ISM43362 M3x l44 Functional Specification


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ISM43362 M3x l44 Functional Specification | Manualzz

ISM43362-M3X Product Specification

INVENTEK SYSTEMS

ISM43362-M3G-L44

Embedded Serial-to-Wi-Fi Modules eS-WiFi™

802.11 b/g/n

Data Sheet

DOC-DS-20071-3.3.1

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Inventek Systems

ISM43362-M3X Product Specification

Table of Contents

1 GENERAL DESCRIPTION ................................................................................................... 4

2 PART NUMBER DETAIL DESCRIPTION .......................................................................... 5

2.1

Ordering Information ...................................................................................................... 5

3 GENERAL FEATURES ......................................................................................................... 5

3.1

Limitations ...................................................................................................................... 6

3.2

Regulatory Compliance .................................................................................................. 6

3.3

FCC and IC User’s Manual Statements: ......................................................................... 7

4 COMPLEMENTARY DOCUMENTATION ...................................................................... 10

4.1

Inventek Systems .......................................................................................................... 10

5 SPECIFICATIONS ............................................................................................................... 10

5.1

Module Architecture ..................................................................................................... 10

5.2

External Antenna Connections ..................................................................................... 11

5.3

Mechanical Specifications ............................................................................................ 11

5.4

Environmental Specifications ....................................................................................... 12

6 HARDWARE ELECTRICAL SPECIFICATIONS ............................................................. 12

6.1.1

Absolute Maximum Ratings ..................................................................................... 12

6.1.2

Recommended Operating Ratings ............................................................................ 12

7 POWER CONSUMPTION ................................................................................................... 13

7.1.1

Power Management Modes....................................................................................... 13

7.1.2

Stop Mode ................................................................................................................. 13

8 PIN OUT ............................................................................................................................... 14

8.1.1

Detailed Pin Description ........................................................................................... 15

8.1.2

Configuration Pins: ................................................................................................... 16

*Requires a 10K ohm pull down .............................................................................................. 16

9 FIRMWARE UPGRADES DURING DEVELOPMENT .................................................... 16

10 SERIAL HOST INTERFACES AVAILABLE .................................................................... 16

10.1

UART ............................................................................................................................ 16

10.1.1

Data Mode ............................................................................................................. 17

10.1.2

Flow Control ......................................................................................................... 17

10.1.3

Supported Baud Rates ........................................................................................... 17

10.1.4

Default Serial Configuration ................................................................................. 17

10.2

SPI (Serial Peripheral Interface Bus) ............................................................................ 17

10.2.1

SPI Communication Overview: ............................................................................ 18

10.2.2

SPI Command Phase: ............................................................................................ 18

10.2.3

SPI Endian Example: ............................................................................................ 19

10.2.4

SPI Data Phase: ..................................................................................................... 20

10.2.5

SPI Asynchronous Messages: ............................................................................... 20

10.2.6

SPI AC Characteristics: ........................................................................................ 21

10.3

USB ............................................................................................................................... 21

10.4

GPIO ............................................................................................................................. 21

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ISM43362-M3X Product Specification

10.5

ADC’s ........................................................................................................................... 21

11 Wi-Fi RF SPECIFICATION................................................................................................. 22

11.1.1

RF Specification.................................................................................................... 22

12 ANTENNA PATTERNS ...................................................................................................... 23

12.1

External Antenna .......................................................................................................... 23

12.2

PCB Etch Antenna Gain on the Evaluation Board ....................................................... 24

12.3

Farfield Directivity........................................................................................................ 25

13 ON BOARD PROCESSOR .................................................................................................. 26

14 ISM43362-M3G-L44 FOOTPRINT ..................................................................................... 27

14.1

Module’s dimensions top view (mm) .......................................................................... 27

14.2

PCB recommended footprint top view (mm)............................................................... 27

15 TYPICAL APLLICATION CIRCUIT ................................................................................. 28

15.1

Reference Schematic (EVB) ......................................................................................... 29

15.2

USB to UART ............................................................................................................... 30

15.3

Connecting Microcontroller to eS-WiFi UART ........................................................... 31

15.4

EXTERNAL FLASH FOR OVER THE AIR UPGRADE........................................... 31

15.5

JTAG and Reset Connections ....................................................................................... 32

15.6

eS-WiFi Programming Options .................................................................................... 32

15.7

eS-WiFi USB Direct Connection Option ...................................................................... 33

16 PRODUCT COMPLIANCE CONSIDERATIONS ............................................................. 33

17 REFLOW PROFILE ............................................................................................................. 34

