User's Guide TI CC3000 BoosterPack Evaluation Board Literature Number: SWRU331 November 2012

User's Guide TI CC3000 BoosterPack Evaluation Board Literature Number: SWRU331 November 2012
TI CC3000 BoosterPack Evaluation Board
User's Guide
Literature Number: SWRU331
November 2012
Contents
3
....................................................................................................................................... 4
Introduction ........................................................................................................................ 5
CC3000 BoosterPack Evaluation Board ................................................................................. 6
2.1
BoosterPack Board Top View ............................................................................................. 6
2.2
CC3000 BoosterPack Board Bottom View .............................................................................. 7
2.3
Antenna ...................................................................................................................... 9
2.4
Hardware Setup ........................................................................................................... 13
2.5
CC3000 BoosterPack Schematic ........................................................................................ 15
2.6
Bill of Materials (BOM) .................................................................................................... 16
2.6.1 PCB Design Guidelines .......................................................................................... 16
2.6.2 RF Trace ........................................................................................................... 16
2.6.3 Antenna ............................................................................................................ 17
2.6.4 Power Trace ....................................................................................................... 17
2.6.5 Ground ............................................................................................................. 18
Application Development ................................................................................................... 19
2
Contents
Preface
1
2
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List of Figures
2-1.
BoosterPack Board Top View ............................................................................................. 6
2-2.
CC3000 BoosterPack Board Bottom View
2-3.
2-4.
2-5.
2-6.
2-7.
2-8.
2-9.
2-10.
2-11.
2-12.
3-1.
..............................................................................
Antenna Location and RF Trace Routing ................................................................................
Matching Circuit Between the Antenna and the CC3000 BoosterPack ............................................
Return Loss From the ACX Antenna and Matching Circuit ..........................................................
Antenna Radiation Pattern ...............................................................................................
Host PCB Mating Connector Arrangement ............................................................................
CC3000 BoosterPack Schematics ......................................................................................
Trace Design for PCB Layout ............................................................................................
Antenna Layout Guidelines ..............................................................................................
Power Trace ................................................................................................................
Ground Routing for the CC3000 BoosterPack Board.................................................................
MSP-EXP430G2 Test Platform and CC3000 BoosterPack Board ..................................................
8
9
10
11
12
13
15
16
17
18
18
19
List of Tables
2-1.
Key Parts of CC3000 BoosterPack Board Top View ................................................................... 6
2-2.
J2 Configuration of the CC3000 Evaluation Module Board
2-3.
Header J11 of the CC3000 BoosterPack Board Top View ............................................................ 7
2-4.
Header J12 of the CC3000 BoosterPack Board Top View ............................................................ 7
2-5.
Header J9 of the CC3000 BoosterPack Board Bottom View.......................................................... 8
2-6.
Header J10 of the CC3000 BoosterPack Board Bottom View ........................................................ 8
2-7.
Launchpad to BoosterPack Pin Comparison
2-8.
PCB Stack-Up Data ....................................................................................................... 16
2-9.
Trace Design Measurement Values
...........................................................
..........................................................................
....................................................................................
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List of Figures
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7
13
16
3
Preface
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Read This First
About This Manual
This user guide describes how to use the TI CC3000 BoosterPack evaluation board to evaluate the
performance of the TI CC3000 module.
Related Documentation From Texas Instruments
•
•
TI SimpleLink™ CC3000 Module – Wi-Fi 802.11b/g Network Processor Data Sheet (SWRS126)
CC3000 Wiki for MCU: http://processors.wiki.ti.com/index.php/CC3000_Wi-Fi_for_MCU
If You Need Assistance
The primary sources of CC3000 information are the device-specific data sheets and user’s guides. For the
most up-to-date version of the user’s guide and data sheets, go to http://www.ti.com/product/cc3000.
FCC Warning
This equipment is intended for use in a laboratory test environment only. It generates, uses, and can
radiate radio frequency energy and has not been tested for compliance with the limits of computing
devices pursuant to subpart J of part 15 of FCC rules, which are designed to provide reasonable
protection against radio frequency interference. Operation of this equipment in other environments may
cause interference with radio communications, in which case the user at his own expense will be required
to take whatever measures may be required to correct this interference.
