Contents
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
14.
15.
16.
17.
18.
Revision History
General Specification
Module Coding System
Interface Pin Function
Outline dimension & Block Diagram
Function Description
Character Generator ROM Pattern
Instruction Table
Timing Characteristics
Initializing of LCM
Optical Characteristics
Absolute Maximum Ratings
Electrical Characteristics
Backlight Information
Reliability
Inspection specification
Precautions in use of LCD Modules
Material List of Components for RoHs
Page
3
4
5
6
7
8
11
12
13
15
17
18
18
19
20
21
25
26
1. Revision History
DATE
VERSION
2009/12/23
1
REVISED PAGE NO.
Note
First issue
2. General Specification
The Features is described as follow:
„
Module dimension: 59.0 x 29.3 x 5.5 (max.) mm 3
„
View area: 52.0 x 15.0 mm 2
„
Acti ve area: 46.7 x 9.84 mm 2
„
Number of Characters: 16 characters x 2 Lines
„
Dot size: 0.45 x 0.54 mm 2
„
Dot pitch: 0.50 x 0.59 mm 2
„
Character size: 2.45 x 4.67 mm 2
„
Character pitch: 2.95 x 5.17 mm 2
„
LCD type: STN, Positive, Yellow Green, Transflective
„
Duty: 1/16
„
View direction:6 o’clock
„
Backlight Type: LED Yellow green
Midas LCD Part Number System
MC COG 132033
1
2
3
A
4
*
5
6
6
W
7
*
8
*
9
-
S N T
L W * *
10 11 12 13 14 15 16
1
=
MC: Midas Components
2
=
Blank: COB (chip on board) COG: chip on glass
3
=
No of dots
4
=
Series
5
=
Series Variant:
A to Z
6
=
3: 3 o’clock
6: 6 o’clock
7
=
S: Normal (0 to + 50 deg C) W: Wide temp. (-20 to + 70 deg C) X: Extended temp (-30 + 80 Deg C)
8
=
Character Set
(e.g. 240064 = 240 x 64 dots)
(e.g. 21605 = 2 x 16 5mm C.H.)
12: 12 o’clock
9: 9 o’clock
Blank: Standard (English/Japanese)
C: Chinese Simplified (Graphic Displays only)
CB: Chinese Big 5 (Graphic Displays only)
H: Hebrew
K: European (std) (English/German/French/Greek)
L: English/Japanese (special)
M: European (English/Scandinavian)
R: Cyrillic
W: European (English/Greek)
U: European (English/Scandinavian/Icelandic)
9
=
Bezel Height (where applicable / available)
Top of Bezel to Top
of PCB
Blank
2
3
4
5
6
7
8
9
A
B
9.5mm / not
applicable
8.9 mm
7.8 mm
7.8 mm
9.5 mm
7 mm
7 mm
6.4 mm
6.4 mm
5.5 mm
5.5 mm
Common
(via pins 1
and 2)
Array
or Edge
Lit
Common
Array
Common
Separate
Common
Separate
Common
Separate
Common
Separate
Common
Separate
Array
Array
Array
Array
Array
Array
Edge
Edge
Edge
Edge
10
=
T: TN S: STN B: STN Blue G: STN Grey F: FSTN F2: FFSTN
11
=
P: Positive N: Negative
12
=
R: Reflective M: Transmissive T: Transflective
13
=
Backlight: Blank: Reflective L: LED
14
=
Backlight Colour: Y: Yellow-Green W: White B: Blue R: Red A: Amber O: Orange G: Green RGB: R.G.B.
