PMLE480W R

PMLE480W R
EQM08-4KC-F5AS101-00
Preliminary
Messrs.
Shock Sensor Specification
Part No. : PMLE480W-R
RoHS Compliant
Halogen-Free Compliant
16.Dec. 2010
Approved by
Kazuki Shimizu
Checked by
Yasuhiro Nakai
Issued by
KYOCERA CORPORATION
CIRCUIT COMPONENT DIVISION
PIZ SECTION
Akira Oikawa
EQM08-4KC-F5AS101 -00
Modification Table
No.
00
Date
16.Dec
2010
Change
The first edition
Apploved
Checked
Issued
Kazuki
Yasuhiro
Akira
Shimizu
Nakai
Oikawa
CIRCUIT COMPONENT DIVISION
PIZ SECTION
EQM08-4KC-F5AS101-00
(1/5)
1.Scope
Preliminary
This specification shall cover the characteristics of the shock sensor.
2.Kyocera’s Type Name
PMLE480W-R
3.Customer’s Type Name
4.Electrical Characteristics
Items
Specifications
4-1 Primary Axis Inclined Angle
0 ± 3degree
4-2 Capacitance
890pF ± 30%, at 1Vrms, 1kHz
4-3 Charge Sensitivity
0.608 pC/G ± 15%
under vibration at 200Hz, 2G
4-4 Insulation Resistance
0.5Gohm minimum, at 10VDC after 1min.
4-5 Resonant Frequency
19.5 ± 3.5kHz
4-6 Non-linearity
5% maximum, under vibration at 25G
4-7 Charge Sensitivity
Temperature Drift
Ta : 70℃ 7.7±3.0%
Ta : 0℃
-4.2±2.0%
under vibration at 200Hz, 2G
<Measurement Condition>
The reference temperature shall be 25 ºC ±5ºC.
5.Dimensions and Marking
Marking of Polarity
Characteristic Spec
0: Initial of Primary Axis Inclined Angle.
4.8±0.2
W: Specification
Manufacturing Day Cade :
0W
1.7
Day
Cade
Day
Cade
Day
Cade
2.0±0.2
1
A
11
L
21
W
2
B
12
M
22
X
3
C
13
N
23
Y
4
D
14
P
24
Z
5
E
15
Q
25
a
6
F
16
R
26
b
7
G
17
S
27
c
8
H
18
T
28
d
9
J
19
U
29
e
10
K
20
V
30 31
f g
Manufacturing Month Cade :
(0.8)
1.05±0.1
0.6
3.7
Fig.1
Unit:mm
2010 Jan.
2011 Jan.
2012 Jan.
2013 Jan.
~
~
~
~
Dec.
Dec.
Dec.
Dec.
:
:
:
:
N ~ Z except "O"
a ~m except "i"
n ~z except "o"
A ~M except "I"
Note:These alphabets should be repeated
after Jan.2014.
CIRCUIT COMPONENT DIVISION
PIZ SECTION
EQM08-4KC-F5AS101-00
(2/5)
6.Emvironmental Characteristics
Preliminary
Items
Conditions
6-1.High Temperature
Keep in a chamber at 85 ±2°C for 1000 +12/-0 hours, and then keep at room
Storage Test
temperature for 1 hour. The characteristics of shock sensor shall meet the
specifications.
6-2.Low Temperature
Keep in a chamber at –40 ±2°C for 1000 +12/-0 hours, and then keep at
Storage Test
room temperature for 1 hour. The characteristics of shock sensor shall meet
the specifications.
6-3.Moisture
Keep in a chamber at 90 to 95 % R.H. and 60 ± 2°C for 500 +12/-0 hours,
Resistance Test
and then keep at room temperature for 1 hour. The characteristics of shock
sensor shall meet the specifications.
6-4.Temperature
Apply 100 thermal cycles with the following temperatures:
Cycling Test
-
upper temperature 85°C for 20 minutes and transfer time 10 minutes
-
lower temperature -40°C for 20 minutes and transfer time 10 minutes
-
total cycle time is 1hour
and then left at room temperature for 1 hour. The characteristics of shock
sensor shall meet the specifications.
6-5.Mechanical Shock
After applying the acceleration at 29430m/sec2 {3000G} in each of X, Y and
Test
Z axis (each 3 times). The characteristics of shock sensor shall meet the
specifications.
6-6.Solderability Test
At first, being soaked in the Methanol solution containing Rosin for 5
seconds and then being dipped in a bath of Pb/Sn solder at 250 ± 5°C for 4
± 0.5 seconds. The surface of the electrode terminal shall be soldered more
than 95%.
6-7.Resistance to
Pre-heat temperature is 150 to 180°C for 1 minute. High temperature is 250
Soldering Heat Test
± 5°C, over 200°C for 20 seconds max.(2times). Then keep at room
temperature for 1 hour. The characteristics of shock sensor shall meet the
specifications.
