User's Guide SLAU535 – February 2014 MSP-EXP430FR5969 LaunchPad™ Evaluation Kit MSP430™ ultra-low-power (ULP) FRAM technology now joins the LaunchPad™ family. The MSP-EXP430FR5969 LaunchPad (or the "FR5969 LaunchPad") is an easy-to-use evaluation module (EVM) for the MSP430FR5969 microcontroller. It contains everything needed to start developing on MSP430's ULP FRAM platform, including on-board emulation for programming, debugging, and energy measurements. Figure 1. MSP-EXP430FR5969 MSP430, LaunchPad, Code Composer Studio are trademarks of Texas Instruments. IAR Embedded Workbench is a trademark of IAR Systems. Sharp is a registered trademark of Sharp Corporation. All other trademarks are the property of their respective owners. SLAU535 – February 2014 Submit Documentation Feedback MSP-EXP430FR5969 LaunchPad™ Evaluation Kit Copyright © 2014, Texas Instruments Incorporated 1 www.ti.com 1 2 3 4 5 6 Contents Getting Started .............................................................................................................. 3 Hardware ..................................................................................................................... 5 Software Examples ........................................................................................................ 18 Additional Resources ..................................................................................................... 26 FAQs ........................................................................................................................ 28 Schematics ................................................................................................................. 29 1 MSP-EXP430FR5969 ...................................................................................................... 1 2 EVM Overview............................................................................................................... 5 3 Block Diagram ............................................................................................................... 6 4 MSP430FR5969 Pinout .................................................................................................... 7 5 eZ-FET Emulator ............................................................................................................ 8 6 eZ-FET Isolation Jumper Block Diagram ................................................................................ 9 7 Application Backchannel UART in Device Manager .................................................................. 10 8 MSP430FR5969 LaunchPad Power Domain Block Diagram........................................................ 11 9 Debugger Power Configuration – USB eZ-FET and JTAG .......................................................... 12 10 External Power Configuration – External and BoosterPack ......................................................... 13 11 Super Cap Power Configuration – Charging and Running Standalone ............................................ 15 12 FR5969 LaunchPad to BoosterPack Connector Pinout .............................................................. 17 13 Directing the Project→Import Function to the Demo Project ........................................................ 19 14 When CCS Has Found the Project...................................................................................... 20 15 FRAM Unified Memory with Dynamic Partitioning List of Figures 16 17 18 19 20 21 .................................................................... MSP-EXP430FR5969 Software Examples in TI Resource Explorer ............................................... Schematic 1 of 5 ........................................................................................................... Schematic 2 of 5 ........................................................................................................... Schematic 3 of 5 ........................................................................................................... Schematic 4 of 5 ........................................................................................................... Schematic 5 of 5 ........................................................................................................... 26 27 29 30 31 32 33 List of Tables 1 Isolation Block Connections ............................................................................................... 9 2 Hardware Change Log .................................................................................................... 18 3 Software Examples ........................................................................................................ 18 4 IDE Minimum Requirements for MSP430FR5969 .................................................................... Source Files and Folders ................................................................................................. FRAM Endurance Calculation for 1KB Block of FRAM............................................................... How MSP430 Device Documentation is Organized .................................................................. 19 5 6 7 2 MSP-EXP430FR5969 LaunchPad™ Evaluation Kit Copyright © 2014, Texas Instruments Incorporated 21 23 26 SLAU535 – February 2014 Submit Documentation Feedback Getting Started www.ti.com 1 Getting Started 1.1 Introduction The MSP-EXP430FR5969 LaunchPad (or the "FR5969 LaunchPad") is an easy-to-use evaluation module (EVM) for the MSP430FR5969 microcontroller. It contains everything needed to start developing on MSP430's ULP FRAM platform, including on-board emulation for programming, debugging, and energy measurements. The board features on-board buttons and LEDs for quick integration of a simple user interface as well as a super capacitor (super cap) that allows standalone applications without external power supply. The MSP430FR5969 device features embedded FRAM (Ferroelectric Random Access Memory), a nonvolatile memory known for its ultra-low power, high endurance, and high-speed write access. Rapid prototyping is a snap thanks to 20-pin headers and a wide range of BoosterPack plug-in modules that enable technologies such as wireless connectivity, graphical displays, environmental sensing, and much more. More information about the LaunchPad, supported BoosterPacks, and available resources can be found at TI's LaunchPad portal and the LaunchPad wiki for design resources and example projects. The out-of-box experience provided with the MSP-EXP430FR5969 LaunchPad uses the 430BOOSTSHARP96 Dot Matrix Memory LCD BoosterPack. The display enables a better user experience and allows developers to more easily model their end application. The MSP-EXP430FR5969 LaunchPad and 430BOOST-SHARP96 BoosterPack are available in a bundled package from the TI eStore, with part number MSP-BNDL-FR5969LCD. The MSP-EXP430FR5969 LaunchPad is not available standalone at this time. Free software development tools are also available, such as TI's Eclipse-based Code Composer Studio™ IDE and IAR Embedded Workbench™ IDE. More information about the LaunchPad, the supported BoosterPacks, and available resources can be found at TI's LaunchPad portal and the MSP430 LaunchPad wiki for design resources and example projects. 1.2 Key Features • • • • • • 1.3 Kit Contents • • • 1.4 MSP430 ultra-low-power FRAM technology based MSP430FR5969 16-bit MCU 20-pin LaunchPad standard that leverages the BoosterPack ecosystem 0.1-F super capacitor for standalone power Onboard eZ-FET emulation Two buttons and two LEDs for user interaction Backchannel UART through USB to PC 1x MSP-EXP430FR5969 1x Micro USB cable 1x Quick Start Guide First Steps – Out-of-Box Experience An easy way to get familiar with the EVM is by using its pre-programmed out-of-box code. It demonstrates some key features from a user level. The out-of-box experience is based on the 430BOOST-SHARP96 Dot Matrix Memory LCD BoosterPack to better showcase the device functionality. The first step is to connect the BoosterPack to the LaunchPad and ensure the correct placement: Rockets facing upward. Now the included Micro USB cable is used to connect the LaunchPad to the computer. SLAU535 – February 2014 Submit Documentation Feedback MSP-EXP430FR5969 LaunchPad™ Evaluation Kit Copyright © 2014, Texas Instruments Incorporated 3 Getting Started www.ti.com The board is pre-programmed with the out-of-box demo. A splash screen displaying the TI logo indicates that the software is loaded and the board has powered up as expected. An LED also blinks briefly at startup. NOTE: The BoosterPack needs to be plugged in at device power up for the out-of-box code to work properly. The user interacts with the demo by using the two capacitive touch sliders on the BoosterPack and by using push buttons S1 (left button) and S2 (right button). The LCD provides a method to interact with the various user modes and view the output based on user interaction. A more detailed explanation of each mode can be found in Section 3. 