MAX1759

MAX1759
MAX1759
RELIABILITY REPORT
FOR
MAX1759EUB+
PLASTIC ENCAPSULATED DEVICES
December 11, 2009
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Approved by
Ken Wendel
Quality Assurance
Director, Reliability Engineering
Maxim Integrated Products. All rights reserved.
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MAX1759
Conclusion
The MAX1759EUB+ successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim"s
continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim"s quality and reliability standards.
Table of Contents
I. ........Device Description
V. ........Quality Assurance Information
II. ........Manufacturing Information
VI. .......Reliability Evaluation
III. .......Packaging Information
IV. .......Die Information
.....Attachments
I. Device Description
A. General
The MAX1759 is a buck/boost regulating charge pump that generates a regulated output voltage from a single lithium-ion (Li+) cell, or two or three
NiMH or alkaline cells for small hand-held portable equipment. The MAX1759 operates over a wide +1.6V to +5.5V input voltage range and generates
a fixed 3.3V or adjustable (2.5V to 5.5V) output (Dual Mode™). Maxim's unique charge-pump architecture allows the input voltage to be higher or
lower than the regulated output voltage. Despite its high 1.5MHz operating frequency, the MAX1759 maintains low 50µA quiescent supply current.
Designed to be an extremely compact buck/boost converter, this device requires only three small ceramic capacitors to build a complete DC-DC
converter capable of generating a guaranteed 100mA (min) output current from a +2.5V input. For added flexibility, the MAX1759 also includes an
open-drain power-OK (POK) output that signals when the output voltage is in regulation. The MAX1759 is available in a space-saving 10-pin µMAX
package that is 1.09mm high and half the size of an 8-pin SO.
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MAX1759
II. Manufacturing Information
A. Description/Function:
Buck/Boost Regulating Charge Pump in µMAX
B. Process:
B8
C. Number of Device Transistors:
0
D. Fabrication Location:
California or Texas
E. Assembly Location:
Malaysia, Philippines, Thailand
F. Date of Initial Production:
January 07, 2000
III. Packaging Information
A. Package Type:
10-pin uMAX
B. Lead Frame:
Copper
C. Lead Finish:
100% matte Tin
D. Die Attach:
Conductive
E. Bondwire:
Au (1.3 mil dia.)
F. Mold Material:
Epoxy with silica filler
G. Assembly Diagram:
#05-1101-0142
H. Flammability Rating:
Class UL94-V0
I. Classification of Moisture Sensitivity per
JEDEC standard J-STD-020-C
Level 1
J. Single Layer Theta Ja:
180°C/W
K. Single Layer Theta Jc:
41.9°C/W
L. Multi Layer Theta Ja:
113.1°C/W
M. Multi Layer Theta Jc:
41.9°C/W
IV. Die Information
A. Dimensions:
61 X 87 mils
B. Passivation:
Si3N4/SiO2 (Silicon nitride/ Silicon dioxide)
C. Interconnect:
Al/0.5%Cu with Ti/TiN Barrier
D. Backside Metallization:
None
E. Minimum Metal Width:
0.8 microns (as drawn)
F. Minimum Metal Spacing:
0.8 microns (as drawn)
G. Bondpad Dimensions:
5 mil. Sq.
H. Isolation Dielectric:
SiO2
I. Die Separation Method:
Wafer Saw
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MAX1759
V. Quality Assurance Information
A. Quality Assurance Contacts:
Ken Wendel (Director, Reliability Engineering)
Bryan Preeshl (Managing Director of QA)
B. Outgoing Inspection Level:
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate:
< 50 ppm
D. Sampling Plan:
Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure Rate ( ) is calculated as follows:
=
1
MTTF
=
1.83
(Chi square value for MTTF upper limit)
192 x 4340 x 156 x 2
(where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV)
-9
= 6.89 x 10
= 6.89 F.I.T. (60% confidence level @ 25°C)
The following failure rate represents data collected from Maxim"s reliability monitor program. Maxim performs quarterly life test
monitors on its processes. This data is published in the Reliability Report found at http://www.maxim-ic.com/qa/reliability/monitor.
Cumulative monitor data for the B8 Process results in a FIT Rate of 0.06 @ 25C and 0.99 @ 55C (0.8 eV, 60% UCL)
B. Moisture Resistance Tests
The industry standard 85°C/85%RH or HAST testing is monitored per device process once a quarter.
C. E.S.D. and Latch-Up Testing
The PX73 die type has been found to have all pins able to withstand a HBM transient pulse of +/-2500 V per Mil-Std 883
Method 3015.7. Latch-Up testing has shown that this device withstands a current of +/-250 mA.
Maxim Integrated Products. All rights reserved.
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MAX1759
Table 1
Reliability Evaluation Test Results
MAX1759EUB+
TEST ITEM
TEST CONDITION
Static Life Test (Note 1)
Ta = 135°C
Biased
Time = 192 hrs.
Moisture Testing (Note 2)
HAST
Ta = 130°C
RH = 85%
Biased
Time = 96hrs.
Mechanical Stress (Note 2)
Temperature
-65°C/150°C
Cycle
1000 Cycles
Method 1010
FAILURE
IDENTIFICATION
SAMPLE SIZE
NUMBER OF
FAILURES
DC Parameters
& functionality
156
0
DC Parameters
& functionality
77
0
DC Parameters
& functionality
77
0
Note 1: Life Test Data may represent plastic DIP qualification lots.
Note 2: Generic Package/Process data
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