OPA2604

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®

OPA2604

OPA2604

OPA2604 www.burr-brown.com/databook/OPA2604.html

Dual FET-Input, Low Distortion

OPERATIONAL AMPLIFIER

FEATURES

LOW DISTORTION: 0.0003% at 1kHz

LOW NOISE: 10nV/

Hz

HIGH SLEW RATE: 25V/

µ

s

WIDE GAIN-BANDWIDTH: 20MHz

UNITY-GAIN STABLE

WIDE SUPPLY RANGE: V

S

DRIVES 600

LOADS

=

±

4.5 to

±

24V

DESCRIPTION

The OPA2604 is a dual, FET-input operational amplifier designed for enhanced AC performance. Very low distortion, low noise and wide bandwidth provide superior performance in high quality audio and other applications requiring excellent dynamic performance.

New circuit techniques and special laser trimming of dynamic circuit performance yield very low harmonic distortion. The result is an op amp with exceptional sound quality. The low-noise FET input of the

OPA2604 provides wide dynamic range, even with high source impedance. Offset voltage is laser-trimmed to minimize the need for interstage coupling capacitors.

The OPA2604 is available in 8-pin plastic mini-DIP and SO-8 surface-mount packages, specified for the

–25

°

C to +85

°

C temperature range.

(+)

(3, 5)

(–)

(2, 6)

APPLICATIONS

PROFESSIONAL AUDIO EQUIPMENT

PCM DAC I/V CONVERTER

SPECTRAL ANALYSIS EQUIPMENT

ACTIVE FILTERS

TRANSDUCER AMPLIFIER

DATA ACQUISITION

Distortion

Rejection

Circuitry*

(8)

V+

Output

Stage*

(1, 7)

V

O

(4)

V–

* Patents Granted:

#5053718, 5019789

SBOS006

International Airport Industrial Park • Mailing Address: PO Box 11400, Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd., Tucson, AZ 85706 • Tel: (520) 746-1111 • Twx: 910-952-1111

Internet: http://www.burr-brown.com/ • FAXLine: (800) 548-6133 (US/Canada Only) • Cable: BBRCORP • Telex: 066-6491 • FAX: (520) 889-1510 • Immediate Product Info: (800) 548-6132

© 1991 Burr-Brown Corporation

OPA2604

Printed in U.S.A. October, 1997

®

SPECIFICATIONS

ELECTRICAL

At T

A

= +25

°

C, V

S

=

±

15V, unless otherwise noted.

PARAMETER

OFFSET VOLTAGE

Input Offset Voltage

Average Drift

Power Supply Rejection

INPUT BIAS CURRENT

(1)

Input Bias Current

Input Offset Current

NOISE

Input Voltage Noise

Noise Density: f = 10Hz f = 100Hz f = 1kHz f = 10kHz

Voltage Noise, BW = 20Hz to 20kHz

Input Bias Current Noise

Current Noise Density, f = 0.1Hz to 20kHz

INPUT VOLTAGE RANGE

Common-Mode Input Range

Common-Mode Rejection

INPUT IMPEDANCE

Differential

Common-Mode

OPEN-LOOP GAIN

Open-Loop Voltage Gain

FREQUENCY RESPONSE

Gain-Bandwidth Product

Slew Rate

Settling Time: 0.01%

0.1%

Total Harmonic Distortion + Noise (THD+N)

CONDITION

V

S

=

±

5 to

±

24V

V

CM

= 0V

V

CM

= 0V

V

CM

=

±

12V

V

O

=

±

10V, R

L

= 1k

G = 100

20Vp-p, R

L

= 1k

G = –1, 10V Step

MIN

70

±

12

80

80

15

Channel Separation

OUTPUT

Voltage Output

Current Output

Short Circuit Current

Output Resistance, Open-Loop

POWER SUPPLY

Specified Operating Voltage

Operating Voltage Range

Current, Total Both Amplifiers

TEMPERATURE RANGE

Specification

Storage

Thermal Resistance

(2)

,

θ

JA

V

O

G = 1, f = 1kHz

= 3.5Vrms, R

L f = 1kHz, R

L

= 1k

= 1k

R

L

V

O

= 600

=

±

12V

I

O

= 0

NOTES: (1) Typical performance, measured fully warmed-up. (2) Soldered to circuit board—see text.

