Edixeon S series ®

Edixeon S series  ®
®
Edixeon S series
Edixeon® S series emitters are one of the highest flux LEDs in
the world by Edison Opto. Edixeon® S series emitters are designed to satisfy
more and more Solid-State lighting High Power LED applications for brilliant
world such as flash light, indoor and outdoor decoration light. Edixeon® S
series emitters are designed by particular package for reflow process
application. Unlike most fluorescent sources, Edixeon® S series contains no
mercury and has more energy efficient than other incandescent light source.
Features
Low voltage operation
Instant on
Long life
Typical Applications
Stage Lighting
Up-lights and Down-lights
LCD Backlights
Contour lights
Ceiling lights
Garden lighting
Decoration lights
Architectural lighting
Beacon light
Copyright©2008 Edison Opto. All rights reserved.
Table of Contents
Product Nomenclature .....................................................................................2
Environmental Compliance ..............................................................................3
LED Package Dimensions and Polarity ...........................................................4
LED Package with Star Dimensions and Polarity.............................................5
Absolute Maximum Ratings .............................................................................6
Luminous Flux Characteristics .........................................................................8
Forward Voltage Characteristics ......................................................................9
Reliability Items and Failure Measures ..........................................................10
Color Spectrum and Radiation Pattern........................................................... 11
JEDEC Information ........................................................................................16
Optical & Electrical Characteristics ................................................................17
Product Soldering Instructions .......................................................................23
Product Thermal Application Information .......................................................27
Product Electrical Application Information......................................................32
Emitter Product Packaging Information..........................................................33
Star Product Packaging Information...............................................................35
EDISON OPTO CORPORATION
1
Version:2
Product Nomenclature
The following table describes the available color, power, and lens type. For more flux
and forward voltage information, please consult the Bin Group document.
®
< Table 1 Edixeon S series nomenclature >
EDISON OPTO CORPORATION
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Version:2
Environmental Compliance
Edixeon® S series are compliant to the Restriction of Hazardous Substances Directive
or RoHS. The restricted materials including lead, mercury cadmium hexavalent
chromium, polybrominated biphenyls (PBB) and polybrominated diphenyl ether
(PBDE) are not used in Edixeon® S series to provide an environmentally friendly
product to the customers.
EDISON OPTO CORPORATION
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Version:2
LED Package Dimensions and Polarity
Lambertian
Top View
Bottom View
Anode(+)
Cathode(-)
(4)Slug
(3)Lens
(1)Lead
(2)Housing
Side View
Circuit
Anode(+)
slug
EDER-1LS3
EDEA-1LS3
EDET-1LS1
EDEJ-1LS1
EDEB-1LS5
EDEC-1LS5
EDED-1LS5
EDEV-1LS1
Anode(+)
slug
Cathode(-)
EDER-SLS3-03
EDET-SLC5-03
EDEB-SLC5-03
EDEC-SLC5-03
EDED-SLC5-03
Cathode(-)
EDEA-SLC3-03
EDEV-SLC1-03
®
< Figure 1 Edixeon S series dimensions >
Notes:
1. All dimensions are measured in mm.
EDISON OPTO CORPORATION
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Version:2
LED Package with Star Dimensions and Polarity
EDSx-xxxx-xx-Ax16
Top View
Side View
Edixeon
Pad
Star
EDSx-xxxx-xx-Bx16
Top View
Side View
Pad
EDISON
+
Edixeon
+
-
Square (25*25mm)
EDSx-xxxx-xx-Cx16
Top View
Side View
Edixeon
Edison Opto
+
+
Pad
+
Square (30*30mm)
Edixeon S-Star
®
<Figure 2 Edixeon star dimensions>
Notes:
1.All Dimensions are in mm.
EDISON OPTO CORPORATION
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Version:2
Absolute Maximum Ratings
The following tables describe the characteristics of Edixeon® S series under
various current.
< Table 2 Edixeon® S series absolute maximum ratings >
Parameter
Rating(1W)
Rating(3W)
Unit
Symbol
DC Forward Current
350
700
mA
IF
Peak pulse current (tp≦100µs, Duty cycle=0.25)
700
1,000
mA
Reverse Voltage
5
5
V
VR
Drive Voltage
5
5
V
VD
125
125
℃
TJ
Operating Temperature
-30 ~ +110
-30 ~ +110
℃
Storage Temperature
-40 ~ +120
-40 ~ +120
℃
60
60
%
4,000
4,000
V
5
5
Sec.
