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MB39C326-EVBSK-01/02
Small size Evaluation Board of 6MHz Buck-boost
DC/DC Converter IC
Operation Manual
Publication Number MB39C326-EVBSK-01/02_SS901-00022
Revision 2.0
Issue Date June 19, 2015
O p e r a t i o n
M a n u a l
Preface
This manual explains how to use the evaluation board. Be sure to read this manual before using the product. For this
product, please consult with sales representatives or support representatives.
Handling and use
Handling and use of this product and notes regarding its safe use are described in the manuals.
Follow the instructions in the manuals to use this product.
Keep this manual at hand so that you can refer to it anytime during use of this product.
Notice on this document
All information included in this document is current as of the date it is issued. Such information is subject to change
without any prior notice.
Please confirm the latest relevant information with the sales representatives.
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Caution of the products described in this document
The following precautions apply to the product described in this manual.
WARNING
Electric shock,
Damage
Electric shock,
Damage
Indicates a potentially hazardous situation which could result in death or serious injury and/or a fault in
the user’s system if the product is not used correctly.
Before performing any operation described in this manual, turn off all the power supplies to the system.
Performing such an operation with the power on may cause an electric shock or device fault.
Once the product has been turned on, do not touch any metal part of it.
Doing so may cause an electric shock or device fault.
Indicates the presence of a hazard that may cause a minor or moderate injury, damages to this product or
CAUTION
devices connected to it, or may cause to loose software resources and other properties such as data, if the
device is not used appropriately.
Before moving the product, be sure to turn off all the power supplies and unplug the cables. Watch your
Cuts, Damage
step when carrying the product. Do not use the product in an unstable location such as a place exposed to
strong vibration or a sloping surface. Doing so may cause the product to fall, resulting in an injury or
fault.
Cuts
The product contains sharp edges that are left unavoidably exposed, such as jumper plugs.
Handle the product with due care not to get injured with such pointed parts.
Do not place anything on the product or expose the product to physical shocks. Do not carry the product
Damage
after the power has been turned on.
Doing so may cause a malfunction due to overloading or shock.
Since the product contains many electronic components, keep it away from direct sunlight, high
Damage
temperature, and high humidity to prevent condensation. Do not use or store the product where it is
exposed to much dust or a strong magnetic or electric field for an extended period of time. Inappropriate
operating or storage environments may cause a fault.
Damage
Use the product within the ranges given in the specifications.
Operation over the specified ranges may cause a fault.
To prevent electrostatic breakdown, do not let your finger or other object come into contact with the
Damage
metal parts of any of the connectors. Before handling the product, touch a metal object (such as a door
knob) to discharge any static electricity from your body.
When turning the power on or off, follow the relevant procedure as described in this document. Before
Damage
turning the power on, in particular, be sure to finish making all the required connections. Furthermore,
be sure to configure and use the product by following the instructions given in this document. Using the
product incorrectly or inappropriately may cause a fault.
Because the product has no casing, it is recommended that it be stored in the original packaging.
Damage
Transporting the product may cause a damage or fault. Therefore, keep the packaging materials and use
them when re-shipping the product.
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Table of Contents
1.
2.
3.
4.
Description ..................................................................................................................................... 5
Evaluation Board Specification ....................................................................................................... 5
Block Diagram ................................................................................................................................ 6
PIN Descriptions ............................................................................................................................. 8
4.1
Input/Output Pin Descriptions .............................................................................................. 8
4.2
Jumper Descriptions............................................................................................................ 8
4.3
Setup and Verification ......................................................................................................... 8
5.
Component and Wiring Layout ....................................................................................................... 9
5.1
Component Layout .............................................................................................................. 9
5.2
Wiring Layout .................................................................................................................... 11
6.
Schematic Circuit.......................................................................................................................... 12
7.
Component List ............................................................................................................................ 14
8.
Evaluation Board Picture .............................................................................................................. 15
9.