±

11

±

4.5

–25

–40

OPA2604AP, AU

TYP MAX

±

1

±

8

80

100

±

4

25

15

11

10

1.5

6

±

13

100

10

12

|| 8

10

12

|| 10

100

20

25

1.5

1

0.0003

142

±

12

±

35

±

40

25

±

15

±

10.5

90

±

5

±

24

±

12

+85

+125

UNITS

mV

µ

V/

°

C dB pA pA dB

MHz

V/

µ s

µ s

µ s

% dB nV/

Hz nV/

Hz nV/

Hz nV/

Hz

µ

Vp-p fA/

Hz

V dB

|| pF

|| pF

V mA mA

V

V mA

°

C

°

C

°

C/W

The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant any BURR-BROWN product for use in life support devices and/or systems.

®

OPA2604

2

PIN CONFIGURATION

Top View

Output A 1

–In A 2

+In A 3

V– 4

8 V+

7 Output B

6 –In B

5 +In B

DIP/SOIC

ELECTROSTATIC

DISCHARGE SENSITIVITY

Any integrated circuit can be damaged by ESD. Burr-Brown recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet published specifications.

ABSOLUTE MAXIMUM RATINGS

(1)

Power Supply Voltage .......................................................................

±

25V

Input Voltage ............................................................. (V–)–1V to (V+)+1V

Output Short Circuit to Ground ............................................... Continuous

Operating Temperature ................................................. –40

°

C to +100

°

C

Storage Temperature ..................................................... –40

°

C to +125

°

C

Junction Temperature .................................................................... +150

°

C

Lead Temperature (soldering, 10s) AP ......................................... +300

°

C

Lead Temperature (soldering, 3s) AU .......................................... +260

°

C

NOTE: (1) Stresses above these ratings may cause permanent damage.

ORDERING INFORMATION

PRODUCT

OPA2604AP

OPA2604AU

PACKAGE

8-Pin Plastic DIP

SO-8 Surface-Mount

TEMP. RANGE

–25

°

C to +85

°

C

–25

°

C to +85

°

C

PACKAGING INFORMATION

PRODUCT

OPA2604AP

OPA2604AU

PACKAGE

8-Pin Plastic DIP

SO-8 Surface-Mount

PACKAGE DRAWING

NUMBER

006

182

(1)

NOTE: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book.

3

OPA2604

®

TYPICAL PERFORMANCE CURVES

At T

A

= +25

°

C, V

S

=

±

15V, unless otherwise noted.

1

0.1

0.01

0.001

0.0001

20

TOTAL HARMONIC DISTORTION + NOISE vs FREQUENCY

3.5Vrms

1k

Measurement BW = 80kHz

See “Distortion Measurements” for description of test method.

G = 100V/V

G = 10V/V

100

G = 1V/V

1k

Frequency (Hz)

10k 20k

TOTAL HARMONIC DISTORTION + NOISE vs OUTPUT VOLTAGE

0.1

See “Distortion Measurements” for description of test method.

0.01

1k

Ω f = 1kHz

Measurement BW = 80kHz

0.001

0.0001

0.1

1 10

Output Voltage (Vp-p)

100

OPEN-LOOP GAIN/PHASE vs FREQUENCY

120

100

80

60

40

20

0

–20

1

G

φ

10 100 1k 10k

Frequency (Hz)

100k 1M 10M

0

–45

–90

–135

–180

1k

INPUT VOLTAGE AND CURRENT NOISE

SPECTRAL DENSITY vs FREQUENCY

1k

100

Voltage Noise

100

10

1

1

10

10

Current Noise

100 1k

Frequency (Hz)

10k 100k

1

1M

INPUT BIAS AND INPUT OFFSET CURRENT

vs TEMPERATURE

100nA

10nA

10nA

1nA

Input

Bias Current

1nA 100

100 10

Input

Offset Current

10 1

1

–75 –50 –25 0 25 50

Ambient Temperature (°C)

75 100

0.1

125

10nA

INPUT BIAS AND INPUT OFFSET CURRENT

vs INPUT COMMON-MODE VOLTAGE

1nA

Input

Bias Current

1nA

100

100

10

–15

10

–10 –5 0

Input

Offset Current

5

Common-Mode Voltage (V)

10 15

1

®

OPA2604

4

TYPICAL PERFORMANCE CURVES

(CONT)

At T

A

= +25

°

C, V

S

=

±

15V, unless otherwise noted.