LED junction Temperature
Storage Relative Humidity
ESD Sensitivity
Manual Soldering Time at 260℃(Max.)
VB
Notes:
1. Proper current derating must be observed to maintain junction temperature below the
maximum at all time.
2. LEDs are not designed to be driven in reverse bias.
3. tp: Pulse width time
EDISON OPTO CORPORATION
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Version:2
The following table describes thermal resistance of Edixeon® S series.
®
< Table 3 Thermal Resistance Junction to Solder Pad Characteristics at TJ=25℃ for Edixeon
S series>
Part Name
RθJ-B
Typ.
Unit
EDER-1LS3
14
℃/W
EDEA-1LS3
13
℃/W
EDET-1LS1
13
℃/W
EDEJ-1LS1
13
℃/W
EDEB-1LS5
13
℃/W
EDEC-1LS5
13
℃/W
EDED-1LS5
13
℃/W
EDEV-1LS1
13
℃/W
EDER-SLC3-03
14
℃/W
EDEA-SLC3-03
14
℃/W
EDET-SLC5-03
13
℃/W
EDEJ-SLC1-03
13
℃/W
EDEB-SLC5-03
13
℃/W
EDEC-SLC5-03
13
℃/W
EDED-SLC5-03
13
℃/W
EDEV-SLC1-03
13
℃/W
EDISON OPTO CORPORATION
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Version:2
Luminous Flux Characteristics
The following tables describe flux of Edixeon® S series under various current
and different color.
< Table 4 Power and Luminous flux characteristics at IF=350mA and TJ=25℃: >
Flux / Pwoer
Lens Item
Lambertian
Part Name
Color
Unit
Min.
Typ.
Max.
EDER-1LS3
Red
30.3
45.0
--
lm
EDEA-1LS3
Amber
30.3
45.0
--
lm
EDET-1LS1
True Green
51.2
70.0
--
lm
EDEJ-1LS1
Cyan
23.3
30.0
--
lm
EDEB-1LS5
Blue
8.2
13.0
--
lm
EDEC-1LS5*
Royal Blue
170.9
220.0
--
mW
EDED-1LS5*
Dental Blue
170.9
200.0
--
mW
EDEV-1LS1*
UV
113.9
180.0
--
mW
< Table 5 Power and Luminous flux characteristics at IF=700mA and TJ=25℃: >
Flux / Pwoer
Lens Item
Part Name
Color
Unit
Min.
Typ.
Max.
EDER-SLC3-03
Red
66.5
75.0
--
lm
EDEA-SLC3-03
Amber
66.5
75.0
--
lm
EDET-SLC5-03
True Green
86.5
120.0
--
lm
EDEJ-SLC1-03
Cyan
39.3
50.0
--
lm
EDEB-SLC5-03
Blue
13.8
20.0
--
lm
EDEC-SLC5-03*
Royal Blue
256.3
350.0
--
mW
EDED-SLC5-03*
Dental Blue
256.3
320.0
--
mW
EDEV-SLC1-03*
UV
170.9
250.0
--
mW
Lambertian
Notes:
1.
Flux is measured with an accuracy of ± 10%
2.
Blue power light source represented here is IEC60825 class 2 for eye safety.
3.
Red and true green light source represented here are IEC60825 class 1 for eye safety.
4.
* Mark is power characteristics
EDISON OPTO CORPORATION
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Version:2
Forward Voltage Characteristics
The following table describes forward voltage of Edixeon® S series under various
current.
< Table 6 Forward voltage characteristics at IF=350mA &700mA and TJ=25℃>
Lens Item
Part Name
Unit
Min.
Typ.
Max.
EDER-1LS3
2.0
--
3.0
EDEA-1LS3
2.0
--
3.0
EDET-1LS1
3.1
--
4.0
3.1
--
4.0
EDEB-1LS5
3.1
--
4.0
EDEC-1LS5
3.1
--
4.0
EDED-1LS5
3.1
--
4.0
EDEV-1LS1
3.1
--
4.0
EDER-SLC3-03
2.0
--
3.0
EDEA-SLC3-03
2.0
--
3.0
EDET-SLC5-03
3.4
--
4.3
3.4
--
4.3
3.4
--
4.3
EDEC-SLC5-03
3.4
--
4.3
EDED-SLC5-03
3.4
--
4.3
EDEV-SLC1-03
3.4
--
4.3
EDEJ-1LS1
Lambertian
VF
Forward Current
(mA)
350
EDEJ-SLC1-03
EDEB-SLC5-03
700
V
Note:
1.
