datasheet for AHT3-INT

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Agilent

Technologies

HyperTransport 3

Solution

Data Sheet

The HyperTransport analysis probes enable designers to debug, test, and verify compliance of 8 and 16 bit HyperTransport links. The analysis probe provides a mechanical, electrical and software interface between your 5.2 GT/s

HyperTransport bus and an Agilent logic analyzer. The probe provides quick and reliable connections to your system under test and has internal termination networks that minimize the effects of loading and refl ections on your

HyperTransport bus during probing. The protocol decode software decodes and displays incoming data on your logic analyzer to make it easy for you to debug your design problems.

Features Complete system

● Analysis of HyperTransport bus up to 5.2 GT/s.

Scalable high speed integrity architecture.

● Support confi guration for 8 bit and 16 bit operation

● Full duplex mode (T

X

and R

X

) – DC coupled probe

architecture with interposer probe for both single and

dual lane measurement

● Non-intrusive probing of midbus using unique soft touch

connectorless probing technology

● Logic analysis triggering and decoding of HyperTransport

buses at the packet level with Packet Viewer software

● Triggering capability with raw 36-bit pattern matching

and menu driven command triggering

● NOOP fi ltering with or without fl ow control

Use a 16900 Series logic analyzer with the analysis probe in your development lab for design and functional validation of

HyperTransport architectures. The analysis probe provides low-intrusion probing of the bus, packet analysis and packet triggering to help you pinpoint your problem areas quickly. The probe supports data scrambling and fl exible lane widths so you can make sure your design is consistent with HyperTransport standards. The interposer and midbus probing option make it easy for you to reliably connect to your device.

Figure 1. Ensure non-intrusive connection to an embedded system with a midbus probe using soft touch connectorless probing technology.

2

Probe connections

HT3-Only Footprint

Figure 2 below shows HT3 footprint which utilizes the same mechanical footprint as Agilent’s PCIe2 probe. Note that this footprint is not backward compatible with the HT1 tools available today.

Figure 2. HT3 footprint

3

38

40

42

32

34

36

24

26

28

30

18

20

22

12

14

16

6

8

10

HT3

Midbus

Pin

2

4

44

46

48

G2

Table 1. Pinout for CAD[7:0] (Lower)

HT3 Signal

NC

GND

CAD[4]_H

CAD[4]_L

GND

CAD[6]_H

CAD[6]_L

GND

CTL[0]_H

CTL[0]_L

GND

LDT_STOP_H

LDT_STOP_L

GND

* No Pad *

GND

NC

NC

GND

CAD[1]_H

CAD[1]_L

GND

CAD[3]_H

CAD[3]_L

GND

NC

37

39

41

31

33

35

23

25

27

29

17

19

21

11

13

15

5

7

9

HT3

Midbus

Pin

G1

1

3

43

45

47

HT3 Signal

GND

CLK[0]_H

CLK[0]_L

GND

CAD[5]_H

CAD[5]_L

GND

CAD[7]_H

CAD[7]_L

GND

RESET_H

RESET_L

GND

* No Pad *

GND

NC

NC

GND

CAD[0]_H

CAD[0]_L

GND

CAD[2]_H

CAD[2]_L

GND

PWROK_H

PWROK_L

HT3 Signal

NC

GND

CAD[12]_H

CAD[12]_L

GND

CAD[14]_H

CAD[14]_L

GND

CTL[1]_H

CTL[1]_L

GND

LDT_STOP_H

LDT_STOP_L

GND

* No Pad *

GND

NC

NC

GND

CAD[9]_H

CAD[9]_L

GND

CAD[11]_H

CAD[11]_L

GND

NC

38

40

42

32

34

36

24

26

28

30

18

20

22

12

14

16

6

8

10

HT3

Midbus

Pin

2

4

44

46

48

G2

37

39

41

31

33

35

23

25

27

29

17

19

21

11

13

15

5

7

9

HT3

Midbus

Pin

G1

1

3

43

45

47

Table 2. Pinout for CAD[15:8] (Upper)

HT3 Signal

GND

CLK[1]_H

CLK[1]_L

GND

CAD[13]_H

CAD[13]_L

GND

CAD[15]_H

CAD[15]_L

GND

RESET_H

RESET_L

GND

* No Pad *

GND

NC

NC

GND

CAD[8]_H

CAD[8]_L

GND

CAD[10]_H

CAD[10]_L

GND

PWROK_H

PWROK_L

4

Probe connections

Soft Touch Twin Footprint

Figure 3 below shows Agilent Technologies Soft Touch

Twin footprint with today’s HT1 tools utilizing the Industry

Standard Connectorless Probe and with Agilent’s HT3 tools of the future. If you want to design a midbus footprint into your system that will accommodate both today’s HT1 tools and Agilent’s HT3 tool, you should design in the “Soft

Touch Twin” footprint.