SimpleLink is a trademark of Texas Instruments.
Wi-Fi is a registered trademark of Wi-Fi Alliance.
4
Read This First
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Chapter 1
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Introduction
This user guide describes how to use the TI CC3000 BoosterPack evaluation board to evaluate the
performance and functionality of the TI CC3000 module. The TI CC3000 module is a self-contained Wi-Fi®
solution that enables internet connectivity for a wide variety of embedded applications. This document
details the key parts and features of the CC3000 BoosterPack evaluation board along with the different
options available for the user and includes layout guidelines to assist in PCB development.
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Introduction
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5
Chapter 2
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CC3000 BoosterPack Evaluation Board
2.1
BoosterPack Board Top View
Figure 2-1 Table 2-1 describe the key parts and jumpers mounted on top of the CC3000 BoosterPack
board. Table 2-2 describes the J2 configuration of the CC3000 evaluation module (EM) board. Table 2-3
and Table 2-4 describe the signals on J11 and J12.
SWRU331-001
Figure 2-1. BoosterPack Board Top View
Table 2-1. Key Parts of CC3000 BoosterPack Board Top View
Part Name
CC3000MOD
Antenna
6
Description
Core module for performance evaluation (for more information, see the CC3000 module
datasheet)
Can be used for radiated testing by reworking the capacitor to correct pads
J1
U.FL RF connector used for conductive power tests
J2
Used to swap between test mode and operation mode. When pins 2 and 3 are shorted, J2 runs in
operation mode. When pins 1 and 2 are shorted, J2 runs in test mode.
J11
Through-hole test points (for more information, see Table 2-3)
J12
Through-hole test points (for more information, see Table 2-4)
J13
Used to switch between external power and power from the motherboard. Can be used for power
measurements. Connect pins 1 and 2 for power from the LaunchPad flash programmer and
debugging tool. Connect pins 2 and 3 for external power.
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CC3000 BoosterPack Board Bottom View
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Table 2-1. Key Parts of CC3000 BoosterPack Board Top View (continued)
Part Name
Description
J14
DC jack for external power supply. If power is not supplied from the motherboard, ensure that
external power is applied.
Table 2-2. J2 Configuration of the CC3000 Evaluation Module Board
Mode
Description
Test mode: CC3000 radio
tool (1)
Connect pins 1 and 2. Test mode is used with the CC3000 radio tool to operate, test, and
calibrate the CC3000 chip-set designs during development. This tool uses the RS232/UART pins
to run radio frequency (RF) RX and TX tests on the CC3000 module. For more information, see
the CC3000 wiki.
Functional mode: Normal mode Connect Pins 2 and 3. Normal mode is for regular functionality between the host platform and the
CC3000 module.
(1)
For more information about test software for the PC, go to the CC3000 wiki at
http://processors.wiki.ti.com/index.php/CC3000_Wi-Fi_for_MCU.
Table 2-3. Header J11 of the CC3000 BoosterPack Board Top View
Pin
Pin Name
Pin Type
Descriptions
1
Reserved
–
Reserved
2
Reserved
–
Reserved
3
WL_RS232_TX
Output
RS232 transmit output; Used for radio tool serial
interface in test mode. Leave floating in functional mode.
4
WL_RS232_RX
Input
RS232 receive output; Used for radio tool serial interface
in test mode. Leave floating in functional mode.
Table 2-4. Header J12 of the CC3000 BoosterPack Board Top View
2.2
Pin
Pin Name
Pin Type
1
GND
–
Descriptions
2
SCL_CC3000
Output
3
SCL__EEPROM
Input
4
SDA_CC3000
Input and Output
I2C data signal from the CC3000 device. This pin is
connected to SDA_EEPROM using a 0-Ω resistor and is
not used by end users.
5
SDA_EEPROM
Input and Output
I2C data signal from EEPROM inside CC3000MOD. This
pin is connected to the SDA_CC3000 device using a 0-Ω
resistor and is not used by end users.
Ground
I2C clock signal output from the CC3000 device. This pin
is connected to SCL_EEPROM through a 0-Ω resistor
and is not used by end users.
