Volume 1 ( ver 4.4, Jun 2009, 4 MB )

Volume 1 ( ver 4.4, Jun 2009, 4 MB )
Stratix II GX Device Handbook, Volume 1
101 Innovation Drive
San Jose, CA 95134
www.altera.com
SIIGX5V1-4.4
Copyright © 2009 Altera Corporation. All rights reserved. Altera, The Programmable Solutions Company, the stylized Altera logo, specific device designations, and all other words and logos that are identified as trademarks and/or service marks are, unless noted otherwise, the trademarks and
service marks of Altera Corporation in the U.S. and other countries. All other product or service names are the property of their respective holders. Altera products are protected under numerous U.S. and foreign patents and pending applications, maskwork rights, and copyrights. Altera warrants
performance of its semiconductor products to current specifications in accordance with Altera's standard warranty, but reserves the right to make
changes to any products and services at any time without notice. Altera assumes no responsibility or liability arising out of the application or use of any information, product, or service described herein except as
expressly agreed to in writing by Altera Corporation. Altera customers are advised to obtain the latest version of device specifications before relying on any published information and before placing orders for
products or services.
ii
Altera Corporation
Contents
Section I. Stratix II GX Device Data Sheet
Chapter 1. Introduction
Features ................................................................................................................................................... 1–1
Referenced Document ........................................................................................................................... 1–5
Document Revision History ................................................................................................................. 1–5
Chapter 2. Stratix II GX Architecture
Transceivers ............................................................................................................................................ 2–1
Transmitter Path ............................................................................................................................... 2–4
Receiver Path ................................................................................................................................... 2–14
Loopback Modes ............................................................................................................................ 2–30
Transceiver Clocking ..................................................................................................................... 2–35
Other Transceiver Features ........................................................................................................... 2–41
Logic Array Blocks .............................................................................................................................. 2–44
LAB Interconnects .......................................................................................................................... 2–45
LAB Control Signals ....................................................................................................................... 2–46
Adaptive Logic Modules .................................................................................................................... 2–48
ALM Operating Modes ................................................................................................................. 2–50
Arithmetic Mode ............................................................................................................................ 2–55
Shared Arithmetic Mode ............................................................................................................... 2–58
Shared Arithmetic Chain ............................................................................................................... 2–60
Register Chain ................................................................................................................................. 2–61
Clear and Preset Logic Control .................................................................................................... 2–63
MultiTrack Interconnect ..................................................................................................................... 2–63
TriMatrix Memory ............................................................................................................................... 2–69
M512 RAM Block ............................................................................................................................ 2–70
M4K RAM Blocks ........................................................................................................................... 2–73
M-RAM Block ................................................................................................................................. 2–75
Digital Signal Processing (DSP) Block .............................................................................................. 2–81
Modes of Operation ....................................................................................................................... 2–85
DSP Block Interface ........................................................................................................................ 2–85
PLLs and Clock Networks .................................................................................................................. 2–89
Global and Hierarchical Clocking ................................................................................................ 2–89
Enhanced and Fast PLLs ............................................................................................................... 2–97
Enhanced PLLs ............................................................................................................................. 2–109
Fast PLLs ........................................................................................................................................ 2–109
I/O Structure ...................................................................................................................................... 2–110
Double Data Rate I/O Pins ......................................................................................................... 2–118
External RAM Interfacing ........................................................................................................... 2–122
Altera Corporation
iii
Contents
Stratix II GX Device Handbook, Volume 1
Programmable Drive Strength ...................................................................................................
Open-Drain Output ......................................................................................................................
Bus Hold ........................................................................................................................................
Programmable Pull-Up Resistor ................................................................................................
Advanced I/O Standard Support ..............................................................................................
On-Chip Termination ..................................................................................................................
MultiVolt I/O Interface ...............................................................................................................
High-Speed Differential I/O with DPA Support ..........................................................................
Dedicated Circuitry with DPA Support ....................................................................................
Fast PLL and Channel Layout ....................................................................................................
Referenced Documents .....................................................................................................................
Document Revision History .............................................................................................................
2–124
2–125
2–125
2–126
2–126
2–130
2–133
2–136
2–138
2–141
2–142
2–143
Chapter 3. Configuration & Testing
IEEE Std. 1149.1 JTAG Boundary-Scan Support ............................................................................... 3–1
SignalTap II Embedded Logic Analyzer ............................................................................................ 3–3
Configuration ......................................................................................................................................... 3–3
Operating Modes .............................................................................................................................. 3–4
Configuration Schemes ................................................................................................................... 3–6
Device Security Using Configuration Bitstream Encryption ..................................................... 3–7
Device Configuration Data Decompression ................................................................................. 3–7
Remote System Upgrades ............................................................................................................... 3–8
Configuring Stratix II GX FPGAs with JRunner .......................................................................... 3–8
Programming Serial Configuration Devices with SRunner ....................................................... 3–9
Configuring Stratix II FPGAs with the MicroBlaster Driver ..................................................... 3–9
PLL Reconfiguration ........................................................................................................................ 3–9
Temperature Sensing Diode (TSD) ................................................................................................... 3–10
Automated Single Event Upset (SEU) Detection ............................................................................ 3–12
Custom-Built Circuitry .................................................................................................................. 3–12
Software Interface ........................................................................................................................... 3–12
Referenced Documents ....................................................................................................................... 3–13
Document Revision History ............................................................................................................... 3–13
Chapter 4. DC and Switching Characteristics
Operating Conditions ........................................................................................................................... 4–1
Absolute Maximum Ratings ........................................................................................................... 4–1
Recommended Operating Conditions .......................................................................................... 4–2
Transceiver Block Characteristics .................................................................................................. 4–3
DC Electrical Characteristics ........................................................................................................ 4–42
I/O Standard Specifications ......................................................................................................... 4–43
Bus Hold Specifications ................................................................................................................. 4–56
On-Chip Termination Specifications ........................................................................................... 4–56
Pin Capacitance .............................................................................................................................. 4–58
Power Consumption ........................................................................................................................... 4–59
Timing Model ....................................................................................................................................... 4–59
Preliminary and Final Timing ...................................................................................................... 4–59
I/O Timing Measurement Methodology .................................................................................... 4–60
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Altera Corporation
Stratix II GX Device Handbook, Volume 1
Contents
Internal Timing Parameters .......................................................................................................... 4–69
Stratix II GX Clock Timing Parameters ....................................................................................... 4–76
Clock Network Skew Adders ....................................................................................................... 4–81
IOE Programmable Delay ............................................................................................................. 4–82
Default Capacitive Loading of Different I/O Standards .......................................................... 4–83
I/O Delays ....................................................................................................................................... 4–84
Maximum Input and Output Clock Toggle Rate ....................................................................... 4–98
Duty Cycle Distortion ....................................................................................................................... 4–118
DCD Measurement Techniques ................................................................................................. 4–118
High-Speed I/O Specifications ........................................................................................................ 4–126
PLL Timing Specifications ................................................................................................................ 4–130
External Memory Interface Specifications ..................................................................................... 4–132
JTAG Timing Specifications ............................................................................................................. 4–134
Referenced Documents ..................................................................................................................... 4–136
Document Revision History ............................................................................................................. 4–137
Chapter 5. Reference and Ordering Information
Device Pin-Outs .....................................................................................................................................
Ordering Information ...........................................................................................................................
Referenced Documents .........................................................................................................................
Document Revision History .................................................................................................................
Altera Corporation
5–1
5–1
5–2
5–2
v
Contents
vi
Stratix II GX Device Handbook, Volume 1
Altera Corporation
Chapter Revision Dates
The chapters in this book, Stratix II GX Device Handbook, Volume 1, were revised on the following
dates. Where chapters or groups of chapters are available separately, part numbers are listed.
Chapter 1. Introduction
Revised:
Part number:
October 2007
SIIGX51001-1.6
Chapter 2. Stratix II GX Architecture
Revised:
October 2007
Part number: SIIGX51003-2.2
Chapter 3. Configuration & Testing
Revised:
October 2007
Part number: SIIGX51005-1.4
Chapter 4. DC and Switching Characteristics
Revised:
June 2009
Part number: SIIGX51006-4.6
Chapter 5. Reference and Ordering Information
Revised:
August 2007
Part number: SIIGX51007-1.3
Altera Corporation
vii
Chapter Revision Dates
viii
Stratix II GX Device Handbook, Volume 1
Altera Corporation
About this Handbook
This handbook provides comprehensive information about the Altera®
Stratix II GX family of devices.
How to Contact
Altera
For the most up-to-date information about Altera products, refer to the
following table.
Contact (1)
Contact
Method
Address
Technical support
Website
www.altera.com/support
Technical training
Website
www.altera.com/training
Email
[email protected]
Product literature
Email
www.altera.com/literature
Altera literature services
Website
[email protected]
Non-technical support (General) Email
(Software Licensing)
Email
[email protected]
[email protected]
Note to table:
(1)
Typographic
Conventions
Visual Cue
You can also contact your local Altera sales office or sales representative.
This document uses the typographic conventions shown below.
Meaning
Bold Type with Initial
Capital Letters
Command names, dialog box titles, checkbox options, and dialog box options are
shown in bold, initial capital letters. Example: Save As dialog box.
bold type
External timing parameters, directory names, project names, disk drive names,
filenames, filename extensions, and software utility names are shown in bold
type. Examples: fMAX, \qdesigns directory, d: drive, chiptrip.gdf file.
Italic Type with Initial Capital
Letters
Document titles are shown in italic type with initial capital letters. Example: AN 75:
High-Speed Board Design.
Altera Corporation
ix
Preliminary
Typographic Conventions
Visual Cue
Italic type
Stratix II GX Device Handbook, Volume 1
Meaning
Internal timing parameters and variables are shown in italic type.
Examples: tPIA, n + 1.
Variable names are enclosed in angle brackets (< >) and shown in italic type.
Example: <file name>, <project name>.pof file.
Initial Capital Letters
Keyboard keys and menu names are shown with initial capital letters. Examples:
Delete key, the Options menu.
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References to sections within a document and titles of on-line help topics are
shown in quotation marks. Example: “Typographic Conventions.”
Courier type
Signal and port names are shown in lowercase Courier type. Examples: data1,
tdi, input. Active-low signals are denoted by suffix n, e.g., resetn.
Anything that must be typed exactly as it appears is shown in Courier type. For
example: c:\qdesigns\tutorial\chiptrip.gdf. Also, sections of an
actual file, such as a Report File, references to parts of files (e.g., the AHDL
keyword SUBDESIGN), as well as logic function names (e.g., TRI) are shown in
Courier.
1., 2., 3., and
a., b., c., etc.
Numbered steps are used in a list of items when the sequence of the items is
important, such as the steps listed in a procedure.
■
Bullets are used in a list of items when the sequence of the items is not important.
●
•
v
The checkmark indicates a procedure that consists of one step only.
1
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A caution calls attention to a condition or possible situation that can damage or
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A warning calls attention to a condition or possible situation that can cause injury
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The angled arrow indicates you should press the Enter key.
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The feet direct you to more information on a particular topic.
x
Preliminary
Altera Corporation
Section I. Stratix II GX
Device Data Sheet
This section provides designers with the data sheet specifications for
Stratix® II GX devices. They contain feature definitions of the
transceivers, internal architecture, configuration, and JTAG
boundary-scan testing information, DC operating conditions, AC timing
parameters, a reference to power consumption, and ordering information
for Stratix II GX devices.
This section includes the following chapters:
Revision History
Altera Corporation
■
Chapter 1, Introduction
■
Chapter 2, Stratix II GX Architecture
■
Chapter 3, Configuration & Testing
■
Chapter 4, DC and Switching Characteristics
■
Chapter 5, Reference and Ordering Information
Refer to each chapter for its own specific revision history. For information
on when each chapter was updated, refer to the Chapter Revision Dates
section, which appears in the full handbook.
Section I–1
Stratix II GX Device Data Sheet
Section I–2
Stratix II GX Device Handbook, Volume 1
Altera Corporation
1. Introduction
SIIGX51001-1.6
The Stratix® II GX family of devices is Altera’s third generation of FPGAs
to combine high-speed serial transceivers with a scalable,
high-performance logic array. Stratix II GX devices include 4 to 20
high-speed transceiver channels, each incorporating clock and data
recovery unit (CRU) technology and embedded SERDES capability at
data rates of up to 6.375 gigabits per second (Gbps). The transceivers are
grouped into four-channel transceiver blocks and are designed for low
power consumption and small die size. The Stratix II GX FPGA
technology is built upon the Stratix II architecture and offers a 1.2-V logic
array with unmatched performance, flexibility, and time-to-market
capabilities. This scalable, high-performance architecture makes
Stratix II GX devices ideal for high-speed backplane interface,
chip-to-chip, and communications protocol-bridging applications.
Features
This section lists the Stratix II GX device features.
■
Altera Corporation
October 2007
Main device features:
●
TriMatrix memory consisting of three RAM block sizes to
implement true dual-port memory and first-in first-out (FIFO)
buffers with performance up to 550 MHz
●
Up to 16 global clock networks with up to 32 regional clock
networks per device region
●
High-speed DSP blocks provide dedicated implementation of
multipliers (at up to 450 MHz), multiply-accumulate functions,
and finite impulse response (FIR) filters
●
Up to four enhanced PLLs per device provide spread spectrum,
programmable bandwidth, clock switch-over, real-time PLL
reconfiguration, and advanced multiplication and phase
shifting
●
Support for numerous single-ended and differential I/O
standards
●
High-speed source-synchronous differential I/O support on up
to 71 channels
●
Support for source-synchronous bus standards, including SPI-4
Phase 2 (POS-PHY Level 4), SFI-4.1, XSBI, UTOPIA IV, NPSI,
and CSIX-L1
●
Support for high-speed external memory, including quad data
rate (QDR and QDRII) SRAM, double data rate (DDR and
DDR2) SDRAM, and single data rate (SDR) SDRAM
1–1
Features
●
●
●
■
Support for multiple intellectual property megafunctions from
Altera® MegaCore® functions and Altera Megafunction Partners
Program (AMPPSM) megafunctions
Support for design security using configuration bitstream
encryption
Support for remote configuration updates
Transceiver block features:
●
High-speed serial transceiver channels with clock data recovery
(CDR) provide 600-megabits per second (Mbps) to 6.375-Gbps
full-duplex transceiver operation per channel
●
Devices available with 4, 8, 12, 16, or 20 high-speed serial
transceiver channels providing up to 255 Gbps of serial
bandwidth (full duplex)
●
Dynamically programmable voltage output differential (VOD)
and pre-emphasis settings for improved signal integrity
●
Support for CDR-based serial protocols, including PCI Express,
Gigabit Ethernet, SDI, Altera’s SerialLite II, XAUI, CEI-6G,
CPRI, Serial RapidIO, SONET/SDH
●
Dynamic reconfiguration of transceiver channels to switch
between multiple protocols and data rates
●
Individual transmitter and receiver channel power-down
capability for reduced power consumption during
non-operation
●
Adaptive equalization (AEQ) capability at the receiver to
compensate for changing link characteristics
●
Selectable on-chip termination resistors (100, 120, or 150 Ω) for
improved signal integrity on a variety of transmission media
●
Programmable transceiver-to-FPGA interface with support for
8-, 10-, 16-, 20-, 32-, and 40-bit wide data transfer
●
1.2- and 1.5-V pseudo current mode logic (PCML) for 600 Mbps
to 6.375 Gbps (AC coupling)
●
Receiver indicator for loss of signal (available only in PIPE
mode)
●
Built-in self test (BIST)
●
Hot socketing for hot plug-in or hot swap and power
sequencing support without the use of external devices
●
Rate matcher, byte-reordering, bit-reordering, pattern detector,
and word aligner support programmable patterns
●
Dedicated circuitry that is compliant with PIPE, XAUI, and
GIGE
●
Built-in byte ordering so that a frame or packet always starts in
a known byte lane
●
Transmitters with two PLL inputs for each transceiver block
with independent clock dividers to provide varying clock rates
on each of its transmitters
1–2
Stratix II GX Device Handbook, Volume 1
Altera Corporation
October 2007
Introduction
●
●
●
●
f
8B/10B encoder and decoder perform 8-bit to 10-bit encoding
and 10-bit to 8-bit decoding
Phase compensation FIFO buffer performs clock domain
translation between the transceiver block and the logic array
Receiver FIFO resynchronizes the received data with the local
reference clock
Channel aligner compliant with XAUI
Certain transceiver blocks can be bypassed. Refer to the Stratix II GX
Architecture chapter in volume 1 of the Stratix II GX Device Handbook for
more details.
Table 1–1 lists the Stratix II GX device features.
Table 1–1. Stratix II GX Device Features (Part 1 of 2)
EP2SGX30C/D
EP2SGX60C/D/E
EP2SGX90E/F
EP2SGX130/G
Feature
C
ALMs
C
13,552
Equivalent LEs
Transceiver
channels
D
E
E
F
24,176
33,880
4
D
36,384
60,440
8
4
8
53,016
90,960
12
132,540
12
16
600 Mbps to
6.375 Gbps
Source-synchronous
receive channels (1)
31
31
31
42
47
59
73
Source-synchronous
transmit channels
29
29
29
42
45
59
71
M512 RAM blocks
(32 × 18 bits)
202
329
488
699
M4K RAM blocks
(128 × 36 bits)
144
255
408
609
M-RAM blocks
(4K × 144 bits)
1
2
4
6
Total RAM bits
1,369,728
2,544,192
4,520,448
6,747,840
Embedded
multipliers (18 × 18)
64
144
192
252
DSP blocks
16
48
63
PLLs
4
4
4
8
8
8
361
364
364
534
Altera Corporation
October 2007
600 Mbps to
6.375 Gbps
20
Transceiver data rate
Maximum user I/O
pins
600 Mbps to 6.375 Gbps
G
36
558
650
600 Mbps to
6.375 Gbps
734
1–3
Stratix II GX Device Handbook, Volume 1
Features
Table 1–1. Stratix II GX Device Features (Part 2 of 2)
EP2SGX30C/D
EP2SGX60C/D/E
EP2SGX90E/F
EP2SGX130/G
Feature
C
Package
D
C
780-pin
FineLine BGA
D
E
780-pin
1,152-pin
FineLine BGA FineLine
BGA
E
F
G
1,152-pin
FineLine
BGA
1,508-pin
FineLine
BGA
1,508-pin
FineLine BGA
Note to Table 1–1:
(1)
Includes two sets of dual-purpose differential pins that can be used as two additional channels for the differential
receiver or differential clock inputs.
Stratix II GX devices are available in space-saving FineLine BGA
packages (refer to Table 1–2). All Stratix II GX devices support vertical
migration within the same package. Vertical migration means that you
can migrate to devices whose dedicated pins, configuration pins, and
power pins are the same for a given package across device densities. For
I/O pin migration across densities, you must cross-reference the available
I/O pins using the device pin-outs for all planned densities of a given
package type to identify which I/O pins are migratable. Table 1–3 lists the
Stratix II GX device package sizes.
Table 1–2. Stratix II GX Package Options (Pin Counts and Transceiver Channels)
Source-Synchronous
Channels
Device
Transceiver
Channels
Maximum User I/O Pin Count
Receive (1)
Transmit
780-Pin
FineLine BGA
(29 mm)
1,152-Pin
FineLine BGA
(35 mm)
1,508-Pin
FineLine BGA
(40 mm)
EP2SGX30C
4
31
29
361
—
—
EP2SGX60C
4
31
29
364
—
—
EP2SGX30D
8
31
29
361
—
—
EP2SGX60D
8
31
29
364
—
—
EP2SGX60E
12
42
42
—
534
—
EP2SGX90E
12
47
45
—
558
—
EP2SGX90F
16
59
59
—
—
650
EP2SGX130G
20
73
71
—
—
734
Note to Table 1–2:
(1)
Includes two differential clock inputs that can also be used as two additional channels for the differential receiver.
1–4
Stratix II GX Device Handbook, Volume 1
Altera Corporation
October 2007
Introduction
Table 1–3. Stratix II GX FineLine BGA Package Sizes
Dimension
780 Pins
1,152 Pins
1,508 Pins
Pitch (mm)
1.00
1.00
1.00
(mm2)
841
1,225
1,600
29 × 29
35 × 35
40 × 40
Area
Length width (mm × mm)
Referenced
Document
This chapter references the following document:
Document
Revision History
Table 1–4 shows the revision history for this chapter.
■
Stratix II GX Architecture chapter in volume 1 of the Stratix II GX
Device Handbook
Table 1–4. Document Revision History
Date and Document
Version
October 2007, v1.6
Changes Made
Summary of Changes
Updated “Features” section.
Minor text edits.
August 2007, v1.5
Added “Referenced Documents” section.
Minor text edits.
February 2007, v1.4
●
●
●
Changed 622 Mbps to 600 Mbps on
page 1-2 and Table 1–1.
Deleted “DC coupling” from the
Transceiver Block Features list.
Changed 4 to 6 in the PLLs row
(columns 3 and 4) of Table 1–1.
Added the “Document Revision History”
section to this chapter.
June 2006, v1.3
●
Updated Table 1–2.
April 2006, v1.2
●
●
Updated Table 1–1.
Updated Table 1–2.
February 2006, v1.1
●
Updated Table 1–1.
October 2005
v1.0
Added chapter to the Stratix II GX Device
Handbook.
Altera Corporation
October 2007
Added support information for the
Stratix II GX device.
Updated numbers for receiver channels and
user I/O pin counts in Table 1–2.
1–5
Stratix II GX Device Handbook, Volume 1
Document Revision History
1–6
Stratix II GX Device Handbook, Volume 1
Altera Corporation
October 2007
2. Stratix II GX Architecture
SIIGX51003-2.2
Transceivers
Stratix® II GX devices incorporate dedicated embedded circuitry on the
right side of the device, which contains up to 20 high-speed 6.375-Gbps
serial transceiver channels. Each Stratix II GX transceiver block contains
four full-duplex channels and supporting logic to transmit and receive
high-speed serial data streams. The transceivers deliver bidirectional
point-to-point data transmissions, with up to 51 Gbps (6.375 Gbps per
channel) of full-duplex data transmission per transceiver block.
Figure 2–1 shows the function blocks that make up a transceiver channel
within the Stratix II GX device.
Figure 2–1. Stratix II GX Transceiver Block Diagram
PMA Analog Section
PCS Digital Section
n
Deserializer
(1)
Receiver
PLL
Reference
Clock
Transmitter
PLL
Word
Aligner
Rate
Matcher
Clock
Recovery
Unit
Reference
Clock
FPGA Fabric
XAUI
Lane
Deskew
8B/10B
Decoder
Byte
Deserializer
Byte
Ordering
Phase
Compensation
FIFO Buffer
m
(2)
n
Serializer
(1)
8B/10B
Encoder
Byte
Serializer
Phase
Compensation
FIFO Buffer
m
(2)
Notes to Figure 2–1:
(1)
(2)
n represents the number of bits in each word that need to be serialized by the transmitter portion of the PMA or have
been deserialized by the receiver portion of the PMA. n = 8, 10, 16, or 20.
m represents the number of bits in the word that pass between the FPGA logic and the PCS portion of the transceiver.
m = 8, 10, 16, 20, 32, or 40.
Transceivers within each block are independent and have their own set of
dividers. Therefore, each transceiver can operate at different frequencies.
Each block can select from two reference clocks to provide two clock
domains that each transceiver can select from.
Altera Corporation
October 2007
2–1
Transceivers
There are up to 20 transceiver channels available on a single Stratix II GX
device. Table 2–1 shows the number of transceiver channels and their
serial bandwidth for each Stratix II GX device.
Table 2–1. Stratix II GX Transceiver Channels
Number of Transceiver
Channels
Serial Bandwidth
(Full Duplex)
EP2SGX30C
4
51 Gbps
EP2SGX60C
4
51 Gbps
EP2SGX30D
8
102 Gbps
EP2SGX60D
8
102 Gbps
EP2SGX60E
12
153 Gbps
EP2SGX90E
12
153 Gbps
Device
EP2SGX90F
16
204 Gbps
EP2SGX130G
20
255 Gbps
Figure 2–2 shows the elements of the transceiver block, including the four
transceiver channels, supporting logic, and I/O buffers. Each transceiver
channel consists of a receiver and transmitter. The supporting logic
contains two transmitter PLLs to generate the high-speed clock(s) used by
the four transmitters within that block. Each of the four transmitter
channels has its own individual clock divider. The four receiver PLLs
within each transceiver block generate four recovered clocks. The
transceiver channels can be configured in one of the following functional
modes:
■
■
■
■
■
■
■
■
■
PCI Express (PIPE)
OIF CEI PHY Interface
SONET/SDH
Gigabit Ethernet (GIGE)
XAUI
Basic (600 Mbps to 3.125 Gbps single-width mode and 1 Gbps to
6.375 Gbps double-width mode)
SDI (HD, 3G)
CPRI (614 Mbps, 1228 Mbps, 2456 Mbps)
Serial RapidIO (1.25 Gbps, 2.5 Gbps, 3.125 Gbps)
2–2
Stratix II GX Device Handbook, Volume 1
Altera Corporation
October 2007
Stratix II GX Architecture
Figure 2–2. Elements of the Transceiver Block
Stratix II GX
Logic Array
Transceiver Block
RX1
Channel 1
TX1
RX0
Channel 0
TX0
Supporting Blocks
(PLLs, State Machines,
Programming)
REFCLK_1
REFCLK_0
RX2
Channel 2
TX2
RX3
Channel 3
TX3
Each Stratix II GX transceiver channel consists of a transmitter and
receiver. The transceivers are grouped in four and share PLL resources.
Each transmitter has access to one of two PLLs. The transmitter contains
the following:
■
■
■
■
■
Transmitter phase compensation first-in first-out (FIFO) buffer
Byte serializer (optional)
8B/10B encoder (optional)
Serializer (parallel-to-serial converter)
Transmitter differential output buffer
The receiver contains the following:
■
■
■
■
■
■
■
■
■
■
■
■
Receiver differential input buffer
Receiver lock detector and run length checker
Clock recovery unit (CRU)
Deserializer
Pattern detector
Word aligner
Lane deskew
Rate matcher (optional)
8B/10B decoder (optional)
Byte deserializer (optional)
Byte ordering
Receiver phase compensation FIFO buffer
Designers can preset Stratix II GX transceiver functions using the
Quartus® II software. In addition, pre-emphasis, equalization, and
differential output voltage (VOD) are dynamically programmable. Each
Stratix II GX transceiver channel supports various loopback modes and is
Altera Corporation
October 2007
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Stratix II GX Device Handbook, Volume 1
Transceivers
capable of built-in self test (BIST) generation and verification. The
ALT2GXB megafunction in the Quartus II software provides a
step-by-step menu selection to configure the transceiver.
Figure 2–1 shows the block diagram for the Stratix II GX transceiver
channel. Stratix II GX transceivers provide PCS and PMA
implementations for all supported protocols. The PCS portion of the
transceiver consists of the word aligner, lane deskew FIFO buffer, rate
matcher FIFO buffer, 8B/10B encoder and decoder, byte serializer and
deserializer, byte ordering, and phase compensation FIFO buffers.
Each Stratix II GX transceiver channel is also capable of BIST generation
and verification in addition to various loopback modes. The PMA portion
of the transceiver consists of the serializer and deserializer, the CRU, and
the high-speed differential transceiver buffers that contain pre-emphasis,
programmable on-chip termination (OCT), programmable voltage
output differential (VOD), and equalization.
Transmitter Path
This section describes the data path through the Stratix II GX transmitter.
The Stratix II GX transmitter contains the following modules:
■
■
■
■
■
■
■
■
Transmitter PLLs
Access to one of two PLLs
Transmitter logic array interface
Transmitter phase compensation FIFO buffer
Byte serializer
8B/10B encoder
Serializer (parallel-to-serial converter)
Transmitter differential output buffer
Transmitter PLLs
Each transceiver block has two transmitter PLLs which receive two
reference clocks to generate timing and the following clocks:
■
■
High-speed clock used by the serializer to transmit the high-speed
differential transmitter data
Low-speed clock to load the parallel transmitter data of the serializer
The serializer uses high-speed clocks to transmit data. The serializer is
also referred to as parallel in serial out (PISO). The high-speed clock is fed
to the local clock generation buffer. The local clock generation buffers
divide the high-speed clock on the transmitter to a desired frequency on
a per-channel basis. Figure 2–3 is a block diagram of the transmitter
clocks.
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October 2007
Stratix II GX Architecture
Figure 2–3. Clock Distribution for the Transmitters Note (1)
Transmitter High-Speed &
Low-Speed Clocks
Transmitter Channel [3..2]
TX Clock
Gen Block
Transmitter Local
Clock Divider Block
Central Block
Reference Clocks
(refclks,
Global Clock (1),
Inter-Transceiver
Lines)
Transmitter PLL Block
Central Clock
Divider Block
Transmitter Channel [1..0]
TX Clock
Gen Block
Transmitter Local
Clock Divider Block
Transmitter High-Speed &
Low-Speed Clocks
Note to Figure 2–3:
(1)
The global clock line must be driven by an input pin.
The transmitter PLLs in each transceiver block clock the PMA and PCS
circuitry in the transmit path. The Quartus II software automatically
powers down the transmitter PLLs that are not used in the design.
Figure 2–4 is a block diagram of the transmitter PLL.
The transmitter phase/frequency detector references the clock from one
of the following sources:
■
■
■
■
Reference clocks
Reference clock from the adjacent transceiver block
Inter-transceiver block clock lines
Global clock line driven by input pin
Two reference clocks, REFCLK0 and REFCLK1, are available per
transceiver block. The inter-transceiver block bus allows multiple
transceivers to use the same reference clocks. Each transceiver block has
one outgoing reference clock which connects to one inter-transceiver
block line. The incoming reference clock can be selected from five
inter-transceiver block lines IQ[4..0] or from the global clock line that
is driven by an input pin.
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October 2007
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Stratix II GX Device Handbook, Volume 1
Transceivers
Figure 2–4. Transmitter PLL Block Note (1)
Transmitter PLL 0
÷m
Inter-Transceiver Block
Routing (IQ[4:0])
From PLD
Dedicated Local
REFCLK 0
High-Speed
Transmitter PLL0 Clock
up
INCLK
PFD
dn
CP+LF
VCO
÷L
÷ /2
2
High-Speed
Transmitter PLL Clock
To Inter-Transceiver
Block Line
Transmitter PLL 1
÷m
up
Inter-Transceiver Block
Routing (IQ[4:0])
From PLD
Dedicated Local
REFCLK 1
INCLK PFD
dn
CP+LF
VCO
÷L
High-Speed
Transmitter PLL1 Clock
÷2
Note to Figure 2–4:
(1)
The global clock line must be driven by an input pin.
The transmitter PLLs support data rates up to 6.375 Gbps. The input clock
frequency is limited to 622.08 MHz. An optional pll_locked port is
available to indicate whether the transmitter PLL is locked to the
reference clock. Both transmitter PLLs have a programmable loop
bandwidth parameter that can be set to low, medium, or high. The loop
bandwidth parameter can be statically set in the Quartus II software.
Table 2–2 lists the adjustable parameters in the transmitter PLL.
Table 2–2. Transmitter PLL Specifications
Parameter
Specifications
Input reference frequency range
50 MHz to 622.08 MHz
Data rate support
600 Mbps to 6.375 Gbps
Multiplication factor (W)
1, 4, 5, 8, 10, 16, 20, 25
Bandwidth
Low, medium, or high
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October 2007
Stratix II GX Architecture
Transmitter Phase Compensation FIFO Buffer
The transmitter phase compensation FIFO buffer resides in the
transceiver block at the PCS/FPGA boundary and cannot be bypassed.
This FIFO buffer compensates for phase differences between the
transmitter PLL clock and the clock from the PLD. After the transmitter
PLL has locked to the frequency and phase of the reference clock, the
transmitter FIFO buffer must be reset to initialize the read and write
pointers. After FIFO pointer initialization, the PLL must remain phase
locked to the reference clock.
Byte Serializer
The FPGA and transceiver block must maintain the same throughput. If
the FPGA interface cannot meet the timing margin to support the
throughput of the transceiver, the byte serializer is used on the
transmitter and the byte deserializer is used on the receiver.
The byte serializer takes words from the FPGA interface and converts
them into smaller words for use in the transceiver. The transmit data path
after the byte serializer is 8, 10, 16, or 20 bits. Refer to Table 2–3 for the
transmitter data with the byte serializer enabled. The byte serializer can
be bypassed when the data width is 8, 10, 16, or 20 bits at the FPGA
interface.
Table 2–3. Transmitter Data with the Byte Serializer Enabled
Input Data Width
Output Data Width
16 bits
8 bits
20 bits
10 bits
32 bits
16 bits
40 bits
20 bits
If the byte serializer is disabled, the FPGA transmit data is passed without
data width conversion.
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October 2007
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Stratix II GX Device Handbook, Volume 1
Transceivers
Table 2–4 shows the data path configurations for the Stratix II GX device
in single-width and double-width modes.
1
Refer to the section “8B/10B Encoder” on page 2–8 for a
description of the single- and double-width modes.
Table 2–4. Data Path Configurations Note (1)
Single-Width Mode
Without Byte
Serialization/
Deserialization
Parameter
Fabric to PCS data path width (bits)
Data rate range (Gbps)
Double-Width Mode
With Byte
Serialization/
Deserialization
Without Byte
Serialization/
Deserialization
With Byte
Serialization/
Deserialization
8 or 10
16 or 20
16 or 20
32 or 40
0.6 to 2.5
0.6 to 3.125
1 to 5.0
1 to 6.375
8 or 10
8 or 10
16 or 20
16 or 20
PCS to PMA data path width (bits)
Byte ordering (1)
v
v
v
v
v
Data symbol A (MSB)
Data symbol B
Data symbol C
v
Data symbol D (LSB)
v
v
v
v
v
Note to Table 2–4:
(1)
Designs can use byte ordering when byte serialization and deserialization are used.
8B/10B Encoder
There are two different modes of operation for 8B/10B encoding.
Single-width (8-bit) mode supports natural data rates from 622 Mbps to
3.125 Gbps. Double-width (16-bit cascaded) mode supports data rates
above 3.125 Gbps. The encoded data has a maximum run length of five.
The 8B/10B encoder can be bypassed. Figure 2–5 diagrams the 10-bit
encoding process.
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October 2007
Stratix II GX Architecture
Figure 2–5. 8B/10B Encoding Process
+
7
6
5
4
3
2
1
0
H
G
F
E
D
C
B
A
ctrl
8B/10B Conversion
j
h
g
f
i
e
d
c
b
a
9
8
7
6
5
4
3
2
1
0
MSB sent last
LSB sent first
In single-width mode, the 8B/10B encoder generates a 10-bit code group
from the 8-bit data and 1-bit control identifier. In double-width mode,
there are two 8B/10B encoders that are cascaded together and generate a
20-bit (2 × 10-bit) code group from the 16-bit (2 × 8-bit) data + 2-bit
(2 × 1-bit) control identifier. Figure 2–6 shows the 20-bit encoding
process. The 8B/10B encoder conforms to the IEEE 802.3 1998 edition
standards.
Figure 2–6. 16-Bit to 20-Bit Encoding Process
CTRL[1..0]
H'
G'
F'
E'
D'
C'
B'
A'
H
G
F
E
D
C
B
A
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
Parallel Data
Cascaded 8B/10B Conversion
j'
h'
g'
f'
i'
e'
d'
c'
b'
a'
j
h
g
f
i
e
d
c
b
a
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
MSB
LSB
Upon power on or reset, the 8B/10B encoder has a negative disparity
which chooses the 10-bit code from the RD-column. However, the
running disparity can be changed via the tx_forcedisp and
tx_dispval ports.
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October 2007
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Stratix II GX Device Handbook, Volume 1
Transceivers
Transmit State Machine
The transmit state machine operates in either PCI Express mode, XAUI
mode, or GIGE mode, depending on the protocol used. The state machine
is not utilized for certain protocols, such as SONET.
GIGE Mode
In GIGE mode, the transmit state machine converts all idle ordered sets
(/K28.5/, /Dx.y/) to either /I1/ or /I2/ ordered sets. /I1/ consists of a
negative-ending disparity /K28.5/ (denoted by /K28.5/-) followed by a
neutral /D5.6/. /I2/ consists of a positive-ending disparity /K28.5/
(denoted by /K28.5/+) and a negative-ending disparity /D16.2/
(denoted by /D16.2/-). The transmit state machines do not convert any of
the ordered sets to match /C1/ or /C2/, which are the configuration
ordered sets. (/C1/ and /C2/ are defined by [/K28.5/, /D21.5/] and
[/K28.5/, /D2.2/], respectively). Both the /I1/ and /I2/ ordered sets
guarantee a negative-ending disparity after each ordered set.
XAUI Mode
The transmit state machine translates the XAUI XGMII code group to the
XAUI PCS code group. Table 2–5 shows the code conversion.
Table 2–5. Code Conversion
XGMII TXC
XGMII TXD
PCS Code-Group
Description
0
00 through FF
Dxx.y
Normal data
1
07
K28.0 or K28.3 or
K28.5
Idle in ||I||
1
07
K28.5
Idle in ||T||
1
9C
K28.4
Sequence
1
FB
K27.7
Start
1
FD
K29.7
Terminate
1
FE
K30.7
Error
1
See IEEE 802.3
reserved code
groups
See IEEE 802.3
reserved code groups
Reserved code groups
1
Other value
K30.7
Invalid XGMII character
The XAUI PCS idle code groups, /K28.0/ (/R/) and /K28.5/ (/K/), are
automatically randomized based on a PRBS7 pattern with an x7 + x6 + 1
polynomial. The /K28.3/ (/A/) code group is automatically generated
between 16 and 31 idle code groups. The idle randomization on the /A/,
/K/, and /R/ code groups is done automatically by the transmit state
machine.
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October 2007
Stratix II GX Architecture
Serializer (Parallel-to-Serial Converter)
The serializer converts the parallel 8, 10, 16, or 20-bit data into a serial data
bit stream, transmitting the least significant bit (LSB) first. The serialized
data stream is then fed to the high-speed differential transmit buffer.
Figure 2–7 is a diagram of the serializer.
Figure 2–7. Serializer Note (1)
10
D9
D9
D8
D8
D7
D7
D6
D6
D5
D5
D4
D4
D3
D3
D2
D2
D1
D1
D0
D0
Serial data
out (to output
buffer)
Low-speed
parallel clock
High-speed
serial clock
Note to Figure 2–7:
(1)
This is a 10-bit serializer. The serializer can also convert 8, 16, and 20 bits of data.
Transmit Buffer
The Stratix II GX transceiver buffers support the 1.2- and 1.5-V PCML
I/O standard at rates up to 6.375 Gbps. The common mode voltage (VCM)
of the output driver is programmable. The following VCM values are
available when the buffer is in 1.2- and 1.5-V PCML.
■
■
Altera Corporation
October 2007
VCM = 0.6 V
VCM = 0.7 V
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Stratix II GX Device Handbook, Volume 1
Transceivers
f
Refer to the Stratix II GX Transceiver Architecture Overview chapter in
volume 2 of the Stratix II GX Handbook.
The output buffer, as shown in Figure 2–8, is directly driven by the
high-speed data serializer and consists of a programmable output driver,
a programmable pre-emphasis circuit, a programmable termination, and
a programmable VCM.
Figure 2–8. Output Buffer
Serializer
Output Buffer
Programmable
Pre-Emphasis
Programmable
Output
Driver
Programmable
Termination
Output
Pins
Programmable Output Driver
The programmable output driver can be set to drive out differentially
200 to 1,400 mV. The differential output voltage (VOD) can be changed
dynamically, or statically set by using the ALT2GXB megafunction or
through I/O pins.
The output driver may be programmed with four different differential
termination values:
■
■
■
■
100 Ω
120 Ω
150 Ω
External termination
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October 2007
Stratix II GX Architecture
Differential signaling conventions are shown in Figure 2–9. The
differential amplitude represents the value of the voltage between the
true and complement signals. Peak-to-peak differential voltage is defined
as 2 × (VHIGH – VLOW) = 2 × single-ended voltage swing. The common
mode voltage is the average of Vhigh and Vlow.
Figure 2–9. Differential Signaling
Single-Ended Waveform
Vhigh
True
+VOD
Complement
Vlow
Differential Waveform
+400
+VOD
0-V Differential
2 * VOD
VOD (Differential)
= Vhigh − Vlow
-VOD
−400
Programmable Pre-Emphasis
The programmable pre-emphasis module controls the output driver to
boost the high frequency components, and compensate for losses in the
transmission medium, as shown in Figure 2–10. The pre-emphasis is set
statically using the ALT2GXB megafunction or dynamically through the
dynamic reconfiguration controller.
Figure 2–10. Pre-Emphasis Signaling
VMAX
Pre-Emphasis % = (
VMIN
VMAX
− 1) × 100
VMIN
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October 2007
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Stratix II GX Device Handbook, Volume 1
Transceivers
Pre-emphasis percentage is defined as (VMAX/VMIN – 1) × 100, where
VMAX is the differential emphasized voltage (peak-to-peak) and VMIN is
the differential steady-state voltage (peak-to-peak).
Programmable Termination
The programmable termination can be statically set in the Quartus II
software. The values are 100 Ω , 120 Ω , 150 Ω , and external termination.
Figure 2–11 shows the setup for programmable termination.
Figure 2–11. Programmable Transmitter Terminations
VCM
50, 60, or 75 9
Programmable
Output
Driver
PCI Express Receiver Detect
The Stratix II GX transmitter buffer has a built-in receiver detection circuit
for use in PIPE mode. This circuit provides the ability to detect if there is
a receiver downstream by sending out a pulse on the channel and
monitoring the reflection. This mode requires the transmitter buffer to be
tri-stated (in electrical idle mode).
PCI Express Electric Idles (or Individual Transmitter Tri-State)
The Stratix II GX transmitter buffer supports PCI Express electrical idles.
This feature is only active in PIPE mode. The tx_forceelecidle port
puts the transmitter buffer in electrical idle mode. This port is available in
all PCI Express power-down modes and has specific usage in each mode.
Receiver Path
This section describes the data path through the Stratix II GX receiver. The
Stratix II GX receiver consists of the following blocks:
■
■
■
■
■
■
Receiver differential input buffer
Receiver PLL lock detector, signal detector, and run length checker
Clock/data recovery (CRU) unit
Deserializer
Pattern detector
Word aligner
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October 2007
Stratix II GX Architecture
■
■
■
■
■
■
Lane deskew
Rate matcher
8B/10B decoder
Byte deserializer
Byte ordering
Receiver phase compensation FIFO buffer
Receiver Input Buffer
The Stratix II GX receiver input buffer supports the 1.2-V and 1.5-V
PCML I/O standard at rates up to 6.375 Gbps. The common mode voltage
of the receiver input buffer is programmable between 0.85 V and 1.2 V.
You must select the 0.85 V common mode voltage for AC- and
DC-coupled PCML links and the 1.2 V common mode voltage for
DC-coupled LVDS links.
The receiver has programmable on-chip 100-, 120-, or 150-Ω differential
termination for different protocols, as shown in Figure 2–12. The
receiver’s internal termination can be disabled if external terminations
and biasing are provided. The receiver and transmitter differential
termination resistances can be set independently of each other.
Figure 2–12. Receiver Input Buffer
Programmable
Termination
Input
Pins
Programmable
Equalizer
Differential
Input
Buffer
Programmable Termination
The programmable termination can be statically set in the Quartus II
software. Figure 2–13 shows the setup for programmable receiver
termination. The termination can be disabled if external termination is
provided.
Altera Corporation
October 2007
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Stratix II GX Device Handbook, Volume 1
Transceivers
Figure 2–13. Programmable Receiver Termination
Differential
Input
Buffer
50, 60, or 75 Ω
VCM
50, 60, or 75 Ω
If a design uses external termination, the receiver must be externally
terminated and biased to 0.85 V or 1.2 V. Figure 2–14 shows an example
of an external termination and biasing circuit.
Figure 2–14. External Termination and Biasing Circuit
Receiver External Termination
and Biasing
Stratix II GX Device
VDD
50/60/75-Ω
Termination
Resistance
R1
C1
Receiver
R1/R2 = 1K
VDD × {R2/(R1 + R 2)} = 0.85/1.2 V
RXIP
R2
RXIN
Receiver External Termination
and Biasing
Transmission
Line
Programmable Equalizer
The Stratix II GX receivers provide a programmable receive equalization
feature to compensate the effects of channel attenuation for high-speed
signaling. PCB traces carrying these high-speed signals have low-pass
filter characteristics. The impedance mismatch boundaries can also cause
signal degradation. The equalization in the receiver diminishes the lossy
attenuation effects of the PCB at high frequencies.
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October 2007
Stratix II GX Architecture
1
The Stratix II GX receivers also have adaptive equalization
capability that adjusts the equalization levels to compensate for
changing link characteristics. The adaptive equalization can be
powered down dynamically after it selects the appropriate
equalization levels.
The receiver equalization circuit is comprised of a programmable
amplifier. Each stage is a peaking equalizer with a different center
frequency and programmable gain. This allows varying amounts of gain
to be applied, depending on the overall frequency response of the channel
loss. Channel loss is defined as the summation of all losses through the
PCB traces, vias, connectors, and cables present in the physical link.
Figure 2–15 shows the frequency response for the 16 programmable
settings allowed by the Quartus II software for Stratix II GX devices.
Figure 2–15. Frequency Response
High
Medium
Low
Bypass EQ
Receiver PLL and CRU
Each transceiver block has four receiver PLLs, lock detectors, signal
detectors, run length checkers, and CRU units, each of which is dedicated
to a receive channel. If the receive channel associated with a particular
receiver PLL or CRU is not used, the receiver PLL and CRU are powered
down for the channel. Figure 2–16 shows the receiver PLL and CRU
circuits.
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October 2007
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Stratix II GX Device Handbook, Volume 1
Transceivers
Figure 2–16. Receiver PLL and CRU
÷1, 4, 5, 8, 10, 16, 20, or 25
÷m
rx_pll_locked
rx_cruclk
÷N
PFD
÷2
Up
Down
÷1, 2, 4
CP+LF
Up
VCO
÷L
÷1, 2, 4
Down
rx_locktorefclk
rx_locktodata
Clock Recovery Unit (CRU)
rx_datain
rx_freqlocked
rx_rlv[ ]
High Speed RCVD_CLK
Low Speed RCVD_CLK
The receiver PLLs and CRUs can support frequencies up to 6.375 Gbps.
The input clock frequency is limited to the full clock range of 50 to
622 MHz but only when using REFCLK0 or REFCLK1. An optional
RX_PLL_LOCKED port is available to indicate whether the PLL is locked
to the reference clock. The receiver PLL has a programmable loop
bandwidth which can be set to low, medium, or high. The Quartus II
software can statically set the loop bandwidth parameter.
All the parameters listed are programmable in the Quartus II software.
The receiver PLL has the following features:
■
■
■
■
■
■
■
Operates from 600 Mbps to 6.375 Gbps.
Uses a reference clock between 50 MHz and 622.08 MHz.
Programmable bandwidth settings: low, medium, and high.
Programmable rx_locktorefclk (forces the receiver PLL to lock
to the reference clock) and rx_locktodata (forces the receiver PLL
to lock to the data).
The voltage-controlled oscillator (VCO) operates at half rate and has
two modes. These modes are for low or high frequency operation
and provide optimized phase-noise performance.
Programmable frequency multiplication W of 1, 4, 5, 8, 10, 16, 20, and
25. Not all settings are supported for any particular frequency.
Two lock indication signals are provided. They are found in PFD
mode (lock-to-reference clock), and PD (lock-to-data).
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Stratix II GX Architecture
The CRU has a built-in switchover circuit to select whether the PLL VCO
is aligned by the reference clock or the data. The optional port
rx_freqlocked monitors when the CRU is in locked-to-data mode.
In the automatic mode, the CRU PLL must be within the prescribed PPM
frequency threshold setting of the CRU reference clock for the CRU to
switch from locked-to-reference to locked-to-data mode.
The automatic switchover circuit can be overridden by using the optional
ports rx_locktorefclk and rx_locktodata. Table 2–6 shows the
possible combinations of these two signals.
Table 2–6. Receiver Lock Combinations
rx_locktodata
rx_locktorefclk
VCO (Lock to Mode)
0
0
Auto
0
1
Reference clock
1
x
Data
If the rx_locktorefclk and rx_locktodata ports are not used, the
default is auto mode.
Deserializer (Serial-to-Parallel Converter)
The deserializer converts a serial bitstream into 8, 10, 16, or 20 bits of
parallel data. The deserializer receives the LSB first. Figure 2–17 shows
the deserializer.
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October 2007
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Stratix II GX Device Handbook, Volume 1
Transceivers
Figure 2–17. Deserializer Note (1)
D9
D9
D8
D8
D7
D7
D6
D6
D5
D5
D4
D4
D3
D3
D2
D2
D1
D1
D0
D0
10
High-speed
serial clock
Low-speed
parallel clock
Note to Figure 2–17:
(1)
This is a 10-bit deserializer. The deserializer can also convert 8, 16, or 20 bits of data.
Word Aligner
The deserializer block creates 8-, 10-, 16-, or 20-bit parallel data. The
deserializer ignores protocol symbol boundaries when converting this
data. Therefore, the boundaries of the transferred words are arbitrary. The
word aligner aligns the incoming data based on specific byte or word
boundaries. The word alignment module is clocked by the local receiver
recovered clock during normal operation. All the data and programmed
patterns are defined as big-endian (most significant word followed by
least significant word). Most-significant-bit-first protocols such as
SONET/SDH should reverse the bit order of word align patterns
programmed.
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Stratix II GX Architecture
This module detects word boundaries for the 8B/10B-based protocols,
SONET, 16-bit, and 20-bit proprietary protocols. This module is also used
to align to specific programmable patterns in PRBS7/23 test mode.
Pattern Detection
The programmable pattern detection logic can be programmed to align
word boundaries using a single 7-, 8-, 10-, 16-, 20, or 32-bit pattern. The
pattern detector can either do an exact match, or match the exact pattern
and the complement of a given pattern. Once the programmed pattern is
found, the data stream is aligned to have the pattern on the LSB portion
of the data output bus.
XAUI, GIGE, PCI Express, and Serial RapidIO standards have embedded
state machines for symbol boundary synchronization. These standards
use K28.5 as their 10-bit programmed comma pattern. Each of these
standards uses different algorithms before signaling symbol boundary
acquisition to the FPGA.
The pattern detection logic searches from the LSB to the most significant
bit (MSB). If multiple patterns are found within the search window, the
pattern in the lower portion of the data stream (corresponding to the
pattern received earlier) is aligned and the rest of the matching patterns
are ignored.
Once a pattern is detected and the data bus is aligned, the word boundary
is locked. The two detection status signals (rx_syncstatus and
rx_patterndetect) indicate that an alignment is complete.
Figure 2–18 is a block diagram of the word aligner.
Figure 2–18. Word Aligner
datain
bitslip
Word
Aligner
enapatternalign
dataout
syncstatus
patterndetect
clock
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October 2007
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Stratix II GX Device Handbook, Volume 1
Transceivers
Control and Status Signals
The rx_enapatternalign signal is the FPGA control signal that
enables word alignment in non-automatic modes. The
rx_enapatternalign signal is not used in automatic modes (PCI
Express, XAUI, GIGE, CPRI, and Serial RapidIO).
In manual alignment mode, after the rx_enapatternalign signal is
activated, the rx_syncstatus signal goes high for one parallel clock
cycle to indicate that the alignment pattern has been detected and the
word boundary has been locked. If the rx_enapatternalign is
deactivated, the rx_syncstatus signal acts as a re-synchronization
signal to signify that the alignment pattern has been detected but not
locked on a different word boundary.
When using the synchronization state machine, the rx_syncstatus
signal indicates the link status. If the rx_syncstatus signal is high, link
synchronization is achieved. If the rx_syncstatus signal is low,
synchronization has not yet been achieved, or there were enough code
group errors to lose synchronization.
In some modes, the rx_enapatternalign signal can be configured to
operate as a rising edge signal.
f
For more information on manual alignment modes, refer to the
Stratix II GX Device Handbook, volume 2.
When the rx_enapatternalign signal is sensitive to the rising edge,
each rising edge triggers a new boundary alignment search, clearing the
rx_syncstatus signal.
The rx_patterndetect signal pulses high during a new alignment,
and also whenever the alignment pattern occurs on the current word
boundary.
SONET/SDH
In all the SONET/SDH modes, you can configure the word aligner to
either align to A1A2 or A1A1A2A2 patterns. Once the pattern is found,
the word boundary is aligned and the word aligner asserts the
rx_patterndetect signal for one clock cycle.
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October 2007
Stratix II GX Architecture
Programmable Run Length Violation
The word aligner supports a programmable run length violation counter.
Whenever the number of the continuous ‘0’ (or ‘1’) exceeds a user
programmable value, the rx_rlv signal goes high for a minimum pulse
width of two recovered clock cycles. The maximum run values supported
are shown in Table 2–7.
Table 2–7. Maximum Run Length (UI)
PMA Serialization
Mode
8 Bit
10 Bit
16 Bit
20 Bit
Single-Width
128
160
—
—
Double-Width
—
—
512
640
Running Disparity Check
The running disparity error rx_disperr and running disparity value
rx_runningdisp are sent along with aligned data from the 8B/10B
decoder to the FPGA. You can ignore or act on the reported running
disparity value and running disparity error signals.
Bit-Slip Mode
The word aligner can operate in either pattern detection mode or in
bit-slip mode.
The bit-slip mode provides the option to manually shift the word
boundary through the FPGA. This feature is useful for:
■
■
■
Longer synchronization patterns than the pattern detector can
accommodate
Scrambled data stream
Input stream consisting of over-sampled data
This feature can be applied at 10-bit and 16-bit data widths.
The word aligner outputs a word boundary as it is received from the
analog receiver after reset. You can examine the word and search its
boundary in the FPGA. To do so, assert the rx_bitslip signal. The
rx_bitslip signal should be toggled and held constant for at least two
FPGA clock cycles.
For every rising edge of the rx_bitslip signal, the current word
boundary is slipped by one bit. Every time a bit is slipped, the bit received
earliest is lost. If bit slipping shifts a complete round of bus width, the
word boundary is back to the original boundary.
Altera Corporation
October 2007
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Stratix II GX Device Handbook, Volume 1
Transceivers
The rx_syncstatus signal is not available in bit-slipping mode.
Channel Aligner
The channel aligner is available only in XAUI mode and aligns the signals
of all four channels within a transceiver. The channel aligner follows the
IEEE 802.3ae, clause 48 specification for channel bonding.
The channel aligner is a 16-word FIFO buffer with a state machine
controlling the channel bonding process. The state machine looks for an
/A/ (/K28.3/) in each channel, and aligns all the /A/ code groups in the
transceiver. When four columns of /A/ (denoted by //A//) are
detected, the rx_channelaligned signal goes high, signifying that all
the channels in the transceiver have been aligned. The reception of four
consecutive misaligned /A/ code groups restarts the channel alignment
sequence and sends the rx_channelaligned signal low.
Figure 2–19 shows misaligned channels before the channel aligner and
the aligned channels after the channel aligner.
Figure 2–19. Before and After the Channel Aligner
Before
Lane 3
K
K
A
K
R
R
K
K
R
K
R
K
K
R
A
K
R
R
K
K
R
K
K
R
A
K
R
R
K
K
R
K
R
Lane 2
Lane 1
K
Lane 0
After
R
K
K
R
A
K
R
R
K
K
R
K
Lane 3
K
K
R
A
K
R
R
K
K
R
K
R
Lane 2
K
K
R
A
K
R
R
K
K
R
K
R
Lane 1
K
K
R
A
K
R
R
K
K
R
K
R
Lane 0
K
K
R
A
K
R
R
K
K
R
K
R
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Stratix II GX Device Handbook, Volume 1
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Altera Corporation
October 2007
Stratix II GX Architecture
Rate Matcher
Rate matcher is available in Basic, PCI Express, XAUI, and GIGE modes
and consists of a 20-word deep FIFO buffer and a FIFO controller.
Figure 2–20 shows the implementation of the rate matcher in the
Stratix II GX device.
Figure 2–20. Rate Matcher
datain
dataout
Rate
Matcher
wrclock
rdclock
In a multi-crystal environment, the rate matcher compensates for up to a
± 300-PPM difference between the source and receiver clocks. Table 2–8
shows the standards supported and the PPM for the rate matcher
tolerance.
Table 2–8. Rate Matcher PPM Support Note (1)
Standard
PPM
XAUI
± 100
PCI Express (PIPE)
± 300
GIGE
± 100
Basic Double-Width
± 300
Note to Table 2–8:
(1)
Refer to the Stratix II GX Transceiver User Guide for the Altera®-defined scheme.
Basic Mode
In Basic mode, you can program the skip and control pattern for rate
matching. In single-width Basic mode, there is no restriction on the
deletion of a skip character in a cluster. The rate matcher deletes the skip
characters as long as they are available. For insertion, the rate matcher
inserts skip characters such that the number of skip characters at the
output of rate matcher does not exceed five. In double-width mode, the
rate matcher deletes skip character when they appear as pairs in the
upper and lower bytes. There are no restrictions on the number of skip
characters that are deleted. The rate matcher inserts skip characters as
pairs.
Altera Corporation
October 2007
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Stratix II GX Device Handbook, Volume 1
Transceivers
GIGE Mode
In GIGE mode, the rate matcher adheres to the specifications in clause 36
of the IEEE 802.3 documentation for idle additions or removals. The rate
matcher performs clock compensation only on /I2/ ordered sets,
composed of a /K28.5/+ followed by a /D16.2/-. The rate matcher does
not perform clock compensation on any other ordered set combinations.
An /I2/ is added or deleted automatically based on the number of words
in the FIFO buffer. A K28.4 is given at the control and data ports when the
FIFO buffer is in an overflow or underflow condition.
XAUI Mode
In XAUI mode, the rate matcher adheres to clause 48 of the IEEE 802.3ae
specification for clock rate compensation. The rate matcher performs
clock compensation on columns of /R/ (/K28.0/), denoted by //R//.
An //R// is added or deleted automatically based on the number of
words in the FIFO buffer.
PCI Express Mode
PCI Express mode operates at a data rate of 2.5 Gbps, and supports lane
widths of ×1, ×2, ×4, and ×8. The rate matcher can support up to
± 300-PPM differences between the upstream transmitter and the
receiver. The rate matcher looks for the skip ordered sets (SOS), which
usually consist of a /K28.5/ comma followed by three /K28.0/ skip
characters. The rate matcher deletes or inserts skip characters when
necessary to prevent the rate matching FIFO buffer from overflowing or
underflowing.
The Stratix II GX rate matcher in PCI Express mode has FIFO overflow
and underflow protection. In the event of a FIFO overflow, the rate
matcher deletes any data after the overflow condition to prevent FIFO
pointer corruption until the rate matcher is not full. In an underflow
condition, the rate matcher inserts 9'h1FE (/K30.7/) until the FIFO is not
empty. These measures ensure that the FIFO can gracefully exit the
overflow and underflow condition without requiring a FIFO reset.
8B/10B Decoder
The 8B/10B decoder (Figure 2–21) is part of the Stratix II GX transceiver
digital blocks (PCS) and lies in the receiver path between the rate matcher
and the byte deserializer blocks. The 8B/10B decoder operates in
single-width and double-width modes, and can be bypassed if the
8B/10B decoding is not necessary. In single-width mode, the 8B/10B
decoder restores the 8-bit data + 1-bit control identifier from the 10-bit
code. In double-width mode, there are two 8B/10B decoders in parallel,
which restores the 16-bit (2 × 8-bit) data + 2-bit (2 × 1-bit) control identifier
from the 20-bit (2 × 10-bit) code. This 8B/10B decoder conforms to the
IEEE 802.3 1998 edition standards.
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Stratix II GX Device Handbook, Volume 1
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October 2007
Stratix II GX Architecture
Figure 2–21. 8B/10B Decoder
dataout[15..8]
8B/10B
Decoder
MSByte
Status Signals[1] (1)
datain[19..10]
To Byte
Deserializer
From Rate
Matcher
dataout[7..0]
8B/10B
Decoder
LSByte
Status Signals[0] (1)
datain[9..0]
The 8B/10B decoder in single-width mode translates the 10-bit encoded
data into the 8-bit equivalent data or control code. The 10-bit code
received must be from the supported Dx.y or Kx.y list with the proper
disparity or error flags asserted. All 8B/10B control signals, such as
disparity error or control detect, are pipelined with the data and
edge-aligned with the data. Figure 2–22 shows how the 10-bit symbol is
decoded in the 8-bit data + 1-bit control indicator.
Figure 2–22. 8B/10B Decoder Conversion
j
h
g
f
i
e
d
c
b
a
9
8
7
6
5
4
3
2
1
0
MSB received last
LSB received first
8B/10B conversion
Parallel data
7
6
5
4
3
2
1
0
H
G
F
E
D
C
B
A
+
ctrl
The 8B/10B decoder in double-width mode translates the 20-bit
(2 × 10-bits) encoded code into the 16-bit (2 × 8-bits) equivalent data or
control code. The 20-bit upper and lower symbols received must be from
the supported Dx.y or Kx.y list with the proper disparity or error flags
Altera Corporation
October 2007
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Stratix II GX Device Handbook, Volume 1
Transceivers
asserted. All 8B/10B control signals, such as disparity error or control
detect, are pipelined with the data in the Stratix II GX receiver block and
are edge aligned with the data.
Figure 2–23 shows how the 20-bit code is decoded to the 16-bit data +
2-bit control indicator.
Figure 2–23. 20-Bit to 16-Bit Decoding Process
j1
h1
g1
f1
i1
e1
d1
c1
b1
a1
j
h
g
f
i
e
d
c
b
a
19
18
17
16
15
14
13
12
11
10
9
8
7
6
5
4
3
2
1
0
MSB
LSB
Cascaded 8B/10B Conversion
CTRL[1..0]
15
14
13
13
11
10
9
8
7
6
5
4
3
2
1
0
H1
G1
F1
E1
D1
C1
B1
A1
H
G
F
E
D
C
B
A
Parallel Data
There are two optional error status ports available in the 8B/10B decoder,
rx_errdetect and rx_disperr. These status signals are aligned with
the code group in which the error occurred.
Receiver State Machine
The receiver state machine operates in Basic, GIGE, PCI Express, and
XAUI modes. In GIGE mode, the receiver state machine replaces invalid
code groups with K30.7. In XAUI mode, the receiver state machine
translates the XAUI PCS code group to the XAUI XGMII code group.
Byte Deserializer
The byte deserializer widens the transceiver data path before the FPGA
interface. This reduces the rate at which the received data needs to be
clocked at in the FPGA logic. The byte deserializer block is available in
both single- and double-width modes.
