Am29SL400C Data Sheet

Am29SL400C Data Sheet
Am29SL400C
Data Sheet (Retired Product)
Am29BDS323D Cover Sheet
This product has been retired and is not recommended for designs. For new and current designs, S29AS008J supercedes
Am29SL400C. This is the factory-recommended migration path. Please refer to the S29AS008J data sheet for specifications
and ordering information. Availability of this document is retained for reference and historical purposes only.
The following document contains information on Spansion memory products.
Continuity of Specifications
There is no change to this data sheet as a result of offering the device as a Spansion product. Any changes that have been
made are the result of normal data sheet improvement and are noted in the document revision summary.
For More Information
Please contact your local sales office for additional information about Spansion memory solutions.
Publication Number Am29SL400C_00
Revision A
Amendment 7
Issue Date February 20, 2009
Da ta
Shee t
(Retire d
Pro duct)
This page left intentionally blank.
2
Am29BDS323D
Am29SL400C_00_A7 February 20, 2009
DATA SHEET
Am29SL400C
4 Megabit (512 K x 8-Bit/256 K x 16-Bit) CMOS 1.8
Volt-only Super Low Voltage Flash Memory
This product has been retired and is not recommended for designs. For new and current designs, S29AS008J supercedes
Am29SL400C. This is the factory-recommended migration path. Please refer to the S29AS008J data sheet for specifications
and ordering information. Availability of this document is retained for reference and historical purposes only.
Distinctive Characteristics
■ Single power supply operation
— 1.65 to 2.2 V for read, program, and erase operations
— Ideal for battery-powered applications
■ Manufactured on 0.32 µm process technology
■ High performance
— Access times as fast as 100 ns
■ Ultra low power consumption (typical values at
5 MHz)
—
—
—
—
1 µA Automatic Sleep Mode current
1 µA standby mode current
5 mA read current
20 mA program/erase current
■ Flexible sector architecture
— One 16 Kbyte, two 8 Kbyte, one 32 Kbyte, and seven
64 Kbyte sectors (byte mode)
— One 8 Kword, two 4 Kword, one 16 Kword, and seven
32 Kword sectors (word mode)
— Supports full chip erase
— Sector Protection features:
A hardware method of locking a sector to prevent any
program or erase operations within that sector
Sectors can be locked in-system or via programming
equipment
Temporary Sector Unprotect feature allows code
changes in previously locked sectors
■ Unlock Bypass Program Command
— Reduces overall programming time when issuing
multiple program command sequences
■ Top or bottom boot block configurations
available
■ Embedded Algorithms
— Embedded Erase algorithm automatically
preprograms and erases the entire chip or any
combination of designated sectors
— Embedded Program algorithm automatically writes
and verifies data at specified addresses
■ Minimum 1,000,000 erase cycle guarantee per
sector
■ 20-year data retention at 125°C
■ Package option
— 48-ball FBGA
— 48-pin TSOP
■ Compatibility with JEDEC standards
— Pinout and software compatible with single-power
supply Flash
— Superior inadvertent write protection
■ Data# Polling and toggle bits
— Provides a software method of detecting program or
erase operation completion
■ Ready/Busy# pin (RY/BY#)
— Provides a hardware method of detecting program or
erase cycle completion
■ Erase Suspend/Erase Resume
— Suspends an erase operation to read data from, or
program data to, a sector that is not being erased,
then resumes the erase operation
■ Hardware reset pin (RESET#)
— Hardware method to reset the device to reading array
data
This Data Sheet states AMD’s current specifications regarding the Products described herein. This Data Sheet may
be revised by subsequent versions or modifications due to changes in technical specifications.
Publication# Am29SL400C_00 Rev: A
Amendment: 7 Issue Date: February 20, 2009
D A T A
S H E E T
General Description
The Am29SL400C is an 4Mbit, 1.8 V volt-only Flash memory
organized as 524,288 bytes or 262,144 words. The device is
offered in 48-pin TSOP and 48-ball FBGA packages. The
word-wide data (x16) appears on DQ15–DQ0; the byte-wide
(x8) data appears on DQ7–DQ0. This device is designed to
be programmed and erased in-system with a single 1.8 volt
VCC supply. No VPP is required for write or erase operations.
The device can also be programmed in standard EPROM
programmers.
The standard device offers access times of 100, 110, 120,
and 150 ns, allowing high speed microprocessors to operate
without wait states. To eliminate bus contention the device
has separate chip enable (CE#), write enable (WE#) and
output enable (OE#) controls.
The device requires only a single 1.8 volt power supply for
both read and write functions. Internally generated and regulated voltages are provided for the program and erase operations.
The device is entirely command set compatible with the
JEDEC single-power-supply Flash standard. Commands
are written to the command register using standard microprocessor write timings. Register contents serve as input to
an internal state-machine that controls the erase and programming circuitry. Write cycles also internally latch addresses and data needed for the programming and erase
operations. Reading data out of the device is similar to reading from other Flash or EPROM devices.
Device programming occurs by executing the program command sequence. This initiates the Embedded Program algorithm—an internal algorithm that automatically times the
program pulse widths and verifies proper cell margin. The
Unlock Bypass mode facilitates faster programming times
by requiring only two write cycles to program data instead of
four.
Device erasure occurs by executing the erase command sequence. This initiates the Embedded Erase algorithm—an
internal algorithm that automatically preprograms the array
(if it is not already programmed) before executing the erase
operation. During erase, the device automatically times the
erase pulse widths and verifies proper cell margin.
2
The host system can detect whether a program or erase operation is complete by observing the RY/BY# pin, or by reading the DQ7 (Data# Polling) and DQ6 (toggle) status bits.
After a program or erase cycle has been completed, the device is ready to read array data or accept another command.
The sector erase architecture allows memory sectors to be
erased and reprogrammed without affecting the data contents of other sectors. The device is fully erased when
shipped from the factory.
Hardware data protection measures include a low VCC detector that automatically inhibits write operations during
power transitions. The hardware sector protection feature
disables both program and erase operations in any combination of the sectors of memory. This can be achieved in-system or via programming equipment.
The Erase Suspend feature enables the user to put erase
on hold for any period of time to read data from, or program
data to, any sector that is not selected for erasure. True
background erase can thus be achieved.
The hardware RESET# pin terminates any operation in
progress and resets the internal state machine to reading
array data. The RESET# pin may be tied to the system reset
circuitry. A system reset would thus also reset the device,
enabling the system microprocessor to read the boot-up
firmware from the Flash memory.
The device offers two power-saving features. When addresses have been stable for a specified amount of time, the
device enters the automatic sleep mode. The system can
also place the device into the standby mode. Power consumption is greatly reduced in both these modes.
AMD’s Flash technology combines years of Flash memory
manufacturing experience to produce the highest levels of
quality, reliability and cost effectiveness. The device electrically erases all bits within a sector simultaneously via
Fowler-Nordheim tunneling. The data is programmed using
hot electron injection.
Am29SL400C
Am29SL400C_00_A7 February 20, 2009
D A T A
S H E E T
TABLE OF CONTENTS
Table of Contents . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 4
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . 5
Special Handling Instructions for
FBGA Packages ..................................................... 6
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 8
Device Bus Operations . . . . . . . . . . . . . . . . . . . . . 9
Table 1. Am29SL400C Device Bus Operations ............9
Word/Byte Configuration ........................................ 9
Requirements for Reading Array Data ................... 9
Writing Commands/Command Sequences ............ 9
Program and Erase Operation Status .................. 10
Standby Mode ...................................................... 10
Automatic Sleep Mode ......................................... 10
RESET#: Hardware Reset Pin ............................. 10
Output Disable Mode ............................................ 10
Table 2. Am29SL400CT Top Boot Block
Sector Address Table ..................................................11
Table 3. Am29SL400CB Bottom Boot Block
Sector Address Table ..................................................11
Autoselect Mode ................................................... 11
Table 4. Am29SL400C Autoselect Codes
(High Voltage Method) ................................................12
Sector Protection/Unprotection ............................ 12
Temporary Sector Unprotect ................................ 12
Figure 2. Temporary Sector Unprotect Operation....... 14
Hardware Data Protection .................................... 14
Command Definitions . . . . . . . . . . . . . . . . . . . . . 15
Reading Array Data .............................................. 15
Reset Command .................................................. 15
Autoselect Command Sequence .......................... 15
Word/Byte Program Command Sequence ........... 15
Figure 3. Program Operation ...................................... 16
Chip Erase Command Sequence ......................... 16
Sector Erase Command Sequence ...................... 16
Figure 4. Erase Operation........................................... 17
Command Definitions ........................................... 18
Table 5. Am29SL400C Command Definitions ............18
Write Operation Status . . . . . . . . . . . . . . . . . . . . . 19
DQ7: Data# Polling ............................................... 19
Figure 5. Data# Polling Algorithm ............................... 19
RY/BY#: Ready/Busy# ......................................... 19
DQ6: Toggle Bit I .................................................. 20
DQ2: Toggle Bit II ................................................. 20
February 20, 2009 Am29SL400C_00_A7
Reading Toggle Bits DQ6/DQ2 ............................ 20
Figure 6. Toggle Bit Algorithm..................................... 21
DQ5: Exceeded Timing Limits .............................. 21
DQ3: Sector Erase Timer ..................................... 21
Table 6. Write Operation Status ..................................22
Absolute Maximum Ratings . . . . . . . . . . . . . . . . 23
Figure 7. Maximum Negative Overshoot Waveform ... 23
Figure 8. Maximum Positive Overshoot Waveform ..... 23
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 24
Figure 9. ICC1 Current vs. Time (Showing Active and
Automatic Sleep Currents) .......................................... 25
Figure 10. Typical ICC1 vs. Frequency ........................ 25
Test Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Figure 11. Test Setup.................................................. 26
Table 7. Test Specifications ........................................26
Key to Switching Waveforms ................................ 26
Figure 12. Input Waveforms
and Measurement Levels ............................................ 26
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 27
Figure 13. Read Operations Timings .......................... 27
Figure 14. RESET# Timings........................................ 28
Figure 15. BYTE# Timings for Read Operations......... 29
Figure 16. BYTE# Timings for Write Operations ......... 29
Figure 17. Program Operation Timings ....................... 31
Figure 18. Chip/Sector Erase Operation Timings........ 32
Figure 19. Data# Polling Timings
(During Embedded Algorithms) ................................... 33
Figure 20. Toggle Bit Timings
(During Embedded Algorithms) ................................... 33
Figure 21. DQ2 vs. DQ6.............................................. 34
Temporary Sector Unprotect ................................ 34
Figure 22. Temporary Sector Unprotect
Timing Diagram ........................................................... 34
Figure 23. Sector Protect/Unprotect Timing
Diagram....................................................................... 35
Figure 24. Alternate CE# Controlled
Write Operation Timings.............................................. 37
Erase and Programming Performance . . . . . . . . 38
Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 39
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 40
TS048—48-Pin Standard TSOP .......................... 40
FBA048—48-Ball Fine-Pitch Ball Grid Array (FBGA)
6 x 8 mm Package ................................................ 41
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 42
Am29SL400C
3
D A T A
S H E E T
PRODUCT SELECTOR GUIDE
Family Part Number
Speed Options
Am29SL400C
Regulated Voltage Range VCC = 1.7–2.2 V
-100R
Standard Voltage Range VCC = 1.65–2.2 V
-110
-120
-150
Max access time, ns (tACC)
100
110
120
150
Max CE# access time, ns (tCE)
100
110
120
150
Max OE# access time, ns (tOE)
35
45
50
65
Note: See “AC Characteristics” for full specifications.