Forward voltage is measured with an accuracy of ± 0.1V
EDISON OPTO CORPORATION
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Version:2
Reliability Items and Failure Measures
Reliability test
The following table describes operating life, mechanical, and environmental tests
performed on Edixeon® S series package.
< Table 7 Operating life, mechanical, and environmental characteristics at IF=350mA~700mA
and TJ=25℃>
Stress Test
Stress Conditions
Stress
Duration
Failure Criteria
Room Temperature Operating Life
25℃, IF = max DC (Note 1)
1,000 hours
Note 2
High Temperature High Humidity
85℃ / 85%RH
1,000 hours
Note 2
Temperature Cycle
-40℃/100℃ ,30 min dwell /<5min transfer
500 cycles
Note 2
High Temperature Storage Life
110℃
1,000 hours
Note 2
Low Temperature Storage Life
-40℃
1,000 hours
Note 2
Thermal Shock
-40 / 125℃, 15 min dwell /<10 sec transfer 1,000 cycles
No catastrophics
Mechanical Shock
1500 G, 0.5 Ms pulse, 5 shocks each of 6
axis
No catastrophics
Solder Heat Resistance (SHR)
260℃ ± 5℃, 10 sec
No catastrophics
Notes:
1.
2.
Depending on the maximum derating curve.
Failure Criteria:
Electrical failures
VF shift >=10%
Light Output Degradation
% Iv shift >= 30% @1,000hrs or 200cycle
Visual failures
Broken or damaged package or lead
Solderability < 95% wetting
Dimension out of tolerance
EDISON OPTO CORPORATION
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Version:2
Color Spectrum and Radiation Pattern
Relative intensity (%)
100
Thru
Green
Blue
Dental
Blue
Red
80
Royal
Blue
Ultraviolet
Amber
Cyan
60
40
20
0
390
400
450
500
550
600
650
700
Relative intensity (%)
®
<Figure 3.Color spectrum at TJ =25℃.for Edixeon S series >
Color Temperature or Dominant Wavelength Characteristics
< Table 8 Dominant Wavelength and Peak Wavelength Characteristics at TJ =25℃ >
Lens ltem
Part Name
Color
EDER-1LS3
λd/λP*
Unit
Min.
Typ.
Max.
Red
620
--
630
nm
EDEA-1LS3
Amber
585
--
595
nm
EDET-1LS1
True Green
515
--
530
nm
EDEJ-1LS1
Cyan
490
--
510
nm
EDEB-1LS5
Blue
455
--
475
nm
EDEC-1LS5*
Royal Blue
440
--
460
nm
EDED-1LS5*
Dental Blue
450
--
470
nm
EDEV-1LS1*
UV
395
--
410
nm
EDER-SLC3-03
Red
620
--
630
nm
EDEA-SLC3-03
Amber
585
--
595
nm
EDET-SLC5-03
True Green
515
--
535
nm
EDEJ-SLC1-03
Cyan
490
--
510
nm
EDEB-SLC5-03
Blue
455
--
475
nm
EDEC-SLC5-03*
Royal Blue
440
--
460
nm
EDED-SLC5-03*
Dental Blue
450
--
470
nm
EDEV-SLC1-03*
UV
395
--
410
nm
Lambertian
Note:
2.