15
=
Driver Chip:
16
=
Voltage Variant: e.g. 3 = 3v
Blank: Standard
I: I2C
4. Interface Pin Function
Pin #
Symbol
Level
Description
1
VLED-
─
Power supply for B/L(-)
2
VSS
0V
Ground
3
VDD
5.0V
4
Vo
5
RS
H/L
H: DATA, L: Instruction code
6
R/W
H/L
H: Read(MPU→Module) L: Write(MPU→Module)
7
E
H/L
Chip enable signal
8
DB0
H/L
Data bus line
9
DB1
H/L
Data bus line
10
DB2
H/L
Data bus line
11
DB3
H/L
Data bus line
12
DB4
H/L
Data bus line
13
DB5
H/L
Data bus line
14
DB6
H/L
Data bus line
15
DB7
H/L
Data bus line
16
$
Supply Voltage for logic
(Variable) Operating voltage for LCD
─ 3RZHUVXSSO\IRU%/
5. Outline Dimension & Block Diagram
59㊣
0.5
56.3( VA) (FRA ME)
1.35
52 .0(V A)
3.5
4.5
50.0
4 6.7(A A)
8.0
1.5
0.4
16
27.8
9.84(AA)
15.0(VA)
29.3㊣0 .5
2-R1.2 5
P 1.27*1 5=19.05
1
10.58
3.3
5.8
26.0
19.4(V A)(FRAM E)
21.5
1.6
6.15
3 .1
0.5
5.5MA X
LED B/L
VLED VS S
VD D
VO
RS
R/W
E
DB0
DB1
DB2
DB3
DB4
DB5
DB6
DB7
A
0.54
4.67
0.59
2 .45
0.5
0.45
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
0.5
The non-spec ifie d tolerance of dimension is ㊣0.3 mm .
DO T SIZE
SC ALE 10/1
VR
10K~20K
Controller/Com Driver
ST 7066
or
Equivalent
Vdd
Vo
Vss
Vee
External contrast adjustment.
Bias and
Power Circuit
80 series
or
68 series
Com1~16
N.V.
Generator
MPU
RS
R/W
E
DB0~DB7
Optional
16X2 LCD
Seg1~ 40
Seg41~80
D
M
CL1
CL2
Vdd,Vss,V1~V5
Seg Driver
6. Function Description
The LCD display Module is built in a LSI controller, the controller has two 8-bit registers, an
instruction register (IR) and a data register (DR).
The IR stores instruction codes, such as display clear and cursor shift, and address
information for display data RAM (DDRAM) and character generator (CGRAM). The IR can
only be written from the MPU. The DR temporarily stores data to be written or read from
DDRAM or CGR AM. When address information is written into the IR, then data is stored into
the DR from DDRAM or CGRAM. By the register selector (RS) signal, these two registers
can be selected.
RS
0
R/W
Operation
0 IR write as an internal operation (display clear, etc.)
0
1
Read busy flag (DB7) and address counter (DB0 to DB7)
1
0
Write data to DDRAM or CGR AM (DR to DDRAM or CGRAM)
1
1
Read data from DDRAM or CGR AM (DDRAM or CGRAM to DR)
Busy Flag (BF)
When the busy flag is 1, the controller LSI is in the internal operation mode, and the next
instruction will not be accepted. When RS=0 and R/W=1, the busy flag is output to DB7.
The next instruction must be written after ensuring that the busy flag is 0.
Address Counter (AC)
The address counter (AC) assigns addresses to both DDRAM and CGRAM.
Displa y Data RAM (DDRAM)
This DDRAM is used to store the display data represented in 8-bit character codes. Its
extended capacity is 80×8 bits or 80 characters. Below figure is the relationships between
DDRAM addresses and positions on the liquid crystal display.
High bits
Low bits
Example: DDRAM addresses 4E
AC
(hexadecimal)
AC6 AC5 AC4 AC3 AC2 AC1 AC0
100
1110
Display position DDRAM address
1
2
3
4
5
6
7
8
9
10
11
12
13 14
15
16
00 01 02 03 04 05 06 07 08 09 0A 0B 0C 0D 0E 0F
40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4E 4F
2-Line by 16-Character Display
Character Generator ROM (CGROM)
The CGROM generate 5×8 dot or 5×10 dot character patterns from 8-bit character codes.
See Table 2.
Character Generator RAM (CGRAM)
In CGRAM, the user can rewrite character by program. For 5×8 dots, eight character
patterns can be written, and for 5×10 dots, four character patterns can be written.
Write into DDRAM the character code at the addresses shown as the left column of table 1.
To show the character patterns stored in CGRAM.
Relationship between CGRAM Addresses, Character Codes (DDRAM) and Character
patterns.
Table 1.
