STMicroelectronics product offer for mobile devices
STMicroelectronics’ product offer
for mobile devices
STMicroelectronics
www.st.com/mobile
Standard
products by
function
Sensors and human interfaces............................................... 5
MEMS.....................................................................................................5
Touch sensing..........................................................................................6
Sensors and human interface products....................................................7
Power management................................................................ 8
Linear DC-DC conversion........................................................................8
Battery management...............................................................................8
Switching DC-DC conversion...................................................................9
Power management products..................................................................9
Audio solutions..................................................................... 10
Audio ICs...............................................................................................10
Audio products......................................................................................10
Interface and interconnect devices...................................... 11
Interface ICs..........................................................................................11
Switch (NEATSwitch).............................................................................12
Microprocessor supervisors and reset ICs..............................................12
Interface and interconnect products.......................................................13
Radio frequency.................................................................... 14
IPD for RF functions...............................................................................14
Clocks and timing circuits......................................................................15
Radio frequency products......................................................................15
Microcontrollers and secure MCUs...................................... 16
Microcontrollers.....................................................................................16
Near Field Communication.....................................................................17
Microcontrollers and secure MCU products............................................17
Imaging solutions................................................................. 18
Imaging sensors....................................................................................18
EDOF – extended depth of field camera modules...................................18
Reflowable camera modules..................................................................19
SoC – system-on-chip fixed-focus camera modules...............................19
Co-processors – hardware accelerated ISP............................................20
Imaging products...................................................................................20
Protection and EMI filtering.................................................. 21
Protection devices.................................................................................21
EMI filtering............................................................................................22
Protection and EMI filtering products......................................................23
3
Microcontrollers and secure MCUs
8/32-bit microcontrollers, NFC controllers,
secure elements
Interface and
interconnected devices
High-speed SD card
interfaces, I/O expanders,
camera interfaces, analog
switches
Imaging solutions
Imaging processors,
CMOS sensors,
camera modules
Sensors and human
interfaces
Audio microphones,
accelerometers, gyroscopes,
pressure sensors, modules,
capacitive touch key controllers,
proximity sensors, touchscreen
controllers, optical finger mice
Audio solutions
Speaker amplifiers,
headphone amplifiers
Radio frequency
Couplers, diplexers, baluns, clock
distribution, real-time clocks
Power management
Protection and EMI filtering
ESD and EOS protection, EMI filtering
and common-mode filtering
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LDO regulators, Li-ion
battery management,
DC-DC converters, flash
LED drivers, backlight
drivers, OLED display power
supplies
Sensors and human interfaces
MEMS (micro electro-mechanical systems) enable unique user-interface gesture recognition and motion
detection. ST offers the widest and most complete MEMS portfolio on the market, and has shipped more than
one billion MEMS sensors.
Micro-machined accelerometers, gyroscopes and magnetic modules have enabled motion-activated user
interfaces in a number of popular consumer devices, such as game consoles, smartphones and remote controls,
making these more accessible and appealing to people.
ST is now introducing digital microphones that allow more accurate sound capture and ambient noise
cancellation. We are also introducing touch-sensor technology with multi-touch capabilities and force
movement detection.
MEMS
MEMS
Audio microphones
Accelerometers
Audio microphones
Omni-directional stereo digital
microphones with sensing elements
capable of detecting acoustic waves
and an IC interface providing PDM
stereo output
Accelerometers
Gyroscopes
Pressure sensors
Modules
Key benefits
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MEMS microphones combining high audio quality with high-volume
manufacturing capability
Wide range of motion sensors with integrated features such as sleepto-wake-up, 6D orientation and free-fall detection with programmable
interrupts
Modules integrating accelerometers with magnetometers for optimized size
and cost
MEMS inertial sensors to measure
linear acceleration: analog and
digital, up to 3 axes, with low-g and
medium-g full scale (ultra-low power,
with high performances and advanced
embedded features)
Gyroscopes
MEMS inertial sensors to measure
angular rate: analog and digital, up to 3
axes (yaw/pitch/roll)
Pressure sensors
New MEMS sensor technology
introduced for high-resolution,
absolute digital output barometers
e-compass modules
Accelerometer and magnetometer
combined to provide accurate
movement tracking for an ideal
compass solution
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Touch sensing
Touch sensing
Touch key controllers, proximity sensors
Touchscreen controllers
Capacitive touch keys
From 3 to 24 sensing channels, for simple switch to more complex slider/wheel
applications, auto calibration, high level of sensitivity, high-performance noise
immunity and proximity sensing
Resistive touchscreen controllers
Available for cost-sensitive and stylus-based products, high resolution and flexible
features, low power consumption and small package size
Capacitive touchscreen controllers
Multi-touch controller with dedicated noise-tolerant sensing hardware,
ultra-low-power operation and easy-to-use programming interface
Optical finger navigation
Optical finger motion sensor for pointer-based navigation in portable multimedia
devices, also ideal for web browsing, document scrolling and more
Proximity sensors
Ultra-low-power, small-footprint and noise-immune solution for proximity detection
(hand, ear, face...)
