MAX1775

MAX1775
MAX1775
RELIABILITY REPORT
FOR
MAX1775EEE+
PLASTIC ENCAPSULATED DEVICES
December 8, 2009
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Approved by
Ken Wendel
Quality Assurance
Director, Reliability Engineering
Maxim Integrated Products. All rights reserved.
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MAX1775
Conclusion
The MAX1775EEE+ successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim"s
continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim"s quality and reliability standards.
Table of Contents
I. ........Device Description
V. ........Quality Assurance Information
II. ........Manufacturing Information
VI. .......Reliability Evaluation
III. .......Packaging Information
IV. .......Die Information
.....Attachments
I. Device Description
A. General
The MAX1775 is a dual, step-down DC-DC converter that generates both the main (+3.3V at over 2A) and core (+1.8V at up to 1.5A) supplies for a
complete power solution for PDAs, subnotebooks, and other hand-held devices. The main output is adjustable from +1.25V to +5.5V. The core output
is adjustable from 1V to 5V. Both switching converters operate at up to 1.25MHz for small external components and use synchronous rectifiers to
achieve efficiencies up to 95%. Operation with up to 100% duty cycle provides the lowest possible dropout voltage to extend useful battery life. The
MAX1775 accepts inputs from +2.7V up to +28V, allowing use with many popular battery configurations as well as AC-DC wall adapters. Digital
soft-start reduces battery current surges at power-up. Both the main and core converters have separate shutdown inputs. The MAX1775 comes in a
small 16-pin QSOP package. The MAX1775 evaluation kit is available to help reduce design time.
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MAX1775
II. Manufacturing Information
A. Description/Function:
Dual-Output Step-Down DC-DC Converter for PDA/Palmtop Computers
B. Process:
B8
C. Number of Device Transistors:
D. Fabrication Location:
California or Texas
E. Assembly Location:
Malaysia, Philippines, Thailand
F. Date of Initial Production:
October 21, 2000
III. Packaging Information
A. Package Type:
16-pin QSOP
B. Lead Frame:
Copper
C. Lead Finish:
100% matte Tin
D. Die Attach:
Conductive
E. Bondwire:
Au (1.3 mil dia.)
F. Mold Material:
Epoxy with silica filler
G. Assembly Diagram:
#05-2301-0025
H. Flammability Rating:
Class UL94-V0
I. Classification of Moisture Sensitivity per
JEDEC standard J-STD-020-C
Level 1
J. Single Layer Theta Ja:
120°C/W
K. Single Layer Theta Jc:
37°C/W
L. Multi Layer Theta Ja:
105°C/W
M. Multi Layer Theta Jc:
37°C/W
IV. Die Information
A. Dimensions:
86 X 134 mils
B. Passivation:
Si3N4/SiO2 (Silicon nitride/ Silicon dioxide)
C. Interconnect:
Al/0.5%Cu with Ti/TiN Barrier
D. Backside Metallization:
None
E. Minimum Metal Width:
0.8 microns (as drawn)
F. Minimum Metal Spacing:
0.8 microns (as drawn)
G. Bondpad Dimensions:
5 mil. Sq.
H. Isolation Dielectric:
SiO2
I. Die Separation Method:
Wafer Saw
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MAX1775
V. Quality Assurance Information
A. Quality Assurance Contacts:
Ken Wendel (Director, Reliability Engineering)
Bryan Preeshl (Managing Director of QA)
B. Outgoing Inspection Level:
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate:
< 50 ppm
D. Sampling Plan:
Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure Rate ( ) is calculated as follows:
=
1
MTTF
=
1.83
(Chi square value for MTTF upper limit)
192 x 4340 x 205 x 2
(where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV)
-9
= 5.24 x 10
= 5.24 F.I.T. (60% confidence level @ 25°C)
The following failure rate represents data collected from Maxim"s reliability monitor program. Maxim performs quarterly life test
monitors on its processes. This data is published in the Reliability Report found at http://www.maxim-ic.com/qa/reliability/monitor.
Cumulative monitor data for the B8 Process results in a FIT Rate of 0.06 @ 25C and 0.99 @ 55C (0.8 eV, 60% UCL)
B. Moisture Resistance Tests
The industry standard 85°C/85%RH or HAST testing is monitored per device process once a quarter.
C. E.S.D. and Latch-Up Testing
The PY08 die type has been found to have all pins able to withstand a HBM transient pulse of +/-1500 V per Mil-Std 883
Method 3015.7. Latch-Up testing has shown that this device withstands a current of +/-250 mA.
Maxim Integrated Products. All rights reserved.
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MAX1775
Table 1
Reliability Evaluation Test Results
MAX1775EEE+
TEST ITEM
TEST CONDITION
Static Life Test (Note 1)
Ta = 135°C
Biased
Time = 192 hrs.
Moisture Testing (Note 2)
HAST
Ta = 130°C
RH = 85%
Biased
Time = 96hrs.
Mechanical Stress (Note 2)
Temperature
-65°C/150°C
Cycle
1000 Cycles
Method 1010
FAILURE
IDENTIFICATION
SAMPLE SIZE
NUMBER OF
FAILURES
DC Parameters
& functionality
205
0
DC Parameters
& functionality
77
0
DC Parameters
& functionality
77
0
Note 1: Life Test Data may represent plastic DIP qualification lots.
Note 2: Generic Package/Process data
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