MAX15006

MAX15006
MAX15006Xxxx+
RELIABILITY REPORT
FOR
MAX15006Xxxx+
(MAX15006-MAX15007)
PLASTIC ENCAPSULATED DEVICES
August 13, 2009
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Approved by
Ken Wendel
Quality Assurance
Director, Reliability Engineering
Maxim Integrated Products. All rights reserved.
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MAX15006Xxxx+
Conclusion
The MAX15006Xxxx+ successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim"s
continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim"s quality and reliability standards.
Table of Contents
I. ........Device Description
V. ........Quality Assurance Information
II. ........Manufacturing Information
VI. .......Reliability Evaluation
III. .......Packaging Information
IV. .......Die Information
.....Attachments
I. Device Description
A. General
The MAX15006/MAX15007 ultra-low quiescent-current linear regulators are ideal for use in automotive and battery-operated systems. These devices
operate from an input voltage of 4V to 40V, deliver up to 50mA of output current, and consume only 10µA of quiescent current at no load. The internal
p-channel pass device keeps the quiescent current low even at full load. The MAX15007 consumes only 3µA current when in shutdown. The
MAX15006A/MAX15007A have a fixed 3.3V output while the MAX15006B/MAX15007B have a fixed 5V output voltage. The MAX15006C/MAX15007C
feature an adjustable output from 1.8V to 10V. The MAX15007 includes an enable input to turn the device on or off. All devices are short-circuit
protected and include thermal shutdown. The MAX15006/MAX15007 operate over the -40°C to +125°C automotive temperature range. These devices
are available in space-saving 3mm x 3mm 6-pin TDFN and 8-pin SO thermally enhanced packages.
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MAX15006Xxxx+
II. Manufacturing Information
A. Description/Function:
40V, Ultra-Low Quiescent-Current Linear Regulators in 6-Pin TDFN/8-Pin SO
B. Process:
BCD8
C. Number of Device Transistors:
D. Fabrication Location:
Oregon
E. Assembly Location:
Thailand
F. Date of Initial Production:
October 19, 2006
III. Packaging Information
A. Package Type:
6-pin TDFN 3x3
B. Lead Frame:
Copper
C. Lead Finish:
100% matte Tin
D. Die Attach:
Conductive Epoxy
E. Bondwire:
Gold (1 mil dia.)
F. Mold Material:
Epoxy with silica filler
G. Assembly Diagram:
#05-9000-2464
H. Flammability Rating:
Class UL94-V0
I. Classification of Moisture Sensitivity per
JEDEC standard J-STD-020-C
Level 1
J. Single Layer Theta Ja:
55°C/W
K. Single Layer Theta Jc:
8.5°C/W
L. Multi Layer Theta Ja:
42°C/W
M. Multi Layer Theta Jc:
8.5°C/W
IV. Die Information
A. Dimensions:
68 X 74 mils
B. Passivation:
Si3N4/SiO2 (Silicon nitride/ Silicon dioxide
C. Interconnect:
Al/0.5%Cu
D. Backside Metallization:
None
E. Minimum Metal Width:
3.0 microns (as drawn)
F. Minimum Metal Spacing:
3.0 microns (as drawn)
G. Bondpad Dimensions:
5 mil. Sq.
H. Isolation Dielectric:
SiO2
I. Die Separation Method:
Wafer Saw
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MAX15006Xxxx+
V. Quality Assurance Information
A. Quality Assurance Contacts:
Ken Wendel (Director, Reliability Engineering)
Bryan Preeshl (Managing Director of QA)
B. Outgoing Inspection Level:
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate:
< 50 ppm
D. Sampling Plan:
Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure Rate ( ) is calculated as
follows:
=
1
MTTF
=
1.83
192 x 4340 x 48 x 2
(Chi square value for MTTF upper limit)
(where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV)
-9
= 22.4 x 10
= 22.4 F.I.T. (60% confidence level @ 25°C)
The following failure rate represents data collected from Maxim’s reliability monitor program. Maxim performs quarterly 1000
hour life test monitors on its processes. This data is published in the Product Reliability Report found at http://www.maxim-ic.com/.
Current monitor data for the BCD8 Process results in a FIT Rate of 2.3 @ 25C and 39.6 @ 55C (0.8 eV, 60% UCL)
B. Moisture Resistance Tests
The industry standard 85°C/85%RH or HAST testing is monitored per device process once a quarter.
C. E.S.D. and Latch-Up Testing
The NQ01 die type has been found to have all pins able to withstand a HBM transient pulse of +/-2500 V per JEDEC
JESD22-A114. Latch-Up testing has shown that this device withstands a current of +/-250 mA.
Maxim Integrated Products. All rights reserved.
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MAX15006Xxxx+
Table 1
Reliability Evaluation Test Results
MAX15006Xxxx+
TEST ITEM
TEST CONDITION
Static Life Test (Note 1)
Ta = 135°C
Biased
FAILURE
IDENTIFICATION
SAMPLE SIZE
NUMBER OF
FAILURES
DC Parameters
& functionality
48
0
DC Parameters
& functionality
77
0
DC Parameters
& functionality
77
0
Time = 192 hrs.
Moisture Testing (Note 2)
85/85
Ta = 85°C
RH = 85%
Biased
Time = 1000hrs.
Mechanical Stress (Note 2)
Temperature
-65°C/150°C
Cycle
1000 Cycles
Method 1010
Note 1: Life Test Data may represent plastic DIP qualification lots.
Note 2: Generic Package/Process data
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