Freescale Semiconductor
Product Brief
Document Number: MPC8569EPB
Rev. 0, 02/2009
MPC8569E PowerQUICC™ III
Integrated Processor
Product Brief
This document provides an overview of the features and
functionality of the MPC8569E PowerQUICC™ III
integrated communications processor. This device
combines an e500 processor core built on Power
Architecture™ technology with system logic required
for networking, wireless infrastructure, and
telecommunications applications.
The MPC8569E offers an excellent combination of
protocol and interface support, including a
high-performance CPU with large L2 cache, one 64-bit
or two 32-bit DDR2/DDR3 memory controllers, SGMII,
serial RapidIO™, USB 2.0, and PCI Express®. These
features allow the replacement of separate control and
data path processors with a single chip. The MPC8569E
also incorporates the new QUICC Engine™ block with
four RISC processors, which provide termination,
interworking, and switching between a wide range of
communication protocols, including ATM, Ethernet,
POS, and HDLC. The QUICC Engine block’s enhanced
interworking eases the transition from ATM to IP-based
© Freescale Semiconductor, Inc., 2009. All rights reserved.
Contents
1
2
3
4
5
MPC8569E Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.1 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
1.2 Critical Performance Parameters . . . . . . . . . . . . . . 3
1.3 Chip-Level Features . . . . . . . . . . . . . . . . . . . . . . . . 3
MPC8569E Application Examples . . . . . . . . . . . . . . . . . . 5
2.1 Base Station Network Interface Card . . . . . . . . . . . 5
2.2 UMTS Channel Card . . . . . . . . . . . . . . . . . . . . . . . . 7
MPC8569E Architecture Overview . . . . . . . . . . . . . . . . . . 8
3.1 e500v2 Core and Memory Unit . . . . . . . . . . . . . . . . 8
3.2 e500 Coherency Module (ECM) and Address Map. 8
3.3 QUICC Engine Block. . . . . . . . . . . . . . . . . . . . . . . . 9
3.4 Integrated Security Engine (SEC) . . . . . . . . . . . . . . 9
3.5 DDR SDRAM Controllers . . . . . . . . . . . . . . . . . . . 10
3.6 High Speed I/O Interfaces . . . . . . . . . . . . . . . . . . . 11
3.7 Programmable Interrupt Controller (PIC). . . . . . . . 12
3.8 DMA, I2C, DUART, and Enhanced Local Bus
Controller12
3.9 Device Boot Locations. . . . . . . . . . . . . . . . . . . . . . 13
3.10 Power Management . . . . . . . . . . . . . . . . . . . . . . . 13
3.11 System Performance Monitor . . . . . . . . . . . . . . . . 13
Development Environment . . . . . . . . . . . . . . . . . . . . . . . 14
4.1 Software Development Tools . . . . . . . . . . . . . . . . 14
4.2 Modular Development System (MDS). . . . . . . . . . 14
4.3 Modular Software Building Blocks . . . . . . . . . . . . . 14
Document Revision History. . . . . . . . . . . . . . . . . . . . . . . 15
MPC8569E Overview
systems and reduces investment costs. The MPC8569E also supports the IEEE 1588™ precision time
protocol for network synchronization over Ethernet.
1
MPC8569E Overview
This section describes the features of the MPC8569E.
1.1
Block Diagram
Figure 1 shows the major functional units within the MPC8569E.
