null  null
NUMBER
TYPE
PRODUCT SPECIFICATION
GS-12-006
TITLE
PAGE
REVISION
1 of 17
Conan™ Micro miniature Connector System
AUTHORIZED BY
C. Martinez
T
DATE
29 July 08
CLASSIFICATION
UNRESTRICTED
1.0
OBJECTIVE
This specification defines the performance, test, quality, and reliability requirements of the Conan™ Micro
miniature Connector System as well as Lead Free product that meets the requirement of the European Union
Directives of Restriction for Hazardous Substances (Directive 2002/95/EC).
2.0
SCOPE
This specification is applicable to the termination characteristics of the Conan™ connector system, which provides
for parallel interconnection of printed wiring boards in low power applications.
3.0
GENERAL
TITLE
PARAGRAPH
1.0
2.0
3.0
4.0
5.0
5.1
5.2
5.3
5.4
6.0
7.0
8.0
9.0
9.1
9.2
9.3
9.4
9.5
4.0
Objective
Scope
General
Applicable Documents
Requirements
Qualification
Material
Finish
Design and Construction
Electrical Characteristics
Mechanical Characteristics
Environmental Conditions
Quality Assurance Provisions
Equipment Calibration
Inspection Conditions
Sample Quantities and Description
Qualification Testing
Requalification Testing
APPLICABLE DOCUMENTS
In the event of a conflict between the requirements outlined in this specification and the product drawing, the
product drawing shall take precedence. In the event of a conflict between the requirements outlined in this
specification and the referenced documents, this specification shall take precedence.
Copyright FCI
Form E-3334
Rev F
GS-01-001
PDM: Rev:T
STATUS:Released
Printed: Nov 28, 2010.
NUMBER
TYPE
PRODUCT SPECIFICATION
GS-12-006
TITLE
PAGE
REVISION
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CLASSIFICATION
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4.1
SPECIFICATIONS
4.1.1
4.2
MILITARY STANDARDS
4.2.1
4.2.2
4.2.3
4.3
Nickel Plating (Electrodeposited)
Beryllium Copper Alloy Strip
Phosphor Bronze Alloy Strip
Cartridge Brass Alloy Strip
Solder
UL-94:
Flammability
ASTM B-19: Brass
ASTM B-36: Brass
ASTMB-194: Beryllium Copper
ASTM B-103: Phosphor Bronze
ISO 9000
FCI SPECIFICATIONS
4.5.1
4.5.2
4.5.3
4.5.4
4.5.5
4.6
QQ-N-290:
QQ-N-533:
QQ-B-750:
QQ-B-613:
QQ-S-571:
OTHER STANDARDS AND SPECIFICATIONS
4.4.1
4.4.2
4.4.3
4.4.3
4.4.4
4.4.5
4.5
MIL-STD-202F: Test Methods for Electronic Component Parts
EIA-364: Test Methods for Electrical Connectors
MIL-C-45662: Equipment Calibration
FEDERAL SPECIFICATIONS
4.3.1
4.3.2
4.3.3
4.3.4
4.3.5
4.4
Engineering Drawings 91900, 10084781 & 10086244
BUS-03-114:
BUS-03-404:
GS-19-037:
GS-19-036:
GS-19-039:
Capacitance Measurement
Normal Force Measurement
Solderability
Porosity
Plating Adhesion
FCI LAB REPORTS - SUPPORTING DATA
4.6.1
4.6.2
4.6.3
4.6.4
4.6.5
4.6.6
EL-93-03-062: Qualification Testing
EL-93-03-062B: Qualification Testing
EL-92-08-051: Qualification Testing
EL-94-01-031: Qualification Testing
EL-2004-09-024: Qualification Testing
ZA5-2625 Lead-free plating investigation (DOE pure tin)
Copyright FCI
Form E-3334
Rev F
GS-01-001
PDM: Rev:T
STATUS:Released
Printed: Nov 28, 2010.
