MiniModuleTM SIO PC/104 Expansion Module Reference Manual

MiniModuleTM SIO
PC/104 Expansion Module
Reference Manual
P/N 50-1Z038-1000 Revision 1.0
Notice Page
DISCLAIMER
ADLINK Technology, Incorporated makes no representations or warranties with respect to the contents of
this manual or of the associated ADLINK products, and specifically disclaims any implied warranties of
merchantability or fitness for any particular purpose. ADLINK shall under no circumstances be liable for
incidental or consequential damages or related expenses resulting from the use of this product, even if it has
been notified of the possibility of such damages. ADLINK reserves the right to revise this publication from
time to time without obligation to notify any person of such revisions. If errors are found, please contact
ADLINK at the address listed below this disclaimer.
TRADEMARKS
CoreModule and the Ampro logo are registered trademarks, and ADLINK, Little Board, LittleBoard,
MightyBoard, MightySystem, MilSystem, MiniModule, ReadyBoard, ReadyBox, ReadyPanel,
RuffSystem, and ReadySystem are trademarks of ADLINK Technology, Inc. All other marks are the
property of their respective companies.
REVISION HISTORY
Revision
Reason for Change
Date
1.0
Initial Release
Jan/10
ADLINK Technology, Incorporated
5215 Hellyer Avenue
San Jose, CA 95138-1007
Tel. 408 360-0200
Fax 408 360-0222
www.adlinktech.com
© Copyright 2010 ADLINK Technology, Incorporated
Audience Assumptions
This manual provides reference only for computer design engineers, including but not limited to hardware
and software designers and applications engineers. ADLNK Technology, Inc. assumes you are qualified to
design and implement prototype computer equipment.
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Reference Manual
MiniModule SIO
Contents
Chapter 1
About This Manual ....................................................................................................1
Purpose ...........................................................................................................................................1
References ......................................................................................................................................1
Chapter 2
Product Overview......................................................................................................3
Stackable Architecture ....................................................................................................................3
Product Description..........................................................................................................................4
Module Features ........................................................................................................................4
Block Diagram ............................................................................................................................5
Major Integrated Circuits (ICs)....................................................................................................6
Headers, Connectors, and Sockets .................................................................................................9
Jumper Settings .......................................................................................................................12
Specifications.................................................................................................................................13
Physical Specifications ............................................................................................................13
Mechanical Specifications ........................................................................................................13
Power Specifications ................................................................................................................14
Environmental Specifications....................................................................................................14
Thermal/Cooling Requirements ................................................................................................14
Chapter 3
Hardware..................................................................................................................15
Overview ........................................................................................................................................15
MiniBlade Storage Solution............................................................................................................15
Serial Interfaces .............................................................................................................................17
Parallel (LPT) Port Interface ..........................................................................................................19
USB Interfaces ..............................................................................................................................20
I2C Bus ..........................................................................................................................................20
Keyboard/Mouse Interface.............................................................................................................20
Power In Interface..........................................................................................................................21
Battery Interface.............................................................................................................................21
LPC (Low Pin Count) Interface ......................................................................................................22
Appendix A
Technical Support...................................................................................................23
Index...................................................................................................................................................25
List of Figures
Figure 2-1.
Figure 2-2.
Figure 2-3.
Figure 2-4.
Figure 2-5.
Figure 2-6.
Figure 2-7.
Figure 2-8.
Figure 2-9.
Figure 3-1.
MiniModule SIO
Stacking the MiniModule ISA with CoreModule Product..........................................3
MiniModule SIO Block Diagram ...............................................................................5
MiniModule SIO Components (Bottom-Side View) ..................................................7
MiniModule SIO Components (Top-Side View) .......................................................8
Connector Pin Identifications .................................................................................10
Header and Connector Locations (Top-Side View) ...............................................10
Header and Connector Locations (Bottom-Side View) ..........................................11
Jumper Locations (Top-Side View)........................................................................12
Mechanical Dimensions (Top-Side View) ..............................................................13
RS-485 Serial Port Implementation .......................................................................17
Reference Manual
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Contents
List of Tables
Table 2-1.
Major Integrated Circuit Description and Function .................................................. 6
Table 2-2.
Module Header, Connector, and Socket Descriptions ............................................ 9
Table 2-3.
Jumper Header Pin Definitions.............................................................................. 12
Table 2-4.
Weight and Footprint Dimensions ......................................................................... 13
Table 2-5.
Power Supply Requirements ................................................................................. 14
Table 2-6.
Environmental Requirements ................................................................................ 14
Table 3-1.
MiniBlade Interface Pin Signal Definitions (J19) ................................................... 15
Table 3-2.
Serial Port Interface Pin Signal Definitions (J7, J9, J10, and J11) ........................ 18
Table 3-3.
LPT Port Interface Pin Signal Definitions (J15) ..................................................... 19
Table 3-4.
USB1 and USB2 Interfaces Pin Signal Definitions (J13)....................................... 20
Table 3-5.
I2C Header Pin Signal Definitions (J14) ................................................................ 20
Table 3-6.
Keyboard/Mouse Interface Pin Signal Definitions (J16) ........................................ 20
Table 3-7.
Power In Interface Pin Signal Descriptions (J18) .................................................. 21
Table 3-8.
LPC Interface Pin/Signal Descriptions (J21) ......................................................... 22
Table A-1.