Ordering Information..................................................................................................................... 16
10. Major Changes ............................................................................................................................. 17
Figures
Figure 1-1 Board Outline ............................................................................................................................ 5
Figure 3-1 Block Diagram for EVBSK-01 ................................................................................................... 6
Figure 3-2 Block Diagram for EVBSK-02 ................................................................................................... 7
Figure 4-1 Image of Connection ................................................................................................................. 8
Figure 5-1 Component Layout (Layer 1) .................................................................................................... 9
Figure 5-2 Component Layout (Layer 2, Top View) .................................................................................. 10
Figure 5-3 Wiring Layout (Layer 1) ............................................................................................................ 11
Figure 5-4 Wiring Layout (Layer 2, Top View) ........................................................................................... 11
Figure 6-1 Schematic Circuit for Power Save Mode ................................................................................. 12
Figure 6-2 Schematic Circuit for Fixed PWM Mode.................................................................................. 13
Figure 8-1 Picture of MB39C326-EVBSK-01 ............................................................................................ 15
Figure 8-2 Picture of MB39C326-EVBSK-02 ............................................................................................ 15
Tables
Table 2-1 Evaluation Board Specification ................................................................................................... 5
Table 4-1 Input/Output Pin Descriptions ..................................................................................................... 8
Table 4-2 Jumper Descriptions ................................................................................................................... 8
Table 7-1 Component List ........................................................................................................................ 14
Table 9-1 Ordering Information ................................................................................................................. 16
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MB39C326-EVB-01/02
Small size Evaluation Board of 6MHz Buck-boost
DC/DC converter IC
Operation Manual
1. Description
The MB39C326-EVBSK-01/02 is the small size evaluation board for the 6MHz Buck-boost DC/DC converter IC,
MB39C326. This evaluation board output preset 3.3V or can be selected the other values by DAC signal input. The
board consists of simple two layers. Two different function of boards lineup : MB39C326-EVBSK-01 for power save
mode and MB39C326-EVBSK-02 for fixed PWM.
Figure 1-1 Board Outline
2. Evaluation Board Specification
Table 2-1 Evaluation Board Specification
Item
Input voltage
Output voltage
Output current
Switching
frequency
Maximum
efficiency
Symbol
Condition
Min
Typ
Max
Unit
VIN
-
2.5
3.7
5.5
V
3.185
3.318
3.451
V
VOUT
R1 = 620 kΩ, R2 = 110 kΩ
IOUT(MAX1)
VIN = 3.3V to 5.5V, EVBSK-02
-
-
1200
mA
IOUT(MAX2)
VIN = 2.5V to 3.3V, EVBSK-02
-
-
800
mA
IOUT(MAX3)
VIN = 3.3V to 5.5V, EVBSK-01, ILIMSEL = H
-
-
600
mA
IOUT(MAX4)
VIN = 2.5V to 3.3V, EVBSK-01, ILIMSEL = H
-
-
500
mA
FREQUENCY
-
5.2
5.8
6.4
MHz
EFFICIENCY
-
-
93
-
%
0.0
-
0.25
V
1.5
-
VIN
V
Signal input
VIL
threshold voltage
VIH
EN, ILIMSEL
Board size: 12.7 mm × 7.62 mm, Component height 1mm max
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3. Block Diagram
Figure 3-1 Block Diagram for EVBSK-01
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Figure 3-2 Block Diagram for EVBSK-02
L1
SWOUT
VIN
VDD
C1
SWIN
SW5
SW1
Current
Sensor
VOUT
VOUT
C3
SW4
SW2
SW3
DGND
C2
VCC
DAC
Gate Controller
EN
EN
ILIMSEL
XPS
Device
Control
BGR
UVLO
AGND
Err
Amp
FB
VSELSW
GND1
Over Temp
Protection
R1
R3
R2
Oscillator
GND2
VSEL
< EVBSK-02 >
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4. PIN Descriptions
4.1
Input/Output Pin Descriptions
Table 4-1 Input/Output Pin Descriptions
Terminal
I/O
Description
VIN
I
Power supply terminal
VOUT
O
EN
I
DAC
I
Output terminal
IC enable terminal
EN = H : Enable
EN = L : Shutdown
Output voltage setting terminal (DAC signal input)(*1)
ILIMSEL
I
GND1
GND2
-
Inductor peak current select terminal (EVBSK-01)(*2)
ILIMSEL = H : Inductor peak current value(IPK)= 1.3A
ILIMSEL = L : Inductor peak current value(IPK)= 0.49A
Input GND terminal
Output GND terminal
*1: Please refer the MB39C326 datasheet for setting output voltage by DAC.
