User's Guide MSP430FG4618/F2013 Experimenter’s Board

User's Guide MSP430FG4618/F2013 Experimenter’s Board
MSP430FG4618/F2013 Experimenter’s Board
U
s
e
r 's
G
u
i d
e
User's Guide
October 2007
SLAU213A
Mixed Signal Products
EVM TERMS AND CONDITIONS
Texas Instruments (TI) provides the enclosed Evaluation Module and related material (EVM) to you, the user,
(you or user) SUBJECT TO the terms and conditions set forth below. By accepting and using the EVM, you are
indicating that you have read, understand and agree to be bound by these terms and conditions. IF YOU DO
NOT AGREE TO BE BOUND BY THESE TERMS AND CONDITIONS, YOU MUST RETURN THE EVM AND
NOT USE IT.
This EVM is provided to you by TI and is intended for your INTERNAL ENGINEERING DEVELOPMENT OR
EVALUATION PURPOSES ONLY. It is provided ”AS IS” and ”WITH ALL FAULTS.” It is not considered by TI to
be fit for commercial use. As such, the EVM may be incomplete in terms of required design−, marketing−, and/or
manufacturing related protective considerations, including product safety measures typically found in the end
product. As a prototype, the EVM does not fall within the scope of the European Union directive on
electromagnetic compatibility and therefore may not meet the technical requirements of the directive.
Should this EVM not meet the specifications indicated in the EVM User’s Guide, it may be returned within 30
days from the date of delivery for a full refund of any amount paid by user for the EVM, which user agrees shall
be user’s sole and exclusive remedy. THE FOREGOING WARRANTY IS THE EXCLUSIVE WARRANTY MADE
BY TI TO USER, AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY,
INCLUDING ANY WARRANTY OF MERCHANTABILITY, FITNESS FOR ANY PARTICULAR PURPOSE OR
NON−INFRINGEMENT.
TI shall have no obligation to defend any claim arising from the EVM, including but not limited to claims that the
EVM infringes third party intellectual property. Further, TI shall have no liability to user for any costs, losses or
damages resulting from any such claims. User shall indemnify and hold TI harmless against any damages,
liabilities or costs resulting from any claim, suit or proceeding arising from user’s handling or use of the EVM,
including but not limited to, (i) claims that the EVM infringes a third party’s intellectual property, and (ii) claims
arising from the user’s use or handling of the EVM. TI shall have no responsibility to defend any such claim, suit
or proceeding.
User assumes all responsibility and liability for proper and safe handling and use of the EVM and the evaluation
of the EVM. TI shall have no liability for any costs, losses or damages resulting from the use or handling of the
EVM. User acknowledges that the EVM may not be regulatory compliant or agency certified (FCC, UL, CE, etc.).
Due to the open construction of the EVM it is the user’s responsibility to take any and all appropriate precautions
with regard to electrostatic discharge.
EXCEPT TO THE EXTENT OF THE USER’S INDEMNITY OBLIGATIONS SET FORTH ABOVE, NEITHER
PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR
CONSEQUENTIAL DAMAGES WHETHER TI IS NOTIFIED OF THE POSSIBILITY OR NOT.
TI currently deals with a variety of customers for products, and therefore our arrangement with the user is not
exclusive.
TI assumes no liability for applications assistance, customer product design, software performance, or
infringement of patents or services described herein.
User agrees to read the EVM User’s Guide and, specifically, the EVM warnings and Restrictions notice in the
EVM User’s Guide prior to handling the EVM and the product. This notice contains important safety information
about temperatures and voltages.
It is user’s responsibility to ensure that persons handling the EVM and the product have electronics training and
observe good laboratory practice standards.
By providing user with this EVM, product and services, TI is NOT granting user any license in any patent or other
intellectual property right.
Mailing Address: Texas Instruments Post Office Box 655303 Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
If You Need Assistance
Support for the MSP430 device and the experimenter’s board
is provided by the Texas Instruments Product Information
Center (PIC). Contact information for the PIC can be found on
the TI web site at www.ti.com. Additional device-specific
information can be found on the MSP430 web site at
www.ti.com/msp430.
Note: IAR KickStart is supported by Texas Instruments
Although IAR KickStart is a product of IAR, Texas Instruments provides
the support for it. Therefore, please do not request support for KickStart
from IAR. Please consult the extensive documentation provided with
KickStart before requesting assistance.
