Intel® Xeon® Processor 5500/5600 Series Thermal/Mechanical Design Guide March 2010

Intel® Xeon® Processor 5500/5600 Series Thermal/Mechanical Design Guide March 2010
Intel® Xeon® Processor 5500/5600
Series
Thermal/Mechanical Design Guide
March 2010
Reference Number: 321323-002
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED,
BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS
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PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or
life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel
reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future
changes to them.
The Intel® Xeon® processor 5500 series, 5600 series and LGA1366 socket may contain design defects or errors known as errata
which may cause the product to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family,
not across different processor families. See http://www.intel.com/products/processor_number for details. Over time processor
numbers will increment based on changes in clock, speed, cache, FSB, or other features, and increments are not intended to
represent proportional or quantitative increases in any particular feature. Current roadmap processor number progression is not
necessarily representative of future roadmaps. See www.intel.com/products/processor_number for details.
Intel® Turbo Boost Technology requires a PC with a processor with Intel Turbo Boost Technology capability. Intel Turbo Boost
Technology performance varies depending on hardware, software and overall system configuration. Check with your PC
manufacturer on whether your system delivers Intel Turbo Boost Technology. For more information, see www.intel.com.
Intel, Xeon, and the Intel logo are trademarks of Intel Corporation in the U.S and other countries.
* Other brands and names may be claimed as the property of others.
Copyright © 2009, Intel Corporation.
2
Thermal/Mechanical Design Guide
Contents
1
Introduction .............................................................................................................. 9
1.1
References ....................................................................................................... 10
1.2
Definition of Terms ............................................................................................ 10
2
LGA1366 Socket ...................................................................................................... 13
2.1
Board Layout .................................................................................................... 15
2.2
Attachment to Motherboard ................................................................................ 16
2.3
Socket Components ........................................................................................... 16
2.3.1 Socket Body Housing .............................................................................. 16
2.3.2 Solder Balls ........................................................................................... 16
2.3.3 Contacts ............................................................................................... 17
2.3.4 Pick and Place Cover............................................................................... 17
2.4
Package Installation / Removal ........................................................................... 18
2.4.1 Socket Standoffs and Package Seating Plane.............................................. 18
2.5
Durability ......................................................................................................... 19
2.6
Markings .......................................................................................................... 19
2.7
Component Insertion Forces ............................................................................... 19
2.8
Socket Size ...................................................................................................... 19
2.9
LGA1366 Socket NCTF Solder Joints..................................................................... 20
3
Independent Loading Mechanism (ILM)................................................................... 21
3.1
Design Concept................................................................................................. 21
3.1.1 ILM Cover Assembly Design Overview ....................................................... 21
3.1.2 ILM Back Plate Design Overview ............................................................... 22
3.2
Assembly of ILM to a Motherboard ....................................................................... 23
4
LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications . 27
4.1
Component Mass............................................................................................... 27
4.2
Package/Socket Stackup Height .......................................................................... 27
4.3
Socket Maximum Temperature ............................................................................ 27
4.4
Loading Specifications........................................................................................ 28
4.5
Electrical Requirements ...................................................................................... 28
4.6
Environmental Requirements .............................................................................. 29
5
Thermal Solutions ................................................................................................... 31
5.1
Performance Targets.......................................................................................... 31
5.1.1 25.5 mm Tall Heatsink ............................................................................ 32
5.2
Heat Pipe Considerations .................................................................................... 33
5.3
Assembly ......................................................................................................... 34
5.3.1 Thermal Interface Material (TIM) .............................................................. 35
5.4
Structural Considerations ................................................................................... 35
5.5
Thermal Design................................................................................................. 35
5.5.1 Thermal Characterization Parameter ......................................................... 35
5.5.2 Dual Thermal Profile ............................................................................... 36
5.6
Thermal Features .............................................................................................. 37
5.6.1 Fan Speed Control .................................................................................. 37
5.6.2 PECI Averaging and Catastrophic Thermal Management............................... 38
5.6.3 Intel® Turbo Boost Technology ................................................................ 39
5.7
Thermal Guidance ............................................................................................. 39
5.7.1 Thermal Excursion Power for Processors with Dual Thermal Profile ................ 39
5.7.2 Thermal Excursion Power for Processors with Single Thermal Profile .............. 40
5.7.3 Absolute Processor Temperature .............................................................. 40
6
Quality and Reliability Requirements ....................................................................... 41
6.1
Test Conditions ................................................................................................. 41
Thermal/Mechanical Design Guide
3
6.2
6.3
Intel Reference Component Validation ..................................................................43
6.2.1 Board Functional Test Sequence ...............................................................43
6.2.2 Post-Test Pass Criteria.............................................................................43
6.2.3 Recommended BIOS/Processor/Memory Test Procedures .............................44
Material and Recycling Requirements....................................................................44
A
Component Suppliers ...............................................................................................45
A.1
Intel Enabled Supplier Information .......................................................................45
A.1.1 Intel Reference Thermal Solution ..............................................................45
A.1.2 Intel Collaboration Thermal Solution..........................................................45
A.1.3 Alternative Thermal Solution ....................................................................46
A.1.4 Socket and ILM Components ....................................................................47
B
Mechanical Drawings ...............................................................................................49
C
Socket Mechanical Drawings ....................................................................................83
D
Heatsink Load Metrology..........................................................................................89
E
Embedded Thermal Solutions ...................................................................................91
E.1
Performance Targets ..........................................................................................91
E.2
Thermal Design Guidelines ..................................................................................92
E.2.1 NEBS Thermal Profile ..............................................................................92
E.2.2 Custom Heat Sinks For UP ATCA ...............................................................93
E.3
Mechanical Drawings and Supplier Information ......................................................96
F
Processor Installation Tool .................................................................................... 101
Figures
1-1
2-1
2-2
2-3
2-4
2-5
2-6
2-7
3-1
3-2
3-3
3-4
4-1
5-1
5-2
5-3
5-4
5-5
6-1
B-1
B-2
B-3
B-4
B-5
B-6
B-7
B-8
4
Intel® Xeon® 5500 Platform Socket Stack............................................................. 9
LGA1366 Socket with Pick and Place Cover Removed..............................................13
LGA1366 Socket Contact Numbering (Top View of Socket) ......................................14
LGA1366 Socket Land Pattern (Top View of Board).................................................15
Attachment to Motherboard.................................................................................16
Pick and Place Cover ..........................................................................................17
Package Installation / Removal Features ...............................................................18
LGA1366 NCTF Solder Joints ...............................................................................20
ILM Cover Assembly...........................................................................................22
Back Plate ........................................................................................................23
ILM Assembly....................................................................................................24
Pin1 and ILM Lever ............................................................................................25
Flow Chart of Knowledge-Based Reliability Evaluation Methodology...........................30
Best-fit Equations ..............................................................................................32
TTV Die Size and Orientation ...............................................................................33
1U Reference Heatsink Assembly .........................................................................34
Processor Thermal Characterization Parameter Relationships ...................................36
Dual Thermal Profile...........................................................................................37
Example Thermal Cycle - Actual profile will vary ....................................................43
Board Keepin / Keepout Zones (Sheet 1 of 4) ........................................................50
Board Keepin / Keepout Zones (Sheet 2 of 4) ........................................................51
Board Keepin / Keepout Zones (Sheet 3 of 4) ........................................................52
Board Keepin / Keepout Zones (Sheet 4 of 4) ........................................................53
1U Reference Heatsink Assembly (Sheet 1 of 2) .....................................................54
1U Reference Heatsink Assembly (Sheet 2 of 2) .....................................................55
1U Reference Heatsink Fin and Base (Sheet 1 of 2) ................................................56
1U Reference Heatsink Fin and Base (Sheet 2 of 2) ................................................57
Thermal/Mechanical Design Guide
B-9
B-10
B-11
B-12
B-13
B-14
B-15
B-16
B-17
B-18
B-19
B-20
B-21
B-22
B-23
B-24
B-25
B-26
B-27
B-28
B-29
B-30
B-31
B-32
C-1
C-2
C-3
C-4
D-1
E-1
E-2
E-3
E-4
E-5
E-6
E-7
E-8
E-9
F-1
Heatsink Shoulder Screw (1U, 2U and Tower) ....................................................... 58
Heatsink Compression Spring (1U, 2U and Tower) ................................................. 59
Heatsink Retaining Ring (1U, 2U and Tower) ......................................................... 60
Heatsink Load Cup (1U, 2U and Tower) ................................................................ 61
2U Collaborative Heatsink Assembly (Sheet 1 of 2) ................................................ 62
2U Collaborative Heatsink Assembly (Sheet 2 of 2) ................................................ 63
2U Collaborative Heatsink Volumetric (Sheet 1 of 2) .............................................. 64
2U Collaborative Heatsink Volumetric (Sheet 2 of 2) .............................................. 65
Tower Collaborative Heatsink Assembly (Sheet 1 of 2) ........................................... 66
Tower Collaborative Heatsink Assembly (Sheet 2 of 2) ........................................... 67
Tower Collaborative Heatsink Volumetric (Sheet 1 of 2).......................................... 68
Tower Collaborative Heatsink Volumetric (Sheet 2 of 2).......................................... 69
