TVS Diode Arrays (SPA™ Family of Products) Lightning Surge Protection - SP3050 Series SP3050 Series 6V 10A Rail Clamp Array Pb GREEN RoHS The SP3050 integrates low capacitance rail-to-rail diodes with an additional zener diode to protect each I/O pin against ESD and high surge events. This robust device can safely absorb surge current per IEC61000-4-5 (tP=8/20µs) without performance degradation and a minimum ±20kV ESD per IEC61000-4-2. Their very low loading capacitance also makes them ideal for protecting high speed signal pins. Features •ESD,IEC61000-4-2, ±20kV contact, ±30kV air •EFT,IEC61000-4-4,40A (5/50ns) •Lightning,IEC61000-4-5, 10A (8/20μs) Pinout GND VCC I/O 2 I/O 3 Applications Functional Block Diagram 6 5 •Firewire •SetTopBoxes •FlatPanelDisplays •PortableMedical •LCD/PDPTVs •Monitors •Notebooks •10/100/1000Ethernet Unused Application Examples TX + 10/100 Ethernet PHY Unused TX + USB Dual Port Protection 1 RT TX - USB RX + Controller RT 2 5 3 4 CT D+ VCC R GND 75 CT VBUS T D+ D- CT RJ45 Unused TX + RX + USB Port GND 10/100/1000 Ethernet Protection TX - Unused 75 VBUS75 RT GND 10/100/1000 Ethernet PHY USB Port RX RX + D- Unused VCC 3 VBUS SP3050-04HTG CT 75 2 TX - VBUS 6 SP3050-04HTG VBUS RX - 1 RJ45 10/100 Ethernet Differential Protection 4 To Twisted-Pair Network I/O 4 Unused TX + TX - 1 6 2 5 3 4 RX + RX - SP3050-04HTG Unused To Twisted-Pair Network I/O 1 •Lowcapacitanceof2pF (TYP) per I/O •Lowleakagecurrentof 0.5μA (MAX) at 5V •SmallSOT23-6packaging Unused 75 75 75 75 RX VCC VCC Life Support Note: Not Intended for Use in Life Support or Life Saving Applications GND The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. 129 Revision: June 27, 2011 SP3050 Series SP3050 Description TVS Diode Arrays (SPA™ Family of Products) Lightning Surge Protection - SP3050 Series Thermal Information Absolute Maximum Ratings Symbol Parameter Value Parameter Rating Units -65 to 150 °C Maximum J unction Temperature 150 °C Maximum L ead Temperature (Soldering 20-40s) 260 °C Units IPP Peak Current (tp=8/20μs) 10 A PPK Peak Pulse Power (tp=8/20μs) 150 W TOP Operating Temperature -40 to 85 °C TSTOR Storage Temperature -50 to 150 °C 1 Storage Temperature R ange CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. 1 Non-repetitive pulse per waveform on page 3 Electrical Characteristics (TOP=25ºC) Parameter Reverse Standoff Voltage Symbol Test Conditions VRWM IR ≤ 1µA VR IR = 1mA ILEAK VR=5V Reverse Voltage Drop Reverse Leakage Current Min Typ Clamp Voltage VC RDYN ESD Withstand Voltage1 VESD CI/O-GND Diode Capacitance1 CI/O-I/O V 0.5 µA IPP=1A, tp=8/20µs, I/O to GND 8.8 10.0 V IPP=5A, tp=8/20µs, I/O to GND 11.5 13.0 V IPP=8A, tp=8/20µs, I/O to GND 13.2 15.0 V (VC2 - VC1) / (IPP2 - IPP1) 0.7 2 Diode Capacitance1 V 0.1 2 Dynamic Resistance Units 6.0 8.0 2 1 Max Ω IEC61000-4-2 (Contact) ±20 kV IEC61000-4-2 (Air) ±30 kV Reverse Bias=0V 2.4 3.0 pF Reverse Bias=1.65V 2.0 pF Reverse Bias=0V 1.2 pF Notes: 1 Parameter is guaranteed by design and/or device characterization. 2 Repetitive pulse per waveform on page 3. Product Characteristics Clamping Voltage vs. IPP 20.0 18.0 Clamp Voltage (VC ) 16.0 14.0 12.0 Lead Plating Matte Tin Lead Material Copper Alloy Lead Coplanarity 0.0004 inches (0.102mm) Subsitute Material Silicon Body Material Molded Epoxy Flammability UL94-V-0 10.0 8.0 6.0 4.0 Notes : 2.0 1. All dimensions are in millimeters 0.0 1 2 3 4 5 6 7 8 9 2. Dimensions include solder plating. 