F o r 5 * 8 d o t ch a r a c te r p att e r n s
C h a r a c te r C o d e s
( D D RA M da ta )
7
6
5
4
3
H ig h
0
0
0
0
0
0
0
0
0
2
1
0
Low
0
0
0
*
*
*
0
0
1
0
0
1
C h a r a c te r P a tte r n s
( C G R A M da t a )
C G R A M Ad d res s
5
4
3
2
1
0
0
1
1
Low
0 0
0 0
0 1
0 1
0 0 0 1 0
1 0
1 1
1 1
0 0
0 0
0 1
0 1
0 0 1 1 0
1 0
1 1
1 1
0 0
0 0
7
H ig h
1
1
1
1
1
1
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
0
1
1
0
1
0
1
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
6
5
H ig h
* *
* *
* *
* *
* *
* *
* *
* *
* *
* *
* *
* *
* *
* *
* *
* *
* *
*
4
3
2
1
0
L ow
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
C h a r a c te r
p a tt e r n ( 1 )
0
0
0
0
0
0
0
C u r s o r p a tte r n
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
C h a r a c te r
p a tt e r n ( 2 )
C u r s o r p a tte r n
*
F o r 5 * 1 0 d o t ch a r a c t e r p a tte r n s
C h a r a c te r C o d e s
( D D RA M da ta )
7
6
5
4
3
H ig h
0
0
0
2
1
0
Low
0
*
0
0
C h a r a c te r P a tte r n s
( C G R A M da t a )
C G R A M Ad d res s
5
4
3
H ig h
0
: " H ig h "
0
2
1
0
7
Low
0
6
5
4
3
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
*
*
*
H ig h
2
Low
0
0
0
0
0
0
0
0
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
0
1
1
0
0
1
1
0
0
1
0
1
0
1
0
1
0
1
0
1
0
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
*
0
0
0
0
0
0
0
1
1
1
1
*
*
*
*
*
0
0
0
C h a r a c te r
p a tt e r n
C u r s o r p a tte r n
7. Character Generator ROM Pattern
Table.2
U pper
4 bit
L ow er
4 b it
LLL L LL LH L LHL LLH H LH LL L HL H LH HL LH HH HLL L HL LH H LHL HLH H HH LL H HLH H HHL HH HH
LLLL
CG
RAM
(1)
LLLH
CG
RAM
(2)
LLHL
CG
RAM
(3)
LLHH
CG
RAM
(4)
LHLL
CG
RAM
(5)
LHLH
CG
RAM
(6)
LHHL
CG
RAM
(7)
LHHH
CG
RAM
(8)
HLLL
CG
RAM
(1)
HLLH
CG
RAM
(2)
HLHL
CG
RAM
(3)
HLHH
CG
RAM
(4)
HHLL
CG
RAM
(5)
HHLH
CG
RAM
(6)
HHHL
CG
RAM
(7)
HHHH
CG
RAM
(8)
8. Instruction Table
Instruction Code
Instruction
Description
RS R/W DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
Clear
Display
0
0
0
0
0
0
0
0
1
Set DDRAM address to “00H” from
AC and return curs or to its original
-
position if shifted. The contents of
DDRAM are not changed.
Return
Home
0
0
0
0
0
0
0
0
1
Entry Mode
Set
0
0
0
0
0
0
0
1
I/D
Display
ON/OFF
Control
0
0
0
0
0
0
1
D
C
SH
Assign cursor moving direction and
enable the shift of entire display.
1.53ms
1.53ms
39µs
Set display (D), cursor (C), and
B blinki ng of c ursor (B) on/off control
39µs
bit.
Cursor or
0
Display Shift
Function
Set
Write “00H” to DDRAM and set
DDRAM address to “00H” from AC
0
Execution time
(fosc=270Khz)
0
Set CGRAM
0
Address
Set DDRAM
0
Address
Set c ursor moving and display s hift
0
0
0
0
1
S/C R/L
-
- control bit, and the direc tion, without
39µs
changing of DDRAM data.
0
0
0
0
0
1
0
1
DL
N
F
-
Set interfac e data length
(DL:8-bit/4-bit), numbers of displ ay
-
line (N:2-line/1-line)and, display font
type (F:5×11 dots/5× 8 dots)
Set CGRAM address in address
counter.
Set DDRAM address i n address
AC6 AC5 AC4 AC3 AC2 AC1 AC0
counter.
1
AC5 AC4 AC3 AC2 AC1 AC0
Whether during internal operation or
not c an be known by reading BF.
AC6 AC5 AC4 AC3 AC2 AC1 AC0
The contents of address counter can
also be read.
