Specification | HP SignagePlayer mp8200 QuickSpecs

QuickSpecs

Overview

1.

Optical DVD-ROM Drive

2.

Secure Digital (SD) Card Reader

3.

Rear I/O includes (6) USB 2.0 ports, DisplayPort v1.1a and VGA video interfaces, PS/2 mouse and keyboard ports, RJ-45 network interface, 3.5mm audio in/out jacks

4.

Front I/O includes (4) USB 2.0 ports, audio out , and a microphone/headphone jack

5.

100mm VESA mounting holes

6.

2.5" internal hard disk drive bay

7.

135W 87% efficient external Power Adapter or

180W 87% efficient external Power Adapter (when configured with discrete graphics)

8.

HP USDT Tower Stand (optional)

9.

HP Mouse (optional)

10. HP Keyboard (optional)

DA - 14115 Canada — Version 1 — September 8, 2011 Page 1

QuickSpecs

Overview

PC chassis and all internal components and modules are 100% free of brominated flame retardants (BFRs) and Polyvinyl

Chloride (PVC).

UEFI BIOS developed and engineered by HP for better security, manageability and software image stability

Intel Q67 Express chipset supporting Intel 2nd generation Core processors, featuring Intel HD Graphics and with vPro

Technology (available with select processors on Windows Embedded Standard 7)

Intel 82579LM GbE integrated network connection

DDR3 Synchronous Dynamic Random Access Memory (SDRAM)

Integrated dual independent monitor support via VGA and digital DisplayPort v1.1a video interfaces (dual monitor support is not supported on the mp8200s using Scala Quickstart)

Discrete graphics options available 87% efficient energy saving external power adapter standard with USDT models

Guaranteed lengthy purchase lifecycles Created using industry leading Design for Environment standards

Tool-less serviceability features for easier upgrades and repairs


QuickSpecs

Standard Features and Configurable Components (availability may vary by country)

Preinstalled Genuine Windows Embedded Standard 2009

1

Genuine Windows Embedded Standard 7

2

1

mp8200s model

2

mp8200 model

Value Added Software

(included on mp8200s)

Scala Quickstart

HP Stable Platform Program

Intel Stable Platform Program

Business-to-Business Portals

HP Global Series Services

* TPM module disabled where restricted by law, i.e. Russia.

Factory Express Deployment and Lifecycle Services

Intel Core vPro Processors

Trusted Platform Module (TPM v1.2) *

On-site warranty and service

1

: This limited warranty and service offering delivers parts, labor and on-site repair for terms up to

5 years. Response time is next business day

2

and includes free telephone support

3

24 x 7. Global coverage

2

ensures any product purchased in one country and transferred to another non-restricted country will remain fully covered under the original warranty and service offering. Some countries/regions do not offer one year onsite and labor.

1

Terms and conditions may vary by country. Certain restrictions and exclusions apply

2

On-site services may be provided pursuant to a service contract between HP and an authorized HP third party provider, and is not available in certain countries. Global service response times are based on commercially reasonable best effort and may vary by country

3

Technical telephone support applies only to HP configured, HP and HP qualified third party hardware and software. Toll-free calling and 24 x 7 support may not be available in some countries.

Intel Q67 Express X X


QuickSpecs


Intel® 2nd Generation Core™ i3 Processors

Intel Core i3-2100 Processor

3.10 GHz, 3M cache, 2 cores/4 threads

Intel Core i5-2400S Processor

2.50 GHz, 6M cache, 4 cores/4 threads

Intel Stable Image Platform Program (SIPP)

Supports Intel vPro Technology

X

X

X

X

All HP SignagePlayer mp8200 Series models featuring this technology include processors that are part of the Intel 2011 Stable

Image Platform Program (SIPP) designed to ensure the stability promise inherent in the value proposition of the HP

SignagePlayer mp8200 Series, thus making these models the most stable, secure, and manageable platforms available to enterprises today.

which provides network administrators the latest and most effective tools to remotely discover, heal, and protect networked client systems regardless of the system's health or power state. AMT 7.0 includes the following advanced management functions:

Power Management (on, off, reset)

Hardware Inventory (includes BIOS and firmware revisions)

Hardware Alerting

Agent Presence

System Defense Filters

SOL/IDER

Cisco NAC/SDN Support

ME Wake-on-LAN

DASH 1.1 compliance

IPv6 Support

Fast Call for Help - a client inside or outside the firewall may initiate a call for help via BIOS screen, periodic connections, or alert triggered connection

Remote Scheduled Maintenance - pre-schedule when the PC connects to the IT or service provider console for maintenance. Remote PCs can get required patches, be inventoried, etc by connecting to their IT console or Service

Provider when it's convenient

Remote Alerts - automatically alert IT or service provider if issues arise

Access Monitor - Provides oversight into Intel® AMT actions to support security requirements

PC Alarm Clock

Microsoft NAP Support

Host Base set-up and configuration

Management Engine (ME) firmware roll back

Wireless AMT functionality on Desktop (WoDT)

Enhanced KVM resolution


QuickSpecs


The HP SignagePlayer mp8200 Series supports the 2nd generation Intel® Core™ processor family. Based on a new PC microarchitecture, the processor is designed for a two-chip platform consisting of a processor and Platform Controller Hub (PCH).

