MAX471

MAX471
MAX471xxA
Rev. A
RELIABILITY REPORT
FOR
MAX471xxA
PLASTIC ENCAPSULATED DEVICES
January 20, 2003
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Written by
Reviewed by
Jim Pedicord
Quality Assurance
Reliability Lab Manager
Bryan J. Preeshl
Quality Assurance
Executive Director
Conclusion
The MAX471 successfully meets the quality and reliability standards required of all Maxim products. In addition,
Maxim’s continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim’s quality
and reliability standards.
Table of Contents
I. ........Device Description
II. ........Manufacturing Information
III. .......Packaging Information
IV. .......Die Information
V. ........Quality Assurance Information
VI. .......Reliability Evaluation
......Attachments
I. Device Description
A. General
The MAX471 is a complete, bidirectional, high-side current-sense amplifiers for portable PCs, telephones, and
other systems where battery/DC power-line monitoring is critical. High-side power-line monitoring is especially
useful in battery-powered systems, since it does not interfere with the ground paths of the battery chargers or
monitors often found in "smart" batteries.
The MAX471 has an internal 35m current-sense resistor and measures battery currents up to ±3A. The device
has a current output that can be converted to a ground-referred voltage with a single resistor, allowing a wide
range of battery voltages and currents.
An open-collector SIGN output indicates current-flow direction, so the user can monitor whether a battery is being
charged or discharged. The device operates from 3V to 36V, draws less than 100µA over temperature, and
include a 18µA max shutdown mode.
B. Absolute Maximum Ratings
Item
Supply Voltage, RS+, RS-, VCC to GND
Differential Input Voltage, RG1 to RG2
Voltage at Any Pin Except SIGN
Voltage at SIGN
Current into SHDN, GND, OUT, RG1, RG2, VCC
Current into SIGN
Junction Temperature Range
Storage Temp.
Lead Temp. (10 sec.)
Continuous Power Dissipation (TA=+70°C)
8-Pin DIP
8-Pin SO
Derates above +70°C
8-Pin DIP
8-Pin SO
Rating
-0.3V, +40V
±0.3V
-0.3V to (VCC + 0.3V)
-0.3V to +40V
±50mA
+10mA, -50mA
-60°C to +150°
-65°C to +160°C
+300°C
1400mW
791mW
17.5mW/°C
9.9mW/°C
Note 1: Due to special packaging considerations, MAX471 (DIP, SO) has a higher power dissipation rating than
the MAX472. RS+ and RS- must be soldered to large copper traces to achieve this dissipation rating.
II. Manufacturing Information
A. Description/Function:
Precision, High-Side Current-Sense Amplifier
B. Process:
BB5 (Standard 44V 5 micron Bipolar Process)
C. Number of Device Transistors:
123
D. Fabrication Location:
Arizona, USA
E. Assembly Location:
Philippines, Malaysia, or Thailand
F. Date of Initial Production:
November, 1994
III. Packaging Information
A. Package Type:
8-Lead SO
8-Lead DIP
B. Lead Frame:
Copper
Copper
C. Lead Finish:
Solder Plate
Solder Plate
D. Die Attach:
Silver-filled Epoxy
Silver-filled Epoxy
E. Bondwire:
Gold (1.3 mil dia.)
Gold (1.3 mil dia.)
F. Mold Material:
Epoxy with silica filler
Epoxy with silica filler
G. Assembly Diagram:
Buildsheet # 05-0601-0430
Buildsheet # 05-0601-0379
H. Flammability Rating:
Class UL94-V0
Class UL94-V0
I. Classification of Moisture Sensitivity
per JEDEC standard JESD22-A112: Level 1
Level 1
IV. Die Information
A. Dimensions:
82 x 130 mils
B. Passivation:
Si3N4/SiO2 (Silicon nitride/ Silicon dioxide)
C. Interconnect:
Aluminum/Si (Si = 1%)
D. Backside Metallization:
None
E. Minimum Metal Width:
5 microns (as drawn)
F. Minimum Metal Spacing:
5 microns (as drawn)
G. Bondpad Dimensions:
5 mil. Sq.