BLOCK DIAGRAM
DQ0–DQ15 (A-1)
RY/BY#
VCC
Sector Switches
VSS
Erase Voltage
Generator
RESET#
WE#
BYTE#
Input/Output
Buffers
State
Control
Command
Register
PGM Voltage
Generator
Chip Enable
Output Enable
Logic
CE#
OE#
VCC Detector
Address Latch
STB
Timer
A0–A17
4
Am29SL400C
STB
Data
Latch
Y-Decoder
Y-Gating
X-Decoder
Cell Matrix
Am29SL400C_00_A7 February 20, 2009
D A T A
S H E E T
CONNECTION DIAGRAMS
A15
A14
A13
A12
A11
A10
A9
A8
NC
NC
WE#
RESET#
NC
NC
RY/BY#
NC
A17
A7
A6
A5
A4
A3
A2
A1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
February 20, 2009 Am29SL400C_00_A7
Standard TSOP
Am29SL400C
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
A16
BYTE#
VSS
DQ15/A-1
DQ7
DQ14
DQ6
DQ13
DQ5
DQ12
DQ4
VCC
DQ11
DQ3
DQ10
DQ2
DQ9
DQ1
DQ8
DQ0
OE#
VSS
CE#
A0
5
D A T A
S H E E T
CONNECTION DIAGRAM
48-Ball FBGA
(Top View, Balls Facing Down)
A6
B6
C6
D6
E6
A13
A12
A14
A15
A16
A5
B5
C5
D5
E5
F5
G5
H5
A9
A8
A10
A11
DQ7
DQ14
DQ13
DQ6
A4
B4
C4
D4
E4
F4
G4
H4
WE#
RESET#
NC
NC
DQ5
DQ12
VCC
DQ4
A3
B3
C3
D3
E3
F3
G3
H3
RY/BY#
NC
NC
NC
DQ2
DQ10
DQ11
DQ3
A2
B2
C2
D2
E2
F2
G2
H2
A7
A17
A6
A5
DQ0
DQ8
DQ9
DQ1
A1
B1
C1
D1
E1
F1
G1
H1
A3
A4
A2
A1
A0
CE#
OE#
VSS
Special Handling Instructions for FBGA
Packages
F6
G6
H6
BYTE# DQ15/A-1
VSS
package and/or data integrity may be compromised if the
package body is exposed to temperatures about 150°C for
prolonged periods of time.
Special handling is required for Flash Memory products in
molded packages (TSOP, BGA, PLCC, PDIP, SSOP). The
6
Am29SL400C
Am29SL400C_00_A7 February 20, 2009
D A T A
PIN CONFIGURATION
A0–A17
=
S H E E T
LOGIC SYMBOL
18 addresses
DQ0–DQ14 =
15 data inputs/outputs
DQ15/A-1
=
DQ15 (data input/output, word mode),
A-1 (LSB address input, byte mode)
BYTE#
=
Selects 8-bit or 16-bit mode
CE#
=
Chip enable
OE#
=
Output enable
WE#
=
Write enable
RESET#
=
Hardware reset pin, active low
RESET#
RY/BY#
=
Ready/Busy# output
BYTE#
VCC
=
1.65–2.2 V single power supply
VSS
=
Device ground
NC
=
Pin not connected internally
February 20, 2009 Am29SL400C_00_A7
18
A0–A17
16 or 8
DQ0–DQ15
(A-1)
CE#
OE#
WE#
Am29SL400C
RY/BY#
7
D A T A
S H E E T
ORDERING INFORMATION
Standard Products
AMD standard products are available in several packages and operating ranges. The order number (Valid Combination) is formed
by a combination of the elements below.
Am29SL400C
T
100R
E
C
TEMPERATURE RANGE
C
=
Commercial (0°C to +70°C)
D
=
Commercial (0°C to +70°C) with Pb-free Package
F
=
Industrial (-40°C to +85°C) with Pb-free Package
I
=
Industrial (–40°C to +85°C)
PACKAGE TYPE
WA =
48-Ball Fine-Pitch Ball Grid Array (FBGA)
0.80 mm pitch, 6 x 8 mm package (FBA048)
E
=
48-Pin Thin Small Outline Package (TSOP)
Standard Pinout (TS048)
SPEED OPTION
See Product Selector Guide and Valid Combinations
BOOT CODE SECTOR ARCHITECTURE
T
=
Top Sector
B
=
Bottom Sector
DEVICE NUMBER/DESCRIPTION
Am29SL400C
4 Megabit (512 K x 8-Bit/256 K x 16-Bit) CMOS Flash Memory
1.8 Volt-only Read, Program, and Erase
Valid Combinations for TSOP Packages
Valid Combinations for FBGA Packages
Order Number
Order Number
AM29SL400CT100R,
AM29SL400CB100R
AM29SL400CT110,
AM29SL400CB110
Package Marking
AM29SL400CT100R,
AM29SL400CB100R
A400CT10R,
A400CB10R
AM29SL400CT110,
AM29SL400CB110
WAC
AM29SL400CT120,
AM29SL400CB120
AM29SL400CT120,
AM29SL400CB120
WAD,
AM29SL400CT150,
AM29SL400CB150
AM29SL400CT150,
AM29SL400CB150
EC, EI,
ED, EF
WAI
WAF
A400CT11V,
A400CB11V
A400CT12V,
A400CB12V
C, I,
D, F
A400CT15V,
A400CB15V
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult the local AMD sales office to
confirm availability of specific valid combinations and to check on newly released combinations.
8
Am29SL400C
Am29SL400C_00_A7 February 20, 2009
D A T A
S H E E T
DEVICE BUS OPERATIONS
This section describes the requirements and use of the device bus operations, which are initiated through the internal
command register. The command register itself does not occupy any addressable memory location. The register is composed of latches that store the commands, along with the
address and data information needed to execute the com-
Table 1.
mand. The contents of the register serve as inputs to the internal state machine. The state machine outputs dictate the
function of the device. Table 1 lists the device bus operations, the inputs and control levels they require, and the resulting output. The following subsections describe each of
these operations in further detail.
Am29SL400C Device Bus Operations
DQ8–DQ15
CE#
OE#
WE#
RESET#
Addresses
(Note 1)
DQ0–
DQ7
BYTE#
= VIH
BYTE#
= VIL
Read
L
L
H
H
AIN
DOUT
DOUT
Write
L
H
L
H
AIN
DIN
DIN
DQ8–DQ14 = High-Z,
DQ15 = A-1
VCC ±
0.2 V
X
X
VCC ±
0.2 V
X
High-Z
High-Z
High-Z
Output Disable
L
H
H
H
X
High-Z
High-Z
High-Z
Reset
X
X
X
L
X
High-Z
High-Z
High-Z
Sector Protect (Note 2)
L
H
L
VID
Sector Address, A6
= L, A1 = H,
A0 = L
DIN
X
X
Sector Unprotect (Note 2)
L
H
L
VID
Sector Address, A6
= H, A1 = H,
A0 = L
DIN
X
X
Temporary Sector Unprotect
X
X
X
VID
AIN
DIN
DIN
High-Z
Operation
Standby
Legend:
L = Logic Low = VIL, H = Logic High = VIH, VID = 10 ± 1.0 V, X = Don’t Care, AIN = Address In, DIN = Data In, DOUT = Data Out
Notes:
1. Addresses are A17:A0 in word mode (BYTE# = VIH), A17:A-1 in byte mode (BYTE# = VIL).
2. The sector protect and sector unprotect functions may also be implemented via programming equipment. See the “Sector
Protection/Unprotection” section.
Word/Byte Configuration
The BYTE# pin controls whether the device data I/O pins
DQ15–DQ0 operate in the byte or word configuration. If the
BYTE# pin is set at logic ‘1’, the device is in word configuration, DQ15–DQ0 are active and controlled by CE# and OE#.
If the BYTE# pin is set at logic ‘0’, the device is in byte configuration, and only data I/O pins DQ0–DQ7 are active and
controlled by CE# and OE#. The data I/O pins DQ8–DQ14
are tri-stated, and the DQ15 pin is used as an input for the
LSB (A-1) address function.
Requirements for Reading Array Data
To read array data from the outputs, the system must drive
the CE# and OE# pins to VIL. CE# is the power control and
selects the device. OE# is the output control and gates array
data to the output pins. WE# should remain at V IH . The
BYTE# pin determines whether the device outputs array
data in words or bytes.
The internal state machine is set for reading array data upon
device power-up, or after a hardware reset. This ensures
February 20, 2009 Am29SL400C_00_A7
that no spurious alteration of the memory content occurs
during the power transition. No command is necessary in
this mode to obtain array data. Standard microprocessor
read cycles that assert valid addresses on the device address inputs produce valid data on the device data outputs.
The device remains enabled for read access until the command register contents are altered.
See Reading Array Data‚ on page 15 for more information.
Refer to the AC Read Operations table for timing specifications and to Figure 14‚ on page 28 for the timing diagram.
ICC1 in the DC Characteristics table represents the active
current specification for reading array data.
Writing Commands/Command Sequences
To write a command or command sequence (which includes
programming data to the device and erasing sectors of
memory), the system must drive WE# and CE# to VIL, and
OE# to VIH.
For program operations, the BYTE# pin determines whether
the device accepts program data in bytes or words. Refer
to Word/Byte Configuration‚ on page 9 for more information.
Am29SL400C
9
D A T A
The device features an Unlock Bypass mode to facilitate
faster programming. Once the device enters the Unlock Bypass mode, only two write cycles are required to program a
word or byte, instead of four. The Word/Byte Program Command Sequence‚ on page 15 has details on programming
data to the device using both standard and Unlock Bypass
command sequences.
An erase operation can erase one sector, multiple sectors, or
the entire device. Table 2 on page 11 and Table 3 on
page 11 indicate the address space that each sector occupies. A sector address consists of the address bits required
to uniquely select a sector. Command Definitions‚ on
page 18 has details on erasing a sector or the entire chip, or
suspending/resuming the erase operation.
After the system writes the autoselect command sequence,
the device enters the autoselect mode. The system can then
read autoselect codes from the internal register (which is
separate from the memory array) on DQ7–DQ0. Standard
read cycle timings apply in this mode. Refer to Autoselect
Mode‚ on page 11 and Autoselect Command Sequence‚ on
page 15 for more information.
