MAX1472

MAX1472
MAX1472
RELIABILITY REPORT
FOR
MAX1472AKA+
PLASTIC ENCAPSULATED DEVICES
October 1, 2009
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Approved by
Ken Wendel
Quality Assurance
Director, Reliability Engineering
Maxim Integrated Products. All rights reserved.
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MAX1472
Conclusion
The MAX1472AKA+ successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim"s
continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim"s quality and reliability standards.
Table of Contents
I. ........Device Description
V. ........Quality Assurance Information
II. ........Manufacturing Information
VI. .......Reliability Evaluation
III. .......Packaging Information
IV. .......Die Information
.....Attachments
I. Device Description
A. General
The MAX1472 is a crystal-referenced phase-locked loop (PLL) VHF/UHF transmitter designed to transmit OOK/ASK data in the 300MHz to 450MHz
frequency range. The MAX1472 supports data rates up to 100kbps, and adjustable output power to more than +10dBm into a 50 load. The
crystal-based architecture of the MAX1472 eliminates many of the common problems with SAW transmitters by providing greater modulation depth,
faster frequency settling, higher tolerance of the transmit frequency, and reduced temperature dependence. Combined, these improvements enable
better overall receiver performance when using a superheterodyne receiver such as the MAX1470 or MAX1473. The MAX1472 is available in a 3mm
x 3mm 8-pin SOT23 package and is specified for the automotive (-40°C to +125°C) temperature range. An evaluation kit is available. Contact Maxim
Integrated Products for more information.
Maxim Integrated Products. All rights reserved.
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MAX1472
II. Manufacturing Information
A. Description/Function:
300MHz-to-450MHz Low-Power, Crystal-Based ASK Transmitter
B. Process:
TS35
C. Number of Device Transistors:
D. Fabrication Location:
Taiwan
E. Assembly Location:
Malaysia
F. Date of Initial Production:
April 22, 2003
III. Packaging Information
A. Package Type:
8-pin SOT23
B. Lead Frame:
Copper Alloy
C. Lead Finish:
100% matte Tin
D. Die Attach:
Non-conductive Epoxy
E. Bondwire:
Gold (1 mil dia.)
F. Mold Material:
Epoxy with silica filler
G. Assembly Diagram:
#05-9000-1715
H. Flammability Rating:
Class UL94-V0
I. Classification of Moisture Sensitivity per
JEDEC standard J-STD-020-C
Level 1
J. Single Layer Theta Jb:
112*°C/W
K. Single Layer Theta Jc:
80°C/W
IV. Die Information
A. Dimensions:
52 X 32 mils
B. Passivation:
Si3N4/SiO2 (Silicon nitride/ Silicon dioxide)
C. Interconnect:
Al/0.5%Cu with Ti/TiN Barrier
D. Backside Metallization:
None
E. Minimum Metal Width:
0.35µm
F. Minimum Metal Spacing:
0.35µm
G. Bondpad Dimensions:
5 mil. Sq.
H. Isolation Dielectric:
SiO2
I. Die Separation Method:
Wafer Saw
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MAX1472
V. Quality Assurance Information
A. Quality Assurance Contacts:
Ken Wendel (Director, Reliability Engineering)
Bryan Preeshl (Managing Director of QA)
B. Outgoing Inspection Level:
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate:
< 50 ppm
D. Sampling Plan:
Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure Rate ( ) is calculated as follows:
=
1
MTTF
=
1.83
(Chi square value for MTTF upper limit)
192 x 4340 x 47 x 2
(where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV)
-9
= 22.8 x 10
= 22.8 F.I.T. (60% confidence level @ 25°C)
The following failure rate represents data collected from Maxim"s reliability monitor program. Maxim performs quarterly life test
monitors on its processes. This data is published in the Reliability Report found at http://www.maxim-ic.com/qa/reliability/monitor.
Cumulative monitor data for the TS35 Process results in a FIT Rate of 0.11 @ 25C and 1.93 @ 55C (0.8 eV, 60% UCL)
B. Moisture Resistance Tests
The industry standard 85°C/85%RH or HAST testing is monitored per device process once a quarter.
C. E.S.D. and Latch-Up Testing
The SC72 die type has been found to have all pins able to withstand a HBM transient pulse of +/-2500 V per JEDEC
JESD22-A114. Latch-Up testing has shown that this device withstands a current of +/-250 mA.
Maxim Integrated Products. All rights reserved.
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MAX1472
Table 1
Reliability Evaluation Test Results
MAX1472AKA+
TEST ITEM
TEST CONDITION
Static Life Test (Note 1)
Ta = 135°C
Biased
Time = 192 hrs.
Moisture Testing (Note 2)
HAST
Ta = 130°C
RH = 85%
Biased
Time = 96hrs.
Mechanical Stress (Note 2)
Temperature
-65°C/150°C
Cycle
1000 Cycles
Method 1010
FAILURE
IDENTIFICATION
SAMPLE SIZE
NUMBER OF
FAILURES
DC Parameters
& functionality
47
0
DC Parameters
& functionality
77
0
DC Parameters
& functionality
77
0
Note 1: Life Test Data may represent plastic DIP qualification lots.
Note 2: Generic Package/Process data
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