RAA730101 16-bit A/D converter IC with programmable gain instrumentation amplifier

RAA730101 16-bit A/D converter IC with programmable gain instrumentation amplifier
Data Sheet
RAA730101
R02DS0014EJ0200
Rev.2.00
Feb 27, 2015
16-bit ∆Σ A/D converter IC with programmable gain instrumentation amplifier
Overview
The RAA730101 is a 16-bit ΔΣ A/D converter IC with a programmable gain instrumentation amplifier ideal for
differential output sensors used for measuring flow and pressure. The RAA730101 incorporates a temperature sensor, a
power supply for external sensor, and an internal reference voltage generator. Using Serial Peripheral Interface (SPI)
communication or Universal Asynchronous Receiver Transmitter (UART) communication, the RAA730101 controls
system configurations for each function block from an external device and outputs measured data to the external device.
The RAA730101 also incorporates flash memory for storing system configurations for each function block. The
RAA730101 uses a 36-pin FBGA package, which enables a more compact set design for measuring flow and pressure.
Features
 16-bit ΔΣ A/D converter
 Programmable gain instrumentation amplifier (capable of gain adjustment from x1 to x32 and adjustment of offset
voltage)
 Four analog input channels (differential input mode or single-ended input mode can be specified for each input
channel)
 Temperature sensor (internally connected to 16-bit ΔΣ A/D converter)
 Power supply for external sensor (output voltage: 1.2 to 2.2 V)
 Internal system clock (OSC) oscillator (clock frequency: 20 MHz (Typ.))
 Power-on reset (POR) circuit
 Serial interface (SPI or UART communication is selectable)
 256-byte flash memory for storing system configuration data
 Operating voltage range: 2.7 V ≤ VDD ≤ 5.5 V
 Operating temperature range:
 125C models: 40C ≤ TA ≤ 125C (during normal operation)
105C models: 40C ≤ TA ≤ 105C (during normal operation)
 125C and 105C models: 10C ≤ TA ≤ 85C (during flash memory programming)
 Package: 36-pin plastic FBGA (4 mm  4 mm, 0.5-mm pitch)
Caution Flash memory programming refers to erasing or writing of data in the flash memory.
Applications
 Industrial equipment for measuring items such as pressure, flow, and temperature
 Healthcare equipment for measuring items such as blood pressure and weight
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Feb 27, 2015
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RAA730101
Ordering Information
Ordering Information
Pin count
36 pins
Package
36-pin plastic FBGA (4  4)
Part Number
RAA7301013CBG, RAA7301014CBG
Part No. R A A 7 3 0 1 0 1 3 C B G
Package type
BG: FBGA
Classification
C: Industrial applications
D: Consumer applications
Temperature
3: −40°C ≤ TA ≤ 105°C
4: −40°C ≤ TA ≤ 125°C
Smart Analog IC group
ASSP product
Analog ASIC
Device
Mixed signal IC
Renesas semiconductor product
How to Read This Manual
It is assumed that the readers of this manual have general knowledge of electrical engineering, logic circuits, and
microcontrollers.
 To gain a general understanding of functions
→ Read this manual in the order of the Contents.
 Revised points
→ The mark “<R>” shows major revised points.
The revised points can be easily searched by copying an “<R>” in the PDF file and specifying it in the “Find
what:” field.
Conventions
Data significance:
Active low representations:
Note:
Caution:
Remark:
Numerical representations:
R02DS0014EJ0200 Rev.2.00
Feb 27, 2015
Higher digits on the left and lower digits on the right
××× (overscore over pin and signal name)
Footnote for item marked with Note in the text
Information requiring particular attention
Supplementary information
Binary … ×××× or ××××B
Decimal … ××××
Hexadecimal … ××××H
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RAA730101
Contents
Contents
1. Pin Connection .......................................................................................................................... 6
1.1
1.2
1.3
1.4
1.5
Pin layout (Top View) ....................................................................................................................................6
Block diagram .................................................................................................................................................7
Pin functions ...................................................................................................................................................8
Connection of unused pins ..............................................................................................................................9
I/O circuits ....................................................................................................................................................10
2. Input Multiplexer..................................................................................................................... 12
2.1
2.2
2.3
Overview ......................................................................................................................................................12
Block diagram ...............................................................................................................................................12
Registers controlling input multiplexers .......................................................................................................13
3. Programmable Gain Instrumentation Amplifier (PGIA)......................................................... 14
3.1 Overview ......................................................................................................................................................14
3.2 Block diagram ...............................................................................................................................................15
3.3 Input voltage range .......................................................................................................................................16
3.3.1
Input voltage range in differential input mode ....................................................................................16
3.3.2
Input voltage range in single-ended input mode and internal temperature sensor input mode ...........17
3.4 Registers controlling the programmable gain instrumentation amplifier (PGIA) .........................................18
4. 16-bit ΔΣ A/D Converter......................................................................................................... 20
4.1 16-bit ΔΣ A/D converter ...............................................................................................................................20
4.1.1
Overview.............................................................................................................................................20
4.1.2
Block diagram .....................................................................................................................................20
4.1.3
Voltage input to the 16-bit ΔΣ A/D converter and A/D conversion result ..........................................21
4.2 Digital filter ..................................................................................................................................................22
4.2.1
Overview.............................................................................................................................................22
4.2.2
Block diagram .....................................................................................................................................22
4.3 Registers controlling the 16-bit ΔΣ A/D converter .......................................................................................24
4.4 Operation of A/D converter (AUTOSCAN) .................................................................................................31
5. SPI ........................................................................................................................................... 34
5.1
5.2
5.3
5.4
5.5
Overview ......................................................................................................................................................34
SPI command format ....................................................................................................................................34
Timing of SPI communication operations ....................................................................................................36
Registers controlling SPI communication.....................................................................................................38
Note on Using the SPI ..................................................................................................................................38
6. UART ...................................................................................................................................... 39
6.1
6.2
6.3
6.4
6.5
6.6
6.7
6.8
Overview ......................................................................................................................................................39
Registers controlling UART communication ...............................................................................................41
UART reception (UART command format) .................................................................................................43
UART transmission ......................................................................................................................................45
Communication flow ....................................................................................................................................48
Note on Using the UART .............................................................................................................................49
PWM direct input .........................................................................................................................................50
Differential output ........................................................................................................................................51
7. Interrupt Signal Output Function (for SPI Communication) .................................................. 52
7.1
7.2
7.3
Overview ......................................................................................................................................................52
Block diagram ...............................................................................................................................................52
Registers controlling the interrupt signal output function .............................................................................53
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RAA730101
7.4
Contents
Operation of interrupt signal output function ...............................................................................................56
8. Power Supply Circuit .............................................................................................................. 57
8.1 Overview ......................................................................................................................................................57
8.2 Block diagram of power supply circuit .........................................................................................................57
8.3 Internal reference voltage generator (VREF)................................................................................................58
8.3.1
Overview.............................................................................................................................................58
8.3.2
Block diagram .....................................................................................................................................58
8.3.3
Registers controlling the internal reference voltage generator (VREF) ..............................................59
8.3.4
Operation of internal reference voltage generator (VREF) .................................................................59
8.4 Sensor power supply (SBIAS) ......................................................................................................................60
8.4.1
Overview.............................................................................................................................................60
8.4.2
Block diagram .....................................................................................................................................60
8.4.3
Registers controlling the sensor power supply (SBIAS) .....................................................................61
8.4.4
Operation of sensor power supply (SBIAS)........................................................................................62
8.5 LDO regulator ...............................................................................................................................................63
8.5.1
AREG (AVDD/IOVDD power supply circuit) .......................................................................................63
8.5.2
CREG (ADVDD/DVDD power supply circuit)......................................................................................65
8.5.3
LDO regulator operation in sleep mode ..............................................................................................66
9. Power Supply Configuration ................................................................................................... 67
9.1 Overview ......................................................................................................................................................67
9.2 Block diagrams of power supply configurations ..........................................................................................68
9.3 Sequence of power-on, power-off, and switching to standby mode .............................................................71
9.4 Settings for flash memory programming ......................................................................................................75
9.4.1
Low-power access (mainly for read access) .......................................................................................75
9.4.2
Settings for bypassing AREG to RVDD (for power supply configuration 2) .....................................75
9.4.3
Protection of power/mode control register (CHIPCNT) .....................................................................76
10. Clock Configuration ................................................................................................................ 77
10.1 Overview ......................................................................................................................................................77
10.2 Block diagram ...............................................................................................................................................77
10.3 Registers controlling clocks ..........................................................................................................................78
11. Temperature Sensor ................................................................................................................. 79
11.1 Overview ......................................................................................................................................................79
11.2 Registers controlling the temperature sensor ................................................................................................79
12. Power-on-Reset (POR) Circuit................................................................................................ 80
12.1
12.2
12.3
12.4
Overview ......................................................................................................................................................80
Block diagram ...............................................................................................................................................80
Registers controlling the power-on-reset (POR) circuit................................................................................81
Operation of power-on-reset (POR) circuit ..................................................................................................81
13. Flash Memory ......................................................................................................................... 82
13.1 Overview ......................................................................................................................................................82
13.2 Registers controlling the flash memory ........................................................................................................83
13.3 Startup (power-on) sequence ........................................................................................................................84
13.4 Commands controlling the flash memory .....................................................................................................86
13.4.1 Controlling the flash memory by using SPI commands ......................................................................86
13.4.2 Controlling the flash memory by using UART commands .................................................................87
14. Application Examples ............................................................................................................. 88
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RAA730101
Contents
15. Electrical Specifications .......................................................................................................... 90
15.1 Absolute maximum ratings ...........................................................................................................................90
15.2 Operating conditions .....................................................................................................................................91
15.3 Supply current characteristics .......................................................................................................................91
15.4 Electrical specifications of each block ..........................................................................................................92
15.4.1 Programmable gain instrumentation amplifier and 16-bit ΔΣ A/D converter .....................................92
15.4.2 Internal reference voltage generator (VREF) ......................................................................................94
15.4.3 Sensor power supply (SBIAS) ............................................................................................................94
15.4.4 AREG (AVDD/IOVDD power supply circuit) .......................................................................................94
15.4.5 CREG (ADVDD/DVDD power supply circuit)......................................................................................95
15.4.6 Power-on-reset (POR) circuit..............................................................................................................96
15.4.7 Temperature sensor .............................................................................................................................96
15.4.8 Internal system clock (OSC) oscillator ...............................................................................................97
15.4.9 Flash memory .....................................................................................................................................97
15.4.10 Digital I/O ...........................................................................................................................................97
15.5 SPI access timing ..........................................................................................................................................98
15.6 Cumulative power-on time and wake-up time ..............................................................................................99
16. Chip Identification ................................................................................................................. 101
16.1 Overview ....................................................................................................................................................101
16.2 Register for chip identification ...................................................................................................................101
17. Package Drawings ................................................................................................................. 102
Characteristics Curve (TA = 25C, TYP.) (reference value) ................................................. 103
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RAA730101
1. Pin Connection
1.
Pin Connection
1.1
Pin layout (Top View)
- 4 × 4 mm / 36-pin TFBGA (0.50 mm pitch)
Top View
Bottom View
6
AGND1
SBIAS
AIN2N
AIN2P
AIN1P
AGND6
5
VREF
AGND2
AGND3
AGND5
AIN3N
AIN1N
4
CREG
AVDD
DGND3
AGND4
AIN4N
AIN3P
3
AREG
IOVDD1
SMODE
DGND4
ADVDD
AIN4P
2
RVDD
IOVDD2
INT
TX_B
MCLK
DVDD
1
DGND1
MOSI_RX
MISO_TX
SCLK
CS_B
DGND2
A
B
C
D
E
F
Cautions 1. Make the potential of AGND (AGND1 to AGND6) and DGND (DGND1 to DGND4) the same.
2. Make the potential of ADVDD and DVDD the same.
3. Connect IOVDD1 and IOVDD2 directly.
4. Make RVDD greater than or equal to IOVDD.
5. Connect RVDD to AGND via a capacitor (0.47 μF recommended).
6. Connect AREG to AGND via a capacitor (0.47 μF recommended).
7. Connect CREG to AGND via a capacitor (0.22 μF recommended).
8. Connect SBIAS to AGND via a capacitor (0.22 μF recommended).
9. Connect VREF to AGND via a capacitor (0.1 μF recommended).
10. Connect ADVDD to AGND via a capacitor (0.1 μF recommended).
Remarks 1. In this document, AGND1, AGND2, AGND3, AGND4, AGND5, and AGND6 are referred to as AGND.
2. In this document, DGND1, DGND2, DGND3, and DGND4 are referred to as DGND.
3. In this document, IOVDD1 and IOVDD2 are referred to as IOVDD.
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RAA730101
1.2
1. Pin Connection
Block diagram
ADVDD
SBIAS
Sensor
power supply
AVDD
RVDD
VREF
VREF
AREG
AREG
CREG
IOVDD1 IOVDD2
CREG
POR
DVDD
Flash memory
(256 Bytes)
Control
circuit
INT
INT
AIN1P
AIN1N
AIN2P
AIN2N
AIN3P
Input
multiplexer
PGIA
Digital
16-bit ∆Σ
filter
ADC
(SINC3)
SMODE
Serial
interface
TX_B
MISO_TX
UART
MOSI_RX
AIN3N
Temperature
sensor
AIN4P
CS_B
SPI
OSC
SCLK
AIN4N
MCLK
AGND5
AGND3
AGND1
AGND6
AGND4
AGND2
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DGND3
DGND1
DGND4
DGND2
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RAA730101
1.3
1. Pin Connection
Pin functions
Table 1.1
Pin
No.
Pin name
I/O
Analog/
digital
Pin functions
I/O level
Description
A1
DGND1
–
–
–
Digital circuit ground pin 1
A2
RVDD
–
–
–
Regulator power supply
A3
AREG
A
Output
RVDD
3.0 V LDO output pin for supplying AVDD
A4
CREG
A
Output
AVDD
2.1 V LDO output pin for supplying ADVDD
A5
VREF
A
Output
AVDD
VREF voltage monitor pin
A6
AGND1
–
–
–
B1
MOSI_RX
D
Input
IOVDD
Analog circuit ground pin 1
B2
IOVDD2
–
–
–
I/O circuit power supply pin 2
B3
IOVDD1
–
–
–
I/O circuit power supply pin 1
B4
AVDD
–
–
–
Analog circuit power supply pin
B5
AGND2
–
–
–
Analog circuit ground pin 2
SPI serial data input/UART data reception pin
B6
SBIAS
A
Output
AVDD
Externally-connected sensor power supply pin
C1
MISO_TX
D
Output
IOVDD
SPI serial data input/UART data transmission pin
C2
INT
D
Output
IOVDD
Interrupt signal output pin
C3
SMODE
D
Input
IOVDD
Serial interface mode select pin
C4
DGND3
–
–
–
C5
AGND3
–
–
–
C6
AIN2N
A
Input
AVDD
Digital circuit ground pin 3
Analog circuit ground pin 3
Input multiplexer 2 (programmable gain instrumentation amplifier input pin 2
(negative))
D1
SCLK
D
Input
IOVDD
SPI serial clock input pin
D2
TX_B
D
Output
IOVDD
UART data transmission pin
D3
DGND4
–
–
–
Digital circuit ground pin 4
D4
AGND4
–
–
–
Analog circuit ground pin 4
D5
AGND5
–
–
–
Analog circuit ground pin 5
D6
AIN2P
A
Input
AVDD
Input multiplexer 2 (programmable gain instrumentation amplifier input pin 2
(positive))
E1
CS_B
D
Input
IOVDD
SPI chip select/UART reception mode select pin
E2
MCLK
D
I/O
IOVDD
Oscillator clock monitor pin (1 MHz)/external clock input pin (4 MHz)
E3
ADVDD
–
–
–
E4
AIN4N
A
Input
AVDD
A/D converter power supply
Input multiplexer 4 (programmable gain instrumentation amplifier input pin 4
(negative))
E5
AIN3N
A
Input
AVDD
Input multiplexer 3 (programmable gain instrumentation amplifier input pin 3
(negative))
E6
AIN1P
A
Input
AVDD
Input multiplexer 1 (programmable gain instrumentation amplifier input pin 1
(positive))
F1
DGND2
–
–
–
F2
DVDD
–
–
–
F3
AIN4P
A
Input
AVDD
F4
AIN3P
A
Input
AVDD
F5
AIN1N
A
Input
AVDD
Digital circuit ground pin 2
Digital circuit power supply pin
Input multiplexer 4 (programmable gain instrumentation amplifier input pin 4
(positive))
Input multiplexer 3 (programmable gain instrumentation amplifier input pin 3
(positive))
Input multiplexer 1 (programmable gain instrumentation amplifier input pin 1
(negative))
F6
AGND6
Remark
–
–
–
Analog circuit ground pin 6
The digital I/O pins are compatible with the CMOS interface and Schmitt-triggered input.
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RAA730101
1.4
1. Pin Connection
Connection of unused pins
Table 1.2 shows the connection of unused pins.
Table 1.2
Pin name
Connection of unused pins
Analog/
digital
I/O
I/O level
Description
AREG
A
Output
RVDD
Connect to AGND via a capacitor (0.47F recommended).
CREG
A
Output
AVDD
Connect to AGND via a capacitor (0.22F recommended).
VREF
A
Output
AVDD
Connect to AGND via a capacitor (0.1F recommended).
SBIAS
A
Output
AVDD
Connect to AGND via a capacitor (0.22F recommended).
AIN1P
A
Input
AVDD
Directly connect to AGND.
AIN1N
A
Input
AVDD
AIN2P
A
Input
AVDD
AIN2N
A
Input
AVDD
AIN3P
A
Input
AVDD
AIN3N
A
Input
AVDD
AIN4P
A
Input
AVDD
AIN4N
A
Input
AVDD
CS_B Note
D
Input
IOVDD
Directly connect to IOVDD or DGND.
SCLK
D
Input
IOVDD
Directly connect to DGND.
MOSI_RX
D
Input
IOVDD
Directly connect to IOVDD
MISO_TX
D
Output
IOVDD
Leave this pin open.
TX_B
D
Output
IOVDD
Leave this pin open.
SMODE
D
Input
IOVDD
Directly connect to IOVDD or DGND.
INT
D
Output
IOVDD
Leave this pin open.
MCLK
D
I/O
IOVDD
Leave this pin open.
(When AREGPD = 1, connect it to RVDD.)
Note
In SPI communication, the CS_B pin is surely used. In UART communication, the CS_B pin is used only when
PWM direct input function is used. For details about PWM direct input function, see 6. 7 PWM direct input.
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RAA730101
1.5
1. Pin Connection
I/O circuits
Figure 1.1 I/O circuit type (1/2)
Pin name
Equivalent circuit
Pin name
CS_B
SCLK
MOSI_RX
SMODE
INT
Equivalent circuit
IOVDD
OUT
IN
Schmitt-triggered input with hysteresis characteristics
DGND
MISO_TX
TX_B
MCLK
IOVDD
OUT
OUT
Schmitt-triggered input with hysteresis characteristics
DGND
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RAA730101
1. Pin Connection
Figure 1.1 I/O circuit type (2/2)
Pin name
AIN1P
AIN1N
AIN2P
AIN2N
AIN3P
AIN3N
AIN4P
AIN4N
Equivalent circuit
Pin name
Equivalent circuit
VREF
+
-
OUT
IN
CREG, SBIAS
AREG
CREG
SBIAS
RVDD
OUT
AVDD
OUT
AGND
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AGND
AGND
AGND
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RAA730101
2. Input Multiplexer
2.
Input Multiplexer
2.1
Overview
The input multiplexer has five analog input channels, four of which (input multiplexers 1 to 4) can be used to input an
external signal, and the remaining one of which (input multiplexer 5) is connected to the internal temperature sensor. For
input multiplexers 1 to 4, differential input mode or single-ended input mode can be selected for each channel. If
single-ended input mode is selected, an internal bias voltage (VBIAS) is connected to the channel.
An internal bias voltage (VBIAS) is also connected to the channel to which the output from the internal temperature
sensor is connected. For details about the internal bias voltage, see 8. Power Supply Circuit.
2.2
Block diagram
Temperature
sensor
AIN1P
AIN1N
AIN2P
+
AIN2N
PGIA
To A/D converter
–
AIN3P
AIN3N
AIN4P
AIN4N
AFE VREF
VBIAS
Figure 2.1 Block diagram of input multiplexer
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RAA730101
2.3
2. Input Multiplexer
Registers controlling input multiplexers
The following kind of register is used to control input multiplexers.