18 PACKING INFORMATION ................................................................................................ 35

18.1

MSL Level / Storage Condition .................................................................................... 35

18.2

Device baking requirements prior to assembly ............................................................. 36

Module’s Assembly Instructions .............................................................................................. 36

19 REVISION CONTROL ........................................................................................................ 37

20 CONTACT INFORMATION ............................................................................................... 37

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1

GENERAL DESCRIPTION

ISM43362-M3X Product Specification

The Inventek ISM43362-M3G-L44 is an embedded (eS-WiFi

TM

) wireless Internet

Connectivity device. The Wi-Fi module hardware consists of an STM M3 Cortex host processor, integrated antenna (or optional external antenna) and Broadcom Wi-Fi device. The module provides UART, USB and SPI interfaces enabling connection to an embedded design. The Wi-Fi module requires no operating system and has a completely integrated TCP/IP Stack that only requires AT commands to establish connectivity for your wireless product, minimizing development time, testing routines and certification. The low cost, small foot print (14.5 mm x 30 mm) and ease of designin make it ideal for a range of embedded applications. The module hardware can be used with I nventek’s AT Command set or with Broadcom’s WICED TM

SDK.

Summary of Key Features:

802.11 b/g/n compliant based on Broadcom MAC/Baseband/Radio device.

Fully contained TCP/IP stack minimizing host CPU requirements.

Configurable using AT commands.

Host interface: UART, SPI, or USB-HID.

Network features: ICMP (Ping), ARP, DHCP,TCP, UDP.

Low power operation (3.3V supply) with built-in low power modes.

Secure Wi-Fi authentication WEP-128, WPA-PSK (TKIP), WPA2-PSK.

Proven Interoperability … Connects with other vendor’s b/g/n Access Points in the

Wireless LAN.

Supported by Broadcom WICED

TM

SDK.

Typical Applications:

PDA, Pocket PC, computing devices.

Building automation and smart energy control.

Industrial sensing and remote equipment monitoring.

Warehousing, logistics and freight management.

PC and gaming peripherals.

Printers, scanners, alarm and video systems.

Medical applications including patient monitoring and remote diagnostics.

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2

PART NUMBER DETAIL DESCRIPTION

ISM43362-M3X Product Specification

2.1 Ordering Information

Device Description

ISM43362-M3G-L44 802.11 Module, STM32F205

(1 MB), UART, Internal

Etched Antenna

Firmware

UART

SPI

USB

Ordering Number

ISM43362-M3G-L44-E-C-xx

ISM43362-M3G-L44-E-SPI-Cxx

ISM43362-M3G-L44-E-USB-Cxx

ISM43362-M3G-L44 802.11 Module, STM32F205

(1 MB), External U.FL

Connector

UART

SPI

ISM43362-M3G-L44-U-C-xx

ISM43362-M3G-L44-U-SPI-Cxx

ISM43362-M3G-

EVB-E

Evaluation Board, USB cable, with ISM43362-M3G-L44-E,

Quick Start Guide

USB

UART

ISM43362-M3G-

EVB-U

Evaluation Board, USB cable, with ISM43362-M3G-L44-U,

UART

Quick Start Guide

*c-xx designates firmware revision

– modules shipped with firmware

ISM43362-M3G-L44-U-USB-Cxx

ISM43362-M3G-EVB-E

ISM43362-M3G-EVB-U

3

GENERAL FEATURES

Based on the Broadcom BCM43362 MAC/Baseband/Radio device.

Supports Broadcom WICED SDK.

CPU ARM Corte x™-M3 32-bit RISC core from ST Microelectronics.

Host UART, SPI, or USB-HID interface.

IEEE 802.11n D7.0 -OFDM-72.2 Mbps -single stream w/20 MHz, Short GI

IEEE 802.11g (OFDM 54 Mbps)

IEEE 802.11b (DSSS 11Mbps)

IEEE 802.11i (Security) o WPA (Wi-Fi Protected Access)

–PSK/TKIP o WPA2 (Wi-Fi Protected Access 2)- AES/CCMP/802.1x Authentication

Inputs +3.3 V tolerant

5 GPIO, 5 ADC (Note: SPI interface utilizes ADC pins.)

The devices operate from a 3.0 to 3.6 V power supply.

-40 to +85 °C temperature range.

Power-saving mode allows the design of low-power applications.

Lead Free Design which is compliant with ROHS requirements.

EMI/EMC Metal Shield for best RF performance in noisy environments and to accommodate for lower RF emissions/signature for easier FCC compliance.

FCC/CE Compliance Certification.