Technical Support Contact Information ................................................................. 23
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MiniModule SIO
Chapter 1
About This Manual
Purpose
This manual provides technical information to allow embedded system designers to expand their embedded
systems.
Information provided in this manual includes:
•
MiniModule SIO board specifications
•
Environmental requirements
•
Major Integrated Circuit (IC) definitions
•
MiniModule SIO board header and connector definitions
Information not provided in this manual includes:
•
Detailed chip specifications
•
Internal component operation
•
Internal registers or signal operations
•
Bus or signal timing for industry standard busses and signals
•
Industry standard connector pinout tables
References
The following list of references may help you successfully complete your design.
Specifications
•
LPC Specification Revision 1.1, August, 2002
Web site: http://www.intel.com/design/chipsets/industry/25128901.pdf
•
MiniBlade Specification Revision 1.00, March 6, 2009
Web site: http://www.sff-sig.org/miniblade.html
•
SUMIT Specification Revision 1.4, May 14, 2009
Web site: http://www.sff-sig.org/sumit_spec_v10.pdf
•
PC/104 Specification Revision 2.5, November 2003
Web site: http://www.pc104.org
Major Integrated Circuit (ICs) Specifications:
•
Fintek, Inc. and the LPC-to-ISA Bridge, F85226FG
Web site: http://www.fintek.com.tw/files/productfiles/F85226AF_V020P.pdf
•
SMSC, Inc. and the LPC Super I/O, SCH3114I-NU
Web site: http://www.smsc.com/media/Downloads_Public/Data_Briefs/311xdb.pdf
•
Maxim Integrated Products and the RS-232 Transceiver, MAX213EEAI
Web site: http://datasheets.maxim-ic.com/en/ds/MAX202E-MAX241E.pdf
•
Linear Technology and the RS-422/485 Transceiver, LTC1334CG#PBF
Web site: http://cds.linear.com/docs/Datasheet/1334fa.pdf
MiniModule SIO
Reference Manual
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Chapter 1
2
About This Manual
Reference Manual
MiniModule SIO
Chapter 2
Product Overview
This introduction presents general information about Stackable architecture and the MiniModule SIO
expansion board. After reading this chapter you should understand:
•
Stackable Architecture
•
MiniModule SIO Features
•
MiniModule SIO Product Description
•
MiniModule SIO Major Components and Headers
•
MiniModule SIO Specifications
Stackable Architecture
Stackable architecture affords a great deal of flexibility in system expansion. The SUMIT interface allows
you to add legacy I/O to a legacy-free CoreModule board by simply stacking an ADLINK MiniModule SIO
board onto the CoreModule SUMIT connectors. Expanding a simple CoreModule system by adding selfstacking MiniModule SIOs or 3rd party PC/104 expansion boards provides functional capabilities such as:
•
Analog or digital I/O (including serial, parallel, and USB 2.0)
•
PCIe links
•
ISA bus
PC/104 expansion modules can be stacked with the MiniModule SIO, avoiding the need for card cages and
backplanes. PC/104 expansion modules can be mounted directly to the PC/104 bus connector of the
MiniModule SIO with an inter-board spacing of ~0.60 inches so that a 3-module system fits in a 3.6 x 3.8 x
2.4 inch space. See Figure 2-1.
PC/104 Module
4-40 nut (4)
0.6 inch spacer (4)
MiniModule SIO
Sumit Stackthrough
0.6 inch spacer (4)
CoreModule
4-40 screw (4)
Figure 2-1. Stacking the MiniModule ISA with CoreModule Product
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Chapter 2
Product Overview
Product Description
The MiniModule SIO is a bus bridge module providing LPC-to-ISA bridge conversion for PC/104
compatible expansion boards. The expansion bus connectors of the MiniModule SIO conform to the SUMIT
and PC/104 standards and can be installed directly onto ADLINK’s CoreModule Single Board Computer
(SBC). The necessary Serial IRQ signals are provided through the SUMIT A interface at pin 34. The
MiniModule SIO receives +3.3V, +5V, and +12V power through the SUMIT A interface and +3.3V and
+5V through the SUMIT B interface. The J18 header receives +5V and +12V for the PC/104 ISA bus.
In addition to the ISA bridge function, the MiniModule SIO includes a Mini-Blade socket, four serial ports,
one I2C header, two USB ports, one parallel port (LPT) header, two headers for PS/2 mouse and keyboard,
and one LPC header.
Module Features
•
Supports PC/104 Bus expansion interface
•
Provides ISA bus signals through PC/104 connector
•
Transparent to the Operating System
LPC Super I/O
•
Integrates hardware monitor functions
•
Provides Two high-speed 16550 compatible UARTs with 16-byte send/receive FIFOs
•
Supports PS/2 compatible bi-directional parallel port
LPC-to-ISA Bridge Controller:
4
•
Provides full ISA bridge support except bus master (by conditions)
•
Provides 16-bit and 8-bit I/O and memory R/W
•
Provides ISA parallel IRQ transfer to serial IRQ by IRQ serializer
•
All ISA signals can be isolated
Reference Manual
MiniModule SIO
Chapter 2
Product Overview
Block Diagram
Figure 2-2 shows the functional components of the module.