Unlike previous generations, the processor includes an integrated memory controller (IMC). The IMC supports DDR3 protocols with two independent, 64-bit wide channels each accessing one or two DIMMs.

Two channels of non-ECC unbuffered DDR3 memory with a maximum of two UDIMMs or SODIMMs per channel

Single-channel and dual-channel memory organization modes

Data burst length of eight for all memory organization modes

DDR3 memory data transfer rates of 1066 MT/s (PC3-8500) and 1333 MT/s (PC3-10600)

64-bit wide channels

DDR3 I/O voltage of 1.5V

Maximum memory bandwidth of 10.6 GB/s in single-channel mode or 21 GB/s in dual-channel mode assuming DDR3

1333 MT/s (PC3-10600)

1GB and 2GB DDR3 DRAM technologies are supported. Using 4 GB device technologies, the largest memory capacity possible is 32 GB, assuming dual channel mode with four x 8 GB dual ranked unbuffered DIMM memory configuration.

Regardless of the power-on state, voltage is always supplied to the memory modules as long as the computer is plugged in to an active AC outlet. Adding or removing memory modules while voltage is present may cause irreparable damage to the memory modules or system board.

Upgradeable to 4 GB. Slot 1 is black and must always be populated. Not all memory configurations possible are represented below.

For systems configured with more than 3 GB of memory and a 32-bit operating system, all memory may not be available due to system resource requirements.

The Intel Q67 Express chipset includes a built-in Management Engine (ME), which allocates memory for manageability functions.

Management Engine memory is shared with system memory. If the PC contains a single SO-DIMM, 16 MB of memory is preallocated for it at system startup. If the PC contains two SO-DIMMs, 32 MB of memory is pre-allocated. This memory is not made available to the operating system, just as pre-allocated video memory is not available.


QuickSpecs


Quantity Supported

Position

SDR

0

1

ODD

1

2

160-GB Hard Disk Drives

HP 160GB 7.2K rpm SATA 3.0Gb/s 2.5" Hard Disk Drive

HP 160-GB SATA 3.0Gb/s Solid State Drive

HP Slim DVD-ROM Drive

1

HDD

1

3

0

X

X

X

1

Trusted Platform Module (TPM) 1.2

1

Stringent security (via BIOS)

2

SATA port disablement (via BIOS)

Drive lock

Serial, parallel, USB enable/disable (via BIOS)

Removable media write/boot control

Power-On password (via BIOS)

X

X

X

X

X

X

X

Setup password (via BIOS)

HP Hood Sensor

X

X

Support for chassis padlocks and cable lock devices X

1

TPM module disabled where use is restricted by law; for example, Russia.

2

This setting is defaulted to disable, but when enabled, the PW jumper will not clear the BIOS pre-boot authentication passwords.

X

X

X

X

X

X

X

X

X

X

X

Intel 82579LM integrated GbE Network Connection

Intel Centrino Advanced-N 6205 Wireless NIC (mini PCI Express) features on the mp8200 model.

X

X

X

X


QuickSpecs


Intel HD Graphics 2000/3000 (integrated)

ATI Radeon HD 5450 Graphics (MXM)

HP DisplayPort Cable

HP DisplayPort to DVI-D Adapter

HP DisplayPort to HDMI Adapter

HP DisplayPort to VGA Adapter

X

X

X

X

X

X

High Definition Audio with Realtek ALC261 codec

(all ports are stereo)

Microphone/Headphone * and dedicated headphone front ports (3.5mm)

Line-out and Line-In rear Ports * (3.5mm)

Internal Speaker (standard)

X

X

X

X

HP USB Standard Keyboard

HP USDT Tower Stand

X

X

X

X

X

X

X

X

X

X

X

X

X

X


QuickSpecs

After-Market Options (availability may vary by country)

HP DisplayPort Cable Kit

HP DisplayPort To DVI-D Adapter

HP DisplayPort to HDMI Adapter

HP DisplayPort to VGA Adapter

HP 160-GB SATA 3.0Gb/s Solid State Drive

HP USB Standard Keyboard

HP USB Optical Mouse

HP 1 GB SO-DIMM

HP 2 GB SO-DIMM

HP Slim DVD-ROM Drive

HP Business PC Security Lock

HP USDT Rear Port Controller Cover

HP Keyed Lock Cable

HP USDT Tower Stand

X

X

X

X

X

X

X

X

X

X

X

X

X

X

VH639AA

VH640AT

VP033AA

PV606AA

VN571AA

BV411AA

VN568AA

VN567AA

FH973AA

BP937AA

AS615AA

BW321AA

DT528A

DC172AT

X

X

X

X

X

X

X

X

X

X

X

X

X


QuickSpecs

Technical Specifications

(configured with 1 HDD and 1 ODD)