I2C clock signal input from EEPROM inside
CC3000MOD. This pin is connected to SCL_CC3000
using a 0-Ω resistor and is not used by end users.
CC3000 BoosterPack Board Bottom View
The two BoosterPack mating connectors (J9 and J10) connect to the host platform and mount to the
bottom of the BoosterPack board, as shown in Figure 2-2. Table 2-5 and Table 2-6 describe the signals
on J9 and J10.
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CC3000 BoosterPack Board Bottom View
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SWRU331-002
Figure 2-2. CC3000 BoosterPack Board Bottom View
Table 2-5. Header J9 of the CC3000 BoosterPack Board Bottom View
Pin
Pin Name
Pin Type
1
VBAT_IN
Power In
Descriptions
2
VBAT_SW_EN
Input
3
Reserved
–
Reserved
4
Reserved
–
Reserved
5
Reserved
–
Reserved
Reserved
Battery voltage input to module. For the MSP430 host
platform, VIO_HOST = VBAT_IN. For other platforms
that have different voltage levels from the battery
voltages, R14 can be removed.
Active-high enables signal from the host device
6
Reserved
–
7
WL_SPI_CLK
Input
8
Reserved
–
Reserved
9
Reserved
–
Reserved
10
Reserved
–
Reserved
Host interface SPI clock input
Table 2-6. Header J10 of the CC3000 BoosterPack Board Bottom View
8
Pin
Pin Name
Pin Type
1
GND
–
Descriptions
2
WL_SPI_IRQ
Output
3
WL_SPI_CS
Input
4
Reserved
–
Reserved
5
Reserved
–
Reserved
Ground
Host interface SPI interrupt request
Host interface SPI chip select
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Antenna
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Table 2-6. Header J10 of the CC3000 BoosterPack Board Bottom View (continued)
2.3
Pin
Pin Name
Pin Type
6
WL_SPI_DIN
Input
Host interface SPI data input
Descriptions
7
WL_SPI_CLK
Input
Host interface SPI clock input
8
Reserved
–
Reserved
9
Reserved
–
Reserved
10
Reserved
–
Reserved
Antenna
The ACX ceramic mounts on the BoosterPack board with a specific layout and matching circuit for the
radiation tests conducted in FCC, CE, and IC certifications. Figure 2-3 shows the location of the ACX
ceramic antenna on the BoosterPack board and the RF trace routing from the CC3000 device to the
antenna. Figure 2-3 shows the matching circuit between the antenna and the BoosterPack board.
AT8010-E2R9HAA
Z
X
Y
SWRU331-003
Figure 2-3. Antenna Location and RF Trace Routing
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Antenna
www.ti.com
AT8010-E2R9HAA
1.8 nH
1.5 pF
Figure 2-4. Matching Circuit Between the Antenna and the CC3000 BoosterPack
The return loss is based on the matching circuit and RF trace routing, as shown in Figure 2-5.
10
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Antenna
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SWRU331-005
Figure 2-5. Return Loss From the ACX Antenna and Matching Circuit
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Antenna
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SWRU331-006
Figure 2-6. Antenna Radiation Pattern
12
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Hardware Setup
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2.4
Hardware Setup
Before conducting performance tests, the BoosterPack board must be connected to the host platform with
the mating connectors (J9 and J10) or the single row headers (J11 and J12). To use the BoosterPack
mating connectors (J9 and J10) to connect the hardware, the mating connectors must be lined up as
shown in Figure 2-7. Using the single row headers (J11 and J12) requires the signals from the EM mating
connectors to be wired to the host platform.
SWRU331-007
Figure 2-7. Host PCB Mating Connector Arrangement
Table 2-7 compares the pins of the Launchpad MSP-EXP430G2 board with the CC3000 BoosterPack
board.
