Voipac i.MX51 SODIMM Module Datasheet Voipac i.MX51 SODIMM Module Datasheet

Voipac i.MX51 SODIMM Module Datasheet Voipac i.MX51 SODIMM Module Datasheet

Voipac i.MX51 SODIMM Module Datasheet

Voipac i.MX51 SODIMM Module

Datasheet

Date

15. March 2011

2. August 2011

Revision

1.0

1.1

Changes

Initial Release

Added Chapter 2.2: Features

Modified Pin-out Description Table in Chapter 3.3

Modified Power Consumption Table in Chapter 5.1

Modified DC Characteristics Table in Chapter 5.2

Modified Temperature Range Table in Chapter 5.6

Voipac Technologies a.s., Dolný Šianec 18B, 911 01 Trenčín, Slovakia, www.voipac.com

Voipac i.MX51 SODIMM Module Datasheet

Table of Contents

1. Introduction...................................................................................................................................... 3

1.1.Hardware..................................................................................................................................3

1.2.Software................................................................................................................................... 3

1.3.Features Summary...................................................................................................................4

1.4.Reference Documents..............................................................................................................4

2.Functional Processor Description..................................................................................................5

2.1.Block Diagram.......................................................................................................................... 5

2.2.Features................................................................................................................................... 6

3.SODIMM Signal Description............................................................................................................7

3.1.SODIMM Module Block Diagram .............................................................................................7

3.2.IO Types Notation....................................................................................................................8

3.3.Pin-out Description...................................................................................................................8

4.Voipac i.MX51 SODIMM module Connectors...............................................................................18

4.1.Physical Locations..................................................................................................................18

4.2.JTAG...................................................................................................................................... 19

5.Technical Specifications...............................................................................................................19

5.1.Electrical - Power Consumption..............................................................................................19

5.2.Electrical – DC Characteristics...............................................................................................20

5.3.Layer Structure.......................................................................................................................20

5.4.Mechanical............................................................................................................................. 21

5.5.Socket for the Voipac i.MX51 SODIMM module.....................................................................22

5.6.Temperature Range...............................................................................................................22

5.7.RoHS and WEEE Compliance................................................................................................23

6.Compatibility.................................................................................................................................. 23

6.1.KARO Electronics TX51 Module.............................................................................................23

7.Support........................................................................................................................................... 24

8.Distributors ................................................................................................................................... 25

9.Ordering Information.....................................................................................................................28

Warranty

Disclaimer

Trademark Acknowledgment

Voipac Technologies a.s., Dolný Šianec 18B, 911 01 Trenčín, Slovakia, www.voipac.com

Voipac i.MX51 SODIMM Module Datasheet

1. Introduction

1.1. Hardware

The i.MX51 based module represents optimal performance and cost-effective solution for embedded systems. With preinstalled operating system and running up to 800MHz, the module enables almost anyone to design new product with quick set-up and easy-to-handle programming of own applications.

The i.MX51 SODIMM Module is a small circuit board which belongs to the group of COMs

(Computer On Module). Its central component is the high-performance and low power consumption i.MX51 multimedia processor from Freescale

TM

. This 1mm thick 10-layer microcontroller board includes all of the technologically and development demanding parts such as the CPU, Flash, SDRAM, I2C and Ethernet chip, saving many man-months of the high-frequency PCB design, complex prototyping, debugging and

OS porting, thus minimizing the time-to-market of the customers’ own applications.

The i.MX51 SODIMM format 200pin Module is available in 3 standard hardware configurations:

BASIC / PROfesional / MAXimum. Upon request, any other possible configuration can be manufactured for no surcharge, minimum batch size is 10pcs. The operating temperature range of a standard unit is -20 /

70°C. Upon request, the module is available in -40 / 85°C operating temperature range for a surcharge.

The standard i.MX51 SODIMM Module is equipped by i.MX515 ARM Cortex A8

TM

CPU, thus supporting all of the available CPU features.

The i.MX51 CPU is targeted at the automotive as well as the general embedded industrial markets, such as: terminals, automation, net applications, attendance systems, point of sales, gaming machines, navigations, netbooks and multimedia systems, building automation, security and surveillance systems, autopilots, handheld PCs, and many other fields, where there is a benefit of using operating system.

The i.MX51 belongs to the group of CPUs included in the Freescale Product Longevity Program , that guarantees a minimum availability period of 15 years for the automotive and medical segments, and

10 years for all other market segments.

1.2. Software

Various operating systems are available for the Voipac i.MX51 SODIMM module provided by

Voipac and the third parties. In case of unsupported operating system, necessary documentation for all hardware peripherals is freely available.

Voipac fully supports Linux operating system with drivers for all basic interfaces. Custom additional drivers for specific applications can be developed upon request.

Linux

Android

Operating system

Windows CE

Description

Linux 2.6 with drivers for most common interfaces

Android Gingerbread 2.3 (UNDER DEVELOPMENT)

Windows CE 6.0 (UNDER DEVELOPMENT)

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Voipac i.MX51 SODIMM Module Datasheet

1.3. Features Summary

Feature

CPU

DDR2 SDRAM

NAND FLASH

I2C EEPROM

LCD

AUDIO/TOUCH

VIDEO CAPTURE

VIDEO

MULTIMEDIA

ETHERNET

USB

OTHER I/O

Description

i.MX515 (Freescale) up to 800 MHz, ARM Cortex-A8™ CPU

Up to 512MB

Up to 1GB

Up to 1MB

LCD controller supporting WXVGA 1280x768px

Digital Audio IN/OUT, 4-wire touch controller

Still-Picture camera interface

HD Video encoder/decoder

• VPU – Video Processing Unit

• IPU – Image Processing Unit

• GPU 3D – OpenGL ES 2.0

• GPU 2D – OpenVG 1.1

LAN8700 10/100Mbps

USB High-Speed USB 2.0 OTG/HOST, USB High-Speed USB 2.0

3xUART / 2xSDIO / I2C / SPI / EIM / GPIO / 2xSSI / AC97 / I2S

1.4. Reference Documents

For more detailed technical information about the i.MX51 SODIMM module components, please refer to the web resources and documents listed below.