1U Reference Heatsink Assembly with TIM (Sheet 1 of 2) ....................................... 70
1U Reference Heatsink Assembly with TIM (Sheet 2 of 2) ....................................... 71
2U Reference Heatsink Assembly with TIM (Sheet 1 of 2) ....................................... 72
2U Reference Heatsink Assembly with TIM (Sheet 2 of 2) ....................................... 73
Tower Reference Heatsink Assembly with TIM (Sheet 1 of 2)................................... 74
Tower Reference Heatsink Assembly with TIM (Sheet 2 of 2)................................... 75
25.5mm Reference Heatsink Assembly (Sheet 1 of 2) ............................................ 76
25.5mm Reference Heatsink Assembly (Sheet 2 of 2) ............................................ 77
25.5mm Reference Heatsink Fin and Base (Sheet 1 of 2) ........................................ 78
25.5mm Reference Heatsink Fin and Base (Sheet 2 of 2) ........................................ 79
25.5mm Reference Heatsink Assembly with TIM (Sheet 1 of 2)................................ 80
25.5mm Reference Heatsink Assembly with TIM (Sheet 2 of 2)................................ 81
Socket Mechanical Drawing (Sheet 1 of 4) ............................................................ 84
Socket Mechanical Drawing (Sheet 2 of 4) ............................................................ 85
Socket Mechanical Drawing (Sheet 3 of 4) ............................................................ 86
Socket Mechanical Drawing (Sheet 4 of 4) ............................................................ 87
Intel Xeon Processor 5500 Series Load Cell Fixture ................................................ 90
ATCA Heatsink Performance Curves ..................................................................... 92
NEBS Thermal Profile ......................................................................................... 93
UP ATCA Thermal Solution .................................................................................. 94
UP ATCA System Layout ..................................................................................... 94
UP ATCA Heat Sink Drawing................................................................................ 95
ATCA Reference Heat Sink Assembly (Sheet 1 of 2) ............................................... 97
ATCA Reference Heat Sink Assembly (Sheet 2 of 2) ............................................... 98
ATCA Reference Heatsink Fin and Base (Sheet 1 of 2) ............................................ 99
ATCA Reference Heatsink Fin and Base (Sheet 2 of 2) .......................................... 100
Processor Installation Tool ................................................................................ 102
Thermal/Mechanical Design Guide
5
Tables
1-1
1-2
4-1
4-2
4-3
4-4
5-1
5-2
5-3
5-4
5-5
6-1
A-1
A-2
A-3
A-4
B-1
C-1
E-1
E-2
E-3
E-4
6
Reference Documents.........................................................................................10
Terms and Descriptions ......................................................................................10
Socket Component Mass .....................................................................................27
1366-land Package and LGA1366 Socket Stackup Height ........................................27
Socket and ILM Mechanical Specifications .............................................................28
Electrical Requirements for LGA1366 Socket..........................................................29
Boundary Conditions and Performance Targets for
Intel® Xeon® Processor 5500 Series ...................................................................31
Boundary Conditions and Performance Targets for
Intel Xeon processor 5600 series .........................................................................31
Performance Expectations for Intel Xeon Processor 5500
Series with 25.5 mm Tall Heatsink .......................................................................32
Fan Speed Control, TCONTROL and DTS Relationship..............................................37
TCONTROL Guidance.............................................................................................38
Heatsink Test Conditions and Qualification Criteria .................................................41
Suppliers for the Intel Reference Thermal Solution .................................................45
Suppliers for the Intel Collaboration Thermal Solution .............................................46
Suppliers for the Alternative Thermal Solution .......................................................46
LGA1366 Socket and ILM Components..................................................................47
Mechanical Drawing List......................................................................................49
Mechanical Drawing List......................................................................................83
Boundary Conditions and Performance Targets for
Intel® Xeon® Processor 5500 Series ...................................................................91
Boundary Conditions and Performance Targets for
Intel® Xeon® Processor 5600 Series ...................................................................91
Embedded Heatsink Component Suppliers.............................................................96
Mechanical Drawings List ....................................................................................96
Thermal/Mechanical Design Guide
Revision History
Document
Number
Revision
Number
321323
321323
Description
Revision
Date
001
Public Release
March 2009
002
Updates / additions in this revision include:
• Changed to reflect addition of Intel® Xeon® Processor 5600 Series
• Figure 1-1: replaced to show ILM load plate with cut out
• Table 1-1: Updated References
• Figures 2-4, 2-5: replaced to show ILM load plate with cut out
• Section 2.3.4: Added Pick_and_Place_Removal_Tool
• Section 3.1.1: fasteners are low carbon steel
• Figures 3-1, 3-3, 3-4: replaced to show ILM load plate with cut out
• Figure 3-2: replaced to show studs without knurled feature
• Section 3.2: Changed torque from 8 ± 2 to 9 ± 1 inch-pounds
• Table 4-3: min static load changed from 106 lbf to 100 lbf
• Table 4-3: clarified Parameter as Target Pick and Place Cover allowable removal
force and updated the force associated with it
• Table 5-1: Changed dP for 2U and Tower heatsink
• Table 5-2: Added Boundary Conditions and Performance Targets for Intel®
Xeon® Processor 5600 Series
March 2010
• Figure 5-1: replaced curves for 1U with equations for 1U, 2U and Tower
• Table 5-3: specified for Intel® Xeon® Processor 5500 Series Processors
• Table 5-3: updated PSIca and dP values
• Figure 5-3: replaced to show ILM load plate with cut out
• Section 5.3: added Fastener sequencing statement (may mitigate against cross
threading).
• Table 5-5: added Tcontrol Guidance for Intel® Xeon® Processor 5600 Series
• Section 5.7: added Thermal Excursion for Intel® Xeon® Processor 5600 Series
• Table 6-1: added reference to Table 5-2 for Intel® Xeon® Processor 5600 Series
• Appendix A: added heatsink info for Intel® Xeon® Processor 5600 Series
• Table A-4, A-5: updated supplier info
• Appendix B: Added Figures B-27 to B-32 for 25.5mm heatsink
• Table E-1: updated PSIca for 60W
• Table E-2: added Boundary Conditions and Performance Targets for Intel®
Xeon® Processor 5600 Series
§
Thermal/Mechanical Design Guide
7
8
Thermal/Mechanical Design Guide
Introduction
1
Introduction
This document provides guidelines for the design of thermal and mechanical solutions
for 2-socket server and 2-socket Workstation processors listed in the Intel® Xeon®
Processor 5500 Series Datasheet, Volume 1 and in the Intel® Xeon® Processor 5600
Series Datasheet, Volume 1. The components described in this document include:
• The processor thermal solution (heatsink) and associated retention hardware.
• The LGA1366 socket and the Independent Loading Mechanism (ILM) and back
plate.
Processors in 1-socket Workstation platforms are covered in the Intel® Core™ i7-900
Desktop Processor Extreme Edition Series and Intel® Core™ i7-900 Desktop Processor
Series, Intel® Xeon® Processor 3500 Series and LGA1366 Socket Thermal / Mechanical
Design Guide.
Figure 1-1.
Intel® Xeon® 5500 Platform Socket Stack
The goals of this document are:
• To assist board and system thermal mechanical designers.
• To assist designers and suppliers of processor heatsinks.
Thermal profiles and other processor specifications are provided in the Datasheet.
Thermal/Mechanical Design Guide
9
Introduction
1.1
References
Material and concepts available in the following documents may be beneficial when
reading this document.
Table 1-1.
Reference Documents
Document
Location
European Blue Angel Recycling Standards
Notes
2
Intel® Xeon® Processor 5500 Series Datasheet, Volume 1
321321
1
Intel® Xeon® Processor 5600 Series Datasheet, Volume 1
323369
1
Intel® Xeon® Processor 5500 Series Mechanical Model
321326
1
Intel® Xeon® Processor 5500 Series Thermal Model
321327
1
Entry-level Electronics Bay Specification
3
Notes:
1.
Document numbers indicated in Location column are subject to change. See the appropriate Electronic
Design Kit (EDK) for the most up-to-date Document number.
2.
Available at http://www.blauer-engel.de
3.
Available at http://ssiforum.org/
1.2
Definition of Terms
Table 1-2.
Terms and Descriptions (Sheet 1 of 2)
Term
Bypass
Bypass is the area between a passive heatsink and any object that can act to form a
duct. For this example, it can be expressed as a dimension away from the outside
dimension of the fins to the nearest surface.
DTS
Digital Thermal Sensor reports a relative die temperature as an offset from TCC
activation temperature.
FSC
Fan Speed Control
IHS
Integrated Heat Spreader: a component of the processor package used to enhance the
thermal performance of the package. Component thermal solutions interface with the
processor at the IHS surface.
ILM
Independent Loading Mechanism provides the force needed to seat the 1366-LGA land
package onto the socket contacts.
LGA1366 socket
The processor mates with the system board through this surface mount, 1366-contact
socket.
PECI
The Platform Environment Control Interface (PECI) is a one-wire interface that provides
a communication channel between Intel processor and chipset components to external
monitoring devices.
CA
CS
SA
10
Description
Case-to-ambient thermal characterization parameter (psi). A measure of thermal
solution performance using total package power. Defined as (TCASE – TLA) / Total
Package Power. Heat source should always be specified for measurements.
Case-to-sink thermal characterization parameter. A measure of thermal interface
material performance using total package power. Defined as (TCASE – TS) / Total
Package Power.
Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal
performance using total package power. Defined as (TS – TLA) / Total Package Power.
TCASE
The case temperature of the processor measured at the geometric center of the topside
of the IHS.
TCASE_MAX
The maximum case temperature as specified in a component specification.
Thermal/Mechanical Design Guide
Introduction
Table 1-2.
Terms and Descriptions (Sheet 2 of 2)
Term
Description
TCC
Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature
by using clock modulation and/or operating frequency and input voltage adjustment
when the die temperature is very near its operating limits.
TCONTROL
TCONTROL is a static value below TCC activation used as a trigger point for fan speed
control.
TDP
Thermal Design Power: Thermal solution should be designed to dissipate this target
power level. TDP is not the maximum power that the processor can dissipate.
Thermal Monitor
A power reduction feature designed to decrease temperature after the processor has
reached its maximum operating temperature.
Thermal Profile
Line that defines case temperature specification of a processor at a given power level.
TIM
Thermal Interface Material: The thermally conductive compound between the heatsink
and the processor case. This material fills the air gaps and voids, and enhances the
transfer of the heat from the processor case to the heatsink.
TLA
The measured ambient temperature locally surrounding the processor. The ambient
temperature should be measured just upstream of a passive heatsink or at the fan inlet
for an active heatsink.
TSA
The system ambient air temperature external to a system chassis. This temperature is
usually measured at the chassis air inlets.
U
A unit of measure used to define server rack spacing height. 1U is equal to 1.75 in, 2U
equals 3.50 in, etc.
§
Thermal/Mechanical Design Guide
11
Introduction
12
Thermal/Mechanical Design Guide
LGA1366 Socket
2
LGA1366 Socket
This chapter describes a surface mount, LGA (Land Grid Array) socket intended for
processors in the Intel® Xeon® 5500 Platform. The socket provides I/O, power and
ground contacts. The socket contains 1366 contacts arrayed about a cavity in the
center of the socket with lead-free solder balls for surface mounting on the
motherboard.
The socket has 1366 contacts with 1.016 mm X 1.016 mm pitch (X by Y) in a
43x41 grid array with 21x17 grid depopulation in the center of the array and selective
depopulation elsewhere.
The socket must be compatible with the package (processor) and the Independent
Loading Mechanism (ILM). The design includes a back plate which is integral to having
a uniform load on the socket solder joints. Socket loading specifications are listed in
Chapter 4.
Figure 2-1.
LGA1366 Socket with Pick and Place Cover Removed
package
socket
cavity
Thermal/Mechanical Design Guide
13
LGA1366 Socket
Figure 2-2.
14
LGA1366 Socket Contact Numbering (Top View of Socket)
Thermal/Mechanical Design Guide
LGA1366 Socket
2.1
Board Layout
The land pattern for the LGA1366 socket is 40 mils X 40 mils (X by Y), and the pad size
is 18 mils. Note that there is no round-off (conversion) error between socket pitch
(1.016 mm) and board pitch (40 mil) as these values are equivalent.
Figure 2-3.
LGA1366 Socket Land Pattern (Top View of Board)
A
C
B
E
D
G
F
J
H
L
K
N
M
R
P
U
T
W
V
AA AC AE AG AJ
Y
AL AN AR AU AW BA
AB AD AF AH AK AM AP AT AV AY
43
42
41
40
39
38
37