e500v2 Core
MPC8569E
Performance
Monitor
DUART
2x I2C
32-Kbyte
I-Cache
Enhanced
Local
Bus
Security
Engine
OpenPIC
32-Kbyte
D-Cache
e500
Coherency
Module
Four 32-bit RISCs
Baud Rate
Generators
256 K
IRAM
1 64-bit or 2 32-bit
DDR2/DDR3
Controller(s)
2 GMII/TBI
QUICC Engine™ Block
Accelerators
512-Kbyte
L2
Cache
Serial DMA
128 K
MURAM
Interrupt
Controller
4-Channel DMA
Communications Interfaces
Up To
16 T1/E1
UTOPIA/
POS-PHY L2
8 MII/RMII
2 SMII
PCI Express
Serial RapidIO
Serial RapidIO
SGMII
2 GMII/TBI
2 SGMII
Four-Lane SerDes
Time Slot Assigner
On-Chip Network
USB
Eth Mgmt
SPI
UCC8
UCC7
UCC6
UCC5
UCC4
UCC3
UCC2
UCC1
MCC2
MCC1
RIO Msg Unit
SGMII
4 RGMII/RTBI
Figure 1. MPC8569E Block Diagram
MPC8569E PowerQUICC™ III Integrated Processor Product Brief, Rev. 0
2
Freescale Semiconductor
MPC8569E Overview
1.2
Critical Performance Parameters
The critical performance parameters for the MPC8569E are as follows:
• e500v2 core frequency of 1.33 GHz
• Power consumption of less than 7 W at 800 MHz core speed
• 45-nm SOI process technology
• Data rate of up to 800 Mbps/pin for DDR2 and DDR3
• Maximum QUICC Engine frequency of 667 MHz
• Supply voltages:
— Core: 1.0 V
— PCI Express, serial RapidIO: 1.0 V
— Ethernet: 3.3 or 2.5 V (subject to protocol)
— Local bus: 3.3, 2.5, or 1.8 V
— DDR: 1.8 V for DDR2, 1.5 V for DDR3 (conforms to JEDEC standard)
• Operating junction temperature (Tj) range: 0–105°C
• Package: 783-pin, flip-chip PBGA
1.3
Chip-Level Features
Key features of the MPC8569E include:
• High-performance Power Architecture e500v2 core
— 36-bit physical addressing
— Double-precision floating-point support
• 32-Kbyte L1 instruction cache and 32-Kbyte L1 data cache
• 512-Kbyte L2 cache with ECC
• QUICC Engine block
— Four RISC processors
— Supports Ethernet, ATM, POS, and T1/E1 along with associated interworking
– Four Gigabit Ethernet interfaces (up to two with SGMII)
– Up to eight 10/100-Mbps Ethernet interfaces
– Up to 16 T1/E1 TDM links (512 × 64 channels)
– Multi-PHY UTOPIA/POS-PHY L2 interface (16-bit)
— IEEE 1588 v2 support
— SPI and Ethernet PHY management interface
— Full-speed USB 2.0 interface
— General-purpose I/O signals
• Integrated security engine
— Protocol support includes ARC4, 3DES, AES, RSA/ECC, RNG, Single-pass SSL/TLS,
Kasumi, SNOW, XOR acceleration
MPC8569E PowerQUICC™ III Integrated Processor Product Brief, Rev. 0
Freescale Semiconductor
3
MPC8569E Overview
•
•
•
•
•
•
One 64-bit or two 32-bit DDR2/DDR3 SDRAM memory controllers with ECC support
High-speed interfaces:
— Two ×1 serial RapidIO interfaces (with message unit) or one x4 interface
— ×4/×2/×1 PCI Express interface
— Two SGMII interfaces
— Four-lane SerDes with the mux options shown in Table 1 (in Section 3.6.3, “High-Speed
Interface Multiplexing”)
Programmable interrupt controller (PIC) compliant with Open-PIC standard
Four-channel DMA controller
Two I2C controllers, DUART, timers
Enhanced local bus controller (eLBC)
These features are described in greater detail in subsequent sections.
NOTE
The MPC8569E is also available without a security engine, in a
configuration known as the MPC8569. All specifications other than those
relating to security apply to the MPC8569 exactly as described in this
document.
MPC8569E PowerQUICC™ III Integrated Processor Product Brief, Rev. 0
4
Freescale Semiconductor
MPC8569E Application Examples
2
MPC8569E Application Examples
The following section provides block diagrams of different MPC8569E applications. The MPC8569E is a
very flexible device and can be configured to meet many system application needs.
2.1
Base Station Network Interface Card
Figure 2 shows an application using the MPC8569E as a base station network interface card.
MPC8569
64 or 32-bit
DDR2/DDR3
DUART
32-bit
DDR2/DDR3
2 x I2C or
SPI
Serial
EEPROM
Local Bus
FLASH
Backhaul – TDM + (ATM or POS)
STM-4 or
4 x STM-1
Framer
1 to 4 SPHYs
Console Port, etc.