Chassis (without stand)

(H x W x D)

System Volume

Tower Stand

(H x W x D)

Packaging

(H x W x D)

System Weight *

Shipping Weight *

Max Supported Weight

(desktop orientation)

USB 2.0

PS/2

Video

DVI output

Audio

NIC

Mini PCI Express

MXM

Slim

Internal HDD Bays

2.6 x 9.9 x 10 in

66 x 252 x 254 mm

257.5 cu in

4.2 L

1.1 x 4.9 x 6.7 in

27 x 125 x 170 mm

8.6 x 15.7 x 19.7 in

218 x 398 x 500 mm

6.8 lb

3.1 kg

14.4 lb

6.5 kg

77.0 lb

35.0 kg

Front - four (4) ports

Rear - six (6) ports color coded support for keyboard (purple) and mouse (green)

VGA and DisplayPort v1.1a provide integrated dual independent monitor support available via optional DisplayPort to DVI Adapter

Front - microphone & headphone

Rear - line input (supports microphone or line input), line out

All ports are 3.5mm in diameter

Industry standard RJ-45 port accesses the integrated network interface controller

1 each

1 each

1 each

1 each

2.5" drives


QuickSpecs


Hard Drive Controller 1 each

Host SATA Controller Advanced Host Controller Interface (AHCI) Revision 1.2. The specification includes a description of the hardware/software interface between system software and the host controller hardware.

1

1

The mp8200s model ships with the SATA controller in IDE mode

General Unit Operating Guidelines

Keep the computer away from excessive moisture, direct moisture and the extremes of heat and cold, to ensure that unit is operated within the specified operating range.

Leave a 10.2 cm (4 in) clearance on all vented sides of the computer to permit the required airflow.

Never restrict airflow into the computer by blocking any vents or air intakes.

Do not stack computers on top of each other or place computers so near each other that they are subject to each other's recirculated or preheated air.

Occasionally clean the air vents on the front, back, and any other vented side of the computer. Lint, dust and other foreign matter can block the vents and limit the airflow.

If the computer is to be operated within a separate enclosure, intake and exhaust ventilation must be provided on the enclosure, and the same operating guidelines listed above will still apply.

Temperature Range Operating: 50° to 95° F (10° to 35° C) *

Non-operating: -22° to 140° F(-30° to 60° C)

Relative Humidity

Maximum Altitude

(unpressurized)

Operating: 10% to 90% (non-condensing at ambient)

Non-operating: 5% to 95% (non-condensing at ambient)

Operating: 10,000 ft (3048 m)

Non-operating: 30,000 ft (9144 m)

* Operating temperature is de-rated 1.0 deg C per 300 m (1000 ft) to 3000 m (10,000 ft) above sea level, no direct sustained sunlight. Maximum rate of change is 10 deg C/Hr. The upper limit may be limited by the type and number of options installed.

Standard Efficiency

High Efficiency

Operating Voltage

Range

Rated Voltage Range

Rated Line Frequency

Operating Line

Frequency Range

Rated Input Current

Rated Input Current with

Energy Efficient * Power

Supply

Integrated graphics:

Discrete graphics:

N/A

135W active PFC 87% efficient

180W active PFC 87% efficient

90 - 264 VAC

100 - 240 VAC

50/60 Hz

47 - 63 Hz

N/A

135W: 2.4A

180W: 2.9A


QuickSpecs


Current Leakage

(NFPA 99)

Power Supply Fan

Power Cord Length

External Power Adapter

Dimensions

Total Cord Length

< 250 µA

N/A

N/A

6.7 x 2.6 x 1.5 in

12 ft 8 in

Key features of the HP BIOS include:

Deployment and manageability - HP BIOS provides several technologies that help integrate the HP SignagePlayer 8200

Series into the enterprise, such as PXE, remote configuration, remote control, and F10 Setup support for 12 languages.

Select models feature either Intel Standard Manageability or Intel Core vPro Processor Technology.

Stability - HP BIOS supports the HP stable product roadmap by releasing only critical BIOS changes to the factory and advanced change notification.

Support UEFI specification 2.1

Thermal and power management - The HP BIOS provides and enables thermal and power management technologies so component temperatures are managed for high reliability and to assist in operating the HP Business Desktop computer in any enterprise environment.

Acoustic performance - Industry leading acoustic emissions across the range of operating conditions.

Serviceability - HP BIOS provides diagnostic and detailed service information.

Upgrades and recovery - HP BIOS provides numerous ways to upgrade HP Business Desktop computers, including BIOS updates from within DOS (DOSFlash), BIOS updates from within Windows (HPQFlash), HP Client Manager, and fail-safe recovery. In addition, the HP Business Desktop BIOS Utilities tool enables replicated BIOS setup throughout the Enterprise; it is available from within the BIOS software and from the support website.