1nA

100

10

1

0

INPUT BIAS CURRENT

vs TIME FROM POWER TURN-ON

V

S

= ±24VDC

V

S

= ±15VDC

V

S

= ±5VDC

1 2 3

Time After Power Turn-On (min)

4 5

COMMON-MODE REJECTION

vs COMMON-MODE VOLTAGE

120

110

100

90

80

–15 –10 –5 0 5

Common-Mode Voltage (V)

10 15

120

100

CMR

POWER SUPPLY AND COMMON-MODE

REJECTION vs FREQUENCY

80

60

40

20

0

10 100

–PSR

1k 10k

Frequency (Hz)

100k

+PSR

1M 10M

120

110

100

90

80

70

5

A

OL

, PSR, AND CMR vs SUPPLY VOLTAGE

10

CMR

A

OL

PSR

15

Supply Voltage (±V

S

)

20 25

GAIN-BANDWIDTH AND SLEW RATE vs SUPPLY VOLTAGE

28

24

Gain-Bandwidth

G = +100

20

Slew Rate

16

12

5 10 15

Supply Voltage (±V

S

)

20

25

21

33

29

25

17

20

16

28

24

GAIN-BANDWIDTH AND SLEW RATE vs TEMPERATURE

Slew Rate

Gain-Bandwidth

G = +100

12

–75 –50 –25 0 25 50

Temperature (°C)

75 100

10

125

30

25

20

15

5

OPA2604

®

TYPICAL PERFORMANCE CURVES

(CONT)

At T

A

= +25

°

C, V

S

=

±

15V, unless otherwise noted.

3

2

5

4

1

0

–1

SETTLING TIME vs CLOSED-LOOP GAIN

V

O

R

L

C

L

= 10V Step

= 1k

= 50pF

0.01%

–10

0.1%

–100

Closed-Loop Gain (V/V)

–1000

160

CHANNEL SEPARATION vs FREQUENCY

R

L

=

140

R

L

= 1k

120

100

80

10

A

V

O

=

20Vp-p

R

L

100

B

Measured

Output

1k

Frequency (Hz)

10k 100k

30

MAXIMUM OUTPUT VOLTAGE SWING vs FREQUENCY

20

10

0

10k 100k

Frequency (Hz)

1M 10M

14

12

10

SUPPLY CURRENT vs TEMPERATURE

Total for Both Op Amps

V

S

= ±15VDC

V

S

= ±24VDC

V

S

= ±5VDC

8

6

–75 –50 –25 0 25 50

Ambient Temperature (°C)

75 100 125

20

15

30

25

10

25

LARGE-SIGNAL TRANSIENT RESPONSE

+10

FPO

Bleed to edge

–10

0 5 10

Time (µs)

®

OPA2604

6

+100

SMALL-SIGNAL TRANSIENT RESPONSE

–100

0 1

µ s

Time (µs)

2

µ s

TYPICAL PERFORMANCE CURVES

(CONT)

At T

A

= +25

°

C, V

S

=

±

15V, unless otherwise noted.

40

30

60

SHORT-CIRCUIT CURRENT vs TEMPERATURE

I

SC+

and I

SC–

50

20

–75 –50 –25 0 25 50

Ambient Temperature (°C)

75 100 125

1

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

6

POWER DISSIPATION vs SUPPLY VOLTAGE

Typical high-level music R

L

= 600

(both channels)

Worst case sine wave R

L

= 600

(both channels)

No signal or no load

8 10 12 14 16 18

Supply Voltage, ±V

S

(V)

20 22 24

0.6

0.4

0.2

0

0

1.4

1.2

1.0

MAXIMUM POWER DISSIPATION vs TEMPERATURE

θ

J-A

= 90°C/W

Soldered to

Circuit Board

(see text)

0.8

Maximum

Specified Operating

Temperature

85°C

25 50 75 100

Ambient Temperature (°C)

125 150

7

OPA2604

®

APPLICATIONS INFORMATION

The OPA2604 is unity-gain stable, making it easy to use in a wide range of circuitry. Applications with noisy or high impedance power supply lines may require decoupling capacitors close to the device pins. In most cases 1

µ

F tantalum capacitors are adequate.

