MAX1576

MAX1576
MAX1576ETG
Rev. A
RELIABILITY REPORT
FOR
MAX1576ETG
PLASTIC ENCAPSULATED DEVICES
October 30, 2004
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Written by
Jim Pedicord
Quality Assurance
Reliability Lab Manager
Conclusion
The MAX1576 successfully meets the quality and reliability standards required of all Maxim products. In
addition, Maxim’s continuous reliability monitoring program ensures that all outgoing product will continue to meet
Maxim’s quality and reliability standards.
Table of Contents
I. ........Device Description
II. ........Manufacturing Information
III. .......Packaging Information
IV. .......Die Information
V. ........Quality Assurance Information
VI. .......Reliability Evaluation
......Attachments
I. Device Description
A. General
The MAX1576 charge pump drives up to 8 white LEDs with regulated constant current for uniform intensity. The
main group of LEDs (LED1-LED4) can be driven up to 30mA per LED for backlighting. The flash group of LEDs
(LED5-LED8) are independently controlled and can be driven up to 100mA per LED (or 400mA total). By utilizing
adaptive 1x/1.5x/2x charge-pump modes and very-low-dropout current regulators, the MAX1576 achieves high
efficiency over the full 1-cell lithium-battery voltage range. The 1MHz fixed-frequency switching allows for tiny
external components, and the regulation scheme is optimized to ensure low EMI and low input ripple.
The MAX1576 uses two external resistors to set the main and flash full-scale (100%) LED currents. Four control
pins are used for LED dimming by either serial control or 2-bit logic per group. ENM1 and ENM2 set the main
LEDs to 10%, 30%, or 100% of full scale. ENF1 and ENF2 set the flash LEDs to 20%, 40%, or 100% of full scale.
In addition, connect either pair of control pins together for single-wire, serial pulse dimming control.
The MAX1576 is available in a 24-pin thin QFN, 4mm x 4mm package (0.8mm max height).
B. Absolute Maximum Ratings
Item
INP, IN, OUT, ENM1, ENM2, ENF1, ENF2 to GND1
SETF, SETM, LED1, LED2, LED3, LED4, LED5,
LED6, LED7, LED8 to GND1
C1N, C2N to GND1
C1P, C2P to GND1
GND2, PGND to GND1
OUT Short Circuit to GND
Continuous Power Dissipation (TA = +70°C)
24-Pin 4mm x 4mm Thin QFN
Derates above +70°C
24-Pin 4mm x 4mm Thin QFN
Rating
-0.3V to +6.0V
-0.3V to (VIN + 0.3V)
-0.3V to (VIN + 1V)
-0.3V to Greater of (VOUT + 1V) or (VIN + 1V)
-0.3V to +0.3V
Continuous
1666mW
20.8mW/°C
II. Manufacturing Information
A. Description/Function:
480mA White LED 1x/1.5x/2x Charge Pump for Backlighting and Camera Flash
B. Process:
B8 - Standard 8 micron silicon gate CMOS
C. Number of Device Transistors:
6679
D. Fabrication Location:
California, USA
E. Assembly Location:
Thailand or Hong Kong
F. Date of Initial Production:
July, 2004
III. Packaging Information
A. Package Type:
24-Lead QFN (4x4)
B. Lead Frame:
Copper
C. Lead Finish:
Solder Plate or 100% Matte Tin
D. Die Attach:
Silver-filled Epoxy
E. Bondwire:
Gold (1.3 mil dia.)
F. Mold Material:
Epoxy with silica filler
G. Assembly Diagram:
Buildsheet # 05-9000-1122
H. Flammability Rating:
Class UL94-V0
I. Classification of Moisture Sensitivity
per JEDEC standard J-STD-020-C: Level 1
IV. Die Information
A. Dimensions:
100 X 100 mils
B. Passivation:
Si3N4/SiO2 (Silicon nitride/ Silicon dioxide)
C. Interconnect:
TiW/ AlCu/ TiWN
D. Backside Metallization:
None
E. Minimum Metal Width:
.8 microns (as drawn)
F. Minimum Metal Spacing:
.8 microns (as drawn)
G. Bondpad Dimensions:
5 mil. Sq.
