STM42441509

STM42441509
MP45DT02
MEMS audio sensor omnidirectional digital microphone
Datasheet - production data
 Speech recognition
 A/V eLearning devices
 Gaming and virtual reality input devices
 Digital still and video cameras
 Antitheft systems
Description
The MP45DT02 is a compact, low-power, topport, omnidirectional, digital MEMS microphone.
The MP45DT02 is built with a sensing element
and an IC interface with stereo capability.
HLGA (4.72 x 3.76 mm) 6LD
The sensing element, capable of detecting
acoustic waves, is manufactured using a
specialized silicon micromachining process to
produce audio sensors.
Features
 Single supply voltage
 Low power consumption
 120 dBSPL acoustic overload point
 Omnidirectional sensitivity
 PDM single-bit output with option for stereo
configuration
 HLGA package (SMD-compliant) plastic or
metal
 ECOPACK®, RoHS, and “Green” compliant
Applications
 Mobile terminals
The IC interface is manufactured using a CMOS
process that allows designing a dedicated circuit
able to provide a digital signal externally in PDM
format.
The MP45DT02 has an acoustic overload point of
120 dBSPL with a best on the market 61 dB
signal-to-noise ratio and -26 dB sensitivity.
The MP45DT02 is available in an SMD-compliant
package metal (M) or plastic and is guaranteed to
operate over an extended temperature range
from -30 °C to +85 °C.
The MP45DT02’s digital output and package size
(1.25 mm thick) make this device the best solution
for laptop and portable computing applications.
 Laptop and notebook computers
 Portable media players
 VoIP
Table 1. Device summary
Order code
Temperature range [°C]
Package
Packing
MP45DT02
-30 to +85
HLGA 4.72 x 3.76 6LD
Tray
MP45DT02TR
-30 to +85
HLGA 4.72 x 3.76 6LD
Tape and reel
MP45DT02TR-M
-30 to +85
HLGA 4.72 x 3.76 6LD
Tape and reel
June 2014
This is information on a product in full production.
DocID018658 Rev 7
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www.st.com
Contents
MP45DT02
Contents
1
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Acoustic and electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1
Acoustic and electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.2
Timing characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.3
Frequency response . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3
Sensing element . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4
Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5
Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5.1
L/R channel selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
6
Application recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
7
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
8
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
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MP45DT02
1
Pin description
Pin description
Figure 1. Pin connections
Table 2. Pin description
Pin n°
Pin name
Function
1
GND
2
LR
3
GND
0 V supply
4
CLK
Synchronization input clock
5
DOUT
Left/right PDM data output
6
Vdd
0 V supply
Left/right channel selection;
MIC1 LR is connected to GND or Vdd and MIC2 LR is connected to
Vdd or GND (see Figure 5)
Power supply
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Acoustic and electrical specifications
MP45DT02
2
Acoustic and electrical specifications
2.1
Acoustic and electrical characteristics
The values listed in the table below are specified for Vdd = 1.8 V, Clock = 2.4 MHz,
T = 25 °C, unless otherwise noted.
Table 3. Acoustic and electrical characteristics
Symbol
Parameter
Test condition
Vdd
Supply voltage
Idd
Current consumption in
normal mode
IddPdn
Current consumption in
power-down mode(2)
Scc
Short-circuit current
AOP
Acoustic overload point
So
Min.
Typ.(1)
Max.
Unit
1.64
1.8
3.6
V
No load on data line
0.65
mA
20
µA
1
10
120
Sensitivity
-29
-26
dBSPL
-23
dBFS
SNR
Signal-to-noise ratio
A-weighted @1 kHz,
1 Pa
61
dB
PSR
Power supply rejection
Guaranteed by
design(3)
-70
dBFS
Clock
Input clock frequency(4)
TWK
Wake-up time
(5)
1
3.25
MHz
10
ms
-30
+85
°C
Guaranteed by design
2.4
Top
Operating temperature
range
VIOL
Low level logic
input/output voltage
Iout = 1 mA
-0.3
0.35xVdd
V
VIOH
High level logic
input/output voltage
Iout = 1 mA
0.65xVdd
Vdd+0.3
V
1. Typical specifications are not guaranteed.
2. Input clock in static mode.
3. Test signal: 217 Hz square wave, 100 mVpp on Vdd pin.
4. Duty cycle: min = 40% max = 60%.
5. Time from the first clock edge to valid output data.
Table 4. Distortion specifications
4/15
mA
Parameter
Test condition
Value
Distortion
100 dBSPL (50 Hz - 4 kHz)
< 1% THD + N
Distortion
115 dBSPL (1 kHz)
< 5% THD + N
DocID018658 Rev 7
MP45DT02
2.2
Acoustic and electrical specifications
Timing characteristics
Table 5. Timing characteristics
Parameter
Description
fCLK
Clock frequency for normal mode
fPD
Clock frequency for power-down mode
TCLK
Clock period for normal mode
Data enabled on DATA line, L/R pin = 1
TR,DIS
Data disabled on DATA line, L/R pin = 1
TL,DIS
Max
Unit
1
3.25
MHz
0.23
MHz
1000
ns
308
TR,EN
TL,EN
Min
(1)
30
ns
16(1)
(1)
Data enabled on DATA line, L/R pin = 0
30
ns
ns
16(1)
Data disabled on DATA line, L/R pin = 0
ns
1. From design simulations
Figure 2. Timing waveforms
TCLK
CLK
TL,DIS
TR,EN
TR,DIS
High Z
PDM R
High Z
TL,EN
PDM L
High Z
High Z
AM045165v1
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Acoustic and electrical specifications
2.3
MP45DT02
Frequency response
Figure 3. Typical frequency response normalized at 1 kHz
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MP45DT02
3
Sensing element
Sensing element
The sensing element shall mean the acoustic sensor consisting of a conductive movable
plate and a fixed plate placed in a tiny silicon chip. This sensor transduces the sound
pressure into the changes of coupled capacity between those two plates.
