LM26 SOT-23, ±3°C Accurate, Factory-Preset Thermostat 1 Features 3 Description
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LM26
SNIS115S – MAY 2001 – REVISED SEPTEMBER 2015
LM26 SOT-23, ±3°C Accurate, Factory-Preset Thermostat
1 Features
1
• Internal Comparator With Pin Programmable 2°C or 10°C Hysteresis
• No External Components Required
• Open-Drain or Push-Pull Digital Output; Supports
CMOS Logic Levels
• Internal Temperature Sensor With V
TEMP
Pin
Output
• V
TEMP
Output Allows After-Assembly System
Testing
• Internal Voltage Reference and DAC for Trip-Point
Setting
• Currently Available in 5-pin SOT-23 Plastic
Package
• Excellent Power Supply Noise Rejection
• UL Recognized Component
• Key Specifications
– Power Supply Voltage 2.7 V to 5.5 V
– Power Supply Current
40 μA (Maximum) 16 μA (Typical)
– Hysteresis Temperature 2°C or 10°C (Typical)
2 Applications
• Microprocessor Thermal Management
• Appliances
• Portable Battery Powered Systems
• Fan Control
• Industrial Process Control
• HVAC Systems
• Remote Temperature Sensing
• Electronic System Protection
3 Description
The LM26 is a precision, single digital-output, lowpower thermostat comprised of an internal reference,
DAC, temperature sensor and comparator. Utilizing factory programming, it can be manufactured with different trip points as well as different digital output functionality. The trip point (T
OS
) can be preset at the factory to any temperature in the range of −55°C to
110°C in 1°C increments. The LM26 has one digital output (OS/OS/US/US), one digital input (HYST) and one analog output (V
TEMP
). The digital output stage can be preset as either open-drain or push-pull. In addition, it can be factory programmed to be active
HIGH or LOW. The digital output can be factory programmed to indicate an over temperature shutdown event (OS or OS) or an under temperature shutdown event (US or US). When preset as an overtemperature shutdown (OS) it will go LOW to indicate that the die temperature is over the internally preset T
OS below (T
OS and go HIGH when the temperature goes
–T
HYST
). Similarly, when preprogrammed as an undertemperature shutdown (US) it will go
HIGH to indicate that the temperature is below T
US and go LOW when the temperature is above
(T
US
+T
HYST
). The typical hysteresis, T
HYST
, can be set to 2°C or 10°C and is controlled by the state of the
HYST pin. A V
TEMP analog output provides a voltage that is proportional to temperature and has a −10.82
mV/°C output slope.
Available parts are detailed in the
Table . For other part options, contact a Texas
Instruments Distributor or Sales Representative for information on minimum order qualification. The
LM26 is currently available in a 5-lead SOT-23 package.
PART NUMBER PACKAGE BODY SIZE (NOM)
LM26 SOT-23 (5) 2.90 mm × 1.60 mm
(1) For all available packages, see the orderable addendum at the end of the datasheet.
LM26CIM5-TPA Simplified Block Diagram and Connection Diagram
HYST OS
T
OS
T
OS
- T
HYST
GND
V
TEMP
REF
TEMP
SENSOR
+
-
HYST
LM26TPA
V+ = 2.7V to 5.5V
OS
Temp. of
Leads
HYST=GND for 10°C Hysteresis
HYST = V+ for 2°C Hysteresis
V
TEMP
= (-3.479 x 10
-6 x (T-30)
2
) + (-1.082 x 10
-2 x (T-30)) + 1.8015V
The LM26CIM5-TPA has a fixed trip point of 85°C. For other trip point and output function availability, please see the
or contact Texas Instruments.
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM26
SNIS115S – MAY 2001 – REVISED SEPTEMBER 2015 www.ti.com
1 Features ..................................................................
2 Applications ...........................................................
3 Description .............................................................
4 Revision History.....................................................
5 Device Comparison Table.....................................
6 Pin Configuration and Functions .........................
7 Specifications.........................................................
7.1
Absolute Maximum Ratings ......................................
7.2
ESD Ratings..............................................................
7.3
Recommended Operating Conditions .......................
7.4
Thermal Information ..................................................
7.5
Electrical Characteristics ..........................................
7.6
Typical Characteristics ..............................................
8 Detailed Description ..............................................
8.1
Overview ...................................................................
8.2
Functional Block Diagrams .......................................
8.3
Feature Description...................................................
Table of Contents
8.4
Device Functional Modes..........................................
9 Application and Implementation ........................
9.1
Application Information............................................
9.2
Typical Application ..................................................
9.3
System Examples ...................................................
10 Power Supply Recommendations .....................
11 Layout...................................................................
11.1
Layout Guidelines .................................................
11.2
Layout Example ....................................................
11.3
Thermal Considerations ........................................
11.4
Part Number Template..........................................
12 Device and Documentation Support .................
12.1
Community Resources..........................................
12.2
Trademarks ...........................................................
12.3
Electrostatic Discharge Caution ............................
12.4
Glossary ................................................................
13 Mechanical, Packaging, and Orderable
Information ...........................................................
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision R (February 2013) to Revision S Page
• Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device
Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section ...................................................................................................................................................................................
• Removed Part Number Template table .................................................................................................................................
• Removed Temperature Trip Point Accuracy table ................................................................................................................
