MAX16910

MAX16910
MAX16910
RELIABILITY REPORT
FOR
MAX16910
PLASTIC ENCAPSULATED DEVICES
March 15, 2012
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Approved by
Richard Aburano
Quality Assurance
Manager, Reliability Engineering
Maxim Integrated Products. All rights reserved.
Page 1
MAX16910
Conclusion
The MAX16910 successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim's continuous
reliability monitoring program ensures that all outgoing product will continue to meet Maxim's quality and reliability standards.
Table of Contents
I. ........Device Description
V. ........Quality Assurance Information
II. ........Manufacturing Information
VI. .......Reliability Evaluation
III. .......Packaging Information
IV. .......Die Information
.....Attachments
I. Device Description
A. General
The MAX16910 ultra-low quiescent current, high-voltage linear regulator is ideal for use in automotive and battery-operated systems. The device
operates from a +3.5V to +30V input voltage, delivers up to 200mA of load current, and consumes only 20µA of quiescent current at no load. The
device consumes only 1.6µA current when in shutdown. The input is +45V transient tolerant and is designed to operate under load-dump conditions.
The MAX16910 can be configured as either fixed output voltage (+3.3V or +5V) or adjustable output voltage using an external resistive divider. The
MAX16910 features an open-drain, active-low RESET output with fixed thresholds offered at 92.5% and 87.5% of the output voltage. The active-low
RESET output remains low for a fixed period of 60µs after the output voltage exceeds its threshold. The active-low RESET delay can be extended with
an external capacitor. The MAX16910 includes an enable input, short-circuit protection, and thermal shutdown. The MAX16910 operates over the
-40°C to +125°C automotive temperature range. The device is available in a space-saving, thermally enhanced, 3mm x 3mm, 8-pin TDFN package
and 5mm x 4mm, 8-pin SO package.
Maxim Integrated Products. All rights reserved.
Page 2
MAX16910
II. Manufacturing Information
A. Description/Function:
200mA, Automotive, Ultra-Low Quiescent Current, Linear Regulator
B. Process:
S45
C. Number of Device Transistors:
2013
D. Fabrication Location:
California, Texas or Japan
E. Assembly Location:
Thailand
F. Date of Initial Production:
July 25, 2009
III. Packaging Information
A. Package Type:
8-pin TDFN 3x3
B. Lead Frame:
Copper
Copper
C. Lead Finish:
100% matte Tin
100% matte Tin
D. Die Attach:
Conductive
Conductive
E. Bondwire:
Au (1.3 mil dia.)
Au (1.3 mil dia.)
F. Mold Material:
Epoxy with silica filler
Epoxy with silica filler
G. Assembly Diagram:
#05-9000-3659
#05-9000-3610
H. Flammability Rating:
Class UL94-V0
Class UL94-V0
I. Classification of Moisture Sensitivity per
JEDEC standard J-STD-020-C
Level 1
Level 1
J. Single Layer Theta Ja:
54°C/W
66°C/W
K. Single Layer Theta Jc:
8°C/W
5°C/W
L. Multi Layer Theta Ja:
41°C/W
53°C/W
M. Multi Layer Theta Jc:
8°C/W
5°C/W
8-pin SOIC (N)
IV. Die Information
A. Dimensions:
40 X 45 mils
B. Passivation:
Si3N4/SiO2 (Silicon nitride/ Silicon dioxide)
C. Interconnect:
Al/0.5%Cu with Ti/TiN Barrier
D. Backside Metallization:
None
E. Minimum Metal Width:
Metal1 = 0.5 / Metal2 = 0.6 / Metal3 = 0.6 microns (as drawn)
F. Minimum Metal Spacing:
Metal1 = 0.45 / Metal2 = 0.5 / Metal3 = 0.6 microns (as drawn)
G. Bondpad Dimensions:
H. Isolation Dielectric:
SiO2
I. Die Separation Method:
Wafer Saw
Maxim Integrated Products. All rights reserved.
Page 3
MAX16910
V. Quality Assurance Information
A. Quality Assurance Contacts:
Richard Aburano (Manager, Reliability Engineering)
Don Lipps (Manager, Reliability Engineering)
Bryan Preeshl (Vice President of QA)
B. Outgoing Inspection Level:
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate:
< 50 ppm
D. Sampling Plan:
Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure Rate ( ) is calculated as follows:
=
1
MTTF
=
= 22.9 x 10
1.83
(Chi square value for MTTF upper limit)
192 x 4340 x 48 x 2
(where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV)
-9
= 22.9 F.I.T. (60% confidence level @ 25°C)
The following failure rate represents data collected from Maxim's reliability monitor program. Maxim performs quarterly life test
monitors on its processes. This data is published in the Reliability Report found at http://www.maxim-ic.com/qa/reliability/monitor.
Cumulative monitor data for the S45 Process results in a FIT Rate of 0.49 @ 25C and 8.49 @ 55C (0.8 eV, 60% UCL)
B. E.S.D. and Latch-Up Testing (lot TULZCQ001B, D/C 1151)
The AP13 die type has been found to have all pins able to withstand a transient pulse of
ESD-HBM:
ESD-CDM:
+/- 1500V per JEDEC JESD22-A114
+/- 750V per JEDEC JESD22-C101
Latch-Up testing has shown that this device withstands a current of +/- 100mA and overvoltage when pin SETOV is limited to
AMR.
Maxim Integrated Products. All rights reserved.
Page 4
MAX16910
Table 1
Reliability Evaluation Test Results
MAX16910
TEST ITEM
TEST CONDITION
Static Life Test (Note 1)
Ta = 135°C
Biased
Time = 192 hrs.
FAILURE
IDENTIFICATION
SAMPLE SIZE
NUMBER OF
FAILURES
COMMENTS
DC Parameters
& functionality
48
0
SULZBQ001E, D/C 0927
Note 1: Life Test Data may represent plastic DIP qualification lots.
Maxim Integrated Products. All rights reserved.
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