 Input multiplexer x (x = 1 to 4) A/D conversion setting register 2 (CHxCNT2)
(1) Input multiplexer x (x = 1 to 4) A/D conversion setting register 2 (CHxCNT2)
These registers are used to specify differential input mode or single-ended input mode for each input multiplexer.
After reset, these registers are initialized to 10H.
Address: 11H
CH1CNT2
After reset: 10H
R/W
7
6
5
4
3
2
1
0
AINSEL1
0
0
AIN1OFT4
AIN1OFT3
AIN1OFT2
AIN1OFT1
AIN1OFT0
AINSEL1
Control of input multiplexer 1
0
Differential input
1
Single-ended input
Caution Bits 6 and 5 are read-only. (When these bits are read, 0 is always returned.)
Address: 14H
CH2CNT2
After reset: 10H
R/W
7
6
5
4
3
2
1
0
AINSEL2
0
0
AIN2OFT4
AIN2OFT3
AIN2OFT2
AIN2OFT1
AIN2OFT0
AINSEL2
Control of input multiplexer 2
0
Differential input
1
Single-ended input
Caution Bits 6 and 5 are read-only. (When these bits are read, 0 is always returned.)
Address: 17H
CH3CNT2
After reset: 10H
R/W
7
6
5
4
3
2
1
0
AINSEL3
0
0
AIN3OFT4
AIN3OFT3
AIN3OFT2
AIN3OFT1
AIN3OFT0
AINSEL3
Control of input multiplexer 3
0
Differential input
1
Single-ended input
Caution Bits 6 and 5 are read-only. (When these bits are read, 0 is always returned.)
Address: 1AH
CH4CNT2
After reset: 10H
R/W
7
6
5
4
3
2
1
0
AINSEL4
0
0
AIN4OFT4
AIN4OFT3
AIN4OFT2
AIN4OFT1
AIN4OFT0
AINSEL4
Control of input multiplexer 4
0
Differential input
1
Single-ended input
Caution Bits 6 and 5 are read-only. (When these bits are read, 0 is always returned.)
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RAA730101
3. Programmable Gain Instrumentation Amplifier (PGIA)
3.
Programmable Gain Instrumentation Amplifier (PGIA)
3.1
Overview
The programmable gain instrumentation amplifier (PGIA) features low offset voltage, low 1/f noise, and high impedance.
The PGIA operates in differential input mode, single-ended input mode, or internal temperature sensor input mode,
according to the setting of the input multiplexer used.
In differential input mode, a gain from x1 to x32 (GTOTAL) can be specified by combining the gain in the preamplifier
(GSET1) and the gain in the post amplifier (GSET2) in the instrumentation amplifier. In single-ended input mode, it is
recommended that you set to 1x gain. The gain cannot be changed in internal temperature sensor input mode. GSET1 and
GSET2 are internally fixed to 1 (GTOTAL = 1).
A D/A converter for adjusting the offset voltage is connected to the post amplifier. In differential input mode and
single-ended input mode, the offset voltage can be adjusted (from 175 mV to +164 mV, in 32 steps (5 bits)) by using this
D/A converter. In internal temperature sensor input mode, the offset voltage cannot be adjusted. The D/A converter output
is internally fixed to 0 mV.
For details about controlling the programmable gain instrumentation amplifier (PGIA), see 4.4 Operation of A/D
converter (AUTOSCAN).
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RAA730101
3.2
3. Programmable Gain Instrumentation Amplifier (PGIA)
Block diagram
Differential input mode
G TOTAL = G SET1 × G SET2:
x1, x2, x3, x4, x6, x8, x12, x16, x24, x32
G SET1 : x1, x2, x3, x4, x8
Positive
G SET2 : x1, x2, x4, x8
+
−
+
Offset
voltage
adjustment
−
Negative
−+
+−
A/D
converter
−175 mV to
+164 mV, 5 bits
+
Single-ended input mode
G TOTAL= G SET1 × G SET2: x1 (Recommended)
Positive
+
G SET2 : x1
G SET1: x1
−
Offset
voltage
adjustment
−
VBIAS
−+
+−
A/D
converter
−175 mV to
+164 mV, 5 bits
+
Internal temperature sensor input mode
G TOTAL= G SET1 × G SET2: x1
G SET2: x1
G SET1: x1
+
−
Offset
voltage
adjustment
−+
+−
A/D
converter
0 mV setting
−
VBIAS
+
Figure 3.1 Block diagram of programmable gain instrumentation amplifier (PGIA)
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RAA730101
3. Programmable Gain Instrumentation Amplifier (PGIA)
Input voltage range
3.3
This section describes the range of voltage input to the programmable gain instrumentation amplifier (PGIA). Figure 3.2
shows the input voltage range in differential input mode, single-ended input mode, and internal temperature sensor input
mode.
Differential input mode
Single-ended input mode (GTOTAL = 1)
Internal temperature sensor input mode
AINxP
+0.35 V/(GSET1×GSET2)
1.6 V
AINxN
Voltage on AINxP pin/
temperature sensor
+0.7 V
1.6 V
Internal bias
voltage
VCOM
-0.35 V/(GSET1×GSET2)
0.2 V
0.9 V
-0.7 V
0.2 V
Figure 3.2 Input voltage range
3.3.1
Input voltage range in differential input mode
VSIG indicates the input-referred amplitude of the differential voltage input signal, VCOM indicates the input-referred
common mode input voltage, and dOFR indicates the input-referred D/A converter output voltage for adjusting the offset
voltage. The voltage input to an amplifier should be 0.2 to 1.6 V. Therefore, the signal that passes through the preamplifier
in the instrumentation amplifier and is then input to the post amplifier must satisfy the conditions in Formula 3.1.
The signal that passes through the preamplifier in the instrumentation amplifier and is then output from the post amplifier
must satisfy the conditions in Formula 3.2.
0.2 V +
VSIG ×GSET1
VSIG ×GSET1
҇VCOM ҇1.6 V 2
2
... Formula 3.1
-0.7 V ҇ (VSIG + dOFR) × GTOTAL ҇ 0.7 V
... Formula 3.2
When dOFR = 0 mV, the input signal is equivalent to the full-scale differential input voltage. VCOM can be expressed by
using Formula 3.3, where VSIG = VID (full-scale differential input voltage).
0.2 V +
VID ×GSET1
VID ×GSET1
҇ VCOM ҇1.6 V 2
2
... Formula 3.3
Figure 3.3 shows the transition of the differential input voltage level in each phase in the programmable gain
instrumentation amplifier (PGIA).
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RAA730101
3. Programmable Gain Instrumentation Amplifier (PGIA)
VIP
+
GSET2
VOP1
–
From input
multiplexer
Offset
voltage
adjustment
GSET1
–+
A/D
converter
+–
−175 mV to
+164 mV, 5 bits
–
+
VIN
VON1
VOP1
VIP
VCOM
VCOM
VIN
+VOFR×
GSET2
A/D converter
full scale
VON1
Vdiff = +/− VSIG
Vdiff = +/− (VSIG×GSET1)
Vdiff = {+/- (VSIG×GSET1) +VOFR} × GSET2
Input differential signal
1st amplifier output
VOFR: DAC output voltage for offset adjustment
(−175 mV to +164 mV, 5 bits)
dOFR: Input-referred DAC voltage for offset adjustment
(dOFR = VDAC/GSET1)
PGIA output (A/D converter input)
Figure 3.3 Transition of the differential input voltage level in the PGIA
3.3.2
Input voltage range in single-ended input mode and internal temperature sensor
input mode
In single-ended input mode and internal temperature sensor input mode, the internal bias voltage (VBIAS = 0.9 V (Typ.))
is connected to the inverting input in the programmable gain instrumentation amplifier (PGIA) as a reference voltage. On
the other hand, the signal from input multiplexer x (x = 1 to 5) is connected to the non-inverting input in the PGIA.
A differential signal in the range of 0.2 to 1.6 V is output based on the reference voltage in GTOTAL=1 (in settings of
GSET1=1 and GSET2=1). Because VBIAS offset gains by GTOTAL,and affects the accuracy of ADC conversion results in
higher gain setting, it is recommended to set GTOTAL=1 (GSET1=1 and GSET2=1) in single-ended mode.
For details about the internal bias voltage, see 8. Power Supply Circuit.
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RAA730101
3.4
3. Programmable Gain Instrumentation Amplifier (PGIA)
Registers controlling the programmable gain instrumentation amplifier (PGIA)
The following two kinds of registers are used to control the programmable gain instrumentation amplifier (PGIA).
 Input multiplexer x (x = 1 to 4) A/D conversion setting register 1 (CHxCNT1)
 Input multiplexer x (x = 1 to 4) A/D conversion setting register 2 (CHxCNT2)
(1) Input multiplexer x (x = 1 to 4) A/D conversion setting register 1 (CHxCNT1)
These registers are used to specify the gain of the programmable gain instrumentation amplifier for input multiplexer
x (x = 1 to 4). After reset, these registers are initialized to 40H.
For details, see 4.4 Operation of A/D converter (AUTOSCAN).
Address: 10H (x = 1), 13H (x = 2), 16H (x = 3), 19H (x = 4)
CHxCNT1
After reset: 40H
R/W
7
6
5
4
3
2
1
0
AINxOSR2
AINxOSR1
AINxOSR0
AINxGC4
AINxGC3
AINxGC2
AINxGC1
AINxGC0
AINxGC4
AINxGC3
AINxGC2
AINxGC1
AINxGC0
Gain setting
GSET1
GSET2
GTOTAL
0
0
0
0
0
1
1
1
0
0
1
0
0
2
1
2
0
1
0
0
0
3
1
3
0
1
1
0
0
4
1
4
1
0
0
0
0
8
1
8
0
0
0
0
1
1
2
2
0
0
1
0
1
2
2
4
0
1
0
0
1
3
2
6
0
1
1
0
1
4
2
8
1
0
0
0
1
8
2
16
0
0
0
1
0
1
4
4
0
0
1
1
0
2
4
8
0
1
0
1
0
3
4
12
0
1
1
1
0
4
4
16
1
0
0
1
0
8
4
32
0
0
0
1
1
1
8
8
0
0
1
1
1
2
8
16
0
1
0
1
1
3
8
24
0
1
1
1
1
4
8
32
Other than above
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Setting prohibited
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RAA730101
3. Programmable Gain Instrumentation Amplifier (PGIA)
(2) Input multiplexer x (x = 1 to 4) A/D conversion setting register 2 (CHxCNT2)
These registers are used to adjust the offset voltage for input multiplexer x (x = 1 to 4). The dOFR (dOFR is the
input-referred value) which is the output voltage from D/A converter for adjusting the offset voltage is calculated by
using the following formula:
(Input-referred) D/A converter output voltage dOFR (mV) = (175 + 350/32 × m) × 1/GSET1
(m = 0 to 31: A value set to the CHxCNT2 register)
After reset, these registers are initialized to 10H.
For details, see 4.4 Operation of A/D converter (AUTOSCAN).
Address: 11H (x = 1), 14H (x = 2), 17H (x = 3), 1AH (x = 4)
CHxCNT2
After reset: 10H
R/W
7
6
5
4
3
2
1
0
AINSELx
0
0
AINxOFT4
AINxOFT3
AINxOFT2
AINxOFT1
AINxOFT0
AINxOFT4
AINxOFT3
AINxOFT2
AINxOFT1
AINxOFT0
m (steps)
dOFR (mV)
0
0
0
0
0
0
175.00 / GSET1
0
0
0
0
1
1
164.06 / GSET1
0
0
0
1
0
2
153.13 / GSET1
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
1
0
0
0
0
16
0
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
...
1
1
1
0
1
29
+142.19 / GSET1
1
1
1
1
0
30
+153.13 / GSET1
1
1
1
1
1
31
+164.06 / GSET1
Caution1. Bits 6 and 5 are read-only. (When these bits are read, 0 is always returned.)
2. dOFR (mV) is fixed to 0 (Number of steps (m) = 16) in internal temperature sensor input mode.
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4. 16-bit ∆Σ A/D Converter
RAA730101
4.
16-bit ∆Σ A/D Converter
4.1
16-bit ∆Σ A/D converter
Overview
4.1.1
The RAA730101 incorporates a 16-bit ΔΣ A/D converter. The signal from input multiplexer x (x = 1 to 5) is input to
the 16-bit ΔΣ A/D converter via the programmable gain instrumentation amplifier (PGIA). The A/D conversion result
is filtered by the SINC3 digital filter and is then stored in an output register.
A/D conversion is performed based on the clock generated in the internal system clock (OSC) oscillator (sampling
frequency = 1 MHz (Typ.)). An external clock can also be used. (For details, see 10. Clock configuration.) A/D
conversion is performed based on a built-in sequencer called AUTOSCAN. The data rate (A/D conversion speed) can
be specified for each channel. For details, see 4.4 Operation of A/D converter (AUTOSCAN).
Block diagram
4.1.2
A/D conversion result register x (x = 1 to 3)
Input multiplexer x (x = 1 to 4) A/D conversion setting register 1 (CHxCNT1)
AINxGC4
AINxGC3
AINxGC2
AINxGC1
AINxGC0
Input multiplexer x (x = 1 to 4) A/D conversion setting register 2 (CHxCNT2)
AINx0FT4
AINx0FT3
AINx0FT2
AINx0FT1
AINx0FT0
A/D conversion result register 1 (ADCC)
ADCC6
ADCC5
ADCC4
ADCC7
ADCC3
ADCC2
ADCC1
ADCC0
A/D conversion result register 2 (ADCH)
ADCH6
ADCH7
ADCH5
ADCH4
ADCH3
ADCH2
ADCH1
ADCH0
A/D conversion result register 3 (ADCL)
ADCL7
ADCL6
ADCL5
ADCL4
ADCL3
ADCL2
ADCL1
ADCL0
Input multiplexer x (x = 1 to 5) A/D conversion setting register 1 (CHxCNT1)
Temperature
sensor
AIN1P
AINxOSR2 AINxOSR1 AINxOSR0
+
AIN1N
-
AIN2P
AIN2N
+
-
AIN3P
+
AIN3N
-
AIN4P
+
AIN4N
-
+
-
PGIA
Secondary  ADC
SINC3
digital filter
A/D conversion result register x (x = 1 to 3)
Clock
A/D converter control register (ADCCNT)
A/D converter control
(AUTOSCAN)
ADSTART
AIN5ADC
AIN4ADC
AIN3ADC
AIN2ADC
AIN1ADC
Input multiplexer x (x = 1 to 5) A/D conversion setting register 3 (CHxCNT3)
AINxCT7
AINxCT6
AINxCT5
AINxCT4
AINxCT3
AINxCT2
AINxCT1
AINxCT0
Input multiplexer x (x = 1 to 4) A/D conversion setting register 2 (CHxCNT2)
AINSELx
Figure 4.1 Block diagram of 16-bit ∆Σ A/D converter
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4. 16-bit ∆Σ A/D Converter
RAA730101
Voltage input to the 16-bit ∆Σ A/D converter and A/D conversion result
4.1.3
This section describes the relationship between the voltage input to the 16-bit ΔΣ A/D converter and A/D conversion
result. Figure 4.2 and Table 4.1 show the A/D conversion result when the full-scale range of voltage can be input to the
A/D converter.
Single-ended input mode (GTOTAL = 1)
Differential input mode
Internal temperature sensor input mode
Code: 2's complement
Digital output
Code: Straight binary
Digital output
65535
+32767
-0.7 V/(GTOTAL)
Full scale = 1.4 V
0
Analog input
0V
32768
+0.7 V/(GTOTAL)
-32768
0
0.2 V
0.9 V
1.6 V
Analog input
Figure 4.2 Digital output (A/D conversion result) and analog input (voltage input to the A/D converter)
Table 4.1
Differential input mode
A/D-converted data
Single-ended input mode(GTOTAL=1) and
internal temperature sensor input mode
Voltage input to
A/D converter
A/D conversion result
(2's complement)
Voltage input to
A/D converter
A/D conversion result
(straight binary)
+700 mV / (GTOTAL)
32767
1.6 V
65535
0V
0
0.9 V
32768
700 mV / (GTOTAL)
32768
0.2 V
0
The A/D conversion result shown in Table 4.1 can be calculated by using the following formulas.
 Differential input mode
Voltage input to A/D converter = (1.4 V/GTOTAL)  (ADCDATA1 / 216)
ADCDATA1: 16-bit A/D conversion result (higher 8 bits stored in ADCH and lower 8 bits stored in ADCL)
expressed as 2's complement
 Single-ended input mode(GTOTAL=1) and internal temperature sensor input mode
Voltage input to A/D converter = (1.4 V/GTOTAL)  (ADCDATA2 / 216) + 0.2 V
ADCDATA2: 16-bit A/D conversion result (higher 8 bits stored in ADCH and lower 8 bits stored in ADCL)
expressed as straight binary
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4. 16-bit ∆Σ A/D Converter
RAA730101
4.2
4.2.1
Digital filter
Overview
A SINC3 digital filter is used to downsample A/D conversion results. The digital filter transfer function is expressed
by using the following equation. M in the equation of the transfer function represents the factor of decimation by the
digital filter, which is itself determined by the OSR (oversampling ratio) set in the AINxOSRn register (x = 0 to 5, n =
0 to 2).
H (z) =
4.2.2
3
1 1 – z-M
࡮
M 1 – z-1
Block diagram
M = OSR = 64, 128, 256, 512, 1024, 2048
1
From A/D converter
(fin = 1 MHz)
34
+
34
+
+
+
-1
+
Z-1
Z
34
+
34
+
Z
M
-1
Z
-1
34
+
-1
Z
34
+
-1
Z
16
To register
(fout = fin/M)
Gain adjustment
(bit shifting)
Figure 4.3 Block diagram of digital filter
Figure 4.3 shows the block diagram of the digital filter. Three integrators and three differentiators are cascaded.
Considering the A/D converter stabilization time, clock synchronization at the input stage in the digital filter, and a
delay caused due to three stages of the differentiator, four times the sampling period (= 4 x 1/fout) is required as the
settling time. (Because the A/D converter stabilization time is fixed to 64 μs or longer, it takes five times the sampling
period when M = 64.)
Remark
The settling time is automatically generated in a built-in sequencer called AUTOSCAN
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4. 16-bit ∆Σ A/D Converter
RAA730101
Figure 4.4 shows the SINC3 filter frequency response.
SINC3 digital filter (M = 256)
0
0
-20
-20
-40
-40
H [dB]
H [dB]
SINC3 digital filter (M = 64)
-60
-60
-80
-80
-100
-100
-120
-120
0
20
40
60
f [kHz]
80
100
120
0
5
10
15
20
25
30
f [kHz]
Figure 4.4 SINC3 filter frequency response where M = 64 and M = 256
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RAA730101
4.3
4. 16-bit ∆Σ A/D Converter
Registers controlling the 16-bit ∆Σ A/D converter
The following six kinds of registers are used to control the 16-bit ΔΣ A/D converter.






A/D converter control register (ADCCNT)
Input multiplexer x (x = 1 to 5) A/D conversion setting register 1 (CHxCNT1)
Input multiplexer x (x = 1 to 5) A/D conversion setting register 3 (CHxCNT3)
A/D conversion result register 1 (ADCC)
A/D conversion result register 2 (ADCH)
A/D conversion result register 3 (ADCL)
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4. 16-bit ∆Σ A/D Converter
RAA730101
(1) A/D converter control register (ADCCNT)
This register is used to start and stop A/D converter operation. This register is also used to enable or disable A/D
conversion of input signals for each input multiplexer channel.
After reset, this register is cleared to 00H.
For details, see 4.4 Operation of A/D converter (AUTOSCAN).
Address: 0FH After reset: 00H R/W
ADCCNT
7
6
5
4
3
2
1
0
ADSTART
0
0
AIN5ADC
AIN4ADC
AIN3ADC
AIN2ADC
AIN1ADC
AIN1ADC
Signal from input multiplexer 1
0
Enable A/D conversion.
1
Disable A/D conversion.
AIN2ADC
Signal from input multiplexer 2
0
Enable A/D conversion.
1
Disable A/D conversion.
AIN3ADC
Signal from input multiplexer 3
0
Enable A/D conversion.
1
Disable A/D conversion.
AIN4ADC
Signal from input multiplexer 4
0
Enable A/D conversion.
1
Disable A/D conversion.
AIN5ADC
Signal from input multiplexer 5 (temperature sensor)
0
Enable A/D conversion.
1
Disable A/D conversion.
ADSTART
Control of A/D converter
0
Stop A/D conversion.
1
Start A/D conversion.
Caution Bits 6 and 5 are read-only. (When these bits are read, 0 is always returned.)
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4. 16-bit ∆Σ A/D Converter
RAA730101
(2) Input multiplexer x (x = 1 to 5) A/D conversion setting register 1 (CHxCNT1)
These registers are used to specify the data rate (A/D conversion speed) for input multiplexer x (x = 1 to 5).