ICC2 in the DC Characteristics table represents the active
current specification for the write mode. The AC Characteristics‚ on page 28 contains timing specification tables and
timing diagrams for write operations.
Program and Erase Operation Status
During an erase or program operation, the system may
check the status of the operation by reading the status bits
on DQ7–DQ0. Standard read cycle timings and ICC read
specifications apply. Refer to Write Operation Status‚ on
page 19 for more information, and to AC Characteristics‚ on
page 28 for timing diagrams.
Standby Mode
When the system is not reading or writing to the device, it
can place the device in the standby mode. In this mode, current consumption is greatly reduced, and the outputs are
placed in the high impedance state, independent of the OE#
input.
The device enters the CMOS standby mode when the CE#
and RESET# pins are both held at VCC ± 0.2 V. (Note that
this is a more restricted voltage range than VIH.) If CE# and
RESET# are held at VIH, but not within VCC ± 0.2 V, the device will be in the standby mode, but the standby current will
be greater. The device requires standard access time (tCE)
for read access when the device is in either of these standby
modes, before it is ready to read data.
The device also enters the standby mode when the RESET#
pin is driven low. Refer to the next section, RESET#: Hardware Reset Pin.
10
S H E E T
If the device is deselected during erasure or programming,
the device draws active current until the operation is completed.
I CC3 in DC Characteristics‚ on page 24 represents the
standby current specification.
Automatic Sleep Mode
The automatic sleep mode minimizes Flash device energy
consumption. The device automatically enables this mode
when addresses remain stable for tACC + 50 ns. The automatic sleep mode is independent of the CE#, WE#, and OE#
control signals. Standard address access timings provide
new data when addresses are changed. While in sleep
mode, output data is latched and always available to the system. ICC4 in the DC Characteristics table represents the automatic sleep mode current specification.
RESET#: Hardware Reset Pin
The RESET# pin provides a hardware method of resetting
the device to reading array data. When the RESET# pin is
driven low for at least a period of tRP, the device immediately terminates any operation in progress, tristates all output pins, and ignores all read/write commands for the
duration of the RESET# pulse. The device also resets the internal state machine to reading array data. The operation
that was interrupted should be reinitiated once the device is
ready to accept another command sequence, to ensure data
integrity.
Current is reduced for the duration of the RESET# pulse.
When RESET# is held at V SS ±0.2 V, the device draws
CMOS standby current (ICC4). If RESET# is held at VIL but
not within VSS±0.2 V, the standby current is greater.
The RESET# pin may be tied to the system reset circuitry. A
system reset would thus also reset the Flash memory, enabling the system to read the boot-up firmware from the
Flash memory.
If RESET# is asserted during a program or erase operation,
the RY/BY# pin remains a 0 (busy) until the internal reset operation is complete, which requires a time of tREADY (during
Embedded Algorithms). The system can thus monitor
RY/BY# to determine whether the reset operation is complete. If RESET# is asserted when a program or erase operation is not executing (RY/BY# pin is 1), the reset operation
is completed within a time of tREADY (not during Embedded
Algorithms). The system can read data tRH after the RESET# pin returns to VIH.
Refer to the AC Characteristics tables for RESET# parameters and to Figure 15‚ on page 29 for the timing diagram.
Output Disable Mode
When the OE# input is at VIH, output from the device is disabled. The output pins are placed in the high impedance
state.
Am29SL400C
Am29SL400C_00_A7 February 20, 2009
D A T A
Table 2.
S H E E T
Am29SL400CT Top Boot Block Sector Address Table
Address Range (in hexadecimal)
Sector
A17
A16
A15
A14
A13
A12
Sector Size
(Kbytes/
Kwords)
SA0
0
0
0
X
X
X
64/32
00000h–0FFFFh
00000h–07FFFh
SA1
0
0
1
X
X
X
64/32
10000h–1FFFFh
08000h–0FFFFh
SA2
0
1
0
X
X
X
64/32
20000h–2FFFFh
10000h–17FFFh
SA3
0
1
1
X
X
X
64/32
30000h–3FFFFh
18000h–1FFFFh
SA4
1
0
0
X
X
X
64/32
40000h–4FFFFh
20000h–27FFFh
SA5
1
0
1
X
X
X
64/32
50000h–5FFFFh
28000h–2FFFFh
SA6
1
1
0
X
X
X
64/32
60000h–6FFFFh
30000h–37FFFh
SA7
1
1
1
0
X
X
32/16
70000h–77FFFh
38000h–3BFFFh
SA8
1
1
1
1
0
0
8/4
78000h–79FFFh
3C000h–3CFFFh
SA9
1
1
1
1
0
1
8/4
7A000h–7BFFFh
3D000h–3DFFFh
SA10
1
1
1
1
1
X
16/8
7C000h–7FFFFh
3E000h–3FFFFh
Table 3.
(x8)
Address Range
(x16)
Address Range
Am29SL400CB Bottom Boot Block Sector Address Table
Address Range (in hexadecimal)
Sector
A17
A16
A15
A14
A13
A12
Sector Size
(Kbytes/
Kwords)
SA0
0
0
0
0
0
X
16/8
00000h–03FFFh
00000h–01FFFh
SA1
0
0
0
0
1
0
8/4
04000h–05FFFh
02000h–02FFFh
SA2
0
0
0
0
1
1
8/4
06000h–07FFFh
03000h–03FFFh
SA3
0
0
0
1
X
X
32/16
08000h–0FFFFh
04000h–07FFFh
SA4
0
0
1
X
X
X
64/32
10000h–1FFFFh
08000h–0FFFFh
SA5
0
1
0
X
X
X
64/32
20000h–2FFFFh
10000h–17FFFh
SA6
0
1
1
X
X
X
64/32
30000h–3FFFFh
18000h–1FFFFh
SA7
1
0
0
X
X
X
64/32
40000h–4FFFFh
20000h–27FFFh
SA8
1
0
1
X
X
X
64/32
50000h–5FFFFh
28000h–2FFFFh
SA9
1
1
0
X
X
X
64/32
60000h–6FFFFh
30000h–37FFFh
SA10
1
1
1
X
X
X
64/32
70000h–7FFFFh
38000h–3FFFFh
(x8)
Address Range
(x16)
Address Range
Note for Tables 2 and 3: Address range is A17:A-1 in byte mode and A17:A0 in word mode. See “Word/Byte Configuration” section for more
information.
Autoselect Mode
The autoselect mode provides manufacturer and device
identification, and sector protection verification, through
identifier codes output on DQ7–DQ0. This mode is primarily
intended for programming equipment to automatically match
a device to be programmed with its corresponding programming algorithm. However, the autoselect codes can also be
accessed in-system through the command register.
When using programming equipment, the autoselect mode
requires VID on address pin A9. Address pins A6, A1, and
A0 must be as shown in Table 4 on page 12. In addition,
when verifying sector protection, the sector address must
February 20, 2009 Am29SL400C_00_A7
appear on the appropriate highest order address bits (see
Table 2 on page 11 and Table 3 on page 11). Table 4 shows
the remaining address bits that are don’t care. When all necessary bits have been set as required, the programming
equipment may then read the corresponding identifier code
on DQ7–DQ0.
To access the autoselect codes in-system, the host system
can issue the autoselect command via the command register, as shown in Table 5 on page 18. This method does not
require VID. See Command Definitions‚ on page 18 for details on using the autoselect mode.
Am29SL400C
11
D A T A
Table 4.
Description
Mode
Manufacturer ID: AMD
Am29SL400C Autoselect Codes (High Voltage Method)
A11
to
A10
A6
A5
to
A2
A1
A0
DQ8
to
DQ15
DQ7
to
DQ0
X
01h
22h
70h
X
70h
22h
F1h
X
F1h
X
01h (protected)
X
00h
(unprotected)
CE#
OE#
WE#
L
L
H
X
X
VID
X
L
X
L
L
L
L
H
X
X
VID
X
L
X
L
H
VID
X
VID
X
Word
Byte
L
L
H
Device ID:
Am29SL400C
(Bottom Boot Block)
Word
L
L
H
X
Sector Protection Verification
A9
A8
to
A7
A17t
o
A12
Device ID:
Am29SL400C
(Top Boot Block)
Byte
S H E E T
L
L
H
L
L
H
X
SA
X
L
L
X
X
L
H
H
L
L = Logic Low = VIL, H = Logic High = VIH, SA = Sector Address, X = Don’t care.
Sector Protection/Unprotection
The hardware sector protection feature disables both program and erase operations in any sector. The hardware sector unprotection feature re-enables both program and erase
operations in previously protected sectors. Sector protection/unprotection can be implemented via two methods.
Sector protection/unprotection requires VID on the RESET#
pin only, and can be implemented either in-system or via
programming equipment. Figure 2‚ on page 14 shows the algorithms and Figure 24‚ on page 37 shows the timing diagram. This method uses standard microprocessor bus cycle
timing. For sector unprotect, all unprotected sectors must
first be protected prior to the first sector unprotect write cycle.
The device is shipped with all sectors unprotected. AMD offers the option of programming and protecting sectors at its
12
factory prior to shipping the device through AMD’s ExpressFlash™ Service. Contact an AMD representative for details.
It is possible to determine whether a sector is protected or
unprotected. See Autoselect Mode‚ on page 11 for details.
Temporary Sector Unprotect
This feature allows temporary unprotection of previously protected sectors to change data in-system. The Sector Unprotect mode is activated by setting the RESET# pin to VID.
During this mode, formerly protected sectors can be programmed or erased by selecting the sector addresses. Once
VID is removed from the RESET# pin, all the previously protected sectors are protected again. Figure 3‚ on page 16
shows the algorithm, and Figure 22 shows the timing diagrams, for this feature.
Am29SL400C
Am29SL400C_00_A7 February 20, 2009
D A T A
S H E E T
START
START
Protect all sectors:
The indicated portion
of the sector protect
algorithm must be
performed for all
unprotected sectors
prior to issuing the
first sector
unprotect address
PLSCNT = 1
RESET# = VID
Wait 1 μs
Temporary Sector
Unprotect Mode
No
PLSCNT = 1
RESET# = VID
Wait 1 μs
No
First Write
Cycle = 60h?
First Write
Cycle = 60h?
Yes
Yes
Set up sector
address
No
All sectors
protected?
Sector Protect:
Write 60h to sector
address with
A6 = 0, A1 = 1,
A0 = 0
Yes
Set up first sector
address
Sector Unprotect:
Write 60h to sector
address with
A6 = 1, A1 = 1,
A0 = 0
Wait 150 µs
Increment
PLSCNT
Temporary Sector
Unprotect Mode
Verify Sector
Protect: Write 40h
to sector address
with A6 = 0,
A1 = 1, A0 = 0
Reset
PLSCNT = 1
Wait 15 ms
Read from
sector address
with A6 = 0,
A1 = 1, A0 = 0
Verify Sector
Unprotect: Write
40h to sector
address with
A6 = 1, A1 = 1,
A0 = 0
Increment
PLSCNT
No
No
PLSCNT
= 25?