The byte deserializer converts the one- or two-byte interface into a
two- or four-byte-wide data path from the transceiver to the FPGA logic
(see Table 2–9). The FPGA interface has a limit of 250 MHz, so the byte
deserializer is needed to widen the bus width at the FPGA interface and
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Stratix II GX Device Handbook, Volume 1
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October 2007
Stratix II GX Architecture
reduce the interface speed. For example, at 6.375 Gbps, the transceiver
logic has a double-byte-wide data path that runs at 318.75 MHz in a ×20
deserializer factor, which is above the maximum FPGA interface speed.
When using the byte deserializer, the FPGA interface width doubles to
40-bits (36-bits when using the 8B/10B encoder) and the interface speed
reduces to 159.375 MHz.
Table 2–9. Byte Deserializer Input and Output Widths
Input Data Width (Bits)
Deserialized Output Data Width to the
FPGA (Bits)
20
40
16
32
10
20
8
16
Byte Ordering Block
The byte ordering block shifts the byte order. A pre-programmed byte in
the input data stream is detected and placed in the least significant byte
of the output stream. Subsequent bytes start appearing in the byte
positions following the LSB. The byte ordering block inserts the
programmed PAD characters to shift the byte order pattern to the LSB.
Based on the setting in the MegaWizard® Plug-In Manager, the byte
ordering block can be enabled either by the rx_syncstatus signal or by
the rx_enabyteord signal from the PLD. When the rx_syncstatus
signal is used as enable, the byte ordering block reorders the data only for
the first occurrence of the byte order pattern that is received after word
alignment is completed. You must assert rx_digitalreset to perform
byte ordering again. However, when the byte ordering block is controlled
by rx_enabyteord, the byte ordering block can be controlled by the
PLD logic dynamically. When you create your functional mode in the
MegaWizard, you can select byte ordering block only if rate matcher is
not selected.
Receiver Phase Compensation FIFO Buffer
The receiver phase compensation FIFO buffer resides in the transceiver
block at the FPGA boundary and cannot be bypassed. This FIFO buffer
compensates for phase differences and clock tree timing skew between
the receiver clock domain within the transceiver and the receiver FPGA
clock after it has transferred to the FPGA.
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October 2007
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Stratix II GX Device Handbook, Volume 1
Transceivers
When the FIFO pointers initialize, the receiver domain clock must remain
phase locked to receiver FPGA clock.
After resetting the receiver FIFO buffer, writing to the receiver FIFO
buffer begins and continues on each parallel clock. The phase
compensation FIFO buffer is eight words deep for PIPE mode and four
words deep for all other modes.
Loopback Modes
The Stratix II GX transceiver has built-in loopback modes for debugging
and testing. The loopback modes are configured in the Stratix II GX
ALT2GXB megafunction in the Quartus II software. The available
loopback modes are:
■
■
■
■
■
Serial loopback
Parallel loopback
Reverse serial loopback
Reverse serial loopback (pre-CDR)
PCI Express PIPE reverse parallel loopback (available only in PIPE
mode)
Serial Loopback
The serial loopback mode exercises all the transceiver logic, except for the
input buffer. Serial loopback is available for all non-PIPE modes. The
loopback function is dynamically enabled through the
rx_seriallpbken port on a channel-by-channel basis.
In serial loopback mode, the data on the transmit side is sent by the PLD.
A separate mode is available in the ALT2GXB megafunction under Basic
protocol mode, in which PRBS data is generated and verified internally in
the transceiver. The PRBS patterns available in this mode are shown in
Table 2–10.
Table 2–10 shows the BIST data output and verifier alignment pattern.
Table 2–10. BIST Data Output and Verifier Alignment Pattern
Parallel Data Width
Pattern
Polynomial
8-Bit
PRBS-7
×7 + ×6 + 1
PRBS-10
×10 + ×7 + 1
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Stratix II GX Device Handbook, Volume 1
10-Bit
16-Bit
20-Bit
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Altera Corporation
October 2007
Stratix II GX Architecture
Figure 2–24 shows the data path in serial loopback mode.
Figure 2–24. Stratix II GX Block in Serial Loopback Mode with BIST and PRBS
Transmitter Digital Logic
TX Phase
Compensation
FIFO
Analog Receiver and
Transmitter Logic
BIST
PRBS
Generator
BIST
Incremental
Generator
Byte
Serializer
20
8B/10B
Encoder
Serializer
FPGA
Logic
Array
Serial
Loopback
BIST
Incremental
Verify
RX Phase
Compensation
FIFO
BIST
PRBS
Verify
Byte
Ordering
Byte
Deserializer
8B/10B
Decoder
Rate
Match
FIFO
Deskew
FIFO
Word
Aligner
Deserializer
Clock
Recovery
Unit
Receiver Digital Logic
Parallel Loopback
The parallel loopback mode exercises the digital logic portion of the
transceiver data path. The analog portions are not used in this loopback
path, and the received high-speed serial data is not retimed. This protocol
is available as one of the sub-protocols under Basic mode and can be used
only for Basic double-width mode.
In this loopback mode, the data from the internally available BIST
generator is transmitted. The data is looped back after the end of PCS and
before the PMA. On the receive side, an internal BIST verifier checks for
errors. This loopback enables you to verify the PCS block.
Altera Corporation
October 2007
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Stratix II GX Device Handbook, Volume 1
Transceivers
Figure 2–25 shows the data path in parallel loopback mode.
Figure 2–25. Stratix II GX Block in Parallel Loopback Mode
Transmitter Digital Logic
Analog Receiver and
Transmitter Logic
BIST
Incremental
Generator
TX Phase
Compensation
FIFO
BIST PRBS
Generator
Byte
Serializer
8B/10B
Encoder
Serializer
20
Parallel
Loopback
FPGA
Logic
Array
BIST
Incremental
Verify
RX Phase
Compensation
FIFO
BIST
PRBS
Verify
Byte
Ordering
Byte
Deserializer
8B/10B
Decoder
Rate
Match
FIFO
Deskew
FIFO
Word
Aligner
Deserializer
Clock
Recovery
Unit
Receiver Digital Logic
Reverse Serial Loopback
The reverse serial loopback mode uses the analog portion of the
transceiver. An external source (pattern generator or transceiver)
generates the source data. The high-speed serial source data arrives at the
high-speed differential receiver input buffer, passes through the CRU
unit, and the retimed serial data is looped back and transmitted though
the high-speed differential transmitter output buffer.
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October 2007
Stratix II GX Architecture
Figure 2–26 shows the data path in reverse serial loopback mode.
Figure 2–26. Stratix II GX Block in Reverse Serial Loopback Mode
Transmitter Digital Logic
Analog Receiver and
Transmitter Logic
BIST
PRBS
Generator
BIST
Incremental
Generator
TX Phase
Compensation
FIFO
Byte
Serializer
8B/10B
20 Encoder
Serializer
FPGA
Logic
Array
Reverse
Serial
Loopback
BIST
Incremental
Verify
RX Phase
Compensation
FIFO
BIST
PRBS
Verify
Byte
Ordering
Byte
Deserializer
8B/10B
Decoder
Rate
Match
FIFO
Deskew
FIFO
Word
Aligner
Deserializer
Clock
Recovery
Unit
Receiver Digital Logic
Reverse Serial Pre-CDR Loopback
The reverse serial pre-CDR loopback mode uses the analog portion of the
transceiver. An external source (pattern generator or transceiver)
generates the source data. The high-speed serial source data arrives at the
high-speed differential receiver input buffer, loops back before the CRU
unit, and is transmitted though the high-speed differential transmitter
output buffer. It is for test or verification use only to verify the signal
being received after the gain and equalization improvements of the input
buffer. The signal at the output is not exactly what is received since the
signal goes through the output buffer and the VOD is changed to the
VOD setting level. The pre-emphasis settings have no effect.
Altera Corporation
October 2007
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Stratix II GX Device Handbook, Volume 1
Transceivers
Figure 2–27 show the Stratix II GX block in reverse serial pre-CDR
loopback mode.
Figure 2–27. Stratix II GX Block in Reverse Serial Pre-CDR Loopback Mode
Transmitter Digital Logic
Analog Receiver and
Transmitter Logic
BIST
PRBS
Generator
BIST
Incremental
Generator
TX Phase
Compensation
FIFO
Byte
Serializer
8B/10B
20 Encoder
Serializer
FPGA
Logic
Array
BIST
Incremental
Verify
RX Phase
Compensation
FIFO
Reverse
Serial
Pre-CDR
Loopback
BIST
PRBS
Verify
Byte
Ordering
Byte
Deserializer
Rate
Match
FIFO
8B/10B
Decoder
Deskew
FIFO
Deserializer
Word
Aligner
Clock
Recovery
Unit
Receiver Digital Logic
PCI Express PIPE Reverse Parallel Loopback
This loopback mode, available only in PIPE mode, can be dynamically
enabled by the tx_detectrxloopback port of the PIPE interface.
Figure 2–28 shows the datapath for this mode.
Figure 2–28. Stratix II GX Block in PCI Express PIPE Reverse Parallel Loopback Mode
Transmitter Digital Logic
Analog Receiver and
Transmitter Logic
BIST
Incremental
Generator
TX Phase
Compensation
FIFO
BIST
PRBS
Generator
Byte
Serializer
8B/10B
Encoder
20
FPGA
Logic
Array
Serializer
PCI Express PIPE
Reverse Parallel
Loopback
BIST
Incremental
Verify
RX Phase
Compensation
FIFO
BIST
PRBS
Verify
Byte
Ordering
Byte
Deserializer
8B/10B
Decoder
Rate
Match
FIFO
Deskew
FIFO
Word
Aligner
Deserializer
Clock
Recovery
Unit
Receiver Digital Logic
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October 2007
Stratix II GX Architecture
Transceiver Clocking
Each Stratix II GX device transceiver block contains two transmitter PLLs
and four receiver PLLs. These PLLs can be driven by either of the two
reference clocks per transceiver block. These REFCLK signals can drive all
global clocks, transmitter PLL inputs, and all receiver PLL inputs.
Subsequently, the transmitter PLL output can only drive global clock
lines and the receiver PLL reference clock port. Only one of the two
reference clocks in a quad can drive the Inter Quad (I/Q) lines to clock the
PLLs in the other quads.
Figure 2–29 shows the inter-transceiver line connections as well as the
global clock connections for the EP2SGX130 device.
Altera Corporation
October 2007
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Stratix II GX Device Handbook, Volume 1
Transceivers
Figure 2–29. EP2SGX130 Device Inter-Transceiver and Global Clock Connections
To PLD
Global Clocks
Transceiver Block 0
Global clk line
IQ[4..0]
Transmitter
PLL 0
REFCLK0
÷2
From Global
Clock Line (3)
To IQ0
REFCLK1
÷2
IQ[4..0]
Global clk line
Transmitter
PLL 1
From Global Clock Line (3)
IQ[4..0]
4
Receiver
PLLs
Transceiver Clock Generator Block
16 Interface Clocks
Global clk line
IQ[4..0]
IQ[4..0]
Transceiver Block 1
Transmitter
PLL 0
REFCLK0
÷2
To IQ1
REFCLK1
÷2
IQ[4..0]
Global clk line
Transmitter
PLL 1
From Global Clock Line (3)
IQ[4..0]
4
Receiver
PLLs
Transceiver Clock Generator Block
Global clk line
IQ[4..0]
Transceiver Block 2
Transmitter
PLL 0
REFCLK0
÷2
To IQ4
REFCLK1
÷2
IQ[4..0]
Transmitter
PLL 1
Global clk line
4
Receiver
PLLs
From Global Clock Line (3)
IQ[4..0]
Transceiver Clock Generator Block
Global clk line
IQ[4..0]
Transceiver Block 3
Transmitter
PLL 0
REFCLK0
÷2
To IQ2
REFCLK1
÷2
IQ[4..0]
Global clk line
Transmitter
PLL 1
4
Receiver
PLLs
From Global Clock Line (3)
IQ[4..0]
Transceiver Clock Generator Block
Global clk line
IQ[4..0]
Transceiver Block 4
Transmitter
PLL 0
REFCLK0
÷2
To IQ3
REFCLK1
IQ[4..0]
÷2
Transmitter
PLL 1
Global clk line
IQ[4..0]
From Global Clock Line (3)
4
Receiver
PLLs
Transceiver Clock Generator Block
Notes to Figure 2–29:
(1)
(2)
(3)
There are two transmitter PLLs in each transceiver block.
There are four receiver PLLs in each transceiver block.
The Global Clock line must be driven by an input pin.
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October 2007
Stratix II GX Architecture
The receiver PLL can also drive the regional clocks and regional routing
adjacent to the associated transceiver block. Figure 2–30 shows which
global clock resource can be used by the recovered clock. Figure 2–31
shows which regional clock resource can be used by the recovered clock.
Figure 2–30. Stratix II GX Receiver PLL Recovered Clock to Global Clock
Connection
Notes (1), (2)
CLK[15..12]
11 5
7
Stratix II GX
Transceiver
Block
GCLK[15..12]
CLK[3..0]
1
2
GCLK[3..0]
GCLK[11..8]
GCLK[4..7]
Stratix II GX
Transceiver
Block
8
12 6
CLK[7..4]
Notes to Figure 2–30:
(1)
(2)
Altera Corporation
October 2007
CLK# pins are clock pins and their associated number. These are pins for global
and regional clocks.
GCLK# pins are global clock pins.
2–37
Stratix II GX Device Handbook, Volume 1
Transceivers
Figure 2–31. Stratix II GX Receiver PLL Recovered Clock to Regional Clock
Connection
Notes (1), (2)
CLK[15..12]
11 5
7
CLK[3..0]
RCLK
[31..28]
RCLK
[27..24]
RCLK
[3..0]
RCLK
[23..20]
RCLK
[7..4]
RCLK
[19..16]
Stratix II GX
Transceiver
Block
1
2
8
RCLK
[11..8]
Stratix II GX
Transceiver
Block
RCLK
[15..12]
12 6
CLK[7..4]
Notes to Figure 2–31:
(1)
(2)
CLK# pins are clock pins and their associated number. These are pins for global
and local clocks.
RCLK# pins are regional clock pins.
2–38
Stratix II GX Device Handbook, Volume 1
Altera Corporation
October 2007
Stratix II GX Architecture
Table 2–11 summarizes the possible clocking connections for the
transceivers.
Table 2–11. Available Clocking Connections for Transceivers
Destination
Source
Transmitter
PLL
Receiver PLL
Global Clock
Regional
Clock
Inter-Transceiver
Lines
v
v
v
v
v
Transmitter PLL
v
v
Receiver PLL
v
v
REFCLK[1..0]
Global clock
(driven from an
input pin)
v
v
Inter-transceiver
lines
v
v
Clock Resource for PLD-Transceiver Interface
For the regional or global clock network to route into the transceiver, a
local route input output (LRIO) channel is required. Each LRIO clock
region has up to eight clock paths and each transceiver block has a
maximum of eight clock paths for connecting with LRIO clocks. These
resources are limited and determine the number of clocks that can be used
between the PLD and transceiver blocks. Table 2–12 shows the number of
LRIO resources available for Stratix II GX devices with different numbers
of transceiver blocks.
Tables 2–12 through 2–15 show the connection of the LRIO clock resource
to the transceiver block.
Table 2–12. Available Clocking Connections for Transceivers in 2SGX30D
Clock Resource
Region
Altera Corporation
October 2007
Transceiver
Global
Clock
Regional
Clock
Bank 13
8 Clock I/O
Region0
8 LRIO clock
v
RCLK 20-27
v
Region1
8 LRIO clock
v
RCLK 12-19
Bank 14
8 Clock I/O
v
2–39
Stratix II GX Device Handbook, Volume 1
Transceivers
.
Table 2–13. Available Clocking Connections for Transceivers in 2SGX60E
Clock Resource
Region
Global Clock
Transceiver
Regional
Clock
Bank 13
8 Clock I/O
Region0
8 LRIO clock
v
RCLK 20-27
v
Region1
8 LRIO clock
v
RCLK 20-27
v
Region2
8 LRIO clock
v
RCLK 12-19
Region3
8 LRIO clock
v
RCLK 12-19
Bank 14
8 Clock I/O
Bank 15
8 Clock I/O
v
v
v
v
.
Table 2–14. Available Clocking Connections for Transceivers in 2SGX90F
Clock Resource
Region
Transceiver
Global
Clock
Regional
Clock
Bank 13
8 Clock I/O
Region0
8 LRIO clock
v
RCLK 20-27
v
Region1
8 LRIO clock
v
RCLK 20-27
Region2
8 LRIO clock
v
RCLK 12-19
Region3
8 LRIO clock
v
RCLK 12-19
2–40
Stratix II GX Device Handbook, Volume 1
Bank 14
8 Clock I/O
Bank 15
8 clock I/O
Bank 16
8 Clock I/O
v
v
v
Altera Corporation
October 2007
Stratix II GX Architecture
.
Table 2–15. Available Clocking Connections for Transceivers in 2SGX130G
Clock Resource
Region
Transceiver
Global
Clock
Regional
Clock
Bank 13
8 Clock I/O
Region0
8 LRIO clock
v
RCLK 20-27
v
Region1
8 LRIO clock
v
RCLK 20-27
Region2
8 LRIO clock
v
RCLK 12-19
Region3
8 LRIO clock
v
RCLK 12-19
Bank 14
8 Clock I/O
Bank 15
8 clock I/O
Bank 16
8 Clock I/O
v
v
Bank 17
8 Clock I/O
v
v
Other Transceiver Features
Other important features of the Stratix II GX transceivers are the power
down and reset capabilities, external voltage reference and bias circuitry,
and hot swapping.
Calibration Block
The Stratix II GX device uses the calibration block to calibrate the on-chip
termination for the PLLs and their associated output buffers and the
terminating resistors on the transceivers. The calibration block counters
the effects of process, voltage, and temperature (PVT). The calibration
block references a derived voltage across an external reference resistor to
calibrate the on-chip termination resistors on the Stratix II GX device. The
calibration block can be powered down. However, powering down the
calibration block during operations may yield transmit and receive data
errors.
Dynamic Reconfiguration
This feature allows you to dynamically reconfigure the PMA portion and
the channel parameters, such as data rate and functional mode, of the
Stratix II GX transceiver. The PMA reconfiguration allows you to quickly
optimize the settings for the transceiver’s PMA to achieve the intended
bit error rate (BER).
Altera Corporation
October 2007
2–41
Stratix II GX Device Handbook, Volume 1
v
Transceivers
The dynamic reconfiguration block can dynamically reconfigure the
following PMA settings:
■
■
■
Pre-emphasis settings
Equalizer and DC gain settings
Voltage Output Differential (VOD) settings
The channel reconfiguration allows you to dynamically modify the data
rate, local dividers, and the functional mode of the transceiver channel.
f
Refer to the Stratix II GX Device Handbook, volume 2, for more
information.
The dynamic reconfiguration block requires an input clock between
2.5 MHz and 50 MHz. The clock for the dynamic reconfiguration block is
derived from a high-speed clock and divided down using a counter.
Individual Power Down and Reset for the Transmitter and Receiver
Stratix II GX transceivers offer a power saving advantage with their
ability to shut off functions that are not needed. The device can
individually reset the receiver and transmitter blocks and the PLLs. The
Stratix II GX device can either globally or individually power down and
reset the transceiver. Table 2–16 shows the connectivity between the reset
signals and the Stratix II GX transceiver blocks. These reset signals can be
controlled from the FPGA or pins.
2–42
Stratix II GX Device Handbook, Volume 1
Altera Corporation
October 2007
Stratix II GX Architecture
v
rx_digitalreset
v
v
v
v
v
rx_analogreset
v
Receiver Analog Circuits
BIST Verifiers
Receiver XAUI State Machine
Receiver PLL / CRU
Receiver Phase Comp FIFO Module/ Byte Deserializer
Receiver 8B/10B Decoder
Receiver Rate Matcher
Receiver Deskew FIFO Module
Receiver Word Aligner
Receiver Deserializer
BIST Generators
Transmitter XAUI State Machine
Transmitter PLL
Transmitter Analog Circuits
Transmitter Serializer
Transmitter 8B/10B Encoder
Reset Signal
Transmitter Phase Compensation FIFO Module/ Byte Serializer
Table 2–16. Reset Signal Map to Stratix II GX Blocks
v
v
v
tx_digitalreset v
v
v
v
gxb_powerdown
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
gxb_enable
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
Voltage Reference Capabilities
Stratix II GX transceivers provide voltage reference and bias circuitry. To
set up internal bias for controlling the transmitter output driver voltage
swings, as well as to provide voltage and current biasing for other analog
circuitry, the device uses an internal bandgap voltage reference of 0.7 V.
An external 2-KΩ resistor connected to ground generates a constant bias
current (independent of power supply drift, process changes, or
temperature variation). An on-chip resistor generates a tracking current
that tracks on-chip resistor variation. These currents are mirrored and
distributed to the analog circuitry in each channel.
f
Altera Corporation
October 2007
For more information, refer to the DC and Switching Characteristics
chapter in volume 1 of the Stratix II GX Handbook.
2–43
Stratix II GX Device Handbook, Volume 1
Logic Array Blocks
Applications and Protocols Supported with Stratix II GX Devices
Each Stratix II GX transceiver block is designed to operate at any serial bit
rate from 600 Mbps to 6.375 Gbps per channel. The wide data rate range
allows Stratix II GX transceivers to support a wide variety of standards
and protocols, such as PCI Express, GIGE, SONET/SDH, SDI, OIF-CEI,
and XAUI. Stratix II GX devices are ideal for many high-speed
communication applications, such as high-speed backplanes,
chip-to-chip bridges, and high-speed serial communications links.
Example Applications Support for Stratix II GX
Stratix II GX devices can be used for many applications, including:
■
■
Logic Array
Blocks
Traffic management with various levels of quality of service (QoS)
and integrated serial backplane interconnect
Multi-port single-protocol switching (for example, PCI Express,
GIGE, XAUI switch, or SONET/SDH)
Each logic array block (LAB) consists of eight adaptive logic modules
(ALMs), carry chains, shared arithmetic chains, LAB control signals, local
interconnects, and register chain connection lines. The local interconnect
transfers signals between ALMs in the same LAB. Register chain
connections transfer the output of an ALM register to the adjacent ALM
register in a LAB. The Quartus II Compiler places associated logic in a
LAB or adjacent LABs, allowing the use of local, shared arithmetic chain,
and register chain connections for performance and area efficiency.
Table 2–17 shows Stratix II GX device resources. Figure 2–32 shows the
Stratix II GX LAB structure.
Table 2–17. Stratix II GX Device Resources
Device
M512 RAM
M4K RAM
Columns/Blocks Columns/Blocks
M-RAM
Blocks
DSP Block
Columns/Blocks
LAB
Columns
LAB Rows
EP2SGX30
6/202
4/144
1
2/16
49
36
EP2SGX60
7/329
5/255
2
3/36
62
51
EP2SGX90
8/488
6/408
4
3/48
71
68
EP2SGX130
9/699
7/609
6
3/63
81
87
2–44
Stratix II GX Device Handbook, Volume 1
Altera Corporation
October 2007
Stratix II GX Architecture
Figure 2–32. Stratix II GX LAB Structure
Row Interconnects of
Variable Speed & Length
ALMs
Direct link
interconnect from
adjacent block
Direct link
interconnect from
adjacent block
Direct link
interconnect to
adjacent block
Direct link
interconnect to
adjacent block
Local Interconnect
LAB
Local Interconnect is Driven
from Either Side by Columns & LABs,
& from Above by Rows
Column Interconnects of
Variable Speed & Length
LAB Interconnects
The LAB local interconnect can drive all eight ALMs in the same LAB. It
is driven by column and row interconnects and ALM outputs in the same
LAB. Neighboring LABs, M512 RAM blocks, M4K RAM blocks, M-RAM
blocks, or digital signal processing (DSP) blocks from the left and right
can also drive a LAB’s local interconnect through the direct link
connection. The direct link connection feature minimizes the use of row
and column interconnects, providing higher performance and flexibility.
Each ALM can drive 24 ALMs through fast local and direct link
interconnects.
Altera Corporation
October 2007
2–45
Stratix II GX Device Handbook, Volume 1
Logic Array Blocks
Figure 2–33 shows the direct link connection.
Figure 2–33. Direct Link Connection
Direct link interconnect from
left LAB, TriMatrixTM memory
block, DSP block, or
input/output element (IOE)
Direct link interconnect from
right LAB, TriMatrix memory
block, DSP block, or IOE output
ALMs
Direct link
interconnect
to right
Direct link
interconnect
to left
Local
Interconnect
LAB
LAB Control Signals
Each LAB contains dedicated logic for driving control signals to its ALMs.
The control signals include three clocks, three clock enables, two
asynchronous clears, synchronous clear, asynchronous preset/load, and
synchronous load control signals, providing a maximum of 11 control
signals at a time. Although synchronous load and clear signals are
generally used when implementing counters, they can also be used with
other functions.
Each LAB can use three clocks and three clock enable signals. However,
there can only be up to two unique clocks per LAB, as shown in the LAB
control signal generation circuit in Figure 2–34. Each LAB’s clock and
clock enable signals are linked. For example, any ALM in a particular
LAB using the labclk1 signal also uses labclkena1. If the LAB uses
both the rising and falling edges of a clock, it also uses two LAB-wide
clock signals. De-asserting the clock enable signal turns off the
corresponding LAB-wide clock. Each LAB can use two asynchronous
clear signals and an asynchronous load/preset signal. The asynchronous
2–46
Stratix II GX Device Handbook, Volume 1
Altera Corporation
October 2007
Stratix II GX Architecture
load acts as a preset when the asynchronous load data input is tied high.
When the asynchronous load/preset signal is used, the labclkena0
signal is no longer available.
The LAB row clocks [5..0] and LAB local interconnect generate the
LAB-wide control signals. The MultiTrack™ interconnects have
inherently low skew. This low skew allows the MultiTrack interconnects
to distribute clock and control signals in addition to data.
Figure 2–34 shows the LAB control signal generation circuit.
Figure 2–34. LAB-Wide Control Signals
There are two unique
clock signals per LAB.
6
Dedicated Row LAB Clocks
6
6
Local Interconnect
Local Interconnect
Local Interconnect
Local Interconnect
Local Interconnect
Local Interconnect
labclk0
labclk1
labclkena0
or asyncload
or labpreset
Altera Corporation
October 2007
labclk2
labclkena1
labclkena2
labclr1
syncload
labclr0
synclr
2–47
Stratix II GX Device Handbook, Volume 1
Adaptive Logic Modules
Adaptive Logic
Modules
The basic building block of logic in the Stratix II GX architecture is the
ALM. The ALM provides advanced features with efficient logic
utilization. Each ALM contains a variety of look-up table (LUT)-based
resources that can be divided between two adaptive LUTs (ALUTs). With
up to eight inputs to the two ALUTs, one ALM can implement various
combinations of two functions. This adaptability allows the ALM to be
completely backward-compatible with four-input LUT architectures. One
ALM can also implement any function of up to six inputs and certain
seven-input functions.
In addition to the adaptive LUT-based resources, each ALM contains two
programmable registers, two dedicated full adders, a carry chain, a
shared arithmetic chain, and a register chain. Through these dedicated
resources, the ALM can efficiently implement various arithmetic
functions and shift registers. Each ALM drives all types of interconnects:
local, row, column, carry chain, shared arithmetic chain, register chain,
and direct link interconnects. Figure 2–35 shows a high-level block
diagram of the Stratix II GX ALM while Figure 2–36 shows a detailed
view of all the connections in the ALM.
Figure 2–35. High-Level Block Diagram of the Stratix II GX ALM
carry_in
shared_arith_in
reg_chain_in
To general or
local routing
dataf0
adder0
datae0
D
dataa
datab
datac
Q
To general or
local routing
reg0
Combinational
Logic
datad
adder1
D
Q
datae1
To general or
local routing
reg1
dataf1
To general or
local routing
carry_out
shared_arith_out
2–48
Stratix II GX Device Handbook, Volume 1
reg_chain_out
Altera Corporation
October 2007
Altera Corporation
October 2007
dataf1
Local
Interconnect
datab
Local
Interconnect
datae1
dataa
Local
Interconnect
Local
Interconnect
datac
Local
Interconnect
datad
datae0
Local
Interconnect
Local
Interconnect
dataf0
Local
Interconnect
3-Input
LUT
3-Input
LUT
4-Input
LUT
3-Input
LUT
3-Input
LUT
4-Input
LUT
shared_arith_out
shared_arith_in
carry_out
carry_in
VCC
sclr
syncload
reg_chain_out
reg_chain_in
clk[2..0]
aclr[1..0]
ENA
CLRN
PRN/ALD
Q
D
ADATA
ENA
CLRN
PRN/ALD
D
Q
ADATA
asyncload
ena[2..0]
Local
Interconnect
Row, column &
direct link routing
Row, column &
direct link routing
Local
Interconnect
Row, column &
direct link routing
Row, column &
direct link routing
Stratix II GX Architecture
Figure 2–36. Stratix II GX ALM Details
2–49
Stratix II GX Device Handbook, Volume 1
Adaptive Logic Modules
One ALM contains two programmable registers. Each register has data,
clock, clock enable, synchronous and asynchronous clear, asynchronous
load data, and synchronous and asynchronous load/preset inputs.
Global signals, general-purpose I/O pins, or any internal logic can drive
the register’s clock and clear control signals. Either general-purpose I/O
pins or internal logic can drive the clock enable, preset, asynchronous
load, and asynchronous load data. The asynchronous load data input
comes from the datae or dataf input of the ALM, which are the same
inputs that can be used for register packing. For combinational functions,
the register is bypassed and the output of the LUT drives directly to the
outputs of the ALM.
Each ALM has two sets of outputs that drive the local, row, and column
routing resources. The LUT, adder, or register output can drive these
output drivers independently (see Figure 2–36). For each set of output
drivers, two ALM outputs can drive column, row, or direct link routing
connections, and one of these ALM outputs can also drive local
interconnect resources. This allows the LUT or adder to drive one output
while the register drives another output. This feature, called register
packing, improves device utilization because the device can use the
register and the combinational logic for unrelated functions. Another
special packing mode allows the register output to feed back into the LUT
of the same ALM so that the register is packed with its own fan-out LUT.
This feature provides another mechanism for improved fitting. The ALM
can also drive out registered and unregistered versions of the LUT or
adder output.
f
See the Stratix II Performance and Logic Efficiency Analysis White Paper for
more information on the efficiencies of the Stratix II GX ALM and
comparisons with previous architectures.
ALM Operating Modes
The Stratix II GX ALM can operate in one of the following modes:
■
■
■
■
Normal mode
Extended LUT mode
Arithmetic mode
Shared arithmetic mode
Each mode uses ALM resources differently. Each mode has 11 available
inputs to the ALM (see Figure 2–35)—the eight data inputs from the LAB
local interconnect; carry-in from the previous ALM or LAB; the shared
arithmetic chain connection from the previous ALM or LAB; and the
register chain connection—are directed to different destinations to
implement the desired logic function. LAB-wide signals provide clock,
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Stratix II GX Device Handbook, Volume 1
Altera Corporation
October 2007
Stratix II GX Architecture
asynchronous clear, asynchronous preset/load, synchronous clear,
synchronous load, and clock enable control for the register. These LAB
wide signals are available in all ALM modes. Refer to “LAB Control
Signals” on page 2–46 for more information on the LAB-wide control
signals.
The Quartus II software and supported third-party synthesis tools, in
conjunction with parameterized functions such as library of
parameterized modules (LPM) functions, automatically choose the
appropriate mode for common functions such as counters, adders,
subtractors, and arithmetic functions. If required, you can also create
special-purpose functions that specify which ALM operating mode to use
for optimal performance.
Normal Mode
The normal mode is suitable for general logic applications and
combinational functions. In this mode, up to eight data inputs from the
LAB local interconnect are inputs to the combinational logic. The normal
mode allows two functions to be implemented in one Stratix II GX ALM,
or an ALM to implement a single function of up to six inputs. The ALM
can support certain combinations of completely independent functions
and various combinations of functions which have common inputs.
Figure 2–37 shows the supported LUT combinations in normal mode.
Altera Corporation
October 2007
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Stratix II GX Device Handbook, Volume 1
Adaptive Logic Modules
Figure 2–37. ALM in Normal Mode
Note (1)
dataf0
datae0
datac
dataa
4-Input
LUT
combout0
datab
datad
datae1
dataf1
4-Input
LUT
combout1
dataf0
datae0
datac
dataa
datab
5-Input
LUT
combout0
datad
datae1
dataf1
dataf0
datae0
datac
dataa
datab
datad
datae1
dataf1
3-Input
LUT
5-Input
LUT
combout0
5-Input
LUT
combout1
dataf0
datae0
dataa
datab
datac
datad
6-Input
LUT
combout0
dataf0
datae0
dataa
datab
datac
datad
6-Input
LUT
combout0
6-Input
LUT
combout1
datad
datae1
dataf1
combout1
5-Input
LUT
4-Input
LUT
dataf0
datae0
datac
dataa
datab
combout0
combout1
datae1
dataf1
Note to Figure 2–37:
(1)
Combinations of functions with less inputs than those shown are also supported. For example, combinations of
functions with the following number of inputs are supported: 4 and 3, 3 and 3, 3 and 2, 5 and 2, etc.
The normal mode provides complete backward compatibility with
four-input LUT architectures. Two independent functions of four inputs
or less can be implemented in one Stratix II GX ALM. In addition, a
five-input function and an independent three-input function can be
implemented without sharing inputs.
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October 2007
Stratix II GX Architecture
To pack two five-input functions into one ALM, the functions must have
at least two common inputs. The common inputs are dataa and datab.
The combination of a four-input function with a five-input function
requires one common input (either dataa or datab).
To implement two six-input functions in one ALM, four inputs must be
shared and the combinational function must be the same. For example, a
4 × 2 crossbar switch (two 4-to-1 multiplexers with common inputs and
unique select lines) can be implemented in one ALM, as shown in
Figure 2–38. The shared inputs are dataa, datab, datac, and datad,
while the unique select lines are datae0 and dataf0 for function0,
and datae1 and dataf1 for function1. This crossbar switch
consumes four LUTs in a four-input LUT-based architecture.
Figure 2–38. 4 × 2 Crossbar Switch Example
4 × 2 Crossbar Switch
sel0[1..0]
inputa
inputb
out0
inputc
inputd
Implementation in 1 ALM
dataf0
datae0
dataa
datab
datac
datad
Six-Input
LUT
(Function0)
combout0
Six-Input
LUT
(Function1)
combout1
out1
sel1[1..0]
datae1
dataf1
In a sparsely used device, functions that could be placed into one ALM
can be implemented in separate ALMs. The Quartus II Compiler spreads
a design out to achieve the best possible performance. As a device begins
to fill up, the Quartus II software automatically utilizes the full potential
of the Stratix II GX ALM. The Quartus II Compiler automatically searches
for functions of common inputs or completely independent functions to
be placed into one ALM and to make efficient use of the device resources.
In addition, you can manually control resource usage by setting location
assignments. Any six-input function can be implemented utilizing inputs
dataa, datab, datac, datad, and either datae0 and dataf0 or
datae1 and dataf1. If datae0 and dataf0 are utilized, the output is
driven to register0, and/or register0 is bypassed and the data
drives out to the interconnect using the top set of output drivers (see
Figure 2–39). If datae1 and dataf1 are utilized, the output drives to
register1 and/or bypasses register1 and drives to the interconnect
Altera Corporation
October 2007
2–53
Stratix II GX Device Handbook, Volume 1
Adaptive Logic Modules
using the bottom set of output drivers. The Quartus II Compiler
automatically selects the inputs to the LUT. Asynchronous load data for
the register comes from the datae or dataf input of the ALM. ALMs in
normal mode support register packing.
Figure 2–39. 6-Input Function in Normal Mode
dataf0
datae0
dataa
datab
datac
datad
Notes (1), (2)
To general or
local routing
6-Input
LUT
datae1
dataf1
(2)
These inputs are available for register packing.
D
Q
To general or
local routing
reg0
D
Q
To general or
local routing
reg1
Notes to Figure 2–39:
(1)
(2)
If datae1 and dataf1 are used as inputs to the six-input function, datae0 and
dataf0 are available for register packing.
The dataf1 input is available for register packing only if the six-input function is
un-registered.
Extended LUT Mode
The extended LUT mode is used to implement a specific set of
seven-input functions. The set must be a 2-to-1 multiplexer fed by two
arbitrary five-input functions sharing four inputs. Figure 2–40 shows the
template of supported seven-input functions utilizing extended LUT
mode. In this mode, if the seven-input function is unregistered, the
unused eighth input is available for register packing. Functions that fit
into the template shown in Figure 2–40 occur naturally in designs. These
functions often appear in designs as “if-else” statements in Verilog HDL
or VHDL code.
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October 2007
Stratix II GX Architecture
Figure 2–40. Template for Supported Seven-Input Functions in Extended LUT Mode
datae0
datac
dataa
datab
datad
dataf0
5-Input
LUT
To general or
local routing
combout0
D
5-Input
LUT
Q
To general or
local routing
reg0
datae1
dataf1
(1)
This input is available
for register packing.
Note to Figure 2–40:
(1)
If the seven-input function is un-registered, the unused eighth input is available for register packing. The second
register, reg1, is not available.
Arithmetic Mode
The arithmetic mode is ideal for implementing adders, counters,
accumulators, wide parity functions, and comparators. An ALM in
arithmetic mode uses two sets of two four-input LUTs along with two
dedicated full adders. The dedicated adders allow the LUTs to be
available to perform pre-adder logic; therefore, each adder can add the
output of two four-input functions. The four LUTs share the dataa and
datab inputs. As shown in Figure 2–41, the carry-in signal feeds to
adder0, and the carry-out from adder0 feeds to carry-in of adder1. The
carry-out from adder1 drives to adder0 of the next ALM in the LAB.
ALMs in arithmetic mode can drive out registered and/or un-registered
versions of the adder outputs.
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October 2007
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Adaptive Logic Modules
Figure 2–41. ALM in Arithmetic Mode
carry_in
adder0
datae0
4-Input
LUT
To general or
local routing
D
dataf0
datac
datab
dataa
Q
To general or
local routing
reg0
4-Input
LUT
adder1
datad
datae1
4-Input
LUT
To general or
local routing
D
4-Input
LUT
Q
To general or
local routing
reg1
dataf1
carry_out
While operating in arithmetic mode, the ALM can support simultaneous
use of the adder’s carry output along with combinational logic outputs.
In this operation, the adder output is ignored. This usage of the adder
with the combinational logic output provides resource savings of up to
50% for functions that can use this ability. An example of such
functionality is a conditional operation, such as the one shown in
Figure 2–42. The equation for this example is:
R = (X < Y) ? Y : X
To implement this function, the adder is used to subtract ‘Y’ from ‘X’. If
‘X’ is less than ‘Y’, the carry_out signal will be ‘1’. The carry_out
signal is fed to an adder where it drives out to the LAB local interconnect.
It then feeds to the LAB-wide syncload signal. When asserted,
syncload selects the syncdata input. In this case, the data ‘Y’ drives
the syncdata inputs to the registers. If ‘X’ is greater than or equal to ‘Y’,
the syncload signal is de-asserted and ‘X’ drives the data port of the
registers.
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Stratix II GX Architecture
Figure 2–42. Conditional Operation Example
Adder output
is not used.
ALM 1
X[0]
Comb &
Adder
Logic
Y[0]
X[0]
D
R[0]
To general or
local routing
R[1]
To general or
local routing
R[2]
To general or
local routing
Q
reg0
syncdata
syncload
X[1]
Comb &
Adder
Logic
Y[1]
X[1]
D
Q
reg1
syncload
Carry Chain
ALM 2
X[2]
Y[2]
Comb &
Adder
Logic
X[2]
D
Q
reg0
syncload
Comb &
Adder
Logic
carry_out
To local routing &
then to LAB-wide
syncload
The arithmetic mode also offers clock enable, counter enable,
synchronous up and down control, add and subtract control,
synchronous clear, synchronous load. The LAB local interconnect data
inputs generate the clock enable, counter enable, synchronous up and
down and add and subtract control signals. These control signals may be
used for the inputs that are shared between the four LUTs in the ALM.
The synchronous clear and synchronous load options are LAB-wide
signals that affect all registers in the LAB. The Quartus II software
automatically places any registers that are not used by the counter into
other LABs.
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October 2007
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Adaptive Logic Modules
Carry Chain
The carry chain provides a fast carry function between the dedicated
adders in arithmetic or shared arithmetic mode. Carry chains can begin in
either the first ALM or the fifth ALM in a LAB. The final carry-out signal
is routed to an ALM, where it is fed to local, row, or column interconnects.
The Quartus II Compiler automatically creates carry chain logic during
compilation, or you can create it manually during design entry.
Parameterized functions, such as LPM functions, automatically take
advantage of carry chains for the appropriate functions. The Quartus II
Compiler creates carry chains longer than 16 (8 ALMs in arithmetic or
shared arithmetic mode) by linking LABs together automatically. For
enhanced fitting, a long carry chain runs vertically, allowing fast
horizontal connections to TriMatrix memory and DSP blocks. A carry
chain can continue as far as a full column. To avoid routing congestion in
one small area of the device when a high fan-in arithmetic function is
implemented, the LAB can support carry chains that only utilize either
the top half or the bottom half of the LAB before connecting to the next
LAB. The other half of the ALMs in the LAB is available for implementing
narrower fan-in functions in normal mode. Carry chains that use the top
four ALMs in the first LAB will carry into the top half of the ALMs in the
next LAB within the column. Carry chains that use the bottom four ALMs
in the first LAB will carry into the bottom half of the ALMs in the next
LAB within the column. Every other column of the LABs are top-half
bypassable, while the other LAB columns are bottom-half bypassable.
Refer to “MultiTrack Interconnect” on page 2–63 for more information on
carry chain interconnect.
Shared Arithmetic Mode
In shared arithmetic mode, the ALM can implement a three-input add. In
this mode, the ALM is configured with four 4-input LUTs. Each LUT
either computes the sum of three inputs or the carry of three inputs. The
output of the carry computation is fed to the next adder (either to adder1
in the same ALM or to adder0 of the next ALM in the LAB) using a
dedicated connection called the shared arithmetic chain. This shared
arithmetic chain can significantly improve the performance of an adder
tree by reducing the number of summation stages required to implement
an adder tree. Figure 2–43 shows the ALM in shared arithmetic mode.
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October 2007
Stratix II GX Architecture
Figure 2–43. ALM in Shared Arithmetic Mode
shared_arith_in
carry_in
4-Input
LUT
To general or
local routing
D
datae0
datac
datab
dataa
datad
datae1
Q
To general or
local routing
reg0
4-Input
LUT
4-Input
LUT
To general or
local routing
D
4-Input
LUT
Q
To general or
local routing
reg1
carry_out
shared_arith_out
Note to Figure 2–43:
(1)
Inputs dataf0 and dataf1 are available for register packing in shared arithmetic mode.
Adder trees are used in many different applications. For example, the
summation of the partial products in a logic-based multiplier can be
implemented in a tree structure. Another example is a correlator function
that can use a large adder tree to sum filtered data samples in a given time
frame to recover or to de-spread data which was transmitted utilizing
spread spectrum technology. An example of a three-bit add operation
utilizing the shared arithmetic mode is shown in Figure 2–44. The partial
sum (S[2..0]) and the partial carry (C[2..0]) is obtained using the
LUTs, while the result (R[2..0]) is computed using the dedicated
adders.
Altera Corporation
October 2007
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Adaptive Logic Modules
Figure 2–44. Example of a 3-Bit Add Utilizing Shared Arithmetic Mode
shared_arith_in = '0'
carry_in = '0'
3-Bit Add Example
ALM Implementation
ALM 1
1st stage add is
implemented in LUTs.
X2 X1 X0
Y2 Y1 Y0
+ Z2 Z1 Z0
2nd stage add is
implemented in adders.
S2 S1 S0
+ C2 C1 C0
R3 R2 R1 R0
Binary Add
Decimal
Equivalents
1 1 0
1 0 1
+ 0 1 0
6
5
+ 2
0 0 1
+ 1 1 0
1
+ 2x6
1 1 0 1
13
3-Input
LUT
S0
R0
X0
Y0
Z0
3-Input
LUT
C0
X1
Y1
Z1
3-Input
LUT
S1
R1
3-Input
LUT
C1
3-Input
LUT
S2
ALM 2
R2
X2
Y2
Z2
3-Input
LUT
C2
3-Input
LUT
'0'
R3
3-Input
LUT
Shared Arithmetic Chain
In addition to the dedicated carry chain routing, the shared arithmetic
chain available in shared arithmetic mode allows the ALM to implement
a three-input add, which significantly reduces the resources necessary to
implement large adder trees or correlator functions. The shared
arithmetic chains can begin in either the first or fifth ALM in a LAB. The
Quartus II Compiler automatically links LABs to create shared arithmetic
chains longer than 16 (8 ALMs in arithmetic or shared arithmetic mode).
For enhanced fitting, a long shared arithmetic chain runs vertically
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Stratix II GX Architecture
allowing fast horizontal connections to TriMatrix memory and DSP
blocks. A shared arithmetic chain can continue as far as a full column.
Similar to the carry chains, the shared arithmetic chains are also top- or
bottom-half bypassable. This capability allows the shared arithmetic
chain to cascade through half of the ALMs in a LAB while leaving the
other half available for narrower fan-in functionality. Every other LAB
column is top-half bypassable, while the other LAB columns are
bottom-half bypassable. Refer to “MultiTrack Interconnect” on page 2–63
for more information on shared arithmetic chain interconnect.
Register Chain
In addition to the general routing outputs, the ALMs in a LAB have
register chain outputs. The register chain routing allows registers in the
same LAB to be cascaded together. The register chain interconnect allows
a LAB to use LUTs for a single combinational function and the registers
to be used for an unrelated shift register implementation. These resources
speed up connections between ALMs while saving local interconnect
resources (see Figure 2–45). The Quartus II Compiler automatically takes
advantage of these resources to improve utilization and performance. See
“MultiTrack Interconnect” on page 2–63 for more information about
register chain interconnect.
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October 2007
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Adaptive Logic Modules
Figure 2–45. Register Chain within a LAB
Note (1)
From Previous ALM
Within The LAB
reg_chain_in
To general or
local routing
adder0
D
Q
To general or
local routing
reg0
Combinational
Logic
adder1
D
Q
To general or
local routing
reg1
To general or
local routing
To general or
local routing
adder0
D
Q
To general or
local routing
reg0
Combinational
Logic
adder1
D
Q
To general or
local routing
reg1
To general or
local routing
reg_chain_out
To Next ALM
within the LAB
Note to Figure 2–45:
(1)
The combinational or adder logic can be utilized to implement an unrelated, un-registered function.
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Stratix II GX Architecture
Clear and Preset Logic Control
LAB-wide signals control the logic for the register’s clear and load/preset
signals. The ALM directly supports an asynchronous clear and preset
function. The register preset is achieved through the asynchronous load
of a logic high. The direct asynchronous preset does not require a NOT
gate push-back technique. Stratix II GX devices support simultaneous
asynchronous load/preset and clear signals. An asynchronous clear
signal takes precedence if both signals are asserted simultaneously. Each
LAB supports up to two clears and one load/preset signal.
In addition to the clear and load/preset ports, Stratix II GX devices
provide a device-wide reset pin (DEV_CLRn) that resets all registers in the
device. An option set before compilation in the Quartus II software
controls this pin. This device-wide reset overrides all other control
signals.
MultiTrack
Interconnect
In the Stratix II GX architecture, the MultiTrack interconnect structure
with DirectDrive technology provides connections between ALMs,
TriMatrix memory, DSP blocks, and device I/O pins. The MultiTrack
interconnect consists of continuous, performance-optimized routing lines
of different lengths and speeds used for inter- and intra-design block
connectivity. The Quartus II Compiler automatically places critical design
paths on faster interconnects to improve design performance.
DirectDrive technology is a deterministic routing technology that ensures
identical routing resource usage for any function regardless of placement
in the device. The MultiTrack interconnect and DirectDrive technology
simplify the integration stage of block-based designing by eliminating the
re-optimization cycles that typically follow design changes and
additions.
The MultiTrack interconnect consists of row and column interconnects
that span fixed distances. A routing structure with fixed length resources
for all devices allows predictable and repeatable performance when
migrating through different device densities. Dedicated row
interconnects route signals to and from LABs, DSP blocks, and TriMatrix
memory in the same row.
These row resources include:
■
■
■
Altera Corporation
October 2007
Direct link interconnects between LABs and adjacent blocks
R4 interconnects traversing four blocks to the right or left
R24 row interconnects for high-speed access across the length of the
device
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The direct link interconnect allows a LAB, DSP block, or TriMatrix
memory block to drive into the local interconnect of its left and right
neighbors and then back into itself, providing fast communication
between adjacent LABs and/or blocks without using row interconnect
resources.
The R4 interconnects span four LABs, three LABs and one M512 RAM
block, two LABs and one M4K RAM block, or two LABs and one DSP
block to the right or left of a source LAB. These resources are used for fast
row connections in a four-LAB region. Every LAB has its own set of R4
interconnects to drive either left or right. Figure 2–46 shows R4
interconnect connections from a LAB.
R4 interconnects can drive and be driven by DSP blocks and RAM blocks
and row IOEs. For LAB interfacing, a primary LAB or LAB neighbor can
drive a given R4 interconnect. For R4 interconnects that drive to the right,
the primary LAB and right neighbor can drive onto the interconnect. For
R4 interconnects that drive to the left, the primary LAB and its left
neighbor can drive onto the interconnect. R4 interconnects can drive
other R4 interconnects to extend the range of LABs they can drive. R4
interconnects can also drive C4 and C16 interconnects for connections
from one row to another. Additionally, R4 interconnects can drive R24
interconnects.
Figure 2–46. R4 Interconnect Connections
Notes (1), (2), (3)
Adjacent LAB can
Drive onto Another
LAB's R4 Interconnect
C4 and C16
Column Interconnects (1)
R4 Interconnect
Driving Right
R4 Interconnect
Driving Left
LAB
Neighbor
Primary
LAB (2)
LAB
Neighbor
Notes to Figure 2–46:
(1)
(2)
(3)
C4 and C16 interconnects can drive R4 interconnects.
This pattern is repeated for every LAB in the LAB row.
The LABs in Figure 2–46 show the 16 possible logical outputs per LAB.
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Stratix II GX Architecture
R24 row interconnects span 24 LABs and provide the fastest resource for
long row connections between LABs, TriMatrix memory, DSP blocks, and
Row IOEs. The R24 row interconnects can cross M-RAM blocks. R24 row
interconnects drive to other row or column interconnects at every fourth
LAB and do not drive directly to LAB local interconnects. R24 row
interconnects drive LAB local interconnects via R4 and C4 interconnects.
R24 interconnects can drive R24, R4, C16, and C4 interconnects. The
column interconnect operates similarly to the row interconnect and
vertically routes signals to and from LABs, TriMatrix memory, DSP
blocks, and IOEs. Each column of LABs is served by a dedicated column
interconnect.
These column resources include:
■
■
■
■
■
Shared arithmetic chain interconnects in a LAB
Carry chain interconnects in a LAB and from LAB to LAB
Register chain interconnects in a LAB
C4 interconnects traversing a distance of four blocks in an up and
down direction
C16 column interconnects for high-speed vertical routing through
the device
Stratix II GX devices include an enhanced interconnect structure in LABs
for routing shared arithmetic chains and carry chains for efficient
arithmetic functions. The register chain connection allows the register
output of one ALM to connect directly to the register input of the next
ALM in the LAB for fast shift registers. These ALM-to-ALM connections
bypass the local interconnect. The Quartus II Compiler automatically
takes advantage of these resources to improve utilization and
performance. Figure 2–47 shows the shared arithmetic chain, carry chain,
and register chain interconnects.
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October 2007
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MultiTrack Interconnect
Figure 2–47. Shared Arithmetic Chain, Carry Chain and Register Chain Interconnects
Local Interconnect
Routing Among ALMs
in the LAB
Carry Chain & Shared
Arithmetic Chain
Routing to Adjacent ALM
ALM 1
ALM 2
Local
Interconnect
Register Chain
Routing to Adjacent
ALM's Register Input
ALM 3
ALM 4
ALM 5
ALM 6
ALM 7
ALM 8
The C4 interconnects span four LABs, M512, or M4K blocks up or down
from a source LAB. Every LAB has its own set of C4 interconnects to drive
either up or down. Figure 2–48 shows the C4 interconnect connections
from a LAB in a column. The C4 interconnects can drive and be driven by
all types of architecture blocks, including DSP blocks, TriMatrix memory
blocks, and column and row IOEs. For LAB interconnection, a primary
LAB or its LAB neighbor can drive a given C4 interconnect. C4
interconnects can drive each other to extend their range as well as drive
row interconnects for column-to-column connections.
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October 2007
Stratix II GX Architecture
Figure 2–48. C4 Interconnect Connections
Note (1)
C4 Interconnect
Drives Local and R4
Interconnects
up to Four Rows
C4 Interconnect
Driving Up
LAB
Row
Interconnect
Adjacent LAB can
drive onto neighboring
LAB's C4 interconnect
Local
Interconnect
C4 Interconnect
Driving Down
Note to Figure 2–48:
(1)
Each C4 interconnect can drive either up or down four rows.
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October 2007
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MultiTrack Interconnect
C16 column interconnects span a length of 16 LABs and provide the
fastest resource for long column connections between LABs, TriMatrix
memory blocks, DSP blocks, and IOEs. C16 interconnects can cross
M-RAM blocks and also drive to row and column interconnects at every
fourth LAB. C16 interconnects drive LAB local interconnects via C4 and
R4 interconnects and do not drive LAB local interconnects directly. All
embedded blocks communicate with the logic array similar to
LAB-to-LAB interfaces. Each block (that is, TriMatrix memory and DSP
blocks) connects to row and column interconnects and has local
interconnect regions driven by row and column interconnects. These
blocks also have direct link interconnects for fast connections to and from
a neighboring LAB. All blocks are fed by the row LAB clocks,
labclk[5..0].
Table 2–18 shows the Stratix II GX device’s routing scheme.
Table 2–18. Stratix II GX Device Routing Scheme (Part 1 of 2)
Shared arithmetic chain
v
Carry chain
v
Register chain
v
Row IOE
Column IOE
DSP Blocks
M-RAM Block
M4K RAM Block
v v v v v v v
Local interconnect
Direct link interconnect
v
R4 interconnect
v
v v v v
v v v v
R24 interconnect
v
C4 interconnect
v
v
v v v v
C16 interconnect
v v v v v v
v
M512 RAM block
v v v
v
M4K RAM block
v v v
v
ALM
M512 RAM Block
ALM
C16 Interconnect
C4 Interconnect
R24 Interconnect
R4 Interconnect
Direct Link Interconnect
Local Interconnect
Register Chain
Carry Chain
Source
Shared Arithmetic Chain
Destination
M-RAM block
v v v v
DSP blocks
v v
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October 2007
Stratix II GX Architecture
Table 2–18. Stratix II GX Device Routing Scheme (Part 2 of 2)
Column IOE
v
Row IOE
v v v v
TriMatrix
Memory
Row IOE
Column IOE
DSP Blocks
M-RAM Block
M4K RAM Block
M512 RAM Block
ALM
C16 Interconnect
C4 Interconnect
R24 Interconnect
R4 Interconnect
Direct Link Interconnect
Local Interconnect
Register Chain
Carry Chain
Source
Shared Arithmetic Chain
Destination
v v
TriMatrix memory consists of three types of RAM blocks: M512, M4K,
and M-RAM. Although these memory blocks are different, they can all
implement various types of memory with or without parity, including
true dual-port, simple dual-port, and single-port RAM, ROM, and FIFO
buffers. Table 2–19 shows the size and features of the different RAM
blocks.
Table 2–19. TriMatrix Memory Features (Part 1 of 2)
Memory Feature
Maximum performance
M512 RAM Block
(32 × 18 Bits)
M4K RAM Block
(128 × 36 Bits)
M-RAM Block
(4K × 144 Bits)
500 MHz
550 MHz
420 MHz
v
v
True dual-port memory
Simple dual-port memory
v
v
v
Single-port memory
v
v
v
Shift register
v
v
ROM
v
v
(1)
FIFO buffer
v
v
v
v
v
Pack mode
Byte enable
v
Address clock enable
v
v
v
v
Parity bits
v
v
v
Mixed clock mode
v
v
v
Memory initialization (.mif)
v
v
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October 2007
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Table 2–19. TriMatrix Memory Features (Part 2 of 2)
Memory Feature
Simple dual-port memory
mixed width support
M512 RAM Block
(32 × 18 Bits)
M4K RAM Block
(128 × 36 Bits)
M-RAM Block
(4K × 144 Bits)
v
v
v
v
v
Outputs cleared
Outputs cleared
Outputs unknown
Output registers
Output registers
True dual-port memory
mixed width support
Power-up conditions
Register clears
Mixed-port read-during-write
Unknown output/old data Unknown output/old data
Configurations
512 × 1
256 × 2
128 × 4
64 × 8
64 × 9
32 × 16
32 × 18
4K × 1
2K × 2
1K × 4
512 × 8
512 × 9
256 × 16
256 × 18
128 × 32
128 × 36
Output registers
Unknown output
64K × 8
64K × 9
32K × 16
32K × 18
16K × 32
16K × 36
8K × 64
8K × 72
4K × 128
4K × 144
Note to Table 2–19:
(1)
Violating the setup or hold time on the memory block address registers could corrupt memory contents. This
applies to both read and write operations.
TriMatrix memory provides three different memory sizes for efficient
application support. The Quartus II software automatically partitions the
user-defined memory into the embedded memory blocks using the most
efficient size combinations. You can also manually assign the memory to
a specific block size or a mixture of block sizes.
M512 RAM Block
The M512 RAM block is a simple dual-port memory block and is useful
for implementing small FIFO buffers, DSP, and clock domain transfer
applications. Each block contains 576 RAM bits (including parity bits).
M512 RAM blocks can be configured in the following modes:
■
■
■
■
■
Simple dual-port RAM
Single-port RAM
FIFO
ROM
Shift register
When configured as RAM or ROM, you can use an initialization file to
pre-load the memory contents.
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Stratix II GX Architecture
M512 RAM blocks can have different clocks on its inputs and outputs.
The wren, datain, and write address registers are all clocked together
from one of the two clocks feeding the block. The read address, rden, and
output registers can be clocked by either of the two clocks driving the
block, allowing the RAM block to operate in read and write or input and
output clock modes. Only the output register can be bypassed. The six
labclk signals or local interconnect can drive the inclock, outclock,
wren, rden, and outclr signals. Because of the advanced interconnect
between the LAB and M512 RAM blocks, ALMs can also control the wren
and rden signals and the RAM clock, clock enable, and asynchronous
clear signals. Figure 2–49 shows the M512 RAM block control signal
generation logic.
Figure 2–49. M512 RAM Block Control Signals
Dedicated
Row LAB
Clocks
6
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Altera Corporation
October 2007
outclocken
inclocken
inclock
outclock
wren
rden
outclr
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The RAM blocks in Stratix II GX devices have local interconnects to allow
ALMs and interconnects to drive into RAM blocks. The M512 RAM block
local interconnect is driven by the R4, C4, and direct link interconnects
from adjacent LABs. The M512 RAM blocks can communicate with LABs
on either the left or right side through these row interconnects or with
LAB columns on the left or right side with the column interconnects. The
M512 RAM block has up to 16 direct link input connections from the left
adjacent LABs and another 16 from the right adjacent LAB. M512 RAM
outputs can also connect to left and right LABs through direct link
interconnect. The M512 RAM block has equal opportunity for access and
performance to and from LABs on either its left or right side. Figure 2–50
shows the M512 RAM block to logic array interface.
Figure 2–50. M512 RAM Block LAB Row Interface
C4 Interconnect
Direct link
interconnect
to adjacent LAB
R4 Interconnect
16
Direct link
interconnect
to adjacent LAB
36
dataout
M4K RAM
Block
Direct link
interconnect
from adjacent LAB
Direct link
interconnect
from adjacent LAB
datain
control
signals
byte
enable
clocks
address
6
M4K RAM Block Local
Interconnect Region
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October 2007
Stratix II GX Architecture
M4K RAM Blocks
The M4K RAM block includes support for true dual-port RAM. The M4K
RAM block is used to implement buffers for a wide variety of applications
such as storing processor code, implementing lookup schemes, and
implementing larger memory applications. Each block contains
4,608 RAM bits (including parity bits). M4K RAM blocks can be
configured in the following modes:
■
■
■
■
■
■
True dual-port RAM
Simple dual-port RAM
Single-port RAM
FIFO
ROM
Shift register
When configured as RAM or ROM, you can use an initialization file to
pre-load the memory contents.
The M4K RAM blocks allow for different clocks on their inputs and
outputs. Either of the two clocks feeding the block can clock M4K RAM
block registers (renwe, address, byte enable, datain, and output
registers). Only the output register can be bypassed. The six labclk
signals or local interconnects can drive the control signals for the A and B
ports of the M4K RAM block. ALMs can also control the clock_a,
clock_b, renwe_a, renwe_b, clr_a, clr_b, clocken_a, and
clocken_b signals, as shown in Figure 2–51.
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October 2007
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Figure 2–51. M4K RAM Block Control Signals
Dedicated
Row LAB
Clocks
6
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
clocken_b
clock_b
clock_a
clocken_a
renwe_b
renwe_a
aclr_b
aclr_a
The R4, C4, and direct link interconnects from adjacent LABs drive the
M4K RAM block local interconnect. The M4K RAM blocks can
communicate with LABs on either the left or right side through these row
resources or with LAB columns on either the right or left with the column
resources. Up to 16 direct link input connections to the M4K RAM block
are possible from the left adjacent LABs and another 16 possible from the
right adjacent LAB. M4K RAM block outputs can also connect to left and
right LABs through direct link interconnect. Figure 2–52 shows the M4K
RAM block to logic array interface.
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October 2007
Stratix II GX Architecture
Figure 2–52. M4K RAM Block LAB Row Interface
C4 Interconnect
Direct link
interconnect
to adjacent LAB
R4 Interconnect
16
Direct link
interconnect
to adjacent LAB
36
dataout
M4K RAM
Block
Direct link
interconnect
from adjacent LAB
Direct link
interconnect
from adjacent LAB
datain
control
signals
byte
enable
clocks
address
6
M4K RAM Block Local
Interconnect Region
LAB Row Clocks
M-RAM Block
The largest TriMatrix memory block, the M-RAM block, is useful for
applications where a large volume of data must be stored on-chip. Each
block contains 589,824 RAM bits (including parity bits). The M-RAM
block can be configured in the following modes:
■
■
■
■
True dual-port RAM
Simple dual-port RAM
Single-port RAM
FIFO
You cannot use an initialization file to initialize the contents of a M-RAM
block. All M-RAM block contents power up to an undefined value. Only
synchronous operation is supported in the M-RAM block, so all inputs
are registered. Output registers can be bypassed.
