TVS Diode Array SPA SP3050 Datasheet
TVS Diode Arrays (SPA™ Family of Products)
Lightning Surge Protection - SP3050 Series
SP3050 Series 6V 10A Rail Clamp Array
Pb GREEN
RoHS
The SP3050 integrates low capacitance rail-to-rail diodes
with an additional zener diode to protect each I/O pin
against ESD and high surge events. This robust device can
safely absorb surge current per IEC61000-4-5 (tP=8/20µs)
without performance degradation and a minimum ±20kV
ESD per IEC61000-4-2. Their very low loading capacitance
also makes them ideal for protecting high speed signal pins.
Features
•ESD,IEC61000-4-2,
±20kV contact, ±30kV air
•EFT,IEC61000-4-4,40A
(5/50ns)
•Lightning,IEC61000-4-5,
10A (8/20μs)
Pinout
GND
VCC
I/O 2
I/O 3
Applications
Functional Block Diagram
6
5
•Firewire
•SetTopBoxes
•FlatPanelDisplays
•PortableMedical
•LCD/PDPTVs
•Monitors
•Notebooks
•10/100/1000Ethernet
Unused
Application Examples
TX +
10/100
Ethernet
PHY
Unused
TX +
USB Dual Port Protection
1
RT
TX -
USB
RX +
Controller
RT
2
5
3
4
CT
D+
VCC
R
GND
75
CT
VBUS
T
D+
D-
CT
RJ45
Unused
TX +
RX +
USB
Port
GND
10/100/1000 Ethernet Protection
TX -
Unused
75 VBUS75
RT
GND
10/100/1000
Ethernet
PHY
USB
Port
RX RX +
D-
Unused
VCC
3
VBUS
SP3050-04HTG
CT
75
2
TX -
VBUS
6
SP3050-04HTG
VBUS
RX -
1
RJ45
10/100 Ethernet Differential Protection
4
To Twisted-Pair Network
I/O 4
Unused
TX +
TX -
1
6
2
5
3
4
RX +
RX -
SP3050-04HTG
Unused
To Twisted-Pair Network
I/O 1
•Lowcapacitanceof2pF
(TYP) per I/O
•Lowleakagecurrentof
0.5μA (MAX) at 5V
•SmallSOT23-6packaging
Unused
75
75
75
75
RX VCC
VCC
Life Support Note:
Not Intended for Use in Life Support or Life Saving Applications
GND
The products shown herein are not designed for use in life sustaining or life saving
applications unless otherwise expressly indicated.
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
129
Revision: June 27, 2011
SP3050 Series
SP3050
Description
TVS Diode Arrays (SPA™ Family of Products)
Lightning Surge Protection - SP3050 Series
Thermal Information
Absolute Maximum Ratings
Symbol
Parameter
Value
Parameter
Rating
Units
-65 to 150
°C
Maximum J unction Temperature
150
°C
Maximum L ead Temperature
(Soldering 20-40s)
260
°C
Units
IPP
Peak Current (tp=8/20μs)
10
A
PPK
Peak Pulse Power (tp=8/20μs)
150
W
TOP
Operating Temperature
-40 to 85
°C
TSTOR
Storage Temperature
-50 to 150
°C
1
Storage Temperature R ange
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.
1
Non-repetitive pulse per waveform on page 3
Electrical Characteristics (TOP=25ºC)
Parameter
Reverse Standoff Voltage
Symbol
Test Conditions
VRWM
IR ≤ 1µA
VR
IR = 1mA
ILEAK
VR=5V
Reverse Voltage Drop
Reverse Leakage Current
Min
Typ
Clamp Voltage
VC
RDYN
ESD Withstand Voltage1
VESD
CI/O-GND
Diode Capacitance1
CI/O-I/O
V
0.5
µA
IPP=1A, tp=8/20µs, I/O to GND
8.8
10.0
V
IPP=5A, tp=8/20µs, I/O to GND
11.5
13.0
V
IPP=8A, tp=8/20µs, I/O to GND
13.2
15.0
V
(VC2 - VC1) / (IPP2 - IPP1)
0.7
2
Diode Capacitance1
V
0.1
2
Dynamic Resistance
Units
6.0
8.0
2
1
Max
Ω
IEC61000-4-2 (Contact)
±20
kV
IEC61000-4-2 (Air)
±30
kV
Reverse Bias=0V
2.4
3.0
pF
Reverse Bias=1.65V
2.0
pF
Reverse Bias=0V
1.2
pF
Notes: 1 Parameter is guaranteed by design and/or device characterization.
2
Repetitive pulse per waveform on page 3.