RMII/MII
UL2 or PL2
(50 MHz/16-bit)
Maintenance/
Debug Ports
RMII/MII
GPIO
802.3ad
Link
Aggregation
RGMII/GMII
SRIO or
PCI-Express
External Host Processor
RGMII/GMII
USB 2.0
JTAG
Full Speed at 12Mbps
Debug
TDM Ports
8 x E1
8 x E1
Octal T1/E1
Framer
Octal T1/E1
Framer
Backplane – Ethernet
(2 x 16 MHz
TDM Interface
or
4 x 8 MHz
TDM Interface
or
8 x 4 MHz
TDM Interface)
SGMII/
RGMII/GMII
SGMII/
RGMII/GMII
SERDES
802.3ad
Link
Aggregation
SERDES
Backplane
Ethernet
Switch
• • • • • • • • or • • • • • • • •
UL2
(50 MHz/16-bit)
Backplane
Cell Switch
Backplane – ATM
Figure 2. Base Station Network Interface Card Application
The MPC8569E enables glueless connection to an external host processor using PCI Express or a serial
RapidIO interconnect in applications where a separate processor is used for control processing.
MPC8569E PowerQUICC™ III Integrated Processor Product Brief, Rev. 0
Freescale Semiconductor
5
MPC8569E Application Examples
Support for both legacy ATM backplanes as well as gigabit Ethernet backplanes is provided. A UTOPIA
Level 2 interface facilitates connection to an ATM backplane with a rich set of ATM TM4.1-compliant
traffic management capabilities. When using an Ethernet backplane, the QUICC Engine technology offers
an advanced Ethernet scheduler with the hard QoS capabilities necessary for mirroring the traffic
management capabilities of ATM when migrating from ATM to Ethernet backplanes. Additionally,
Ethernet multicast capabilities are also offered to offload multicasting from the CPU core to the QUICC
Engine block for emerging video and streaming data services to mobile users. Furthermore, Ethernet link
aggregation is offered to help attain a desired combination of higher throughput, load balancing, and
redundancy.
For backhaul from a Node B to an RNC, connectivity of up to 16 T1/E1s through external framers is
possible. Both IMA and MLPPP are supported on these links. The MPC8569E also supports a network
interface card configuration for a Hub Node B. Such a hub aggregates T1/E1s from several subtended
Node Bs and backhauls the traffic by ATM or POS over an STS-3c/STM-1 link. The QUICC Engine block
supports the STS-3c/STM-1 by a UTOPIA/Packet-over-SONET (POS) Level 2 interface. Furthermore,
backhaul by fast or gigabit Ethernet interfaces is also possible.
In addition to the variety of interface options, advanced multiprotocol interworking capabilities such as
IMA to Ethernet interworking and MLPPP to Ethernet interworking are also offerred. Designed with IPv6
support in mind, powerful protocol handling capabilities at Layers 2, 3, and 4 facilitate the migration
towards an All-IP network A flexible and programmable solution for the network interface card is highly
desirable to facilitate feature additions as standards and system architectures evolve. Hence the
MPC8569E offers a complete solution to meet different network interface card architectures.
MPC8569E PowerQUICC™ III Integrated Processor Product Brief, Rev. 0
6
Freescale Semiconductor
MPC8569E Application Examples
2.2
UMTS Channel Card
Figure 3 shows the MPC8569E used as a UMTS channel card.
MPC8569
64 or 32-bit
DDR2/DDR3
DUART
Console Port, etc.
32-bit
DDR2/DDR3
2 x I2C or
SPI
Serial
EEPROM
Local Bus
FLASH
RMII/MII
Maintenance/
Debug Ports
Channel Card Functionality
RMII/MII
SRIO
Switch
SRIO
GPIO
SRIO or
PCI-Express
DSP Farm
External Host Processor
USB 2.0
RGMII/GMII
JTAG
RGMII/GMII
SGMII/
RGMII/GMII
May be used for
connection to
other processors
Full Speed at 12Mbps
Debug
Backplane – Ethernet
SGMII/
RGMII/GMII
802.3ad
Link
Aggregation
SERDES
SERDES
Backplane
Ethernet
Switch
• • • • • • • • or • • • • • • • •
UL2
(50 MHz/16-bit)
Backplane
Cell Switch
Backplane – ATM
Figure 3. UMTS Channel Card Application
In a channel card, the MPC8569E performs the data path functionality between the baseband processing
DSPs on the channel card and network interface cards. Options for connectivity over the backplane are as
described in Section 2.1, “Base Station Network Interface Card,” and include both ATM and Ethernet
backplanes. Connections to DSPs are typically achieved by Ethernet or serial RapidIO interfaces. A ×1 or
×4 serial RapidIO interface may be used to connect to a RapidIO switch. The switch, in turn, connects to
multiple DSPs. Alternatively, two ×1 serial RapidIO interfaces, which are offered on the MPC8569E, may
be used to connect to two multicore baseband processing DSPs directly. The two ×1 serial RapidIO
interfaces also can facilitate an efficient daisy chain across a chain of DSPs without a switch.