36
35
34
33
32
31
32
30
29
31
30
28
27
29
28
26
25
27
26
24
23
25
24
22
21
23
20
22
19
21
20
18
17
19
18
16
15
17
16
14
13
15
14
12
13
12
11
10
9
8
7
6
5
4
3
2
1
A
C
B
Thermal/Mechanical Design Guide
E
D
G
F
J
H
L
K
N
M
R
P
U
T
W
V
AA AC AE AG AJ
Y
AL AN AR AU AW BA
AB AD AF AH AK AM AP AT AV AY
15
LGA1366 Socket
2.2
Attachment to Motherboard
The socket is attached to the motherboard by 1366 solder balls. There are no additional
external methods (that is, screw, extra solder, adhesive, and so on) to attach the
socket.
As indicated in Figure 2-4, the Independent Loading Mechanism (ILM) is not present
during the attach (reflow) process.
Figure 2-4.
Attachment to Motherboard
2.3
Socket Components
The socket has two main components, the socket body and Pick and Place (PnP) cover,
and is delivered as a single integral assembly. Refer to Appendix C for detailed
drawings.
2.3.1
Socket Body Housing
The housing material is thermoplastic or equivalent with UL 94 V-0 flame rating capable
of withstanding 260 °C for 40 seconds (typical reflow/rework). The socket coefficient of
thermal expansion (in the XY plane), and creep properties, must be such that the
integrity of the socket is maintained for the conditions listed in the LGA1366 Socket
Validation Reports.
The color of the housing will be dark as compared to the solder balls to provide the
contrast needed for pick and place vision systems.
2.3.2
Solder Balls
A total of 1366 solder balls corresponding to the contacts are on the bottom of the
socket for surface mounting with the motherboard.
The socket has the following solder ball material:
• Lead free SAC (SnAgCu) solder alloy with a silver (Ag) content between 3% and
4% and a melting temperature of approximately 217 °C. The alloy must be
16
Thermal/Mechanical Design Guide
LGA1366 Socket
compatible with immersion silver (ImAg) motherboard surface finish and a SAC
alloy solder paste.
The co-planarity (profile) and true position requirements are defined in Appendix C.
2.3.3
Contacts
Base material for the contacts is high strength copper alloy.
For the area on socket contacts where processor lands will mate, there is a 0.381 m
[15 inches] minimum gold plating over 1.27 m [50 inches] minimum nickel
underplate.
No contamination by solder in the contact area is allowed during solder reflow.
2.3.4
Pick and Place Cover
The cover provides a planar surface for vacuum pick up used to place components in
the Surface Mount Technology (SMT) manufacturing line. The cover remains on the
socket during reflow to help prevent contamination during reflow. The cover can
withstand 260 °C for 40 seconds (typical reflow/rework profile) and the conditions
listed in the LGA1366 Socket Validation Reports without degrading.
As indicated in Figure 2-5, the cover remains on the socket during ILM installation, and
should remain on whenever possible to help prevent damage to the socket contacts.
Cover retention must be sufficient to support the socket weight during lifting,
translation, and placement (board manufacturing), and during board and system
shipping and handling.
The covers are designed to be interchangeable between socket suppliers. As indicated
in Figure 2-5, a Pin1 indicator on the cover provides a visual reference for proper
orientation with the socket.
See LGA1366_Socket_Pick_and_Place_Removal_Tool_rev2.0 for a drawing of a tool
designed to provide mechanical assistance during cover installation and removal.
Figure 2-5.
Pick and Place Cover
Thermal/Mechanical Design Guide
17
LGA1366 Socket
2.4
Package Installation / Removal
As indicated in Figure 2-6, access is provided to facilitate manual installation and
removal of the package.
To assist in package orientation and alignment with the socket:
• The package Pin1 triangle and the socket Pin1 chamfer provide visual reference for
proper orientation.
• The package substrate has orientation notches along two opposing edges of the
package, offset from the centerline. The socket has two corresponding orientation
posts to physically prevent mis-orientation of the package. These orientation
features also provide initial rough alignment of package to socket.
• The socket has alignment walls at the four corners to provide final alignment of the
package.
See Appendix F for information regarding a tool designed to provide mechanical
assistance during processor installation and removal.
.
Figure 2-6.
Package Installation / Removal Features
orientation
notch
Pin1 triangle
alignment
walls
access
orientation
post
Pin1 chamfer
2.4.1
Socket Standoffs and Package Seating Plane
Standoffs on the bottom of the socket base establish the minimum socket height after
solder reflow and are specified in Appendix C.
Similarly, a seating plane on the topside of the socket establishes the minimum
package height. See Section 4.2 for the calculated IHS height above the motherboard.
18
Thermal/Mechanical Design Guide
LGA1366 Socket
2.5
Durability
The socket must withstand 30 cycles of processor insertion and removal. The max
chain contact resistance from Table 4-4 must be met when mated in the 1st and 30th
cycles.
The socket Pick and Place cover must withstand 15 cycles of insertion and removal.
2.6
Markings
There are three markings on the socket:
• LGA1366: Font type is Helvetica Bold - minimum 6 point (2.125 mm).
• Manufacturer's insignia (font size at supplier's discretion).
• Lot identification code (allows traceability of manufacturing date and location).
All markings must withstand 260°C for 40 seconds (typical reflow/rework profile)
without degrading, and must be visible after the socket is mounted on the
motherboard.
LGA1366 and the manufacturer's insignia are molded or laser marked on the side wall.
2.7
Component Insertion Forces
Any actuation must meet or exceed SEMI S8-95 Safety Guidelines for Ergonomics/
Human Factors Engineering of Semiconductor Manufacturing Equipment, example Table
R2-7 (Maximum Grip Forces). The socket must be designed so that it requires no force
to insert the package into the socket.
2.8
Socket Size
Socket information needed for motherboard design is given in Appendix C.
This information should be used in conjunction with the reference motherboard keepout drawings provided in Appendix B to ensure compatibility with the reference thermal
mechanical components.
Thermal/Mechanical Design Guide
19
LGA1366 Socket
2.9
LGA1366 Socket NCTF Solder Joints
Intel has defined selected solder joints of the socket as non-critical to function (NCTF)
for post environmental testing. The processor signals at NCTF locations are typically
redundant ground or non-critical reserved, so the loss of the solder joint continuity at
end of life conditions will not affect the overall product functionality. Figure 2-7
identifies the NCTF solder joints.
.
Figure 2-7.
LGA1366 NCTF Solder Joints
A
C
B
E
D
G
F
J
H
L
K
N
M
R
P
U
T
W
V
AA AC AE AG AJ
Y
AL AN AR AU AW BA
AB AD AF AH AK AM AP AT AV AY
43
42
41
40
39
38
37
36
35
34
33
32
31
32
30
29
31
30
28
27
29
28
26
25
27
26
24
23
25
24
22
23
21
20
22
19
21
20
18
17
19
18
16
17
16
15
14
13
15
14
12
13
12
11
10
9
8
7
6
5
4
3
2
1
A
C
B
Note:
E
D
G
F
J
H
L
K
N
M
R
P
U
T
W
V
AA AC AE AG AJ AL AN AR AU AW BA
Y
AB AD AF AH AK AM AP AT AV AY
For platforms supporting the DP processor land C3 is CTF.
§
20
Thermal/Mechanical Design Guide
Independent Loading Mechanism (ILM)
3
Independent Loading
Mechanism (ILM)
The Independent Loading Mechanism (ILM) provides the force needed to seat the
1366-LGA land package onto the socket contacts. The ILM is physically separate from
the socket body. The assembly of the ILM to the board is expected to occur after wave
solder. The exact assembly location is dependent on manufacturing preference and test
flow.
Note:
The ILM has two critical functions: deliver the force to seat the processor onto the
socket contacts and distribute the resulting compressive load evenly through the socket
solder joints.
Note:
The mechanical design of the ILM is integral to the overall functionality of the LGA1366
socket. Intel performs detailed studies on integration of processor package, socket and
ILM as a system. These studies directly impact the design of the ILM. The Intel
reference ILM will be “build to print” from Intel controlled drawings. Intel recommends
using the Intel Reference ILM. Custom non-Intel ILM designs do not benefit from Intel's
detailed studies and may not incorporate critical design parameters.
3.1
Design Concept
The ILM consists of two assemblies that will be procured as a set from the enabled
vendors. These two components are ILM cover assembly and back plate.
3.1.1
ILM Cover Assembly Design Overview
The ILM Cover assembly consists of four major pieces: load lever, load plate, frame and
the captive fasteners.
The load lever and load plate are stainless steel. The frame is high carbon steel with
appropriate plating. The fasteners are fabricated from a low carbon steel. The frame
provides the hinge locations for the load lever and load plate.
The cover assembly design ensures that once assembled to the back plate and the load
lever is closed, the only features touching the board are the captive fasteners. The
nominal gap of the frame to the board is ~1 mm when the load plate is closed on the
empty socket or when closed on the processor package.
When closed, the load plate applies two point loads onto the IHS at the “dimpled”
features shown in Figure 3-1. The reaction force from closing the load plate is
transmitted to the frame and through the captive fasteners to the back plate. Some of
the load is passed through the socket body to the board inducing a slight compression
on the solder joints.
Thermal/Mechanical Design Guide
21
Independent Loading Mechanism (ILM)
Figure 3-1.
ILM Cover Assembly
3.1.2
ILM Back Plate Design Overview
The unified back plate for 2-socket server and 2-socket Workstation products consists
of a flat steel back plate with threaded studs for ILM attach, and internally threaded
nuts for heatsink attach. The threaded studs have a smooth surface feature that
provides alignment for the back plate to the motherboard for proper assembly of the
ILM around the socket. A clearance hole is located at the center of the plate to allow
access to test points and backside capacitors. An additional cut-out on two sides
provides clearance for backside voltage regulator components. An insulator is preapplied.
Back plates for processors in 1-socket Workstation platforms are covered in the Intel®
Core™ i7-900 Desktop Processor Extreme Edition Series and Intel® Core™ i7-900
Desktop Processor Series, Intel® Xeon® Processor 3500 Series and LGA1366 Socket
Thermal / Mechanical Design Guide.
22
Thermal/Mechanical Design Guide
Independent Loading Mechanism (ILM)
Figure 3-2.
Back Plate
3.2
Assembly of ILM to a Motherboard
The ILM design allows a bottoms up assembly of the components to the board. In
step 1, (see Figure 3-3), the back plate is placed in a fixture. Holes in the motherboard
provide alignment to the threaded studs. In step 2, the ILM cover assembly is placed
over the socket and threaded studs. Using a T20 Torx* driver fasten the ILM cover
assembly to the back plate with the four captive fasteners. Torque to 9 ± 1 inchpounds. The length of the threaded studs accommodate board thicknesses from
0.062” to 0.100”.
Thermal/Mechanical Design Guide
23
Independent Loading Mechanism (ILM)
.
Figure 3-3.
24
ILM Assembly
Thermal/Mechanical Design Guide
Independent Loading Mechanism (ILM)
As indicated in Figure 3-4, socket protrusion and ILM key features prevent 180-degree
rotation of ILM cover assembly with respect to the socket. The result is a specific Pin 1
orientation with respect to the ILM lever.
Figure 3-4.
Pin1 and ILM Lever
§
Thermal/Mechanical Design Guide
25
Independent Loading Mechanism (ILM)
26
Thermal/Mechanical Design Guide
LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications
4
LGA1366 Socket and ILM
Electrical, Mechanical, and
Environmental Specifications
This chapter describes the electrical, mechanical, and environmental specifications for
the LGA1366 socket and the Independent Loading Mechanism.
4.1
Component Mass
Table 4-1.
Socket Component Mass
Component
Mass
Socket Body, Contacts and PnP Cover
15 gm
ILM Cover
ILM Back Plate for dual processor server products
4.2
43 gm
100 gm
Package/Socket Stackup Height
Table 4-2 provides the stackup height of a processor in the 1366-land LGA package and
LGA1366 socket with the ILM closed and the processor fully seated in the socket.
Table 4-2.
1366-land Package and LGA1366 Socket Stackup Height
Integrated Stackup Height (mm)
From Top of Board to Top of IHS
7.729 ± 0.282 mm
Notes:
1.
This data is provided for information only, and should be derived from: (a) the height of the socket seating
plane above the motherboard after reflow, given in Appendix C, (b) the height of the package, from the
package seating plane to the top of the IHS, and accounting for its nominal variation and tolerances that
are given in the corresponding processor EMTS.
2.
This value is a RSS calculation.
4.3
Socket Maximum Temperature
The power dissipated within the socket is a function of the current at the pin level and
the effective pin resistance. To ensure socket long term reliability, Intel defines socket
maximum temperature using a via on the underside of the motherboard. Exceeding the
temperature guidance may result in socket body deformation, or increases in thermal
and electrical resistance which can cause a thermal runaway and eventual electrical
failure. The guidance for socket maximum temperature is listed below:
• Via temperature under socket < 96 °C
Thermal/Mechanical Design Guide
27
LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications
4.4
Loading Specifications
The socket will be tested against the conditions listed in the LGA1366 Socket Validation
Reports with heatsink and the ILM attached, under the loading conditions outlined in
this chapter.
Table 4-3 provides load specifications for the LGA1366 socket with the ILM installed.
The maximum limits should not be exceeded during heatsink assembly, shipping
conditions, or standard use condition. Exceeding these limits during test may result in
component failure. The socket body should not be used as a mechanical reference or