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October 2007
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TriMatrix Memory
Similar to all RAM blocks, M-RAM blocks can have different clocks on
their inputs and outputs. Either of the two clocks feeding the block can
clock M-RAM block registers (renwe, address, byte enable, datain,
and output registers). The output register can be bypassed. The six
labclk signals or local interconnect can drive the control signals for the
A and B ports of the M-RAM block. ALMs can also control the clock_a,
clock_b, renwe_a, renwe_b, clr_a, clr_b, clocken_a, and
clocken_b signals, as shown in Figure 2–53.
Figure 2–53. M-RAM Block Control Signals
Dedicated
Row LAB
Clocks
6
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
Local
Interconnect
clocken_a
Local
Interconnect
clock_a
renwe_a
aclr_a
clock_b
aclr_b
renwe_b
Local
Interconnect
clocken_b
The R4, R24, C4, and direct link interconnects from adjacent LABs on
either the right or left side drive the M-RAM block local interconnect. Up
to 16 direct link input connections to the M-RAM block are possible from
the left adjacent LABs and another 16 possible from the right adjacent
LAB. M-RAM block outputs can also connect to left and right LABs
through direct link interconnect. Figure 2–54 shows an example floorplan
for the EP2SGX130 device and the location of the M-RAM interfaces.
Figures 2–55 and 2–56 show the interface between the M-RAM block and
the logic array.
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Stratix II GX Architecture
Figure 2–54. EP2SGX130 Device with M-RAM Interface Locations
Note (1)
M-RAM blocks interface to
LABs on right and left sides for
easy access to horizontal I/O pins
M4K
Blocks
M-RAM
Block
M-RAM
Block
M-RAM
Block
M-RAM
Block
M-RAM
Block
M-RAM
Block
M512
Blocks
DSP
Blocks
LABs
DSP
Blocks
Note to Figure 2–54:
(1)
The device shown is an EP2SGX130 device. The number and position of M-RAM blocks varies in other devices.
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October 2007
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TriMatrix Memory
Figure 2–55. M-RAM Block LAB Row Interface Note (1)
Row Unit Interface Allows LAB
Rows to Drive Port A Datain,
Dataout, Address and Control
Signals to and from M-RAM Block
Row Unit Interface Allows LAB
Rows to Drive Port B Datain,
Dataout, Address and Control
Signals to and from M-RAM Block
L0
R0
L1
R1
M-RAM Block
L2
Port A
Port B R2
L3
R3
L4
R4
L5
R5
LAB Interface
Blocks
LABs in Row
M-RAM Boundary
LABs in Row
M-RAM Boundary
Note to Figure 2–55:
(1)
Only R24 and C16 interconnects cross the M-RAM block boundaries.
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October 2007
Stratix II GX Architecture
Figure 2–56. M-RAM Row Unit Interface to Interconnect
C4 Interconnect
R4 and R24 Interconnects
M-RAM Block
LAB
Up to 16
dataout_a[ ]
16
Up to 28
Direct Link
Interconnects
datain_a[ ]
addressa[ ]
addr_ena_a
renwe_a
byteena_a[ ]
clocken_a
clock_a
aclr_a
Row Interface Block
M-RAM Block to
LAB Row Interface
Block Interconnect Region
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October 2007
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TriMatrix Memory
Table 2–20 shows the input and output data signal connections along
with the address and control signal input connections to the row unit
interfaces (L0 to L5 and R0 to R5).
Table 2–20. M-RAM Row Interface Unit Signals
f
Unit Interface Block
Input Signals
Output Signals
L0
datain_a[14..0]
byteena_a[1..0]
dataout_a[11..0]
L1
datain_a[29..15]
byteena_a[3..2]
dataout_a[23..12]
L2
datain_a[35..30]
addressa[4..0]
addr_ena_a
clock_a
clocken_a
renwe_a
aclr_a
dataout_a[35..24]
L3
addressa[15..5]
datain_a[41..36]
dataout_a[47..36]
L4
datain_a[56..42]
byteena_a[5..4]
dataout_a[59..48]
L5
datain_a[71..57]
byteena_a[7..6]
dataout_a[71..60]
R0
datain_b[14..0]
byteena_b[1..0]
dataout_b[11..0]
R1
datain_b[29..15]
byteena_b[3..2]
dataout_b[23..12]
R2
datain_b[35..30]
addressb[4..0]
addr_ena_b
clock_b
clocken_b
renwe_b
aclr_b
dataout_b[35..24]
R3
addressb[15..5]
datain_b[41..36]
dataout_b[47..36]
R4
datain_b[56..42]
byteena_b[5..4]
dataout_b[59..48]
R5
datain_b[71..57]
byteena_b[7..6]
dataout_b[71..60]
Refer to the TriMatrix Embedded Memory Blocks in Stratix II & Stratix II GX
Devices chapter in volume 2 of the Stratix II GX Device Handbook for more
information on TriMatrix memory.
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October 2007
Stratix II GX Architecture
Digital Signal
Processing
(DSP) Block
The most commonly used DSP functions are finite impulse response (FIR)
filters, complex FIR filters, infinite impulse response (IIR) filters, fast
Fourier transform (FFT) functions, direct cosine transform (DCT)
functions, and correlators. All of these use the multiplier as the
fundamental building block. Additionally, some applications need
specialized operations such as multiply-add and multiply-accumulate
operations. Stratix II GX devices provide DSP blocks to meet the
arithmetic requirements of these functions.
Each Stratix II GX device has two to four columns of DSP blocks to
efficiently implement DSP functions faster than ALM-based
implementations. Stratix II GX devices have up to 24 DSP blocks per
column (see Table 2–21). Each DSP block can be configured to support up
to:
■
■
■
Eight 9 × 9-bit multipliers
Four 18 × 18-bit multipliers
One 36 × 36-bit multiplier
As indicated, the Stratix II GX DSP block can support one 36 × 36-bit
multiplier in a single DSP block, and is true for any combination of
signed, unsigned, or mixed sign multiplications.
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October 2007
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Digital Signal Processing (DSP) Block
Figures 2–57 shows one of the columns with surrounding LAB rows.
Figure 2–57. DSP Blocks Arranged in Columns
DSP Block
Column
4 LAB
Rows
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DSP Block
Altera Corporation
October 2007
Stratix II GX Architecture
Table 2–21 shows the number of DSP blocks in each Stratix II GX device.
DSP block multipliers can optionally feed an adder/subtractor or
accumulator in the block, depending on the configuration, which makes
routing to ALMs easier, saves ALM routing resources, and increases
performance because all connections and blocks are in the DSP block.
Table 2–21. DSP Blocks in Stratix II GX Devices
Note (1)
DSP Blocks
Total 9 × 9
Multipliers
Total 18 × 18
Multipliers
Total 36 × 36
Multipliers
EP2SGX30
16
128
64
16
EP2SGX60
36
288
144
36
EP2SGX90
48
384
192
48
EP2SGX130
63
504
252
63
Device
Note to Table 2–21:
(1)
This list only shows functions that can fit into a single DSP block. Multiple DSP
blocks can support larger multiplication functions.
Additionally, the DSP block input registers can efficiently implement shift
registers for FIR filter applications, and DSP blocks support Q1.15 format
rounding and saturation. Figure 2–58 shows the top-level diagram of the
DSP block configured for 18 × 18-bit multiplier mode.
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October 2007
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Digital Signal Processing (DSP) Block
Figure 2–58. DSP Block Diagram for 18 × 18-Bit Configuration
Optional Serial Shift Register
Inputs from Previous
DSP Block
Multiplier Stage
D
Optional Stage Configurable
as Accumulator or Dynamic
Adder/Subtractor
Q
ENA
CLRN
D
D
ENA
CLRN
Q
Output Selection
Multiplexer
Q
ENA
CLRN
Adder/
Subtractor/
Accumulator
1
D
Q
ENA
CLRN
D
D
ENA
CLRN
Q
Q
ENA
CLRN
Summation
D
Q
ENA
CLRN
D
D
ENA
CLRN
Q
Q
Summation Stage
for Adding Four
Multipliers Together
Optional Output
Register Stage
ENA
CLRN
Adder/
Subtractor/
Accumulator
2
D
Optional Serial
Shift Register
Outputs to
Next DSP Block
in the Column
Q
ENA
CLRN
D
D
ENA
CLRN
Q
ENA
CLRN
Q
Optional Pipeline
Register Stage
Optional Input Register
Stage with Parallel Input or
Shift Register Configuration
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to MultiTrack
Interconnect
Altera Corporation
October 2007
Stratix II GX Architecture
Modes of Operation
The adder, subtractor, and accumulate functions of a DSP block have four
modes of operation:
■
■
■
■
Simple multiplier
Multiply-accumulator
Two-multipliers adder
Four-multipliers adder
Table 2–22 shows the different number of multipliers possible in each
DSP block mode according to size. These modes allow the DSP blocks to
implement numerous applications for DSP including FFTs, complex FIR,
FIR, 2D FIR filters, equalizers, IIR, correlators, matrix multiplication, and
many other functions. The DSP blocks also support mixed modes and
mixed multiplier sizes in the same block. For example, half of one DSP
block can implement one 18 × 18-bit multiplier in multiply-accumulator
mode, while the other half of the DSP block implements four 9 × 9-bit
multipliers in simple multiplier mode.
Table 2–22. Multiplier Size and Configurations per DSP Block
DSP Block Mode
9×9
18 × 18
36 × 36
Eight multipliers with
eight product outputs
Four multipliers with four
product outputs
One multiplier with one
product output
Multiply-accumulator
—
Two 52-bit multiplyaccumulate blocks
—
Two-multipliers adder
Four two-multiplier adder
(two 9 × 9 complex
multiply)
Two two-multiplier adder
(one 18 × 18 complex
multiply)
—
Four-multipliers adder
Two four-multiplier adder
One four-multiplier adder
—
Multiplier
DSP Block Interface
The Stratix II GX device DSP block input registers can generate a shift
register that can cascade down in the same DSP block column. Dedicated
connections between DSP blocks provide fast connections between the
shift register inputs to cascade the shift register chains. You can cascade
registers within multiple DSP blocks for 9 × 9- or 18 × 18-bit FIR filters
larger than four taps, with additional adder stages implemented in
ALMs. If the DSP block is configured as 36 × 36 bits, the adder, subtractor,
or accumulator stages are implemented in ALMs. Each DSP block can
route the shift register chain out of the block to cascade multiple columns
of DSP blocks.
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October 2007
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Digital Signal Processing (DSP) Block
The DSP block is divided into four block units that interface with four
LAB rows on the left and right. Each block unit can be considered one
complete 18 × 18-bit multiplier with 36 inputs and 36 outputs. A local
interconnect region is associated with each DSP block. Like a LAB, this
interconnect region can be fed with 16 direct link interconnects from the
LAB to the left or right of the DSP block in the same row. R4 and C4
routing resources can access the DSP block’s local interconnect region.
The outputs also work similarly to LAB outputs. Eighteen outputs from
the DSP block can drive to the left LAB through direct link interconnects
and 18 can drive to the right LAB through direct link interconnects. All 36
outputs can drive to R4 and C4 routing interconnects. Outputs can drive
right- or left-column routing.
Figures 2–59 and 2–60 show the DSP block interfaces to LAB rows.
Figure 2–59. DSP Block Interconnect Interface
DSP Block
R4, C4 & Direct
Link Interconnects
OA[17..0]
OB[17..0]
R4, C4 & Direct
Link Interconnects
A1[17..0]
B1[17..0]
OC[17..0]
OD[17..0]
A2[17..0]
B2[17..0]
OE[17..0]
OF[17..0]
A3[17..0]
B3[17..0]
OG[17..0]
OH[17..0]
A4[17..0]
B4[17..0]
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October 2007
Stratix II GX Architecture
Figure 2–60. DSP Block Interface to Interconnect
Direct Link Interconnect
from Adjacent LAB
C4 Interconnect
Direct Link Outputs
to Adjacent LABs
R4 Interconnect
Direct Link Interconnect
from Adjacent LAB
36
DSP Block
Row Structure
36
LAB
LAB
18
16
16
12
Control
36
A[17..0]
B[17..0]
OA[17..0]
OB[17..0]
36
Row Interface
Block
DSP Block to
LAB Row Interface
Block Interconnect Region
36 Inputs per Row
36 Outputs per Row
A bus of 44 control signals feeds the entire DSP block. These signals
include clocks, asynchronous clears, clock enables, signed and unsigned
control signals, addition and subtraction control signals, rounding and
saturation control signals, and accumulator synchronous loads. The clock
signals are routed from LAB row clocks and are generated from specific
LAB rows at the DSP block interface. The LAB row source for control
signals, data inputs, and outputs is shown in Table 2–23.
f
Altera Corporation
October 2007
Refer to the DSP Blocks in Stratix II GX Devices chapter in volume 2 of the
Stratix II GX Device Handbook for more information on DSP blocks.
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Table 2–23. DSP Block Signal Sources and Destinations
LAB Row at
Interface
Control Signals Generated
Data Inputs
Data Outputs
0
clock0
aclr0
ena0
mult01_saturate
addnsub1_round/
accum_round
addnsub1
signa
sourcea
sourceb
A1[17..0]
B1[17..0]
OA[17..0]
OB[17..0]
1
clock1
aclr1
ena1
accum_saturate
mult01_round
accum_sload
sourcea
sourceb
mode0
A2[17..0]
B2[17..0]
OC[17..0]
OD[17..0]
2
clock2
aclr2
ena2
mult23_saturate
addnsub3_round/
accum_round
addnsub3
sign_b
sourcea
sourceb
A3[17..0]
B3[17..0]
OE[17..0]
OF[17..0]
3
clock3
aclr3
ena3
accum_saturate
mult23_round
accum_sload
sourcea
sourceb
mode1
A4[17..0]
B4[17..0]
OG[17..0]
OH[17..0]
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October 2007
Stratix II GX Architecture
PLLs and Clock
Networks
Stratix II GX devices provide a hierarchical clock structure and multiple
phase-locked loops (PLLs) with advanced features. The large number of
clocking resources in combination with the clock synthesis precision
provided by enhanced and fast PLLs provides a complete clock
management solution.
Global and Hierarchical Clocking
Stratix II GX devices provide 16 dedicated global clock networks and
32 regional clock networks (eight per device quadrant). These clocks are
organized into a hierarchical clock structure that allows for up to 24 clocks
per device region with low skew and delay. This hierarchical clocking
scheme provides up to 48 unique clock domains in Stratix II GX devices.
There are 12 dedicated clock pins to drive either the global or regional
clock networks. Four clock pins drive each side of the device, as shown in
Figures 2–61 and 2–62. Internal logic and enhanced and fast PLL outputs
can also drive the global and regional clock networks. Each global and
regional clock has a clock control block, which controls the selection of the
clock source and dynamically enables or disables the clock to reduce
power consumption. Table 2–24 shows global and regional clock features.
Table 2–24. Global and Regional Clock Features
Feature
Global Clocks
Regional Clocks
Number per device
16
32
Number available per
quadrant
16
8
Clock pins, PLL outputs,
core routings,
inter-transceiver clocks
Clock pins, PLL outputs,
core routings,
inter-transceiver clocks
Dynamic clock source
selection
v
—
Dynamic enable/disable
v
v
Sources
Global Clock Network
These clocks drive throughout the entire device, feeding all device
quadrants. The global clock networks can be used as clock sources for all
resources in the device IOEs, ALMs, DSP blocks, and all memory blocks.
These resources can also be used for control signals, such as clock enables
and synchronous or asynchronous clears fed from the external pin. The
global clock networks can also be driven by internal logic for internally
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October 2007
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PLLs and Clock Networks
generated global clocks and asynchronous clears, clock enables, or other
control signals with large fanout. Figure 2–61 shows the 12 dedicated CLK
pins driving global clock networks.
Figure 2–61. Global Clocking
CLK[15..12]
Global Clock [15..0]
CLK[3..0]
Global Clock [15..0]
CLK[7..4]
Regional Clock Network
There are eight regional clock networks (RCLK[7..0]) in each quadrant
of the Stratix II GX device that are driven by the dedicated
CLK[15..12]and CLK[7..0] input pins, by PLL outputs, or by internal
logic. The regional clock networks provide the lowest clock delay and
skew for logic contained in a single quadrant. The CLK pins
symmetrically drive the RCLK networks in a particular quadrant, as
shown in Figure 2–62.
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Stratix II GX Architecture
Figure 2–62. Regional Clocks
CLK[15..12]
11 5
7
CLK[3..0]
RCLK
[31..28]
RCLK
[27..24]
RCLK
[3..0]
RCLK
[23..20]
RCLK
[7..4]
RCLK
[19..16]
Stratix II GX
Transceiver
Block
1
2
8
RCLK
[11..8]
Stratix II GX
Transceiver
Block
RCLK
[15..12]
12 6
CLK[7..4]
Dual-Regional Clock Network
A single source (CLK pin or PLL output) can generate a dual-regional
clock by driving two regional clock network lines in adjacent quadrants
(one from each quadrant), which allows logic that spans multiple
quadrants to utilize the same low skew clock. The routing of this clock
signal on an entire side has approximately the same speed but slightly
higher clock skew when compared with a clock signal that drives a single
quadrant. Internal logic-array routing can also drive a dual-regional
clock. Clock pins and enhanced PLL outputs on the top and bottom can
drive horizontal dual-regional clocks. Clock pins and fast PLL outputs on
the left and right can drive vertical dual-regional clocks, as shown in
Figure 2–63. Corner PLLs cannot drive dual-regional clocks.
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October 2007
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PLLs and Clock Networks
Figure 2–63. Dual-Regional Clocks
Clock Pins or PLL Clock Outputs
Can Drive Dual-Regional Network
Clock Pins or PLL Clock
Outputs Can Drive
Dual-Regional Network
CLK[15..12]
CLK[3..0]
CLK[15..12]
CLK[3..0]
PLLs
PLLs
CLK[7..4]
CLK[7..4]
Combined Resources
Within each quadrant, there are 24 distinct dedicated clocking resources
consisting of 16 global clock lines and 8 regional clock lines. Multiplexers
are used with these clocks to form buses to drive LAB row clocks, column
IOE clocks, or row IOE clocks. Another multiplexer is used at the LAB
level to select three of the six row clocks to feed the ALM registers in the
LAB (see Figure 2–64).
Figure 2–64. Hierarchical Clock Networks per Quadrant
Clocks Available
to a Quadrant
or Half-Quadrant
Column I/O Cell
IO_CLK[7..0]
Global Clock Network [15..0]
Clock [23..0]
Lab Row Clock [5..0]
Regional Clock Network [7..0]
Row I/O Cell
IO_CLK[7..0]
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Stratix II GX Architecture
IOE clocks have row and column block regions that are clocked by 8 I/O
clock signals chosen from the 24 quadrant clock resources. Figures 2–65
and 2–66 show the quadrant relationship to the I/O clock regions.
Figure 2–65. EP2SGX30 Device I/O Clock Groups
IO_CLKA[7..0]
IO_CLKB[7..0]
8
8
I/O Clock Regions
8
24 Clocks in
the Quadrant
24 Clocks in
the Quadrant
IO_CLKH[7..0]
IO_CLKC[7..0]
8
8
IO_CLKG[7..0]
IO_CLKD[7..0]
24 Clocks in
the Quadrant
24 Clocks in
the Quadrant
8
8
8
IO_CLKF[7..0]
Altera Corporation
October 2007
IO_CLKE[7..0]
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PLLs and Clock Networks
Figure 2–66. EP2SGX60, EP2SGX90 and EP2SGX130 Device I/O Clock Groups
IO_CLKA[7..0]
IO_CLKB[7..0]
8
IO_CLKC[7..0]
8
IO_CLKD[7..0]
8
8
I/O Clock Regions
8
8
IO_CLKE[7..0]
IO_CLKP[7..0]
24 Clocks in the
Quadrant
24 Clocks in the
Quadrant
8
8
IO_CLKF[7..0]
IO_CLKO[7..0]
8
8
IO_CLKN[7..0]
IO_CLKG[7..0]
24 Clocks in the
Quadrant
24 Clocks in the
Quadrant
8
8
IO_CLKH[7..0]
IO_CLKM[7..0]
8
8
IO_CLKL[7..0]
8
IO_CLKK[7..0]
8
IO_CLKJ[7..0]
IO_CLKI[7..0]
You can use the Quartus II software to control whether a clock input pin
drives either a global, regional, or dual-regional clock network. The
Quartus II software automatically selects the clocking resources if not
specified.
Clock Control Block
Each global clock, regional clock, and PLL external clock output has its
own clock control block. The control block has two functions:
■
■
Clock source selection (dynamic selection for global clocks)
Clock power-down (dynamic clock enable or disable)
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Stratix II GX Architecture
Figures 2–67 through 2–69 show the clock control block for the global
clock, regional clock, and PLL external clock output, respectively.
Figure 2–67. Global Clock Control Blocks
CLKp
Pins
PLL Counter
Outputs
CLKSELECT[1..0]
(1)
2
2
CLKn
Pin
2
Internal
Logic
Static Clock Select (2)
This multiplexer supports
User-Controllable
Dynamic Switching
Enable/
Disable
Internal
Logic
GCLK
Notes to Figure 2–67:
(1)
(2)
These clock select signals can be dynamically controlled through internal logic when the device is operating in user
mode.
These clock select signals can only be set through a configuration file (SRAM Object File [.sof] or Programmer Object
File [.pof]) and cannot be dynamically controlled during user mode operation.
Figure 2–68. Regional Clock Control Blocks
CLKp
Pin
PLL Counter
Outputs
CLKn
Pin (2)
2
Internal
Logic
Static Clock Select (1)
Enable/
Disable
Internal
Logic
RCLK
Notes to Figure 2–68:
(1)
(2)
These clock select signals can only be set through a configuration file (.sof or .pof) and cannot be dynamically
controlled during user mode operation.
Only the CLKn pins on the top and bottom of the device feed to regional clock select.
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October 2007
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PLLs and Clock Networks
Figure 2–69. External PLL Output Clock Control Blocks
PLL Counter
Outputs (c[5..0])
6
Static Clock Select (1)
Enable/
Disable
Internal
Logic
IOE (2)
Internal
Logic
Static Clock
Select (1)
PLL_OUT
Pin
Notes to Figure 2–69:
(1)
(2)
These clock select signals can only be set through a configuration file (.sof or .pof) and cannot be dynamically
controlled during user mode operation.
The clock control block feeds to a multiplexer within the PLL_OUT pin’s IOE. The PLL_OUT pin is a dual-purpose
pin. Therefore, this multiplexer selects either an internal signal or the output of the clock control block.
For the global clock control block, the clock source selection can be
controlled either statically or dynamically. You have the option of
statically selecting the clock source by using the Quartus II software to set
specific configuration bits in the configuration file (.sof or .pof) or you can
control the selection dynamically by using internal logic to drive the
multiplexer select inputs. When selecting statically, the clock source can
be set to any of the inputs to the select multiplexer. When selecting the
clock source dynamically, you can either select between two PLL outputs
(such as the C0 or C1 outputs from one PLL), between two PLLs (such as
the C0/C1 clock output of one PLL or the C0/C1 c1ock output of the other
PLL), between two clock pins (such as CLK0 or CLK1), or between a
combination of clock pins or PLL outputs.
For the regional and PLL_OUT clock control block, the clock source
selection can only be controlled statically using configuration bits. Any of
the inputs to the clock select multiplexer can be set as the clock source.
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October 2007
Stratix II GX Architecture
The Stratix II GX clock networks can be disabled (powered down) by both
static and dynamic approaches. When a clock net is powered down, all
the logic fed by the clock net is in an off-state, thereby reducing the overall
power consumption of the device. The global and regional clock
networks can be powered down statically through a setting in the
configuration file (.sof or .pof). Clock networks that are not used are
automatically powered down through configuration bit settings in the
configuration file generated by the Quartus II software. The dynamic
clock enable and disable feature allows the internal logic to control power
up and down synchronously on GCLK and RCLK nets and PLL_OUT pins.
This function is independent of the PLL and is applied directly on the
clock network or PLL_OUT pin, as shown in Figures 2–67 through 2–69.
Enhanced and Fast PLLs
Stratix II GX devices provide robust clock management and synthesis
using up to four enhanced PLLs and four fast PLLs. These PLLs increase
performance and provide advanced clock interfacing and clock frequency
synthesis. With features such as clock switchover, spread spectrum
clocking, reconfigurable bandwidth, phase control, and reconfigurable
phase shifting, the Stratix II GX device’s enhanced PLLs provide you with
complete control of clocks and system timing. The fast PLLs provide
general purpose clocking with multiplication and phase shifting as well
as high-speed outputs for high-speed differential I/O support. Enhanced
and fast PLLs work together with the Stratix II GX high-speed I/O and
advanced clock architecture to provide significant improvements in
system performance and bandwidth.
Altera Corporation
October 2007
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Stratix II GX Device Handbook, Volume 1
PLLs and Clock Networks
The Quartus II software enables the PLLs and their features without
requiring any external devices. Table 2–25 shows the PLLs available for
each Stratix II GX device and their type.
Table 2–25. Stratix II GX Device PLL Availability
Device
Notes (1), (2)
Fast PLLs
1
2
3 (3) 4 (3)
7
EP2SGX30
v
v
EP2SGX60
v
v
v
EP2SGX90
v
v
v
EP2SGX130
v
v
v
Enhanced PLLs
8
9 (3)
10 (3)
5
6
11
12
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
Notes to Table 2–25:
(1)
(2)
(3)
EP2SGX30C/D and EP2SGX60C/D devices only have two fast PLLs (1 and 2), but the connectivity from these two
PLLs to the global and regional clock networks remains the same as shown. The EP2S60C/D devices only have
two enhanced PLLs (5 and 6).
The global or regional clocks in a fast PLL’s quadrant can drive the fast PLL input. A dedicated clock input pin or
other PLL must drive the global or regional source. The source cannot be driven by internally generated logic
before driving the fast PLL.
PLLs 3, 4, 9, and 10 are not available in Stratix II GX devices. However, these PLLs are listed in Table 2–25 because
the Stratix II GX PLL numbering scheme is consistent with Stratix and Stratix II devices.
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October 2007
Stratix II GX Architecture
Table 2–26 shows the enhanced PLL and fast PLL features in Stratix II GX
devices.
Table 2–26. Stratix II GX PLL Features
Feature
Enhanced PLL
Fast PLL
Clock multiplication and division
m/(n × post-scale counter) (1)
m/(n × post-scale counter) (2)
Down to 125-ps increments (3), (4)
Down to 125-ps increments (3), (4)
Clock switchover
v
v (5)
PLL reconfiguration
v
v
Reconfigurable bandwidth
v
v
Spread spectrum clocking
v
Programmable duty cycle
v
v
Number of internal clock outputs
6
4
Number of external clock outputs
Three differential/six single-ended
(6)
Number of feedback clock inputs
One single-ended or differential
(7), (8)
Phase shift
Notes to Table 2–26:
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
For enhanced PLLs, m, n range from 1 to 256 and post-scale counters range from 1 to 512 with 50% duty cycle.
For fast PLLs, m, and post-scale counters range from 1 to 32. The n counter ranges from 1 to 4.
The smallest phase shift is determined by the voltage controlled oscillator (VCO) period divided by 8.
For degree increments, Stratix II GX devices can shift all output frequencies in increments of at least 45. Smaller
degree increments are possible depending on the frequency and divide parameters.
Stratix II GX fast PLLs only support manual clock switchover.
Fast PLLs can drive to any I/O pin as an external clock. For high-speed differential I/O pins, the device uses a data
channel to generate txclkout.
If the feedback input is used, you will lose one (or two, if fBIN is differential) external clock output pin.
Every Stratix II GX device has at least two enhanced PLLs with one single-ended or differential external feedback
input per PLL.
Altera Corporation
October 2007
2–99
Stratix II GX Device Handbook, Volume 1
PLLs and Clock Networks
Figure 2–70 shows a top-level diagram of the Stratix II GX device and PLL
floorplan.
Figure 2–70. PLL Locations
CLK[15..12]
FPLL7CLK
7
CLK[3..0]
1
2
11
5
12
6
PLLs
FPLL8CLK
8
CLK[7..4]
Figures 2–71 and 2–72 shows global and regional clocking from the fast
PLL outputs and the side clock pins. The connections to the global and
regional clocks from the fast PLL outputs, internal drivers, and the CLK
pins on the left side of the device are shown in Table 2–27.
2–100
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Altera Corporation
October 2007
Stratix II GX Architecture
Figure 2–71. Global and Regional Clock Connections from Center Clock Pins and Fast PLL Outputs Notes (1),
(2)
C0
CLK0
Fast
PLL 1
CLK1
C1
C2
C3
Logic Array
Signal Input
To Clock
Network
C0
Fast
PLL 2
CLK2
CLK3
C1
C2
C3
RCLK0
RCLK2
RCLK1
RCLK4
RCLK3
RCLK6
RCLK5
RCLK7
GCLK0
GCLK1
GCLK2
GCLK3
Notes to Figure 2–71:
(1)
(2)
EP2SGX30C/D and P2SGX60C/D devices only have two fast PLLs (1 and 2) and two Enhanced PLLs (5 and 6), but
the connectivity from these PLLs to the global and regional clock networks remains the same as shown.
The global or regional clocks in a fast PLL’s quadrant can drive the fast PLL input. A dedicated clock input pin or
other PLL must drive the global or regional source. The source cannot be driven by internally generated logic before
driving the fast PLL.
Altera Corporation
October 2007
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Stratix II GX Device Handbook, Volume 1
PLLs and Clock Networks
Figure 2–72. Global and Regional Clock Connections from Corner Clock Pins and Fast PLL
Outputs Notes (1), (2)
RCLK1
RCLK3
RCLK0
RCLK2
RCLK4
RCLK6
C0
Fast
PLL 7
C1
C2
C3
C0
Fast
PLL 8
C1
C2
C3
RCLK5
GCLK0
RCLK7
GCLK2
GCLK1
GCLK3
Notes to Figure 2–72:
(1)
(2)
The global or regional clocks in a fast PLL’s quadrant can drive the fast PLL input. A dedicated clock input pin or
other PLL must drive the global or regional source. The source cannot be driven by internally generated logic before
driving the fast PLL.
EP2SGX30C/D and EP2SGX60C/D devices only have two fast PLLs (1 and 2); they do not contain corner fast
PLLs.
RCLK7
RCLK6
RCLK5
RCLK4
v
RCLK3
v
RCLK2
v
RCLK1
v
CLK1p
RCLK0
CLK1
CLK0p
CLK3
CLK0
Left Side Global and Regional
Clock Network Connectivity
CLK2
Table 2–27. Global and Regional Clock Connections from Left Side Clock Pins and Fast PLL Outputs
(Part 1 of 3)
Clock pins
CLK2p
v
v
v
v
v
v
v
v
v
v
CLK3p
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v
v
Altera Corporation
October 2007
Stratix II GX Architecture
GCLKDRV2
v
v
GCLKDRV3
v
v
RCLK7
v
RCLK6
v
RCLK5
GCLKDRV1
RCLK4
v
RCLK3
v
RCLK2
GCLKDRV0
RCLK1
CLK3
CLK1
CLK2
CLK0
Left Side Global and Regional
Clock Network Connectivity
RCLK0
Table 2–27. Global and Regional Clock Connections from Left Side Clock Pins and Fast PLL Outputs
(Part 2 of 3)
Drivers from internal logic
v
RCLKDRV0
v
v
RCLKDRV1
v
v
RCLKDRV2
v
v
RCLKDRV3
v
RCLKDRV4
v
v
v
RCLKDRV5
v
v
RCLKDRV6
v
v
RCLKDRV7
v
PLL 1 outputs
c0
v
v
c1
v
v
v
v
v
c2
v
v
c3
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
PLL 2 outputs
c0
v
v
c1
v
v
v
c2
v
v
c3
v
v
c0
v
v
c1
v
v
v
v
v
v
v
v
v
v
v
v
v
PLL 7 outputs
c2
v
v
v
v
v
v
v
v
v
v
c3
Altera Corporation
October 2007
v
v
2–103
Stratix II GX Device Handbook, Volume 1
PLLs and Clock Networks
RCLK7
RCLK6
v
RCLK5
v
RCLK4
c1
RCLK3
v
RCLK2
v
RCLK1
CLK3
c0
RCLK0
CLK2
CLK1
Left Side Global and Regional
Clock Network Connectivity
CLK0
Table 2–27. Global and Regional Clock Connections from Left Side Clock Pins and Fast PLL Outputs
(Part 3 of 3)
PLL 8 outputs
c2
v
v
c3
v
v
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v
v
v
v
v
v
v
v
Altera Corporation
October 2007
Stratix II GX Architecture
Figure 2–73 shows the global and regional clocking from enhanced PLL
outputs and top and bottom CLK pins.
Figure 2–73. Global and Regional Clock Connections from Top and Bottom Clock Pins and Enhanced PLL
Outputs Notes (1), (2)
CLK15
CLK13
CLK12
(2)
(2)
PLL5_FB
CLK14
PLL11_FB
PLL 11
PLL 5
c0 c1 c2 c3 c4 c5
c0 c1 c2 c3 c4 c5
PLL5_OUT[2..0]p
PLL5_OUT[2..0]n
RCLK31
RCLK30
RCLK29
RCLK28
PLL11_OUT[2..0]p
PLL11_OUT[2..0]n
Regional
Clocks
RCLK27
RCLK26
RCLK25
RCLK24
G15
G14
G13
G12
Global
Clocks
Regional
Clocks
G4
G5
G6
G7
RCLK8
RCLK9
RCLK10
RCLK11
RCLK12
RCLK13
RCLK14
RCLK15
PLL6_OUT[2..0]p
PLL6_OUT[2..0]n
PLL12_OUT[2..0]p
PLL12_OUT[2..0]n
c0 c1 c2 c3 c4 c5
c0 c1 c2 c3 c4 c5
PLL 12
PLL 6
PLL12_FB
(2)
CLK4
CLK6
CLK5
CLK7
PLL6_FB
(2)
Notes to Figure 2–73:
(1)
(2)
EP2SGX30C/D and EP2SGX60C/D devices only have two enhanced PLLs (5 and 6), but the connectivity from these
two PLLs to the global and regional clock networks remains the same as shown.
If the design uses the feedback input, you will lose one (or two, if FBIN is differential) external clock output pin.
Altera Corporation
October 2007
2–105
Stratix II GX Device Handbook, Volume 1
PLLs and Clock Networks
The connections to the global and regional clocks from the top clock pins
and enhanced PLL outputs are shown in Table 2–28. The connections to
the clocks from the bottom clock pins are shown in Table 2–29.
CLK14p
v
v
v
CLK15p
v
v
v
RCLK31
v
RCLK30
v
RCLK29
v
RCLK28
CLK13p
RCLK27
v
RCLK26
v
RCLK25
CLK13
v
CLK15
CLK12
CLK12p
CLK14
DLLCLK
Top Side Global and
Regional Clock Network
Connectivity
RCLK24
Table 2–28. Global and Regional Clock Connections from Top Clock Pins and Enhanced PLL Outputs
(Part 1 of 2)
Clock pins
v
v
v
CLK12n
v
v
v
v
v
v
CLK13n
v
v
v
v
CLK14n
v
v
v
v
CLK15n
v
v
v
Drivers from internal logic
v
GCLKDRV0
v
GCLKDRV1
v
GCLKDRV2
v
GCLKDRV3
v
RCLKDRV0
v
v
RCLKDRV1
v
v
RCLKDRV2
v
v
RCLKDRV3
v
RCLKDRV4
v
v
v
RCLKDRV5
v
v
RCLKDRV6
v
v
RCLKDRV7
v
Enhanced PLL5 outputs
c0
v
v
v
c1
v
v
v
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v
v
v
v
Altera Corporation
October 2007
Stratix II GX Architecture
v
c4
v
c5
v
v
v
v
v
v
RCLK31
v
v
RCLK30
v
RCLK29
c3
RCLK28
v
RCLK27
v
RCLK26
v
RCLK25
CLK15
c2
RCLK24
CLK14
CLK13
CLK12
Top Side Global and
Regional Clock Network
Connectivity
DLLCLK
Table 2–28. Global and Regional Clock Connections from Top Clock Pins and Enhanced PLL Outputs
(Part 2 of 2)
v
v
v
v
v
v
Enhanced PLL 11 outputs
c0
v
v
c1
v
v
v
v
v
c2
v
v
c3
v
v
v
v
v
v
c4
v
v
v
c5
v
v
v
v
v
v
v
v
v
v
v
RCLK15
v
CLK7p
RCLK14
v
RCLK13
v
RCLK12
v
CLK6p
RCLK11
v
RCLK10
v
RCLK9
CLK5
v
CLK5p
CLK7
CLK4
CLK4p
CLK6
DLLCLK
Bottom Side Global and
Regional Clock Network
Connectivity
RCLK8
Table 2–29. Global and Regional Clock Connections from Bottom Clock Pins and Enhanced PLL
Outputs
(Part 1 of 2)
Clock pins
CLK4n
v
v
v
v
v
v
v
v
v
CLK5n
v
v
v
v
CLK7n
v
v
v
CLK6n
v
v
v
v
Drivers from internal logic
GCLKDRV0
GCLKDRV1
Altera Corporation
October 2007
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v
2–107
Stratix II GX Device Handbook, Volume 1
PLLs and Clock Networks
RCLK15
RCLK14
RCLK13
RCLK12
RCLK11
RCLK10
RCLK9
RCLK8
CLK7
CLK6
CLK5
CLK4
Bottom Side Global and
Regional Clock Network
Connectivity
DLLCLK
Table 2–29. Global and Regional Clock Connections from Bottom Clock Pins and Enhanced PLL
Outputs
(Part 2 of 2)
v
GCLKDRV2
v
GCLKDRV3
v
RCLKDRV0
v
v
RCLKDRV1
v
v
RCLKDRV2
v
v
RCLKDRV3
v
RCLKDRV4
v
v
v
RCLKDRV5
v
v
RCLKDRV6
v
v
RCLKDRV7
v
Enhanced PLL 6 outputs
c0
v
v
v
v
c1
v
v
v
c2
v
v
v
c3
v
v
v
c4
v
c5
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
v
Enhanced PLL 12 outputs
c0
v
v
c1
v
v
v
v
c2
v
v
c3
v
v
c4
c5
2–108
Stratix II GX Device Handbook, Volume 1
v
v
v
v
v
v
v
v
v
v
v
v
v
v
Altera Corporation
October 2007
Stratix II GX Architecture
Enhanced PLLs
Stratix II GX devices contain up to four enhanced PLLs with advanced
clock management features. These features include support for external
clock feedback mode, spread-spectrum clocking, and counter cascading.
Figure 2–74 shows a diagram of the enhanced PLL.
Figure 2–74. Stratix II GX Enhanced PLL
Note (1)
From Adjacent PLL
VCO Phase Selection
Selectable at Each
PLL Output Port
Clock
Switchover
Circuitry
Post-Scale
Counters
Spread
Spectrum
Phase Frequency
Detector
/c0
INCLK[3..0]
/c1
4
/n
PFD
Charge
Pump
Loop
Filter
8
VCO
Global or
Regional
Clock
4
Global
Clocks
8
Regional
Clocks
/c2
6
/c3
6
/m
I/O Buffers (3)
/c4
(2)
/c5
Lock Detect
& Filter
FBIN
to I/O or general
routing
VCO Phase Selection
Affecting All Outputs
Shaded Portions of the
PLL are Reconfigurable
Notes to Figure 2–74:
(1)
(2)
(3)
(4)
Each clock source can come from any of the four clock pins that are physically located on the same side of the device
as the PLL.
If the feedback input is used, you will lose one (or two, if FBIN is differential) external clock output pin.
Each enhanced PLL has three differential external clock outputs or six single-ended external clock outputs.
The global or regional clock input can be driven by an output from another PLL, a pin-driven dedicated global or
regional clock, or through a clock control block provided the clock control block is fed by an output from another
PLL or a pin-driven dedicated global or regional clock. An internally generated global signal cannot drive the PLL.
Fast PLLs
Stratix II GX devices contain up to four fast PLLs with high-speed serial
interfacing ability. The fast PLLs offer high-speed outputs to manage the
high-speed differential I/O interfaces. Figure 2–75 shows a diagram of
the fast PLL.
Altera Corporation
October 2007
2–109
Stratix II GX Device Handbook, Volume 1
I/O Structure
Figure 2–75. Stratix II GX Device Fast PLL
Clock
Switchover
Circuitry (4)
Global or
regional clock (1)
Clock
Input
VCO Phase Selection
Selectable at each PLL
Output Port
Phase
Frequency
Detector
Post-Scale
Counters
diffioclk0 (2)
load_en0 (3)
÷c0
÷n
4
PFD
Charge
Pump
Loop
Filter
VCO
÷k
8
load_en1 (3)
÷c1
diffioclk1 (2)
4
Global clocks
÷c2
4
Global or
regional clock (1)
8
Regional clocks
÷c3
÷m
8
to DPA block
Shaded Portions of the
PLL are Reconfigurable
Notes to Figure 2–75:
(1)
(2)
(3)
(4)
The global or regional clock input can be driven by an output from another PLL, a pin-driven dedicated global or
regional clock, or through a clock control block provided the clock control block is fed by an output from another
PLL or a pin-driven dedicated global or regional clock. An internally generated global signal cannot drive the PLL.
In high-speed differential I/O support mode, this high-speed PLL clock feeds the serializer/deserializer (SERDES)
circuitry. Stratix II GX devices only support one rate of data transfer per fast PLL in high-speed differential I/O
support mode.
This signal is a differential I/O SERDES control signal.
Stratix II GX fast PLLs only support manual clock switchover.
f
I/O Structure
Refer to the PLLs in Stratix II & Stratix II GX Devices chapter in volume 2
of the Stratix II GX Device Handbook for more information on enhanced
and fast PLLs. Refer to “High-Speed Differential I/O with DPA Support”
on page 2–136 for more information on high-speed differential I/O
support.
The Stratix II GX IOEs provide many features, including:
■
■
■
■
■
■
■
■
■
■
■
■
Dedicated differential and single-ended I/O buffers
3.3-V, 64-bit, 66-MHz PCI compliance
3.3-V, 64-bit, 133-MHz PCI-X 1.0 compliance
Joint Test Action Group (JTAG) boundary-scan test (BST) support
On-chip driver series termination
On-chip termination for differential standards
Programmable pull-up during configuration
Output drive strength control
Tri-state buffers
Bus-hold circuitry
Programmable pull-up resistors
Programmable input and output delays
2–110
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Altera Corporation
October 2007
Stratix II GX Architecture
■
■
■
Open-drain outputs
DQ and DQS I/O pins
Double data rate (DDR) registers
The IOE in Stratix II GX devices contains a bidirectional I/O buffer, six
registers, and a latch for a complete embedded bidirectional single data
rate or DDR transfer. Figure 2–76 shows the Stratix II GX IOE structure.
The IOE contains two input registers (plus a latch), two output registers,
and two output enable registers. You can use both input registers and the
latch to capture DDR input and both output registers to drive DDR
outputs. Additionally, you can use the output enable (OE) register for fast
clock-to-output enable timing. The negative edge-clocked OE register is
used for DDR SDRAM interfacing. The Quartus II software automatically
duplicates a single OE register that controls multiple output or
bidirectional pins.
Altera Corporation
October 2007
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Stratix II GX Device Handbook, Volume 1
I/O Structure
Figure 2–76. Stratix II GX IOE Structure
Logic Array
OE Register
OE
D
Q
OE Register
D
Q
Output Register
Output A
D
Q
CLK
Output Register
Output B
D
Q
Input Register
D
Q
Input A
Input B
Input Register
D
Q
Input Latch
D
Q
ENA
The IOEs are located in I/O blocks around the periphery of the
Stratix II GX device. There are up to four IOEs per row I/O block and four
IOEs per column I/O block. The row I/O blocks drive row, column, or
direct link interconnects. The column I/O blocks drive column
interconnects.
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Stratix II GX Architecture
Figure 2–77 shows how a row I/O block connects to the logic array.
Figure 2–77. Row I/O Block Connection to the Interconnect
R4 & R24
Interconnects
C4 Interconnect
I/O Block Local
Interconnect
32 Data & Control
Signals from
Logic Array (1)
32
LAB
Horizontal
I/O Block
io_dataina[3..0]
io_datainb[3..0]
Direct Link
Interconnect
to Adjacent LAB
Direct Link
Interconnect
to Adjacent LAB
io_clk[7:0]
LAB Local
Interconnect
Horizontal I/O
Block Contains
up to Four IOEs
Note to Figure 2–77:
(1)
The 32 data and control signals consist of eight data out lines: four lines each for DDR applications
io_dataouta[3..0] and io_dataoutb[3..0], four output enables io_oe[3..0], four input clock enables
io_ce_in[3..0], four output clock enables io_ce_out[3..0], four clocks io_clk[3..0], four asynchronous
clear and preset signals io_aclr/apreset[3..0], and four synchronous clear and preset signals
io_sclr/spreset[3..0].
Altera Corporation
October 2007
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I/O Structure
Figure 2–78 shows how a column I/O block connects to the logic array.
Figure 2–78. Column I/O Block Connection to the Interconnect
32 Data &
Control Signals
from Logic Array (1)
Vertical I/O
Block Contains
up to Four IOEs
Vertical I/O Block
32
IO_dataina[3..0]
IO_datainb[3..0]
io_clk[7..0]
I/O Block
Local Interconnect
R4 & R24
Interconnects
LAB
LAB Local
Interconnect
LAB
LAB
C4 & C16
Interconnects
Note to Figure 2–78:
(1)
The 32 data and control signals consist of eight data out lines: four lines each for DDR applications
io_dataouta[3..0] and io_dataoutb[3..0], four output enables io_oe[3..0], four input clock enables
io_ce_in[3..0], four output clock enables io_ce_out[3..0], four clocks io_clk[3..0], four asynchronous
clear and preset signals io_aclr/apreset[3..0], and four synchronous clear and preset signals
io_sclr/spreset[3..0].
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There are 32 control and data signals that feed each row or column I/O
block. These control and data signals are driven from the logic array. The
row or column IOE clocks, io_clk[7..0], provide a dedicated routing
resource for low-skew, high-speed clocks. I/O clocks are generated from
global or regional clocks. Refer to “PLLs and Clock Networks” on
page 2–89 for more information.
Figure 2–79 illustrates the signal paths through the I/O block.
Figure 2–79. Signal Path Through the I/O Block
Row or Column
io_clk[7..0]
To Logic
Array
To Other
IOEs
io_dataina
io_datainb
oe
ce_in
io_oe
ce_out
io_ce_in
io_ce_out
Control
Signal
Selection
aclr/apreset
IOE
sclr/spreset
io_aclr
From Logic
Array
clk_in
io_sclr
clk_out
io_clk
io_dataouta
io_dataoutb
Each IOE contains its own control signal selection for the following
control signals: oe, ce_in, ce_out, aclr/apreset, sclr/spreset,
clk_in, and clk_out. Figure 2–80 illustrates the control signal
selection.
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October 2007
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Figure 2–80. Control Signal Selection per IOE
Note (1)
Dedicated I/O
Clock [7..0]
Local
Interconnect
io_oe
Local
Interconnect
io_sclr
Local
Interconnect
io_aclr
Local
Interconnect
io_ce_out
Local
Interconnect
io_ce_in
Local
Interconnect
io_clk
ce_out
clk_out
clk_in
ce_in
sclr/spreset
aclr/apreset
oe
Note to Figure 2–80:
(1)
Control signals ce_in, ce_out, aclr/apreset, sclr/spreset, and oe can be global signals even though their
control selection multiplexers are not directly fed by the ioe_clk[7..0] signals. The ioe_clk signals can drive
the I/O local interconnect, which then drives the control selection multiplexers.
In normal bidirectional operation, you can use the input register for input
data requiring fast setup times. The input register can have its own clock
input and clock enable separate from the OE and output registers. The
output register can be used for data requiring fast clock-to-output
performance. You can use the OE register for fast clock-to-output enable
timing. The OE and output register share the same clock source and the
same clock enable source from local interconnect in the associated LAB,
dedicated I/O clocks, and the column and row interconnects. Figure 2–81
shows the IOE in bidirectional configuration.
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Figure 2–81. Stratix II GX IOE in Bidirectional I/O Configuration
Note (1)
ioe_clk[7..0]
Column, Row,
or Local
Interconnect
oe
OE Register
D
Q
clkout
ENA
CLRN/PRN
ce_out
OE Register
tCO Delay
VCCIO
PCI Clamp (2)
VCCIO
Programmable
Pull-Up
Resistor
aclr/apreset
Chip-Wide Reset
Output Register
D
sclr/spreset
Q
Output
Pin Delay
On-Chip
Termination
Drive Strength Control
ENA
Open-Drain Output
CLRN/PRN
Input Pin to
Logic Array Delay
Input Register
clkin
ce_in
D
Input Pin to
Input Register Delay
Bus-Hold
Circuit
Q
ENA
CLRN/PRN
Notes to Figure 2–81:
(1)
(2)
All input signals to the IOE can be inverted at the IOE.
The optional PCI clamp is only available on column I/O pins.
The Stratix II GX device IOE includes programmable delays that can be
activated to ensure input IOE register-to-logic array register transfers,
input pin-to-logic array register transfers, or output IOE register-to-pin
transfers.
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October 2007
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A path in which a pin directly drives a register can require the delay to
ensure zero hold time, whereas a path in which a pin drives a register
through combinational logic may not require the delay. Programmable
delays exist for decreasing input-pin-to-logic-array and IOE input
register delays. The Quartus II Compiler can program these delays to
automatically minimize setup time while providing a zero hold time.
Programmable delays can increase the register-to-pin delays for output
and/or output enable registers. Programmable delays are no longer
required to ensure zero hold times for logic array register-to-IOE register
transfers. The Quartus II Compiler can create the zero hold time for these
transfers. Table 2–30 shows the programmable delays for Stratix II GX
devices.
Table 2–30. Stratix II GX Programmable Delay Chain
Programmable Delays
Quartus II Logic Option
Input pin to logic array delay
Input delay from pin to internal cells
Input pin to input register delay
Input delay from pin to input register
Output pin delay
Delay from output register to output pin
Output enable register tCO delay
Delay to output enable pin
The IOE registers in Stratix II GX devices share the same source for clear
or preset. You can program preset or clear for each individual IOE. You
can also program the registers to power up high or low after
configuration is complete. If programmed to power up low, an
asynchronous clear can control the registers. If programmed to power up
high, an asynchronous preset can control the registers. This feature
prevents the inadvertent activation of another device’s active-low input
upon power-up. If one register in an IOE uses a preset or clear signal, all
registers in the IOE must use that same signal if they require preset or
clear. Additionally, a synchronous reset signal is available for the IOE
registers.
Double Data Rate I/O Pins
Stratix II GX devices have six registers in the IOE, which support DDR
interfacing by clocking data on both positive and negative clock edges.
The IOEs in Stratix II GX devices support DDR inputs, DDR outputs, and
bidirectional DDR modes. When using the IOE for DDR inputs, the two
input registers clock double rate input data on alternating edges. An
input latch is also used in the IOE for DDR input acquisition. The latch
holds the data that is present during the clock high times, allowing both
bits of data to be synchronous with the same clock edge (either rising or
falling). Figure 2–82 shows an IOE configured for DDR input. Figure 2–83
shows the DDR input timing diagram.
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Stratix II GX Architecture
Figure 2–82. Stratix II GX IOE in DDR Input I/O Configuration
Note (1)
ioe_clk[7..0]
Column, Row,
or Local
Interconnect
VCCIO
To DQS Logic
Block (3)
DQS Local
Bus (2)
PCI Clamp (4)
VCCIO
Programmable
Pull-Up
Resistor
On-Chip
Termination
Input Pin to
Input RegisterDelay
sclr/spreset
Input Register
D
Q
clkin
ce_in
ENA
CLRN/PRN
Bus-Hold
Circuit
aclr/apreset
Chip-Wide Reset
Latch
Input Register
D
Q
ENA
CLRN/PRN
D
Q
ENA
CLRN/PRN
Notes to Figure 2–82:
(1)
(2)
(3)
(4)
All input signals to the IOE can be inverted at the IOE.
This signal connection is only allowed on dedicated DQ function pins.
This signal is for dedicated DQS function pins only.
The optional PCI clamp is only available on column I/O pins.
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October 2007
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Figure 2–83. Input Timing Diagram in DDR Mode
Data at
input pin
B0
A0
B1
A1
B2
A2
B3
A3
B4
CLK
A0
A1
A2
A3
B0
B1
B2
B3
Input To
Logic Array
When using the IOE for DDR outputs, the two output registers are
configured to clock two data paths from ALMs on rising clock edges.
These output registers are multiplexed by the clock to drive the output
pin at a ×2 rate. One output register clocks the first bit out on the clock
high time, while the other output register clocks the second bit out on the
clock low time. Figure 2–84 shows the IOE configured for DDR output.
Figure 2–85 shows the DDR output timing diagram.
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Stratix II GX Architecture
Figure 2–84. Stratix II GX IOE in DDR Output I/O Configuration
Notes (1), (2)
ioe_clk[7..0]
Column, Row,
or Local
Interconnect
oe
OE Register
D
Q
clkout
ENA
CLRN/PRN
OE Register
tCO Delay
ce_out
aclr/apreset
VCCIO
PCI Clamp (3)
Chip-Wide Reset
OE Register
D
VCCIO
Q
sclr/spreset
ENA
CLRN/PRN
Used for
DDR, DDR2
SDRAM
Programmable
Pull-Up
Resistor
Output Register
D
Q
ENA
CLRN/PRN
Output Register
D
Output
Pin Delay
On-Chip
Termination
clk
Drive Strength
Control
Open-Drain Output
Q
ENA
CLRN/PRN
Bus-Hold
Circuit
Notes to Figure 2–84:
(1)
(2)
(3)
All input signals to the IOE can be inverted at the IOE.
The tri-state buffer is active low. The DDIO megafunction represents the tri-state buffer as active-high with an
inverter at the OE register data port.
The optional PCI clamp is only available on column I/O pins.
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October 2007
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Figure 2–85. Output Timing Diagram in DDR Mode
CLK
A1
A2
A3
A4
B1
B2
B3
B4
From Internal
Registers
B1
DDR output
A1
B2
A2
B3
A3
B4
A4
The Stratix II GX IOE operates in bidirectional DDR mode by combining
the DDR input and DDR output configurations. The
negative-edge-clocked OE register holds the OE signal inactive until the
falling edge of the clock to meet DDR SDRAM timing requirements.
External RAM Interfacing
In addition to the six I/O registers in each IOE, Stratix II GX devices also
have dedicated phase-shift circuitry for interfacing with external memory
interfaces, including DDR and DDR2 SDRAM, QDR II SRAM,
RLDRAM II, and SDR SDRAM. In every Stratix II GX device, the I/O
banks at the top (banks 3 and 4) and bottom (banks 7 and 8) of the device
support DQ and DQS signals with DQ bus modes of ×4, ×8/×9, ×16/×18,
or ×32/×36. Table 2–31 shows the number of DQ and DQS buses that are
supported per device.
Table 2–31. DQS and DQ Bus Mode Support
Device
EP2SGX30
EP2SGX60
Number of
×4 Groups
Number of
×8/×9 Groups
Number of
×16/×18
Groups
Number of
×32/×36
Groups
780-pin FineLine BGA
18
8
4
0
Package
780-pin FineLine BGA
18
8
4
0
1,152-pin FineLine BGA
36
18
8
4
1,152-pin FineLine BGA
36
18
8
4
1,508-pin FineLine BGA
36
18
8
4
EP2SGX130 1,508-pin FineLine BGA
36
18
8
4
EP2SGX90
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Stratix II GX Architecture
A compensated delay element on each DQS pin automatically aligns
input DQS synchronization signals with the data window of their
corresponding DQ data signals. The DQS signals drive a local DQS bus in
the top and bottom I/O banks. This DQS bus is an additional resource to
the I/O clocks and is used to clock DQ input registers with the DQS
signal.
The Stratix II GX device has two phase-shifting reference circuits, one on
the top and one on the bottom of the device. The circuit on the top controls
the compensated delay elements for all DQS pins on the top. The circuit
on the bottom controls the compensated delay elements for all DQS pins
on the bottom.
Each phase-shifting reference circuit is driven by a system reference clock,
which must have the same frequency as the DQS signal. Clock pins
CLK[15..12]p feed the phase circuitry on the top of the device and
clock pins CLK[7..4]p feed the phase circuitry on the bottom of the
device. In addition, PLL clock outputs can also feed the phase-shifting
reference circuits. Figure 2–86 shows the phase-shift reference circuit
control of each DQS delay shift on the top of the device. This same circuit
is duplicated on the bottom of the device.
Figure 2–86. DQS Phase-Shift Circuitry
Notes (1), (2)
From PLL 5 (4)
DQSn
Pin
DQS
Pin
DQSn
Pin
DQS
Pin
Δt
Δt
Δt
Δt
to IOE
to IOE
to IOE
to IOE
CLK[15..12]p (3)
DQS
Phase-Shift
Circuitry
DQS
Pin
DQSn
Pin
DQS
Pin
DQSn
Pin
Δt
Δt
Δt
Δt
to IOE
to IOE
to IOE
to IOE
DQS Logic
Blocks
Notes to Figure 2–86:
(1)
(2)
(3)
(4)
There are up to 18 pairs of DQS and DQSn pins available on the top or the bottom of the Stratix II GX device. There
are up to 10 pairs on the right side and 8 pairs on the left side of the DQS phase-shift circuitry.
The “t” module represents the DQS logic block.
Clock pins CLK[15..12]p feed the phase-shift circuitry on the top of the device and clock pins CLK[7..4]p feed
the phase circuitry on the bottom of the device. You can also use a PLL clock output as a reference clock to the
phaseshift circuitry.
You can only use PLL 5 to feed the DQS phase-shift circuitry on the top of the device and PLL 6 to feed the DQS
phase-shift circuitry on the bottom of the device.
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These dedicated circuits combined, with enhanced PLL clocking and
phase-shift ability, provide a complete hardware solution for interfacing
to high-speed memory.
f
For more information on external memory interfaces, refer to the
External Memory Interfaces in Stratix II & Stratix II GX Devices chapter in
volume 2 of the Stratix II GX Device Handbook.
Programmable Drive Strength
The output buffer for each Stratix II GX device I/O pin has a
programmable drive strength control for certain I/O standards. The
LVTTL, LVCMOS, SSTL, and HSTL standards have several levels of drive
strength that you can control. The default setting used in the Quartus II
software is the maximum current strength setting that is used to achieve
maximum I/O performance. For all I/O standards, the minimum setting
is the lowest drive strength that guarantees the IOH/IOL of the standard.
Using minimum settings provides signal slew rate control to reduce
system noise and signal overshoot.
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Stratix II GX Architecture
Table 2–32 shows the possible settings for the I/O standards with drive
strength control.
Table 2–32. Programmable Drive Strength Note (1)
IOH / IOL Current Strength
Setting (mA) for Column
I/O Pins
IOH / IOL Current Strength
Setting (mA) for Row
I/O Pins
3.3-V LVTTL
24, 20, 16, 12, 8, 4
12, 8, 4
3.3-V LVCMOS
I/O Standard
24, 20, 16, 12, 8, 4
8, 4
2.5-V LVTTL/LVCMOS
16, 12, 8, 4
12, 8, 4
1.8-V LVTTL/LVCMOS
12, 10, 8, 6, 4, 2
8, 6, 4, 2
8, 6, 4, 2
4, 2
SSTL-2 Class I
12, 8
12, 8
SSTL-2 Class II
24, 20, 16
16
SSTL-18 Class I
12, 10, 8, 6, 4
10, 8, 6, 4
SSTL-18 Class II
20, 18, 16, 8
—
HSTL-18 Class I
12, 10, 8, 6, 4
12, 10, 8, 6, 4
HSTL-18 Class II
20, 18, 16
—
HSTL-15 Class I
12, 10, 8, 6, 4
8, 6, 4
HSTL-15 Class II
20, 18, 16
—
1.5-V LVCMOS
Note to Table 2–32:
(1)
The Quartus II software default current setting is the maximum setting for each
I/O standard.
Open-Drain Output
Stratix II GX devices provide an optional open-drain (equivalent to an
open collector) output for each I/O pin. This open-drain output enables
the device to provide system-level control signals (for example, interrupt
and write enable signals) that can be asserted by any of several devices.
Bus Hold
Each Stratix II GX device I/O pin provides an optional bus-hold feature.
The bus-hold circuitry can hold the signal on an I/O pin at its last-driven
state. Since the bus-hold feature holds the last-driven state of the pin until
the next input signal is present, an external pull-up or pull-down resistor
is not needed to hold a signal level when the bus is tri-stated.
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The bus-hold circuitry also pulls undriven pins away from the input
threshold voltage where noise can cause unintended high-frequency
switching. You can select this feature individually for each I/O pin. The
bus-hold output drives no higher than VCCIO to prevent overdriving
signals. If the bus-hold feature is enabled, the programmable pull-up
option cannot be used. Disable the bus-hold feature when the I/O pin has
been configured for differential signals.
The bus-hold circuitry uses a resistor with a nominal resistance (RBH) of
approximately 7 kΩ to pull the signal level to the last-driven state.
f
Refer to the DC & Switching Characteristics chapter in volume 1 of the
Stratix II GX Device Handbook for the specific sustaining current driven
through this resistor and overdrive current used to identify the
next-driven input level. This information is provided for each VCCIO
voltage level.
The bus-hold circuitry is active only after configuration. When going into
user mode, the bus-hold circuit captures the value on the pin present at
the end of configuration.
Programmable Pull-Up Resistor
Each Stratix II GX device I/O pin provides an optional programmable
pull-up resistor during user mode. If you enable this feature for an I/O
pin, the pull-up resistor (typically 25 kΩ ) holds the output to the VCCIO
level of the output pin’s bank.
Programmable pull-up resistors are only supported on user I/O pins and
are not supported on dedicated configuration pins, JTAG pins, or
dedicated clock pins.
Advanced I/O Standard Support
The Stratix II GX device IOEs support the following I/O standards:
■
■
■
■
■
■
■
■
■
■
■
3.3-V LVTTL/LVCMOS
2.5-V LVTTL/LVCMOS
1.8-V LVTTL/LVCMOS
1.5-V LVCMOS
3.3-V PCI
3.3-V PCI-X mode 1
LVDS
LVPECL (on input and output clocks only)
Differential 1.5-V HSTL class I and II
Differential 1.8-V HSTL class I and II
Differential SSTL-18 class I and II
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■
■
■
■
■
■
Differential SSTL-2 class I and II
1.2-V HSTL class I and II
1.5-V HSTL class I and II
1.8-V HSTL class I and II
SSTL-2 class I and II
SSTL-18 class I and II
Table 2–33 describes the I/O standards supported by Stratix II GX
devices.