*2: EVBSK-01: MB39C326 XPS pin is set to L, ILIMSEL pin is set to H and output current limit value(IPK) =
1.3A at ILIMSEL = H and 0.49A at ILIMSEL = L.
EVBSK-02: MB39C326 XPS pin is set to H, ILIMSEL pin is set to L and inductor peak current value(IPK) =
3.2A.
4.2
Jumper Descriptions
Table 4-2 Jumper Descriptions
Jumper
Description
JP2
4.3
Initial
H: MB39C326 ILIMSEL pin is short to VIN.
(L) : MB39C326 ILIMSEL pin is shorted to GND.
Short to
VIN
Setup and Verification
1. Connect the power supply between VIN and GND1. EN is connected to VIN.
2. 3.3V is output to VOUT terminal after power is supplied.
Low impedance power supply is recommended to use. The power supply line can be stable at evaluation when some
capacitor is connected to the line.
Figure 4-1 Image of Connection
Power
supply
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EN
DAC
VIN
VOUT
GND1
GND2
Multimeter
 load etc.
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5. Component and Wiring Layout
5.1
Component Layout
Figure 5-1 Component Layout (Layer 1)
<EVBSK-01>
<EVBSK-02>
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Figure 5-2 Component Layout (Layer 2, Top View)
<EVBSK-01>
<EVBSK-02>
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Wiring Layout
Figure 5-3 Wiring Layout (Layer 1)
<EVBSK-01>
<EVBSK-02>
Figure 5-4 Wiring Layout (Layer 2, Top View)
<EVBSK-01/02>
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6. Schematic Circuit
Figure 6-1 Schematic Circuit for Power Save Mode
L1
B1
VIN
EN
VIN
GND1
B2
A1
A2
C1
VIN
10μF
A3
VIN
C2
JP2
B3
0.1μF
0.47μH
M1
SWOUT1
SWIN1
SWOUT2
SWIN2
VDD1
VOUT1
VDD2
VOUT2
D1
D2
E2
FB
C3
D3
E4
R3
330kΩ
R2
110kΩ
C4 VSEL
ILIMSEL
R1
620kΩ
E3
A4 EN
B4
C3
22μF
XPS
VCC
DAC
VOUT
GND2
E1
VSELSW
D4
GND1_1
GND1_2
DGND1
GND2
DGND2
C1
C2
MB39C326
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Figure 6-2 Schematic Circuit for Fixed PWM Mode
L1
B1
VIN
EN
VIN
GND1
B2
A1
A2
C1
VIN
10μF
B3
A3
A4
C2
0.1μF
C4
B4
C3
D3
E4
M1
0.47μH
SWOUT1
SWIN1 D1
SWOUT2
SWIN2
VDD1
VOUT1
VDD2
VOUT2 E2
D2
C3
2.2μF
XPS
VCC
FB
DAC
VOUT
GND2
E1
R1
620kΩ
R3
330kΩ
E3
EN
R2
VSEL
ILIMSEL
VSELSW
D4
110kΩ
GND1_1
GND1_2
DGND1
GND2
DGND2
C1
C2
MB39C326
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7. Component List
Table 7-1 Component List
No.
Component
1
M1
PMIC
Item
MB39C326
Parts Number
Cypress
Vendor
Value
Remarks
2
L1
Inductor
GLCHKR4701A
ALPS
0.47 μH
35 mΩ, 3.7A
3
C1
Ceramic Capacitor
EMK107BBJ106MA-T
TAIYO YUDEN
10 μF
16V, X5R, 1608
4
C2
Ceramic Capacitor
UMK105BJ104KV-F
TAIYO YUDEN
0.1 μF
50V, X5R, 1005
Ceramic Capacitor
EMK105ABJ225MV-F
TAIYO YUDEN
2.2 μF
16V, X5R, 1005, EVBSK-02
-
5
C3
Ceramic Capacitor
JMK107BBJ226MA-T
TAIYO YUDEN
22 μF(*1)
6.3V, X5R, 1608, EVBSK-01
6
R1
Chip Resistor
RK73H1ETTP6203F
KOA
620 kΩ
±1.0%
7
R2
Chip Resistor
RK73H1ETTP1103F
KOA
110 kΩ
±1.0%
8
R3
Chip Resistor
RK73H1ETTP3303F
KOA
330 kΩ
±1.0%
9
JP2
Solder jumper
Cypress
ALPS
TAIYO YUDEN
KOA
JPPAD
-
-
H (Short to VIN)
: Cypress Semiconductor Corp.