MPC8569E PowerQUICC™ III Integrated Processor Product Brief, Rev. 0
Freescale Semiconductor
7
MPC8569E Architecture Overview
3
MPC8569E Architecture Overview
This section contains a high-level view of the MPC8569E architecture.
3.1
e500v2 Core and Memory Unit
The MPC8569E contains a high-performance, 32-bit, Power instruction set architecture (ISA)–enhanced
e500v2 core that implements Power Architecture technology. In addition to 36-bit physical addressing,
this version of the e500 core includes:
• Embedded floating-point instructions defined as part of the SPE that use the general-purpose
registers (GPRs) for specifying operands. These include the following:
— 64-bit vector and 32-bit scalar single-precision floating-point instructions
— 64-bit, scalar, double-precision floating-point instructions
• 32-Kbyte L1 instruction cache and 32-Kbyte L1 data cache with parity protection
The MPC8569E also contains 512 Kbytes of L2 cache/SRAM, as follows:
• Eight-way set-associative cache organization with 32-byte cache lines
• Flexible configuration (can be configured as part cache, part SRAM)
• External masters can force data to be allocated into the cache through programmed memory ranges
or special transaction types (stashing).
• SRAM features include the following:
— I/O devices access SRAM regions by marking transactions as snoopable (global).
— Regions can reside at any aligned location in the memory map.
— Byte-accessible ECC uses read-modify-write transaction accesses for smaller-than-cache-line
accesses.
3.2
e500 Coherency Module (ECM) and Address Map
The e500 coherency module (ECM) provides a mechanism for I/O-initiated transactions to snoop the bus
between the e500v2 core and the integrated L2 cache in order to maintain coherency across local cacheable
memory. It also provides a flexible switch-type structure for core- and I/O-initiated transactions to be
routed or dispatched to target modules on the device.
The MPC8569E supports a flexible 36-bit physical address map. Conceptually, the address map consists
of local space and external address space. The local address map is supported by ten local access windows
that define mapping within the local 36-bit (64-Gbyte) address space.
The MPC8569E can be made part of a larger system address space through the mapping of translation
windows. This functionality is included in the address translation and mapping units (ATMUs). Both
inbound and outbound translation windows are provided. The ATMUs allows the MPC8569E to be part of
larger address maps such as those of PCI Express or RapidIO.
MPC8569E PowerQUICC™ III Integrated Processor Product Brief, Rev. 0
8
Freescale Semiconductor
MPC8569E Architecture Overview
3.3
QUICC Engine Block
The QUICC Engine block includes support for the following:
• Serial interfaces
— UTOPIA/POS-PHY L2 bus controller (UPC) supporting 124 ports (optional 128 ports with
extended address)
— Up to four gigabit Ethernet interfaces. The following combinations are supported:
– Four RGMII/RTBI
– Two RGMII/RTBI and two SGMII
– Two RGMII/RTBI and one GMII
– Two GMII and two SGMII
— Up to eight 10/100-Mbps Ethernet interfaces using RMII
— Up to 16 T1/E1/J1/E3 or DS-3 serial interfaces
— SPI and Ethernet PHY management interface
— One full-/low-speed USB interface supporting USB 2.0
• Protocols
— IP termination support for IPv4 and IPv6 packets including TOS, TTL, and header checksum
processing
— L2 Ethernet switching using MAC address or IEEE 802.1P/Q® VLAN tags
— IP forwarding
— ATM SAR up to 622 Mbps (OC-12) full duplex, with ATM traffic shaping (ATM Forum
TM 4.1) for up to 64K ATM connections
— ATM AAL1 structured and unstructured circuit emulation service (CES 2.0)
— IMA and ATM transmission convergence sub-layer
— ATM OAM handling features compatible with ITU-T I.610
— PPP, multi-link (ML-PPP), multi-class (MC-PPP) and PPP mux in accordance with the
following RFCs: 1661, 1662, 1990, 2686 and 3153
— ATM (AAL2/AAL5) to Ethernet (IP) interworking
— PPP to Ethernet interworking
— Extensive support for ATM statistics and Ethernet RMON/MIB statistics
— 512 channels of HDLC/Transparent or 256 channels of SS7
• IEEE 1588 v2 support
3.4
Integrated Security Engine (SEC)
The SEC is a modular and scalable security core optimized to process all the algorithms associated with
IPsec, IKE, SSL/TLS, iSCSI, SRTP, IEEE 802.11i®, IEEE 802.16® (WiMAX), IEEE 802.1AE® Std.