After reset, these registers are initialized to 40H.
For details, see 4.4 Operation of A/D converter (AUTOSCAN).
Address: 10H (x = 1), 13H (x = 2), 16H (x = 3), 19H (x = 4) After reset: 40H R/W
CHxCNT1
7
6
5
4
3
2
1
0
AINxOSR2
AINxOSR1
AINxOSR0
AINxGC4
AINxGC3
AINxGC2
AINxGC1
AINxGC0
Address: 1CH (x = 5) After reset: 40H R/W
CH5CNT1
7
6
5
4
3
2
1
0
AIN5OSR2
AIN5OSR1
AIN5OSR0
0
0
0
0
0
Caution Bits 4 to 0 are read-only. (When these bits are read, 0 is always returned.)
AINxOSR2
AINxOSR1
AINxOSR0
OSR (oversampling ratio)
Data rate (sps)
0
0
0
64
15625.000
0
0
1
128
7812.500
0
1
0
256
3906.250
0
1
1
512
1953.125
1
0
0
1024
976.563
1
0
1
2048
488.281
Other than above
Setting prohibited
Remark The A/D converter sampling clock frequency is set to 1 MHz (Typ.).
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4. 16-bit ∆Σ A/D Converter
RAA730101
(3) Input multiplexer x (x = 1 to 5) A/D conversion setting register 3 (CHxCNT3)
These registers are used to specify the number of A/D conversions per AUTOSCAN cycle for input multiplexer x (x =
1 to 5). The number of A/D conversions N can be expressed by using the formula below.
After reset, these registers are cleared to 00H.
For details, see 4.4 Operation of A/D converter (AUTOSCAN).
N = 32  (2n  1) + m  2n (m and n correspond to the values set to the CHxCNT3 register)
Address: 12H (x = 1), 15H (x = 2), 18H (x = 3), 1BH (x = 4), 1EH (x = 5) After reset: 00H R/W
CHxCNT3
7
6
5
4
3
2
1
0
AINxCT7
AINxCT6
AINxCT5
AINxCT4
AINxCT3
AINxCT2
AINxCT1
AINxCT0
AINxCT4
AINxCT3
AINxCT2
AINxCT1
AINxCT0
m
0
0
0
0
0
0
0
0
0
0
1
1
0
0
0
1
0
2
...
...
...
...
...
...
1
0
0
0
0
16
...
...
...
...
...
...
1
1
1
0
1
29
1
1
1
1
0
30
1
1
1
1
1
31
AINxCT7
AINxCT6
AINxCT5
n
0
0
0
0
0
0
1
1
0
1
0
2
0
1
1
3
1
0
0
4
1
0
1
5
1
1
0
6
1
1
1
7
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4. 16-bit ∆Σ A/D Converter
RAA730101
Up to 256 levels can be selected by combining m and n. The following figure shows the correlation between the
number of A/D conversions and the number of levels (0 to 255) calculated by using the register value.
9000
Number of A/D conversions
8000
7000
6000
5000
4000
3000
2000
1000
0
0
32
64
96
128
160
192
224
Number of levels
Figure 4.5 The number of A/D conversions and the number of levels calculated
by using the register value (0 to 255)
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4. 16-bit ∆Σ A/D Converter
RAA730101
(4) A/D conversion result register 1 (ADCC)
This is a read-only register that is used to check the A/D conversion result. You can check the A/D conversion result
parameters including the checksum, overflow flag, and the channel of input multiplexer corresponding to the
conversion result. For details about a checksum, see 6. UART.
After reset, this register is cleared to 00H.
For details, see 4.4 Operation of A/D converter (AUTOSCAN).
Address: 0CH After reset: 00H R/
ADCC
7
6
5
4
3
2
1
0
ADCC7
ADCC6
ADCC5
ADCC4
ADCC3
ADCC2
ADCC1
ADCC0
ADCC3
ADCC2
ADCC1
ADCC0
1/0
1/0
1/0
1/0
ADCC4
Checksum calculated from A/D conversion result
Checksum
Flag that indicates whether A/D conversion result overflowed
0
No overflow (within range)
1
Overflow occurred (causing the register value to be the maximum value)
ADCC7
ADCC6
ADCC5
0
0
0
Invalid
0
0
1
Input multiplexer 1 (AIN1P/AIN1N)
0
1
0
Input multiplexer 2 (AIN2P/AIN2N)
0
1
1
Input multiplexer 3 (AIN3P/AIN3N)
1
0
0
Input multiplexer 4 (AIN4P/AIN4N)
1
0
1
Input multiplexer 5 (temperature sensor)
1
1
0
Invalid
1
1
1
Invalid
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The channel corresponding to the conversion result
Page 29 of 105
4. 16-bit ∆Σ A/D Converter
RAA730101
(5) A/D conversion result register 2 (ADCH)
This is a read-only register that is used to check the A/D conversion result. This register stores the higher 8 bits of the
16-bit conversion result.
After reset, this register is cleared to 00H.
For details, see 4.4 Operation of A/D converter (AUTOSCAN).
Address: 0DH After reset: 00H R/
ADCH
7
6
5
4
3
2
1
0
ADCH7
ADCH6
ADCH5
ADCH4
ADCH3
ADCH2
ADCH1
ADCH0
(6) A/D conversion result register 3 (ADCL)
This is a read-only register that is used to check the A/D conversion result. This register stores the lower 8 bits of the
16-bit conversion result.
After reset, this register is cleared to 00H.
For details, see 4.4 Operation of A/D converter (AUTOSCAN).
Address: 0EH After reset: 00H R/
ADCL
7
6
5
4
3
2
1
0
ADCL7
ADCL6
ADCL5
ADCL4
ADCL3
ADCL2
ADCL1
ADCL0
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RAA730101
4.4
4. 16-bit ∆Σ A/D Converter
Operation of A/D converter (AUTOSCAN)
All operations controlling the A/D conversion are based on a built-in sequencer called AUTOSCAN. The AUTOSCAN
operation starts when "1" is written to the ADSTART bit of the A/D converter control register (ADCCNT). The signal
from input channels is A/D-converted in round-robin fashion.
Use the AIN5ADC, AIN4ADC, AIN3ADC, AIN2ADC, and AIN1ADC bits of the A/D converter control register
(ADCCNT) to control whether to A/D-convert the signal from each input channel.
Use input multiplexer x (x = 1 to 5) A/D conversion setting register 3 (CHxCNT3) to specify the number of times A/D
conversion is to be performed in an active channel until execution shifts to the next channel. If CHxCNT3 is set to 00H, it
specifies single-shot operation, which stops A/D conversion each time when a conversion ends.
Use the AINxOSR2, AINxOSR1, and AINxOSR0 bits of input multiplexer x (x = 1 to 5) A/D conversion setting register
1 (CHxCNT1) to specify the data rate (A/D conversion speed) on a conversion channel.
The A/D conversion result is stored in read-only registers ADCC (for storing the checksum, overflow status, and the
A/D-converted channel of the input multiplexer), ADCH (for storing the higher 8 bits of the conversion result), and
ADCL (for storing the lower 8 bits of the conversion result).
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4. 16-bit ∆Σ A/D Converter
RAA730101
ADSTART
bit
AUTOSCAN starts
A/D conversion
Disabled
Channel 1
Channel 2
result
ADCC
ADCH
1 sampling period
ADCL
Settling time
Example 1
Channel 4
Channel 5
Channel 1
Channel 2
A/D conversion is
repeated until
ADSTART is set
to 0.
Settling time
When skipping A/D conversion of the signal from input channels
AIN5ADC = AIN3ADC = AIN1ADC = 0, AIN4ADC = AIN2ADC = 1
AIN1CTn [7:0] = 1, AIN3CTn [7:0] = 2, AIN5CTn [7:0] = 3
ADSTART
bit
AUTOSCAN starts
A/D conversion
Disabled
result
ADCC
ADCH
ADCL
Example 2
Channel 3
Channel 3 Channel 3
Channel 1
Channel 5 Channel 5 Channel 5
Channel 1
A/D conversion is
repeated until
ADSTART is set
to 0.
To perform single-shot A/D conversion of the signal from channel 3
AIN3ADC = AIN2ADC = AIN1ADC = 0, AIN5ADC = AIN4ADC = 1
AINxCTn [7:0] > 0 (x = 1, 2) *Value of input multiplexer x (x = 1 or 2) A/D conversion setting register
AIN3CTn [7:0] = 0 *Value of input multiplexer 3 A/D conversion setting register
ADSTART
AUTOSCAN starts
bit
AUTOSCAN stops automatically.
A/D conversion
Disabled
Disabled
Channel
1
Channel
2
result
ADCC
Channel 3
ADCH
(one
conversion)
ADCL
Example 3
When only the signal from channel 2 is A/D converted successively
AIN2ADC = 0, AIN5ADC = AIN4ADC = AIN3ADC = AIN1ADC = 1
AIN2CTn [7:0] > 0 *Value of input multiplexer 2 A/D conversion setting register
ADSTART
AUTOSCAN starts
bit
A/D conversion
Disabled
Channel 2
result
ADCC
ADCH
ADCL
Remark
A/D conversion
continues until
ADSTART is set
to 0.
The settling time is automatically generated in a built-in sequencer called AUTOSCAN
Figure 4.6 AUTOSCAN sequence
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4. 16-bit ∆Σ A/D Converter
RAA730101
To transfer the A/D conversion result to a microcontroller, three types of communication, UART, SPI, and SPI which
does not use an interrupt signal (INT), can be used. The simplified timing charts for each communication type are shown
below. For details, see 5. SPI and 6. UART.
ADSTART
1 sampling period
A/D conversion
result
Settling time
UART
MISO_TX
Header
Higher byte
Header
Lower byte
Higher byte
Lower byte
SPI
INT
MOSI_RX
Read
Read
Address: 05h
MISO_TX
INTF
Read
0Ch
0Dh
0Eh
ADCC
ADCH
ADCL
Read
Address: 05h
INTF
ADC bit = 1
0Ch
0Dh
0Eh
ADCC
ADCH
ADCL
ADC bit = 1
SPI not using INT
Sampling time / 2
ADCIP
bit
MOSI_RX
Polling the A/D conversion status
Read
Read
Address: 06h
MISO_TX
STAT
ADCIP bit = 0
Read
0Ch
0Dh
0Eh
ADCC
ADCH
ADCL
Read
Address: 06h
STAT
0Ch
0Dh
0Eh
ADCC
ADCH
ADCL
ADCIP bit = 0
Figure 4.7 AUTOSCAN interface timing
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RAA730101
5. SPI
5.
SPI
5.1
Overview
The SPI interface is used to allow control from external devices by using clocked communication via four lines: a serial
clock line (SCLK), a serial data input line (MOSI_RX), a serial data output line (MISO_TX), and a chip select input line
(CS_B).
SPI communication or UART communication is selected according to the SMODE pin setting. If a high level is input to
the SMODE pin, SPI communication is selected. If a low level is input to the SMODE pin, UART communication is
selected. Some SPI pins are also used as UART pins, which are selected according to the SMODE pin setting (exclusive
use).
 SMODE = 1: SPI communication (TGLSM = 0)
 SMODE = 0: UART communication (TGLSM = 0)
<R>
There is a point to note when using the SPI of the RAA730101. For details, see 5.5 Note on Using the SPI.
Caution
Clear the TGLSM bit of the startup sequence/communication control register (STARTUP) to "0". For details,
see 13. Flash Memory.
5.2
SPI command format
An SPI access is established by using a short access command or long access command. Which to use is determined
according to the command used. For the detailed command definitions, see the table SPI commands. Because reading data
from the flash memory takes a long time to start, the flash read command requires an access cycle equivalent to two
commands.
Short access command
Command (8 bits)
R/W
R/F
1
C4
C7
C6
C5
C3
Data (8 bits)
C2
C1
C0
D7
D6
D5
D4
D3
D2
D1
D0
Long access command
Command (8 bits)
R/W
R/F
0
C7
C6
C5
C4
C3
C2
Extension (8 bits)
C1
C0
R/W
0: Read mode
1: Write mode
R/F
0: Register
1: Flash memory
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E7
E6
E5
E4
E3
Data (8 bits)
E2
E1
E0
D7
D6
D5
D4
D3
D2
D1
D0
Page 34 of 105
RAA730101
5. SPI
The following table shows the SPI commands.
Table 5.1 SPI commands
No.
1
Name
Register Read
Command
Extension
C7
C6
C5
C4 to C0
E7 to E0
0
0
1
Address:
–
Reads 1 byte of data from the
00h to 1Fh
2
Register Write
1
0
1
Address:
specified register.
–
Writes 1 byte of data to the specified
00h to 1Fh
3
Register Burst Read
0
0
0
Data length
1xxxxNote 1
Description
register.
Start address
Reads the specified length of data
00h to 1Fh
from the specified register
successively.
(Starting from the specified address)
4
Register Burst Write
1
0
0
Data length
Note 1
1xxxx
Start address
Writes the specified length of data to
00h to 1Fh
the specified register successively.
(Starting from the specified address)
5
Register All Write
1
0
0
01111
–
Copies all data stored in the register
from Flash
shadow in the flash memory to the
specified register.
6
Buffer Refresh
1
0
0
01100
–
Copies the default configuration
data to the register buffer.
7
Flash (Burst) Read Note 3
0
1
0
11111
Start address
Reads data from the flash memory.
00h to FFh
Specifies the address from which to
start reading data.
(First command)
0
1
0
11100
Data length
00h to FFh
Note 2
Reads data from the flash memory.
Specifies the length of data to be
read. (Second command)
8
9
Flash Write
Flash All Erase Note 3
1
1
1
1
0
1
11111
11010
Address:
Writes 1 byte of data to the flash
00h to FFh
memory.
–
Erases all data in the flash memory.
(First command)
1
1
1
01011
–
Erases all data in the flash memory.
(Second command)
Notes 1. Data length = “sum of C3 to C0 values” + 1 (Up to 16 bytes)
2. Data length = “sum of E7 to E0 values” + 1 (Up to 256 bytes)
3. To (burst) read and erase data in the flash memory, accessing the flash memory by successively using two
commands is required.
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RAA730101
5.3
5. SPI
Timing of SPI communication operations
The timing of SPI communication operations is shown below.
< Register Read / Register Burst Read >
MOSI input is latched at rising edge of SCLK
CS_B
SCLK
MOSI_RX
Command
Extension
(Optional)
Read data 1
MISO_TX
Burst read case
Read data 2
Read data n
(Incremental access)
< Register Write / Register Burst Write / Flash Write Note >
MOSI input is latched at rising edge of SCLK
CS_B
SCLK
MOSI_RX
Command
Extension
Write data 1
(Optional)
MISO_TX
Burst write case
Write data 2
Write data n
(Incremental access)
Notes There is not burst function for Flash write. Only writing 1 Byte data is available.
< Register All Write from Flash / Buffer Refresh >
MOSI input is latched at rising edge of SCLK
CS_B
SCLK
MOSI_RX
Command
MISO_TX
Figure 5.1 Timing of SPI communication operations
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RAA730101
5. SPI
< Flash (Burst) Read >
CS_B
SCLK
MOSI_RX
Command 1
Head address
Command 2
Data length
wait for the interrupt (FR flag)
MISO_TX
Read data 1
INT
Latency < 3us
INT
The latency can be concealed by
overwrapping Flash Read 2 command.
(to be ignored)
Figure 5.2 Timing of SPI communication operations (read access to the flash memory)
< Flash Erase >
MOSI input is latched at rising edge of SCLK
CS_B
SCLK
MOSI_RX
Command
Command
MISO_TX
Figure 5.3 Timing of SPI communication operations (erasing all the data of the flash memory)
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RAA730101
5.4
5. SPI
Registers controlling SPI communication
The following register is used to control SPI communication.
 Startup sequence/communication control register (STARTUP)
(1) Startup sequence/communication control register (STARTUP)
This register is used to control flash memory access during the startup sequence and select the communication mode.
After reset, this register is cleared to 00H. For details, see 13. Flash Memory.
Be sure to clear the TGLSM bit to “0”.
Address: 1FH After reset: 00H R/
STARTUP
7
6
5
4
3
2
1
0
0
0
0
TGLSM
0
0
SDCOR
CPSOR
TGLSM
Control of SMODE pin function
0
UART communication is selected when SMODE = 0, and SPI communication is selected when
SMODE = 1.
1
Setting prohibited
Caution Bits 7, 6, 5, 3, and 2 are read-only. (When these bits are read, 0 is always returned.)
<R>
5.5
Note on Using the SPI
Pay attention to the following point when using the SPI.
When the communicating node enters the reset state, the levels on the CS_B and SCLK pins become undefined and the
result of the first SPI communication after the other party is released from the reset state may be failure.
When using a communication mode where the level on the SCLK pin becomes high while the level on CS_B pin is high,
confirm that the CHIPID can be read correctly after the other party is released from the reset state, and then start the
communications that are actually required.
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RAA730101
6. UART
6.
UART
6.1
Overview
A full duplex operational communication interface is available by using two lines: a serial data transmission line (TxD)
and a serial data reception line (RxD). Using these two communication lines, a data frame (a packet ; its character length
= 10-12bits), which consists of a start bit, data, parity bit, and stop bit, is transmitted and received asynchronously (using
an internal baud rate) with a communicating node.
There is a point to note when using the UART of the RAA730101. For details, see 6.6 Note on Using the UART.
SPI communication or UART communication is selected according to the SMODE pin setting. If a high level is input to
the SMODE pin, SPI communication is selected. If a low level is input to the SMODE pin, UART communication is
selected. Some UART pins are also used as SPI pins, which are selected according to the SMODE pin setting (exclusive
used).
 SMODE = 1: SPI communication (TGLSM = 0)
 SMODE = 0: UART communication (TGLSM = 0)
Caution Clear the TGLSM bit of the startup sequence/communication control register (STARTUP) to "0". For details, see 13.
Flash Memory.
Data length = 8 bits
Start bit
LSB first
Data
MSB
Parity bit
(any)
Stop bit
(1 or 2 bits)
Sampling timing
Figure 6.1 UART packet format
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RAA730101
6. UART
By default, the baud rate is 4.8 kbps, no parity, and the number of stop bits is 1. This default setting is used for the first
communication after a power-on reset. If you want to use a setting other than the default for the first communication after
a power-on reset, store the configuration data you want to use in the register shadow in the flash memory in advance. For
details, see 13. Flash Memory.
UART communication parameters such as the baud rate, parity bit, and stop bit can be selected by using a register. For
details, see 6.2 Registers controlling UART communication.
As special features, PWM direct input using the Rx pin and differential output using the Tx pin are available. For details,
see 6.7 PWM direct input and 6.8 Differential output.
There is a time out feature for UART reception and transmission. For details, see 6.3 UART reception (UART command
format) and 6.4 UART transmission.
The following shows an overview of the UART.
Table 6.1 Overview of UART
Receiver side (Rx communication)
Transmitter side (Tx communication)
Baud rate
4.8 kbps (default) or 250 kbps
(Selectable by using the RXBR bit in the
setting register)
4.8 kbps (default) or 250 kbps
(Selectable by using the TXBR bit in the
setting register)
Signal format
NRZNote 1 or PWMNote 2
(Selected according to the CS_B pin level)
NRZNote 1
Packet format
(character length =
10-12bits)
Start bit
- 1 bit (fixed)
Data length
- 8 bits (fixed)
- LSB first
Parity setting
- No parity (default)
- Odd parity (Selectable by using the PEN and EPS bits in the setting register)
- Even parity (Selectable by using the PEN and EPS bits in the setting register)
Number of stop bits
- 1 bit (default)
- 2 bits (Selectable by using the STB bit in the setting register register)
Time-out time
Character length × 2
Special function
PWM direct input
Differential output
Notes 1. NRZ: Non Return to Zero
2. PWM: Pulse Width Modulation
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RAA730101
6.2
6. UART
Registers controlling UART communication
The following two kinds of registers are used to control UART communication.
 Startup sequence/communication control register (STARTUP)
 Clock/UART control register (UARTCNT)
(1) Startup sequence/communication control register (STARTUP)
This register is used to control flash memory access during the startup sequence and select the communication mode.
After reset, this register is cleared to 00H. For details, see 13. Flash Memory.
Be sure to clear the TGLSM bit to “0”.
Address: 1FH After reset: 00H R/
STARTUP
7
6
5
4
3
2
1
0
0
0
0
TGLSM
0
0
SDCOR
CPSOR
TGLSM
Control of SMODE pin function
0
UART communication is selected when SMODE = 0, and SPI communication is selected when
SMODE = 1.