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Optical finger navigation
Key benefits
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Optimized solution for touch
keys for both MCU and
standalone architectures
Complete set of touchscreen
controllers for mono, dual and
multi touch devices
ST touchscreen controller
offering includes both resistive
and capacitive technology
Sensors and human interface products
MP34DB011
MP45DT01
LIS331DLF
LIS331DLM
LIS331DLH
LIS3DH
LPRxxxxx
LPYxxxxx
L3G4200D
LPS0011
LPS001WP1
LPS331AP
LSM303DLH
Audio microphones
Bottom port digital microphone
Top port digital microphone
Accelerometers
3-axis, digital 6-bit accelerometer
3-axis, digital 8-bit accelerometer
3-axis, digital 12-bit accelerometer
3-axis, digital 12-bit, ultra-low-power accelerometer
Gyroscopes
Pitch and yaw analog gyroscope family
Full scale 30 to 6000 dps
Pitch and yaw analog gyroscope family
Full scale 30 to 6000 dps
3-axis digital, full scale 250/500/2000 dps, FIFO
Temperature sensor
Pressure sensors
300 to 1100 mbar digital barometer
300 to 1100 mbar digital absolute barometer, LGA8
300 to 1100 mbar digital output barometer
Modules
e-compass module: 3-axis accelerometer and 3-axis
magnetometer
STMPE321
STMPE821
STMPExxM31
STM8L MCUs2
STM8T14x
STM8T1431
STMPE812
STMT05N11
STM32TS60
VD5376
VD53771
STLM20
STTS7511
Touch key controllers, proximity sensors
3-button capacitive touch key
8-button capacitive touch key with PWM
16-button capacitive touch key with PWM, slider/wheel
and proximity sensor
Capacitive charge library for touch keys
Single-channel touch and proximity sensors
Single-channel proximity sensor
Touchscreen controllers
4-wire resistive touchscreen controller
Capacitive multi-touch screen controller (up to 5”)
ASSP dedicated to multi-touch resistive screens, up to 10
fingers, 2.5” to ~7” touchscreens with a single chip
Optical finger navigation
Low-power optical finger motion sensor
Ultra-low-power optical finger motion sensor
Temperature sensors
Ultra low current analog temperature sensor
2.2 V low-voltage digital temperature sensor
Note:1. Under development. Target datasheet and samples available upon request.
2. SW
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Power management
As a key supplier in the field of power management, ST’s devices provide high efficiency, power density and low
standby power consumption.
ST’s high-efficiency and tiny sized illumination drivers are highly suited for mobile phones and other handheld
devices.
Our innovative LED flash controllers with enhanced diagnostics and I2C communication provides brighter flash
and higher quality pictures even under the most demanding lighting conditions.
ST’s product offer also includes complete solutions for battery charge and monitoring functions.
Linear DC-DC conversion
Linear DC-DC conversion
LDO regulators
LDO regulators
Key benefits
ST’s low drop out regulators (LDO)
offer an ultra-low quiescent current
performance and miniaturized
packages. This makes them ideal for
micro-power applications and other
applications where board space saving
is a premium.
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We offer a complete portfolio with
voltages ranging from 0.8 to 5 V and
current from 150 to 1000 mA. Many
of the regulators are also available in
dedicated low-noise versions.
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The enable pin can further reduce
current in the off state to less than 1 µA.
Ideal solutions for micro-power
applications and when board
space is at a premium
Very low quiescent current
ensuring extended battery life
in applications with a very long
standby time
Latest capacitorless LDOs
(no bypass capacitor) for PCB
space saving
Low system power
consumption with low
quiescent current
Battery management
Battery management
Li-ion battery management
Linear standalone battery
charger family
Single input from wall adapter and dual
inputs from USB and wall adapter,
programmable charging current, up to
1.1 A output current
Battery monitor ICs for gas
gauges
Monitoring of the battery voltage,
current and temperature for accurate
battery state-of-charge reporting
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Key benefits
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Complete solutions for battery
charge and monitoring
functions in handheld
applications
Easy-to-build gas gauge
system
Extended battery lifetime
Switching DC-DC conversion
Switching DC-DC conversion
DC-DC converters
Flash LED drivers
Backlight drivers
DC-DC converters
High-frequency switching, step-down,
step-up and buck-boost topology
family, ultra-small package optimized
for battery powered applications.
Flash LED drivers
ST offers a complete portfolio of highpower LED drivers for camera flash
applications. Our offer includes boost
and buck-boost topologies that ensure
optimized picture quality and battery
performance in different ambient light
conditions. In addition, I²C enables
torch and video lighting control.
Drivers for displays and LCD
backlight
Boost converter for high-brightness
LED drivers with multiple dimming
controls, high-efficiency solutions for
extended battery life.
OLED power supplies
Highly integrated power supply
family for PMOLED and AMOLED
display matrices. Optimized AMOLED
low-noise DC-DC converter ensures
excellent display accuracy and low
external component count. Negative
voltage capability via s-wire.