1.5 Next Steps – Looking Into the Provided Code After the EVM features have been explored, the fun can begin. It is time to open an integrated development environment (IDE) and start digging into the code example. Refer to Section 3 for more information on IDEs and where to download them. The out-of-box source code and more code examples are provided for download at http://www.ti.com/tool/msp-exp430fr5969. Code is licensed under BSD and TI encourages reuse and modifications to fit specific needs. Section 3 describes all functions in detail and provides a project structure to help familiarize yourself with the code. With the onboard eZ-FET emulator, debugging and downloading new code is a breeze. A USB connection between the EVM and a PC through the provided USB cable is all that is needed. 4 MSP-EXP430FR5969 LaunchPad™ Evaluation Kit Copyright © 2014, Texas Instruments Incorporated SLAU535 – February 2014 Submit Documentation Feedback Hardware www.ti.com 2 Hardware Figure 2 shows an overview of the LaunchPad hardware. Micro-B USB LED Red, Green ESD Protection Emulation MCU Crystal 4 MHz Power, UART, SBW to Target Reset Button Target Button LaunchPad header 1x10 LaunchPad header 1x10 0.1-F Super Cap Target Device MSP430FR5969 HF Crystal Red, Green LED LF Crystal Target Button Figure 2. EVM Overview SLAU535 – February 2014 Submit Documentation Feedback MSP-EXP430FR5969 LaunchPad™ Evaluation Kit Copyright © 2014, Texas Instruments Incorporated 5 Hardware 2.1 www.ti.com Block Diagram Figure 3 shows the block diagram. Micro-B USB LED Red, Green ESD Protection Crystal 4 MHz Debug MCU 3.3-V LDO UART, SBW to Target Power to Target 14-pin JTAG header Power Selection Reset button Crystals HF (MHz) and 32.768 kHz Target Device MSP430FR5969 100-mF SuperCap 20-pin LaunchPad standard headers User Interface 2 buttons and 2 LEDs Figure 3. Block Diagram 2.2 2.2.1 Hardware Features MSP430FR5969 The MSP430FR5969 is the first device in TI's new ULP FRAM technology platform. FRAM is a cutting edge memory technology, combining the best features of flash and RAM into one nonvolatile memory. More information on FRAM can be found at www.ti.com/fram. Device features include: • 1.8-V to 3.6-V operation • Up to 16-MHz system clock and 8-MHz FRAM access • 64KB FRAM and 2KB SRAM • Ultra-low-power operation • Five timer blocks and up to three serial interfaces (SPI, UART, or I2C) • Analog: 16-channel 12-bit differential ADC and 16-channel comparator • Digital: AES256, CRC, DMA, and hardware MPY32 6 MSP-EXP430FR5969 LaunchPad™ Evaluation Kit Copyright © 2014, Texas Instruments Incorporated SLAU535 – February 2014 Submit Documentation Feedback Hardware DVCC P2.7 P2.3/TA0.0/UCA1STE/A6/C10 P2.4/TA1.0/UCA1CLK/A7/C11 AVSS PJ.6/HFXIN PJ.7/HFXOUT AVSS PJ.4/LFXIN PJ.5/LFXOUT AVSS AVCC www.ti.com 48 47 46 45 44 43 42 41 40 39 38 37 P1.0/TA0.1/DMAE0/RTCCLK/A0/C0/VREF-/VeREF- 1 36 DVSS P1.1/TA0.2/TA1CLK/COUT/A1/C1/VREF+/VeREF+ 2 35 P4.6 P1.2/TA1.1/TA0CLK/COUT/A2/C2 3 34 P4.5 P3.0/A12/C12 4 33 P4.4/TB0.5 P3.1/A13/C13 5 32 P1.7/TB0.4/UCB0SOMI/UCB0SCL/TA1.0 P3.2/A14/C14 6 31 P1.6/TB0.3/UCB0SIMO/UCB0SDA/TA0.0 P3.3/A15/C15 7 30 P3.7/TB0.6 P4.7 8 29 P3.6/TB0.5 P1.3/TA1.2/UCB0STE/A3/C3 9 28 P3.5/TB0.4/COUT P1.4/TB0.1/UCA0STE/A4/C4 10 27 P3.4/TB0.3/SMCLK P1.5/TB0.2/UCA0CLK/A5/C5 11 26 P2.2/TB0.2/UCB0CLK P2.1/TB0.0/UCA0RXD/UCA0SOMI/TB0.0 P2.0/TB0.6/UCA0TXD/UCA0SIMO/TB0CLK/ACLK RST/NMI/SBWTDIO TEST/SBWTCK P2.6/TB0.1/UCA1RXD/UCA1SOMI P2.5/TB0.0/UCA1TXD/UCA1SIMO P4.3/A11 P4.1/A9 P4.2/A10 P4.0/A8 PJ.3/TCK/SRCPUOFF/C9 PJ.2/TMS/ACLK/SROSCOFF/C8 12 25 13 14 15 16 17 18 19 20 21 22 23 24 PJ.1/TDI/TCLK/MCLK/SRSCG0/C7 PJ.0/TDO/TB0OUTH/SMCLK/SRSCG1/C6 MSP430FR596x MSP430FR586x Figure 4. MSP430FR5969 Pinout To compare the various MSP430 derivatives, download the MSP430 Product Brochure (SLAB034), which is also available from http://www.ti.com/msp430. The brochure has a table that lets you see, at a glance, how the families compare, and their pricing. This document is frequently updated, as new MSP430 derivatives become available. SLAU535 – February 2014 Submit Documentation Feedback MSP-EXP430FR5969 LaunchPad™ Evaluation Kit Copyright © 2014, Texas Instruments Incorporated 7 Hardware 2.2.2 www.ti.com eZ-FET Onboard Emulator To keep development easy and cost effective, TI's LaunchPad development tools integrate an onboard emulator, eliminating the need for expensive programmers. The FR5969 LaunchPad has the new eZ-FET emulator (see Figure 5), a simple and low-cost debugger that supports almost all MSP430 device derivatives. Figure 5. eZ-FET Emulator The eZ-FET provides a "backchannel" UART-over-USB connection with the host, which can be very useful during debugging and for easy communication with a PC. The provided UART supports hardware flow control (RTS and CTS), although these signals are not connected to the target by default. The dotted line through J13 shown in Figure 5 divides the eZ-FET emulator from the target area. The signals that cross this line can be disconnected by jumpers on J13, the isolation jumper block. More details on the isolation jumper block are in Section 2.2.3. The eZ-FET hardware can be found in the schematics in Section 6 and in the accompanying design files (SLAC645). The software and more information about the debugger can be found at the eZ-FET lite wiki. 2.2.3 Emulator Connection – Isolation Jumper Block The isolation jumper block at Jumper J13 allows the user to connect/disconnect signals that cross from the eZ-FET domain into the FR5969 target domain. This includes eZ-FET Spy-Bi-Wire signals, application UART signals, and 3V3 and 5V power (see Table 1). Reasons to open these connections: • To remove any and all influence from the eZ-FET emulator for high accuracy target power measurements • To control 3-V and 5-V power flow between eZ-FET and target domains • To expose the target MCU pins for other use than onboard debugging and application UART communication • To expose programming and UART interface of the eZ-FET so it can be used for devices other than the onboard MCU. 8 MSP-EXP430FR5969 LaunchPad™ Evaluation Kit Copyright © 2014, Texas Instruments Incorporated SLAU535 – February 2014 Submit Documentation Feedback Hardware www.ti.com Table 1. Isolation Block Connections Jumper GND V+ Description Ground 3.3-V rail, derived from VBUS by an LDO in the eZ-FET domain RTS >> Backchannel UART: Ready-To-Send, for hardware flow control. The target can use this to indicate whether 'it is ready to receive data from the host PC. The arrows indicate the direction of the signal. CTS << Backchannel UART: Clear-To-Send, for hardware flow control. The host PC (through the emulator) uses this to indicate whether or not it is ready to receive data. The arrows indicate the direction of the signal. RXD << Backchannel UART: the target FR5969 receives data through this signal. The arrows indicate the direction of the signal. TXD >> Backchannel UART: the target FR5969 sends data through this signal. The arrows indicate the direction of the signal. RST Spy-Bi-Wire emulation: SBWTDIO data signal. This pin also functions as the RST signal (active low) TST Spy-Bi-Wire emulation: SBWTCK clock signal. This pin also functions as the TST signal USB Connector eZ-FET USB in out LDO eZ-FET Emulator MCU Target MSP430FR5969 MCU BoosterPack Header Spy-Bi-Wire (SBW) Emulation Application UART USCI A0 3.3V Power BoosterPack Header MSP430FR5969 Target Isolation Jumper Block Figure 6. eZ-FET Isolation Jumper Block Diagram 2.2.4 14-Pin JTAG Connector This EVM contains a footprint for TI's standard 14-pin MSP430 JTAG header. This connector can be used as needed. For debug purposes, this connector offers 4 wire JTAG compared to the 2-wire Spy-Bi-Wire from the eZ-FET. In certain use cases this can be advantageous. The MSP-FET430UIF or another MSP430 external debug tool can be used. This JTAG connector can be used to power the system directly or can be used with external power. See Section 2.3 for more details on the JTAG system power requirements. SLAU535 – February 2014 Submit Documentation Feedback MSP-EXP430FR5969 LaunchPad™ Evaluation Kit Copyright © 2014, Texas Instruments Incorporated 9 Hardware 2.2.5 www.ti.com Application (or "Backchannel") UART The backchannel UART allows communication with the USB host that isn't part of the target application's main functionality. This is very useful during development, and also provides a communication channel to the PC host side. This can be used to create GUIs and other programs on the PC that communicate with the FR5969 LaunchPad. The pathway of the backchannel UART is shown in Figure 6. The backchannel UART (USCI_A0) is independent of the UART on the 20-pin BoosterPack connector (USCI_A1). On the host side, a virtual COM port for the application backchannel UART is generated when the LaunchPad enumerates on the host. You can use any PC application that interfaces with COM ports, including terminal applications like Hyperterminal or Docklight, to open this port and communicate with the target application. You need to identify the COM port for the backchannel. On Windows PCs, Device Manager can assist (see Figure 7). Figure 7. Application Backchannel UART in Device Manager The backchannel UART is the "MSP Application UART1" port. In this case, Figure 7 shows COM13, but this varies from one host PC to the next. After you identify the correct COM port, configure it in your host application, according to its documentation. You can then open the port and begin talking to it from the host. On the target FR5969 side, the backchannel is connected to the USCI_A0 module. The eZ-FET has a configurable baudrate, therefore, it is important that the PC application configures the baudrate to be the same as what's configured on the USCI_A0. The eZ-FET also supports hardware flow control, if desired. Hardware flow control (CTS/RTS handshaking) allows the target FR5969 and the emulator to tell each other to wait before sending more data. At low baud rates and with simple target applications, flow control may not be necessary. Applications with faster baud rates and more interrupts to service have a higher likelihood that they cannot read the USCI_A0's RXBUF register in time, before the next byte arrives. If this happens, the USCI_A0's UCA0STATW register will report an overrun error. 