There is one minor change to the Industry Standard

Connectorless Probe footprint: pin A27 must be tied to

GND in the Soft Touch Twin pinout, rather than to ID[0] as in the original Industry Standard pinout. In addition to this change, the other pinout requirement to make special note of is that the PWROK pair is routed to pins C12 and C13 in addition to pins B26 and B27 in the Industry Standard footprint. Finally, please note that positions C1 and C27 have no pads in the Soft Touch Twin footprint. A red font is used for these pads numbers and signal names in the tables below to highlight their unique handling in the Soft

Touch Twin pinout for HT3. Note also that the differential signals in rows B and C are essentially “double probed.”

Figure 3. “Soft Touch Twin” footprint for HT1 and HT3 tool

5

A17

A18

A19

A20

A21

A22

A10

A11

A12

A13

A14

A15

A16

Soft Touch

Twin Pin

A1

A2

A3

A7

A8

A9

A4

A5

A6

A23

A24

A25

A26

A27

Table 3. Soft Touch Twin pinout for CAD[7:0] (Lower)

HT3 Signal

NC

NC

GND

CAD[4]_H

CAD[4]_L

GND

CAD[6]_H

CAD[6]_L

GND

CTL[0]_H

CTL[0]_L

GND

LDT_STOP_H

LDT_STOP_L

GND

NC

NC

GND

NC

NC

GND

CAD[1]_H

CAD[1]_L

GND

CAD[3]_H

CAD[3]_L

GND

B17

B18

B19

B20

B21

B22

B10

B11

B12

B13

B14

B15

B16

Soft Touch

Twin Pin

B1

B2

B3

B7

B8

B9

B4

B5

B6

B23

B24

B25

B26

B27

HT3 Signal

GND

CLK[0]_H

CLK[0]_L

GND

CAD[5]_H

CAD[5]_L

GND

CAD[7]_H

CAD[7]_L

GND

RESET_H

RESET_L

ID[1]

PWROK_H

PWROK_L

ID[2]

NC

NC

GND

CAD[0]_H

CAD[0]_L

GND

CAD[2]_H

CAD[2]_L

GND

NC

NC

Soft Touch Twin Pin

C20

C21

C22

C23

C24

C25

C26

C27

C13

C14

C15

C16

C17

C18

C19

C7

C8

C9

C10

C11

C12

C4

C5

C6

C1

C2

C3

HT3 Signal

PWROK_L

GND

CLK[0]_H

CLK[0]_L

GND

CAD[5]_H

CAD[5]_L

GND

CAD[7]_H

CAD[7]_L

GND

RESET_H

RESET_L

GND

* No Pad *

* No Pad *

GND

NC

NC

GND

CAD[0]_H

CAD[0]_L

GND

CAD[2]_H

CAD[2]_L

GND

PWROK_H

6

HT3 Signal

NC

NC

GND

CAD[12]_H

CAD[12]_L

GND

CAD[14]_H

CAD[14]_L

GND

CTL[1]_H

CTL[1]_L

GND

LDT_STOP_H

LDT_STOP_L

GND

NC

NC

GND

NC

NC

GND

CAD[9]_H

CAD[9]_L

GND

CAD[11]_H

CAD[11]_L

GND

A17

A18

A19

A20

A21

A22

A10

A11

A12

A13

A14

A15

A16

Soft Touch

Twin Pin

A1

A2

A3

A7

A8

A9

A4

A5

A6

A23

A24

A25

A26

A27

B17

B18

B19

B20

B21

B22

B10

B11

B12

B13

B14

B15

B16

Soft Touch Twin

Pin

B1

B2

B3

B7

B8

B9

B4

B5

B6

B23

B24

B25

B26

B27

Table 4. Soft Touch Twin pinout for CAD[15:8] (Upper)