load-bearing surface for thermal solutions.
Table 4-3.
Socket and ILM Mechanical Specifications
Parameter
Min
Max
Notes
Static compressive load from ILM cover to
processor IHS
445 N [100 lbf]
623 N [140 lbf]
3, 4
Heatsink Static Compressive Load
0 N [0 lbf]
266 N [60 lbf]
1, 2, 3
Total Static Compressive Load
(ILM plus Heatsink)
445 N (100 lbf)
890 N (200 lbf)
3, 4
Dynamic Compressive Load
(with heatsink installed)
N/A
890 N [200 lbf]
1, 3, 5, 6
Target Pick and Place Cover allowable removal
force
N/A
4.45 - 6.68 N [1.0 1.5 lbf]
Load Lever actuation force
N/A
38.3 N [8.6 lbf] in the
vertical direction
10.2 N [2.3 lbf] in the
lateral direction.
Notes:
1.
These specifications apply to uniform compressive loading in a direction perpendicular to the IHS top
surface.
2.
This is the minimum and maximum static force that can be applied by the heatsink and it’s retention
solution to maintain the heatsink to IHS interface. This does not imply the Intel reference TIM is validated
to these limits.
3.
Loading limits are for the LGA1366 socket.
4.
This minimum limit defines the compressive force required to electrically seat the processor onto the socket
contacts.
5.
Dynamic loading is defined as an 11 ms duration average load superimposed on the static load
requirement.
6.
Test condition used a heatsink mass of 550 gm [1.21 lb] with 50 g acceleration measured at heatsink mass.
The dynamic portion of this specification in the product application can have flexibility in specific values, but
the ultimate product of mass times acceleration should not exceed this dynamic load.
4.5
Electrical Requirements
LGA1366 socket electrical requirements are measured from the socket-seating plane of
the processor to the component side of the socket PCB to which it is attached. All
specifications are maximum values (unless otherwise stated) for a single socket
contact, but includes effects of adjacent contacts where indicated.
28
Thermal/Mechanical Design Guide
LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications
Table 4-4.
Electrical Requirements for LGA1366 Socket
Parameter
Value
Comment
<3.9nH
The inductance calculated for two contacts,
considering one forward conductor and one return
conductor. These values must be satisfied at the
worst-case height of the socket.
Mated loop inductance, Loop
Mated partial mutual inductance, L
Maximum mutual capacitance, C.
NA
<1 pF
Socket Average Contact Resistance
(EOL)
15.2 m
Max Individual Contact Resistance
(EOL)
100 m
Bulk Resistance Increase
Dielectric Withstand Voltage
Insulation Resistance
4.6
3m
The inductance on a contact due to any single
neighboring contact.
The capacitance between two contacts
The socket average contact resistance target is
derived from average of every chain contact
resistance for each part used in testing, with a
chain contact resistance defined as the resistance
of each chain minus resistance of shorting bars
divided by number of lands in the daisy chain.
The specification listed is at room temperature
and has to be satisfied at all time.
Socket Contact Resistance: The resistance of
the socket contact, solderball, and interface
resistance to the interposer land.
The specification listed is at room temperature
and has to be satisfied at all time.
Socket Contact Resistance: The resistance of
the socket contact, solderball, and interface
resistance to the interposer land; gaps included.
The bulk resistance increase per contact from
24 °C to 107 °C
360 Volts RMS
800 M
Environmental Requirements
Design, including materials, shall be consistent with the manufacture of units that meet
the following environmental reference points.
The reliability targets in this chapter are based on the expected field use environment
for these products. The test sequence for new sockets will be developed using the
knowledge-based reliability evaluation methodology, which is acceleration factor
dependent. A simplified process flow of this methodology can be seen in Figure 4-1.
Thermal/Mechanical Design Guide
29
LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications
Figure 4-1.
Flow Chart of Knowledge-Based Reliability Evaluation Methodology
Establish the
market/expected use
environment for the
technology
Develop Speculative
stress conditions based on
historical data, content
experts, and literature
search
Freeze stressing
requirements and perform
additional data turns
Perform stressing to
validate accelerated
stressing assumptions and
determine acceleration
factors
A detailed description of this methodology can be found at:
ftp://download.intel.com/technology/itj/q32000/pdf/reliability.pdf.
§
30
Thermal/Mechanical Design Guide
Thermal Solutions
5
Thermal Solutions
This section describes a 1U reference heatsink, design targets for 2U and Tower
heatsinks, performance expectations for a 25.5 mm tall heatsink, and thermal design
guidelines for processors in the Intel® Xeon® 5500 Platform.
5.1
Performance Targets
Values for boundary conditions and performance targets are used to generate
processor thermal specifications and to provide guidance for heatsink design.
Table 5-1.
Boundary Conditions and Performance Targets for Intel® Xeon® Processor
5500 Series
Parameter
Value
Altitude, system
ambient temp
Sea level, 35oC
TDP
60W
80W
95W, Profile B
95W, Profile A
130W, WS9
1
49oC
49oC
49oC
55oC
40oC
0.335oC/W
0.336oC/W
0.337oC/W
0.201oC/W
0.201o C/W
9.7 CFM @
0.20” dP
9.7 CFM @
0.20” dP
9.7 CFM @
0.20” dP
30 CFM @
0.173” dP
30 CFM @
0.173” dP
1U (EEB)
1U (EEB)
1U (EEB) 5
2U (EEB)
Pedestal (EEB)
90 x 90 x 64mm
(2U)6,7
90 x 90 x 99mm
(Tower)6
TLA
CA
2
Airflow
3
System height
(form factor)4
90 x 90 x 27mm (1U)6
Heatsink
volumetric
Heatsink
technology8
Table 5-2.
Cu base, Al fins
Cu/Al base, Al fins with heatpipes
Boundary Conditions and Performance Targets for Intel Xeon processor 5600
series
Parameter
Value
Altitude, system
ambient temp
Sea level, 35oC
TDP
40W
60W
80W
TLA1
CA
CA
95W, Profile B
49oC
95W, Profile A
130W
55oC
53o C
2
(6 core)
n/a
0.340ºC/W
0.340ºC/W
0.340ºC/W
0.200ºC/W
0.196ºC/W
2
(4 core)
0.353ºC/W
n/a
0.357ºC/W
0.357o C/W
0.217oC/W
0.211oC/W
30 CFM @
0.173” dP
35 CFM @
0.214” dP
Airflow3
System height
(form factor)4
Heatsink
volumetric
Heatsink
technology8
9.7 CFM @ 0.20” dP
1U (EEB)
2U (EEB)
90 x 90 x 27mm (1U)6
90 x 90 x 64mm (2U)6,7
Cu base, Al fins
Cu/Al base, Al fins with
heatpipes
Notes:
1. Local ambient temperature of the air entering the heatsink.
2. Max target (mean + 3 sigma + offset) for thermal characterization parameter (Section 5.5.1).
Thermal/Mechanical Design Guide
31
Thermal Solutions
3. Airflow through the heatsink fins with zero bypass. Max target for pressure drop (dP) measured in inches H2O.
4. Reference system configuration. Processor is downstream from memory in EEB (Entry-Level Electronics Bay).
Ducting is utilized to direct airflow.
5. The 1U heatsink can also meet Profile B for the 95W processor in TEB (Thin Electronics Bay) under the
following conditions: TLA = 40ºC, CA = 0.275ºC/W, airflow = 16 CFM @ 0.344” dP (these TEB values are
not used to generate processor thermal specifications). Processor is not downstream from memory in TEB.
Ducting is utilized to direct airflow.
6. Dimensions of heatsink do not include socket or processor.
7. The 2U heatsink height (64mm) + socket/processor height (7.729 mm, Table 4-2) complies with 76.2 mm
max height for EEB monoplanar boards (http://ssiforum.org/).
8. Passive heatsinks. PCM45F thermal interface material.
9. WS = Workstation.
Table 5-1 and Table 5-2 specify CA and pressure drop targets for specific airflows. To
determine CA and pressure drop targets for other airflows, use Best-fit equations in
Figure 5-1. Heatsink detailed drawings are in Appendix B.
Figure 5-1.
Best-fit Equations
5.1.1
25.5 mm Tall Heatsink
For the 25.5 mm tall heatsink, Table 5-3 provides guidance regarding performance
expectations. These values are not used to generate processor thermal specifications.
Table 5-3.
Performance Expectations for Intel Xeon Processor 5500 Series with 25.5 mm
Tall Heatsink
Parameter
Value
Altitude, system
ambient temp
Sea level, 35oC
TDP
95W, Profile B
T LA1
49oC
40oC
0.296oC/W
0.333oC/W
0.278oC/W
3
13.3 CFM @ 0.329” dP
10 CFM @ 0.239” dP
16 CFM @ 0.406” dP
System height
(form factor)4
SSI blade
1U (EEB)
1U (TEB)
CA
2
50oC
Airflow
Heatsink
volumetric
Heatsink
technology6
90 x 90 x 25.5mm (1U)5
Cu base, Al fins
Notes:
1. Local ambient temperature of the air entering the heatsink.
2. Max target (mean + 3 sigma + offset) for thermal characterization parameter (Section 5.5.1).
3. Airflow through the heatsink fins with zero bypass. Max target for pressure drop (dP) measured in inches H2O.
4. Reference system configuration. Processor is downstream from memory in SSI blade and EEB (Entry-Level
Electronics Bay), not in TEB (Thin Electronics Bay). Ducting is utilized to direct airflow.
32
Thermal/Mechanical Design Guide
Thermal Solutions
5. Dimensions of heatsink do not include socket or processor. The 25.5 mm heatsink height + socket/processor
height (7.729 mm, Table 4-2) complies with 33.5mm max height for SSI blade boards
(http://ssiforum.org/).
6. Passive heatsinks. Dow Corning TC-1996 thermal interface material.
5.2
Heat Pipe Considerations
Figure 5-2 shows the orientation and position of the TTV die. The TTV die is sized and
positioned similarly to the processor die.
Figure 5-2.
TTV Die Size and Orientation
45
Figure 1 - Side Views of Package with IHS (not to scale)
Cache
Cache
Cache Cache Cache
Die CL
Package CL
Core
1.0
19.3
NOT TO SCALE
All Dimensions in mm
Thermal/Mechanical Design Guide
33
Thermal Solutions
5.3
Assembly
Figure 5-3.
1U Reference Heatsink Assembly
The assembly process for the 1U reference heatsink begins with application of
Honeywell PCM45F thermal interface material to improve conduction from the IHS.
Tape and roll format is recommended. Pad size is 35 x 35mm, thickness is 0.25mm.
Next, position the heatsink such that the heatsink fins are parallel to system airflow.
While lowering the heatsink onto the IHS, align the four captive screws of the heatsink
to the four threaded nuts of the back plate.
Using a #2 Phillips driver, torque the four captive screws to 8 inch-pounds. Fastener
sequencing (starting threads on all four screws before torquing) may mitigate against
cross threading.
This assembly process is designed to produce a static load of 39 - 51 lbf, for 0.062" 0.100" board thickness respectively. Honeywell PCM45F is expected to meet the
performance targets in Table 5-1 from 30 - 60 lbf. From Table 4-3, the Heatsink Static
Compressive Load of 0 - 60 lbf allows for designs that vary from the 1U reference
heatsink. Example: A customer’s unique heatsink with very little static load (as little as
0 lbf) is acceptable from a socket loading perspective as long as the TCASE specification
is met.
Compliance to Board Keepout Zones in Appendix B is assumed for this assembly
process.
34
Thermal/Mechanical Design Guide
Thermal Solutions
5.3.1
Thermal Interface Material (TIM)
TIM should be verified to be within its recommended shelf life before use.
Surfaces should be free of foreign materials prior to application of TIM.
Use isopropyl alcohol and a lint free cloth to remove old TIM before applying new TIM.
5.4
Structural Considerations
Mass of the 1U reference heatsink and the target mass for 2U and Tower heatsinks
does not exceed 500 gm.
From Table 4-3, the Dynamic Compressive Load of 200 lbf max allows for designs that
exceed 500 gm as long as the mathematical product does not exceed 200 lbf. Example:
A heatsink of 2-lb mass (908 gm) x 50 g (acceleration) x 2.0 Dynamic Amplification
Factor = 200 lbf. The Total Static Compressive Load (Table 4-3) should also be
considered in dynamic assessments.
The heatsink limit of 500 gm and use of back plate have eliminated the need for Direct
Chassis Attach retention (as used previously with the Intel® Xeon® processor 5000
sequence). Direct contact between back plate and chassis pan will help minimize board
deflection during shock.
Placement of board-to-chassis mounting holes also impacts board deflection and
resultant socket solder ball stress. Customers need to assess shock for their designs as
their heatsink retention (back plate), heatsink mass and chassis mounting holes may
vary.
5.5
Thermal Design
5.5.1
Thermal Characterization Parameter
The case-to-local ambient Thermal Characterization Parameter ( CA) is defined by:
Equation 5-1. CA = (TCASE - TLA) / TDP
Where:
TCASE
TLA
TDP
Equation 5-2. CA =
=
=
=
+
CS
Processor case temperature (°C). For TCASE specification see the
appropriate datasheet.
Local ambient temperature in chassis at processor (°C).
TDP (W) assumes all power dissipates through the integrated heat
spreader. This inexact assumption is convenient for heatsink design.
TTVs are often used to dissipate TDP. Correction offsets account for
differences in temperature distribution between processor and TTV.
SA
Where:
CS
=
SA
=
Thermal characterization parameter of the TIM (°C/W) is dependent
on the thermal conductivity and thickness of the TIM.
Thermal characterization parameter from heatsink-to-local ambient
(°C/W) is dependent on the thermal conductivity and geometry of the
heatsink and dependent on the air velocity through the heatsink fins.
Figure 5-4 illustrates the thermal characterization parameters.
Thermal/Mechanical Design Guide
35
Thermal Solutions
Figure 5-4.
Processor Thermal Characterization Parameter Relationships
5.5.2
Dual Thermal Profile
Processors that offer dual thermal profile are specified in the appropriate datasheet.
Dual thermal profile helps mitigate limitations in volumetrically constrained form
factors and allows trade-offs between heatsink cost and TCC activation risk. For
heatsinks that comply to Profile B, yet do not comply to Profile A (1U heatsink in
Figure 5-5), the processor has an increased probability of TCC activation and an
associated measurable performance loss. Measurable performance loss is defined to be
any degradation in processor performance greater than 1.5%. 1.5% is chosen as the
baseline since run-to-run variation in a performance benchmark is typically between 1
and 2%.
36
Thermal/Mechanical Design Guide
Thermal Solutions
Figure 5-5.
Dual Thermal Profile