2.2.6 100-mF Super Capacitor (Super Cap) A 100-mF (0.1-F) super cap is mounted onboard and allows powering the system without any external power. This highlights the ultra-low power of the MSP430FR5969 target device. See how long you can run your application on the super cap alone! For more power information on the super cap, see Section 2.3.5. 10 MSP-EXP430FR5969 LaunchPad™ Evaluation Kit Copyright © 2014, Texas Instruments Incorporated SLAU535 – February 2014 Submit Documentation Feedback Hardware www.ti.com 2.3 Power The board is designed to support five different power scenarios. The board can be powered by the eZFET or JTAG debugger, external power, BoosterPack power, or standalone super cap power. Legend Debug Power Domain J13 V+ eZ-FET J3 JTAG Bypass Use J2 J11 Charge External Power Domain J10 J9 Super Cap Power Domain J4 Target and BoosterPack Power Domain External VCC J12 GND GND External Measure Current Super Cap Debugger J5 Target MSP430FR5969 Device MSP430FR5969 target and BoosterPack GND J1 GND VCC Figure 8. MSP430FR5969 LaunchPad Power Domain Block Diagram SLAU535 – February 2014 Submit Documentation Feedback MSP-EXP430FR5969 LaunchPad™ Evaluation Kit Copyright © 2014, Texas Instruments Incorporated 11 Hardware 2.3.1 www.ti.com eZ-FET USB Power The most common scenario is power from USB through the eZ-FET debugger. This provides 5-V power from USB and also regulates this power rail to 3.3 V for eZ-FET operation and 3.3 V to the target side of the LaunchPad. Power from the eZ-FET is controlled by jumper J13. For 3.3 V, ensure that a jumper is connected across the J13 "V+" terminal. The eZ-FET is a debugger, so J10 must be set to debugger for power to reach the target MSP430FR5969 device. For the power configuration diagram, see Figure 9. 2.3.2 14-Pin JTAG When powering directly from the JTAG connector through the MSP-FET430UIF or other MSP430 debugger tool, ensure that jumper J10 is set to "Debugger." JTAG debugging can also be used with an external power source, when J10 is set to "External," and some external power source is connected through J12. In this case the JTAG debugger will sense the external power and debug the system without providing its own power. For power configuration diagram, see Figure 9. USB (eZ-FET) Power Configuration JTAG Power Configuration eZ-FET J13 V+ J13 J3 J3 J11 J9 J4 External Bypass J12 Use J11 GND J9 J4 Target MSP430FR5969 Device MSP430FR5969 target and BoosterPack External VCC J12 Super Cap GND External J5 Debugger J10 J2 VCC Measure Current Super Cap JTAG Debugger Charge Use J2 Charge J10 GND GND External Measure Current JTAG Bypass V+ eZ-FET J5 Target MSP430FR5969 Device GND J1 GND VCC MSP430FR5969 target and BoosterPack GND J1 GND VCC Figure 9. Debugger Power Configuration – USB eZ-FET and JTAG 12 MSP-EXP430FR5969 LaunchPad™ Evaluation Kit Copyright © 2014, Texas Instruments Incorporated SLAU535 – February 2014 Submit Documentation Feedback Hardware www.ti.com 2.3.3 External Power Supply An extra header J12 is present on the board to supply external power. When supplying external power, jumper J10 must be set to "External." It is important to understand the device voltage operation specifications when supplying external power. The MSP430FR5969 has an operating range of 1.8V – 3.6V. More information can be found in the device data sheet. For power configuration diagram, see Figure 10. 2.3.4 BoosterPack In some use cases it might be required to power the board from a BoosterPack. When powered from a BoosterPack, the BoosterPack voltage should be across J4 Pin1 (Vcc) and J5 Pin20 (GND). This complies with the BoosterPack pinout shown in Section 2.7. These pins are connected directly to the FR5969 target device, and do not require any specific jumper configuration. Header J1 also provides power directly to the target device. Because J1 and the BoosterPack headers are connected directly to the target device Vcc, there are two primary consequences: • The super cap cannot charge through J11. Use of the super cap with this power scenario is not recommended. • Current of the target device through J9 cannot be measured. It is best to remove J9 in this scenario to prevent back-powering of any additional circuitry such as the eZ-FET. For power configuration diagram, see Figure 10. External Power Source Configuration BoosterPack Power Configuration eZ-FET eZ-FET J3 J2 J11 J9 J4 External Bypass Use J11 GND Super Cap GND External J9 J5 J4 VCC Target MSP430FR5969 Device MSP430FR5969 target and BoosterPack Debugger J10 J2 VCC J12 Measure Current Super Cap JTAG Debugger External Charge Use Charge J10 VCC J12 GND GND External Measure Current JTAG Bypass V+ J13 V+ J13 J3 J5 GND Target MSP430FR5969 Device GND J1 GND VCC MSP430FR5969 target and BoosterPack GND J1 GND VCC Figure 10. External Power Configuration – External and BoosterPack SLAU535 – February 2014 Submit Documentation Feedback MSP-EXP430FR5969 LaunchPad™ Evaluation Kit Copyright © 2014, Texas Instruments Incorporated 13 Hardware 2.3.5 www.ti.com Super Cap 2.3.5.1 Charging the Super Cap To charge the super cap, jumper J11 is used. By default there is no jumper across J11. Place a jumper across J11 to charge the super cap. If another jumper is not handy, the GND jumper on the isolation jumper block can be used- as this jumper doesn't actually disconnect the GND connection. To charge the super cap, power must be coming from a debugger (eZ-FET or JTAG) or external power through J10. External power through J1 or a BoosterPack will not charge the super cap through J11. Placing a jumper across J11 will charge the super cap when there is 3.3V Vcc present, regardless of the state of the Bypass/Use J2 jumper, however if J2 is in the "Bypass" state, changing it over to the "Use" state will remove power from the target MSP430FR5969 and it will be reset. 2.3.5.2 Using the Super Cap To use the super cap to power the LaunchPad, first change the J2 jumper to select "Use" and then set a jumper on J11 to charge the super cap. After waiting for it to charge, any external power can be removed from the system, and it will be powered completely by the super cap. To remove any additional power drain from the super cap, remove any jumper to disconnect power to any external source. This can be J11, J10, or J13 depending on the power configuration. This prevents the super cap from back-powering the debug circuitry or any external power circuitry connected. The most effective method for charging the capacitor is outlined in the following steps. These steps assume the LaunchPad is powered by USB cable through the eZ-FET debugger. 1. Set "Power Selector" jumper (J10) to "Debugger" position 2. Set jumper J2 to "Use" super cap position 3. Set jumper J11 to "Charge" super cap position 4. Set "V+" jumper J13 5. Connect board to PC with USB cable 6. Allow 2-3 minutes for the super cap to charge (time may vary depending on initial charge of the super cap) to full Vcc 7. Remove the "V+" jumper J13 For power configuration diagram, see Figure 11. 14 MSP-EXP430FR5969 LaunchPad™ Evaluation Kit Copyright © 2014, Texas Instruments Incorporated SLAU535 – February 2014 Submit Documentation Feedback Hardware www.ti.com Super Cap Charging Configuration Super Cap Running Standalone Configuration Bypass Use J2 J11 Charge J10 J9 J4 JTAG External Bypass Use J11 GND Super Cap GND External J9 J5 J4 Target MSP430FR5969 Device MSP430FR5969 target and BoosterPack J10 J2 VCC J12 Measure Current Super Cap Debugger J3 Debugger External VCC J12 GND GND External Measure Current JTAG J13 *Power from Debugger or External Charge V+ J13 J3 V+ eZ-FET eZ-FET J5 Target MSP430FR5969 Device GND J1 GND VCC MSP430FR5969 target and BoosterPack GND J1 GND VCC Figure 11. Super Cap Power Configuration – Charging and Running Standalone 2.3.5.3 Disabling the Super Cap To disable the super cap, change J2 to "Bypass," and remove jumper J11 to prevent additional current for charging the super cap. With these 2 jumper selections, the super cap is completely disconnected from the system. SLAU535 – February 2014 Submit Documentation Feedback MSP-EXP430FR5969 LaunchPad™ Evaluation Kit Copyright © 2014, Texas Instruments Incorporated 15 Hardware 2.4 www.ti.com Measure MSP430 Current Draw A specific jumper J9 is placed on the LaunchPad to allow for measuring current draw of the MSP430FR5969 device. The current measured includes the FR5969, and any current drawn through the BoosterPack headers and jumper J1. To measure ultra-low power, follow these steps: 1. Remove the J9 jumper; attach an ammeter across this jumper. 