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3.1 Limitations

ISM43362-M3X Product Specification

Inventek Systems products are not authorized for use in safety-critical applications

(such as life support) where a failure of the Inventek Systems product would reasonably be expected to cause severe personal injury or death.

3.2 Regulatory Compliance

CE

Regulator

FCC

IC

RoHS

Status

07P-362

10147A-362

Compliant

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3.3 FCC and IC

User’s Manual Statements:

ISM43362-M3X Product Specification

OEM INSTRUCTIONS:

This module is limited to OEM installation only.

OEM integrators must ensure that the end-user has no manual instructions to remove or install the module.. OEM’s must comply with FCC marking regulation part 15 declaration of conformity (Section 2.925(e)).

This module is to be installed only in mobile or fixed applications (Please refer to FCC

CFR 47 Part 2.1091(b) for a definition of mobile and fixed devices).

Separate approval is required for all other operating configurations, including portable configurations with respect to FCC CFR 47 Part 2.1093, and different antenna configurations.

The antennas used with this module must be installed to provide a separation distance of at least 20cm from all persons, and must not be co-located or transmit simultaneously with any other antenna or transmitter, except in accordance with FCC multi transmitter product procedures.

The ISM43362 Module has been designed to operate with the following antennas and gains. Use with other antenna types or with these antenna types at higher gains is strictly prohibited.

Manufacturer Type of

Antenna

Model Gain dB Type of

Connector

Inventek

Inventek

U.FL port

Antenna

W24P-U

Trace Antenna NA

2.15

0

Unique

Connector

Permanent integral

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ISM43362-M3X Product Specification

Warning: changes or modifications not expressly approved by the party responsible for compliance could void th e user’s authority to operate this equipment.

A clearly visible label is required on the outside of the user’s (OEM) enclosure stat the following text:

Contains FCC ID: O7P-362

Contains IC: 10147A-362

This transmitter module has been certified for FCC Part 15 operation; when installed in a host device, the host manufacturer is responsible for making sure that the host device with the transmitter installed continues to be compliant with Part 15B unintentional radiator requirements

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Industry Canada User’s Manual Statements:

IC RSS-210/RSS-Gen Notices-

ISM43362-M3X Product Specification

Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device must accept any interference, including interference that may cause undesired operation of this device.

L’opѐration est soumise aux deux conditions suivantes: (1) cet appareil ne peut pas provoquer d’interfѐrences et (2) cet apparial doit accepter toute interfѐrence, y compris les interf ѐrences qui peuvent causer un mauvis fonctionment de l’appareil.

Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser) gain approved for the transmitter by Industry

Canada. To reduce potential radio interference to other users, the antenna type and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for successful communication.

Sous la r ѐglementation d’Industrie Canada, ce transmetteur radio ne peut fonctionner en utilisant une antenne d’un type et un maximum (ou moins) gain approuvѐes pour l’ѐmetteur par Industrie Canada. Pour rѐduire le risqué d’interference aux autres utilisateures, le type d’antenne et son gain doivent être choisis de maniѐre que la puissance isotrpe rayonn ѐe ѐquivalente (PIRE) ne dѐpasse pas ce qui est nѐcessaire pour une communication r ѐussie.

The radio transmitter has been approved by Industry Canada to operate with the antenna types listed above with the maximum permissible gain and required antenna impedance for each antenna type indicated. Antenna types not included in this list having a gain greater than the maximum gain indicated for that type, are strictly prohibited for use with this device.

Cet ѐmetteur de radio a ѐtѐ approuvѐ par Industrie Canada pour fonctionner avec les types d’antennes ѐnumѐrѐes ci-dessus avec le gain maximal admissible et impѐdance d’antenna requise pour chaque type d’antenne indiquѐ. Types d’antennes ne figurant pas dans cette liste, ayant un gain sup ѐrieur au gain maximum indiquѐ pour ce type, sont strictement interdites pour l’utilisation avec cet appareil.

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4

COMPLEMENTARY DOCUMENTATION

ISM43362-M3X Product Specification

4.1 Inventek Systems

 Evaluation Board o ISM43362-M3G-EVB Evaluation Board Specification o EVB User’s Guide o Quick Start Guide o eS-WiFi Demo software (includes EVB Drivers and Firmware)

 AT Command Set o AT Command Set User’s Manual o AT Command Set Quick Reference Guide o AT Command Sample scripts (E-mail, Cloud..)

 Firmware

 OrCAD Schematic Symbol

 PADS Land Pattern

 FCC Test Report

5

SPECIFICATIONS

5.1 Module Architecture

Figure 1 Inventek’s ISM43362-M3 General Block Diagram

Note: 1. Antenna Options: Integrated microstrip antenna or U.FL connector for an external antenna

.