FCC Warning
This equipment is intended for use in a laboratory test
environment only. It generates, uses, and can radiate radio
frequency energy and has not been tested for compliance with
the limits of computing devices pursuant to subpart J of part 15
of FCC rules, which are designed to provide reasonable
protection against radio frequency interference. Operation of
this equipment in other environments may cause interference
with radio communications, in which case the user at his own
expense will be required to take whatever measures may be
required to correct this interference.
1. Getting Started
The MSP430FG4618/F2013 experimenter’s board is a comprehensive
development target board that can be used for a number of applications. The
MSP-EXP430FG4618 kit comes with one MSP430FG4618/F2013 experimenter’s
board shown in Figure 1 and two AAA 1.5 V batteries.
Figure 1: MSP430FG4618/F2013 Experimenter’s Board
2. Devices Supported
The MSP430FG4618/F2013 experimenter’s board is based on the Texas
Instruments ultra-low power MSP430 family of microcontrollers [1, 2]. Residing on
this board are the MSP430FG4618 [3] and the MSP430F2013 [4] microcontrollers.
3. Tools Requirement
An MSP430 Flash Emulation Tool (MSP-FET430UIF) is required to download
code and debug the MSP430FG4618 and MSP430F2013. Two separate JTAG
headers are available, supporting independent debug environments. The
MSP430FG4618 uses the standard 4-wire JTAG connection while the
MSP430F2013 uses the Spy-Bi-wire (2-wire) JTAG interface allowing all port pins
to be used during debug. For more details on the Flash Emulation Tool, refer to
the MSP430 Flash Emulation Tool (FET) User’s Guide [5], which covers two
different debug environments: IAR Embedded Workbench and TI Code Composer
Essentials (CCE). Detailed information of their use is included in Appendix A.
1
4. Functional Overview
The MSP430FG4618/F2013 experimenter’s board supports various applications
through the use of the on-chip peripherals connecting to a number of on-board
components and interfaces as shown in Figure 2.
Wireless
CC1100/
2420/2500
EMK
Interface
Analog
Out
LCD
RS-232
Buzzer
JTAG1
FG4618
JTAG2
Microphone
F2013
Capacitive
Touch
Pad
Buttons
Figure 2: Experimenter’s Board Block Diagram
Wireless communication is possible through the expansion header which is
compatible with all Chipcon Wireless Evaluation Modules from Texas Instruments.
Interface to a 4-mux LCD, UART connection, microphone, audio output jack,
buzzer, and single touch capacitive touch pad enable the development of a variety
of applications. Communication between the two on-board microcontrollers is also
possible. In addition, all pins of the MSP430FG4618 are made available either via
headers or interfaces for easy debugging. Sample code for this board is available
online at www.ti.com/msp430.
2
5. Hardware Installation
Power may be provided locally from two on-board AAA batteries, externally from a
Flash emulation tool (FET), or an external supply. The power source is selected
by configuring jumpers VCC_1, VCC_2, and BATT. PWR1 and PWR2 will supply
power to each MSP430 independently. Appendix B has information on the exact
location of these jumpers. Figure 3 shows the jumper hierarchy and configuration
options.
Figure 3: Jumper Settings for Power Selection
The battery jumper BATT is used to select the on-board batteries to power the
system, independent of the FET connections. The user must ensure that this
voltage meets the requirement for proper functionality of the MSP430.
The power selection jumpers VCC_1 and VCC_2 select the power connections
between the board and each FET interface. These jumpers are two rows of 3-pin
headers, one for each MSP430 on-board. VCC_1, the bottom row, is for the
MSP430FG4618 and, VCC_2 on the top row, is for the MSP430F2013. A jumper
placed on the rightmost 2-pins (FET) selects the JTAG FET as the power source.
A jumper placed on the leftmost 2-pins (LCL) would enable local power (either
from the batteries or an external supply) to be applied to each FET for proper logic
threshold level matching during program/debug.
Headers PWR1 and PWR2 have been provided to enable power to the individual
MSP430s. A jumper placed on PWR1 provides power to the MSP430FG4618 and
a jumper placed on PWR2 provides power to the MSP430F2013. Individual device
current consumption can be measured via each of these jumpers. Care should be
taken that MSP430 interconnections are not made that could influence such a
measurement.