Wavelength is measured with an accuracy of ± 2nm
EDISON OPTO CORPORATION
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Version:2
100
90
Luminous Intesity (%)
80
70
60
50
40
30
20
10
0
-100
-80
-60
-40
-20
0
20
40
60
80
100
Angular (Deg)
< Figure 4.Lambertain Relative Intensity vs. Angular for EDER、EDEA at TJ=25℃.>
100
90
Luminous Intesity (%)
80
70
60
50
40
30
20
10
0
-100
-80
-60
-40
-20
0
20
40
60
80
100
Angular (Deg)
< Figure 5.Lambertain Relative Intensity vs. Angular for EDEA-SLC3-03 X direction at
TJ=25℃.>
EDISON OPTO CORPORATION
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Version:2
100
Luminous Intensity(%)
90
80
70
60
50
40
30
20
10
0
-100
-80
-60
-40
-20
0
20
40
60
80
100
Angular (Deg)
< Figure 6.Lambertain Relative Intensity vs. Angular for EDEA-SLC3-03 Y direction at
TJ=25℃.>
100
90
Luminous Intesity (%)
80
70
60
50
40
30
20
10
0
-100
-80
-60
-40
-20
0
20
40
60
80
100
Angular(Deg)
< Figure 7.Lambertain Relative Intensity vs. Angular for EDET-1LS1、EDEB、EDEC、EDED at
TJ=25℃.>
EDISON OPTO CORPORATION
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Version:2
100
Luminous Intensity (%)
90
80
70
60
50
40
30
20
10
0
-100
-80
-60
-40
-20
0
20
40
60
80
100
Angular (Deg)
< Figure 8.Lambertain Relative Intensity vs. Angular for EDEJ-SLC1-03、EDEV-SLC1-03, X
direction at TJ=25℃.>
100
Luminous Intensity (%)
90
80
70
60
50
40
30
20
10
0
-100
-80
-60
-40
-20
0
20
40
60
80
100
Angular (Deg)
< Figure 9.Lambertain Relative Intensity vs. Angular for EDEJ-SLC1-03、EDEV-SLC1-03, Y
direction at TJ=25℃.>
EDISON OPTO CORPORATION
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Version:2
Note:
1.EDEA-SLC3-03、EDEJ-SLC1-03、EDEV-SLC1-03 Testing direction
X Direction
Y Direction
Emission Angle Characteristics
< Table 9 Emission angle characteristics at TJ=25℃ >
Lens ltem
Lambertian
2Θ½(Typ.)
Part Name
Lambertian
Unit
EDER-1LS3
130
Deg.
EDEA-1LS3
130
Deg.
EDET-1LS1
150
Deg.
EDEJ-1LS1
130
Deg.
EDEB-1LS5
150
Deg.
EDEC-1LS5
150
Deg.
EDED-1LS5
150
Deg.
EDEV-1LS1
150
Deg.
EDER-SLC3-03
130
Deg.
EDEA-SLC3-03
X:125
Y:135
Deg
EDET-SLC5-03
130
Deg.
EDEJ-SLC1-03
X:130
Y:150
Deg
EDEB-SLC5-03
130
Deg.
EDEC-SLC5-03
130
Deg.
EDED-SLC5-03
150
Deg.
EDEV-SLC1-03
X:130
Y:150
Deg.
Note:
1.
Emission angular is measured with an accuracy of ± 10 degree
EDISON OPTO CORPORATION
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Version:2
JEDEC Information
JEDEC has defined a moisture sensitivity classification. So that the users can
properly store and handle the devices and to avoid subsequent thermal and
mechanical damage during the assembly reflow attachment or repair
operation.
The present moisture sensitivity standard contains six levels, the lower the
level ,the longer the devices floor life. Edixeon® K series are certified at level
2a. This means Edixeon® K series have a floor life of 4 weeks before K series
need to re-baked.
< Table 10 JEDEC characteristics at IF=350mA/700mA/1000mA and TJ=25℃>
Soak Requirements
4
Accelerated Equivalent
Floor Life
Level
Standard
Time
Condition
Time(hours)
72 hours
≦30℃/60% RH
96 +5/-0
1
eV
0.40~0.48
Condition
30℃/60% RH
eV
0.30~0.39
Condition
Time(hours) Time(hours)
20 +5/-0
24 +5/-0
60℃/60% RH
Soak Requirements
Accelerated Equivalent
Floor Life
Level
Standard
eV
0.40~0.48
eV
0.30~0.39
Condition
Time
Condition
Time(hours)
Condition
1
Unlimited
≦30℃/85% RH
168 +5/-0
85℃/85% RH
NA
NA
NA
2
1 year
≦30℃/60% RH
168 +5/-0
85℃/60% RH
NA
NA
NA
1
30℃/60% RH
120 +1/-0
168 +1/-0
60℃/60% RH
1
30℃/60% RH
40 +5/-0
52 +5/-0
60℃/60% RH
1
30℃/60% RH
20 +5/-0
24 +5/-0
60℃/60% RH
1
30℃/60% RH
15 +5/-0
20 +5/-0
60℃/60% RH
2a
4 weeks
≦30℃/60% RH
696 +5/-0
3
168 hours
≦30℃/60% RH
192 +5/-0
72 hours
4
≦30℃/60% RH
Time(hours) Time(hours)
96 +5/-0
5
48 hours
≦30℃/60% RH
72 +5/-0
5a
24 hours
≦30℃/60% RH
48 +5/-0
1
30℃/60% RH
10 +5/-0
13 +5/-0
60℃/60% RH
TOL
30℃/60% RH
NA
NA
NA
Time on label
≦30℃/60% RH
(TOL)
6
Note:
1.