2. Consider the effect that the backchannel UART and any circuitry attached to the FR5969 may have on current draw. Maybe these should be disconnected at the isolation jumper block, or their current sinking and sourcing capability at least considered in the final measurement. 3. Make sure there are no floating input I/Os. These cause unnecessary extra current draw. Every I/O should either be driven out or, if an input, should be pulled or driven to a high or low level. 4. Begin target FR5969 execution. 5. Measure the current. (Keep in mind that if the current levels are fluctuating, it may be difficult to get a stable measurement. It is easier to measure quiescent states.) 2.5 Clocking The FR5969 LaunchPad provides external clocks in addition to the internal clocks in the device. • Y4: a 32-kHz crystal • Y1: an unpopulated region that supports HF crystal or resonator (4 to 24 MHz) The 32-kHz crystal allows for lower LPM3 sleep currents than do the other low-frequency clock sources. Therefore, the presence of the crystal allows the full range of low-power modes to be used. For more information about internal clocks and how to use the 32-kHz or HF crystal, see the MSP430FR59xx family user's guide. 2.6 Using the eZ-FET Emulator With a Different Target The eZ-FET emulator on the FR5969 LaunchPad can interface to most MSP430 derivative devices, not just the on-board FR5969 target device. To do this, disconnect every jumper in the isolation jumper block. This is necessary because the emulator cannot connect to more than one target at a time over the Spy-Bi-Wire (SBW) connection. Next, make sure the target board has proper connections for Spy-Bi-Wire. Note that to be compatible with SBW, the capacitor on RST/SBWTDIO cannot be greater than 2.2 nF. The documentation for designing MSP430 JTAG interface circuitry is the MSP430 Hardware Tools User's Guide (SLAU278). Finally, wire together these signals from the emulator's side of the isolation jumper block to the target hardware: • 3.3 V (V+) • GND • SBWTDIO • SBWTCK • TXD (if the UART backchannel is to be used) • RXD (if the UART backchannel is to be used) • CTS (if hardware flow control is to be used) • RTS (if hardware flow control is to be used) This wiring can be done either with jumper wires or by designing the board with a connector that plugs into the isolation jumper block. 16 MSP-EXP430FR5969 LaunchPad™ Evaluation Kit Copyright © 2014, Texas Instruments Incorporated SLAU535 – February 2014 Submit Documentation Feedback Hardware www.ti.com 2.7 BoosterPack Pinout The FR5969 LaunchPad adheres to the 20-pin LaunchPad pinout standard. A standard was created to aid compatibility between LaunchPad and BoosterPack tools across the TI ecosystem. The 20-pin standard is compatible with the 40-pin standard used by other LaunchPads like the MSPEXP430F5529LP. This allows some subset of functionality of 40-pin BoosterPacks to be used with 20-pin LaunchPads. This having been said, while most BoosterPacks are compliant with the standard, some are not. The FR5969 LaunchPad is compatible with all 20-pin BoosterPacks that are compliant with the standard. If the reseller or owner of the BoosterPack does not explicitly indicate compatibility with the FR5969 LaunchPad, you might want to compare the schematic of the candidate BoosterPack with the LaunchPad to ensure compatibility. Keep in mind that sometimes conflicts can be resolved by changing the FR5969 device pin function configuration in software. More information about compatibility might also be found at http://www.ti.com/launchpad. Figure 12 shows the 20-pin pinout of the FR5969 LaunchPad. Note that software's configuration of the pin functions plays a role in compatibility. The FR5969 LaunchPad side of the dashed line shows all of the functions for which the FR5969 device's pins can be configured. This can also be seen in the MSP430FR5969 data sheet. The BoosterPack side of the dashed line shows the standard. The FR5969 function whose color matches the BoosterPack function shows the specific software-configurable function by which the FR5969 LaunchPad adheres to the standard. Below are the pins exposed at the BoosterPack connector. Also shown are functions that map with the BoosterPack standard. * Note that to comply with the I2C channels of the BoosterPack standard, a software-emulated I2C must be used. (!) Denotes I/O pins that are interrupt-capable. Light Gray boxes in the BoosterPack standard indic ate that some LaunchPads may be missing that functionality. BoosterPack Standard MSP-EXP430FR5969 Pin Map +3.3V Analog In RX UART TX GPIO (!) Analog In SPI CLK GPIO (!) SCL I2C* SDA UCA1SOMI UCA1RXD UCA1SIMO UCA1TXD C11 A7 UCA1CLK UCB0CLK SMCLK COUT A10 TB0.1 TB0.0 A11 TA1.0 TB0.2 TB0.3 TB0.4 TB0.5 (!) (!) (!) (!) (!) (!) (!) (!) (!) +3.3V P4.2 P2.6 P2.5 P4.3 P2.4 P2.2 P3.4 P3.5 P3.6 MSP-EXP430FR5969 Pin Map GND P1.2 P3.0 NC RST P1.6 P1.7 P1.5 P1.4 P1.3 (!) TA1.1 (!) A12 (!) (!) (!) (!) (!) TA0CLK C12 COUT A2 BoosterPack Standard C2 TB0.3 UCB0SIMO UCB0SDA TA0.0 TB0.4 UCB0SOMI UCB0SCL TA1.0 A5 C5 TB0.2 UCA0CLK A4 C4 TB0.1 UCA0STE A3 C3 TA1.2 UCB0STE PWM Out SPI CS Wireless SPI CS Display SPI CS Other GND GPIO (!) GPIO (!) TEST RST MOSI SPI MISO GPIO (!) GPIO (!) GPIO (!) Figure 12. FR5969 LaunchPad to BoosterPack Connector Pinout SLAU535 – February 2014 Submit Documentation Feedback MSP-EXP430FR5969 LaunchPad™ Evaluation Kit Copyright © 2014, Texas Instruments Incorporated 17 Software Examples 2.8 www.ti.com Design Files Schematics can be found in Section 6. All design files including schematics, layout, bill of materials (BOM), and Gerber files are made available in a zip folder (SLAC645) from ti.com. The zip folder also contains the software examples, TI-TXT object-code firmware images, and documentation. The MSP-EXP430FR5969 LaunchPad was designed in Mentor Graphics PADS schematic and layout. A free viewer is available to see both the schematic and layout files on the Mentor Graphics website at http://www.mentor.com/pcb/downloads/pads-pcb-viewer. A full time-limited version of PADS is available online for free. This version has complete functionality until the 30 day license expires. This version can be downloaded directly from http://www.mentor.com/pcb/product-eval/pads-download-evaluation. 2.9 Hardware Change log Table 2 shows the hardware revision history. Table 2. Hardware Change Log PCB Revision Rev 1.6 3 Description Initial Release Software Examples There are two software examples included with the FR5969 LaunchPad, which can be found in the zip source folder (SLAC645), shown in Table 3. Table 3. Software Examples Demo Name 3.1 BoosterPack Required Description More Details Section 3.3 Section 3.4 430BOOSTSHARP96_OutOfBox 430BOOST-SHARP96 The out-of-box demo pre-programmed on the LaunchPad from the factory. Its function was described in Section 1.4. Demonstrates features of MSP430FR5969 ULP FRAM device 430BOOSTSHARP96_GrlibDisplay 430BOOST-SHARP96 A very simple example showing how to use MSP430 Graphics Library (grlib) to display graphics primitives and images. MSP430 Software: Driver Library, Graphics Library, and Capacitive Touch Library The examples are built upon three MSP430 libraries available from TI shown below. All three libraries are available as part of MSP430Ware. Downloading CCS will include MSP430Ware along with TI Resource Explorer. • Driver library (driverlib): a foundational MSP430 software library, useful for interfacing with all MSP430 core functions and peripherals, especially clocks and power. • Graphics library (grlib): a library for interfacing MSP430 devices to dot-matrix LCD displays. Contains primitives for simple drawing as well as images and more. • Capacitive Touch Library: a library for capacitive touch sensing applications. This library supports the use of buttons, sliders, wheels and more. Highly configurable for each application. When you begin your own development, you will need more information about these libraries than can be included in this User's Guide. All the information you need is in MSP430Ware or specific library documentation linked above. 18 MSP-EXP430FR5969 LaunchPad™ Evaluation Kit Copyright © 2014, Texas Instruments Incorporated SLAU535 – February 2014 Submit Documentation Feedback Software Examples www.ti.com 3.2 Development Environment Requirements To use any of the below software examples with the MSP430FR5969 LaunchPad, you must have an integrated development environment (IDE) that supports the MSP430FR5969 device. Table 4. IDE Minimum Requirements for MSP430FR5969 Code Composer Studio™ IDE IAR Embedded Workbench™ IDE CCS v5.5 or later IAR EW430 v5.60 or later For more details on where to download the latest IDE, see Section 4.3. 