Component

I.MX51 (Freescale) Processor

MICRON NAND Flash Memory

MICRON SDRAM Memory

SMSC LAN8700 Ethernet Controller

Power Management and User Interface IC

I2C EEPROM

Description

Freescale_data_sheet_iMX51.pdf

MT29F1G08ABBDAHC ,

MT47H16M16BG-5E, MT47H32M16HR-3, MT47H64M16HR-3

SMSC LAN8700.pdf

freescale.com/data sheet MC13892.pdf

,

Atmel AT24C512BN-SH-B.pdf

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Voipac i.MX51 SODIMM Module Datasheet

2. Functional Processor Description

2.1. Block Diagram

More information in interactive table on Freescale’s webpage

The i.MX515 processor features Freescale’s advanced and power-efficient implementation of the ARM Cortex A8™ core, which operates at speeds as high as 800 MHz.

Up to 200 MHz DDR2 and mobile DDR DRAM clock rates are supported. The CPU is suitable for the following applications:

• Netbooks

(web tablets)

• Nettops

(internet desktop devices)

• Mobile internet devices

(MID)

• Portable media players

(PMP)

More information in interactive table on Freescale’s webpage

• Portable navigation devices

(PND)

• High-end PDAs

• Gaming consoles

• Automotive navigation and entertainment

(see automotive data sheet, IMX51AEC)

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Voipac i.MX51 SODIMM Module Datasheet

2.2. Features

i.MX512

Up to 800MHz (Consumer), 600 MHz (Industrial)

Target Applications:

Factory Automation

HMI

Portable/Tethered Printers

Medical Devices

Ebooks

i.MX514

Up to 600 MHz

Target Applications:

Navigation

Advanced HMI

Instrument Cluster

Telematics

i.MX513

Up to 800MHz (Consumer), 600 MHz (Industrial)

Target Applications:

IP Camera

V2IP Media Phones

Digital Signage

HMI

Medical Devices

i.MX515

Up to 800MHz (Consumer), 600 MHz (Industrial)

Target Applications:

Smartbook

Mobile Internet Devices

PMPs

Secure Devices

Advanced HMI

High-End PDAs

i.MX516

Up to 600MHz

Target Applications:

Infotainment

Rear Seat Entertainment

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Voipac i.MX51 SODIMM Module Datasheet

3. SODIMM Signal Description

This chapter describes the signals of the Voipac i.MX51 SODIMM module. Some pins have dedicated functionality, but most are highly multiplexed, so that the same pin can have up to 6 different roles and the same functionality is sometimes available alternatively on different pins. Each of these multiplexed pins is additionally also usable as a General Purpose

Input/Output pin (GPIO). Additionally each GPIO pin can be used as interrupt source.

3.1. SODIMM Module Block Diagram

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Voipac i.MX51 SODIMM Module Datasheet

3.2. IO Types Notation

Signal

1V8 or 3V3

ANG

GND

PWR

Digital Signal Voltage Level

Analog Signal

Ground

Power supply

Description

3.3. Pin-out Description

5

6

3

4

7

Pin

1

2

VIN

Baseboard

VIN

VIN

VIN

VIO

VIO

VIO

8 BOOT MODE

9 VOUT

10 VOUT

11 VOUT

12 VOUT

Module

PWR_SW2

PWR_SW2

PWR_SW2

IMX_BOOT_MODE

PWR_SW1

PWR_SW1

PWR_SW1

PWR_SW1

13 VBACKUP PMIC_LICELL

14 POWER_ON PMIC_PWRON1

Functions

src_BOOT_MODE[0] src_BOOT_MODE[1]

15 RESET_OUT

16 POR_IN

IMX_DI1_PIN13

IMX_POR_B

IMX_RESET_IN_B

PMIC_RESETB

17 RESET_IN gpio3_GPIO[2] src_POR_B src_RESET_B

Type

PWR

PWR

PWR

PWR

PWR

PWR

PWR

Description

Module power supply input (3.0V-5.5V)

1.8V power supply output (up to 1A)

1V8

Boot mode select H:Serial Downloader /

L: Internal Boot

PWR

PWR

PWR

PWR

3.3V power supply output (up to 1A)

2V5 to

3V3

Provides a connection for a coin cell backup battery or supercap. If the main battery is deeply discharged, removed, or contactbounced, the RTC system and coin cell maintained logic will switch over to the LICELL for backup power. This pin can be connected to a rechargable cell or a supercap when used with trickle charge feature.

UP to

VIN

Power on/off button connection. A turn on event can be accomplished by connecting an open drain NMOS driver.

1V8

1V8

This pin is connected to the GPIO to serve as reset.

UP to

VIN

Power on reset

Master Reset – External active low Schmitt trigger input signal. When this signal goes active, all modules (except the reset module,

SDRAMC module, and the clock control module) are reset.

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Voipac i.MX51 SODIMM Module Datasheet

Functions Pin Baseboard

18 GND

ETHERNET

19 PHY_TXN

GND

Module

LAN_TXN

20 PHY_LINK

21 PHY_TXP

22 PHY_VDD

23 PHY_RXN

LAN_LINK

LAN_TXP

LAN_VDD33

LAN_RXP

24 PHY_ACT LAN_ACTIVITY

25 PHY_RXP

26 GND

USB HOST

LAN_RXN

GND

27 USB_VBUS_EN USB_CPEN

28 USBH_OC IMX_GPIO1_6 gpio1_GPIO[6] ccm_SSI_EXT2_CLK epit2_EPITO gpt_CAPIN2

29 USBH_DM

30 USBH_VBUS

31 USBH_DP

32 GND

USB OTG

33 USBO_ID

USB_DM

USB_VBUS

USB_DP

GND

IMX_ID

34 USBO_VBUS_EN IMX_GPIO1_8

35 USBO_ DM

36 USBO_OC

IMX_DN

IMX_GPIO1_9 gpio1_GPIO[8] usboh3_USB_PWR ccm_CLKO2 esdhc2_CD gpio1_GPIO[9] usboh3_USB_OC ccm_CLKO

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Type

GND

Description

ANG

3V3

ANG

PWR

ANG

3V3

ANG

Transmit Data Negative: 100Base-TX or

10Base-T differential transmit output to magnetics.