2. ADC1-ADC5 can also be used as SPI port

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5.2 External Antenna Connections

ISM43362-M3X Product Specification

ISM43362-M3G-L44-U module is designed for use with an external antenna via a connection using the U.FL connector.

Item

Connector

Description

U.FL series

Manufacturer I-PEX Co., Ltd.

Part No.

Height

Width

DC

20279-001E-01

1.25 mm

2 mm

3.0 – 5.0 V

Table 1 On-Board Antenna Connector

5.3 Mechanical Specifications

The Physical dimensions of this eS-WiFi Module are as follow:

* Keep out

Area

Figure 2: ANTENNA IS IN ETCH

”Keep out” area should ideally have the antenna hanging off the side of the PCB for best performance. If you do not hang the antenna off the PCB, ensure no ground planes or traces are placed under the antenna (keep out area). Surrounding metal will affect the antenna performance. The ISM43362-M3G-L44- U and -E have the same footprint.

* External Antenna does not require “keep out” area

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ISM43362-M3X Product Specification

Items

Length

Width

Height

Package

Description

ISM43362-M3G-L44-E /U

30 mm (-/+0.5 mm)

14.5 mm (-/+0.5 mm)

2.5 ± 0.2 mm

44 pin LGA

5.4 Environmental Specifications

Item Description

Operating temperature range -40 deg. C to +85 deg. C

Storage temperature range

Humidity

-40 deg. C to +85 deg. C

95% max non-condensing

Note 1: The ISM43362-M3G supports a functional operating range of -40°C to +85°C.

However the optimal RF performance specified in this data sheet is only guaranteed for temperatures from -10°C to +65°C

6

HARDWARE ELECTRICAL SPECIFICATIONS

6.1.1 Absolute Maximum Ratings

Symbol Description

VDD

VBAT

Input supply Voltage

Battery Backup

6.1.2 Recommended Operating Ratings

Symbol Min. Typ.

VDD 3.0 3.3

VBAT 3.0 3.3

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Min

-0.4

-0.4

Max

3.7

3.6

Max. Unit.

3.6 V

3.6 V

Unit

V

V

Inventek Systems

7

POWER CONSUMPTION

ISM43362-M3X Product Specification

7.1.1 Power Management Modes

Power

Management

Modes

WiFi On/Off

Description Current AT Commands

WiFi Power Save

On/Off

WiFi Beacon listen

Skip MCU Sleep

MCU is powered on, but WiFi radio can be powered off

After you join a network, Power Save mode can be entered. The unit will automatically wake up when data is ready. AP will buffer data

You can extend beacon time to save additional power while sleeping the

MCU

37 mA

50 mA

(160 mA burst of not more than 5ms)

Beacon set to 1, ~7.2mA

Beacon set to 1, ~4.7mA

Beacon set to 1, ~4.2mA

One Second Sleep

ZP=3,0 -Stop

ZP=3,1 -Start

ZP=1,0 -Off

ZP=1,1 -ON

ZP=2,1; ZP=6

ZP=2,5;ZP=6

ZP=2,10;ZP=6

Stop Mode 10 mA

Note:

Typical current when WiFi is connected to a network is 110 mA. During transmit the maximum current can reach 340 mA burst of not more than 5ms.

Power Save mode does not work when in Access mode. In order to save power, AT

Commands, ZP=2 and ZP=6, can be used to allow the MCU to sleep and reduce the beacon intervals by turning the radio on/off at a duty cycle.

The eS-WiFi modules support multiple power saving modes. Please see the power savings application note for more detailed information. For power critical applications

please contact Inventek for alternative low power modes.

7.1.2 Stop Mode

Stop Mode is initiated by software and exited by the an input on the Wakeup pin.

(Wakeup pin is 3.3 volt tolerant). The wakeup pin is an external interrupt pin that on the rising edge will cause the module to exit stop mode. It is an edge trigged input. It is critical to have no glitch on this line.