NUMBER
TYPE
PRODUCT SPECIFICATION
GS-12-006
TITLE
PAGE
REVISION
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Conan™ Micro miniature Connector System
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CLASSIFICATION
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5.0
REQUIREMENTS
5.1
QUALIFICATION
Connectors furnished under this specification shall be products that are capable of meeting the
qualification test requirements specified herein.
5.2
MATERIAL
The material for each part shall be as specified herein, or equivalent. Substitute material shall meet
the performance requirements of this specification.
5.3
5.4
5.2.1
Receptacle Terminal. The base material shall be beryllium copper strip C17200, SHM
(TMO5).
5.2.2
Header Terminal. The base material shall be 3/4 hard phosphor bronze strip C51000.
5.2.3
Header and Receptacle Insulator Housing. The insulators shall be molded of 30% glass
filled liquid crystal polymer that is rated 94V-0 or better in accordance with UL-94.
5.2.4
Hold-Down. The base material shall be full hard, brass strip C26000. See Section 5.3.2
for plating requirements.
FINISH
5.3.1
The header and receptacle terminals shall be plated in the contact area with 15
microinches min. GXT™, 30 microinches min. GXT™ or 50 microinches min. Gold
(dependent on finish specified by part number) over 50 microinches Nickel or Copper.
The terminal soldertail shall be plated with 200 microinhces min. tin lead, 100
microinches min. tin lead or pure tin over 50 microinches min. Nickel or Copper . The
terminal areas outside of the contact area and soldertail areas shall be plated with 50
microinches min. Nickel or Copper.
5.3.2
The hold-down shall be plated with 100 microinches min. tin lead or pure tin over 50
microinches min. Nickel or Copper.
DESIGN AND CONSTRUCTION
The connector shall be a multi-piece assembly having two rows of contacts with surface mount
soldertail terminations and solderable surface mount retention devices for installation on surface
mount printed wiring boards or flexible circuits.
5.4.1
Mating. The connector shall be capable of mating and unmating manually without the
use of special tools.
5.4.2
Workmanship. Connectors shall be uniform in quality and shall be free from burrs,
scratches, cracks, voids, chips, blisters, pin holes, sharp edges, and other defects that
will adversely affect life or serviceability. Open knit lines, which may appear as a crack,
may be present in the housing but do not adversely affect the performance of the
connector as per the requirements outlined in this specification.
Copyright FCI
Form E-3334
Rev F
GS-01-001
PDM: Rev:T
STATUS:Released
Printed: Nov 28, 2010.
NUMBER
TYPE
PRODUCT SPECIFICATION
GS-12-006
TITLE
PAGE
REVISION
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Conan™ Micro miniature Connector System
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6.0
ELECTRICAL CHARACTERISTICS
6.1
CURRENT RATING
The maximum current rating based upon a 30 degree C temperature rise over ambient is 1.0 amp
DC per contact for a 69 position connector with all contacts carrying current. The maximum current
carrying capacity for an individual contact is 2.0 amps D.C.
6.2
LOW LEVEL CONTACT RESISTANCE
The low level contact resistance of the 4.15mm, 4.5mm, 5mm and 5.5mm mated height connectors
shall not exceed 20 milliohms initially and 30 milliohms after environmental exposure when
measured in accordance with EIA-364 TP45. The low level contact resistance of the 6mm, 7mm
and 7.5mm mated height connectors shall not exceed 25 milliohms initially and 35 milliohms after
environmental exposure when measured in accordance with EIA-364 TP45. The following details
shall apply:
6.3
A.
Method of connection: Attach current and voltage leads as shown in Figure 1.0. The
resistance shall be measured from the solder tail of the header to the solder tail of the
receptacle.
B.
Test Voltage: 20 millivolts DC max open circuit.
C.
Test Current: Not to exceed 100 milliamperes.
INSULATION RESISTANCE
The insulation resistance of the mated connectors shall not be less than 1 gigaohm after
environmental exposure when measured in accordance with MIL-STD-202F, Method 302. The
following details shall apply:
6.4
A.