Changes from Revision Q (September 2011) to Revision R Page
• Changed layout of National Data Sheet to TI format ...........................................................................................................
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5 Device Comparison Table
Order Number
Bulk Rail (1000 Units)
LM26CIM5-BPB
LM26CIM5-DPB
LM26CIM5-HHD
LM26CIM5-NPA
LM26CIM5-RPA
LM26CIM5-SHA
LM26CIM5-SPA
LM26CIM5-TPA
LM26CIM5-VHA
LM26CIM5-VPA
LM26CIM5-XHA
LM26CIM5-XPA
LM26CIM5-YHA
LM26CIM5-YPA
LM26CIM5-ZHA
LM26
SNIS115S – MAY 2001 – REVISED SEPTEMBER 2015
Tape & Reel (3000 Units)
LM26CIM5X-BPB
LM26CIM5X-DPB
LM26CIM5X-HHD
LM26CIM5X-NPA
LM26CIM5X-RPA
LM26CIM5X-SHA
LM26CIM5X-SPA
LM26CIM5X-TPA
LM26CIM5X-VHA
LM26CIM5X-VPA
LM26CIM5X-XHA
LM26CIM5X-XPA
LM26CIM5X-YHA
LM26CIM5X-YPA
LM26CIM5X-ZHA
Top Mark Trip Point Output Function
Setting
TBPB
TDPB
THHD
TNPA
TRPA
TSHA
TSPA
TTPA
TVHA
TVPA
TXHA
TXPA
TYHA
TYPA
TZHA
-45°C
-25°C
0°C
45°C
65°C
75°C
70°C
85°C
90°C
95°C
100°C
105°C
110°C
115°C
120°C
Active-Low, Open-Drain, US output
Active-Low, Open-Drain, US output
Active-High, Push-Pull, US output
Active-Low, Open-Drain, OS output
Active-Low, Open-Drain, OS output
Active-Low, Open-Drain, OS output
Active-Low, Open-Drain, OS output
Active-Low, Open-Drain, OS output
Active-Low, Open-Drain, OS output
Active-Low, Open-Drain, OS output
Active-Low, Open-Drain, OS output
Active-Low, Open-Drain, OS output
Active-Low, Open-Drain, OS output
Active-Low, Open-Drain, OS output
Active-Low, Open-Drain, OS output
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SNIS115S – MAY 2001 – REVISED SEPTEMBER 2015
6 Pin Configuration and Functions
DBV Package
5-Pin SOT-23
(Top View) www.ti.com
Pin Functions
PIN
NAME
HYST
V
TEMP
V
+
TYPE
Input
Power
DESCRIPTION
NO.
5
1
2
3
4
(1)
GND
OS
OS
US
US
Output
Power
Output
Output
Output
Output
Hysteresis control, digital input; connect to GND for 10°C or V+ for 2°C
Ground, connected to the back side of the die through lead frame; connect to system ground
Analog output voltage proportional to temperature; leave floating or connect to a high impedance node.
Supply input; connect to 2.7 V to 5.5 V with a 0.1μF bypass capacitor.
Overtemperature Shutdown open-drain active low thermostat digital output; connect to controller interrupt, system/power supply shutdown; pullup resistor ≥ 10 k Ω
Overtemperature Shutdown push-pull active high thermostat digital output; connect to controller interrupt, system/power supply shutdown
Undertemperature Shutdown open-drain active low thermostat digital output; connect to controller interrupt, system/power supply shutdown; pullup resistor ≥ 10 k Ω
Undertemperature Shutdown push-pull active high thermostat digital output; connect to controller interrupt, system/power supply shutdown
(1) Pin 5 functionality and trip point setting are programmed during LM26 manufacture.
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1)
Input Voltage
Input Current at any pin
(2)
Package Input Current
(2)
Package Dissipation at T
A
= 25°C
(3)
Soldering
Information
(4)
SOT-23 Package
Vapor Phase (60 seconds)
Infrared (15 seconds)
MIN MAX
6
5
20
500
215
220
150
UNIT
V mA mA mW
°C
Storage Temperature, T stg
−65 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
(2)
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
When the input voltage (V
I
) at any pin exceeds the power supply (V
I
< GND or V
I
> V
+
), the current at that pin should be limited to 5 mA.
The 20-mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 5 mA to four. Under normal operating conditions the maximum current that pins 2, 4 or 5 can handle is limited to 5 mA each.
(3) The maximum power dissipation must be derated at elevated temperatures and is dictated by T
JMAX
θ
JA
(junction to ambient thermal resistance) and T
A
(maximum junction temperature),
(ambient temperature). The maximum allowable power dissipation at any temperature is P
D
= (T
JMAX
–T
A
) / θ
JA or the number given in the Absolute Maximum Ratings, whichever is lower. For this device, T
JMAX
= 150°C. For this device the typical thermal resistance ( θ
JA
) of the different package types when board mounted follow:
(4) See the URL http://www.ti.com/packaging for other recommendations and methods of soldering surface mount devices.
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LM26
SNIS115S – MAY 2001 – REVISED SEPTEMBER 2015
7.2 ESD Ratings
V
(ESD)
Electrostatic discharge
(1)
Human body model (HBM)
Machine Model
VALUE
±2500
±250
(1) The human body model is a 100-pF capacitor discharge through a 1.5-k Ω resistor into each pin. The machine model is a 200-pF capacitor discharged directly into each pin.