Compliance to Profile A ensures that no measurable performance loss will occur due to
TCC activation. It is expected that TCC would only be activated for very brief periods of
time when running a worst-case real world application in a worst-case thermal
condition. A worst-case real world application is a commercially available, useful
application which dissipates power above TDP for a thermally relevant timeframe. One
example of a worst-case thermal condition is when the processor local ambient
temperature is above the y-axis intercept for Profile A.
5.6
Thermal Features
More information regarding processor thermal features is contained in the appropriate
datasheet.
5.6.1
Fan Speed Control
There are many ways to implement fan speed control. Using processor ambient
temperature (in addition to Digital Thermal Sensor) to scale fan speed can improve
acoustics when DTS > TCONTROL.
Table 5-4.
Fan Speed Control, TCONTROL and DTS Relationship
Condition
FSC Scheme
DTS
TCONTROL
FSC can adjust fan speed to maintain DTS
DTS
TCONTROL
FSC should adjust fan speed to keep TCASE at or below the Thermal Profile
specification (increased acoustic region).
Thermal/Mechanical Design Guide
TCONTROL (low acoustic region).
37
Thermal Solutions
5.6.1.1
TCONTROL Guidance
Factory configured TCONTROL values are available in the appropriate Dear Customer
Letter or may be extracted by issuing a Mailbox or an RDMSR instruction. See the
appropriate datasheet for more information.
Due to increased thermal headroom based on thermal characterization on the latest
processors, customers have the option to reduce TCONTROL to values lower than the
factory configured values.
In some situations, use of reduced TCONTROL Guidance can reduce average fan power
and improve acoustics. There are no plans to change Intel's specification or the factory
configured TCONTROL values on individual processors.
To implement this guidance, customers must re-write code to set TCONTROL to the
reduced values provided in the table below. Implementation is optional. Alternately, the
factory configured TCONTROL values can still be used, or some value between factory
configured and Guidance. Regardless of TCONTROL values used, BIOS needs to identify
the processor type.
Table 5-5.
TCONTROL Guidance
TDP
TCONTROL
Guidance
130W
See Note 1
Intel® Xeon® Processor 5500 Series
95W
-10
Intel® Xeon® Processor 5500 Series with 2.93 GHz Max Core Frequency
95W
-1
Intel® Xeon® Processor 5500 Series frequencies lower than 2.93 GHz
80W
-1
Intel® Xeon® Processor 5500 Series 2.53 GHz or lower, except Embedded (NEBS)
Comment
60W
-1
Intel® Xeon® Processor 5500 Series 2.26 GHz or lower, except Embedded (NEBS)
130W
See Note 1
Intel Xeon processor 5600 series (6 core and 4 core)
95W
-1
Intel Xeon processor 5600 series (6 core) 2.93 GHz or lower
95W
-1
Intel Xeon processor 5600 series (4 core) 3.06 GHz or lower
80W
-1
Intel Xeon processor 5600 series (4 core) 2.66 GHz or lower, except Embedded
60W
-1
Intel Xeon processor 5600 series (6 core) 2.26 GHz or lower, except Embedded
40W
-1
Intel Xeon processor 5600 series (4 core) 2.13 GHz or lower, except Embedded
Notes:
1.
Use factory configured TCONTROL values.
Implementation of TCONTROL Guidance above maintains Intel standards of reliability
(based on modeling of the Intel Reference Design). Implementation of TCONTROL of -1
may increase risk of throttling (Thermal Control Circuit activation). Increased TCC
activation may or may not result in measurable performance loss.
Thermal Profile still applies. If PECI >= TCONTROL Guidance, then the case temperature
must meet the Thermal Profile.
5.6.2
PECI Averaging and Catastrophic Thermal Management
By averaging DTS over PECI, thermal solution failure can be detected and a soft
shutdown can be initiated to help prevent loss of data.
Thermal data is averaged over a rolling window of 256 mS by default (X=8):
AVGN = AVGN-1 * (1 – 1/2X) + Temperature * 1/2X
38
Thermal/Mechanical Design Guide
Thermal Solutions
Using a smaller averaging constant could cause premature detection of failure.
The Critical Temperature threshold generally triggers somewhere between PECI of
-0.75 and -0.50. To avoid false shutdowns, initiate soft shutdown at -0.25.
Since customer designs, boundary conditions, and failure scenarios differ, above
guidance should be tested in the customer’s system to prevent loss of data during
shutdown.
5.6.3
Intel® Turbo Boost Technology
Intel® Turbo Boost Technology (Intel® TBT) is a new feature available on certain
processor SKUs that opportunistically, and automatically, allows the processor to run
faster than the marked frequency if the part is operating below its power, temperature
and current limits.
Heatsink performance (lower CA as described in Section 5.5.1) is one of several
factors that can impact the amount of Intel TBT frequency benefit. Intel TBT
performance is also constrained by ICC, and VCC limits.
Increased IMON accuracy may provide more Intel TBT benefit on TDP limited
applications, as compared to lower CA, as temperature is not typically the limiter for
these workloads.
With Intel TBT enabled, the processor may run more consistently at higher power levels
(but still within TDP), and be more likely to operate above TCONTROL, as compared to
when Intel TBT is disabled. This may result in higher acoustics.
With Intel TBT enabled, processors with dual thermal profiles (described in
Section 5.5.2, have greater potential for performance delta between Profile A and
Profile B platforms, as compared to previous platforms.
5.7
Thermal Guidance
5.7.1
Thermal Excursion Power for Processors with Dual
Thermal Profile
Under fan failure or other anomalous thermal excursions, Tcase may exceed Thermal
Profile B for a duration totaling less than 360 hours per year without affecting long term
reliability (life) of the processor. For more typical thermal excursions, Thermal Monitor
is expected to control the processor power level as long as conditions do not allow the
Tcase to exceed the temperature at which Thermal Control Circuit (TCC) activation
initially occurred. Under more severe anomalous thermal excursions when the
processor temperature cannot be controlled at or below this Tcase level by TCC
activation, then data integrity is not assured. At some higher threshold, THERMTRIP#
will enable a shut down in an attempt to prevent permanent damage to the processor.
Thermal Test Vehicle (TTV) may be used to check anomalous thermal excursion
compliance by ensuring that the processor Tcase value, as measured on the TTV, does
not exceed Tcase_max_B at the anomalous power level for the environmental condition
of interest. This anomalous power level is equal to 75% of the TDP limit.
This guidance can be applied to 95W Intel Xeon processor 5500 series and 95W Intel
Xeon processor 5600 series.
Thermal/Mechanical Design Guide
39
Thermal Solutions
5.7.2
Thermal Excursion Power for Processors with Single
Thermal Profile
Under fan failure or other anomalous thermal excursions, Tcase may exceed the
thermal profile for a duration totaling less than 360 hours per year without affecting
long term reliability (life) of the processor. For more typical thermal excursions,
Thermal Monitor is expected to control the processor power level as long as conditions
do not allow the Tcase to exceed the temperature at which Thermal Control Circuit
(TCC) activation initially occurred. Under more severe anomalous thermal excursions
when the processor temperature cannot be controlled at or below this Tcase level by
TCC activation, then data integrity is not assured. At some higher threshold,
THERMTRIP# will enable a shut down in an attempt to prevent permanent damage to
the processor. Thermal Test Vehicle (TTV) may be used to check anomalous thermal
excursion compliance by ensuring that the processor Tcase value, as measured on the
TTV, does not exceed Tcase_max at the anomalous power level for the environmental
condition of interest. This anomalous power level is equal to 75% of the TDP limit.
This guidance can be applied to 80 W Intel Xeon processor 5500 series, 80W Intel Xeon
processor 5600 series and 130 W Intel Xeon processor 5600 series.
5.7.3
Absolute Processor Temperature
Intel does not test any third party software that reports absolute processor
temperature. As such, Intel cannot recommend the use of software that claims this
capability. Since there is part-to-part variation in the TCC (thermal control circuit)
activation temperature, use of software that reports absolute temperature can be
misleading.
See the appropriate datasheet for details regarding use of
IA32_TEMPERATURE_TARGET register to determine the minimum absolute