Key benefits
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Up to 6 MHz switching
frequency to minimize the
solution size
Wide input operating range
of 2.05 to 6 V to support
applications powered from
Li-ion batteries and extended
usage time
Low system power
consumption with high
efficiency
Several package options: chip
scale, DFN and BGA
OLED display power supplies
L1
VBAT
CIN
S-Wire
CMID
STOD0x
AMOLED
display
EN
L2
CREF
CO2
Power management products
LDO regulators
STLQ50
50 mA, IQ <6 µA
LD39115J/SJ 150 mA, IQ <30 µA, internal soft
start
LD59015
150 mA, IQ <30 µA, high PSSR
LDCL015
150 mA, IQ <100 µA,
capacitorless
LDLN015
150 mA, IQ < 100 µA, ultra LN
STLQ015
150 mA, IQ < 2 µA
LD39030SJ 300 mA, IQ <30 µA, internal soft
start
STLDLN015 150 mA, high PSRR, ultra-low
noise, ultra-low quiescent
current
Li-ion battery management
STW4102
Dual-source USB Li-ion charger
with gas gauge
STC3100
Battery monitor IC with Coulomb
counter/gas gauge
ST4078
950 mA linear programmable
dual input wall/USB Li-ion
battery charger
STC4054
800 mA linear programmable
Li-ion battery charger
STBC08
800 mA linear programmable
Li-ion battery charger
L6924D/U
1 A wall/USB charger for Li-ion
and LiP batteries
STBC21
1.2 A linear charger with battery
temperature control
STUC02
1.6 A programmable 3 MHz USB
switching charger for Li-ion and
LiP batteries
Note:1. Under development. Target datasheet and samples
available upon request.
Switching DC-DC converters
700 mA, 1.7 MHz step-down
converter
ST1S151 6 MHz step-down converter
ST14R
3 MHz step-up converter, class D
audio power
ST9R001 1200 mA step-up converter
optimized for class D audio
L6928
800 mA high-efficiency PFM/PWM
STBB21
Buck-boost converter to support
new battery generation, very low
battery input down to 2.3 V
Flash LED drivers
STCF04
High-power, SuperCap LED driver
for up to 10 A discharge
STCF05
400 mA camera flash LED driver:
drives 2 high-power LEDs in series
STCF06
1.5 A camera flash LED driver:
drives 1 high-power LED
STCF111 320 mA LED flash driver
STCF051 Driver for high-power single
LED, up to 400 mA min in 2 LEDs,
very few external components,
and very small PCB area for space
saving
Note: Possibility upon request to
increase the output current
Backlight drivers
STLA02
Step-up to 18 V @ 20 mA, 4 LEDs
STLD40D Step-up to 40 V @ 20 mA, 10 LEDs
STLD41D Step-up to 40 V @ 120 mA,
up 40 LEDs (4 x 10)
OLED display power supplies
STOD02
2.5 to 3” AMOLED displays, 150 mA
step-up and inverting 1.6 MHz PWM
STOD03
4” AMOLED displays, 200 mA
dual-channel DC-DC converter
STOD05
3 to 4” AMOLED displays, 200 mA,
dual DC-DC converter
STOD1812 PMOLED displays, step-up
converter, 10 to 120 mA
ST1S12
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Audio solutions
High-quality audio is a real plus for multimedia-rich mobile platforms. Our audio amplifier portfolio ranges from
headphone drivers offering record-breaking PSRR and THD + N performances, to class D stereo-speaker drivers
that deliver high-quality sound extremely efficiently.
Audio ICs
Audio ICs
Speaker amplifiers
Headphone amplifiers
Speaker amplifiers
Key benefits
Wide range of standalone class AB and filterless class D audio amplifiers for mono
and stereo applications with gain control, 3D sound effects and anti-clipping
Headphone amplifiers
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Very high audio quality and low power consumption with capacitorless class AB,
class G and class H architectures in tiny flip-chip packages
Speaker amplifiers: Higher
efficiency and longer battery life
with class D
Headphone amplifiers: High
audio quality and performance
in PSRR, SNR, THD+N and
high efficiency
Audio products
TS4909
TS4601
TS4621
TS46311
Headphone amplifiers
Class AB, dual-mode, low-power 150 mW stereo, capacitorless
and single-ended outputs
Class AB, high audio quality class AB stereo, I2C volume control,
board optimization with ground-referenced outputs, no external
DC blocking capacitors needed
Class G, high audio quality, stereo, I2C volume control, long
battery life due to reduced quiescent current
Class H, high audio quality, stereo, quiescent current less than
0.9 mA, integrated ESD for low cost
TS4994
TS4990
TS4997
TS4962M
TS2007
TS20091
TS2012
TS4999
TS49151
TS49161
Note:1. Under development. Target datasheet and samples available upon request.