PC/104
Connector
PS/2
ISA
LPC
Parallel
Port
Header
DB9
Connectors (2)
R232/422/485
Headers (2)
Sumit Connector B - Top
Keyboard
and Mouse
Headers
R232/422/485
Headers (2)
R232/422/485
Transceivers (2)
LPT
LPC Header
R232/422/485
Transceivers (2)
Sumit Connector A - Top
LPC-to-ISA
Bridge
F85226FG
LPC
Super I/O
SCH3114I-NU
LPC
I2C
Header
USB
Header
MiniBlade
Connector
MMSIO_BlkDiag_a
LPC
SPI
I2C
LPC
USB 2.0 (2)
USB 2.0 (1)
PCIe x1
Sumit Connector B - Bottom
PCIe x1 (3)
Sumit Connector A - Bottom
LPC Bus (4)
USB 2.0 (3)
PCIe x1
SPI
I2C
Figure 2-2. MiniModule SIO Block Diagram
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Chapter 2
Product Overview
Major Integrated Circuits (ICs)
Table 2-1 lists the major ICs on the MiniModule SIO, and Figures 2-3 and 2-4 show the locations of the
major ICs.
Table 2-1. Major Integrated Circuit Description and Function
6
Chip Type
Mfg.
Model
Description
LPC-to-ISA Bridge
(U6)
Fintek
F85226FG
Converts LPC to ISA signal for use with
legacy ISA interfaces.
LPC Super I/O
(U7)
SMSC
SCH3114I-NU
Functions for legacy I/O
RS-232
Transceiver (U8)
Maxim
MAX213EEAI
RS-232 Transceiver for COM1 and COM2
RS-485/422
Transceiver (U10)
Linear
LTC1334CG#PBF
RS-422/485 Transceiver for COM1 and
COM2
RS-232
Transceiver (U12)
[On top side of
board; see
Figure 2-4]
Maxim
MAX213EEAI
RS-232 Transceiver for COM3 and COM4
RS-485/422
Transceiver (U14)
[On top side of
board; see
Figure 2-4]
Linear
LTC1334CG#PBF
RS-422/485 Transceiver for COM3 and
COM4
Reference Manual
MiniModule SIO
Chapter 2
Product Overview
Key:
U6 - ISA Bridge
U7 - Super I/O
U8 - R2-232 Transceiver
U10 - R2-485/422 Transceiver
U7
U10
U8
MMSIO_comp_bottom_a
U6
Figure 2-3. MiniModule SIO Components (Bottom-Side View)
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Chapter 2
Product Overview
Key:
U12 - R2-232 Transceiver
U14 - R2-485/422 Transceiver
U14
U12
MMSIO_comp_top_a
Figure 2-4. MiniModule SIO Components (Top-Side View)
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Product Overview
Headers, Connectors, and Sockets
Table 2-2 describes the headers, connectors, and sockets shown in Figures 2-6 and 2-8.
Table 2-2. Module Header, Connector, and Socket Descriptions
Jack/Plug #
Board
Access
Description
J1 – SUMIT A
Top
52-pin, 0.025" (0.635mm) connector for USB, PCIe, Power,
ACPI, SMBus, I2C, SPI, LPC, Serial, Keyboard, Mouse, and
Clock signals
J2 – SUMIT B
Top
52-pin, 0.025" (0.635mm) connector for PCIe and Power
J3 – SUMIT A
[On bottom side of
board; see Figure 2-7]
Bottom
52-pin, 0.025" (0.635mm) connector for USB, PCIe, Power,
ACPI, SMBus, I2C, SPI, LPC, Serial, Keyboard, Mouse, and
Clock signals
J4 – SUMIT B
[On bottom side of
board; see Figure 2-7]
Bottom
52-pin, 0.025" (0.635mm) connector for PCIe and Power
J5 – Battery
Top
2-pin, 0.049" (1.24mm), shrouded header for VBAT supply
voltage to the SIO
NOTE
MMSIO battery cannot be used concurrently with the
CM730 battery.
J6 – Serial
Top
9-pin, 0.109" (2.77mm) DB9 connector for serial port 1 (COM1)
J7 – Serial
Top
10-pin, 0.079" (2.0mm) header for serial port 1 (COM1)
J8 – Serial
Top
9-pin, 0.109" (2.77mm) DB9 connector for serial port 2 (COM2)
J9 – Serial
Top
10-pin, 0.079" (2.0mm) header for serial port 2 (COM2)
J10 – Serial
Top
10-pin, 0.079" (2.0mm), right-angle header for serial port 3
(COM3)
J11 – Serial
Top
10-pin, 0.079" (2.0mm), right-angle header for serial port 4
(COM4)
J12 – NA
NA
Not available
J13 – USB
Top
10-pin, 0.079" (2.0mm) header for USB1 and USB2 ports
J14 – I2C
Top
5-pin, 0.049" (1.25mm) header for I2C bus signals
J15 – Parallel
Top
26-pin, 0.079" (2.0mm) right-angle header for printer port (LPT1)
J16 – Keyboard
and Mouse
Top
10-pin, 0.079" (2.0mm), shrouded header for Keyboard and
Mouse signals
J17 – PC/104
Top
104-pin, 0.100" (2.54mm) connector for PC/104 (ISA) bus
J18 – Power In
Top
10-pin, 0.100" (2.54mm), right-angle header for external power to
PC/104 (ISA) bus (required for most PC/104 ISA cards)
J19 – MiniBlade
Socket
Top
40-pin, 0.031" (0.80mm), right-angle edge socket for flash storage
module
J20 –
SUMIT A/B Wake
Top
2-pin, 0.079" (2.0mm) jumper header for selecting SUMIT A/B
connectors to wake simultaneously. See Table 2-3 on page 12.