10 3. Dimensions are exclusive of mold flash & metal burr. Peak Pulse Current-IPP (A) 4. All specifications comply to JEDEC SPEC MO-223 Issue A 5. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 6. Package surface matte finish VDI 11-13. SP3050 Series 130 Revision: June 27, 2011 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. TVS Diode Arrays (SPA™ Family of Products) Lightning Surge Protection - SP3050 Series Capacitance vs. Reverse Bias Pulse Waveform 3.0 110% 100% 2.5 90% 80% VCC =3.3V VCC =5V 1.5 1.0 70% SP3050 2.0 Percent of IPP Capacitance (pF) VCC=Float 60% 50% 40% 30% 20% 0.5 10% 0% 0.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0.0 5.0 10.0 DC Bias (V) 15.0 20.0 25.0 30.0 Time (μs) Soldering Parameters Pb – Free assembly Reflow Condition tP Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (T L) (Liquidus) 217°C - Temperature (t L) 60 – 150 seconds Temperature TP 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C tL Ramp-do Ramp-down Preheat TS(min) tS time to peak temperature Time Part Marking System Part Numbering System L*4 SP 3050 – 04 H T G Silicon Protection Array (SPATM) Family of TVS Diode Arrays Number of Channels TL TS(max) 25 Peak Temperature (T P) Series Critical Zone TL to TP Ramp-up L*4 G= Green Product Series L = SP3050 Assembly Site (Varies) T= Tape & Reel Package H: SOT23-6 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information. Number of Channels Ordering Information Part Number Package Marking Min. Order Qty. SP3050-04HTG SOT23-6 L*4 3000 131 Revision: June 27, 2011 SP3050 Series TVS Diode Arrays (SPA™ Family of Products) Lightning Surge Protection - SP3050 Series Package Dimensions — SOT23-6 Package SOT23-6 Pins 6 JEDEC MO-203 Issue A Millimeters Min Max Max Notes A 0.900 1.450 0.035 0.057 - 0.000 0.150 0.000 0.006 - A2 0.900 1.300 0.035 0.051 - b 0.350 0.500 0.0138 0.0196 - C 0.080 0.220 0.0031 0.009 - D 2.800 3.000 0.11 0.118 3 E 2.600 3.000 0.102 0.118 - E1 1.500 1.750 0.06 0.069 3 e 0.95 Ref 0.0374 ref e1 1.9 Ref 0.0748 Ref 0.100 0.600 0.004 10º 0º 6 N - 0.023 6 0º a 2.590 M M Min A1 L Recommended Solder Pad Layout Inches 4,5 6 10º - 0.102 - O 0.690 .027 TYP - P 0.990 .039 TYP - R 0.950 0.038 - Notes: 1. Dimensioning and tolerances per ANSI 14.5M-1982. 2. Package conforms to EIAJ SC-74 (1992). 3. Dimensions D and E1 are exclusive of mold flash, protrusions, or gate burrs. 4. Footlenth L measured at reference to seating plane. 5. “L” is the length of flat foot surface for soldering to substrate. 6. “N” is the number of terminal positions. 7. Controling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. P R O Embossed Carrier Tape & Reel Specification — SOT23-6 8mm TAPE AND R EEL 14.4mm ACCESS HOLE 13mm 180mm 4.0mm 1.5mm DIA. HOLE 2.0mm 1.75mm CL 8mm 4.0mm 60mm GENERAL INFORMATION 1. 3000 PIECES PER REEL. 2. ORDER IN MULTIPLES OF FULL REELS ONLY. 3. MEETS EIA-481 REVISION "A" SPECIFICATIONS. SOT-23 (8mm POCKET PITCH) 8.4mm USER DIRECTION OF FEED SP3050 Series COVER TAPE 132 Revision: June 27, 2011 PIN 1 ©2011 Littelfuse, Inc. Specifications are subject to change without notice. Please refer to www.littelfuse.com/SPA for current information.
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