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Speaker amplifiers
Class AB, mono, 1.2 W, differential, external gain setting, optional
fixed gain
Class AB, mono, 1.2 W, single-ended, external gain setting
Class AB, stereo, 2 x 1 W, adjustable 3D sound effect
Class D, filterless 3.0 W, mono (power @ 4 Ω load)
Class D, filterless 3 W, mono, internal adjustable gain
(power @ 4 Ω load)
Class D, filterless 3 W, mono, anti-clipping (power @ 4 Ω load)
Class D, filterless 2.2 W, stereo, gain select (power @ 4 Ω load)
Class D, filterless stereo, 3D sound effect (power @ 4 Ω load)
Class D, high-quality, low-cost mono, 1.7 W, 5.5 V boost, analog
input, battery monitoring (power @ 8 Ω load)
Class D, high-quality, low-cost mono, 1.7 W, 5.5 V boost, PDM
input, battery monitoring (power @ 8 Ω load)
Interface and interconnect devices
Interface secure digital (SD) cards with ST level translators.
Increase the number of I/O ports and enhance the control capability of existing platforms with ST’s Xpander™
technology.
Direct audio and data signals on mobile devices with audio and high-speed switches.
Improve design and user experience with smart reset devices when dedicated reset hole is not needed and
there is no need to remove battery when device freezes.
Prevent over discharging and system start-up with low battery with supervisor devices.
Interface ICs
Interface ICs
High-speed SD card interfaces
I/O expanders
Memory card interfaces
High-speed 50 Mbit/s SD level shifter supporting SDA 2.0 specification.
High-speed 120 Mbit/s SD level shifter supporting SDA 3.0 specification.
I/O expanders
I/O expanders with advanced features: keypad scanning, PWM and rotator.
General I/O expanders with 8-16 I/Os.
Camera interfaces
Deserializer for SMIA CCP1 and CCP2.
Dual mode deserializer for SMIA/CCP2 and MIPI/CSI2.
Camera interfaces
Key benefits
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Flexibility in system
design versus monolithic
implementation
Easier verification of
subsystems
Faster development time by
using discrete components
Deserializer enables use of
parallel interface baseband with
serial cameras
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Switch (NEATSwitch)
Switch (NEATSwitch)
Analog switches
Audio switches
Key benefits
For audio line multiplexing, for example between headset and phone speakers and
microphone. Special negative rail switches are used to avoid pop-noise.
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High ESD switches
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Used in applications that are directly connected to phone connectors (risk of
electrostatic discharge). ESD protection on the component reduces area on PWB
and saves time in assembly.
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Flexibility in system
design versus monolithic
implementation
Easier verification of
subsystems
Faster development time by
using discrete components
High-speed switches
SEL
For high-frequency lines such as USB and CCP (compact camera port), designed
to be compliant with USB 2.0 (HS) with bandwidth up to 950 MHz.
Multi-functional switches
Switches with additional features such as accessory detection.
Analog switch
Microprocessor supervisors and reset ICs
Microprocessor supervisors and reset ICs
Smart resets
Smart resets
Programmable push button solutions.
Hardware reset or shutdown by using
existing keys.
Smart power on/off controllers.
Supervisors
Smart voltage supervisors with on/off
controls.
Prevent over-charging and starting
system with low battery.
Key benefits
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Improve mobile device design
Reset device without removing
battery
Re-use existing keys for reset,
no need for dedicated reset key
Supervisors
Interface and interconnect products
ST6G32441
STMPE801
STMPE1600
STMPE1801
STMPE2403
STMIPID02
STSMIA832
STG4260
STG4160
STG4159
STG3220
STG3820
STG3696E1
STG3300
STM65XX
STM660X
STM1068
STBP120
High-speed SD card interfaces
High-speed 120 Mbit/s level shifter SDA 3.0 compatible
I/O expanders
8-bit basic I/O expander
16-bit basic I/O expander
18-bit enhanced I/O expander
10 x 8 QWERTY keypad, low power, low EMI
24-bit enhanced I/O expander keypad/LED/rotator wheel controller
Camera interfaces
Dual deserializer for MIPI/CSI2 and SMIA/CCP2 buses
Deserializer for CCP1 and CCP2 imaging buses
Analog switches
High ESD dual audio switch
High ESD single audio switch
High ESD single audio switch
High-speed dual data switch and USB switching
High-speed octal data switch for dual SIM card solution
High-speed, high ESD dual switch for USB/negative rail audio
Application specific accessory switch for earphone jack detector
Smart resets
Smart reset family allows hardware reset or shutdown by existing keys, selectable reset time-out
Smart push button with on/off
Supervisors
Smart voltage supervisor with power-on control
Overvoltage protection for battery
Note:1. Under development. Target datasheet and samples available upon request.
13
Radio frequency
STMicroelectronics provides a wide RF product offer based on its integrated passive device (IPD) technology.
IPD solutions based on glass substrate can offer a low parasitic and high-Q solution suitable for RF applications.
STMicroelectronics also provides a comprehensive portfolio of clock and timer ICs providing best-in-class
performance for accuracy and low power consumption.
IPD for RF functions
IPD for RF functions
Couplers
Diplexers
Couplers
Couples a known amount of the transmitted and reflected RF power in order to
adjust the transmitter performance. Very high directivity (>25 dB) and low insertion
losses.
Baluns
Key benefits
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Diplexers
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Cost- and size-efficient way to combine different complementary radio access
paths into single antenna. Combine dual antenna feeds into single feeds or vice
versa.