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8

PIN OUT

ISM43362-M3X Product Specification

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ISM43362-M3X Product Specification

8.1.1 Detailed Pin Description

Pin No. Type

1 G GND

Pin Definition

2

3

I VDD

G GND

4

5

6

7

8

9

I/O TMS

I/O TCK

I/O TDI

I/O TD0

I/O TDRSTN

I/O ADC 4 / SPI_MOSI

14

15

16

17

10 I/O ADC 3 / SPI_MISO

11 I/O ADC 2 / SPI_SCK

12 I/O ADC 1 / SPI_SSN

13 I/O ADC 0 (I)/ DATARDY (0)

I

I

I

VDD

VBAT

Wakeup

G GND

31

32

33

34

35

36

18 I DP

19 I/O DM

20 G GND

21 I/O RX

22 I/O TX

23 I/O GPIO 0

24 I/O GPIO 1

25 I/O GPIO 2

26 I/O GPIO 3

27 I/O GPIO 4

28

29

30

I CFGO

I CFG1

O RES

I RES

I RES

I BOOT 0

I RSTN

G GND

G GND

DOC-DS-20071-3.3.1

Descriptions

Ground

3.3V

Ground

JTAG

JTAG

JTAG

JTAG

JTAG

ADC Input Pins or SPI Host Interface

(Refer to SPI Section 10.2)

3.3V

3.3V

(Refer to Section 7.1.2)

Ground

USB Data Plus (Refer to Table 8.1.2)

USB Data Minus (Refer to Table 8.1.2 )

Ground

UART Receive (Refer to section 10.1 )

UART Transmit (Refer to section 10.1 )

General Purpose Interface Pins

Configuration Pin 0 (Refer to Table 8.1.2 )

Configuration Pin 1 (Refer to Table 8.1.2 )

Reserved

Reserved

Reserved

Enable On Board Micro Boot Loader

Reset (See STM32F205 NRST specification )

Ground

Ground

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Pin No. Type

37 G GND

Pin Definition

38

39

G GND

G GND

40

41

42

43

44

G GND

G GND

G GND

G GND

G GND

Ground

Ground

Ground

Ground

Ground

Ground

Ground

Ground

ISM43362-M3X Product Specification

Descriptions

8.1.2 Configuration Pins:

CFGO

1

1

0*

0*

CFG1

1

Internally Pulled High

UART ( NC)

0* SPI

1 USB VCP

0* USB HID

*Requires a 10K ohm pull down

Note: These pins are not used in the currently available production firmware. Modules are preprogrammed with separate and specific firmware that supports either UART, SPI or USB

HID. In future versions of the firmware these pins will be used to select the host interface type.

9

FIRMWARE UPGRADES DURING DEVELOPMENT

We recommend using a JTAG 10 pin header or directly connecting to the JTAG pins on the module for updating. Use the ST-Link to flash the ST micro.

Below are links to the ST-Link and JTAG header at Digikey:

STLink: http://www.digikey.com/product-detail/en/ST-LINK%2FV2/497-10484-ND/2214535

The 10 to 20 pin JTAG adapter is Digi-Key PN 726-1193-ND: http://www.digikey.com/product-detail/en/MDL-ADA2/726-1193-ND/1986451

*JTAG Firmware Update Note can be found at www.inventeksys.com

10

SERIAL HOST INTERFACES AVAILABLE

UART, SPI and USB-HID host interfaces are supported and unique firmware is required for each interface.

10.1 UART

A universal asynchronous receiver / transmitter (UART) with 3.3v logic levels is available.

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ISM43362-M3X Product Specification

10.1.1 Data Mode

When the eS-WiFi module is interfaced serially, the serial interface needs to be configured for 8 bit data, no parity, and one stop bit -- (8-n-1).

10.1.2 Flow Control

The eS-WiFi module doesn’t require or support Flow Control, so Flow Control should be

‘None’

10.1.3 Supported Baud Rates

The eS-WiFi module uses USART1 (PA9 and PA10 of the STM32F205) and the following serial baud rates are supported: 1200, 2400, 4800, 9600, 19200, 38400, 57600, 115200,

230400, 460800, 921600, 1152000, 1382400, 1612800, 1834200, 2073600. USART1 can be run at higher rates but have not been tested with the AT command set.

10.1.4 Default Serial Configuration

The eS-WiFi module is shipped with the default serial configuration of 115200 baud, 8 data bits, no party, and 1 stop bits.

10.2 SPI (Serial Peripheral Interface Bus)

The eS-WiFi module supports SPI (Contact Inventek for specific firmware.)

SCLK

MOSI

MISO

SSN

CMD/DATA

READY

Command

Phase

Data

Phase

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SPI Slave Interface:

Clock rate: 20MHz max.

Width: 16-bit

ISM43362-M3X Product Specification

Mode:

Endian:

0

Little

Note: All commands to the eS-WiFi module must be post-padded with 0x0A (Line Feed) to an even number of bytes.

All data from eS-WiFi module will be post-padded with 0x15(NAK) to an even number of bytes.