DISTORTION MEASUREMENTS

The distortion produced by the OPA2604 is below the measurement limit of virtually all commercially available equipment. A special test circuit, however, can be used to extend the measurement capabilities.

Op amp distortion can be considered an internal error source which can be referred to the input. Figure 1 shows a circuit which causes the op amp distortion to be 101 times greater than normally produced by the op amp. The addition of R

3

to the otherwise standard non-inverting amplifier configuration alters the feedback factor or noise gain of the circuit. The closed-loop gain is unchanged, but the feedback available for error correction is reduced by a factor of 101. This extends the measurement limit, including the effects of the signal-source purity, by a factor of 101. Note that the input signal and load applied to the op amp are the same as with conventional feedback without R

3

.

Validity of this technique can be verified by duplicating measurements at high gain and/or high frequency where the distortion is within the measurement capability of the test equipment. Measurements for this data sheet were made with the Audio Precision System One which greatly simplifies such repetitive measurements. The measurement technique can, however, be performed with manual distortion measurement instruments.

CAPACITIVE LOADS

The dynamic characteristics of the OPA2604 have been optimized for commonly encountered gains, loads and operating conditions. The combination of low closed-loop gain and capacitive load will decrease the phase margin and may lead to gain peaking or oscillations. Load capacitance reacts with the op amp’s open-loop output resistance to form an additional pole in the feedback loop. Figure 2 shows various circuits which preserve phase margin with capacitive load.

Request Application Bulletin AB-028 for details of analysis techniques and applications circuits.

For the unity-gain buffer, Figure 2a, stability is preserved by adding a phase-lead network, R

C

and C

C

. Voltage drop across

R

C

will reduce output voltage swing with heavy loads. An alternate circuit, Figure 2b, does not limit the output with low load impedance. It provides a small amount of positive feedback to reduce the net feedback factor. Input impedance of this circuit falls at high frequency as op amp gain rolloff reduces the bootstrap action on the compensation network.

Figures 2c and 2d show compensation techniques for noninverting amplifiers. Like the follower circuits, the circuit in Figure 2d eliminates voltage drop due to load current, but at the penalty of somewhat reduced input impedance at high frequency.

Figures 2e and 2f show input lead compensation networks for inverting and difference amplifier configurations.

NOISE PERFORMANCE

Op amp noise is described by two parameters—noise voltage and noise current. The voltage noise determines the noise performance with low source impedance. Low noise bipolarinput op amps such as the OPA27 and OPA37 provide very low voltage noise. But if source impedance is greater than a few thousand ohms, the current noise of bipolar-input op amps react with the source impedance and will dominate. At a few thousand ohms source impedance and above, the OPA2604 will generally provide lower noise.

R

1

R

2

R

3

1

2

OPA2604

Generator

Output

Audio Precision

System One

Analyzer*

Analyzer

Input

R

L

1k

V

O

= 10Vp-p

(3.5Vrms)

FIGURE 1. Distortion Test Circuit.

®

OPA2604

* Measurement BW = 80kHz

8

SIG.

GAIN

1

10

100

DIST.