(MACSec), 3GPP, A5/3 for GSM and EDGE, and GEA3 for GPRS. Although it is not a protocol processor,
the SEC is designed to perform multi-algorithmic operations (for example, 3DES-HMAC-SHA-1) in a
MPC8569E PowerQUICC™ III Integrated Processor Product Brief, Rev. 0
Freescale Semiconductor
9
MPC8569E Architecture Overview
single pass of the data. The version of the SEC used in the MPC8569E is specifically capable of performing
single-pass security cryptographic processing for SSL 3.0, SSL 3.1/TLS 1.0, IPSec, SRTP, and 802.11i.
SEC features include the following:
• Compatible with code written for the Freescale MPC8548E, MPC8555E, and MPC8541E devices
• XOR engine for parity checking in RAID storage applications.
• Four crypto-channels, each supporting multi-command descriptor chains
• Cryptographic execution units:
— PKEU—public key execution unit
— DEU—data encryption standard execution unit
— AESU—advanced encryption standard unit
— AFEU—ARC four execution unit
— MDEU—message digest execution unit
— KEU—Kasumi execution unit
— CRCU—cyclical redundancy check unit
— RNG—random number generator
— SEU—SNOW standard execution unit
3.5
DDR SDRAM Controllers
The MPC8569E has one 64-bit or two 32-bit DDR controllers, which support DDR2 and DDR3 SDRAM.
The memory interfaces control main memory accesses and provide for a maximum of 16 Gbytes of main
memory.
The MPC8569E supports a variety of SDRAM configurations. SDRAM banks can be built using DIMMs
or directly-attached memory devices. Sixteen multiplexed address signals provide for device densities
from 64 Mbits to 4 Gbits. Four chip select signals support up to four banks of memory. The MPC8569E
supports bank sizes from 64 Mbytes to 4 Gbytes. Nine column address strobes (MDM[0:8]) are used to
provide byte selection for memory bank writes.
The MPC8569E can be configured to retain the currently active SDRAM page for pipelined burst accesses.
Page mode support of up to 16 simultaneously open pages (32 for DDR2/DDR3) can dramatically reduce
access latencies for page hits. Depending on the memory system design and timing parameters, using page
mode can save 3 to 4 clock cycles from subsequent burst accesses that hit in an active page.
Using ECC, the MPC8569E detects and corrects all single-bit errors and detects all double-bit errors and
all errors within a nibble.
The MPC8569E can invoke a level of system power management by asserting the MCKE SDRAM signal
on-the-fly to put the memory into a low-power sleep mode.
The MPC8569E offers both hardware and software options to support battery-backed main memory. In
addition, the DDR controller offers an initialization bypass feature that system designers may use to
prevent re-initialization of main memory during system power-on following abnormal shutdown.
MPC8569E PowerQUICC™ III Integrated Processor Product Brief, Rev. 0
10
Freescale Semiconductor
MPC8569E Architecture Overview
3.6
High Speed I/O Interfaces
The MPC8569E supports the SGMII, serial RapidIO, and PCI Express high-speed I/O interface standards.