6-8.Board Flex Test
After soldered on the circuit board specified as below, then the load which
cause 3 mm bend to the board is applied. The characteristics of shock
sensor shall meet the specifications. The shock sensor cause no defect in
the appearance. (Circuit Board: FR4, 100 x
40 x 1.6 )
50
20
F
R230
1.0
3.0mm
45
45
<Measurement Condition>
The reference temperature shall be 25°C±5°C.
CIRCUIT COMPONENT DIVISION
PIZ SECTION
EQM08-4KC-F5AS101-00
(3/5)
7. Recommended Land pattern
Preliminary
6.32
2.2
2.57
1.94
4.14
Unit: (mm)
Fig.2 Recommended Land pattern
8. Recommended Convection Reflow profile
300
Reflow
Peak:245+/-5ºC
250
Temperature (ºC)
(Over
to than
40sec)
(Over230ºC,30
230℃,less
40sec)
200
Preheat
150
150 to 180ºC
100
50
Over 200ºC
within 80 sec
90 to 120sec
0
Time(Sec)
Fig.3 Recommended Convection Reflow profile
9. Taping Specifications
9-1.CarrierTape
9-1-1.Dimensions
Marking of Polarity
K
P0
D0
T
P2
Unit: (mm)
E
Sym
F
W
BB00
T2
A0
P1
D1
Pulling Direction
bol
Dimensions
Sym
bol
Dimensions
A0
2.25 ± 0.1
P0
4.0 ± 0.1
B0
4.4 ± 0.1
P1
4.0 ± 0.1
W
12.0 +0.3/-0.1
D0
1.5 +0.1/-0
E
1.75 ± 0.1
K
1.25± 0.1
F
5.5± 0.05
T
0.3 ± 0.05
Fig.4 Emboss Carrier Tape Dimensions
CIRCUIT COMPONENT DIVISION
PIZ SECTION
EQM08-4KC-F5AS101-00
(4/5)
9-2. Taping
Preliminary
9-2-1. Taping Quantity
One reel of the carrier tape shall pack 3500 pcs. Shock sensor shall be contained in pocket
continuously.
9-2-2. Dimensions
W1
E
A
C
N
D
W2
Fig.5 Reel
Unit: (mm)
A
N
W1
W2
180±5.0
60min.
12.5 +2.0/-0.0
20.5 max.
C
D
E
13.0±0.2
21.0±0.8
2.0±0.5
Symbol
Dimensions
Symbol
Dimensions
9-2-3. Leader and Blank Pocket
Package shall consist of leader, blank pocket and loaded pocket as follows. (fig.6)
Pulling Direction
D
C
B
A
A) Leader
B) Blank Pocket (160mm Min.)
A+B: 400mm to 560mm
C) Load Pocket
D) Blank Pocket (40 to 190mm )
Fig.6 Packing Method
Peeling load of top tape shall be 0.1N {10gf} to 0.7N {70gf} from Carrier Tape.
Top Tape
Carrier Tape
165º to 180º
Pulling Direction
Fig.7 Peeling Strength
CIRCUIT COMPONENT DIVISION
PIZ SECTION
EQM08-4KC-F5AS101-00
(5/5)
9-2-4. Reel label
A reel label shall be contained as below: (Based on EIAJ C-3 format)
A)
Customer P/N
B)
Lot No.
Preliminary
C) Quantity
D) Shipping date
E)
Vender Name
9-2-5. Exterior Package label
Shock sensor shall be packed properly to avoid defect in transportation and the marking of
exterior package shall be contained as below:
A)
Name of Customer
B)
P/O No.
C) Customer P/N
D) Lot No.
E)
Quantity
F)
Shipping Date
G) Vender Name
10. The agreement of this specifications
Should any part of the content of this specification become questionable, it shall be settled by mutual
deliberations.
11. Remarks on Usage
A)
This part can use only reflow soldering.
B)
Not washable
C) Maximum temperature is 280 degree.
12.RoHS Compliant
A) Sensor Case: LCP(liquid crystal polymer)
B) Terminal:
Plating:
Bronze with phosphate (thickness 100 um)
Cu(1-2um), Ag(1-3 um)
C) Elememt: Piezo Ceramic, contains lead-oxide, however, piezo-electronic devices
are exempted from RoHS compliant requirement of article 4(1).
(Refer to Annex, Section 7)
All materials meet to RoHS Compliant.
13.Halogen-Free Compliant
A) Bromine(Br) <900ppm(0.09%)
B) Chlorine(Cl) <900ppm(0.09%)
C)Total concentration of Chlorine(Cl)+Bromine(Br) <1500ppm(0.15%)
D)Antimony Trioxide(Sb2O3) <1000ppm(0.1%)
E)Red Phosphorus <1000ppm(0.1%)
All materials meet to Halogen-Free Compliant.
CIRCUIT COMPONENT DIVISION
PIZ SECTION
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