Resistors Inductors Resistors Attenuator Appendix Certificated Products by industry Organizations Packaging Specifications Products Catalog (Fixed Resistors) Recommended land pattern dimensions Recommended soldering condition

Resistors Inductors Resistors Attenuator Appendix Certificated Products by industry Organizations Packaging Specifications Products Catalog (Fixed Resistors) Recommended land pattern dimensions Recommended soldering condition
Surface Mount Resistors Recommended Soldering Conditions
Recommended Soldering Conditions
Recommendations and precautions are described below.
● Rectagular
●
Type
Recommended soldering conditions for reflow
· Reflow soldering shall be performed a maximum of
two times.
· Please contact us for additional information when
used in conditions other than those specified.
· Please measure the temperature of the terminals
and study every kind of solder and printed circuit
board for solderability before actual use.
For soldering (Example : Sn/Pb)
Preheating
Main heating
Peak
Temperature
140 °C to 160 °C
Above 200 °C
235 ± 5 °C
Time
60 s to 120 s
30 s to 40 s
max. 10 s
For lead-free soldering (Example : Sn/Ag/Cu)
Temperature
Peak
Preheating
Heating
Preheating
Main heating
Peak
Temperature
150 °C to 180 °C
Above 230 °C
max. 260 °C
Time
60 s to 120 s
30 s to 40 s
max. 10 s
Time
● Recommended
soldering conditions for flow
For soldering
Temperature
Time
140 °C to 180 °C
60 s to 120 s
245 ± 5 °C
20 s to 30 s
Preheating
Soldering
● Chip
●
For lead-free soldering
Temperature
Time
150 °C to 180 °C
60 s to 120 s
max. 260 °C
max. 10 s
Resistor Array, Chip Resistor Networks and Chip Attenuator
Recommended soldering conditions for reflow
· Reflow soldering shall be performed a maximum of
two times.
· Please contact us for additional information when
used in conditions other than those specified.
· Please measure the temperature of the terminals
and study every kind of solder and printed circuit
board for solderability before actual use.
For soldering (Example : Sn/Pb)
Preheating
Main heating
Peak
Temperature
140 °C to 160 °C
Above 200 °C
235 ± 5 °C
Time
60 s to 120 s
30 s to 40 s
max. 10 s
For lead-free soldering (Example : Sn/Ag/Cu)
Temperature
Peak
Preheating
Heating
Preheating
Main heating
Peak
Temperature
150 °C to 180 °C
Above 230 °C
max. 260 °C
Time
60 s to 120 s
30 s to 40 s
max. 10 s
Time
●
Flow soldering
We do not recommend flow soldering, because a solder bridge may form.
Please contact us regarding flow soldering of EXBA series.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
02 Sep. 2014
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