3.2.1 CCS CCS v5.5 or higher is required. When CCS has been launched, and a workspace directory chosen, use Project→Import Existing CCS Eclipse Project. Direct it to the desired demo's project directory containing main.c. This is either the 430BOOST-SHARP96_OutOfBox or 430BOOST-SHARP96_GrlibDisplay project (see Figure 13). Figure 13. Directing the Project→Import Function to the Demo Project Selecting the \CCS or \CCS_Code_Size_Limited sub-directory also works. The CCS-specific files are located there. When you click "OK", CCS should recognize the project and allow you to import it. The indication that CCS has found it is that the project appears in the box shown in Figure 14, and it has a checkmark to the left of it. SLAU535 – February 2014 Submit Documentation Feedback MSP-EXP430FR5969 LaunchPad™ Evaluation Kit Copyright © 2014, Texas Instruments Incorporated 19 Software Examples www.ti.com Figure 14. When CCS Has Found the Project Sometimes CCS finds it, but does not have a checkmark; this might mean that your workspace already has a project by that name. You can resolve this by re-naming or deleting that project. (Even if you don't see it in the CCS workspace, be sure to check the workspace's directory on the file system.) Finally, click "Finish". Note that even if you check the "Copy projects into workspace" checkbox, most of the resources are linked and will remain in their original location. 3.2.2 IAR IAR Embedded Workbench™ IDE v5.60 or higher is required. To open the demo in IAR, simply choose File→Open→Workspace…, and direct it to the *.eww workspace file inside the \IAR subdirectory of the desired demo. All workspace information is contained within this file. The subdirectory also has an *.ewp project file; this file can be opened into an existing workspace, using Project→Add-Existing-Project…. Although the software examples have all the code required to run them, IAR users may wish to download and install MSP430Ware, which contains driverlib, grlib, capacitive touch library, and the TI Resource Explorer. These are already included in a CCS installation (unless the user selected otherwise). 3.3 Out-of-Box Software Example This section describes the functionality and structure of the out-of-box software that is preloaded on the EVM. NOTE: The out-of-box experience relies on the 430BOOST-SHARP96 BoosterPack and has a very limited use without it. A 430BOOST-SHARP96 BoosterPack is included in the MSP-BNDLFR5969LCD bundle along with the FR5969 LaunchPad. 20 MSP-EXP430FR5969 LaunchPad™ Evaluation Kit Copyright © 2014, Texas Instruments Incorporated SLAU535 – February 2014 Submit Documentation Feedback Software Examples www.ti.com The full out-of-box demo cannot be built with the free version of CCS or IAR (IAR Kickstart) due to the code size limit. To bypass this limitation, a code-size-limited CCS version is provided that has most functionality integrated into a library. The code that is built into the library can be viewed by the user, but it cannot be edited. For full functionality, download the full version of either CCS or IAR. There are five applications in the out-of-box software. All of them are in one project and the different applications can be cycled through in the user interface. 3.3.1 Source File Structure The project is split into multiple files. This makes it easier to navigate and reuse parts of it for other projects. Table 5. Source Files and Folders Name 3.3.2 Description Main.c The user experience demo main function, shared ISRs, and other functions ActivePowerMeasure.c Main function file for Active Mode Power app ClockApp.c Main function file for Clock app FR59xx_EXP.c File for handling system init, main menu, and button operations FRAMSpeedApp.c Main function file for FRAM Speed app Game.c Main function file for SliderBall video game app SYS.c Functions to enter and exit LPM3.5 myTimer.c Contains all timer-based functions and interrupts ULPMeter.c Main function file for Battery Free Stopwatch app Library: CTS Capacitive Touch Software Library (CAPSENSELIBRARY) Library: Driverlib Device driver library (MSP430DRIVERLIB) Library: grlib Graphics library for the SHARP LCD (MSP430-GRLIB) Folder: Preloaded images Images for the LCD screen Navigation and Main Menu Upon powering up the out-of-box demo, the title screens appear on the LCD, and are followed by the main selection menu. The main menu displays all the applications available in the demo. The application options in the menu are highlighted by using the left capacitive touch slider. NOTE: Only the left capacitive touch slider is activated for navigation. Once an application is selected, the right button (S2) is used to enter the application. To change the application or exit, use the left button (S1) and then navigate the main menu to switch to a different application. 3.3.3 Clock Application NOTE: This application relies on the operation of the 32.768-kHz clock crystal that is pre-populated on the LaunchPad. To enter this application the "Clock" option on the main menu must be highlighted and the right button (S2) then pushed. Immediately upon entering the Clock app, the user is expected to setup the date and time details before the clock starts running. This needs to be done every time the application is entered since the clock values are not maintained when running any of the other applications. To set the time and data parameters use the following steps: 1. On entering the app, the parameter being modified will begin to blink 2. The left capacitive touch slider can be used to increment or decrement the blinking parameter by SLAU535 – February 2014 Submit Documentation Feedback MSP-EXP430FR5969 LaunchPad™ Evaluation Kit Copyright © 2014, Texas Instruments Incorporated 21 Software Examples www.ti.com placing a finger on the top or bottom portion, respectively, of the slider 3. The value of the blinking parameter can be locked by placing a finger in the middle of the left capacitive touch slider 4. The parameter which is being modified can be changed with the right button (S2). 5. Repeat steps 2 to 4 until all parameters have been set, after which the clock will reset the seconds and begin to track the time from the set time and date When the clock begins to run, note that an option to turn on or off the seconds display is provided using the left button (S1). This is useful when attempting to measure power. The device spends most of the time in standby (LPM3), waking up every one second to update the RTC values. However if the display is updated every second, the average power is much higher than just the LPM3 power due to time and energy required to modify the LCD through SPI. If the SecON option is turned off, the device continues to provide a one second wakeup to update the RTC values but the display is updated only once a minute to save power. In this configuration the device power will be similar to power in LPM3 (refer device data sheet for exact values). When attempting to measure power using the Current jumper J9, ensure that the meter is in place before the board is powered up. If this jumper is removed while running the application it results in a power cycle of the device (since the connection to Vcc is broken) and the clock parameters will need to be re-entered. 3.3.4 FRAM Speed Application To enter the FRAM Speed app, the "FRAM Speed" option on the main menu must be highlighted and the right button (S2) then pushed. In this application, the FRAM write speed (in kilobytes per second), the total data written to FRAM (in kilobytes), and the FRAM endurance (in percentage) is tracked and displayed on the LCD. No user interaction is required. The application uses Direct Memory Access (DMA) to transfer data to a 1KB block of FRAM. The starting address of this block is defined and can be modified within the FRAMSpeedApp.h file. Note that changing this location can cause an overlap with other application code. This is not advised since code may be over written while running the application. Hence special care needs to be taken to evaluate the size of the code to ensure that it is not over-written while measuring the FRAM write speed. It should be noted that this application is optimized for speed rather than power. The speed of this application is approximately 7500KB (7.5MB) per second. On a flash device, the achievable speed would be approximately 13KB per second. Larger blocks of data can be written to, resulting in faster write speeds, but also higher power consumption. For more information on how to optimize FRAM write speeds, refer to the application report Maximizing FRAM Write Speed on the MSP430FR57xx (SLAA498). In this application, the system main clock is configured to use the DCO at 8 MHz. The application configures the DMA transfer of data and continuously executes it while remaining in LPM0. Each time the DMA writes the 1KB block, a count variable is incremented and the next DMA transfer is triggered. A timer is set up to interrupt the FRAM writing every 0.25 second to calculate the speed, total the kilobytes of data written, update the endurance, and then output these parameters on the LCD. Note that the FRAM endurance percentage is retained after a power cycle. To exit the application and stop the FRAM writes, the left button (S1) can be pushed allowing the user to return to the main menu. 3.3.4.1 Understanding the Numbers Behind the FRAM Speed Application The LCD is updated every 250 ms with an updated percentage change in the FRAM endurance. To calculate the endurance, some approximations were made in order to provide a meaningful output on the LCD. Every 250 ms, 1.8MB of FRAM are programmed with a pattern. Hence the speed of FRAM writes is calculated as 7.564 MB/s. The FRAM is written to in blocks of 1K bytes; it is this 1KB block that is subject to the lifetime FRAM endurance specification. FRAM endurance of block = E = 1015 write cycles. This is a minimum specification for FRAM endurance found in the device data sheet. 