Yes
Yes
No
Yes
Device failed
PLSCNT
= 1000?
Protect another
sector?
No
Yes
Remove VID
from RESET#
Device failed
Write reset
command
Sector Protect
Algorithm
Read from
sector address
with A6 = 1,
A1 = 1, A0 = 0
Data = 01h?
Sector Protect
complete
Set up
next sector
address
No
Data = 00h?
Yes
Last sector
verified?
No
Yes
Sector Unprotect
Algorithm
Remove VID
from RESET#
Write reset
command
Sector Unprotect
complete
Figure 1. In-System Sector Protect/
Unprotect Algorithms
February 20, 2009 Am29SL400C_00_A7
Am29SL400C
13
D A T A
definitions). In addition, the following hardware data protection measures prevent accidental erasure or programming,
which might otherwise be caused by spurious system level
signals during VCC power-up and power-down transitions, or
from system noise.
START
RESET# = VID
(Note 1)
Low VCC Write Inhibit
When VCC is less than VLKO, the device does not accept any
write cycles. This protects data during VCC power-up and
power-down. The command register and all internal program/erase circuits are disabled, and the device resets. Subsequent writes are ignored until VCC is greater than VLKO.
The system must provide the proper signals to the control
pins to prevent unintentional writes when VCC is greater than
VLKO.
Perform Erase or
Program Operations
RESET# = VIH
Write Pulse “Glitch” Protection
Temporary Sector
Unprotect Completed
(Note 2)
Noise pulses of less than 5 ns (typical) on OE#, CE# or WE#
do not initiate a write cycle.
Logical Inhibit
Notes:
1. All protected sectors unprotected.
Write cycles are inhibited by holding any one of OE# = VIL,
CE# = VIH or WE# = VIH. To initiate a write cycle, CE# and
WE# must be a logical zero while OE# is a logical one.
2. All previously protected sectors are protected once again.
Figure 2. Temporary Sector Unprotect Operation
Hardware Data Protection
The command sequence requirement of unlock cycles for
programming or erasing provides data protection against inadvertent writes (refer to Table 5 on page 18 for command
14
S H E E T
Power-Up Write Inhibit
If WE# = CE# = VIL and OE# = VIH during power up, the device does not accept commands on the rising edge of WE#.
The internal state machine is automatically reset to reading
array data on power-up.
Am29SL400C
Am29SL400C_00_A7 February 20, 2009
D A T A
S H E E T
COMMAND DEFINITIONS
Writing specific address and data commands or sequences
into the command register initiates device operations.
Table 5 on page 18 defines the valid register command sequences. Writing incorrect address and data values or
writing them in the improper sequence resets the device to
reading array data.
All addresses are latched on the falling edge of WE# or CE#,
whichever happens later. All data is latched on the rising
edge of WE# or CE#, whichever happens first. Refer to the
appropriate timing diagrams in the AC Characteristics section.
Reading Array Data
The device is automatically set to reading array data after
device power-up. No commands are required to retrieve
data. The device is also ready to read array data after completing an Embedded Program or Embedded Erase algorithm.
After the device accepts an Erase Suspend command, the
device enters the Erase Suspend mode. The system can
read array data using the standard read timings, except that
if it reads at an address within erase-suspended sectors, the
device outputs status data. After completing a programming
operation in the Erase Suspend mode, the system may once
again read array data with the same exception. See “Erase
Suspend/Erase Resume Commands” for more information
on this mode.
The system must issue the reset command to re-enable the
device for reading array data if DQ5 goes high, or while in
the autoselect mode. See the Reset Command‚ on page 15
section, next.
See also Requirements for Reading Array Data‚ on page 9
for more information. The Read Operations table provides
the read parameters, and Figure 14‚ on page 28 shows the
timing diagram.
Reset Command
Writing the reset command to the device resets the device to
reading array data. Address bits are don’t care for this command.
The reset command may be written between the sequence
cycles in an erase command sequence before erasing begins. This resets the device to reading array data. Once erasure begins, however, the device ignores reset commands
until the operation is complete.
The reset command may be written between the sequence
cycles in a program command sequence before programming begins. This resets the device to reading array data
(also applies to programming in Erase Suspend mode).
Once programming begins, however, the device ignores
reset commands until the operation is complete.
The reset command may be written between the sequence
cycles in an autoselect command sequence. Once in the autoselect mode, the reset command must be written to return
to reading array data (also applies to autoselect during
Erase Suspend).
February 20, 2009 Am29SL400C_00_A7
If DQ5 goes high during a program or erase operation, writing the reset command returns the device to reading array
data (also applies during Erase Suspend).
Autoselect Command Sequence
The autoselect command sequence allows the host system
to access the manufacturer and devices codes, and determine whether or not a sector is protected. Table 5 on
page 18 shows the address and data requirements. This
method is an alternative to that shown in Table 4 on page 12,
which is intended for PROM programmers and requires VID
on address bit A9.
The autoselect command sequence is initiated by writing two
unlock cycles, followed by the autoselect command. The device then enters the autoselect mode, and the system may
read at any address any number of times, without initiating
another command sequence. A read cycle at address
XX00h retrieves the manufacturer code. A read cycle at address 01h in word mode (or 02h in byte mode) returns the
device code. A read cycle containing a sector address (SA)
and the address 02h in word mode (or 04h in byte mode) returns 01h if that sector is protected, or 00h if it is unprotected. Refer to Table 2 on page 11 and Table 3 on page 11
for valid sector addresses.
The system must write the reset command to exit the autoselect mode and return to reading array data.
Word/Byte Program Command Sequence
The system may program the device by word or byte, depending on the state of the BYTE# pin. Programming is a
four-bus-cycle operation. The program command sequence
is initiated by writing two unlock write cycles, followed by the
program set-up command. The program address and data
are written next, which in turn initiate the Embedded Program algorithm. The system is not required to provide further
controls or timings. The device automatically generates the
program pulses and verifies the programmed cell margin.
Table 5 on page 18 shows the address and data requirements for the byte program command sequence.
When the Embedded Program algorithm is complete, the device then returns to reading array data and addresses are no
longer latched. The system can determine the status of the
program operation by using DQ7, DQ6, or RY/BY#. See
Write Operation Status‚ on page 19 for information on these
status bits.
Any commands written to the device during the Embedded
Program Algorithm are ignored. Note that a hardware reset
immediately terminates the programming operation. The
Byte Program command sequence should be reinitiated
once the device has reset to reading array data, to ensure
data integrity.
Programming is allowed in any sequence and across sector
boundaries. A bit cannot be programmed from a 0 back
to a 1. Attempting to do so may halt the operation and set
DQ5 to 1, or cause the Data# Polling algorithm to indicate
the operation was successful. However, a succeeding read
will show that the data is still 0. Only erase operations can
convert a 0 to a 1.
Am29SL400C
15
D A T A
S H E E T
Unlock Bypass Command Sequence
Chip Erase Command Sequence
The unlock bypass feature allows the system to program
bytes or words to the device faster than using the standard
program command sequence. The unlock bypass command
sequence is initiated by first writing two unlock cycles. This is
followed by a third write cycle containing the unlock bypass
command, 20h. The device then enters the unlock bypass
mode. A two-cycle unlock bypass program command sequence is all that is required to program in this mode. The
first cycle in this sequence contains the unlock bypass program command, A0h; the second cycle contains the program address and data. Additional data is programmed in
the same manner. This mode dispenses with the initial two
unlock cycles required in the standard program command
sequence, resulting in faster total programming time. Table 5
on page 18 shows the requirements for the command sequence.
Chip erase is a six bus cycle operation. The chip erase command sequence is initiated by writing two unlock cycles, followed by a set-up command. Two additional unlock write
cycles are then followed by the chip erase command, which
in turn invokes the Embedded Erase algorithm. The device
does not require the system to preprogram prior to erase.
The Embedded Erase algorithm automatically preprograms
and verifies the entire memory for an all zero data pattern
prior to electrical erase. The system is not required to provide any controls or timings during these operations. Table 5
on page 18 shows the address and data requirements for
the chip erase command sequence.
During the unlock bypass mode, only the Unlock Bypass
Program and Unlock Bypass Reset commands are valid. To
exit the unlock bypass mode, the system must issue the
two-cycle unlock bypass reset command sequence. The first
cycle must contain the data 90h; the second cycle the data
00h. Addresses are don’t cares. The device then returns to
reading array data.
Any commands written to the chip during the Embedded
Erase algorithm are ignored. Note that a hardware reset
during the chip erase operation immediately terminates the
operation. The Chip Erase command sequence should be
reinitiated once the device has returned to reading array
data, to ensure data integrity The system can determine the
status of the erase operation by using DQ7, DQ6, DQ2, or
RY/BY#. See Write Operation Status‚ on page 19 for information on these status bits. When the Embedded Erase algorithm is complete, the device returns to reading array data
and addresses are no longer latched.
Figure 3‚ on page 16 illustrates the algorithm for the program
operation. See Erase/Program Operations‚ on page 30 for
parameters, and Figure 17‚ on page 31 for timing diagrams.
Figure 4‚ on page 17 illustrates the algorithm for the erase
operation. See Erase/Program Operations‚ on page 30 for
parameters, and to Figure 18 for timing diagrams.
Sector Erase Command Sequence
Sector erase is a six bus cycle operation. The sector erase
command sequence is initiated by writing two unlock cycles,
followed by a set-up command. Two additional unlock write
cycles are then followed by the address of the sector to be
erased, and the sector erase command. Table 5 on page 18
shows the address and data requirements for the sector
erase command sequence.
START
Write Program
Command Sequence
Embedded
Program
algorithm
in progress
Verify Data?
Yes
Increment Address
No
Last Address?
Yes
Programming
Completed
Note: See Table 5 for program command sequence.
Figure 3.
16
The device does not require the system to preprogram the
memory prior to erase. The Embedded Erase algorithm automatically programs and verifies the sector for an all zero
data pattern prior to electrical erase. The system is not required to provide any controls or timings during these operations.
Data Poll
from System
Program Operation
No
After the command sequence is written, a sector erase
time-out of 50 µs begins. During the time-out period, additional sector addresses and sector erase commands may be
written. Loading the sector erase buffer may be done in any
sequence, and the number of sectors may be from one sector to all sectors. The time between these additional cycles
must be less than 50 µs, otherwise the last address and
command might not be accepted, and erasure may begin. It
is recommended that processor interrupts be disabled during this time to ensure all commands are accepted. The interrupts can be re-enabled after the last Sector Erase
command is written. If the time between additional sector
erase commands can be assumed to be less than 50 µs, the
system need not monitor DQ3. Any command other than
Sector Erase or Erase Suspend during the time-out period resets the device to reading array data. The system
must rewrite the command sequence and any additional
sector addresses and commands.