3.6.1
Serial RapidIO
The serial RapidIO interface is based on the RapidIO Interconnect Specification, Revision 1.2. RapidIO is
a high-performance, point-to-point, low-pin-count, packet-switched system-level interconnect that can be
used in a variety of applications as an open standard. The RapidIO architecture has a rich variety of
features including high data bandwidth, low-latency capability, and support for high-performance I/O
devices, as well as support for message-passing and software-managed programming models. Key features
of the serial RapidIO interface unit include:
• Support for RapidIO Interconnect Specification, Revision 1.2 (all transaction flows and priorities)
• Both ×1 and ×4 LP-serial link interfaces, with transmission rates of 1.25, 2.5, and 3.125 Gbaud
(data rates of 1.0, 2.0, and 2.5 Gbps) per lane
• Auto detection of ×1 or ×4 mode operation during port initialization
• 34-bit addressing and up to 256-byte data payload
• Receiver-controlled flow control
• Support for RapidIO error injection
• Internal LP-serial and application interface-level loopback modes
The RapidIO messaging unit supports two inbox/outbox mailboxes (queues) for data and one doorbell
message structure. Both chaining and direct modes are provided for the outbox, and messages can hold up
to 16 packets of 256 bytes, or a total of 4 Kbytes.
3.6.2
PCI Express Interface
The MPC8569E supports a PCI Express interface compliant with the PCI Express Base Specification
Revision 1.0a. It is configurable at boot time to act as either root complex or endpoint.
The physical layer of the PCI Express interface operates at a 2.5-Gbaud data rate per lane. The theoretical
unidirectional peak bandwidth is 2 Gbps per lane. Receive and transmit ports operate independently,
resulting in an aggregate theoretical bandwidth of 4 Gbps per lane.
Other features of the PCI Express interface include:
• ×4, ×2, and ×1 link widths supported
• Both 32- and 64-bit addressing and 256-byte maximum payload size
• Full 64-bit decode with 36-bit wide windows
MPC8569E PowerQUICC™ III Integrated Processor Product Brief, Rev. 0
Freescale Semiconductor
11
MPC8569E Architecture Overview
3.6.3
High-Speed Interface Multiplexing
Table 1 shows the supported high-speed interface configurations. The desired configuration must be
selected at power-on reset.
Table 1. Supported High-Speed Interface Combinations
Lanes
Configuration
3.7
Frequency
f
e
b
a
1
SGMII
SGMII
×1 SRIO2
×1 SRIO1
SRIO at 2.5 Gbaud
2
SGMII
SGMII
—
×1 PEX
PEX at 2.5 Gbaud
3
SGMII
SGMII
4
×1 SRIO2
×1 SRIO1
5
×1 SRIO2
×1 SRIO1
×2 PEX
PEX at 2.5 Gbaud
×1 PEX
—
×2 PEX
6
×4 SRIO1
7
×4 PEX
2.5 Gbaud
2.5 Gbaud
2.5 or 3.125 Gbaud
2.5 Gbaud
8
—
—
—
×1 PEX
9
—
—
×1 SRIO2
×1 SRIO1
10
SGMII
SGMII
×1 SRIO2
×1 PEX
2.5 Gbaud
3.125 Gbaud
SRIO at 2.5 Gbaud
Programmable Interrupt Controller (PIC)
The MPC8569E PIC implements the logic and programming structures of the OpenPIC architecture,
providing for external interrupts (with fully nested interrupt delivery), message interrupts, internal-logic
driven interrupts, and global high-resolution timers. Up to 16 programmable interrupt priority levels are
supported. The PIC can be bypassed to allow use of an external interrupt controller.
3.8
DMA, I2C, DUART, and Enhanced Local Bus Controller
The MPC8569E provides an integrated four-channel DMA controller, which can transfer data between any
of its I/O or memory ports or between two devices or locations on the same port. The DMA controller can
be used as follows:
• To chain (both extended and direct) through local memory-mapped chain descriptors.
• To handle misaligned transfers as well as stride transfers and complex transaction chaining.
• To specify local attributes such as snoop and L2 write stashing.
There are two I2C controllers. These synchronous, multimaster buses can be connected to additional
devices for expansion and system development.
The DUART supports full-duplex operation and is compatible with the PC16450 and PC16550
programming models. Both the transmitter and receiver support 16-byte FIFOs.