The standard soak time includes a default value of 24 hours for semiconductor
manufacturer’s exposure time (MET) between bake and bag , and includes the
maximum time allowed out of the bag at the distributor’s facility.
EDISON OPTO CORPORATION
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Version:2
Optical & Electrical Characteristics
800
Forward Current(mA)
700
600
500
400
Rth(J-A)=40° C/W
300
Rth(J-A)=30° C/W
Rth(J-A)=25° C/W
200
Rth(J-A)=20° C/W
Rth(J-A)=15° C/W
100
0
0
25
100
75
50
125
150
Ambient temperature(° C)
<Figure 10 Forward current & ambient temperature at 700mA>
400
350
Forward Current(mA)
300
250
200
Rth(J-A)=60° C/W
150
Rth(J-A)=50° C/W
100
Rth(J-A)=40° C/W
Rth(J-A)=30° C/W
50
0
0
25
50
75
100
125
150
Ambient temperature(° C)
< Figure 11 Forward current & ambient temperature at 350mA >
EDISON OPTO CORPORATION
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Version:2
Forward Voltage (V)
3.50
3.00
2.50
2.00
1.50
0
350
700
1050
1400
Forward Current (mA)
< Figure 12 Forward current & forward voltage for EDER、EDEA at TJ=25℃>
4.50
Forward Voltage (V)
4.00
3.50
3.00
2.50
2.00
0
350
700
1050
1400
Forward Current (mA)
< Figure 13 Forward current & forward voltage for EDET、EDEJ、EDEB、EDEC、EDED、EDEV
at TJ=25℃>
EDISON OPTO CORPORATION
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Version:2
Relative Luminous Intensity (%)
2.50
2.00
1.50
1.00
0.50
0.00
0
350
700
1050
1400
Forwadr Current (mA)
<Figure 14 Forward current & relative luminous for EDER、EDEA at TJ=25℃>
Relative Luminous Intensity (%)
2.50
2.00
1.50
1.00
0.50
0.00
0
350
700
1050
1400
Forwadr Current (mA)
<Figure 15 Forward current & relative luminous for EDET、EDEJ at TJ=25℃>
EDISON OPTO CORPORATION
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Version:2
Relative Luminous Intensity (%)
3.00
2.50
2.00
1.50
1.00
0.50
0.00
0
350
700
1050
1400
Forwadr Current (mA)
<Figure 16 Forward current & relative luminous for EDEB、EDED、EDEC、EDEV at TJ=25℃>
630
Red
Wavelength (nm)
620
610
600
Amber
590
580
0
350
700
1050
1400
Forward Current (mA)
<Figure 17 Forward current & wavelength for EDER、EDEA at TJ=25℃>
EDISON OPTO CORPORATION
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Version:2
535
530
Wavelength (nm)
525
Green
520
515
510
505
500
Cyan
495
490
0
350
700
1050
1400
Forward Current (mA)
<Figure 18 Forward current & wavelength for EDET、EDEJ at TJ=25℃>
465.00
Wavelength (nm)
462.50
460.00
Blue
457.50
455.00
Royal Blue
Dental Blue
452.50
450.00
0
350
700
1050
1400
Forward Current (mA)
<Figure 19 Forward current & wavelength for EDEB、EDED、EDEC at TJ=25℃>
EDISON OPTO CORPORATION
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Version:2
405
Wavelength (nm)
403
401
UV
399
397
395
0
350
700
1050
1400
Forward Current (mA)
<Figure 20 Forward current & wavelength for EDEV at TJ=25℃>
EDISON OPTO CORPORATION
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Version:2
Product Soldering Instructions
The central circle pad at the bottom face of the package provides the main path for
heat dissipation from the LED to the heat sink (heatsink contact).