22 MSP-EXP430FR5969 LaunchPad™ Evaluation Kit Copyright © 2014, Texas Instruments Incorporated SLAU535 – February 2014 Submit Documentation Feedback Software Examples www.ti.com Table 6. FRAM Endurance Calculation for 1KB Block of FRAM Variable Derived From Value E (FRAM Endurance) Data sheet 1015 writes W (Write Speed) Application 7.564 MB/second B (FRAM block size) Application 1KB (1024 bytes) N (number of writes to a unique byte/sec) N=W/B 7386 writes/second TLCD (time between LCD updates) Application 250 ms TLIFE = E / N 1.35 × 1011 seconds (over 4000 years) L = (TLCD / TLIFE) × 100 1.85 × 10-10% TLIFE (time until endurance spec is met) L (lifetime percentage reduction/LCD update) The calculated value is rounded up to 2 × 10-10%, or 0.0000000002%. This is the amount the FRAM endurance is decremented on the LCD every 250 ms. Note that the FRAM endurance percentage is retained during on a power cycle. This parameter is preserved by storing it in FRAM and preventing the variable from being overwritten on a power cycle. Refer to the NO INIT and LOCATION pragmas in the CCS compiler documentation for more details. This parameter will be reset when the device is reprogrammed, and the address overwritten. 3.3.5 Battery Free Application To enter the Battery Free Stopwatch application, the "Battery Free" option on the main menu must be highlighted and the right button (S2) then pushed. This mode is intended to be used when running from the super cap only. See Section 2.2.6 for more information on how to power the LaunchPad from the super cap. When the application is entered, a submenu appears showing two possible actions to be taken. The first action is to "Run App," which will start the Battery Free Stopwatch application, and log . The other option is to "Transmit Data," which will transmit all logged data from previous runs through the MSP430 UART to a PC. The "Run App" selection has four modes: 1. Title Mode (Warning Page) 2. Deep Sleep -LPM3.5 Mode 3. Display Mode 4. Low Battery Indicator Mode When in Title mode or Display mode, the right button (S2) can be used to put the device into LPM3.5 (Deep Sleep Mode). Also in these two modes, the left button (S1) can be used to exit the app and return to the main menu at any time. When in Deep Sleep mode, the device remains in LPM3.5, and only the RTC is active. The left button (S1) is deactivated while in this mode, and the right button (S2) can be used to wake the device from LPM3.5 and send the device into Display mode. Also, in this mode the RTC wakes up the device periodically to allow the ADC to sample the supply voltage before returning to LPM3.5. These ADC samples of the supply voltage are logged into FRAM and can be transmitted back to a PC in the "Transmit Data" mode. The Display mode shows the stopwatch display and also the charge consumed while in LPM3.5. The stopwatch is started when the device enters LPM3.5 and stopped on exit. Hence the total time spent in LPM3.5 is displayed in HH:MM:SS format. The charge indicator is a reflection of the most recent ADC sample of supply voltage. If the device is left inactive at the "Display Mode" screen for more than ten seconds, the app will timeout and control reverts to the main menu. SLAU535 – February 2014 Submit Documentation Feedback MSP-EXP430FR5969 LaunchPad™ Evaluation Kit Copyright © 2014, Texas Instruments Incorporated 23 Software Examples www.ti.com Low Battery mode is entered conditionally following an ADC measurement of the supply voltage. When VCC < 2.2 V, the device will display a "Low Battery" warning screen. The screen will recommend that the device be plugged into the PC through USB for charging. In this mode, the left button (S1) is deactivated, and the right button (S2) is used to check if USB has been plugged in or not. If the device has not been plugged into USB and the right button (S2) is pushed, the device remains in Low Battery mode. If the device has been plugged into USB and the right button (S2) is pushed, the device will enter Deep Sleep mode once again. When running this application, the ADC measurements are logged in FRAM while the device is running from the super cap indicating that the ADC sampling and FRAM write have a very low power footprint. These logged values can then be sent to the PC and the data processed to analyze the reduction of charge over time. The transfer of data can be done in the UART transmit mode. The basic operation of the UART transmit mode is outlined below. 1. The eUSCI-UART and DMA modules are set up to transfer the data from FRAM 2. "Sending Data – Please Wait" screen displayed while the operation is in progress 3. On completion "Data Send Complete" screen is displayed 4. The data can be viewed using any hyper terminal application on the PC 3.3.6 Active Power Application The active power of the MSP430FR5969 device is directly dependent on the code and data cache hit ratio and the clock speed of the CPU. The Active Power application shows the impact of both these factors on overall system power. To measure the power consumption of the MSP430FR5969 for the different frequencies and cache hit ratios, the following steps should be followed: 1. Remove the "Measure Current" jumper from the LaunchPad 2. Use an ammeter set to the "mA" range and connect the leads of the ammeter to the nodes of the "Measure Current" jumper 3. Navigate the main menu to the "Active Mode" app 4. Choose a frequency and cache hit ratio from the subsequent menus 5. Press the right button (S2) to enter the cache hit code 6. Tune the ammeter range to obtain the most accurate current measurement values 7. Prior to exiting the cache hit code, ensure that ammeter is in "mA" range, then press right button (S2) to exit cache hit code 3.3.7 SliderBall Game This application was designed to show the functioning ability of the two Capacitive Touch sliders in conjunction with the LCD from the 430BOOST-SHARP96 BoosterPack. To enter the application, the SliderBall game option on the main menu must be highlighted and the right button (S2) then pushed. The SliderBall game requires the player to use a sliding paddle to keep the ball in play. The goal of the game is to keep the ball alive and on the screen by having it hit off of the two paddles at each end of the screen. Users start off with five lives to accumulate as many points as possible. For each time that the ball is blocked by the paddle, points are awarded. The higher the difficulty, the more points are awarded for each hit. Each time the ball reaches the end of the screen and the paddle has not hit the ball, the user loses a life. After the life is lost, the ball automatically starts again for another round. This repeats until all lives are exhausted, and the game is over. If the high score has been achieved, a congratulations screen will be displayed to notify the user. At this point the final score, as well as the board high score will be displayed and the user may then choose a new level of difficulty to play once again. 24 MSP-EXP430FR5969 LaunchPad™ Evaluation Kit Copyright © 2014, Texas Instruments Incorporated SLAU535 – February 2014 Submit Documentation Feedback Software Examples www.ti.com To navigate the user levels menu and choose an option, the left capacitive touch slider and right button are used similar to all previous menus. The user may choose between the following: easy, normal, hard, and Insane. After selecting a difficulty, the game will begin to start, with the ball moving to the right-hand side first. Both capacitive touch sliders are used to control their respective paddles along the side of the screen. When the user misses the ball, it will be held in place for a few cycles before starting to move again to give the user a chance to regroup following losing a life. To create "easier" versions of the game, sleep cycles are added to slow down the game play. The high score for each user level is stored in FRAM and is retained on subsequent power cycles. This value is erased only when the device is re-programmed. 