HP BIOS uses PKI signing of the BIOS for trusted BIOS upgrades and recovery.

Additional HP BIOS Features

Power-On password - Helps prevent an unauthorized user from powering on the system.

Administrator password - Also known as the setup password, this helps prevent unauthorized changes to the system configuration. If the administrator password is not known, the BIOS version cannot be changed and changes cannot be made to BIOS settings using F10 setup or under the OS.

Advanced Configuration and Power Interface (ACPI) - Represents a significant innovation in power and configuration management, allowing operating systems and applications to manage power based on activity and usage. HP Elite models use ACPI to provide power conservation features.

S5 Max Power Savings setting supports EU Lot6 requirement and allows the computer to power down below 1W is S5 (when turned off). When S5 Max Power Savings feature is enabled power to slots is turned off along with WOL functionality.


QuickSpecs


Advanced Configuration and Power Management Interface (ACPI). Allows the system to wake from a low power mode.

Controls system power consumption, making it possible to place individual cards and peripherals in a low-power or powered-off state without affecting other elements of the system.

System Management BIOS v2.6

Intel Wired for Management support; industry wide initiative to make Intel architecture based PCs, servers and mobile computers more inherently manageable out-of-the-box and over the network

Dual State Power Button; acts as both an on/off button and a suspend-to-sleep button

Dual colored power LED on front of computer to indicate either normal or fault condition

Diagnostic LED Explanation Table:

Number of 1-second red LED blinks followed by a 2-second pause, then repeats:

2 - processor thermal protection activated

3 - processor not installed

4 - power supply failure

5 - memory error

6 - video error

7 - PCA failure (ROM detected failure prior to video)

8 - invalid ROM, bootblock recovery mode

9 - system not fetching code

10 - system hang while loading an option ROM

System/Emergency ROM

Flash ROM

CMOS Battery Holder for easy replacement

Flash Recovery with Video Configuration Record Software

5 Aux Power LED on System PCA

Processor ZIF Socket for easy Upgrade

Over-Temp Warning on Screen (Requires IM Agents)

Clear Password Jumper

DIMM Connectors for easy Upgrade

Clear CMOS Button

NIC LEDs (integrated) (Green & Amber)

Dual Color Power and HD LED - To Indicate Normal Operations and Fault Conditions

Color coordinated cables and connectors

Tool-less Hood Removal

Front power switch

System memory can be upgraded without removing the system board or any internal components

Tool-less Hard Drive, CD & Diskette Removal

Green Pull Tabs, and Quick Release Latches for easy Identification


QuickSpecs


Towerable Orientation

Drive Lock

Drive Protection System

SMART Technology (Self-Monitoring, Analysis and Reporting

Technology)

SMART I - Drive Failure Prediction

SMART II - Off-Line Data Collection

SMART III - Off-Line Read Scanning with Defect Reallocation

SMART IV - End-to-End CRC for hard drives

Product can be oriented as either a desktop or a tower

Implementation of the industry standard ATA Security feature set.

When enabled, it prevents software access to user data on the drive until one or two user-defined passwords are provided.

DPS Access through F10 Setup during Boot

A diagnostic hard drive self test. It scans critical physical components and every sector of the hard drive for physical faults and then reports any faults to the user

Running independently of the operating system, it can be accessed through a Windows-based diagnostics utility or through the computer's setup procedure. It produces an evaluation on whether the hard drive is the source of the problem and needs to be replaced

The system expands on the Self-Monitoring, Analysis, and

Reporting Technology (SMART), a continuously running systems diagnostic that alerts the user to certain types of failures

Allows hard drives to monitor their own health and to raise flags if imminent failures were predicted

Predicts failures before they occur. Tracks fault prediction and failure indication parameters such as re-allocated sector count, spin retry count, calibration retry count

By avoiding actual hard drive failures, SMART hard drives act as

"insurance" against unplanned user downtime and potential data loss from hard drive failure

IOEDC: I/O Error Detection Circuitry

Detects errors in Read/Write buffers on HDD cache RAM

Interface in F10 setup provides confirmation of SMART IV support.


QuickSpecs

Technical Specifications - Audio

Integrated

Realtek 2-channel ALC261 codec

Front microphone-In (150-K ohm Input Impedance)

Rear Line-In/Microphone input (150-K ohm Input Impedance, function is configurable by audio driver)

Rear Line-Out * (190 ohms Output Impedance, expects at least a 10-K ohm load)

Front Headphone-Out (0.5 Ohm Output Impedance, expects at least a 32 ohm load)

Front Microphone/Headphone jack is re-task able to provide Microphone input, line-in or Headphone output to support connecting two headphones to the front of the system. When configured as a second front headphone output, both front headphone outputs are always driven with the same signal.

All ports are 3.5 mm

1.5W amplifier for the internal speaker only. External speakers must be powered externally. Rear Line-in audio port is re-taskable as either Line-in or Microphone-In.

sent to/from the front and rear jacks.