temperature at which the TCC will be activated and PROCHOT# will be asserted.
§
40
Thermal/Mechanical Design Guide
Quality and Reliability Requirements
6
Quality and Reliability
Requirements
6.1
Test Conditions
The Test Conditions provided in Table 6-1 address processor heatsink failure
mechanisms only. Test Conditions, Qualification and Visual Criteria vary by customer;
Table 6-1 applies to Intel requirements.
Socket Test Conditions are provided in the LGA1366 Socket Validation Reports available
from socket suppliers listed in Appendix A.
Table 6-1.
Heatsink Test Conditions and Qualification Criteria (Sheet 1 of 2)
Assessment
Min
Sample
Size
Test Condition
Qualification Criteria
1) Humidity
Non-operating, 500 hours, +85°C and 85%
R.H.
No visual defects.
As verified in wind tunnel:
• Mean CA + 3s + offset not to exceed
value in Table 5-1 and Table 5-2.
• Pressure drop not to exceed value in
Table 5-1 and Table 5-2.
15
2) Board-Level
UnPackaged Shock
50G+/-10%; 170+/-10% in/sec; 3 drops
per face, 6 faces.
No damage to heatsink base or pipe.
No visual defects.
As verified in wind tunnel:
• Mean CA + 2.54s + offset not to
exceed value in Table 5-1 and
Table 5-2.
• Pressure drop not to exceed value in
Table 5-1 and Table 5-2.
15
3) Board-Level
UnPackaged Vibration
5 Hz @ 0.01 g2/Hz to 20 Hz @ 0.02 g2/Hz
(slope up).
20 Hz to 500 Hz @ 0.02 g2/Hz (flat).
Input acceleration is 3.13 g RMS.
10 minutes/axis for all 3 axes on all
samples.
Random control limit tolerance is ±3 dB.
No damage to heatsink base or pipe.
No visual defects.
As verified in wind tunnel:
• Mean CA + 2.54s + offset not to
exceed value in Table 5-1 and
Table 5-2
• Pressure drop not to exceed value in
Table 5-1 and Table 5-2
15
4) First Article
Inspection
Not Applicable
Meet all dimensions on 5 samples.
Meet all CTF dimensions on 32 additional
samples with 1.33 Cpk (mean + 4s).
If samples are soft-tooled, a hard tool plan
must be defined.
37
5) Shipping Media:
Packaged Shock
Drop height determined by weight and may
vary by customer; Intel requirement in
General Supplier Packaging Spec.
10 drops (6 sides, 3 edges, 1 corner)
No visual defects
1 box
6) Shipping Media:
Packaged Vibration
0.015 g2/Hz @ 10-40 Hz, sloping to 0.0015
g2/Hz @ 500 Hz, 1.03 gRMS, 1 hour/axis
for 3 axes
No visual defects
1 box
7) Gravitational
Evaluation
Required for heatpipe designs.
3 orientations (0°, +90°, -90°)
Thermal/Mechanical Design Guide
As verified in wind tunnel, mean CA + 3s
+ offset not to exceed value in Table 5-1
and Table 5-2
15
41
Quality and Reliability Requirements
Table 6-1.
Heatsink Test Conditions and Qualification Criteria (Sheet 2 of 2)
Assessment
8a) Thermal
Performance for
Intel® Xeon®
Processor 5500 Series
Test Condition
Qualification Criteria
Min
Sample
Size
Using 1U heatsink and 1U airflow from
Table 5-1:
1) TTV @ 95W (Profile B), Note 1.
Using 2U heatsink and 2U airflow from
Table 5-1:
2) TTV @ 95W (Profile A), Note 1.
3) TTV @ 80W.
4) TTV @ 60W.
Using Tower heatsink and Tower airflow
from Table 5-1:
5) TTV @ 130W, Note 1.
6) TTV @ 95W (Profile A).
7) TTV @ 80W.
8) TTV @ 60W.
As verified in wind tunnel:
1) mean CA+ 3s + offset not to exceed
Table 5-1 value for 95W in 1U.
2-4) mean CA + 3s + offset not to exceed
Table 5-1 value for 2U.
5-8) mean CA + 3s + offset not to exceed
Table 5-1 value for Tower.
5 heatsinks
X 8 tests by
supplier.
8b) Thermal
Performance for
Intel® Xeon®
Processor 5600 Series
Using 1U heatsink and 1U airflow from
Table 5-2:
1) TTV @ 95W (Profile B), Note 1.
Using 2U heatsink and 2U airflow from
Table 5-2:
2) TTV @ 130W, Note 1.
3) TTV @ 95W (Profile A).
4) TTV @ 80W.
5) TTV @ 60W.
As verified in wind tunnel:
1) mean CA+ 3s + offset not to exceed
Table 5-2 value for 95W in 1U.
2-5) mean CA + 3s + offset not to exceed
Table 5-2 value for 2U.
Thermal
Test data
re-assessed
from Intel®
Xeon®
Processor
5500 Series
Qualification
9) Thermal Cycling
Required for heatpipe designs.
Temperature range at pipe in heatsink
assembly: -25C to +100C for 500 cycles.
Cycle time is 30 minutes per full cycle,
divided into half cycle in hot zone and half
in cold zone, with minimum 1min soak at
each temperature extreme for each cycle.
See Figure 6-1 for example profile.
As verified in wind tunnel:
• Mean CA + 3s + offset not to exceed
value in Table 5-1 and Table 5-2.
• Pressure drop not to exceed value in
Table 5-1 and Table 5-2.
15
10) Heat Pipe Burst
Continuously raise oven temperature and
record the burst/leak temperatures of fully
assembled heatsinks
No failures at minimum of 300C @ 20
minutes
11) Heatsink Mass
Design Target < 500 g
All samples < 550 g
12) Heatsink Load
Design Targets:
0.062" board = 38.7 ± 7.2 lbf (Fmin =
31.5 lbf).
0.100" board = 51.4 ± 7.9 lbf (Fmax =
59.3 lbf).
42
Note 1: 30
heatsinks X
3 tests by
Intel.
32 pipes
30
30
No samples < 30 lbf on 0.062" board.
5 highest load samples (from 0.062" test)
< 60 lbf on 0.100" board
Thermal/Mechanical Design Guide
Quality and Reliability Requirements
Figure 6-1.
Example Thermal Cycle - Actual profile will vary
6.2
Intel Reference Component Validation
Intel tests reference components both individually and as an assembly on mechanical
test boards, and assesses performance to the envelopes specified in previous sections
by varying boundary conditions.
While component validation shows that a reference design is tenable for a limited range
of conditions, customers need to assess their specific boundary conditions and perform
reliability testing based on their use conditions.
Intel reference components are also used in board functional tests to assess
performance for specific conditions.
6.2.1
Board Functional Test Sequence
Each test sequence should start with components (baseboard, heatsink assembly, and
so on) that have not been previously submitted to any reliability testing.
The test sequence should always start with a visual inspection after assembly and
BIOS/Processor/memory test. The stress test should be then followed by a visual
inspection and then BIOS/Processor/memory test.
6.2.2
Post-Test Pass Criteria
The post-test pass criteria are:
1. No significant physical damage to the heatsink and retention hardware.
Thermal/Mechanical Design Guide
43
Quality and Reliability Requirements
2. Heatsink remains seated and its bottom remains mated flat against the IHS
surface. No visible gap between the heatsink base and processor IHS. No visible tilt
of the heatsink with respect to the retention hardware.
3. No signs of physical damage on baseboard surface due to impact of heatsink.
4. No visible physical damage to the processor package.
5. Successful BIOS/Processor/memory test.
6. Thermal compliance testing to demonstrate that the case temperature specification
can be met.
6.2.3
Recommended BIOS/Processor/Memory Test Procedures
This test is to ensure proper operation of the product before and after environmental
stresses, with the thermal mechanical enabling components assembled. The test shall
be conducted on a fully operational baseboard that has not been exposed to any
battery of tests prior to the test being considered.
The testing setup should include the following components, properly assembled and/or
connected:
• Appropriate system baseboard.
• Processor and memory.
• All enabling components, including socket and thermal solution parts.
The pass criterion is that the system under test shall successfully complete the
checking of BIOS, basic processor functions and memory, without any errors.
6.3
Material and Recycling Requirements
Material shall be resistant to fungal growth. Examples of non-resistant materials
include cellulose materials, animal and vegetable based adhesives, grease, oils, and
many hydrocarbons. Synthetic materials such as PVC formulations, certain
polyurethane compositions (for example, polyester and some polyethers), plastics
which contain organic fillers of laminating materials, paints, and varnishes also are
susceptible to fungal growth. If materials are not fungal growth resistant, then MILSTD-810E, Method 508.4 must be performed to determine material performance.
Any plastic component exceeding 25 gm should be recyclable per the European Blue
Angel recycling standards.
The following definitions apply to the use of the terms lead-free, Pb-free, and RoHS
compliant.
Lead-free and Pb-free: Lead has not been intentionally added, but lead may still
exist as an impurity below 1000 ppm.
RoHS compliant: Lead and other materials banned in RoHS Directive are either
(1) below all applicable substance thresholds as proposed by the EU or (2) an
approved/pending exemption applies.
Note:
RoHS implementation details are not fully defined and may change.
§
44
Thermal/Mechanical Design Guide