UNIT
V
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) (1)
Specified Temperature Range (T
MIN
≤ T
A
≤ T
MAX
)
Positive Supply Voltage (V
+
)
Maximum V
OUT
MIN
−55
2.7
MAX
125
5.5
5.5
UNIT
°C
V
V
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions.
7.4 Thermal Information
THERMAL METRIC
(1)
LM26
DBV (SOT-23)
5 PINS
250
UNIT
R
θJA
Junction-to-ambient thermal resistance °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953 .
7.5 Electrical Characteristics
The following specifications apply for V limits apply for T
A
= T
J
= T
MIN to T
MAX
+
= 2.7 V
DC to 5.5 V
DC
, and V unless otherwise specified.
TEMP load current = 0 µA unless otherwise specified. All
PARAMETER TEST CONDITIONS MIN
(1)
TYP
(2)
MAX
(1)
UNIT
TEMPERATURE SENSOR
Trip Point Accuracy (Includes V
REF
, DAC,
Comparator Offset, and Temperature
Sensitivity errors)
–55°C ≤ T
A
≤ +110°C
T
A
= +120°C
±3
±4
°C
°C
Trip Point Hysteresis
V
TEMP
Output Temperature Sensitivity
V
TEMP
Temperature Sensitivity Error to
Equation:
V
O
= ( −3.479 × 10
( −1.082 × 10
−2
−6
× (T
× (T − 30)
2
) +
− 30)) + 1.8015 V
HYST = GND
HYST = V
+
−30°C ≤ T
A
≤ 120°C
−55°C ≤ T
A
120°C,
≤
4.5 V ≤ V
+
≤ 5.5 V
T
A
= 30°C
11
2
−10.82
±3
±3
±2.5
°C
°C mV/°C
°C
°C
°C
I
S
V
TEMP
Load Regulation
V
TEMP
Line Regulation
Supply Current
Source ≤ 1 μA
Sink ≤ 40 μA
+2.7 V ≤ V
+
−30°C ≤ T
A
≤ +5.5 V,
≤ +120°C
T
A
= 25°C
0.070
−0.2
16
0.7
20
40 mV mV mV/V
µA
(1) Limits are guaranteed to TI's AOQL (Average Outgoing Quality Level).
(2) Typicals are at T
J
= T
A
= 25°C and represent most likely parametric norm.
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SNIS115S – MAY 2001 – REVISED SEPTEMBER 2015 www.ti.com
Electrical Characteristics (continued)
The following specifications apply for V limits apply for T
A
= T
J
= T
MIN to T
MAX
+ = 2.7 V
DC to 5.5 V
DC
, and V unless otherwise specified.
TEMP load current = 0 µA unless otherwise specified. All
PARAMETER TEST CONDITIONS MIN
(1)
TYP
(2)
MAX
(1)
UNIT
I
DIGITAL OUTPUT AND INPUT
OUT(1)
Logical 1 Output Leakage Current
(3)
0.001
1 µA
V
OUT(0)
V
OUT(1)
V
IH
V
IL
Logical 0 Output Voltage
Logical 1 Push-Pull Output Voltage
HYST Input Logical 1 Threshold Voltage
HYST Input Logical 0 Threshold Voltage
T
A
= 25°C V
+
= +5.0 V
I
OUT
I
OUT
= +1.2 mA and V
+
= +3.2 mA and V
+
≥ 2.7 V;
≥ 4.5 V
(4)
I
SOURCE
= 500 µA, V
+
≥ 2.7 V
I
SOURCE
= 800 µA, V
+
≥ 4.5 V
0.8 × V
+
V
+
− 1.5
0.8 × V
+
0.4
0.2 × V
+
V
V
V
V
V
(3) The 1-µA limit is based on a testing limitation and does not reflect the actual performance of the part. Expect to see a doubling of the current for every 15°C increase in temperature. For example, the 1-nA typical current at 25°C would increase to 16 nA at 85°C.
(4) Take care to include the effects of self heating when setting the maximum output load current. The power dissipation of the LM26 would increase by 1.28 mW when I
OUT
= 3.2 mA and V
OUT
= 0.4 V. With a thermal resistance of 250°C/W, this power dissipation would cause an increase in the die temperature of about 0.32°C due to self heating. Self heating is not included in the trip point accuracy specification.
7.6 Typical Characteristics
100
80
60
40
20
0
±60 ±40 ±20 0 20 40 60 80 100 120 140
Temperature (°C)
C001
Figure 1. Power Supply Current Temperature Dependence
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8 Detailed Description
LM26
SNIS115S – MAY 2001 – REVISED SEPTEMBER 2015
8.1 Overview
The LM26 is a factory preset thermostat (temperature switch) that includes an integrated temperature sensor, reference voltage, DAC and comparator. The LM26 can be factory programmed to have a trip point anywhere in the range of −55°C to +120°C. The output functionality can also be changed during the manufacturing process, as described in the functional block diagrams. Available options include:
• OS: active low, open drain that indicates an over temperature shutdown event (most common)
• US: active low, open-drain that indicates an under temperature shutdown event
• OS: active high, push-pull that indicates an over temperature shutdown event
• US: active high, push-pull that indicates an under temperature shutdown event
The internal temperature sensor is brought out on the V
TEMP pin and can be used to determine the temperature that the LM26 is reading by monitoring with an ADC. It has a negative temperature coefficient (NTC) of approximately -10mV/°C. This pin also allows after assembly PCB testing (see section
for more details).