10.2.1 SPI Communication Overview:

With the exception of initial cursor, all communication with the module happens synchronously.

In other words, the SPI Master must always poll for every asynchronous event.

A typical command flow is provided flow. This is an example using the Direct Connect Soft AP with a TCP communication server.

SPI Master

“AS=0,ABC\r\x0A”

“AD\r\ x0A”

"P1=0\r\ x0A”

"P4=2000\r"

"P5=1\r\ x0A”

"MR\r\ x0A”

SPI Slave (eS-WiFi)

“\r\n> “

"\r\n\r\nOK\r\n> "

"\r\n\r\nOK\r\n> "

"\r\n\r\nOK\r\n> "

"\r\n\r\nOK\r\n> "

"\r\n\r\nOK\r\n> "

"\r\n[SOMA]...[EOMA]\r\nOK\r\n>

"

Description

Prompt

Set Access Point SSID

Start AP - Direct Mode

Set TCP Protocol

Set TCP Port

Start TCP COMM Server

Read Messages

Note: [SOMA] - Start of Message Asynchronous, [EOMA] - End Of Message Asynchronous

The SPI communication is always 16-bit and can be sustained up to 20MHz. The eS-WiFi module after power up or reset will raise CMD/DATA READY pin to signal that the first Data

Phase has started. In this mode, the SPI Host must fetch the cursor. As provided by the example above, this is the only time host needs fetch data from slave without issuing a command.

The Host will initiate a SPI cycle (lower SSN) and clock out 0x0A (Line Feed) until the

CMD/DATA READY pin lowers signaling the end of the Data Phase. The data received will be

0x0d (CR) 0x0A (LF) 0x3E (>) 0x20 (SP).

The next rising edge of the CMD/DATA READY pin signals the Command Phase.

10.2.2 SPI Command Phase:

The Command Phase indicates the eS-WiFi module is ready to accept an AT Command. The command must include all delimiters and data for the command.

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Ex. S3=0010\r0123456789

ISM43362-M3X Product Specification

The command must also be sent as one continuous SPI cycle, that is SSN must stay low for the complete command, delimiters, and data.

The Host will initiate a SPI cycle (lower SSN) and clock out the command, delimiters and associated data and raise the NSS signal to indicated that the all data has be sent. As result of the

NNS raising the eS-WiFi module will lower the CMD/DATA READY pin to signal the end

Command Phase.

The data that will be clocked back to the Host will be 0x15 (NAK).

10.2.3 SPI Endian Example:

The data is in little endian (0x15 0x15 0x0A 0x0D 0x20 0x3E) and needs to be converted back to big endian with the leading 0x15’s removed. Please remember that this is a 16-bit interface so the endian conversion is done one 16-bit at a time.

The endian requirement extends to the command being sent to the module. So a “I?\r\x0A” command would be sent as 0x3F 0x49 0x0A 0x0D.

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ISM43362-M3X Product Specification

10.2.4 SPI Data Phase:

The Data Phase indicates the eS-WiFi module has data ready for the Host to read. The eS-WiFi module will raise CMD/DATA READY and the Host will initiate a SPI cycle (lower SSN) and clock out 0x0A (Line Feed) until the CMD/DATA READY pin lowers signaling the end of the

Data Phase.

10.2.5 SPI Asynchronous Messages:

There are certain situations in which the eS-WiFi will issue asynchronous messages:

Soft AP (AO/AD Commands), when a device connects to the Soft AP a DHCP assigned message will issued.

Ex. [DHCP ] Assigned 00:00:00:00:00:00 has 192.168.10.100

TCP/UDP Communication Servers (P5=1), when a client connects to the server a connected message will be issued.

Ex. [TCP SVR] Waiting on connection...

[TCP SVR] Accepted 192.168.10.100:2000

[UDP SVR] Accepted 192.168.10.100:2000

With the SPI host interface being synchronous the Host must poll for these messages. This can be done by using the MR (Message Read) command or when a Communication connection the issuing of a R0 command will read all asynchronous message and the result of the R0 command.

The asynchronous messages are delineated by the Start Of Message Asynchronous ([SOMA]) and End Of Message Asynchronous ([EOMA]) markers.

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10.2.6 SPI AC Characteristics:

ISM43362-M3X Product Specification

Symbol

Tf(sck)

Tc(sck)

Tsu(sck)

Tc(byte)

Tsu(ssn)

Th(ssn)

Min.

50 ns

Typ.

15 us

8 * Tc(sck)

4 us

3 us

Max.

20 MHz

10.3 USB

The eS-WiFi module supports a USB HID interface. (Contact Inventek for specific firmware.)