Once the required power selections have been made the experimenter’s board is
ready to be used. Both the MSP430FG4618 and MSP430F2013 are factory
programmed. After power up, the MSP430FG4618 executes an ultra-low power
real-time clock displayed on the LCD. The MSP430F2013 pulses LED3 from
LPM3 using the VLO as a periodic wake-up time base.
3
6. Functional Overview
This section contains information about the various on-board interfaces and their
functionality and about the various peripherals enabling these interfaces. Wireless
applications are facilitated using the MSP430’s capabilities to interface with the
Chipcon wireless evaluation modules (CCxxxxEMK) from Texas Instruments. The
on-board LEDs and LCD display are used for visual feedback. Audio applications
leveraging the MSP430FG4618’s full analog signal chain can be implemented
using the microphone and the audio output jack. In addition, communication
across components on and off the board has been integrated.
6.1 Interfaces
Some of these interfaces have the option of being inactive when not in use to
conserve power. This is made possible by MSP430 port pin configurations and/or
hardware jumpers on-board. Appendix B gives complete details of these jumper
configurations and their positions.
6.1.1 4-Mux LCD Display
The integrated SoftBaugh SBLCDA4 LCD display supports 4-MUX
operation and interfaces to the LCD driver peripheral of the
MSP430FG4618. More information on the LCD can be obtained from the
manufacturer’s datasheet.
6.1.2 Momentary-On Push Buttons
Two external push buttons, S1 and S2, are connected to the interrupt
capable MSP430FG4618 digital I/O port, P1.
6.1.3 Light Emitting Diodes (LEDs)
The experimenter board has a total of four LEDs, three connected to the
MSP430FG4618 and one connected to the MSP430F2013. The LEDs are
primarily used for display purposes. Two of the LEDs can be disconnected
using jumpers to reduce the overall power consumption of the board.
6.1.4 Buzzer
A buzzer is connected to a digital I/O port of the MSP430FG4618. It is
driven via a port pin of the MSP430. The buzzer can be completely
disconnected by using jumper JP1.
6.1.5 Single-Touch Sensing Interface
A capacitive touch sensing interface in the shape of a “4” is provided onboard. This touchpad is connected to the digital I/O ports of the
MSP430F2013. A total of 16 individual segments form the touchpad, and
activity is monitored by the MSP430F2013. The resulting data is
communicated to the MSP430FG4618 via the MSP430 intercommunication connections provided on-board.
4
6.2 Communication Peripherals
The experimenter’s board supports numerous communication interfaces for onand off-board connections.
6.2.1 Chipcon Wireless Evaluation Module Interface
Interface to the wireless world is accomplished via the Wireless Evaluation
Module header supporting the CCxxxxEMK boards from TI. The
transceiver modules are connected to the USART of the MSP430FG4618
configured in SPI mode. Libraries [6] that interface the MSP430 to these
transceivers are available at www.ti.com/msp430. The CC2420EMK
supports the 802.15.4/Zigbee standard. The CC1100EMK may be
configured to work at an RF carrier frequency of up to 868 MHz and the
CC2500EMK/CC2420EMK at an RF carrier frequency of 2.4 GHz.
6.2.2
RS-232
For a serial interface to a PC, the MSP430FG4618 supports the standard
RS-232 9-pin interface via its USCI peripheral configured in UART mode.
Standard baud rates for transmission and reception can be configured
using in software
6.2.3 I2C/SPI
The MSP430FG4618 and the MSP430F2013 have support for I2C and
SPI protocols using the USCI and the USI peripherals. This protocol is
used for inter-processor communication The link can be disconnected in
hardware allowing these peripherals to be used for other communication
purposes.
6.3 Analog Signal Chain
The experimenter’s board is capable of forming a complete analog signal chain
using the MSP430FG4618. This board can be used for numerous audio
applications and is capable of recording and playback of audio signals without the
use of additional external components.
Analog IN
1ST Order
Active HPF
Filter
Using OA0
12-bit
Analog-todigital
Converter
Digital IN
Data
Processing
MIC
SAMPLING FREQ
12-bit
Digital-toanalog
Converter
2ND Order
Active LPF
Filter
Using OA1
Active
Voltage
Follower
Using OA2
Output Jack
Analog OUT
Figure 4: MSP430 Analog Signal Chain
5
6.3.1 Microphone
The microphone is connected to the MSP430FG4618 and may be used
for various applications. The microphone is enabled/disabled via a port pin
connected to the MSP430FG4618.