Am29SL400C
Am29SL400C_00_A7 February 20, 2009
D A T A
The system can monitor DQ3 to determine if the sector
erase timer has timed out. (See the “DQ3: Sector Erase
Timer” section.) The time-out begins from the rising edge of
the final WE# pulse in the command sequence.
Once the sector erase operation has begun, only the Erase
Suspend command is valid. All other commands are ignored. Note that a hardware reset during the sector erase
operation immediately terminates the operation. The Sector
Erase command sequence should be reinitiated once the
device has returned to reading array data, to ensure data integrity.
When the Embedded Erase algorithm is complete, the device returns to reading array data and addresses are no
longer latched. The system can determine the status of the
erase operation by using DQ7, DQ6, DQ2, or RY/BY#. (Refer to Write Operation Status‚ on page 19 for information on
these status bits.)
Figure 4 illustrates the algorithm for the erase operation.
Refer to the Erase/Program Operations‚ on page 30 for parameters, and to Figure 18‚ on page 32 for timing diagrams.
S H E E T
After an erase-suspended program operation is complete,
the system can once again read array data within non-suspended sectors. The system can determine the status of the
program operation using the DQ7 or DQ6 status bits, just as
in the standard program operation. See Write Operation
Status‚ on page 19 for more information.
The system may also write the autoselect command sequence when the device is in the Erase Suspend mode. The
device allows reading autoselect codes even at addresses
within erasing sectors, since the codes are not stored in the
memory array. When the device exits the autoselect mode,
the device reverts to the Erase Suspend mode, and is ready
for another valid operation. See Autoselect Command Sequence‚ on page 15 for more information.
The system must write the Erase Resume command (address bits are “don’t care”) to exit the erase suspend mode
and continue the sector erase operation. Further writes of
the Resume command are ignored. Another Erase Suspend
command can be written after the device has resumed erasing.
Erase Suspend/Erase Resume Commands
The Erase Suspend command allows the system to interrupt
a sector erase operation and then read data from, or program data to, any sector not selected for erasure. This command is valid only during the sector erase operation,
including the 50 µs time-out period during the sector erase
command sequence. The Erase Suspend command is ignored if written during the chip erase operation or Embedded
Program algorithm. Writing the Erase Suspend command
during the Sector Erase time-out immediately terminates the
time-out period and suspends the erase operation. Addresses are don’t-cares when writing the Erase Suspend
command.
START
Write Erase
Command Sequence
Data Poll
from System
When the Erase Suspend command is written during a sector erase operation, the device requires a maximum of 20 µs
to suspend the erase operation. However, when the Erase
Suspend command is written during the sector erase
time-out, the device immediately terminates the time-out period and suspends the erase operation.
After the erase operation has been suspended, the system
can read array data from or program data to any sector not
selected for erasure. (The device erase suspends all sectors
selected for erasure.) Normal read and write timings and
command definitions apply. Reading at any address within
eras e-suspended sectors produces status data on
DQ7–DQ0. The system can use DQ7, or DQ6 and DQ2 together, to determine if a sector is actively erasing or is
erase-suspended. See Write Operation Status‚ on page 19
for information on these status bits.
No
Data = FFh?
Yes
Erasure Completed
Notes:
1. See Table 5 on page 18 for erase command sequence.
2. See DQ3: Sector Erase Timer‚ on page 21 for more information.
Figure 4.
February 20, 2009 Am29SL400C_00_A7
Embedded
Erase
algorithm
in progress
Am29SL400C
Erase Operation
17
D A T A
S H E E T
Command Definitions
Table 5.
Read (Note 6)
Reset (Note 7)
Autoselect (Note 8)
Manufacturer ID
Word
Byte
Device ID,
Top Boot Block
Word
Device ID,
Bottom Boot Block
Word
Byte
Byte
Addr
Data
1
RA
RD
1
XXX
F0
4
4
4
Word
Sector Protect Verify
(Note 9)
Program
Unlock Bypass
Bus Cycles (Notes 2-5)
Cycles
Command
Sequence
(Note 1)
Am29SL400C Command Definitions
First
555
AAA
555
AAA
555
AAA
Second
AA
AA
AA
555
4
Addr
2AA
555
2AA
555
2AA
555
Third
Data
555
55
AAA
555
55
AAA
555
55
AAA
2AA
AA
55
AAA
555
AAA
Word
555
2AA
555
Word
Byte
4
3
AAA
555
AAA
AA
AA
555
2AA
555
55
AAA
555
55
AAA
2
XXX
A0
PA
PD
Unlock Bypass Reset (Note 11)
2
XXX
90
XXX
00
Sector Erase
Word
Byte
Word
Byte
6
6
555
AAA
555
AAA
AA
AA
Erase Suspend (Note 12)
1
XXX
B0
Erase Resume (Note 13)
1
XXX
30
2AA
555
2AA
555
Legend:
X = Don’t care
Addr
Data
90
X00
01
90
90
X01
70h
X02
70h
X01
FIh
X02
FIh
(SA)
X02
XX00
(SA)
X04
00
PA
PD
90
Byte
Byte
Fourth
Data
555
Unlock Bypass Program (Note 10)
Chip Erase
Addr
555
55
AAA
555
55
AAA
A0
Fifth
Addr
Sixth
Data
Addr
Data
XX01
01
20
80
80
555
AAA
555
AAA
AA
AA
2AA
555
2AA
555
55
55
555
AAA
SA
10
30
PD = Data to be programmed at location PA. Data latches on the rising
edge of WE# or CE# pulse, whichever happens first.
RA = Address of the memory location to be read.
RD = Data read from location RA during read operation.
PA = Address of the memory location to be programmed. Addresses
latch on the falling edge of the WE# or CE# pulse, whichever happens
later.
SA = Address of the sector to be verified (in autoselect mode) or
erased. Address bits A17–A12 uniquely select any sector.
Notes:
1. See Table 1 for description of bus operations.
8. The fourth cycle of the autoselect command sequence is a read
cycle.
2. All values are in hexadecimal.
3. Except when reading array or autoselect data, all bus cycles are
write operations.
9. The data is 00h for an unprotected sector and 01h for a protected
sector. See “Autoselect Command Sequence” for more
information.
4. Data bits DQ15–DQ8 are don’t cares for unlock and command
cycles.
10. The Unlock Bypass command is required prior to the Unlock
Bypass Program command.
5. Address bits A17–A11 are don’t cares for unlock and command
cycles, unless SA or PA required.
11. The Unlock Bypass Reset command is required to return to
reading array data when the device is in the unlock bypass mode.
6. No unlock or command cycles required when reading array data,
unless SA or PA required.
12. The system may read and program in non-erasing sectors, or
enter the autoselect mode, when in the Erase Suspend mode.
The Erase Suspend command is valid only during a sector erase
operation.
7. The Reset command is required to return to reading array data
when device is in the autoselect mode, or if DQ5 goes high (while
the device is providing status data).
18
13. The Erase Resume command is valid only during the Erase Suspend
mode.
Am29SL400C
Am29SL400C_00_A7 February 20, 2009
D A T A
S H E E T
WRITE OPERATION STATUS
The device provides several bits to determine the status of a
write operation: DQ2, DQ3, DQ5, DQ6, DQ7, and RY/BY#.
Table 6 on page 22 and the following subsections describe
the functions of these bits. DQ7, RY/BY#, and DQ6 each
offer a method for determining whether a program or erase
operation is complete or in progress. These three bits are
discussed first.
START
Read DQ7–DQ0
Addr = VA
DQ7: Data# Polling
The Data# Polling bit, DQ7, indicates to the host system
whether an Embedded Algorithm is in progress or completed, or whether the device is in Erase Suspend. Data#
Polling is valid after the rising edge of the final WE# pulse in
the program or erase command sequence.
During the Embedded Program algorithm, the device outputs on DQ7 the complement of the datum programmed to
DQ7. This DQ7 status also applies to programming during
Erase Suspend. When the Embedded Program algorithm is
complete, the device outputs the datum programmed to
DQ7. The system must provide the program address to read
valid status information on DQ7. If a program address falls
within a protected sector, Data# Polling on DQ7 is active for
approximately 1 µs, then the device returns to reading array
data.
DQ7 = Data?
No
No
When the system detects DQ7 has changed from the complement to true data, it can read valid data at DQ7–DQ0 on
the following read cycles. This is because DQ7 may change
asynchronously with DQ0–DQ6 while Output Enable (OE#)
is asserted low. Figure 19‚ on page 33 Data# Polling Timings
(During Embedded Algorithms), illustrates this.
DQ5 = 1?
Yes
During the Embedded Erase algorithm, Data# Polling produces a 0 on DQ7. When the Embedded Erase algorithm is
complete, or if the device enters the Erase Suspend mode,
Data# Polling produces a 1 on DQ7. This is analogous to the
complement/true datum output described for the Embedded
Program algorithm: the erase function changes all the bits in
a sector to 1; prior to this, the device outputs the complement, or 0. The system must provide an address within any
of the sectors selected for erasure to read valid status information on DQ7.
After an erase command sequence is written, if all sectors
selected for erasing are protected, Data# Polling on DQ7 is
active for approximately 100 µs, then the device returns to
reading array data. If not all selected sectors are protected,
the Embedded Erase algorithm erases the unprotected sectors, and ignores the selected sectors that are protected.
Yes
Read DQ7–DQ0
Addr = VA
DQ7 = Data?
Yes
No
FAIL
PASS
Notes:
1. VA = Valid address for programming. During a sector erase
operation, a valid address is an address within any sector
selected for erasure. During chip erase, a valid address is any
non-protected sector address.
2. DQ7 should be rechecked even if DQ5 = 1 because DQ7 may
change simultaneously with DQ5.
Figure 5. Data# Polling Algorithm
Table 6 on page 22 shows the outputs for Data# Polling on
DQ7. Figure 5 shows the Data# Polling algorithm.
RY/BY#: Ready/Busy#
The RY/BY# is a dedicated, open-drain output pin that indicates whether an Embedded Algorithm is in progress or
complete. The RY/BY# status is valid after the rising edge of
the final WE# pulse in the command sequence. Since
RY/BY# is an open-drain output, several RY/BY# pins can be
tied together in parallel with a pull-up resistor to VCC.
February 20, 2009 Am29SL400C_00_A7
Am29SL400C
19
D A T A
If the output is low (Busy), the device is actively erasing or
programming. (This includes programming in the Erase Suspend mode.) If the output is high (Ready), the device is
ready to read array data (including during the Erase Suspend mode), or is in the standby mode.
Table 6 on page 22 shows the outputs for RY/BY#.
Figure 14‚ on page 28, Figure 17‚ on page 31, and
Figure 18‚ on page 32 shows RY/BY# for reset, program,
and erase operations, respectively.
DQ6: Toggle Bit I
Toggle Bit I on DQ6 indicates whether an Embedded Program or Erase algorithm is in progress or complete, or
whether the device has entered the Erase Suspend mode.
Toggle Bit I may be read at any address, and is valid after the
rising edge of the final WE# pulse in the command sequence
(prior to the program or erase operation), and during the sector erase time-out.