: Alps Green Devices Co., Ltd
: Taiyo Yuden Co., LTD
: KOA Corporation
These components are compliant with RoHS. Please ask each vendor for details if necessary.
*1: EVBSK-01 operates by PFM mode at light load. Large output capacitor (around 22 μF) is recommended
to reduce the output ripple voltage.
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8. Evaluation Board Picture
Figure 8-1 Picture of MB39C326-EVBSK-01
<TOP>
<BOTTOM>
Figure 8-2 Picture of MB39C326-EVBSK-02
<TOP>
MB39C326-EVBSK-01/02_SS901-00022-2v0-E, June 19, 2015
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<BOTTOM>
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9. Ordering Information
Table 9-1 Ordering Information
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Part Number
EVB Revision
Note
MB39C326-EVBSK-01
Rev 1.2
---
MB39C326-EVBSK-02
Rev 1.2
---
MB39C326-EVBSK-01/02_SS901-00022-2v0-E, June 19, 2015
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10. Major Changes
Page
Section
Change Results
Revision 1.0
-
-
Initial release
Revision 2.0
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7. Component List
15
8. Evaluation Board Picture
MB39C326-EVBSK-01/02_SS901-00022-2v0-E, June 19, 2015
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Revised the Component of Component list
GLC series → GLCHKR4701A
Inserted board pictures
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MB39C326-EVBSK-01/02_SS901-00022-2v0-E, June 19, 2015
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SS901-00022-2v0-E
Cypress  Operation Manual
MB39C326-EVBSK-01/02
Evaluation Board of 6MHz Buck-boost DC/DC Converter IC
Operation Manual
June 2015 Rev. 2.0
Published: Cypress Semiconductor Corp.
Edited:
Communications
MB39C326-EVBSK-01/02_SS901-00022-2v0-E, June 19, 2015
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Colophon
The products described in this document are designed, developed and manufactured as contemplated for general use, including without
limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and
manufactured as contemplated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could
have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear
reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile
launch control in weapon system), or (2) for any use where chance of failure is intolerable (i.e., submersible repeater and artificial
satellite). Please note that Cypress will not be liable to you and/or any third party for any claims or damages arising in connection with
above-mentioned uses of the products. Any semiconductor devices have an inherent chance of failure. You must protect against injury,
damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire
protection, and prevention of over-current levels and other abnormal operating conditions. If any products described in this document
represent goods or technologies subject to certain restrictions on export under the Foreign Exchange and Foreign Trade Law of Japan,
the US Export Administration Regulations or the applicable laws of any other country, the prior authorization by the respective
government entity will be required for export of those products.
Trademarks and Notice
The contents of this document are subject to change without notice. This document may contain information on a Cypress product under
development by Cypress. Cypress reserves the right to change or discontinue work on any product without notice. The information in
this document is provided as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for
particular purpose, merchantability, non-infringement of third-party rights, or any other warranty, express, implied, or statutory. Cypress
assumes no liability for any damages of any kind arising out of the use of the information in this document.
Copyright © 2014-2015 Cypress Semiconductor Corp. All rights reserved. Cypress, the Cypress logo, Spansion®, the Spansion logo,
MirrorBit®, MirrorBit® EclipseTM, ORNANDTM , Easy DesignSimTM, TraveoTM and combinations thereof, are trademarks and registered
trademarks of Cypress Semiconductor Corp. in the United States and other countries. Other names used are for informational purposes
only and may be trademarks of their respective owners.
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