6.3.2 Analog Filters
An active first order high-pass filter (HPF) with a cut-off frequency set at
approximately 340Hz follows the microphone to eliminate extremely low
input frequencies. An optional 2nd order Sallen-Key active low-pass filter
(LPF) with a cut-off frequency set to approximately 4 kHz removes the
high-frequency noise on the analog output of the 12-bit DAC. The filter
setup is shown in Figure 5. These filters use the integrated Op-Amps of
the MSP430. The Op-Amps OA0 & OA1 facilitate the filtering processes.
The grayed dashed blocks in Figure 5 identify those elements which are
internal to the MSP430FG4618.
C21 15pF
R30 150K
C18
470nF
R29
1K
OA0I0
12-bit
OA0
ADC12
OA0O
+
OA0O
12-bit
DAC12
OA0I1
MIC
C17
3.3nF
R24
1.4K
1st Order
Active HPF
MSP430
Internal
R25 C16
15.4K 22nF
OA1O OA2I1 OA1
OA2
OA2O
+
+
OA2I0
OA1I0
OA1I1
nd
SALLEN-KEY 2
Order Active LPF
Unity Gain
Buffer
Figure 5: Active Analog Filter setup
6.3.3 Analog Output
Analog output can be brought out of the board via a mono 3.5mm jack
connected to the integrated Op-Amp OA2. The input to this amplifier can
be internally connected to the DAC12 output of the MSP430FG4618.
Several attenuation options are provided internally and in hardware using
jumper JP4.
6
6.4 System Clocks
The experimenter’s board has various system clock options that support low and
high frequencies. Each MSP430 has integrated clock sources as well as support
for external connections.
6.4.1 MSP430F2013 Clock Sources
The MSP430F2013 uses the internal VLO operating at ~12kHz for an
ultra-low power standby wake up time base. The integrated DCO is
internally programmable at frequencies up to 16MHz for high speed CPU
and system clocking.
6.4.2 MSP430FG4618 Clock Sources
A standard 32.768kHz watch crystal is populated at footprint X2 and
sources source ACLK of the MSP430FG4618 for low frequency, ultra-low
power standby operation and RTC functionality. The integrated FLL+ clock
module provides a programmable internal high frequency clock source for
the CPU and other peripherals on-chip. In addition to the FLL+, an
external high frequency crystal or resonator up to 8MHz can be added via
footprint X1.
6.5 Jumper Configurations
The board supports various peripherals and components to be enabled when
required and disabled when not in use to reduce overall power consumption. This
is achieved either by software or directly in hardware. Some of the jumpers are
mandatory for the board to function correctly. Refer to Appendix B for detailed
information regarding the exact locations of these jumpers and their functionality.
7
7. Frequently Asked Questions
1) What devices can be programmed with the experimenter’s board?
The experimenter’s board is designed to develop applications using the
MSP430FG4618 and MSP430F2013. These devices can be replaced by
MSP430FG461x and MSP430F20xx device derivatives, respectively.
2) How is power supplied to the experimenter’s board?
Three supply options exist: 2xAAA battery power, JTAG and external power
supplies are supported.
3) Can I use the Parallel FET (MSP-FET430PIF) to program/debug the
MSP430?
The MSP4304618 supports the USB and Parallel Port FETs. The
MSP430F2013 is supported by the USB FET (MSP-FET430UIF) only. The
Parallel Port FET does not support the Spy Bi-Wire program/debug mode
used.
4) I have erased and reprogrammed the MSP430; can I restore the factory
programmed-firmware on the device(s)?
The software source files are available at the MSP-EXP430FG4618
documentation page at www.ti.com/msp430.
5) The MSP430FG4618 is no longer accessible via JTAG, is something
wrong with the device?
- Verify that the target device is powered properly
- If the target is powered locally, verify Vcc is applied to pin 4 of the JTAG
header
- If communication and power are correctly applied to the target and the issue
persists, it may be due to the MSP430FG4618 accidentally being
programmed with MSP430F2xx source code. In some conditions ‘F2xx
source code loaded onto the ‘FG4618 can configure the SVS module to
monitor SVSIN (P6.7) and reset the device in case of a low voltage condition
externally applied. Temporarily connecting P6.7 of the ‘FG4618 to Vcc and
reprogramming the target device with the valid source code will eliminate this
issue.