Omron Corporation supplies this element for STMicroelectronics.
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Absolute maximum ratings
4
MP45DT02
Absolute maximum ratings
Stresses above those listed as “absolute maximum ratings” may cause permanent damage
to the device. This is a stress rating only and functional operation of the device under these
conditions is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.
Table 6. Absolute maximum ratings
Symbol
Ratings
Vdd
Supply voltage
Vin
Input voltage on any control pin
TSTG
Storage temperature range
ESD
Electrostatic discharge protection
Maximum value
Unit
-0.3 to 6
V
-0.3 to Vdd +0.3
V
-40 to +125
°C
2 (HBM)
kV
This device is sensitive to mechanical shock, improper handling can cause
permanent damage to the part.
This device is ESD-sensitive, improper handling can cause permanent damage to the
part.
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MP45DT02
Functionality
5
Functionality
5.1
L/R channel selection
The L/R digital pad lets the user select the DOUT signal pattern as explained in Table 7. The
L/R pin must be connected to Vdd or GND.
Table 7. L/R channel selection
L/R
CLK low
CLK high
GND
Data valid
High impedence
Vdd
High impedence
Data valid
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Application recommendations
6
MP45DT02
Application recommendations
Figure 4. MP45DT02 electrical connections
Vdd
10 µF
10 0 nF
1
CODEC
2
TOP VIEW
L/R
6
Dout
5
CLK
3
4
AM07927v1
Figure 5. MP45DT02 electrical connections for stereo configuration
Vdd
10 µ F
100 nF
MIC 1
MIC 2
Dou t
Vdd
5
2
4
3
6
Dout
5
4
CLK
3
TOP VIE W
2
1
6
TOP VIE W
1
CODEC
AM07928v1
Power supply decoupling capacitors (100 nF ceramic, 10 µF ceramic) should be placed as
near as possible to pin 6 of the device (common design practice).
The L/R pin must be connected to Vdd or GND (refer to Table 7).
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MP45DT02
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Soldering information
The HLGA (4.72 x 3.76 x 1.25) mm package is also compliant with the RoHS and “Green”
standards and is qualified for soldering heat resistance according to JEDEC J-STD-020.
Landing pattern and soldering recommendations are available at www.st.com.
Figure 6. Recommended soldering profile limits
tp
TP
CRITICAL ZONE
RAMP-UP
TL to T P
TL
TSMAX
TEMPERATURE
7
Package mechanical data
tL
TSMIN
ts
PREHEAT
RAMP-DOWN
T25°C to PEAK
30
60
90
120
150
180
TIME
210
240
270
300
330
360
390
AM045166v1
Table 8. Recommended soldering profile limits
Description
Average ramp rate
Parameter
Pb free
TL to TP
3 °C/sec max
TSMIN
TSMAX
tS
150 °C
200 °C
60 sec to 120 sec
Preheat
Minimum temperature
Maximum temperature
Time (TSMIN to TSMAX)
TSMAX to TL
Ramp-up rate
Time maintained above liquidus temperature
Liquidus temperature
tL
TL
60 sec to 150 sec
217 °C
Peak temperature
TP
260 °C max
Time within 5 °C of actual peak temperature
20 sec to 40 sec
Ramp-down rate
6 °C/sec max
Time 25 °C (t25 °C) to peak temperature
8 minutes max
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Package mechanical data
MP45DT02
Figure 7. HLGA (4.72 x 3.76 mm) 6-lead package outline
Note:
12/15
The MEMS microphone metal cap can exhibit some level of variation in color when the
device is subjected to a thermal process.
DocID018658 Rev 7
MP45DT02
Package mechanical data
Figure 8. HLGA (4.72 x 3.76 mm9 6-lead package outline
N4
A1
Pin 1 indicator
K C
K
C
R1
N3
D2
//
L1
D1
D
N1
E1
K E
E
E2
K D
N2
7*
G1
K
L2
8287552_A
Table 9. HLGA (4.72 x 3.76 mm) 6-lead package dimensions
mm.
Symbol
Min.
Typ.
Max.
A1
1.125
1.250
1.375
D1
4.670
4.720
4.770
D2
1.320
R1
0.750
0.840
0.930
E1
3.710
3.760
3.810
E2
1.880
L1
3.200
3.300
3.400
L2
2.250
2.350
2.450
N1
1.550
1.650
1.750
N2
1.075
1.175
1.275
N3
1.350
1.450
1.550
N4
0.865
0.965
1.065
G1
0.810
0.910
1.010
K
0.050
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Revision history
8
MP45DT02
Revision history
Table 10. Document revision history
14/15
Date
Revision
Changes
28-Mar-2011
1
Initial release
21-Oct-2011
2
Added max. peak temperature TP to Table 8
Added min. and max. sensitivity So to Table 3
01-Mar-2012
3
Document status promoted from preliminary to production data
Updated SNR to 61 dB (Description and Table 3)
07-May-2012
4
Added VIOL, VIOH to Table 3: Acoustic and electrical characteristics
05-Jul-2012
5
Added Section 3: Sensing element
21-Mar-2014
6
Added new package Figure 7: HLGA (4.72 x 3.76 mm) 6-lead
package outline
17-Jun-2014
7
Updated Figure 3 on page 6
DocID018658 Rev 7
MP45DT02
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