8 kHz - 192 kHz

Yes - Uses OS soft wavetable

Yes

Stereo (Left & Right channels)

Yes

External Speaker Jack Yes


QuickSpecs

Technical Specifications - Communications

Intel 82579LM GbE Network Connection

(integrated)

RJ-45

Integrated on PCA

Intel 82579LM GbE platform LAN connect networking controller

24 KB FIFO packet buffer memory

10/100/1000 Mbps

802.1P

802.1Q

802.2

802.3

802.3ab

802.3az

802.3u

PCI Express and SMBus

PCIe-based interface for active state operation (S0 state) and SMBus for host and management traffic

(Sx low power state)

Requires 3.3V and 1.05V or just 3.3V with integrated regulators

Power consumption 0.697 Watts

Yes

Network transfer mode Full-duplex

Half-duplex (not supported for the 1000BASE-T transceiver)

10BASE-T (half-duplex) 10 Mbps

10BASE-T (full-duplex) 20 Mbps

100BASE-TX (half-duplex) 100 Mbps

100BASE-TX (full-duplex) 200 Mbps

1000BASE-T (full-duplex) 2000 Mbps

Operating Temperature: 0° to 85° C

Operating Humidity: 60% RH

WOL, auto MDI crossover, PXE, Muti-port teaming, RSS, Advanced cable diagnostic.

ASF 2.0 support; AMT 7.0 support

IEEE 802.11b

IEEE 802.11g

IEEE 802.11n

Supports Intel Core vPro Processor Technologies

Cisco Compatible Extensions Program compliant (802.11a/b/g only) with Microsoft Windows XP,

Windows Vista and Windows 7

2.4 GHz and 5 GHz


QuickSpecs


2 transmit; 2 receive (2x2)

802.11b: 1, 2, 5.5, 6, 9, 11 Mbps

802.11a/g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps

802.11n: ranging from 6 Mbps to 300 Mbps, depending on the combination of Bandwidth, Modulation

Coding Scheme, and Guard Interval used, as defined in IEEE 802.11n specification

Direct Sequence Spread Spectrum

DBPSK, DQPSK, CCK, OFDM, BPSK, QPSK, 16-QAM, 64-QAM

Supports 64- and 128-bit WEP, WPA, WPA2, hardware-accelerated AES (support for key sizes of 128,

192, and 256 bits), 802.1x authentication types EAP-TLS, EAP-TTLS, PEAP-GTC, PEAP-MSCHAPv2,

LEAP, EAP-FAST.

Support for Cisco Security Features (proven compatibility with Cisco Aironet infrastructure products through the Cisco Compatible Extensions Program Version 4) with Microsoft Windows Vista and XP only.

Multinational support with frequency bands and channels compliant to local regulations.

Media Access Protocol CSMA/CA (Collision Avoidance) with ACK

Ad-hoc (Peer to Peer)

Infrastructure (Access Point Required)

IEEE 802.11 compliant roaming between access points

Output Power 15 dBm

15 dBm

OFDM; power varies by data rate)

Transmit: 2.3 Watts (average, with one spatial streams)

Receive: 1.9 Watts (average with two receive chains)

Idle mode: 30mW - 40mW (average)

Radio off: 20 mW (max)

ACPI compliant power management

802.11 compliant power saving mode

3 U.FL type connectors, 50 ohm nominal impedance

802.11 a - Typical (@6

Mbps)

802.11 b - Typical (@1

Mbps)

600 feet - Outdoor Open Area

150 feet - Indoor, Office environment



802.11 g - Typical (@1

Mbps)

MiniPCI-Express



0.013 lb (4.0 g)

1.1 x 1.2 in (26.8 x 30.0 mm)

3.3V +/- 9%, 1.5V +/- 5%

Operating: 32° to 176° F (0° to 80° C)

Non-operating: -40° to 176° F (-40° to 80° C)

Operating: 10% to 90% (non-condensing)

Non-operating: 5% to 90% (non-condensing)


QuickSpecs


Operating: 0 to 10,000 ft (3,048 m)

Non-operating: 0 to 50,000 ft (15,240 m)


QuickSpecs

Technical Specifications - Graphics

Microsoft DirectX 10.1 based with support for Pixel Shader 4.1

Integrated v1.1a; integrated, multimode capable; supports HDCP and audio over DisplayPort

PCI Express™ x16

Integrated, 350 MHz

Graphics memory is shared with system memory. Graphics memory usage varies depending on the amount of system memory installed, BIOS settings, operating system, and system load. 32 MB is preallocated for graphics use at system boot time. Additional memory can be allocated at boot time by the

BIOS for PAVP (Protected Audio Video Playback) support for playback of protected video content.

Additional memory is allocated for graphics as needed using Intel's Dynamic Video Memory Technology

(DVMT), to provide an optimal balance between graphics and system memory use.