1.60
Solder Pad
Slug Pad
4.2
Solder Pad
Notes:
3.6
Ø6.0
1.90
< Figure 21 Pad dimensions >
1. All dimensions are measured in mm.
2. Solder pad cannot be connected to slug pad.
3. MCPCB material with a thermal conductivity
greater than 3.0 W/mK.
®
4. Please avoid touching the Edixeon lens
during assembly processes .This may cause
pollution or scratch on the surface of lens.
The choice of solder and the application method will dictate the specific amount of
solder. For most consistent results, an automated dispensing system or a solder
stencil printer is recommended.
Positive results will be used solder thickness that results in 50µm. The lamp can be
placed on the PCB simultaneously with any other required SMD devices and reflow
completed in a single step. Automated pick-and-place tools are recommended.
The central slug at the bottom face of the package provides the main path for heat
dissipation from the LED to the heat sink (heat sink contact). A key feature of
Edixeon® emitter is an electrically neutral heat path that is separate from the LED’s
electrical contacts. This electrically isolated thermal pad makes Edixeon® emitter
perfect for use with metal-core printed circuit boards (MCPCB).
EDISON OPTO CORPORATION
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Version:2
Recommend Solder Steps
To prevent mechanical failure of LEDs in the soldering process, a carefully controlled
preheat and post-cooling sequence is necessary. The heating rate in an IR furnace
depends on the absorption coefficients of the material surfaces and on the ratio of the
component’s mass to its irradiated surface. The temperature of parts in an IR furnace,
with a mixture of radiation and convection, cannot be determined in advance.
Temperature measurement may be performed by measuring the temperature of a
specific component while it is being transported through the furnace. Influencing
parameters on the internal temperature of the component are as follows:
• Time and power
• Mass of the component (for Edixeon® S series on MCPCB)
• Size of the MCPCB
• Absorption coefficient of the surfaces and MCPCB
• Packing density
Peak temperatures can vary greatly across the MCPCB during IR processes. The
variables that contribute to this wide temperature range include the furnace type and
the size, mass and relative location of the components on the board. Profiles must be
carefully tested to determine the hottest and coolest points on the board. The hottest
and coolest points should fall within the recommended temperatures. The profile of
the reflow system should be based on design needs, the selected solder system and
the solder-paste manufacturer’s recommended reflow profile.
EDISON OPTO CORPORATION
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Version:2
Recommended Profile for Reflow Soldering
The following reflow soldering profiles are provided for reference. It is recommended
that users follow the recommended soldering profile provided by the manufacturer of
the solder paste used.
< Figure 22 Reflow profiles >
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Version:2
Table of Classification Reflow Profiles
< Table 10 Reflow profiles >
Profile Feature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-120 seconds
3 °C/second max.
3 °C/second max.
Liquidous temperature (TL)
Time at liquidous (tL)
183 °C
60-150 seconds
217 °C
60-150 seconds
Peak package body temperature (Tp)*
230 °C ~235 °C *
255 °C ~260 °C *
235 °C
260 °C
Time (tp)** within 5 °C of the specified
classification temperature (Tc)
20** seconds
30** seconds
Average ramp-down rate (Tp to Tsmax)
6 °C/second max.
6 °C/second max.
6 minutes max.
8 minutes max.
Preheat & Soak
Temperature min (Tsmin)
Temperature max (Tsmax)
Time (Tsmin to Tsmax) (ts)
Average ramp-up rate
(Tsmax to Tp)
Classification temperature (Tc)
Time 25 °C to peak temperature
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
EDISON OPTO CORPORATION
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Version:2
Product Thermal Application Information
Thermal grease should be evenly speeded with a thickness <100um.
When assembling on MCPCB or heat sink carrier.