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Baluns
Conversion between differential and single-ended RF signals, suitable for SIP,
available in a variety of impedance ratios, flip-chip packages.
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Size: Up to 80% board saving
Cost: Up to 40% cost saving
Performance: Improved RF
immunity
Low component height
compared to low-temperature
co-fired ceramic technologies
Less board placement variation
effects than discrete due to
monolithic implementation
High predictability from
simulation to enable fast
production response time
Clocks and timing circuits
Clocks and timing circuits
Clock distribution
Clock distribution
ST’s multichannel clock distribution
circuits do not need any coupling
capacitor at the input, and have a very
low standby current and an ultralow phase noise. By distributing a
single master clock to multiple clock
domains, designers eliminate multiple
individual clock sources for circuits
supporting GSM, Bluetooth, WLAN,
WiMAX or other RF communications.
Real-time clocks
Key benefits
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Ultra-low phase noise
Improved crosstalk between channels
Lower system cost by eliminating number of time bases and saving board
space
Autonomous clock distribution solution together with desired TCXO
Multi-channel clock
distribution circuit
Real-time clocks
ST’s serial real-time clock devices
combine the RTC function with
the supervisor functions for
different master devices such as
microprocessors and NVRAMs.
WLAN
Bluetooth
TCXO
GPS
USB, camera
video, MP3
Radio frequency products
Couplers
CPL-WB-00C2
CPL-WB-00D31
CPL-WB-01C2
DCPL-WB-00C2
DCPL-WB-00D31
Single path, GSM, EDGE, WCDMA, k ≈ 34 dB
Small single path, GSM, EDGE, WCDMA, k ≈ 34 dB
Single path, TD-SCDMA, k ≈ 26 dB
Dual path, GSM, EDGE, WCDMA, k ≈ 34 dB
Small dual path, GSM, EDGE, WCDMA, k ≈ 34 dB
DIP1524-01D31
WLAN/GPS diplexer (ISM bands)
BAL-2593-D5U
BAL-2690-D3U
50/50+j50, 2.45 GHz (ISM bands)
50/30+j25, 2.45 GHz (ISM bands)
STCD10x0
STCD2x00
2- to 4-channel clock distribution
2- to 4-channel clock distribution, with LDO
M41T62X
32 kHz oscillator
Diplexers
Baluns
Clock distribution
Real-time clocks
Note:1. Under development. Target datasheet and samples available upon request.
15
Microcontrollers and secure MCUs
There is an increasing demand for lower power products in all types of market applications. Several factors
are driving this: new national and international norms to reduce power consumption, the increasing number
of battery-powered applications, cost reduction (through battery size reduction), development of new green
technologies, or simply the need to be environmentally friendly.
Microcontrollers
Microcontrollers
STM8L
STM32L
STM32 F-2
Key benefits
STM8L
Full range of microcontrollers from 4 to 64 Kbytes of Flash memory in small
footprint packages (ultra thin QFN and CSP) with data EEPROM, real-time
clock, LCD controllers, I2C multimaster, SPI, USART, DMA, 12-bit ADC, DAC,
comparators, multifunction timers and more.
STM32L
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Full range of microcontrollers from 64 to 384 Kbytes of Flash memory in small
footprint packages with data EEPROM, real-time clock, LCD controllers, I2C
multimaster, SPI, USART, DMA, 12-bit ADC, DAC, comparators, multifunction
timers and more.
STM32 F-2
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High-performance STM32 core with supply voltages down to 1.8 V.
Complements existing microcontrollers with more memory (up to 1 Mbyte),
advanced features (USB OTG 480 Mbit/s) with close pinout, full software
compatibility and very small footprint (WCSP). Fastest Cortex-M3 MCU with
150 DMIPs @ 120 MHz (Dhrystone 2.1).
Performance (MIPS)
STM32 32-bit
ARM Cortex MCU
(Multi-segment, EnergyLite,
RF, Touch sensing)
STM8 8-bit MCU
(Multi-segment, Touch sensing, EnergyLite)
Integration (features)
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130 nm ultra-low-leakage
process technology allowing
major improvement in power
consumption in static and
dynamic modes
High performance/powerconsumption ratio due to new
specific architecture
Common architecture allowing
seamless migration from one
family to another
Wide range of microcontrollers
from 4 Kbytes to 1 Mbyte of
Flash memory with state-ofthe-art peripheral set and
performance
Near Field Communication
Near Field Communication
NFC controller (ST21)
NFC controller
The ST21NFCA is based on a
microcontroller architecture with
embedded EEPROM and multiple
connectivity channels. By integrating
a complete set of firmware, and
complying with all relevant standards,
the ST21NFCA is perfectly suited to
address all possible NFC use cases.
Secure element (ST33)
Key benefits
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Low external component count
Competitive PWB footprint
Ready-to-use solution with full embedded firmware
Complete solution combined with Stollmann NFC stack and ST33F1M SIM
card IC
ST license available for all MIFARE technologies
Secure element
The ST33 family has been designed
to meet the advanced security and
performance requirements, combining
the latest 90 nm Flash technologies
with the highest security levels
on the ARM SC300 (secure ARM
Cortex™-M3). The ST33F1M is the
first product in this family and embeds
a large Flash memory combined with a
30-Kbyte RAM and an SWP interface
for NFC connectivity. It is certifiable for
secure and banking applications.