39µs
39µs
39µs
Read Busy
Flag and
Address
0
1
BF
Write Data
to RAM
1
0
D7
D6
D5
D4
D3
D2
D1
D0
Write data i nto inter nal RAM
(DDRAM/CGRAM).
43µs
Read Data
from RAM
1
1
D7
D6
D5
D4
D3
D2
D1
D0
Read data from internal RAM
(DDRAM/CGRAM).
43µs
0µs
* ”-”:don’t care
9. Timing Characteristics
9.1
Write Operation
Ta=25℃, VDD=2.7V
Item
Symbol
Min
Typ
Ma x
Unit
TC
1200
-
-
ns
TPW
460
-
-
ns
TR,TF
-
-
25
ns
Address set-up time (RS, R/W to
E)
tAS
0
-
-
ns
Address hold time
tAH
10
-
-
ns
Data set-up time
tDSW
80
-
-
ns
tH
10
-
-
ns
Enable cycle time
Enable pulse width (high level)
Enable rise/fall time
Data hold time
9.2
Read Operation
Ta=25℃, VDD=2.7V
Item
Symbol
Min
Typ
Ma x
Unit
TC
1200
-
-
ns
TPW
480
-
-
ns
TR,TF
-
-
25
ns
tAS
0
-
-
Address hold time
tAH
10
-
-
ns
Data delay time
tDDR
-
-
320
ns
Data hold time
tH
10
-
-
ns
Enable cycle time
Enable pulse width (high level)
Enable rise/fall time
Address set-up time (RS, R/W to
E)
ns
10. Initializing of LCM
11. Optical Characteristics
Item
View Angle
Symbol
Condition
Min
Typ
Max
Unit
(V)θ
CR≧2
20
-
40
deg
(H)φ
CR≧2
-30
-
30
deg
CR
-
-
3
-
-
T rise
25℃
-
260
-
ms
T fall
25℃
-
280
-
ms
T rise
70℃
-
160
-
ms
T fall
70℃
-
175
-
ms
T rise
-20℃
-
3400
-
ms
T fall
-20℃
-
3500
-
ms
Contrast Ratio
Response Time
Definition of Operation Voltage (Vop)
Definition of Response Time ( Tr , Tf )
Non-selected
Conition
Intensity
100%
Selected Wave
Selected Conition
Non-selected
Conition
Intensity
Non-selected Wave
10%
Cr Max
Cr = Lon / Loff
Vop
90%
100%
Tr
Driving Voltage(V)
Tf
[positive type]
[positive type]
Conditions :
Operating Voltage : Vop
Viewing Angle(θ,φ) : 0°, 0°
Frame Frequency : 64 HZ Driving Waveform : 1/N duty , 1/a bias
Definition of view ing angle(CR≧ 2)
θb
θf
θl
φ = 1 8 0°
θr
φ = 90°
φ = 2 7 0°
φ = 0°
12. Absolute Maximum Ratings
Item
Symbol
Min
Typ
Max
Unit
Operating Temperature
TOP
-20
-
+70
℃
Storage Temperature
TST
-30
-
+80
℃
VI
VSS
-
VDD
V
Supply Voltage For Logic
VDD-VSS
-0.3
-
7
V
Supply Voltage For LCD
VDD-V0
-0.3
-
13
V
Input Voltage
13. Electrical Characteristics
Item
Supply Voltage For
Logic
Supply Voltage For LCD
Symbol
Condition
Min
Typ
Max
Unit
VDD-VSS
-
4.5
5.0
5.5
V
Ta=-20℃
─
─
─
V
Ta=25℃
─
3.8
─
V
Ta=70℃
─
─
─
V
VDD-V0
Input High Volt.
VIH
-
0.7VDD
-
VDD
V
Input Low Volt.
VIL
-
Vss
-
0.6
V
Output High Volt.
VOH
-
3.9
-
-
V
Output Low Volt.
VOL
-
-
-
0.4
V
Supply Current
IDD
VDD=5V
-
1.5
mA
1.2
14. Backlight Information
Specification
PARAMETER SYMBOL MIN
TYP
MAX
UNIT
TEST
Supply Current
ILED
─
40
─
mA
Supply Voltage
V
-
4.2
4.6
V
-
-
-
8
V
-
21
-
Reverse Voltage VR
Luminous
IV
Intensity
CONDITION
V=4.2V
CD/M2 ILED=40mA
Wave Length
λp
─
570
-
nm
ILED=40mA
Life Time
-
-
100k
-
Hr.