J21 – LPC
Top
10-pin, 0.079" (2.0mm) header for LPC signals
MiniModule SIO
Reference Manual
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Chapter 2
Product Overview
The pinout tables in Chapter 3 of this manual identify pin sequences using the
following methods: A 10-pin header with two rows of pins, using odd/even
numbering, where pin 2 is directly across from pin 1, is noted as 10-pin, 2 rows, odd/
even (1, 2). Alternately, a 10-pin header using consecutive numbering, where pin 6 is
directly across from pin 1, is noted in this way: 10-pin, 2 rows, consecutive (1, 6).
The second number in the parenthesis is always directly across from pin 1. See
Figure 2-5.
MMSIO_ConNum_a
NOTE
54 3 21
9 7531
10-pin, two rows,
10-pin, two rows,
Odd/Even, (1, 2)
Or Consecutive, (1, 11)
10 8 6 4 2
6
10
Figure 2-5. Connector Pin Identifications
JP5 JP4
Key:
J1 - SUMIT A, Top
J2 - SUMIT B, Top
J5 - Battery
J6 - COM1, DB9
J7 - COM1
J8 - COM2, DB9
J9 - COM2
J10 - COM3
J11 - COM4
J12 - Not Available
J13 - USB1 and USB2
J14 - I2C
J15 - Parallel
J16 - Keyboard and Mouse
J17 - PC/104
J18 - Power In
J19 - MiniBlade
J20 - SUMIT A/B Wake
J21 - LPC
J1
J20
J6
J8
MMSIO_conn_top_a
Figure 2-6. Header and Connector Locations (Top-Side View)
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Chapter 2
Product Overview
NOTE
Pin 1 is shown as a black square on vertical headers and connectors and DB9
connectors. Black squares on right-angle headers indicate pin 2 on the top side
and pin 1 on the bottom side.
J4
MMSIO_conn_bottom_a
J3
Figure 2-7. Header and Connector Locations (Bottom-Side View)
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Chapter 2
Product Overview
Jumper Settings
Table 2-3 defines the jumper header pins shown in Figure 2-8.
Table 2-3. Jumper Header Pin Definitions
Jumper #
Installed/Enabled
Removed/Enabled
JP2 – RS-485/422 for COM2
Enable (pins 1-2)
Disable (removed) Default
JP3 – RS-485/422 for COM1
Enable (pins 1-2)
Disable (removed) Default
JP4 – RS-485/422 for COM4
Enable (pins 1-2)
Disable (removed) Default
JP5 – RS-485/422 for COM3
Enable (pins 1-2)
Disable (removed) Default
J20 – SUMIT A/B
Dual Wake Control
Enable (pins 1-2)
Disable (removed) Default
JP5 JP4
J20
JP3
JP2
MMSIO_jmpr_top_a
Figure 2-8. Jumper Locations (Top-Side View)
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Chapter 2
Product Overview
Specifications
Physical Specifications
Table 2-4 shows the physical dimensions of the module, and Figure 2-9 gives the mounting dimensions.
Table 2-4. Weight and Footprint Dimensions
Item
Dimension
Weight
0.100kg. (0.200lbs.)
Height (overall)
10.75 mm (0.423 inches)
Width
95.89 mm (3.775 inches)
Length
102.87 mm (4.05 inches)
3.200
2.900
2.575
1.500
0.000
0.350
Mechanical Specifications
0.200
3.575
0.000
1.400
2.750
0.000
0.200
MMSIO_MechDwg_top_a
3.850
3.350
0.000
0.200
Figure 2-9. Mechanical Dimensions (Top-Side View)
NOTE
MiniModule SIO
All dimensions are given in inches. Pin 1 is shown as a black pin (square or
round) on vertical headers and connectors and DB9 connectors. Black squares
on right-angle headers indicate pin 2.
Reference Manual
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Chapter 2
Product Overview
Power Specifications
Table 2-5 provides the power requirements for the MiniModule SIO powered by the CoreModule 730 SBC.
Table 2-5. Power Supply Requirements
Parameter
Characteristics for 1.6GHz CPU
Input Type
Regulated DC voltages
In-rush Current
(Maximum)
1.81A (9.05W)
Idle Power
1.00A (5.00W)
BIT* Current
(Typical)
1.99A (9.95W)
Operating configurations:
•
In-rush operating configuration includes CoreModule 730 SBC, CRT video, and 1GB DDR2 RAM.
•
Idle operating configuration includes the In-rush configuration as well as on-board 128MB Compact
Flash, one PATE hard drive, one mouse, and one keyboard.
•
*BIT = Burn-In-Test operating configuration includes Idle configuration as well as one USB Compact
Flash reader with 64MB Compact Flash, one Ethernet connection, and one USB CD-ROM drive.
Environmental Specifications
Table 2-6 provides the operating and storage condition ranges required for this module.
Table 2-6.
Environmental Requirements
Parameter
Conditions
Temperature
Operating
–20° to +70° C (–4° to +158° F)
Extended (Optional)
–40° to +85° C (–40° F to +185° F)
Storage
–55° to +85° C (–67° F to +185° F)
Humidity
Operating
5% to 90% relative humidity, non-condensing
Non-operating
5% to 95% relative humidity, non-condensing
Thermal/Cooling Requirements
The LPC-to-ISA bridge controller (U6) and the Super I/O controller (U7) are sources of heat on the board,
and neither of these devices requires a heatsink.