Active low LINK ON indication: Active indicates that the link is on.

Transmit Data Positive: 100Base-TX or

10Base-T differential transmit output to magnetics.

+3.3V analog power supply output to magnetics

Receive Data Negative: 100Base-TX or

10Base-T differential receive input from magnetics.

Active low ACTIVITY indication: Active indicates that there is Carrier sense (CRS) from the active PMD.

Receive Data Positive: 100Base-TX or

10Base-T differential receive input from magnetics.

GND

3V3

Active high external 5V supply enable. This pin is used to enable the external VBUS power supply.

1V8

Active low over-current indicator input connected to a GPIO.

ANG D- pin of the USB cable

5V

ANG D+ pin of the USB cable

GND

ANG

ID pin of the USB cable. For an A-Device ID is grounded. For a Bdevice ID is floated.

1V8

Active high external 5V supply enable. This pin is used to enable the external VBUS power supply.

ANG D- pin of the USB cable

1V8 Active low over-current indicator input connected to a GPIO. 10KΩ pull-up resistor.

Voipac i.MX51 SODIMM Module Datasheet

Pin Baseboard Module Functions

esdhc2_LCTL

Type Description

37 USBO_DP

38 USBO_VBUS

39 GND

I2C INTERFACE

IMX_DP

IMX_VBUS

GND

ANG D+ pin of the USB cable

5V

VBUS pin of the USB cable. This pin is used for the VBUS comparator inputs.

GND

40 I2C DATA

41 I2C CLK

IMX_EIM_D16

IMX_EIM_D19 gpio2_GPIO[0] uart2_CTS i2c1_SDA audmux_AUD4_RXFS audmux_AUD5_TXD gpio1_GPIO[2] uart2_RTS i2c1_SCL audmux_AUD4_RXC audmux_AUD5_TXFS

1V8 I2C Data

1V8 I2C Clock

PWM INTERFACE

42 PWM IMX_GPIO1_2 gpio1_GPIO[2] pwm1_PWMO i2c2_SCL

1V8 PWM Output

1 WIRE INTERFACE

43 O WIRE IMX_OWIRE_LINE owire_LINE gpio1_GPIO[24] spdif_OUT1 src_SYSTEM_RST

1V8

SPI INTERFACE

44 CSPI_SS0

45 CSPI_SS1

46 CSPI_MOSI

47 CSPI_MISO

48 CSP_CLK

IMX_CSPI1_SS0

IMX_CSPI1_SS1

IMX_CSPI1_MOSI

IMX_CSPI1_MISO

IMX_CSPI1_SCLK ecspi1_SS0 audmux_AUD4_TXC gpio4_GPIO[24] ecspi1_SS1 audmux_AUD4_TXD gpio4_GPIO[25] ecspi1_MOSI i2c1_SDA gpio4_GPIO[22] ecspi1_MISO audmux_AUD4_RXD gpio4_GPIO[23] ecspi1_SCLK i2c1_SCL gpio4_GPIO[27]

1V8 Slave Select (Selectable polarity) signal

1V8 Slave Select (Selectable polarity) signal

1V8 Master Out/Slave In signal

1V8 Master In/Slave Out signal

1V8 Serial Clock signal

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Voipac i.MX51 SODIMM Module Datasheet

Pin Baseboard

49 CSPI_RDY

Module

IMX_CSPI1_RDY

Functions

ecspi1_RDY audmux_AUD4_TXFS gpio4_GPIO[26]

Type Description

1V8 Serial Data Ready signal

50 GND

SD1 INTERFACE

51 SD1_CD

52 SD1_D0

53 SD1_D1

54 SD1_D2

55 SD1_D3

56 SD1_CMD

57 SD1_CLK

GND

IMX_NANDF_D12

IMX_SD1_DATA0

IMX_SD1_DATA1

IMX_SD1_DATA2

IMX_SD1_DATA3

IMX_SD1_CMD

IMX_SD1_CLK gpio3_GPIO[28] esdhc1_DAT0 audmux_AUD5_TXD cspi_MISO esdhc1_DAT1 audmux_AUD5_RXD esdhc1_DAT2 audmux_AUD5_TXC esdhc1_DAT3 audmux_AUD5_TXFS cspi_SS1 esdhc1_CMD audmux_AUD5_RXFS cspi_MOSI esdhc1_CLK audmux_AUD5_RXC cspi_SCLK

GND

1V8 SD Card Detect

1V8

1V8

SD Data bidirectional signals—If the system designer does not want to make use of the internal pull-up, via the Pull-up enable register, a 50 K–69 K external pull up resistor must be added.

1V8

1V8

1V8 SD Command (bidirectional signal)

1V8 SD Output Clock.

58 GND

UART1 INTERFACE

GND GND

59 UART1_TXD

60 UART1_RXD

61 UART1_RTS

IMX_UART1_TXD

IMX_UART1_RXD

IMX_UART1_RTS uart1_TXD_MUX pwm2_PWMO gpio4_GPIO[29] uart1_RXD_MUX gpio4_GPIO[28] uart1_RTS gpio4_GPIO[30] uart1_CTS gpio4_GPIO[31]

1V8 Transmit Data output signal

1V8 Receive Data input signal

1V8 Request to Send input signal

62 UART1_CTS

UART2 INTERFACE

IMX_UART1_CTS 1V8 Clear to Send output signal

63 UART2_TXD

64 UART2_RXD

IMX_UART2_TXD

IMX_UART2_RXD uart2_TXD_MUX firi_RXD gpio1_GPIO[21] uart2_RXD_MUX firi_TXD gpio1_GPIO[20]

1V8 Transmit Data output signal

1V8 Receive Data input signal

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Voipac i.MX51 SODIMM Module Datasheet

Pin Baseboard Module

65 UART2_RTS

66 UART2_CTS

IMX_EIM_D26

IMX_EIM_D25

Functions

kpp_COL[7] uart3_TXD_MUX uart2_RTS gpt_CMPOUT2 uart1_DSR uart3_RXD_MUX uart2_CTS gpt_CMPOUT1