During an Embedded Program or Erase algorithm operation,
successive read cycles to any address cause DQ6 to toggle
(The system may use either OE# or CE# to control the read
cycles). When the operation is complete, DQ6 stops toggling.
After an erase command sequence is written, if all sectors
selected for erasing are protected, DQ6 toggles for approximately 100 µs, then returns to reading array data. If not all
selected sectors are protected, the Embedded Erase algorithm erases the unprotected sectors, and ignores the selected sectors that are protected.
The system can use DQ6 and DQ2 together to determine
whether a sector is actively erasing or is erase-suspended.
When the device is actively erasing (that is, the Embedded
Erase algorithm is in progress), DQ6 toggles. When the device enters the Erase Suspend mode, DQ6 stops toggling.
However, the system must also use DQ2 to determine which
sectors are erasing or erase-suspended. Alternatively, the
system can use DQ7 (see the subsection on DQ7: Data#
Polling‚ on page 19).
If a program address falls within a protected sector, DQ6 toggles for approximately 1 µs after the program command sequence is written, then returns to reading array data.
DQ6 also toggles during the erase-suspend-program mode,
and stops toggling once the Embedded Program algorithm is
complete.
Table 6 on page 22 shows the outputs for Toggle Bit I on
DQ6. Figure 6‚ on page 21 shows the toggle bit algorithm.
Figure 20‚ on page 33 shows the toggle bit timing diagrams.
Figure 21 shows the differences between DQ2 and DQ6 in
graphical form. See also the subsection on DQ2: Toggle Bit
II‚ on page 20.
20
S H E E T
DQ2: Toggle Bit II
The “Toggle Bit II” on DQ2, when used with DQ6, indicates
whether a particular sector is actively erasing (that is, the
Embedded Erase algorithm is in progress), or whether that
sector is erase-suspended. Toggle Bit II is valid after the rising edge of the final WE# pulse in the command sequence.
The device toggles DQ2 with each OE# or CE# read cycle.
DQ2 toggles when the system reads at addresses within
those sectors that have been selected for erasure. But DQ2
cannot distinguish whether the sector is actively erasing or is
erase-suspended. DQ6, by comparison, indicates whether
the device is actively erasing, or is in Erase Suspend, but
cannot distinguish which sectors are selected for erasure.
Thus, both status bits are required for sector and mode information. Refer to Table 6 on page 22 to compare outputs for
DQ2 and DQ6.
Figure 6‚ on page 21 shows the toggle bit algorithm in flowchart form, and the section DQ2: Toggle Bit II‚ on page 20
explains the algorithm. See also the DQ6: Toggle Bit I subsection. Figure 20‚ on page 33 shows the toggle bit timing diagram. Figure 21‚ on page 34 shows the differences
between DQ2 and DQ6 in graphical form.
Reading Toggle Bits DQ6/DQ2
Refer to Figure 6‚ on page 21 for the following discussion.
Whenever the system initially begins reading toggle bit status, it must read DQ7–DQ0 at least twice in a row to determine whether a toggle bit is toggling. Typically, the system
would note and store the value of the toggle bit after the first
read. After the second read, the system would compare the
new value of the toggle bit with the first. If the toggle bit is not
toggling, the device has completed the program or erase operation. The system can read array data on DQ7–DQ0 on
the following read cycle.
However, if after the initial two read cycles, the system determines that the toggle bit is still toggling, the system also
should note whether the value of DQ5 is high (see the section on DQ5). If it is, the system should then determine again
whether the toggle bit is toggling, since the toggle bit may
have stopped toggling just as DQ5 went high. If the toggle bit
is no longer toggling, the device has successfully completed
the program or erase operation. If it is still toggling, the device did not completed the operation successfully, and the
system must write the reset command to return to reading
array data.
The remaining scenario is that the system initially determines that the toggle bit is toggling and DQ5 has not gone
high. The system may continue to monitor the toggle bit and
DQ5 through successive read cycles, determining the status
as described in the previous paragraph. Alternatively, it may
choose to perform other system tasks. In this case, the system must start at the beginning of the algorithm when it returns to determine the status of the operation (top of
Figure 6‚ on page 21).
Am29SL400C
Am29SL400C_00_A7 February 20, 2009
D A T A
S H E E T
DQ5: Exceeded Timing Limits
DQ5 indicates whether the program or erase time has exceeded a specified internal pulse count limit. Under these
conditions DQ5 produces a 1. This is a failure condition that
indicates the program or erase cycle was not successfully
completed.
START
Read DQ7–DQ0
The DQ5 failure condition may appear if the system tries to
program a 1 to a location that is previously programmed to
“0.” Only an erase operation can change a 0 back to a 1.
Under this condition, the device halts the operation, and
when the operation has exceeded the timing limits, DQ5 produces a 1.
(Note 1)
Read DQ7–DQ0
Under both these conditions, the system must issue the
reset command to return the device to reading array data.
No
Toggle Bit
= Toggle?
DQ3: Sector Erase Timer
Yes
No
After writing a sector erase command sequence, the system
may read DQ3 to determine whether or not an erase operation has begun. (The sector erase timer does not apply to
the chip erase command.) If additional sectors are selected
for erasure, the entire time-out also applies after each additional sector erase command. When the time-out is complete, DQ3 switches from 0 to 1. If the time between
additional sector erase commands from the system can be
assumed to be less than 50 µs, the system need not monitor
DQ3. See also Sector Erase Command Sequence‚ on
page 16.
DQ5 = 1?
Yes
Read DQ7–DQ0
Twice
(Notes
1, 2)
Toggle Bit
= Toggle?
After the sector erase command sequence is written, the
system should read the status on DQ7 (Data# Polling) or
DQ6 (Toggle Bit I) to ensure the device has accepted the
command sequence, and then read DQ3. If DQ3 is 1, the internally controlled erase cycle has begun; all further commands (other than Erase Suspend) are ignored until the
erase operation is complete. If DQ3 is 1, the device will accept additional sector erase commands. To ensure the command has been accepted, the system software should check
the status of DQ3 prior to and following each subsequent
sector erase command. If DQ3 is high on the second status
check, the last command might not have been accepted.
Table 6 on page 22 shows the outputs for DQ3.
No
Yes
Program/Erase
Operation Not
Complete, Write
Reset Command
Program/Erase
Operation Complete
Notes:
1. Read toggle bit twice to determine whether or not it is toggling.
See text.
2. Recheck toggle bit because it may stop toggling as DQ5
changes to 1. See text.
Figure 6. Toggle Bit Algorithm
February 20, 2009 Am29SL400C_00_A7
Am29SL400C
21
D A T A
S H E E T
Table 6. Write Operation Status
DQ7
(Note 2)
DQ6
DQ5
(Note 1)
DQ3
DQ2
(Note 2)
RY/BY#
DQ7#
Toggle
0
N/A
No toggle
0
0
Toggle
0
1
Toggle
0
1
No toggle
0
N/A
Toggle
1
Reading within Non-Erase
Suspended Sector
Data
Data
Data
Data
Data
1
Erase-Suspend-Program
DQ7#
Toggle
0
N/A
N/A
0
Operation
Standard
Mode
Erase
Suspend
Mode
Embedded Program Algorithm
Embedded Erase Algorithm
Reading within Erase
Suspended Sector
Notes:
1. DQ5 switches to 1 when an Embedded Program or Embedded Erase operation has exceeded the maximum timing limits. See DQ5:
Exceeded Timing Limits‚ on page 21 for more information.
2. DQ7 and DQ2 require a valid address when reading status information. Refer to the appropriate subsection for further details.
22
Am29SL400C
Am29SL400C_00_A7 February 20, 2009
D A T A
S H E E T
ABSOLUTE MAXIMUM RATINGS
Storage Temperature
Plastic Packages . . . . . . . . . . . . . . . . . . . . –65°C to +150°C
Ambient Temperature
with Power Applied. . . . . . . . . . . . . . . . . . . –65°C to +125°C
Voltage with Respect to Ground
20 ns
20 ns
0.0 V
–0.5 V
VCC (Note 1) . . . . . . . . . . . . . . . . . . . . . . . .–0.5 V to +2.5 V
A9, OE#,
and RESET# (Note 2) . . . . . . . . . . . . . . . .–0.5 V to +11.0 V
–2.0 V
20 ns
All other pins (Note 1) . . . . . . . . . . . . . –0.5 V to VCC+0.5 V
Output Short Circuit Current (Note 3) . . . . . . . . . . . 100 mA
Notes:
1. Minimum DC voltage on input or I/O pins is –0.5 V. During voltage
transitions, input or I/O pins may overshoot VSS to –2.0 V for
periods of up to 20 ns. See Figure 7. Maximum DC voltage on
input or I/O pins is VCC +0.5 V. During voltage transitions, input
or I/O pins may overshoot to VCC +2.0 V for periods up to 20 ns.
See Figure 8.
2. Minimum DC input voltage on pins A9, OE#, and RESET# is –0.5
V. During voltage transitions, A9, OE#, and RESET# may
overshoot VSS to –2.0 V for periods of up to 20 ns. See.
Maximum DC input voltage on pin A9 is +11.0 V which may
overshoot to 12.5 V for periods up to 20 ns.
3. No more than one output may be shorted to ground at a time.
Duration of the short circuit should not be greater than one
second.
Stresses above those listed under “Absolute Maximum Ratings” may
cause permanent damage to the device. This is a stress rating only;
functional operation of the device at these or any other conditions
above those indicated in the operational sections of this data sheet is
not implied. Exposure of the device to absolute maximum rating
conditions for extended periods may affect device reliability.
Figure 7. Maximum Negative Overshoot Waveform
20 ns
VCC
+2.0 V
VCC
+0.5 V
2.0 V
20 ns
20 ns
Figure 8. Maximum Positive Overshoot Waveform
OPERATING RANGES
VCC Supply Voltages
Commercial (C) Devices
VCC for full voltage range . . . . . . . . . . . . . +1.65 V to +2.2 V
Ambient Temperature (TA) . . . . . . . . . . . . . . . . 0°C to +70°C
Industrial (I) Devices
VCC for regulated voltage range. . . . . . . . +1.70 V to +2.2 V
Note: Operating ranges define those limits between which the functionality of the device is guaranteed.