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MiniModule SIO
Chapter 3
Hardware
Overview
This chapter discusses the user interfaces of the module in the following order:
•
MiniBlade Storage Solution
•
Serial Interfaces
•
Parallel Interface
•
USB Interfaces
•
•
•
•
•
I2C Bus
Keyboard/Mouse Interface
Power In Interface
Battery Interface
LPC Interface
NOTE
ADLINK Technology, Inc. supports only the features tested and listed in this manual.
The integrated circuits used in the MiniModule SIO may provide more features than
are listed for the MiniModule SIO, but some of these features are not supported on
the module and will not function as specified.
This chapter includes pinout tables only for non-standard headers and connectors.
This chapter does not include pinout tables for standard headers and connectors such
as Serial DB9, PC/104, and SUMIT.
MiniBlade Storage Solution
The MiniBlade consists of a 40-pin, right-angle socket interface. This socket will carry all of the appropriate
USB signals. Possible uses for the storage system include a rugged flash storage device, rugged operating
system boot device, or a rugged wireless transceiver.
Table 3-1 provides the pin signal definitions for the MiniBlade Storage System.
Table 3-1. MiniBlade Interface Pin Signal Definitions (J19)
Pin #
Signal
Description
1
+3VSB
Standby Voltage – Connecting the always-on standby voltage +3V to the
target electronics allows the module to remain powered during lowpower ACPI suspend/standby/sleep states for those SBCs that support
ACPI.
2
SMB/I2C_DATA
3
SATA+
4
SMB/I2C_CLK
5
SATA-
6
SMB/
I2C_ALERT#
7
+3V3_1
MiniModule SIO
Not connected
Reference Manual
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Chapter 3
Hardware
Table 3-1. MiniBlade Interface Pin Signal Definitions (J19) (Continued)
8
+5V
9
NC
10
LED
11
NC
12
BLADE_REQ#
13
+3V3_2
Not connected
14
NC
Not connected
15
GND1
16
NC
17
USB+
18
NC
19
USB-
20
NC
21
GND2
22
NC
23
A_PETP0
24
NC
25
A_PETN0
26
NC
27
BLADE_PRSNT#
28
NC
29
A_PERP0
30
NC
31
A_PERN0
32
NC
33
GND3
34
NC
35
A_CLKP
36
NC
37
A_CLKN
38
PERST#
39
PCIE-PRSNT#
40
WAKE#
Not Connected
Not Connected
Not Connected
Not Connected
Not Connected
Not Connected
Not Connected
Not Connected
Not Connected
Not Connected
Not Connected
Not Connected
Not Connected
Note: The shaded area denotes power or ground. Signals marked with # indicate Active Low.
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Chapter 3
Hardware
Serial Interfaces
The LPC Super I/O chip (SCH3114I-NU) provides the circuitry for four serial ports through four
transceivers. Transceivers U8 and U12 provide RS-232 signals, and transceivers U10 and U14 provide
RS-485/422 signals. The J7 and J9 headers each consist of 10 vertical pins, 2 rows, odd/even (1, 2) pin
sequence, and 0.079" (2.0mm) pitch. The J10 and J11 headers each consist of 10 right-angle pins, 2 rows,
odd/even (1, 2) pin sequence, and 0.079" (2.0mm) pitch. The two DB9 connectors, J6 and J8, are standard
serial connectors, and those pinouts are not included in this manual. The J7 and J9 headers serve as internal
alternatives to the DB9 connectors (COM1 and COM2). The four serial ports support the following features:
•
Programmable word length, stop bits and parity
•
16-bit programmable baud rate generator
•
Interrupt generator
•
Loop-back mode
•
Four individual 16-bit FIFOs
•
Serial Interfaces:
♦
Serial COM1 (J7) supports RS-232/RS-485/422 with full modem operation
♦
Serial COM2 (J9) supports RS-232/RS-485/422 with full modem operation
♦
Serial COM3 (J10) supports RS-232/RS-485/422 with full modem operation
♦
Serial COM4 (J11) supports RS-232/RS-485/422 with full modem operation
NOTE
The RS-485/422 mode for any serial port is selected in the BIOS Setup Utility.
However, the RS-232 mode is the default for any serial port.
RS-485/422 mode termination is selected with jumper JP2 for COM2, JP3 for
COM1, JP4 for COM4, and JP5 for COM3. Refer to Table 2-3 for more
information.
Serial Headers
J7, J9, J10, and J11
(COM1, COM2, COM3,
and COM4)
1 2 3 4 5
9 7531
Or
10 8 6 4 2
Standard DB9 Serial
Port Connectors
(COM1 and COM2)
Male Front View
6 7 8 9
MMSIO_RS485jump_a
To implement the two-wire RS-485 mode on any of the 10-pin serial headers, you must tie pin 3 (Rx Data –)
to 5 (Tx Data –) and pin 4 (Tx Data +) to 6 (Rx Data +) as shown in Figure 3-1. As an alternate, you may
short the equivalent pins on the DB9 connectors attached to respective serial ports, as shown in Figure 3-1.
Refer also to Table 3-2 for the specific pin signals on each of the headers. The RS-422 mode uses a four-wire
interface and does not require combining pins for its operation, but you must select RS-485 in BIOS Setup.
Figure 3-1. RS-485 Serial Port Implementation
Table 3-2 lists the pin signals for each of the serial headers (J7, J9, J10, and J11.) Refer to previous bullets in
this section for port number identification.
