MAX6642

MAX6642
MAX6642
RELIABILITY REPORT
FOR
MAX6642ATT90+
PLASTIC ENCAPSULATED DEVICES
July 27, 2010
MAXIM INTEGRATED PRODUCTS
120 SAN GABRIEL DR.
SUNNYVALE, CA 94086
Approved by
Don Lipps
Quality Assurance
Manager, Reliability Engineering
Maxim Integrated Products. All rights reserved.
Page 1/5
MAX6642
Conclusion
The MAX6642ATT90+ successfully meets the quality and reliability standards required of all Maxim products. In addition, Maxim"s
continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim"s quality and reliability standards.
Table of Contents
I. ........Device Description
V. ........Quality Assurance Information
II. ........Manufacturing Information
VI. .......Reliability Evaluation
III. .......Packaging Information
IV. .......Die Information
.....Attachments
I. Device Description
A. General
The MAX6642 precise, two-channel digital temperature sensor accurately measures the temperature of its own die and a remote PN junction and
reports the temperature data over a 2-wire serial interface. The remote PN junction is typically a substrate PNP transistor on the die of a CPU, ASIC,
GPU, or FPGA. The remote PN junction can also be a discrete diode-connected small-signal transistor. The 2-wire serial interface accepts standard
system management bus (SMBus(tm)), Write Byte, Read Byte, Send Byte, and Receive Byte commands to read the temperature data and to program
the alarm thresholds. To enhance system reliability, the MAX6642 includes an SMBus timeout. The temperature data format is 10 bits with the least
significant bit (LSB) corresponding to +0.25°C. The active-low ALERT output asserts when the local or remote overtemperature thresholds are
violated. A fault queue can be used to prevent the active-low ALERT output from setting until two consecutive faults have been detected.
Measurements can be done autonomously or in a single-shot mode. Remote accuracy is ±1°C maximum error between +60°C and +100°C. The
MAX6642 operates from -40°C to +125°C, and measures remote temperatures between 0°C and +150°C. The MAX6642 is available in a 6-pin TDFN
package with an exposed pad.
Maxim Integrated Products. All rights reserved.
Page 2/5
MAX6642
II. Manufacturing Information
A. Description/Function:
±1°C, SMBus-Compatible Remote/Local Temperature Sensor with
Overtemperature Alarm
B. Process:
B8
C. Number of Device Transistors:
D. Fabrication Location:
California or Texas
E. Assembly Location:
Thailand
F. Date of Initial Production:
July
26, 2003
III. Packaging Information
A. Package Type:
6-pin TDFN 3x3
B. Lead Frame:
Copper
C. Lead Finish:
100% matte Tin
D. Die Attach:
Conductive
E. Bondwire:
Au (1 mil dia.)
F. Mold Material:
Epoxy with silica filler
G. Assembly Diagram:
#05-9000-0591
H. Flammability Rating:
Class UL94-V0
I. Classification of Moisture Sensitivity per
JEDEC standard J-STD-020-C
Level 1
J. Single Layer Theta Ja:
55°C/W
K. Single Layer Theta Jc:
8.5°C/W
L. Multi Layer Theta Ja:
42°C/W
M. Multi Layer Theta Jc:
8.5°C/W
IV. Die Information
A. Dimensions:
46 X 90 mils
B. Passivation:
Si3N4/SiO2 (Silicon nitride/ Silicon dioxide)
C. Interconnect:
Al/0.5%Cu with Ti/TiN Barrier
D. Backside Metallization:
None
E. Minimum Metal Width:
0.8 microns (as drawn)
F. Minimum Metal Spacing:
0.8 microns (as drawn)
G. Bondpad Dimensions:
5 mil. Sq.
H. Isolation Dielectric:
SiO2
I. Die Separation Method:
Wafer Saw
Maxim Integrated Products. All rights reserved.
Page 3/5
MAX6642
V. Quality Assurance Information
A. Quality Assurance Contacts:
Don Lipps (Manager, Reliability Engineering)
Bryan Preeshl (Managing Director of QA)
B. Outgoing Inspection Level:
0.1% for all electrical parameters guaranteed by the Datasheet.
0.1% For all Visual Defects.
C. Observed Outgoing Defect Rate:
< 50 ppm
D. Sampling Plan:
Mil-Std-105D
VI. Reliability Evaluation
A. Accelerated Life Test
The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure Rate ( ) is calculated as follows:
=
1
MTTF
=
1.83
(Chi square value for MTTF upper limit)
192 x 4340 x 48 x 2
(where 4340 = Temperature Acceleration factor assuming an activation energy of 0.8eV)
= 22.9 x 10-9
= 22.9 F.I.T. (60% confidence level @ 25°C)
The following failure rate represents data collected from Maxim"s reliability monitor program. Maxim performs quarterly life test
monitors on its processes. This data is published in the Reliability Report found at http://www.maxim-ic.com/qa/reliability/monitor.
Cumulative monitor data for the B8 Process results in a FIT Rate of 0.06 @ 25C and 0.99 @ 55C (0.8 eV, 60% UCL)
B. Moisture Resistance Tests
The industry standard 85°C/85%RH or HAST testing is monitored per device process once a quarter.
C. E.S.D. and Latch-Up Testing
The TS55 die type has been found to have all pins able to withstand a HBM transient pulse of +/-2500V per Mil-Std 883
Method 3015.7. Latch-Up testing has shown that this device withstands a current of +/-250mA.
Maxim Integrated Products. All rights reserved.
Page 4/5
MAX6642
Table 1
Reliability Evaluation Test Results
MAX6642ATT90+
TEST ITEM
TEST CONDITION
Static Life Test (Note 1)
Ta = 135°C
Biased
Time = 192 hrs.
Moisture Testing (Note 2)
HAST
Ta = 130°C
RH = 85%
Biased
Time = 96hrs.
Mechanical Stress (Note 2)
Temperature
-65°C/150°C
Cycle
1000 Cycles
Method 1010
FAILURE
IDENTIFICATION
SAMPLE SIZE
NUMBER OF
FAILURES
DC Parameters
& functionality
48
0
DC Parameters
& functionality
77
0
DC Parameters
& functionality
77
0
Note 1: Life Test Data may represent plastic DIP qualification lots.
Note 2: Generic Package/Process data
Maxim Integrated Products. All rights reserved.
Page 5/5
Was this manual useful for you? yes no
Thank you for your participation!

* Your assessment is very important for improving the work of artificial intelligence, which forms the content of this project

Download PDF

advertisement