MAX7359

MAX7359
MAX7359Exx+
RELIABILITY REPORT
FOR
MAX7359ETG+/EWA+
PLASTIC ENCAPSULATED DEVICES
July 8, 2008
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Approved by
Ken Wendel
Quality Assurance
Director, Reliability Engineering
Maxim Integrated Products. All rights reserved.
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MAX7359Exx+
Conclusion
The MAX7359Exx+ successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim"s
continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim"s quality and reliability standards.
Table of Contents
I. ........Device Description
V. ........Quality Assurance Information
II. ........Manufacturing Information
VI. .......Reliability Evaluation
III. .......Packaging Information
IV. .......Die Information
.....Attachments
I. Device Description
A. General
The MAX7359 I²C interfaced peripheral provides microprocessors with management of up to 64 key switches. Key codes are generated for each press
and release of a key for easier implementation of multiple key entries. Key inputs are monitored statically, not dynamically, to ensure low-EMI operation.
The switches can be metallic or resistive (carbon) with up to 5k of resistance. The MAX7359 features autosleep and autowake to further minimize the
power consumption of the device. The autosleep feature puts the device in a low-power state (1µA typ) after a sleep timeout period. The autowake
feature configures the MAX7359 to return to normal operating mode from sleep upon a key press. The key controller debounces and maintains a FIFO of
key-press and release events (including autorepeat, if enabled). An interrupt (active-low INT) output can be configured to alert key presses either as they
occur, or at maximum rate. Any of the column drivers (COL2/PORT2-COL7/PORT7) or the active-low INT, if not used, can function as a generalpurpose output (GPO). The MAX7359 is offered in a small 24-pin TQFN (3.5mm x 3.5mm) package for cell phones, pocket PCs, and other portable
consumer electronic applications. The MAX7359 operates over the -40°C to +85°C temperature range.
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MAX7359Exx+
II. Manufacturing Information
A. Description/Function:
2-Wire Interfaced Low-EMI Key Switch Controller/GPO
B. Process:
S4
C. Number of Device Transistors:
43668
D. Fabrication Location:
California, Texas or Japan
E. Assembly Location:
Thailand, Casio
F. Date of Initial Production:
2007
III. Packaging Information
MAX7359ETG+
MAX7359EWA+
A. Package Type:
24-pin TQFN 3.5x3.5
25-Bump CSP
B. Lead Frame:
Copper
NA
C. Lead Finish:
100% matte Tin
SnAgCu (SAC305) Balls
D. Die Attach:
Conductive Epoxy
NA
E. Bondwire:
Gold (1 mil dia.)
NA
F. Mold Material:
Epoxy with silica filler
NA
G. Assembly Diagram:
#05-9000-2869
#05-9000-3902
H. Flammability Rating:
Class UL94-V0
Class UL95-V0
I. Classification of Moisture Sensitivity per
JEDEC standard J-STD-020-C
Level 1
Level 1
J. Single Layer Theta Ja:
65.1°C/W
K. Single Layer Theta Jc:
5.4°C/W
IV. Die Information
A. Dimensions:
70 X 80 mils
B. Passivation:
C. Interconnect:
Si3N4/SiO2 (Silicon nitride/ Silicon dioxide
Aluminum/Si (Si = 1%)
D. Backside Metallization:
None
E. Minimum Metal Width:
Metal1 = 0.5 / Metal2 = 0.6 / Metal3 = 0.6 microns (as drawn)
F. Minimum Metal Spacing:
Metal1 = 0.45 / Metal2 = 0.5 / Metal3 = 0.6 microns (as drawn)
G. Bondpad Dimensions:
5 mil. Sq.
H. Isolation Dielectric:
SiO2
I. Die Separation Method:
Wafer Saw
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MAX7359Exx+
V. Quality Assurance Information
A. Quality Assurance Contacts:
Ken Wendel (Director, Reliability Engineering)
Bryan Preeshl (Managing Director of QA)
B. Outgoing Inspection Level:
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate:
< 50 ppm
D. Sampling Plan:
Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are pending. Using these results, the Failure Rate ( ) is calculated as follows:
=
1
MTTF
=
1.83
(Chi square value for MTTF upper limit)
192 x 4340 x 48 x 2
(where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV)
= 24.43 x 10-9
= 24.43 F.I.T. (60% confidence level @ 25°C)
The following failure rate represents data collected from Maxim’s reliability monitor program. Maxim performs quarterly 1000 hour
life test monitors on its processes. This data is published in the Product Reliability Report found at http://www.maxim-ic.com/. Current
monitor data for the S4 Process results in a FIT Rate of 0.28 @ 25C and 4.85 @ 55C (0.8 eV, 60% UCL)
B. Moisture Resistance Tests
The industry standard 85°C/85%RH or HAST testing is monitored per device process once a quarter.
C. E.S.D. and Latch-Up Testing
The DX46 die type has been found to have all pins able to withstand a HBM transient pulse of +/-2500V per JEDEC
JESD22-A114-D, +/-250V MM ESD per JEDEC JESD22-A115 and +/-750V CDM ESD per JEDEC JESD22-C101-A
Latch-Up testing has shown that this device withstands a current of +/-250mA.
axim Integrated Products. All rights reserved.
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MAX7359Exx+
Table 1
Reliability Evaluation Test Results
MAX7359ETG+/EWA+
TEST ITEM
TEST CONDITION
FAILURE
IDENTIFICATION
SAMPLE SIZE
NUMBER OF
FAILURES
Static Life Test (Note 1)
Ta = 135°C
Biased
Time = 192 hrs.
DC Parameters
& functionality
48
0
Moisture Testing (Note 2)
85/85
Ta = 85°C
RH = 85%
Biased
DC Parameters
& functionality
77
0
DC Parameters
& functionality
77
0
Time = 1000hrs.
Mechanical Stress (Note 2)
Temperature
-65°C/150°C
Cycle
1000 Cycles
Method 1010
Note 1: Life Test Data may represent plastic DIP qualification lots.
Note 2: Generic Package/Process data
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