10.4 GPIO

Each of the GPIO pins can be configured by the AT command set as Button, LED, Digital input or Digital output. The outputs are 3.3V CMOS and reference the AT Command Set User manual to configure.

10.5

ADC’s

One 12-bit analog-to-digital converter is available. Reference the AT Command Set User’s manual for configuration.

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11

Wi-Fi RF SPECIFICATION

11.1.1 RF Specification

Conditions: VDD=3.3V; VDDIO=3.3V; TEMP: 25°C

ISM43362-M3X Product Specification

Feature

WLAN Standard

Frequency Range

Description

IEEE 802.11b/g/n, Wi-Fi compliant

2.400 GHz ~ 2.497 GHz (2.4 GHz ISM Band)

Number of Channels Ch1 ~ Ch14

Modulation 802.11 g/n : OFDM /64-QAM,16-QAM, QPSK, BPSK

*Output Power

Receive Sensitivity

(11n,20MHz)

@10% PER

Receive Sensitivity

(11g) @10% PER

Receive Sensitivity

(11b) @10% PER

Data Rates

Data Rate

(20MHz ,Long GI,800ns)

802.11b : CCK, DQPSK, DBPSK

802.11b /11Mbps : 18* dBm ± 1.5 dB

802.11g /54Mbps: 18* dBm ± 1.5 dB

802.11n /72Mbps: 18* dBm ± 1.5 dB

- MCS=0 PER @ -86 dBm, typical

- MCS=1 PER @ -85 dBm, typical

- MCS=2

- MCS=3

- MCS=4

- MCS=5

PER @ -85 dBm, typical

PER @ -84 dBm, typical

PER @ -80 dBm, typical

PER @ -78 dBm, typical

- MCS=6

- MCS=7

- 6Mbps

- 9Mbps

- 12Mbps

- 18Mbps

- 24Mbps

PER @ -72 dBm, typical

PER @ -69 dBm, typical

PER @ -89 dBm, typical

PER @ -88 dBm, typical

PER @ -88 dBm, typical

PER @ -87 dBm, typical

PER @ -83 dBm, typical

- 36Mbps

- 48Mbps

- 54Mbps

- 1Mbps

PER @ -80 dBm, typical

PER @ -75 dBm, typical

PER @ -72 dBm, typical

PER @ -93 dBm, typical

- 2Mbps PER @ -91 dBm, typical

- 5.5Mbps PER @ -89 dBm, typical

- 11Mbps PER @ -87 dBm, typical

802.11b : 1, 2, 5.5, 11Mbps

802.11g : 6, 9, 12, 18, 24, 36, 48, 54Mbps

802.11n: 6.5, 13, 19.5, 26, 39, 52, 58.5, 65Mbps

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ISM43362-M3X Product Specification

Data Rate

802.11n : 7.2, 14.4, 21.7, 28.9, 43.3, 57.8, 65,72.2Mbps

(20MHz ,short GI,400ns)

Maximum Input Level

802.11b : -10 dBm

802.11g : -10 dBm

*Maximum output power can be set to 20 dBM ± 1.5 dB with firmware modifications.

12

ANTENNA PATTERNS

12.1 External Antenna

The Inventek U.FL PCB antenna has passed FCC and CE testing. The part number is W24P-U. It is a 2.4 GHz PCB antenna with a U.FL connector.

The eS-Wifi family of Wi-Fi products comes with two different antenna offerings:

ISM43362-M3G-L44-E

ISM43362-M3G-L44-U

PCB Etched Antenna

U.FL connector for external antenna

The Inventek W24P-U PCB antenna is FCC and CE certified and can be found on the Inventek

Website.

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ISM43362-M3X Product Specification

12.2 PCB Etch Antenna Gain on the Evaluation Board

The eS-WiFi PCB etched antenna performance is shown below. This etched antenna is FCC and

CE certified and the radiation patterns shown below are based on simulation using evaluation boards that have a ground plane with dimensions of 71mm x 48mm.

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12.3 Farfield Directivity

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ISM43362-M3X Product Specification

Inventek Systems

ISM43362-M3X Product Specification

13

ON BOARD PROCESSOR

The eS-WiFi module is available with ST Microcontroller, F205 family of processors.

ISM43362-M3G-L44 -E STM32F205 (1 MB), Flash

Microcontroller

ISM43362-M3G-L44-U STM32F205 (1MB), Flash

Microcontroller)

See the STM32F205 specification from ST Microelectronics for UART, SPI (Slave Mode) and

USB Device. http://www.st.com/st-webui/static/active/en/resource/technical/document/datasheet/CD00237391.pdf

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14

ISM43362-M3G-L44 FOOTPRINT

14.1

Module’s dimensions top view (mm)

.