UART3 INTERFACE

67 UART3_TXD

68 UART3_RXD

69 UART3_RTS

70 UART3_CTS

IMX_UART3_TXD

IMX_UART3_RXD

IMX_EIM_D18

IMX_EIM_D17 uart1_DSR uart3_TXD_MUX gpio1_GPIO[23] uart1_DTR uart3_RXD_MUX gpio1_GPIO[22] gpio2_GPIO[2] uart2_TXD_MUX uart3_RTS audmux_AUD5_TXC gpio2_GPIO[1] uart2_RXD+MUX uart3_CTS audmux_AUD5_RXD

71 GND

KEYPAD INTERFACE

72 KP_COL0

73 KP_COL1

74 KP_COL2

GND

IMX_KEY_COL0

IMX_KEY_COL1

IMX_KEY_COL2

75 KP_COL3 IMX_KEY_COL3

76 KP_COL4

77 KP_ROW0

78 KP_ROW1

79 KP_ROW2

80 KP_ROW3

81 KP_COL5

IMX_KEY_COL4

IMX_KEY_ROW0

IMX_KEY_ROW1

IMX_KEY_ROW2

IMX_KEY_ROW3

IMX_KEY_COL5 kpp_COL[0] kpp_COL[1] kpp_COL[2] kpp_COL[3] src_INT_BOOT kpp_COL[4] uart1_RI uart3_RTS i2c2_SCL spdif_OUT1 kpp_ROW[0] kpp_ROW[1] kpp_ROW[2] kpp_ROW[3] kpp_COL[5]

Type

GND

1V8

1V8

1V8

1V8

Keypad Column selection signals.

1V8

Description

1V8 Request to Send input signal

1V8 Clear to Send output signal

1V8 Transmit Data output signal

1V8 Receive Data input signal

1V8 Request to Send input signal

1V8 Clear to Send output signal

1V8

1V8

1V8

Keypad Row selection signals.

1V8

1V8 Keypad column selection signal

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Voipac i.MX51 SODIMM Module Datasheet

Pin Baseboard Module Functions

uart1_DCD uart3_CTS i2c2_SDA

82 GND

SSI1 INTERFACE

83 SSI1_INT

GND

IMX_DI1_D0_CS

84 SSI1_RXD

85 SSI1_TXD

86 SSI1_CLK

87 SSI1_FS

IMX_AUD3_BB_RXD

IMX_AUD3_BB_TXD

IMX_AUD3_BB_CK

IMX_AUD3_BB_FS gpio3_GPIO[3] audmux_AUD3_RXD uart3_RXD_MUX gpio4_GPIO[19] audmux_AUD3_TXD gpio4_GPIO[18] audmux_AUD3_TXC gpio4_GPIO[20] audmux_AUD3_TXFS uart3_TXD_MUX gpio4_GPIO[21]

88 GND

SSI2 INTERFACE

89 SSI2_INT

90 SSI2_RXD

91 SSI2_TXD

92 SSI2_CLK

93 SSI2_FS

94 GND

SD2 INTERFACE

95 SD2_CD

GND

IMX_DI1_D1_CS

IMX_EIM_D29

IMX_EIM_D28

IMX_EIM_D30

IMX_EIM_D31

GND

IMX_NANDF_D13 gpio3_GPIO[4] kpp_ROW[5] audmux_AUD6_RXD kpp_ROW[4] audmux_AUD6_TXD kpp_ROW[6] audmux_AUD6_TXC kpp_ROW[7] audmux_AUD6_TXFS

96 SD2_D0

97 SD2_D1

98 SD2_D2

99 SD2_D3

IMX_SD2_DATA0

IMX_SD2_DATA1

IMX_SD2_DATA2

IMX_SD2_DATA3 gpio3_GPIO[27] esdhc2_DAT0 esdhc1_DAT4 cspi_MISO esdhc2_DAT1 esdhc1_DAT5 usboh3_H2_DP esdhc2_DAT2 esdhc1_DAT6 usboh3_H2_DM esdhc2_DAT3

Type

GND

1V8 SSI Interupt

1V8 Receive serial data

1V8 Transmit serial data

1V8 Serial clock

1V8 Frame Sync

GND

1V8 SSI Interrupt

1V8 Receive serial data

1V8 Transmit serial data

1V8 Serial clock

1V8 Frame Sync

GND

1V8 SD Card Detect

1V8

SD Data (bidirectional signal) - If the system designer does not want to make use of the internal pull-up, via the Pull-up enable register, a 50 K–69 K external pull up resistor must be added

1V8

1V8

1V8

Description

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Voipac i.MX51 SODIMM Module Datasheet

Pin Baseboard Module

100 SD2_CMD

101 SD2 CLK

IMX_SD2_CMD

IMX_SD2_CLK

Functions

esdhc1_DAT7 cspi_SS2 esdhc2_CMD i2c1_SCL cspi_MOSI esdhc2_CLK i2c1_SDA cspi_SCLK

102 GND GND

CMOS SENSOR INTERFACE

103 CSI_D0 IMX_CSI2_D12

104 CSI_D1

105 CSI_D2

106 CSI_D3

107 CSI_D4

108 CSI_D5

109 CSI_D6

110 CSI_D7

111 GND

112 CSI_HSYNC

113 CSI_VSYNC

114 CSI_PCLK

115 CSI_MCLK

IMX_CSI2_D13

IMX_CSI2_D14

IMX_CSI2_D15

IMX_CSI2_D16

IMX_CSI2_D17

IMX_CSI2_D18

IMX_CSI2_D19

GND

IMX_CSI2_HSYNC

IMX_CSI2_VSYNC

IMX_CSI2_PIXCLK

CSI_MCLK

CSI2_D[12] gpio4_GPIO[9]

CSI2_D[13] gpio4_GPIO[10]

CSI2_D[14]

CSI2_D[15]

CSI2_D[16]

CSI2_D[17]

CSI2_D[18] gpio4_GPIO[11]

CSI2_D[19] gpio4_GPIO[12]

CSI2_VSYNC gpio4_GPIO[13]