Product Characteristics
Clamping Voltage vs. IPP
20.0
18.0
Clamp Voltage (VC )
16.0
14.0
12.0
Lead Plating
Matte Tin
Lead Material
Copper Alloy
Lead Coplanarity
0.0004 inches (0.102mm)
Subsitute Material
Silicon
Body Material
Molded Epoxy
Flammability
UL94-V-0
10.0
8.0
6.0
4.0
Notes :
2.0
1. All dimensions are in millimeters
0.0
1
2
3
4
5
6
7
8
9
2. Dimensions include solder plating.
10
3. Dimensions are exclusive of mold flash & metal burr.
Peak Pulse Current-IPP (A)
4. All specifications comply to JEDEC SPEC MO-223 Issue A
5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.
6. Package surface matte finish VDI 11-13.
SP3050 Series
130
Revision: June 27, 2011
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
TVS Diode Arrays (SPA™ Family of Products)
Lightning Surge Protection - SP3050 Series
Capacitance vs. Reverse Bias
Pulse Waveform
3.0
110%
100%
2.5
90%
80%
VCC =3.3V
VCC =5V
1.5
1.0
70%
SP3050
2.0
Percent of IPP
Capacitance (pF)
VCC=Float
60%
50%
40%
30%
20%
0.5
10%
0%
0.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
0.0
5.0
10.0
DC Bias (V)
15.0
20.0
25.0
30.0
Time (μs)
Soldering Parameters
Pb – Free assembly
Reflow Condition
tP
Pre Heat
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 – 180 secs
Average ramp up rate (Liquidus) Temp
(TL) to peak
3°C/second max
TS(max) to TL - Ramp-up Rate
3°C/second max
Reflow
- Temperature (T L) (Liquidus)
217°C
- Temperature (t L)
60 – 150 seconds
Temperature
TP
260+0/-5 °C
Time within 5°C of actual peak
Temperature (tp)
20 – 40 seconds
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (TP)
8 minutes Max.
Do not exceed
260°C
tL
Ramp-do
Ramp-down
Preheat
TS(min)
tS
time to peak temperature
Time
Part Marking System
Part Numbering System
L*4
SP 3050 – 04 H T G
Silicon Protection
Array (SPATM)
Family of
TVS Diode Arrays
Number of
Channels
TL
TS(max)
25
Peak Temperature (T P)
Series
Critical Zone
TL to TP
Ramp-up
L*4
G= Green
Product Series
L = SP3050
Assembly Site
(Varies)
T= Tape & Reel
Package
H: SOT23-6
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
Number of Channels
Ordering Information
Part Number
Package
Marking
Min. Order Qty.
SP3050-04HTG
SOT23-6
L*4
3000
131
Revision: June 27, 2011
SP3050 Series
TVS Diode Arrays (SPA™ Family of Products)
Lightning Surge Protection - SP3050 Series
Package Dimensions — SOT23-6
Package
SOT23-6
Pins
6
JEDEC
MO-203 Issue A
Millimeters
Min
Max
Max
Notes
A
0.900
1.450
0.035
0.057
-
0.000
0.150
0.000
0.006
-
A2
0.900
1.300
0.035
0.051
-
b
0.350
0.500
0.0138
0.0196
-
C
0.080
0.220
0.0031
0.009
-
D
2.800
3.000
0.11
0.118
3
E
2.600
3.000
0.102
0.118
-
E1
1.500
1.750
0.06
0.069
3
e
0.95 Ref
0.0374 ref
e1
1.9 Ref
0.0748 Ref
0.100
0.600
0.004
10º
0º
6
N
-
0.023
6
0º
a
2.590
M
M
Min
A1
L
Recommended Solder Pad Layout
Inches
4,5
6
10º
-
0.102
-
O
0.690
.027 TYP
-
P
0.990
.039 TYP
-
R
0.950
0.038
-
Notes:
1. Dimensioning and tolerances per ANSI 14.5M-1982.
2. Package conforms to EIAJ SC-74 (1992).
3. Dimensions D and E1 are exclusive of mold flash, protrusions, or gate burrs.
4. Footlenth L measured at reference to seating plane.
5. “L” is the length of flat foot surface for soldering to substrate.
6. “N” is the number of terminal positions.
7. Controling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.
P
R
O
Embossed Carrier Tape & Reel Specification — SOT23-6
8mm TAPE AND R EEL
14.4mm
ACCESS HOLE
13mm
180mm
4.0mm
1.5mm
DIA. HOLE
2.0mm
1.75mm
CL
8mm
4.0mm
60mm
GENERAL INFORMATION
1. 3000 PIECES PER REEL.
2. ORDER IN MULTIPLES OF FULL REELS ONLY.
3. MEETS EIA-481 REVISION "A" SPECIFICATIONS.
SOT-23 (8mm POCKET PITCH)
8.4mm
USER DIRECTION OF FEED
SP3050 Series
COVER TAPE
132
Revision: June 27, 2011
PIN 1
©2011 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
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