BCR8KM-20LA DATASHEET

BCR8KM-20LA DATASHEET

To our customers,

Old Company Name in Catalogs and Other Documents

On April 1

st

, 2010, NEC Electronics Corporation merged with Renesas Technology

Corporation, and Renesas

Electronics Corporation

took over all the business of both companies.

Therefore, although the old company name remains in this document, it is a valid

Renesas

Electronics document. We appreciate your understanding.

Renesas Electronics website: http://www.renesas.com

April 1

st

, 2010

Renesas Electronics Corporation

Issued by: Renesas Electronics Corporation ( http://www.renesas.com

)

Send any inquiries to http://www.renesas.com/inquiry .

Notice

1. All information included in this document is current as of the date this document is issued. Such information, however, is subject to change without any prior notice. Before purchasing or using any Renesas Electronics products listed herein, please confirm the latest product information with a Renesas Electronics sales office. Also, please pay regular and careful attention to additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website.

2. Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of third parties by or arising from the use of Renesas Electronics products or technical information described in this document.

No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or others.

3. You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part.

4. Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for the incorporation of these circuits, software, and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits, software, or information.

5. When exporting the products or technology described in this document, you should comply with the applicable export control laws and regulations and follow the procedures required by such laws and regulations. You should not use Renesas

Electronics products or the technology described in this document for any purpose relating to military applications or use by the military, including but not limited to the development of weapons of mass destruction. Renesas Electronics products and technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or regulations.

6. Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics does not warrant that such information is error free. Renesas Electronics assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein.

7. Renesas Electronics products are classified according to the following three quality grades: “Standard”, “High Quality”, and

“Specific”. The recommended applications for each Renesas Electronics product depends on the product’s quality grade, as indicated below. You must check the quality grade of each Renesas Electronics product before using it in a particular application. You may not use any Renesas Electronics product for any application categorized as “Specific” without the prior written consent of Renesas Electronics. Further, you may not use any Renesas Electronics product for any application for which it is not intended without the prior written consent of Renesas Electronics. Renesas Electronics shall not be in any way liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an application categorized as “Specific” or for which the product is not intended where you have failed to obtain the prior written consent of Renesas Electronics. The quality grade of each Renesas Electronics product is “Standard” unless otherwise expressly specified in a Renesas Electronics data sheets or data books, etc.

“Standard”: Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic equipment; and industrial robots.

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8. You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics, especially with respect to the maximum rating, operating supply voltage range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or damages arising out of the use of Renesas Electronics products beyond such specified ranges.

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Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to guard them against the possibility of physical injury, and injury or damage caused by fire in the event of the failure of a

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10. Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. Please use Renesas Electronics products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS

Directive. Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations.

11. This document may not be reproduced or duplicated, in any form, in whole or in part, without prior written consent of Renesas

Electronics.

12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries.

(Note 1) “Renesas Electronics” as used in this document means Renesas Electronics Corporation and also includes its majorityowned subsidiaries.

(Note 2) “Renesas Electronics product(s)” means any product developed or manufactured by or for Renesas Electronics.

BCR8KM-20LA

Triac

Medium Power Use

Features

I

T (RMS)

: 8 A

V

DRM

: 1000 V

I

FGTI

, I

RGTI

, I

RGTⅢ

Viso : 2000 V

: 30 mA

Outline

TO-220FN

REJ03G0337-0100

Rev.1.00

Aug.20.2004

Insulated Type

Planar Passivation Type

UL Recognized : Yellow Card No. E223904

File No. E80271

2

1. T

1

Terminal

2. T

2

Terminal

3. Gate Terminal

1

3

1

2

3

Applications

Switching mode power supply, washing machine, motor control, heater control, and other general controlling devices

Maximum Ratings

Parameter

Repetitive peak off-state voltage

Note1

Non-repetitive peak off-state voltage

Note1

Symbol

V

DRM

V

DSM

Voltage class

20

1000

1200

Unit

V

V

Rev.1.00, Aug.20.2004, page 1 of 7

BCR8KM-20LA

Parameter

RMS on-state current

Surge on-state current

I

2 t for fusing

Peak gate power dissipation

Average gate power dissipation

Peak gate voltage

Peak gate current

Junction temperature

Storage temperature

Mass

Isolation voltage

Notes: 1. Gate open.