Figure 3 Module Dimensions- Top View

ISM43362-M3X Product Specification

14.2 PCB recommended footprint top view (mm)

Figure 4 PCB Recommended Foot print - Top View

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ISM43362-M3X Product Specification

15

TYPICAL APLLICATION CIRCUIT

This is the minimum number of wires required to be connected to a host microcontroller for operation in UART mode. It is recommended that the JTAG and BOOT0 lines are also brought out for future firmware upgrades.

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15.1 Reference Schematic (EVB)

ISM43362-M3X Product Specification

Typical application circuits please refer to schematic below. For a *.pdf version please visit the

Wi-Fi ISM43362 evaluation board website, www.Inventeksys.com

.

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15.2 USB to UART

ISM43362-M3X Product Specification

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ISM43362-M3X Product Specification

15.3 Connecting Microcontroller to eS-WiFi UART

15.4 EXTERNAL FLASH FOR OVER THE AIR UPGRADE

(In development, contact Inventek)

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15.5 JTAG and Reset Connections

ISM43362-M3X Product Specification

15.6 eS-WiFi Programming Options

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15.7 eS-WiFi USB Direct Connection Option

ISM43362-M3X Product Specification

16

PRODUCT COMPLIANCE CONSIDERATIONS

RoHS: Restriction of Hazardous Substances (RoHS) directive has come into force since

1st July 2006 all electronic products sold in the EU must be free of hazardous materials, such as lead. Inventek is fully committed to being one of the first to introduce lead-free products while maintaining backwards compatibility and focusing on a continuously high level of product and manufacturing quality.

EMI/EMC: The Inventek module design embeds EMI/EMC suppression features and accommodations to allow for higher operational reliability in noisier (RF) environments and easier integration compliance in host (OEM) applications.

FCC/CE: The module will be in compliance test for FCC/CE

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17

REFLOW PROFILE

Reference the IPC/JEDEC standard.

Peak Temperature: <250°C

Number of Times: ≤2 times

ISM43362-M3X Product Specification

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18

PACKING INFORMATION

18.1 MSL Level / Storage Condition

ISM43362-M3X Product Specification

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ISM43362-M3X Product Specification

18.2 Device baking requirements prior to assembly

Boards must be baked prior to rework or assembly to avoid damaging moisture sensitive

components during localized reflow. The default bake cycles is 24 hours at 125C.

Maintaining proper control of moisture uptake in components is critical.

Before opening the shipping bag and attempting solder reflow, you should maintain a minimal out-of-bag time and ensure the highest possible package reliability for the final product.

Module’s Assembly Instructions

Board Placement: The ISM43362-M3G-L44 has an optional on board Wi-Fi antenna.

The board is designed to be a stuffing option. If you elect to use the on-board antenna, then board placement is critical in your system. Several key items to consider when placing the module are:

Ensure that the antenna portion of the design is placed so that the antenna has no ground plane under, above or near the antenna. Ideally, the antenna requires clear sky for optimal performance. If you have shields or other material around the antenna, please test for interference and loss of signal strength.

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19

REVISION CONTROL

Document : ISM43362-M3G-L44

External Release

Date

8/15/2012

2/11/2013

5/5/2013

7/24/13

Author

FMT

FMT

FMT

FMT

8/27/2013

9/18/2013

10/17/13

8/8/2014

10/29/2014

FMT

FMT

FMT

KMT

FMT

Wi-Fi module

DOC-DS-20023

Revision

1.0

1.1

2.0

2.1

3.0

3.1

3.2

3.3

3.3.1

ISM43362-M3X Product Specification

Comment

Preliminary

Updated Ref. Schematic

Updated SPI

Added FCC, updated

Temperature ,SPI,UART

Updated SPI information and reference schematic

Update

Update Ref Schematic

Footprint Updated

Power settings updated, added

Boot 0 description

Fig. 4 update

20

CONTACT INFORMATION

Inventek Systems

2 Republic Road

Billerica Ma, 01862

Tel: 978-667-1962

[email protected]

www.inventeksys.com

Inventek Systems reserves the right to make changes without further notice to any products or data herein to improve reliability, function, or design. The information contained within is believed to be accurate and reliable. However Inventek Systems does not assume any liability arising out of the application or use of this information, nor the application or use of any product or circuit described herein, neither does it convey any license under its patent rights nor the rights of others.

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