V≦4.2V
Color
Yellow Green
Note: The LED of B/L is drive by current only, drive voltage is for reference only.
drive voltage can make driving current under safety area (current between
minimum and maximum).
Drive from pin1,pin16
pin16
pin1
R
R
A
B/L
K
LCM
(Will never get Vee output from pin16)
15. Reliability
Content of Reliability Test (wide temperature, -20℃ ~70℃)
Environmental Test
Test Item
High Temperature storage
Low Temperature storage
High Temperature Operation
Low Temperature Operation
High Temperature/
Humidity Operation
Content of Test
Condition
Endurance test applying the high storage temperature for a long 80℃
time.
200hrs
Endurance test applying the high storage temperature for a long -30℃
time.
200hrs
Endurance test apply ing the electric stress (Voltage & Current) 70℃
and the thermal stress to the element f or a long time.
Endurance test
applying the electric
stress
200hrs
under
low -20℃
temperature f or a long time.
200hrs
The module should be allowed to stand at 60℃,90%RH max
For 96hrs under no-load condition excluding the polarizer,
Then taking it out and drying it at normal temperature.
60℃ ,90%RH
96hrs
Note
2
1,2
1
1,2
The sample should be allowed stand the f ollowing 10 cycles of
operation
-20℃
25℃
70℃
Thermal shock resistance
-20℃ /70℃
10 cycles
30min
5min
-
30min
1 cycle
fixed
amplitude:
15mm
Vibration.
Frequency:
Vibration test
Endurance test apply ing the v ibration during transportation and 10~55Hz.
using.
One cycle 60
3
seconds to 3
directions of
X,Y,Z for
Each 15
minutes
VS=800V,RS=
Static electricity test
Endurance test apply ing the electric stress to the terminal.
1.5kΩ
CS=100pF
——
1 time
Note1: No dew condensation to be observed.
Note2: The function test shall be conducted after 4 hours storage at the normal temperature and humidity
after remove from the test chamber.
Note3: Vibration test w ill be conducted to the product itself without putting it in a container.
16. Inspection specification
NO
Item
01
Electrical
Testing
02
Black or
white spots
on LCD
(display only)
Criterion
1.1 Missing vertical, horizontal segment, segment contrast
defect.
1.2 Missing character, dot or icon.
1.3 Display malfunction.
1.4 No function or no display.
1.5 Current consumption exceeds product specifications.
1.6 LCD viewing angle defect.
1.7 Mi xed product types.
1.8 Contrast defect.
2.1 White and black spots on display ≦0.25mm, no more
than three white or black spots present.
2.2 Densely spaced: No more than two spots or lines within
3mm
AQL
0.65
2.5
3.1 Round type : As following drawing
Φ=( x + y ) / 2
2.5
03
04
LCD black
spots, white
spots,
contaminatio
n
(non-display)
Polarizer
bubbles
3.2 Line type : (As following drawing)
Length
Width
---
W≦0.02
L≦3.0
L≦2.5
---
0.02<W≦0.03
0.03<W≦0.05
0.05<W
If bubbles are visible,
judge using black spot
specifications, not
easy to find, must
check in specify
direction.
Size Φ
Φ≦0.20
0.20<Φ≦0.50
0.50<Φ≦1.00
1.00<Φ
Total Q TY
Acceptable Q
TY
Accept no
dense
2.5
2
As round type
Acceptable Q
TY
Accept no
dense
3
2
0
3
2.5
NO
05
Item
Scratches
Criterion
Follow NO.3 LCD black spots, white spots, contamination
AQL
Symbols Define:
x: Chip length
y: Chip width
z: Chip thickness
k: Seal width
t: Glass thickness a: LCD side length
L: Electrode pad length:
6.1 General glass chip :
6.1.1 Chip on panel surface and crack between panels:
06
Chipped
glass
z: Chip thickness
Z≦1/2t
y: Chip width
x: Chip length
Not over viewing
x≦1/8a
area
Not exceed 1/3k
1/2t<z≦2t
x≦1/8a
☉If there are 2 or more chips, x is total length of each chip.