Test voltage: 500 volts DC
B.
Preparation: The connectors shall be mated but not soldered to a P.C. board.
C.
Measurement points: The insulation resistance shall be measured between a minimum
of 10 adjacent and 10 opposing contacts per connector.
DIELECTRIC WITHSTANDING VOLTAGE
There shall be no evidence of arc-over, insulation breakdown or leakage current in excess of 1
milliampere when the unmated connector is tested in accordance with MIL-STD-202F, Method 301.
The following details shall apply:
A.
Test voltage: 500 volts rms at 60 hz.
Copyright FCI
Form E-3334
Rev F
GS-01-001
PDM: Rev:T
STATUS:Released
Printed: Nov 28, 2010.
NUMBER
TYPE
PRODUCT SPECIFICATION
GS-12-006
TITLE
PAGE
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6.5
B.
Test duration: 60 seconds
C.
Preparation: The connectors shall be mounted but not soldered to a P.C. board.
D.
Measurement points: The dielectric withstanding voltage shall be applied across a
minimum of 10 adjacent and 10 opposing contacts.
CAPACITANCE
The capacitance between adjacent and opposing contacts in a mated connector shall not exceed
2.0 picofarads when tested in accordance with Du Pont specification BUS-03-114. The following
details shall apply:
7.0
A.
Test frequency: 100 khz
B.
Preparation: The connectors shall be mated but not soldered to a P.C. board.
C.
Measurement points: The capacitance shall be measured across a minimum of 10
adjacent and 10 opposing contacts.
MECHANICAL CHARACTERISTICS
7.1
CONTACT RETENTION
Individual contacts in the unterminated header and receptacle portions of the connector shall
withstand a load normal to the soldertail of 0.25 min. pounds. The force shall be measured on a
minimum of 10 contacts per unmated header and receptacle connector. The crosshead speed shall
be no greater than 0.2 inches per minute.
7.2
MATING FORCE
The force to mate header and receptacle connectors that are mounted on a P.C. board shall not
exceed 125 grams per contact. The crosshead speed shall be no greater than 1.0 inches per
minute.
7.3
UNMATING FORCE
The force to unmate header and receptacle connectors that are mounted on a P.C. board shall be
no less than 45 grams per contact. The crosshead speed shall be no greater than 1.0 inch per
minute.
7.4
NORMAL FORCE
Copyright FCI
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PDM: Rev:T
STATUS:Released
Printed: Nov 28, 2010.
NUMBER
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TITLE
PAGE
REVISION
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The contact normal force shall not be less than 75 grams when tested in accordance with BUS-03404 Section 3.2 (probe method). Refer to Figure 2.0. The following process shall be used:
7.4.1
Solder the receptacle and header connectors to a printed circuit board.
7.4.2
Select the receptacle terminal positions to be measured.
7.4.3
Measure the maximum terminal gap between the selected positions and the opposite row
of terminals in the receptacle connector.
7.4.4
Measure the minimum width across the selected positions and the opposite row of
terminals of the header connector.
7.4.5
Using an "L" shaped probe, Lab Fixture Number MF149, Figure 2, deflect the contact
positions on the instron tester.
7.4.6
The minimum beam deflection occurs on the long row of terminals. Calculate the
minimum beam deflection as follows:
V = Minimum width across the header terminals.
W = Maximum gap between receptacle terminals.
Z = Deflection of terminals in the long row.
A = Number of terminals in the short row.
B = Number of terminals in the long row.
A*(V-W)
Minimum deflection (Z) = -----------(A+B)
7.4.7
7.5
Starting at the bottom of the force-deflection curve where the terminal begins to deflect,
move up the curve a distance equal to the minimum deflection, Z, to find the minimum
normal force. Measure a minimum of 5 contacts per connector.
