MP45DT02 MEMS audio sensor omnidirectional digital microphone Description

MP45DT02  MEMS audio sensor omnidirectional digital microphone Description
MP45DT02
MEMS audio sensor omnidirectional digital microphone
Datasheet - production data
Description
The MP45DT02 is a compact, low-power, topport, omnidirectional, digital MEMS microphone.
The MP45DT02 is built with a sensing element
and an IC interface with stereo capability.
The sensing element, capable of detecting
acoustic waves, is manufactured using a
specialized silicon micromachining process to
produce audio sensors.
The IC interface is manufactured using a CMOS
process that allows designing a dedicated circuit
able to provide a digital signal externally in PDM
format.
HLGA (4.72 x 3.76 mm) 6LD
The MP45DT02 has an acoustic overload point of
120 dBSPL with a best on the market 61 dB
signal-to-noise ratio and -26 dB sensitivity.
Features
•
•
•
•
•
•
•
Single supply voltage
Low power consumption
120 dBSPL acoustic overload point
Omnidirectional sensitivity
PDM single-bit output with option for stereo
configuration
HLGA package (SMD-compliant) plastic or
metal
®
ECOPACK , RoHS, and “Green” compliant
The MP45DT02 is available in an SMD-compliant
metal (M) or plastic package and is guaranteed to
operate over an extended temperature range
from -30 °C to +85 °C.
The MP45DT02’s digital output and package size
(1.25 mm thick) make this device the best
solution for laptop and portable computing
applications.
Table 1: Device summary
Applications
•
•
•
•
•
•
•
•
•
Mobile terminals
Laptop and notebook computers
Portable media players
VoIP
Speech recognition
A/V eLearning devices
Gaming and virtual reality input devices
Digital still and video cameras
Antitheft systems
January 2016
Order code
Temp. range [°C]
Package
Packing
MP45DT02
-30 to +85
HLGA
4.72x3.76 6LD
Tray
MP45DT02TR
-30 to +85
HLGA
4.72x3.76 6LD
Tape and reel
MP45DT02TR-M
-30 to +85
HLGA
4.72x3.76 6LD
Tape and reel
DocID018658 Rev 8
This is information on a product in full production.
1/15
www.st.com
Contents
MP45DT02
Contents
1
Pin description ................................................................................ 3
2
Acoustic and electrical specifications ........................................... 4
2.1
Acoustic and electrical characteristics............................................... 4
2.2
Timing characteristics ....................................................................... 5
2.3
Frequency response ......................................................................... 6
3
Sensing element .............................................................................. 7
4
5
Absolute maximum ratings............................................................. 8
Functionality .................................................................................... 9
5.1
L/R channel selection ........................................................................ 9
6
Application recommendations ..................................................... 10
7
Package information ..................................................................... 11
8
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7.1
Soldering information ...................................................................... 11
7.2
HLGA (4.72 x 3.76 mm) 6L (plastic) package information ............... 12
7.3
HLGA (4.72 x 3.76 mm) 6L (metal) package information ................ 13
Revision history ............................................................................ 14
DocID018658 Rev 8
MP45DT02
1
Pin description
Pin description
Figure 1: Pin connections
Vdd
6
1
GND
DOUT
55
2
LR
CLK
44
33
GND
( BO T T OM V I EW )
Table 2: Pin description
Pin n°
Pin
name
1
GND
2
LR
3
GND
0 V supply
4
CLK
Synchronization input clock
5
DOUT
Left/right PDM data output
6
Vdd
Function
0 V supply
Left/right channel selection;
MIC1 LR is connected to GND or Vdd and MIC2 LR is connected to Vdd or GND
(see Figure 5: "MP45DT02 electrical connections for stereo configuration")
Power supply
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Acoustic and electrical specifications
MP45DT02
2
Acoustic and electrical specifications
2.1
Acoustic and electrical characteristics
The values listed in the table below are specified for Vdd = 1.8 V, Clock = 2.4 MHz,
T = 25 °C, unless otherwise noted.
Table 3: Acoustic and electrical characteristics
Symbol
Test
condition
Parameter
Vdd
Supply voltage
Idd
Current consumption in
normal mode
IddPdn
Current consumption in
(2)
power-down mode
Scc
Short-circuit current
AOP
Acoustic overload point
So
Min.
Typ.
1.64
1.8
No load on
data line
(1)
Max.