Symbol

I

T (RMS)

I

TSM

I

2 t

P

GM

P

G (AV)

V

GM

I

GM

Tj

Tstg

Viso

Ratings

8

80

26

5

0.5

10

2

– 40 to +125

– 40 to +125

2.0

2000

Unit

A

A

A

2 s

W

W

V

A

°

C

°

C g

V

Conditions

Commercial frequency, sine full wave

360° conduction, Tc = 89

°

C

60Hz sinewave 1 full cycle, peak value, non-repetitive

Value corresponding to 1 cycle of half wave 60Hz, surge on-state current

Typical value

Ta = 25

°

C, AC 1 minute,

T

1

·T

2

·G terminal to case

Electrical Characteristics

Parameter

Repetitive peak off-state current

On-state voltage

Gate trigger voltage

Gate trigger current

Note2

Note2

Gate non-trigger voltage

Thermal resistance

Critical-rate of rise of off-state commutating voltage

Note4

ΙΙΙ

Ι

ΙΙ

ΙΙΙ

Ι

ΙΙ

Symbol

I

DRM

V

TM

V

FGT

Ι

V

RGT

Ι

V

RGT

ΙΙΙ

I

FGT

Ι

I

RGT

Ι

I

RGT

ΙΙΙ

V

GD

R th (j-c)

(dv/dt)c

Min.

0.2

10

Typ.

Max.

2.0

1.6

1.5

1.5

1.5

30

30

30

3.6

Unit

mA

V

V

V

V mA mA

Notes: 2. Measurement using the gate trigger characteristics measurement circuit.

Tj = 25

°

C, V

R

R

G

G

Test conditions

Tj = 125

°

C, V

DRM

applied

Tc = 25

°

C, I

TM

= 12 A,

Instantaneous measurement

= 330

Tj = 25

°

C, V

= 330

D

D

= 6 V, R

L

= 6 V, R

L

= 6 mA

V Tj = 125

°

C, V

D

= 1/2 V

DRM

°

C/W Junction to case

Note3

V/

µ s Tj = 125

°

C

= 6

,

,

3. The contact thermal resistance R th (c-f)

in case of greasing is 0.5°C/W.

4. Test conditions of the critical-rate of rise of off-state commutating voltage is shown in the table below.

Test conditions

1. Junction temperature

Tj = 125

°

C

2. Rate of decay of on-state commutating current

(di/dt)c = – 4 A/ms

3. Peak off-state voltage

V

D

= 400 V

Commutating voltage and current waveforms

(inductive load)

Supply Voltage

Time

Main Current

Main Voltage

(dv/dt)c

(di/dt)c

Time

Time

V

D

Rev.1.00, Aug.20.2004, page 2 of 7

BCR8KM-20LA

Performance Curves

Maximum On-State Characteristics

10

1

7

5

3

2

10

2

7

5

3

2

10

0

7

5

3

2

Tj = 25°C

Tj = 125°C

10 –1

0.6

1.0

1.4

1.8

2.2

2.6

3.0

3.4

3.8

On-State Voltage (V)

Gate Characteristics (I, II and III)

3

2

10 1

7

5

3

2

V

V

GM

GT

= 10V

= 1.5V

P

G(AV)

= 0.5W

P

GM

I

= 5W

GM

= 2A

10 0

7

5

3

2

I

10

–1

7

5

10

1

FGT I

2 3

I

RGT I

, I

RGT III

V

GD

= 0.2V

5 7 10

2

2 3 5 7 10

3

2 3 5 7 10

4

Gate Current (mA)

Gate Trigger Voltage vs.