Ambient Temperature (TA) . . . . . . . . . . . . . . –40°C to +85°C
February 20, 2009 Am29SL400C_00_A7
Am29SL400C
23
D A T A
S H E E T
DC CHARACTERISTICS
CMOS Compatible
Parameter
Description
Test Conditions
ILI
Input Load Current
VIN = VSS to VCC,
VCC = VCC max
ILIT
A9 Input Load Current
VCC = VCC max; A9 = 11.0 V
ILO
Output Leakage Current
VOUT = VSS to VCC,
VCC = VCC max
ICC1
VCC Active Read Current
(Notes 1, 2)
Min
Typ
Max
Unit
±1.0
µA
35
µA
±1.0
µA
CE# = VIL, OE# = VIH,
Byte Mode
5 MHz
5
10
1 MHz
1
3
CE# = VIL, OE# = VIH,
Word Mode
5 MHz
5
10
1 MHz
1
3
mA
ICC2
VCC Active Write Current
(Notes 2, 3, 5)
CE# = VIL, OE# = VIH
20
25
mA
ICC3
VCC Standby Current (Note 2)
CE#, RESET# = VCC ± 0.2 V
1
5
µA
ICC4
VCC Reset Current (Note 2)
RESET# = VSS ± 0.2 V
1
5
µA
ICC5
Automatic Sleep Mode
(Notes 2, 3)
VIH = VCC ± 0.2 V;
VIL = VSS ± 0.2 V
1
5
µA
VIL
Input Low Voltage
–0.5
0.2 x VCC
V
VIH
Input High Voltage
0.8 x VCC
VCC + 0.3
V
VID
Voltage for Autoselect and
Temporary Sector Unprotect
9.0
11.0
V
IOL = 2.0 mA, VCC = VCC min
0.25
V
IOL = 100 μA, VCC = VCC min
0.1
V
VOL1
Output Low Voltage
VOL2
VOH1
Output High Voltage
VOH2
VLKO
VCC = 2.0 V
IOH = –2.0 mA, VCC = VCC min
0.7 x VCC
V
IOH = –100 μA, VCC = VCC min
VCC–0.1
V
Low VCC Lock-Out Voltage
(Note 4)
1.2
1.5
V
Notes:
1. The ICC current listed is typically less than 1 mA/MHz, with OE# at VIH. Typical VCC is 2.0 V.
2. The maximum ICC specifications are tested with VCC = VCCmax.
3. ICC active while Embedded Erase or Embedded Program is in progress.
4. Automatic sleep mode enables the low power mode when addresses remain stable for tACC + 50 ns.
5. Not 100% tested.
24
Am29SL400C
Am29SL400C_00_A7 February 20, 2009
D A T A
S H E E T
DC CHARACTERISTICS (Continued)
Zero Power Flash
Supply Current in mA
20
15
10
5
0
0
500
1000
1500
2000
2500
3000
3500
4000
Time in ns
Note: Addresses are switching at 1 MHz
Figure 9.
ICC1 Current vs. Time (Showing Active and Automatic Sleep Currents)
10
Supply Current in mA
8
6
2.2 V
4
1.8 V
2
0
1
2
3
4
5
Frequency in MHz
Note: T = 25 °C
Figure 10. Typical ICC1 vs. Frequency
February 20, 2009 Am29SL400C_00_A7
Am29SL400C
25
D A T A
S H E E T
TEST CONDITIONS
Table 7.
Test Specifications
Test Condition
Device
Under
Test
All Speed Options
Unit
Output Load Capacitance, CL
(including jig capacitance)
30
pF
Input Rise and Fall Times
5
ns
0.0–2.0
V
Input timing measurement
reference levels
1.0
V
Output timing measurement
reference levels
1.0
V
Input Pulse Levels
CL
Figure 11.
Test Setup
Key to Switching Waveforms
WAVEFORM
INPUTS
OUTPUTS
Steady
Changing from H to L
Changing from L to H
2.0 V
Input
Don’t Care, Any Change Permitted
Changing, State Unknown
Does Not Apply
Center Line is High Impedance State (High Z)
1.0 V
Measurement Level
1.0 V
Output
0.0 V
Figure 12. Input Waveforms
and Measurement Levels
26
Am29SL400C
Am29SL400C_00_A7 February 20, 2009
D A T A
S H E E T
AC CHARACTERISTICS
Read Operations
Parameter
Speed Options
JEDEC
Std.
tAVAV
tRC
Read Cycle Time (Note 1)
tAVQV
tACC
Address to Output Delay
tELQV
tCE
Chip Enable to Output Delay
tGLQV
tOE
tEHQZ
tGHQZ
tAXQX
Description
Test Setup
-100R
-110
-120
-150
Unit
Min
100
110
120
150
ns
CE# = VIL
OE# = VIL
Max
100
110
120
150
ns
OE# = VIL
Max
100
110
120
150
ns
Output Enable to Output Delay
Max
35
45
50
65
ns
tDF
Chip Enable to Output High Z (Note 1)
Max
16
ns
tDF
Output Enable to Output High Z (Note 1)
Max
16
ns
Read
Min
0
ns
Toggle and
Data# Polling
Min
30
ns
Min
0
ns
tOEH
Output Enable
Hold Time (Note 1)
tOH
Output Hold Time From Addresses, CE# or OE#,
Whichever Occurs First (Note 1)
Notes:
1. Not 100% tested.
2. See Figure 11‚ on page 26 and Table 7 on page 26 for test specifications.
tRC
Addresses Stable
Addresses
tACC
CE#
tDF
tOE
OE#
tOEH
WE#
tCE
tOH
HIGH Z
HIGH Z
Output Valid
Outputs
RESET#
RY/BY#
0V
Figure 13. Read Operations Timings
February 20, 2009 Am29SL400C_00_A7
Am29SL400C
27
D A T A
S H E E T
AC CHARACTERISTICS
Hardware Reset (RESET#)
Parameter
JEDEC
Std
Description
Test Setup
All Speed Options
Unit
tREADY
RESET# Pin Low (During Embedded Algorithms) to
Read or Write (See Note)
Max
20
µs
tREADY
RESET# Pin Low (NOT During Embedded
Algorithms) to Read or Write (See Note)
Max
500
ns
tRP
RESET# Pulse Width
Min
500
ns
tRH
RESET# High Time Before Read (See Note)
Min
200
ns
tRPD
RESET# Low to Standby Mode
Min
20
µs
tRB
RY/BY# Recovery Time
Min
0
ns
Note: Not 100% tested.
RY/BY#
CE#, OE#
tRH
RESET#
tRP
tReady
Reset Timings NOT during Embedded Algorithms
Reset Timings during Embedded Algorithms
tReady
RY/BY#
tRB
CE#, OE#
RESET#
tRP
Figure 14. RESET# Timings
28
Am29SL400C
Am29SL400C_00_A7 February 20, 2009
D A T A
S H E E T
AC CHARACTERISTICS
Word/Byte Configuration (BYTE#)
Parameter
JEDEC
Speed Options
Description
Std
-100R
-110
-120
-150
Unit
tELFL/tELFH
CE# to BYTE# Switching Low or High
Max
tFLQZ
BYTE# Switching Low to Output HIGH Z
Max
50
55
60
60
ns
tFHQV
BYTE# Switching High to Output Active
Min
100
110
120
150
ns
10
ns
CE#
OE#
BYTE#
tELFL
BYTE#
Switching
from word
to byte
mode
Data Output
(DQ0–DQ14)
DQ0–DQ14
Data Output
(DQ0–DQ7)
Address
Input
DQ15
Output
DQ15/A-1
tFLQZ
tELFH
BYTE#
BYTE#
Switching
from byte to
word mode
Data Output
(DQ0–DQ7)
DQ0–DQ14
Address
Input
DQ15/A-1
Data Output
(DQ0–DQ14)
DQ15
Output
tFHQV
Figure 15.
BYTE# Timings for Read Operations
CE#
The falling edge of the last WE# signal
WE#
BYTE#
tSET
(tAS)
tHOLD (tAH)
Note: Refer to the Erase/Program Operations table for tAS and tAH specifications.
Figure 16. BYTE# Timings for Write Operations
February 20, 2009 Am29SL400C_00_A7
Am29SL400C
29
D A T A
S H E E T
AC CHARACTERISTICS
Erase/Program Operations
Parameter
Speed Options
JEDEC
Std
Description
-100R
-110
-120
-150
Unit
tAVAV
tWC
Write Cycle Time (Note 1)
Min
100
110
120
150
ns
tAVWL
tAS
Address Setup Time
Min
tWLAX
tAH
Address Hold Time
Min
50
55
60
70
ns
tDVWH
tDS
Data Setup Time
Min
50
55
60
70
ns
tWHDX
tDH
Data Hold Time
Min
0
ns
tOES
Output Enable Setup Time
Min
0
ns
Read Recovery Time Before Write
(OE# High to WE# Low)
Min
0
ns
0
ns
tGHWL
tGHWL
tELWL
tCS
CE# Setup Time
Min
0
ns
tWHEH
tCH
CE# Hold Time
Min
0
ns
tWLWH
tWP
Write Pulse Width
Min
tWHWL
tWPH
Write Pulse Width High
Min
30
Byte
Typ
10
tWHWH1
tWHWH1
Programming Operation (Notes 1, 2)
Word
Typ
12
tWHWH2
tWHWH2
Sector Erase Operation (Notes 1, 2)
Typ
2
sec
tVCS
VCC Setup Time
Min
50
µs
tRB
Recovery Time from RY/BY#
Min
0
ns
Program/Erase Valid to RY/BY# Delay
Max
200
ns
tBUSY
50
55
60
70
ns
ns
µs
Notes:
1. Not 100% tested.
2. See the Erase and Programming Performance‚ on page 38 section for more information.
30
Am29SL400C
Am29SL400C_00_A7 February 20, 2009
D A T A
S H E E T
AC CHARACTERISTICS
Program Command Sequence (last two cycles)
tAS
tWC
Addresses
Read Status Data (last two cycles)
555h
PA
PA
PA
tAH
CE#
tCH
OE#
tWHWH1
tWP
WE#
tWPH
tCS
tDS
tDH
A0h
Data
PD
Status
tBUSY
DOUT
tRB
RY/BY#
VCC
tVCS
Notes:
1. PA = program address, PD = program data, DOUT is the true data at the program address.
2. Illustration shows device in word mode.
Figure 17.
February 20, 2009 Am29SL400C_00_A7
Program Operation Timings
Am29SL400C
31
D A T A
S H E E T
AC CHARACTERISTICS
Erase Command Sequence (last two cycles)
tAS
tWC
2AAh
Addresses
Read Status Data
VA
SA
VA
555h for chip erase
tAH
CE#
tCH
OE#
tWP
WE#
tWPH
tCS
tWHWH2
tDS
tDH
Data
55h
In
Progress
30h
Complete
10 for Chip Erase
tBUSY
tRB
RY/BY#
tVCS
VCC
Notes:
1. SA = sector address (for Sector Erase), VA = Valid Address for reading status data (see Write Operation Status‚ on page 19.
2. Illustration shows device in word mode.
Figure 18.
32
Chip/Sector Erase Operation Timings
Am29SL400C
Am29SL400C_00_A7 February 20, 2009
D A T A
S H E E T
AC CHARACTERISTICS
tRC
Addresses
VA
VA
VA
tACC
tCE
CE#
tCH
tOE
OE#
tOEH
tDF
WE#
tOH
High Z
DQ7
Complement
Complement
DQ0–DQ6
Status Data
Status Data
Valid Data
True
High Z
Valid Data
True
tBUSY
RY/BY#
Note: VA = Valid address. Illustration shows first status cycle after command sequence, last status read cycle, and array data read cycle.