1
Setting prohibited
Caution Bits 7, 6, 5, 3, and 2 are read-only. (When these bits are read, 0 is always returned.)
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RAA730101
6. UART
(2) Clock/UART control register (UARTCNT)
This register is used to specify UART parameters and control the clock configuration.
After reset, this register is cleared to 00H.
Address: 08H After reset: 00H R/W
UARTCNT
7
6
5
4
3
2
1
0
EXTCLK
MONIOUT
DIFFOUT
STB
EPS
PEN
TXBR
RXBR
RXBR
Baud rate during reception
0
4.8 kbps (default)
1
250 kbps
TXBR
Baud rate during transmission
0
4.8 kbps (default)
1
250 kbps
PEN
Enabling/disabling the parity bit
0
No parity (default)
1
A parity bit is generated (checked)
EPS
Parity bit selection
0
Odd parity (default): The number of 1s in each set of written bits must be an odd number.
1
Even parity: The number of 1s in each set of written bits must be an even number.
STB
Number of stop bits
0
1 bit (default)
1
2 bits
DIFFOUT
Differential output during transmission
0
Disable differential output (default)
1
Enabled differential output
Remark When DIFFOUT is set to 0, the output of the TX_B pin becomes high impedance. The TX_B pin can
be left open when it is not used. For details, see 1.4 Connection of unused pins.
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RAA730101
6. UART
UART reception (UART command format)
6.3
Like SPI commands, UART commands require a 1- or 2-byte packet for each command (see 5.2 SPI command format).
Message reception might take a time-out if the interval of each packet that makes up a message could not be within a
period of two character length. If packet reception fails due to a time-out, the UART receiver is initialized.
There are two commands dedicated to UART communication. One is a "baud rate correction" command. If this command
is received, a message that consists of 9-bits logical low level (= start bit + 0000_0000b) is output from the transmission
output pin. An external device can adjust the baud rate by counting the number of low cycles.
The other is a "Send request" command. If this command is received, a message that was transmitted last is transmitted
again. By using this command, an external device can regain a message which was lost due to a parity error or checksum
error. “Send request” is available only for a deferred response, which is described in a later section.
There is a point to note regarding the UART reception. For details, see 6.6 Note on Using the UART.
Short access command
Command (8 bits)
R/W
R/F
1
C4
C7
C6
C5
C3
Data (8 bits)
C2
C1
C0
D7
D6
D5
D4
D3
D2
D1
D0
Long access command
Command (8 bits)
R/W
R/F
0
C7
C6
C5
C4
R/W 0: Read mode
R/F
0: Register
C3
C2
Extension (8 bits)
C1
C0
E7
E6
E5
E4
E3
Data (8 bits)
E2
E1
E0
D7
D6
D5
D4
D3
D2
D1
D0
1: Write mode
1: Flash memory
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RAA730101
6. UART
The following table shows the UART commands.
Table 6.2 UART commands
No.
1
Name
Register Read
Command
C7
C6
C5
0
0
1
Extension
C4 to C0
Address:
E7 to E0
–
00h to 1Fh
2
Register Write
1
0
1
Address:
Register Burst Read
0
0
0
Reads 1 byte of data from the specified
register.
–
00h to 1Fh
3
Description
Writes 1 byte of data to the specified
register.
Data length
Start address
Reads the specified length of data from
1xxxxNote 1
00h to 1Fh
the specified register successively.
Data length
Start address
Writes the specified length of data to the
00h-1Fh
specified register successively.
(Starting from the specified address)
4
Register Burst Write
1
0
0
Note 1
1xxxx
(Starting from the specified address)
5
Register All Write
1
0
0
01111
–
from Flash
Copies all data stored in the register
shadow in the flash memory to the
specified register.
6
Buffer Refresh
1
0
0
01100
–
Copies the default configuration data to
the register buffer.
7
Flash (Burst) Read Note 3
0
1
0
11111
Start address
Reads data from the flash memory.
00h to FFh
Specifies the address from which to
start reading data. (First command)
0
1
0
11100
Data length
Reads data from the flash memory.
00h to FFhNote 2
Specifies the length of data to be read.
(Second command)
8
9
Flash Write
Flash All Erase Note 3
1
1
0
11111
Address
Writes 1 byte of data to the flash
00h to FFh
memory.
1
1
1
11010
–
1
1
1
01011
–
Erases all data in the flash memory.
(First command)
Erases all data in the flash memory.
(Second command)
10
Baud rate correction
0
0
0
00000
–
Corrects the baud rate.
(Only available in UART
communication)
11
Send request
0
0
0
01111
–
Requests re-transmission of the
message transmitted last. (Only
available in UART communication)
Notes 1. Data length = “sum of C3 to C0 values” + 1 (Up to 16 bytes)
2. Data length = “sum of E7 to E0 values” + 1 (Up to 256 bytes)
3. To (burst) read and erase data in the flash memory, accessing the flash memory by successively using two
commands is required.
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RAA730101
6.4
6. UART
UART transmission
A UART transmission message has three types of the structures shown below.
A type 1 message is transmitted in response to Register Read, Register Burst Read or Flash (Burst) Read command shown
in the table of UART commands. A type 2 message is transmitted automatically when A/D conversion ends. A type 3
message is transmitted automatically when an interrupt request is generated. A type 3 message is equivalent to the INT
signal used in SPI communication. (For details, see 7. Interrupt signal output function (for SPI communication).)
Message transmission might take a time-out if the interval of each packet that makes up a message could not be within a
period of two character length.
Type 1: Response to Register (Burst) Read or Flash (Burst) Read
Header
Data length
(any)
Start address
Read data 1
(Incremental access)
LSB
L0
L1
L2
L3
L4
0
0
Data length (n − 1)
0
MSB
Read data n
Checksum
(fixed)
Type 2: A/D conversion result
Header
A/D conversion result (higher byte)
A/D conversion result (lower byte)
* Data length = 2 bytes (fixed)
LSB
S0
S1
S2
S3
OV
N0
N1
N2
MSB
Channel n
(n = 1 to 5)
Checksum + overflow
Type 3: Status report
* Header only
Header
LSB
F0
F1
F2
F3
Interrupt signal flag
F4
1
1
(fixed)
1
MSB
Sends a response to a flash memory access
(equivalent to an interrupt in SPI communication),
such as that a parity error (PE) occurred in the
last received message.
Figure 6.2 Transmission message structure
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RAA730101
6. UART
The type 1 message consists of the header which describes the data length of read data, the start address of read data and
read data. The maximum data length which the header can describe is 32 bytes. If the data length of read data is 32 bytes
or more, an additional packet that indicates the actual data length (data length = n-1; 32 to 256 bytes) is inserted following
to the header in the message.
The type 2 message consists of the header, A/D conversion result (higher bytes) and A/D conversion result (lower bytes).
These three contents corresponds to the information of A/D conversion result register 1 (ADCC), A/D conversion result
register 2 (ADCH), A/D conversion result register 3 (ADCL). The header of the type 2 message reserves the information
of the checksum, the overflow status and the input channel which is A/D converted. The overflow flag in a type 2 header
indicates whether the A/D conversion result has been clipped to the maximum value that can be stored in the register.
The type 3 message consists of the header which describes the status. The definitions of flags included in type 3 are shown
below. These flags have the same meaning as that indicated in the interrupt signal flag indication register (INTFLAG).
(For details, see 7.3 Registers controlling the interrupt signal output function.) Note, however, that the F4 bit is not the
ADC flag but the PE flag. This is because the A/D conversion result is transmitted automatically when the A/D
conversion ends in UART communication, and therefore the ADC flag is not required.
Like SPI communication, the RAW flag is also set when the Buffer Refresh command (see No. 6 in the table UART
commands) is executed.
F0: Flash Read ready (FR flag)
F1: Flash Write (FW flag)
F2: Flash All Erase (FAE flag)
F3: Register All Write (RAW flag)
F4: Parity Error at the last reception (PE flag)
If the logic of one of the five flags included in a message becomes high, transmitting an interrupt request is enabled and
the message is automatically transmitted. A communication error can be detected by checking the bit arrangement, even if
a parity bit is disabled.
To transmit an A/D conversion result successively by using the UART, the baud rate must be set to 250 kbps. Even though
the baud rate is set to 250 kbps, the communication speed becomes insufficient and UART transmission fails under the
condition when the oversampling ratio (OSR) for A/D conversion is set to 64, or when the oversampling ratio (OSR) is set
to 128 with the parity bit enabled or with the number of stop bits set to 2.
If A/D conversion result is not transmitted successively (but by just one time, or by single-shot), there is no restriction on
the communication speed.
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RAA730101
6. UART
The checksum can be calculated as follows. When verifying the checksum from an external device, see the relevant
checksum calculation.
How to calculate a checksum for type 1 (response to Register Read or Flash Read)
Start address (8 bits)
Read data 1 (8 bits)
Accumulated
Read data n (8 bits)
Carry bit (ignored)
Checksum (8 bits)
How to calculate a checksum for type 2 (A/D conversion result)
Carry bit (ignored)
ST8
MSB
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
ST7
ST6
ST5
ST4
ST3
ST2
ST1
ST0
ST7
ST6
ST5
ST4
ST3
ST2
ST1
ST0
S3
S2
S1
S0
Carry bit (ignored)
S4
A/D conversion
result
(8 bits each)
Subtotal
Checksum
Figure 6.3 Checksum calculation
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RAA730101
6.5
6. UART
Communication flow
Some instant responses always occur, regardless of the command conditions including whether the command has finished
normally or abnormally. In addition to instant responses, deferred responses are also sent asynchronously in terms of
some commands.
Any new command is ignored until a series of command and response (including a deferred response) is completed. The
table below shows the relationship between received commands and transmitted responses.
Abnormal end shown for type 3 (PE) indicates that an error such as a parity error and framing error has occurred, or an
execution error such as a flash memory access being attempted while flash memory access is prohibited has occurred.
Because A/D conversion results are transmitted asynchronously, a conflict might occur. The messages of responses (data)
are retained in the transmission buffer as much as possible. If the conflict continues for a long time, however, the
transmission buffer becomes full, which causes the A/D conversion results to be lost because the transmission buffer is
updated periodically. Therefore, it is not recommended to issue a reception command while A/D conversion results are
transmitted.
Table 6.3 Relationship between reception commands and transmitted responses
Reception command
No.
Name
Transmitted response
→
Instant response
(normal end)Note 1
or
Instant response
(abnormal end)Note 2
→
Deferred
responseNote 3
1
Register Read
→
Type 1
or
Type 3 (PE)
2
Register Write
→
Type 3 (normal end)
or
Type 3 (PE)
3
Register Burst Read
→
Type 1
or
Type 3 (PE)
4
Register Burst Write
→
Type 3 (normal end)
or
Type 3 (PE)
Register All Write from
→
Type 3 (normal end)
or
Type 3 (PE)
→
Type 3 (RAW)
5
Flash
6
Buffer Refresh
→
Type 3 (normal end)
or
Type 3 (PE)
→
Type 3 (RAW)
7
Flash (Burst) Read
→
Type 3 (normal end)
or
Type 3 (PE)
→
Type 3 (FR)
→
Type 1
or
Type 3 (PE)
(First command)
Flash (Burst) Read
(Second command)
8
Flash Write
→
Type 3 (normal end)
or
Type 3 (PE)
→
Type 3 (FW)
9
Flash All Erase
→
Type 3 (normal end)
or
Type 3 (PE)
→
Type 3 (FAE)
Baud rate correction
→
→
Type 2
10
Zero data
Note 4
or
Type 3 (PE)
(0000_0000b)
11-1
Send request
→
Type 3, excluding PE
or
Type 3 (PE)
→
Type 2
or
Type 3 (PE)
(when ADSTART = 0)
11-2
Send request
(when ADSTART = 1)
A/D conversion results (when ADSTART = 1)
-No reception command is required since A/D conversion results are transmitted automatically.
Notes 1. The type-3 (normal end) message indicates interrupt flag Fx = 0 (x = 0 to 4). (“00000111” in LSB first)
2. A type-3 (PE) response is transmitted if an error occurs during command reception or command execution.
(A type-3 (PE) response = “00001111” in LSB first)
3. A deferred response is transmitted asynchronously when a flash memory access finished or the A/D conversion
result is updated.
4. Four-bit zero data (“0000xxxx” in LSB first) always occurs, even if a command ends abnormally. Therefore, zero
data (“00000000” in LSB first) that occurs when a command ends normally must be distinguished when
adjusting the baud rate.
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RAA730101
6.6
6. UART
Note on Using the UART
Pay attention to the following point when using the UART.
<R>
(1) Disabling the reception by the UART
The receiver of UART turns to be disabled under the condition both Non parity (PEN = 0) and low-level signal is input to
the pin of MOSI_Rx for the period of the three times of character length or more. Once the receiver of UART becomes
disabled, only power on reset by external power supply can make the receiver of UART enabled again.
The examples of condition which make the receiver of UART disabled are described below.
- After powered on, low-level signal continued to be input to the pin of MOSI_Rx for more than 5ms.
- After the baud rate of the RAA730101 is set to be 250kbps (RXBR = 1), the external device tries to communicate with
the RAA730101 using the baud rate of 4.8kbps.
To avoid the unexpected situation that the receiver of UART is disabled, be sure to carry the operations as described
below into effect.
1. Connect the pin of MOSI_Rx and the pin of MISO_Tx to IOVDD via a resistor.
2. When the baud rate of the RAA730101 is set to be 250kbps (RXBR = 1), be sure to set the parity bit enabled (PEN = 1).
The parity bit enabled (PEN = 1) is recommended even if the baud rate of the RAA730101 is 4.8kbps (RXBR = 0). If
you use the copy function from Register shadow of flash memory to register to set the baud rate 250kbps (RXBR = 1), you
must set the parity bit enabled (PEN = 1) by the copy function, too. For details about the copy function from Register
shadow of flash memory to register, see 13. Flash Memory.
<R>
(2) Reading the ADSTART bit
While communications by the UART are in progress, and only then, the value of ADSTART bit cannot be read correctly.
To check for the start of A/D conversion (whether writing to the ADSTART bit was successful or failed), check whether
a type 3 normal end was returned as the instant response to the writing.
To check for the state of operation of the A/D converter (the value of the ADSTART bit), read the bit twice and treat the
second value as the true value.
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RAA730101
6.7
6. UART
PWM direct input
In the RAA730101, the logic level of the NRZ signal can be set to high (= 1) or low (= 0) according to the duty ratio of the
PWM signal. This feature assumes use in isolated communication. The PWM direct input feature is enabled by inputting
a high level to the CS_B pin. The logic level of the NRZ signal becomes high (= 1) when the duty of the PWM signal is
75%, and becomes low (= 0) when the duty of the PWM signal is 25%.
Conventionally, an analog filter has been used to demodulate the PWM signal to the NRZ signal. In the RAA730101, a
digital PWM filter is used to directly input PWM, instead of the analog filter.
enable
1
CS_B
L: NRZ
H: PWM
PWM filter
MOSI_RX
0
UART
MISO_TX
TX_B
NRZ signal
DIFFOUT register
Figure 6.4 Special UART feature 1 - PWM direct input
T2 = 1 / Baud rate ≤ T1
T1 = 1/carrier frequency
MOSI_RX
(PWM signal)
Delayed by T1
Filter output
(NRZ signal)
Carrier frequency: 76.8 kHz to 400 kHz
PWM signal (typ.) duty 25%: NRZ = low,
duty 75%: NRZ = high
Figure 6.5 Timing of PWM filtering
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RAA730101
6.8
6. UART
Differential output
Differential output is used to enlarge the output amplitude and improve noise robustness. Differential output can be
enabled by setting the DIFFOUT bit of the Clock/UART control register (UARTCNT). For details, see 6.2 Registers
controlling UART communication.
enable
1
CS_B
L: NRZ
H: PWM
PWM filter
MOSI_RX
0
UART
MISO_TX
TX_B
NRZ signal
DIFFOUT register
Figure 6.6 Special UART feature 2 - Differential output
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RAA730101
7. Interrupt Signal Output Function (for SPI Communication)
7.
Interrupt Signal Output Function (for SPI Communication)
7.1
Overview
The RAA730101 has an interrupt signal output function. This feature is available only when using SPI communication.
The interrupt signal output function outputs a high level from the INT pin when A/D conversion or flash memory access
finishes. By inputting this output signal to an external device connected to the RAA730101 as an interrupt (INT) signal,
the status of A/D conversion or flash memory access can be reported to the external device. For details, see 7.4 Operation
of interrupt signal output function.
7.2
Block diagram
Flash Read
(FR flag)
[0]
If ADSTART = 1, an interrupt
signal (INT) is not generated
in response to a flash memory
access.
Flash Write
(FW flag)
[1]
Flash All Erase
(FAE flag)
[2]
0
Register All Write
(RAW flag)
[3]
A/D conversion
result
(ADC flag)
INT pin
1
[4]
5
INTMASK register
ADSTART bit
(ADCCNT register)
Figure 7.1 Structure of interrupt (INT) signal output function
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RAA730101
7.3
7. Interrupt Signal Output Function (for SPI Communication)
Registers controlling the interrupt signal output function
The following three kinds of registers are used to control the interrupt signal output function.
 Interrupt mask setting register (INTMASK)
 Interrupt flag indication register (INTFLAG)
 Processing status indication register (STATUS)
(1) Interrupt mask setting register (INTMASK)
This register is used to enable or disable the output of interrupt signals.
After reset, this register is cleared to 00H.
Address: 04H After reset: 00H R/W
INTMASK
7
6
5
4
3
2
1
0
0
0
0
MADC
MRAW
MFAE
MFW
MFR
MFR
Outputting an interrupt signal in response to Flash Read
0
Enable output of interrupts.
1
Disable output of interrupts. (Mask output of interrupts.)
MFW
Outputting an interrupt signal in response to Flash Write
0
Enable output of interrupts.
1
Disable output of interrupts. (Mask output of interrupts.)
MFAE
Outputting an interrupt signal in response to Flash All Erase
0
Enable output of interrupts.
1
Disable output of interrupts. (Mask output of interrupts.)
MRAW
Outputting an interrupt signal in response to Register All Write
0
Enable output of interrupts.
1
Disable output of interrupts. (Mask output of interrupts.)
MADC
Outputting an interrupt signal in response to A/D conversion
0
Enable output of interrupts.
1
Disable output of interrupts. (Mask output of interrupts.)
Caution Bits 7 to 5 are read-only. (When these bits are read, 0 is always returned.)
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RAA730101
7. Interrupt Signal Output Function (for SPI Communication)
(2) Interrupt flag indication register (INTFLAG)
This is a flag register that indicates whether an interrupt signal is ready to be output.
After reset, this register is cleared to 00H.
Address: 05H After reset: 00H R/
INTFLAG
7
6
5
4
3
2
1
0
0
0
0
ADC
RAW
FAE
FW
FR
FR
Interrupt flag indication for Flash Read
0
Output is not ready
1
Output is ready
FW
Interrupt flag indication for Flash Write
0
Output is not ready
1
Output is ready
FAE
Interrupt flag indication for Flash All Erase
0
Output is not ready
1
Output is ready
RAW
Interrupt flag indication for Register All Write
0
Output is not ready
1
Output is ready
ADC
Interrupt flag indication for A/D conversion
0
Output is not ready
1
Output is ready
Caution When bits 7 to 5 are read, 0 is always returned.
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RAA730101
7. Interrupt Signal Output Function (for SPI Communication)
(3) Processing status indication register (STATUS)
This register indicates the processing status of Flash Write, Flash ALL Erase, Register All Write, and A/D conversion.
After reset, this register is cleared to 00H.
Address: 06H After reset: 00H R/
STATUS
7
6
5
4
3
2
1
0
0
0
0
ADCIP
RAWIP
FAEIP
FWIP
0
FWIP
Flash Write processing status
0
Processing finished
1
Processing in progress
FAEIP
Flash All Erase processing status
0
Processing finished
1
Processing in progress
RAWIP
Register All Write processing status
0
Processing finished
1
Processing in progress
ADCIP
A/D conversion processing status
0
Processing finished
1
Processing in progress
Caution When bits 7 to 5 and 0 are read, 0 is always returned.
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RAA730101
7.4
7. Interrupt Signal Output Function (for SPI Communication)
Operation of interrupt signal output function
When any of the commands Flash Write, Flash ALL Erase, and Register All Write, or a command that triggers A/D
conversion is executed by using SPI communication, the corresponding bit in the processing status indication register
(STATUS) is set to 1. When the above processing has finished, the corresponding bit in the processing status indication
register (STATUS) is cleared to 0. At this time, the corresponding bit in the interrupt flag indication register (INTFLAG)
is set to 1, and a high-level interrupt (INT) signal is output from the INT pin. When the interrupt flag indication register
(INTFLAG) is read, it is cleared to 0, and the output of the INT pin goes low.