ST33
Secure element/
SD card solutions
ST21NFCA
Baseband
NFC baseband
middleware
Secure
element
NFC
controller
SIM
ST33
SWP SIM
Microcontrollers and secure MCU products
STM8L101
STM8L151
STM8L152
STM32L151
STM32L152
STM32F2051
STM32F2071
ST21NFCA
ST33F1M
8-bit microcontroller family (STM8L)
Entry-level, low-voltage family for simple applications with small packages
Feature-rich, low-voltage family for complex applications
With LCD support, low-voltage family for complex applications
32-bit microcontroller family (STM32L)
ARM Cortex core, low-voltage family for calculation power applications
With LCD support, ARM Cortex core, low-voltage family for high calculation power applications
32-bit high-performance microcontroller family (STM32 F-2)
ARM Cortex-M3 120 MHz core, down to 1.65 V supply voltage with very high performance and peripherals, WLCSP64 package,
less than 4 mm x 4 mm
ARM Cortex-M3 120 MHz core, down to 1.8 V supply voltage with very high performance and additional camera and Ethernet peripherals,
WLCSP64 package, less than 4 mm x 4 mm
NFC controller
Card emulation A/B/B’/F
Reader A/B/F/ISO 15693, NFC Tag 1, 2, 3, 4
Peer-to-peer ISO 18092
Battery off and battery low
I2C, SPI for terminal interface
SWP interface for (U)SIM interface
Supports MIFARE Classic (U)SIM application through SWP-CLT
Full embedded firmware (contact and contactless drivers and HCI)
Secure element
Highly secure MCU with 32-bit ARM® SecurCore® SC300™ CPU and 1.25-Mbyte Flash memory, MIFARE capable with firmware
Note:1. Under development. Target datasheet and samples available upon request.
17
Imaging solutions
STMicroelectronics offers a wide range of sensors and camera modules. With our 12 years of experience and
expertise in the complete imaging chain (sensors, optics, processing), ST’s cameras produce high image quality
in compact form factors at a low cost. Our internal high-volume supply chain guarantees supply, while still
providing for short-term upside flexibility.
Imaging sensors
Imaging sensors
Up to 8 Mpixels
High system integration
Key benefits
VCM driver, EDOF processing, ISP
integrateable on chip
Standard interfaces
MIPI CSI-2, CCP2, MDDI and parallel
supported
QQ
Pixel
matrix
Output
High
RGB
interface
performance
YUV
ISP
formatter MIPI CSI-2
parallel
QQ
QQ
Bayer and SoC
Bayer available up to 8 Mpixels and
SoC up to 5 Mpixels
Communication
I²C GPIO
OTP
memory
Power supply
1.8 V
(internal 1.2 V
LDO)
ST’s advanced pixel technology
for great image quality
ST’s ultra-low optical-pixel
stack enables realization of
ultra-low z-height camera
modules
ST’s high-density technology
for smallest die size and small
modules
EDOF – extended depth of field camera modules
EDOF – extended depth of field camera modules
3 Mpixels
5 Mpixels
Near and far focus
Simple construction
Allows near and far objects to be in
focus at the same time
Solid-state, similar to fixed focus
modules, superior mechanical
robustness compared to auto-focus
camera modules
Small footprint
SMIA65 for 3 and 5 Mpixels
Standard interfaces
MIPI CSI-2 and CCP2 supported
Key benefits
Improved performance over fixed
focus
EMC shielding
QQ
Integral EMC shielding and EMI
reduction techniques
QQ
Socket or flex
Socket for trouble-free volume
manufacturing
18
QQ
Near and far fields in focus
simultaneously
No need for more costly
autofocus in some applications
No auto-focus latency
Reflowable camera modules
Reflowable camera modules
2-Mpixel primary
Simple construction
Package directly connectable to the
product PCB avoiding extra cost of
socket or flex PCB
VGA video call
Key benefits
QQ
Small footprint
QQ
Innovative package techniques yielding
ultra-small, ultra-low-cost, surfacemount modules
QQ
QQ
Standard interfaces
ST’s ground-breaking throughsilicon via (TSV) packaging
technology delivers ultra-small
modules at an ultra-low cost
Ultra-fast production with direct
SMD reflow process
Efficient low height second
camera solutions
Very low cost primary cameras
targeting entry level phones
MIPI-SCI2 and CCP2 both supported
EMC shielding
Integral EMC shielding and EMI
reduction techniques
SoC – system-on-chip fixed-focus camera modules
SoC – system-on-chip fixed-focus camera modules
2 Mpixels
High system integration
Advanced algorithms
Image signal processing functions
carried out on chip
Adaptive to give optimal performance
under all viewing conditions
Small footprint
Socket or flex
No secondary ISP required
Socket for trouble-free volume
manufacturing
Standard interfaces
Key benefits
QQ
QQ
SoC solution allows reduced
development time and resource
impact on platform provider
Image quality tuning carried out
once only and independent of
platform
Industry-standard parallel interface
supported
Full scalar
For high-quality viewfinder and video
capture
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Co-processors – hardware accelerated ISP
Co-processors – hardware accelerated ISP
Up to 1.3 Mpixels
Up to 2 Mpixels
Up to 5 Mpixels
Video capability
Advanced algorithms
Up to 30 fps HD video. A dual video
pipe generates concurrent viewfinder
and still/movie image generation.