Unit
3.6
V
0.65
mA
20
µA
1
10
120
Sensitivity
-29
-26
mA
dBSPL
-23
dBFS
SNR
Signal-to-noise ratio
A-weighted
@1 kHz, 1 Pa
61
dB
PSR
Power supply rejection
Guaranteed by
(3)
design
-70
dBFS
Clock
Input clock frequency
(4)
1
3.25
MHz
10
ms
-30
+85
°C
Guaranteed by
design
(5)
2.4
TWK
Wake-up time
Top
Operating temperature
range
VIOL
Low level logic
input/output voltage
Iout = 1 mA
-0.3
0.35xVdd
V
VIOH
High level logic
input/output voltage
Iout = 1 mA
0.65xVdd
Vdd+0.3
V
Notes:
(1)
(2)
(3)
(4)
(5)
Typical specifications are not guaranteed.
Input clock in static mode.
Test signal: 217 Hz square wave, 100 mVpp on Vdd pin.
Duty cycle: min = 40% max = 60%.
Time from the first clock edge to valid output data.
Table 4: Distortion specifications
4/15
Parameter
Test condition
Value
Distortion
100 dBSPL (50 Hz - 4 kHz)
< 1% THD + N
Distortion
115 dBSPL (1 kHz)
< 5% THD + N
DocID018658 Rev 8
MP45DT02
2.2
Acoustic and electrical specifications
Timing characteristics
Table 5: Timing characteristics
Parameter
Description
fCLK
Clock frequency for normal mode
fPD
Clock frequency for power-down mode
TCLK
TR,EN
TR,DIS
TL,EN
TL,DIS
Clock period for normal mode
Data enabled on DATA line, L/R pin = 1
Min
Max
Unit
1
3.25
MHz
0.23
MHz
1000
ns
308
30
(1)
Data disabled on DATA line, L/R pin = 1
Data enabled on DATA line, L/R pin = 0
Data disabled on DATA line, L/R pin = 0
30
ns
16
(1)(2)
16
(1)(2)
(1)
ns
ns
ns
Notes:
(1)
(2)
From design simulations
In order to measure the disable time, a 1 kΩ pull-down resistor must be added to the DOUT pin.
Figure 2: Timing waveforms
DocID018658 Rev 8
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Acoustic and electrical specifications
2.3
MP45DT02
Frequency response
Figure 3: Typical frequency response normalized at 1 kHz
6/15
DocID018658 Rev 8
MP45DT02
3
Sensing element
Sensing element
The sensing element shall mean the acoustic sensor consisting of a conductive movable
plate and a fixed plate placed in a tiny silicon chip. This sensor transduces the sound
pressure into the changes of coupled capacity between those two plates.
Omron Corporation supplies this element for STMicroelectronics.
DocID018658 Rev 8
7/15
Absolute maximum ratings
4
MP45DT02
Absolute maximum ratings
Stresses above those listed as “absolute maximum ratings” may cause permanent damage
to the device. This is a stress rating only and functional operation of the device under these
conditions is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.
Table 6: Absolute maximum ratings
Symbol
8/15
Ratings
Vdd
Supply voltage
Vin
Input voltage on any control pin
TSTG
Storage temperature range
ESD
Electrostatic discharge protection
DocID018658 Rev 8
Maximum value
Unit
-0.3 to 6
V
-0.3 to Vdd +0.3
V
-40 to +125
°C
2 (HBM)
kV
MP45DT02
Functionality
5
Functionality
5.1
L/R channel selection
The L/R digital pad lets the user select the DOUT signal pattern as explained in Table 7:
"L/R channel selection". The L/R pin must be connected to Vdd or GND.
Table 7: L/R channel selection
L/R
CLK low
CLK high
GND
Data valid
High impedence
Vdd
High impedence
Data valid
DocID018658 Rev 8
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Application recommendations
6
MP45DT02
Application recommendations
Figure 4: MP45DT02 electrical connections
Vdd
10 µF
100 nF
1
2
CODEC
Dout
TOP VIEW
L/R
6
5
3
4
C LK
Figure 5: MP45DT02 electrical connections for stereo configuration
Vd d
10 µ F
10 0 n F
MIC 1
MIC 2
D out
Vd d
5
2
4
3
6
D out
5
4
C LK
3
TO P VIE W
2
1
6
TOP VIE W
1
CODEC
Power supply decoupling capacitors (100 nF ceramic, 10 µF ceramic) should be placed as
near as possible to pin 6 of the device (common design practice).