Table 2–33. Stratix II GX Supported I/O Standards
I/O Standard
Type
Output Supply
Board Termination
Input Reference
Voltage (VREF) (V) Voltage (VCCIO) (V) Voltage (VTT) (V)
LVTTL
Single-ended
—
3.3
—
LVCMOS
Single-ended
—
3.3
—
2.5 V
Single-ended
—
2.5
—
1.8 V
Single-ended
—
1.8
—
1.5-V LVCMOS
Single-ended
—
1.5
—
3.3-V PCI
Single-ended
—
3.3
—
3.3-V PCI-X mode 1
Single-ended
—
3.3
—
LVDS
Differential
—
2.5 (3)
—
LVPECL (1)
Differential
—
3.3
—
HyperTransport technology Differential
—
2.5 (3)
—
Differential 1.5-V HSTL
class I and II (2)
Differential
0.75
1.5
0.75
Differential 1.8-V HSTL
class I and II (2)
Differential
0.90
1.8
0.90
Differential SSTL-18 class I Differential
and II (2)
0.90
1.8
0.90
Differential SSTL-2 class I
and II (2)
1.25
2.5
1.25
Differential
1.2-V HSTL(4)
Voltage-referenced
0.6
1.2
0.6
1.5-V HSTL class I and II
Voltage-referenced
0.75
1.5
0.75
1.8-V HSTL class I and II
Voltage-referenced
0.9
1.8
0.9
SSTL-18 class I and II
Voltage-referenced
0.90
1.8
0.90
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Table 2–33. Stratix II GX Supported I/O Standards
I/O Standard
SSTL-2 class I and II
Type
Voltage-referenced
Input Reference
Output Supply
Board Termination
Voltage (VREF) (V) Voltage (VCCIO) (V) Voltage (VTT) (V)
1.25
2.5
1.25
Notes to Table 2–33:
(1)
(2)
(3)
(4)
This I/O standard is only available on input and output column clock pins.
This I/O standard is only available on input clock pins and DQS pins in I/O banks 3, 4, 7, and 8, and output clock
pins in I/O banks 9,10, 11, and 12.
VCCIO is 3.3 V when using this I/O standard in input and output column clock pins (in I/O banks 3, 4, 7, 8, 9, 10,
11, and 12).
1.2-V HSTL is only supported in I/O banks 4, 7, and 8.
f
For more information on I/O standards supported by Stratix II GX I/O
banks, refer to the Selectable I/O Standards in Stratix II & Stratix II GX
Devices chapter in volume 2 of the Stratix II GX Device Handbook.
Stratix II GX devices contain six I/O banks and four enhanced PLL
external clock output banks, as shown in Figure 2–87. The two I/O banks
on the left of the device contain circuitry to support source-synchronous,
high-speed differential I/O for LVDS inputs and outputs. These banks
support all Stratix II GX I/O standards except PCI or PCI-X I/O pins, and
SSTL-18 class II and HSTL outputs. The top and bottom I/O banks
support all single-ended I/O standards. Additionally, enhanced PLL
external clock output banks allow clock output capabilities such as
differential support for SSTL and HSTL.
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Stratix II GX Architecture
Figure 2–87. Stratix II GX I/O Banks
DQS ×8
PLL7
DQS ×8
DQS ×8
DQS ×8
VREF0B3 VREF1B3 VREF2B3 VREF3B3 VREF4B3
Bank 2
VREF0B2 VREF1B2
VREF2B2
VREF3B2 VREF4B2
Bank 3
VREF3B1 VREF4B1
Bank 1
VREF2B1
PLL5
DQS ×8
DQS ×8
DQS ×8
DQS ×8
DQS ×8
VREF0B4 VREF1B4 VREF2B4 VREF3B4 VREF4B4
Bank 4
Bank 9
This I/O bank supports LVDS
and LVPECL standards
for input clock operations. Differential HSTL
and differential SSTL standards
are supported for both input
and output operations. (3)
I/O Banks 3, 4, 9, and 11 support all single-ended
I/O standards for both input and output operations.
All differential I/O standards are supported for both
input and output operations at I/O banks 9 and 11.
This I/O bank supports LVDS
and LVPECL standards for input clock
operation. Differential HSTL and
differential SSTL standards are
supported for both input and output
operations. (3)
I/O banks 1 & 2 support LVTTL, LVCMOS,
2.5 V, 1.8 V, 1.5 V, SSTL-2, SSTL-18 class I,
LVDS, pseudo-differential SSTL-2 and pseudo-differential
SSTL-18 class I standards for both input and output
operations. HSTL-18 class II, SSTL-18 class II,
pseudo-differential HSTL and pseudo-differential
SSTL-18 class II standards are only supported for
input operations. (4)
PLL2
VREF0B1 VREF1B1
PLL11
Bank 11
PLL1
VREF4B8 VREF3B8 VREF2B8 VREF1B8 VREF0B8
DQS ×8
DQS ×8
DQS ×8
DQS ×8
Bank 12
Bank 10
PLL12
PLL6
Transmitter: Bank 13
Receiver: Bank 13
REFCLK: Bank 13
Transmitter: Bank 14
Receiver: Bank 14
REFCLK: Bank 14
I/O banks 7, 8, 10 and 12 support all single-ended I/O
standards for both input and output operations. All differential
I/O standards are supported for both input and output operations
at I/O banks 10 and 12.
This I/O bank supports LVDS
This I/O bank supports LVDS
and LVPECL standards for input clock operation.
and LVPECL standards for input clock
Differential HSTL and differential
operation. Differential HSTL and differential
SSTL standards are supported
SSTL standards are supported
for both input and output operations. (3)
for both input and output operations. (3)
Bank 8
PLL8
Notes (1), (2)
Transmitter: Bank 15
Receiver: Bank 15
REFCLK: Bank 15
Bank 7
VREF4B7 VREF3B7 VREF2B7 VREF1B7 VREF0B7
DQS ×8
DQS ×8
DQS ×8
DQS ×8
DQS ×8
Notes to Figure 2–87:
(1)
(2)
(3)
(4)
Figure 2–87 is a top view of the silicon die that corresponds to a reverse view for flip-chip packages. It is a graphical
representation only.
Depending on the size of the device, different device members have different numbers of VREF groups. Refer to the
pin list and the Quartus II software for exact locations.
Banks 9 through 12 are enhanced PLL external clock output banks.
Horizontal I/O banks feature SERDES and DPA circuitry for high-speed differential I/O standards. See the
High-Speed Differential I/O Interfaces with DPA in Stratix II & Stratix II GX Devices chapter in volume 2 of the Stratix II
Device Handbook 2 for more information on differential I/O standards.
Each I/O bank has its own VCCIO pins. A single device can support
1.5-, 1.8-, 2.5-, and 3.3-V interfaces; each bank can support a different
VCCIO level independently. Each bank also has dedicated VREF pins to
support the voltage-referenced standards (such as SSTL-2).
Each I/O bank can support multiple standards with the same VCCIO for
input and output pins. Each bank can support one VREF voltage level. For
example, when VCCIO is 3.3 V, a bank can support LVTTL, LVCMOS, and
3.3-V PCI for inputs and outputs.
Altera Corporation
October 2007
2–129
Stratix II GX Device Handbook, Volume 1
I/O Structure
On-Chip Termination
Stratix II GX devices provide differential (for the LVDS technology I/O
standard) and series on-chip termination to reduce reflections and
maintain signal integrity. On-chip termination simplifies board design by
minimizing the number of external termination resistors required.
Termination can be placed inside the package, eliminating small stubs
that can still lead to reflections.
Stratix II GX devices provide four types of termination:
■
■
■
■
Differential termination (RD)
Series termination (RS) without calibration
Series termination (RS) with calibration
Parallel termination (RT) with calibration
Table 2–34 shows the Stratix II GX on-chip termination support per I/O
bank.
Table 2–34. On-Chip Termination Support by I/O Banks (Part 1 of 2)
On-Chip Termination Support
Series termination without
calibration
Top and Bottom Banks
(3, 4, 7, 8)
Left Bank (1, 2)
3.3-V LVTTL
v
v
3.3-V LVCMOS
v
v
2.5-V LVTTL
v
v
2.5-V LVCMOS
v
v
1.8-V LVTTL
v
v
1.8-V LVCMOS
v
v
1.5-V LVTTL
v
v
1.5-V LVCMOS
v
v
SSTL-2 class I and II
v
v
SSTL-18 class I
v
v
SSTL-18 class II
v
—
1.8-V HSTL class I
v
v
1.8-V HSTL class II
v
—
1.5-V HSTL class I
v
v
1.2-V HSTL
v
—
I/O Standard Support
2–130
Stratix II GX Device Handbook, Volume 1
Altera Corporation
October 2007
Stratix II GX Architecture
Table 2–34. On-Chip Termination Support by I/O Banks (Part 2 of 2)
On-Chip Termination Support
Series termination with
calibration
Differential termination (1)
Top and Bottom Banks
(3, 4, 7, 8)
Left Bank (1, 2)
3.3-V LVTTL
v
—
3.3-V LVCMOS
v
—
2.5-V LVTTL
v
—
2.5-V LVCMOS
v
—
1.8-V LVTTL
v
—
1.8-V LVCMOS
v
—
1.5-V LVTTL
v
—
1.5-V LVCMOS
v
—
SSTL-2 class I and II
v
—
SSTL-18 class I and II
v
—
1.8-V HSTL class I
v
—
1.8-V HSTL class II
v
—
1.5-V HSTL class I
v
—
1.2-V HSTL
v
—
LVDS
—
v
HyperTransport technology
—
v
I/O Standard Support
Note to Table 2–34:
(1)
Clock pins CLK1 and CLK3, and pins FPLL[7..8]CLK do not support differential on-chip termination. Clock pins
CLK0 and CLK2, do support differential on-chip termination. Clock pins in the top and bottom banks (CLK[4..7,
12..15]) do not support differential on-chip termination.
Differential On-Chip Termination
Stratix II GX devices support internal differential termination with a
nominal resistance value of 100 for LVDS input receiver buffers. LVPECL
input signals (supported on clock pins only) require an external
termination resistor. Differential on-chip termination is supported across
the full range of supported differential data rates, as shown in the
High-Speed I/O Specifications section of the DC & Switching Characteristics
chapter in volume 1 of the Stratix II GX Device Handbook.
f
Altera Corporation
October 2007
For more information on differential on-chip termination, refer to the
High-Speed Differential I/O Interfaces with DPA in Stratix II & Stratix II GX
Devices chapter in volume 2 of the Stratix II GX Device Handbook.
2–131
Stratix II GX Device Handbook, Volume 1
I/O Structure
f
For more information on tolerance specifications for differential on-chip
termination, refer to the DC & Switching Characteristics chapter in
volume 1 of the Stratix II GX Device Handbook.
On-Chip Series Termination without Calibration
Stratix II GX devices support driver impedance matching to provide the
I/O driver with controlled output impedance that closely matches the
impedance of the transmission line. As a result, reflections can be
significantly reduced. Stratix II GX devices support on-chip series
termination for single-ended I/O standards with typical RS values of
25 and 50 Ω . Once matching impedance is selected, current drive
strength is no longer selectable. Table 2–34 shows the list of output
standards that support on-chip series termination without calibration.
f
For more information about series on-chip termination supported by
Stratix II GX devices, refer to the Selectable I/O Standards in Stratix II &
Stratix II GX Devices chapter in volume 2 of the Stratix II GX Device
Handbook.
f
For more information about tolerance specifications for on-chip
termination without calibration, refer to the DC & Switching
Characteristics chapter in volume 1 of the Stratix II GX Device Handbook.
On-Chip Series Termination with Calibration
Stratix II GX devices support on-chip series termination with calibration
in column I/O pins in top and bottom banks. There is one calibration
circuit for the top I/O banks and one circuit for the bottom I/O banks.
Each on-chip series termination calibration circuit compares the total
impedance of each I/O buffer to the external 25-Ω or 50-Ω resistors
connected to the RUP and RDN pins, and dynamically enables or disables
the transistors until they match. Calibration occurs at the end of device
configuration. Once the calibration circuit finds the correct impedance, it
powers down and stops changing the characteristics of the drivers.
f
For more information about series on-chip termination supported by
Stratix II GX devices, refer to the Selectable I/O Standards in Stratix II &
Stratix II GX Devices chapter in volume 2 of the Stratix II GX Device
Handbook.
f
For more information about tolerance specifications for on-chip
termination with calibration, refer to the DC & Switching Characteristics
chapter in volume 1 of the Stratix II GX Device Handbook.
2–132
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Altera Corporation
October 2007
Stratix II GX Architecture
On-Chip Parallel Termination with Calibration
Stratix II GX devices support on-chip parallel termination with
calibration for column I/O pins only. There is one calibration circuit for
the top I/O banks and one circuit for the bottom I/O banks. Each on-chip
parallel termination calibration circuit compares the total impedance of
each I/O buffer to the external 50-Ω resistors connected to the RUP and
RDN pins and dynamically enables or disables the transistors until they
match. Calibration occurs at the end of device configuration. Once the
calibration circuit finds the correct impedance, it powers down and stops
changing the characteristics of the drivers.
1
On-chip parallel termination with calibration is only supported
for input pins.
f
For more information about on-chip termination supported by Stratix II
devices, refer to the Selectable I/O Standards in Stratix II & Stratix II GX
Devices chapter in volume 2 of the Stratix II GX Device Handbook.
f
For more information about tolerance specifications for on-chip
termination with calibration, refer to the DC & Switching Characteristics
chapter in volume 1 of the Stratix II GX Device Handbook.
MultiVolt I/O Interface
The Stratix II GX architecture supports the MultiVolt I/O interface feature
that allows Stratix II GX devices in all packages to interface with systems
of different supply voltages. The Stratix II GX VCCINT pins must always
be connected to a 1.2-V power supply. With a 1.2-V VCCINT level, input
pins are 1.2-, 1.5-, 1.8-, 2.5-, and 3.3-V tolerant. The VCCIO pins can be
connected to either a 1.2-, 1.5-, 1.8-, 2.5-, or 3.3-V power supply,
depending on the output requirements. The output levels are compatible
with systems of the same voltage as the power supply (for example, when
VCCIO pins are connected to a 1.5-V power supply, the output levels are
compatible with 1.5-V systems). The Stratix II GX VCCPD power pins
must be connected to a 3.3-V power supply. These power pins are used to
supply the pre-driver power to the output buffers, which increases the
performance of the output pins. The VCCPD pins also power
configuration input pins and JTAG input pins.
Altera Corporation
October 2007
2–133
Stratix II GX Device Handbook, Volume 1
I/O Structure
Table 2–35 summarizes Stratix II GX MultiVolt I/O support.
Table 2–35. Stratix II GX MultiVolt I/O Support Note (1)
Input Signal (V)
VCCIO (V)
1.2
Output Signal (V)
1.2
1.5
1.8
2.5
3.3
1.2
1.5
1.8
2.5
3.3 5.0
(4)
v (2)
v (2)
v (2)
v (2)
v (4)
—
—
—
—
v
—
—
—
—
v
—
—
—
1.5
(4)
v
v
v (2)
v (2)
v (3)
1.8
(4)
v
v
v (2)
v (2)
v (3) v (3)
—
2.5
(4)
—
—
v
v
v (3) v (3) v (3)
v
—
—
3.3
(4)
—
—
v
v
v (3) v (3) v (3)
v (3)
v
v
Notes to Table 2–35:
(1)
(2)
(3)
(4)
To drive inputs higher than VCCIO but less than 4.0 V, disable the PCI clamping diode and select
the Allow LVTTL and LVCMOS input levels to overdrive input buffer option in the Quartus II
software.
The pin current may be slightly higher than the default value. You must verify that the driving
device’s VO L maximum and VO H minimum voltages do not violate the applicable Stratix II GX
VI L maximum and VI H minimum voltage specifications.
Although VCCIO specifies the voltage necessary for the Stratix II GX device to drive out, a
receiving device powered at a different level can still interface with the Stratix II GX device if it
has inputs that tolerate the VCCIO value.
Stratix II GX devices support 1.2-V HSTL. They do not support 1.2-V LVTTL and 1.2-V LVCMOS.
The TDO and nCEO pins are powered by VCCIO of the bank that they reside.
TDO is in I/O bank 4 and nCEO is in I/O bank 7. Ideally, the VCC supplies
for the I/O buffers of any two connected pins are at the same voltage
level. This may not always be possible depending on the VCCIO level of
TDO and nCEO pins on master devices and the configuration voltage level
chosen by VCCSEL on slave devices. Master and slave devices can be in any
position in the chain. Master indicates that it is driving out TDO or nCEO
to a slave device. For multi-device passive configuration schemes, the
nCEO pin of the master device drives the nCE pin of the slave device. The
VCCSEL pin on the slave device selects which input buffer is used for nCE.
When VCCSEL is logic high, it selects the 1.8-V/1.5-V buffer powered by
VCCIO. When VCCSEL is logic low, it selects the 3.3-V/2.5-V input buffer
powered by VCCPD. The ideal case is to have the VCCIO of the nCEO bank
in a master device match the VCCSEL settings for the nCE input buffer of
the slave device it is connected to, but that may not be possible depending
on the application.
2–134
Stratix II GX Device Handbook, Volume 1
Altera Corporation
October 2007
Stratix II GX Architecture
Table 2–36 contains board design recommendations to ensure that nCEO
can successfully drive nCE for all power supply combinations.
Table 2–36. Board Design Recommendations for nCEO and nCE Input Buffer Power
nCE Input Buffer Power in
I/O Bank 3
Stratix II GX nCEO VCCIO Voltage Level in I/O Bank 7
VC C I O = 3.3 V VC C I O = 2.5 V
VC C I O = 1.8 V VC C I O = 1.5 V VC C I O = 1.2 V
VCCSEL high
(VC C I O Bank 3 = 1.5 V)
v(1), (2)
v (3), (4)
v (5)
v
v
VCCSEL high
(VC C I O Bank 3 = 1.8 V)
v (1), (2)
v (3), (4)
v
v
Level shifter
required
v
v (4)
v (6)
Level shifter
required
Level shifter
required
VCCSEL low (nCE powered
by VC C P D = 3.3 V)
Notes to Table 2–36:
(1)
(2)
(3)
(4)
(5)
(6)
Input buffer is 3.3-V tolerant.
The nCEO output buffer meets VO H (MIN) = 2.4 V.
Input buffer is 2.5-V tolerant.
The nCEO output buffer meets VOH (MIN) = 2.0 V.
Input buffer is 1.8-V tolerant.
An external 250-Ω pull-up resistor is not required, but recommended if signal levels on the board are not optimal.
For JTAG chains, the TDO pin of the first device drives the TDI pin of the
second device in the chain. The VCCSEL input on the JTAG input I/O cells
(TCK, TMS, TDI, and TRST) is internally hardwired to GND selecting the
3.3-V/2.5-V input buffer powered by VCCPD. The ideal case is to have the
VCCIO of the TDO bank from the first device match the VCCSEL settings for
TDI on the second device, but that may not be possible depending on the
application. Table 2–37 contains board design recommendations to
ensure proper JTAG chain operation.
Table 2–37. Supported TDO/TDI Voltage Combinations (Part 1 of 2)
Device
TDI Input
Buffer Power
Stratix II GX Always
VC C P D (3.3 V)
Altera Corporation
October 2007
Stratix II GX TDO VC C I O Voltage Level in I/O Bank 4
VC C I O = 3.3 V
VC C I O = 2.5 V
v (1)
v (2)
VC C I O = 1.8 V VC C I O = 1.5 V VC C I O = 1.2 V
v (3)
Level shifter
required
Level shifter
required
2–135
Stratix II GX Device Handbook, Volume 1
High-Speed Differential I/O with DPA Support
Table 2–37. Supported TDO/TDI Voltage Combinations (Part 2 of 2)
Device
TDI Input
Buffer Power
Stratix II GX TDO VC C I O Voltage Level in I/O Bank 4
VC C I O = 3.3 V
VC C I O = 2.5 V
v (1)
v (2)
v (3)
Level shifter
required
Level shifter
required
VCC = 2.5 V
v (1), (4)
v (2)
v (3)
Level shifter
required
Level shifter
required
VCC = 1.8 V
v (1), (4)
v (2), (5)
v
Level shifter
required
Level shifter
required
VCC = 1.5 V
v (1), (4)
v (2), (5)
v (6)
v
v
NonVCC = 3.3 V
Stratix II GX
VC C I O = 1.8 V VC C I O = 1.5 V VC C I O = 1.2 V
Notes to Table 2–37:
(1)
(2)
(3)
(4)
(5)
(6)
The TDO output buffer meets VOH (MIN) = 2.4 V.
The TDO output buffer meets VOH (MIN) = 2.0 V.
An external 250-Ω pull-up resistor is not required, but recommended if signal levels on the board are not optimal.
Input buffer must be 3.3-V tolerant.
Input buffer must be 2.5-V tolerant.
Input buffer must be 1.8-V tolerant.
High-Speed
Differential I/O
with DPA
Support
Stratix II GX devices contain dedicated circuitry for supporting
differential standards at speeds up to 1 Gbps. The LVDS differential I/O
standards are supported in the Stratix II GX device. In addition, the
LVPECL I/O standard is supported on input and output clock pins on the
top and bottom I/O banks.
The high-speed differential I/O circuitry supports the following
high-speed I/O interconnect standards and applications:
■
■
■
SPI-4 Phase 2 (POS-PHY Level 4)
SFI-4
Parallel RapidIO standard
There are two dedicated high-speed PLLs in the EP2SGX30 device and
four dedicated high-speed PLLs in the EP2SGX60, EP2SGX90, and
EP2SGX130 devices to multiply reference clocks and drive high-speed
differential SERDES channels.
Tables 2–38 through 2–41 show the number of channels that each Fast
PLL can clock in each of the Stratix II GX devices. In Tables 2–38 through
2–41, the first row for each transmitter or receiver provides the number of
channels driven directly by the PLL. The second row below it shows the
maximum channels a Fast PLL can drive if cross bank channels are used
from the adjacent center Fast PLL. For example, in the 780-pin
FineLine BGA EP2SGX30 device, PLL 1 can drive a maximum of
2–136
Stratix II GX Device Handbook, Volume 1
Altera Corporation
October 2007
Stratix II GX Architecture
16 transmitter channels in I/O bank 1 or a maximum of 29 transmitter
channels in I/O banks 1 and 2. The Quartus II software can also merge
receiver and transmitter PLLs when a receiver is driving a transmitter. In
this case, one fast PLL can drive both the maximum numbers of receiver
and transmitter channels.
Table 2–38. EP2SGX30 Device Differential Channels
Note (1)
Center Fast PLLs Package
Package
780-pin FineLine BGA
Transmitter/Receiver
Total Channels
780-pin FineLine BGA
1,152-pin FineLine BGA
29
16
13
Receiver
31
17
14
Center Fast PLLs
Corner Fast PLLs
Note (1)
Transmitter/Receiver Total Channels
1,152-pin FineLine BGA
1,508-pin FineLine BGA
Altera Corporation
October 2007
PLL1
PLL2
PLL7
PLL8
—
—
Transmitter
29
16
13
Receiver
31
17
14
—
—
Transmitter
42
21
21
21
21
Receiver
42
21
21
21
21
Table 2–40. EP2SGX90 Device Differential Channels
Package
PLL2
Transmitter
Table 2–39. EP2SGX60 Device Differential Channels
Package
PLL1
Note (1)
Total
Channels
Center Fast PLLs
Corner Fast PLLs
PLL1
PLL2
PLL7
PLL8
Transmitter
45
23
22
23
22
Transmitter/Receiver
Receiver
47
23
24
23
24
Transmitter
59
30
29
29
29
Receiver
59
30
29
29
29
2–137
Stratix II GX Device Handbook, Volume 1
High-Speed Differential I/O with DPA Support
Table 2–41. EP2SGX130 Device Differential Channels
Package
1508-pin FineLine BGA
Transmitter/Receiver
Total
Channels
Note (1)
Center Fast PLLs
PLL1
PLL2
Corner Fast PLLs
PLL7
PLL8
Transmitter
71
37
41
37
41
Receiver
73
37
41
37
41
Note to Tables 2–38 through 2–41:
(1)
The total number of receiver channels includes the four non-dedicated clock channels that can be optionally used
as data channels.
Therefore, the total number of channels is not the addition of the number
of channels accessible by PLLs 1 and 2 with the number of channels
accessible by PLLs 7 and 8.
Dedicated Circuitry with DPA Support
Stratix II GX devices support source-synchronous interfacing with LVDS
signaling at up to 1 Gbps. Stratix II GX devices can transmit or receive
serial channels along with a low-speed or high-speed clock.
The receiving device PLL multiplies the clock by an integer factor W = 1
through 32. The SERDES factor J determines the parallel data width to
deserialize from receivers or to serialize for transmitters. The SERDES
factor J can be set to 4, 5, 6, 7, 8, 9, or 10 and does not have to equal the PLL
clock-multiplication W value. A design using the dynamic phase aligner
also supports all of these J factor values. For a J factor of 1, the
Stratix II GX device bypasses the SERDES block. For a J factor of 2, the
Stratix II GX device bypasses the SERDES block, and the DDR input and
output registers are used in the IOE. Figure 2–88 shows the block diagram
of the Stratix II GX transmitter channel.
2–138
Stratix II GX Device Handbook, Volume 1
Altera Corporation
October 2007
Stratix II GX Architecture
Figure 2–88. Stratix II GX Transmitter Channel
Data from R4, R24, C4, or
direct link interconnect
+
–
10
Local
Interconnect
Up to 1 Gbps
10
Dedicated
Transmitter
Interface
diffioclk
refclk
Fast
PLL
load_en
Regional or
global clock
Each Stratix II GX receiver channel features a DPA block for phase
detection and selection, a SERDES, a synchronizer, and a data realigner
circuit. You can bypass the dynamic phase aligner without affecting the
basic source-synchronous operation of the channel. In addition, you can
dynamically switch between using the DPA block or bypassing the block
via a control signal from the logic array.
Altera Corporation
October 2007
2–139
Stratix II GX Device Handbook, Volume 1
High-Speed Differential I/O with DPA Support
Figure 2–89 shows the block diagram of the Stratix II GX receiver channel.
Figure 2–89. Stratix II GX Receiver Channel
Data to R4, R24, C4, or
direct link interconnect
Up to 1 Gbps
+
–
D
Q
Data Realignment
Circuitry
10
data
retimed_data
DPA
Synchronizer
Dedicated
Receiver
Interface
DPA_clk
Eight Phase Clocks
8
diffioclk
refclk
Fast
PLL
load_en
Regional or
global clock
An external pin or global or regional clock can drive the fast PLLs, which
can output up to three clocks: two multiplied high-speed clocks to drive
the SERDES block and/or external pin, and a low-speed clock to drive the
logic array. In addition, eight phase-shifted clocks from the VCO can feed
to the DPA circuitry.
f
For more information on the fast PLL, see the PLLs in Stratix II GX
Devices chapter in volume 2 of the Stratix II GX Handbook.
The eight phase-shifted clocks from the fast PLL feed to the DPA block.
The DPA block selects the closest phase to the center of the serial data eye
to sample the incoming data. This allows the source-synchronous
circuitry to capture incoming data correctly regardless of the
channel-to-channel or clock-to-channel skew. The DPA block locks to a
phase closest to the serial data phase. The phase-aligned DPA clock is
used to write the data into the synchronizer.
The synchronizer sits between the DPA block and the data realignment
and SERDES circuitry. Since every channel utilizing the DPA block can
have a different phase selected to sample the data, the synchronizer is
needed to synchronize the data to the high-speed clock domain of the
data realignment and the SERDES circuitry.
2–140
Stratix II GX Device Handbook, Volume 1
Altera Corporation
October 2007
Stratix II GX Architecture
For high-speed source synchronous interfaces such as POS-PHY 4 and the
Parallel RapidIO standard, the source synchronous clock rate is not a
byte- or SERDES-rate multiple of the data rate. Byte alignment is
necessary for these protocols because the source synchronous clock does
not provide a byte or word boundary since the clock is one half the data
rate, not one eighth. The Stratix II GX device’s high-speed differential I/O
circuitry provides dedicated data realignment circuitry for
user-controlled byte boundary shifting. This simplifies designs while
saving ALM resources. You can use an ALM-based state machine to
signal the shift of receiver byte boundaries until a specified pattern is
detected to indicate byte alignment.
Fast PLL and Channel Layout
The receiver and transmitter channels are interleaved such that each I/O
bank on the left side of the device has one receiver channel and one
transmitter channel per LAB row. Figure 2–90 shows the fast PLL and
channel layout in the EP2SGX30C/D and EP2SGX60C/D devices.
Figure 2–91 shows the fast PLL and channel layout in EP2SGX60E,
EP2SGX90E/F, and EP2SGX130G devices.
Figure 2–90. Fast PLL and Channel Layout in the EP2SGX30C/D and EP2SGX60C/D Devices
Note (1)
4
LVDS
Clock
DPA
Clock
Quadrant
Quadrant
Quadrant
Quadrant
4
2
Fast
PLL 1
Fast
PLL 2
2
4
LVDS
Clock
DPA
Clock
Note to Figure 2–90:
(1)
See Table 2–38 for the number of channels each device supports.
Altera Corporation
October 2007
2–141
Stratix II GX Device Handbook, Volume 1
Referenced Documents
Figure 2–91. Fast PLL and Channel Layout in the EP2SGX60E to EP2SGX130 Devices
Note (1)
Fast
PLL 7
2
4
LVDS
Clock
DPA
Clock
Quadrant
Quadrant
DPA
Clock
Quadrant
Quadrant
4
2
Fast
PLL 1
Fast
PLL 2
2
4
LVDS
Clock
2
Fast
PLL 8
Note to Figure 2–91:
(1)
See Tables 2–39 through Tables 2–41 for the number of channels each device supports.
Referenced
Documents
This chapter references the following documents:
■
■
■
■
■
■
■
■
DC & Switching Characteristics chapter in volume 1 of the Stratix II GX
Handbook
DSP Blocks in Stratix II GX Devices chapter in Volume 2 of the
Stratix II GX Device Handbook
External Memory Interfaces in Stratix II & Stratix II GX Devices chapter
in volume 2 of the Stratix II GX Device Handbook
High-Speed Differential I/O Interfaces with DPA in Stratix II & Stratix II
GX Devices chapter in volume 2 of the Stratix II GX Handbook
PLLs in Stratix II & Stratix II GX Devices chapter in volume 2 of the
Stratix II GX Device Handbook
Selectable I/O Standards in Stratix II & Stratix II GX Devices chapter in
volume 2 of the Stratix II GX Handbook
Stratix II GX Device Handbook, volume 2
Stratix II GX Transceiver Architecture Overview chapter in volume 2 of
the Stratix II GX Handbook
2–142
Stratix II GX Device Handbook, Volume 1
Altera Corporation
October 2007
Stratix II GX Architecture
■
■
Document
Revision History
Stratix II Performance and Logic Efficiency Analysis White Paper
TriMatrix Embedded Memory Blocks in Stratix II & Stratix II GX Devices
chapter in volume 2 of the Stratix II GX Device Handbook
Table 2–42 shows the revision history for this chapter.
Table 2–42. Document Revision History (Part 1 of 6)
Date and
Document
Version
October 2007,
v2.2
Changes Made
Summary of Changes
Updated:
“Programmable Pull-Up Resistor”
● “Reverse Serial Pre-CDR Loopback”
● “Receiver Input Buffer”
● “Pattern Detection”
● “Control and Status Signals”
● “Individual Power Down and Reset for the
Transmitter and Receiver”
●
Updated:
● Figure 2–14
● Figure 2–26
● Figure 2–27
● Figure 2–86 (notes only)
● Figure 2–87
Updated:
● Table 2–4
● Table 2–7
Removed note from Table 2–31.
Removed Tables 2-2, 2-7, and 2-8.
Minor text edits.
August 2007, v2.1 Added “Reverse Serial Pre-CDR Loopback”
section.
Updated Table 2–2.
Added “Referenced Documents” section.
Altera Corporation
October 2007
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Document Revision History
Table 2–42. Document Revision History (Part 2 of 6)
Date and
Document
Version
February 2007
v2.0
Changes Made
Added Chapter 02 “Stratix II GX Transceivers”
to the beginning of Chapter 03 “Stratix II GX
Architecture”.
● Changed chapter number to Chapter 02.
Summary of Changes
Combined Chapter 02 “Stratix II GX
Transceivers” and Chapter 03
“Stratix II GX Architecture” in the new
Chapter 02 “Stratix II GX Architecture”
Added the “Document Revision History”
section to this chapter.
Moved the “Stratix II GX Transceiver Clocking”
section to after the “Receiver Path” section.
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Altera Corporation
October 2007
Stratix II GX Architecture
Table 2–42. Document Revision History (Part 3 of 6)
Date and
Document
Version
Changes Made
Summary of Changes
Moved the “Transmit State Machine” section to
after the “8B/10B Encoder” section.
Moved the “PCI Express Receiver Detect” and
“PCI Express Electric Idles (or Individual
Transmitter Tri-State)” sections to after the
“Transmit Buffer” section.
Moved the “Dynamic Reconfiguration” section
to the “Other Transceiver Features” section.
Moved the “Calibration Block”, “Receiver PLL
& CRU”, and “Deserializer (Serial-to-Parallel
Converter)” sections to the “Receiver Path”
section.
Moved the “8B/10B Decoder” and “Receiver
State Machine” sections to after the “Rate
Matcher” section.
Moved the “Byte Ordering Block” section to
after the “Byte Deserializer” section.
Updated the Clocking diagrams.
Added the “Clock Resource for PLDTransceiver Interface” section.
Added the “On-Chip Parallel Termination with
Calibration” section to the “On-Chip
Termination” section.
Updated:
● Table 2–2.
● Table 2–10
● Table 2–14.
● Table 2–3.
● Table 2–5.
● Table 2–8.
● Table 2–13
● Table 2–18
● Table 2–19
● Table 2–29.
Updated Figures 2–3, 2–9, 2–24, 2–25, 2–28,
2–29, 2–60, 2–62.
Change 622 Mbps to 600 Mbps throughout the
chapter.
Altera Corporation
October 2007
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Document Revision History
Table 2–42. Document Revision History (Part 4 of 6)
Date and
Document
Version
Changes Made
Summary of Changes
Updated:
● “Transmitter PLLs”
● “Transmitter Phase Compensation FIFO
Buffer”
● “8B/10B Encoder”
● “Byte Serializer”
● “Programmable Output Driver”
● “Receiver PLL & CRU”
● “Programmable Pre-Emphasis”
● “Receiver Input Buffer”
● “Control and Status Signals”
● “Programmable Run Length Violation”
● “Channel Aligner”
● “Basic Mode”
● “Byte Ordering Block”
● “Receiver Phase Compensation FIFO
Buffer”
● “Loopback Modes”
● “Serial Loopback”
● “Parallel Loopback”
● “Regional Clock Network”
● “MultiVolt I/O Interface”
● “High-Speed Differential I/O with DPA
Support”
Updated bulleted lists at the beginning of the
“Transceivers” section.
Added reference to the “Transmit Buffer”
section.
Deleted the Programmable VOD table from the
“Programmable Output Driver” section.
Changed “PLD Interface” heading to “Parallel
Data Width” heading in Table 2–14.
Deleted “Global & Regional Clock
Connections from Right Side Clock Pins &
Fast PLL Outputs” table.
Updated notes to Tables 2–29 and 2–37.
Updated notes to Figures 2–72, 2–73 and
2–74.
Updated bulleted list in the “Advanced I/O
Standard Support” section.
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Stratix II GX Architecture
Table 2–42. Document Revision History (Part 5 of 6)
Date and
Document
Version
Previous Chapter
02 changes:
June 2006, v1.2
Changes Made
●
●
●
●
●
●
●
●
●
●
Previous Chapter
02 changes:
April 2006, v1.1
●
●
●
●
Updated input frequency range in
Updated notes 1 and 2 in Figure 2–1.
Table 2–4.
Updated “Byte Serializer” section.
Updated Tables 2–4, 2–7, and 2–16.
Updated “Programmable Output Driver”
section.
Updated Figure 2–12.
Updated “Programmable Pre-Emphasis”
section.
Added Table 2–11.
Added “Dynamic Reconfiguration” section.
Added “Calibration Block” section.
Updated “Programmable Equalizer”
section, including addition of Figure 2–18.
Updated Figure 2–3.
Updated Figure 2–7.
Updated Table 2–4.
Updated “Transmit Buffer” section.
Previous Chapter
02 changes:
October 2005
v1.0
Added chapter to the Stratix II GX Device
Handbook.
Previous Chapter
03 changes:
August 2006, v1.4
●
Updated Table 3–18 with note.
Previous Chapter
03 changes:
June 2006, v1.3
●
Updated note 2 in Figure 3–41.
Updated column title in Table 3–21.
Previous Chapter
03 changes:
April 2006, v1.2
●
●
●
●
●
●
●
●
●
Altera Corporation
October 2007
Summary of Changes
Updated note 1 in Table 3–9.
Updated note 1 in Figure 3–40.
Updated note 2 in Figure 3–41.
Updated Table 3–16.
Updated Figure 3–56.
Updated Tables 3–19 through 3–22.
Updated Tables 3–25 and 3–26.
Updated “Fast PLL & Channel Layout”
section.
Updated input frequency range in
Table 2–4.
Added 1,152-pin FineLine BGA package
information for EP2SGX60 device in
Table 3–16.
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Document Revision History
Table 2–42. Document Revision History (Part 6 of 6)
Date and
Document
Version
Changes Made
Previous Chapter
03 changes:
December 2005
v1.1
Updated Figure 3–56.
Previous Chapter
03 changes:
October 2005
v1.0
Added chapter to the Stratix II GX Device
Handbook.
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Summary of Changes
Altera Corporation
October 2007
3. Configuration & Testing
SIIGX51005-1.4
IEEE Std. 1149.1
JTAG BoundaryScan Support
All Stratix® II GX devices provide Joint Test Action Group (JTAG)
boundary-scan test (BST) circuitry that complies with the IEEE
Std. 1149.1. You can perform JTAG boundary-scan testing either before or
after, but not during configuration. Stratix II GX devices can also use the
JTAG port for configuration with the Quartus® II software or hardware
using either Jam Files (.jam) or Jam Byte-Code Files (.jbc).
Stratix II GX devices support IOE I/O standard setting reconfiguration
through the JTAG BST chain. The JTAG chain can update the I/O
standard for all input and output pins any time before or during user
mode through the CONFIG_IO instruction. You can use this capability for
JTAG testing before configuration when some of the Stratix II GX pins
drive or receive from other devices on the board using voltage-referenced
standards. Since the Stratix II GX device may not be configured before
JTAG testing, the I/O pins may not be configured for appropriate
electrical standards for chip-to-chip communication. Programming these
I/O standards via JTAG allows you to fully test I/O connections to other
devices.
A device operating in JTAG mode uses four required pins, TDI, TDO, TMS,
and TCK, and one optional pin, TRST. The TCK pin has an internal weak
pull-down resistor, while the TDI, TMS, and TRST pins have weak
internal pull-up resistors. The JTAG input pins are powered by the 3.3-V
VCCPD pins. The TDO output pin is powered by the VCCIO power supply
in I/O bank 4.
Stratix II GX devices also use the JTAG port to monitor the logic operation
of the device with the SignalTap® II embedded logic analyzer.
Stratix II GX devices support the JTAG instructions shown in Table 3–1.
1
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October 2007
Stratix II GX devices must be within the first eight devices in a
JTAG chain. All of these devices have the same JTAG controller.
If any of the Stratix II GX devices appear after the eighth device
in the JTAG chain, they will fail configuration. This does not
affect SignalTap II embedded logic analysis.
3–1
IEEE Std. 1149.1 JTAG Boundary-Scan Support
Table 3–1. Stratix II GX JTAG Instructions
JTAG Instruction
Instruction Code
Description
SAMPLE/PRELOAD
00 0000 0101
Allows a snapshot of signals at the device pins to be captured and
examined during normal device operation and permits an initial
data pattern to be output at the device pins. Also used by the
SignalTap II embedded logic analyzer.
EXTEST(1)
00 0000 1111
Allows the external circuitry and board-level interconnects to be
tested by forcing a test pattern at the output pins and capturing test
results at the input pins.
BYPASS
11 1111 1111
Places the 1-bit bypass register between the TDI and TDO pins,
which allows the BST data to pass synchronously through selected
devices to adjacent devices during normal device operation.
USERCODE
00 0000 0111
Selects the 32-bit USERCODE register and places it between the
TDI and TDO pins, allowing the USERCODE to be serially shifted
out of TDO.
IDCODE
00 0000 0110
Selects the IDCODE register and places it between TDI and TDO,
allowing the IDCODE to be serially shifted out of TDO.
HIGHZ (1)
00 0000 1011
Places the 1-bit bypass register between the TDI and TDO pins,
which allows the BST data to pass synchronously through selected
devices to adjacent devices during normal device operation, while
tri-stating all of the I/O pins.
CLAMP (1)
00 0000 1010
Places the 1-bit bypass register between the TDI and TDO pins,
which allows the BST data to pass synchronously through selected
devices to adjacent devices during normal device operation while
holding the I/O pins to a state defined by the data in the boundaryscan register.
ICR instructions
Used when configuring a Stratix II GX device via the JTAG port with
a USB-Blaster™, MasterBlaster™, ByteBlasterMV™, or
ByteBlaster II download cable, or when using a .jam or .jbc via an
embedded processor or JRunner.
PULSE_NCONFIG
00 0000 0001
Emulates pulsing the nCONFIG pin low to trigger reconfiguration
even though the physical pin is unaffected.
CONFIG_IO (2)
00 0000 1101
Allows configuration of I/O standards through the JTAG chain for
JTAG testing. Can be executed before, during, or after
configuration. Stops configuration if executed during configuration.
Once issued, the CONFIG_IO instruction holds nSTATUS low to
reset the configuration device. nSTATUS is held low until the IOE
configuration register is loaded and the TAP controller state
machine transitions to the UPDATE_DR state.
SignalTap II
instructions
Monitors internal device operation with the SignalTap II embedded
logic analyzer.
Notes to Table 3–1:
(1)
(2)
Bus hold and weak pull-up resistor features override the high-impedance state of HIGHZ, CLAMP, and EXTEST.
For more information on using the CONFIG_IO instruction, refer to the MorphIO: An I/O Reconfiguration Solution
for Altera Devices White Paper.
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Altera Corporation
October 2007
Configuration & Testing
The Stratix II GX device instruction register length is 10 bits and the
USERCODE register length is 32 bits. Tables 3–2 and 3–3 show the boundaryscan register length and device IDCODE information for Stratix II GX
devices.
Table 3–2. Stratix II GX Boundary-Scan Register Length
Device
Boundary-Scan Register Length
EP2SGX30
1,320
EP2SGX60
1,506
EP2SGX90
2,016
EP2SGX130
2,454
Table 3–3. 32-Bit Stratix II GX Device IDCODE
IDCODE (32 Bits)
Device
Version (4 Bits)
Part Number (16 Bits)
Manufacturer Identity
(11 Bits)
LSB (1 Bit)
EP2SGX30
0000
0010 0000 1110 0001
000 0110 1110
1
EP2SGX60
0000
0010 0000 1110 0010
000 0110 1110
1
EP2SGX90
0000
0010 0000 1110 0011
000 0110 1110
1
EP2SGX130
0000
0010 0000 1110 0100
000 0110 1110
1
SignalTap II
Embedded Logic
Analyzer
Stratix II GX devices feature the SignalTap II embedded logic analyzer,
which monitors design operation over a period of time through the IEEE
Std. 1149.1 (JTAG) circuitry. You can analyze internal logic at speed
without bringing internal signals to the I/O pins. This feature is
particularly important for advanced packages, such as FineLine BGA
packages, because it can be difficult to add a connection to a pin during
the debugging process after a board is designed and manufactured.
Configuration
The logic, circuitry, and interconnects in the Stratix II GX architecture are
configured with CMOS SRAM elements. Altera® FPGAs are
reconfigurable and every device is tested with a high coverage
production test program so you do not have to perform fault testing and
can instead focus on simulation and design verification.
Stratix II GX devices are configured at system power-up with data stored
in an Altera configuration device or provided by an external controller
(for example, a MAX® II device or microprocessor). You can configure
Stratix II GX devices using the fast passive parallel (FPP), active serial
Altera Corporation
October 2007
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Stratix II GX Device Handbook, Volume 1
Configuration
(AS), passive serial (PS), passive parallel asynchronous (PPA), and JTAG
configuration schemes. The Stratix II GX device’s optimized interface
allows microprocessors to configure it serially or in parallel and
synchronously or asynchronously. The interface also enables
microprocessors to treat Stratix II GX devices as memory and configure
them by writing to a virtual memory location, making reconfiguration
easy.
In addition to the number of configuration methods supported,
Stratix II GX devices also offer the design security, decompression, and
remote system upgrade features. The design security feature, using
configuration bitstream encryption and advanced encryption standard
(AES) technology, provides a mechanism to protect designs. The
decompression feature allows Stratix II GX FPGAs to receive a
compressed configuration bitstream and decompress this data in realtime, reducing storage requirements and configuration time. The remote
system upgrade feature allows real-time system upgrades from remote
locations of Stratix II GX designs. For more information, refer to the
“Configuration Schemes” on page 3–6.
Operating Modes
The Stratix II GX architecture uses SRAM configuration elements that
require configuration data to be loaded each time the circuit powers up.
The process of physically loading the SRAM data into the device is called
configuration. During initialization, which occurs immediately after
configuration, the device resets registers, enables I/O pins, and begins to
operate as a logic device. The I/O pins are tri-stated during power-up,
and before and during configuration. Together, the configuration and
initialization processes are called command mode. Normal device
operation is called user mode.
SRAM configuration elements allow you to reconfigure Stratix II GX
devices in-circuit by loading new configuration data into the device. With
real-time reconfiguration, the device is forced into command mode with
a device pin. The configuration process loads different configuration
data, re-initializes the device, and resumes user-mode operation. You can
perform in-field upgrades by distributing new configuration files either
within the system or remotely.
The PORSEL pin is a dedicated input used to select power-on reset (POR)
delay times of 12 ms or 100 ms during power up. When the PORSEL pin
is connected to ground, the POR time is 100 ms. When the PORSEL pin is
connected to VCC, the POR time is 12 ms.
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October 2007
Configuration & Testing
The nIO_PULLUP pin is a dedicated input that chooses whether the
internal pull-up resistors on the user I/O pins and dual-purpose
configuration I/O pins (nCSO, ASDO, DATA[7..0], nWS, nRS, RDYnBSY,
nCS, CS, RUnLU, PGM[2..0], CLKUSR, INIT_DONE, DEV_OE, DEV_CLR)
are on or off before and during configuration. A logic high (1.5, 1.8, 2.5,
3.3 V) turns off the weak internal pull-up resistors, while a logic low turns
them on.
Stratix II GX devices also offer a new power supply, VCCPD, which must
be connected to 3.3 V in order to power the 3.3-V/2.5-V buffer available
on the configuration input pins and JTAG pins. VCCPD applies to all the
JTAG input pins (TCK, TMS, TDI, and TRST) and the following
configuration pins: nCONFIG, DCLK (when used as an input),
nIO_PULLUP, DATA[7..0], RUnLU, nCE, nWS, nRS, CS, nCS, and
CLKUSR. The VCCSEL pin allows the VCCIO setting (of the banks where the
configuration inputs reside) to be independent of the voltage required by
the configuration inputs. Therefore, when selecting the VCCIO voltage,
you do not have to take the VIL and VIH levels driven to the configuration
inputs into consideration. The configuration input pins, nCONFIG, DCLK
(when used as an input), nIO_PULLUP, RUnLU, nCE, nWS, nRS, CS, nCS,
and CLKUSR, have a dual buffer design: a 3.3-V/2.5-V input buffer and a
1.8-V/1.5-V input buffer. The VCCSEL input pin selects which input buffer
is used. The 3.3-V/2.5-V input buffer is powered by VCCPD, while the 1.8V/1.5-V input buffer is powered by VCCIO.
VCCSEL is sampled during power-up. Therefore, the VCCSEL setting cannot
change on-the-fly or during a reconfiguration. The VCCSEL input buffer is
powered by VCCINT and must be hardwired to VCCPD or ground. A logic
high VCCSEL connection selects the 1.8-V/1.5-V input buffer; a logic low
selects the 3.3-V/2.5-V input buffer. VCCSEL should be set to comply with
the logic levels driven out of the configuration device or the MAX II
microprocessor.
If the design must support configuration input voltages of 3.3 V/2.5 V, set
VCCSEL to a logic low. You can set the VCCIO voltage of the I/O bank that
contains the configuration inputs to any supported voltage. If the design
must support configuration input voltages of 1.8 V/1.5 V, set VCCSEL to a
logic high and the VCCIO of the bank that contains the configuration
inputs to 1.8 V/1.5 V.
f
Altera Corporation
October 2007
For more information on multi-volt support, including information on
using TDO and nCEO in multi-volt systems, refer to the Stratix II GX
Architecture chapter in volume 1 of the Stratix II GX Device Handbook.
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Configuration
Configuration Schemes
You can load the configuration data for a Stratix II GX device with one of
five configuration schemes (refer to Table 3–4), chosen on the basis of the
target application. You can use a configuration device, intelligent
controller, or the JTAG port to configure a Stratix II GX device. A
configuration device can automatically configure a Stratix II GX device at
system power-up.
Multiple Stratix II GX devices can be configured in any of the five
configuration schemes by connecting the configuration enable (nCE) and
configuration enable output (nCEO) pins on each device. Stratix II GX
FPGAs offer the following:
■
■
■
Configuration data decompression to reduce configuration file
storage
Design security using configuration data encryption to protect
designs
Remote system upgrades for remotely updating Stratix II GX designs
Table 3–4 summarizes which configuration features can be used in each
configuration scheme.
f
Refer to the Configuring Stratix II & Stratix II GX Devices chapter in
volume 2 of the Stratix II GX Device Handbook for more information about
configuration schemes in Stratix II GX devices.
Table 3–4. Stratix II GX Configuration Features (Part 1 of 2)
Configuration
Scheme
Configuration Method
Design Security Decompression
v (1)
v
v (2)
v
v
v
v (3)
v
v
v
Enhanced configuration device
v
v
v
Download cable (4)
v
v
FPP
MAX II device or microprocessor and
flash device
AS
Serial configuration device
MAX II device or microprocessor and
flash device
v (1)
Enhanced configuration device
PS
PPA
Remote System
Upgrade
MAX II device or microprocessor and
flash device
3–6
Stratix II GX Device Handbook, Volume 1
v
Altera Corporation
October 2007
Configuration & Testing
Table 3–4. Stratix II GX Configuration Features (Part 2 of 2)
Configuration
Scheme
Configuration Method
Design Security Decompression
Remote System
Upgrade
Download cable (4)
JTAG
MAX II device or microprocessor and
flash device
Notes for Table 3–4:
(1)
(2)
(3)
(4)
In these modes, the host system must send a DCLK that is 4× the data rate.
The enhanced configuration device decompression feature is available, while the Stratix II GX decompression
feature is not available.
Only remote update mode is supported when using the AS configuration scheme. Local update mode is not
supported.
The supported download cables include the Altera USB-Blaster universal serial bus (USB) port download cable,
MasterBlaster serial/USB communications cable, ByteBlaster II parallel port download cable, and the
ByteBlasterMV parallel port download cable.
Device Security Using Configuration Bitstream Encryption
Stratix II and Stratix II GX FPGAs are the industry’s first FPGAs with the
ability to decrypt a configuration bitstream using the AES algorithm.
When using the design security feature, a 128-bit security key is stored in
the Stratix II GX FPGA. To successfully configure a Stratix II GX FPGA
that has the design security feature enabled, the device must be
configured with a configuration file that was encrypted using the same
128-bit security key. The security key can be stored in non-volatile
memory inside the Stratix II GX device. This nonvolatile memory does
not require any external devices, such as a battery back up, for storage.
1
An encrypted configuration file is the same size as a
non-encrypted configuration file. When using a serial
configuration scheme such as passive serial (PS) or active serial
(AS), configuration time is the same whether or not the design
security feature is enabled. If the fast passive parallel (FPP)
scheme is used with the design security or decompression
feature, a 4× DCLK is required. This results in a slower
configuration time when compared to the configuration time of
an FPGA that has neither the design security nor the
decompression feature enabled. For more information about
this feature, contact an Altera sales representative.
Device Configuration Data Decompression
Stratix II GX FPGAs support decompression of configuration data, which
saves configuration memory space and time. This feature allows you to
store compressed configuration data in configuration devices or other
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October 2007
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Stratix II GX Device Handbook, Volume 1
Configuration
memory, and transmit this compressed bitstream to Stratix II GX FPGAs.
During configuration, the Stratix II GX FPGA decompresses the bitstream
in real time and programs its SRAM cells. Stratix II GX FPGAs support
decompression in the FPP (when using a MAX II device or
microprocessor and flash memory), AS, and PS configuration schemes.
Decompression is not supported in the PPA configuration scheme nor in
JTAG-based configuration.
Remote System Upgrades
Shortened design cycles, evolving standards, and system deployments in
remote locations are difficult challenges faced by system designers.
Stratix II GX devices can help effectively deal with these challenges with
their inherent re programmability and dedicated circuitry to perform
remote system updates. Remote system updates help deliver feature
enhancements and bug fixes without costly recalls, reducing time to
market, and extending product life.
Stratix II GX FPGAs feature dedicated remote system upgrade circuitry to
facilitate remote system updates. Soft logic (Nios processor or user logic)
implemented in the Stratix II GX device can download a new
configuration image from a remote location, store it in configuration
memory, and direct the dedicated remote system upgrade circuitry to
initiate a reconfiguration cycle. The dedicated circuitry performs error
detection during and after the configuration process, recovers from any
error condition by reverting back to a safe configuration image, and
provides error status information. This dedicated remote system upgrade
circuitry avoids system downtime and is the critical component for
successful remote system upgrades.
Remote system configuration is supported in the following Stratix II GX
configuration schemes: FPP, AS, PS, and PPA. Remote system
configuration can also be implemented in conjunction with Stratix II GX
features such as real-time decompression of configuration data and
design security using AES for secure and efficient field upgrades.
f
Refer to the Remote System Upgrades with Stratix II & Stratix II GX Devices
chapter in volume 2 of the Stratix II GX Device Handbook for more
information about remote configuration in Stratix II GX devices.
Configuring Stratix II GX FPGAs with JRunner
The JRunner™ software driver configures Altera FPGAs, including
Stratix II GX FPGAs, through the ByteBlaster II or ByteBlasterMV cables
in JTAG mode. The programming input file supported is in Raw Binary
File (.rbf) format. JRunner also requires a Chain Description File (.cdf)
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October 2007
Configuration & Testing
generated by the Quartus II software. JRunner is targeted for embedded
JTAG configuration. The source code is developed for the Windows NT
operating system (OS), but can be customized to run on other platforms.
f
For more information on the JRunner software driver, refer to the
AN 414: An Embedded Solution for PLD JTAG Configuration and the source
files on the Altera web site (www.altera.com).
Programming Serial Configuration Devices with SRunner
A serial configuration device can be programmed in-system by an
external microprocessor using SRunner. SRunner is a software driver
developed for embedded serial configuration device programming that
can be easily customized to fit into different embedded systems. SRunner
reads a Raw Programming Data file (.rpd) and writes to serial
configuration devices. The serial configuration device programming time
using SRunner is comparable to the programming time when using the
Quartus II software.
f
For more information about SRunner, refer to the AN 418 SRunner: An
Embedded Solution for Serial Configuration Device Programming and the
source code on the Altera web site.
f
For more information on programming serial configuration devices,
refer to the Serial Configuration Devices (EPCS1, EPCS4, EPCS64, and
EPCS128) Data Sheet in the Configuration Handbook.
Configuring Stratix II FPGAs with the MicroBlaster Driver
The MicroBlaster software driver supports an RBF programming input
file and is ideal for embedded FPP or PS configuration. The source code
is developed for the Windows NT operating system, although it can be
customized to run on other operating systems.
f
For more information on the MicroBlaster software driver, refer to the
Configuring the MicroBlaster Fast Passive Parallel Software Driver White
Paper or the Configuring the MicroBlaster Passive Serial Software Driver
White Paper on the Altera web site.
PLL Reconfiguration
The phase-locked loops (PLLs) in the Stratix II GX device family support
reconfiguration of their multiply, divide, VCO-phase selection, and
bandwidth selection settings without reconfiguring the entire device. You
can use either serial data from the logic array or regular I/O pins to
program the PLL’s counter settings in a serial chain. This option provides
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October 2007
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Stratix II GX Device Handbook, Volume 1
Temperature Sensing Diode (TSD)
considerable flexibility for frequency synthesis, allowing real-time
variation of the PLL frequency and delay. The rest of the device is
functional while reconfiguring the PLL.
f
Temperature
Sensing Diode
(TSD)
See the PLLs in Stratix II & Stratix II GX Devices chapter in volume 2 of
the Stratix II GX Device Handbook for more information on Stratix II GX
PLLs.
Stratix II GX devices include a diode-connected transistor for use as a
temperature sensor in power management. This diode is used with an
external digital thermometer device. These devices steer bias current
through the Stratix II GX diode, measuring forward voltage and
converting this reading to temperature in the form of an 8-bit signed
number (7 bits plus 1 sign bit). The external device’s output represents the
junction temperature of the Stratix II GX device and can be used for
intelligent power management.
The diode requires two pins (tempdiodep and tempdioden) on the
Stratix II GX device to connect to the external temperature-sensing
device, as shown in Figure 3–1. The temperature sensing diode is a
passive element and therefore can be used before the Stratix II GX device
is powered.
Figure 3–1. External Temperature-Sensing Diode
Stratix II GX Device
Temperature-Sensing
Device
tempdiodep
tempdioden
3–10
Stratix II GX Device Handbook, Volume 1
Altera Corporation
October 2007
Configuration & Testing
Table 3–5 shows the specifications for bias voltage and current of the
Stratix II GX temperature sensing diode.
Table 3–5. Temperature-Sensing Diode Electrical Characteristics
Parameter
IBIAS high
IBIAS low
VBP - VBN
Minimum
Typical
Maximum
Unit
80
100
120
μA
8
10
12
μA
0.9
V
0.3
VBN
0.7
V
Series resistance
Ω
3
The temperature-sensing diode works for the entire operating range
shown in Figure 3–2.
Figure 3–2. Temperature Versus Temperature-Sensing Diode Voltage
0.95
0.90
100 μA Bias Current
10 μA Bias Current
0.85
0.80
0.75
Voltage
(Across Diode)
0.70
0.65
0.60
0.55
0.50
0.45
0.40
–55
–30
–5
20
45
70
95
120
Temperature (˚C)
Altera Corporation
October 2007
3–11
Stratix II GX Device Handbook, Volume 1
Automated Single Event Upset (SEU) Detection
The temperature sensing diode is a very sensitive circuit which can be
influenced by noise coupled from other traces on the board, and possibly
within the device package itself, depending on device usage. The
interfacing device registers temperature based on millivolts of difference
as seen at the TSD. Switching I/O near the TSD pins can affect the
temperature reading. Altera recommends you take temperature readings
during periods of no activity in the device (for example, standby mode
where no clocks are toggling in the device), such as when the nearby I/Os
are at a DC state, and disable clock networks in the device.
Automated
Single Event
Upset (SEU)
Detection
Stratix II GX devices offer on-chip circuitry for automated checking of
single event upset (SEU) detection. Some applications that require the
device to operate error free at high elevations or in close proximity to
Earth’s North or South Pole will require periodic checks to ensure
continued data integrity. The error detection cyclic redundancy check
(CRC) feature controlled by the Device & Pin Options dialog box in the
Quartus II software uses a 32-bit CRC circuit to ensure data reliability and
is one of the best options for mitigating SEU.
You can implement the error detection CRC feature with existing circuitry
in Stratix II GX devices, eliminating the need for external logic.
Stratix II GX devices compute CRC during configuration and checks the
computed-CRC against an automatically computed CRC during normal
operation. The CRC_ERROR pin reports a soft error when configuration
SRAM data is corrupted, triggering device reconfiguration.
Custom-Built Circuitry
Dedicated circuitry is built into Stratix II GX devices to automatically
perform error detection. This circuitry constantly checks for errors in the
configuration SRAM cells while the device is in user mode. You can
monitor one external pin for the error and use it to trigger a
reconfiguration cycle. You can select the desired time between checks by
adjusting a built-in clock divider.
Software Interface
Beginning with version 4.1 of the Quartus II software, you can turn on the
automated error detection CRC feature in the Device & Pin Options
dialog box. This dialog box allows you to enable the feature and set the
internal frequency of the CRC between 400 kHz to 50 MHz. This controls
the rate that the CRC circuitry verifies the internal configuration SRAM
bits in the Stratix II GX FPGA.
f
For more information on CRC, refer to AN 357: Error Detection Using CRC
in Altera FPGA Devices.
3–12
Stratix II GX Device Handbook, Volume 1
Altera Corporation
October 2007
Configuration & Testing
Referenced
Documents
This chapter references the following documents:
■
■
■
■
■
■
■
■
■
■
■
Document
Revision History
AN 357: Error Detection Using CRC in Altera FPGA Devices
AN 414: An Embedded Solution for PLD JTAG Configuration
AN 418 SRunner: An Embedded Solution for Serial Configuration Device
Programming
Configuring Stratix II & Stratix II GX Devices chapter in volume 2 of
the Stratix II GX Device Handbook
Configuring the MicroBlaster Fast Passive Parallel Software Driver White
Paper
Configuring the MicroBlaster Passive Serial Software Driver White Paper
MorphIO: An I/O Reconfiguration Solution for Altera Devices White
Paper
PLLs in Stratix II & Stratix II GX Devices chapter in volume 2 of the
Stratix II GX Device Handbook
Remote System Upgrades with Stratix II & Stratix II GX Devices chapter
in volume 2 of the Stratix II GX Device Handbook
Serial Configuration Devices (EPCS1, EPCS4, EPCS64, and EPCS128)
Data Sheet in the Configuration Handbook
Stratix II GX Architecture chapter in volume 1 of the Stratix II GX
Device Handbook.
Table 3–6 shows the revision history for this chapter.
Table 3–6. Document Revision History
Date and
Document
Version
Changes Made
Summary of Changes
October 2007
v1.4
Minor text edits.
—
August 2007
v1.3
Updated the note in the “IEEE Std. 1149.1 JTAG
Boundary-Scan Support”
—
Updated Table 3–3.
—
Added the “Referenced Documents” section.
—
May 2007
v1.2
Updated the “Temperature Sensing Diode
(TSD)” section.