CSI2_HSYNC gpio4_GPIO[14]

CSI2_PIXCLK gpio4_GPIO[15] gpio1_GPIO[5] wdog2_WDOG_B ccm_CLKO ccm_CSI2_MCLK

116 GND

LCD INTERFACE

117 LCD_D0

118 LCD_D1

119 LCD_D2

120 LCD_D3

121 LCD_D4

IMX_DISP1_DAT0

IMX_DISP1_DAT1

IMX_DISP1_DAT2

IMX_DISP1_DAT3

IMX_DISP1_DAT4 ipu_DISP1_DAT[0] ipu_DISP1_DAT[1] ipu_DISP1_DAT[2] ipu_DISP1_DAT[3] ipu_DISP1_DAT[4]

Type

1V8 SD command bidirectional signal

1V8 SD Output Clock

GND

1V8 Sensor port data

1V8 Sensor port data

1V8 Sensor port data

1V8 Sensor port data

1V8 Sensor port data

1V8 Sensor port data

1V8 Sensor port data

1V8 Sensor port data

GND

1V8 Horizontal Sync (Start Of Frame)

1V8 Vertical Sync (Blank Signal)

1V8 Sensor data latch clock (Pixel Clock)

1V8 Sensor Master Clock

GND

1V8 LCD Data Bus

1V8 LCD Data Bus

1V8 LCD Data Bus

1V8 LCD Data Bus

1V8 LCD Data Bus

Description

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Voipac i.MX51 SODIMM Module Datasheet

Pin Baseboard

122 LCD_D5

123 LCD_D6

Module

IMX_DISP1_DAT5

IMX_DISP1_DAT6

124 LCD_D7

125 LCD_D8

126 LCD_D9

127 LCD_D10

128 LCD_D11

129 GND

130 LCD_D12

131 LCD_D13

132 LCD_D14

133 LCD_D15

134 LCD_D16

135 LCD_D17

136 LCD_D18

137 LCD_D19

138 LCD_D20

139 LCD_D21

140 LCD_D22

141 LCD_D23

142 GND

143 LCD_HSYNC

IMX_DISP1_DAT7

IMX_DISP1_DAT8

IMX_DISP1_DAT9

IMX_DISP1_DAT10

IMX_DISP1_DAT11

GND

IMX_DISP1_DAT12

IMX_DISP1_DAT13

IMX_DISP1_DAT14

IMX_DISP1_DAT15

IMX_DISP1_DAT16

IMX_DISP1_DAT17

IMX_DISP1_DAT18

IMX_DISP1_DAT19

IMX_DISP1_DAT20

IMX_DISP1_DAT21

IMX_DISP1_DAT22

IMX_DISP1_DAT23

GND

IMX_DI1_PIN2

Functions

ipu_DISP1_DAT[5] ipu_DISP1_DAT[6] src_BT_USB_SRC ipu_DISP1_DAT[7] src_BT_EEPROM_CFG ipu_DISP1_DAT[8] src_BT_SRC[0] ipu_DISP1_DAT[9] src_BT_SRC[1] ipu_DISP1_DAT[10] src_BT_SPARE_SIZE ipu_DISP1_DAT[11] src_BT_LPB_FREQ[2]

Type

1V8 LCD Data Bus

1V8

1V8

1V8

1V8

1V8

LCD Data Bus

LCD Data Bus

LCD Data Bus

LCD Data Bus

LCD Data Bus

1V8 LCD Data Bus

GND

1V8 LCD Data Bus ipu_DISP1_DAT[12] src_MLC_SEL ipu_DISP1_DAT[13] src_BT_MEM_CTL[0] ipu_DISP1_DAT[14] src_BT_MEM_CTL[1] ipu_DISP1_DAT[15] src_BT_BUS_WIDTH ipu_DISP1_DAT[16] src_BT_PAGE_SIZE[0] ipu_DISP1_DAT[17] src_BT_PAGE_SIZE[1] ipu_DISP1_DAT[18] src_BT_WEIM_MUXED[0] ipu_DISP1_DAT[19] src_BT_WEIM_MUXED[1] ipu_DISP1_DAT[20] src_BT_MEM_TYPE[0] ipu_DISP1_DAT[21] src_BT_MEM_TYPE[1] ipu_DISP1_DAT[22] src_BT_LPB_FREQ[0] src_BT_LPB_FREQ[0] src_BT_LPB_FREQ[1]

1V8 LCD Data Bus

1V8 LCD Data Bus

1V8 LCD Data Bus

1V8 LCD Data Bus

1V8 LCD Data Bus

1V8 LCD Data Bus

1V8 LCD Data Bus

1V8 LCD Data Bus

1V8

1V8

LCD Data Bus

LCD Data Bus

1V8 LCD Data Bus

Description

ipu_DI1_PIN2

GND

1V8 Line Pulse or HSync

Voipac Technologies a.s., Dolný Šianec 18B, 911 01 Trenčín, Slovakia, www.voipac.com

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Voipac i.MX51 SODIMM Module Datasheet

Pin Baseboard

144 LCD_VSYNC

145 LCD_OE_ACD

146 LCD_LSCLK

Module

IMX_DI1_PIN3

IMX_DI1_PIN15

IMX_DI1_DISP_CLK

147 GND GND

GPIO INTERFACE/ MODULE SPECIFIC SIGNALS

Functions

ipu_DI1_PIN3 ipu_DI1_PIN15 ipu_DI1_DISP_CLK esdhc1_CD

148 GPIO0 IMX_GPIO1_0

149 GPIO1

150 GPIO2

151 GPIO3

152 GPIO4

153 GPIO5

154 GPIO6

IMX_GPIO1_1

IMX_EIM_D20

IMX_EIM_D21

IMX_EIM_D22

IMX_EIM_D23

IMX_DI1_PIN11 gpio1_GPIO[0] cspi_SS1 esdhc1_WP gpio1_GPIO[1] cspi_MISO gpio2_GPIO[4] audmux_AUD4_TXD gpio2_GPIO[5] audmux_AUD4_RXD gpio2_GPIO[6] audmux_AUD4_TXC gpio2_GPIO[7] spdif_OUT1 audmux_AUD4_TXFS gpio3_GPIO[0] ecspi1_SS2