Hardware Accelerated decode for MPEG2 encrypted video; support for PAVP

Maximum Color Depth 32 bits/pixel

Integrated dual independent monitor support facilitated via one VGA port and one DisplayPort v1.1a

integrated on the back plane of the system board and presented as part of the rear I/O set of interfaces. Support for DVI, HDMI, dual link DVI or second VGA monitor provided by optional HP

DisplayPort adapters. (see complete listing of available optional adapters elsewhere in this QuickSpec).

The system can support greater than two monitors with the addition of an optional discrete graphics card. Both integrated graphics and discrete graphics can be utilized simultaneously.

DirectX 10.1 support in hardware

OpenGL 3.0 support in hardware and qualified by HP

DA - 14115 Canada — Version 1 — September 8, 2011

60 *

Page 18

QuickSpecs


* Only supported when using a DisplayPort connection connections

MXM 3.0 A

650 MHz

DDR3

800 MHz

512 MB (64 bit)

DX11, SM 5

Yes

1.1a

yes

1.3 compatible

Full rate playback @ max. resolution of display

Full sub-video support w/o frame drops

Full BDJ or iHD support w/o frame drops

25W

DisplayPort and DVI-D single link connector

7.5 in (19.0 cm)

.10 lbs (.05 kg)


QuickSpecs


DisplayPort and VGA connector

8 in (20 cm)

.1 lbs (.06 kg)

85 Hz

162 MHz RAMDAC

Display max resolution 1600x1200 the HP DisplayPort to VGA Adapter may require an update to the graphics driver installed on your system. To install the most up-todate graphics driver go to: www.hp.com

.


QuickSpecs

Technical Specifications – Data Storage

Introduction

:

HP Serial Advanced Technology Attachment (SATA) Hard Drives maximize the performance of HP Business PCs by providing the technologies to meet your increasing storage demands with high-capacity drives offering superior reliability and performance.

SATA provides faster data transfer speeds, better system cooling airflow, more bandwidth, more headroom for speed increases in future generations and better data integrity. A next-generation technology, the SATA interface connects hard drives to the PC platform enabling easy aggregation of multiple hard drives into a single PC. This offers you the additional benefits of dedicated bandwidth, the ability to more easily identify device failures and scalability. The HP SignagePlayer mp8200 Elite Series supports the latest SATA 6.0Gb/s specification.

HP Serial ATA Hard Drives offer enhanced security via a new Drive Lock. When enabled, this ATA security feature set prevents software access to user data on the drive until one or two user-defined passwords are provided.

Self Monitoring Analysis and Reporting Technology (SMART) hard drive technology allows hard drives to monitor their own health and to raise flags if imminent failures are predicted. If the drive determines that a failure is imminent, the SMART hard drive technology enables the intelligent manageability or management software to generate a fault alert. While the current versions of

SMART hard drives do a good job monitoring the data on the hard drive media, the ever increasing emphasis on reliability and quality has promoted HP to implement SMART IV technology which constantly checks that the data flow from host interface to media and media to host interface is not compromised. This is accomplished by inserting a 2 byte parity code into every 512 byte block in the data path of the hard drive's Cache RAM. This unique parity checking performed by HP's SMART IV technology hard drives, allows for more complete error detection coverage encompassing the entire data path between the host and the hard drive.

Smart IV is also known as IOEDC: I/O Error Detection Code.

NCQ or Native Command Queuing is a SATA protocol extension that allows the hard drive to have several write or read commands outstanding at the same time. In contrast, normal non-queued operation requires each command to be completed before the next command is issued by the host system. Queuing allows the drive to complete the commands in the order that allows for best overall throughput. It also involves an advanced method of transferring data to or from the host, called First Party Direct

Memory Access (FPDMA), which allows the hard drive and the host controller to manage the data transfers for multiple outstanding commands, without involving the host processor. NCQ can contribute to better performance but the results are dependent on many factors, including the access patterns of the various applications and operating system functions that are initiating drive accesses.

Enabling NCQ features in the hard drive requires AHCI support from the host system BIOS, controller, and driver. AHCI support is typically implemented in RAID configurations.


QuickSpecs

Technical Specifications – Data Storage

Unformatted Capacity 160 GB

Multi Level Cell (MLC) NAND Flash with wear leveling 10 channel controller

Serial ATA 2.0 (3.0 Gb/s)

Dimensions 2.74 x 0.37 x 4 in (6.98 x 0.95 x 10.2 cm)

0.18 lb (80 g)

Up to 250 MB/s Bandwidth Performance Sustained Sequential

Read:

Sustained Sequential

Write:

Up to 70 MB/s

(all conditions, noncondensing)

Random Read:

Random Write:

Read:

Write:

DC power requirement: 5 VDC 5%-100 mV ripple p-p

Total power consumption: 0.15W (active); 0.075W (idle)

35TB written, up to 20GB/day for 5 years

Operating Temperature: 32° to 158° F (0° to 70° C)

Relative Humidity:

Maximum Wet Bulb

Temperature (operating):

Shock:

Up to 35K IOPs

Up to 6.6K IOPs

65-ms

85-ms

5% to 95%

84° F (29° C)

1,500 G/0.5-ms drive is reserved for flash management features. Actual capacity varies by content and will be less than 15.8GB.