6.1.2 Corner crack:
z: Chip thickness
Z≦1/2t
y: Chip width
x: Chip length
Not over viewing
x≦1/8a
area
Not exceed 1/3k
1/2t<z≦2t
x≦1/8a
☉If there are 2 or more chips, x is the total length of each chip.
2.5
NO
Item
Criterion
AQL
Symbols :
x: Chip length
y: Chip width
z: Chip thickness
k: Seal width
t: Glass thickness a: LCD side length
L: Electrode pad length
6.2 Protrusion over terminal :
6.2.1 Chip on electrode pad :
y: Chip width
x: Chip length
y≦0.5mm
x≦1/8a
6.2.2 Non-conductive portion:
06
z: Chip thickness
0 < z≦ t
Glass
crack
2.5
y: Chip width
x: Chip length
z: Chip
thickness
y≦ L
x≦1/8a
0 < z≦ t
☉If the chipped area touches the ITO terminal, over 2/3 of the
ITO must remain and be inspected according to electrode
terminal specifications.
☉If the product will be heat sealed by the customer, the
alignment mark not be damaged.
6.2.3 Substrate protuberance and internal crack.
y: width
y≦1/3L
x: length
x≦ a
NO
07
08
09
10
Item
Cracked
glass
Backlight
elements
Bezel
PCB、COB
Criterion
AQL
The LCD with extensive crack is not acceptable.
2.5
8.1 Illumination source flickers when lit.
8.2 Spots or scratched that appear when lit must be judged.
Using LCD spot, lines and contamination standards.
8.3 Backlight doesn’t light or color wrong.
0.65
2.5
9.1 Bezel may not have rust, be deformed or have
fingerprints, stains or other contamination.
9.2 Bezel must comply with job specifications.
2.5
0.65
10.1 COB seal may not have pinholes larger than 0.2mm or
contamination.
10.2 COB seal surface may not have pinholes through to the
IC.
10.3 The height of the COB should not exceed the height
indicated in the assembly diagram.
10.4 There may not be more than 2mm of sealant outside
the seal area on the PCB. And there should be no more
than three places.
10.5 No oxidation or contamination PCB terminals.
10.6 Parts on PCB must be the same as on the production
characteristic chart. There should be no wrong parts,
missing parts or excess parts.
10.7 The jumper on the PCB should conform to the product
characteristic chart.
10.8 If solder gets on bezel tab pads, LED pad, zebra pad or
screw hold pad, make sure it is smoothed down.
10.9 The Scraping testing standard for Copper Coating of
PCB
0.65
2.5
2.5
0.65
2.5
2.5
0.65
0.65
2.5
2.5
X
Y
X * Y<=2mm2
2.5
2.5
11
Soldering
2.5
11.1 No un-melted solder paste may be present on the PCB.
0.65
11.2 No cold solder joints, missing solder connections,
oxidation or icicle.
11.3 No residue or solder balls on PCB.
11.4 No short circuits in components on PCB.
NO
12
Item
Criterion
AQL
2.5
General
appearance
12.1 No oxidation, contamination, curves or, bends on
interface Pin (OLB) of TCP.
12.2 No cracks on interface pin (OLB) of TCP.
12.3 No contamination, solder residue or solder balls on
product.
12.4 The IC on the TCP may not be damaged, circuits.
12.5 The uppermost edge of the protective strip on the
interface pin must be present or look as if it causes the
interface pin to sever.
12.6 The residual rosin or tin oil of soldering (component or
chip component) is not burned into brown or black color.
12.7 Sealant on top of the ITO circuit has not hardened.
12.8 Pin type must match type in specification sheet.
12.9 LCD pin loose or missing pins.
12.10 Product packaging must the same as specified on
packaging specification sheet.
12.11 Product dimension and structure must conform to
product specification sheet.
0.65
2.5
2.5
2.5
2.5
2.5
0.65
0.65
0.65
0.65
17. Precautions in use of LCD Modules
1. Avoid applying excessive shocks to the module or making any alterations or modifications
to it.
2. Don’t make extra holes on the printed circuit board, modify its shape or change the
components of LCD module.
3. Don’t disassemble the LCM.
4. Don’t operate it above the absolute maximum rating.
5. Don’t drop, bend or twist LCM.
6. Soldering: only to the I/O terminals.
7. Storage: please storage in anti-static electricity container and clean environment.
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