BOARD RETENTION
The force to remove the header and receptacle connectors from a P.C. board shall be no less than
10 lbs. when both the hold-downs and the terminal leads are soldered in place. The crosshead
speed shall be no greater than 0.2 inches per minute.
Copyright FCI
Form E-3334
Rev F
GS-01-001
PDM: Rev:T
STATUS:Released
Printed: Nov 28, 2010.
NUMBER
TYPE
PRODUCT SPECIFICATION
GS-12-006
TITLE
PAGE
REVISION
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8.0
ENVIRONMENTAL CONDITIONS
After exposure to the following environmental conditions in accordance with the specified test procedures
and/or details, the product shall show no physical damage and shall meet the electrical and mechanical
requirements per paragraphs 6.0 and 7.0 as specified in the Table 1.0 test sequences. Unless specified
otherwise, the assemblies shall be mated during exposure.
8.1
HUMIDITY, STEADY STATE - MIL-STD-202F, METHOD 103B
A.
B.
C.
D.
8.2
THERMAL SHOCK - MIL-STD-202F, METHOD 107G
A.
B.
C.
D.
E.
8.3
Relative humidity: 90% +/- 5%
Temperature: 40 +/- 3 Deg. C
Test Duration: 96 hours
Samples: Groups 1 and 2 - unmated during exposure.
Test condition: A - (25, 1 hour cycles).
Temperature range: -55 +/- 5 to +130 +5/-0 Deg. C.
Time at each temperature: 30 minutes
Transfer time: 5 minutes max.
Samples: Groups 1 and 2 - unmated during exposure.
ENVIRONMENTAL SEQUENCE
Phase 1 - Thermal shock, MIL-STD-202F, Method 107G.
A.
B.
C.
D.
Test duration - 36, 1-hour cycles
Temperature range - between -20 and +80 deg. C.
Time at temperature - 30 minutes
Transfer time - 5 minutes, maximum
Phase 2 - Humidity, MIL-STD-202F, Method 103B.
A.
B.
C.
Test duration - 10 days
Relative humidity - 95%
Temperature - 40 +/- 3 deg. C.
8.3.1 - High Tem Life MIL-STD-202F, Method 108A
A.
B.
Test Duration - 21 days
Temperature - 105 deg. C.
Copyright FCI
Form E-3334
Rev F
GS-01-001
PDM: Rev:T
STATUS:Released
Printed: Nov 28, 2010.
NUMBER
TYPE
PRODUCT SPECIFICATION
GS-12-006
TITLE
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8.4
8.5
8.6
8.7
SHOCK - MIL-STD-202F, METHOD 213B
A.
Condition - A, (50G, 11 ms half-sine) contacts shall show no evidence of discontinuity
greater than one microsecond. The following details shall apply:
B.
Shocks: 3 shocks in both directions along each of 3 orthogonal axes (18 total).
C.
Mounting: See Figure 3.0.
D.
No discontinuities greater than 1.0 microseconds.
VIBRATION - MIL-STD-202F, METHOD 204D
A.
Condition: B
B.
Vibration Amplitude: +/-15G or .06" da.
C.
Frequency range: 10 to 2000 hz.
D.
Sweep time and duration: 20 minutes per sweep, 4 hours along each of 3 orthogonal
axes (12 hours total).
E.
Mounting: See Figure 3.0.
INDUSTRIAL MIXED FLOWING GAS - BATTELLE PROCEDURE
A.
Class: IIa
B.
Duration: 20 days, mated
SOLDERABILITY - MIL-STD-202F METHOD 208F
A.
Contact tails shall be solderable over a minimum of .035 from the tip.
B.
Steam aging: Suspended 2 inches above boiling, distilled water for 4 hours.
C.
Acceptable coverage: 95% minimum.
D.
Solder: 60/40 tin-lead in accordance with QQ-S-571, Type S.
E.
Flux: Type RMA.
F.
Flux immersion time: 10 seconds.