Type Description

1V8 Frame Sync or Vsync

1V8 Alternate Crystal Direction/Output Enable

1V8 Shift Clock

GND

1V8

1V8

1V8

1V8

1V8

1V8

1V8

GPIO1_0

GPIO1_1

GPIO2_4

GPIO2_5

GPIO2_6

GPIO2_7

GPIO3_0

155 GPIO7

156 GPIO8

157 GPIO9

158 GPIO10

IMX_DI1_PIN12 gpio3_GPIO[1]

IMX_DISPB2_SER_DIN gpio3_GPIO[5]

IMX_DISPB2_SER_DIO

1V8 GPIO3_1

1V8 GPIO3_5 gpio3_GPIO[6] wdog1_WDOG_RST_B_DEB

1V8 GPIO3_6

IMX_DISPB2_SER_CLK

159 GPIO11

160 GND

EXTERNAL MEMORY INTERFACE

gpio3_GPIO[7] wdog2_WDOG_RST_B_DEB

1V8 GPIO3_7

IMX_DISPB2_SER_RS gpio3_GPIO[8]

GND

1V8

GND

GPIO3_8

161 EMI-CS0

162 EMI-CS1

163 EMI-CS4

MIX_EIM_CS0

MIX_EIM_CS1

MIX_EIM_DTACK

EIM_A27 emi_EIM_CS0 gio2_GPIO[25] emi_EIM_CS1 gpio2_GPIO[26] emi_WEIM_DTACK_B gpio2_GPIO[31] emi_EIM_A[27]

1V8

1V8

1V8

164 EMI_WAIT MIX_EIM_WAIT gpio2_GPIO[21] emi_EIM_WAIT 1V8

Voipac Technologies a.s., Dolný Šianec 18B, 911 01 Trenčín, Slovakia, www.voipac.com

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Voipac i.MX51 SODIMM Module Datasheet

Pin Baseboard

165 EMI_EB0

166 EMI_EB1

167 EMI_OE

Module

MIX_EIM_EB0

MIX_EIM_EB1

MIX_EIM_OE

168 EMI_LBA

169 EMI_RW

170 EMI_BCLK

171 GND

MIX_EIM_LBA

MIX_EIM_RW

MIX_EIM_BCLK

GND

Functions

emi_EMI_EB[0] emi_EIM_EB[1] emi_EIM_OE gpio2_GPIO[24] emi_EIM_LBA gpio3_GPIO[1] emi_EIM_RW emi_EIM_BCLK

172 EMI_A0

173 EMI_A1

174 EMI_A2

175 EMI_A3

176 EMI_A4

177 EMI_A5

178 EMI_A6

179 EMI_A7

180 EMI_A8

181 EMI_A9

182 EMI_A10

183 GND

184 EMI_D0

MIX_EIM_A16

MIX_EIM_A17

MIX_EIM_A18

MIX_EIM_A19

MIX_EIM_A20

MIX_EIM_A21

MIX_EIM_A22

MIX_EIM_A23

MIX_EIM_A24

MIX_EIM_A25

MIX_EIM_A26

GND

MIX_EIM_DA0 emi_EIM_A[16] gpio2_GPIO[10] src_OSC_FREQ_SEL[0] emi_EIM_A[17] gpio2_GPIO[11] src_OSC_FREQ_SEL[1] emi_EIM_A[18] gpio2_GPIO[12] src_BT_LPB[0] emi_EIM_A[19] gpio2_GPIO[13] src_BT_LPB[1] emi_EIM_A[20] gpio2_GPIO[14] src_BT_UART_SRC[0] emi_EIM_A[21] gpio2_GPIO[15] src_BT_UART_SRC[1] emi_EIM_A[22] gpio2_GPIO[16] emi_EIM_A[23] gpio2_GPIO[17] src_BT_HPN_EN emi_EIM_A[24] gpio2_GPIO[18] emi_EIM_A[25] gpio2_GPIO[19] emi_EIM_A[26] gpio2_GPIO[20] emi_EIM_DA[0]

1V8

1V8

1V8

1V8

1V8

1V8

1V8

1V8

1V8

1V8

GND

Type

1V8

1V8

1V8

1V8

1V8

1V8

1V8

GND

1V8

Description

Voipac Technologies a.s., Dolný Šianec 18B, 911 01 Trenčín, Slovakia, www.voipac.com

- 17 -

Voipac i.MX51 SODIMM Module Datasheet

Pin Baseboard

185 EMI_D1

186 EMI_D2

187 EMI_D3

188 EMI_D4

189 EMI_D5

190 EMI_D6

191 EMI_D7

192 EMI_D8

193 EMI_D9

194 EMI D10

195 EMI_D11

196 EMI_D12

197 EMI_D13

198 EMI_D14

199 EMI_D15

200 GND

Module

MIX_EIM_DA1

MIX_EIM_DA2

MIX_EIM_DA3

MIX_EIM_DA4

MIX_EIM_DA5

MIX_EIM_DA6

MIX_EIM_DA7

MIX_EIM_DA8

MIX_EIM_DA9

MIX_EIM_DA10

MIX_EIM_DA11

MIX_EIM_DA12

MIX_EIM_DA13

MIX_EIM_DA14

MIX_EIM_DA15

Functions

emi_EIM_DA[1] emi_EIM_DA[2] emi_EIM_DA[3] emi_EIM_DA[4] emi_EIM_DA[5] emi_EIM_DA[6] emi_EIM_DA[7] emi_EIM_DA[8] emi_EIM_DA[9] emi_EIM_DA[10] emi_EIM_DA[11] emi_EIM_DA[12] emi_EIM_DA[13] emi_EIM_DA[14] emi_EIM_DA[15]

1V8

1V8

1V8

1V8

1V8

1V8

1V8

1V8

Type

1V8

1V8

1V8

1V8

1V8

1V8

1V8

GND

Description

4. Voipac i.MX51 SODIMM module Connectors

4.1. Physical Locations

Along with the main 200pin SODIMM connector the Voipac i.MX51 SODIMM module is equipped with pads for board-to-board pitch compression JTAG connector. The position is shown in the figure below.