When the first command of Flash Read is executed, the corresponding bit in the interrupt flag indication register
(INTFLAG) is set to 1, and a high-level interrupt (INT) signal is output from the INT pin. When the second command of
Flash Read is executed, the interrupt flag indication register (INTFLAG) is cleared to 0, and the output of the INT pin
goes low.
The interrupt mask setting register (INTMASK) controls the high-level interrupt (INT) signal output from the INT pin.
(See Figure 7.1 Structure of interrupt signal output function.) If operation of Flash Read, Flash Write, Flash ALL Erase,
Register All Write, or A/D conversion is masked by using the interrupt mask setting register (INTMASK), a high-level
interrupt (INT) signal is not output even when the operation has finished. Outputting an interrupt (INT) signal for A/D
conversion and an accessing to the flash memory is exclusive. If the ADSTART bit of the A/D converter control register
(ADCCNT) is set to 1, an interrupt (INT) signal for a flash memory access is not output. (For details, see 4.3 Registers
controlling the 16-bit ΔΣ A/D converter.)
Like SPI communication, the RAW flag is also set when the Buffer Refresh command (see No. 6 in the table UART
commands) is executed. When the Buffer Refresh command is executed and its processing has finished, the
corresponding bit in the interrupt flag indication register (INTFLAG) is set to 1, and a high-level interrupt (INT) signal is
output from the INT pin.
Instead of using the INT pin, you can check the status of A/D conversion or an accessing to the flash memory by
constantly monitoring the processing status indication register (STATUS).
Flash Write execution complete
SPI communication
Flash Write command
Read INTFLAG
Cleared
FWIP bit in processing
status indication register
FW bit in interrupt signal flag
indication register
INT
(INT pin output)
Figure 7.2 Interrupt signal (INT) output timing (for Flash Write command)
CS_B
SCLK
MOSI_RX
Command 1
Head address
Command 2
Data length
wait for the interrupt (FR flag)
MISO_TX
Read data 1
INT
Latency < 3us
INT
(to be ignored)
The latency can be concealed by
overwrapping Flash Read 2 command.
Figure 7.3 Interrupt signal (INT) output timing (for Flash (Burst) Read command)
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RAA730101
8. Power Supply Circuit
8.
Power Supply Circuit
8.1
Overview
The RAA730101 has a power supply circuit for supplying power to internal circuits and external devices. The power
supply circuit consists of a 2-channel bandgap reference circuit (high-precision BGR and low-power BGR), 2-channel
LDO regulator (AREG and CREG), and a sensor (external device) power supply (SBIAS). For details about the power
supply configuration, see 9. Power Supply Configuration.
8.2
Block diagram of power supply circuit
Low-power
BGR
AREG
0.47 µFNote
RVDD
ADET
POR
AREG
AREGPD
PSTHRU
CDET
STRATUP
SMODE
SLP
Highprecision
BGR
+
BUFAMP
IREF
CREG
CREG
–
0.22 µFNote
VREF
SLP
0.1 µFNote
OSC
FlashCP
VBIAS
Input
multiplexer
PGIA
A/D
converter
SBIAS
D/A converter reference voltage
SBIAS
0.22 µFNote
AFE VREF
SLP
SENSPD
A/D converter reference voltage
Internal reference voltage generator (VREF)
Note Capacitance values are recommended values.
.
Figure 8.1 Block diagram of power supply circuit
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RAA730101
8. Power Supply Circuit
8.3
Internal reference voltage generator (VREF)
8.3.1
Overview
The internal reference voltage generator (VREF) consists of a high-precision BGR and an analog circuit reference voltage
generator (AFE VREF). VREF generates a reference voltage for CREG and SBIAS based on the voltage output from the
high-precision BGR. The voltage output from the high-precision BGR passes through SBIAS and AFE VREF, and is then
used as a reference voltage in the A/D converter and D/A converter, and as an internal bias voltage (VBIAS) to be
connected to input multiplexers. The high-precision BGR can achieve high precision in the output voltage because it is
less dependent on the temperature.
By connecting an external capacitor of 0.1 μF (recommended) to the VREF pin, the internal reference voltage generator
(VREF) is equipped with a low-pass filter that consists of an on-chip resistor and this external capacitor.
8.3.2
Block diagram
AVDD
STARTUP
ADET
High-precision
BGR
BUFAMP
IREF
+
-
VREF
To CREG and SBIAS
0.1 µFNote
SMODE
VREFON
SLP
VBIAS
D/A converter
AFE VREF
From SBIAS
A/D converter
Note Capacitance values are recommended values.
Figure 8.2 Block diagram of internal reference voltage generator (VREF)
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RAA730101
8.3.3
8. Power Supply Circuit
Registers controlling the internal reference voltage generator (VREF)
The following register is used to control the internal reference voltage generator (VREF).
 Power/mode control register (CHIPCNT)
(1) Power/mode control register (CHIPCNT)
This register is used to set the internal reference voltage generator (VREF) to normal operation or sleep mode.
After reset, this register is cleared to 00H.
For details, see 8.3.4 Operation of internal reference voltage generator (VREF).
Address: 01H After reset: 00H R/W
CHIPCNT
7
6
5
4
3
2
1
0
0
0
PSTHRU
AREGPD
0
0
SENSPD
SLP
SLP
Control of sleep mode
0
Normal operation
1
Sleep mode
Caution Bits 7, 6, 3, and 2 are read-only. (When these bits are read, 0 is always returned.)
8.3.4
Operation of internal reference voltage generator (VREF)
The SLP bit of the power/mode control register (CHIPCNT) sets the high-precision BGR to sleep mode. To shift to sleep
mode, the result of logical operations using data of the SLP bit and data input to the SMODE pin is used. When "1" is
written to the SLP bit of the power/mode control register (CHIPCNT) during SPI communication (SMODE = 1), the
high-precision BGR shifts to sleep mode and stops operating. During UART communication (SMODE = 0), on the other
hand, the high-precision BGR is in normal operating mode.
When SBIAS stops operating, AFE VREF also stops operating even if the high-precision BGR operates normally. As a
result, a reference voltage in the A/D converter and D/A converter, and an internal bias voltage (VBIAS) to be connected
to input multiplexers, are not generated. For details about SBIAS, see 8.4 Sensor power supply (SBIAS).
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RAA730101
8. Power Supply Circuit
8.4
Sensor power supply (SBIAS)
8.4.1
Overview
SBIAS supplies power to the sensor connected to the RAA730101. A reference voltage is input from VREF. SBIAS
outputs a voltage between 1.2 and 2.2 V, which can be specified in units of 0.1 V. Output current of 5 mA or less can be
provided. An external capacitor of 0.22 μF (recommended) must be connected to the SBIAS pin.
SBIAS has a protection circuit against an overcurrent. When an overcurrent occurs, the protection circuit works to protect
the internal circuits. SBIAS also has a circuit that monitors and detects the voltage output by SBIAS.
The reference voltage output from VREF passes through SBIAS and is then used as a reference voltage in the A/D
converter and D/A converter, and as an internal bias voltage (VBIAS) to be connected to input multiplexers. For details,
see 8.4.4 Operation of sensor power supply (SBIAS).
8.4.2
Block diagram
SLP
SENSPD
AVDD
VREF
–
+
SBIAS
0.22 µFNote
Protection
circuit
AFEON
SBIAS voltage
detector
(SBIASDET)
AGND
AFE REF
Sensor power supply voltage setting register (VSBIAS)
VSBIAS3
VSBIAS2
VSBIAS1
VSBIAS0
Note Capacitance values are recommended values
Figure 8.3 Block diagram of sensor power supply (SBIAS)
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RAA730101
8.4.3
8. Power Supply Circuit
Registers controlling the sensor power supply (SBIAS)
The following two kinds of registers are used to control the sensor power supply (SBIAS).
 Power/mode control register (CHIPCNT)
 Sensor power supply voltage setting register (VSBIAS)
(1) Power/mode control register (CHIPCNT)
This register is used to set the sensor power supply (SBIAS) to normal operation or sleep mode, or stop the operation.
After reset, this register is cleared to 00H.
For details, see 8.4.4 Operation of sensor power supply (SBIAS).
Address: 01H After reset: 00H R/W
CHIPCNT
7
6
5
4
3
2
1
0
0
0
PSTHRU
AREGPD
0
0
SENSPD
SLP
SLP
Control of sleep mode
0
Normal operation
1
Sleep mode
SENSPD
Control of SBIAS operation
0
Normal operation
1
Stops operation.
Caution Bits 7, 6, 3, and 2 are read-only. (When these bits are read, 0 is always returned.)
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RAA730101
8. Power Supply Circuit
(2) Sensor power supply voltage setting register (VSBIAS)
This register is used to specify the SBIAS output voltage. After reset, this register is cleared to 00H.
Address: 02H After reset: 00H R/W
VSBIAS
7
6
5
4
3
2
1
0
0
0
0
0
VSBIAS3
VSBIAS2
VSBIAS1
VSBIAS0
VSBIAS3
VSBIAS2
VSBIAS1
VSBIAS0
Voltage output from sensor power supply
(SBIAS) (in V)
0
0
0
0
1.2
0
0
0
1
1.3
0
0
1
0
1.4
0
0
1
1
1.5
0
1
0
0
1.6
0
1
0
1
1.7
0
1
1
0
1.8
0
1
1
1
1.9
1
0
0
0
2.0
1
0
0
1
2.1
1
0
1
0
2.2
Other than above
Setting prohibited
Caution Bits 7, 6, 5, and 4 are read-only. (When these bits are read, 0 is always returned.)
8.4.4
Operation of sensor power supply (SBIAS)
In addition to supplying power to the sensor connected to the RAA730101, SBIAS is involved in generating reference
voltages used in analog circuits, such as the reference voltage used in the A/D converter and D/A converter and an internal
bias voltage (VBIAS) to be connected to input multiplexers.
SBIAS has a circuit that monitors and detects the voltage output by SBIAS (SBIASDET), and is used to start analog
circuits such as AFE VREF, programmable gain instrumentation amplifier (PGIA), and A/D converter. When
SBIASDET detects the SBIAS output voltage, SBIASDET is released, which enables analog circuits to start operating.
When SBIASDET detects that the SBIAS output voltage has not risen normally, analog circuits stop operating.
When "1" is written to the SLP bit of the power/mode control register (CHIPCNT), SBIAS shifts to sleep mode and stops
operating. When "1" is written to the SENSPD bit of the power/mode control register (CHIPCNT), SBIAS stops operating.
In both cases, SBIASDET detects the SBIAS output voltage and analog circuits such as AFE VREF, PGIA, and A/D
converter stop operating. When AFE VREF stops operating, a reference voltage in the A/D converter and D/A converter
and an internal bias voltage (VBIAS) to be connected to input multiplexers are not generated.
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8.5
8. Power Supply Circuit
LDO regulator
The LDO regulator consists of AREG (AVDD/IOVDD power supply circuit) and CREG (ADVDD/DVDD power supply
circuit). For how to use AREG and CREG, see 9. Power Supply Configuration.
8.5.1
AREG (AVDD/IOVDD power supply circuit)
8.5.1.1 Overview
AREG generates a voltage based on the voltage output from the low-power BGR, and supplies power to AVDD and IOVDD.
Output voltage is 3.0 V (Typ.). Output current of 50 mA or less can be provided. An external capacitor of 0.47 μF
(recommended) must be connected to the AREG output pin.
AREG has a protection circuit against an overcurrent and a low output voltage detector (ADET). For details about the
AREG operation, see 8.5.1.4 Operation of AREG (AVDD/IOVDD power supply circuit).
8.5.1.2 Block diagram
AREGPD
PSTHRU
Low-power BGR
RVDD
–
+
AREG
Protection
circuit
0.47 µFNote
AREGPD
AGND
Note Capacitance values are recommended values
Figure 8.4 Block diagram of AREG
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8. Power Supply Circuit
8.5.1.3 Registers controlling AREG (AVDD/IOVDD power supply circuit)
The following register is used to control AREG (AVDD/IOVDD power supply circuit).
 Power/mode control register (CHIPCNT)
(1) Power/mode control register (CHIPCNT)
This register is used to set AREG to normal operation or sleep mode, and controls the output status.
After reset, this register is cleared to 00H.
For details, see 8.5.1.4 Operation of AREG (AVDD/IOVDD power supply circuit).
Address: 01H After reset: 00H R/W
CHIPCNT
7
6
5
4
3
2
1
0
0
0
PSTHRU
AREGPD
0
0
SENSPD
SLP
PSTHRU
AREGPD
AREG operating status
Voltage output from AREG pin
0
0
Normal operation
3.0 V
1
0
Operation stops.
RVDD
*
1
Operation stops.
Hi-Z
Caution Bits 7, 6, 3, and 2 are read-only. (When these bits are read, 0 is always returned.)
Remark * ; don’t care
8.5.1.4 Operation of AREG (AVDD/IOVDD power supply circuit)
The AREGPD and PSTHRU bits of the power/mode control register (CHIPCNT) are used to set AREG to normal
operation or sleep mode, and controls the output status.
AREG can be stopped and its output made invalid (high impedance) by writing "1" to the AREGPD bit after AREG starts
operating normally. In this case, the AREG and RVDD pins must be connected externally so that oscillation does not start.
In addition, power must be supplied to RVDD, AVDD, and IOVDD externally. For details, see 9. Power Supply
Configuration.
When "1" is written to the PSTHRU bit, AREG stops operating and the output from AREG is bypassed to RVDD inside the
circuit. This bypass feature can be used when a voltage of 3.0 V or higher needs to be supplied to IOVDD during flash
memory programming. For details, see 9. Power Supply Configuration.
For details about the low output voltage detector (ADET), see 12. Power-on-Reset (POR) Circuit.
Caution Flash memory programming refers to erasing or writing of data in the flash memory.
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8.5.2
8. Power Supply Circuit
CREG (ADVDD/DVDD power supply circuit)
8.5.2.1 Overview
CREG generates a voltage based on the voltage output from the high-precision BGR, and supplies power to ADVDD and
DVDD. Output voltage is 2.1 V (Typ.). Output current of 20 mA or less can be provided. An external capacitor of 0.22 μF
(recommended) must be connected to the CREG output pin.
CREG has a protection circuit against an overcurrent and a low output voltage detector (CDET). For details about the
CREG operation, see 8.5.2.4 Operation of CREG (ADVDD/DVDD power supply circuit).
8.5.2.2 Block diagram
AVDD
VREF
0
Low-power BGR
1
–
+
SLP
CREG
0.22 µFNote
Protection
circuit
AGND
Note Capacitance values are recommended values.
Figure 8.5 Block diagram of CREG
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8. Power Supply Circuit
8.5.2.3 Registers controlling CREG (ADVDD/DVDD power supply circuit)
The following register is used to control CREG (ADVDD/DVDD power supply circuit).
 Power/mode control register (CHIPCNT)
(1) Power/mode control register (CHIPCNT)
This register is used to set CREG to normal operation or sleep mode.
After reset, this register is cleared to 00H.
For details, see 8.5.2.4 Operation of CREG (ADVDD/DVDD power supply circuit).
Address: 01H After reset: 00H R/W
CHIPCNT
7
6
5
4
3
2
1
0
0
0
PSTHRU
AREGPD
0
0
SENSPD
SLP
SLP
Control of sleep mode
0
Normal operation
1
Sleep mode
Caution Bits 7, 6, 3, and 2 are read-only. (When these bits are read, 0 is always returned.)
8.5.2.4 Operation of CREG (ADVDD/DVDD power supply circuit)
The SLP bit of the power/mode control register (CHIPCNT) sets CREG to sleep mode. When "1" is written to the SLP bit
of the power/mode control register (CHIPCNT), CREG shifts to sleep mode and enters the standby state. In the standby
state, CREG operates at low power and outputs a current of 2 mA or less. The reference voltage source is switched from
the high-precision BGR to the low-power BGR. Even in this state, power is supplied to the protection circuit and the low
output voltage detector (CDET).
For details about the low output voltage detector (CDET), see 12. Power-on-Reset (POR) Circuit.
8.5.3
LDO regulator operation in sleep mode
How the LDO regulator operates in sleep mode differs depending on which of the SPI communication and UART
communication is selected.
When "1" is written to the SLP bit of the power/mode control register (CHIPCNT) during SPI communication (SMODE =
1), the power supply circuits other than the low-power BGR, AREG, and CREG stop operating. When "1" is written to the
SLP bit of the power/mode control register (CHIPCNT) during UART communication (SMODE = 0), the high-precision
BGR, in addition to the low-power BGR, AREG, and CREG, can operate. The high-precision BGR operates during
UART communication (SMODE = 0) so as to operate the internal system clock (OSC) oscillator.
In sleep mode, CREG is in standby mode (operates at low power) during SPI communication (SMODE = 1) and UART
communication (SMODE = 0), whichever is selected.
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RAA730101
9. Power Supply Configuration
9.
Power Supply Configuration
9.1
Overview
The RA730101 can use the three power supply configurations shown below.
Configuration 1: External power supply (3.3 V to 5.5 V) = RVDD = IOVDD, AREG = AVDD, CREG = ADVDD = DVDD
Configuration 2: External power supply (3.3 V to 5.5 V) = RVDD, AREG = AVDD = IOVDD, CREG = ADVDD = DVDD
Configuration 3: External power supply (2.7 V to 3.6 V) = RVDD = AVDD = IOVDD, AREG disabled (AREGPD = 1),
CREG = ADVDD = DVDD
Table 9.1 shows the power supply configurations. For details, see 9.2 Block diagrams of power supply configurations.
Table 9.1
Settings
specified in:
Overview of power supply configuration
External power supply is
connected to:
(External power supply
voltage)
RVDD, IOVDD
Configuration 1
(3.3 to 5.5 V)
RVDD
Configuration 2
(3.3 to 5.5 V)
Configuration 3
AREG is connected to:
(AREG = 3.0 V)
CREG is connected
to: (CREG = 2.1 V)
See:
AVDD
ADVDD, DVDD
Figure 9.1
AVDD, IOVDD
ADVDD, DVDD
Figure 9.2
ADVDD, DVDD
Figure 9.3
RVDD, AVDD, IOVDD
RVDD
(2.7 to 3.6 V)
(AREGPD = 1: Output disabled)
Caution The power supply voltage range of IOVDD determines the range of the input and output voltages used
for serial communication.
During flash memory programming, 5 V (Typ.) must be supplied to IOVDD. To perform flash memory programming in
any of the above power supply configurations, the settings need to be changed as shown in Table 9.2. For details, see 9.4
Settings for flash programming.
Table 9.2
Settings
specified in:
Configuration 1
Overview of power supply configuration (for flash memory programming)
External power supply is
connected to:
(External power supply
voltage)
RVDD, IOVDD
(4.5 to 5.5 V)
AREG is connected to:
(AREG = 3.0 V)
CREG is connected
to: (CREG = 2.1 V)
See:
AVDD
ADVDD, DVDD
-
ADVDD, DVDD
-
ADVDD, DVDD
-
AVDD, IOVDD
Configuration 2
RVDD
(PSTHRU = 1: AREG stops
(4.6 to 5.5 V)
operating and the AREG
output is bypassed to RVDD.)
Configuration 3
RVDD, AVDD, IOVDD
RVDD
(4.5 to 5.5 V)
(AREGPD = 1: AREG stopped)
Cautions 1. Flash memory programming refers to erasing or writing of data in the flash memory.
2. The power supply voltage range of IOVDD determines the range of the input and output voltages
used for serial communication.
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9.2
9. Power Supply Configuration
Block diagrams of power supply configurations
Configuration 1: External power supply (3.3 V to 5.5 V) = RVDD = IOVDD, AREG = AVDD, CREG = ADVDD = DVDD
 Supply 3.3 V to 5.5 V from an external power source to RVDD and IOVDD. (Short RVDD and IOVDD
externally.)
 Supply AVDD from AREG (3.0 V).
 Supply ADVDD and DVDD from CREG (2.1 V).
RVDD
3.3 V to 5.5 V
0.47 µFNote
AREG
Low-power
BGR
AREG
0.47 µFNote
POR
AVDD
VREF
VREF
0.1 µFNote
CREG
CREG
0.22 µFNote
SBIAS
SBIAS
0.22 µFNote
OSC
Temperature
sensor
Input
multiplexer
PGIA
ADVDD
0.1 µF
Note
16-bit ΔΣ
ADC
DVDD
Digital
circuits
IOVDD
Flash
memory
I/O circuits
External power supply
Power supplied from LDO (externally connected)
Note Capacitance values are recommended values.