Edixeon® S series on MCPCB
Edixeon® S series
Edixeon® S series on MCPCB and heat sink
®
<Figure 23 Edixeon S series heat sink application >
®
<Figure 24 Edixeon S series assemble with heatsink>
EDISON OPTO CORPORATION
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Version:2
Thermal Resistance Application
TJunction
Rth(J-S)
TSlug
Rth(S-G)
TGrease
Rth(G-B)
TBoard
Rth(B-A)
TAmbient
TJunction
TSlug
TGrease
TBoard
TAmbient
Rth(J-A)= Rth(J-S) +Rth(S-G) + Rth(G-B)+ Rth(B-A)
TJunction =TAmbient + Rth(J-A) x PDissipation
(TJ =TA + Rth(J-A) x PDissipation)
®
<Figure 25 Rth and TJ for Edixeon S series >
Suggested Adhesive for Selection(such as thermal grease)
Ease of use
Non-solvent, One-part
Fast tack free
3 minutes at 25oC
No corrosion
Alcohol type of room temperature vulcanization (RTV)
Low volatility
Low weight loss of silicone volatiles
Adhesion
Excellent adhesion to most materials without use of a primer
Dielectric properties
Cured rubber exhibits good dielectric properties
Excellent thermal stability and cold resistance
Cured rubber provides wide service temperature range
EDISON OPTO CORPORATION
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Version:2
<Table 11 Specifications for adhesive properties >
Specification
Suggested Properties
Take-free time
3~10 minutes
Specific gravity
< 3 g/cm
Thermal conductivity
> 2.5 W/mK
Rth in using
< 1.8 C/W
2
o
14
Volume resistance
> 1x10
Lap shear adhesion strength
> 200 N/ cm
Tensile strength
> 4 Mpa
2
Thermal Resistance Calculation
The thermal resistance between two points is defined as the ratio of the difference in
temperature to the power dissipated. For calculations in the following units used are
°C/W. In the case of LEDs, the resistance of two important thermal paths affects the
junction temperature:
From the LED junction to the thermal contact at the bottom of the package, this
thermal resistance is governed by the package design. It is referred to as the thermal
resistance between junction and slug (Rth (J-S))
From the thermal contact to ambient conditions, this thermal resistance is defined by
the path between the slug ,board ,and ambient. It is referred to as the thermal
resistance between slug and board (Rth (S-B)) and between board and ambient (Rth
(B-A)).
The overall thermal resistance between the LED junction and ambient (Rth (J-A)) can
be modeled as the sum of the series resistances Rth (J-S) , Rth (S-B).,and Rth (B-A).
The following will show how to calculate Rth for each part of LED module.
1. Rth(J-S)
Assume Edixeon® Rth(J-S)=13 ºC/W
2. Rth(S-G)
If the thickness of thermal grease is 100um and area is (6.4/2)2π mm2.
Thermal conductivity of thermal grease is 2.6 W/mK.
Thickness(um)
The Formula of Rth is
2
Thermal Conductivity (W/mK) x Area(mm )
EDISON OPTO CORPORATION
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Version:2
Therefore Rth(S-G)=
100
2
2.6 X (6.4/2) π
= 1.2 ºC/W
3. Rth(G-B)
The Rth of standard MCPCB is 1.5 ºC/W
4. Rth(B-A)
The Rth between board and air is mainly dependent on the total surface area.
500
Therefore Rth(B-A) ≒
Area(cm)
2
If Area is 30cm2 Rth=16.7
Rth(J-A) =13+1.2+1.5+16.7 =32.4 ºC/W
2
Rth(J-A) =13+1.2+1.5+8.3 =24 ºC/W
2
Rth(J-A) =13+1.2+1.5+5.5 =21.2 ºC/W
If Area is 60cm Rth=8.3
If Area is 90cm Rth=5.5
Junction Temperature Calculation
The total power dissipated by the LED is the product of the forward voltage (VF) and
the forward current (IF) of the LED.
The temperature of the LED junction is the sum of the ambient temperature and the
product of the thermal resistance from junction to ambient and the power dissipated.
TJunction =TAir + Rth(J-A) x PDissipation
If one white Edixeon® in room temperature (25ºC) operated 350mA and VF=3.3V,
the PDissipation=0.35 x 3.3=1.155W
And junction temperature is
TJunction = 25ºC+ 18.2 x 1.155 = 46.021ºC (total surface area =90cm2)
TJunction = 25ºC+ 21 x 1.155 = 49.255 ºC (total surface area =60cm2)
TJunction = 25ºC+ 29.4 x 1.155 = 58.957 ºC (total surface area =30cm2)
Example : Junction Temperature Calculation
One white LED is used under ambient temperature (TAmbient ) of 30°C. This LED is
soldered on MCPCB (Area=10cm2). Calculate junction temperature.
Assuming a forward voltage of VF=3.3V at 350mA and total power dissipated is
PDissipation=1x 0.35 x 3.3= 1.155 W.
LED Rth(J-S)=13 ºC/W.
With good design, Rth(S-G) can be minimized to 1 ºC/W.
Rth(G-B) of a standard MCPCB can be 1.5 ºC/W.