HT3 Signal

GND

CLK[1]_H

CLK[1]_L

GND

CAD[13]_H

CAD[13]_L

GND

CAD[15]_H

CAD[15]_L

GND

RESET_H

RESET_L

ID[1]

PWROK_H

PWROK_L

ID[2]

NC

NC

GND

CAD[8]_H

CAD[8]_L

GND

CAD[10]_H

CAD[10]_L

GND

NC

NC

Soft Touch Twin Pin

C20

C21

C22

C23

C24

C25

C26

C27

C13

C14

C15

C16

C17

C18

C19

C7

C8

C9

C10

C11

C12

C4

C5

C6

C1

C2

C3

HT3 Signal

PWROK_L

GND

CLK[1]_H

CLK[1]_L

GND

CAD[13]_H

CAD[13]_L

GND

CAD[15]_H

CAD[15]_L

GND

RESET_H

RESET_L

GND

* No Pad *

* No Pad *

GND

NC

NC

GND

CAD[8]_H

CAD[8]_L

GND

CAD[10]_H

CAD[10]_L

GND

PWROK_H

7

Interposer probe

The high-speed signals along with DC level startup conditions have made it almost impossible to use typical

AC coupled probe architectures (snooping probe) without signifi cantly effecting the measurement. The Interposer probe is a DC coupled probe that acts as a “man-in-the middle” between the CPU and the downstream device and sends a buffered copy of the link data to the HT3 logic analysis probe for analysis. The end result is full eyes at probe and target since the signals are buffered and sent back out to the target and the probe.

To the target system

Connections to the logic analyzer

HT3 Interposer HT3 logic analysis probe

Figure 4. DC coupled interposer probe sends buffered copy of the link data from the target to the HT3 logic analysis probe.

The Interposer probe has confi gurations for both single lane (L1) and dual lane (L1L0) applications. The dual lane socket can be used in single lane mode (L1 or L0) if desired. The Interposer solution along with LAI can be ordered from Astek

Corporation as a single unit. The table below gives the confi gurations allowed with the current HT3 LAI and Interposer probe system for various applications.

x8 US/DS* x16 US or DS** x16 US/DS

2 lanes x16 US/DS

Number of LAIs required

1

1

2

4

Number of single lane

Interposers required

1

1

1

N/A

* US/DS corresponds to full-duplex upstream and downstream.

** US or DS corresponds to either upstream or downstream.

*** Dual lane measurements require some additional hardware over single lane.

1

1

Number of Dual Lane Interposers required (use one or two lanes)

1

1***

8

HyperTransport 3 analysis probe

The HyperTransport analysis probe is capable of probing at a serial data rate of 5.2 Gb/s – it’s the speed of standard

HyperTransport 3 bus so you can be confi dent your bus works at HyperTransport 3 speeds. The probe monitors two directions of x8 and x16 links so you can accurately capture the packet of interest. The probe is designed to handle a single, unidirectional link or a bidirectional link.

Protocol decode software

The analysis probe, which includes protocol decode software for 16900 Series logic analyzers, acquires serial data, converts it to parallel form, recognizes and fi lters packets, and clocks the information into the analyzer. Data sent to the logic analyzer includes:

Captured data

Packet type and state information

Packet recognizers and error indicators

This data is processed by the protocol decoder for display of packets, transactions and errors. You can view the packet decode data with the Packet Viewer tool. Although the probe hardware has the ability to fi lter and trigger, the software interface provides bits arranged to support the use of logic-analyzer-based trigger functions, even on packetbased data. The decoder detects packet types and checks packet delimiters (minimal protocol checking).

Packet Viewer software

Figure 5. Packet Viewer – see packet and lane decode in an intuitive format.

Packet Viewer software is a powerful tool for easy analysis of protocol traffi c. Packet viewer provides bidirectional information in a single display. Packet viewer allows packet-to-packet comparisons and detailed information on each lane, header format and payload.