Figure 9.1 Block diagram of power supply configuration 1
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9. Power Supply Configuration
Configuration 2: External power supply (3.3 V to 5.5 V) = RVDD, AREG = AVDD = IOVDD, CREG = ADVDD = DVDD
 Supply 3.3 V to 5.5 V from an external power source to RVDD.
 Supply AVDD and IOVDD from AREG (3.0 V).
 Supply ADVDD and DVDD from CREG (2.1 V).
RVDD
3.3 V to 5.5 V
0.47 µFNote
Low-power
BGR
AREG
AREG
0.47 µFNote
POR
AVDD
VREF
VREF
0.1 µFNote
CREG
CREG
0.22 µFNote
SBIAS
SBIAS
0.22 µFNote
OSC
Temperature
sensor
Input
multiplexer
PGIA
ADVDD
0.1 µFNote
16-bit ΔΣ
ADC
DVDD
Digital
circuits
IOVDD
Flash
memory
I/O circuits
External power supply
Power supplied from LDO (externally connected)
Note Capacitance values are recommended values.
Figure 9.2 Block diagram of power supply configuration 2
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9. Power Supply Configuration
Configuration 3: External power supply (2.7 V to 3.6 V) = RVDD = AVDD = IOVDD, AREG disabled (AREGPD = 1),
CREG = ADVDD = DVDD
 Supply 2.7 V to 3.6 V from an external power source to RVDD, AVDD, and IOVDD. (Short RVDD, AVDD, and
IOVDD externally.)
 Set the AREGPD bit to 1 after circuits start operating normally. (Short AREG and RVDD externally.)
 Supply ADVDD and DVDD from CREG (2.1 V).
RVDD
2.7 V to 3.6 V
0.47 µFNote
AREG
Low-power
BGR
AREG
Short AREG and RVDD
externally.
POR
AVDD
VREF
VREF
0.1 µFNote
CREG
CREG
0.22 µFNote
SBIAS
SBIAS
0.22 µFNote
OSC
Temperature
sensor
Input
multiplexer
PGIA
ADVDD
0.1 µFNote
16-bit ΔΣ
ADC
DVDD
Digital
circuits
IOVDD
Flash
memory
I/O circuits
External power supply
Power supplied from LDO (externally connected)
Note Capacitance values are recommended values.
Figure 9.3 Block diagram of power supply configuration 3
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9.3
9. Power Supply Configuration
Sequence of power-on, power-off, and switching to standby mode
Figures 9.4 to 9.7 show the timing at which to power on, power off, and switch to standby mode.
RVDD
(IOVDD
(configuration 1))
AREG
(AVDD, IOVDD
(configuration 2))
3.3 V
2.2 V to 2.4 V
1800 µs
AREG operating normally
AREGPD
ADET
VREFON
VREF
550 µs
550 µs
CREGSTBYB
CREG
400 µs
On standby
150 µs
700 µs
5 ms
CDET
POR
OSC
(20 MHz)
250 µs OSC: Operating
Digital blocks: Operating
250 µs OSC: Operating
Flash memory
Data read
SBIAS
250 µs
5 ms
250 µs
SBIASDET
AFEON
SLP
Figure 9.4 Timing chart 1 (for configurations 1 and 2, during SPI communication (SMODE = 1))
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9. Power Supply Configuration
RVDD
AVDD
IOVDD
2.2 V to 2.4 V
2.7 V
AREG
AREG operating normally
AREGPD
AREG is turned off
ADET
1800 µs
VREFON
VREF
550 µs
550 µs
CREGSTBYB
CREG
400 µs
On standby
150 µs
700 µs
CDET
POR
OSC
(20 MHz)
OSC: Operating
250 µs Digital blocks: Operating
OSC: Operating
250 µs
Flash memory
Data read
SBIAS
250 µs
5 ms
250 µs
SBIASDET
AFEON
SLP
Figure 9.5 Timing chart 2 (for configuration 3, during SPI communication (SMODE = 1))
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RVDD
(IOVDD
(configuration 1))
AREG
(AVDD, (IOVDD
(configuration 2))
AREGPD
9. Power Supply Configuration
3.3 V
2.2 V to 2.4 V
1800 µs
AREG operating normally
ADET
VREFON
VREF
550 µs (max.)
CREGSTBYB
CREG
400 µs
700 µs (max.)
On standby
150 µs
CDET
POR
OSC
(20 MHz)
250 µs
OSC: Operating
Digital blocks: Operating
Flash memory
Data read
SBIAS
250 µs
5 ms
250 µs
SBIASDET
AFEON
SLP
Figure 9.6 Timing chart 3 (for configurations 1 and 2, during UART communication (SMODE = 0))
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9. Power Supply Configuration
RVDD
AVDD
IOVDD
2.2 V to 2.4 V
2.7 V
AREG
AREG operating normally
AREGPD
AREG is turned off
ADET
1800 µs
VREFON
VREF
550 µs
CREGSTBYB
CREG
400 µs
On standby
150 µs
700 µs
CDET
POR
OSC
(20 MHz)
OSC: Operating
250 µs Digital blocks: Operating
Flash memory
Data read
SBIAS
250 µs
5 ms
250 µs
SBIASDET
AFEON
SLP
Figure 9.7 Timing chart 4 (for configuration 3, during UART communication (SMODE = 0))
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9. Power Supply Configuration
9.4
Settings for flash memory programming
9.4.1
Low-power access (mainly for read access)
Setting the SENSPD bit of the power/mode control register (CHIPCNT) enables accessing (mainly for reading) the flash
memory at low power. When "1" is written to the SENSPD bit of the power/mode control register (CHIPCNT), SBIAS
stops operating and analog circuits such as the PGIA and A/D converter stop operating. These analog circuits are not used
for accessing the flash memory, so power supply to these circuits can be stopped to reduce power consumption. For details,
see 8.4.3 Registers controlling the sensor power supply (SBIAS) and 8.4.4 Operation of sensor power supply (SBIAS).
9.4.2
Settings for bypassing AREG to RVDD (for power supply configuration 2)
Even if IOVDD is connected to the AREG output as shown in power supply configuration 2, flash memory programming
can be performed by setting the PSTHRU bit of the power/mode control register (CHIPCNT). When "1" is written to the
PSTHRU bit of the power/mode control register (CHIPCNT), AREG stops operating and the output from AREG is
bypassed to RVDD inside the circuit. For details, see 8.5.1.3 Registers controlling AREG (AVDD/IOVDD power supply
circuit) and 8.5.1.4 Operation of AREG (AVDD/IOVDD power supply circuit).
RVDD
Bypass (PSTHRU = 1)
AREG
Apply 5.0 V (typ.) during
flash memory programming
3.0 V LDO
Connected on the board
Flash memory
IOVDD
Caution 5.0 V (typ.) is also applied to the serial communication pins.
Figure 9.8 Bypassing AREG to RVDD
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9.4.3
9. Power Supply Configuration
Protection of power/mode control register (CHIPCNT)
If the value of the AREGPD or PSTHRU bit changes accidentally during operation, a critical error or a malfunction that
cannot be detected easily might occur. To prevent such a problem, the power/mode control register (CHIPCNT) has two
protective features.
One is write-protection of the AREGPD bit of the power/mode control register (CHIPCNT). This protects the AREGPD
bit from being written, thus ensuring that its data is retained. The setting of the SLP bit of the power/mode control register
(CHIPCNT) affects writing to the AREGPD bit. The SLP bit must be set to 1 to enable writing to the AREGPD bit. If the
SLP bit is not set to 1, writing to the AREGPD bit is disabled and thus the current data of the AREGPD bit is retained.
Note, however, that this protection does not work when the register data in the flash memory is copied.
The other protective feature is masking of the PSTHRU bit of the power/mode control register (CHIPCNT). The setting of
the ADSTART bit of the A/D converter control register (ADCCNT) affects writing to the PSTHRU bit. If "1" is written to
the ADSTART bit to start A/D conversion, the PSTHRU bit is masked and thus retains 0. Writing to the PSTHRU bit is
enabled again when a power-on reset (POR) occurs.
Figure 9.9 shows an example for accessing the power/mode control register (CHIPCNT).
x: don't care
y: Value to be written
Address: 01h Initial value:
(CHIPCNT)
000000
Three commands are used to change the AREGPD bit.
Write
1yxx10
Write
0yxx00
Write
1yxx01
Write
1yxx01
Write
00yxx00
SLP
(D0 bit)
0
0
0
1
1
0
SENSPD
(D1 bit)
0
1
0
0
0
0
AREGPD
(D4 bit)
0
0
y
PSTHRU
(D5 bit)
0
y
0
y
0
Protected
Protected
1
0
y
Protected
1
0
Masked
Address: 0Fh
(ADCCNT)
ADSTART
(D7 bit)
y
0
Protected
1
0
0
Masked
ADSTART = 1
ADSTART = 0
ADSTART = 0
When the ADSTART bit is set to "1", PSTHRU is set to "0" and masked.
Figure 9.9 Protection of CHIPCNT register
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10. Clock Configuration
10.
Clock Configuration
10.1
Overview
The RAA730101 has an internal system clock (OSC) oscillator. This oscillator generates all the clocks required in each
circuit (clock frequency = 20 MHz (Typ.)). The generated clock is divided and distributed to the A/D converter, UART,
and flash memory controller. The ADC logic generates a clock for the A/D converter. The clock for the A/D converter can
be monitored by using the MCLK pin.
An external clock can also be input to the A/D converter. In this case, the MCLK pin is used to input the external clock.
An external clock is valid only during SPI communication (SMODE = 1). An external clock cannot be input during
UART communication (SMODE = 0). For details, see 10.3 Registers controlling clocks.
10.2
Block diagram
OSC
20 MHz
5 MHz
DIV
Flash
controller
EXTCLK register
SMODE pin
DIV
0
1
4 MHz
UART
ADC logic
1 MHz
ADC
+Clock generator
+Digital filter
+Autoscan sequence
MCLK pin
MONIOUT register
Figure 10.1 Clock configuration
Remark For details about MONIOUT and EXTCLK, see 10.3 Registers controlling clocks.
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10.3
10. Clock Configuration
Registers controlling clocks
The following register is used to control the clocks.
 Clock/UART control register (UARTCNT)
(1) Clock/UART control register (UARTCNT)
This register is used to specify UART parameters and control the clock configuration.
After reset, this register is cleared to 00H.
Address: 08H After reset: 00H R/W
UARTCNT
7
6
5
4
3
2
1
0
EXTCLK
MONIOUT
DIFFOUT
STB
EPS
PEN
TXBR
RXBR
MONIOUT
Monitoring the MCLK pin output
0
Disable monitoring (default).
1
Enable monitoring.
EXTCLK
External clock input to the A/D converter
0
Disable external clock input (default).
1
Enable external clock input.
Remark When MONIOUT is set to 0, the logic level of the MCLK pin output is fixed to low (pulled down to
DGND inside the IC.) When not using this pin, see 1.4 Connection of unused pins.
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11.
Temperature Sensor
11.1
Overview
11. Temperature Sensor
The RAA730101 has one on-chip temperature sensor channel. The output from the on-chip temperature sensor passes
through input multiplexer 5 and the programmable gain instrumentation amplifier, and is then input to the A/D converter.
11.2
Registers controlling the temperature sensor
The following six kinds of registers are used to control the temperature sensor.






A/D converter control register (ADCCNT)
Input multiplexer 5 A/D conversion setting register 1 (CH5CNT1)
Input multiplexer 5 A/D conversion setting register 3 (CH5CNT3)
A/D conversion result register 1 (ADCC)
A/D conversion result register 2 (ADCH)
A/D conversion result register 3 (ADCL)
For details, see 4.3 Registers controlling the 16-bit ΔΣ A/D converter.
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12. Power-on-Reset (POR) Circuit
12.
Power-on-Reset (POR) Circuit
12.1
Overview
The RAA730101 has a power-on-reset (POR) circuit. The POR circuit is built in as part of the power supply circuit and is
used to monitor and detect the voltage output from the LDO regulators (AREG and CREG). The POR circuit consists of
ADET, a circuit that monitors and detects the voltage output from AREG (or RVDD when AREG is bypassed) and CDET,
a circuit that monitors and detects the voltage output from CREG. For details about the operation, see 12.4 Operation of
power-on-reset (POR) circuit.
12.2
Block diagram
RVDD
Low-power
BGR
AREG
AREG
0.47 µFNote
Power-on-reset (POR) circuit
ADET
0
1
AREGPD
PSTHRU
Power-on reset
CDET
High-precision
BGR
To VREF
SMODE
SLP
VREFON
From VREF
1
0
CREG
CREG
0.22 µFNote
A-DELAY
CREGSTBYB
Note Capacitance values are recommended values.
Figure 12.1 Block diagram of power-on-reset (POR) circuit
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12.3
12. Power-on-Reset (POR) Circuit
Registers controlling the power-on-reset (POR) circuit
The following register is used to control the power-on-reset (POR) circuit
 Power/mode control register (CHIPCNT)
(1) Power/mode control register (CHIPCNT)
This register is used to switch the voltage to be monitored and detected by ADET, a circuit that monitors and detects
the voltage output from AREG (or RVDD when AREG is bypassed).
After reset, this register is cleared to 00H.
For details, see 12.4 Operation of power-on-reset (POR) circuit.
Address: 01H After reset: 00H R/W
CHIPCNT
7
6
5
4
3
2
1
0
0
0
PSTHRU
AREGPD
0
0
SENSPD
SLP
PSTHRU
AREGPD
AREG operating status
ADET monitoring/detection target
0
0
Normal operation
Voltage output from AREG
1
0
Operation stops.
Voltage applied to RVDD
*
1
Operation stops.
Voltage applied to RVDD
Caution Bits 7, 6, 3, and 2 are read-only. (When these bits are read, 0 is always returned.)
Remark * ; don’t care
12.4
Operation of power-on-reset (POR) circuit
The POR signal is generated based on the results of voltage detection by ADET and CDET. If both circuits detect a
voltage higher than the removal voltage, the POR signal goes high and the internal blocks becomes active. If either circuit
detects a voltage lower than the detection voltage, the POR signal goes low and the internal blocks are reset.
The AREGPD and PSTHRU bits of the power/mode control register (CHIPCNT) are used to switch the voltage to be
monitored and detected by ADET. When "1" is written to the AREGPD or PSTHRU bit, the voltage to be monitored and
detected by ADET is switched from the AREG output voltage to the voltage applied to RVDD.
The POR circuit operates normally even if "1" is written to the SLP bit of the power/mode control register (CHIPCNT)
and the power supply circuit enters sleep mode. For details, see 8. Power Supply Circuit.
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RAA730101
13. Flash Memory
13.
Flash Memory
13.1
Overview
The RAA730101 has a 256-byte flash memory for storing information specific to the sensor connected to the RAA730101,
such as the sensor ID, initial values, calibration data, and RAA730101 internal register settings specified for the sensor.
The lower 32 bytes of the address space are defined as a register shadow that can be used to store the data to be copied to
registers. Data stored in the register shadow is copied to the relevant registers in the startup sequence that starts after
power-on. Data stored in the register shadow can also be copied to the relevant registers by using an SPI or UART
command in response to a request during normal operation.
The flash memory can be read and written in bytes, but should be erased all at once.
Flash memory programming is prohibited while A/D conversion is being performed (ADSTART = 1). Flash memory
programming in sleep mode (SLP = 1) is also prohibited.
For details about the operation, see 13.3 Startup (power-on) sequence.
Flash memory map
Register map
FFh
User area
Data in the register shadow is automatically copied to
registers when the CPSOR bit of the startup sequence/
communication control register (STARTUP) is set to 1.
Specify the setting in the flash memory register shadow.
256 bytes
1Fh
Copy
Register
shadow
Register
32 bytes
00h
Figure 13.1 Address space
Cautions 1. Flash memory programming refers to erasing or writing of data in the flash memory.
2. If more than 30 days have passed since the data of flash memory was erased last, be sure to erase
the data of flash memory again, and then write the required data to flash memory.
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RAA730101
13.2
13. Flash Memory
Registers controlling the flash memory
The following register is used to control the flash memory.
 Startup sequence/communication control register (STARTUP)
(1) Startup sequence/communication control register (STARTUP)
This register is used to control flash memory access during the startup sequence and select the communication mode.
After reset, this register is cleared to 00H. For details, see 13.3 Startup (power-on) sequence.
This is a read-only register and cannot be written by using an SPI or UART command. However, this register is
updated when data in the register shadow is copied during the startup sequence. The updated value then becomes
valid.
Be sure to clear the TGLSM bit to “0”. The TGLSM bit is also updated when data in the register shadow is copied. The
updated value then becomes valid.
Address: 1FH After reset: 00H R/
STARTUP
7
6
5
4
3
2
1
0
0
0
0
TGLSM
0
0
SDCOR
CPSOR
CPSOR
Copying data in the register shadow
0
Disable operation.
1
Enable operation.
SDCOR
Data transmission to an external device using UART communication
0
Disable operation.
1
Enable operation.
TGLSM
Control of SMODE pin function
0
UART communication is selected when SMODE = 0, and SPI communication is selected when
SMODE = 1.
1
Setting prohibited
Caution Bits 7, 6, 5, 3, and 2 are read-only. (When these bits are read, 0 is always returned.)
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RAA730101
13.3
13. Flash Memory
Startup (power-on) sequence
Power-on
Copy the default setting data (trimming data) to the register buffer.
* The user cannot change this default setting data.
Check the value of the CPSOR bit in the register shadow.
Disabled
(CPSOR = 0)
Enabled
(CPSOR = 1)
Copy the data in the register shadow to the relevant registers.
Check the value of the SDCOR bit in the register shadow.
Disabled
(SDCOR = 0)
(or during SPI
communication)
Enable
(SDCOR = 1)
Transmit all the data in the user area (256-byte address space) to the
microcontroller by using UART communication.
Check the value of the ADSTART bit.
Start
(ADSTART = 1)
Stop
(ADSTART = 0)
Wait for a command to be received
A/D conversion starts
(AUTOSCAN)
Figure 13.2 Startup (power-on) sequence
After power-on reset, the default setting data of the RAA730101 such as trimming data is copied to the register buffer area
automatically. (The default setting data is always copied automatically.) The default setting data can also be copied to the
register buffer area by using an SPI or UART command during normal operation. For details, see 5. SPI and 6. UART.
Next, the CPSOR bit value stored in the register shadow is checked. If CPSOR is 1, the data in the register shadow are
copied to the relevant registers. Then, the SDCOR bit value stored in the register shadow is checked. If SDCOR is 1, all
256 bytes of data in the user area in the flash memory are transmitted to the microcontroller connected to the RAA730101
by using UART communication. (This data is not transmitted in SPI communication.) The processes up to this point are
automatically performed after power-on reset.
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RAA730101
13. Flash Memory
There is a programming window period in the interval from when the system starts up after power-on reset to when the
first A/D conversion starts. Flash memory programming can only be performed in this period.
When ADSTART is set to 1 to trigger A/D conversion, flash memory programming can no longer be performed. This
prevents the flash memory from being erased and overwritten unintentionally during operation. Flash memory
programming is enabled again when power-on reset (POR) occurs.
Note that this operation occurs when ADSTART has been set to 1 by using an SPI or UART command. Flash memory
programming is not disabled just by copying the value of ADSTART set to 1 in the register shadow to the relevant
register.
Cautions 1. Flash memory programming refers to erasing or writing of data in the flash memory.
2. When the copy function from the register shadow to the registers is used, see 6.6 Note on Using the
UART.
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RAA730101
13.4
13. Flash Memory
Commands controlling the flash memory
13.4.1
Controlling the flash memory by using SPI commands
Table 13.1 SPI commands
No.
1
Name
Register Read
Command
C7
C6
C5
0
0
1
Extension
C4 to C0
E7 to E0
Address:
–
00h to 1Fh
2
Register Write
1
0
1
Address:
Register Burst Read
0
0
0
Data length
Note 1
1xxxx
Reads 1 byte of data from the
specified register.
–
00h to 1Fh
3
Description
Writes 1 byte of data to the specified
register.
Start address
Reads the specified length of data
00h to 1Fh
from the specified register
successively.
(Starting from the specified address)
4
Register Burst Write
1
0
0
Data length
Note 1
1xxxx
Start address
Writes the specified length of data to
00h to 1Fh
the specified register successively.
(Starting from the specified address)
5
Register All Write
1
0
0
01111
–
from Flash
Copies all data stored in the register
shadow in the flash memory to the
specified register.
6
Buffer Refresh
1
0
0
01100
7
Flash (Burst) Read Note 3
0
1
0
11111
–
Copies the default configuration data
to the register buffer.