The L/R pin must be connected to Vdd or GND (refer to Table 7: "L/R channel selection").
10/15
DocID018658 Rev 8
MP45DT02
7
Package information
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
®
®
ECOPACK packages, depending on their level of environmental compliance. ECOPACK
specifications, grade definitions and product status are available at: www.st.com.
®
ECOPACK is an ST trademark.
7.1
Soldering information
The HLGA (4.72 x 3.76 x 1.25) mm package is also compliant with the RoHS and “Green”
standards and is qualified for soldering heat resistance according to JEDEC J-STD-020.
Landing pattern and soldering recommendations are available at www.st.com.
Figure 6: Recommended soldering profile limits
Table 8: Recommended soldering profile limits
Description
Average ramp rate
Preheat
Minimum temperature
Maximum temperature
Time (TSMIN to TSMAX)
Ramp-up rate
Parameter
Pb free
TL to TP
3 °C/sec max
TSMIN
TSMAX
tS
150 °C
200 °C
60 sec to 120 sec
TSMAX to TL
Time maintained above liquidus temperature
Liquidus temperature
tL
TL
60 sec to 150 sec
217 °C
Peak temperature
TP
260 °C max
Time within 5 °C of actual peak temperature
20 sec to 40 sec
Ramp-down rate
6 °C/sec max
Time 25 °C (t25 °C) to peak temperature
8 minutes max
DocID018658 Rev 8
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Package information
7.2
MP45DT02
HLGA (4.72 x 3.76 mm) 6L (plastic) package information
Figure 7: HLGA (4.72 x 3.76 mm) 6-lead package outline
N4
A1
Pin 1 indicator
KC
K
C
R1
N3
D2
//
L1
D1
D
N1
E1
KE
E2
E
N2
KD
7*G
1
K
L2
8287552_A
Table 9: HLGA (4.72 x 3.76 mm) 6-lead package mechanical data
mm.
Symbol
Min.
Max.
A1
1.125
1.250
1.375
D1
4.670
4.720
4.770
D2
1.320
R1
0.750
0.840
0.930
E1
3.710
3.760
3.810
E2
1.880
L1
3.200
3.300
3.400
L2
2.250
2.350
2.450
N1
1.550
1.650
1.750
N2
1.075
1.175
1.275
N3
1.350
1.450
1.550
N4
0.865
0.965
1.065
G1
0.810
0.910
1.010
K
12/15
Typ.
0.050
DocID018658 Rev 8
MP45DT02
7.3
Package information
HLGA (4.72 x 3.76 mm) 6L (metal) package information
Figure 8: HLGA (4.72 x 3.76 mm) 6-lead package outline and mechanical data
Dimensions are in millimeter unless otherwise specified
General Tolerance is +/-0.15mm unless otherwise spe cified
OUTER DIMENSIONS
ITEM
L e n g th [L ]
W i d t h [W ]
H e ig h t [ H ]
DIMENSION [mm ]
4 .7 2
3 .7 6
1 .2 5
TOL ERANCE [mm ]
± 0 .1
± 0 .1
± 0 .1
8499123_A
Note: The MEMS microphone metal cap can exhibit some level of variation in color when
the device is subjected to a thermal process.
DocID018658 Rev 8
13/15
Revision history
8
MP45DT02
Revision history
Table 10: Document revision history
14/15
Date
Revision
Changes
28-Mar-2011
1
Initial release
21-Oct-2011
2
Added max. peak temperature TP to
Added min. and max. sensitivity So to Table 3: "Acoustic and
electrical characteristics"
01-Mar-2012
3
Document status promoted from preliminary to production data
Updated SNR to 61 dB ("Description" and Table 3: "Acoustic and
electrical characteristics")
07-May-2012
4
Added VIOL, VIOH to Table 3: "Acoustic and electrical characteristics"
05-Jul-2012
5
Added Section 4: "Sensing element"
21-Mar-2014
6
Added new package "Figure 8: "HLGA (4.72 x 3.76 mm) 6-lead
package outline and mechanical data"
17-Jun-2014
7
Updated "Figure 3: Typical frequency response normalized at 1
kHz"
26-Jan-2016
8
Added footnote concerning disable time to Table 5: "Timing
characteristics"
DocID018658 Rev 8
MP45DT02
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DocID018658 Rev 8
15/15
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Authorized Distributor
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