EDISON OPTO CORPORATION
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Version:2
The Rth between board and air is mainly dependent on the total surface area.
500
Therefore it can be calculated in formula
Area(cm)
2
500
Rth(B-A)=
10
=50 ºC/W.
Following the formula TJunction =TAmbient + Rth(J-A) x PDissipation
TJunction=30 oC + (13 ºC/W +1 ºC/W +1.5 ºC/W +50 ºC/W) x 1.155W
=105.6525 ºC
That means this LED emitter is operated under good condition(TJunction<125 ºC).
It’s strongly recommended to keep the junction temperature under 125 ºC
Or keep the temperature of emitter lead not exceed 55 ºC
EDISON OPTO CORPORATION
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Version:2
Product Electrical Application Information
Following graphs and descriptions show how to connect LED or LED module and plug
to AC outlet.
Step1: Connect the wires of LED Module to the DC output of the driver.
<Figure 26 LED Module connect to the DC output of the driver>
Step2 : Plug the driver to AC outlet.
<Figure 27 Plug the AC output of the driver to AC outlet>
Caution: Never plug the driver to AC outlet before the LED Module is properly
connected as this may generate transient voltage damage the LEDs permanently with
a short or open circuit.
EDISON OPTO CORPORATION
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Version:2
Emitter Product Packaging Information
Cover Tape
Carrier Tape
Leader Length 20 Pockets
15”Reel
Φ13mm
艾笛森光電股份有限公司
EDISON OPTO COPORATION
Part No: EDEW-KLC8-B3
Inspected by:
Group: UZ1V03
Color: White
Label
Quantity: 1000
ROHS
A41 00 000 05
Directive Compl iance
Tel +86-2-82276996 Fax +86- 2-8227-6997
4F No.800 Chung-Cheng ., Chung-Ho City Taipei. Taiwan
Item
Quantity
Total
Dimensions(mm)
15”Reel
1,000pcs
1,000pcs
Diameter=380
Inner box
2 reels
2,000pcs
390*390*170
Outer box
2 inner boxes
4,000pcs
425*405*350
<Figure 28 Taping reel dimensions>
EDISON OPTO CORPORATION
33
Version:2
7”Reel
Φ13mm
艾笛森 光電 股份有 限公司
E D IS O N O PT O C O P O R A TIO N
P a rt N o: E D E W -K L C 8-B 3
I ns p ec t ed by :
G roup : U Z1 V 03
C o lor: W hit e
Qu ant it y : 1 000
A4 1 0 0 0 0 0 0 5
R O HS
D ri e c ti ve C om p l i an c e
T el +8 6-2- 8227 6996 Fax +86- 2-8 227- 6997
4F N o.8 00 C hu ng-C he ng ., C hung -H o C ity T aipei. T aiw an
Label
Item
Quantity
Total
Dimensions(mm)
7”Reel
200pcs
200pcs
Diameter=178
Inner box
2 reels
400pcs
240*235*67
Outer box
5 inner boxes
2,000pcs
353*254*256
<Figure 29 Taping reel dimensions>
d By:
I nspecte
Pb
No.:
x00
5xxxELExs
100pc
00
A0W1V
XX
XXXXX
有限 公司
電股份 ORAT ION
艾笛森光OPTO CORP
EDIS ON
Lot No.:
ity:
Quant
:
Group
Part
69 97
. O.C
6 -2-8227
iwan,R
FAX.:88
i pei,Ta
-8227 6996 800號4 樓
C ity,Ta
ng-Ho
TEL. :886-2
中正路
R d.,Chu
Cheng
台北 縣中和市
,Chung4F, No.800
The Label
Label
< Figure 30 Label on bag >
EDISON OPTO CORPORATION
< Figure 31 Package label >
34
Version:2
Star Product Packaging Information
Tray
Cover
Item
Quantity
Total
Dimensions(mm)
Tray
100pcs
100pcs
325*300
Inner box
10 Tray
1,000pcs
340*330*160
Outer box
2 inner boxes
2,000pcs
350*350*340
Tray
Cover
Item
Quantity
Total
Dimensions(mm)
Tray
60pcs
60pcs
310*290
Inner box
10 Tray
600pcs
340*330*160
Outer box
2 inner boxes
1200pcs
350*350*340
®
<Figure 32 Edixeon Star Package>
EDISON OPTO CORPORATION
35
Version:2
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