The comparator hysteresis is selectable by the state of the HYST. Two values are available 10°C or 2°C.
Comparator hysteresis is essential, as it prevents comparator output chattering when the temperature is at the comparator threshold set point (REF as shown in the functional block diagrams). Once the comparator trips the hysteresis function changes the comparator threshold (REF) level such that the output remains locked in the active state. The threshold is changed by either 10°C or 2°C as programmed by the state of the HYST pin.
8.2 Functional Block Diagrams
HYST
OS
GND
V
TEMP
REF
TEMP
SENSOR
+
-
HYST
LM26__A
V
+
Figure 2. LM26-_ _A Output Pin Block Diagram
HYST US
GND
V
TEMP
REF
TEMP
SENSOR
-
+
HYST
LM26__B
V
+
Figure 3. LM26-_ _B Output Pin Block Diagram
HYST
GND
V
TEMP
REF
TEMP
SENSOR
-
+
HYST
LM26__C
V+
OS
V
+
Figure 4. LM26-_ _C Output Pin Block Diagram
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LM26
SNIS115S – MAY 2001 – REVISED SEPTEMBER 2015
Functional Block Diagrams (continued)
HYST
US
GND
V
TEMP
REF
TEMP
SENSOR
-
+
HYST
LM26__D
V+
V
+
Figure 5. LM26-_ _D Output Pin Block Diagram www.ti.com
8.3 Feature Description
8.3.1 Hysteresis
The HYST pin level sets the comparator hysteresis. Setting the HYST pin to GND selects 10°C hysteresis, while setting it to V + selects 2°C. A series resistor can be used for protection purposes. The input leakage current of the pin is less than 10 µA. The value of the resistor will depend on the value of V
+ as well as the leakage current.
For example with V + = 3.3 V the input threshold level for V
IH
= 0.8 × 3.3 V = 2.64 V, thus the voltage drop across the resistor should be less than 0.66 V. The 10-µA input leakage current requires the resistor value to be less than 66 k Ω.
8.3.2 V
TEMP
Output
The V
TEMP output provides an output voltage that can be used to determine the temperature reading of the LM26.
The temperature reading of the LM26 can be calculated using the equation:
V = (
´
-
6
´
(T
´
-
2
´
(T
-
30)) + 1.8015 V
(1) or
T
= -
1525.04
+
2.4182
10
6
´ +
1.8015
-
V
TEMP
3.479
´
10 -
6
(2)
The V
TEMP output has very weak drive capability (1-µA source, 40-µA sink). So care should be taken when attaching circuitry to this pin. Capacitive loading may cause the V
TEMP output to oscillate. Simply adding a resistor in series as shown in
and
will prevent oscillations from occurring. To determine the value of the resistor follow the guidelines given in
Table 1 . The same value resistor will work for either placement of the
resistor. If an additional capacitive load is placed directly on the LM26 output, rather than across C
LOAD be at least a factor of 10 smaller than C
LOAD
.
, it should
Table 1. Resistive Compensation for Capacitive Loading of V
TEMP
C
LOAD
≤100pF
1nF
10nF
100nF
≥1µF
R ( Ω)
0
8200
3000
1000
430
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Heavy Capacitive
Load, Cable/Wiring
C
LOAD
R
HYST
GND
OS/OS/US/
US
LM26
VTEMP V+
0.1
P f
LM26
SNIS115S – MAY 2001 – REVISED SEPTEMBER 2015
Heavy Capacitive
Load, Cable/Wiring
R
HYST
GND
OS/OS/US/
US
LM26
VTEMP V+
C
LOAD
0.1
P f
Figure 6. Resistor Placement for Capacitive-
Loading Compensation of V
TEMP
With Capacitor
With R in Series
Figure 7. Resistor Placement for Capacitive-
Loading Compensation of V
TEMP
With Signal Path
With R in Series
8.4 Device Functional Modes
The LM26 after factory programming has two functional modes one with 2°C Hysteresis and the other with 10°C hysteresis as programmed by the level of the HYST pin. Selection of the level will depend on the system noise and the temperature transition rate.
8.4.1 After Assembly PCB Testing
The LM26's V
TEMP output allows after-assembly PCB testing by following a simple test procedure. Simply measuring the V
TEMP output voltage will verify that the LM26 has been assembled properly and that its temperature sensing circuitry is functional. The V
TEMP output has very weak drive capability that can be overdriven by 1.5mA. Therefore, one can simply force the V
TEMP voltage to cause the digital output to change state, thereby verifying that the comparator and output circuitry function after assembly. Here is a sample test procedure that can be used to test the LM26CIM5-TPA which has an 85°C trip point.
1. Turn on V
+ and measure V
TEMP
. Then calculate the temperature reading of the LM26 using the equation:
V = (
´
-
6
´
(T
´
-
2
´
(T
-
30)) + 1.8015 V
(3) or
T
= -
1525.04
+
2.4182
10
6
´ +
1.8015
-
V
TEMP
3.479
´
10 -
6
(4)
2. Verify that the temperature measured in step one is within (±3°C + error of reference temperature sensor) of the ambient/board temperature. The ambient/board temperature (reference temperature) should be measured using an extremely accurate calibrated temperature sensor.