Table 2-7. Launchpad to BoosterPack Pin Comparison
Pin
MSP430 Port
CC3000 BoosterPack
1
VCC
VBAT_IN
2
P1.0
VBAT_SW_EN
3
P1.1/TX
NC
4
1.2/RX
NC
5
P1.3
NC
6
P1.4
NC
7
P1.5
WL_SPI_CLK
8
P2.0
NC
9
P2.1
NC
10
P2.2
NC
11
P2.3
NC
12
P2.4
NC
13
P2.5
NC
14
P1.6
WL_SPI_DOUT
15
P1.7
WL_SPI_DIN
16
T/SBWT
NC
17
T/SBW
NC
18
2.6/XOUT
WL_SPI_CS
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Hardware Setup
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Table 2-7. Launchpad to BoosterPack Pin Comparison (continued)
14
Pin
MSP430 Port
CC3000 BoosterPack
19
P2.7/XIN
WL_SPI_IRQ
20
GND
GND
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J2
Pin2 and Pin3 short
Pin1 and Pin2 short
Function mode
Mode
2
Test mode
1
2
3
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RES1005
RES1005
0R
RES1005
RES1005
WL_SPI_DIN
WL_SPI_CLK
0R
0R
0R
0R
R15
R19
R18
R17
R16
10
GND
GND
WL_RS232_RX
WL_EN1
WL_RS232_TX
WL_EN2
RESERVED_2
J11
NL_HEADER 1x4
H-1x4_2MM
1
2
3
4
NS_UARTD
WL_UART_DBG
WL_RS232_TX
WL_RS232_RX
SCL_CC3000
SCL_EEPROM
SDA_CC300
SDA_EEPROM
J12
NL_HEADER 1x5
H-1x5_2MM
1
2
3
4
5
Header for Debug
RES1005
WL_SPI_IRQ
8
WL_RS232_RX
WL_SPI_DOUT
7
WL_EN1
WL_SPI_CS
6
WL_RS232_TX
9
5
4
WL_EN2
CC3000MOD
U1
19
20
21
22
23
24
25
26
27
28
0R RES1005
R20
C10
0.1uF
CAP1005
U2
IN
N/C
N/C
EN
OUT
N/C
NR/FB
GND
TPS73701DRB
8
7
6
5
1
2
3
4
LED1
SML-LX0603IW
LED1608
C11
1uF
CAP1005
R23
30K
RES1005
R22
52.3K
RES1005
VBAT_IN
C8
1uF
CAP1005
1
2
3
4
5
6
7
8
9
10
WL_SPI_CLK
VBAT_SW_EN
VBAT_IN
J10
F101-SGP-D030-10
H-1x10_2.54
1
2
3
4
5
6
7
8
9
10
Connect to LaunchPad J2
WL_SPI_DIN
WL_SPI_DOUT
WL_SPI_IRQ
WL_SPI_CS
SWRU331-008
Resistor Values for Output Voltages:
3.3V => R22=52.3K / R23=30K
3.6V => R22=56K / R23=28K
C12
NL
CAP1005
J13
HEADER 1x3
H-1x3_2MM
1
2
3
Power Supply Option:
1-2 => Supplied from Launch Pad
2-3 => External Plug-in
Booster pack Connector
C9
10uF
CAP1608
J15
HEADER 1x2
H-1x2_2MM
R21
470R
RES1005
WL_VBAT
SDA_EEPROM
0R
RES1608
VBAT_SW_EN
Connect to LaunchPad J1
3
1
2
SCL_EEPROM
0R RES1608
VIO_HOST
0R RES1005
R2
J9
F101-SGP-D030-10
H-1x10_2.54
R13
R5
0R RES1608
Functional mode => R1,R2 - 0R to short I2C Pins
R1
SDA_CC300
SCL_CC3000
J14
3 PORT DC-JACK
DC-JACK-11.9x6x5-0.65
VBAT_IN
GND
EXT_32K
GND
VIO_HOST
RESERVED_3
GND
11
J2
HEADER 1x3
H-1x3_2MM
SDA_CC3000
VBAT_SW_EN
SDA_EEPROM
GND
WL_UART_DBG
NC
RESERVED_1
GND
12
3
SPI_CS
2
SPI_DOUT
13
1
36
GND
C2
10pF
CAP1005
35
RF_ANT
C3
NL_10pF
CAP1005
34
GND
SPI_IRQ
14
NS_UARTD
2
1
3
33
GND
15
J1
NL_U.FL-R-SMT(10)
U.FL
32
GND
SPI_DIN
L2
2.2nH
IND1005
31
GND
GND
16
L1
NL
IND1005
30
SCL_CC3000
SPI_CLK
17
C1
2.2pF
CAP1005
29
SCL_EEPROM
GND
18
1
46
45
44
43
42
41
GND
GND
GND
GND
37
38
39
40
ANT1
AT8010-E2R9HAA
AT8010
1
2
2.5
GND
GND
GND
GND
GND
GND
CC3000MOD Boosterpack Board Schematic
www.ti.com
CC3000 BoosterPack Schematic
CC3000 BoosterPack Schematic
Figure 2-8 shows the CC3000 BoosterPack schematics.