Start address
Reads data from the flash memory.
00h to FFh
Specifies the address from which to
start reading data.
(First command)
0
1
0
11100
Data length
Reads data from the flash memory.
00h to FFhNote 2
Specifies the length of data to be read.
(Second command)
8
9
Flash Write
Flash All Erase
1
Note 3
1
1
1
0
1
11111
11010
Address:
Writes 1 byte of data to the flash
00h to FFh
memory.
–
Erase all data in the flash memory.
(First command)
1
1
1
01011
–
Erase all data in the flash memory.
(Second command)
Notes 1. Data length = “sum of C3 to C0 values” + 1 (Up to 16 bytes)
2. Data length = “sum of E7 to E0 values” + 1 (Up to 256 bytes)
3. To (burst) read and erase data in the flash memory, accessing the flash memory by successively using two
commands is required.
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RAA730101
13.4.2
13. Flash Memory
Controlling the flash memory by using UART commands
Table 13.2 UART commands
No.
1
Name
Register Read
Command
Extension
C7
C6
C5
C4 to C0
0
0
1
Address:
E7 to E0
–
Reads 1 byte of data from the specified
00h to 1Fh
2
Register Write
1
0
1
Address:
register.
–
Writes 1 byte of data to the specified
00h to 1Fh
3
Register Burst Read
0
0
0
Data length
Note 1
1xxxx
Description
register.
Start address
Reads the specified length of data from
00h to 1Fh
the specified register successively.
(Starting from the specified address)
4
Register Burst Write
1
0
0
Data length
Start address
Writes the specified length of data to the
1xxxxNote 1
00h to 1Fh
specified register successively.
(Starting from the specified address)
5
Register All Write
1
0
0
01111
–
Copies all data stored in the register
from Flash
shadow in the flash memory to the
specified register.
6
Buffer Refresh
1
0
0
01100
–
Copies the default configuration data to
the register buffer.
7
Flash (Burst) Read Note 3
0
1
0
11111
Start address
Reads data from the flash memory.
00h to FFh
Specifies the address from which to start
reading data. (First command)
0
1
0
11100
Data length
00h to FFh
Note 2
Reads data from the flash memory.
Specifies the length of data to be read.
(Second command)
8
9
Flash Write
Flash All Erase Note 3
1
1
1
1
0
1
11111
11010
Address
Writes 1 byte of data to the flash
00h to FFh
memory.
–
Erase all data in the flash memory.
(First command)
1
1
1
01011
–
Erase all data in the flash memory.
(Second command)
10
Baud rate correction
0
0
0
00000
–
Corrects the baud rate.
(Only available in UART communication)
11
Send request
0
0
0
01111
–
Requests re-transmission of the
message transmitted last. (Only
available in UART communication)
Notes 1. Data length = “sum of C3 to C0 values” + 1 (Up to 16 bytes)
2. Data length = “sum of E7 to E0 values” + 1 (Up to 256 bytes)
3. To (burst) read and erase data in the flash memory, accessing the flash memory by successively using two
commands is required.
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RAA730101
14.
14. Application Examples
Application Examples
Bidirectional SPI communication
*RVDD and IOVDD are externally connected.
*AVDD is supplied from AREG
*AIN1P and AIN1N pins: Differential input
*AIN2P pin: Single-ended input
*AIN2N, AIN3P, AIN3N, AIN4P, and AIN4N pins: Not used
3.3 V to 5.5 V
RVDD
0.47 uFNote
VREF
0.1 uFNote
IOVDD1
AREG
SBIAS
3.0 V
0.47 uFNote
0.22 uFNote
1.2 V to 2.2 V
AVDD
AIN1P
AIN1N
CREG
2.1 V
0.22 uFNote
ADVDD
MEMS
sensor
0.1 uFNote
RAA730101
AIN2P
AIN2N
AIN3P
AIN3N
AIN4P
AIN4N
DVDD
MCLK
INT
CS_B
SCLK
MOSI_RX
MISO_TX
TX_B
SMODE
AGND1
AGND2
AGND3
AGND4
AGND5
AGND6
MCU
DGND3
DGND4
IOVDD2
DGND1
DGND2
Note Capacitance values are recommended values.
Figure 14.1 Example of connecting a sensor to a microcontroller (for SPI communication)
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RAA730101
14. Application Examples
Bidirectional UART communication
*RVDD and IOVDD are externally connected.
*AVDD is supplied from AREG
*AIN1P and AIN1N pins: Differential input
*AIN2P pin: Single-ended input
*AIN2N, AIN3P, AIN3N, AIN4P, and AIN4N pins: Not used
3.3 V to 5.5 V
RVDD
0.47 uFNote
VREF
0.1uFNote
IOVDD1
AREG
SBIAS
3.0 V
0.47 uFNote
0.22 uFNote
1.2 V to 2.2 V
AVDD
AIN1P
AIN1N
CREG
2.1 V
0.22 uFNote
ADVDD
MEMS
sensor
0.1 uFNote
RAA730101
AIN2P
AIN2N
AIN3P
AIN3N
AIN4P
AIN4N
DVDD
MCLK
INT
CS_B
SCLK
MOSI_RX
MISO_TX
TX_B
SMODE
AGND1
AGND2
AGND3
AGND4
AGND5
AGND6
MCU
DGND3
DGND4
IOVDD2
DGND1
DGND2
Note Capacitance values are recommended values.
Figure 14.2 Example of connecting a sensor to a microcontroller (for UART communication)
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RAA730101
15. Electrical Specifications
Electrical Specifications
15.
The electrical specifications shown in this section are verified under the following conditions unless otherwise specified.




The temperature ranges are 40C  TA  125C (for 125 C models), 40C  TA  105C (for 105 C models).
The power supply voltage ranges satisfy the values prescribed in 15.2 Operating conditions.
The Typ. value is the value when TA = 25C.
Differential input mode, FS = 1 MHz, FDATA = 3.90625 ksps, SBIAS = 1.2 V, dOFR = 0 mV, EXTCLK = 0, and VCOM
= 0.9 V.
Absolute maximum ratings
15.1
Parameter
Supply voltage
Input voltage
Symbol
Conditions
Ratings
Unit
VDD1
RVDD, AVDD, IOVDD
0.3 to +6.5
V
VDD2
ADVDD, DVDD
0.3 to +2.8
V
VSS
AGND, DGND
0.3 to +0.3
V
VI2
AIN1P, AIN1N, AIN2P, AIN2N, AIN3P,
0.3 to AVDD + 0.3Note
V
0.3 to IOVDD + 0.3Note
V
0.3 to RVDD +
0.3Note
V
0.3 to AVDD +
0.3Note
V
0.3 to IOVDD +
0.3Note
AIN3N, AIN4P, AIN4N
VI1
Output voltage
VO1
VO2
CS_B, SCLK, MOSI_RX, SMODE, MCLK
AREG
CREG, SBIAS, VREF
VO3
MISO_TX, TX_B, INT, MCLK
Output current, low
IOL
MISO_TX
Operating ambient
TA
In normal operating mode
V
10
mA
40 to +125
C
40 to +105
C
10 to 85
C
55 to +150
C
(for 125 C models)
temperature
In normal operating mode
(for 105 C models)
During flash memory programming
(for both 125 C models and 105 C models)
Storage
TSTG
temperature
Note
Must be 6.5 V or lower.
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RAA730101
15.2
15. Electrical Specifications
Operating conditions
Parameter
Symbol
Range of power supply voltage
Conditions
Min.
Typ.
Max.
Unit
AREG is operating
3.3
5.0
5.5
V
AREG operation stopped
2.7
3.0
3.6
V
AVDD
2.7
3.0
3.6
V
ADVDD
2.0
2.1
2.2
V
DVDD
2.0
2.1
2.2
V
5.0
5.5
V
RVDD
for regulator
Range of power supply voltage
for analog circuits
Power supply voltage input to the
A/D converter
Range of power supply voltage
for digital circuits
Range of power supply voltage
IOVDD
RVDD  IOVDDNote 1
2.7
VFP1
When VFP1 = IOVDDNote 2
4.5
5.5
V
VFP2
When VFP2 = RVDDNote 3
4.6
5.5
V
for I/O circuits
Range of voltage for flash
memory programming 1
Range of voltage for flash
memory programming 2
Notes 1. Make RVDD greater than or equal to IOVDD.
2. For power supply configurations 1 and 3
3. For power supply configuration 2 and when PSTHRU = 1
Caution Flash memory programming refers to erasing or writing of data in the flash memory.
15.3
Supply current characteristics
Parameter
Current consumption in sleep mode
Symbol
Conditions
Min.
Typ.
Max.
Unit
IDDS1
SMODE = 1, SLP = 1, AREGPD = 0
3
20
μA
IDDS2
SMODE = 1, SLP = 1, AREGPD = 1
1.5
15
μA
IDDS3
SMODE = 0, SLP = 1, AREGPD = 0
550
850
μA
IDDA1
During A/D conversion
1.3
1.7
mA
(total of analog and digital circuits)
Analog power supply current
(RVDD + AVDD + ADVDD)
Digital power supply current (DVDD)
Current consumption in flash
AREGPD = 0, SBIAS IOUT = 0 mA
IDDA2
SENSPD = 1, SLP = 0, AREGPD = 0
0.35
0.5
mA
IDDD1
During A/D conversion
0.25
0.4
mA
IDDD2
When reading from flash memoryNote
1.3
1.7
mA
When writing to flash memory
1.2
3
mA
1.2
2
mA
IDDF1
10C  TA  85C
memory programming
(IOVDD + DVDD)
IDDF2
When erasing flash memory
10C  TA  85C
Note
The current consumption under the condition that some data are written to flash memory.
Caution Flash memory programming refers to erasing or writing of data in the flash memory.
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RAA730101
15.4
15. Electrical Specifications
Electrical specifications of each block
Programmable gain instrumentation amplifier and 16-bit ∆Σ A/D converter
15.4.1
Analog input in differential input mode
Parameter
Full-scale differential input voltage
Symbol
VID
range
Input voltage range
VI
Conditions
Min.
Typ.
VID = (AINxP  AINxN)
± 700
(x = 1, 2, 3, 4)
/GTOTAL
Each of AINxP and AINxN pins
Max.
Unit
mV
0.2
1.6
V
0.2 + (|VID|x
1.6  (|VID|x
V
GSET1)/2
GSET1)/2
(x = 1, 2, 3, 4)
Common mode input voltage
Input impedance
VCOM
dOFR = 0 mV
ZIN
5
M
Analog input in single-ended input mode
Parameter
Symbol
Input voltage
VI
Input impedance
ZIN
Conditions
Min.
GSET1 = 1, GSET2 = 1
Typ.
0.2
Max.
Unit
1.6
V
5
M
Programmable gain instrumentation amplifier and 16-bit ∆Σ A/D converter (1/2)
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Sampling frequency
FS
Output data rate
FDATA
Gain setting range
GTOTAL
1st gain setting range
GSET1
1, 2, 3, 4, 8
V/V
2nd gain setting range
GSET2
1, 2, 4, 8
V/V
Offset adjustment bit range
dOFFB
5
bit
Offset adjustment range
dOFR
Referred to input
Offset adjustment steps
dOFS
Referred to input
Remark
1
Unit
GTOTAL = GSET1 x GSET2
MHz
(0.48828)
(15.625)
ksps
1
32
V/V
175/GSET1
+164/GSET1
11/GSET1
mV
mV
In the specification column, values in parentheses are the target design values and therefore are not tested for
shipment.
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RAA730101
15. Electrical Specifications
Programmable gain instrumentation amplifier and 16-bit ∆Σ A/D converter (2/2)
Parameter
Gain error
Gain drift
Symbol
Conditions
dEG
Typ.
10
EG
Note
Min.
GSET1 = 1, GSET2 = 1
Max.
Unit
10
%
(22)
ppm/C
5
mV
(16)
V/C
Excluding SBIAS drift
Offset error
EOS
GSET1 = 1, GSET2 = 1
Offset drift
dEOS
GSET1 = 1, GSET2 = 1
S/N
SNR
GSET1 = 1, GSET2 = 1
Note
5
82
85
dB
40
60
dB
(60)
(70)
dB
3.8
4
Excluding MEMS noise
Common mode rejection ratio
CMRR
fin = 50 Hz, GSET1 = 1, GSET2 = 1
Power supply rejection ratio
PSRR
AVDD = 3.0 V + 0.1 Vpp ripple
fin = 50 Hz, GSET1 = 1, GSET2 = 1
A/D converter input clock frequency
Note
fADC
EXTCLK = 1
4.2
MHz
Calculate the gain drift and offset drift by using the following expression:
(for 125 C models)
For gain drift: (MAX(EG(T(-40) to T(125)))  MIN(EG(T(-40) to T(125)))) / (125C  (40C))
For offset drift: (MAX(EOS(T(-40) to T(125)))  MIN(EOS(T(-40) to T(125)))) / (125C  (40C))
MAX(EG(T(-40) to T(125)): The maximum value of gain error when the temperature range is 40C to 125C
MIN(EG(T(-40) to T(125)): The minimum value of gain error when the temperature range is 40C to 125C
MAX(EOS(T(-40) to T(125)): The maximum value of offset error when the temperature range is 40C to 125C
MIN(EOS(T(-40) to T(125)): The minimum value of offset error when the temperature range is 40C to 125C
(for 105 C models)
For gain drift: (MAX(EG(T(-40) to T(105)))  MIN(EG(T(-40) to T(105)))) / (105C  (40C))
For offset drift: (MAX(EOS(T(-40) to T(105)))  MIN(EOS(T(-40) to T(105)))) / (105C  (40C))
MAX(EG(T(-40) to T(105)): The maximum value of gain error when the temperature range is 40C to 105C
MIN(EG(T(-40) to T(105)): The minimum value of gain error when the temperature range is 40C to 105C
MAX(EOS(T(-40) to T(105)): The maximum value of offset error when the temperature range is 40C to 105C
MIN(EOS(T(-40) to T(105)): The minimum value of offset error when the temperature range is 40C to 105C
Remark
In the specification column, values in parentheses are the target design values and therefore are not tested for
shipment.
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RAA730101
15. Electrical Specifications
Internal reference voltage generator (VREF)
15.4.2
(COUT = 0.1 F)
Parameter
Symbol
Output voltage
VOUT
Turn-on time
TON
Remark
Conditions
Min.
Typ.
Max.
Unit
0.76
0.8
0.84
V
(550)
s
Max.
Unit
2.2
V
VOUT > 90%
Values in parentheses are the target design values and therefore are not tested for shipment.
Sensor power supply (SBIAS)
15.4.3
(COUT = 0.22 F)
Parameter
Symbol
Output voltage range
VOUT
Output voltage setting steps
VSTEP
Output voltage range
VA
Output current
IOUT
Output current limit
ILIMIT
Short-circuit current
ISHORT
Load regulation
LR
Power supply rejection ratio
PSRR
Conditions
Min.
Typ.
1.2
0.1
0 mA ≤ IOUT ≤ 5 mA
5
V
+5
5
VOUT = 0 V
mA
(40)
(60)
mA
40
65
mA
15
mV
0 mA ≤ IOUT ≤ 5 mA
AVDD = 3.0 V + 0.1 Vpp ripple
(45)
%
(50)
dB
f = 100 Hz, IOUT = 2.5 mA
Turn-on time
TON
VOUT > 90%
(250)
μs
Turn-off time
TOFF
VOUT < 10%
(5)
ms
Remark
Values in parentheses are the target design values and therefore are not tested for shipment.
AREG (AVDD/IOVDD power supply circuit)
15.4.4
(COUT = 0.47 F)
Parameter
Symbol
Conditions
0 mA ≤ IOUT ≤ 50 mA
Output voltage
VOUT
Output current
IOUT
Output current limit
ILIMIT
Short-circuit current
ISHORT
VOUT = 0 V
Load regulation
LR
1 mA ≤ IOUT ≤ 50 mA
Power supply rejection ratio
PSRR
RVDD = 5.0 V + 0.1 Vpp ripple
Min.
Typ.
Max.
Unit
2.85
3
3.15
V
50
(35)
mA
(110)
(150)
mA
40
65
mA
40
mV
(45)
dB
f = 100 Hz, IOUT = 25 mA
Turn-on time
TON
RVDD ≥ 3.3 V,
(1800)
μs
VOUT > 90%, IOUT = 0 mA
Remark
Values in parentheses are the target design values and therefore are not tested for shipment.
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Feb 27, 2015
Page 94 of 105
RAA730101
15. Electrical Specifications
CREG (ADVDD/DVDD power supply circuit)
15.4.5
(COUT = 0.22 F, in normal operating mode)
Parameter
Symbol
Conditions
0 mA ≤ IOUT ≤ 20 mA
Output voltage
VOUT
Output current
IOUT
Output current limit
ILIMIT
Short-circuit current
ISHORT
VOUT = 0 V
Load regulation
LR
1 mA ≤ IOUT ≤ 20 mA
Power supply rejection ratio
PSRR
AVDD = 3.0 V + 0.1 Vpp ripple
Min.
Typ.
Max.
Unit
2
2.1
2.2
V
20
(45)
mA
(60)
(90)
mA
40
65
mA
20
mV
(50)
dB
f = 100 Hz, IOUT = 10 mA
Turn-on time
TON
VOUT > 90%, IOUT = 0 mA
(700)
μs
(5)
ms
including VREF turn-on time
Turn-off time
TOFF
VOUT < 10%, IOUT = 0 mA
Mode switching time 1
TSW1
Operating to Standby
(400)
μs
Mode switching time 2
TSW2
Standby to Operating
(150)
μs
Excluding VREF turn-on time
Remark
Values in parentheses are the target design values and therefore are not tested for shipment.
(COUT = 0.22 F, on standby)
Parameter
Symbol
Output voltage
VOUT
Output current
IOUT
R02DS0014EJ0200 Rev.2.00
Feb 27, 2015
Conditions
0 mA ≤ IOUT ≤ 2 mA
Min.
Typ.
Max.
Unit
2
2.1
2.2
V
2
mA
Page 95 of 105
RAA730101
15.4.6
15. Electrical Specifications
Power-on-reset (POR) circuit
ADET (AREG/RVDD voltage monitor and detector)
Parameter
Symbol
Removal voltage
VPOR
Detection voltage 1
VPDR1
Conditions
Min.
Typ.
Max.
Unit
When AREG output voltage rises
2.4
2.5
2.6
V
When AREG output voltage falls
2.2
2.3
2.4
V
2.2
2.3
2.4
V
Min.
Typ.
Max.
Unit
AREGPD = 0
Detection voltage 2
VPDR2
When RVDD input voltage falls
AREGPD = 1
CDET (CREG voltage monitor and detector)
Parameter
Symbol
Conditions
Removal voltage
VPOR
When CREG output voltage rises
1.82
1.9
1.98
V
Detection voltage
VPDR
When CREG output voltage falls
1.75
1.83
1.91
V
Min.
Typ.
Max
Unit
(2.1)
(1.8)
(1.5)
mV/C
580
680
780
mV
15.4.7
Temperature sensor
Parameter
Symbol
Temperature coefficient for sensor
TCSNS
Temperature sensor output voltage
VTEMP
Remark
Conditions
TA = 25C
Values in parentheses are the target design values and therefore are not tested for shipment.
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Feb 27, 2015
Page 96 of 105
RAA730101
15.4.8
15. Electrical Specifications
Internal system clock (OSC) oscillator
Parameter
Clock frequency
15.4.9
Symbol
Conditions
fOSC
Min.
Typ.
Max.
Unit
19
20
21
MHz
Min.
Typ.
Max.
Unit
Flash memory
(10C  TA  85C, 4.5 (4.6) VNote  IOVDD  RVDD  5.5 V)
Parameter
Symbol
Conditions
Erase time
TER
(5)
ms
Write time
TWR
(100)
μs
Number of rewrite times
CEW
(100)
Times
Data retention period
TDR
(10)
Years
Note
Specify the voltage to be applied according to the power supply configuration used. For details, see 9 Power
Supply Configuration and see 15.2 Operating conditions about the power supply voltage ranges.
Remark
Values in parentheses are the target design values and therefore are not tested for shipment.
15.4.10 Digital I/O
Parameter
Input voltage, high
Input voltage, low
Symbol
VIH
VIL
Conditions
Min.
CS_B, SCLK, MOSI_RX, SMODE
0.7 
MCLK (EXTCLK = 1)
IOVDD
CS_B, SCLK, MOSI_RX, SMODE
0
MCLK (EXTCLK = 1)
Output voltage, high
VOH
Typ.
Max.