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Chapter 3
Hardware
Table 3-2. Serial Port Interface Pin Signal Definitions (J7, J9, J10, and J11)
Pin #
Signal
DB9 #
Description
1
DCD#
1
Data Carrier Detect – Indicates external serial device is detecting a
carrier signal (i.e., a communication channel is currently open). In direct
connect environments, this input is driven by DTR as part of the DTR/
DSR handshake.
2
DSR#
6
Data Set Ready – Indicates external serial device is powered, initialized,
and ready. Used as hardware handshake with DTR for overall readiness.
3
RXD
2
Receive Data – Serial port receive data input is typically held at a logic 1
(mark) when no data is being transmitted, and is held “Off” for a brief
interval after an “On” to “Off” transition on the RTS line to allow the
transmission to complete.
Rx Data –
4
RTS#
Serial Port 1 or 2 – If in RS-485 mode, this pin is Rx Data Negative.
7
Tx Data +
5
TXD
Serial Port 1 or 2 – If in RS-485 mode, this pin is Tx Data Positive.
3
Tx Data –
6
CTS#
Request To Send – Indicates serial port is ready to transmit data. Used as
hardware handshake with CTS for low level flow control.
Transmit Data – Serial port transmit data output is typically held to a
logic 1 when no data is being sent. Typically, a logic 0 (On) must be
present on RTS, CTS, DSR, and DTR before data can be transmitted on
this line.
Serial Port 1 or 2 – If in RS-485 mode, this pin is Tx Data Negative.
8
Rx Data +
Clear To Send – Indicates external serial device is ready to receive data.
Used as hardware handshake with RTS for low level flow control.
Serial Port 1 or 2 – If in RS-485 mode, this pin is Rx Data Positive.
7
DTR#
4
Data Terminal Ready – Indicates serial port is powered, initialized, and
ready. Used as hardware handshake with DSR for overall readiness.
8
RI#
9
Ring Indicator – Indicates external serial device is detecting a ring
condition. Used by software to initiate operations to answer and open the
communications channel.
9
GND
5
Ground
10
Key/NC
NC
Key Pin/Not connected
Note: The shaded area denotes ground. Signals are listed in the following order: RS232 followed by
RS485/RS422. Signals marked with # indicate Active Low.
18
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Chapter 3
Hardware
Parallel (LPT) Port Interface
Table 3-3 provides the pin signal descriptions for the parallel port header consisting of 26 pins, 2 rows with
odd/even (1, 14) pin sequence, and 0.079" (2.0mm) pitch.
Table 3-3.
LPT Port Interface Pin Signal Definitions (J15)
Pin
#
Signal
Descriptions
1
STRB*
Strobe – Output used to strobe data into the printer. I/O pin in ECP/EPP mode.
2
AFD*
Auto Feed – This is Request signal to the printer to automatically feed one line
after each line is printed.
3
PD0
Parallel Port Data 0 – These signals (0 to 7) provide the parallel port data.
4
ERR*
Error – This is a Status output signal from the printer. A Low State indicates an
error condition on the printer.
5
PD1
Parallel Port Data 1 – These signals (0 to 7) provide the parallel port data.
6
INIT*
Initialize – This signal is used to Initialize printer. Output in standard mode, I/
O in ECP/EPP mode.
7
PD2
Parallel Port Data 2 – These signals (0 to 7) provide the parallel port data.
8
SLIN*
Select In – This signal Output used to select the printer. I/O pin in ECP/EPP
mode.
9
PD3
Parallel Port Data 3 – These signals (0 to 7) provide the parallel port data.
11
PD4
Parallel Port Data 4 – These signals (0 to 7) provide the parallel port data.
13
PD5
Parallel Port Data 5 – These signals (0 to 7) provide the parallel port data.
15
PD6
Parallel Port Data 6 – These signals (0 to 7) provide the parallel port data.
17
PD7
Parallel Port Data 7 – These signals (0 to 7) provide the parallel port data.
19
ACK*
Acknowledge – This is a Status output signal from the printer. A Low State
indicates it has received the data and is ready to accept new data.
21
BUSY
Busy – This is a Status output signal from the printer.
23
PE
Paper End – This is a Status output signal from the printer. A High State
indicates it is out of paper.
25
SLCT
Select – This is a Status output signal from the printer. A High State indicates
it is powered on.
26
Key
Not connected
10, 12,
14, 16,
18, 20,
22, 24
GND
Ground
Note: The shaded area denotes power or ground. The signals marked with * indicate signal inversion.
MiniModule SIO
Reference Manual
19
Chapter 3
Hardware
USB Interfaces
The MiniModule SIO provides two USB ports (USB1 and USB2) on a 10-pin header. The USB ports are
protected with a power distributor that detects over-current situations and acts as a fuse to protect the ports
and devices on the ports.
Table 3-4 lists the pin signals for the USB1 and USB2 header which consists of 10 pins, two rows, odd/even
(1, 2) pin sequence, and 0.079" (2.0mm) pitch.
Table 3-4. USB1 and USB2 Interfaces Pin Signal Definitions (J13)
Pin #
Signal
Description
1
USB POWER 2
+5 volts power
2
USB POWER 1
+5 volts power
3
CONN USB2 N
USB2 data negative
4
CONN USB1 N
USB1 data negative
5
CONN USB2 P
USB2 data positive
6
CONN USB1 P
USB1 data positive
7
USB GND2
Ground
8
USB GND1
Ground
9
USB GND2
Ground
10
USB GND1
Ground
Note: The shaded areas denote power or ground.