Dimensions

(in millimeters)

Voipac Technologies a.s., Dolný Šianec 18B, 911 01 Trenčín, Slovakia, www.voipac.com

- 18 -

7

8

5

6

3

4

1

2

Voipac i.MX51 SODIMM Module Datasheet

4.2. JTAG

Connector: Molex 47041-0001 www.molex.com

Pin#

+1V8

GND

TMS nTRST

Pin Name

TCK

TDO

TDI nSRST

PWR

PWR

IN

IN

IN

OUT

IN

OUT

Type Description

JTAG interface I/O voltage detect

Ground

JTAG mode select

JTAG reset

JTAG clock

JTAG Data output

JTAG Data input

System reset

5. Technical Specifications

5.1. Electrical - Power Consumption

Table Part 1

Parameter

State

Barebox

Linux

Linux (backlight off)

Memtest

VIN

Pin

[mW]

2420,63

2124,83

1793,22

2788,88

VIO

Pout

[mW]

-1,82

-1,82

-1,82

-1,82

3V3

Pout

[mW]

-82,25

-783,02

-546,14

-546,14

Pmod

[mW]

2336,56

1339,99

1245,26

2240,92

Table Part 2

Test Point

State

Barebox

Linux

Linux (backlight off)

Memtest

TP100

U

[V]

4,91

4,93

4,94

4,91

U

TP100-101

I

[mV]

49,3

43,1

36,3

56,8

[mA]

493

431

363

568

TP103

U

[V]

1,82

1,82

1,82

1,82

U

TP102-103

I

[mV]

-0,1

-0,1

-0,1

-0,1

[mA]

-1

-1

-1

-1

TP105

U

[V]

3,29

3,29

3,29

3,29

U

TP104-105

I

[mV]

-2,5

-23,8

-16,6

-16,6

[mA]

-25

-238

-166

-166

Voipac Technologies a.s., Dolný Šianec 18B, 911 01 Trenčín, Slovakia, www.voipac.com

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Voipac i.MX51 SODIMM Module Datasheet

5.2. Electrical – DC Characteristics

Symbol Description

VCC Power supply voltage

ARM core supply voltage

IDD_800 Operating current at 800MHz (5V)

VIH Digital input high voltage

VIL Digital input low voltage

Min

4.5

1.05

170

1.26

0

5.3. Layer Structure

Typ

5.0

1.1

250

-

-

Max

5.5

1.15

500

1.8

0.54

Unit

V

V mA

V

V

Voipac Technologies a.s., Dolný Šianec 18B, 911 01 Trenčín, Slovakia, www.voipac.com

- 20 -

Voipac i.MX51 SODIMM Module Datasheet

5.4. Mechanical

Top Layer

(in millimeters)

Bottom Layer

(in millimeters)

Voipac Technologies a.s., Dolný Šianec 18B, 911 01 Trenčín, Slovakia, www.voipac.com

- 21 -

Voipac i.MX51 SODIMM Module Datasheet

Dimensions

(in millimeters)

5.5. Socket for the Voipac i.MX51 SODIMM module

The Voipac i.MX51 SODIMM module fits into a regular 2.5V DDR1 SODIMM memory socket. More details are available in Manufacturer`s Datasheet or 3D View .

5.6. Temperature Range

Symbol

T_AMB

T_AMB

T_AMB

Description

Operating temperature range - COMMERCIAL

Operating temperature range - EXTENDED

Operating temperature range - INDUSTRIAL

Min

0

-20

-40

Max Unit Standard Unit Range

70 °C

70 °C X

85 °C

Voipac Technologies a.s., Dolný Šianec 18B, 911 01 Trenčín, Slovakia, www.voipac.com

- 22 -

Voipac i.MX51 SODIMM Module Datasheet

5.7. RoHS and WEEE Compliance

All of the products designed and manufactured by Voipac Technologies are classified as Electrical and Electronic Equipment (EEE) under the Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment 2002/95/EC (RoHS).

To comply with the RoHS directive, the restricted use of Lead (Pb), Mercury (Hg), Cadmium

(Cd), Hexavalent Chromium (Cr 6+), Polybrominated Biphenyls (PBB) and Polybrominated

Diphenyl Ethers (PBDE) must be ensured. Voipac Technologies guarantees that products ordered after July 1, 2006 are assembled in full compliance with the RoHS directive from the

European Parliament and Counsel. The company procedures also complies with the Waste

Electrical and Electronic Equipment Directive 2002/96/EC (WEEE) .

6. Compatibility

Voipac i.MX51 SODIMM module can be used as a replacement for KARO Electronics

TX51 Module. This chapter points out the differences for a smooth transition.

6.1. KARO Electronics TX51 Module

Voipac i.MX51 SODIMM Module and TX51 from KaRo share the same pin mapping of all SODIMM pins, besides the General Purpose IOs and Module specific signals that may differ. For more details, see the picture below.

Voipac Technologies a.s., Dolný Šianec 18B, 911 01 Trenčín, Slovakia, www.voipac.com

- 23 -

Voipac i.MX51 SODIMM Module Datasheet

7. Support

All the relevant communication should be executed via e-mails preferably. Response time is up to 48 hours, except state holidays and weekends. Voipac Technologies working hours are: 8:00 - 17:00, Monday – Friday.

To claim warranty and RMA number assignment, please fill in this protocol/problem description form and send it to: [email protected]

.

Board warranty without the protocol/problem description will not be processed.

For more information, see our General Terms and Conditions .

Besides the free-of-charge support, we provide support for your new designs when it comes to the special drivers for the peripherals not included in the Voipac development kits, design of your own base boards, prototyping, or even new products development, please contact: [email protected]

for more info.

By registering on Voipac`s Internet Customer Details site , you will be granted to access the

Voipac Ticketing System , where you can post support request tickets and receive e-mail notifications upon any change of your ticket's status.