—
February 2007
v1.1
Added the “Document Revision History” section Added support information for the
to this chapter.
Stratix II GX device.
October 2005
v1.0
Added chapter to the Stratix II GX Device
Handbook.
Altera Corporation
October 2007
—
3–13
Stratix II GX Device Handbook, Volume 1
Document Revision History
3–14
Stratix II GX Device Handbook, Volume 1
Altera Corporation
October 2007
4. DC and Switching
Characteristics
SIIGX51006-4.6
Operating
Conditions
Stratix® II GX devices are offered in both commercial and industrial
grades. Industrial devices are offered in -4 speed grade and commercial
devices are offered in -3 (fastest), -4, and -5 speed grades.
Tables 4–1 through 4–51 provide information on absolute maximum
ratings, recommended operating conditions, DC electrical characteristics,
and other specifications for Stratix II GX devices.
Absolute Maximum Ratings
Table 4–1 contains the absolute maximum ratings for the Stratix II GX
device family.
Table 4–1. Stratix II GX Device Absolute Maximum Ratings
Symbol
Parameter
Notes (1), (2),(3)
Conditions
Minimum
Maximum
Unit
VCCINT
Supply voltage
With respect to ground
–0.5
1.8
V
VCCIO
Supply voltage
With respect to ground
–0.5
4.6
V
VCCPD
Supply voltage
With respect to ground
–0.5
4.6
V
VI
DC input voltage (4)
–0.5
4.6
V
IOUT
DC output current, per pin
–25
40
mA
TSTG
Storage temperature
No bias
–65
150
C
TJ
Junction temperature
BGA packages under bias
–55
125
C
Notes to Table 4–1:
(1)
(2)
(3)
(4)
See the Operating Requirements for Altera Devices Data Sheet for more information.
Conditions beyond those listed in Table 4–1 may cause permanent damage to a device. Additionally, device
operation at the absolute maximum ratings for extended periods of time may have adverse affects on the device.
Supply voltage specifications apply to voltage readings taken at the device pins, not at the power supply.
During transitions, the inputs may overshoot to the voltage shown in Table 4–2 based upon the input duty cycle.
The DC case is equivalent to 100% duty cycle. During transitions, the inputs may undershoot to –2.0 V for input
currents less than 100 mA and periods shorter than 20 ns.
Altera Corporation
June 2009
4–1
Operating Conditions
Table 4–2. Maximum Duty Cycles in Voltage Transitions
Symbol
Parameter
Condition
Maximum Duty Cycles
(%) (1)
VI
Maximum duty cycles
in voltage transitions
VI = 4.0 V
100
VI = 4.1 V
90
VI = 4.2 V
50
VI = 4.3 V
30
VI = 4.4 V
17
VI = 4.5 V
10
Note to Table 4–2:
(1)
During transition, the inputs may overshoot to the voltages shown based on the
input duty cycle. The duty cycle case is equivalent to 100% duty cycle.
Recommended Operating Conditions
Table 4–3 contains the Stratix II GX device family recommended
operating conditions.
Table 4–3. Stratix II GX Device Recommended Operating Conditions (Part 1 of 2)
Symbol
Parameter
Conditions
Note (1)
Minimum
Maximum
Unit
1.15
1.25
V
100 μs ≤rise time ≤100 ms (3), (6)
3.135
(3.00)
3.465
(3.60)
V
Supply voltage for output
buffers, 2.5-V operation
100 μs ≤rise time ≤100 ms (3)
2.375
2.625
V
Supply voltage for output
buffers, 1.8-V operation
100 μs ≤rise time ≤100 ms (3)
1.71
1.89
V
Supply voltage for output
buffers, 1.5-V operation
100 μs ≤rise time ≤100 ms (3)
1.425
1.575
V
Supply voltage for output
buffers, 1.2-V operation
100 μs ≤rise time ≤100 ms (3)
1.15
1.25
V
VCCPD
Supply voltage for pre-drivers as 100 μs ≤rise time ≤100 ms (4)
well as configuration and JTAG
I/O buffers.
3.135
3.465
V
VI
Input voltage (see Table 4–2)
–0.5
4.0
V
VO
Output voltage
0
VCCIO
V
VCCINT
Supply voltage for internal logic
and input buffers
100 μs ≤rise time ≤100 ms (3)
VCCIO
Supply voltage for output
buffers, 3.3-V operation
4–2
Stratix II GX Device Handbook, Volume 1
(2), (5)
Altera Corporation
June 2009
DC and Switching Characteristics
Table 4–3. Stratix II GX Device Recommended Operating Conditions (Part 2 of 2)
Symbol
TJ
Parameter
Operating junction temperature
Conditions
Minimum
Maximum
Unit
0
85
C
–40
100
C
For commercial use
For industrial use
Note (1)
Notes to Table 4–3:
(1)
(2)
(3)
(4)
(5)
(6)
Supply voltage specifications apply to voltage readings taken at the device pins, not at the power supply.
During transitions, the inputs may overshoot to the voltage shown in Table 4–2 based upon the input duty cycle.
The DC case is equivalent to 100% duty cycle. During transitions, the inputs may undershoot to –2.0 V for input
currents less than 100 mA and periods shorter than 20 ns.
Maximum VCC rise time is 100 ms, and VCC must rise monotonically from ground to VCC.
VCCPD must ramp-up from 0 V to 3.3 V within 100 μs to 100 ms. If VCCPD is not ramped up within this specified
time, the Stratix II GX device will not configure successfully. If the system does not allow for a VCCPD ramp-up time
of 100 ms or less, hold nCONFIG low until all power supplies are reliable.
All pins, including dedicated inputs, clock, I/O, and JTAG pins, may be driven before VCCINT, VCCPD, and VCCIO
are powered.
VCCIO maximum and minimum conditions for PCI and PCI-X are shown in parentheses.
Transceiver Block Characteristics
Tables 4–4 through 4–6 contain transceiver block specifications.
Table 4–4. Stratix II GX Transceiver Block Absolute Maximum Ratings
Symbol
Parameter
Conditions
Note (1)
Minimum Maximum
Units
VCCA
Transceiver block supply
voltage
Commercial and
industrial
–0.5
4.6
V
VCCP
Transceiver block supply
voltage
Commercial and
industrial
–0.5
1.8
V
VCCR
Transceiver block supply
Voltage
Commercial and
industrial
–0.5
1.8
V
VCCT
Transceiver block supply
voltage
Commercial and
industrial
–0.5
1.8
V
VCCT_B
Transceiver block supply
voltage
Commercial and
industrial
–0.5
1.8
V
VCCL
Transceiver block supply
voltage
Commercial and
industrial
–0.5
1.8
V
VCCH_B
Transceiver block supply
voltage
Commercial and
industrial
–0.5
2.4
V
Note to Table 4–4:
(1)
The device can tolerate prolonged operation at this absolute maximum, as long as the maximum specification is
not violated.
Altera Corporation
June 2009
4–3
Stratix II GX Device Handbook, Volume 1
Operating Conditions
Table 4–5. Stratix II GX Transceiver Block Operating Conditions
Symbol
Parameter
Conditions
Minimum
Typical
Maximum
Units
VCCA
Transceiver block supply
voltage
Commercial
and industrial
3.135
3.3
3.465
V
VCCP
Transceiver block supply
voltage
Commercial
and industrial
1.15
1.2
1.25
V
VCCR
Transceiver block supply
voltage
Commercial
and industrial
1.15
1.2
1.25
V
VCCT
Transceiver block supply
voltage
Commercial
and industrial
1.15
1.2
1.25
V
VCCT_B
Transceiver block supply
voltage
Commercial
and industrial
1.15
1.2
1.25
V
VCCL
Transceiver block supply
voltage
Commercial
and industrial
1.15
1.2
1.25
V
VCCH_B (2)
Transceiver block supply
voltage
Commercial
and industrial
1.15
1.2
1.25
V
RREF (1)
Reference resistor
Commercial
and industrial
1.425
1.5
1.575
V
2000 –1%
2000
2000 +1%
Ω
Notes to Table 4–5:
(1)
(2)
The DC signal on this pin must be as clean as possible. Ensure that no noise is coupled to this pin.
Refer to the Stratix II GX Device Handbook, volume 2, for more information.
Table 4–6. Stratix II GX Transceiver Block AC Specification (Part 1 of 6)
Symbol /
Description
Conditions
-3 Speed Commercial
Speed Grade
-4 Speed Commercial
and Industrial Speed
Grade
-5 Speed Commercial
Speed Grade
Unit
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Input
frequency from
REFCLK input
50
-
622.08
50
-
622.08
50
-
622.08
MHz
Input
frequency from
PLD input
50
-
325
50
-
325
50
-
325
MHz
3.3
V
Reference clock
Input clock
jitter
Absolute VM A X
for a REFCLK
pin (12)
Refer to Table 4–20 on page 4–36 for the input jitter specifications for the
reference clock.
-
4–4
Stratix II GX Device Handbook, Volume 1
-
3.3
-
-
3.3
-
-
Altera Corporation
June 2009
DC and Switching Characteristics
Table 4–6. Stratix II GX Transceiver Block AC Specification (Part 2 of 6)
Symbol /
Description
Conditions
-3 Speed Commercial
Speed Grade
-4 Speed Commercial
and Industrial Speed
Grade
-5 Speed Commercial
Speed Grade
Unit
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
-0.3
-
-
-0.3
-
-
-0.3
-
-
V
-
0.2
-
-
0.2
-
-
0.2
-
UI
Duty cycle
40
-
60
40
-
60
40
-
60
%
Peak-to-peak
differential
input voltage
200
-
2000
200
-
2000
200
-
2000
mV
30
0 to
-0.5%
-
33
0 to
-0.5%
30
0 to
-0.5%
-
33
0 to
-0.5%
30
0 to
-0.5%
-
33
0 to
-0.5%
kHz
Absolute VM I N
for a REFCLK
pin (12)
Rise/fall time
Spreadspectrum
clocking
On-chip
termination
resistors
115 ±20%
115 ±20%
115 ±20%
Ω
VI C M (AC
coupled) (12)
1200 ±5%
1200 ±5%
1200 ±5%
mV
VI C M (DC
coupled) (4)
0.25
Rref
-
0.55
0.25
2000 ±1%
-
0.55
0.25
2000 ±1%
-
0.55
V
Ω
2000 ±1%
Transceiver Clocks
Calibration
block clock
frequency
10
-
125
10
-
125
10
-
125
MHz
Calibration
block minimum
power-down
pulse width
30
-
-
30
-
-
30
-
-
ns
Time taken for
one-time
calibration
-
-
8
-
-
8
-
-
8
ms
PCI Express
Receiver
Detect
-
125
-
-
125
-
-
125
-
MHz
Adaptive
Equalization
(AEQ)
2.5
-
125
2.5
-
125
-
-
-
MHz
fixedclk
clock
frequency
Altera Corporation
June 2009
4–5
Stratix II GX Device Handbook, Volume 1
Operating Conditions
Table 4–6. Stratix II GX Transceiver Block AC Specification (Part 3 of 6)
Symbol /
Description
Conditions
reconfig_c
lk clock
-3 Speed Commercial
Speed Grade
-4 Speed Commercial
and Industrial Speed
Grade
-5 Speed Commercial
Speed Grade
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
2.5
-
50
2.5
-
50
2.5
-
50
100
-
-
100
-
-
100
-
-
Unit
MHz
frequency
Transceiver
block minimum
power-down
pulse width
ns
Receiver
Data rate
600
-
6375
600
-
5000
600
-
4250
Mbps
Absolute VM A X
for a receiver
pin (1)
-
-
2.0
-
-
2.0
-
-
2.0
V
Absolute VM I N
for a receiver
pin
-0.4
-
-
-0.4
-
-
-0.4
-
-
V
Maximum
peak-to-peak
differential
input voltage
VI D (diff p-p)
VC M = 0.85 V
-
-
3.3
-
-
3.3
-
-
3.3
V
Minimum
peak-to-peak
differential
input voltage
VI D (diff p-p)
VC M = 0.85 V
DC Gain =
≥ 3 dB
160
-
-
160
-
-
160
-
-
mV
VI C M
VI C M = 0.85
V setting
850±10%
850±10%
850±10%
mV
VI C M = 1.2 V
setting (11)
1200±10%
1200±10%
1200±10%
mV
100 Ω setting
100±15%
100±15%
100±15%
Ω
120 Ω setting
120±15%
120±15%
120±15%
Ω
150 Ω setting
150±15%
150±15%
150±15%
Ω
On-chip
termination
resistors
Bandwidth at
6.375 Gbps
BW = Low
-
20
-
-
-
-
-
-
-
MHz
BW = Med
-
35
-
-
-
-
-
-
-
MHz
BW = High
-
45
-
-
-
-
-
-
-
MHz
4–6
Stratix II GX Device Handbook, Volume 1
Altera Corporation
June 2009
DC and Switching Characteristics
Table 4–6. Stratix II GX Transceiver Block AC Specification (Part 4 of 6)
Symbol /
Description
Bandwidth at
3.125 Gbps
Bandwidth at
2.5 Gbps
Conditions
-3 Speed Commercial
Speed Grade
-4 Speed Commercial
and Industrial Speed
Grade
-5 Speed Commercial
Speed Grade
Unit
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
BW = Low
-
30
-
-
30
-
-
30
-
MHz
BW = Med
-
40
-
-
40
-
-
40
-
MHz
BW = High
-
50
-
-
50
-
-
50
-
MHz
BW = Low
-
35
-
-
35
-
-
35
-
MHz
BW = Med
-
50
-
-
50
-
-
50
-
MHz
BW = High
-
60
-
-
60
-
-
60
-
MHz
Return loss
differential
mode
100 MHz to 2.5 GHz (XAUI): -10 dB
50 MHz to 1.25 GHz (PCI-E): -10 dB
100 MHz to 4.875 GHz (OIF/CEI): -8dB
4.875 GHz to 10 GHz (OIF/CEI): 16.6 dB/decade slope
Return loss
common mode
100 MHz to 2.5 GHz (XAUI): -6 dB
50 MHz to 1.25 GHz (PCI-E): -6 dB
100 MHz to 4.875 GHz (OIF/CEI): -6dB
4.875 GHz to 10 GHz (OIF/CEI): 16.6 dB/decade slope
Programmable
PPM detector
(2)
±62.5, 100, 125, 200,
250, 300,
500, 1000
±62.5, 100, 125, 200,
250, 300,
500, 1000
±62.5, 100, 125, 200,
250, 300,
500, 1000
ppm
Run length (3),
(9)
80
80
80
UI
Programmable
equalization
-
-
16
-
-
16
-
-
16
dB
65
-
175
65
-
175
65
-
175
mV
CDR LTR TIme
(5), (9)
-
-
75
-
-
75
-
-
75
us
CDR Minimum
T1b (6), (9)
15
-
-
15
-
-
15
-
-
us
LTD lock time
(7), (9)
0
100
4000
0
100
4000
0
100
4000
ns
Data lock time
from
-
-
4
-
-
4
-
-
4
us
Signal
detect/loss
threshold (4)
rx_freqloc
ked (8), (9)
Programmable
DC gain
0, 3, 6
0, 3, 6
0, 3, 6
Transmitter
Altera Corporation
June 2009
4–7
Stratix II GX Device Handbook, Volume 1
dB
Operating Conditions
Table 4–6. Stratix II GX Transceiver Block AC Specification (Part 5 of 6)
Symbol /
Description
Conditions
Data rate
VO C M
On-chip
termination
resistors
-3 Speed Commercial
Speed Grade
-4 Speed Commercial
and Industrial Speed
Grade
-5 Speed Commercial
Speed Grade
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
600
-
6375
600
-
5000
600
-
4250
Unit
Mbps
VO C M = 0.6 V
setting
580±10%
580±10%
580±10%
mV
VO C M = 0.7 V
setting
680±10%
680±10%
680±10%
mV
100 Ω setting
108±10%
108±10%
108±10%
Ω
120 Ω setting
125±10%
125±10%
125±10%
Ω
150 Ω setting
152±10%
152±10%
152±10%
Ω
Return loss
differential
mode
312 MHz to 625 MHz (XAUI): -10 dB
625 MHz to 3.125 GHz (XAUI): -10 dB/decade slope
50 MHz to 1.25 GHz (PCI-E): -10dB
100 MHz to 4.875 GHz (OIF/CEI): -8db
4.875 GHz to 10 GHz (OIF/CEI): 16.6 dB/decade slope
Return loss
common mode
50 MHz to 1.25 GHz (PCI-E): -6dB
100 MHz to 4.875 GHz (OIF/CEI): -6db
4.875 GHz to 10 GHz (OIF/CEI): 16.6 dB/decade slope
Rise time
35
-
65
35
-
65
35
-
65
ps
Fall time
35
-
65
35
-
65
35
-
65
ps
-
-
15
-
-
15
-
-
15
ps
Intratransceiver
block skew (x4)
-
-
100
-
-
100
-
-
100
ps
Intertransceiver
block skew (x8)
-
-
300
-
-
300
-
-
300
ps
VCO
frequency
range (low
gear)
500
-
1562.5
500
-
1562.5
500
-
1562.5
MHz
VCO
frequency
range (high
gear)
1562.5
3187.5
1562.5
2500
1562.
5
-
2125
MHz
Intra
differential pair
skew
VOD =
800 mV
TXPLL (TXPLL0 and TXPLL1)
4–8
Stratix II GX Device Handbook, Volume 1
Altera Corporation
June 2009
DC and Switching Characteristics
Table 4–6. Stratix II GX Transceiver Block AC Specification (Part 6 of 6)
Symbol /
Description
Bandwidth at
6.375 Gbps
Bandwidth at
3.125 Gbps
Bandwidth at
2.5 Gbps
Conditions
BW = Low
-3 Speed Commercial
Speed Grade
-4 Speed Commercial
and Industrial Speed
Grade
-5 Speed Commercial
Speed Grade
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
-
2
-
-
-
-
-
-
-
Unit
MHz
BW = Med
-
3
-
-
-
-
-
-
-
MHz
BW = High
-
7
-
-
-
-
-
-
-
MHz
BW = Low
-
3
-
-
3
-
-
3
-
MHz
BW = Med
-
5
-
-
5
-
-
5
-
MHz
BW = High
-
9
-
-
9
-
-
9
-
MHz
BW = Low
-
1
-
-
1
-
-
1
-
MHz
BW = Med
-
2
-
-
2
--
-
2
-
MHz
BW = High
-
4
-
-
4
-
-
4
-
MHz
-
-
100
-
-
100
-
-
100
us
25
-
250
25
-
250
25
-
200
MHz
TX PLL lock
time from
gxb_
powerdown
deassertion
(9), (10)
PLD-Transceiver Interface
Interface
speed
Digital Reset
Pulse Width
Minimum is 2 parallel clock cycles
Notes to Table 4–6:
(1)
(2)
(3)
(4)
(5)
(6)
The device cannot tolerate prolonged operation at this absolute maximum. Refer to Figure 4–5 for more information.
The rate matcher supports only up to +/-300 ppm.
This parameter is measured by embedding the run length data in a PRBS sequence.
This feature is only available in PCI-Express (PIPE) mode.
Time taken to rx_pll_locked goes high from rx_analogreset deassertion. Refer to Figure 4–1.
This is how long GXB needs to stay in LTR mode after rx_pll_locked is asserted and before rx_locktodata is
asserted in manual mode. Refer to Figure 4–1.
(7) Time taken to recover valid data from GXB after rx_locktodata signal is asserted in manual mode. Measurement
results are based on PRBS31, for native data rates only. Refer to Figure 4–1.
(8) Time taken to recover valid data from GXB after rx_freqlocked signal goes high in automatic mode. Measurement
results are based on PRBS31, for native data rates only. Refer to Figure 4–1.
(9) Please refer to the Protocol Characterization documents for lock times specific to the protocols.
(10) Time taken to lock TX PLL from gxb_powerdown deassertion.
(11) The 1.2 V RX VICM setting is intended for DC-coupled LVDS links.
(12) For AC-coupled links, the on-chip biasing circuit is switched off before and during configuration. Make sure that input
specifications are not violated during this period.
Altera Corporation
June 2009
4–9
Stratix II GX Device Handbook, Volume 1
Operating Conditions
Figure 4–1 shows the lock time parameters in manual mode, Figure 4–2
shows the lock time parameters in automatic mode.
1
LTD = Lock to data
LTR = Lock to reference clock
Figure 4–1. Lock Time Parameters for Manual Mode
r x_analogreset
CDR status
LTR
LTD
r x_pll_locked
r x_locktodata
Invalid Data
Valid data
r x_dataout
CDR LTR Time
LTD lock time
CDR Minimum T1b
4–10
Stratix II GX Device Handbook, Volume 1
Altera Corporation
June 2009
DC and Switching Characteristics
Figure 4–2. Lock Time Parameters for Automatic Mode
LTR
CDR status
LTD
r x_freqlocked
Invalid
r x_dataout
Valid
data
data
Data lock time from rx_freqlocked
Figures 4–3 and 4–4 show differential receiver input and transmitter
output waveforms, respectively.
Figure 4–3. Receiver Input Waveform
Single-Ended Waveform
Positive Channel (p)
VID
Negative Channel (n)
VCM
Ground
Differential Waveform
VID (diff peak-peak) = 2 x VID (single-ended)
VID
p−n=0V
VID
Altera Corporation
June 2009
4–11
Stratix II GX Device Handbook, Volume 1
Operating Conditions
Figure 4–4. Transmitter Output Waveform
Single-Ended Waveform
Positive Channel (p)
VOD
Negative Channel (n)
VCM
Ground
Differential Waveform
VOD (diff peak-peak) = 2 x VOD (single-ended)
VOD
p−n=0V
VOD
Figure 4–5. Maximum Receiver Input Pin Voltage
Single-Ended Waveform
Positive Channel (p)
V(single-ended p-p)max = 3.3 V/2
Negative Channel (n)
VCM = 0.85 V
Ground
VMAX = VCM + V(single-ended p-p)max = 0.85 + 0.825 = 1.675 V (1)
2
Note to Figure 4–5:
(1)
The absolute VMAX that the receiver input pins can tolerate is 2 V.
Tables 4–7 through 4–12 show the typical VOD for data rates from
600 Mbps to 6.375 Gbps. The specification is for measurement at the
package ball.
Table 4–7. Typical VOD Setting, TX Term = 100 Ω Note (1)
VC C H TX = 1.5 V
VOD Typical (mV)
VOD Setting (mV)
200
400
600
800
1000
1200
1400
220
430
625
830
1020
1200
1350
Note to Table 4–7:
(1)
Applicable to data rates from 600 Mbps to 6.375 Gbps. Specification is for measurement at the package ball.
4–12
Stratix II GX Device Handbook, Volume 1
Altera Corporation
June 2009
DC and Switching Characteristics
Table 4–8. Typical VOD Setting, TX Term = 120 Ω Note (1)
VC C H TX = 1.5 V
VOD Typical (mV)
VOD Setting (mV)
240
480
720
960
1200
260
510
750
975
1200
Note to Table 4–8:
(1)
Applicable to data rates from 600 Mbps to 6.375 Gbps. Specification is for
measurement at the package ball.
Table 4–9. Typical VOD Setting, TX Term = 150 Ω Note (1)
VC C H TX = 1.5 V
VOD Typical (mV)
VOD Setting (mV)
300
600
900
1200
325
625
920
1200
Note to Table 4–9:
(1)
Applicable to data rates from 600 Mbps to 6.375 Gbps. Specification is for
measurement at the package ball.
Table 4–10. Typical VOD Setting, TX Term = 100 Ω Note (1)
VC C H TX = 1.2 V
VOD Typical (mV)
VOD Setting (mV)
320
480
640
800
960
344
500
664
816
960
Note to Table 4–10:
(1)
Altera Corporation
June 2009
Applicable to data rates from 600 Mbps to 3.125 Gbps. Specification is for
measurement at the package ball.
4–13
Stratix II GX Device Handbook, Volume 1
Operating Conditions
Table 4–11. Typical VOD Setting, TX Term = 120 Ω Note (1)
VC C H TX = 1.2 V
VOD Setting (mV)
VOD Typical (mV)
192
384
576
768
960
210
410
600
780
960
Note to Table 4–11:
(1)
Applicable to data rates from 600 Mbps to 3.125 Gbps. Specification is for
measurement at the package ball.
Table 4–12. Typical VOD Setting, TX Term = 150 Ω Note (1)
VC C H TX = 1.2 V
VOD Setting (mV)
VOD Typical (mV)
240
480
720
960
260
500
730
960
Note to Table 4–12:
(1)
Applicable to data rates from 600 Mbps to 3.125 Gbps. Specification is for
measurement at the package ball.
Tables 4–13 through 4–18 show the typical first post-tap pre-emphasis.
Table 4–13. Typical Pre-Emphasis (First Post-Tap), Note (1) (Part 1 of 2)
VC C H TX
= 1.5 V
VOD
Setting
(mV)
First Post Tap Pre-Emphasis Level
1
2
3
4
5
6
7
8
9
457%
10
11
12
TX Term = 100 Ω
400
62%
112%
184%
600
24%
31%
56%
86%
800
20%
122%
168%
230%
329%
35%
53%
73%
96%
123%
156%
196%
237%
312%
387%
1000
23%
36%
49%
64%
79%
97%
118%
141%
165%
200%
1200
17%
25%
35%
45%
56%
68%
82%
95%
110%
125%
4–14
Stratix II GX Device Handbook, Volume 1
Altera Corporation
June 2009
DC and Switching Characteristics
Table 4–13. Typical Pre-Emphasis (First Post-Tap), Note (1) (Part 2 of 2)
VC C H TX
= 1.5 V
VOD
Setting
(mV)
First Post Tap Pre-Emphasis Level
1
2
3
1400
4
5
6
7
8
9
10
11
12
20%
26%
33%
41%
51%
58%
67%
77%
86%
Note to Table 4–13:
(1)
Applicable to data rates from 600 Mbps to 6.375 Gbps. Specification is for measurement at the package ball.
Table 4–14. Typical Pre-Emphasis (First Post-Tap), Note (1)
VC C H TX
= 1.5 V
VOD
Setting
(mV)
First Post Tap Pre-Emphasis Level
1
2
3
4
5
6
7
8
9
10
11
12
179%
226%
280%
405%
477%
TX Term = 120 Ω
240
45%
480
41%
76%
114%
166%
257%
355%
720
23%
38%
55%
84%
108%
137%
960
15%
1200
24%
36%
47%
64%
80%
97%
122%
140%
170%
196%
18%
22%
30%
41%
51%
63%
77%
86%
98%
116%
Note to Table 4–14:
(1)
Applicable to data rates from 600 Mbps to 6.375 Gbps. Specification is for measurement at the package ball.
Table 4–15. Typical Pre-Emphasis (First Post-Tap), Note (1) (Part 1 of 2)
VC C H TX
= 1.5 V
VOD
Setting
(mV)
First Post Tap Pre-Emphasis Level
1
2
3
4
5
6
7
8
9
10
11
12
TX Term = 150 Ω
300
32%
Altera Corporation
June 2009
85%
4–15
Stratix II GX Device Handbook, Volume 1
Operating Conditions
Table 4–15. Typical Pre-Emphasis (First Post-Tap), Note (1) (Part 2 of 2)
VC C H TX
= 1.5 V
VOD
Setting
(mV)
First Post Tap Pre-Emphasis Level
1
2
3
4
5
6
7
8
9
600
33%
53%
80%
115%
157%
195%
294%
386%
900
19%
28%
38%
56%
70%
86%
113%
17%
22%
31%
40%
52%
62%
1200
10
11
12
133%
168%
196%
242%
75%
86%
96%
112%
Note to Table 4–15:
(1)
Applicable to data rates from 600 Mbps to 6.375 Gbps. Specification is for measurement at the package ball.
Table 4–16. Typical Pre-Emphasis (First Post-Tap), Note (1)
VC C H TX
= 1.2 V
VOD
Setting
(mV)
First Post Tap Pre-Emphasis Level
1
2
3
4
5
6
7
8
9
10
11
12
24%
61%
114%
480
31%
55%
86%
121%
170%
232%
333%
640
20%
35%
54%
72%
95%
124%
157%
195%
233%
307%
373%
800
23%
36%
49%
64%
960
18%
25%
35%
44%
81%
97%
117%
140%
161%
195%
57%
69%
82%
94%
108%
127%
TX Term = 100 Ω
320
Note to Table 4–16:
(1)
Applicable to data rates from 600 Mbps to 3.125 Gbps. Specification is for measurement at the package ball.
4–16
Stratix II GX Device Handbook, Volume 1
Altera Corporation
June 2009
DC and Switching Characteristics
Table 4–17. Typical Pre-Emphasis (First Post-Tap), Note (1)
VC C H TX
= 1.2 V
VOD
Setting
(mV)
First Post Tap Pre-Emphasis Level
1
2
3
4
5
6
7
8
9
10
11
12
TX Term = 120 Ω
192
45%
384
41%
76%
114%
166%
257%
355%
576
23%
38%
55%
84%
108%
137%
179%
226%
280%
405%
477%
768
15%
24%
36%
47%
64%
80%
97%
122%
140%
170%
196%
18%
22%
30%
41%
51%
63%
77%
86%
98%
116%
960
Note to Table 4–17:
(1)
Applicable to data rates from 600 Mbps to 3.125 Gbps. Specification is for measurement at the package ball.
Table 4–18. Typical Pre-Emphasis (First Post-Tap), Note (1)
VC C H TX
= 1.2 V
VOD
Setting
(mV)
First Post Tap Pre-Emphasis Level
1
2
31%
85%
3
4
5
6
7
8
9
10
11
12
TX Term = 150 Ω
240
480
32%
52%
78%
112%
152%
195%
275%
720
19%
28%
37%
56%
68%
86%
108%
133%
169%
194%
239%
17%
22%
30%
39%
51%
59%
75%
85%
94%
109%
960
Note to Table 4–18:
(1)
Applicable to data rates from 600 Mbps to 3.125 Gbps. Specification is for measurement at the package ball.
Altera Corporation
June 2009
4–17
Stratix II GX Device Handbook, Volume 1
Operating Conditions
Table 4–19 shows the Stratix II GX transceiver block AC specifications.
Table 4–19. Stratix II GX Transceiver Block AC Specification Notes (1), (2), (3) (Part 1 of 19)
Symbol/
Description
Conditions
-3 Speed
Commercial Speed
Grade
Min
-4 Speed
Commercial and
Industrial Speed
Grade
-5 Speed
Commercial Speed
Grade
Typ
Max
Min
Typ
Max
Min
Typ
Max
Unit
SONET/SDH Transmit Jitter Generation (7)
Peak-to-peak jitter REFCLK =
at 622.08 Mbps
77.76 MHz
Pattern = PRBS23
VOD = 800 mV
No Pre-emphasis
-
-
0.1
-
-
0.1
-
-
0.1
UI
RMS jitter at
622.08 Mbps
REFCLK =
77.76 MHz
Pattern = PRBS23
VOD = 800 mV
No Pre-emphasis
-
-
0.01
-
-
0.01
-
-
0.01
UI
Peak-to-peak jitter REFCLK =
at 2488.32 Mbps
155.52 MHz
Pattern = PRBS23
VOD = 800 mV
No Pre-emphasis
-
-
0.1
-
-
0.1
-
-
0.1
UI
RMS jitter at
2488.32 Mbps
-
-
0.01
-
-
0.01
-
-
0.01
UI
REFCLK =
155.52 MHz
Pattern = PRBS23
VOD = 800 mV
No Pre-emphasis
4–18
Stratix II GX Device Handbook, Volume 1
Altera Corporation
June 2009
DC and Switching Characteristics
Table 4–19. Stratix II GX Transceiver Block AC Specification Notes (1), (2), (3) (Part 2 of 19)
Symbol/
Description
Conditions
-3 Speed
Commercial Speed
Grade
Min
Typ
Max
-4 Speed
Commercial and
Industrial Speed
Grade
Min
Typ
Max
-5 Speed
Commercial Speed
Grade
Min
Typ
Unit
Max
SONET/SDH Receiver Jitter Tolerance (7)
Jitter tolerance at
622.08 Mbps
Jitter tolerance at
2488.32 MBps
Altera Corporation
June 2009
Jitter frequency =
0.03 KHz
Pattern = PRBS23
No Equalization
DC Gain = 0 dB
> 15
> 15
> 15
UI
Jitter frequency = 25
KHZ Pattern =
PRBS23
No Equalization
DC Gain = 0 dB
> 1.5
> 1.5
> 1.5
UI
Jitter frequency =
250 KHz Pattern =
PRBS23
No Equalization
DC Gain = 0 dB
> 0.15
> 0.15
> 0.15
UI
Jitter frequency =
0.06 KHz
Pattern = PRBS23
No Equalization
DC Gain = 0 dB
> 15
> 15
> 15
UI
Jitter frequency =
100 KHZ
Pattern = PRBS23
No Equalization
DC Gain = 0 dB
> 1.5
> 1.5
> 1.5
UI
Jitter frequency =
1 MHz
Pattern = PRBS23
No Equalization
DC Gain = 0 dB
> 0.15
> 0.15
> 0.15
UI
Jitter frequency = 10
MHz
Pattern = PRBS23
No Equalization
DC Gain = 0 dB
> 0.15
> 0.15
> 0.15
UI
4–19
Stratix II GX Device Handbook, Volume 1
Operating Conditions
Table 4–19. Stratix II GX Transceiver Block AC Specification Notes (1), (2), (3) (Part 3 of 19)
Symbol/
Description
Conditions
-3 Speed
Commercial Speed
Grade
Min
Typ
-4 Speed
Commercial and
Industrial Speed
Grade
-5 Speed
Commercial Speed
Grade
Max
Min
Typ
Max
Min
Typ
Max
Unit
Fibre Channel Transmit Jitter Generation (8), (17)
Total jitter FC-1
REFCLK =
106.25 MHz
Pattern = CRPAT
VOD = 800 mV
No Pre-emphasis
-
-
0.23
-
-
0.23
-
-
0.23
UI
Deterministic jitter
FC-1
REFCLK =
106.25 MHz
Pattern = CRPAT
VOD = 800 mV
No Pre-emphasis
-
-
0.11
-
-
0.11
-
-
0.11
UI
Total jitter FC-2
REFCLK =
106.25 MHz
Pattern = CRPAT
VOD = 800 mV
No Pre-emphasis
-
-
0.33
-
-
0.33
-
-
0.33
UI
Deterministic jitter
FC-2
REFCLK =
106.25 MHz
Pattern = CRPAT
VOD = 800 mV
No Pre-emphasis
-
-
0.2
-
-
0.2
-
-
0.2
UI
Total jitter FC-4
REFCLK =
106.25 MHz
Pattern = CRPAT
VOD = 800 mV
No Pre-emphasis
-
-
0.52
-
-
0.52
-
-
0.52
UI
Deterministic jitter
FC-4
REFCLK =
106.25 MHz
Pattern = CRPAT
VOD = 800 mV
No Pre-emphasis
-
-
0.33
-
-
0.33
-
-
0.33
UI
Fibre Channel Receiver Jitter Tolerance (8), (18)
Deterministic jitter
FC-1
Pattern = CJTPAT
No Equalization
DC Gain = 0 dB
> 0.37
> 0.37
> 0.37
UI
Random jitter FC1
Pattern = CJTPAT
No Equalization
DC Gain = 0 dB
> 0.31
> 0.31
> 0.31
UI
4–20
Stratix II GX Device Handbook, Volume 1
Altera Corporation
June 2009
DC and Switching Characteristics
Table 4–19. Stratix II GX Transceiver Block AC Specification Notes (1), (2), (3) (Part 4 of 19)
Symbol/
Description
Conditions
-3 Speed
Commercial Speed
Grade
Min
Typ
Sinusoidal jitter
FC-1
Fc/25000
Fc/1667
> 0.1
Deterministic jitter
FC-2
Pattern = CJTPAT
No Equalization
DC Gain = 0 dB
> 0.33
Random jitter FC2
Pattern = CJTPAT
No Equalization
DC Gain = 0 dB
> 0.29
Sinusoidal jitter
FC-2
Fc/25000
> 1.5
Fc/1667
> 0.1
Deterministic jitter
FC-4
Pattern = CJTPAT
No Equalization
DC Gain = 0 dB
> 0.33
Random jitter FC4
Pattern = CJTPAT
No Equalization
DC Gain = 0 dB
> 0.29
Sinusoidal jitter
FC-4
Fc/25000
Fc/1667
Max
-4 Speed
Commercial and
Industrial Speed
Grade
Min
> 1.5
Typ
Max
-5 Speed
Commercial Speed
Grade
Min
> 1.5
Typ
Unit
Max
> 1.5
UI
> 0.1
> 0.1
UI
> 0.33
> 0.33
UI
> 0.29
> 0.29
UI
> 1.5
> 1.5
UI
> 0.1
> 0.1
UI
> 0.33
> 0.33
UI
> 0.29
> 0.29
UI
> 1.5
> 1.5
> 1.5
UI
> 0.1
> 0.1
> 0.1
UI
XAUI Transmit Jitter Generation (9)
Total jitter at
3.125 Gbps
REFCLK =
156.25 MHz
Pattern = CJPAT
VOD = 1200 mV
No Pre-emphasis
-
-
0.3
-
-
0.3
-
-
0.3
UI
Deterministic jitter
at 3.125 Gbps
REFCLK =
156.25 MHz
Pattern = CJPAT
VOD = 1200 mV
No Pre-emphasis
-
-
0.17
-
-
0.17
-
-
0.17
UI
XAUI Receiver Jitter Tolerance (9)
Total jitter
Pattern = CJPAT
No Equalization
DC Gain = 3 dB
> 0.65
> 0.65
> 0.65
UI
Deterministic jitter
Pattern = CJPAT
No Equalization
DC Gain = 3 dB
> 0.37
> 0.37
> 0.37
UI
Altera Corporation
June 2009
4–21
Stratix II GX Device Handbook, Volume 1
Operating Conditions
Table 4–19. Stratix II GX Transceiver Block AC Specification Notes (1), (2), (3) (Part 5 of 19)
Symbol/
Description
Conditions
-3 Speed
Commercial Speed
Grade
Min
Typ
Max
-4 Speed
Commercial and
Industrial Speed
Grade
Min
Typ
Max
-5 Speed
Commercial Speed
Grade
Min
Typ
Unit
Max
Peak-to-peak jitter Jitter frequency =
22.1 KHz
> 8.5
> 8.5
> 8.5
UI
Peak-to-peak jitter Jitter frequency =
1.875 MHz
> 0.1
> 0.1
> 0.1
UI
Peak-to-peak jitter Jitter frequency = 20
MHz
> 0.1
> 0.1
> 0.1
UI
PCI Express Transmit Jitter Generation (10)
Total jitter at 2.5
Gbps
Compliance pattern
VOD = 800 mV
Pre-emphasis
(1st post-tap) =
Setting 5
-
-
0.25
-
-
0.25
-
-
0.25
UI
PCI Express Receiver Jitter Tolerance (10)
Total jitter at 2.5
Gbps
> 0.6
Compliance pattern
No Equalization
DC gain = 3 dB
> 0.6
> 0.6
UI
Serial RapidIO Transmit Jitter Generation (11)
Deterministic Jitter Data Rate = 1.25,
(peak-to-peak)
2.5, 3.125 Gbps
REFCLK = 125 MHz
Pattern = CJPAT
VOD = 800 mV
No Pre-emphasis
-
-
0.17
-
-
0.17
-
-
0.17
UI
Total Jitter
(peak-to-peak)
-
-
0.35
-
-
0.35
-
-
0.35
UI
Data Rate = 1.25,
2.5, 3.125 Gbps
REFCLK = 125 MHz
Pattern = CJPAT
VOD = 800 mV
No Pre-emphasis
4–22
Stratix II GX Device Handbook, Volume 1
Altera Corporation
June 2009
DC and Switching Characteristics
Table 4–19. Stratix II GX Transceiver Block AC Specification Notes (1), (2), (3) (Part 6 of 19)
Symbol/
Description
Conditions
-3 Speed
Commercial Speed
Grade
Min
Typ
Max
-4 Speed
Commercial and
Industrial Speed
Grade
Min
Typ
Max
-5 Speed
Commercial Speed
Grade
Min
Typ
Unit
Max
Serial RapidIO Receiver Jitter Tolerance (11)
Deterministic Jitter Data Rate = 1.25,
2.5, 3.125 Gbps
Tolerance
(peak-to-peak)
REFCLK = 125 MHz
Pattern = CJPAT
Equalizer Setting =
0 for 1.25 Gbps
Equalizer Setting =
6 for 2.5 Gbps
Equalizer Setting =
6 for 3.125 Gbps
> 0.37
> 0.37
> 0.37
UI
Data Rate = 1.25,
2.5, 3.125 Gbps
REFCLK = 125 MHz
Pattern = CJPAT
Equalizer Setting =
0 for 1.25 Gbps
Equalizer Setting =
6 for 2.5 Gbps
Equalizer Setting =
6 for 3.125 Gbps
> 0.55
> 0.55
> 0.55
UI
Combined
Deterministic and
Random Jitter
Tolerance
(peak-to-peak)
Altera Corporation
June 2009
4–23
Stratix II GX Device Handbook, Volume 1
Operating Conditions
Table 4–19. Stratix II GX Transceiver Block AC Specification Notes (1), (2), (3) (Part 7 of 19)
Symbol/
Description
Conditions
-3 Speed
Commercial Speed
Grade
Min
Sinusoidal Jitter
Tolerance
(peak-to-peak)
Typ
Max
-4 Speed
Commercial and
Industrial Speed
Grade
Min
Typ
Max
-5 Speed
Commercial Speed
Grade
Min
Typ
Unit
Max
Jitter Frequency =
22.1 KHz
Data Rate = 1.25,
2.5, 3.125 Gbps
REFCLK = 125 MHz
Pattern = CJPAT
Equalizer Setting =
0 for 1.25 Gbps
Equalizer Setting =
6 for 2.5 Gbps
Equalizer Setting =
6 for 3.125 Gbps
> 8.5
> 8.5
> 8.5
UI
Jitter Frequency =
1.875 MHz
Data Rate = 1.25,
2.5, 3.125 Gbps
REFCLK = 125 MHz
Pattern = CJPAT
Equalizer Setting =
0 for 1.25 Gbps
Equalizer Setting =
6 for 2.5 Gbps
Equalizer Setting =
6 for 3.125 Gbps
> 0.1
> 0.1
> 0.1
UI
Jitter Frequency =
20 MHz
Data Rate = 1.25,
2.5, 3.125 Gbps
REFCLK = 125 MHz
Pattern = CJPAT
Equalizer Setting =
0 for 1.25 Gbps
Equalizer Setting =
6 for 2.5 Gbps
Equalizer Setting =
6 for 3.125 Gbps
> 0.1
> 0.1
> 0.1
UI
4–24
Stratix II GX Device Handbook, Volume 1
Altera Corporation
June 2009
DC and Switching Characteristics
Table 4–19. Stratix II GX Transceiver Block AC Specification Notes (1), (2), (3) (Part 8 of 19)
Symbol/
Description
Conditions
-3 Speed
Commercial Speed
Grade
-4 Speed
Commercial and
Industrial Speed
Grade
-5 Speed
Commercial Speed
Grade
Unit
Min
Typ
Max
Min
Typ
Max
Min
Typ
Max
Deterministic Jitter Data Rate =
(peak-to-peak)
1.25 Gbps
REFCLK = 125 MHz
Pattern = CRPAT
VOD = 1400 mV
No Pre-emphasis
-
-
0.14
-
-
0.14
-
-
0.14
UI
Total Jitter
(peak-to-peak)
-
-
0.279
-
-
0.279
-
-
0.279
UI
GIGE Transmit Jitter Generation (12)
Data Rate =
1.25 Gbps
REFCLK = 125 MHz
Pattern = CRPAT
VOD = 1400 mV
No Pre-emphasis
GIGE Receiver Jitter Tolerance (12)
Deterministic Jitter Data Rate =
1.25 Gbps
Tolerance
(peak-to-peak)
REFCLK = 125 MHz
Pattern = CJPAT
No Equalization
> 0.4
> 0.4
> 0.4
UI
Data Rate =
1.25 Gbps
REFCLK = 125 MHz
Pattern = CJPAT
No Equalization
> 0.66
> 0.66
> 0.66
UI
Combined
Deterministic and
Random Jitter
Tolerance
(peak-to-peak)
HiGig Transmit Jitter Generation (4), (13)
Deterministic Jitter Data Rate =
(peak-to-peak)
3.75 Gbps
REFCLK =
187.5 MHz
Pattern = CJPAT
VOD = 1200 mV
No Pre-emphasis
-
-
0.17
-
UI
Total Jitter
(peak-to-peak)
-
-
0.35
-
UI
Altera Corporation
June 2009
Data Rate =
3.75 Gbps
REFCLK =
187.5 MHz
Pattern = CJPAT
VOD = 1200 mV
No Pre-emphasis
4–25
Stratix II GX Device Handbook, Volume 1
Operating Conditions
Table 4–19. Stratix II GX Transceiver Block AC Specification Notes (1), (2), (3) (Part 9 of 19)
Symbol/
Description
Conditions
-3 Speed
Commercial Speed
Grade
Min
Typ
Max
-4 Speed
Commercial and
Industrial Speed
Grade
Min
Typ
Max
-5 Speed
Commercial Speed
Grade
Min
Typ
Unit
Max
HiGig Receiver Jitter Tolerance (13)
Deterministic Jitter Data Rate =
3.75 Gbps
Tolerance
(peak-to-peak)
REFCLK =
187.5 MHz
Pattern = CJPAT
No Equalization
DC Gain = 3 dB
> 0.37
-
-
UI
Data Rate =
3.75 Gbps
REFCLK =
187.5 MHz
Pattern = CJPAT
No Equalization
DC Gain = 3 dB
> 0.65
-
-
UI
Jitter Frequency =
22.1 KHz
Data Rate =
3.75 Gbps
REFCLK =
187.5 MHz
Pattern = CJPAT
No Equalization
DC Gain = 3 dB
> 8.5
-
-
UI
Combined
Deterministic and
Random Jitter
Tolerance
(peak-to-peak)
4–26
Stratix II GX Device Handbook, Volume 1
Altera Corporation
June 2009
DC and Switching Characteristics
Table 4–19. Stratix II GX Transceiver Block AC Specification Notes (1), (2), (3) (Part 10 of 19)
Symbol/
Description
Conditions
-3 Speed
Commercial Speed
Grade
Min
Sinusoidal Jitter
Tolerance
(peak-to-peak)
Typ
Max
-4 Speed
Commercial and
Industrial Speed
Grade
Min
Typ
Max
-5 Speed
Commercial Speed
Grade
Min
Typ
Unit
Max
Jitter Frequency =
1.875 MHz
Data Rate =
3.75 Gbps
REFCLK =
187.5 MHz
Pattern = CJPAT
No Equalization
DC Gain = 3 dB
> 0.1
-
-
UI
Jitter Frequency =
20 MHz
Data Rate =
3.75 Gbps
REFCLK =
187.5 MHz
Pattern = CJPAT
No Equalization
DC Gain = 3 dB
> 0.1
-
-
UI
(OIF) CEI Transmitter Jitter Generation (14)
Total Jitter
(peak-to-peak)
Data Rate =
6.375 Gbps
REFCLK =
318.75 MHz
Pattern = PRBS15
Vod=1000 mV (5)
No Pre-emphasis
BER = 10-12
0.3
N/A
N/A
UI
(OIF) CEI Receiver Jitter Tolerance (14)
Deterministic Jitter Data Rate =
6.375 Gbps
Tolerance
Pattern = PRBS31
(peak-to-peak)
Equalizer Setting =
15
DC Gain = 0 dB
BER = 10-12
Altera Corporation
June 2009
> 0.675
N/A
N/A
UI
4–27
Stratix II GX Device Handbook, Volume 1
Operating Conditions
Table 4–19. Stratix II GX Transceiver Block AC Specification Notes (1), (2), (3) (Part 11 of 19)
Symbol/
Description
Conditions
-3 Speed
Commercial Speed
Grade
Min
Combined
Deterministic and
Random Jitter
Tolerance
(peak-to-peak)
Sinusoidal Jitter
Tolerance
(peak-to-peak)
Typ
Max
-4 Speed
Commercial and
Industrial Speed
Grade
Min
Typ
Max
-5 Speed
Commercial Speed
Grade
Min
Typ
Unit
Max
Data Rate =
6.375 Gbps
Pattern = PRBS31
Equalizer Setting =
15
DC Gain = 0 dB
BER = 10-12
> 0.988
N/A
N/A
UI
Jitter Frequency =
38.2 KHz
Data Rate =
6.375 Gbps
Pattern = PRBS31
Equalizer Setting =
15
DC Gain = 0 dB
BER = 10-12
>5
N/A
N/A
UI
Jitter Frequency =
3.82 MHz
Data
Rate = 6.375 Gbps
Pattern = PRBS31
Equalizer Setting =
15
DC Gain = 0 dB
BER = 10-12
> 0.05
N/A
N/A
UI
Jitter Frequency =
20 MHz
Data Rate =
6.375 Gbps
Pattern = PRBS31
Equalizer Setting =
15
DC Gain = 0 dB
BER = 10-12
> 0.05
N/A
N/A
UI
4–28
Stratix II GX Device Handbook, Volume 1
Altera Corporation
June 2009
DC and Switching Characteristics
Table 4–19. Stratix II GX Transceiver Block AC Specification Notes (1), (2), (3) (Part 12 of 19)
Symbol/
Description
Conditions
-3 Speed
Commercial Speed
Grade
Min
Typ
Max
-4 Speed
Commercial and
Industrial Speed
Grade
Min
Typ
Max
-5 Speed
Commercial Speed
Grade
Min
Typ
Unit
Max
CPRI Transmitter Jitter Generation (15)
Deterministic Jitter Data Rate =
(peak-to-peak)
614.4 Mbps,
1.2288 Gbps,
2.4576 Gbps
REFCLK =
61.44 MHz for
614.4 Mbps and
1.2288 Gbps
REFCLK =
122.88 MHz for
2.4576 Gbps
Pattern = CJPAT
Vod = 1400 mV
No Pre-emphasis
0.14
0.14
N/A
UI
Total Jitter
(peak-to-peak)
0.279
0.279
N/A
UI
Altera Corporation
June 2009
Data Rate =
614.4 Mbps,
1.2288 Gbps,
2.4576 Gbps
REFCLK =
61.44 MHz for
614.4 Mbps and
1.2288 Gbps
REFCLK =
122.88 MHz for
2.4576 Gbps
Pattern = CJPAT
Vod = 1400 mV
No Pre-emphasis
4–29
Stratix II GX Device Handbook, Volume 1
Operating Conditions
Table 4–19. Stratix II GX Transceiver Block AC Specification Notes (1), (2), (3) (Part 13 of 19)
Symbol/
Description
Conditions
-3 Speed
Commercial Speed
Grade
Min
Typ
Max
-4 Speed
Commercial and
Industrial Speed
Grade
Min
Typ
Max
-5 Speed
Commercial Speed
Grade
Min
Typ
Unit
Max
CPRI Receiver Jitter Tolerance (15)
Deterministic Jitter Data Rate =
614.4 Mbps,
Tolerance
1.2288 Gbps,
(peak-to-peak)
2.4576 Gbps
REFCLK =
61.44 MHz for
614.4 Mbps
REFCLK =
122.88 MHz for
1.2288 Gbps and
2.4576 Gbps
Pattern = CJPAT
Equalizer Setting =
6
DC Gain = 0 dB
> 0.4
> 0.4
N/A
UI
Data Rate =
614.4 Mbps,
1.2288 Gbps,
2.4576 Gbps
REFCLK =
61.44 MHz for
614.4 Mbps
REFCLK =
122.88 MHz for
1.2288 Gbps and
2.4576 Gbps
Pattern = CJPAT
Equalizer Setting =
6
DC Gain = 0 dB
> 0.66
> 0.66
N/A
UI
Combined
Deterministic and
Random Jitter
Tolerance
(peak-to-peak)
4–30
Stratix II GX Device Handbook, Volume 1
Altera Corporation
June 2009
DC and Switching Characteristics
Table 4–19. Stratix II GX Transceiver Block AC Specification Notes (1), (2), (3) (Part 14 of 19)
Symbol/
Description
Conditions
-3 Speed
Commercial Speed
Grade
Min
Sinusoidal Jitter
Tolerance
(peak-to-peak) (6)
Altera Corporation
June 2009
Typ
Max
-4 Speed
Commercial and
Industrial Speed
Grade
Min
Typ
Max
-5 Speed
Commercial Speed
Grade
Min
Typ
Unit
Max
Jitter Frequency =
22.1 KHz
Data Rate =
614.4 Mbps,
1.2288 Gbps,
2.4576 Gbps
REFCLK =
61.44 MHz for
614.4 Mbps
REFCLK =
122.88 MHz for
1.2288 Gbps and
2.4576 Gbps
Pattern = CJPAT
Equalizer Setting =
6
DC Gain = 0 dB
> 8.5
> 8.5
N/A
UI
Jitter Frequency =
1.875 MHz
Data Rate =
614.4 Mbps,
1.2288 Gbps,
2.4576 Gbps
REFCLK =
61.44 MHz for
614.4 Mbps
REFCLK =
122.88 MHz for
1.2288 Gbps and
2.4576 Gbps
Pattern = CJPAT
Equalizer Setting =
6
DC Gain = 0 dB
> 0.1
> 0.1
N/A
UI
4–31
Stratix II GX Device Handbook, Volume 1
Operating Conditions
Table 4–19. Stratix II GX Transceiver Block AC Specification Notes (1), (2), (3) (Part 15 of 19)
Symbol/
Description
Conditions
-3 Speed
Commercial Speed
Grade
Min
Jitter Frequency =
20 MHz
Data Rate =
614.4 Mbps,
1.2288 Gbps,
2.4576 Gbps
REFCLK =
61.44 MHz for
614.4 Mbps
REFCLK =
122.88 MHz for
1.2288 Gbps and
2.4576 Gbps
Pattern = CJPAT
Equalizer Setting =
6
DC Gain = 0 dB
Typ
> 0.1
Max
-4 Speed
Commercial and
Industrial Speed
Grade
Min
Typ
> 0.1
Max
-5 Speed
Commercial Speed
Grade
Min
Typ
N/A
Unit
Max
UI
Sinusoidal Jitter
Tolerance
(peak-to-peak) (6)
(cont.)
4–32
Stratix II GX Device Handbook, Volume 1
Altera Corporation
June 2009
DC and Switching Characteristics
Table 4–19. Stratix II GX Transceiver Block AC Specification Notes (1), (2), (3) (Part 16 of 19)
Symbol/
Description
Conditions
-3 Speed
Commercial Speed
Grade
Min
Typ
Max
-4 Speed
Commercial and
Industrial Speed
Grade
Min
Typ
Max
-5 Speed
Commercial Speed
Grade
Min
Typ
Unit
Max
SDI Transmitter Jitter Generation (16)
Data Rate =
1.485 Gbps (HD)
REFCLK =
74.25 MHz
Pattern = ColorBar
Vod = 800 mV
No Pre-emphasis
Low-Frequency
Roll-Off = 100 KHz
0.2
0.2
0.2
UI
Data Rate =
2.97 Gbps (3G)
REFCLK =
148.5 MHz
Pattern = ColorBar
Vod = 800 mV
No Pre-emphasis
Low-Frequency
Roll-Off = 100 KHz
0.3
0.3
0.3
UI
Alignment Jitter
(peak-to-peak)
Altera Corporation
June 2009
4–33
Stratix II GX Device Handbook, Volume 1
Operating Conditions
Table 4–19. Stratix II GX Transceiver Block AC Specification Notes (1), (2), (3) (Part 17 of 19)
Symbol/
Description
Conditions
-3 Speed
Commercial Speed
Grade
Min
Typ
Max
-4 Speed
Commercial and
Industrial Speed
Grade
Min
Typ
Max
-5 Speed
Commercial Speed
Grade
Min
Typ
Unit
Max
SDI Receiver Jitter Tolerance (16)
Sinusoidal Jitter
Tolerance
(peak-to-peak)
Jitter Frequency =
15 KHz
Data Rate =
2.97 Gbps (3G)
REFCLK =
148.5 MHz
Pattern = Single
Line Scramble Color
Bar
No Equalization
DC Gain = 0 dB
>2
>2
>2
UI
Jitter Frequency =
100 KHz
Data Rate =
2.97 Gbps (3G)
REFCLK =
148.5 MHz
Pattern = Single
Line Scramble Color
Bar
No Equalization
DC Gain = 0 dB
> 0.3
> 0.3
> 0.3
UI
Jitter Frequency =
148.5 MHz
Data Rate =
2.97 Gbps (3G)
REFCLK =
148.5 MHz
Pattern = Single
Line Scramble Color
Bar
No Equalization
DC Gain = 0 dB
> 0.3
> 0.3
> 0.3
UI
4–34
Stratix II GX Device Handbook, Volume 1
Altera Corporation
June 2009
DC and Switching Characteristics
Table 4–19. Stratix II GX Transceiver Block AC Specification Notes (1), (2), (3) (Part 18 of 19)
Symbol/
Description
Conditions
-3 Speed
Commercial Speed
Grade
Min
Sinusoidal Jitter
Tolerance
(peak-to-peak)
Altera Corporation
June 2009
Typ
Max
-4 Speed
Commercial and
Industrial Speed
Grade
Min
Typ
Max
-5 Speed
Commercial Speed
Grade
Min
Typ
Unit
Max
Jitter Frequency =
20 KHz
Data Rate =
1.485 Gbps (HD)
REFCLK =
74.25 MHz
Pattern = 75% Color
Bar
No Equalization
DC Gain = 0 dB
>1
>1
>1
UI
Jitter Frequency =
100 KHz
Data Rate =
1.485 Gbps (HD)
REFCLK =
74.25 MHz
Pattern = 75% Color
Bar
No Equalization
DC Gain = 0 dB
> 0.2
> 0.2
> 0.2
UI
Jitter Frequency =
148.5 MHz
Data Rate =
1.485 Gbps (HD)
REFCLK =
74.25 MHz
Pattern = 75% Color
Bar
No Equalization
DC Gain = 0 dB
> 0.2
> 0.2
> 0.2
UI
4–35
Stratix II GX Device Handbook, Volume 1
Operating Conditions
Table 4–19. Stratix II GX Transceiver Block AC Specification Notes (1), (2), (3) (Part 19 of 19)
Symbol/
Description
Conditions
-3 Speed
Commercial Speed
Grade
Min
Typ
Max
-4 Speed
Commercial and
Industrial Speed
Grade
Min
Typ
Max
-5 Speed
Commercial Speed
Grade
Min
Typ
Unit
Max
Notes to Table 4–19:
(1)
(2)
(3)
(4)
(5)
(6)
(7)
(8)
(9)
(10)
(11)
(12)
(13)
(14)
(15)
(16)
(17)
(18)
Dedicated REFCLK pins were used to drive the input reference clocks.
Jitter numbers specified are valid for the stated conditions only.
Refer to the protocol characterization documents for detailed information.
HiGig configuration is available in a -3 speed grade only. For more information, refer to the Stratix II GX Transceiver
Architecture Overview chapter in volume 2 of the Stratix II GX Device Handbook.
Stratix II GX transceivers meet CEI jitter generation specification of 0.3 UI for a VOD range of 400 mV to 1000 mV.
The Sinusoidal Jitter Tolerance Mask is defined only for low voltage (LV) variant of CPRI.
The jitter numbers for SONET/SDH are compliant to the GR-253-CORE Issue 3 Specification.
The jitter numbers for Fibre Channel are compliant to the FC-PI-4 Specification revision 6.10.
The jitter numbers for XAUI are compliant to the IEEE802.3ae-2002 Specification.
The jitter numbers for PCI Express are compliant to the PCIe Base Specification 2.0.
The jitter numbers for Serial RapidIO are compliant to the RapidIO Specification 1.3.
The jitter numbers for GIGE are compliant to the IEEE802.3-2002 Specification.
The jitter numbers for HiGig are compliant to the IEEE802.3ae-2002 Specification.
The jitter numbers for (OIF) CEI are compliant to the OIF-CEI-02.0 Specification.
The jitter numbers for CPRI are compliant to the CPRI Specification V2.1.
The HD-SDI and 3G-SDI jitter numbers are compliant to the SMPTE292M and SMPTE424M Specifications.
The Fibre Channel transmitter jitter generation numbers are compliant to the specification at βT interoperability point.
The Fibre Channel receiver jitter tolerance numbers are compliant to the specification at βR interoperability point.
Table 4–20 provides information on recommended input clock jitter for
each mode.
Table 4–20. Recommended Input Clock Jitter (Part 1 of 2)
Mode
PCI-E
(OIF) CEI
PHY
Reference
Clock (MHz)
Vectron
LVPECL XO
Type/Model
RMS Jitter
Frequency
(12 kHz to 20
Range (MHz)
MHz) (ps)
Period Jitter
(Peak to
Peak) (ps)
Phase Noise
at 1 MHz
(dB c/Hz)
100
VCC6-Q/R
10 to 270
0.3
23
-149.9957
156.25
VCC6-Q/R
10 to 270
0.3
23
-146.2169
622.08
VCC6-Q
270 to 800
2
30
Not available
GIGE
62.5
VCC6-Q/R
10 to 270
0.3
23
-149.9957
125
VCC6-Q/R
10 to 270
0.3
23
-146.9957
XAUI
156.25
VCC6-Q/R
10 to 270
0.3
23
-146.2169
4–36
Stratix II GX Device Handbook, Volume 1
Altera Corporation
June 2009
DC and Switching Characteristics
Table 4–20. Recommended Input Clock Jitter (Part 2 of 2)
Mode
Reference
Clock (MHz)
Vectron
LVPECL XO
Type/Model
SONET/SDH
OC-48
SONET/SDH
OC-12
RMS Jitter
Frequency
(12 kHz to 20
Range (MHz)
MHz) (ps)
Period Jitter
(Peak to
Peak) (ps)
Phase Noise
at 1 MHz
(dB c/Hz)
77.76
VCC6-Q/R
10 to 270
0.3
23
-149.5476
155.52
VCC6-Q/R
10 to 270
0.3
23
-149.1903
311.04
VCC6-Q
270 to 800
2
30
Not available
622.08
VCC6-Q
270 to 800
2
30
Not available
62.2
VCC6-Q/R
10 to 270
0.3
23
-149.6289
311
VCC6-Q
270 to 800
2
30
Not available
77.76
VCC6-Q/R
10 to 270
0.3
23
-149.5476
155.52
VCC6-Q/R
10 to 270
0.3
23
-149.1903
622.08
VCC6-Q
270 to 800
2
30
Not available
Tables 4–21 and 4–22 show the transmitter and receiver PCS latency for
each mode, respectively.