3.
(a) Observe that OS is high.
(b) Drive V
TEMP to ground.
(c) Observe that OS is now low.
(d) Release the V
TEMP pin.
(e) Observe that OS is now high.
4.
(a) Observe that OS is high.
(b) Drive V
TEMP
(c) When OS goes low, note the V
TEMP
(d) V
TEMP voltage down gradually.
Trig = V
TEMP
(e) Calculate Trig using
voltage.
at OS trigger (HIGH->LOW)
5.
(a) Gradually raise V
TEMP
(b) Calculate T
HYST until OS goes HIGH. Note V using
TEMP
.
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.
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9.1 Application Information
The LM26 thermostat (temperature switch) can be used in applications such as microprocessor thermal management, appliances, fan control, industrial process control, power supplies for system protection, fan speed adjust or plain temperature monitoring.
9.2 Typical Application
HYST
GND
VTEMP
LM26
OS
V+
System Fan
Sanyo Denki
109R0612T4H12
+5V
10k
12V
0.1
P f
Figure 8. Two-Speed Fan Speed Control
9.2.1 Design Requirements
The requirement is to change speed fo a fan to maximum at 45°C with an accuracy of
Table 2. Design Parameters
DESIGN PARAMETER
Min Fan Speed
Max Fan Speed
Temperature Threshold To Switch From Min Speed to Max Speed
Threshold accuracy
EXAMPLE VALUE
1900 RPM
3800 RPM
45°C
±3°C
9.2.2 Detailed Design Procedure
The design procedure is simple. A fan was selected that has the capability to be controlled by an external NTC thermistor. The recommended NTC thermistor adjusts the fan speed to maximum at 40°C. The LM26 meets the threshold accuracy requirements for temperature control of the fan speed and allows setting the max speed temperature threshold higher as required to 45°C. The resistance of the thermistor for the min fan speed is 6.8
k Ω. Since thermistors have a negative temperature coefficient (NTC), 10 kΩ was chosen to ensure that the fan is at min speed when the LM26 OS is off. When the OS output goes low at 45°C it simulates the low thermistor resistance at higher temperatures thus setting fan to max speed.
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9.2.3 Application Curve
LM26
SNIS115S – MAY 2001 – REVISED SEPTEMBER 2015
V
TEMP
Output
(Temp. of Leads)
Trip Point
Trip Point - Hysteresis
Fan
Speed
OS
OFF
ON
3800 RPM
1900 RPM
Figure 9. Temperature Effect on Fan Speed
9.3 System Examples
5V
HYST OS
GND
VTEMP
LM26
V+
R1
(100k)
0.1
5V
5V Fan
MC05J3
Comair-Rotron
NDS356P
1N4001
8 :
Figure 10. Fan High-Side Drive
5V
THERMALLY COUPLED
+28V
IC1
-28V
LM3886
+
-
20k
1k 47k
3.3
P F
Audio
Input
HYST
GND
VTEMP
IC2
LM26
OS
V+
0.1
P f
100k
5V
10 P F
5V Fan
MC05J3
Comair-Rotron
NDS356P
1N4001
Figure 12. Audio Power Amplifier Thermal
Protection
12V
HYST
GND
VTEMP
LM26
OS
V+
R1
(1k)
5V
0.1
Figure 11. Fan Low-Side Drive
5V
1N4001
Vout
TOYO
USTF802512HW
HYST
GND
VTEMP
LM26
OS
V+
R1
(10k)
0.1
5V
Figure 13. Simple Thermostat
Heater
Heater
Supply
Copyright © 2001–2015, Texas Instruments Incorporated
Product Folder Links: LM26
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SNIS115S – MAY 2001 – REVISED SEPTEMBER 2015 www.ti.com
10 Power Supply Recommendations
The LM26 has excellent power supply noise rejection. Listed below is a variety of signals used to test the LM26 power supply rejection. False triggering of the output was not observed when these signals where coupled into the V+ pin of the LM26.
• square wave 400 kHz, 1 Vp-p
• square wave 2 kHz, 200 mVp-p
• sine wave 100 Hz to 1 MHz, 200 mVp-p
Testing was done while maintaining the temperature of the LM26 one degree centigrade way from the trip point with the output not activated.
11 Layout
11.1 Layout Guidelines
The LM26 can be applied easily in the same way as other integrated-circuit temperature sensors. It can be glued or cemented to a surface. The temperature that the LM26 is sensing will be within about +0.06°C of the surface temperature to which the LM26's leads are attached to.
This presumes that the ambient air temperature is almost the same as the surface temperature; if the air temperature were much higher or lower than the surface temperature, the actual temperature measured would be at an intermediate temperature between the surface temperature and the air temperature.
To ensure good thermal conductivity, the backside of the LM26 die is directly attached to the GND pin (pin 2).
The temperatures of the lands and traces to the other leads of the LM26 will also affect the temperature that is being sensed.