GAIN

101

101

101

R

1

500

50

R

2

5k

5k

5k

R

3

50

500

IBM PC or

Compatible

(a)

e i

1

2

OPA2604

C

C

820pF

R

C

750

Ω e o

C

L

5000pF

C

C

= 120 X 10 –12 C

L

R

1

10k

Ω e i

(c)

R

2

10k

C

C

24pF

1

2

OPA2604

C

C

=

50

R

2

C

L

R

C

25

Ω e o

C

L

5000pF

(b)

e i

R

2

2k

1

2

OPA2604

C

C

0.47µF

R

C

10

R

C

=

R

2

4C

L

X 10

10

– 1

C

C

=

C

L

X 10

3

R

C e o

C

L

5000pF

(d)

e i

R

1

2k

R

C

20

C

C

0.22µF

R

2k

1

2

2

OPA2604

R

C

=

R

2

2C

L

X 10

10

– (1 + R

2

/R

1

)

C

C

=

C

L

X 10

3

R

C e o

C

L

5000pF e i

R

1

2k

R

C

20

C

C

0.22µF

(e)

R

2

2k

1

2

OPA2604

e o

C

L

5000pF

R

C

=

R

2

2C

L

X 10

10

– (1 + R

2

/R

1

)

C

C

=

C

L

X 10

3

R

C

(f)

e

1

R

1

2k

R

2

2k

Ω e

2

R

C

20

C

C

0.22µF

1

2

OPA2604

R

3

R

4

2k

2k

R

C

=

R

2

2C

L

X 10

10

– (1 + R

2

/R

1

)

C

C

=

C

L

X 10

3

R

C e o

C

L

5000pF

NOTE: Design equations and component values are approximate. User adjustment is required for optimum performance.

FIGURE 2. Driving Large Capacitive Loads.

9

OPA2604

®

POWER DISSIPATION

The OPA2604 is capable of driving 600

loads with power supply voltages up to

±

24V. Internal power dissipation is increased when operating at high power supply voltage. The typical performance curve, Power Dissipation vs Power Supply Voltage, shows quiescent dissipation (no signal or no load) as well as dissipation with a worst case continuous sine wave. Continuous high-level music signals typically produce dissipation significantly less than worst case sine waves.

Copper leadframe construction used in the OPA2604 improves heat dissipation compared to conventional plastic packages. To achieve best heat dissipation, solder the device directly to the circuit board and use wide circuit board traces.

OUTPUT CURRENT LIMIT

Output current is limited by internal circuitry to approximately

±

40mA at 25

°

C. The limit current decreases with increasing temperature as shown in the typical curves.

V

IN

R

1

2.7k

R

2

22k

C

1

3000pF

R

3

10k

C

2

2000pF

R

4

22k

C

3

100pF

1

2

OPA2604

f p

= 20kHz

FIGURE 3. Three-Pole Low-Pass Filter.

V

O

V

IN

R

1

6.04k

R

5

2k

1

2

OPA2604

R

2

4.02k

R

2

4.02k

C

3

1000pF

1

2

OPA2604

Low-pass

3-pole Butterworth f

–3dB

= 40kHz

1

2

OPA2604

C

1

1000pF

R

4

5.36k

C

2

1000pF

See Application Bulletin AB-026 for information on GIC filters.

FIGURE 4. Three-Pole Generalized Immittance Converter (GIC) Low-Pass Filter.

V

O

®

OPA2604

10

I-Out DAC

C

OUT

C

1

*

R

1

1

2

OPA2604

2k

R

2

2.94k

C

2

2200pF

R

3

21k

* C

1

C

OUT

2

π

R

1

f c

R

1

= Feedback resistance = 2k

Ω f c

= Crossover frequency = 8MHz

C

3

470pF

1

2

OPA2604

Low-pass

2-pole Butterworth f

–3dB

= 20kHz

V

O

FIGURE 5. DAC I/V Amplifier and Low-Pass Filter.

7.87k

V

IN

+

100pF

7.87k

100kHz Input Filter

1

2

OPA2604

1

2

OPA2604

FIGURE 6. Differential Amplifier with Low-Pass Filter.

10k

10k

1

2

OPA2604

10k

10k

V

O

G = 1

11

OPA2604

®

Piezoelectric

Transducer

100

10k

1

2

OPA2604

G = 101

(40dB)

10

PCM63

20-bit

D/A

Converter

5

6

9

* C

1

C

OUT

2

π

R f

f c

R f

= Internal feedback resistance = 1.5k

Ω f c

= Crossover frequency = 8MHz

C

1

*

1

2

OPA2604

V

O

= ±3Vp

To low-pass filter.