Advanced noise filtering for improved
low light performance, smart lighting,
color enhancement, state-of-theart AWB and part-to-part variation
support for high-quality images, fast
autofocus control
Small footprint
Available in TFBGA packages
Standard interfaces
ITU parallel, CCP2 and 1-Gbit/s MIPI
supported
Up to 8 Mpixels
Key benefits
QQ
QQ
QQ
Advanced features
Face or object detection and tracking,
video stabilization, auto ISO
QQ
Streaming engine
Connects two cameras to a
host having a single camera
input port
Virtually zero shutter lag using
twin video pipeline
Simplifies camera module
integration and adapts different
camera modules to a system
without modifying host
software
Provides DSC-class ISP to
systems with no or poor ISP
embedded in the host
Low latency with JPEG compression
with programmable target size or
target quality, dual-pipe architecture
for concurrent still and video and view
finder, low-cost streaming architecture
with no frame store
Imaging products
Imaging sensors – raw Bayer
VD6558/559 VGA , 2.2 µm pixel, optical
format 1/10”, COB, CP2 or
MIPI-CSI2
VD6803
3 Mpixels, 1.75 µm pixel, optical
format 1/4”, EDOF, COB or TSV,
CCP2 or ITU parallel
VD6963
5 Mpixels, 1.4 µm pixel, optical
format 1/4”, EDOF, COB, CCP2
or MIPI
VD6868
3 Mpixels, 2.8 µm pixel, optical
format 1/2.5”, VCM driver, COB,
CCP2 or dual MIPI
VD6955
5 Mpixels, 1.4 µm pixel, optical
format 1/4”, COB, dual MIPI
30 fps @ full resolution
Imaging sensors – SoC (embedded ISP)
VD6525
VGA, 2.2 µm pixel, optical format
1/10”, COB, ITU parallel
VD6725
2 Mpixels, 1.75 µm pixel, optical
format 1/5”, COB or TSV, MIPI or
ITU parallel
VD6826
3 Mpixels, 1.4 µm pixel, optical
format 1/5”, EDOF, COB, MIPI or
ITU parallel
VD6926
5 Mpixels, 1.4 µm pixel, optical
format 1/4”, EDOF, COB, dual
MIPI or ITU parallel
20
System-on-chip camera modules
VS6725C 2-Mpixel, fixed-focus socket
module with ITU interface
Autofocus camera modules
VB6851
3-Mpixel, SMIA65 module with CCP
interface
VB6871
3-Mpixel, SMIA65 module with
MDDI interface
EDOF camera modules
VX6854C 3-Mpixel, SMIA65 EDOF module
with MIPI or CCP interface
VX6953C 5-Mpixel, SMIA65 EDOF module
with MIPI or CCP interface
Reflowable camera modules
VW6754
2-Mpixel, 5.0 x 5.0 x 3.8 mm
module with CCP2 interface
VW6558
VGA 3.03 x 3.5 x 2.5 mm module
with CCP2 interface
VW6559
VGA 3.03 x 3.5 x 2.5 mm module
with MIPI CSI2 interface
Co-processors – hardware accelerated ISP
STV0977 30 fps at SVGA, 15 fps at
1.3 Mpixels, dynamic defect
correction and anti-shading,
CCP2 interface, TFBGA, 84 balls,
6 x 6 x 1.2 mm
STV0984S 30 fps at SVGA, 15 fps at
1.3 Mpixels, dynamic defect
correction and anti-shading, dual
video pipe, LED flash support,
ITU parallel and CCP2 interfaces,
TFBGA, 84 balls, 6 x 6 x 1.2 mm
STV0986 30 fps at 2 Mpixels, 15 fps at
5 Mpixels, HD 720p video @ 30 fps,
dual video pipe, low-latency
autofocus and LED flash support,
MIPI, ITU parallel and CCP2
interfaces, TFBGA, 84 balls,
6 x 6 x 1.2 mm
STV0987 30 fps at 5 Mpixels, 15 fps at
8 Mpixels, improved anti-shaking
and video stabilization,
HD 1080p @ 30 fps, face detection
and tracking, low latency auto
focus, auto ISO and LED flash
support, MIPI, ITU parallel and CCP2
interfaces, TFBGA, 84 balls,
6 x 6 x 1.2 mm
Protection and EMI filtering
IPAD™ products integrate the various functions required by wireless applications, such as ESD protection
diodes, EMI low-pass or common-mode filters, line terminations, pull-up or pull-down resistors, and RF
components.
With its complete protection and filtering range, as integrated or standalone solutions, ST offers design
flexibility while bringing space saving and high system immunity.