Component Suppliers
A
Component Suppliers
Various suppliers have developed support components for processors in the Intel®
Xeon® 5500 Platform. These suppliers and components are listed as a convenience to
customers. Intel does not guarantee quality, reliability, functionality or compatibility of
these components. The supplier list and/or the components may be subject to change
without notice. Customers are responsible for the system thermal, mechanical, and
environmental verification of the components with the supplier.
A.1
Intel Enabled Supplier Information
Performance targets for heatsinks are described in Section 5.1. Mechanical drawings
are provided in Appendix B. Mechanical models are listed in Table 1-1. Heatsinks
assemble to server back plate Table A-4.
A.1.1
Intel Reference Thermal Solution
The Intel reference thermal solutions have been verified to meet the criteria outlined in
Table 6-1. Customers can purchase the Intel reference thermal solutions from the
suppliers listed in Table A-1.
Table A-1.
Assembly
Assembly, Heat
Sink, 1U
Suppliers for the Intel Reference Thermal Solution
Component
Description
Supplier PN
1U URS Intel
Reference
Heatsink p/n
E32409-001
27 mm 1U Aluminum Fin,
Copper Base, includes
TIM, 95W capable
Fujikura
HSA-8078 Rev A
1U URS SSI Blade
Reference
Heatsink p/n
E39069-001 refers
to E22056 Rev 02 +
Snap Cover
25.5mm 1U Aluminum
Fin, Copper Base,
includes TIM and Snap
Cover, 95W capable.
Thermal Interface
Material
Fujikura
HSA-8083C
Honeywell PCM45F
Supplier Contact Info
Fujikura America
Yuji Yasuda
[email protected]
408-748-6991
Fujikura Taiwan Branch
Yao-Hsien Huang
[email protected]
886(2)8788-4959
Honeywell International, Inc.
Judy Oles (Customer Service)
[email protected]
509-252-8605
Andrew S.K. Ho (APAC)
[email protected]
(852) 9095-4593
Andy Delano (Technical)
[email protected]
m 509-252-2224
A.1.2
Intel Collaboration Thermal Solution
The Intel collaboration thermal solutions have been verified to meet the criteria
outlined in Table 6-1. Customers can purchase the Intel collaboration thermal solutions
from the suppliers listed in Table A-2.
Thermal/Mechanical Design Guide
45
Component Suppliers
Table A-2.
Suppliers for the Intel Collaboration Thermal Solution
Assembly
Component
Assembly,
Heatsink,
Intel® Xeon®
Processor 5500
Series and
Intel® Xeon®
Processor 5600
Series, 2U
2U URS Heatsink
Assembly,
Heatsink,
Intel® Xeon®
Processor 5500
Series and
Intel® Xeon®
Processor 5600
Series, Pedestal
Tower URS Heatsink
A.1.3
Intel Collaboration
Heatsink p/n
E32410-001
Intel Collaboration
Heatsink p/n
E32412-001
Description
Supplier PN
Supplier Designed
Solution with
Intel-specified
retention, includes
TIM, 130W
capable
Foxconn
pn 1A016500
Supplier Designed
Solution with
Intel-specified
retention, includes
TIM, 130W
capable
Chaun-Choung
Technology Corp
(CCI)
pn 0007029401
Supplier Contact Info
Foxconn
Ray Wang
[email protected]
(512) 670-2638 ext 273
Chaun-Choung Technology Corp (CCI)
Monica Chih
[email protected]
+886 (2) 2995-2666 x1131
Harry Lin
[email protected]
714 739-5797
Alternative Thermal Solution
The alternative thermal solutions are preliminary and are not verified by Intel to meet
the criteria outlined in Table 6-1. Customers can purchase the alternative thermal
solutions from the suppliers listed in Table A-3.
Table A-3.
Assembly
Assembly,
Heat Sink, 1U
Assembly
Heatsink, 1U
Suppliers for the Alternative Thermal Solution (Sheet 1 of 2)
Component
1U SSI Blade
Alternative
URS Heatsink
1U Alternative
URS Heatsink
Description
Intel® Xeon®
Processor
5500 Series
Intel® Xeon®
Processor
5600 Series
Standard
TaiSol Corporation
1A1-9031000960-A
www.Taisol.com
95W capable
95W capable
Standard
Thermaltake
CL-P0484
www.Thermaltake.com
95W capable
95W capable
Standard
CoolerMaster
S1N-PJFCS-07-GP
www.CoolerMaster.com
95W capable
95W capable
Standard
Aavid Thermalloy
050073
www.AavidThermalloy.com
95W capable
95W capable
Performance
Aavid Thermalloy
050231
www.AavidThermalloy.com
95W capable
95W capable
CoolJag
JYC0B39CTA
www.CoolJag.com
95W capable
95W capable
Performance
Taiwan Microloops
99-520040-M03
www.Microloops.com
95W capable
95W capable
Performance
Vapro, Inc.
MS109AH-Cu
www.VaproInc.com
95W capable
95W capable
Standard
46
Supplier PN
Thermal/Mechanical Design Guide
Component Suppliers
Table A-3.
Assembly
Assembly,
Heatsink, 2U
Assembly,
Heatsink,
Tower
Assembly,
Heatsink
Suppliers for the Alternative Thermal Solution (Sheet 2 of 2)
Component
2U Alternative
URS Heatsink
Tower
Alternative
URS Heatsink
Pedestal/2U
Active
Heatsink
Description
Supplier PN
Intel® Xeon®
Processor
5500 Series
Intel® Xeon®
Processor
5600 Series
Standard
Asia Vital Components
(AVC)
SR40400001
www.AVC.com.tw
95W capable
130W capable
Standard
Thermaltake
CL-P0486
www.Thermaltake.com
95W capable
95W capable
Standard
CoolerMaster
S2N-PJMHS-07-GP
www.CoolerMaster.com
95W capable
80W capable
Standard
TaiSol Corporation
1A0-9041000960-A
www.Taisol.com
95W capable
130W capable
Low Cost
Dynatron Corporation
(Top Motor/Dynaeon)
G520
www.Dynatron-Corp.com
80W capable
80W capable
Low Cost
CoolJag
JAC0B40A
www.CoolJag.com
80W capable
80W capable
Standard
TaiSol Corporation
1A0-9051000960-A
www.Taisol.com
130W capable
130W capable
Standard
Thermaltake
CL-P0485
www.Thermaltake.com
130W capable
130W capable
80W capable
80W capable
Active
Dynatron Corporation*
(Top Motor/Dynaeon)
G555
www.Dynatron-Corp.com
Notes:
1) Standard - Design and technology similar to Intel Reference or Collaboration designs, however, may not meet thermal
requirements for all processor SKUs.
2) Performance - 1U Heatsink designed with premium materials or technology expected to provide optimum thermal performance
for all processor SKUs.
3) Low Cost - 2U Cost-Optimized Heatsink, expected to meet thermal targets for lower power processor SKUs.
A.1.4
Socket and ILM Components
The LGA1366 Socket and ILM Components are described in Chapter 2 and Chapter 3,
respectively. Socket mechanical drawings are provided in Appendix C. Mechanical
models are listed in Table 1-1.
Table A-4.
LGA1366 Socket and ILM Components
Item
Intel PN
Foxconn
Tyco
Molex
ILM Cover Assembly
D92428-003
PT44L13-4101
1554105-1
475939000
Server Back Plate
D92433-002
PT44P12-4101
1981467-1
475937000
LGA1366 Socket
D86205-002
PE136627-4371-01F
1939737-1
475940001
§
Thermal/Mechanical Design Guide
47
Component Suppliers
48
Thermal/Mechanical Design Guide
Mechanical Drawings
B
Mechanical Drawings
Table B-1.
Mechanical Drawing List
Description
Figure
Board Keepin / Keepout Zones (Sheet 1 of 4)
Figure B-1
Board Keepin / Keepout Zones (Sheet 2 of 4)
Figure B-2
Board Keepin / Keepout Zones (Sheet 3 of 4)
Figure B-3
Board Keepin / Keepout Zones (Sheet 4 of 4)
Figure B-4
1U Reference Heatsink Assembly (Sheet 1 of 2)
Figure B-5
1U Reference Heatsink Assembly (Sheet 2 of 2)
Figure B-6
1U Reference Heatsink Fin and Base (Sheet 1 of 2)
Figure B-7
1U Reference Heatsink Fin and Base (Sheet 2 of 2)
Figure B-8
Heatsink Shoulder Screw (1U, 2U and Tower)
Figure B-9
Heatsink Compression Spring (1U, 2U and Tower)
Figure B-10
Heatsink Retaining Ring (1U, 2U and Tower)
Figure B-11
Heatsink Load Cup (1U, 2U and Tower)
Figure B-12
2U Collaborative Heatsink Assembly (Sheet 1 of 2)
Figure B-13
2U Collaborative Heatsink Assembly (Sheet 2 of 2)
Figure B-14
2U Collaborative Heatsink Volumetric (Sheet 1 of 2)
Figure B-15
2U Collaborative Heatsink Volumetric (Sheet 2 of 2)
Figure B-16
Tower Collaborative Heatsink Assembly (Sheet 1 of 2)
Figure B-17
Tower Collaborative Heatsink Assembly (Sheet 2 of 2)
Figure B-18
Tower Collaborative Heatsink Volumetric (Sheet 1 of 2)
Figure B-19
Tower Collaborative Heatsink Volumetric (Sheet 2 of 2)
Figure B-20
1U Reference Heatsink Assembly with TIM (Sheet 1 of 2)
Figure B-21
1U Reference Heatsink Assembly with TIM (Sheet 2 of 2)
Figure B-22
2U Reference Heatsink Assembly with TIM (Sheet 1 of 2)
Figure B-23
2U Reference Heatsink Assembly with TIM (Sheet 2 of 2)
Figure B-24
Tower Reference Heatsink Assembly with TIM (Sheet 1 of 2)
Figure B-25
Tower Reference Heatsink Assembly with TIM (Sheet 2 of 2)
Figure B-26
25.5mm Reference Heatsink Assembly (Sheet 1 of 2)
Figure B-27
25.5mm Reference Heatsink Assembly (Sheet 2 of 2)
Figure B-28
25.5mm Reference Heatsink Fin and Base (Sheet 1 of 2)
Figure B-29
25.5mm Reference Heatsink Fin and Base (Sheet 2 of 2)
Figure B-30
25.5mm Reference Heatsink Assembly with TIM (Sheet 1 of 2)
Figure B-31
25.5mm Reference Heatsink Assembly with TIM (Sheet 2 of 2)
Figure B-32
Thermal/Mechanical Design Guide
49
Mechanical Drawings
Figure B-1.
50
Board Keepin / Keepout Zones (Sheet 1 of 4)
Thermal/Mechanical Design Guide
Thermal/Mechanical Design Guide
51