6) Does the experimenter’s board protect against blowing the JTAG fuse of
the target devices?
No. Fuse blow capability is inherent to all Flash-based MSP430 devices in
order to protect user’s intellectual property. Care must be taken to avoid the
enabling of the fuse blow option during programming that would prevent
further access to the MSP430 device(s) via JTAG.
7) I am measuring system current in the range of 30mA, is this normal?
Current consumption of the system is dependent on the functions and
operation of the hardware being performed. The RF connectivity and isolated
UART communication support, when used, can reach these current
consumption levels. Take care that these elements are not accidentally
enabled, specifically the isolated UART, if such system currents are not
expected.
8
8) Can I use two FETs to perform simultaneous access of the FG4618 and
F2013 during program/debug?
Yes, independent flash emulation tools (either USB or Parallel for ‘FG4618
and USB only for ‘F2013) can be simultaneously used to program the MSP430
target devices. When supplying power via the FET, it is recommended to use
only one FET to source power. The second FET can sense this voltage level
instead of supplying power, to avoid any voltage conflicts in-system. Refer to
section 5 Hardware Installation for details regarding supported power supply
configurations.
9) I cannot properly open the workspace and projects provided in the .zip
file with IAR, how can I open the sample code?
The IAR workspace/projects included for the sample code provided has been
created using IAR Embedded Workbench Version 3.42A. These projects are
not backward compatible with older IAR releases and will not open using prior
versions. New workspace/projects can be created and the sample code
source files can be added manually in order to build these samples with older
versions. Instruction for setting up a project in IAR are described in the MSPFET430 Flash Emulation Tool (FET) (for use with IAR v3.x) User's Guide,[5].
10) I have loaded the ‘FG4618 and ‘F2013 sample code for the capacitive
touch sensing application. It doesn’t seem to be working, what is wrong?
Verify that the correct jumper settings are used for H1 enabling the I2C
communication link between MSP430s. Make sure jumper JP2 is removed,
disconnecting LED3 from the touchpad circuitry. When connected, the LED
causes the measurement of the capacitive touch element on P1.0 to fail.
8. References
1.
2.
3.
4.
5.
MSP430x4xx Family User's Guide, Texas Instruments literature number SLAU056
MSP430x2xx Family User's Guide, Texas Instruments literature number SLAU144
MSP430xG461x device data sheet, Texas Instruments literature number SLAS508
MSP430x20x3 Device datasheet, Texas Instruments literature number SLAS491
MSP-FET430 Flash Emulation Tool (FET) (for use with IAR v3.x) User's Guide, Texas Instruments
literature number SLAU138
6. MSP430 Interface to CC1100/2500 Code Library, Texas Instruments literature number SLAA325
9
Appendix A Configuring an IAR Embedded Workbench Project
IAR Embedded Workbench may be used to program/debug the on-board MSP430
devices with custom firmware or provided sample code available at
www.ti.com/msp430. Programming and debug is done using JTAG1 and JTAG2
providing access to the MSP430FG4618 and MSP430F2013 respectively. Steps
to program each of these devices are shown in this section. It is assumed that the
USB FET tool has been installed using the instructions provided in the FET User’s
guide. Please note that the Parallel port FET tool can also be used to
program/debug the MSP430FG4618.
MSP430FG4618 Programming
1. Connect the 14-pin cable to the JTAG1 header on the board.
2. Create a new project or load a valid existing project on the IAR Embedded
Workbench.
3. In IAR Embedded Workbench under the Project drop-down choose Options;
this brings up the menu shown in Figure A-1. Under the General
OptionsÆTarget choose MSP430FG4618 from the MSP430x4xx Family
option.
Figure A-1: Device selection in IAR
10
4. From the same menu under the Debugger option, select the FET Debugger
shown as a snapshot in Figure A-2.
Figure A-2: Selecting the FET Debugger
5. Then proceed to the FET Debugger option and choose the Texas Instrument
USB-IF as shown in Figure A-3. The default setting of Automatic needs no
change.