Table 4–21. PCS Latency (Part 1 of 2) Note (1)
Transmitter PCS Latency
Functional Mode
XAUI
PIPE
Sum (2)
-
2-3
1
0.5
0.5
4-5
3-4
1
-
1
6-7
×1, ×4, ×8
16-bit channel
width
1
3-4
1
-
0.5
6-7
-
2-3
1
-
1
4-5
OC-12
-
2-3
1
-
1
4-5
OC-48
-
2-3
1
-
0.5
4-5
OC-96
Altera Corporation
June 2009
8B/10B
Encoder
1
-
2-3
1
-
0.5
4-5
-
2-3
1
-
0.5
4-5
614 Mbps,
1.228 Gbps
-
2
1
-
1
4
2.456 Gbps
-
2-3
1
-
1
4-5
(OIF) CEI PHY
CPRI (3)
Byte
TX State
Serializer Machine
×1, ×4, ×8
8-bit channel
width
GIGE
SONET/SDH
TX PIPE
TX
Phase
Comp
FIFO
Configuration
4–37
Stratix II GX Device Handbook, Volume 1
Operating Conditions
Table 4–21. PCS Latency (Part 2 of 2) Note (1)
Transmitter PCS Latency
Functional Mode
Serial RapidIO
SDI
BASIC Single
Width
BASIC Double
Width
TX PIPE
TX
Phase
Comp
FIFO
1.25 Gbps,
2.5 Gbps,
3.125 Gbps
-
2-3
1
HD
10-bit channel
width
-
2-3
HD, 3G
20-bit channel
width
-
8-bit/10-bit
channel width
Configuration
Byte
TX State
Serializer Machine
8B/10B
Encoder
Sum (2)
-
0.5
4-5
1
-
1
4-5
2-3
1
-
0.5
4-5
-
2-3
1
-
1
4-5
16-bit/20-bit
channel width
-
2-3
1
-
0.5
4-5
16-bit/20-bit
channel width
-
2-3
1
-
1
4-5
32-bit/40-bit
channel width
-
2-3
1
-
0.5
4-5
Parallel
Loopback/
BIST
-
2-3
1
-
1
4-5
Notes to Table 4–21:
(1)
(2)
(3)
The latency numbers are with respect to the PLD-transceiver interface clock cycles.
The total latency number is rounded off in the Sum column.
For CPRI 614 Mbps and 1.228 Gbps data rates, the Quartus II software customizes the PLD-transceiver
interface clocking to achieve zero clock cycle uncertainty in the transmitter phase compensation FIFO
latency. For more details, refer to the CPRI Mode section in the Stratix II GX Transceiver Architecture Overview
chapter in volume 2 of the Stratix II GX Device Handbook.
4–38
Stratix II GX Device Handbook, Volume 1
Altera Corporation
June 2009
DC and Switching Characteristics
Table 4–22. PCS Latency (Part 1 of 3) Note (1)
Receiver PCS Latency
Functional
Mode
Word
Aligner
Deskew
FIFO
Rate
Matcher
(3)
8B/10B
Decoder
Receiver
State
Machine
Byte
Deserializer
Byte
Order
Receiver
Phase
Comp
FIFO
Receiver
PIPE
Sum
(2)
2-2.5
2-2.5
5.5-6.5
0.5
1
1
1
1-2
-
14-17
×1, ×4, ×8
8-bit
channel
width
4-5
-
11-13
1
-
1
1
2-3
1
21-25
×1, ×4, ×8
16-bit
channel
width
2-2.5
-
5.5-6.5
0.5
-
1
1
2-3
1
13-16
4-5
-
11-13
1
-
1
1
1-2
-
19-23
OC-12
6-7
-
-
1
-
1
1
1-2
-
10-12
Configuration
XAUI
PIPE
GIGE
SONET/
SDH
OC-48
3-3.5
-
-
0.5
-
1
1-2
1-2
-
7-9
OC-96
2-2.5
-
-
0.5
-
1
1
1-2
-
6-7
2.5
-
-
0.5
-
1
1
1-2
-
6-7
614 Mbps,
1.228 Gbps
4-5
-
-
1
-
1
1
1
-
8-9
2.456 Gbps
4-5
-
-
1
-
1
1
1-2
-
8-10
1.25 Gbps,
2.5 Gbps,
3.125 Gbps
2-2.5
-
-
0.5
-
1
1
1-2
-
6-7
HD
10-bit
channel
width
5
-
-
1
-
1
1
1-2
-
9-10
HD, 3G
20-bit
channel
width
2.5
-
-
0.5
-
1
1
1-2
-
6-7
(OIF)
CEI
PHY
CPRI
(4)
Serial
RapidIO
SDI
Altera Corporation
June 2009
4–39
Stratix II GX Device Handbook, Volume 1
Operating Conditions
Table 4–22. PCS Latency (Part 2 of 3) Note (1)
Receiver PCS Latency
Functional
Mode
BASIC
Single
Width
Word
Aligner
Deskew
FIFO
Rate
Matcher
(3)
8B/10B
Decoder
Receiver
State
Machine
Byte
Deserializer
Byte
Order
Receiver
Phase
Comp
FIFO
Receiver
PIPE
Sum
(2)
8/10-bit
channel
width;
with Rate
Matcher
4-5
-
11-13
1
-
1
1
1-2
1
19-23
8/10-bit
channel
width;
without
Rate
Matcher
4-5
-
-
1
-
1
1
1-2
-
8-10
16/20-bit
channel
width;
with Rate
Matcher
2-2.5
-
5.5-6.5
0.5
-
1
1
1-2
-
11-14
16/20-bit
channel
width;
without
Rate
Matcher
2-2.5
-
-
0.5
-
1
1
1-2
-
6-7
Configuration
4–40
Stratix II GX Device Handbook, Volume 1
Altera Corporation
June 2009
DC and Switching Characteristics
Table 4–22. PCS Latency (Part 3 of 3) Note (1)
Receiver PCS Latency
Functional
Mode
BASIC
Double
Width
Word
Aligner
Deskew
FIFO
Rate
Matcher
(3)
8B/10B
Decoder
Receiver
State
Machine
Byte
Deserializer
Byte
Order
Receiver
Phase
Comp
FIFO
Receiver
PIPE
Sum
(2)
16/20-bit
channel
width; with
Rate
Matcher
4-5
-
11-13
1
-
1
1
1-2
-
19-23
16/20-bit
channel
width;
without
Rate
Matcher
4-5
-
-
1
-
1
1
1-2
-
8-10
32/40-bit
channel
width; with
Rate
Matcher
2-2.5
-
5.5-6.5
0.5
-
1
1
1-2
-
11-14
32/40-bit
channel
width;
without
Rate
Matcher
2-2.5
-
-
0.5
-
1
1-3
1-2
-
6-9
Configuration
Notes to Table 4–21:
(1)
(2)
(3)
(4)
The latency numbers are with respect to the PLD-transceiver interface clock cycles.
The total latency number is rounded off in the Sum column.
The rate matcher latency shown is the steady state latency. Actual latency may vary depending on the skip ordered set
gap allowed by the protocol, actual PPM difference between the reference clocks, and so forth.
For CPRI 614 Mbps and 1.228 Gbps data rates, the Quartus II software customizes the PLD-transceiver interface clocking
to achieve zero clock cycle uncertainty in the receiver phase compensation FIFO latency. For more details, refer to the CPRI
Mode section in the Stratix II GX Transceiver Architecture Overview chapter in volume 2 of the Stratix II GX Device Handbook
Altera Corporation
June 2009
4–41
Stratix II GX Device Handbook, Volume 1
Operating Conditions
DC Electrical Characteristics
Table 4–23 shows the Stratix II GX device family DC electrical
characteristics.
Table 4–23. Stratix II GX Device DC Operating Conditions (Part 1 of 2)
Symbol
Parameter
Conditions
Device
Note (1)
Minimum Typical Maximum
Unit
II
Input pin leakage
current
VI = VCCIOmax to
0 V (2)
All
–10
10
μA
IOZ
Tri-stated I/O pin
leakage current
VO = VCCIOmax to
0 V (2)
All
–10
10
μA
ICCINT0
VCCINT supply current
(standby)
VI = ground, no
load, no toggling
inputs
TJ = 25 °C
EP2SGX30
0.30
(3)
A
EP2SGX60
0.50
(3)
A
EP2SGX90
0.62
(3)
A
ICCPD0
ICCI00
VCCPD supply current
(standby)
VCCIO supply current
(standby)
EP2SGX130
0.82
(3)
A
VI = ground, no
load, no toggling
inputs
TJ = 25 °C,
VCCPD = 3.3V
EP2SGX30
2.7
(3)
mA
EP2SGX60
3.6
(3)
mA
EP2SGX90
4.3
(3)
mA
EP2SGX130
5.4
(3)
mA
VI = ground, no
load, no toggling
inputs
TJ = 25 °C
EP2SGX30
4.0
(3)
mA
EP2SGX60
4.0
(3)
mA
EP2SGX90
4.0
(3)
mA
EP2SGX130
4.0
(3)
mA
4–42
Stratix II GX Device Handbook, Volume 1
Altera Corporation
June 2009
DC and Switching Characteristics
Table 4–23. Stratix II GX Device DC Operating Conditions (Part 2 of 2)
Symbol
RCONF
(4)
Parameter
Conditions
Value of I/O pin pull-up
resistor before and
during configuration
Device
Note (1)
Minimum Typical Maximum
Unit
Vi = 0, VCCIO =
3.3 V
10
25
50
KOhm
Vi = 0, VCCIO =
2.5 V
15
35
70
KOhm
Vi = 0, VCCIO =
1.8 V
30
50
100
KOhm
Vi = 0, VCCIO =
1.5 V
40
75
150
KOhm
Vi = 0, VCCIO =
1.2 V
50
90
170
KOhm
1
2
KOhm
Recommended value of
I/O pin external
pull-down resistor
before and during
configuration
Notes to Table 4–23:
(1)
(2)
(3)
(4)
Typical values are for TA = 25 °C, VCCINT = 1.2 V, and VCCIO = 1.5 V, 1.8 V, 2.5 V, and 3.3 V.
This value is specified for normal device operation. The value may vary during power-up. This applies for all VCCIO
settings (3.3, 2.5, 1.8, and 1.5 V).
Maximum values depend on the actual TJ and design utilization. See PowerPlay Early Power Estimator (EPE) and
Power Analyzer or the Quartus II PowerPlay Power Analyzer and Optimization Technology (available at www.altera.com)
for maximum values. See the section “Power Consumption” on page 4–59 for more information.
Pin pull-up resistance values will lower if an external source drives the pin higher than VCCIO.
I/O Standard Specifications
Tables 4–24 through 4–47 show the Stratix II GX device family I/O
standard specifications.
Table 4–24. LVTTL Specifications (Part 1 of 2)
Symbol
Parameter
VCCIO (1)
Output supply voltage
Conditions
Minimum
Maximum
Unit
3.135
3.465
V
VIH
High-level input voltage
1.7
4.0
V
VIL
Low-level input voltage
–0.3
0.8
V
VOH
High-level output voltage
Altera Corporation
June 2009
IOH = –4 mA (2)
2.4
V
4–43
Stratix II GX Device Handbook, Volume 1
Operating Conditions
Table 4–24. LVTTL Specifications (Part 2 of 2)
Symbol
VOL
Parameter
Low-level output voltage
Conditions
Minimum
IOL = 4 mA (2)
Maximum
Unit
0.45
V
Notes to Table 4–24:
(1)
(2)
Stratix II GX devices comply to the narrow range for the supply voltage as specified in the EIA/JEDEC Standard,
JESD8-B.
This specification is supported across all the programmable drive strength settings available for this I/O standard
as shown in the Stratix II GX Architecture chapter in volume 1 of the Stratix II GX Device Handbook.
Table 4–25. LVCMOS Specifications
Symbol
Parameter
Note (1)
Minimum
Maximum
Unit
3.135
3.465
V
High-level input voltage
1.7
4.0
V
VIL
Low-level input voltage
–0.3
0.8
V
VOH
High-level output voltage
VCCIO = 3.0, IOH = –0.1 mA (2)
VOL
Low-level output voltage
VCCIO = 3.0, IOL = 0.1 mA (2)
VCCIO(1)
Output supply voltage
VIH
Conditions
VCCIO – 0.2
V
0.2
V
Notes to Table 4–25:
(1)
(2)
Stratix II GX devices comply to the narrow range for the supply voltage as specified in the EIA/JEDEC Standard,
JESD8-B.
This specification is supported across all the programmable drive strength available for this I/O standard as shown
in Stratix II GX Architecture chapter in volume 1 of the Stratix II GX Device Handbook.
Table 4–26. 2.5-V I/O Specifications
Symbol
Parameter
Conditions
VCCIO (1)
Output supply voltage
VIH
High-level input voltage
VIL
Low-level input voltage
VOH
High-level output voltage
IOH = –1 mA (2)
VOL
Low-level output voltage
IOL = 1 mA (2)
Minimum
Maximum
Unit
2.375
2.625
V
1.7
4.0
V
–0.3
0.7
2.0
V
V
0.4
V
Notes to Table 4–26:
(1)
(2)
The Stratix II GX device VCCIO voltage level support of 2.5 to 5% is narrower than defined in the Normal Range of
the EIA/JEDEC standard.
This specification is supported across all the programmable drive settings available for this I/O standard as shown
in Stratix II GX Architecture chapter in volume 1 of the Stratix II GX Device Handbook.
4–44
Stratix II GX Device Handbook, Volume 1
Altera Corporation
June 2009
DC and Switching Characteristics
Table 4–27. 1.8-V I/O Specifications
Symbol
Parameter
VCCIO (1)
Output supply voltage
VIH
High-level input voltage
Conditions
VIL
Low-level input voltage
VOH
High-level output voltage
IOH = –2 mA (2)
VOL
Low-level output voltage
IOL = 2 mA (2)
Minimum
Maximum
Unit
1.71
1.89
V
0.65 × VCCIO
2.25
V
–0.3
0.35 × VCCIO
VCCIO – 0.45
V
V
0.45
V
Notes to Table 4–27:
(1)
(2)
The Stratix II GX device VCCIO voltage level support of 1.8 to 5% is narrower than defined in the Normal Range of
the EIA/JEDEC standard.
This specification is supported across all the programmable drive settings available for this I/O standard as shown
in Stratix II GX Architecture chapter in volume 1 of the Stratix II GX Device Handbook.
Table 4–28. 1.5-V I/O Specifications
Symbol
Parameter
VCCIO (1)
Output supply voltage
VIH
High-level input voltage
Conditions
VIL
Low-level input voltage
VOH
High-level output voltage
IOH = –2 mA (2)
VOL
Low-level output voltage
IOL = 2 mA (2)
Minimum
Maximum
Unit
1.425
1.575
V
0.65 VCCIO
VCCIO + 0.3
V
–0.3
0.35 VCCIO
V
0.75 VCCIO
V
0.25 VCCIO
V
Notes to Table 4–28:
(1)
(2)
The Stratix II GX device VCCIO voltage level support of 1.5 to 5% is narrower than defined in the Normal Range of
the EIA/JEDEC standard.
This specification is supported across all the programmable drive settings available for this I/O standard as shown
in Stratix II GX Architecture chapter in volume 1 of the Stratix II GX Device Handbook.
Altera Corporation
June 2009
4–45
Stratix II GX Device Handbook, Volume 1
Operating Conditions
Figures 4–6 and 4–7 show receiver input and transmitter output
waveforms, respectively, for all differential I/O standards (LVDS and
LVPECL).
Figure 4–6. Receiver Input Waveforms for Differential I/O Standards
Single-Ended Waveform
Positive Channel (p) = VIH
VID
Negative Channel (n) = VIL
VCM
Ground
Differential Waveform
VID
p−n=0V
VID (Peak-to-Peak)
VID
Figure 4–7. Transmitter Output Waveforms for Differential I/O Standards
Single-Ended Waveform
Positive Channel (p) = VOH
VOD
Negative Channel (n) = VOL
VCM
Ground
Differential Waveform
VOD
p−n=0V
VOD
4–46
Stratix II GX Device Handbook, Volume 1
Altera Corporation
June 2009
DC and Switching Characteristics
Table 4–29. 2.5-V LVDS I/O Specifications
Symbol
Parameter
Conditions
Minimum
Typical
Maximum
Unit
2.375
2.5
2.625
V
VCCIO
I/O supply voltage for left and
right I/O banks (1, 2, 5, and
6)
VID
Input differential voltage
swing (single-ended)
100
350
900
mV
VICM
Input common mode voltage
200
1,250
1,800
mV
VOD
Output differential voltage
(single-ended)
RL = 100 Ω
250
450
mV
VOCM
Output common mode
voltage
RL = 100 Ω
1.125
1.375
V
RL
Receiver differential input
discrete resistor (external to
Stratix II GX devices)
90
100
110
Ω
Minimum
Typical
Maximum
Unit
3.135
3.3
3.465
V
Table 4–30. 3.3-V LVDS I/O Specifications
Symbol
Parameter
Conditions
VCCIO (1)
I/O supply voltage for top and
bottom PLL banks (9, 10, 11,
and 12)
VID
Input differential voltage
swing (single-ended)
100
350
900
mV
VICM
Input common mode voltage
200
1,250
1,800
mV
VOD
Output differential voltage
(single-ended)
RL = 100 Ω
250
710
mV
VOCM
Output common mode
voltage
RL = 100 Ω
840
1,570
mV
RL
Receiver differential input
discrete resistor (external to
Stratix II GX devices)
110
Ω
90
100
Note to Table 4–30:
(1)
The top and bottom clock input differential buffers in I/O banks 3, 4, 7, and 8 are powered by VCCINT, not VCCIO.
The PLL clock output/feedback differential buffers are powered by VCC_PLL_OUT. For differential clock
output/feedback operation, connect VCC_PLL_OUT to 3.3 V.
Altera Corporation
June 2009
4–47
Stratix II GX Device Handbook, Volume 1
Operating Conditions
Table 4–31. PCML Specifications Note (1)
Symbol
Parameter
References
Reference Clock
3.3-V PCML
1.5-V PCML
1.2-V PCML
Reference clock supported
PCML standards
VID
Peak-to-peak differential input
voltage
VICM
Input common mode voltage
R
On-chip termination resistors
The specifications are located in the Reference Clock section
of Table 4–6 on page 4–4.
The specifications listed in Table 4–6 are applicable to PCML
input standards.
Receiver
3.3-V PCML
1.5-V PCML
1.2-V PCML
Receiver supported PCML
standards
VID
Peak-to-peak differential input
voltage
VICM
Input common mode voltage
R
On-chip termination resistors
The specifications are located in the Receiver section of
Table 4–6 on page 4–4.
The specifications listed in Table 4–6 are applicable to PCML
input standards.
Transmitter
1.5-V PCML
1.2-V PCML
Transmitter supported PCML
standards
VCCH
Output buffer supply voltage
The specifications are located in Table 4–5 on page 4–4.
VOD
Peak-to-peak differential output
voltage
The specifications are located in Tables 4–7, 4–8, 4–9, 4–10,
4–11, and 4–12.
The specifications listed in these tables are applicable to
PCML output standards.
VOCM
Output common mode voltage
R
On-chip termination resistors
The specifications are located in the Transmitter section of
Table 4–6 on page 4–4.
The specifications listed in Table 4–6 are applicable to PCML
output standards.
Note to Table 4–31:
(1)
Stratix II GX devices support PCML input and output on GXB banks 13, 14, 15, 16, and 17. This table references
Stratix II GX PCML specifications that are located in other sections of the Stratix II GX Device Handbook.
4–48
Stratix II GX Device Handbook, Volume 1
Altera Corporation
June 2009
DC and Switching Characteristics
Table 4–32. LVPECL Specifications
Symbol
Parameter
Conditions
Minimum
Typical
Maximum
Unit
3.135
3.3
3.465
V
600
1,000
mV
VCCIO (1)
I/O supply voltage
VID
Input differential voltage
swing (single-ended)
300
VICM
Input common mode voltage
1.0
2.5
V
VOD
Output differential voltage
(single-ended)
RL = 100 Ω
525
970
mV
VOCM
Output common mode
voltage
RL = 100 Ω
1,650
2,250
mV
RL
Receiver differential input
resistor
110
Ω
90
100
Note to Table 4–32:
(1)
The top and bottom clock input differential buffers in I/O banks 3, 4, 7, and 8 are powered by VCCINT, not VCCIO.
The PLL clock output/feedback differential buffers are powered by VCC_PLL_OUT. For differential clock
output/feedback operation, connect VCC_PLL_OUT to 3.3 V.
Table 4–33. 3.3-V PCI Specifications
Symbol
Parameter
VCCIO
Output supply voltage
Conditions
Minimum
Typical
Maximum
Unit
3.0
3.3
3.6
V
VIH
High-level input voltage
0.5 VCCIO
VCCIO + 0.5
V
VIL
Low-level input voltage
–0.3
0.3 VCCIO
V
VOH
High-level output voltage
IOUT = –500 μA
VOL
Low-level output voltage
IOUT = 1,500 μA
0.9 VCCIO
V
0.1 VCCIO
V
Maximum
Unit
3.0
3.6
V
Table 4–34. PCI-X Mode 1 Specifications
Symbol
Parameter
VCCIO
Output supply voltage
Conditions
Minimum
Typical
VIH
High-level input voltage
0.5 VCCIO
VCCIO + 0.5
V
VIL
Low-level input voltage
–0.3
0.35 VCCIO
V
VIPU
Input pull-up voltage
VOH
High-level output voltage
IOUT = –500 μA
VOL
Low-level output voltage
IOUT = 1,500 μA
Altera Corporation
June 2009
0.7 VCCIO
V
0.9 VCCIO
V
0.1 VCCIO
V
4–49
Stratix II GX Device Handbook, Volume 1
Operating Conditions
Table 4–35. SSTL-18 Class I Specifications
Symbol
Parameter
Conditions
Minimum
Typical
Maximum
Unit
VCCIO
Output supply voltage
1.71
1.8
1.89
V
VREF
Reference voltage
0.855
0.9
0.945
V
VTT
Termination voltage
VREF – 0.04
VREF
VREF + 0.04
V
VIH (DC)
High-level DC input voltage
VREF + 0.125
VIL (DC)
Low-level DC input voltage
VIH (AC)
High-level AC input voltage
V
VREF – 0.125
VREF + 0.25
VIL (AC)
Low-level AC input voltage
VOH
High-level output voltage
IOH = –6.7 mA (1)
VOL
Low-level output voltage
IOL = 6.7 mA (1)
V
V
VREF – 0.25
VTT + 0.475
V
V
VTT – 0.475
V
Note to Table 4–35:
(1)
This specification is supported across all the programmable drive settings available for this I/O standard as shown
in the Stratix II GX Architecture chapter in volume 1 of the Stratix II GX Device Handbook.
Table 4–36. SSTL-18 Class II Specifications
Symbol
Parameter
Conditions
Minimum
Typical
Maximum
Unit
VCCIO
Output supply voltage
1.71
1.8
1.89
V
VREF
Reference voltage
0.855
0.9
0.945
V
VTT
Termination voltage
VREF – 0.04
VREF
VREF + 0.04
V
VIH (DC) High-level DC input voltage
VREF + 0.125
VIL (DC) Low-level DC input voltage
VIH (AC) High-level AC input voltage
V
VREF – 0.125
V
VREF – 0.25
V
VREF + 0.25
VIL (AC) Low-level AC input voltage
VOH
High-level output voltage
IOH = –13.4 mA (1)
VOL
Low-level output voltage
IOL = 13.4 mA (1)
V
VCCIO – 0.28
V
0.28
V
Note to Table 4–36:
(1)
This specification is supported across all the programmable drive settings available for this I/O standard as shown
in the Stratix II GX Architecture chapter in volume 1 of the Stratix II GX Device Handbook.
4–50
Stratix II GX Device Handbook, Volume 1
Altera Corporation
June 2009
DC and Switching Characteristics
Table 4–37. SSTL-18 Class I and II Differential Specifications
Symbol
Parameter
Conditions
Minimum
Typical
Maximum
Unit
1.8
1.89
V
VCCIO
Output supply voltage
1.71
VSWING
(DC)
DC differential input voltage
0.25
VX (AC)
AC differential input cross
point voltage
VSWING
(AC)
AC differential input voltage
VISO
Input clock signal offset
voltage
0.5 VCCIO
V
ΔVISO
Input clock signal offset
voltage variation
200
mV
VOX (AC)
AC differential cross point
voltage
V
(VCCIO/2) – 0.175
(VCCIO/2) + 0.175
0.5
V
V
(VCCIO/2) – 0.125
(VCCIO/2) + 0.125
V
Table 4–38. SSTL-2 Class I Specifications
Symbol
Parameter
VCCIO
Output supply voltage
VTT
Termination voltage
VREF
Reference voltage
VIH (DC)
High-level DC input voltage
Conditions
Minimum
Typical
Maximum
Unit
2.375
2.5
2.625
V
VREF – 0.04
VREF
VREF + 0.04
V
1.188
1.25
1.313
V
VREF + 0.18
3.0
V
VREF – 0.18
VIL (DC)
Low-level DC input voltage
–0.3
VIH (AC)
High-level AC input voltage
VREF + 0.35
VIL (AC)
Low-level AC input voltage
VOH
High-level output voltage
IOH = –8.1 mA (1)
VOL
Low-level output voltage
IOL = 8.1 mA (1)
V
V
VREF – 0.35
VTT + 0.57
V
V
VTT – 0.57
V
Note to Table 4–38:
(1)
This specification is supported across all the programmable drive settings available for this I/O standard as shown
in the Stratix II GX Architecture chapter in volume 1 of the Stratix II GX Device Handbook.
Table 4–39. SSTL-2 Class II Specifications
Symbol
Parameter
VCCIO
Output supply voltage
VTT
Termination voltage
VREF
Reference voltage
Altera Corporation
June 2009
Conditions
Minimum
Typical
Maximum
Unit
2.375
2.5
2.625
V
VREF – 0.04
VREF
VREF + 0.04
V
1.188
1.25
1.313
V
4–51
Stratix II GX Device Handbook, Volume 1
Operating Conditions
Table 4–39. SSTL-2 Class II Specifications
Symbol
Parameter
Conditions
Minimum
Typical
Maximum
Unit
VIH (DC)
High-level DC input voltage
VREF + 0.18
VCCIO + 0.3
V
VIL (DC)
Low-level DC input voltage
–0.3
VREF – 0.18
V
VREF + 0.35
VREF – 0.35
V
VIH (AC)
High-level AC input voltage
VIL (AC)
Low-level AC input voltage
VOH
High-level output voltage
IOH = –16.4 mA (1)
VOL
Low-level output voltage
IOL = 16.4 mA (1)
V
VTT + 0.76
V
VTT – 0.76
V
Note to Table 4–39:
(1)
This specification is supported across all the programmable drive settings available for this I/O standard as shown
in the Stratix II GX Architecture chapter in volume 1 of the Stratix II GX Device Handbook.
Table 4–40. SSTL-2 Class I and II Differential Specifications
Symbol
VCCIO
Parameter
Conditions
Output supply voltage
VSWING (DC) DC differential input voltage
VX (AC)
AC differential input cross
point voltage
Minimum
Typical
Maximum
Unit
2.375
2.5
2.625
V
0.36
V
(VCCIO/2) – 0.2
VSWING (AC) AC differential input voltage
(VCCIO/2) + 0.2
0.7
V
V
VISO
Input clock signal offset
voltage
0.5 VCCIO
V
ΔVISO
Input clock signal offset
voltage variation
200
mV
VOX (AC)
AC differential output cross
point voltage
(VCCIO/2) – 0.2
(VCCIO/2) + 0.2
V
Maximum
Unit
Table 4–41. 1.2-V HSTL Specifications
Symbol
Parameter
Conditions
Minimum
Typical
VCCIO
Output supply voltage
1.14
1.2
1.26
V
VREF
Reference voltage
0.48 VCCIO
0.5 VCCIO
0.52 VCCIO
V
VIH (DC) High-level DC input voltage
VREF + 0.08
VCCIO + 0.15
V
VIL (DC) Low-level DC input voltage
–0.15
VREF – 0.08
V
VIH (AC) High-level AC input voltage
VREF + 0.15
VCCIO + 0.24
V
VIL (AC) Low-level AC input voltage
–0.24
VREF – 0.15
V
4–52
Stratix II GX Device Handbook, Volume 1
Altera Corporation
June 2009
DC and Switching Characteristics
Table 4–41. 1.2-V HSTL Specifications
Symbol
Parameter
Conditions
Minimum
Typical
Maximum
Unit
VOH
High-level output voltage
IOH = 8 mA
VREF + 0.15
VCCIO + 0.15
V
VOL
Low-level output voltage
IOH = –8 mA
–0.15
VREF – 0.15
V
Table 4–42. 1.5-V HSTL Class I Specifications
Symbol
Parameter
Conditions
Minimum
Typical
Maximum
Unit
VCCIO
Output supply voltage
1.425
1.5
1.575
V
VREF
Input reference voltage
0.713
0.75
0.788
V
VTT
Termination voltage
0.713
0.75
0.788
VIH (DC)
DC high-level input voltage
VREF + 0.1
VIL (DC)
DC low-level input voltage
–0.3
VIH (AC)
AC high-level input voltage
VREF + 0.2
VIL (AC)
AC low-level input voltage
VOH
High-level output voltage
IOH = 8 mA (1)
VOL
Low-level output voltage
IOH = –8 mA (1)
V
V
VREF – 0.1
V
VREF – 0.2
V
V
VCCIO – 0.4
V
0.4
V
Note to Table 4–42:
(1)
This specification is supported across all the programmable drive settings available for this I/O standard as shown
in the Stratix II GX Architecture chapter in volume 1 of the Stratix II GX Device Handbook.
Table 4–43. 1.5-V HSTL Class II Specifications
Symbol
Parameter
Conditions
Minimum
Typical
Maximum
Unit
VCCIO
Output supply voltage
1.425
1.50
1.575
V
VREF
Input reference voltage
0.713
0.75
0.788
V
VTT
Termination voltage
0.713
0.75
0.788
VIH (DC)
DC high-level input voltage
VREF + 0.1
VIL (DC)
DC low-level input voltage
–0.3
VIH (AC)
AC high-level input voltage
VREF + 0.2
VIL (AC)
AC low-level input voltage
VOH
High-level output voltage
IOH = 16 mA (1)
VOL
Low-level output voltage
IOH = –16 mA (1)
V
V
VREF – 0.1
V
VREF – 0.2
V
V
VCCIO – 0.4
V
0.4
V
Note to Table 4–43:
(1)
This specification is supported across all the programmable drive settings available for this I/O standard as shown
in the Stratix II GX Architecture chapter in volume 1 of the Stratix II GX Device Handbook.
Altera Corporation
June 2009
4–53
Stratix II GX Device Handbook, Volume 1
Operating Conditions
Table 4–44. 1.5-V HSTL Class I and II Differential Specifications
Symbol
Parameter
Conditions
Minimum
Typical
Maximum
Unit
1.425
1.5
1.575
V
VCCIO
I/O supply voltage
VDIF (DC)
DC input differential voltage
0.2
VCM (DC)
DC common mode input
voltage
0.68
VDIF (AC)
AC differential input voltage
0.4
VOX (AC)
AC differential cross point
voltage
0.68
V
0.9
V
V
0.9
V
Table 4–45. 1.8-V HSTL Class I Specifications
Symbol
Parameter
Conditions
Minimum
Typical
Maximum
Unit
VCCIO
Output supply voltage
1.71
1.80
1.89
V
VREF
Input reference voltage
0.85
0.90
0.95
V
VTT
Termination voltage
0.85
0.90
0.95
V
VIH (DC)
DC high-level input voltage
VREF + 0.1
VIL (DC)
DC low-level input voltage
–0.3
VIH (AC)
AC high-level input voltage
VREF + 0.2
VIL (AC)
AC low-level input voltage
VOH
High-level output voltage
IOH = 8 mA (1)
VOL
Low-level output voltage
IOH = –8 mA (1)
V
VREF – 0.1
V
V
VREF – 0.2
VCCIO – 0.4
V
V
0.4
V
Note to Table 4–45:
(1)
This specification is supported across all the programmable drive settings available for this I/O standard as shown
in the Stratix II GX Architecture chapter in volume 1 of the Stratix II GX Device Handbook.
4–54
Stratix II GX Device Handbook, Volume 1
Altera Corporation
June 2009
DC and Switching Characteristics
Table 4–46. 1.8-V HSTL Class II Specifications
Symbol
Parameter
Conditions
Minimum
Typical
Maximum
Unit
VCCIO
Output supply voltage
1.71
1.80
1.89
V
VREF
Input reference voltage
0.85
0.90
0.95
V
VTT
Termination voltage
0.85
0.90
0.95
VIH (DC)
DC high-level input voltage
VREF + 0.1
VIL (DC)
DC low-level input voltage
–0.3
VIH (AC)
AC high-level input voltage
VREF + 0.2
VIL (AC)
AC low-level input voltage
VOH
High-level output voltage
IOH = 16 mA (1)
VOL
Low-level output voltage
IOH = –16 mA (1)
V
V
VREF – 0.1
V
V
VREF – 0.2
VCCIO – 0.4
V
V
0.4
V
Note to Table 4–46:
(1)
This specification is supported across all the programmable drive settings available for this I/O standard as shown
in the Stratix II GX Architecture chapter in volume 1 of the Stratix II GX Device Handbook.
Table 4–47. 1.8-V HSTL Class I and II Differential Specifications
Symbol
Parameter
Conditions
Minimum
Typical
Maximum
Unit
1.80
1.89
V
VCCIO
I/O supply voltage
1.71
VDIF (DC)
DC input differential voltage
0.2
VCM (DC)
DC common mode input
voltage
0.78
VDIF (AC)
AC differential input voltage
0.4
VOX (AC)
AC differential cross point
voltage
0.68
Altera Corporation
June 2009
V
1.12
V
V
0.9
V
4–55
Stratix II GX Device Handbook, Volume 1
Operating Conditions
Bus Hold Specifications
Table 4–48 shows the Stratix II GX device family bus hold specifications.
Table 4–48. Bus Hold Parameters
VCCIO Level
Parameter
Conditions
1.2 V
Min
Max
1.5 V
Min
Max
1.8 V
Min
2.5 V
Max
Min
Max
3.3 V
Min
Unit
Max
Low
sustaining
current
VIN > VIL
(maximum)
22.5
25
30
50
70
μA
High
sustaining
current
VIN < VIH
(minimum)
–22.5
–25
–30
–50
–70
μA
Low
overdrive
current
0 V < VIN <
VCCIO
120
160
200
300
500
μA
High
overdrive
current
0 V < VIN <
VCCIO
–120
–160
–200
–300
–500
μA
2.0
V
Bus-hold
trip point
0.45
0.95
0.5
1.0
0.68
1.07
0.7
1.7
0.8
On-Chip Termination Specifications
Tables 4–49 and 4–50 define the specification for internal termination
resistance tolerance when using series or differential on-chip termination.
Table 4–49. On-Chip Termination Specification for Top and Bottom I/O Banks (Part 1 of 2) Notes (1), (2)
Resistance Tolerance
Symbol
25-Ω RS
3.3/2.5
50-Ω RS
3.3/2.5
Description
Conditions
Commercial
Max
Industrial
Max
Unit
Internal series termination with
calibration (25-Ω setting)
VCCIO = 3.3/2.5 V
±5
±10
%
Internal series termination without
calibration (25-Ω setting)
VCCIO = 3.3/2.5 V
±30
±30
%
Internal series termination with
calibration (50-Ω setting)
VCCIO = 3.3/2.5 V
±5
±10
%
Internal series termination without
calibration (50-Ω setting)
VCCIO = 3.3/2.5 V
±30
± 30
%
4–56
Stratix II GX Device Handbook, Volume 1
Altera Corporation
June 2009
DC and Switching Characteristics
Table 4–49. On-Chip Termination Specification for Top and Bottom I/O Banks (Part 2 of 2) Notes (1), (2)
Resistance Tolerance
Symbol
Description
Conditions
Commercial
Max
Industrial
Max
Unit
50-Ω RT
2.5
Internal parallel termination with
calibration (50-Ω setting)
VCCIO = 1.8 V
±30
± 30
%
25-Ω RS
1.8
Internal series termination with
calibration (25-Ω setting)
VCCIO = 1.8 V
±5
±10
%
Internal series termination without
calibration (25-Ω setting)
VCCIO = 1.8 V
±30
±30
%
Internal series termination with
calibration (50-Ω setting)
VCCIO = 1.8 V
±5
±10
%
Internal series termination without
calibration (50-Ω setting)
VCCIO = 1.8 V
±30
±30
%
50-Ω RT
1.8
Internal parallel termination with
calibration (50-Ω setting)
VCCIO = 1.8 V
±10
±15
%
50-Ω RS
1.5
Internal series termination with
calibration (50-Ω setting)
VCCIO = 1.5 V
±8
±10
%
Internal series termination without
calibration (50-Ω setting)
VCCIO = 1.5 V
±36
±36
%
50-Ω RT
1.5
Internal parallel termination with
calibration (50-Ω setting)
VCCIO = 1.5 V
±10
±15
%
50-Ω RS
1.2
Internal series termination with
calibration (50-Ω setting)
VCCIO = 1.2 V
±8
±10
%
Internal series termination without
calibration (50-Ω setting)
VCCIO = 1.2 V
±50
±50
%
Internal parallel termination with
calibration (50-Ω setting)
VCCIO = 1.2 V
±10
±15
%
50-Ω RS
1.8
50-Ω RT
1.2
Note for Table 4–49:
(1)
(2)
The resistance tolerance for calibrated SOCT is for the moment of calibration. If the temperature or voltage changes
over time, the tolerance may also change.
On-chip parallel termination with calibration is only supported for input pins.
Altera Corporation
June 2009
4–57
Stratix II GX Device Handbook, Volume 1
Operating Conditions
Table 4–50. Series and Differential On-Chip Termination Specification for Left I/O Banks Note (1)
Resistance Tolerance
Symbol
Description
Conditions
Commercial Industrial
Max
Max
Unit
25-Ω RS
3.3/2.5
Internal series termination without
calibration (25-Ω setting)
VCCIO = 3.3/2.5V
±30
±30
%
50-Ω RS
3.3/2.5/1.8
Internal series termination without
calibration (50-Ω setting)
VCCIO = 3.3/2.5/1.8V
±30
±30
%
50-Ω RS 1.5
Internal series termination without
calibration (50-Ω setting)
VCCIO = 1.5V
±36
±36
%
RD
Internal differential termination for
LVDS (100-Ω setting)
VCCIO = 2.5 V
±20
±25
%
Note to Table 4–50:
(1)
On-chip parallel termination with calibration is only supported for input pins.
Pin Capacitance
Table 4–51 shows the Stratix II GX device family pin capacitance.
Table 4–51. Stratix II GX Device Capacitance
Symbol
Note (1)
Typical
Unit
CIOTB
Input capacitance on I/O pins in I/O banks 3, 4, 7, and 8.
Parameter
5.0
pF
CIOL
Input capacitance on I/O pins in I/O banks 1 and 2, including high-speed
differential receiver and transmitter pins.
6.1
pF
CCLKTB
Input capacitance on top/bottom clock input pins: CLK[4..7] and
CLK[12..15].
6.0
pF
CCLKL
Input capacitance on left clock inputs: CLK0 and CLK2.
6.1
pF
CCLKL+
Input capacitance on left clock inputs: CLK1 and CLK3.
3.3
pF
COUTFB
Input capacitance on dual-purpose clock output/feedback pins in PLL
banks 11 and 12.
6.7
pF
Note to Table 4–51:
(1)
Capacitance is sample-tested only. Capacitance is measured using time-domain reflections (TDR). Measurement
accuracy is within ±0.5 pF.
4–58
Stratix II GX Device Handbook, Volume 1
Altera Corporation
June 2009
DC and Switching Characteristics
Power
Consumption
Altera offers two ways to calculate power for a design: the Excel-based
PowerPlay early power estimator power calculator and the Quartus® II
PowerPlay power analyzer feature.
The interactive Excel-based PowerPlay early power estimator is typically
used prior to designing the FPGA in order to get an estimate of device
power. The Quartus II PowerPlay power analyzer provides better quality
estimates based on the specifics of the design after place-and-route is
complete. The power analyzer can apply a combination of user-entered,
simulation-derived and estimated signal activities which, combined with
detailed circuit models, can yield very accurate power estimates.
In both cases, these calculations should only be used as an estimation of
power, not as a specification.
f
For more information on PowerPlay tools, refer to the PowerPlay Early
Power Estimators (EPE) and Power Analyzer, the Quartus II PowerPlay
Analysis and Optimization Technology, and the PowerPlay Power Analyzer
chapter in volume 3 of the Quartus II Handbook. The PowerPlay early
power estimators are available on the Altera web site at
www.altera. com.
1
Timing Model
See Table 4–23 on page 42 for typical ICC standby specifications.
The DirectDrive technology and MultiTrack interconnect ensure
predictable performance, accurate simulation, and accurate timing
analysis across all Stratix II GX device densities and speed grades. This
section describes and specifies the performance, internal, external, and
PLL timing specifications.
All specifications are representative of worst-case supply voltage and
junction temperature conditions.
Preliminary and Final Timing
Timing models can have either preliminary or final status. The Quartus II
software issues an informational message during the design compilation
if the timing models are preliminary. Table 4–52 shows the status of the
Stratix II GX device timing models.
Preliminary status means the timing model is subject to change. Initially,
timing numbers are created using simulation results, process data, and
other known parameters. These tests are used to make the preliminary
numbers as close to the actual timing parameters as possible.
Altera Corporation
June 2009
4–59
Stratix II GX Device Handbook, Volume 1
Timing Model
Final timing numbers are based on actual device operation and testing.
These numbers reflect the actual performance of the device under
worst-case voltage and junction temperature conditions.
Table 4–52. Stratix II GX Device Timing Model Status
Device
Preliminary
Final
EP2SGX30
v
EP2SGX60
v
EP2SGX90
v
EP2SGX130
v
I/O Timing Measurement Methodology
Different I/O standards require different baseline loading techniques for
reporting timing delays. Altera characterizes timing delays with the
required termination for each I/O standard and with 0 pF (except for PCI
and PCI-X which use 10 pF) loading and the timing is specified up to the
output pin of the FPGA device. The Quartus II software calculates the
I/O timing for each I/O standard with a default baseline loading as
specified by the I/O standards.
The following measurements are made during device characterization.
Altera measures clock-to-output delays (tCO) at worst-case process,
minimum voltage, and maximum temperature (PVT) for default loading
conditions shown in Table 4–53. Use the following equations to calculate
clock pin to output pin timing for Stratix II GX devices.
tCO from clock pin to I/O pin = delay from clock pad to I/O output
register + IOE output register clock-to-output delay + delay
from output register to output pin + I/O output delay
txz/tzx from clock pin to I/O pin = delay from clock pad to I/O
output register + IOE output register clock-to-output delay +
delay from output register to output pin + I/O output delay +
output enable pin delay
Simulation using IBIS models is required to determine the delays on the
PCB traces in addition to the output pin delay timing reported by the
Quartus II software and the timing model in the device handbook.
1.
Simulate the output driver of choice into the generalized test setup,
using values from Table 4–53.
2.
Record the time to VMEAS.
4–60
Stratix II GX Device Handbook, Volume 1
Altera Corporation
June 2009
DC and Switching Characteristics
3.
Simulate the output driver of choice into the actual PCB trace and
load, using the appropriate IBIS model or capacitance value to
represent the load.
4.
Record the time to VMEAS.
5.
Compare the results of steps 2 and 4. The increase or decrease in
delay should be added to or subtracted from the I/O Standard
Output Adder delays to yield the actual worst-case propagation
delay (clock-to-output) of the PCB trace.
The Quartus II software reports the timing with the conditions shown in
Table 4–53 using the above equation. Figure 4–8 shows the model of the
circuit that is represented by the output timing of the Quartus II software.
Figure 4–8. Output Delay Timing Reporting Setup Modeled by Quartus II
VTT
VCCIO
Outputp
RT
Output
Buffer
RS
Output
VMEAS
GND
Outputn
CL
RD
GND
Notes to Figure 4–8:
(1)
(2)
(3)
Output pin timing is reported at the output pin of the FPGA device. Additional
delays for loading and board trace delay need to be accounted for with IBIS model
simulations.
VCCPD is 3.085 V unless otherwise specified.
VCCINT is 1.12 V unless otherwise specified.
Table 4–53. Output Timing Measurement Methodology for Output Pins (Part 1 of 2) Notes (1), (2), (3)
Measurement
Point
Loading and Termination
I/O Standard
RS (Ω)
LVTTL (4)
RD (Ω)
RT (Ω)
VCCIO (V)
3.135
VTT (V)
CL (pF)
VMEAS (V)
0
1.5675
LVCMOS (4)
3.135
0
1.5675
2.5 V (4)
2.375
0
1.1875
1.8 V (4)
1.710
0
0.855
1.5 V (4)
1.425
0
0.7125
Altera Corporation
June 2009
4–61
Stratix II GX Device Handbook, Volume 1
Timing Model
Table 4–53. Output Timing Measurement Methodology for Output Pins (Part 2 of 2) Notes (1), (2), (3)
Measurement
Point
Loading and Termination
I/O Standard
RS (Ω)
RD (Ω)
RT (Ω)
VCCIO (V)
VTT (V)
CL (pF)
VMEAS (V)
PCI (5)
2.970
10
1.485
PCI-X (5)
2.970
10
1.485
SSTL-2 Class I
25
50
2.325
1.123
0
1.1625
SSTL-2 Class II
25
25
2.325
1.123
0
1.1625
SSTL-18 Class I
25
50
1.660
0.790
0
0.83
SSTL-18 Class II
25
25
1.660
0.790
0
0.83
1.8-V HSTL Class I
50
1.660
0.790
0
0.83
1.8-V HSTL Class II
25
1.660
0.790
0
0.83
1.5-V HSTL Class I
50
1.375
0.648
0
0.6875
1.5-V HSTL Class II
25
1.375
0.648
0
0.6875
1.2-V HSTL with OCT
Differential SSTL-2 Class I
1.140
25
50
2.325
1.123
0
0.570
0
1.1625
Differential SSTL-2 Class II
25
25
2.325
1.123
0
1.1625
Differential SSTL-18 Class I
50
50
1.660
0.790
0
0.83
Differential SSTL-18 Class II
25
25
1.660
0.790
0
0.83
1.5-V differential HSTL Class I
50
1.375
0.648
0
0.6875
1.5-V differential HSTL Class II
25
1.375
0.648
0
0.6875
1.8-V differential HSTL Class I
50
1.660
0.790
0
0.83
25
1.660
0.790
1.8-V differential HSTL Class II
0
0.83
LVDS
100
2.325
0
1.1625
LVPECL
100
3.135
0
1.5675
Notes to Table 4–53:
(1)
(2)
(3)
(4)
(5)
Input measurement point at internal node is 0.5 VCCINT.
Output measuring point for VMEAS at buffer output is 0.5 VCCIO.
Input stimulus edge rate is 0 to VCC in 0.2 ns (internal signal) from the driver preceding the I/O buffer.
Less than 50-mV ripple on VCCIO and VCCPD, VCCINT = 1.15 V with less than 30-mV ripple.
VCCPD = 2.97 V, less than 50-mV ripple on VCCIO and VCCPD, VCCINT = 1.15 V.
4–62
Stratix II GX Device Handbook, Volume 1
Altera Corporation
June 2009
DC and Switching Characteristics
Figures 4–9 and 4–10 show the measurement setup for output disable and
output enable timing.
Figure 4–9. Measurement Setup for txz
Note (1)
tXZ, Driving High to Tristate
Enable
OE
OE
½ VCCINT
Dout
Din
100 Ω
Disable
“1”
Din
100 mv
Dout
thz
GND
tXZ, Driving Low to Tristate
Enable
OE
100 Ω
Disable
½ VCCINT
OE
Dout
Din
Din
Dout
“0”
tlz
VCCIO
100 mv
Note to Figure 4–9:
(1)
Altera Corporation
June 2009
VCCINT is 1.12 V for this measurement.
4–63
Stratix II GX Device Handbook, Volume 1
Timing Model
Figure 4–10. Measurement Setup for tzx
tZX, Tristate to Driving High
Disable
OE
OE
Enable
½ VCCINT
Dout
Din
“1”
Din
1 MΩ
tzh
Dout
½ VCCIO
tZX, Tristate to Driving Low
Disable
Enable
½ VCCINT
OE
1 MΩ
OE
Dout
Din
“0”
Din
½ VCCIO
tzl
Dout
Table 4–54 specifies the input timing measurement setup.
Table 4–54. Timing Measurement Methodology for Input Pins (Part 1 of 2)
Notes (1), (2), (3), (4)
Measurement Conditions
Measurement Point
I/O Standard
VCCIO (V)
LVTTL (5)
VREF (V)
3.135
Edge Rate (ns)
VMEAS (V)
3.135
1.5675
LVCMOS (5)
3.135
3.135
1.5675
2.5 V (5)
2.375
2.375
1.1875
1.8 V (5)
1.710
1.710
0.855
1.5 V (5)
1.425
1.425
0.7125
PCI (6)
2.970
2.970
1.485
PCI-X (6)
2.970
2.970
1.485
SSTL-2 Class I
2.325
1.163
2.325
1.1625
SSTL-2 Class II
2.325
1.163
2.325
1.1625
SSTL-18 Class I
1.660
0.830
1.660
0.83
SSTL-18 Class II
1.660
0.830
1.660
0.83
1.8-V HSTL Class I
1.660
0.830
1.660
0.83
4–64
Stratix II GX Device Handbook, Volume 1
Altera Corporation
June 2009
DC and Switching Characteristics
Table 4–54. Timing Measurement Methodology for Input Pins (Part 2 of 2)
Notes (1), (2), (3), (4)
Measurement Conditions
Measurement Point
I/O Standard
VCCIO (V)
VREF (V)
Edge Rate (ns)
VMEAS (V)
1.8-V HSTL Class II
1.660
0.830
1.660
0.83
1.5-V HSTL Class I
1.375
0.688
1.375
0.6875
1.5-V HSTL Class II
1.375
0.688
1.375
0.6875
1.2-V HSTL with OCT
1.140
0.570
1.140
0.570
Differential SSTL-2 Class I
2.325
1.163
2.325
1.1625
Differential SSTL-2 Class II
2.325
1.163
2.325
1.1625
Differential SSTL-18 Class I
1.660
0.830
1.660
0.83
Differential SSTL-18 Class II
1.660
0.830
1.660
0.83
1.5-V differential HSTL Class I
1.375
0.688
1.375
0.6875
1.5-V differential HSTL Class II
1.375
0.688
1.375
0.6875
1.8-V differential HSTL Class I
1.660
0.830
1.660
0.83
1.8-V differential HSTL Class II
1.660
0.830
1.660
0.83
LVDS
2.325
0.100
1.1625
LVPECL
3.135
0.100
1.5675
Notes to Table 4–54:
(1)
(2)
(3)
(4)
(5)
(6)
Input buffer sees no load at buffer input.
Input measuring point at buffer input is 0.5 VCCIO.
Output measuring point is 0.5 VCC at internal node.
Input edge rate is 1 V/ns.
Less than 50-mV ripple on VCCIO and VCCPD, VCCINT = 1.15 V with less than 30-mV ripple.
VCCPD = 2.97 V, less than 50-mV ripple on VCCIO and VCCPD, VCCINT = 1.15 V.
Altera Corporation
June 2009
4–65
Stratix II GX Device Handbook, Volume 1
Timing Model
Table 4–55 shows the Stratix II GX performance for some common
designs. All performance values were obtained with the Quartus II
software compilation of LPM or MegaCore functions for FIR and FFT
designs.
Table 4–55. Stratix II GX Performance Notes (Part 1 of 3)
Note (1)
Resources Used
Performance
ALUTs
TriMatrix
Memory
Blocks
DSP
Blocks
-3 Speed
Grade
(2)
-3
Speed
Grade
(3)
-4 Speed
Grade
-5
Speed
Grade
Units
16-to-1
multiplexer (4)
21
0
0
657.03
620.73
589.62
477.09
MHz
32-to-1
multiplexer (4)
38
0
0
534.75
517.33
472.81
369.27
MHz
16-bit counter
16
0
0
568.18
539.66
507.61
422.47
MHz
64-bit counter
64
0
0
242.54
231.0
217.77
180.31
MHz
Simple
dual-port RAM
32 x 18bit
0
1
0
500.0
476.19
447.22
373.13
MHz
FIFO 32 x 18 bit
22
1
0
500.00
476.19
460.82
373.13
MHz
Simple dualTriMatrix
port RAM 128 x
Memory
M4K block 36bit
0
1
0
540.54
515.46
483.09
401.6
MHz
True dual-port
RAM 128 x 18bit
0
1
0
540.54
515.46
483.09
401.6
MHz
FIFO 128 x 36
bit
22
1
0
524.10
500.25
466.41
381.38
MHz
Applications
LE
TriMatrix
Memory
M512
block
4–66
Stratix II GX Device Handbook, Volume 1
Altera Corporation
June 2009
DC and Switching Characteristics
Table 4–55. Stratix II GX Performance Notes (Part 2 of 3)
Note (1)
Resources Used
Performance
ALUTs
TriMatrix
Memory
Blocks
DSP
Blocks
-3 Speed
Grade
(2)
-3
Speed
Grade
(3)
-4 Speed
Grade
-5
Speed
Grade
Units
Single port
TriMatrix
RAM 4K x
Memory
MegaRAM 144bit
block
Simple dualport RAM 4K x
144bit
0
1
0
349.65
333.33
313.47
261.09
MHz
0
1
0
420.16
400.0
375.93
313.47
MHz
True dual-port
RAM 4K x 144
bit
0
1
0
349.65
333.33
313.47
261.09
MHz
Single port
RAM 8K x 72 bit
0
1
0
354.6
337.83
317.46
263.85
MHz
Simple dualport RAM 8K x
72 bit
0
1
0
420.16
400.0
375.93
313.47
MHz
True dual-port
RAM 8K x 72 bit
0
1
0
349.65
333.33
313.47
261.09
MHz
Single port
RAM 16K x 36
bit
0
1
0
364.96
347.22
325.73
271.73
MHz
Simple dualport RAM 16K x
36 bit
0
1
0
420.16
400.0
375.93
313.47
MHz
True dual-port
RAM 16K x 36
bit
0
1
0
359.71
342.46
322.58
268.09
MHz
Single port
RAM 32K x 18
bit
0
1
0
364.96
347.22
325.73
271.73
MHz
Simple dualport RAM 32K x
18 bit
0
1
0
420.16
400.0
375.93
313.47
MHz
True dual-port
RAM 32K x 18
bit
0
1
0
359.71
342.46
322.58
268.09
MHz
Applications
Altera Corporation
June 2009
4–67
Stratix II GX Device Handbook, Volume 1
Timing Model
Table 4–55. Stratix II GX Performance Notes (Part 3 of 3)
Note (1)
Resources Used
Performance
ALUTs
TriMatrix
Memory
Blocks
DSP
Blocks
-3 Speed
Grade
(2)
-3
Speed
Grade
(3)
-4 Speed
Grade
-5
Speed
Grade
Units
Single port RAM
TriMatrix
64K x 9 bit
Memory
MegaRAM Simple
block
dual-port RAM
(cont.)
64K x 9 bit
0
1
0
364.96
347.22
325.73
271.73
MHz
0
1
0
420.16
400.0
375.93
313.47
MHz
True dual-port
RAM 64K x 9 bit
0
1
0
359.71
342.46
322.58
268.09
MHz
9 x 9-bit
multiplier (5)
0
0
1
430.29
409.16
385.2
320.1
MHz
18 x 18-bit
multiplier (5)
0
0
1
410.17
390.01
367.1
305.06
MHz
18 x 18-bit
multiplier (7)
0
0
1
450.04
428.08
403.22
335.12
MHz
36 x 36-bit
multiplier (5)
0
0
1
250.0
238.15
224.01
186.6
MHz
36 x 36-bit
multiplier (6)
0
0
1
410.17
390.01
367.1
305.06
MHz
18-bit, 4-tap FIR
filter
0
0
1
410.17
390.01
367.1
305.06
MHz
Applications
DSP
block
Notes to Table 4–55:
(1)
(2)
(3)
(4)
(5)
(6)
(7)
These design performance numbers were obtained using the Quartus II software.
This column refers to -3 speed grades for EP2SGX30, EP2SGX60, and EP2SGX90 devices.
This column refers to -3 speed grades for EP2SGX130 devices.
This application uses registered inputs and outputs.
This application uses registered multiplier input and output stages within the DSP block.
This application uses registered multiplier input, pipeline, and output stages within the DSP block.
This application uses registered multiplier inputs with outputs of the multiplier stage feeding the accumulator or
subtractor within the DSP block.
4–68
Stratix II GX Device Handbook, Volume 1
Altera Corporation
June 2009
DC and Switching Characteristics
Internal Timing Parameters
Refer to Tables 4–56 through 4–61 for internal timing parameters.
Table 4–56. LE_FF Internal Timing Microparameters
Symbol
-3 Speed
Grade (1)
Parameter
Min
-3 Speed
Grade (2)
Max
Min
-4 Speed Grade
Max
Min
Max
-5 Speed
Grade
Min
Unit
Max
tSU
LE register setup time
before clock
90
95
101
121
ps
tH
LE register hold time after
clock
149
157
167
200
ps
tCO
LE register
clock-to-output delay
62
tCLR
Minimum clear pulse
width
204
214
227
273
ps
tPRE
Minimum preset pulse
width
204
214
227
273
ps
tCLKL
Minimum clock low time
612
642
683
820
ps
tCLKH
Minimum clock high time
612
642
683
820
ps
94
62
99
62
105
62
127
tL U T
170
378
170
397
170
422
170
507
tA D D E R
372
619
372
650
372
691
372
829
ps
Notes to Table 4–56:
(1)
(2)
This column refers to –3 speed grades for EP2SGX30, EP2SGX60, and EP2SGX90 devices.
This column refers to –3 speed grades for EP2SGX130 devices.
Table 4–57. IOE Internal Timing Microparameters (Part 1 of 2)
Symbol
Parameter
-3 Speed
Grade (1)
Min
Max
-3 Speed
Grade (2)
Min
Max
-4 Speed
Grade
Min
Max
-5 Speed
Grade
Min
Unit
Max
tSU
IOE input and output
register setup time
before clock
122
128
136
163
ps
tH
IOE input and output
register hold time after
clock
72
75
80
96
ps
tCO
IOE input and output
register clock-to-output
delay
101
Altera Corporation
June 2009
169
101
177
101
188
101
226
ps
4–69
Stratix II GX Device Handbook, Volume 1
Timing Model
Table 4–57. IOE Internal Timing Microparameters (Part 2 of 2)
Symbol
-3 Speed
Grade (1)
Parameter
-3 Speed
Grade (2)
-4 Speed
Grade
-5 Speed
Grade
Unit
Min
Max
Min
Max
Min
Max
Min
Max
tPIN2COMBOUT_R Row input pin to IOE
combinational output
410
760
410
798
410
848
410
1018
ps
tPIN2COMBOUT_C Column input pin to
IOE combinational
output
428
787
428
825
428
878
428
1054
ps
tCOMBIN2PIN_R
Row IOE data input to
combinational output
pin
1101
2026
1101
2127
1101
2261
1101
2439
ps
tCOMBIN2PIN_C
Column IOE data input
to combinational output
pin
991
1854
991
1946
991
2069
991
2246
ps
tCLR
Minimum clear pulse
width
200
210
223
268
ps
tPRE
Minimum preset pulse
width
200
210
223
268
ps
tCLKL
Minimum clock low
time
600
630
669
804
ps
tCLKH
Minimum clock high
time
600
630
669
804
ps
(1)
(2)
This column refers to –3 speed grades for EP2SGX30, EP2SGX60, and EP2SGX90 devices.
This column refers to –3 speed grades for EP2SGX130 devices.
Table 4–58. DSP Block Internal Timing Microparameters (Part 1 of 2)
Symbol
Parameter
-3 Speed
Grade (1)
Min
Max
-3 Speed
Grade (2)
Min
Max
-4 Speed
Grade
Min
Max
-5 Speed
Grade
Min
Unit
Max
tSU
Input, pipeline, and
output register setup
time before clock
50
52
55
67
ps
tH
Input, pipeline, and
output register hold
time after clock
180
189
200
241
ps
tCO
Input, pipeline, and
output register
clock-to-output
delay
0
4–70
Stratix II GX Device Handbook, Volume 1
0
0
0
0
0
0
0
ps
Altera Corporation
June 2009
DC and Switching Characteristics
Table 4–58. DSP Block Internal Timing Microparameters (Part 2 of 2)
Symbol
Parameter
-3 Speed
Grade (1)
-3 Speed
Grade (2)
-4 Speed
Grade
-5 Speed
Grade
Min
Max
Min
Max
Min
Max
Min
Max
Unit
tINREG2PIPE9
Input register to
DSP block pipeline
register in 9 × 9-bit
mode
1312
2030
1312
2131
1312
2266
1312
2720
ps
tINREG2PIPE18
Input register to
DSP block pipeline
register in 18 × 18bit mode
1302
2010
1302
2110
1302
2244
1302
2693
ps
tINREG2PIPE36
Input register to
DSP block pipeline
register in 36 × 36bit mode
1302
2010
1302
2110
1302
2244
1302
2693
ps
tPIPE2OUTREG2ADD DSP block pipeline
register to output
register delay in
two-multipliers
adder mode
924
1450
924
1522
924
1618
924
1943
ps
tPIPE2OUTREG4ADD DSP block pipeline
register to output
register delay in
four-multipliers
adder mode
1134
1850
1134
1942
1134
2065
1134
2479
ps
tPD9
Combinational input
to output delay for
9×9
2100
2880
2100
3024
2100
3214
2100
3859
ps
tPD18
Combinational input
to output delay for
18 × 18
2110
2990
2110
3139
2110
3337
2110
4006
ps
tPD36
Combinational input
to output delay for
36 × 36
2939
4450
2939
4672
2939
4967
2939
5962
ps
tCLR
Minimum clear pulse
width
2212
2322
2469
2964
ps
tCLKL
Minimum clock low
time
1190
1249
1328
1594
ps
tCLKH
Minimum clock high
time
1190
1249
1328
1594
ps
(1)
(2)
This column refers to –3 speed grades for EP2SGX30, EP2SGX60, and EP2SGX90 devices.
This column refers to –3 speed grades for EP2SGX130 devices.