The MPC8569E enhanced local bus controller (eLBC) port allows connection with a wide variety of
external memories, DSPs, and ASICs. Three separate state machines share the same external pins and can
be programmed separately to access different types of devices. The general-purpose chip select machine
MPC8569E PowerQUICC™ III Integrated Processor Product Brief, Rev. 0
12
Freescale Semiconductor
MPC8569E Architecture Overview
(GPCM) controls accesses to asynchronous devices using a simple handshake protocol. The user
programmable machine (UPM) can be programmed to interface to synchronous devices or custom ASIC
interfaces. The NAND Flash control machine (FCM) further extends interface options. Each chip select
can be configured so that the associated chip interface can be controlled by the GPCM, UPM, or FCM
controller. All may exist in the same system. The local bus controller supports the following features:
• Nonmultiplexed bus: 28-bit address and 16-bit data, operating at up to 166 MHz
• Eight chip selects support eight external slaves
• Up to eight-beat burst transfers
• 16- and 8-bit port sizes controlled by on-chip memory controller
• Three protocol engines available on a per-chip-select basis
• Parity support
• Default boot ROM chip select with configurable bus width (8 or 16 bits)
• Supports zero-bus-turnaround (ZBT) RAM
• Boot from 8-bit NAND Flash
3.9
Device Boot Locations
The MPC8569E may be configured to boot using one of the following interfaces:
• DDR2/DDR3 memory controller
• Serial RapidIO interface
• PCI Express interface
• Local bus interface (using the GPCM)
• I2C boot sequencer (I2C1 interface)
• SD/MMC controller
3.10
Power Management
In addition to low-voltage operation and dynamic power management, which automatically minimizes
power consumption of blocks when they are idle, four power consumption modes are supported: full on,
doze, nap, and sleep.
3.11
System Performance Monitor
The performance monitor facility supports eight 32-bit counters that can count up to 512 counter-specific
events. It supports duration and quantity threshold counting and a burstiness feature that permits counting
of burst events with a programmable time between bursts.
MPC8569E PowerQUICC™ III Integrated Processor Product Brief, Rev. 0
Freescale Semiconductor
13
Development Environment
4
Development Environment
Development tools, hardware platforms, software building blocks, and application-specific software
solutions are available from Freescale and the Freescale Alliance Program, including third party protocol
and signaling stack suppliers, real time operating systems support and a variety of applications software
support. All of this builds upon the existing industry standard PowerQUICC family support program.
4.1
Software Development Tools
To simplify and accelerate the development process, Freescale will provide a user-friendly, integrated
development environment (IDE), which includes a compiler, instruction set simulator, and debugger for
the e500v2 core.
4.2
Modular Development System (MDS)
Freescale provides an MDS board as a reference platform and programming development environment for
the MPC8569E with a complete Linux board support package. The MDS board supports on-board DDR
SDRAM memory and a debug port and can be configured with optional daughter cards supporting
protocols such as OC-3 or OC-12 ATM, 16x T1/E1, and Ethernet (10/100/1000Base T).
4.3
Modular Software Building Blocks
The QUICC Engine block is supported by a complete set of configurable device API drivers and
initialization software. Table 2 and Table 3 show the wealth of software protocols that the QUICC Engine
block with the e500v2 core supports.
Table 2. QUICC Engine Block Software Package Overview: Demo Applications and Drivers
Category
Example
Documentation
Demo Applications
(Node B, DSLAM, DSP Aggregator, WAN GW) Demo Manuals, Use cases HOW TOs
Driver applications
Use cases, Test application suite
Termination Drivers ATM, ETH, Interworking Drivers
Tests reports
Drivers API
MPC8569E PowerQUICC™ III Integrated Processor Product Brief, Rev. 0
14
Freescale Semiconductor
Document Revision History
Table 3. QUICC Engine Block Software Package Overview: MIcrocode
Layer
5
Use
Layer 3+
Layer 3 (IP/Ethernet)
L3 control packets filtered to host CPU
Parsing & Multi-field classification
Hierarchical Lookups
Traffic Management (IP/Ethernet)
Combined SP + WFQ Scheduling
Rate limiting/shaping
Lossless Flow Control
DiffServ + WRED
ATM
TM 4.1 UBR, CBR, GFR, VBR
Per-flow ATM scheduler for 64K VC’s
Hierarchical frame and cell based scheduling
Policing
Congestion Control
Layer 2.5
VLAN
ATM to ATM switching
ATM to Ethernet interworking
AAL2 CPS switching and SSSAR
Multi-Link PPP, Multi-Class PPP, PPP-Mux
PPP to Ethernet interworking
IP Header Compression
IMA over TDM / UTOPIA / Channelized
E-MSP
Layer 2
ATM AAL 0/1/2/5
10/100/1000 Ethernet
L2 (Fast Ethernet) Switch
HDLC
BISYNC
Serial ATM (ATM TC sublayer)
SS7
Layer 1
(Physical)
UTOPIA-L2, POS-L2
10/100/1000 Ethernet
TDM – T1/T3/E1/E3
Document Revision History
Table 4 provides a revision history for this product brief.