Figure A-3: Selection of the USB interface
11
MSP430F2013 Programming
1.
Connect the 14-pin cable to JTAG2 header on the board.
2.
Create a new project or load a valid existing project on the IAR Embedded
Workbench.
3.
In IAR Embedded Workbench under the Project drop-down choose Options;
this brings up the menu shown in Figure A-1. Under the General
OptionsÆTarget choose MSP430F2013 from the MSP430x2xx Family
option.
4.
From the same menu under the Debugger option select the FET Debugger
shown as a snapshot in Figure A-2.
5.
Then proceed to the FET Debugger option and choose the Texas Instrument
USB-IF as shown in Figure A-3. The default setting of Automatic needs no
change.
6.
For a new project created, the Spy-Bi-Wire interface is the default setting for
the MSP430F2013. If this selection needs modification, under the FET
Debugger menu as shown in Figure A-4, check the Override default box and
then make the Spy-Bi-Wire selection instead of the 4-Wire JTAG. It is to be
noted that the Parallel FET does not support the Spy-Bi-Wire interface and
cannot be used to debug/program the MSP430F2013.
Figure A-4: Selection of the Spy-Bi-Wire interface for MSP430F2013
12
Appendix B Jumper Locations and Settings
Figure B-1 represents the location and name of each jumper on the experimenter’s
board.
Figure B-1: Jumper Locations
13
Table B-1 Jumper Settings and Functionality
Header
Functionality when
jumper present
Functionality when
jumper absent
Requirement
PWR1
Provides power to MSP430FG4618
Also used to measure current
consumption of the MSP430FG4618
MSP430FG4618 is
not powered
Required for
MSP430FG4618
use
PWR2
Provides power to MSP430F2013
Also used to measure current
consumption of the MSP430F2013
MSP430F2013 is
not powered
Required for
MSP430F2013
use
BATT
On-board batteries provide power Also
used to measure current consumption
Batteries will not
provide power to
either MSP430
Required for use with
AAA batteries
JP1
Buzzer enabled and connected
to P3.5 of the MSP430FG4618
Buzzer muted
Optional
JP2
LED3 enabled and connected
to P1.0 of the MSP430F2013
LED3 connection
disabled
Optional / Required for
LED3 use
JP3
LED4 enabled and connected
to P5.1 of MSP430FG4618
LED4 connection
disabled
Optional / Required for
LED4 use
JP4
Attenuation set to approximately
69% of the DAC12 audio output
98% attenuation of
the DAC12 audio
output
Optional
Header H1
(Pins 1-2, 3-4)
I2C Configuration
1-2: SDA – UCB0SDA
3-4: SCL – UCB0SCL
No communication
possible via I2C
Required for
inter-processor
communication
Header H1
(Pins 1-2, 3-4,
5-6, 7-8)
SPI Configuration
1-2: SDI – UCB0SIMO
3-4: SDO – UCB0SOMI
5-6: P1.4 – P3.0 (CS)
7-8: SCLK – UCB0CLK
No communication
possible via SPI
Required for
inter-processor
communication
Table B-1 breaks down the function of each jumper shown in Figure B-1.