H. Isolation Dielectric:
SiO2
I. Die Separation Method:
Wafer Saw
V. Quality Assurance Information
A. Quality Assurance Contacts:
B. Outgoing Inspection Level:
Jim Pedicord (Reliability Lab Manager)
Bryan Preeshl (Executive Director)
Kenneth Huening (Vice President)
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate: < 50 ppm
D. Sampling Plan: Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure
Rate (λ) is calculated as follows:
λ=
1 =
MTTF
1.83
(Chi square value for MTTF upper limit)
192 x 4389 x 240 x 2
Temperature Acceleration factor assuming an activation energy of 0.8eV
λ = 4.52 x 10
-9
λ = 4.52 F.I.T. (60% confidence level @ 25°C)
This low failure rate represents data collected from Maxim’s reliability monitor program. In addition to
routine production Burn-In, Maxim pulls a sample from every fabrication process three times per week and
subjects it to an extended Burn-In prior to shipment to ensure its reliability. The reliability control level for each lot
to be shipped as standard product is 59 F.I.T. at a 60% confidence level, which equates to 3 failures in an 80
piece sample. Maxim performs failure analysis on any lot that exceeds this reliability control level. Attached
Burn-In Schematic (Spec. # 06-5009) shows the static Burn-In circuit. Maxim also performs quarterly 1000 hour
life test monitors. This data is published in the Product Reliability Report (RR-1M).
B. Moisture Resistance Tests
Maxim pulls pressure pot samples from every assembly process three times per week. Each lot sample
must meet an LTPD = 20 or less before shipment as standard product. Additionally, the industry standard
85°C/85%RH testing is done per generic device/package family once a quarter.
C. E.S.D. and Latch-Up Testing
The OA58 die type has been found to have all pins able to withstand a transient pulse of ±3000, per MilStd-883 Method 3015 (reference attached ESD Test Circuit).
Latch-Up testing has shown that this device withstands a current of ±100mA.
Table 1
Reliability Evaluation Test Results
MAX471xxA
TEST ITEM
TEST CONDITION
Static Life Test (Note 1)
Ta = 135°C
Biased
Time = 192 hrs.
FAILURE
IDENTIFICATION
PACKAGE
DC Parameters
& functionality
SAMPLE
SIZE
NUMBER OF
FAILURES
240
0
77
77
0
0
Moisture Testing (Note 2)
Pressure Pot
Ta = 121°C
P = 15 psi.
RH= 100%
Time = 168hrs.
DC Parameters
& functionality
PDIP
SO
85/85
Ta = 85°C
RH = 85%
Biased
Time = 1000hrs.
DC Parameters
& functionality
77
0
DC Parameters
& functionality
77
0
Mechanical Stress (Note 2)
Temperature
Cycle
-65°C/150°C
1000 Cycles
Method 1010
Note 1: Life Test Data may represent plastic D.I.P. qualification lots.
Note 2: Generic package/process data.
Attachment #1
TABLE II. Pin combination to be tested. 1/ 2/
Terminal A
(Each pin individually
connected to terminal A
with the other floating)
Terminal B
(The common combination
of all like-named pins
connected to terminal B)
1.
All pins except VPS1 3/
All VPS1 pins
2.
All input and output pins
All other input-output pins
1/ Table II is restated in narrative form in 3.4 below.
2/ No connects are not to be tested.
3/ Repeat pin combination I for each named Power supply and for ground
(e.g., where VPS1 is VDD, VCC, VSS, VBB, GND, +VS, -VS, VREF, etc).
3.4
Pin combinations to be tested.
a.
Each pin individually connected to terminal A with respect to the device ground pin(s) connected to terminal B. All
pins except the one being tested and the ground pin(s) shall be open.
b.
Each pin individually connected to terminal A with respect to each different set of a combination of all named power
supply pins (e.g., VSS1, or VSS2 or VSS3 or VCC1, or VCC2) connected to terminal B. All pins except the one being
tested and the power supply pin or set of pins shall be open.
c.
Each input and each output individually connected to terminal A with respect to a combination of all the other input
and output pins connected to terminal B. All pins except the input or output pin being tested and the combination of
all the other input and output pins shall be open.
TERMINAL C
R1
R2
S1
TERMINAL A
REGULATED
HIGH VOLTAGE
SUPPLY
S2
C1
DUT
SOCKET
SHORT
TERMINAL B
TERMINAL D
Mil Std 883D
Method 3015.7
Notice 8
R = 1.5kΩ
Ω
C = 100pf
CURRENT
PROBE
(NOTE 6)
Was this manual useful for you? yes no
Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Download PDF

advertisement