1M

*

* Provides input bias

current return path.

FIGURE 7. High Impedance Amplifier.

V

IN

1/2 OPA2604

A

1

R

2

R

1

FIGURE 8. Digital Audio DAC I-V Amplifier.

1/2 OPA2604

A

2

I

2

R

4

51

R

3

51

Ω i

1

I

L

= I

1

+ I

2

V

OUT

Load

V

OUT

= V

IN

(1 + R

2

/R

1

)

FIGURE 9. Using the Dual OPA2604 Op Amp to Double the Output Current to a Load.

®

OPA2604

12

www.ti.com

PACKAGE OPTION ADDENDUM

18-Sep-2008

PACKAGING INFORMATION

Orderable Device

OPA2604AP

OPA2604APG4

OPA2604AU

OPA2604AU/2K5

OPA2604AU/2K5E4

OPA2604AUE4

OPA2604AUG4

Status

(1)

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

ACTIVE

Package

Type

PDIP

PDIP

SOIC

SOIC

SOIC

SOIC

SOIC

Package

Drawing

P

P

D

D

D

D

D

Eco Plan

(2)

Pins Package

Qty

8 50 Green (RoHS & no Sb/Br)

Lead/Ball Finish MSL Peak Temp

(3)

CU NIPDAU N / A for Pkg Type

8 CU NIPDAU N / A for Pkg Type

8

50 Green (RoHS & no Sb/Br)

100 Green (RoHS & no Sb/Br)

CU NIPDAU Level-3-260C-168 HR

8 CU NIPDAU Level-3-260C-168 HR

8

8

8

2500 Green (RoHS & no Sb/Br)

2500 Green (RoHS & no Sb/Br)

100 Green (RoHS & no Sb/Br)

100 Green (RoHS & no Sb/Br)

CU NIPDAU

CU NIPDAU

CU NIPDAU

Level-3-260C-168 HR

Level-3-260C-168 HR

Level-3-260C-168 HR

(1)

The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

OTHER QUALIFIED VERSIONS OF OPA2604 :

Automotive: OPA2604-Q1

NOTE: Qualified Version Definitions:

Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects

Addendum-Page 1

www.ti.com

TAPE AND REEL INFORMATION

PACKAGE MATERIALS INFORMATION

11-Mar-2008

*All dimensions are nominal

Device

OPA2604AU/2K5

Package

Type

Package

Drawing

SOIC D

Pins

8

SPQ

2500

Reel

Diameter

(mm)

Reel

Width

W1 (mm)

330.0

12.4

A0 (mm)

6.4

B0 (mm)

5.2

K0 (mm) P1

(mm)

W

(mm)

Pin1

Quadrant

2.1

8.0

12.0

Q1

Pack Materials-Page 1

www.ti.com

PACKAGE MATERIALS INFORMATION

11-Mar-2008

*All dimensions are nominal

Device

OPA2604AU/2K5

Package Type Package Drawing Pins

SOIC D 8

SPQ

2500

Length (mm) Width (mm) Height (mm)

346.0

346.0

29.0

Pack Materials-Page 2

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.

TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.

TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.

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TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.

Following are URLs where you can obtain information on other Texas Instruments products and application solutions:

Products

Amplifiers

Data Converters

DSP

Clocks and Timers

Interface

Logic

Power Mgmt

Microcontrollers amplifier.ti.com

dataconverter.ti.com

dsp.ti.com

www.ti.com/clocks interface.ti.com

logic.ti.com

power.ti.com

microcontroller.ti.com

RFID www.ti-rfid.com

RF/IF and ZigBee® Solutions www.ti.com/lprf

Applications

Audio

Automotive

Broadband

Digital Control

Medical

Military

Optical Networking

Security

Telephony

Video & Imaging

Wireless www.ti.com/audio www.ti.com/automotive www.ti.com/broadband www.ti.com/digitalcontrol www.ti.com/medical www.ti.com/military www.ti.com/opticalnetwork www.ti.com/security www.ti.com/telephony www.ti.com/video www.ti.com/wireless

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

Copyright © 2008, Texas Instruments Incorporated

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