14
18
16
14
12
10
8
6
4
2
2
PWR2 1
VCC
H4
VCC
1
3
5
7
1
3
5
7
0.1uF
1uF
BB3
10
11
13
12
14
1
17
15
13
11
9
7
5
3
1
18
16
14
12
10
8
6
4
2
BB2
17
15
13
11
9
7
5
3
1
18
16
14
12
10
8
6
4
2
BB1
GND
17
15
13
11
9
7
5
3
1
10
R20
470
16
15
14
13
12
16
15
14
13
12
3
1
2
UCB0SDA
UCB0CLK
P3.5
P3.7
2
4
6
8
11
UCA0SIMO
UCA0CLK
P7.5
P7.7
2
4
6
8
11
P5.7
P5.5
2
4
3
1
2
VEREFP5.0
P10.6
P6.0
P6.2
P6.4
P6.6
10uF
C19
GND
1
3
5
1
3
5
7
H9
H8
2
2013_P1.0
3
2013_P1.1
4
2013_P1.2
5
2013_P1.3
6
2013_P1.4
7
2013_P1.5
8 SCL
H1
9 SDA
1
3
5
7
5M1
P6.1
P6.3
P6.5
P6.7
VEREF+
P5.1
P10.7
2
4
6
8
2
4
6
2
4
6
8
UCB0SDA
UCB0SCL
P3.0
UCB0CLK
R32
0
R29
1k
R30
150k
P6.2
(A2/OA0I1)
P6.1
(A1/OA0O)
BATT
2
1
VCC
GND
FET_PWR2
2
1
LCL_PWR2 3
2
FET_PWR1 1
LCL_PWR1 3
VCC_2
VCC_1
2
JP3 1
GND
1
2
3
4
5
6
7
8
9
VEREF+ 10
VEREF- 11
P5.1 12
P5.0 13
P10.7 14
P10.6 15
16
S0
17
S1
18
S2
19
S3
20
S4
21
S5
22
S6
23
S7
24
S8
25
S9
GND
10uF 0.1uF
P6.3
(A3/OA1O)
R25
R24
C16
22nF
15.4k
1.4k
13
11
9
7
5
3
1
GND
P6.4
(A4/OA1I0)
C17
3.3nF
GND
Sallen-Key 2nd Order OA1 Active LPF
GND
JTAG1
GND
VREG_EN
RESETCC
AVCC_4618
C8
C7
14
12
10
8
6
LCL_PWR1 4
FET_PWR1 2
DVCC_4618
P6.3
P6.4
C10
P6.5
P6.6
10uF
P6.7
VREF
X2
P6.7
(A7/DAC1)
GND
0.1uF
C6
10uF 0.1uF
C5
DVCC_4618
VREF
C9
10
R10
10
R8
AVCC_4618
Pos 1-2: FET Powered
Pos 2-3: Battery Powered
VCC_1: FG4618 Supply Config
VCC_2: F2013 Supply Config
VCC
P6.0
(A0/OA0I0)
Mic Input Circuitry and
1st Order OA0 Active HPF
P2.3
(Mic Supply)
P1.0/TACLK/ACLK/A0+
P1.1/TA0/A0-/A4+
P1.2/TA1/A1+/A4P1.3/VREF/A1P1.4/SMCLK/A2+/TCK
P1.5/TA0/A2-/SCLK/TMS
P1.6/TA1/A3+/SDO/SCL/TDI/TCLK
P1.7/A3-/SDI/SDA/TDO/TDI
LED3
2 FET_PWR2
4 LCL_PWR2
6
8
10
12
14
NMI/RST/SBWTDIO
TEST/SBWTCK
XIN/P2.6/TA1
XOUT/P2.7
VSS
VCC
JTAG2
8
9
H7
10
1
3
5
7
1
3
5
7
H6
H5
INNER_GND
MSP430F2013PW
Breadboard
2013_P2.6
2013_P2.7
GND
C12
47k
C11
U4
GND
3
5
SBWTCK 7
9
11
13
SBWTDIO 1
GND
INNER_GND
8
P3.0
UCB0SCL
P3.4
P3.6
P2.1
P2.3
UCA0RXD
P2.7
2
4
6
8
9
P7.0
UCA0SOMI
P7.4
P7.6
URXD1
SIMO1
UCLK1
P4.7
2
4
6
8
1
3
R16
H3
LCDCAP
P5.6
SW2
GDO2
VREG_EN
FIFOP
5
P2.0
P2.2
UCA0TXD
P2.6
R19
2
4
6
8
C14
H2
2
1
DNP
+
B1
-
1
3
5
7
9
11
13
15
17
19
FIFO
FIFOP
GDO0
GDO2
P4.2
UCLK1
SIMO1
SOMI1
DVCC_4618
RF1
2
4
6
8
10
12
14
16
18
20
0.1uF
C2
GND
0.1uF
C1
VCC
(Output
Attn.)