160,041,885,696 bytes

7,200 rpm

Serial ATA 2.0 (3.0 Gb/s)

16 MB

312,581,808

Single Track: 2.0 ms includes controller overhead, including settling)

Average:

Full-Stroke:

12 ms

22 ms

0.374 in/9.5 mm

Media diameter: 2.5 in/63.5 mm

Physical size: 2.75 in/70 mm

Operating Temperature 41° to 131° F (5° to 55° C)


QuickSpecs

Technical Specifications - Removable Storage

Physical characteristics Keys 104, 105, 106, 107, 109 layout (depending upon country)

Dimensions (L x W x H) 18.0 x 6.4 x 0.98 in (45.8 x 16.3 x 2.5 cm)

Weight 2 lb (0.9 kg)

Operating voltage

Power consumption

System interface

ESD

+ 5VDC ± 5%

50-mA maximum (with three LEDs ON)

USB Type A plug connector

CE level 4, 15-kV air discharge

EMI - RFI Conforms to FCC rules for a Class B computing device

Microsoft® PC 99 - 2001 Functionally compliant

Languages

Keycaps

38 available

Low-profile design

Switch actuation

Switch life

55-g nominal peak force with tactile feedback

20 million keystrokes (using Hasco modified tester)

Switch type Contamination-resistant switch membrane

Key-leveling mechanisms For all double-wide and greater-length keys

Cable length 6 ft (1.8 m)

Microsoft PC 99 - 2001 Mechanically compliant

Acoustics 43-dBA maximum sound pressure level

Operating temperature 50° to 122° F (10° to 50° C)

-22° to 140° F (-30° to 60° C) Non-operating temperature

Operating humidity 10% to 90% (non-condensing at ambient)

Non-operating humidity 20% to 80% (non-condensing at ambient)

Operating shock 40 g, six surfaces

Non-operating shock

Operating vibration

80 g, six surfaces

2-g peak acceleration

Non-operating vibration 4-g peak acceleration

Drop (out of box) 26 in (66 cm) on carpet, six-drop sequence

Drop (in box) 42 in (107 cm) on concrete, 16-drop sequence

UL, CSA, FCC, CE Mark, TUV, TUV GS, VCCI, BSMI, C-Tick, MIC

Ergonomic compliance ANSI HFS 100, ISO 9241-4, and TUVGS

Keyboard Installation Guide

Warranty Card Safety and Comfort Guide


QuickSpecs

Technical Specifications - Removable Storage

VP033AA

12.7mm

Either horizontal or vertical

SATA/ATAPI

Dimensions 5.0 x 0.5 x 5.0 in (128 x 13.6 x 129 mm)

0.42 lb (190 g)

DVD+R/-R/+RW/

-RW/+R DL /-R DL

Up to 4X

(typical reads, including settling) conditions noncondensing)

DVD-ROM

CD-ROM, CD-R

CD-RW

Random DVD

Up to 8X

Up to 24X

Up to 24X

DVD: < 140 ms (typical), CD: < 125 ms (typical)

Random CD

Data Transfer Modes

DVD: < 250 ms (seek), CD: < 210 ms (seek)

ATA PIO mode 4 (16.7 MB/s); ATA Multi-word DMA mode 2 (16.7 MB/s)

Source Four-pin, DC power receptacle

DC Power Requirement 5 VDC ± 5%-100 mV ripple p-p

DC Current 5 VDC - <1000 mA typical, < 1600 mA maximum

Total Drive Power (standby mode)

< 2.5 Watt

Line-Out

Signal-to-Noise Ratio

Channel Separation

Temperature

Relative Humidity

Maximum Wet Bulb

Temperature (operating)

0.7 VRMS

74 dB

65 dB

41° to 122° F (5° to 50° C)

5% to 85%

86° F (30° C)


QuickSpecs

Technical Specifications - Eco Data

This product has received or is in the process of being certified to the following approvals and may be labeled with one or more of these marks:

IT ECO declaration

115 VAC 230 VAC 100 VAC

(typically configured)

Heat Dissipation *

18.95 W

2.09 W

1.128 W

20.01 W

2.182 W

1.228 W

18.66 W

2.099 W

1.127 W

115 VAC

65 BTU/hr

7 BTU/hr

4 BTU/hr

230 VAC

68 BTU/hr

7 BTU/hr

4 BTU/hr

100 VAC

64 BTU/hr

7 BTU/hr

4 BTU/hr

*Heat dissipation is calculated based on the measured watts, assuming the service level is attained for one hour.