H. Isolation Dielectric:
SiO2
I. Die Separation Method:
Wafer Saw
V. Quality Assurance Information
A. Quality Assurance Contacts: Jim Pedicord
Bryan Preeshl
B. Outgoing Inspection Level:
(Manager, Reliability Operations)
(Managing Director of QA)
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate: < 50 ppm
D. Sampling Plan: Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure
Rate (λ) is calculated as follows:
λ=
1 =
MTTF
1.83
(Chi square value for MTTF upper limit)
192 x 4389 x 48 x 2
Temperature Acceleration factor assuming an activation energy of 0.8eV
λ = 22.62 x 10-9
λ = 22.62 F.I.T. (60% confidence level @ 25°C)
This low failure rate represents data collected from Maxim’s reliability qualification and monitor
programs. Maxim also performs weekly Burn-In on samples from production to assure reliability of its
processes. The reliability required for lots which receive a burn-in qualification is 59 F.I.T. at a 60% confidence
level, which equates to 3 failures in an 80 piece sample. Maxim performs failure analysis on rejects from lots
exceeding this level. The Burn-In Schematic (Spec.# 06-6345) shows the static circuit used for this test. Maxim
also performs 1000 hour life test monitors quarterly for each process. This data is published in the Product
Reliability Report (RR-1M) located on the Maxim website at http://www.maxim-ic.com .
B. Moisture Resistance Tests
Maxim evaluates pressure pot stress from every assembly process during qualification of each new
design. Pressure Pot testing must pass a 20% LTPD for acceptance. Additionally, industry standard
85°C/85%RH or HAST tests are performed quarterly per device/package family.
C. E.S.D. and Latch-Up Testing
The PN55 die type has been found to have all pins able to withstand a transient pulse of ±1000V, per
Mil-Std-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device
withstands a current of ±250mA.
Table 1
Reliability Evaluation Test Results
MAX1576ETG
TEST ITEM
TEST CONDITION
Static Life Test (Note 1)
Ta = 135°C
Biased
Time = 192 hrs.
FAILURE
IDENTIFICATION
SAMPLE
SIZE
NUMBER OF
FAILURES
DC Parameters
& functionality
48
0
Moisture Testing (Note 2)
Pressure Pot
Ta = 121°C
P = 15 psi.
RH= 100%
Time = 168hrs.
DC Parameters
& functionality
77
0
85/85
Ta = 85°C
RH = 85%
Biased
Time = 1000hrs.
DC Parameters
& functionality
77
0
DC Parameters
& functionality
77
0
Mechanical Stress (Note 2)
Temperature
Cycle
-65°C/150°C
1000 Cycles
Method 1010
Note 1: Life Test Data may represent plastic D.I.P. qualification lots.
Note 2: Generic process/package data
Attachment #1
TABLE II. Pin combination to be tested. 1/ 2/
Terminal A
(Each pin individually
connected to terminal A
with the other floating)
Terminal B
(The common combination
of all like-named pins
connected to terminal B)
1.
All pins except VPS1 3/
All VPS1 pins
2.
All input and output pins
All other input-output pins
1/ Table II is restated in narrative form in 3.4 below.
2/ No connects are not to be tested.
3/ Repeat pin combination I for each named Power supply and for ground
(e.g., where VPS1 is VDD, VCC, VSS, VBB, GND, +VS, -VS, VREF, etc).
3.4
Pin combinations to be tested.
a.
Each pin individually connected to terminal A with respect to the device ground pin(s) connected
to terminal B. All pins except the one being tested and the ground pin(s) shall be open.
b.
Each pin individually connected to terminal A with respect to each different set of a combination
of all named power supply pins (e.g., VSS1, or VSS2 or VSS3 or VCC1, or VCC2) connected to
terminal B. All pins except the one being tested and the power supply pin or set of pins shall be
open.
c.
Each input and each output individually connected to terminal A with respect to a combination of
all the other input and output pins connected to terminal B. All pins except the input or output
pin being tested and the combination of all the other input and output pins shall be open.
TERMINAL C
R1
R2
S1
TERMINAL A
REGULATED
HIGH VOLTAGE
SUPPLY
S2
C1
DUT
SOCKET
SHORT
TERMINAL B
Mil Std 883D
Method 3015.7
Notice 8
TERMINAL D
R = 1.5kΩ
C = 100pf
CURRENT
PROBE
(NOTE 6)
ONCE PER SOCKET
ONCE PER BOARD
0.22 uF
0.22 uF
5 Ohms
24
23
22
21
20
19
C1P
C2P
INP
C2N
C1N
PGND
+5V
330 Ohms
1
OUT
IN 1 8
2
ENN1
SETF 1 7
3
ENN2
SETM 1 6
4
ENF1
LED1 1 5
5
ENF2
G 14
6
LED8
LED2 1 3
240 K
G2
LED6
LED5
LED4
LED3
1 uF
LED7
240 K
7
8
9
10
11
12
1 uF
DEVICES: MAX1576 (PN55)
PACKAGE: 24-QFN 4x4 THIN
MAX EXPECTED CURRENT: 23mA, Typical : 20mA
DOCUMENT I.D. 06-6345
REVISION B
NOTES:
MAXIM TITLE: BI Circuit: MAX1576 (PN55)
PAGE 2
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