I2C Bus
Table 3-5 lists the pin signals for the I2C bus which provides a medium-speed serial interface. The I2C
header consists of 5 pins, single row with 0.049" (1.25mm) pitch.
Table 3-5. I2C Header Pin Signal Definitions (J14)
Pin #
Signal
Description
1
SCL
Serial Clock Line
2
GND
Ground
3
SDA
Serial Data Line
4
VSM
+3.3 Volts Power
5
ALERT#
I2C Alert
Note: The shaded areas denote power or ground. Signals marked with # indicate Active Low.
Keyboard/Mouse Interface
Table 3-6 lists the pin signals for the keyboard and mouse header which consists of 10 pins, 2 rows with odd/
even (1, 2) pin sequence, and 0.079" (2.0mm) pitch.
Table 3-6. Keyboard/Mouse Interface Pin Signal Definitions (J16)
20
Pin #
Signal
Description
1
KEY VCC
+5 Volts
2
KEY DATA
Keyboard data
3
KEY CLK
Keyboard clock
4
KEY GND
Keyboard ground
Reference Manual
MiniModule SIO
Chapter 3
Hardware
Table 3-6. Keyboard/Mouse Interface Pin Signal Definitions (J16) (Continued)
5
KEY GND
Keyboard ground
6
KEY GND
Keyboard ground
7
KEY VCC
+5 Volts
8
DAT MOUSE
Mouse data
9
CLK MOUSE
Mouse clock
10
KEY GND
Keyboard ground
Note: The shaded area denotes power or ground.
Power In Interface
The PC/104 interface requires +12/5V power and is provided by the Power In header (J18). Though not
recommended for use when the PC/104 add-on board is powered directly, the Power In header supplies the
voltages shown in Table 3-7 directly to the PC/104 connector.
Table 3-7 describes the Power In Interface, which consists of a 10-pin, right-angle, header with two rows,
odd/even (1, 2) pin sequence, and 0.100" (2.54mm) pitch.
Table 3-7. Power In Interface Pin Signal Descriptions (J18)
Pin #
Signal
Description
1
GND
Ground
2
+5
+5 Volts +/- 5%
3
Key/GND
Key Pin on connector/Grounded on board
4
+12V
+12 Volts +/- 5%
5
GND
Ground
6
NC
Not connected
7
GND
Ground
8
+5
+5 Volts +/- 5%
9
GND
Ground
10
+5
+5 Volts +/- 5%
Note: The shaded area denotes power or ground.
Battery Interface
An external battery connection is provided through the J5 header for the SIO VBAT supply voltage. Pin 1 is
+3.3 volts power, and Pin 2 is Ground. See Figure 2-6 on page 10 for pin locations.
NOTE
MiniModule SIO
MMSIO battery cannot be used concurrently with the CM730 battery.
Reference Manual
21
Chapter 3
Hardware
LPC (Low Pin Count) Interface
The LPC interface provides expansion for custom LPC devices that require high-speed buses. The LPC
header consists of 10 pins with 2 rows, odd/even (1, 2) pin sequence, and 0.050" (1.27mm) pitch. Table 3-8
describes the pin signals of the LPC interface.
Table 3-8. LPC Interface Pin/Signal Descriptions (J21)
Pin #
Signal
Description
1
V.3.3
+3.3 Volts Power
2
GND
Ground
3
NC
Not Connected
4
AD3
Command, Address, and Data 3
5
RESET*
Reset Signals - reset the connected LPC device
6
AD2
Command, Address, and Data 2
7
CLK_LPC
LPC Clock
8
AD1
Command, Address, and Data 1
9
FRAME*
Frame Signals - indicate start of new cycle or termination of broken cycle
10
AD0
Command, Address, and Data 0
Note: The shaded area denotes power or ground. Signals marked with # indicate Active Low.
22
Reference Manual
MiniModule SIO
Appendix A
Technical Support
ADLINK Technology, Inc. provides a number of methods for contacting Technical Support listed below in
Table A-1. Requests for support through the Ask an Expert are given the highest priority, and usually will be
addressed within one working day.
•
ADLINK’s Ask an Expert – This is a comprehensive support center designed to meet all your technical
needs. This service is free and available 24 hours a day through the Ampro By ADLINK web page at
http://www.adlinktech.com/AAE/ . This includes a searchable database of Frequently Asked Questions,
which will help you with the common information requested by most customers. This is a good source
of information to look at first for your technical solutions. However, you must register online if you
wish to use the Ask a Question feature.
ADLINK strongly suggests that you register with the web site. By creating a profile on the ADLINK
web site, you will have a portal page called “My ADLINK” unique to you with access to exclusive
services and account information.
•
Personal Assistance – You may also request personal assistance by creating an Ask an Expert account
and then going to the Ask a Question feature. Requests can be submitted 24 hours a day, 7 days a week.
You will receive immediate confirmation that your request has been entered. Once you have submitted
your request, you must log in to go to My Stuff area where you can check status, update your request,
and access other features.
•
Download Service – This service is also free and available 24 hours a day at
http://www.adlinktech.com. For certain downloads such as technical documents and software, you must
register online before you can log in to this service.