  




  

  

  

  
 

  

  

  

  

  

  

  

  
Figure B-2.
Board Keepin / Keepout Zones (Sheet 2 of 4)
Mechanical Drawings
Mechanical Drawings
Figure B-3.
Board Keepin / Keepout Zones (Sheet 3 of 4)

  




  

  

  

  

  
52
Thermal/Mechanical Design Guide
Mechanical Drawings
Figure B-4.
Board Keepin / Keepout Zones (Sheet 4 of 4)
Thermal/Mechanical Design Guide
53
Mechanical Drawings
Figure B-5.
54
1U Reference Heatsink Assembly (Sheet 1 of 2)
Thermal/Mechanical Design Guide
Mechanical Drawings
Figure B-6.
1U Reference Heatsink Assembly (Sheet 2 of 2)
Thermal/Mechanical Design Guide
55
Mechanical Drawings
Figure B-7.
56
1U Reference Heatsink Fin and Base (Sheet 1 of 2)
Thermal/Mechanical Design Guide
Mechanical Drawings
Figure B-8.
1U Reference Heatsink Fin and Base (Sheet 2 of 2)
Thermal/Mechanical Design Guide
57
Mechanical Drawings
Figure B-9.
58
Heatsink Shoulder Screw (1U, 2U and Tower)
Thermal/Mechanical Design Guide
Mechanical Drawings
Figure B-10. Heatsink Compression Spring (1U, 2U and Tower)
Thermal/Mechanical Design Guide
59
Mechanical Drawings
Figure B-11. Heatsink Retaining Ring (1U, 2U and Tower)
60
Thermal/Mechanical Design Guide
Mechanical Drawings
Figure B-12. Heatsink Load Cup (1U, 2U and Tower)
Thermal/Mechanical Design Guide
61
Mechanical Drawings
Figure B-13. 2U Collaborative Heatsink Assembly (Sheet 1 of 2)
62
Thermal/Mechanical Design Guide
Mechanical Drawings
Figure B-14. 2U Collaborative Heatsink Assembly (Sheet 2 of 2)
Thermal/Mechanical Design Guide
63
Mechanical Drawings
Figure B-15. 2U Collaborative Heatsink Volumetric (Sheet 1 of 2)
64
Thermal/Mechanical Design Guide
Mechanical Drawings
Figure B-16. 2U Collaborative Heatsink Volumetric (Sheet 2 of 2)
Thermal/Mechanical Design Guide
65
Mechanical Drawings
Figure B-17. Tower Collaborative Heatsink Assembly (Sheet 1 of 2)
66
Thermal/Mechanical Design Guide
Mechanical Drawings
Figure B-18. Tower Collaborative Heatsink Assembly (Sheet 2 of 2)
Thermal/Mechanical Design Guide
67
Mechanical Drawings
Figure B-19. Tower Collaborative Heatsink Volumetric (Sheet 1 of 2)
68
Thermal/Mechanical Design Guide
Mechanical Drawings
Figure B-20. Tower Collaborative Heatsink Volumetric (Sheet 2 of 2)
Thermal/Mechanical Design Guide
69
Mechanical Drawings
Figure B-21. 1U Reference Heatsink Assembly with TIM (Sheet 1 of 2)
70
Thermal/Mechanical Design Guide
Mechanical Drawings
Figure B-22. 1U Reference Heatsink Assembly with TIM (Sheet 2 of 2)
Thermal/Mechanical Design Guide
71
Mechanical Drawings
Figure B-23. 2U Reference Heatsink Assembly with TIM (Sheet 1 of 2)
72
Thermal/Mechanical Design Guide
Mechanical Drawings
Figure B-24. 2U Reference Heatsink Assembly with TIM (Sheet 2 of 2)
Thermal/Mechanical Design Guide
73
Mechanical Drawings
Figure B-25. Tower Reference Heatsink Assembly with TIM (Sheet 1 of 2)
74
Thermal/Mechanical Design Guide
Mechanical Drawings
Figure B-26. Tower Reference Heatsink Assembly with TIM (Sheet 2 of 2)
Thermal/Mechanical Design Guide
75
Mechanical Drawings
Figure B-27. 25.5mm Reference Heatsink Assembly (Sheet 1 of 2)
76
Thermal/Mechanical Design Guide
Mechanical Drawings
Figure B-28. 25.5mm Reference Heatsink Assembly (Sheet 2 of 2)
Thermal/Mechanical Design Guide
77
Mechanical Drawings
Figure B-29. 25.5mm Reference Heatsink Fin and Base (Sheet 1 of 2)
78
Thermal/Mechanical Design Guide
Mechanical Drawings
Figure B-30. 25.5mm Reference Heatsink Fin and Base (Sheet 2 of 2)
Thermal/Mechanical Design Guide
79
Mechanical Drawings
Figure B-31. 25.5mm Reference Heatsink Assembly with TIM (Sheet 1 of 2)
80
Thermal/Mechanical Design Guide
Mechanical Drawings
Figure B-32. 25.5mm Reference Heatsink Assembly with TIM (Sheet 2 of 2)
Thermal/Mechanical Design Guide
81
Mechanical Drawings
§
82
Thermal/Mechanical Design Guide
Socket Mechanical Drawings
C
Socket Mechanical Drawings
Table C-1 lists the mechanical drawings included in this appendix.
Table C-1.
Mechanical Drawing List
Drawing Description
Figure Number
“Socket Mechanical Drawing (Sheet 1 of 4)”
Figure C-1
“Socket Mechanical Drawing (Sheet 2 of 4)”
Figure C-2
“Socket Mechanical Drawing (Sheet 3 of 4)”
Figure C-3
“Socket Mechanical Drawing (Sheet 4 of 4)”
Figure C-4
Thermal/Mechanical Design Guide
83
Socket Mechanical Drawings
Figure C-1.
84
Socket Mechanical Drawing (Sheet 1 of 4)
Thermal/Mechanical Design Guide
Socket Mechanical Drawings
Figure C-2.
Socket Mechanical Drawing (Sheet 2 of 4)
Thermal/Mechanical Design Guide
85
Socket Mechanical Drawings
Figure C-3.
86
Socket Mechanical Drawing (Sheet 3 of 4)
Thermal/Mechanical Design Guide
Socket Mechanical Drawings
Figure C-4.
Socket Mechanical Drawing (Sheet 4 of 4)
§
Thermal/Mechanical Design Guide
87
Socket Mechanical Drawings
88
Thermal/Mechanical Design Guide
Heatsink Load Metrology
D
Heatsink Load Metrology
To ensure compliance to max socket loading value listed in Table 4-3, and to meet the
performance targets for Thermal Interface Material in Table 5.3, the Heatsink Static
Compressive Load can be assessed using the items listed below:
• HP34970A DAQ
• Omegadyne load cell, 100 lbf max (LCKD-100)
• Test board (0.062") with ILM & back plate installed
• 8 in-lbf pneumatic driver
• Heatsink
• Intel Xeon processor 5500 series Load Cell Fixture (Figure D-1)
Thermal/Mechanical Design Guide
89
Heatsink Load Metrology
Figure D-1. Intel Xeon Processor 5500 Series Load Cell Fixture
§
90
Thermal/Mechanical Design Guide
Embedded Thermal Solutions
E
Embedded Thermal Solutions
This section describes the LV processors and Embedded reference heatsinks for NEBS
(Network Equipment Building Systems) compliant ATCA (Advanced Telecommunications
Computing Architecture) systems. These LV processors are good for any form factor
that needs to meet NEBS requirements.
E.1
Performance Targets
Table E-1 and Table E-2 provide boundary conditions and performance targets for 1U
and ATCA heatsinks. These values are used to generate processor thermal
specifications and to provide guidance for heatsink design.
Table E-1.
Boundary Conditions and Performance Targets for Intel® Xeon® Processor
5500 Series
Parameter
Value
Altitude, system ambient temp
Nominal/Short-term
Sea level, 40o C/55C
Sea level, 40o C/55C
TDP
60 W
38 W
51.9/66.9 C
50/65o C
0.336o C/W
0.532o C/W
System height (form factor)3
1U (EEB) or ATCA
ATCA
Heatsink volumetric
1U (90 x 90 x 27) or Custom
ATCA (90 x 90 x 13mm + heat
exchanger)
ATCA (90 x 90 x 13 mm)
TLA
1,4
CA
o
2
Cu base, Cu fins
Heatsink technology5
Table E-2.
Value
Boundary Conditions and Performance Targets for Intel® Xeon® Processor
5600 Series
Parameter
Value
Value
Altitude, system ambient temp
Nominal/Short-term
Sea level, 40o C/55C
Sea level, 40o C/55C
TDP
60 W
40W
51.7/66.7 C
50/65 o C
0.306o C/W
0.548o C/W
System height (form factor)3
1U (EEB) or ATCA
ATCA
Heatsink volumetric
1U (90 x 90 x 27) or Custom
ATCA (90 x 90 x 13mm + heat
exchanger)
ATCA (90 x 90 x 13 mm)
TLA
1,4
CA
2
Heatsink technology5
o
Cu base, Cu fins
NOTES:
1. Local ambient temperature of the air entering the heatsink.
2. Max target (mean + 3 sigma + offset) for thermal characterization parameter (Section 5.5.1).
3. Reference system configuration. In a single wide ATCA blade the 60 W processor should be used in single
Thermal/Mechanical Design Guide
91
Embedded Thermal Solutions
socket only and the 38 W processor can be used in dual socket.
4. Local Ambient Temperature written 50/65o C means 50o C under Nominal conditions but 65o C is allowed for
Short-Term NEBS excursions.
5. Passive heatsinks with TIM.
6. See Section 5.1 for standard 1U solutions that do not need to meet NEBS.
Detailed drawings for the ATCA reference heatsink can be found in Section E.3.
Table E-1 and Table E-2 above specify CA targets. Figure E-1 below shows CA and
pressure drop for the ATCA heatsink versus the airflow provided. Best-fit equations are
provided to prevent errors associated with reading the graph.
Figure E-1.
ATCA Heatsink Performance Curves
2.5
2
P = 1.3e-04CFM2 +1.1e-02CFM
2
1.6
1.5
1.2
1
0.8
0.5
0.4
Mean
0
0
5
10
ca
15
= 0.337 + 1.625 CFM -0.939
0
20
25
30
35
CFM Through Fins
Other LGA1366 compatible thermal solutions may work with the same retention.
E.2
Thermal Design Guidelines
E.2.1
NEBS Thermal Profile
Processors that offer a NEBS compliant thermal profile are specified in the appropriate
Datasheet.
NEBS thermal profiles help relieve thermal constraints for Short-Term NEBS conditions.
To help reliability, processors must meet the nominal thermal profile under standard
operating conditions and can only rise up to the Short-Term spec for NEBS excursions
(see Figure E-2). The definition of Short-Term time is clearly defined for NEBS Level 3
conditions but the key is that it cannot be longer than 360 hours per year.
92
Thermal/Mechanical Design Guide
Embedded Thermal Solutions
Figure E-2.
NEBS Thermal Profile
\
Thermal Profile
90
Short-term Thermal Profile may only be used for short term
excursions to higher ambient temperatures, not to exceed 360
hours per year
80
70
Short-Term Thermal Profile
Tc = 0.302 * P + 66.9
Nominal Thermal Profile
Tc = 0.302* P + 51.9
60
50
40
0
5
10
15
20
25
30
35
40
45
50
55
60
Power [W]
NOTES:
1.) The thermal specifications shown in this graph are for reference only. See the appropriate Datasheet for the
Thermal Profile specifications. In case of conflict, the data in the datasheet supersedes any data in this figure.
2.) The Nominal Thermal Profile must be used for all normal operating conditions, or for products that do not
require NEBS Level 3 compliance.
3.) The Short-Term Thermal Profile may only be used for short-term excursions to higher ambient operating
temperatures, not to exceed 360 hours per year as compliant with NEBS Level 3.
4.) Implementation of either thermal profile should result in virtually no TCC activation.
5.) Utilization of a thermal solution that exceeds the Short-Term Thermal Profile, or which operates at the ShortTerm Thermal Profile for a duration longer than the limits specified in Note 3 above, do not meet the processor
thermal specifications and may result in permanent damage to the processor.
E.2.2
Custom Heat Sinks For UP ATCA
The Embedded specific 60W SKU is targeted for NEBS compliant 1U+ systems and UP
ATCA configurations with custom thermal solutions. In order to cool this part in a single
wide ATCA slot, a custom thermal solution will be required. Since solutions like this will
be very configuration specific, this heat sink was not fully designed with retention and
keep-out definitions.
In order to cool the additional power of a 60W processor in ATCA, the heat sink volume
was increased. The assumption was that the heat sink could not grow wider because of
VR and Memory placement, so a Remote Heat Exchanger (RHE) was used. The RHE is
attached to the main heat sink with a heat pipe. The RHE gives additional convective
surface area and gives the thermal solution access to more air. Samples of the
following design were ordered and tested for thermal performance only.
Flotherm analysis shows that the following design can cool an LGA1366 TTV in an ATCA
blade at 30CFM. The heat sink ca would be 0.50C/W at 55C ambient which falls below
the thermal profile for the 60W processor.
Thermal/Mechanical Design Guide
93
Embedded Thermal Solutions
Figure E-3.
UP ATCA Thermal Solution
NOTES:Thermal sample only, retention not production ready.
Figure E-4.
UP ATCA System Layout
NOTES:Heat sink should be optimized for the layout.
94
Thermal/Mechanical Design Guide
Embedded Thermal Solutions
§
Figure E-5.
UP ATCA Heat Sink Drawing
Thermal/Mechanical Design Guide
95
Embedded Thermal Solutions
E.3
Mechanical Drawings and Supplier Information
See Appendix B for retention and keep out drawings.
The part number below represent Intel reference designs for a DP ATCA heatsink.
Customer implementation of these components may be unique and require validation
by the customer. Customers can obtain these components directly from the supplier
below.
Table E-3.
Embedded Heatsink Component Suppliers
Assembly
Component
Description
Supplier PN
Supplier Contact Info
Fujikura America
Assembly,
Heat Sink,
Nehalem-EP,
ATCA
Table E-4.
ATCA
Reference
heatsink
Intel P/N
E65918-001
ATCA Copper
Fin, Copper
Base
Fujikura
HSA-7901
Fujikura Taiwan Branch
Yao-Hsien Huang
[email protected]
.tw
886(2)8788-4959
Mechanical Drawings List
Parameter
96
Ash Ooe
[email protected]
408-748-6991
Value
ATCA Reference Heat Sink Assembly (Sheet 1 of 2)
Figure E-6
ATCA Reference Heat Sink Assembly (Sheet 2 of 2)
Figure E-7
ATCA Reference Heatsink Fin and Base (Sheet 1 of 2)
Figure E-8
ATCA Reference Heatsink Fin and Base (Sheet 2 of 2)
Figure E-9
Thermal/Mechanical Design Guide
Embedded Thermal Solutions
§
Figure E-6.
ATCA Reference Heat Sink Assembly (Sheet 1 of 2)
Thermal/Mechanical Design Guide
97
Embedded Thermal Solutions
§
Figure E-7.
98
ATCA Reference Heat Sink Assembly (Sheet 2 of 2)
Thermal/Mechanical Design Guide
Embedded Thermal Solutions
§
Figure E-8.
ATCA Reference Heatsink Fin and Base (Sheet 1 of 2)
Thermal/Mechanical Design Guide
99
Embedded Thermal Solutions
§
Figure E-9.
ATCA Reference Heatsink Fin and Base (Sheet 2 of 2)
§
100
Thermal/Mechanical Design Guide
Processor Installation Tool
F
Processor Installation Tool
The following optional tool is designed to provide mechanical assistance during
processor installation and removal.
Contact the supplier for details regarding this tool:
Billy Hsieh
[email protected]
+81 44 844 8292
Thermal/Mechanical Design Guide
101
Processor Installation Tool
Figure F-1.
Processor Installation Tool
§
102
Thermal/Mechanical Design Guide
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