Voipac Technologies a.s., Dolný Šianec 18B, 911 01 Trenčín, Slovakia, www.voipac.com

- 24 -

Voipac i.MX51 SODIMM Module Datasheet

8. Distributors

Slovakia

SOS electronic s.r.o.

Pri pracharni 16

040 11 Kosice, Slovak Republic

Phone: 00421 55 7860415

Fax: 00421 55 7860445

E-mail: [email protected]

Czech Republic

SOS electronic s.r.o.

Hybesova 42

602 00 Brno, Czech Republic

Phone: +420 543 427 111

Fax: +420 543 427 110

E-mail: [email protected]

Austria

KDS Handelsgesellschaft mBH

Rienoesslgasse 22/11

1040 Vienna, Austria

Phone: 0043 1 7260408

Fax: 0043 1 546804983

E-mail: [email protected]

Germany

SOS electronic GmbH

Perchaer Weg 5

82335 Berg, Germany

Phone: 0049 (0) 8151 44 97 11

Fax: 0049 (0) 8151 74 48 26 [email protected]

Hungary

SOS electronic Kft.

Jozsef Attila ut 74.

H-3527 Miskolc, Hungary

Phone: 0036 46 501 380

Fax: 0036 46 501 389 [email protected]

Ukraine

Technotrade Ltd

Polupanova 10

04114 Kiev, Ukraine

Phone / Fax:

0038 44 5024655 (-77)

0038 44 2369055 (-57)

E-mail: [email protected]

Italy

Adelsy srl

via J. Lennon 6

40057 Cadriano di Granarolo dell'Emilia, Italia

Phone: 0039 51 763069

Fax: 0039 51 763073

E-mail: [email protected]

Italy

Dofware s.r.l.

C.so IV Novembre, 7

10036 Settimo Torinese, Italia

Phone: 0039 011 569.24.45

Fax: 0039 011 995.17.34

E-mail: [email protected]

Voipac Technologies a.s., Dolný Šianec 18B, 911 01 Trenčín, Slovakia, www.voipac.com

- 25 -

Voipac i.MX51 SODIMM Module Datasheet

Spain & Portugal

Monolitic, s.a.

Avda Vallcarca 78-80

08023 Barcelona, Spain

Phone: 0034 932859292

Fax: 0034 932841193

E-mail: [email protected]

Spain & Portugal

MATRIX ELECTRONICA

C/Alejandro Sanchez, 109

28019 Madrid, Spain

Phone: +34 902 19 81 46

Fax: +34 902 99 54 14

E-mail: [email protected]

The Netherlands

Alcom Electronics bv

Rivium 1e straat 52

2909 LE Capelle ad IJssel

Tel: +31.10.288.2500

Fax: +31.10.288.2525

E-mail: [email protected]

Belgium

Alcom electronics nv/sa

Singel 3

2550 Kontich, Belgium

Phone: +32 3458 3033

Fax: +32 3458 3126

E-mail: [email protected]

Poland

SOS electronic

ul. Tatarkiewicza 17

92-753 Lodz, Poland

Phone: 0048 42 6484576

Fax: 0048 42 6484576

E-mail: [email protected]

Japan

POSITIVE ONE CORPORATION

22F, Shibuya Mark City West

1-12-1, Shibuya-ku, Dougenzaka

Tokyo, Japan

Phone: +81-(0)3-5330-8648

Fax: +81-(0)3-4360-5301

E-mail: [email protected]

Russian Federation

Terraelectronica Ltd.

Derbenevskaya 1, corps.1 entr. 23

115114 Moscow, Russia

Phone: 007 495 221 7803

Fax: 007 495 221 7802

E-mail: [email protected]

Romania

SOS electronic

Bucureşti, str. Icoanei nr. 84, bloc A, scara A, etaj 1, ap. 3, sector 2, cod 020459, Romania

Phone: 0040 311 020475

Fax: 0040 311 020476

E-mail: [email protected]

Arad, Calea Aurel Vlaicu, bloc Z32, scara B, ap. 10, cod 310365, Romania

Phone: 0040 357 412040

Fax: 0040 311 020476

E-mail: [email protected]

Voipac Technologies a.s., Dolný Šianec 18B, 911 01 Trenčín, Slovakia, www.voipac.com

- 26 -

Voipac i.MX51 SODIMM Module Datasheet

CONTACT

Voipac Technologies a.s.

Dolný Šianec 18B

911 01 Trečín

Slovak Republic (Slovakia)

Registration no.: 36 331 759

EU VAT no.: SK 2021 7704 76

Sales dep. phone no.: 00421 32 3810821

Purchasing dep. phone no.: 00421 32 3810822

HW & SW support dep. phone no.: 00421 32 3810823

Sales department: [email protected]

Purchasing department: [email protected]

HW & SW support: [email protected]

Reclamations: [email protected]

Voipac Technologies a.s., Dolný Šianec 18B, 911 01 Trenčín, Slovakia, www.voipac.com

- 27 -

Voipac i.MX51 SODIMM Module Datasheet

9. Ordering Information

207mm

74mm

278mm

The standard box includes 75pcs of modules, each of them sealed in ESD plastic bag.

Voipac Technologies a.s., Dolný Šianec 18B, 911 01 Trenčín, Slovakia, www.voipac.com

- 28 -

Warranty:

Voipac Technologies a.s. Does Not Bear Responsibility for the Following:

Failure of a product resulting from misuse, accident, modification, unsuitable operating environment, or improper maintenance by user

Unless otherwise agreed in written, a product does not include technical support and the customer may be able to purchase technical support under separate agreement

Any technical or other support provided under warranty by Voipac Technologies a.s. such as assistance, set-up and installation is provided WITHOUT WARRANTY OF ANY KIND.

Disclaimer:

Voipac Technologies a.s. reserves the right to make changes, without notice, to any product, including circuits and/or software described or contained in this datasheet. Voipac Technologies a.s. assumes no responsibility or liability for the use of the described product(s), conveys no license or title under any patent, copyright, or mask work rights to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.

Trademark Acknowledgment:

Brand and product names are trademarks or registered trademarks of their respective owners.

Voipac Technologies a.s., Dolný Šianec 18B, 911 01 Trenčín, Slovakia, www.voipac.com

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