3.3.8 Special Notes: Inverting the Display Color Scheme A feature that has been built in to the out-of-box demo code is the ability to invert the display colors. This can be a useful feature for times when the original display color settings are difficult to read. To invert the colors edit the file 'sharp96x96.h' within the 'grlib' directory. In the 'User Configuration for the LCD Driver' section under 'Invert Display Option' use either one of the # defines 'NORMAL_DISPLAY' or 'INVERT_DISPLAY' as needed. When INVERT_DISPLAY is defined it allows the out-of-box demo to display with a black background and white foreground once the demo code is re-downloaded onto the MSP-EXP430FR5969 board. 3.3.9 Special Notes: Adding the Out-of-Box Source Files to an Existing Project These instructions for Code Composer Studio™ IDE also apply to creating a new project for downloading the out-of-box code. Once the source files have been added the following additional project options need to be set. 1. From the Project Properties -> MSP430 Compiler -> Advanced Language Options , Check the 'Enable GCC Support' box 2. From the Project -> Properties -> MSP430 Compiler -> Optimization, set the optimization level to '1' 3. Add all the include paths for the header files present in each subfolder. This is done from Project -> Properties -> MSP430 Compiler -> Include Options. Edit the box titled "Add dir to #include search path" as shown below. 3.4 430BOOST-SHARP96 Graphics Library Demo NOTE: This graphics library demo is dependent on the 430BOOST-SHARP96 BoosterPack that comes with the MSP-BNDL-FR5969LCD bundle. The grlib demo shows how to use the MSP430 Graphics Library http://www.ti.com/tool/msp430-grlib or "grlib," in a project with the Sharp® display. This demo cycles screens without user interaction to show simple graphics primitives. • Pixels • Lines • Circles • Rectangles • Text • Images The demo introduces the functions to configure grlib such as initialization, color inversion, and using foreground and background colors properly. FRAM memory devices like the MSP430FR5969 are touted for ultra-low power, but in some applications the FRAM memory can provide additional benefits such as dynamic memory allocation. In applications with dot matrix LCD displays, it is often advantageous to keep a RAM buffer of the contents currently on the display. For a smaller display such as the Sharp display on the 430BOOST-SHARP96 BoosterPack, this doesn't require much RAM to keep the display contents. SLAU535 – February 2014 Submit Documentation Feedback MSP-EXP430FR5969 LaunchPad™ Evaluation Kit Copyright © 2014, Texas Instruments Incorporated 25 Additional Resources www.ti.com 4#/ >UPAO [email protected] = 96 LETAHO/NKS × 96 NKSO = 1152 >UPAO 8 LETAHO/>UPA (1) But in displays with more pixels or color displays, these RAM buffers can quickly become very large. If the Sharp display was a color display with 16 bits or color per pixel, (common in color displays) this buffer would be significantly larger. 96 LETAHO/NKS 4#/ >UPAO [email protected] = × 96 NKSO = 18432 >UPAO 0.5 LETAHO/>UPA (2) When selecting a microcontroller for an application with a display like this would require a very large memory device for a typical RAM/Flash microcontroller. Typical RAM memory cutoffs would likely require a 32kB RAM device with around 128kB or 256kB of Flash. This may be significantly more memory than the application requires. FRAM's unified memory block can be dynamically partitioned into data or code memory, providing unmatched flexibility. Applications like this can be easily supported with a 32kB or 64kB FRAM device. Figure 15. FRAM Unified Memory with Dynamic Partitioning 4 Additional Resources 4.1 LaunchPad Websites More information about the FR5969 LaunchPad, supported BoosterPacks, and available resources can be found at: • FR5969 LaunchPad tool page: resources specific to this particular LaunchPad • TI's LaunchPad portal: information about all LaunchPads from TI for all MCUs 4.2 Information on the MSP430FR5969 At some point, you will probably want more information about the FR5969 device. For every MSP430 device, the documentation is organized as shown in Table 7. Table 7. How MSP430 Device Documentation is Organized Document 26 For FR5969 Description Device family user's guide MSP430FR58xx, MSP430FR59xx, MSP430FR68xx, and MSP430FR69xx Family User's Guide (SLAU367) Architectural information about the device, including clocks, timers, ADC, and other peripherals. Device-specific data sheet MSP430FR59xx, MSP430FR58xx Mixed Signal Microcontroller data sheet (SLAS704) Device-specific information and all parametric information for this device MSP-EXP430FR5969 LaunchPad™ Evaluation Kit Copyright © 2014, Texas Instruments Incorporated SLAU535 – February 2014 Submit Documentation Feedback Additional Resources www.ti.com 4.3 Download CCS, IAR, or MSPGCC Although the files can be viewed with any text editor, 'more can be done with the projects if they're opened with a development environment like Code Composer Studio (CCS), IAR, or Energia. CCS and IAR are each available in a full version, or a free, code-size-limited version. The full out-of-box demo cannot be built with the free version of CCS or IAR (IAR Kickstart) due to the code size limit. To bypass this limitation, a code-size-limited CCS version is provided, that has most functionality integrated into a library. The code that is built into the library is able to be viewed by the user, but it cannot be edited. For full functionality download the full version of either CCS or IAR. See the MSP430 software tools page to download them, and for instructions on installation. 4.4 MSP430Ware and TI Resource Explorer MSP430Ware is a complete collection of libraries and tools. It includes a driver library (driverlib) and the graphics library (grlib) used in the software demo. By default, MSP430Ware is included in a CCS installation. IAR users must download it separately. MSP430Ware includes the TI Resource Explorer, for easily browsing tools. For example, all the software examples are shown in the tree below. Figure 16. MSP-EXP430FR5969 Software Examples in TI Resource Explorer Inside TI Resource Explorer, these examples and many more can be found, and easily imported into CCS with one click. 4.5 MSP430FR5969 Code Examples This is a set of very simple code examples that demonstrate how to use the MSP430's entire set of peripherals: ADC12, Timer_A, Timer_B, and so on. These do not use driverlib, rather they access the MSP430 registers directly. SLAU535 – February 2014 Submit Documentation Feedback MSP-EXP430FR5969 LaunchPad™ Evaluation Kit Copyright © 2014, Texas Instruments Incorporated 27 FAQs www.ti.com Every MSP430 derivative has a set of these code examples. When writing code that uses a peripheral, they can often serve as a starting point. There are also code examples available that use driver library. These code examples are part of the driverlib download included with MSP430Ware. To access these code examples, navigate into the driverlib folder or use the TI Resource Explorer to import into CCS. 4.6 MSP430 Application Notes There are many application notes at www.ti.com/msp430 with practical design examples and topics. 4.7 The Community 4.7.1 TI E2E Community Search the forums at e2e.ti.com. If you 'cannot find your answer, post your question to the community! 4.7.2 Community at Large Many online communities focus on the LaunchPad – for example, http://www.43oh.com. You can find additional tools, resources, and support from these communities. 