Altera Corporation
June 2009
4–71
Stratix II GX Device Handbook, Volume 1
Timing Model
Table 4–59. M512 Block Internal Timing Microparameters (Part 1 of 2)
Symbol
-3 Speed
Grade(2)
Parameter
-3 Speed Grade
-4 Speed Grade -5 Speed Grade
(3)
Unit
Min
Max
Min
Max
Min
Max
Min
Max
2318
2089
2433
2089
2587
2089
3104
tM512RC
Synchronous
read cycle time
2089
tM512WERESU
Write or read
enable setup
time before clock
22
23
24
29
ps
tM512WEREH
Write or read
enable hold time
after clock
203
213
226
272
ps
tM512DATASU
Data setup time
before clock
22
23
24
29
ps
tM512DATAH
Data hold time
after clock
203
213
226
272
ps
tM512WADDRSU Write address
setup time before
clock
22
23
24
29
ps
tM512WADDRH
Write address
hold time after
clock
203
213
226
272
ps
tM512RADDRSU
Read address
setup time before
clock
22
23
24
29
ps
tM512RADDRH
Read address
hold time after
clock
203
213
226
272
ps
tM512DATACO1
Clock-to-output
delay when using
output registers
298
478
298
501
298
533
298
640
ps
tM512DATACO2
Clock-to-output
delay without
output registers
2102
2345
2102
2461
2102
2616
2102
3141
ps
tM512CLKL
Minimum clock
low time
1315
1380
1468
1762
ps
tM512CLKH
Minimum clock
high time
1315
1380
1468
1762
ps
4–72
Stratix II GX Device Handbook, Volume 1
ps
Altera Corporation
June 2009
DC and Switching Characteristics
Table 4–59. M512 Block Internal Timing Microparameters (Part 2 of 2)
Symbol
Parameter
-3 Speed
Grade(2)
Min
tM512CLR
(1)
(2)
(3)
Minimum clear
pulse width
Max
144
-3 Speed Grade
-4 Speed Grade -5 Speed Grade
(3)
Unit
Min
Max
151
Min
Max
160
Min
Max
192
ps
The M512 block fMAX obtained using the Quartus II software does not necessarily equal to 1/TM512RC.
This column refers to –3 speed grades for EP2SGX30, EP2SGX60, and EP2SGX90 devices.
This column refers to –3 speed grades for EP2SGX130 devices.
Table 4–60. M4K Block Internal Timing Microparameters (Part 1 of 2)
Symbol
Parameter
Note (1)
-3 Speed Grade -3 Speed Grade
-4 Speed Grade -5 Speed Grade
(2)
(3)
Unit
Min
Max
Min
Max
Min
Max
Min
Max
1462
2240
1462
2351
1462
2500
1462
3000
tM4KRC
Synchronous
read cycle time
tM4KWERESU
Write or read
enable setup
time before clock
22
23
24
29
ps
tM4KWEREH
Write or read
enable hold time
after clock
203
213
226
272
ps
tM4KBESU
Byte enable
setup time before
clock
22
23
24
29
ps
tM4KBEH
Byte enable hold
time after clock
203
213
226
272
ps
tM4KDATAASU
A port data setup
time before clock
22
23
24
29
ps
tM4KDATAAH
A port data hold
time after clock
203
213
226
272
ps
tM4KADDRASU
A port address
setup time before
clock
22
23
24
29
ps
tM4KADDRAH
A port address
hold time after
clock
203
213
226
272
ps
tM4KDATABSU
B port data setup
time before clock
22
23
24
29
ps
Altera Corporation
June 2009
ps
4–73
Stratix II GX Device Handbook, Volume 1
Timing Model
Table 4–60. M4K Block Internal Timing Microparameters (Part 2 of 2)
Symbol
Parameter
-3 Speed Grade -3 Speed Grade
-4 Speed Grade -5 Speed Grade
(2)
(3)
Unit
Min
tM4KDATABH
Note (1)
Min
Max
Min
Max
Min
Max
203
213
226
272
ps
tM4KRADDRBSU B port address
setup time before
clock
22
23
24
29
ps
tM4KRADDRBH
B port address
hold time after
clock
203
213
226
272
ps
tM4KDATACO1
Clock-to-output
delay when using
output registers
334
524
334
549
334
584
334
701
ps
tM4KDATACO2
Clock-to-output
delay without
output registers
1616
2453
1616
2574
1616
2737
1616
3286
ps
tM4KCLKH
Minimum clock
high time
1250
1312
1395
1675
ps
tM4KCLKL
Minimum clock
low time
1250
1312
1395
1675
ps
tM4KCLR
Minimum clear
pulse width
144
151
160
192
ps
(1)
(2)
(3)
B port data hold
time after clock
Max
The M512 block fMAX obtained using the Quartus II software does not necessarily equal to 1/TM4KRC.
This column refers to –3 speed grades for EP2SGX30, EP2SGX60, and EP2SGX90 devices.
This column refers to –3 speed grades for EP2SGX130 devices.
Table 4–61. M-RAM Block Internal Timing Microparameters (Part 1 of 2)
Symbol
Parameter
-3 Speed
Grade (2)
-3 Speed
Grade (3)
Note (1)
-4 Speed
Grade
-5 Speed
Grade
Min
Max
Min
Max
Min
Max
Min
Max
1866
2774
1866
2911
1866
3096
1866
3716
Unit
tMEGARC
Synchronous read
cycle time
tMEGAWERESU
Write or read enable
setup time before
clock
144
151
160
192
ps
tMEGAWEREH
Write or read enable
hold time after clock
39
40
43
52
ps
4–74
Stratix II GX Device Handbook, Volume 1
ps
Altera Corporation
June 2009
DC and Switching Characteristics
Table 4–61. M-RAM Block Internal Timing Microparameters (Part 2 of 2)
Symbol
Parameter
-3 Speed
Grade (2)
Min
Max
-3 Speed
Grade (3)
Min
Max
Note (1)
-4 Speed
Grade
Min
Max
-5 Speed
Grade
Min
Unit
Max
tMEGABESU
Byte enable setup time
before clock
-9
-10
-11
-13
ps
tMEGABEH
Byte enable hold time
after clock
39
40
43
52
ps
tMEGADATAASU
A port data setup time
before clock
50
52
55
67
ps
tMEGADATAAH
A port data hold time
after clock
243
255
271
325
ps
tMEGAADDRASU A port address setup
time before clock
589
618
657
789
ps
tMEGAADDRAH
A port address hold
time after clock
-347
-365
-388
-465
ps
tMEGADATABSU
B port setup time
before clock
50
52
55
67
ps
tMEGADATABH
B port hold time after
clock
243
255
271
325
ps
tMEGAADDRBSU B port address setup
time before clock
589
618
657
789
ps
tMEGAADDRBH
B port address hold
time after clock
-347
-365
-388
-465
ps
tMEGADATACO1
Clock-to-output delay
when using output
registers
480
715
480
749
480
797
480
957
ps
tMEGADATACO2
Clock-to-output delay
without output
registers
1950
2899
1950
3042
1950
3235
1950
3884
ps
tMEGACLKL
Minimum clock low
time
1250
1312
1395
1675
ps
tMEGACLKH
Minimum clock high
time
1250
1312
1395
1675
ps
tMEGACLR
Minimum clear pulse
width
144
151
160
192
ps
(1)
(2)
(3)
The M512 block fMAX obtained using the Quartus II software does not necessarily equal to 1/TMEGARC.
This column refers to –3 speed grades for EP2SGX30, EP2SGX60, and EP2SGX90 devices.
This column refers to –3 speed grades for EP2SGX130 devices.
Altera Corporation
June 2009
4–75
Stratix II GX Device Handbook, Volume 1
Timing Model
Stratix II GX Clock Timing Parameters
See Tables 4–62 through 4–78 for Stratix II GX clock timing parameters.
Table 4–62. Stratix II GX Clock Timing Parameters
Symbol
Parameter
tCIN
Delay from clock pad to I/O input register
tCOUT
Delay from clock pad to I/O output register
tPLLCIN
Delay from PLL inclk pad to I/O input register
tPLLCOUT
Delay from PLL inclk pad to I/O output register
EP2SGX30 Clock Timing Parameters
Tables 4–63 through 4–66 show the maximum clock timing parameters
for EP2SGX30 devices.
Table 4–63. EP2SGX30 Column Pins Global Clock Timing Parameters
Fast Corner
Commercial
-3 Speed
Grade
-4 Speed
Grade
-5 Speed
Grade
Units
Industrial
tC I N
1.615
1.633
2.669
2.968
3.552
ns
tC O U T
1.450
1.468
2.427
2.698
3.228
ns
Parameter
tP L L C I N
tP L L C O U T
0.11
0.129
0.428
0.466
0.547
ns
-0.055
-0.036
0.186
0.196
0.223
ns
Table 4–64. EP2SGX30 Row Pins Global Clock Timing Parameters
Fast Corner
Industrial
Commercial
-3 Speed
Grade
1.365
1.382
2.280
Parameter
tC I N
-4 Speed
Grade
-5 Speed
Grade
Units
2.535
3.033
ns
tC O U T
1.370
1.387
2.276
2.531
3.028
ns
tP L L C I N
-0.151
-0.136
0.043
0.037
0.032
ns
tP L L C O U T
-0.146
-0.131
0.039
0.033
0.027
ns
4–76
Stratix II GX Device Handbook, Volume 1
Altera Corporation
June 2009
DC and Switching Characteristics
Table 4–65. EP2SGX30 Column Pins Regional Clock Timing Parameters
Fast Corner
Industrial
Commercial
-3 Speed
Grade
tC I N
1.493
1.507
2.522
tC O U T
1.353
1.372
2.525
2.809
3.364
ns
tP L L C I N
0.087
0.104
0.237
0.253
0.292
ns
tP L L C O U T
-0.078
-0.061
0.237
0.253
0.29
ns
Parameter
-4 Speed
Grade
-5 Speed
Grade
Units
2.806
3.364
ns
Table 4–66. EP2SGX30 Row Pins Regional Clock Timing Parameters
Fast Corner
Industrial
Commercial
-3 Speed
Grade
tC I N
1.246
1.262
2.437
2.712
3.246
ns
tC O U T
1.251
1.267
2.437
2.712
3.246
ns
tP L L C I N
-0.18
-0.167
0.215
0.229
0.263
ns
tP L L C O U T
-0.175
-0.162
0.215
0.229
0.263
ns
Parameter
-4 Speed
Grade
-5 Speed
Grade
Units
EP2SGX60 Clock Timing Parameters
Tables 4–67 through 4–70 show the maximum clock timing parameters
for EP2SGX60 devices.
Table 4–67. EP2SGX60 Column Pins Global Clock Timing Parameters
Fast Corner
Industrial
Commercial
-3 Speed
Grade
tC I N
1.722
1.736
2.940
3.275
3.919
ns
tC O U T
1.557
1.571
2.698
3.005
3.595
ns
tP L L C I N
0.037
0.051
0.474
0.521
0.613
ns
tP L L C O U T
-0.128
-0.114
0.232
0.251
0.289
ns
Parameter
Altera Corporation
June 2009
-4 Speed
Grade
-5 Speed
Grade
Units
4–77
Stratix II GX Device Handbook, Volume 1
Timing Model
Table 4–68. EP2SGX60 Row Pins Global Clock Timing Parameters
Fast Corner
Industrial
Commercial
-3 Speed
Grade
1.494
1.508
2.582
Parameter
tC I N
-4 Speed
Grade
-5 Speed
Grade
Units
2.875
3.441
ns
tC O U T
1.499
1.513
2.578
2.871
3.436
ns
tP L L C I N
-0.183
-0.168
0.116
0.122
0.135
ns
tP L L C O U T
-0.178
-0.163
0.112
0.118
0.13
ns
Table 4–69. EP2SGX60 Column Pins Regional Clock Timing Parameters
Fast Corner
Industrial
Commercial
-3 Speed
Grade
tC I N
1.577
1.591
2.736
3.048
3.648
ns
tC O U T
1.412
1.426
2.740
3.052
3.653
ns
tP L L C I N
0.065
0.08
0.334
0.361
0.423
ns
-0.1
-0.085
0.334
0.361
0.423
ns
Parameter
tP L L C O U T
-4 Speed
Grade
-5 Speed
Grade
Units
Table 4–70. EP2SGX60 Row Pins Regional Clock Timing Parameters
Fast Corner
Industrial
Commercial
-3 Speed
Grade
tC I N
1.342
1.355
2.716
3.024
3.622
ns
tC O U T
1.347
1.360
2.716
3.024
3.622
ns
tP L L C I N
-0.18
-0.166
0.326
0.352
0.412
ns
tP L L C O U T
-0.175
-0.161
0.334
0.361
0.423
ns
Parameter
4–78
Stratix II GX Device Handbook, Volume 1
-4 Speed
Grade
-5 Speed
Grade
Units
Altera Corporation
June 2009
DC and Switching Characteristics
EP2SGX90 Clock Timing Parameters
Tables 4–71 through 4–74 show the maximum clock timing parameters
for EP2SGX90 devices.
Table 4–71. EP2SGX90 Column Pins Global Clock Timing Parameters
Fast Corner
Industrial
Commercial
-3 Speed
Grade
tC I N
1.861
1.878
3.115
3.465
4.143
ns
tC O U T
1.696
1.713
2.873
3.195
3.819
ns
tP L L C I N
-0.254
-0.237
0.171
0.179
0.206
ns
tP L L C O U T
-0.419
-0.402
-0.071
-0.091
-0.118
ns
Parameter
-4 Speed
Grade
-5 Speed
Grade
Units
Table 4–72. EP2SGX90 Row Pins Global Clock Timing Parameters
Fast Corner
Commercial
-3 Speed
Grade
-4 Speed
Grade
-5 Speed
Grade
Units
Industrial
tC I N
1.634
1.650
2.768
3.076
3.678
ns
tC O U T
1.639
1.655
2.764
3.072
3.673
ns
tP L L C I N
-0.481
-0.465
-0.189
-0.223
-0.279
ns
tP L L C O U T
-0.476
-0.46
-0.193
-0.227
-0.284
ns
Parameter
Table 4–73. EP2SGX90 Column Pins Regional Clock Timing Parameters
Fast Corner
Industrial
Commercial
-3 Speed
Grade
1.688
1.702
2.896
Parameter
tC I N
-4 Speed
Grade
-5 Speed
Grade
Units
3.224
3.856
ns
tC O U T
1.551
1.569
2.893
3.220
3.851
ns
tP L L C I N
-0.105
-0.089
0.224
0.241
0.254
ns
tP L L C O U T
-0.27
-0.254
0.224
0.241
0.254
ns
Altera Corporation
June 2009
4–79
Stratix II GX Device Handbook, Volume 1
Timing Model
Table 4–74. EP2SGX90 Row Pins Regional Clock Timing Parameters
Fast Corner
Industrial
Commercial
-3 Speed
Grade
1.444
1.461
2.792
Parameter
tC I N
-4 Speed
Grade
-5 Speed
Grade
Units
3.108
3.716
ns
tC O U T
1.449
1.466
2.792
3.108
3.716
ns
tP L L C I N
-0.348
-0.333
0.204
0.217
0.243
ns
tP L L C O U T
-0.343
-0.328
0.212
0.217
0.254
ns
EP2SGX130 Clock Timing Parameters
Tables 4–75 through 4–78 show the maximum clock timing parameters
for EP2SGX130 devices.
Table 4–75. EP2SGX130 Column Pins Global Clock Timing Parameters
Fast Corner
Industrial
Commercial
-3 Speed
Grade
tC I N
1.980
1.998
3.491
3.706
4.434
ns
tC O U T
1.815
1.833
3.237
3.436
4.110
ns
tP L L C I N
-0.027
-0.009
0.307
0.322
0.376
ns
tP L L C O U T
-0.192
-0.174
0.053
0.052
0.052
ns
Parameter
-4 Speed
Grade
-5 Speed
Grade
Units
Table 4–76. EP2SGX130 Row Pins Global Clock Timing Parameters
Fast Corner
Industrial
Commercial
-3 Speed
Grade
tC I N
1.741
1.759
3.112
3.303
3.950
ns
tC O U T
1.746
1.764
3.108
3.299
3.945
ns
tP L L C I N
-0.261
-0.243
-0.089
-0.099
-0.129
ns
tP L L C O U T
-0.256
-0.238
-0.093
-0.103
-0.134
ns
Parameter
4–80
Stratix II GX Device Handbook, Volume 1
-4 Speed
Grade
-5 Speed
Grade
Units
Altera Corporation
June 2009
DC and Switching Characteristics
Table 4–77. EP2SGX130 Column Pins Regional Clock Timing Parameters
Fast Corner
Industrial
Commercial
-3 Speed
Grade
tC I N
1.815
1.834
3.218
3.417
4.087
ns
tC O U T
1.650
1.669
3.218
3.417
4.087
ns
tP L L C I N
0.116
0.134
0.349
0.364
0.426
ns
tP L L C O U T
-0.049
-0.031
0.361
0.378
0.444
ns
Parameter
-4 Speed
Grade
-5 Speed
Grade
Units
Table 4–78. EP2SGX130 Row Pins Regional Clock Timing Parameters
Fast Corner
Industrial
Commercial
-3 Speed
Grade
tC I N
1.544
1.560
3.195
3.395
4.060
ns
tC O U T
1.549
1.565
3.195
3.395
4.060
ns
tP L L C I N
-0.149
-0.132
0.34
0.356
0.417
ns
tP L L C O U T
-0.144
-0.127
0.342
0.356
0.417
ns
Parameter
-4 Speed
Grade
-5 Speed
Grade
Units
Clock Network Skew Adders
The Quartus II software models skew within dedicated clock networks
such as global and regional clocks. Therefore, the intra-clock network
skew adder is not specified. Table 4–79 specifies the intra-clock skew
between any two clock networks driving any registers in the Stratix II GX
device.
Table 4–79. Clock Network Specifications
Name
(Part 1 of 2)
Max
Unit
Clock skew adder
EP2SGX30 (1)
Inter-clock network, same side
±50
ps
Inter-clock network, entire chip
±100
ps
Clock skew adder
EP2SGX60 (1)
Inter-clock network, same side
±50
ps
Inter-clock network, entire chip
±100
ps
Clock skew adder
EP2SGX90 (1)
Inter-clock network, same side
±55
ps
Inter-clock network, entire chip
±110
ps
Altera Corporation
June 2009
Description
Min
Typ
4–81
Stratix II GX Device Handbook, Volume 1
Table 4–79. Clock Network Specifications
Name
Clock skew adder
EP2SGX130 (1)
(1)
(Part 2 of 2)
Description
Min
Typ
Max
Unit
Inter-clock network, same side
±63
ps
Inter-clock network, entire chip
±125
ps
This is in addition to intra-clock network skew, which is modeled in the Quartus II software.
IOE Programmable Delay
See Tables 4–80 and 4–81 for IOE programmable delay.
Table 4–80. Stratix II GX IOE Programmable Delay on Column Pins
Parameter
Input
delay from
pin to
internal
cells
Paths
Affected
Available
Settings
Pad to
I/O
dataout
to core
Pad to
Input
delay from I/O input
register
pin to
input
register
Delay
from
output
register to
output pin
I/O
output
register
to pad
tXZ, tZX
Output
enable pin
delay
(1)
(2)
(3)
Minimum
Timing
-3 Speed
Grade (2)
Note (1)
-3 Speed
Grade (3)
-4 Speed Grade
-5 Speed
Grade
Unit
Min
Offset
Max
Offset
Min
Offset
Max
Offset
Min
Offset
Max
Offset
Min
Offset
Max
Offset
Min
Offset
Max
Offset
8
0
1781
0
2881
0
3025
0
3217
0
3,860
ps
64
0
2053
0
3275
0
3439
0
3657
0
4388
ps
2
0
332
0
500
0
525
0
559
0
670
ps
2
0
320
0
483
0
507
0
539
0
647
ps
The incremental values for the settings are generally linear. For the exact delay associated with each setting, use the latest
version of the Quartus II software.
This column refers to –3 speed grades for EP2SGX30, EP2SGX60, and EP2SGX90 devices.
This column refers to –3 speed grades for EP2SGX130 devices.
Table 4–81. Stratix II GX IOE Programmable Delay on Row Pins
Minimum
Timing
Paths
Affected
Available
Settings
Input delay
from pin to
internal
cells
Pad to I/O
dataout to
logic array
8
0
1782
Input delay
from pin to
input
register
Pad to I/O
input
register
64
0
Delay from
output
register to
output pin
I/O output
register to
pad
2
Output
enable pin
delay
tXZ, tZX
2
Parameter
(1)
-3 Speed
Grade
Note (1)
-3 Speed
Grade
-4 Speed
Grade
-5 Speed
Grade
Unit
Min
Max
Offset Offset
Min
Offset
Max
Min
Offset Offset
Max
Offset
Min
Max
Min
Max
Offset Offset Offset Offset
0
2876
0
3020
0
3212
0
3853
ps
2054
0
3270
0
3434
0
3652
0
4381
ps
0
332
0
500
0
525
0
559
0
670
ps
0
320
0
483
0
507
0
539
0
647
ps
The incremental values for the settings are generally linear. For the exact delay associated with each setting, use the latest
version of the Quartus II software.
Default Capacitive Loading of Different I/O Standards
See Table 4–82 for default capacitive loading of different I/O standards.
Table 4–82. Default Loading of Different I/O Standards for Stratix II GX
Devices (Part 1 of 2)
I/O Standard
Capacitive Load
Unit
LVTTL
0
pF
LVCMOS
0
pF
2.5 V
0
pF
1.8 V
0
pF
1.5 V
0
pF
PCI
10
pF
PCI-X
10
pF
SSTL-2 Class I
0
pF
SSTL-2 Class II
0
pF
Table 4–82. Default Loading of Different I/O Standards for Stratix II GX
Devices (Part 2 of 2)
I/O Standard
Capacitive Load
Unit
SSTL-18 Class I
0
pF
SSTL-18 Class II
0
pF
1.5-V HSTL Class I
0
pF
1.5-V HSTL Class II
0
pF
1.8-V HSTL Class I
0
pF
1.8-V HSTL Class II
0
pF
Differential SSTL-2 Class I
0
pF
Differential SSTL-2 Class II
0
pF
Differential SSTL-18 Class I
0
pF
Differential SSTL-18 Class II
0
pF
1.5-V differential HSTL Class I
0
pF
1.5-V differential HSTL Class II
0
pF
1.8-V differential HSTL Class I
0
pF
1.8-V differential HSTL Class II
0
pF
LVDS
0
pF
I/O Delays
See Tables 4–83 through 4–87 for I/O delays.
Table 4–83. I/O Delay Parameters
Symbol
Parameter
tDIP
Delay from I/O datain to output pad
tOP
Delay from I/O output register to output pad
tPCOUT
Delay from input pad to I/O dataout to core
tPI
Delay from input pad to I/O input register
Table 4–84. Stratix II GX I/O Input Delay for Column Pins (Part 1 of 3)
I/O Standard
LVTTL
Parameter
Fast Corner
Industrial/
Commercial
-3 Speed
Grade (2)
-3 Speed
Grade (3)
-4 Speed
Grade
tPI
707
1223
1282
1364
1637
ps
tPCOUT
428
787
825
878
1054
ps
-5 Speed
Unit
Grade
Table 4–84. Stratix II GX I/O Input Delay for Column Pins (Part 2 of 3)
I/O Standard
2.5 V
1.8 V
1.5 V
LVCMOS
SSTL-2 Class I
SSTL-2 Class II
SSTL-18 Class I
SSTL-18 Class II
1.5-V HSTL Class I
1.5-V HSTL Class II
1.8-V HSTL Class I
1.8-V HSTL Class II
PCI
PCI-X
Differential SSTL-2
Class I (1)
Parameter
Fast Corner
Industrial/
Commercial
-3 Speed
Grade (2)
-3 Speed
Grade (3)
-4 Speed
Grade
tPI
717
1210
1269
1349
1619
ps
tPCOUT
438
774
812
863
1036
ps
tPI
783
1366
1433
1523
1829
ps
tPCOUT
504
930
976
1037
1246
ps
-5 Speed
Unit
Grade
tPI
786
1436
1506
1602
1922
ps
tPCOUT
507
1000
1049
1116
1339
ps
tPI
707
1223
1282
1364
1637
ps
tPCOUT
428
787
825
878
1054
ps
tPI
530
818
857
912
1094
ps
tPCOUT
251
382
400
426
511
ps
tPI
530
818
857
912
1094
ps
tPCOUT
251
382
400
426
511
ps
tPI
569
898
941
1001
1201
ps
tPCOUT
290
462
484
515
618
ps
tPI
569
898
941
1001
1201
ps
tPCOUT
290
462
484
515
618
ps
tPI
587
993
1041
1107
1329
ps
tPCOUT
308
557
584
621
746
ps
tPI
587
993
1041
1107
1329
ps
tPCOUT
308
557
584
621
746
ps
tPI
569
898
941
1001
1201
ps
tPCOUT
290
462
484
515
618
ps
tPI
569
898
941
1001
1201
ps
tPCOUT
290
462
484
515
618
ps
tPI
712
1214
1273
1354
1625
ps
tPCOUT
433
778
816
868
1042
ps
tP I
712
1214
1273
1354
1625
ps
tPCOUT
433
778
816
868
1042
ps
tPI
530
818
857
912
1094
ps
tPCOUT
251
382
400
426
511
ps
Table 4–84. Stratix II GX I/O Input Delay for Column Pins (Part 3 of 3)
I/O Standard
Differential SSTL-2
Class II (1)
Differential SSTL-18
Class I (1)
Differential SSTL-18
Class II (1)
1.8-V differential HSTL
Class I (1)
1.8-V differential HSTL
Class II (1)
1.5-V differential HSTL
Class I (1)
1.5-V differential HSTL
Class II (1)
(1)
(2)
(3)
Parameter
Fast Corner
Industrial/
Commercial
-3 Speed
Grade (2)
-3 Speed
Grade (3)
-4 Speed
Grade
tPI
530
818
857
912
tPCOUT
251
382
400
tPI
569
898
941
tPCOUT
290
462
484
-5 Speed
Unit
Grade
1094
ps
426
511
ps
1001
1201
ps
515
618
ps
tPI
569
898
941
1001
1201
ps
tPCOUT
290
462
484
515
618
ps
tPI
569
898
941
1001
1201
ps
tPCOUT
290
462
484
515
618
ps
tPI
569
898
941
1001
1201
ps
tPCOUT
290
462
484
515
618
ps
tPI
587
993
1041
1107
1329
ps
tPCOUT
308
557
584
621
746
ps
tPI
587
993
1041
1107
1329
ps
tPCOUT
308
557
584
621
746
ps
These I/O standards are only supported on DQS pins.
This column refers to –3 speed grades for EP2SGX30, EP2SGX60, and EP2SGX90 devices.
This column refers to –3 speed grades for EP2SGX130 devices.
Table 4–85. Stratix II GX I/O Input Delay for Row Pins (Part 1 of 3)
I/O Standard
LVTTL
2.5 V
1.8 V
1.5 V
Parameter
Fast Corner
Industrial/
Commercial
-3 Speed
Grade (2)
-3 Speed
Grade (3)
-4 Speed
Grade
-5 Speed
Grade
Unit
tPI
749
1287
1350
1435
1723
ps
tPCOUT
410
760
798
848
1018
ps
tPI
761
1273
1335
1419
1704
ps
tPCOUT
422
746
783
832
999
ps
tPI
827
1427
1497
1591
1911
ps
tPCOUT
488
900
945
1004
1206
ps
tPI
830
1498
1571
1671
2006
ps
tPCOUT
491
971
1019
1084
1301
ps
Table 4–85. Stratix II GX I/O Input Delay for Row Pins (Part 2 of 3)
I/O Standard
LVCMOS
SSTL-2 Class I
SSTL-2 Class II
SSTL-18 Class I
SSTL-18 Class II
1.5-V HSTL Class I
1.5-V HSTL Class II
1.8-V HSTL Class I
1.8-V HSTL Class II
PCI
PCI-X
LVDS (1)
HyperTransport
Differential SSTL-2
Class I
Differential SSTL-2
Class II
Parameter
Fast Corner
Industrial/
Commercial
-3 Speed
Grade (2)
-3 Speed
Grade (3)
-4 Speed
Grade
-5 Speed
Grade
Unit
tPI
749
1287
1350
1435
1723
ps
tPCOUT
410
760
798
848
1018
ps
tPI
573
879
921
980
1176
ps
tPCOUT
234
352
369
393
471
ps
tPI
573
879
921
980
1176
ps
tPCOUT
234
352
369
393
471
ps
tPI
605
960
1006
1070
1285
ps
tPCOUT
266
433
454
483
580
ps
tPI
605
960
1006
1070
1285
ps
tPCOUT
266
433
454
483
580
ps
tPI
631
1056
1107
1177
1413
ps
tPCOUT
292
529
555
590
708
ps
tPI
631
1056
1107
1177
1413
ps
tPCOUT
292
529
555
590
708
ps
tPI
605
960
1006
1070
1285
ps
tPCOUT
266
433
454
483
580
ps
tPI
605
960
1006
1070
1285
ps
tPCOUT
266
433
454
483
580
ps
tPI
830
1498
1571
1671
2006
ps
tPCOUT
491
971
1019
1084
1301
ps
tPI
830
1498
1571
1671
2006
ps
tPCOUT
491
971
1019
1084
1301
ps
tPI
540
948
994
1057
1269
ps
tPCOUT
201
421
442
470
564
ps
tPI
540
948
994
1057
1269
ps
tPCOUT
201
421
442
470
564
ps
tPI
573
879
921
980
1176
ps
tPCOUT
234
352
369
393
471
ps
tPI
573
879
921
980
1176
ps
tPCOUT
234
352
369
393
471
ps
Table 4–85. Stratix II GX I/O Input Delay for Row Pins (Part 3 of 3)
I/O Standard
Differential SSTL-18
Class I
Differential SSTL-18
Class II
1.8-V differential HSTL
Class I
1.8-V differential HSTL
Class II
1.5-V differential HSTL
Class I
1.5-V differential HSTL
Class II
(1)
(2)
(3)
Parameter
Fast Corner
Industrial/
Commercial
-3 Speed
Grade (2)
-3 Speed
Grade (3)
-4 Speed
Grade
-5 Speed
Grade
Unit
tPI
605
960
1006
1070
1285
ps
tPCOUT
266
433
454
483
580
ps
tPI
605
960
1006
1070
1285
ps
tPCOUT
266
433
454
483
580
ps
tPI
605
960
1006
1070
1285
ps
tPCOUT
266
433
454
483
580
ps
tPI
605
960
1006
1070
1285
ps
tPCOUT
266
433
454
483
580
ps
tPI
631
1056
1107
1177
1413
ps
tPCOUT
292
529
555
590
708
ps
tPI
631
1056
1107
1177
1413
ps
tPCOUT
292
529
555
590
708
ps
The parameters are only available on the left side of the device.
This column refers to –3 speed grades for EP2SGX30, EP2SGX60, and EP2SGX90 devices.
This column refers to –3 speed grades for EP2SGX130 devices.
Table 4–86. Stratix II GX I/O Output Delay for Column Pins (Part 1 of 7)
I/O Standard
LVTTL
Drive
Parameter
Strength
4 mA
8 mA
12 mA
16 mA
20 mA
24 mA (1)
LVCMOS
4 mA
8 mA
12 mA
16 mA
20 mA
24 mA (1)
Fast Corner
-3 Speed
Industrial/
Grade (3)
Commercial
-3 Speed
Grade (4)
-4 Speed
Grade
-5 Speed
Grade
Unit
tOP
1236
2351
2467
2624
2820
ps
tDIP
1258
2417
2537
2698
2910
ps
tOP
1091
2036
2136
2272
2448
ps
tDIP
1113
2102
2206
2346
2538
ps
tOP
1024
2036
2136
2272
2448
ps
tDIP
1046
2102
2206
2346
2538
ps
tOP
998
1893
1986
2112
2279
ps
tDIP
1020
1959
2056
2186
2369
ps
tOP
976
1787
1875
1994
2154
ps
tDIP
998
1853
1945
2068
2244
ps
tOP
969
1788
1876
1995
2156
ps
tDIP
991
1854
1946
2069
2246
ps
tOP
1091
2036
2136
2272
2448
ps
tDIP
1113
2102
2206
2346
2538
ps
tOP
999
1786
1874
1993
2153
ps
tDIP
1021
1852
1944
2067
2243
ps
tOP
971
1720
1805
1919
2075
ps
tDIP
993
1786
1875
1993
2165
ps
tOP
978
1693
1776
1889
2043
ps
tDIP
1000
1759
1846
1963
2133
ps
tOP
965
1677
1759
1871
2025
ps
tDIP
987
1743
1829
1945
2115
ps
tOP
954
1659
1741
1851
2003
ps
tDIP
976
1725
1811
1925
2093
ps
Table 4–86. Stratix II GX I/O Output Delay for Column Pins (Part 2 of 7)
I/O Standard
2.5 V
Drive
Parameter
Strength
4 mA
8 mA
12 mA
16 mA (1)
1.8 V
2 mA
4 mA
6 mA
8 mA
10 mA
12 mA (1)
1.5 V
2 mA
4 mA
6 mA
8 mA (1)
Fast Corner
-3 Speed
Industrial/
Grade (3)
Commercial
-3 Speed
Grade (4)
-4 Speed
Grade
-5 Speed
Grade
Unit
tOP
1053
2063
2165
2302
2480
ps
tDIP
1075
2129
2235
2376
2570
ps
tOP
1001
1841
1932
2054
2218
ps
tDIP
1023
1907
2002
2128
2308
ps
tOP
980
1742
1828
1944
2101
ps
tDIP
1002
1808
1898
2018
2191
ps
tOP
962
1679
1762
1873
2027
ps
tDIP
984
1745
1832
1947
2117
ps
tOP
1093
2904
3048
3241
3472
ps
tDIP
1115
2970
3118
3315
3562
ps
tOP
1098
2248
2359
2509
2698
ps
tDIP
1120
2314
2429
2583
2788
ps
tOP
1022
2024
2124
2258
2434
ps
tDIP
1044
2090
2194
2332
2524
ps
tOP
1024
1947
2043
2172
2343
ps
tDIP
1046
2013
2113
2246
2433
ps
tOP
978
1882
1975
2100
2266
ps
tDIP
1000
1948
2045
2174
2356
ps
tOP
979
1833
1923
2045
2209
ps
tDIP
1001
1899
1993
2119
2299
ps
tOP
1073
2505
2629
2795
3002
ps
tDIP
1095
2571
2699
2869
3092
ps
tOP
1009
2023
2123
2257
2433
ps
tDIP
1031
2089
2193
2331
2523
ps
tOP
1012
1923
2018
2146
2315
ps
tDIP
1034
1989
2088
2220
2405
ps
tOP
971
1878
1970
2095
2262
ps
tDIP
993
1944
2040
2169
2352
ps
Table 4–86. Stratix II GX I/O Output Delay for Column Pins (Part 3 of 7)
I/O Standard
SSTL-2 Class I
Drive
Parameter
Strength
8 mA
12 mA (1)
SSTL-2 Class II
16 mA
20 mA
24 mA (1)
SSTL-18 Class I
4 mA
6 mA
8 mA
10 mA
12 mA (1)
SSTL-18 Class II
8 mA
16 mA
18 mA
20 mA (1)
Fast Corner
-3 Speed
Industrial/
Grade (3)
Commercial
-3 Speed
Grade (4)
-4 Speed
Grade
-5 Speed
Grade
Unit
tOP
957
1715
1799
1913
2041
ps
tDIP
979
1781
1869
1987
2131
ps
tOP
940
1672
1754
1865
1991
ps
tDIP
962
1738
1824
1939
2081
ps
tOP
918
1609
1688
1795
1918
ps
tDIP
940
1675
1758
1869
2008
ps
tOP
919
1598
1676
1783
1905
ps
tDIP
941
1664
1746
1857
1995
ps
tOP
915
1596
1674
1781
1903
ps
tDIP
937
1662
1744
1855
1993
ps
tOP
953
1690
1773
1886
2012
ps
tDIP
975
1756
1843
1960
2102
ps
tOP
958
1656
1737
1848
1973
ps
tDIP
980
1722
1807
1922
2063
ps
tOP
937
1640
1721
1830
1954
ps
tDIP
959
1706
1791
1904
2044
ps
tOP
942
1638
1718
1827
1952
ps
tDIP
964
1704
1788
1901
2042
ps
tOP
936
1626
1706
1814
1938
ps
tDIP
958
1692
1776
1888
2028
ps
tOP
925
1597
1675
1782
1904
ps
tDIP
947
1663
1745
1856
1994
ps
tOP
937
1578
1655
1761
1882
ps
tDIP
959
1644
1725
1835
1972
ps
tOP
933
1585
1663
1768
1890
ps
tDIP
955
1651
1733
1842
1980
ps
tOP
933
1583
1661
1766
1888
ps
tDIP
955
1649
1731
1840
1978
ps
Table 4–86. Stratix II GX I/O Output Delay for Column Pins (Part 4 of 7)
I/O Standard
1.8-V HSTL
Class I
Drive
Parameter
Strength
4 mA
6 mA
8 mA
10 mA
12 mA (1)
1.8-V HSTL
Class II
16 mA
18 mA
20 mA (1)
1.5-V HSTL
Class I
4 mA
6 mA
8 mA
10 mA
12 mA (1)
Fast Corner
-3 Speed
Industrial/
Grade (3)
Commercial
-3 Speed
Grade (4)
-4 Speed
Grade
-5 Speed
Grade
Unit
tOP
956
1608
1687
1794
1943
ps
tDIP
978
1674
1757
1868
2033
ps
tOP
962
1595
1673
1779
1928
ps
tDIP
984
1661
1743
1853
2018
ps
tOP
940
1586
1664
1769
1917
ps
tDIP
962
1652
1734
1843
2007
ps
tOP
944
1591
1669
1775
1923
ps
tDIP
966
1657
1739
1849
2013
ps
tOP
936
1585
1663
1768
1916
ps
tDIP
958
1651
1733
1842
2006
ps
tOP
919
1385
1453
1545
1680
ps
tDIP
941
1451
1523
1619
1770
ps
tOP
921
1394
1462
1555
1691
ps
tDIP
943
1460
1532
1629
1781
ps
tOP
921
1402
1471
1564
1700
ps
tDIP
943
1468
1541
1638
1790
ps
tOP
956
1607
1686
1793
1942
ps
tDIP
978
1673
1756
1867
2032
ps
tOP
961
1588
1666
1772
1920
ps
tDIP
983
1654
1736
1846
2010
ps
tOP
943
1590
1668
1774
1922
ps
tDIP
965
1656
1738
1848
2012
ps
tOP
943
1592
1670
1776
1924
ps
tDIP
965
1658
1740
1850
2014
ps
tOP
937
1590
1668
1774
1922
ps
tDIP
959
1656
1738
1848
2012
ps
Table 4–86. Stratix II GX I/O Output Delay for Column Pins (Part 5 of 7)
I/O Standard
1.5-V HSTL
Class II
Drive
Parameter
Strength
16 mA
18 mA
20 mA (1)
PCI
-
PCI-X
-
Differential SSTL2 Class I (2)
8 mA
12 mA
Differential
SSTL-2 Class II (2)
16 mA
20 mA
24 mA
Differential
SSTL-18 Class I
(2)
4 mA
6 mA
8 mA
10 mA
12 mA
Fast Corner
-3 Speed
Industrial/
Grade (3)
Commercial
-3 Speed
Grade (4)
-4 Speed
Grade
-5 Speed
Grade
Unit
tOP
924
1431
1501
1596
1734
ps
tDIP
946
1497
1571
1670
1824
ps
tOP
927
1439
1510
1605
1744
ps
tDIP
949
1505
1580
1679
1834
ps
tOP
929
1450
1521
1618
1757
ps
tDIP
951
1516
1591
1692
1847
ps
tOP
1082
1956
2051
2176
2070
ps
tDIP
1104
2022
2121
2250
2160
ps
tOP
1082
1956
2051
2176
2070
ps
tDIP
1104
2022
2121
2250
2160
ps
tOP
957
1715
1799
1913
2041
ps
tDIP
979
1781
1869
1987
2131
ps
tOP
940
1672
1754
1865
1991
ps
tDIP
962
1738
1824
1939
2081
ps
tOP
918
1609
1688
1795
1918
ps
tDIP
940
1675
1758
1869
2008
ps
tOP
919
1598
1676
1783
1905
ps
tDIP
941
1664
1746
1857
1995
ps
tOP
915
1596
1674
1781
1903
ps
tDIP
937
1662
1744
1855
1993
ps
tOP
953
1690
1773
1886
2012
ps
tDIP
975
1756
1843
1960
2102
ps
tOP
958
1656
1737
1848
1973
ps
tDIP
980
1722
1807
1922
2063
ps
tOP
937
1640
1721
1830
1954
ps
tDIP
959
1706
1791
1904
2044
ps
tOP
942
1638
1718
1827
1952
ps
tDIP
964
1704
1788
1901
2042
ps
tOP
936
1626
1706
1814
1938
ps
tDIP
958
1692
1776
1888
2028
ps
Table 4–86. Stratix II GX I/O Output Delay for Column Pins (Part 6 of 7)
I/O Standard
Differential
SSTL-18 Class II
(2)
Drive
Parameter
Strength
8 mA
16 mA
18 mA
20 mA
1.8-V differential
HSTL Class I (2)
4 mA
6 mA
8 mA
10 mA
12 mA
1.8-V differential
HSTL Class II (2)
16 mA
18 mA
20 mA
Fast Corner
-3 Speed
Industrial/
Grade (3)
Commercial
-3 Speed
Grade (4)
-4 Speed
Grade
-5 Speed
Grade
Unit
tOP
925
1597
1675
1782
1904
ps
tDIP
947
1663
1745
1856
1994
ps
tOP
937
1578
1655
1761
1882
ps
tDIP
959
1644
1725
1835
1972
ps
tOP
933
1585
1663
1768
1890
ps
tDIP
955
1651
1733
1842
1980
ps
tOP
933
1583
1661
1766
1888
ps
tDIP
955
1649
1731
1840
1978
ps
tOP
956
1608
1687
1794
1943
ps
tDIP
978
1674
1757
1868
2033
ps
tOP
962
1595
1673
1779
1928
ps
tDIP
984
1661
1743
1853
2018
ps
tOP
940
1586
1664
1769
1917
ps
tDIP
962
1652
1734
1843
2007
ps
tOP
944
1591
1669
1775
1923
ps
tDIP
966
1657
1739
1849
2013
ps
tOP
936
1585
1663
1768
1916
ps
tDIP
958
1651
1733
1842
2006
ps
tOP
919
1385
1453
1545
1680
ps
tDIP
941
1451
1523
1619
1770
ps
tOP
921
1394
1462
1555
1691
ps
tDIP
943
1460
1532
1629
1781
ps
tOP
921
1402
1471
1564
1700
ps
tDIP
943
1468
1541
1638
1790
ps
Table 4–86. Stratix II GX I/O Output Delay for Column Pins (Part 7 of 7)
I/O Standard
1.5-V differential
HSTL Class I (2)
Drive
Parameter
Strength
4 mA
6 mA
8 mA
10 mA
12 mA
1.5-V differential
HSTL Class II (2)
16 mA
18 mA
20 mA
(1)
(2)
(3)
(4)
Fast Corner
-3 Speed
Industrial/
Grade (3)
Commercial
-3 Speed
Grade (4)
-4 Speed
Grade
-5 Speed
Grade
Unit
tOP
956
1607
1686
1793
1942
ps
tDIP
978
1673
1756
1867
2032
ps
tOP
961
1588
1666
1772
1920
ps
tDIP
983
1654
1736
1846
2010
ps
tOP
943
1590
1668
1774
1922
ps
tDIP
965
1656
1738
1848
2012
ps
tOP
943
1592
1670
1776
1924
ps
tDIP
965
1658
1740
1850
2014
ps
tOP
937
1590
1668
1774
1922
ps
tDIP
959
1656
1738
1848
2012
ps
tOP
924
1431
1501
1596
1734
ps
tDIP
946
1497
1571
1670
1824
ps
tOP
927
1439
1510
1605
1744
ps
tDIP
949
1505
1580
1679
1834
ps
tOP
929
1450
1521
1618
1757
ps
tDIP
951
1516
1591
1692
1847
ps
This is the default setting in the Quartus II software.
These I/O standards are only supported on DQS pins.
This column refers to –3 speed grades for EP2SGX30, EP2SGX60, and EP2SGX90 devices.
This column refers to –3 speed grades for EP2SGX130 devices.
Table 4–87. Stratix II GX I/O Output Delay for Row Pins (Part 1 of 4)
I/O Standard
LVTTL
Drive
Strength
Parameter
Fast Corner
Industrial/
Commercial
-3 Speed
Grade (3)
-3 Speed
Grade (4)
-4 Speed
Grade
4 mA
tOP
1328
2655
2786
2962
3189
ps
tDIP
1285
2600
2729
2902
3116
ps
tOP
1200
2113
2217
2357
2549
ps
tDIP
1157
2058
2160
2297
2476
ps
tOP
1144
2081
2184
2321
2512
ps
tDIP
1101
2026
2127
2261
2439
ps
8 mA
12 mA (1)
-5 Speed
Unit
Grade
Table 4–87. Stratix II GX I/O Output Delay for Row Pins (Part 2 of 4)
I/O Standard
LVCMOS
Drive
Strength
Parameter
Fast Corner
Industrial/
Commercial
-3 Speed
Grade (3)
-3 Speed
Grade (4)
-4 Speed
Grade
4 mA
tOP
1200
2113
2217
2357
2549
ps
tDIP
1157
2058
2160
2297
2476
ps
tOP
1094
1853
1944
2067
2243
ps
tDIP
1051
1798
1887
2007
2170
ps
8 mA (1)
12 mA (1)
2.5 V
4 mA
8 mA
12 mA (1)
1.8 V
2 mA
4 mA
6 mA
8 mA (1)
1.5 V
2 mA
4 mA (1)
SSTL-2 Class I
8 mA
12 mA (1)
SSTL-2 Class II 16 mA (1)
-5 Speed
Unit
Grade
tOP
1061
1723
1808
1922
2089
ps
tDIP
1018
1668
1751
1862
2016
ps
tOP
1183
2091
2194
2332
2523
ps
tDIP
1140
2036
2137
2272
2450
ps
tOP
1080
1872
1964
2088
2265
ps
tDIP
1037
1817
1907
2028
2192
ps
tOP
1061
1775
1862
1980
2151
ps
tDIP
1018
1720
1805
1920
2078
ps
tOP
1253
2954
3100
3296
3542
ps
tDIP
1210
2899
3043
3236
3469
ps
tOP
1242
2294
2407
2559
2763
ps
tDIP
1199
2239
2350
2499
2690
ps
tOP
1131
2039
2140
2274
2462
ps
tDIP
1088
1984
2083
2214
2389
ps
tOP
1100
1942
2038
2166
2348
ps
tDIP
1057
1887
1981
2106
2275
ps
tOP
1213
2530
2655
2823
3041
ps
tDIP
1170
2475
2598
2763
2968
ps
tOP
1106
2020
2120
2253
2440
ps
tDIP
1063
1965
2063
2193
2367
ps
tOP
1050
1759
1846
1962
2104
ps
tDIP
1007
1704
1789
1902
2031
ps
tOP
1026
1694
1777
1889
2028
ps
tDIP
983
1639
1720
1829
1955
ps
tOP
992
1581
1659
1763
1897
ps
tDIP
949
1526
1602
1703
1824
ps
Table 4–87. Stratix II GX I/O Output Delay for Row Pins (Part 3 of 4)
I/O Standard
SSTL-18
Class I
Drive
Strength
Parameter
Fast Corner
Industrial/
Commercial
-3 Speed
Grade (3)
-3 Speed
Grade (4)
-4 Speed
Grade
4 mA
tOP
1038
1709
1793
1906
2046
ps
tDIP
995
1654
1736
1846
1973
ps
tOP
1042
1648
1729
1838
1975
ps
tDIP
999
1593
1672
1778
1902
ps
6 mA
8 mA
10 mA (1)
1.8-V HSTL
Class I
4 mA
6 mA
8 mA
10 mA
12 mA (1)
1.5-V HSTL
Class I
4 mA
6 mA
8 mA (1)
Differential
SSTL-2 Class I
8 mA
12 mA
Differential
SSTL-2 Class II
16 mA
-5 Speed
Unit
Grade
tOP
1018
1633
1713
1821
1958
ps
tDIP
975
1578
1656
1761
1885
ps
tOP
1021
1615
1694
1801
1937
ps
tDIP
978
1560
1637
1741
1864
ps
tOP
1019
1610
1689
1795
1956
ps
tDIP
976
1555
1632
1735
1883
ps
tOP
1022
1580
1658
1762
1920
ps
tDIP
979
1525
1601
1702
1847
ps
tOP
1004
1576
1653
1757
1916
ps
tDIP
961
1521
1596
1697
1843
ps
tOP
1008
1567
1644
1747
1905
ps
tDIP
965
1512
1587
1687
1832
ps
tOP
999
1566
1643
1746
1904
ps
tDIP
956
1511
1586
1686
1831
ps
tOP
1018
1591
1669
1774
1933
ps
tDIP
975
1536
1612
1714
1860
ps
tOP
1021
1579
1657
1761
1919
ps
tDIP
978
1524
1600
1701
1846
ps
tOP
1006
1572
1649
1753
1911
ps
tDIP
963
1517
1592
1693
1838
ps
tOP
1050
1759
1846
1962
2104
ps
tDIP
1007
1704
1789
1902
2031
ps
tOP
1026
1694
1777
1889
2028
ps
tDIP
983
1639
1720
1829
1955
ps
tOP
992
1581
1659
1763
1897
ps
tDIP
949
1526
1602
1703
1824
ps
Table 4–87. Stratix II GX I/O Output Delay for Row Pins (Part 4 of 4)
I/O Standard
Differential
SSTL-18 Class I
Drive
Strength
Parameter
Fast Corner
Industrial/
Commercial
-3 Speed
Grade (3)
-3 Speed
Grade (4)
-4 Speed
Grade
4 mA
tOP
1038
1709
1793
1906
2046
ps
tDIP
995
1654
1736
1846
1973
ps
tOP
1042
1648
1729
1838
1975
ps
tDIP
999
1593
1672
1778
1902
ps
6 mA
8 mA
10 mA
LVDS (2)
HyperTransport
(1)
(2)
(3)
(4)
-
-
-5 Speed
Unit
Grade
tOP
1018
1633
1713
1821
1958
ps
tDIP
975
1578
1656
1761
1885
ps
tOP
1021
1615
1694
1801
1937
ps
tDIP
978
1560
1637
1741
1864
ps
tOP
1067
1723
1808
1922
2089
ps
tDIP
1024
1668
1751
1862
2016
ps
tOP
1053
1723
1808
1922
2089
ps
tDIP
1010
1668
1751
1862
2016
ps
This is the default setting in the Quartus II software.
The parameters are only available on the left side of the device.
This column refers to –3 speed grades for EP2SGX30, EP2SGX60, and EP2SGX90 devices.
This column refers to –3 speed grades for EP2SGX130 devices.
Maximum Input and Output Clock Toggle Rate
Maximum clock toggle rate is defined as the maximum frequency
achievable for a clock type signal at an I/O pin. The I/O pin can be a
regular I/O pin or a dedicated clock I/O pin.
The maximum clock toggle rate is different from the maximum data bit
rate. If the maximum clock toggle rate on a regular I/O pin is 300 MHz,
the maximum data bit rate for dual data rate (DDR) could be potentially
as high as 600 Mbps on the same I/O pin.
Tables 4–88 through 4–90 specify the maximum input clock toggle rates.
Tables 4–91 through 4–96 specify the maximum output clock toggle rates
at 0 pF load. Table 4–97 specifies the derating factors for the output clock
toggle rate for a non 0 pF load.
To calculate the output toggle rate for a non 0 pF load, use this formula:
The toggle rate for a non 0 pF load
= 1,000 / (1,000/ toggle rate at 0 pF load + derating factor × load
value in pF /1,000)
For example, the output toggle rate at 0 pF load for SSTL-18 Class II
20 mA I/O standard is 550 MHz on a -3 device clock output pin. The
derating factor is 94 ps/pF. For a 10 pF load the toggle rate is calculated
as:
1,000 / (1,000/550 + 94 × 10 /1,000) = 363 (MHz)
Table 4–88 shows the maximum input clock toggle rates for Stratix II GX
device column pins.
Table 4–88. Stratix II GX Maximum Input Clock Rate for Column I/O Pins (Part 1 of 2)
I/O Standard
-3 Speed Grade
-4 Speed Grade
-5 Speed Grade
Unit
LVTTL
500
500
450
MHz
2.5 V
500
500
450
MHz
1.8 V
500
500
450
MHz
1.5 V
500
500
450
MHz
LVCMOS
500
500
450
MHz
SSTL-2 Class I
500
500
500
MHz
SSTL-2 Class II
500
500
500
MHz
SSTL-18 Class I
500
500
500
MHz
SSTL-18 Class I I
500
500
500
MHz
1.5-V HSTL Class I
500
500
500
MHz
1.5-V HSTL Class I I
500
500
500
MHz
1.8-V HSTL Class I
500
500
500
MHz
1.8-V HSTL Class II
500
500
500
MHz
PCI
500
500
450
MHz
PCI-X
500
500
450
MHz
Differential SSTL-2
Class I
500
500
500
MHz
Differential SSTL-2
Class II
500
500
500
MHz
Differential SSTL-18
Class I
500
500
500
MHz
Table 4–88. Stratix II GX Maximum Input Clock Rate for Column I/O Pins (Part 2 of 2)
I/O Standard
-3 Speed Grade
-4 Speed Grade
-5 Speed Grade
Unit
Differential SSTL-18
Class I I
500
500
500
MHz
1.8-V differential
HSTL Class I
500
500
500
MHz
1.8-V differential
HSTL Class II
500
500
500
MHz
1.5-V differential
HSTL Class I
500
500
500
MHz
1.5-V differential
HSTL Class I I
500
500
500
MHz
1.2-V HSTL
280
250
250
MHz
1.2-V differential
HSTL
280
250
250
MHz
Table 4–89 shows the maximum input clock toggle rates for Stratix II GX
device row pins.
Table 4–89. Stratix II GX Maximum Input Clock Rate for Row I/O Pins (Part 1 of 2)
I/O Standard
-3 Speed Grade
-4 Speed Grade
-5 Speed Grade
Unit
LVTTL
500
500
450
MHz
2.5 V
500
500
450
MHz
1.8 V
500
500
450
MHz
1.5 V
500
500
450
MHz
LVCMOS
500
500
450
MHz
SSTL-2 Class I
500
500
500
MHz
SSTL-2 Class II
500
500
500
MHz
SSTL-18 Class I
500
500
500
MHz
SSTL-18 Class II
500
500
500
MHz
1.5-V HSTL Class I
500
500
500
MHz
1.5-V HSTL Class II
500
500
500
MHz
1.8-V HSTL Class I
500
500
500
MHz
1.8-V HSTL Class II
500
500
500
MHz
PCI
500
500
425
MHz
PCI-X
500
500
425
MHz
Differential SSTL-2
Class I
500
500
500
MHz
Table 4–89. Stratix II GX Maximum Input Clock Rate for Row I/O Pins (Part 2 of 2)
I/O Standard
-3 Speed Grade
-4 Speed Grade
-5 Speed Grade
Unit
Differential SSTL-2
Class II
500
500
500
MHz
Differential SSTL-18
Class I
500
500
500
MHz
Differential SSTL-18
Class I I
500
500
500
MHz
1.8-V differential
HSTL Class I
500
500
500
MHz
1.8-V differential
HSTL Class I I
500
500
500
MHz
1.5-V differential
HSTL Class I
500
500
500
MHz
1.5-V differential
HSTL Class II
500
500
500
MHz
LVDS (1)
520
520
420
MHz
HyperTransport
520
520
420
MHz
(1)
The parameters are only available on the left side of the device.
Table 4–90 shows the maximum input clock toggle rates for Stratix II GX
device dedicated clock pins.
Table 4–90. Stratix II GX Maximum Input Clock Rate for Dedicated Clock Pins (Part 1 of 2)
I/O Standard
-3 Speed Grade
-4 Speed Grade
-5 Speed Grade
Unit
LVTTL
500
500
400
MHz
2.5 V
500
500
400
MHz
1.8 V
500
500
400
MHz
1.5 V
500
500
400
MHz
LVCMOS
500
500
400
MHz
SSTL-2 Class I
500
500
500
MHz
SSTL-2 Class II
500
500
500
MHz
SSTL-18 Class I
500
500
500
MHz
SSTL-18 Class II
500
500
500
MHz
1.5-V HSTL Class I
500
500
500
MHz
1.5-V HSTL Class II
500
500
500
MHz
1.8-V HSTL CLass I
500
500
500
MHz
Table 4–90. Stratix II GX Maximum Input Clock Rate for Dedicated Clock Pins (Part 2 of 2)
I/O Standard
-3 Speed Grade
-4 Speed Grade
-5 Speed Grade
Unit
1.8-V HSTL CLass I
500
500
500
MHz
PCI
500
500
400
MHz
PCI-X
500
500
400
MHz
Differential SSTL-2
Class I
500
500
500
MHz
Differential SSTL-2
Class II
500
500
500
MHz
Differential SSTL-18
Class I
500
500
500
MHz
Differential SSTL-18
Class II
500
500
500
MHz
1.8-V differential
HSTL Class I
500
500
500
MHz
1.8-V differential
HSTL Class II
500
500
500
MHz
1.5-V differential
HSTL Class I
500
500
500
MHz
1.5-V differential
HSTL Class I I
500
500
500
MHz
HyperTransport (1)
LVPECL (1), (2)
LVDS (1)
(1)
(2)
717
717
640
MHz
450
450
400
MHz
717
717
640
MHz
450
450
400
MHz
717
717
640
MHz
450
450
400
MHz
The first set of numbers refers to the HIO dedicated clock pins. The second set of numbers refers to the VIO
dedicated clock pins.
LVPECL is only supported on column clock pins.
Table 4–91 shows the maximum output clock toggle rates for Stratix II GX
device column pins.
Table 4–91. Stratix II GX Maximum Output Clock Rate for Column Pins (Part 1 of 3)
I/O Standard
LVTTL
LVCMOS
2.5 V
1.8 V
1.5 V
SSTL-2 Class I
SSTL-2 Class II
Drive Strength
-3 Speed Grade
-4 Speed Grade
-5 Speed Grade
Unit
4 mA
270
225
210
MHz
8 mA
435
355
325
MHz
12 mA
580
475
420
MHz
16 mA
720
594
520
MHz
20 mA
875
700
610
MHz
24 mA (1)
1030
794
670
MHz
4 mA
290
250
230
MHz
8 mA
565
480
440
MHz
12 mA
790
710
670
MHz
16 mA
1020
925
875
MHz
20 mA
1066
985
935
MHz
24 mA (1)
1100
1040
1000
MHz
4 mA
230
194
180
MHz
8 mA
430
380
380
MHz
12 mA
630
575
550
MHz
16 mA (1)
930
845
820
MHz
2 mA
120
109
104
MHz
4 mA
285
250
230
MHz
6 mA
450
390
360
MHz
8 mA
660
570
520
MHz
10 mA
905
805
755
MHz
12 mA (1)
1131
1040
990
MHz
2 mA
244
200
180
MHz
4 mA
470
370
325
MHz
6 mA
550
430
375
MHz
8 mA (1)
625
495
420
MHz
8 mA
400
300
300
MHz
12 mA (1)
400
400
350
MHz
16 mA
350
350
300
MHz
20 mA
400
350
350
MHz
24 mA (1)
400
400
350
MHz
Table 4–91. Stratix II GX Maximum Output Clock Rate for Column Pins (Part 2 of 3)
I/O Standard
Drive Strength
-3 Speed Grade
-4 Speed Grade
-5 Speed Grade
Unit
SSTL-18 Class I
4 mA
200
150
150
MHz
6 mA
350
250
200
MHz
8 mA
450
300
300
MHz
10 mA
500
400
400
MHz
12 mA (1)
700
550
400
MHz
SSTL-18 Class II
1.8-V HSTL
Class I
1.8-V HSTL
Class II
1.5-V HSTL
Class I
1.5-V HSTL
Class II
8 mA
200
200
150
MHz
16 mA
400
350
350
MHz
18 mA
450
400
400
MHz
20 mA (1)
550
500
450
MHz
4 mA
300
300
300
MHz
6 mA
500
450
450
MHz
8 mA
650
600
600
MHz
10 mA
700
650
600
MHz
12 mA (1)
700
700
650
MHz
16 mA
500
500
450
MHz
18 mA
550
500
500
MHz
20 mA (1)
650
550
550
MHz
4 mA
350
300
300
MHz
6 mA
500
500
450
MHz
8 mA
700
650
600
MHz
10 mA
700
700
650
MHz
12 mA (1)
700
700
700
MHz
16 mA
600
600
550
MHz
18 mA
650
600
600
MHz
20 mA (1)
700
650
600
MHz
PCI
-
1000
790
670
MHz
PCI-X
-
1000
790
670
MHz
Differential
SSTL-2 Class I
Differential
SSTL-2 Class II
8 mA
400
300
300
MHz
12 mA
400
400
350
MHz
16 mA
350
350
300
MHz
20 mA
400
350
350
MHz
24 mA
400
400
350
MHz
Table 4–91. Stratix II GX Maximum Output Clock Rate for Column Pins (Part 3 of 3)
I/O Standard
Drive Strength
-3 Speed Grade
-4 Speed Grade
-5 Speed Grade
Unit
Differential
SSTL-18 Class I
4 mA
200
150
150
MHz
6 mA
350
250
200
MHz
8 mA
450
300
300
MHz
10 mA
500
400
400
MHz
12 mA
700
550
400
MHz
Differential
SSTL-18 Class II
1.8-V HSTL
differential
Class I
1.8-V HSTL
differential
Class II
1.5-V HSTL
differential
Class I
1.5-V HSTL
differential
Class II
(1)
8 mA
200
200
150
MHz
16 mA
400
350
350
MHz
18 mA
450
400
400
MHz
20 mA
550
500
450
MHz
4 mA
300
300
300
MHz
6 mA
500
450
450
MHz
8 mA
650
600
600
MHz
10 mA
700
650
600
MHz
12 mA
700
700
650
MHz
16 mA
500
500
450
MHz
18 mA
550
500
500
MHz
20 mA
650
550
550
MHz
4 mA
350
300
300
MHz
6 mA
500
500
450
MHz
8 mA
700
650
600
MHz
10 mA
700
700
650
MHz
12 mA
700
700
700
MHz
16 mA
600
600
550
MHz
18 mA
650
600
600
MHz
20 mA
700
650
600
MHz
This is the default setting in the Quartus II software.
Table 4–92 shows the maximum output clock toggle rates for Stratix II GX
device row pins.