Protection devices
Protection devices
ESD protection
ESD protection
Multi-purpose ESD protection devices, available in a single-line, ultra-small
package (0201) for flexibility, as well as multi-line for high integration
EOS protection
EOS protection
Key benefits
QQ
QQ
EOS + 15 kV ESD protection in SOD-523 package, for example ESDAxx-1K 450 W
QQ
High ESD protection at system
level including high-speed serial
interfaces
PWB space saving by discrete
component replacement
and high-density capacitor
capability of IPAD™
Minimized track parasitic
inductances through integration
and high-density package
21
EMI filtering
EMI filtering
EMI filtering
EMI filtering
Strong attenuation at 900 MHz and higher frequencies for different applications
including:
QQ
QQ
QQ
QQ
QQ
Displays and cameras
Keypads and touch pads
Memory and SIM cards
Headsets, loudspeakers and microphones
USB, video-out, HDMI
Common-mode filtering
High-performance for common-mode noise filtering and integrated ESD protection
of high-speed serial interfaces with IPAD such as:
QQ
QQ
QQ
QQ
22
Camera serial interfaces
Display serial interfaces
HDMI 1.4
High-speed USB
Common-mode filtering
Key benefits
QQ
QQ
Best LC filter trade-off between
bandwidth and RF attenuation
with strong ESD protection up
to + 30 kV
Minimized track parasitic
inductances through integration
and high-density package
Protection and EMI filtering products
EMI filtering
EMIF01-TV01F3
EMIF01-TV02F3
EMIF01-1003M3
EMIF02-MIC03M6
EMIF02-MIC06F3
EMIF02-MIC07F3
EMIF02-SPK02F2
EMIF02-USB04F3
EMIF03-SIM02M8
EMIF03-SIM03F3
EMIF03-SIM04F3
EMIF04-EAR01M8
HDMI05-CL0xF3
EMIF06-1002F2
EMIF06-1005N12
EMIF06-AUD01F2
EMIF06-mSD02C3
EMIF06-SD03F3
EMIF08-LCD04M16
EMIF10-COM01F2
EMIF0x-1502Mx
EMIFxx-LCD02F3
EMIFxx-LCD03F3
ECMF02-2AMX6
ECMF04-4AMX12
ESDA6V1-5T6
ESDA8V2-1MY2
ESDALC6V1M3
ESDALC6V1-1U2
ESDALC6V1-5T6
ESDARF01-1BM2
ESDARF02-1C21
ESDARF03-1BF3
ESDAVLC8-1BU2
ESDAXLC6-1MY2
ESDAxx-1K
HDMIULC6-4F3
HSP061-4NY8
USBP01-5M81
USBULC1606-4M8
USBULC6-2F3/M6
USBULC6-3F3
TV composite filter
TV composite + reconstruction filter
1-line, high-attenuation filter
Microphone filter in microQFN
Microphone filter + biasing
Microphone filter + AC decoupling
Speaker filter
USB LS/FS OTG filter
SIM card filter, mQFN9
SIM card filter, CSP
SIM card filter + USB IF
Headset audio filter, earphone + mic
HDMI filter
6-line µSD filter
6-line filter for keypads
Headset microphone and speaker filter
6-line mini and µSD + pull-up
µSD card filter + LS + LDO
8-line filter for LCDs
10-line filter, CSP, 0.5 mm pitch
4- or 6-line filter for video
10- or 7-line filter, CSP, 0.4 mm pitch
10- or 7-line LC filter for LCDs
Common-mode filters
Differential pair low-pass filter for USB 2.0 with 7 GHz differential bandwidth, includes differential pair ESD protection
Differential pair low-pass filter for HSSI with 7 GHz differential bandwidth, includes differential pair ESD protection
EOS + ESD protection
5-line, 1 x 1 mm ESD protection
500 W, 8/20 μs power surge protection + 15 kV ESD in μDFN (1 x 1.45 mm)
Low-capacitance ESD protection
Low-capacitance 0.6 x 0.3 mm ESD protection
5-line, 1 x 1 mm, low-capacitance ESD protection
Ultra-low capacitance. Protection for FM TX, DVB-H, GPS and GSM antenna
Ultra-low capacitance. Protection for FM TX, DVB-H, GPS and GSM antenna
Ultra-low capacitance. Protection for FM TX, DVB-H, GPS and GSM antenna
Bidirectional audio ESD protection
µUSB connector, data line
450 W, 8/20 μs power surge protection + 15 kV ESD in SOD-523 (1.6 x 0.8 mm)
HDMI data-line protection
Flow-thru, 2 x 1 mm, 4 high-speed lines
µUSB connector full protection
USB 2.0 + battery charger protection
µUSB connector, data lines + Vbus
µUSB connector protection with ID
Note:1. Under development. Target datasheet and samples available upon request.
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© STMicroelectronics - January 2011 - Printed in United Kingdom - All rights reserved
The STMicroelectronics corporate logo is a registered trademark of the STMicroelectronics group of companies
All other names are the property of their respective owners
Order code: BRMOBILE0111
For more information on ST products and solutions, visit www.st.com
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