9

Confi guration guide

Bidirectional x8 lane width or one directional x16 lane width – Midbus probe

Product Description

AHT3-LAI-01

One of the following

16900 Series logic analyzers:

16902B

HyperTransport 3 analysis probe

6-slot mainframe with 15-in touch display

One of the following modules:

16950B

16951B

N4246A

68-channel 4 GHz timing, 667 MHz state logic analysis module

68-channel 4 GHz timing, 667 MHz state/deep logic analysis module

Midbus probe bi-directional X8 for HT3 5.2GB/s

E5378A

34 -ch single-ended SAMTEC connector probe, connects to 90-pin LA cable

Quantity

1

1

3

3

2

5

Bidirectional x8 lane width or one bidirectional x16 lane width – Interposer probe

Product Description

AHT3-LAI-01

HyperTransport 3 analysis probe

16902B

One of the following modules:

16950B

16951B

6-slot mainframe with 15-in touch display

68-channel 4 GHz timing, 667 MHz state logic analysis module

68-channel 4 GHz timing, 667 MHz state/deep logic analysis module

One of the following interposer:

Single lane AHT3-INT-01

Dual lane AHT3-INT-02

Dual lane AHT3-ADP-01

RHL1 Single Lane Interposer

L1L0 Dual Lane Interposer

Dual lane additional adapter kit

(Only needed for Dual Lane measurements using the

L0L1 Dual Lane Interposer, AHT3-INT-02)

E5378A

34 -ch single-ended SAMTEC connector probe, connects to 90-pin LA cable

Quantity

1

1

3

3

1

1

1

6

Ordering information

Model number

AHT3-LAI-01

AHT3-INT-01

AHT3-INT-02

AHT3-ADP-01

Product

HyperTransport 3 Analysis Probe

RHL1 Single Lane Interposer

L1L0 Dual Lane Interposer

Dual Lane additional adapter kit

Contact information:

5055 Corporate Plaza Drive,

Colorado Springs, C0 80919

10

www.agilent.com

Agilent Email Updates www.agilent.com/fi nd/emailupdates

Get the latest information on the products and applications you select.

Agilent Direct www.agilent.com/fi nd/agilentdirect

Quickly choose and use your test equipment solutions with confi dence.

Agilent

Open

www.agilent.com/fi nd/open

Agilent Open simplifi es the process of connecting and programming test systems to help engineers design, validate and manufacture electronic products. Agilent offers open connectivity for a broad range of system-ready instruments, open industry software, PC-standard I/O and global support, which are combined to more easily integrate test system development.

www.lxistandard.org

LXI is the LAN-based successor to

GPIB, providing faster, more effi cient connectivity. Agilent is a founding member of the LXI consortium.

Remove

all

doubt

Our repair and calibration services will get your equipment back to you, performing like new, when promised. You will get full value out of your Agilent equipment throughout its lifetime. Your equipment will be serviced by Agilent-trained technicians using the latest factory calibration procedures, automated repair diagnostics and genuine parts.

You will always have the utmost confi dence in your measurements.

For information regarding self maintenance of this product, please contact your Agilent offi ce.

Agilent offers a wide range of additional expert test and measurement services for your equipment, including initial start-up assistance, onsite education and training, as well as design, system integration, and project management.

For more information on Agilent

Technologies’ products, applications or services, please contact your local Agilent offi ce. The complete list is available at:

www.agilent.com/fi nd/contactus

Americas

Latin America 305 269 7500

United States (800) 829-4444

Asia Pacifi c

Australia

Hong Kong

India

Malaysia

Singapore

Thailand

Europe & Middle East

Belgium

Denmark

1 800 629 485

800 938 693

1 800 112 929

1 800 888 848

1 800 375 8100

1 800 226 008

32 (0) 2 404 93 40

45 70 13 15 15

For more information on repair and calibration services, go to: www.agilent.com/fi nd/removealldoubt

Product specifi cations and descriptions in this document subject to change without notice.

Israel 972-3-9288-504/544

Italy 39 02 92 60 8484

Netherlands

Spain

31 (0) 20 547 2111

34 (91) 631 3300

Switzerland 0800 80 53 53

United Kingdom 44 (0) 118 9276201

Other European Countries: www.agilent.com/fi nd/contactus

Revised: October 6, 2008

Related literature

Publication title

Agilent Technologies

16900 Series logic analyzer

Publication type

Color brochure

Publication number

5989-0420EN

© Agilent Technologies, Inc. 2008

Printed in USA, December 17, 2008

5989-6652EN

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