Unit
IOVDD
V
0.3 
V
IOVDD
MISO_TX, TX_B, INT,
IOVDD
MCLK, IOH = 1 mA,
 0.5
IOVDD
V
0
0.4
V
0
0.7
V
1
1
μA
2.7 V ≤ IOVDD ≤ 5.5 V
Output voltage, low 1
VOL1
MISO_TX, TX_B, INT,
MCLK, IOL = 1 mA,
2.7 V ≤ IOVDD ≤ 5.5 V
Output voltage, low 2
VOL2
Input leakage current
IINL
MISO_TX, IOL = 5 mA,
2.7 V ≤ IOVDD ≤ 5.5 V
CS_B, SCLK, MOSI_RX, SMODE
MCLK (EXTCLK = 1)
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Feb 27, 2015
Page 97 of 105
RAA730101
15. Electrical Specifications
SPI access timing
15.5
CS_B
Tcssu
Tcshd
Tckpd
Tcshw
SCLK
Twdsu Twdhd
Tckhw
Tcklw
MOSI_RX
Trddly
MISO_TX
Trddly
Trdrel
High impedance
Figure 15.1 SPI access timing
IOVDD = 2.7 V to 5.5 V, C = 15 pF
Symbol
Description
Min.
Typ.
Max.
Unit
Tcssu
From CS_B to first SCLK or to first SCLK
20
ns
Tcshd
From SCLK to CS_B
20
ns
Tcshw
CS_B high-level width between transfers
80
ns
Tckpd
SCLK clock cycle
200 (500)Note
ns
Tckhw
SCLK high-level width
80
ns
Tcklw
SCLK low-level width
80
ns
Twdsu
MOSI_RX setup time (to SCLK)
20
ns
Twdhd
MOSI_RX hold time (from SCLK)
20
ns
Trddly
From SCLK to MISO_TX stabilizes
40
ns
Trdrel
From CS_B to MISO_TX released
40
ns
Note
The maximum clock cycle of the burst read access to the flash memory is 2 MHz.
R02DS0014EJ0200 Rev.2.00
Feb 27, 2015
Page 98 of 105
RAA730101
15. Electrical Specifications
Cumulative power-on time and wake-up time
15.6
CPSOR = SDCOR = 0
Wake-up time (s)
Power-on time (s)
During SPI
communication
During UART
communication
(SMODE = 1)
(SMODE = 0)
Until serial communication is ready
(3300)
–
–
Until A/D conversion is ready
(3570)
(820)
(270)
(3698 + 3T) Note
(948 + 3T) Note
(398 + 3T) Note
Until the first A/D conversion ends
Based on
Note
SLP = 1 → 0
Power-on
T: Sampling time (= 1/fOUT)
Values in parentheses are the target design values and therefore are not tested for shipment.
Remark
The figure 15.2 shows the status transition at power-on and the figure 15.3 shows the status transition at wake-up.
Estimate the cumulative power-on time and wake-up time referring to the figure 15.2 and to the figure 15.3. It is possible
to make a sufficient allowance of time as a safety margin according to the actual system of use. For details about each
function in the figures below, see the relevant section described about that function.
In the figures below, it is assumed that ADSTART is set to 1 during the SBIAS stabilization time. If ADSTART is not set
to 1 during that time, the timing when the actual A/D conversion starts is delayed according to the timing when
ADSTART is set to 1.
Power-on
AREG/CREG
stabilization time
Ready for serial communication
OSC
stabilization time
Ready for A/D
conversion
Reading
trimming data
CPSOR
processing
Skipped if
CPSOR = 0
SDCOR
processing
Skipped if
SDCOR = 0
ADSTART = 1
SBIAS
stabilization time
Result of 1st A/D
conversion
A/D converter
settling time
tSDCOR
2500µs
250µs
550µs
(50µs)
(570ms)
270µs
128µs + 3T
Figure 15.2 Cumulative power-on time
R02DS0014EJ0200 Rev.2.00
Feb 27, 2015
Page 99 of 105
RAA730101
15. Electrical Specifications
SPI mode (SMODE = 1)
UART mode (SMODE = 0)
SLP = 0
SLP = 0
Exit from low-power mode
Exit from low-power mode
CREG stabilization time
CREG stabilization
time
Ready for A/D conversion
VREF power on
Ready for A/D conversion
OSC stabilization time
ADSTART = 1
SBIAS stabilization time
ADSTART = 1
Result of 1st A/D
conversion
A/D converter
settling time
550µs
270µs
Result of 1st A/D
conversion
SBIAS stabilization time
128µs + 3T
A/D converter
settling time
270µs
128µs + 3T
Figure 15.3 Cumulative wake-up time
The example is added for explanation about the time required for SDCOR processing.
As the time required for SDCOR processing varies depending on the UART setting, calculate the SDCOR processing
time by using the following equation:
tSDCOR [sec.] = (1/baud rate [bps])  packet length [bits]  (256 + 4) [packets]
In the figure 15.2, it is assumed that baud rate is 4.8 kbps, no parity bit, number of stop bits is 1, and then
tSDCOR [sec.] = (1 / 4800)  10  (256 + 4) = 0.54 [sec.]
Considering the accuracy of clock frequency, add about +5% of 0.54 [sec.] as a safety margin and use the resulting 0.57
[sec.] for the setting.
R02DS0014EJ0200 Rev.2.00
Feb 27, 2015
Page 100 of 105
RAA730101
16. Chip Identification
16.
Chip Identification
16.1
Overview
The RAA730101 has a chip identification register.
16.2
Register for chip identification
The following register is used for chip identification.
 Chip identification register (CHIPID)
(1) Chip identification register (CHIPID)
This is a read-only register storing chip ID. The initial value is 3AH.
Address: 00H After reset: 3AH R/
CHIPID
7
6
5
4
3
2
1
0
0
0
1
1
1
0
1
0
R02DS0014EJ0200 Rev.2.00
Feb 27, 2015
Page 101 of 105
17. Package Drawings
RAA730101
17.
Package Drawings
4 × 4 mm/36-pin FBGA (0.50 mm pitch)
JEITA Package code
RENESAS code
P-TFBGA36-4x4-0.50
PTBG0036KA-A
E
Previous
code
MASS(TYP.)[g]
P36F1-50-AA6
0.027
w S B
INDEX AREA
D
w S
y1
S
A
A
S
y
A1
S
ZE
B
Referance
Symbol
F
ZD
E
A
Min
Nom
Max
D
3.90
4.00
4.10
E
3.90
4.00
4.10
0.17
0.22
0.27
A
A1
D
Dimension in Millimeters
1.10
e
0.50
C
b
B
x
0.05
y
0.08
y1
0.20
A
e
1
3
2
b
5
4
6
M
0.31
ZD
0.75
ZE
0.75
w
x
0.26
0.36
0.20
S AB
2013 Renesas Electronics Corporation. All rights reserved.
R02DS0014EJ0200 Rev.2.00
Feb 27, 2015
Page 102 of 105
RAA730101
Characteristics Curve (TA = 25C, TYP.) (reference value)
 Programmable gain instrumentation amplifier and 16-bit ∆Σ A/D converter
RVDD = IOVDD = 5.0V, AVDD = 3.0V, ADVDD = DVDD = 2.1V,
differential input mode, FS = 1MHz, SBIAS = 1.2V, dOFR = 0mV, GTOTAL=1
Time Trend
15
OSR = 256, FDATA = 3.90625ksps
13
13
12
12
11
10
9
11
10
9
8
8
7
7
6
6
5
0
200
400
600
800
OSR = 2048, FDATA = 0.48828ksps
14
Output Code
Output Code
14
Time Trend
15
5
0
1000
200
Time (Reading Number)
Noise Histogram
100
70
70
Occurrence
Occurrence
80
50
40
50
40
30
20
20
10
10
5
6
7
8
9
10 11 12 13 14 15
Output Code
R02DS0014EJ0200 Rev.2.00
Feb 27, 2015
1000
60
30
0
800
OSR = 2048, FDATA = 0.48828ksps
90
80
60
600
Noise Histogram
100
OSR = 256, FDATA = 3.90625ksps
90
400
Time (Reading Number)
0
5
6
7
8
9
10 11 12 13 14 15
Output Code
Page 103 of 105
RAA730101
RVDD = IOVDD = 5.0V, AVDD = 3.0V, ADVDD = DVDD = 2.1V, differential input mode, FS = 1MHz,
FDATA = 3.90625ksps, SBIAS = 1.2V, dOFR = 0mV, OSR = 256, GTOTAL=1
SNR
100
95
GTOTAL=1 : GSET1=1 x GSET1=1
GTOTAL=8 : GSET1=4 x GSET1=2
SNR [dB]
90
GTOTAL=16 : GSET1=4 x GSET1=4
85
GTOTAL=32 : GSET1=4 x GSET1=8
80
75
70
65
0
256
512
768
1024
1280
1536
1792
2048
OSR
Internal CLK frequency (OSC)
1.04
CLK frequency [MHz]
1.03
1.02
1.01
1
0.99
0.97
0.96
-50
0
50
100
150
Temperature [°C]
R02DS0014EJ0200 Rev.2.00
Feb 27, 2015
Page 104 of 105
RAA730101
 Internal reference voltage generator(VREF)
RVDD = IOVDD = 5.0V, AVDD = 3.0V, ADVDD = DVDD = 2.1V, differential input mode, FS = 1MHz,
FDATA = 3.90625ksps, SBIAS = 1.2V, dOFR = 0mV, OSR = 256, GTOTAL=1
0.804
Output from VREF pin
Output Voltage [V]
0.803
0.802
0.801
0.8
0.799
0.798
0.797
0.796
-50
0
50
100
150
Temperature [°C]
 Temperature Sensor
RVDD = IOVDD = 5.0V, AVDD = 3.0V, ADVDD = DVDD = 2.1V, differential input mode, FS = 1MHz,
FDATA = 3.90625ksps, SBIAS = 1.2V, dOFR = 0mV, OSR = 256, GTOTAL=1
0.9
Output from Temperature sensor
0.85
Output Voltage [V]
0.8
0.75
0.7
0.65
0.6
0.55
0.5
0.45
0.4
-50
0
50
100
150
Temperature [°C]
R02DS0014EJ0200 Rev.2.00
Feb 27, 2015
Page 105 of 105
Revision Record RAA730101
16-bit ∆Σ A/D converter IC with programmable gain instrumentation amplifier
Rev.
Date
Page
1.00
1.10
Mar 31, 2014
Jul 31, 2014
–
14
15
16
17
18
21
2.00
Feb 27, 2015
32
92
All
34
38
49
Description
Summary
First edition issued
Modification of description in 3.1 Function of Programmable Gain Instrumentation
Amplifier
Addition of description in 3.2 Function of Single-ended input mode
Addition of description in 3.3 Function of Single-ended input mode
Addition of description in 3.3.2 Function of Single-ended input mode
Deletion of note in A/D conversion setting register 1
・Addition of description in 4.1.3 Function of Single-ended input mode
・Addition of description in 4.1 table of Single-ended input mode
Modification of Figure in Example 1
Addition of Condition in Input voltage at single-ended input mode
The English expression has been corrected.
Addition of description in 5.1 Overview
Addition of 5.5 Note on Using the SPI
Addition of title (1) Disabling the reception by the UART and description of (2)
Reading the ADSTART bit in 6.6 Note on Using the UART
All trademarks and registered trademarks are the property of their respective owners.
EEPROM is a trademark of Renesas Electronics Corporation.
SuperFlash is a registered trademark of Silicon Storage Technology, Inc. in several countries including the United
States and Japan.
Caution: This product uses SuperFlash technology licensed from Silicon Storage Technology, Inc.
C-1
NOTES FOR CMOS DEVICES
1
VOLTAGE APPLICATION WAVEFORM AT INPUT PIN
Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the
CMOS device stays in the area between VIL (MAX) and VIH (MIN) due to noise, etc., the device may
malfunction. Take care to prevent chattering noise from entering the device when the input level is fixed,
and also in the transition period when the input level passes through the area between VIL (MAX) and
VIH (MIN).
2
HANDLING OF UNUSED INPUT PINS
Unconnected CMOS device inputs can be cause of malfunction. If an input pin is unconnected, it is
possible that an internal input level may be generated due to noise, etc., causing malfunction. CMOS
devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed
high or low by using pull-up or pull-down circuitry. Each unused pin should be connected to VDD or GND
via a resistor if there is a possibility that it will be an output pin. All handling related to unused pins must
be judged separately for each device and according to related specifications governing the device.
3
PRECAUTION AGAINST ESD
A strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and
ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as
much as possible, and quickly dissipate it when it has occurred.
Environmental control must be
adequate. When it is dry, a humidifier should be used. It is recommended to avoid using insulators that
easily build up static electricity. Semiconductor devices must be stored and transported in an anti-static
container, static shielding bag or conductive material. All test and measurement tools including work
benches and floors should be grounded.
The operator should be grounded using a wrist strap.
Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for
PW boards with mounted semiconductor devices.
4
STATUS BEFORE INITIALIZATION
Power-on does not necessarily define the initial status of a MOS device. Immediately after the power
source is turned ON, devices with reset functions have not yet been initialized. Hence, power-on does
not guarantee output pin levels, I/O settings or contents of registers. A device is not initialized until the
reset signal is received. A reset operation must be executed immediately after power-on for devices
with reset functions.
5
POWER ON/OFF SEQUENCE
In the case of a device that uses different power supplies for the internal operation and external
interface, as a rule, switch on the external power supply after switching on the internal power supply.
When switching the power supply off, as a rule, switch off the external power supply and then the
internal power supply. Use of the reverse power on/off sequences may result in the application of an
overvoltage to the internal elements of the device, causing malfunction and degradation of internal
elements due to the passage of an abnormal current.
The correct power on/off sequence must be judged separately for each device and according to related
specifications governing the device.
6
INPUT OF SIGNAL DURING POWER OFF STATE
Do not input signals or an I/O pull-up power supply while the device is not powered. The current
injection that results from input of such a signal or I/O pull-up power supply may cause malfunction and
the abnormal current that passes in the device at this time may cause degradation of internal elements.
Input of signals during the power off state must be judged separately for each device and according to
related specifications governing the device.
Notice
1.
Descriptions of circuits, software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples. You are fully responsible for
the incorporation of these circuits, software, and information in the design of your equipment. Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the
use of these circuits, software, or information.
2.
Renesas Electronics has used reasonable care in preparing the information included in this document, but Renesas Electronics does not warrant that such information is error free. Renesas Electronics
3.
Renesas Electronics does not assume any liability for infringement of patents, copyrights, or other intellectual property rights of third parties by or arising from the use of Renesas Electronics products or
assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein.
technical information described in this document. No license, express, implied or otherwise, is granted hereby under any patents, copyrights or other intellectual property rights of Renesas Electronics or
others.
4.
You should not alter, modify, copy, or otherwise misappropriate any Renesas Electronics product, whether in whole or in part. Renesas Electronics assumes no responsibility for any losses incurred by you or
5.
Renesas Electronics products are classified according to the following two quality grades: "Standard" and "High Quality". The recommended applications for each Renesas Electronics product depends on
third parties arising from such alteration, modification, copy or otherwise misappropriation of Renesas Electronics product.
the product's quality grade, as indicated below.
"Standard": Computers; office equipment; communications equipment; test and measurement equipment; audio and visual equipment; home electronic appliances; machine tools; personal electronic
equipment; and industrial robots etc.
"High Quality": Transportation equipment (automobiles, trains, ships, etc.); traffic control systems; anti-disaster systems; anti-crime systems; and safety equipment etc.
Renesas Electronics products are neither intended nor authorized for use in products or systems that may pose a direct threat to human life or bodily injury (artificial life support devices or systems, surgical
implantations etc.), or may cause serious property damages (nuclear reactor control systems, military equipment etc.). You must check the quality grade of each Renesas Electronics product before using it
in a particular application. You may not use any Renesas Electronics product for any application for which it is not intended. Renesas Electronics shall not be in any way liable for any damages or losses
incurred by you or third parties arising from the use of any Renesas Electronics product for which the product is not intended by Renesas Electronics.
6.
You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics, especially with respect to the maximum rating, operating supply voltage
range, movement power voltage range, heat radiation characteristics, installation and other product characteristics. Renesas Electronics shall have no liability for malfunctions or damages arising out of the
use of Renesas Electronics products beyond such specified ranges.
7.
Although Renesas Electronics endeavors to improve the quality and reliability of its products, semiconductor products have specific characteristics such as the occurrence of failure at a certain rate and
malfunctions under certain use conditions. Further, Renesas Electronics products are not subject to radiation resistance design. Please be sure to implement safety measures to guard them against the
possibility of physical injury, and injury or damage caused by fire in the event of the failure of a Renesas Electronics product, such as safety design for hardware and software including but not limited to
redundancy, fire control and malfunction prevention, appropriate treatment for aging degradation or any other appropriate measures. Because the evaluation of microcomputer software alone is very difficult,
please evaluate the safety of the final products or systems manufactured by you.
8.
Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product. Please use Renesas Electronics
products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. Renesas Electronics assumes
no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations.
9.
Renesas Electronics products and technology may not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable domestic or foreign laws or
regulations. You should not use Renesas Electronics products or technology described in this document for any purpose relating to military applications or use by the military, including but not limited to the
development of weapons of mass destruction. When exporting the Renesas Electronics products or technology described in this document, you should comply with the applicable export control laws and
regulations and follow the procedures required by such laws and regulations.
10. It is the responsibility of the buyer or distributor of Renesas Electronics products, who distributes, disposes of, or otherwise places the product with a third party, to notify such third party in advance of the
contents and conditions set forth in this document, Renesas Electronics assumes no responsibility for any losses incurred by you or third parties as a result of unauthorized use of Renesas Electronics
products.
11. This document may not be reproduced or duplicated in any form, in whole or in part, without prior written consent of Renesas Electronics.
12. Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electronics products, or if you have any other inquiries.
(Note 1)
"Renesas Electronics" as used in this document means Renesas Electronics Corporation and also includes its majority-owned subsidiaries.
(Note 2)
"Renesas Electronics product(s)" means any product developed or manufactured by or for Renesas Electronics.
http://www.renesas.com
SALES OFFICES
Refer to "http://www.renesas.com/" for the latest and detailed information.
Renesas Electronics America Inc.
2801 Scott Boulevard Santa Clara, CA 95050-2549, U.S.A.
Tel: +1-408-588-6000, Fax: +1-408-588-6130
Renesas Electronics Canada Limited
9251 Yonge Street, Suite 8309 Richmond Hill, Ontario Canada L4C 9T3
Tel: +1-905-237-2004
Renesas Electronics Europe Limited
Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K
Tel: +44-1628-585-100, Fax: +44-1628-585-900
Renesas Electronics Europe GmbH
Arcadiastrasse 10, 40472 Düsseldorf, Germany
Tel: +49-211-6503-0, Fax: +49-211-6503-1327
Renesas Electronics (China) Co., Ltd.
Room 1709, Quantum Plaza, No.27 ZhiChunLu Haidian District, Beijing 100191, P.R.China
Tel: +86-10-8235-1155, Fax: +86-10-8235-7679
Renesas Electronics (Shanghai) Co., Ltd.
Unit 301, Tower A, Central Towers, 555 Langao Road, Putuo District, Shanghai, P. R. China 200333
Tel: +86-21-2226-0888, Fax: +86-21-2226-0999
Renesas Electronics Hong Kong Limited
Unit 1601-1611, 16/F., Tower 2, Grand Century Place, 193 Prince Edward Road West, Mongkok, Kowloon, Hong Kong
Tel: +852-2265-6688, Fax: +852 2886-9022
Renesas Electronics Taiwan Co., Ltd.
13F, No. 363, Fu Shing North Road, Taipei 10543, Taiwan
Tel: +886-2-8175-9600, Fax: +886 2-8175-9670
Renesas Electronics Singapore Pte. Ltd.
80 Bendemeer Road, Unit #06-02 Hyflux Innovation Centre, Singapore 339949
Tel: +65-6213-0200, Fax: +65-6213-0300
Renesas Electronics Malaysia Sdn.Bhd.
Unit 1207, Block B, Menara Amcorp, Amcorp Trade Centre, No. 18, Jln Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia
Tel: +60-3-7955-9390, Fax: +60-3-7955-9510
Renesas Electronics India Pvt. Ltd.
No.777C, 100 Feet Road, HALII Stage, Indiranagar, Bangalore, India
Tel: +91-80-67208700, Fax: +91-80-67208777
Renesas Electronics Korea Co., Ltd.
12F., 234 Teheran-ro, Gangnam-Gu, Seoul, 135-080, Korea
Tel: +82-2-558-3737, Fax: +82-2-558-5141
© 2015 Renesas Electronics Corporation. All rights reserved.
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