Junction Temperature

10 3

7

5

4

3

2

10

2

7

5

4

3

2

Typical Example

10

1

–60 –40 –20 0 20 40 60 80 100 120 140

Junction Temperature (°C)

Rev.1.00, Aug.20.2004, page 3 of 7

Rated Surge On-State Current

100

90

80

70

60

50

40

30

20

10

0

10

0

2 3 4 5 7 10

1

2 3 4 5 7 10

2

Conduction Time (Cycles at 60Hz)

Gate Trigger Current vs.

Junction Temperature

10

3

7

5

4

3

2

I

RGT III

10

2

7

5

4

3

2

I

RGT I

, I

FGT I

Typical Example

10 1

–60 –40 –20 0 20 40 60 80 100 120 140

Junction Temperature (°C)

Maximum Transient Thermal Impedance

Characteristics (Junction to case)

4.0

10 2 2 3 5 7 10 3 2 3 5

3.5

3.0

2.5

2.0

1.5

1.0

0.5

0

10

–1

2 3 5 7 10

0

2 3 5 7 10

1

2 3 5 7 10

2

Conduction Time (Cycles at 60Hz)

BCR8KM-20LA

Maximum Transient Thermal Impedance

Characteristics (Junction to ambient)

10

3

7

5

3

2

10

2

7

5

3

2

10

1

7

5

3

2

10

0

7

5

3

2

10

–1

10

1

2 3 5 7 10

2

2 3 5 7 10

3

2 3 5 7 10

4

No Fins

2 3 5 7 10

5

Conduction Time (Cycles at 60Hz)

Allowable Case Temperature vs.

RMS On-State Current

160

140

Curves apply regardless of conduction angle

120

100

80

60

40

20

360° Conduction

Resistive, inductive loads

0

0 2 4 6 8 10 12 14 16

RMS On-State Current (A)

160

140

120

100

80

60

40

20

0

0

Allowable Ambient Temperature vs.

RMS On-State Current

Natural convection

No Fins

Curves apply regardless of conduction angle

Resistive, inductive loads

0.5

1.0

1.5

2.0

2.5

3.0

RMS On-State Current (A)

16

Maximum On-State Power Dissipation

6

4

2

14

12

10

360° Conduction

Resistive, inductive loads

8

0

0 2 4 6 8 10 12 14 16

RMS On-State Current (A)

Allowable Ambient Temperature vs.

RMS On-State Current

160

140

All fins are black painted aluminum and greased

120

100

80

60

40

20

0

0 2 4

120

× 120 × t2.3

100

× 100 × t2.3

60

× 60 × t2.3

6 8

Curves apply regardless of conduction angle

Resistive, inductive loads

Natural convection

10 12 14 16

RMS On-State Current (A)

Repetitive Peak Off-State Current vs.

Junction Temperature

10

5

7

5

3

2

Typical Example

10

4

7

5

3

2

10

3

7

5

3

2

10 2

–60 –40 –20 0 20 40 60 80 100 120 140

Junction Temperature (°C)

Rev.1.00, Aug.20.2004, page 4 of 7

BCR8KM-20LA

Holding Current vs.

Junction Temperature

10

2

7

5

4

3

2

10

3

7

5

4

3

2

Typical Example

10 1

–60 –40 –20 0 20 40 60 80 100 120 140

Junction Temperature (°C)

Breakover Voltage vs.

Junction Temperature

160

140

120

100

80

60

Typical Example

40

20

0

–60 –40 –20 0 20 40 60 80 100 120 140

Junction Temperature (°C)

Commutation Characteristics

3

2

10

2

7

5

3

2

Typical Example

Tj = 125°C

I

T

= 4A

τ = 500µs

V

D

= 200V f = 3Hz

Main Voltage

(dv/dt)c

Main Current

I

T

τ

Time

V

D

(di/dt)c

Time

10

1

7

5

3

2

10 0

7

5

10

0

Minimum

Characteristics

Value

2 3 5 7 10

1

I Quadrant

III Quadrant

2 3 5 7 10

2

2 3 5 7 10

3

Rate of Decay of On-State

Commutating Current (A/ms)

Rev.1.00, Aug.20.2004, page 5 of 7

Latching Current vs.