Alternatively, the LM26 can be mounted inside a sealed-end metal tube, and can then be dipped into a bath or screwed into a threaded hole in a tank. As with any IC, the LM26 and accompanying wiring and circuits must be kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit may operate at cold temperatures where condensation can occur. Printed-circuit coatings and varnishes such as Humiseal and epoxy paints or dips are often used to ensure that moisture cannot corrode the LM26 or its connections.
11.2 Layout Example
VIA to ground plane
VIA to power plane
R only required for open-drain
R is optional maybe directly connected to GND or V
+
HYST
OS, OS,
US, US
GND
V
TEMP
V
+
0.1 µ F
12 Submit Documentation Feedback
Figure 14. LM26 Typical Layout
Copyright © 2001–2015, Texas Instruments Incorporated
Product Folder Links: LM26
www.ti.com
Still Air
Moving Air
LM26
SNIS115S – MAY 2001 – REVISED SEPTEMBER 2015
11.3 Thermal Considerations
The junction to ambient thermal resistance (R
θJA
) is the parameter used to calculate the rise of a part's junction temperature due to its power dissipation. For the LM26 the equation used to calculate the rise in the die junction temperature is as follows:
T
J
= T
A
+ Q
JA
(V
+
V
TEMP
)I
L _ TEMP
+ V I ) where
• T
A is the ambient temperature, V
+ is the power supply voltage
• I
Q is the quiescent current, I
L_TEMP is the load current on the V
TEMP output
• V
DO is the voltage on the digital output
• and I
DO is the load current on the digital output (5)
Since the LM26's junction temperature is the actual temperature being measured, care should be taken to minimize the load current that the LM26 is required to drive.
summarizes the thermal resistance for different conditions and the rise in die temperature of the LM26 without any loading on V supply.
TEMP and a 10-k Ω pullup resistor on an open-drain digital output with a 5.5-V power
Table 3. Thermal resistance (R
θJA
) and Temperature Rise Due to Self Heating (T
J
−T
A
)
SOT-23 5 pin no heat sink
R
θJA
(°C/W)
250
TBD
T
J
−T
A
(°C)
0.11
TBD
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Product Folder Links: LM26
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LM26
SNIS115S – MAY 2001 – REVISED SEPTEMBER 2015 www.ti.com
11.4 Part Number Template
The series of digits labeled xyz in the part number LM26CIM-xyz, describe the set point value and the function of the output as follows:
The place holders xy describe the set point temperature as shown in the following table.
J
K
L
F
H
N
P x (10x)
A
B
C
D
E
Y
Z
V
X
R
S
T
J
K
L
-
H
N
P y (1x)
-
-
-
-
-
-
-
V
-
R
S
T
Temperature (°C)
−5
−4
−3
−2
−1
−0
0
1
2
3
6
7
8
4
5
9
10
11
12
The value of z describes the assignment/function of the output as shown in the following table:
Active-Low/High
0
0
1
1
Open-Drain/ Push-
Pull
0
0
1
1
OS/US
0
1
0
1
Value of z
A
B
C
D
Digital Output Function
Active-Low, Open-Drain, OS output
Active-Low, Open-Drain, US output
Active-High, Push-Pull, OS output
Active-High, Push-Pull, US output
For example:
• the part number LM26CIM5-TPA has T
OS overtemperature shutdown output.
• the part number LM26CIM5-FPD has T
US undertemperature shutdown output.
= 85°C, and programmed as an active-low open-drain
= −5°C, and programmed as an active-high, push-pull
Active-high open-drain and active-low push-pull options are available, please contact Texas Instruments for more information.
14 Submit Documentation Feedback
Product Folder Links: LM26
Copyright © 2001–2015, Texas Instruments Incorporated
www.ti.com
12 Device and Documentation Support
LM26
SNIS115S – MAY 2001 – REVISED SEPTEMBER 2015
12.1 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use .
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.