Table 4. Document Revision History
Rev. No.
Date
0
2/2009
Substantive Change(s)
This is the first released version of this document.
MPC8569E PowerQUICC™ III Integrated Processor Product Brief, Rev. 0
Freescale Semiconductor
15
How to Reach Us:
Home Page:
www.freescale.com
Web Support:
http://www.freescale.com/support
USA/Europe or Locations Not Listed:
Freescale Semiconductor
Technical Information Center, EL516
2100 East Elliot Road
Tempe, Arizona 85284
+1-800-521-6274 or +1-480-768-2130
www.freescale.com/support
Europe, Middle East, and Africa:
Freescale Halbleiter Deutschland GmbH
Technical Information Center
Schatzbogen 7
81829 Muenchen, Germany
+44 1296 380 456 (English)
+46 8 52200080 (English)
+49 89 92103 559 (German)
+33 1 69 35 48 48 (French)
www.freescale.com/support
Japan:
Freescale Semiconductor Japan Ltd.
Headquarters
ARCO Tower 15F
1-8-1, Shimo-Meguro, Meguro-ku,
Tokyo 153-0064
Japan
0120 191014 or +81 3 5437 9125
support.japan@freescale.com
Asia/Pacific:
Freescale Semiconductor Hong Kong Ltd.
Technical Information Center
2 Dai King Street
Tai Po Industrial Estate
Tai Po, N.T., Hong Kong
+800 2666 8080
support.asia@freescale.com
For Literature Requests Only:
Freescale Semiconductor Literature Distribution Center
P.O. Box 5405
Denver, Colorado 80217
1-800-441-2447 or 303-675-2140
Fax: 303-675-2150
LDCForFreescaleSemiconductor@hibbertgroup.com
Document Number: MPC8569EPB
Rev. 0
02/2009
Information in this document is provided solely to enable system and software
implementers to use Freescale Semiconductor products. There are no express or
implied copyright licenses granted hereunder to design or fabricate any integrated
circuits or integrated circuits based on the information in this document.
Freescale Semiconductor reserves the right to make changes without further notice to
any products herein. Freescale Semiconductor makes no warranty, representation or
guarantee regarding the suitability of its products for any particular purpose, nor does
Freescale Semiconductor assume any liability arising out of the application or use of any
product or circuit, and specifically disclaims any and all liability, including without
limitation consequential or incidental damages. “Typical” parameters that may be
provided in Freescale Semiconductor data sheets and/or specifications can and do vary
in different applications and actual performance may vary over time. All operating
parameters, including “Typicals”, must be validated for each customer application by
customer’s technical experts. Freescale Semiconductor does not convey any license
under its patent rights nor the rights of others. Freescale Semiconductor products are
not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life,
or for any other application in which the failure of the Freescale Semiconductor product
could create a situation where personal injury or death may occur. Should Buyer
purchase or use Freescale Semiconductor products for any such unintended or
unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all
claims, costs, damages, and expenses, and reasonable attorney fees arising out of,
directly or indirectly, any claim of personal injury or death associated with such
unintended or unauthorized use, even if such claim alleges that Freescale
Semiconductor was negligent regarding the design or manufacture of the part.
Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc.
The Power Architecture and Power.org word marks and the Power and Power.org logos
and related marks are trademarks and service marks licensed by Power.org. The
described product contains a PowerPC processor core. The PowerPC name is a
trademark of IBM Corp. and used under license. IEEE 802.16, 802.1AE, 802.1li, 802.1P,
and 1158 are trademarks or registered trademarks of the Institute of Electrical and
Electronics Engineers, Inc. (IEEE). This product is not endorsed or approved by the
IEEE. RapidIO is a registered trademark of the RapidIO Trade Association. All other
product or service names are the property of their respective owners.
© Freescale Semiconductor, Inc., 2009. All rights reserved.