Copyright FCI
Form E-3334
Rev F
GS-01-001
PDM: Rev:T
STATUS:Released
Printed: Nov 28, 2010.
NUMBER
TYPE
GS-12-006
PRODUCT SPECIFICATION
TITLE
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8.8
8.9
9.0
G.
Solder dwell time: Terminal held immediately above solder for 10 seconds and then
immersed for 5 +/- 0.5 seconds. The solder tails shall be bent normal to the base of the
connector to prevent the insulator from touching the solder bath.
H.
Solder temperature: 245 +/- 5 deg. C.
I.
Samples: Group 7 - unsoldered and unmated.
RESISTANCE TO IR SOLDERING HEAT
A.
Temperature: 260oC + 5o C (peak temperature)
B.
Duration: 30 seconds.
DURABILITY - STANDARD LABORATORY PROCEDURES
A.
Number of cycles:
30 cycles for 15u" GXT Contact Finish
200 cycles for 30u" GXT Contact Finish
B.
Crosshead speed: 1 inch/minute max.
QUALITY ASSURANCE PROVISIONS
9.1
EQUIPMENT CALIBRATION
All test equipment and inspection facilities used in the performance of any test shall be maintained in
a calibration system in accordance with MIL-C-45662 and ISO 9000.
9.2
INSPECTION CONDITIONS
Unless otherwise specified herein, all inspections shall be performed under the following ambient
conditions:
A.
Temperature: 25 +/- 5 deg. C.
B.
Relative humidity: 30 to 60%
C.
Barometric pressure: Local ambient.
Copyright FCI
Form E-3334
Rev F
GS-01-001
PDM: Rev:T
STATUS:Released
Printed: Nov 28, 2010.
NUMBER
TYPE
PRODUCT SPECIFICATION
GS-12-006
TITLE
PAGE
REVISION
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9.3
SAMPLE QUANTITIES
Sample quantities for the respective test groups are as follows:
Test
Group
Size (number of
positions)
Connector
Height
Quantity
1
69
4.15
3
2
69
4.15
3
21 & 69
21 & 69
4.15 & 7.0
4.15 & 7.0
3 ea.
3 ea.
4
21
7.0
3
5
5A
69
69
7.0
7.0
3
3
6
69
4.15 & 7.0
3 ea.
7
69
7.0
3
8
9 & 21 & 69
7.0
3 ea.
9
69
N/A
3
10
21 & 69
4.15 & 7.0
3 ea.
11
69
7.0
1
11A
69
7.0
1
11B
69
7.0
1
12
69
4.15 & 7.0
1 ea.
13
13A
69
69
4.15
4.15
3
3
3
3A
Copyright FCI
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STATUS:Released
Printed: Nov 28, 2010.
NUMBER
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PRODUCT SPECIFICATION
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9.4
QUALIFICATION TESTING
Qualification testing shall be performed on sample units produced with equipment and procedures
normally used in production. The test sequence shall be as shown in Table 1.
9.5
REQUALIFICATION TESTING
If either of the following conditions occurs, the responsible product engineer shall initiate
requalification testing consisting of all applicable parts of the qualification test matrix, Table 1.
A.
A significant design change is made to the existing product. A significant change shall
include, but is not limited to, changes in the contact material composition, contact
material thickness, contact force, contact surface geometry, underlying material
composition, underlying material thickness, insulator design, contact base material, or
contact lubrication requirements.
B.
A significant change is made to the manufacturing process which impacts the product
form, fit, or function.
C.
A significant event occurs during production or end use requiring corrective action to be
taken relative to the product design or manufacturing process.
Copyright FCI
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STATUS:Released
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NUMBER
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T
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CLASSIFICATION
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TABLE 1 - QUALIFICATION TESTING
TEST/OPERATION
Product Examination
Sample Preparation
Plating Thkns. and/or
Metal Exam.