12.2 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
12.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2001–2015, Texas Instruments Incorporated
Product Folder Links: LM26
Submit Documentation Feedback 15
PACKAGE OPTION ADDENDUM www.ti.com
10-Apr-2015
PACKAGING INFORMATION
Orderable Device
LM26CIM5-BPB/NOPB
LM26CIM5-DPB/NOPB
LM26CIM5-HHD/NOPB
LM26CIM5-NPA/NOPB
LM26CIM5-PHA/NOPB
LM26CIM5-RPA
LM26CIM5-RPA/NOPB
LM26CIM5-SHA/NOPB
LM26CIM5-SPA/NOPB
LM26CIM5-TPA/NOPB
LM26CIM5-VHA/NOPB
LM26CIM5-VPA/NOPB
LM26CIM5-XHA/NOPB
LM26CIM5-XPA/NOPB
LM26CIM5-YHA/NOPB
LM26CIM5-YPA/NOPB
LM26CIM5-ZHA
LM26CIM5-ZHA/NOPB
Status
(1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
NRND
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
NRND
ACTIVE
Package Type Package
Drawing
SOT-23
SOT-23
DBV
DBV
Pins Package
5
5
Qty
Eco Plan
(2)
1000 Green (RoHS
& no Sb/Br)
1000 Green (RoHS
& no Sb/Br)
SOT-23 DBV 5
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
DBV
5
5
5
5
5
5
5
1000 Green (RoHS
& no Sb/Br)
1000 Green (RoHS
& no Sb/Br)
1000 Green (RoHS
& no Sb/Br)
1000 TBD
1000 Green (RoHS
& no Sb/Br)
1000 Green (RoHS
& no Sb/Br)
1000 Green (RoHS
& no Sb/Br)
1000 Green (RoHS
& no Sb/Br)
SOT-23 DBV 5
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
DBV
5
5
5
5
5
5
5
1000 Green (RoHS
& no Sb/Br)
1000 Green (RoHS
& no Sb/Br)
1000 Green (RoHS
& no Sb/Br)
1000 Green (RoHS
& no Sb/Br)
1000 Green (RoHS
& no Sb/Br)
1000 Green (RoHS
& no Sb/Br)
1000 TBD
1000 Green (RoHS
& no Sb/Br)
Lead/Ball Finish
(6)
CU SN
CU SN
CU SN
CU SN
CU SN
Call TI
CU SN
CU SN
CU SN
CU SN
CU SN
CU SN
CU SN
CU SN
CU SN
CU SN
Call TI
CU SN
MSL Peak Temp
(3)
Level-1-260C-UNLIM
Op Temp (°C)
Level-1-260C-UNLIM -55 to 125
Level-1-260C-UNLIM -55 to 125
Level-1-260C-UNLIM -55 to 125
Level-1-260C-UNLIM -55 to 125
Call TI
Level-1-260C-UNLIM
-55 to 125
-55 to 125
Level-1-260C-UNLIM -55 to 125
Level-1-260C-UNLIM -55 to 125
Level-1-260C-UNLIM -55 to 125
Level-1-260C-UNLIM -55 to 125
Level-1-260C-UNLIM -55 to 125
Level-1-260C-UNLIM -55 to 125
Level-1-260C-UNLIM -55 to 125
Level-1-260C-UNLIM -55 to 125
Level-1-260C-UNLIM -55 to 125
Call TI
Level-1-260C-UNLIM
-55 to 125
-55 to 125
Addendum-Page 1
TVHA
TVPA
TXHA
TXPA
TYHA
TYPA
TZHA
TZHA
TBPB
Device Marking
(4/5)
TDPB
THHD
TNPA
TPHA
TRPA
TRPA
TSHA
TSPA
TTPA
Samples
PACKAGE OPTION ADDENDUM www.ti.com
10-Apr-2015
Orderable Device
LM26CIM5X-DPB/NOPB
LM26CIM5X-HHD
LM26CIM5X-HHD/NOPB
LM26CIM5X-NPA/NOPB
LM26CIM5X-PHA/NOPB
LM26CIM5X-RPA/NOPB
LM26CIM5X-SHA/NOPB
LM26CIM5X-SPA/NOPB
Status
(1)
ACTIVE
NRND
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Type Package
Drawing
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
Pins Package
5
5
5
Qty
Eco Plan
(2)
3000 Green (RoHS
& no Sb/Br)
3000 TBD
SOT-23 DBV 5
3000 Green (RoHS
& no Sb/Br)
3000 Green (RoHS
& no Sb/Br)
SOT-23 DBV 5
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
5
5
5
3000 Green (RoHS
& no Sb/Br)
3000 Green (RoHS
& no Sb/Br)
3000 Green (RoHS
& no Sb/Br)
3000 Green (RoHS
& no Sb/Br)
Lead/Ball Finish
(6)
CU SN
Call TI
CU SN
CU SN
CU SN
CU SN
CU SN
CU SN
MSL Peak Temp
(3)
Level-1-260C-UNLIM
Call TI
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Op Temp (°C)
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
LM26CIM5X-TPA/NOPB
LM26CIM5X-VHA/NOPB
LM26CIM5X-VPA/NOPB
LM26CIM5X-XHA/NOPB
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
5
5
5
5
3000 Green (RoHS
& no Sb/Br)
3000 Green (RoHS
& no Sb/Br)
3000 Green (RoHS
& no Sb/Br)
3000 Green (RoHS
& no Sb/Br)
CU SN
CU SN
CU SN
CU SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-55 to 125
-55 to 125
-55 to 125
-55 to 125
LM26CIM5X-XPA/NOPB
LM26CIM5X-YHA/NOPB
ACTIVE
ACTIVE
SOT-23
SOT-23
DBV
DBV
5
5
3000 Green (RoHS
& no Sb/Br)
3000 Green (RoHS
& no Sb/Br)
CU SN
CU SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-55 to 125
-55 to 125
LM26CIM5X-YPA/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -55 to 125
LM26CIM5X-ZHA/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