5 FAQs Q: I can't get the backchannel UART to connect. What's wrong? A: • • • Check the following: Do the baud rate in the host's terminal application and the USCI_A0 settings match? Are the appropriate jumpers in place on the isolation jumper block? Probe on RXD and send data from the host; if you don't see data, it might be a problem on the host side. • Probe on TXD while sending data from the MSP430. If you don't see data, it might be a configuration problem on the USCI_A0 module. • Consider the use of the hardware flow control lines (especially for higher baud rates) Q: So the onboard emulator is really open source? And I can build my own onboard emulator? A: Yes! We encourage you to do so. The design files are on ti.com. Q: The MSP430 G2 LaunchPad had a socket, allowing me change the target device. Why doesn't this LaunchPad use one? A: This LaunchPad provides more functionality, and this means using a device with more pins. Sockets for devices with this many pins are too expensive for the LaunchPad's target price. Q: With the female headers on the bottom, the board doesn't sit flat on the table, and I can't unsolder them. Why did TI do this? A: For several reasons. A major feedback item on previous LaunchPads was the desire for female headers instead of male ones. But simply using female instead is problematic, because compatibility with existing BoosterPacks would be lost, and some people prefer male headers. So, adding female headers without removing male ones satisfies both preferences. It also allows more flexibility in stacking BoosterPacks and other LaunchPads. The downside to this approach is perhaps that the board doesn't sit flat. But while a USB cable is attached (the usual development model), it tends to not sit flat anyway. For those wishing it to sit flat, holes were drilled in the corners, so that standoffs could be fastened. Rubber bumper feet also should work. 28 MSP-EXP430FR5969 LaunchPad™ Evaluation Kit Copyright © 2014, Texas Instruments Incorporated SLAU535 – February 2014 Submit Documentation Feedback Schematics www.ti.com 6 Schematics A C B MSP430FR5969 LaunchPad Main MCU 1 TDO TMS TDI JTAG TCK TEST RST RST CTS_TARGETIN TX_TARGETOUT RX_TARGETIN 1 RTS_TARGETOUT APPLICATION_UART D JTAG VCC J5 J4 BP1-VCC 25 P2.1/TB0.0 BP7 26 P2.2/TB0.2 BP8 BP9 PJ.1/TDI13 PJ.3/TCK15 P4.1/A9 17 P4.0/A8 16 P4.3/A11 19 P4.2/A1018 PJ.2/TMS/ACLK14 BP6 P2.5/TB0.020 BP5 P2.6/TB0.121 BP4 TEST/SBWTCK22 BP18 P2.0/TB0.624 BP19 BP3 NMI/SBWTDIO/RST 23 BP16-RST PJ.0/TDO12 BP15 BP14 27 P3.4/TB0.3/SMCLK P1.4/TB0.110 BP13 28 P3.5/TB0.4/COUT P1.3/TA1.2 9 BP12 P4.7 8 BP11 29 P3.6/TB0.5 30 P3.7/TB0.6 31 P1.6/TB0.3 P3.1/A13/C13 5 33 P4.4/TB0.5 S2 P1.0/TA0.1/DMAE01 47 AVSS C9 46 PJ.5/LFXOUT C2 44 AVSS VCC 45 PJ.4/LFXIN Low Current Red Basic User Interface (left) 100n 37 DVCC 1u J6 41 AVSS 36 DVSS 38 P2.7 470 P1.1/TA0.2 2 42 PJ.6/HFXIN R3 P1.2/TA1.1 3 35 P4.6 39 P2.3/TA0.0 3 P3.0/A12/C12 4 34 P4.5 40 P2.4/TA1.0 S1 LaunchPad Header (right) P3.2/A14/C14 6 MSP430FR5969RGZ 32 P1.7/TB0.4 LED1 P3.3/A15/C15 7 R6 49 PWPD LaunchPad Header (left) U1 48 AVCC BP10 Y1 4 MHz (DNP) Low Current Green R4 10p10p C3 27p (DNP) C4 27p (DNP) 0 Expand functionality with BoosterPacks: VCC 100n C8 Crystals Texas Instruments R5 Title 0 www.ti.com/LaunchPad Size Connect Analog and Digital Power Supply Engineer A LED2 Basic User Interface (right) 32.7638 kHz, 7.0pF Y4 C5 C6 3 390 Place Jumper 4 2 BP17-TEST P1.5/TB0.211 43 PJ.7/HFXOUT 2 BP20-GND BP2 B C D.Schneider B 4 MSP430 LaunchPad FR5969 Number Rev MSP-EXP430FR5969 2.0 Drawn by D.Schneider Date 12/19/2013 1 5 Filename of LaunchPad-MSP430FR5969.sch Sheet D 12/19/2013 Figure 17. Schematic 1 of 5 SLAU535 – February 2014 Submit Documentation Feedback MSP-EXP430FR5969 LaunchPad™ Evaluation Kit Copyright © 2014, Texas Instruments Incorporated 29 Schematics www.ti.com A C B D Main MCU - Debugger and Power Connections 1 1 External Power Supply J21 1 RX_TARGETIN 2 V_DEBUGGER V_EXT 3 2 3 TEST 1 4 RST J12 5 6 TX_TARGETOUT Measure Current J10 dnp V_EXT 1 eZ430 50mil header Power Selection2 V_DEBUGGER 3 Bypass External V_CHARGE R2 Debugger 10 Place Jumper R7 Cap Selection VCC 1 VCC 1 Place Jumper J11 Current Limiter 3 + Charge Cap EZFET_SBWNC C7 J8 dnp EEC-S0HD104H 0.1F Place Jumper EZFET_SBWTCK TEST EZFET_SBWTDIO RST EZFET_UARTRXD TX_TARGETOUT EZFET_UARTTXD RX_TARGETIN EZFET_UARTRTS CTS_TARGETIN EZFET_UARTCTS RTS_TARGETOUT EZFET_VCCTARGET 2 3 Place Jumper J13 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 2 V_CAP Use 10 Measure Voltage J9 2 3 2 eZ-FET J2 Super Cap EZFET_VBUS J7 5V_VBUS JTAG 3 LaunchPad Power Hooks (bottom right) VCC VCC 1 VCC J3 2 J1 TMS RST TCK TEST C1 TX_TARGETOUT RST 1n Reset S3 Texas Instruments Title CTS_TARGETIN dnp 3 TDI RX_TARGETIN 4 R1 47k TDO RTS_TARGETOUT 1 2 3 4 5 6 7 8 9 10 11 12 13 14 14 pin JTAG Size B APPLICATION_UART Engineer A B C D.Schneider 4 MSP430 LaunchPad FR5969 Number Rev MSP-EXP430FR5969 2.0 Drawn by D.Schneider Date 12/19/2013 2 5 Filename of LaunchPad-MSP430FR5969.sch Sheet D 12/19/2013 Figure 18. Schematic 2 of 5 30 MSP-EXP430FR5969 LaunchPad™ Evaluation Kit SLAU535 – February 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Schematics www.ti.com A C B D eZ-FET - USB Interface and Power Supply eZ-FET Rev1.2 1 7 6 1 CONN_USB_ZX62R-B-5P 5 PGND 4 3 2 R104 27 EZFET_DP EZFET_PU.0/DP EZFET_DM EZFET_PU.1/DM 1 13 12 1 IO1 VCC 6 2 IO2 IO4 5 3 GND 2 R103 27 IC102 EZFET_VBUS PGND IO3 4 R123 R106 C110 C111 10p 10p EZFET_PUR PGND PGND R105 1M 33k TPD4E004DRY 1k4 PGND 2 PGND ezFET - DEBUG 1 1 TP-038 1 1 TP101 TP-038 IC101 EZFET_VCC TP102 PGND C108 1 1 TP-038 1 1 TP103 3 TP-038 100n EZFET_VBUS TP104 1 IN EN 6 2 GND NC 5 3 OUT NC 4 TLV70036DSE EZFET_VCC PGND 3 PGND PGND 1 1 TP-038 1 1 TP-038 1 1 TP-038 1 1 TP-038 1 1 TP-038 1 1 TP105 TP-038 C105 100n EZFET_TEST TP106 EZFET_TDO TP107 PGND EZFET_TDI TP108 EZFET_TMS TP109 EZFET_TCK TP110 EZFET_RST Texas Instruments 4 Title 4 MSP430 LaunchPad FR5969 1 1 TP-038 1 1 TP113 TP-038 Size EZFET_DCDCRST TP114 B EZFET_DCDCTEST Engineer A B C D.Schneider Number Rev MSP-EXP430FR5969 2.0 Drawn by D.Schneider Date 12/19/2013 3 5 Filename of LaunchPad-MSP430FR5969.sch Sheet D 12/19/2013 Figure 19. Schematic 3 of 5 SLAU535 – February 2014 Submit Documentation Feedback MSP-EXP430FR5969 LaunchPad™ Evaluation Kit Copyright © 2014, Texas Instruments Incorporated 31 Schematics www.ti.com A C B D eZ-FET - Host MCU for emulation Q101 PIEZO_CSTCR4M00G15L992 EZFET_TEST PJ.0/TDO 60 TEST/SBWTCK 59 EZFET_VBUS EZFET_TDI EZFET_TDO PJ.1/TDI/TCLK 61 EZFET_TCK EZFET_TMS PJ.3/TCK 63 EZFET_RST PJ.2/TMS 62 R109 47k EZFET_PUR 1 EZFET_VCC EZFET_PU.0/DP 3 1 EZFET_PU.1/DM eZ-FET Rev1.2 C102 C107 220n 220n 1 EZFET_RST C112 1 P6.0/CB0/A0 2 R125 150k VSSU 49 PUR 51 PU.0/DP 50 VBUS 53 PU.1/DM 52 V18 55 VUSB 54 AVSS2 56 P5.2/XT2IN 57 P5.3/XT2OUT 58 PWPD 65 R124 240k NMI-SBWTDIO/RST64 1n EZFET_VBUS P4.7/PM_NONE 48 C123EZFET_AVCCOUT2ADC 2 P6.1/CB1/A1 P4.6/PM_NONE 47 33p 3 P6.2/CB2/A2 46 P4.5/PM_UCA1RXD/PM_UCA1SOMI 4 P6.3/CB3/A3 45 P4.4/PM_UCA1TXD/PM_UCA1SIMO EZFET_SBWNC EZFET_DCDCIO0 5 P6.4/CB4/A4 44 P4.3/PM_UCB1CLK/PM_UCA1STE EZFET_SBWTCK EZFET_DCDCIO1 6 P6.5/CB5/A5 43 P4.2/PM_UCB1SOMI/PM_UCB1SCL EZFET_SBWTDIO EZFET_DCDCRST 7 P6.6/CB6/A6 EZFET_DCDCTEST 42 P4.1/PM_UCB1SIMO/PM_UCB1SDA MSP101 8 P6.7/CB7/A7 MSP430F5528IRGC 9 P5.0/A8/VREF+/VEREF+ 41 P4.0/PM_UCB1STE/PM_UCA1CLK EZFET_VCC DVCC2 40 DVSS2 39 10 P5.1/A9/VREF-/VEREF- C103 C121 11 AVCC1 P3.4/UCA0RXD/UCA0SOMI38 EZFET_UARTRXD 100n 12 P5.4/XIN P3.3/UCA0TXD/UCA0SIMO37 EZFET_UARTTXD R102 LED101 LED102 Red Green 32 P2.6/RTCCLK/ 30 P2.4/TA2.1 31 P2.5/TA2.2 28 P2.2/TA2CLK/SMCLK 27 P2.1/TA1.2 26 P2.0/TA1.1 29 P2.3/TA2.0 EZFET_UARTCTS EZFET_DCDCPULSE Texas Instruments Title Size B Engineer A 3 390 EZFET_VCCEN2 470n 4 24 P1.6/TA1CLK/CBOUT R101 470 EZFET_VCCEN1 C101 25 P1.7/TA1.0 EZFET_UARTRTS 22 P1.4/TA0.3 P2.7/UCB0STE/UCA0CLK33 16 DVSS1 23 P1.5/TA0.4 100n EZFET_HOSTSDA 21 P1.3/TA0.2 10u EZFET_HOSTSCL P3.0/UCB0SIMO/UCB0SDA34 20 P1.2/TA0.1 C113 P3.1/UCB0SOMI/UCB0SCL35 15 DVCC1 18 P1.0/TA0CLK/ACLK C104 14 AVSS1 19 P1.1/TA0.0 EZFET_VCC 17 VCORE(2) 3 100n P3.2/UCB0CLK/UCA0STE36 13 P5.5/XOUT + 2 B C D.Schneider 4 MSP430 LaunchPad FR5969 Number Rev MSP-EXP430FR5969 2.0 Drawn by D.Schneider Date 12/19/2013 4 5 Filename of LaunchPad-MSP430FR5969.sch Sheet D 12/19/2013 Figure 20. Schematic 4 of 5 32 MSP-EXP430FR5969 LaunchPad™ Evaluation Kit SLAU535 – February 2014 Submit Documentation Feedback Copyright © 2014, Texas Instruments Incorporated Schematics www.ti.com A C B D eZ-FET - MCU controlled DCDC converter eZ-FET Rev1.2 1 1 EZFET_VCC + C106 C124 4.7u 100n AVSS 13 DVSS 14 AVCC 15 PWPD R112 220k DVCC 16 17 EZFET_VCCOUT EZFET_AVCCOUT 1 P1.0 2 P1.1 3k3 EZFET_DCDCPULSE 2k2 EZFET_VCCOUT EZFET_DCDCTEST 4 P1.3MSP430G2452RSARST 9 5 P1.7 EZFET_DCDCRST 2 8 P1.4 2 R117 4k7 EZFET_VCCOUT 6k8 TEST 10 3 P1.2 EZFET_DCDCIO0 R114 220k R128 XOUT 11 MSP102 P1.5 33p R127 P1.6 EZFET_VCCOUT 7 C115 6 R113 220k R116 4k7 R126 XIN 12 EZFET_DCDCIO1 EZFET_HOSTSDA EZFET_HOSTSDA EZFET_HOSTSCL R115 220k EZFET_AVCC C116 EZFET_HOSTSCL 33p EZFET_VCCEN1 EZFET_VBUS EZFET_VBUS + R120 470 C109 C117 C118 4.7u 4.7u 100n EZFET_VCC 2 IN2 7 3 IN1 GND 6 4 COM2 NO2 5 EZFET_VCCEN2 R108 47k EZFET_VCCTARGET TS5A21366RSE 3 DMG1013UW-7 T101 D 3 D101 BAS40-05W COM1 8 47k G 3 EZFET_DCDCPULSE 2 V+ R107 S 1 3 EZFET_VCCEN2 IC103 1 NO1 2 1 L101 1 B 820 D102 BAS40-05W E 1 EZFET_VCCOUT R121 220k C119 4.7u C120 100n R119 0 EZFET_AVCCOUT2ADC 4 2.2uH 2 TARGET VCC SENSE T102 BC850CW-115 3 R118 2 EZFET_VCCOUT C C122 R122 220k Texas Instruments 33p Title Size B Engineer A B C D.Schneider 4 MSP430 LaunchPad FR5969 Number Rev MSP-EXP430FR5969 2.0 Drawn by D.Schneider Date 12/19/2013 5 5 Filename of LaunchPad-MSP430FR5969.sch Sheet D 12/19/2013 Figure 21. Schematic 5 of 5 SLAU535 – February 2014 Submit Documentation Feedback MSP-EXP430FR5969 LaunchPad™ Evaluation Kit Copyright © 2014, Texas Instruments Incorporated 33 EVALUATION BOARD/KIT/MODULE (EVM) ADDITIONAL TERMS Texas Instruments (TI) provides the enclosed Evaluation Board/Kit/Module (EVM) under the following conditions: The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claims arising from the handling or use of the goods. Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be returned within 30 days from the date of delivery for a full refund. THE FOREGOING LIMITED WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. 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