Junction Temperature

10

3

7

5

3

2

10

2

7

5

3

2

Distribution

T

2

+, G–

Typical Example

10 1

7

5

3

2

10 0

–40

T

2

+, G+

T

2

–, G– Typical Example

0 40 80 120 160

Junction Temperature (°C)

Breakover Voltage vs.

Rate of Rise of Off-State Voltage

160

140

120

100

Typical Example

Tj = 125°C

80

60

III Quadrant

40

20

I Quadrant

0

10

1

2 3 5 7 10

2

2 3 5 7 10

3

2 3 5 7 10

4

Rate of Rise of Off-State Voltage (V/

µs)

Gate Trigger Current vs.

Gate Current Pulse Width

10

3

7

5

4

3

2

Typical Example

I

FGT I

I

RGT I

I

RGT III

10 2

7

5

4

3

2

10

1

10

0

2 3 4 5 7 10

1

2 3 4 5 7 10

2

Gate Current Pulse Width (

µs)

BCR8KM-20LA

6

Gate Trigger Characteristics Test Circuits

6

6V

V

A

Test Procedure I

6

330

6V

V

A

Test Procedure II

330

6V

V

A

Test Procedure III

330

Rev.1.00, Aug.20.2004, page 6 of 7

BCR8KM-20LA

Package Dimensions

TO-220FN

EIAJ Package Code

JEDEC Code

Mass (g) (reference value)

2.0

Lead Material

Cu alloy

10 ± 0.3

2.8 ± 0.2

2.54 ± 0.25

φ

3.2 ± 0.2

1.1 ± 0.2

1.1 ± 0.2

0.75 ± 0.15

2.54 ± 0.25

0.75 ± 0.15

Note 1) The dimensional figures indicate representative values unless

otherwise the tolerance is specified.

Symbol e x y

A

A

1

A

2 b

D

E y

1

ZD

ZE

Dimension in Millimeters

Min Typ Max

Order Code

Lead form Standard packing Quantity Standard order code

Straight type

Lead form

Plastic Magazine (Tube)

Plastic Magazine (Tube)

50

50

Type name

Type name – Lead forming code

Note : Please confirm the specification about the shipping in detail.

Standard order code example

BCR8KM-20LA

BCR8KM-20LA-A8

Rev.1.00, Aug.20.2004, page 7 of 7

Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan

Keep safety first in your circuit designs!

1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage.

Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary

circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.

Notes regarding these materials

1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party.

2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.

3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product information before purchasing a product listed herein.

The information described here may contain technical inaccuracies or typographical errors.

Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors.

Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com).

4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the information contained herein.

5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.

6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials.

7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and cannot be imported into a country other than the approved destination.

Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.

8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.

http://www.renesas.com

RENESAS SALES OFFICES

Renesas Technology America, Inc.

450 Holger Way, San Jose, CA 95134-1368, U.S.A

Tel: <1> (408) 382-7500 Fax: <1> (408) 382-7501

Renesas Technology Europe Limited.

Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, United Kingdom

Tel: <44> (1628) 585 100, Fax: <44> (1628) 585 900

Renesas Technology Europe GmbH

Dornacher Str. 3, D-85622 Feldkirchen, Germany

Tel: <49> (89) 380 70 0, Fax: <49> (89) 929 30 11

Renesas Technology Hong Kong Ltd.

7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Hong Kong

Tel: <852> 2265-6688, Fax: <852> 2375-6836

Renesas Technology Taiwan Co., Ltd.

FL 10, #99, Fu-Hsing N. Rd., Taipei, Taiwan

Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999

Renesas Technology (Shanghai) Co., Ltd.

26/F., Ruijin Building, No.205 Maoming Road (S), Shanghai 200020, China

Tel: <86> (21) 6472-1001, Fax: <86> (21) 6415-2952

Renesas Technology Singapore Pte. Ltd.

1, Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632

Tel: <65> 6213-0200, Fax: <65> 6278-8001

© 2004. Renesas Technology Corp., All rights reserved. Printed in Japan.

Colophon .1.0

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