-55 to 125
Addendum-Page 2
TTPA
TVHA
TVPA
TXHA
TPHA
TRPA
TSHA
TSPA
TXPA
TYHA
TYPA
TZHA
TDPB
Device Marking
(4/5)
THHD
THHD
TNPA
Samples
PACKAGE OPTION ADDENDUM www.ti.com
10-Apr-2015
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 3
www.ti.com
TAPE AND REEL INFORMATION
PACKAGE MATERIALS INFORMATION
10-Apr-2015
*All dimensions are nominal
Device
LM26CIM5-BPB/NOPB
LM26CIM5-RPA
LM26CIM5-YPA/NOPB
LM26CIM5-ZHA
LM26CIM5-ZHA/NOPB
Package
Type
Package
Drawing
SOT-23 DBV
LM26CIM5-DPB/NOPB SOT-23 DBV
LM26CIM5-HHD/NOPB SOT-23 DBV
LM26CIM5-NPA/NOPB SOT-23 DBV
LM26CIM5-PHA/NOPB SOT-23 DBV
SOT-23 DBV
LM26CIM5-RPA/NOPB SOT-23 DBV
LM26CIM5-SHA/NOPB SOT-23 DBV
LM26CIM5-SPA/NOPB SOT-23 DBV
LM26CIM5-TPA/NOPB SOT-23 DBV
LM26CIM5-VHA/NOPB SOT-23 DBV
LM26CIM5-VPA/NOPB SOT-23 DBV
LM26CIM5-XHA/NOPB SOT-23 DBV
LM26CIM5-XPA/NOPB SOT-23 DBV
LM26CIM5-YHA/NOPB SOT-23 DBV
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
Pins
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
SPQ
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
1000
178.0
178.0
178.0
178.0
178.0
178.0
178.0
178.0
Reel
Diameter
(mm)
Reel
Width
W1 (mm)
178.0
8.4
178.0
178.0
8.4
8.4
A0
(mm)
3.2
3.2
3.2
178.0
178.0
178.0
178.0
8.4
8.4
8.4
8.4
3.2
3.2
3.2
3.2
178.0
178.0
178.0
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
8.4
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
B0
(mm)
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
10-Apr-2015 www.ti.com
Device Package
Type
Package
Drawing
LM26CIM5X-DPB/NOPB SOT-23 DBV
LM26CIM5X-HHD SOT-23 DBV
LM26CIM5X-HHD/NOPB SOT-23 DBV
LM26CIM5X-NPA/NOPB SOT-23 DBV
LM26CIM5X-PHA/NOPB SOT-23 DBV
LM26CIM5X-RPA/NOPB SOT-23 DBV
LM26CIM5X-SHA/NOPB SOT-23 DBV
LM26CIM5X-SPA/NOPB SOT-23 DBV
LM26CIM5X-TPA/NOPB SOT-23 DBV
LM26CIM5X-VHA/NOPB SOT-23 DBV
LM26CIM5X-VPA/NOPB SOT-23 DBV
LM26CIM5X-XHA/NOPB SOT-23 DBV
LM26CIM5X-XPA/NOPB SOT-23 DBV
LM26CIM5X-YHA/NOPB SOT-23 DBV
LM26CIM5X-YPA/NOPB SOT-23 DBV
LM26CIM5X-ZHA/NOPB SOT-23 DBV
Pins
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
SPQ
3000
3000
3000
3000
3000
3000
3000
3000
3000
3000
3000
3000
3000
3000
3000
3000
Reel
Diameter
(mm)
Reel
Width
W1 (mm)
178.0
8.4
178.0
178.0
178.0
178.0
178.0
178.0
8.4
8.4
8.4
8.4
8.4
8.4
A0
(mm)
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
178.0
178.0
178.0
8.4
8.4
8.4
3.2
3.2
178.0
178.0
178.0
178.0
178.0
178.0
8.4
8.4
8.4
8.4
8.4
8.4
3.2
3.2
3.2
3.2
3.2
3.2
B0
(mm)
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
3.2
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
1.4
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
*All dimensions are nominal
Device
LM26CIM5-BPB/NOPB
Package Type Package Drawing Pins
SOT-23 DBV 5
SPQ
1000
Length (mm) Width (mm) Height (mm)
210.0
185.0
35.0
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
10-Apr-2015 www.ti.com
Device
LM26CIM5-DPB/NOPB
LM26CIM5-HHD/NOPB
LM26CIM5-NPA/NOPB
LM26CIM5-PHA/NOPB
LM26CIM5-RPA
LM26CIM5-RPA/NOPB
LM26CIM5-SHA/NOPB
LM26CIM5-SPA/NOPB
LM26CIM5-TPA/NOPB
LM26CIM5-VHA/NOPB
LM26CIM5-VPA/NOPB
LM26CIM5-XHA/NOPB
LM26CIM5-XPA/NOPB
LM26CIM5-YHA/NOPB
LM26CIM5-YPA/NOPB
LM26CIM5-ZHA
LM26CIM5-ZHA/NOPB
LM26CIM5X-DPB/NOPB
LM26CIM5X-HHD
LM26CIM5X-HHD/NOPB
LM26CIM5X-NPA/NOPB
LM26CIM5X-PHA/NOPB
LM26CIM5X-RPA/NOPB
LM26CIM5X-SHA/NOPB
LM26CIM5X-SPA/NOPB
LM26CIM5X-TPA/NOPB
LM26CIM5X-VHA/NOPB
LM26CIM5X-VPA/NOPB
LM26CIM5X-XHA/NOPB
LM26CIM5X-XPA/NOPB
LM26CIM5X-YHA/NOPB
LM26CIM5X-YPA/NOPB
LM26CIM5X-ZHA/NOPB
Package Type Package Drawing Pins
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
SPQ
3000
3000
3000
3000
3000
3000
3000
3000
3000
3000
3000
3000
1000
1000
1000
1000
1000
1000
1000
1000
1000
3000
3000
3000
3000
1000
1000
1000
1000
1000
1000
1000
1000
Length (mm) Width (mm) Height (mm)
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
210.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
185.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
Pack Materials-Page 3
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