Table A-1. Technical Support Contact Information
Method
Contact Information
Ask an Expert
http://www.adlinktech.com/AAE/
Web Site
http://www.adlinktech.com
Standard Mail
ADLINK Technology Inc.
Address: 9F, No.166 Jian Yi Road, Chungho City,
Taipei County 235, Taiwan
♿▦傲₼✛ゑㆉ₏恾 166 壮 9 㲢
Tel:
+886-2-8226-5877
Fax:
+886-2-8226-5717
Email:
service@adlinktech.com
Ampro ADLINK Technology Inc.
Address: 5215 Hellyer Avenue, #110, San Jose, CA 95138, USA
Tel:
+1-408-360-0200
Toll Free: +1-800-966-5200 (USA only)
Fax:
+1-408-360-0222
Email:
info@adlinktech.com
ADLINK Technology Beijing
Address: ▦℻ゑ䀆䁏◉ₙ⦿₫恾 1 ⚆䥗⒪┷┪⮶☵ E ㄶ 801 ⸳
(100085)
Rm. 801, Power Creative E, No. 1, B/D
Shang Di East Rd., Beijing 100085, China
Tel:
+86-10-5885-8666
Fax:
+86-10-5885-8625
Email:
market@adlinktech.com
MiniModule SIO
Reference Manual
23
Appendix A
Technical Support
Table A-1. Technical Support Contact Information (Continued)
ADLINK Technology Shanghai
Address: ₙ䀆ゑ䆤㽂㾍浧䱠㔏㆏♠◉朵㻮恾 333 ⚆ 39 ヱ 4 ⻑
(200233)
Tel:
+86-21-6495-5210
Fax:
+86-21-5450-0414
Email:
market@adlinktech.com
ADLINK Technology Shenzhen
Address: 䂀⧂ゑ◦⼀◉䱠㔏⥼◦◉浧㠿◦ₒ拢 㟿ⷦ㔏㦾⥼
A1 㪚 2 㰋 C ◉ (518057)
2F, C Block, Bld. A1, Cyber-Tech Zone,
Gao Xin Ave. Sec 7, High-Tech Industrial Park S.,
Shenzhen, 518054 China
Tel:
+86-755-2643-4858
Fax:
+86-755-2664-6353
Email:
market@adlinktech.com
ADLINK Technology Inc. (German Liaison Office)
Address: Nord Carree 3, 40477 Duesseldorf, Germany
Tel:
+49-211-495-5552
Fax:
+49-211-495-5557
Email:
emea@adlinktech.com
ADLINK (French Liaison Office)
Address: 15 rue Emile Baudot, 91300 MASSY Cedex, France
Tel:
+33 (0) 1 60 12 35 66
Fax:
+33 (0) 1 60 12 35 66
Email:
france@adlinktech.com
ADLINK Technology Japan Corporation
Address: 151-0072 㨀℻掌䂚廆◉ヰዓ廆
1-1-2 㦬㡴䞮✌ヰዓ廆ኰወ 8F
Asahiseimei Hatagaya Bldg. 8F
1-1-2 Hatagaya, Shibuya-ku, Tokyo 151-0072, Japan
Tel:
+81-3-4455-3722
Fax:
+81-3-5333-6040
Email:
japan@adlinktech.com
ADLINK Technology Inc. (Korean Liaison Office)
Address: ꫑끭겑 ꫑뚽霡 ꫑뚽鶎 1506-25 뼑鵹 B/D 2 럪
2F, Hando B/D, 1506-25, Seocho-Dong,
Seocho-Gu,Seoul, 137-070, Korea
Tel:
+82-2-2057-0565
Fax:
+82-2-2057-0563
Email:
korea@adlinktech.com
ADLINK Technology Singapore Pte Ltd.
Address: 84 Genting Lane #07-02A, Cityneon Design Centre,
Singapore 349584
Tel:
+65-6844-2261
Fax:
+65-6844-2263
Email:
singapore@adlinktech.com
ADLINK Technology Singapore Pte Ltd. (Indian Liaison Office)
Address: No. 1357, "Anupama", Sri Aurobindo Marg, 9th Cross,
JP Nagar Phase I, Bangalore - 560078, India
Tel:
+91-80-65605817
Fax:
+91-80-22443548
Email:
india@adlinktech.com
24
Reference Manual
MiniModule SIO
Index
B
P
Battery Interface ................................................. 21
Power In Interface ...............................................21
C
R
connectors
pin arrangement description .......................... 10
pin identification ........................................... 10
references
PC/104 specifications ......................................1
web sites ..........................................................1
D
S
dimensions .......................................................... 13
serial ports
connector pin out ...........................................18
site preparation
environmental considerations ........................14
supported features
PS/2 Keyboard ...............................................20
serial ports ......................................................17
E
Environmental specifications .............................. 14
H
heatsink
requirements .................................................. 14
L
LPC Interface ...................................................... 22
M
major IC
web sites .......................................................... 1
MiniBlade Interface ............................................ 15
MiniModule SIO
expansion board .............................................. 3
ISA expansion board ....................................... 4
RS-485 mode ................................................ 18
serial connectors ............................................ 18
Serial IRQ signals ........................................... 4
MiniModule SIO
T
Technical Support
Ask an Expert ................................................23
contact information ........................................23
W
web sites
IC specifications ..............................................1
PC/104 specifications ......................................1
references .........................................................1
weight ..................................................................13
weight and dimensions ........................................13
Reference Manual
25
Index
26
Reference Manual
MiniModule SIO