Porosity
Contact Resistance
Current Rating
Insulation Resistance
Dielectric Withstanding
Voltage
Capacitance
Mating Force
Unmating Force
Contact Retention
Normal Force
Board Retention
Humidity
Thermal Shock
Thermal Shock Phase 1
Temp. & Hum. Phase 2
Hi Temp. Life
Mechanical Shock
Vibration
Durability (30 cycles)
Durability (200 Cycles)
Battelle Imfg
Resistance to IR Heat
Solderability
TEST GROUP
7
8
9
1
2
3
3
A
4
5
5
A
6
10
11
11
A
11
B
12
13
13
A
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
10
-
8
2
14
2
14
2
10
2
11
2
11
2
5
2
4
2
4
2
4
2
7
2
5
2
5
2
4
2
2
12
2
12
2
2
6
8
3
9
4
5
7
-
3
5
7
4
6
-
5
7
9
13
3
11
4
12
6
8
10
-
5
7
9
13
3
11
4
12
6
8
10
-
5
8
3
4
9
6
7
-
5
7
9
3
4
10
6
8
-
5
7
9
3
4
10
6
8
-
4
3
-
3
3
-
3
-
3
5
6
4
-
4
3
-
4
3
-
3
-
3
-
5
9
11
3
7
4
8
10
6
-
5
9
11
3
7
4
8
10
6
-
Copyright FCI
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Printed: Nov 28, 2010.
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FIGURE 1.0
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FIGURE 2.0
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FIGURE 3.0
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STATUS:Released
Printed: Nov 28, 2010.
NUMBER
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REVISION RECORD
REV
PAGE
1
A
All
All
B
15
C
All
D
All
E
2,3,4
5,6,7
8,9
12
DESCRIPTION
Created new product spec.
Various changes
Released
Change dim. on drawing
.236 to .230
.082 to .064
.098 to .095
Rewrite the following sections:
Change title
1.0, 4.1, 4.6, 5.2, 5.4, 6.1, 7.2, 7.3, 8.6, 8.8, 9.3, Table 1
Correct spelling in header
2.0 - change "family of products" to "system"
9.3 - add Test group 13
Update 4.6, 5.3.2, 6.2, 7.2, 7.3
7.4.5, 8.3
Remove 8.9 Section and renumber
Add Test Group 7 and delete 13
Update chart
Change Connector to Receptacle on dwg.
Add 4.6.4
Add Test Group #13
Update 5.3.1 and 6.1
Update 8.0
Add 3A, 5A and 13A
Sect. 8.3 - Change Phase II to read ‘Phase 2’; change Phase
III to read ‘8.3.1’.
Para. 6.2 - add 5.5mm and 7.5mm.
Revised format to be consistent with GS-01-001, and change
BERG, Dupont, etc. references to FCI. Change document
number prefix from GES to GS.
4.0 Add statement for document control precedence.
5.4.2 Add statement concerning allowance for open knit lines.
Change Logo
Add Lead-Free information
EC #
DATE
V22342
10/14/91
04/16/92
V33470
07/09/92
V31757
09/29/93
V31770
10/07/93
V40605
01/26/94
V40450
03/21/94
V51216
10/16/95
V60740
03/18/97
V70778
V01949
05/08/97
08/15/00
V03-1033
09/12/03
M06-0295
08/01/06
H
15
2
10,12
3
9
10,12
7
J
K
4
All
L
1,3
M
All
1,2,3,9
N
2
MIL-STD-1344 was replaced by EIA-364
M06-0326
08/25/06
P
3
Remove “Tin Lead” information
M07-0357
08/09/07
R
3
Add “Trade Mark” at GXT .
M08-0012
01/11/08
S
2&3
Add “Tin Lead” information and new series
M08-0042
02/13/08
T
2&3
Change Solderability, Porosity & Adhesion Specifications;
remove Obsolete specifications. Add new plating option
M08-0204
07/29/08
F
G
Copyright FCI
Form E-3334
Rev F
GS-01-001
PDM: Rev:T
STATUS:Released
Printed: Nov 28, 2010.
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