Table 4–92. Stratix II GX Maximum Output Clock Rate for Row Pins (Part 1 of 2)
I/O Standard
LVTTL
LVCMOS
2.5 V
1.8 V
1.5 V
SSTL-2 Class I
SSTL-2 Class II
SSTL-18 Class I
1.8-V HSTL
Class I
1.5-V HSTL
Class I
Drive Strength
-3 Speed Grade
-4 Speed Grade
-5 Speed Grade
Unit
4 mA
270
225
210
MHz
8 mA
435
355
325
MHz
12 mA (1)
580
475
420
MHz
4 mA
290
250
230
MHz
8 mA
565
480
440
MHz
12 mA (1)
350
350
297
MHz
4 mA
230
194
180
MHz
8 mA
430
380
380
MHz
12 mA (1)
630
575
550
MHz
2 mA
120
109
104
MHz
4 mA
285
250
230
MHz
6 mA
450
390
360
MHz
8 mA (1)
660
570
520
MHz
2 mA
244
200
180
MHz
4 mA (1)
470
370
325
MHz
8 mA
400
300
300
MHz
12 mA (1)
400
400
350
MHz
16 mA
350
350
300
MHz
20 mA (1)
350
350
297
MHz
4 mA
200
150
150
MHz
6 mA
350
250
200
MHz
8 mA
450
300
300
MHz
10 mA
500
400
400
MHz
12 mA (1)
350
350
297
MHz
4 mA
300
300
300
MHz
6 mA
500
450
450
MHz
8 mA
650
600
600
MHz
10 mA
700
650
600
MHz
12 mA (1)
700
700
650
MHz
4 mA
350
300
300
MHz
6 mA
500
500
450
MHz
8 mA (1)
700
650
600
MHz
Table 4–92. Stratix II GX Maximum Output Clock Rate for Row Pins (Part 2 of 2)
I/O Standard
Differential
SSTL-2 Class I
Drive Strength
-3 Speed Grade
-4 Speed Grade
-5 Speed Grade
Unit
8 mA
400
300
300
MHz
12 mA
400
400
350
MHz
Differential
SSTL-2 Class II
16 mA (1)
350
350
300
MHz
Differential
SSTL-18 Class I
4 mA
200
150
150
MHz
6 mA
350
250
200
MHz
8 mA
450
300
300
MHz
10 mA (1)
500
400
400
MHz
LVDS
-
717
717
640
MHz
HyperTransport
-
717
717
640
MHz
(1)
This is the default setting in Quartus II software.
Table 4–93 shows the maximum output clock toggle rate for Stratix II GX
device dedicated clock pins.
Table 4–93. Stratix II GX Maximum Output Clock Rate for Dedicated Clock Pins (Part 1 of 4)
I/O Standard
LVTTL
LVCMOS
Drive Strength
-3 Speed
Grade
-4 Speed
Grade
-5 Speed
Grade
4 mA
270
225
210
MHz
Unit
8 mA
435
355
325
MHz
12 mA
580
475
420
MHz
16 mA
720
594
520
MHz
20 mA
875
700
610
MHz
24 mA (1)
1030
794
670
MHz
4 mA
290
250
230
MHz
8 mA
565
480
440
MHz
12 mA
790
710
670
MHz
16 mA
1020
925
875
MHz
20 mA
1066
985
935
MHz
24 mA (1)
1100
1040
1000
MHz
Table 4–93. Stratix II GX Maximum Output Clock Rate for Dedicated Clock Pins (Part 2 of 4)
I/O Standard
2.5 V
1.8 V
1.5 V
SSTL-2 Class I
SSTL-2 Class II
SSTL-18 Class I
SSTL-18 Class II
1.8-V HSTL Class I
Drive Strength
-3 Speed
Grade
-4 Speed
Grade
-5 Speed
Grade
Unit
4 mA
230
194
180
MHz
8 mA
430
380
380
MHz
12 mA
630
575
550
MHz
16 mA (1)
930
845
820
MHz
2 mA
120
109
104
MHz
4 mA
285
250
230
MHz
6 mA
450
390
360
MHz
8 mA
660
570
520
MHz
10 mA
905
805
755
MHz
12 mA (1)
1131
1040
990
MHz
2 mA
244
200
180
MHz
4 mA
470
370
325
MHz
6 mA
550
430
375
MHz
8 mA (1)
625
495
420
MHz
8 mA
400
300
300
MHz
12 mA (1)
400
400
350
MHz
16 mA
350
350
300
MHz
20 mA
400
350
350
MHz
24 mA (1)
400
400
350
MHz
4 mA
200
150
150
MHz
6 mA
350
250
200
MHz
8 mA
450
300
300
MHz
10 mA
500
400
400
MHz
12 mA (1)
650
550
400
MHz
8 mA
200
200
150
MHz
16 mA
400
350
350
MHz
18 mA
450
400
400
MHz
20 mA (1)
550
500
450
MHz
4 mA
300
300
300
MHz
6 mA
500
450
450
MHz
8 mA
650
600
600
MHz
10 mA
700
650
600
MHz
12 mA (1)
700
700
650
MHz
Table 4–93. Stratix II GX Maximum Output Clock Rate for Dedicated Clock Pins (Part 3 of 4)
I/O Standard
1.8-V HSTL Class II
1.5-V HSTL Class I
1.5-V HSTL Class II
Drive Strength
-3 Speed
Grade
-4 Speed
Grade
-5 Speed
Grade
Unit
16 mA
500
500
450
MHz
18 mA
550
500
500
MHz
20 mA (1)
550
550
550
MHz
4 mA
350
300
300
MHz
6 mA
500
500
450
MHz
8 mA
700
650
600
MHz
10 mA
700
700
650
MHz
12 mA (1)
700
700
700
MHz
16 mA
600
600
550
MHz
18 mA
650
600
600
MHz
20 mA (1)
700
650
600
MHz
PCI
-
1000
790
670
MHz
PCI-X
-
1000
790
670
MHz
Differential SSTL-2
Class I
Differential SSTL-2
Class II
Differential SSTL-18
Class I
Differential SSTL-18
Class II
1.8-V differential Class I
8 mA
400
300
300
MHz
12 mA
400
400
350
MHz
16 mA
350
350
300
MHz
20 mA
400
350
350
MHz
24 mA
400
400
350
MHz
4 mA
200
150
150
MHz
6 mA
350
250
200
MHz
8 mA
450
300
300
MHz
10 mA
500
400
400
MHz
12 mA
650
550
400
MHz
8 mA
200
200
150
MHz
16 mA
400
350
350
MHz
18 mA
450
400
400
MHz
20 mA
550
500
450
MHz
4 mA
300
300
300
MHz
6 mA
500
450
450
MHz
8 mA
650
600
600
MHz
10 mA
700
650
600
MHz
12 mA
700
700
650
MHz
Table 4–93. Stratix II GX Maximum Output Clock Rate for Dedicated Clock Pins (Part 4 of 4)
I/O Standard
1.8-V differential
Class II
1.5-V differential Class I
1.5-V differential
Class II
Drive Strength
-3 Speed
Grade
-4 Speed
Grade
-5 Speed
Grade
Unit
16 mA
500
500
450
MHz
18 mA
550
500
500
MHz
20 mA
550
550
550
MHz
4 mA
350
300
300
MHz
6 mA
500
500
450
MHz
8 mA
700
650
600
MHz
10 mA
700
700
650
MHz
12 mA
700
700
700
MHz
16 mA
600
600
550
MHz
18 mA
650
600
600
MHz
20 mA
700
650
600
MHz
HyperTransport
-
300
250
125
MHz
LVPECL
-
450
400
300
MHz
(1)
This is the default setting in Quartus II software.
Table 4–94 shows the maximum output clock toggle rate for Stratix II GX
device series-terminated column pins.
Table 4–94. Stratix II GX Maximum Output Clock Rate for Column Pins (Series Termination) (Part 1
of 2)
I/O Standard
Drive Strength
-3 Speed Grade
-4 Speed Grade
-5 Speed Grade
Unit
LVTTL
OCT_25_OHMS
400
400
350
MHz
OCT_50_OHMS
400
400
350
MHz
LVCMOS
OCT_25_OHMS
350
350
300
MHz
OCT_50_OHMS
350
350
300
MHz
OCT_25_OHMS
350
350
300
MHz
OCT_50_OHMS
350
350
300
MHz
OCT_25_OHMS
700
550
450
MHz
2.5 V
1.8 V
OCT_50_OHMS
700
550
450
MHz
1.5 V
OCT_50_OHMS
550
450
400
MHz
SSTL-2 Class I
OCT_50_OHMS
600
500
500
MHz
SSTL-2 Class II
OCT_25_OHMS
600
550
500
MHz
Table 4–94. Stratix II GX Maximum Output Clock Rate for Column Pins (Series Termination) (Part 2
of 2)
I/O Standard
Drive Strength
SSTL-18 Class I OCT_50_OHMS
-3 Speed Grade
-4 Speed Grade
-5 Speed Grade
Unit
560
400
350
MHz
SSTL-18 Class II OCT_25_OHMS
550
500
450
MHz
1.5-V HSTL
Class I
OCT_50_OHMS
600
550
500
MHz
1.8-V HSTL
Class I
OCT_50_OHMS
650
600
600
MHz
1.8-V HSTL
Class II
OCT_25_OHMS
500
500
450
MHz
Differential
SSTL-2 Class I
OCT_50_OHMS
600
500
500
MHz
Differential
SSTL-2 Class II
OCT_25_OHMS
600
550
500
MHz
Differential
OCT_50_OHMS
SSTL-18 Class I
560
400
350
MHz
Differential
OCT_25_OHMS
SSTL-18 Class II
550
500
450
MHz
1.8-V differential
HSTL Class I
OCT_50_OHMS
650
600
600
MHz
1.8-V differential
HSTL Class II
OCT_25_OHMS
500
500
450
MHz
1.5-V differential
HSTL Class I
OCT_50_OHMS
600
550
500
MHz
Table 4–95 shows the maximum output clock toggle rate for Stratix II GX
device series-terminated row pins.
Table 4–95. Stratix II GX Maximum Output Clock Rate for Row Pins (Series Termination) (Part 1 of 2)
I/O Standard
LVTTL
LVCMOS
2.5 V
Drive Strength
-3 Speed Grade
-4 Speed Grade
-5 Speed Grade
Unit
OCT_25_OHMS
400
400
350
MHz
OCT_50_OHMS
400
400
350
MHz
OCT_25_OHMS
350
350
300
MHz
OCT_50_OHMS
350
350
300
MHz
OCT_25_OHMS
350
350
300
MHz
OCT_50_OHMS
350
350
300
MHz
1.8 V
OCT_50_OHMS
700
550
450
MHz
1.5 V
OCT_50_OHMS
550
450
400
MHz
Table 4–95. Stratix II GX Maximum Output Clock Rate for Row Pins (Series Termination) (Part 2 of 2)
I/O Standard
Drive Strength
-3 Speed Grade
-4 Speed Grade
-5 Speed Grade
Unit
SSTL-2 Class I
OCT_50_OHMS
600
500
500
MHz
SSTL-2 Class II
OCT_25_OHMS
600
550
500
MHz
SSTL-18 Class I OCT_50_OHMS
590
400
350
MHz
1.5-V HSTL
Class I
OCT_50_OHMS
600
550
500
MHz
1.8-V HSTL
Class I
OCT_50_OHMS
650
600
600
MHz
Differential
SSTL-2 Class I
OCT_50_OHMS
600
500
500
MHz
Differential
SSTL-2 Class II
OCT_25_OHMS
600
550
500
MHz
Differential
OCT_50_OHMS
SSTL-18 Class I
590
400
350
MHz
Differential
OCT_50_OHMS
HSTL-18 Class I
650
600
600
MHz
Differential
OCT_50_OHMS
HSTL-15 Class I
600
550
500
Table 4–96 shows the maximum output clock toggle rate for Stratix II GX
device series-terminated dedicated clock pins.
Table 4–96. Stratix II GX Maximum Output Clock Rate for Dedicated Clock Pins (Series Termination) (Part
1 of 2)
I/O Standard
Drive Strength
-3 Speed Grade
-4 Speed Grade
-5 Speed Grade
Unit
LVTTL
OCT_25_OHMS
400
400
350
MHz
OCT_50_OHMS
400
400
350
MHz
LVCMOS
OCT_25_OHMS
350
350
300
MHz
OCT_50_OHMS
350
350
300
MHz
OCT_25_OHMS
350
350
300
MHz
OCT_50_OHMS
350
350
300
MHz
OCT_25_OHMS
700
550
450
MHz
2.5 V
1.8 V
OCT_50_OHMS
700
550
450
MHz
1.5 V
OCT_50_OHMS
550
450
400
MHz
SSTL-2 Class I
OCT_50_OHMS
600
500
500
MHz
SSTL-2 Class II
OCT_25_OHMS
600
550
500
MHz
SSTL-18 Class I OCT_50_OHMS
450
400
350
MHz
Table 4–96. Stratix II GX Maximum Output Clock Rate for Dedicated Clock Pins (Series Termination) (Part
2 of 2)
I/O Standard
Drive Strength
-3 Speed Grade
-4 Speed Grade
-5 Speed Grade
Unit
SSTL-18 Class II OCT_25_OHMS
550
500
450
MHz
1.5-V HSTL
Class I
OCT_50_OHMS
600
550
500
MHz
1.8-V HSTL
Class I
OCT_50_OHMS
650
600
600
MHz
1.8-V HSTL
Class II
OCT_25_OHMS
500
500
450
MHz
DIfferential
SSTL-2 Class I
OCT_50_OHMS
600
500
500
MHz
DIfferential
SSTL-2 Class II
OCT_25_OHMS
600
550
500
MHz
DIfferential
OCT_50_OHMS
SSTL-18 Class I
560
400
350
MHz
DIfferential
OCT_25_OHMS
SSTL-18 Class II
550
500
450
MHz
1.8-V differential
HSTL Class I
OCT_50_OHMS
650
600
600
MHz
1.8-V differential
HSTL Class II
OCT_25_OHMS
500
500
450
MHz
1.5-V differential
HSTL Class I
OCT_50_OHMS
600
550
500
MHz
Table 4–97 specifies the derating factors for the output clock toggle rate
for a non 0 pF load.
Table 4–97. Maximum Output Clock Toggle Rate Derating Factors (Part 1 of 5)
Maximum Output Clock Toggle Rate Derating Factors (ps/pF)
I/O Standard
Drive
Strength
Column I/O Pins
-3
3.3-V LVTTL
Dedicated Clock
Outputs
Row I/O Pins
-4
-5
-3
-4
-5
-3
-4
-5
4 mA
478
510
510
478
510
510
466
510
510
8 mA
260
333
333
260
333
333
291
333
333
12 mA
213
247
247
213
247
247
211
247
247
16 mA
136
197
197
-
-
-
166
197
197
20 mA
138
187
187
-
-
-
154
187
187
24 mA
134
177
177
-
-
-
143
177
177
Table 4–97. Maximum Output Clock Toggle Rate Derating Factors (Part 2 of 5)
Maximum Output Clock Toggle Rate Derating Factors (ps/pF)
I/O Standard
3.3-V LVCMOS
2.5-V LVTTL/
LVCMOS
1.8-V LVTTL/
LVCMOS
1.5-V LVTTL/
LVCMOS
SSTL-2 Class I
SSTL-2 Class II
SSTL-18 Class I
Drive
Strength
4 mA
Column I/O Pins
Dedicated Clock
Outputs
Row I/O Pins
-3
-4
-5
-3
-4
-5
-3
-4
-5
377
391
391
377
391
391
377
391
391
8 mA
206
212
212
206
212
212
178
212
212
12 mA
141
145
145
-
-
-
115
145
145
16 mA
108
111
111
-
-
-
86
111
111
20 mA
83
88
88
-
-
-
79
88
88
24 mA
65
72
72
-
-
-
74
72
72
4 mA
387
427
427
387
427
427
391
427
427
8 mA
163
224
224
163
224
224
170
224
224
12 mA
142
203
203
142
203
203
152
203
203
16 mA
120
182
182
-
-
-
134
182
182
2 mA
951
1,421
1,421
951
1,421
1,421
904
1,421
1,421
4 mA
405
516
516
405
516
516
393
516
516
6 mA
261
325
325
261
325
325
253
325
325
8 mA
223
274
274
223
274
274
224
274
274
10 mA
194
236
236
-
-
-
199
236
236
12 mA
174
209
209
-
-
-
180
209
209
2 mA
652
963
963
652
963
963
618
963
963
4 mA
333
347
347
333
347
347
270
347
347
6 mA
182
247
247
-
-
-
198
247
247
8 mA
135
194
194
-
-
-
155
194
194
8 mA
364
680
680
364
680
680
350
680
680
12 mA
163
207
207
163
207
207
188
207
207
16 mA
118
147
147
118
147
147
94
147
147
20 mA
99
122
122
-
-
-
87
122
122
24 mA
91
116
116
-
-
-
85
116
116
4 mA
458
570
570
458
570
570
505
570
570
6 mA
305
380
380
305
380
380
336
380
380
8 mA
225
282
282
225
282
282
248
282
282
10 mA
167
220
220
167
220
220
190
220
220
12 mA
129
175
175
-
-
-
148
175
175
Table 4–97. Maximum Output Clock Toggle Rate Derating Factors (Part 3 of 5)
Maximum Output Clock Toggle Rate Derating Factors (ps/pF)
I/O Standard
SSTL-18 Class II
2.5-V SSTL-2
Class I
2.5-V SSTL-2
Class II
1.8-V SSTL-18
Class I
1.8-V SSTL-18
Class II
1.8-V HSTL Class I
1.8-V HSTL
Class II
1.5-V HSTL Class I
Drive
Strength
Column I/O Pins
Dedicated Clock
Outputs
Row I/O Pins
-3
-4
-5
-3
-4
-5
-3
-4
-5
8 mA
173
206
206
-
-
-
155
206
206
16 mA
150
160
160
-
-
-
140
160
160
18 mA
120
130
130
-
-
-
110
130
130
20 mA
109
127
127
-
-
-
94
127
127
8 mA
364
680
680
364
680
680
350
680
680
12 mA
163
207
207
163
207
207
188
207
207
16 mA
118
147
147
118
147
147
94
147
147
20 mA
99
122
122
-
-
-
87
122
122
24 mA
91
116
116
-
-
-
85
116
116
4 mA
458
570
570
458
570
570
505
570
570
6 mA
305
380
380
305
380
380
336
380
380
8 mA
225
282
282
225
282
282
248
282
282
10 mA
167
220
220
167
220
220
190
220
220
12 mA
129
175
175
-
-
-
148
175
175
8 mA
173
206
206
-
-
-
155
206
206
16 mA
150
160
160
-
-
-
140
160
160
18 mA
120
130
130
-
-
-
110
130
130
20 mA
109
127
127
-
-
-
94
127
127
4 mA
245
282
282
245
282
282
229
282
282
6 mA
164
188
188
164
188
188
153
188
188
8 mA
123
140
140
123
140
140
114
140
140
10 mA
110
124
124
110
124
124
108
124
124
12 mA
97
110
110
97
110
110
104
110
110
16 mA
101
104
104
-
-
-
99
104
104
18 mA
98
102
102
-
-
-
93
102
102
20 mA
93
99
99
-
-
-
88
99
99
4 mA
168
196
196
168
196
196
188
196
196
6 mA
112
131
131
112
131
131
125
131
131
8 mA
84
99
99
84
99
99
95
99
99
10 mA
87
98
98
-
-
-
90
98
98
12 mA
86
98
98
-
-
-
87
98
98
Table 4–97. Maximum Output Clock Toggle Rate Derating Factors (Part 4 of 5)
Maximum Output Clock Toggle Rate Derating Factors (ps/pF)
I/O Standard
1.5-V HSTL
Class II
2.5-V differential
SSTL Class II (3)
1.8-V differential
SSTL Class I (3)
1.8-V differential
SSTL Class II (3)
1.8-V differential
HSTL Class I (3)
1.8-V differential
HSTL Class II (3)
1.5-V differential
HSTL Class I (3)
Drive
Strength
Column I/O Pins
Dedicated Clock
Outputs
Row I/O Pins
-3
-4
-5
-3
-4
-5
-3
-4
-5
16 mA
95
101
101
-
-
-
96
101
101
18 mA
95
100
100
-
-
-
101
100
100
20 mA
94
101
101
-
-
-
104
101
101
8 mA
364
680
680
-
-
-
350
680
680
12 mA
163
207
207
-
-
-
188
207
207
16 mA
118
147
147
-
-
-
94
147
147
20 mA
99
122
122
-
-
-
87
122
122
24 mA
91
116
116
-
-
-
85
116
116
4 mA
458
570
570
-
-
-
505
570
570
6 mA
305
380
380
-
-
-
336
380
380
8 mA
225
282
282
-
-
-
248
282
282
10 mA
167
220
220
-
-
-
190
220
220
12 mA
129
175
175
-
-
-
148
175
175
8 mA
173
206
206
-
-
-
155
206
206
16 mA
150
160
160
-
-
-
140
160
160
18 mA
120
130
130
-
-
-
110
130
130
20 mA
109
127
127
-
-
-
94
127
127
4 mA
245
282
282
-
-
-
229
282
282
6 mA
164
188
188
-
-
-
153
188
188
8 mA
123
140
140
-
-
-
114
140
140
10 mA
110
124
124
-
-
-
108
124
124
12 mA
97
110
110
-
-
-
104
110
110
16 mA
101
104
104
-
-
-
99
104
104
18 mA
98
102
102
-
-
-
93
102
102
20 mA
93
99
99
-
-
-
88
99
99
4 mA
168
196
196
-
-
-
188
196
196
6 mA
112
131
131
-
-
-
125
131
131
8 mA
84
99
99
-
-
-
95
99
99
10 mA
87
98
98
-
-
-
90
98
98
12 mA
86
98
98
-
-
-
87
98
98
Table 4–97. Maximum Output Clock Toggle Rate Derating Factors (Part 5 of 5)
Maximum Output Clock Toggle Rate Derating Factors (ps/pF)
I/O Standard
1.5-V differential
HSTL Class II (3)
Drive
Strength
Column I/O Pins
Dedicated Clock
Outputs
Row I/O Pins
-3
-4
-5
-3
-4
-5
-3
-4
-5
16 mA
95
101
101
-
-
-
96
101
101
18 mA
95
100
100
-
-
-
101
100
100
20 mA
94
101
101
-
-
-
104
101
101
3.3-V PCI
134
177
177
-
-
-
143
177
177
3.3-V PCI-X
134
177
177
-
-
-
143
177
177
-
-
-
155 (1)
155
(1)
155
(1)
134
134
134
LVDS
LVPECL (4)
3.3-V LVTTL
OCT 50 Ω
-
-
-
-
-
-
134
134
134
133
152
152
133
152
152
147
152
152
2.5-V LVTTL
OCT 50 Ω
207
274
274
207
274
274
235
274
274
1.8-V LVTTL
OCT 50 Ω
151
165
165
151
165
165
153
165
165
3.3-V LVCMOS
OCT 50 Ω
300
316
316
300
316
316
263
316
316
1.5-V LVCMOS
OCT 50 Ω
157
171
171
157
171
171
174
171
171
SSTL-2 Class I
OCT 50 Ω
121
134
134
121
134
134
77
134
134
SSTL-2 Class II
OCT 25 Ω
56
101
101
56
101
101
58
101
101
SSTL-18 Class I
OCT 50 Ω
100
123
123
100
123
123
106
123
123
SSTL-18 Class II
OCT 25 Ω
61
110
110
-
-
-
59
110
110
1.2-V HSTL (2)
OCT 50 Ω
95
-
-
-
-
-
95
-
-
(1)
(2)
(3)
(4)
For LVDS output on row I/O pins the toggle rate derating factors apply to loads larger than 5 pF. In the derating
calculation, subtract 5 pF from the intended load value in pF for the correct result. For a load less than or equal to
5 pF, refer to Tables 4–91 through 4–95 for output toggle rates.
1.2-V HSTL is only supported on column I/O pins on -3 devices.
Differential HSTL and SSTL is only supported on column clock and DQS outputs.
LVPECL is only supported on column clock outputs.
Duty Cycle
Distortion
Duty cycle distortion (DCD) describes how much the falling edge of a
clock is off from its ideal position. The ideal position is when both the
clock high time (CLKH) and the clock low time (CLKL) equal half of the
clock period (T), as shown in Figure 4–11. DCD is the deviation of the
non-ideal falling edge from the ideal falling edge, such as D1 for the
falling edge A and D2 for the falling edge B (see Figure 4–11). The
maximum DCD for a clock is the larger value of D1 and D2.
Figure 4–11. Duty Cycle Distortion
Ideal Falling Edge
CLKH = T/2
CLKL = T/2
D1
Falling Edge A
D2
Falling Edge B
Clock Period (T)
DCD expressed in absolution derivation, for example, D1 or D2 in
Figure 4–11, is clock-period independent. DCD can also be expressed as a
percentage, and the percentage number is clock-period dependent. DCD
as a percentage is defined as:
(T/2 – D1) / T (the low percentage boundary)
(T/2 + D2) / T (the high percentage boundary)
DCD Measurement Techniques
DCD is measured at an FPGA output pin driven by registers inside the
corresponding I/O element (IOE) block. When the output is a single data
rate signal (non-DDIO), only one edge of the register input clock (positive
or negative) triggers output transitions (Figure 4–12). Therefore, any
DCD present on the input clock signal or caused by the clock input buffer
or different input I/O standard does not transfer to the output signal.
Figure 4–12. DCD Measurement Technique for Non-DDIO (Single-Data Rate) Outputs
However, when the output is a double data rate input/output (DDIO)
signal, both edges of the input clock signal (positive and negative) trigger
output transitions (Figure 4–13). Therefore, any distortion on the input
clock and the input clock buffer affect the output DCD.
Figure 4–13. DCD Measurement Technique for DDIO (Double-Data Rate) Outputs
When an FPGA PLL generates the internal clock, the PLL output clocks
the IOE block. As the PLL only monitors the positive edge of the reference
clock input and internally re-creates the output clock signal, any DCD
present on the reference clock is filtered out. Therefore, the DCD for a
DDIO output with PLL in the clock path is better than the DCD for a
DDIO output without PLL in the clock path.
Tables 4–98 through 4–105 show the maximum DCD in absolution
derivation for different I/O standards on Stratix II GX devices. Examples
are also provided that show how to calculate DCD as a percentage.
Table 4–98. Maximum DCD for Non-DDIO Output on Row I/O Pins
Maximum DCD (ps) for Non-DDIO Output
Row I/O Output Standard
-3 Devices
-4 and -5 Devices
Unit
3.3-V LVTTTL
245
275
ps
3.3-V LVCMOS
125
155
ps
2.5 V
105
135
ps
1.8 V
180
180
ps
1.5-V LVCMOS
165
195
ps
SSTL-2 Class I
115
145
ps
SSTL-2 Class II
95
125
ps
SSTL-18 Class I
55
85
ps
1.8-V HSTL Class I
80
100
ps
1.5-V HSTL Class I
85
115
ps
LVDS
55
80
ps
Here is an example for calculating the DCD as a percentage for a
non-DDIO output on a row I/O on a -3 device:
If the non-DDIO output I/O standard is SSTL-2 Class II, the maximum
DCD is 95 ps (see Table 4–99). If the clock frequency is 267 MHz, the clock
period T is:
T = 1/ f = 1 / 267 MHz = 3.745 ns = 3,745 ps
To calculate the DCD as a percentage:
(T/2 – DCD) / T = (3,745 ps/2 – 95 ps) / 3,745 ps = 47.5% (for low
boundary)
(T/2 + DCD) / T = (3,745 ps/2 + 95 ps) / 3,745 ps = 52.5% (for high
boundary)
Therefore, the DCD percentage for the output clock at 267 MHz is from
47.5% to 52.5%.
Table 4–99. Maximum DCD for Non-DDIO Output on Column I/O Pins
Column I/O Output
Standard I/O
Standard
Maximum DCD (ps) for Non-DDIO
Output
-3 Devices
Unit
-4 and -5 Devices
3.3-V LVTTL
190
220
ps
3.3-V LVCMOS
140
175
ps
2.5 V
125
155
ps
1.8 V
80
110
ps
1.5-V LVCMOS
185
215
ps
SSTL-2 Class I
105
135
ps
SSTL-2 Class II
100
130
ps
SSTL-18 Class I
90
115
ps
SSTL-18 Class II
70
100
ps
1.8-V HSTL
Class I
80
110
ps
1.8-V HSTL
Class II
80
110
ps
1.5-V HSTL
Class I
85
115
ps
1.5-V HSTL
Class II
50
80
ps
1.2-V HSTL-12
170
200
ps
LVPECL
55
80
ps
Table 4–100. Maximum DCD for DDIO Output on Row I/O Pins Without PLL in the Clock Path for -3 Devices
Note (1)
Input I/O Standard (No PLL in Clock Path)
Maximum DCD (ps) for
Row DDIO Output I/O
Standard
TTL/CMOS
SSTL-2
SSTL/HSTL
LVDS
2.5 V
1.8 and
1.5 V
3.3 V
Unit
3.3 and
2.5 V
1.8 and
1.5 V
3.3-V LVTTL
260
380
145
145
110
ps
3.3-V LVCMOS
210
330
100
100
65
ps
2.5 V
195
315
85
85
75
ps
1.8 V
150
265
85
85
120
ps
1.5-V LVCMOS
255
370
140
140
105
ps
SSTL-2 Class I
175
295
65
65
70
ps
SSTL-2 Class II
170
290
60
60
75
ps
SSTL-18 Class I
155
275
55
50
90
ps
1.8-V HSTL Class I
150
270
60
60
95
ps
1.5-V HSTL Class I
150
270
55
55
90
ps
LVDS
180
180
180
180
180
ps
(1)
The information in Table 4–100 assumes the input clock has zero DCD.
Here is an example for calculating the DCD in percentage for a DDIO
output on a row I/O on a -3 device:
If the input I/O standard is 2.5-V SSTL-2 and the DDIO output I/O
standard is SSTL-2 Class= II, the maximum DCD is 60 ps (see
Table 4–100). If the clock frequency is 267 MHz, the clock period T is:
T = 1/ f = 1 / 267 MHz = 3.745 ns = 3,745 ps
Calculate the DCD as a percentage:
(T/2 – DCD) / T = (3,745 ps/2 – 60 ps) / 3745 ps = 48.4% (for low
boundary)
(T/2 + DCD) / T = (3,745 ps/2 + 60 ps) / 3745 ps = 51.6% (for high
boundary)
Therefore, the DCD percentage for the output clock is from 48.4% to
51.6%.
Table 4–101. Maximum DCD for DDIO Output on Row I/O Pins Without PLL in the Clock Path for -4 and -5
Devices
Note (1)
Maximum DCD (ps) for
Row DDIO Output I/O
Standard
3.3-V LVTTL
Input I/O Standard (No PLL in the Clock Path)
TTL/CMOS
SSTL-2
SSTL/HSTL
LVDS
Unit
3.3/2.5V
1.8/1.5V
2.5V
1.8/1.5V
3.3V
440
495
170
160
105
ps
3.3-V LVCMOS
390
450
120
110
75
ps
2.5 V
375
430
105
95
90
ps
1.8 V
325
385
90
100
135
ps
1.5-V LVCMOS
430
490
160
155
100
ps
SSTL-2 Class I
355
410
85
75
85
ps
SSTL-2 Class II
350
405
80
70
90
ps
SSTL-18 Class I
335
390
65
65
105
ps
1.8-V HSTL Class I
330
385
60
70
110
ps
1.5-V HSTL Class I
330
390
60
70
105
ps
LVDS
180
180
180
180
180
ps
(1)
Table 4–101 assumes the input clock has zero DCD.
Table 4–102. Maximum DCD for DDIO Output on Column I/O Pins Without PLL in the Clock Path for -3
Devices (Part 1 of 2)
Note (1)
Maximum DCD (ps) for
DDIO Column Output I/O
Standard
Input IO Standard (No PLL in the Clock Path)
TTL/CMOS
SSTL-2
SSTL/HSTL
HSTL12
1.8/1.5V
1.2V
Unit
3.3/2.5V
1.8/1.5V
2.5V
3.3-V LVTTL
260
380
145
145
145
ps
3.3-V LVCMOS
210
330
100
100
100
ps
2.5 V
195
315
85
85
85
ps
1.8 V
150
265
85
85
85
ps
1.5-V LVCMOS
255
370
140
140
140
ps
SSTL-2 Class I
175
295
65
65
65
ps
SSTL-2 Class II
170
290
60
60
60
ps
SSTL-18 Class I
155
275
55
50
50
ps
Table 4–102. Maximum DCD for DDIO Output on Column I/O Pins Without PLL in the Clock Path for -3
Devices (Part 2 of 2)
Note (1)
Maximum DCD (ps) for
DDIO Column Output I/O
Standard
Input IO Standard (No PLL in the Clock Path)
TTL/CMOS
SSTL-2
SSTL/HSTL
HSTL12
Unit
3.3/2.5V
1.8/1.5V
2.5V
1.8/1.5V
1.2V
SSTL-18 Class II
140
260
70
70
70
ps
1.8-V HSTL Class I
150
270
60
60
60
ps
1.8-V HSTL Class II
150
270
60
60
60
ps
1.5-V HSTL Class I
150
270
55
55
55
ps
1.5-V HSTL Class II
125
240
85
85
85
ps
1.2-V HSTL
240
360
155
155
155
ps
LVPECL
180
180
180
180
180
ps
(1)
Table 4–102 assumes the input clock has zero DCD.
Table 4–103. Maximum DCD for DDIO Output on Column I/O Pins Without PLL in the Clock Path for -4 and
-5 Devices
Note (1)
Maximum DCD (ps) for
DDIO Column Output I/O
Standard
Input IO Standard (No PLL in the Clock Path)
TTL/CMOS
SSTL-2
SSTL/HSTL
Unit
3.3/2.5V
1.8/1.5V
2.5V
1.8/1.5V
3.3-V LVTTL
440
495
170
160
ps
3.3-V LVCMOS
390
450
120
110
ps
2.5 V
375
430
105
95
ps
1.8 V
325
385
90
100
ps
1.5-V LVCMOS
430
490
160
155
ps
SSTL-2 Class I
355
410
85
75
ps
SSTL-2 Class II
350
405
80
70
ps
SSTL-18 Class I
335
390
65
65
ps
SSTL-18 Class II
320
375
70
80
ps
1.8-V HSTL Class I
330
385
60
70
ps
1.8-V HSTL Class II
330
385
60
70
ps
1.5-V HSTL Class I
330
390
60
70
ps
1.5-V HSTL Class II
330
360
90
100
ps
LVPECL
180
180
180
180
ps
(1)
Table 4–103 assumes the input clock has zero DCD.
Table 4–104. Maximum DCD for DDIO Output on Row I/O Pins With PLL in the
Clock Path
Maximum DCD (ps) for
Row DDIO Output I/O
Standard
3.3-V LVTTL
Stratix II GX Devices (PLL Output Feeding
DDIO)
-3 Device
-4 and -5 Device
110
105
Unit
ps
3.3-V LVCMOS
65
75
ps
2.5V
75
90
ps
1.8V
85
100
ps
1.5-V LVCMOS
105
100
ps
SSTL-2 Class I
65
75
ps
SSTL-2 Class II
60
70
ps
SSTL-18 Class I
50
65
ps
1.8-V HSTL Class I
50
70
ps
1.5-V HSTL Class I
55
70
ps
LVDS
180
180
ps
Table 4–105. Maximum DCD for DDIO Output on Column I/O Pins With PLL in
the Clock Path (Part 1 of 2)
Maximum DCD (ps) for
Column DDIO Output I/O
Standard
Stratix II GX Devices (PLL Output Feeding
DDIO)
Unit
-3 Device
-4 and -5 Device
3.3-V LVTTL
145
160
ps
3.3-V LVCMOS
100
110
ps
2.5V
85
95
ps
1.8V
85
100
ps
1.5-V LVCMOS
140
155
ps
SSTL-2 Class I
65
75
ps
SSTL-2 Class II
60
70
ps
SSTL-18 Class I
50
65
ps
SSTL-18 Class II
70
80
ps
1.8-V HSTL Class I
60
70
ps
1.8-V HSTL Class II
60
70
ps
1.5-V HSTL Class I
55
70
ps
1.5-V HSTL Class II
85
100
ps
Table 4–105. Maximum DCD for DDIO Output on Column I/O Pins With PLL in
the Clock Path (Part 2 of 2)
Maximum DCD (ps) for
Column DDIO Output I/O
Standard
High-Speed I/O
Specifications
Stratix II GX Devices (PLL Output Feeding
DDIO)
Unit
-3 Device
-4 and -5 Device
1.2-V HSTL
155
155
ps
LVPECL
180
180
ps
Table 4–106 provides high-speed timing specifications definitions.
Table 4–106. High-Speed Timing Specifications and Definitions
High-Speed Timing Specifications
Definitions
tC
High-speed receiver/transmitter input and output clock period.
fH S C L K
High-speed receiver/transmitter input and output clock frequency.
J
Deserialization factor (width of parallel data bus).
W
PLL multiplication factor.
tR I S E
Low-to-high transmission time.
tF A L L
High-to-low transmission time.
Timing unit interval (TUI)
The timing budget allowed for skew, propagation delays, and data
sampling window. (TUI = 1/(Receiver Input Clock Frequency ×
Multiplication Factor) = tC /w).
fIN
Fast PLL input clock frequency
fH S D R
Maximum/minimum LVDS data transfer rate (fH S D R = 1/TUI), non-DPA.
fH S D R D P A
Maximum/minimum LVDS data transfer rate (fH S D R D PA = 1/TUI), DPA.
Channel-to-channel skew (TCCS)
The timing difference between the fastest and the slowest output edges
including tCO variation and clock skew across channels driven by the
same fast PLL. The clock is included in the TCCS measurement.
Sampling window (SW)
The period of time during which the data must be valid in order to capture
it correctly. The setup and hold times determine the ideal strobe position
within the sampling window.
Input jitter
Peak-to-peak input jitter on high-speed PLLs.
Output jitter
Peak-to-peak output jitter on high-speed PLLs.
tDUTY
Duty cycle on high-speed transmitter output clock.
tL O C K
Lock time for high-speed transmitter and receiver PLLs.
Table 4–107 shows the high-speed I/O timing specifications for -3 speed
grade Stratix II GX devices.
Table 4–107. High-Speed I/O Specifications for -3 Speed Grade
Notes (1), (2)
-3 Speed Grade
Symbol
Conditions
Unit
Min
fI N = f H S D R / W
fH S D R (data rate)
W = 2 to 32 (LVDS, HyperTransport technology)
(3)
Typ
Max
16
520
MHz
W = 1 (SERDES bypass, LVDS only)
16
500
MHz
W = 1 (SERDES used, LVDS only)
150
717
MHz
J = 4 to 10 (LVDS, HyperTransport technology)
150
1,040
Mbps
J = 2 (LVDS, HyperTransport technology)
(4)
760
Mbps
J = 1 (LVDS only)
fH S D R D PA (DPA data rate) J = 4 to 10 (LVDS, HyperTransport technology)
(4)
500
Mbps
150
1,040
Mbps
200
ps
TCCS
All differential standards
-
SW
All differential standards
330
Output jitter
-
ps
190
ps
Output tR I S E
All differential I/O standards
160
ps
Output tFA L L
All differential I/O standards
180
ps
55
%
tDUTY
45
DPA run length
DPA jitter tolerance (5)
6,400
Data channel peak-to-peak jitter
0.44
DPA lock time
Parallel Rapid I/O
Miscellaneous
0000000000
1111111111
10%
256
00001111
25%
256
10010000
50%
256
10101010
100%
256
01010101
(4)
(5)
UI
UI
Number of
repetitions
SPI-4
(1)
(2)
(3)
50
256
When J = 4 to 10, the SERDES block is used.
When J = 1 or 2, the SERDES block is bypassed.
The input clock frequency and the W factor must satisfy the following fast PLL VCO specification: 150 ≤input clock
frequency × W ≤1,040.
The minimum specification is dependent on the clock source (fast PLL, enhanced PLL, clock pin, and so on) and
the clock routing resource (global, regional, or local) utilized. The I/O differential buffer and input register do not
have a minimum toggle rate.
For setup details, refer to the characterization report.
Table 4–108 shows the high-speed I/O timing specifications for -4 speed
grade Stratix II GX devices.
Table 4–108. High-Speed I/O Specifications for -4 Speed Grade
Notes (1), (2)
-4 Speed Grade
Symbol
Conditions
Unit
Min
fI N = f H S D R / W
fH S D R (data rate)
W = 2 to 32 (LVDS, HyperTransport technology)
(3)
Typ
Max
16
520
MHz
W = 1 (SERDES bypass, LVDS only)
16
500
MHz
W = 1 (SERDES used, LVDS only)
150
717
MHz
J = 4 to 10 (LVDS, HyperTransport technology)
150
1,040
Mbps
J = 2 (LVDS, HyperTransport technology)
(4)
760
Mbps
J = 1 (LVDS only)
fH S D R D PA (DPA data rate) J = 4 to 10 (LVDS, HyperTransport technology)
(4)
500
Mbps
150
1,040
Mbps
200
ps
TCCS
All differential standards
-
SW
All differential standards
330
Output jitter
-
ps
190
ps
Output tR I S E
All differential I/O standards
160
ps
Output tFA L L
All differential I/O standards
180
ps
55
%
6,400
UI
tDUTY
45
DPA run length
DPA jitter tolerance
Data channel peak-to-peak jitter
0.44
DPA lock time
SPI-4
0000000000
1111111111
10%
256
Parallel Rapid I/O
00001111
25%
256
10010000
50%
256
10101010
100%
256
01010101
(4)
UI
Number of
repetitions
Miscellaneous
(1)
(2)
(3)
50
256
When J = 4 to 10, the SERDES block is used.
When J = 1 or 2, the SERDES block is bypassed.
The input clock frequency and the W factor must satisfy the following fast PLL VCO specification: 150 ≤input clock
frequency × W ≤1,040.
The minimum specification is dependent on the clock source (fast PLL, enhanced PLL, clock pin, and so on) and
the clock routing resource (global, regional, or local) utilized. The I/O differential buffer and input register do not
have a minimum toggle rate.
Table 4–109 shows the high-speed I/O timing specifications for -5 speed
grade Stratix II GX devices.
Table 4–109. High-Speed I/O Specifications for -5 Speed Grade
Notes (1), (2)
-5 Speed Grade
Symbol
Conditions
Unit
Min
fI N = f H S D R / W
fH S D R (data rate)
W = 2 to 32 (LVDS, HyperTransport technology)
(3)
Typ
Max
16
420
MHz
W = 1 (SERDES bypass, LVDS only)
16
500
MHz
W = 1 (SERDES used, LVDS only)
150
640
MHz
J = 4 to 10 (LVDS, HyperTransport technology)
150
840
Mbps
J = 2 (LVDS, HyperTransport technology)
(4)
700
Mbps
J = 1 (LVDS only)
fH S D R D PA (DPA data rate) J = 4 to 10 (LVDS, HyperTransport technology)
(4)
500
Mbps
150
840
Mbps
200
ps
TCCS
All differential I/O standards
-
SW
All differential I/O standards
440
Output jitter
-
ps
190
ps
Output tR I S E
All differential I/O standards
290
ps
Output tFA L L
All differential I/O standards
290
ps
55
%
6,400
UI
tDUTY
45
DPA run length
DPA jitter tolerance
Data channel peak-to-peak jitter
0.44
DPA lock time
Parallel Rapid I/O
Miscellaneous
0000000000
1111111111
10%
256
00001111
25%
256
10010000
50%
256
10101010
100%
256
01010101
(4)
UI
Number of
repetitions
SPI-4
(1)
(2)
(3)
50
256
When J = 4 to 10, the SERDES block is used.
When J = 1 or 2, the SERDES block is bypassed.
The input clock frequency and the W factor must satisfy the following fast PLL VCO specification: 150 ≤input clock
frequency × W ≤840.
The minimum specification is dependent on the clock source (fast PLL, enhanced PLL, clock pin, and so on) and
the clock routing resource (global, regional, or local) utilized. The I/O differential buffer and input register do not
have a minimum toggle rate.
PLL Timing
Specifications
Tables 4–110 and 4–111 describe the Stratix II GX PLL specifications when
operating in both the commercial junction temperature range (0 to 85 C)
and the industrial junction temperature range (–40 to 100 C), except for
the clock switchover and phase-shift stepping features. These two
features are only supported from the 0 to 100 C junction temperature
range.
Table 4–110. Enhanced PLL Specifications (Part 1 of 2)
Name
Description
Min
Typ
Max
Unit
fIN
Input clock frequency
4
500
MHz
fINPFD
Input frequency to the PFD
4
420
MHz
fINDUTY
Input clock duty cycle
40
60
%
fENDUTY
External feedback input clock duty
cycle
40
60
%
tINJITTER
Input or external feedback clock input
jitter tolerance in terms of period jitter.
Bandwidth ≤0.85 MHz
0.5
ns (peakto-peak)
Input or external feedback clock input
jitter tolerance in terms of period jitter.
Bandwidth > 0.85 MHz
1.0
ns (peakto-peak)
tOUTJITTER
Dedicated clock output period jitter
tFCOMP
External feedback compensation time
fOUT
Output frequency for internal global or
regional clock
fOUTDUTY
Duty cycle for external clock output
fSCANCLK
Scanclk frequency
tCONFIGEPLL
Time required to reconfigure scan
chains for EPLLs
fOUT_EXT
PLL external clock output frequency
tLOCK
Time required for the PLL to lock from
the time it is enabled or the end of
device configuration
tDLOCK
Time required for the PLL to lock
dynamically after automatic clock
switchover between two identical clock
frequencies
fSWITCHOVER
Frequency range where the clock
switchover performs properly
1.5
fCLBW
PLL closed-loop bandwidth
0.13
1.5 (2)
45
50
250 ps for ≥
100 MHz outclk
25 mUI for <
100 MHz outclk
ps or mUI
(p-p)
10
ns
550
MHz
55
%
100
MHz
174/fSCANCLK
1.5 (2)
ns
(1)
MHz
1
ms
1
ms
1
500
MHz
1.2
16.9
MHz
0.03
Table 4–110. Enhanced PLL Specifications (Part 2 of 2)
Name
fVCO
Description
Min
Typ
Max
Unit
PLL VCO operating range for –3 and
–4 speed grade devices
300
1,040
MHz
PLL VCO operating range for –5 speed
grade devices
300
840
MHz
fSS
Spread-spectrum modulation
frequency
100
500
kHz
% spread
Percent down spread for a given clock
frequency
0.4
0.6
%
tP L L _ P S E R R
Accuracy of PLL phase shift
±30
ps
tARESET
Minimum pulse width on areset
signal.
10
ns
tARESET_RECONFIG
Minimum pulse width on the areset
signal when using PLL reconfiguration.
Reset the PLL after scandone goes
high.
500
ns
tRECONFIGWAIT
The time required for the wait after the
reconfiguration is done and the areset
is applied.
(1)
(2)
0.5
2
us
This is limited by the I/O fMAX. See Tables 4–91 through 4–95 for the maximum.
If the counter cascading feature of the PLL is utilized, there is no minimum output clock frequency.
Table 4–111. Fast PLL Specifications (Part 1 of 2)
Name
fIN
Description
Min
Typ
Max
Unit
Input clock frequency (for -3 and -4 speed
grade devices)
16
717
MHz
Input clock frequency (for -5 speed grade
devices)
16
640
MHz
fINPFD
Input frequency to the PFD
16
500
MHz
fINDUTY
Input clock duty cycle
40
60
%
tINJITTER
Input clock jitter tolerance in terms of period
jitter. Bandwidth ≤2 MHz
0.5
ns (p-p)
Input clock jitter tolerance in terms of period
jitter. Bandwidth > 0.2 MHz
1.0
ns (p-p)
Table 4–111. Fast PLL Specifications (Part 2 of 2)
Name
fVCO
fOUT
Description
Min
Upper VCO frequency range for –3 and –4
speed grades
Max
Unit
300
1,040
MHz
Upper VCO frequency range for –5 speed
grades
300
840
MHz
Lower VCO frequency range for –3 and –4
speed grades
150
520
MHz
Lower VCO frequency range for –5 speed
grades
150
420
MHz
4.6875
550
MHz
150
1,040
MHz
4.6875
(1)
MHz
PLL output frequency to GCLK or RCLK
PLL output frequency to LVDS or DPA clock
Typ
fOUT_EXT
PLL clock output frequency to regular I/O
tCONFIGPLL
Time required to reconfigure scan chains for
fast PLLs
fCLBW
PLL closed-loop bandwidth
tLOCK
Time required for the PLL to lock from the
time it is enabled or the end of the device
configuration
tPLL_PSERR
Accuracy of PLL phase shift
tARESET
Minimum pulse width on areset signal.
10
ns
tARESET_RECONFIG
Minimum pulse width on the areset signal
when using PLL reconfiguration. Reset the
PLL after scandone goes high.
500
ns
(1)
75/fSCANCLK
1.16
ns
5
28
MHz
0.03
1
ms
±30
ps
This is limited by the I/O fMAX. See Tables 4–91 through 4–95 for the maximum.
External
Memory
Interface
Specifications
Tables 4–112 through 4–116 contain Stratix II GX device specifications for
the dedicated circuitry used for interfacing with external memory
devices.
Table 4–112. DLL Frequency Range Specifications (Part 1 of 2)
Frequency Mode
Frequency Range (MHz)
Resolution
(Degrees)
0
100 to 175
30
1
2
150 to 230
22.5
200 to 350 (–3 speed grade)
30
200 to 310 (–4 and –5 speed grade)
30
Table 4–112. DLL Frequency Range Specifications (Part 2 of 2)
Frequency Range (MHz)
Resolution
(Degrees)
240 to 400 (–3 speed grade)
36
240 to 350 (–4 and –5 speed grade)
36
Frequency Mode
3
Table 4–113. DQS Jitter Specifications for DLL-Delayed Clock (tDQS_JITTER)
Note (1)
Number of DQS Delay Buffer Stages
(2)
Commercial (ps)
Industrial (ps)
1
80
110
2
110
130
3
130
180
4
160
210
(1)
(2)
Peak-to-peak period jitter on the phase-shifted DQS clock. For example, jitter on
two delay stages under commercial conditions is 200 ps peak-to-peak or 100 ps.
Delay stages used for requested DQS phase shift are reported in a project’s
Compilation Report in the Quartus II software.
Table 4–114. DQS Phase-Shift Error Specifications for DLL-Delayed Clock (tDQS_PSERR)
Number of DQS Delay Buffer Stages (1) –3 Speed Grade (ps) –4 Speed Grade (ps) –5 Speed Grade (ps)
(1)
1
25
30
35
2
50
60
70
3
75
90
105
4
100
120
140
Delay stages used for request DQS phase shift are reported in a project’s Compilation Report in the Quartus II
software. For example, phase-shift error on two delay stages under -3 conditions is 50 ps peak-to-peak or 25 ps.
Table 4–115. DQS Bus Clock Skew Adder Specifications
(tDQS_CLOCK_SKEW_ADDER)
(1)
Mode
DQS Clock Skew Adder (ps) (1)
4 DQ per DQS
40
9 DQ per DQS
70
18 DQ per DQS
75
36 DQ per DQS
95
This skew specification is the absolute maximum and minimum skew. For
example, skew on a 40 DQ group is 40 ps or 20 ps.
Table 4–116. DQS Phase Offset Delay Per Stage (ps)
Positive Offset
Notes (1), (2), (3)
Negative Offset
Speed Grade
(1)
(2)
(3)
JTAG Timing
Specifications
Min
Max
Min
Max
-3
10
15
8
11
-4
10
15
8
11
-5
10
16
8
12
The delay settings are linear.
The valid settings for phase offset are -32 to +31.
The typical value equals the average of the minimum and maximum values.
Figure 4–14 shows the timing requirements for the JTAG signals
Figure 4–14. Stratix II GX JTAG Waveforms.
TMS
TDI
t JCP
t JCH
t JCL
t JPSU
t JPH
TCK
tJPZX
t JPXZ
t JPCO
TDO
tJSSU
Signal
to be
Captured
Signal
to be
Driven
tJSZX
tJSH
tJSCO
tJSXZ
Table 4–117 shows the JTAG timing parameters and values for
Stratix II GX devices.
Table 4–117. Stratix II GX JTAG Timing Parameters and Values
Symbol
Parameter
Min Max Unit
tJCP
TCK clock period
30
ns
tJCH
TCK clock high time
12
ns
tJCL
TCK clock low time
12
ns
tJPSU
JTAG port setup time
4
ns
tJPH
JTAG port hold time
5
tJPCO
JTAG port clock to output
9
ns
tJPZX
JTAG port high impedance to valid output
9
ns
tJPXZ
JTAG port valid output to high impedance
9
ns
tJSSU
Capture register setup time
4
ns
tJSH
Capture register hold time
5
ns
tJSCO
Update register clock to output
tJSZX
Update register high impedance to valid output
12
ns
tJSXZ
Update register valid output to high impedance
12
ns
ns
12
ns
Referenced
Documents
This chapter references the following documents:
■
■
■
■
■
■
■
Operating Requirements for Altera Devices Data Sheet
PowerPlay Power Analyzer chapter in volume 3 of the Quartus II
Handbook.
PowerPlay Early Power Estimator (EPE) and Power Analyzer
Quartus II PowerPlay Analysis and Optimization Technology
Stratix II GX Architecture chapter in volume 1 of the Stratix II
GX Device Handbook
Stratix II GX Transceiver Architecture Overview chapter in volume 2 of
the Stratix II GX Device Handbook
Volume 2, Stratix II GX Device Handbook
Document
Revision History
Table 6–105 shows the revision history for this chapter.
Table 4–118. Document Revision History (Part 1 of 5)
Date and
Document
Version
June 2009
v4.6
October 2007
v4.5
Changes Made
Replaced Table 4–31
Updated:
● Table 4–5
● Table 4–6
● Table 4–7
● Table 4–8
● Table 4–9
● Table 4–10
● Table 4–11
● Table 4–12
● Table 4–13
● Table 4–14
● Table 4–15
● Table 4–16
● Table 4–17
● Table 4–18
● Table 4–20
● Table 4–50
● Table 4–95
● Table 4–105
● Table 4–110
● Table 4–111
Updated:
Table 4–3
● Table 4–6
● Table 4–16
● Table 4–19
● Table 4–20
● Table 4–21
● Table 4–22
● Table 4–55
● Table 4–106
● Table 4–107
● Table 4–108
● Table 4–109
● Table 4–112
●
Updated title only in Tables 4–88 and 4–89.
Minor text edits.
Summary of Changes
Table 4–118. Document Revision History (Part 2 of 5)
Date and
Document
Version
August 2007
v4.4
Changes Made
Removed note “The data in this table is preliminary.
Altera will provide a report upon completion of
characterization of the Stratix II GX devices.
Conditions for testing the silicon have not been
determined.” from each table.
Removed note “The data in Tables xxx through xxx
is preliminary. Altera will provide a report upon
completion of characterization of the Stratix II GX
devices. Conditions for testing the silicon have not
been determined.” in the clock timing parameters
sections.
Updated clock timing parameter Tables 4–63
through 4–78 (Table 4–75 was unchanged).
Updated Table 4–21 and added new Table 4–22.
Updated:
Table 4–6
● Table 4–16
● Table 4–19
● Table 4–49
● Table 4–52
● Table 4–107
●
Added note to Table 4–50.
Added:
● Figure 4–3
● Figure 4–4
● Figure 4–5
Added the “Referenced Documents” section.
May 2007 v4.3
Changed 1.875 KHz to 1.875 MHz in Table 4–19,
XAUI Receiver Jitter Tolerance section.
Summary of Changes
Table 4–118. Document Revision History (Part 3 of 5)
Date and
Document
Version
February 2007
v4.2
Changes Made
Added the “Document Revision History” section to
this chapter.
Updated Table 4–5:
Removed last three lines
● Removed note 1
● Added new note 4
●
Deleted table 6-6.
Replaced Table 4–6 with all new information.
Added Figures 4–1 and 4–2.
Added Tables 4–7 through 4–19.
Removed Figures 6-1 through 6-4.
Updated Table 4–22:
● Changed RCONF information.
Updated Table 4–52
● SSTL-18 Class I, column 1: changed 25 to 50.
Updated:
● Table 4–54
● Table 4–87
● Table 4–91
● Table 4–94
Updated Tables 4–62 through 4–77
Updated Tables 4–79 and 4–80
● Added “units” column
Updated Tables 4–83 through 4–86
● Changed column title to “Fast Corner
Industrial/Commercial”.
Updated Table 4–109.
● Added a new line to the bottom of the table.
August 2006
v4.1
Update Table 6–75, Table 6–84, and Table 6–90.
Summary of Changes
Added support information for the
Stratix II GX device.
Table 4–118. Document Revision History (Part 4 of 5)
Date and
Document
Version
June 2006, v4.0
Changes Made
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
●
Updated Table 6–5.
Updated Table 6–6.
Updated all values in Table 6–7.
Added Tables 6–8 and 6–9.
Added Figures 6–1 through 6–4.
Updated Table 6–18.
Updated Tables 6–85 through 6–96.
Added Table 6–80, Stratix II GX Maximum
Output Clock Rate for Dedicated Clock Pins.
Updated Table 6–100.
In “I/O Timing Measurement Methodology”
section, updated Table 6–42.
In “Internal Timing Parameters” section,
updated Tables 6–43 through 6–48.
In “Stratix II GX Clock Timing Parameters”
section, updated Tables 6–50 through 6–65.
In “IOE Programmable Delay” section, updated
Tables 6–67 and 6–68.
In “I/O Delays” section, updated Tables 6–71
through 6–74.
In “Maximum Input & Output Clock Toggle Rate”
section, updated Tables 6–75 through 6–83.
In “DCD Measurement Techniques” section,
updated Tables 6–85 through 6–92.
In “High-Speed I/O Specifications” section,
updated Tables 6–94 through 6–96.
In “External Memory Interface Specifications”
section, updated Table 6–100.
Summary of Changes
●
●
●
●
Removed rows for VI D , VO D, VI C M ,
and VO C M from Table 6–5.
Updated values for rx, tx, and
refclkb in Table 6–6.
Removed table containing 1.2-V
PCML I/O information. That
information is in Table 6–7.
Added values to Table 6–100.
Table 4–118. Document Revision History (Part 5 of 5)
Date and
Document
Version
April 2006, v3.0
Changes Made
●
●
●
●
●
●
●
●
●
February 2006,
v2.1
●
●
Updated Table 6–3.
Updated Table 6–5.
Updated Table 6–7.
Added Table 6–42.
Updated “Internal Timing Parameters” section
(Tables 6–43 through 6–48).
Updated “Stratix II GX Clock Timing
Parameters” section (Tables 6–49 through
6–65).
Updated “IOE Programmable Delay” section
(Tables 6–67 and 6–68)
Updated “I/O Delays” section (Tables 6–71
through 6–74.
Updated “Maximum Input & Output Clock Toggle
Rate” section. Replaced tables 6-73 and 6-74
with Tables 6–75 through 6–83. Input and output
clock rates for row, column, and dedicated clock
pins are now in separate tables.
Updated Tables 6–4 and 6–5.
Updated Tables 6–49 through 6–65 (removed
column designations for industrial/commercial
and removed industrial numbers).
December 2005, Updated timing numbers.
v2.0
October 2005
v1.1
●
●
●
●
October 2005
v1.0
Updated Table 6–7.
Updated Table 6–38.
Updated 3.3-V PCML information and notes to
Tables 6–73 through 6–76.
Minor textual changes throughout the
document.
Added chapter to the Stratix II GX Device
Handbook.
Summary of Changes
5. Reference and Ordering
Information
SIIGX51007-1.3
Software
Stratix ® II GX devices are supported by the Altera® Quartus® II design
software, which provides a comprehensive environment for
system-on-a-programmable-chip (SOPC) design. The Quartus II software
includes HDL and schematic design entry, compilation and logic
synthesis, full simulation and advanced timing analysis, SignalTap® II
logic analyzer, and device configuration.
f
Refer to the Quartus II Development Software Handbook for more
information on the Quartus II software features.
The Quartus II software supports the Windows XP/2000/NT, Sun
Solaris 8/9, Linux Red Hat v7.3, Linux Red Hat Enterprise 3, and HP-UX
operating systems. It also supports seamless integration with
industry-leading EDA tools through the NativeLink interface.
Device Pin-Outs
Stratix II GX device pin-outs (Pin-Out Files for Altera Devices) are available
on the Altera web site at www.altera.com.
Ordering
Information
Figure 5–1 describes the ordering codes for Stratix II GX devices.
f
For more information on a specific package, refer to the Package
Information for Stratix II & Stratix II GX Devices chapter in volume 2 of the
Stratix II GX Device Handbook.
Referenced Documents
Figure 5–1. Stratix II GX Device Packaging Ordering Information
EP2SGX
130
G
F
40
C
3
Family Signature
Optional Suffix
EP2SGX: Stratix II GX
Indicates specific device options or
shipment method.
Engineering sample
ES:
Lead free
N:
NES: Lead-free engineering sample
Device Type
30
60
90
130
Speed Grade
3, 4, or 5, with 3 being the fastest
Number of
Transceiver
Channels
Operating Temperature
C: Commercial temperature (tJ = 0˚ C to 85˚ C)
I: Industrial temperature (tJ = −40˚ C to 100˚ C)
C: 4
D: 8
E: 12
F: 16
G: 20
Pin Count
Package Type
F: FineLine BGA
(1)
ES
780
1,152 (1)
1,508
Product code notations for ES silicon for all EP2SGX130 family members (standard and lead free) and EP2SGX90
(lead free) use the following codings to denote pin count: 35 for 1152-pin devices and 40 for 1508-pin devices
Referenced
Documents
This chapter references the following documents:
■
■
■
Document
Revision History
Package Information for Stratix II & Stratix II GX Devices chapter in
volume 2 of the Stratix II GX Device Handbook
Pin-Out Files for Altera Devices
Quartus II Development Software Handbook
Table 5–1 shows the revision history for this chapter.
Table 5–1. Document Revision History (Part 1 of 2)
Date and
Document
Version
August 2007
v1.3
Changes Made
Summary of Changes
Added the “Referenced Documents” section.
Minor text edits.
5–2
Stratix II GX Device Handbook, Volume 1
Altera Corporation
August 2007
Reference and Ordering Information
Table 5–1. Document Revision History (Part 2 of 2)
Date and
Document
Version
Changes Made
February 2007
v1.2
Added the “Document Revision History” section.
June 2006, v1.1
●
●
October 2005
v1.0
Summary of Changes
Added support information for the
Stratix II GX device.
Updated “Device Pin-Outs” section.
Updated Figure 7–1.
Added chapter to the Stratix II GX Device
Handbook.
Altera Corporation
August 2007
5–3
Stratix II GX Device Handbook, Volume 1
Document Revision History
5–4
Stratix II GX Device Handbook, Volume 1
Altera Corporation
August 2007
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