(in accordance with ISO

7779 and ISO 9296)

Sound Power

(LWAd, bels)

3.7

3.9

Sound Pressure

(LpAm, decibels)

28

28

(random writes)

The battery(s) in this product complies with EU Directive 2006/66/EC, and does not contain:

Mercury greater the 5ppm by weight

Cadmium greater than 10ppm by weight

CR2032 (coin cell)

Lithium

Additional Information This product is in compliance with the Restrictions of Hazardous Substances (RoHS) directive -

2002/95/EC.

This HP product is designed to comply with the Waste Electrical and Electronic Equipment (WEEE)

Directive - 2002/96/EC.

This product is in compliance with California Proposition 65 (State of California; Safe Drinking Water and Toxic Enforcement Act of 1986).

Plastics parts weighing over 25 grams used in the product are marked per ISO 11469 and ISO1043.

This product contains 0.03% post-consumer recycled plastic (by wt.)

This product is 92.2% recyclable when properly disposed of at end of life.


QuickSpecs


External Corrugated Carton - 1526.2 g

Internal Polyethylene low density foam - 177 g

The corrugated packaging material contains at least 49.42 % recycled content.

The Polyethylene low density Foam packaging material contains at least 60.42% recycled content.

Hewlett-Packard is committed to compliance with all applicable environmental laws and regulations, including the European Union Restriction of Hazardous Substances (RoHS) Directive. HP's goal is to exceed compliance obligations by meeting the requirements of the RoHS Directive on a worldwide basis.

By July 1, 2006, RoHS substances will be virtually eliminated (virtually = to levels below legal limits) for all HP electronic products subject to the RoHS Directive, except where it is widely recognized that there is no technically feasible alternative (as indicated by an exemption under the EU RoHS Directive).

This product does not contain any of the following substances in excess of regulatory limits (refer to the

HP General Specification for the Environment at: http://www.hp.com/hpinfo/globalcitizenship/environment/supplychain/gen_specifications.html

):

Asbestos

Certain Azo Colorants

Certain Brominated Flame Retardants - may not be used as flame retardants in plastics

Cadmium

Chlorinated Hydrocarbons

Chlorinated Paraffins

Formaldehyde

Halogenated Diphenyl Methanes

Lead carbonates and sulfates

Lead and Lead compounds

Mercuric Oxide Batteries

Ozone Depleting Substances

Polybrominated Biphenyls (PBBs)

Polybrominated Biphenyl Ethers (PBBEs)

Polybrominated Biphenyl Oxides (PBBOs)

Polychlorinated Biphenyl (PCB)

Polychlorinated Terphenyls (PCT)

Polyvinyl Chloride (PVC) - except for wires and cables, and certain retail packaging has been voluntarily removed from most applications.

Radioactive Substances

Tributyl Tin (TBT), Triphenyl Tin (TPT), Tributyl Tin Oxide (TBTO)

Nickel finishes that release greater than 0.5 micro-grams/cm^2/week, measured according to

EN 1811:1998, are not used on any product surface designed to be frequently handled or touched by users.

HP follows these guidelines to decrease the environmental impact of product packaging:

Eliminate the use of heavy metals such as lead, chromium, mercury and cadmium in packaging materials.

Eliminate the use of ozone-depleting substances (ODS) in packaging materials.

Design packaging materials for ease of disassembly.

Maximize the use of post-consumer recycled content materials in packaging materials.

Use readily recyclable packaging materials such as paper and corrugated materials.

Reduce size and weight of packages to improve transportation fuel efficiency.


QuickSpecs


Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards.

Hewlett-Packard offers end-of-life HP product return and recycling programs in many geographic areas.

To recycle your product, please go to: http://www.hp.com/go/reuse-recycle or contact your nearest HP sales office. Products returned to HP will be recycled, recovered or disposed of in a responsible manner.

The EU WEEE directive (2002/95/EC) requires manufacturers to provide treatment information for each product type for use by treatment facilities. This information (product disassembly instructions) is posted on the Hewlett Packard web site at: http://www.hp.com/go/recyclers . These instructions may be used by recyclers and other WEEE treatment facilities as well as HP OEM customers who integrate and re-sell HP equipment.

For more information about HP's commitment to the environment:

Global Citizenship Report http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html

Eco-label certifications http://www.hp.com/hpinfo/globalcitizenship/environment/productdesign/ecolabels.html

ISO 14001 certificates: http://www.hp.com/hpinfo/globalcitizenship/environment/operations/envmanagement.html

Copyright © 2011 Hewlett-Packard Development Company, L.P.

All rights reserved. Microsoft, Windows, Windows 7, and Windows Vista are registered trademarks or trademarks of Microsoft

Corporation in the U.S. and/or other countries. Intel, Core 2 Quad, Core 2 Duo, Pentium and Celeron are registered trademarks or trademarks of Intel Corporation in the U.S. and/or other countries. Bluetooth is a registered trademark of Bluetooth SIG, Inc., in the U.S. and other countries. All other product names mentioned herein may be trademarks of their respective companies.

The information contained herein is subject to change without notice and is provided "as is" without warranty of any kind. The warranties for HP products are set forth in the express limited warranty statements accompanying such products. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein.


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