Figure 19. Data# Polling Timings
(During Embedded Algorithms)
tRC
Addresses
VA
VA
VA
VA
tACC
tCE
CE#
tCH
tOE
OE#
tOEH
tDF
WE#
tOH
High Z
DQ6/DQ2
tBUSY
Valid Status
Valid Status
(first read)
(second read)
Valid Status
Valid Data
(stops toggling)
RY/BY#
Note: VA = Valid address; not required for DQ6. Illustration shows first two status cycle after command sequence, last status read cycle, and
array data read cycle.
Figure 20. Toggle Bit Timings
(During Embedded Algorithms)
February 20, 2009 Am29SL400C_00_A7
Am29SL400C
33
D A T A
S H E E T
AC CHARACTERISTICS
Enter
Embedded
Erasing
Erase
Suspend
Erase
WE#
Enter Erase
Suspend Program
Erase
Resume
Erase
Suspend
Program
Erase Suspend
Read
Erase
Erase Suspend
Read
Erase
Complete
DQ6
DQ2
Note: The system may use CE# or OE# to toggle DQ2 and DQ6. DQ2 toggles only when read at an address within an erase-suspended sector.
Figure 21. DQ2 vs. DQ6
Temporary Sector Unprotect
Parameter
JEDEC
Std
Description
All Speed Options
Unit
tVIDR
VID Rise and Fall Time
Min
500
ns
tRSP
RESET# Setup Time for Temporary Sector
Unprotect
Min
4
µs
10 V
RESET#
0 or 1.8 V
0 or 1.8 V
tVIDR
tVIDR
Program or Erase Command Sequence
CE#
WE#
tRSP
RY/BY#
Figure 22. Temporary Sector Unprotect
Timing Diagram
34
Am29SL400C
Am29SL400C_00_A7 February 20, 2009
D A T A
S H E E T
AC CHARACTERISTICS
VID
VIH
RESET#
SA, A6,
A1, A0
Valid*
Valid*
Sector Protect/Unprotect
Data
60h
1 µs
Valid*
Verify
60h
40h
Status
Sector Protect: 150 µs
Sector Unprotect: 15 ms
CE#
WE#
OE#
* For sector protect, A6 = 0, A1 = 1, A0 = 0. For sector unprotect, A6 = 1, A1 = 1, A0 = 0.
Figure 23. Sector Protect/Unprotect Timing Diagram
February 20, 2009 Am29SL400C_00_A7
Am29SL400C
35
D A T A
S H E E T
AC CHARACTERISTICS
Alternate CE# Controlled Erase/Program Operations
Parameter
Speed Options
JEDEC
Std
Description
tAVAV
tWC
Write Cycle Time (Note 1)
Min
tAVEL
tAS
Address Setup Time
Min
tELAX
tAH
Address Hold Time
Min
50
55
60
70
ns
tDVEH
tDS
Data Setup Time
Min
50
55
60
70
ns
tEHDX
tDH
Data Hold Time
Min
0
ns
tOES
Output Enable Setup Time
Min
0
ns
tGHEL
tGHEL
Read Recovery Time Before Write
(OE# High to WE# Low)
Min
0
ns
tWLEL
tWS
WE# Setup Time
Min
0
ns
tEHWH
tWH
WE# Hold Time
Min
0
ns
tELEH
tCP
CE# Pulse Width
Min
tEHEL
tCPH
CE# Pulse Width High
Min
30
Typ
10
tWHWH1
Programming Operation
(Notes 1, 2)
Byte
tWHWH1
Word
Typ
12
tWHWH2
tWHWH2
Sector Erase Operation (Notes 1, 2)
Typ
2
-100R
-110
-120
-150
Unit
100
110
120
150
ns
0
50
55
ns
60
70
ns
ns
µs
sec
Notes:
1. Not 100% tested.
2. See the Erase and Programming Performance‚ on page 38 section for more information.
36
Am29SL400C
Am29SL400C_00_A7 February 20, 2009
D A T A
S H E E T
AC CHARACTERISTICS
555 for program
2AA for erase
PA for program
SA for sector erase
555 for chip erase
Data# Polling
Addresses
PA
tWC
tAS
tAH
tWH
WE#
tGHEL
OE#
tWHWH1 or 2
tCP
CE#
tWS
tCPH
tBUSY
tDS
tDH
DQ7#
Data
tRH
A0 for program
55 for erase
DOUT
PD for program
30 for sector erase
10 for chip erase
RESET#
RY/BY#
Notes:
1. PA = program address, PD = program data, DQ7# = complement of the data written, DOUT = data written
2. Figure indicates the last two bus cycles of command sequence.
3. Word mode address used as an example.
Figure 24. Alternate CE# Controlled
Write Operation Timings
February 20, 2009 Am29SL400C_00_A7
Am29SL400C
37
D A T A
S H E E T
ERASE AND PROGRAMMING PERFORMANCE
Parameter
Typ (Note 1)
Max (Note 2)
Unit
Comments
Sector Erase Time
2
15
s
Chip Erase Time
38
Excludes 00h programming prior to
erasure (Note 4)
Byte Programming Time
10
300
µs
Word Programming Time
12
360
µs
Chip Programming Time
Byte Mode
5
40
s
(Note 3)
Word Mode
3.5
30
s
s
Excludes system level overhead
(Note 5)
Notes:
1.
Typical program and erase times assume the following conditions: 25°C, 2.0 V VCC, 1,000,000 cycles. Additionally, programming typicals assume
checkerboard pattern.
2.
Under worst case conditions of 90°C, VCC = 1.8 V, 1,000,000 cycles.
3.
The typical chip programming time is considerably less than the maximum chip programming time listed, since most bytes program faster than
the maximum program times listed.
4.
In the pre-programming step of the Embedded Erase algorithm, all bytes are programmed to 00h before erasure.
5.
System-level overhead is the time required to execute the two- or four-bus-cycle sequence for the program command. See Table 5 on page 18
for further information on command definitions.
6.
The device has a minimum guaranteed erase and program cycle endurance of 1,000,000 cycles.
38
Am29SL400C
Am29SL400C_00_A7 February 20, 2009
D A T A
S H E E T
LATCHUP CHARACTERISTICS
Description
Min
Max
Input voltage with respect to VSS on all pins except I/O pins
(including A9, OE#, and RESET#)
–1.0 V
11.0 V
Input voltage with respect to VSS on all I/O pins
–0.5 V
VCC + 0.5 V
–100 mA
+100 mA
VCC Current
Includes all pins except VCC. Test conditions: VCC = 1.8 V, one pin at a time.
TSOP PIN AND BGA PACKAGE CAPACITANCE
Parameter Symbol
Parameter Description
CIN
Input Capacitance
COUT
Output Capacitance
CIN2
Control Pin Capacitance
Test Setup
VIN = 0
VOUT = 0
VIN = 0
Typ
Max
Unit
TSOP
6
7.5
pF
Fine-pitch BGA
4.2
5.0
pF
TSOP
8.5
12
pF
Fine-pitch BGA
5.4
6.5
pF
TSOP
7.5
9
pF
Fine-pitch BGA
3.9
4.7
pF
Notes:
1. Sampled, not 100% tested.
2. Test conditions TA = 25°C, f = 1.0 MHz.
DATA RETENTION
Parameter
Test Conditions
Min
Unit
150°C
10
Years
125°C
20
Years
Minimum Pattern Data Retention Time
February 20, 2009 Am29SL400C_00_A7
Am29SL400C
39
D A T A
S H E E T
PHYSICAL DIMENSIONS
TS048—48-Pin Standard TSOP
Dwg rev AA; 10/99
40
Am29SL400C
Am29SL400C_00_A7 February 20, 2009
D A T A
S H E E T
PHYSICAL DIMENSIONS
FBA048—48-Ball Fine-Pitch Ball Grid Array (FBGA) 6 x 8 mm Package
Dwg rev AF; 10/99
February 20, 2009 Am29SL400C_00_A7
Am29SL400C
41
D A T A
S H E E T
REVISION SUMMARY
Revision A (August 14, 2002)
Revision A+5 (March 3, 2005)
Initial Release.
Ordering Information
Revision A+1 (August 28, 2002)
Added Commercial and Industrial Pb-free Package temperatures.
Sector Protection/Unprotection
Changed beginning of second paragraph from, “The primary
method....” to read, “Sector protection/unprotection.”
Valid Combinations for TSOP package
Deleted third paragraph.
Valid Combination for FBGA package
FBB048—48-Ball Fine-Pitch Ball Grid Array (FBGA)
6 x 8 mm package
Added two package codes.
Changed number in row D in table from 9.00 mm to 8.0 mm.
Revision A+2 (February 5, 2003)
Added two package codes.
Global
Added Colophon. Updated Trademark information.
Revision A6 (January 23, 2007)
Global
Changed fastest speed option from 103 ns to 100 ns, regulated voltage, added 110 ns speed option standard voltage.
AC Characteristics
Erase and Program Operations table: Changed tBUSY to a
maximum specification.
General Description
Changed first sentenced to indicate 48-pin TSOP package
option.
Revision A7 (February 20, 2009)
Command Definitions, Table 5
Added obsolescence information.
Global
Removed TBD markers from device ID, Top Boot Block to
70h.
Removed TBD markers from device ID, Bottom Boot Block to
FIh.
Changed address bits A18–A11 to A17–A11.
Physical Dimensions, 48-pin TSOP
Changed from Reverse to Standard TSOP package.
Revision A+3 (February 26, 2003)
Global
Added 110 ns speed option.
Distinctive Characteristics
Updated Automatic Sleep Mode and standby mode current
values.
Pin Configuration
Updated VCC low-end value.
Ordering Information
Changed WB package type to WA.
DC Characteristics, CMOS Compatible
Updated VCC Standby and Reset currents Typ values, and
Automatic Sleep Mode Typ value.
Revision A+4 (March 18, 2003)
Ordering Information, Valid Combinations
Removed dashes from Order Numbers.
42
Am29SL400C
Am29SL400C_00_A7 February 20, 2009
D A T A
S H E E T
Colophon
The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the
public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,
aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for
any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion Inc. will not be liable
to you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor
devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design
measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating
conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under the Foreign
Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior authorization by the respective government entity will be required for export of those products.
Trademarks
Copyright © 2002–2005 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc. ExpressFlash is a trademark of Advanced Micro Devices, Inc. Product names used in this publication are
for identification purposes only and may be trademarks of their respective companies.
Copyright © 2006–2009 Spansion Inc. All rights reserved. Spansion®, the Spansion Logo, MirrorBit®, MirrorBit® Eclipse™, ORNAND™,
ORNAND2™, HD-SIM™, EcoRAM™ and combinations thereof, are trademarks of Spansion LLC in the US and other countries. Other names
used are for informational purposes only and may be trademarks of their respective owners.
February 20, 2009 Am29SL400C_00_A7
Am29SL400C
43
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