2
JP4 1
P6.5
(A5/OA2O)
GND
1
3
5
7
9
11
13
15
17
19
RF Daughter Card Connect
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
1k
2k2
R9
100
R5
GND
Q1
MMBT5088
VCC
3
2
DVCC_4618
PS8802
U2
SW1
GND
5
8
7
6
5
8
7
6
SW2
0-DNP
0-DNP
R22
R21
10uF
C3
1N4148
D2
GND
P3.5
SBWTCK
SBWTDIO
1 JP1
2
R17
DOL_ERR_MINUS_MEM
ENV_TX_RX_8BC
ANT_A2_A1_A0
BT_B1_B0_BB
AU_AR_AD_AL
PL_P0_P1_P2
F1_F2_F3_F4
F5_PR_P4_P3
COM0
COM1
COM2
COM3
Date: 26-Oct-2006
Document Number:
MSP-EXP430FG4618 PCB Ver 0-00
P$26
P$25
P$24
P$23
P$22
P$21
P$20
P$19
P$18
P$17
P$16
P$15
Buzzer
Mute
C4
G1
G2
9
8
7
6
VER:
0-00
S21
S20
S19
S18
S17
S16
S15
S14
COM0
COM1
COM2
COM3
PC_GND
RS232
10uF
5
4
3
2
1
Sheet: 1/1
MSP430FG4618/F2013 Experimenter's Board
1A_1B_1C_1D
1F_1G_1E_DP1
2A_2B_2C_2D
2F_2G_2E_DP2
3A_3B_3C_3D
3F_3G_3E_COL3
4A_4B_4C_4D
4F_4G_4E_DP4
5A_5B_5C_5D
5F_5G_5E_COL5
6A_6B_6C_6D
6F_6G_6E_DP6
7A_7B_7C_7D
7F_7G_7E_DP7
SoftBaugh SBLCDA4
(For opt. F2013 programming)
DVCC_4618
P$14
P$13
P$12
P$11
P$10
P$9
P$8
P$7
P$6
P$5
P$4
P$3
P$2
P$1
3
2
PS8802
U1
DVCC_4618
Isolated RS232 Communication
UCA0TXD
UCA0RXD
P2.6
P2.7
P3.0
UCB0SDA
UCB0SCL
UCB0CLK
P3.4
P3.5
P3.6
P3.7
UTXD1
C13
URXD1
GND
0.1uF
DVCC_4618
LCDCAP
P5.7
C15
P5.6
P5.5
10uF
COM3
COM2
COM1
COM0
GND
P4.2
S0
S1
S2
S3
S4
S5
S6
S7
S8
S9
S10
S11
S12
S13
UCA0RXD
UCA0TXD
GND GND
Audio output jack
A1
RF2
2
4
6
8
10
12
14
16
18
20
R1
D1
1N4148
Power Supply Configuration
PWR1
GND
UTXD1
P4.2
SOMI1
P4.6
VCC_2013
R18
7
7
6
6
GND
5
4
4
+
+
R3
1
3
5
7
M1
10
R13
R26
470
LED1
SW1
GDO0
RESETCC
FIFO
5M1
C18
R23
5M1
1 JP2
2
470
1k
3k3
R14
470n
R15
C21
470
LED4
R7
R2
MSP430FG4618 Pin Access
470n
5M1
15p
R27
1
2
R34
22k
470k
10k
R28
R31
R33
TIP
P$1
C20
RING
P$2
S1
47k
100
99
98
97 P6.2
96 P6.1
95 P6.0
94
93
92
91
90
89
88
87
SW1
86
SW2
X1
85
GDO0
84
GDO2
83
RESETCC
82
VREG_EN
81
FIFO
80
FIFOP
79
P2.0
78
P2.1
77
P2.2
76
P2.3
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
S10
S11
S12
S13
S14
S15
S16
S17
S18
S19
S20
S21
P7.7
P7.6
P7.5
P7.4
UCA0CLK
UCA0SOMI
UCA0SIMO
P7.0
P4.7
P4.6
UCLK1
SOMI1
SIMO1
R11
R6
470
BAND
100k
2
1
LED2
P$4
S2
R4
+
R12
2k2
2k2
100k
2
1
2AL60P1
470
D3
1N4148
+
SP1
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s
standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this
warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily
performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should
provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask
work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services
are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such
products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under
the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is
accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an
unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties
may be subject to additional restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service
voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business
practice. TI is not responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would
reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement
specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications
of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related
requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any
applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its
representatives against any damages arising out of the use of TI products in such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is
solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in
connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products
are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any
non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
RFID
www.ti-rfid.com
Telephony
www.ti.com/telephony
Low Power
Wireless
www.ti.com/lpw
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2007, Texas Instruments Incorporated
Was this manual useful for you? yes no
Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Download PDF

advertising