Figure 2-8. CC3000 BoosterPack Schematics
CC3000 BoosterPack Evaluation Board
15
Bill of Materials (BOM)
2.6
www.ti.com
Bill of Materials (BOM)
2.6.1 PCB Design Guidelines
The recommendations in this document refer to a two-layer PCB with the CC3000MOD. The PCB is built
using standard FR4 material, and both layers are used for signal routing. TI recommends keeping the
traces of the SPI signals as short as possible. Table 2-8 shows the PCB stack-up data.
Table 2-8. PCB Stack-Up Data
PCB Stack Up
Layer
Type
Impedance
Thickness
Single end
Theory value
0.50 mil
copper + plating
1.82 mil
Trace 20 space 5,
50 Ω ±10%
47.57
Top side solder mask
L1
Top
Prepreg
52.20 mil
mil
L2
copper + plating
1.82 mil
mil
Bottom side solder mask
0.50 mil
TOTAL
56.84 mil
1.44 mm
2.6.2 RF Trace
Figure 2-9 shows a 50-Ω trace design recommended for the PCB layout.
SWRU331-009
Figure 2-9. Trace Design for PCB Layout
Table 2-9. Trace Design Measurement Values
16
Measurement
Length
H (height between L1 and L2)
52.2 mil
H1 (height 1)
0.5 mil
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Bill of Materials (BOM)
www.ti.com
Table 2-9. Trace Design Measurement Values (continued)
Measurement
Length
W (width)
19 mil
W1 (width 1)
20 mil
T (thickness)
1.82 mil
S (grid separation)
5 mil
εr (dielectric )
4.3
Zo (impedance)
47.57
2.6.3 Antenna
Figure 2-10 shows the guidelines specified for the BoosterPack antenna.
NOTE: The antenna vendor determines the antenna guidelines.
SWRU331-010
Figure 2-10. Antenna Layout Guidelines
2.6.4 Power Trace
Figure 2-11 shows the power trace for VBAT_IN highlighted in white.
NOTE: VBAT_IN must have a thickness of 24 mil or more.
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Bill of Materials (BOM)
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SWRU331-011
Figure 2-11. Power Trace
2.6.5 Ground
The PCB must have a strong ground with more ground vias under the module for system stability and
thermal dissipation. Ground vias must be close to the pad.
Figure 2-12 shows the ground routing for the CC3000 BoosterPack board.
SWRU331-012
Figure 2-12. Ground Routing for the CC3000 BoosterPack Board
18
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Chapter 3
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Application Development
TI supports the CC3000 BoosterPack when paired with the TI MSP-EXP430G2 Launchpad, a
microcontroller (MCU) test platform.
The CC3000 BoosterPack lets users easily develop a complete Wi-Fi solution paired with the MSPEXP430G2 Launchpad platform.
For example applications, go to the TI wiki at http://processors.wiki.ti.com/index.php/CC3000 Wi-Fi for
MCU.
The CC3000 BoosterPack also can be used on other platforms with the same connector interface. The TI
wiki also has a host driver porting guide to assist with porting to other platforms.
Figure 3-1 shows the Launchpad MSP-EXP430G2 test platform and the CC3000 BoosterPack board.
SWRU331-013
Figure 3-1. MSP-EXP430G2 Test Platform and CC3000 BoosterPack Board
To order the MSP-EXP430G2 test platform, go to the following link:
http://www.ti.com/tool/msp-exp430g2
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www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
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www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
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