CD#

PCIE_RXP1

PCIE_RXN1

PCIE_WAKE#

NC

PCIE_RXP0

PCIE_RXN0

GND

DDI0_LANE0_P

DDI0_LANE0_N

DDI0_LANE1_P

DDI0_LANE1_N

DDI0_LANE2_P

DDI0_LANE2_N

NC

Pin

B100

B101

B102

B103

B104

B105

B106

B92

B93

B94

B95

B96

B97

B98

B99

B107

B108

B109

B110

B85

B86

B87

B88

B89

B90

B91

B78

B79

B80

B81

B82

B83

B84

B70

B71

B72

B73

B74

B75

B76

B77

B63

B64

B65

B66

B67

B68

B69

B56

B57

B58

B59

B60

B61

B62

B50

B51

B52

B53

B54

B55

Description / Standard

DDI0_PAIR4-

LVDS_BKLT_EN

GND (FIXED)

DDI0_PAIR3+

DDI0_PAIR3-

LVDS_BKLT_CTRL

VCC_5V_SBY

VCC_5V_SBY

VCC_5V_SBY

VCC_5V_SBY

BIOS_DIS1#

DDI0_HPD

GND (FIXED)

DDI0_PAIR5+

DDI0_PAIR5-

DDI0_PAIR6+

DDI0_PAIR6-

DDI0_DDC_AUX_SEL

USB_HOST_PRSNT

SPI_CS#

DDI0_CTRLCLK_AUX+

DDI0_CTRLDAT_AUX-

GND (FIXED)

FAN_PWMOUT

FAN_TACHIN

SLEEP#

VCC_12V

VCC_12V

VCC_12V

VCC_12V

VCC_12V

VCC_12V

GND (FIXED)

CB_RESET#

GND (FIXED)

RSRVD

RSRVD

GPO1/SD_CMD

RSRVD

RSRVD

GPO2/SD_WP

PCIE_RX3+

PCIE_RX3-

GND (FIXED)

PCIE_RX2+

PCIE_RX2-

GPO3/SD_CD

PCIE_RX1+

PCIE_RX1-

WAKE0#

WAKE1#

PCIE_RX0+

PCIE_RX0-

GND (FIXED)

DDI0_PAIR0+

DDI0_PAIR0-

DDI0_PAIR1+

DDI0_PAIR1-

DDI0_PAIR2+

DDI0_PAIR2-

DDI0_PAIR4+

Type

G

O

I

PI

PI

PI

PI

PI

PI

G

O

IO

IO

IO

PI

PI

PI

I

I

G

O

G

O

O

O

PI

O

O

O

G

O

O

O

I

I

IO

I

I

I

O

IO

I

I

G

I

I

O

G

O

O

IO

O

Carrier Board Interface

Comments / Availability

10k PU (S0)

Additional PCIe clock

20k PU (S0)

Additional PCIe clock

10k PU (S5)

10k PU (S5)

10k PU (S5)

DDI0 differential pairs [2:0] eDP/LVDS Backlight enable

DDI0 differential pair 3 eDP/LVDS Backlight control

10k PU (S5) PU33SPI

100k PD

1M PD

100k PD

100k PU (S0)

12V tolerant, 10k PD

12V tolerant

4.75-20V range

4.75-20V range

4.75-20V range

4.75-20V range

4.75-20V range

4.75-20V range

Revised September 2015 COMEX-IE38 Reference Guide 21

6.2

Carrier Board Interface

Mating Connectors

COMEX-IE38 should be connected to a carrier board using one 110x2 pins, 0.5mm pitch connector. The connector on the carrier board should be Foxconn QT002206-2141-3H for 5mm stack, Foxconn QT002206-4131-3H for 8mm stack, or other compatible connectors.

Revised September 2015 COMEX-IE38 Reference Guide 22

7

7.1

MECHANICAL SPECIFICATIONS

Mechanical Drawings

Figure 2 COMEX-IE38 Top Side

Mechanical Specifications

Figure 3 COMEX-IE38 Bottom Side

All dimensions are in millimeters. The tolerances are ± 0.1mm.

Board thickness is 1.6mm. The drawing is intended for reference uses only.

3D models and detailed mechanical drawings are available at http://www.compulab.co.il/products/com-express/comex-ie38/#devres

Revised September 2015 COMEX-IE38 Reference Guide 23

7.2

Mechanical Specifications

Heat Spreader and Cooling Solutions

CompuLab provides COMEX-IE38 with a dedicated heat-spreader assembly. The COMEX-

IE38 heat-spreader has been designed to act as a thermal interface and should be used in conjunction with a heat-sink or an external cooling solution.

External cooling must be provided to maintain the heat-spreader at proper operating temperatures. The cooling solution must ensure that under worst-case conditions the temperature on any spot of the heat-spreader surface is maintained according to the COMEX-IE38 temperature specifications.

Various thermal management solutions can be used with the heat-spreader, including active and passive approaches.

Reference cooling solutions are provided by CompuLab.

Documentation and CAD drawings for the COMEX-IE38 heat-spreader and cooling solutions are provided at http://www.compulab.co.il/products/com-express/comex-ie38/#devres .

Revised September 2015 COMEX-IE38 Reference Guide 24

Operational Characteristics

8 OPERATIONAL CHARACTERISTICS

8.1

8.2

Recommended Operating Conditions

Table 13 Recommended Operating Conditions

Power Rail

+VCC

+5VSBY

+VRTC

Min. Typ. Max.

4.75

4.75

2.0

12

5.0

3.0

20.0

5.25

3.3

Unit

V

V

V

Operating Temperature Ranges

Table 14 Operating Temperature Ranges

Range

Commercial

Extended

Industrial

Temp. Description

0 to 70 C

Sample boards from each batch are tested for the lower and upper temperature limits. Individual boards are not tested.

-20o to 70o C Every board undergoes a short test for the lower limit (-20o C) qualification.

-40 to 85 C

Every board is extensively tested for both lower and upper limits and at several midpoints.

Revised September 2015 COMEX-IE38 Reference Guide 25

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