MAX1983

MAX1983
MAX1983EUT+
RELIABILITY REPORT
FOR
MAX1983EUT+
(MAX1982/MAX1983)
PLASTIC ENCAPSULATED DEVICES
February 8, 2009
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Approved by
Ken Wendel
Quality Assurance
Director, Reliability Engineering
Maxim Integrated Products. All rights reserved.
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MAX1983EUT+
Conclusion
The MAX1983EUT+ successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim"s
continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim"s quality and reliability standards.
Table of Contents
I. ........Device Description
V. ........Quality Assurance Information
II. ........Manufacturing Information
VI. .......Reliability Evaluation
III. .......Packaging Information
IV. .......Die Information
.....Attachments
I. Device Description
A. General
The MAX1982/MAX1983 are low-voltage, low-dropout linear regulators with an external bias supply input. The 5V bias supply drives the gate of the
internal N-channel pass transistor, making these devices ideal for applications that require low-voltage outputs from low-voltage inputs. The MAX1982
delivers 1.2V (±3%) at 300mA from an input voltage of 1.25V to 5.5V. The MAX1983 delivers an adjustable output voltage from 0.8V to 2V. The
MAX1982/MAX1983 include a current-limit and thermal shutdown that protects the regulator in the event of a fault condition. Both devices are offered
in a 6-pin SOT23 package and are specified over the extended (-40°C to +85°C) temperature range.
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MAX1983EUT+
II. Manufacturing Information
A. Description/Function:
Low-Voltage, Low-Dropout Linear Regulators with External Bias Supply
B. Process:
B8
C. Number of Device Transistors:
D. Fabrication Location:
Texas
E. Assembly Location:
Carsem Malaysia, UTL Thailand, Unisem Malaysia
F. Date of Initial Production:
July 26, 2002
III. Packaging Information
A. Package Type:
6-pin SOT23
B. Lead Frame:
Copper
C. Lead Finish:
100% matte Tin
D. Die Attach:
Conductive Epoxy
E. Bondwire:
Gold (1 mil dia.)
F. Mold Material:
Epoxy with silica filler
G. Assembly Diagram:
#05-3801-0014
H. Flammability Rating:
Class UL94-V0
I. Classification of Moisture Sensitivity per
JEDEC standard J-STD-020-C
Level 1
J. Single Layer Theta Jb:
115*°C/W
K. Single Layer Theta Jc:
80°C/W
IV. Die Information
A. Dimensions:
57 X 35 mils
B. Passivation:
Si3N4/SiO2 (Silicon nitride/ Silicon dioxide
C. Interconnect:
Aluminum/Si (Si = 1%)
D. Backside Metallization:
None
E. Minimum Metal Width:
0.8 microns (as drawn)
F. Minimum Metal Spacing:
0.8 microns (as drawn)
G. Bondpad Dimensions:
5 mil. Sq.
H. Isolation Dielectric:
SiO2
I. Die Separation Method:
Wafer Saw
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MAX1983EUT+
V. Quality Assurance Information
A. Quality Assurance Contacts:
Ken Wendel (Director, Reliability Engineering)
Bryan Preeshl (Managing Director of QA)
B. Outgoing Inspection Level:
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate:
< 50 ppm
D. Sampling Plan:
Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure Rate ( ) is calculated as
follows:
=
1
MTTF
=
1.83
192 x 4340 x 140 x 2
(Chi square value for MTTF upper limit)
(where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV)
-9
= 7.7 x 10
= 7.7 F.I.T. (60% confidence level @ 25°C)
The following failure rate represents data collected from Maxim’s reliability monitor program. Maxim performs
quarterly 1000 hour life test monitors on its processes. This data is published in the Product Reliability Report found at
http://www.maxim-ic.com/. Current monitor data for the B8 Process results in a FIT Rate of 2.71 @ 25C and 17.30 @ 55C
(0.8 eV, 60% UCL)
B. Moisture Resistance Tests
The industry standard 85°C/85%RH or HAST testing is monitored per device process once a quarter.
C. E.S.D. and Latch-Up Testing
The PD19-1 die type has been found to have all pins able to withstand a HBM transient pulse of +/-1000 V per Mil-Std 883
Method 3015.7. Latch-Up testing has shown that this device withstands a current of +/-250 mA.
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MAX1983EUT+
Table 1
Reliability Evaluation Test Results
MAX1983EUT+
TEST ITEM
TEST CONDITION
Static Life Test (Note 1)
Ta = 135°C
Biased
FAILURE
IDENTIFICATION
SAMPLE SIZE
NUMBER OF
FAILURES
DC Parameters
& functionality
140
0
DC Parameters
& functionality
77
0
DC Parameters
& functionality
77
0
Time = 192 hrs.
Moisture Testing (Note 2)
85/85
Ta = 85°C
RH = 85%
Biased
Time = 1000hrs.
Mechanical Stress (Note 2)
Temperature
-65°C/150°C
Cycle
1000 Cycles
Method 1010
Note 1: Life Test Data may represent plastic DIP qualification lots.
Note 2: Generic Package/Process data
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